BUK7607-30B

BUK75/7607-30B TrenchMOS™ standard level FET Rev. 01 — 07 April 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using Philips High-Performance Automotive (HPA) TrenchMOS™ technology. Product availability: BUK7507-30B in SOT78 (TO-220AB) BUK7607-30B in SOT404 (D2-PAK). 1.2 Features s Very low on-state resistance s 175 °C rated s Q101 compliant s Standard level compatible. 1.3 Applications s Automotive systems s Motors, lamps and solenoids s 12 V loads s General purpose power switching. 1.4 Quick reference data s EDS(AL)S ≤ 329 mJ s ID ≤ 75 A s RDSon = 5.9 mΩ (typ) s Ptot ≤ 157 W. 2. Pinning information Table 1: Pin 1 2 3 mb Pinning - SOT78 and SOT404 simplified outlines and symbol Description gate (g) drain (d) source (s) mounting base, connected to drain (d) 1 MBK106 Simplified outline mb mb Symbol [1] d g 2 3 MBK116 MBB076 s 123 SOT78 (TO-220AB) [1] SOT404 (D2-PAK) It is not possible to make connection to pin 2 of the SOT404 package. Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 3. Limiting values Table 2: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS VDGR VGS ID drain-source voltage (DC) drain-gate voltage (DC) gate-source voltage (DC) drain current (DC) Tmb = 25 °C; VGS = 10 V; Figure 2 and 3 Tmb = 100 °C; VGS = 10 V; Figure 2 IDM Ptot Tstg Tj IDR IDRM peak drain current total power dissipation storage temperature junction temperature reverse drain current (DC) peak reverse drain current Tmb = 25 °C Tmb = 25 °C; pulsed; tp ≤ 10 µs unclamped inductive load; ID = 75 A; VDS ≤ 30 V; VGS = 10 V; RGS = 50 Ω; starting Tmb = 25 °C [1] [2] [1] [2] [2] Conditions RGS = 20 kΩ Min −55 −55 - Max 30 30 ±20 108 75 75 435 157 +175 +175 108 75 435 329 Unit V V V A A A A W °C °C A A A mJ Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 Tmb = 25 °C; Figure 1 Source-drain diode Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy [1] [2] Current is limited by power dissipation chip rating. Continuous current is limited by package. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 2 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 120 Pder (%) 80 03na19 120 ID (A) 03nm94 Capped at 75 A due to package 80 40 40 0 0 50 100 150 200 Tmb (° C) 0 0 50 100 150 200 Tmb (°C) P tot P der = ---------------------- × 100 % P ° tot ( 25 C ) VGS ≥ 10 V Fig 1. Normalized total power dissipation as a function of mounting base temperature. Fig 2. Continuous drain current as a function of mounting base temperature. 103 03nm92 ID (A) Limit RDSon = VDS/ID tp = 10 µ s 102 100 µ s Capped at 75 A due to package 1 ms DC 10 10 ms 100 ms 1 10-1 1 10 VDS (V) 102 Tmb = 25 °C; IDM single pulse. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 3 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 4. Thermal characteristics Table 3: Rth(j-mb) Rth(j-a) Thermal characteristics Conditions Figure 4 Min Typ Max Unit 0.95 K/W thermal resistance from junction to mounting base thermal resistance from junction to ambient SOT78 (TO-220AB) SOT404 (D2-PAK) vertical in still air minimum footprint; mounted on a PCB 60 50 K/W K/W Symbol Parameter 4.1 Transient thermal impedance 1 Zth(j-mb) (K/W) δ = 0.5 0.2 0.1 0.05 0.02 03nm93 10-1 10-2 single shot P δ= tp T tp T 10-3 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) t 1 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 4 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 5. Characteristics Table 4: Characteristics Tj = 25 °C unless otherwise specified. Symbol V(BR)DSS Parameter drain-source breakdown voltage Conditions ID = 0.25 mA; VGS = 0 V Tj = 25 °C Tj = −55 °C VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 Tj = 25 °C Tj = 175 °C Tj = −55 °C IDSS drain-source leakage current VDS = 30 V; VGS = 0 V Tj = 25 °C Tj = 175 °C IGSS RDSon gate-source leakage current drain-source on-state resistance VGS = ±20 V; VDS = 0 V VGS = 10 V; ID = 25 A; Figure 7 and 8 Tj = 25 °C Tj = 175 °C Dynamic characteristics Qg(tot) Qgs Qgd Ciss Coss Crss td(on) tr td(off) tf Ld total gate charge gate-source charge gate-drain (Miller) charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time internal drain inductance from drain lead 6 mm from package to centre of die from contact screw on mounting base to centre of die SOT78 from upper edge of drain mounting base to centre of die SOT404 Ls internal source inductance from source lead 6 mm from package to source bond pad VDD = 25 V; RL = 1.2 Ω; VGS = 10 V; RG = 10 Ω VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 VGS = 10 V; VDD = 24 V; ID = 25 A; Figure 14 36 9 12 1820 632 256 20 51 51 44 4.5 3.5 2427 758 351 nC nC nC pF pF pF ns ns ns ns nH nH 5.9 7 13.3 mΩ mΩ 0.02 2 1 500 100 µA µA nA 2 1 3 4 4.4 V V V 30 27 V V Min Typ Max Unit Static characteristics - 2.5 - nH - 7.5 - nH 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 5 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET Table 4: Characteristics…continued Tj = 25 °C unless otherwise specified. Symbol VSD trr Qr Parameter source-drain (diode forward) voltage reverse recovery time recovered charge Conditions IS = 25 A; VGS = 0 V; Figure 15 IS = 20 A; dIS/dt = −100 A/µs VGS = −10 V; VDS = 20 V Min Typ 0.85 46 28 Max 1.2 Unit V ns nC Source-drain diode 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 6 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 300 ID (A) 200 8.5 8 7.5 100 7 6.5 6 5.5 5 4.5 0 0 2 4 6 8 20 10 9.5 9 03nm89 12 RDSon (mΩ) 10 03nk83 Label VGS (V) 8 6 4 10 VDS (V) 5 10 15 VGS (V) 20 Tj = 25 °C; tp = 300 µs Tj = 25 °C; ID = 25 A Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values. Fig 6. Drain-source on-state resistance as a function of gate-source voltage; typical values. 20 RDSon (mΩ) 15 03nm90 6 6.5 7 7.5 8 2 a 1.5 03aa27 Label is VGS (V) 9 10 10 1 5 0.5 0 0 100 200 ID (A) 300 0 -60 0 60 120 Tj (°C) 180 Tj = 25 °C R DSon a = ---------------------------R DSon ( 25 °C ) Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature. Fig 7. Drain-source on-state resistance as a function of drain current; typical values. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 7 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 5 VGS(th) (V) 4 max 03aa32 10-1 ID (A) 10-2 03aa35 3 typ 10-3 min typ max 2 min 10-4 1 10-5 0 -60 0 60 120 Tj (°C) 180 10-6 0 2 4 VGS (V) 6 ID = 1 mA; VDS = VGS Tj = 25 °C; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. Fig 10. Sub-threshold drain current as a function of gate-source voltage. 40 gfs (S) 30 03nm86 4000 C (pF) 3000 Ciss 03nm91 Coss 20 2000 Crss 10 1000 0 0 25 50 75 ID (A) 100 0 10-2 10-1 1 10 VDS (V) 102 Tj = 25 °C; VDS = 25 V VGS = 0 V; f = 1 MHz Fig 11. Forward transconductance as a function of drain current; typical values. Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 8 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 100 ID (A) 75 03nm87 10 VGS (V) 8 VDD = 14 V 03nm85 VDD = 24 V 6 50 4 25 Tj = 175 °C Tj = 25 °C 2 0 0 2 4 6 VGS (V) 8 0 0 10 20 30 QG (nC) 40 VDS = 25 V Tj = 25 °C; ID = 25 A Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values. Fig 14. Gate-source voltage as a function of gate charge; typical values. 100 IS (A) 75 03nm84 50 Tj = 175 °C 25 Tj = 25 °C 0 0.0 0.4 0.8 VSD (V) 1.2 VGS = 0 V Fig 15. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 9 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 6. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E p A A1 q D1 mounting base D L1(1) L2 Q L b1 1 2 3 b c e e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 b1 1.3 1.0 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.7 e 2.54 L 15.0 13.5 L1(1) 3.30 2.79 L2 max. 3.0 p 3.8 3.6 q 3.0 2.7 Q 2.6 2.2 Note 1. Terminals in this zone are not tinned. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC 3-lead TO-220AB EIAJ SC-46 EUROPEAN PROJECTION ISSUE DATE 00-09-07 01-02-16 Fig 16. SOT78 (TO-220AB). 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 10 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped) SOT404 A E A1 mounting base D1 D HD 2 Lp 1 3 b c Q e e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.50 4.10 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.80 14.80 Q 2.60 2.20 OUTLINE VERSION SOT404 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-06-25 01-02-12 Fig 17. SOT404 (D2-PAK). 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 11 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 7. Soldering handbook, full pagewidth 10.85 10.60 10.50 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.35 8.275 1.50 4.60 0.30 4.85 5.40 8.075 7.95 3.00 0.20 solder lands solder resist occupied area solder paste 5.08 1.20 1.30 1.55 MSD057 Dimensions in mm. Fig 18. Reflow soldering footprint for SOT404. 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 12 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 8. Revision history Table 5: Rev Date 01 20030407 Revision history CPCN Description Product data (9397 750 11232) 9397 750 11232 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 13 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET 9. Data sheet status Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 10. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 12. Trademarks TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V. 11. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. 9397 9397 750 11232 Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. Product data Rev. 01 — 07 April 2003 14 of 15 Philips Semiconductors BUK75/7607-30B TrenchMOS™ standard level FET Contents 1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 9 10 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 © Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 07 April 2003 Document order number: 9397 750 11232