BUK764R0-75C

BUK764R0-75C N-channel TrenchMOS standard level FET Rev. 01 — 17 August 2006 Product data sheet 1. Product profile 1.1 General description N-channel enhancement mode power Field-Effect Transistor (FET) in a plastic package, using Philips Ultra High-Performance (UHP) automotive TrenchMOS technology. 1.2 Features I TrenchMOS technology I 175 °C rated I Q101 compliant I Standard level compatible 1.3 Applications I Automotive systems I Motors, lamps and solenoids I General purpose power switching I 12 V, 24 V and 42 V loads 1.4 Quick reference data I EDS(AL)S ≤ 630 mJ I ID ≤ 100 A I RDSon = 3.4 mΩ (typ) I Ptot ≤ 333 W 2. Pinning information Table 1. Pin 1 2 3 mb Pinning Description gate (G) drain (D) source (S) mounting base; connected to drain 2 1 3 [1] Simplified outline mb Symbol D G mbb076 S SOT404 (D2PAK) [1] It is not possible to make a connection to pin 2 of the SOT404 package. Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 3. Ordering information Table 2. Ordering information Package Name BUK764R0-75C D2PAK Description plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) Version SOT404 Type number 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS VDGR VGS ID drain-source voltage drain-gate voltage (DC) gate-source voltage drain current Tmb = 25 °C; VGS = 10 V; see Figure 2 and 3 Tmb = 100 °C; VGS = 10 V; see Figure 2 IDM Ptot Tstg Tj IDR IDRM peak drain current total power dissipation storage temperature junction temperature reverse drain current peak reverse drain current Tmb = 25 °C Tmb = 25 °C; pulsed; tp ≤ 10 µs unclamped inductive load; ID = 100 A; VDS ≤ 75 V; RGS = 50 Ω; VGS = 10 V; starting at Tj = 25 °C [4] [1][2] [1][3] [1][2] [2][3] [2][3] Conditions RGS = 20 kΩ Min −55 −55 - Max 75 75 ±20 199 100 100 797 333 +175 +175 199 100 797 630 - Unit V V V A A A A W °C °C A A A mJ J Tmb = 25 °C; pulsed; tp ≤ 10 µs; see Figure 3 Tmb = 25 °C; see Figure 1 Source-drain diode Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy EDS(AL)R repetitive drain-source avalanche energy [1] [2] [3] [4] Current is limited by chip power dissipation rating. Refer to document 9397 750 12572 for further information. Continuous current is limited by package. Conditions: a) Maximum value not quoted. Repetitive rating defined in Figure 16. b) Single-pulse avalanche rating limited by Tj(max) of 175 °C. c) Repetitive avalanche rating limited by an average junction temperature of 170 °C. d) Refer to application note AN10273 for further information. BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 2 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 120 Pder (%) 80 03aa16 200 ID (A) 150 003aab492 100 (1) 40 50 0 0 50 100 150 Tmb (°C) 200 0 0 50 100 150 Tmb (°C) 200 P tot P der = ----------------------- × 100 % P tot ( 25 ° C ) Fig 1. Normalized total power dissipation as a function of mounting base temperature 103 ID (A) 102 (1) VGS ≥ 10 V (1) Capped at 100 A due to package. Fig 2. Normalized continuous drain current as a function of mounting base temperature 003aab393 Limit RDSon = VDS / ID tp = 10 µs 10 100 µs 1 ms 10 ms 1 100 ms DC 10-1 10-1 1 10 VDS (V) 102 Tmb = 25 °C; IDM is single pulse. (1) Capped at 100 A due to package. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 3 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 5. Thermal characteristics Table 4. Symbol Rth(j-mb) Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to mounting base thermal resistance from junction to ambient minimum footprint [1] Conditions Min - Typ 50 Max 0.45 - Unit K/W K/W Mounted on a printed-circuit board; vertical in still air. 1 Zth(j-mb) (K/W) 10-1 0.1 0.05 0.02 003aab340 δ = 0.5 0.2 10-2 P δ= tp T single shot tp T t 10-3 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) 1 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 4 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified. Symbol V(BR)DSS Parameter drain-source breakdown voltage Conditions ID = 250 µA; VGS = 0 V Tj = 25 °C Tj = −55 °C VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; see Figure 9 and 10 Tj = 25 °C Tj = 175 °C Tj = −55 °C IDSS drain leakage current VDS = 75 V; VGS = 0 V Tj = 25 °C Tj = 175 °C IGSS RDSon gate leakage current drain-source on-state resistance VGS = ±20 V; VDS = 0 V VGS = 10 V; ID = 25 A; see Figure 6 and 8 Tj = 25 °C Tj = 175 °C Dynamic characteristics QG(tot) QGS QGD VGS(pl) Ciss Coss Crss td(on) tr td(off) tf LD LS VSD trr Qr total gate charge gate-source charge gate-drain charge gate-source plateau voltage input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time internal drain inductance internal source inductance source-drain voltage reverse recovery time recovered charge from upper edge of drain mounting base to center of die from source lead to source bonding pad IS = 25 A; VGS = 0 V; see Figure 15 IS = 20 A; dIS/dt = −100 A/µs; VGS = 0 V; VR = 25 V VDS = 30 V; RL = 1.2 Ω; VGS = 10 V; RG = 10 Ω VGS = 0 V; VDS = 25 V; f = 1 MHz; see Figure 12 ID = 25 A; VDD = 60 V; VGS = 10 V; see Figure 14 142 36 67 5 8744 923 579 65 133 146 119 2.5 7.5 0.85 83 155 1108 793 1.2 nC nC nC V pF pF ns ns ns ns nH nH V ns nC 3.4 4.0 8.4 mΩ mΩ 0.02 2 1 500 100 µA µA nA 2 1 3 4 4.4 V V V 75 70 V V Min Typ Max Unit Static characteristics 11659 pF Source-drain diode BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 5 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 200 ID (A) 8 150 6 20 003aab377 12 RDSon (mΩ) 10 003aab386 8 5.5 100 6 50 5 VGS (V) = 4.5 4 0 0 2 4 6 8 VDS (V) 10 2 5 10 15 VGS (V) 20 Tj = 25 °C Tj = 25 °C; ID = 25 A Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 8 RDSon (mΩ) VGS (V) = 5.5 6 6 003aab387 Fig 6. Drain-source on-state resistance as a function of gate-source voltage; typical values 2.4 a 1.8 03aa28 1.2 8 10 20 0.6 4 2 0 70 140 ID (A) 210 0 -60 0 60 120 Tj (°C) 180 Tj = 25 °C R DSon a = ----------------------------R DSon ( 25 ° C ) Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 7. Drain-source on-state resistance as a function of drain current; typical values BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 6 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 5 VGS(th) (V) 4 max 03aa32 10−1 ID (A) 10−2 min typ max 03aa35 3 typ 10−3 2 min 10−4 1 10−5 0 −60 10−6 0 60 120 Tj (°C) 180 0 2 4 VGS (V) 6 ID = 1 mA; VDS = VGS Tj = 25 °C; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature 180 gfs (S) 120 003aab380 Fig 10. Sub-threshold drain current as a function of gate-source voltage 16000 C (pF) Ciss 12000 003aab381 8000 Coss 60 4000 Crss 0 0 75 150 ID (A) 225 0 10-1 1 10 VDS (V) 102 Tj = 25 °C; VDS = 25 V VGS = 0 V; f = 1 MHz Fig 11. Forward transconductance as a function of drain current; typical values Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 7 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 200 003aab382 10 VGS (V) 8 003aab383 VDS = 14 V ID (A) VDS = 60 V 6 100 Tj = 25 °C 4 Tj = 175 °C 0 0 2 4 6 VGS (V) 8 2 0 0 50 100 150 QG (nC) 200 VDS = 25 V Tj = 25 °C; ID = 25 A Fig 13. Transfer characteristics: drain current as a function of gate-source voltage; typical values 250 IS (A) 200 003aab384 Fig 14. Gate-source voltage as a function of gate charge; typical values 103 IAL (A) 102 003aab385 150 (1) 100 10 Tj = 175 °C 50 Tj = 25 °C 1 10-3 (2) (3) 0 0 0.5 1 1.5 VSD (V) 2 10-2 10-1 1 tAL (ms) 10 VGS = 0 V See Table note 4 of Table 3 “Limiting values”. (1) Single-pulse; Tj = 25 °C. (2) Single-pulse; Tj = 150 °C. (3) Repetitive. Fig 15. Source current as a function of source-drain voltage; typical values Fig 16. Single-pulse and repetitive avalanche rating; avalanche current as a function of avalanche time BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 8 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 7. Package outline Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) SOT404 A E A1 mounting base D1 D HD 2 Lp 1 3 b c Q e e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.50 4.10 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.80 14.80 Q 2.60 2.20 OUTLINE VERSION SOT404 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-02-11 06-03-16 Fig 17. Package outline SOT404 (D2PAK) BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 9 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 8. Soldering 10.85 10.60 10.50 1.50 7.50 7.40 1.70 2.25 2.15 8.15 8.35 8.275 1.50 4.60 0.30 4.85 5.40 8.075 7.95 3.00 0.20 solder lands solder resist occupied area solder paste 5.08 1.20 1.30 1.55 msd057 Fig 18. Reflow soldering footprint for SOT404 BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 10 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 9. Revision history Table 6. Revision history Release date 20060817 Data sheet status Product data sheet Change notice Supersedes Document ID BUK764R0-75C_1 BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 11 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V. 11. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com BUK764R0-75C_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 — 17 August 2006 12 of 13 Philips Semiconductors BUK764R0-75C N-channel TrenchMOS standard level FET 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 17 August 2006 Document identifier: BUK764R0-75C_1