BYC5DX-500,127

TO -2 20F BYC5DX-500 Hyperfast power diode Rev. 1 — 6 July 2011 Product data sheet 1. Product profile 1.1 General description Hyperfast power diode in a SOD113 (2-lead TO-220F) plastic package. 1.2 Features and benefits  Isolated plastic package  Low thermal resistance  Low reverse recovery current  Reduces switching losses in associated MOSFET 1.3 Applications  Continuous Current Mode (CCM) Power Factor Correction (PFC)  Half-bridge/full-bridge switched-mode power supplies  Half-bridge lighting ballasts 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VRRM repetitive peak reverse voltage IF(AV) average forward current Conditions Min Typ Max Unit - - 500 V square-wave pulse; δ = 0.5; Th = 103 °C; see Figure 1; see Figure 2 - - 5 A IF = 5 A; Tj = 25 °C; see Figure 5 - 1.5 2 V IF = 5 A; Tj = 150 °C; see Figure 5 - 1.15 1.45 V IF = 5 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 25 °C; see Figure 6 - 16 - ns Static characteristics VF forward voltage Dynamic characteristics trr reverse recovery time BYC5DX-500 NXP Semiconductors Hyperfast power diode 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 K cathode 2 A anode mb n.c. mounting base; isolated mb Graphic symbol K A 001aaa020 1 2 SOD113 (TO-220F) 3. Ordering information Table 3. Ordering information Type number BYC5DX-500 BYC5DX-500 Product data sheet Package Name Description Version TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 "full pack" SOD113 All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 2 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VRRM Conditions Min Max Unit repetitive peak reverse voltage - 500 V VRWM crest working reverse voltage - 500 V VR reverse voltage DC - 500 V IF(AV) average forward current square-wave pulse; δ = 0.5; Th = 103 °C; see Figure 1; see Figure 2 - 5 A IFRM repetitive peak forward current square-wave pulse; δ = 0.5; tp = 25 µs; Th = 103 °C - 10 A IFSM non-repetitive peak forward current tp = 10 ms; sine-wave pulse; Tj(init) = 25 °C; see Figure 3 - 40 A tp = 8.3 ms; sine-wave pulse; Tj(init) = 25 °C; see Figure 3 - 44 A Tstg storage temperature -40 150 °C Tj junction temperature - 150 °C 003aag305 12 Ptot (W) 10 003aag306 10 δ=1 Ptot (W) a = 1.57 8 0.5 1.9 2.2 8 6 2.8 6 0.2 4.0 0.1 4 4 2 2 0 Fig 1. 0 2 4 6 IF(AV) (A) 0 8 Forward power dissipation as a function of average forward current; square waveform; maximum values BYC5DX-500 Product data sheet Fig 2. 0 1 3 4 5 IF(AV) (A) Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 2 © NXP B.V. 2011. All rights reserved. 3 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 003aag307 103 P IFSM (A) t tp 102 101 10-5 Fig 3. 10-4 10-3 10-2 tp (s) Non-repetitive peak forward current as a function of pulse width; square waveform; maximum values 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-h) thermal resistance from junction to heatsink without heatsink compound - - 7.2 K/W with heatsink compound; see Figure 4 - - 5.5 K/W - 60 - K/W Rth(j-a) thermal resistance from junction to ambient free air 001aaf257 10 Zth(j-h) (K/W) 1 10−1 δ= P tp T 10−2 t tp 10−3 T 10−6 10−5 10−4 10−3 10−2 10−1 1 10 tp (s) Fig 4. Transient thermal impedance from junction to heatsink as a function of pulse width BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 4 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 6. Isolation characteristics Table 6. Isolation characteristics Symbol Parameter Conditions Min Typ Max Unit Visol(RMS) RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all pins to external heatsink; sinusoidal waveform; clean and dust free - - 2500 V Cisol isolation capacitance f = 1 MHz; from cathode to external heatsink - 10 - pF Conditions Min Typ Max Unit IF = 5 A; Tj = 25 °C; see Figure 5 - 1.5 2 V IF = 5 A; Tj = 150 °C; see Figure 5 - 1.15 1.45 V IF = 10 A; Tj = 150 °C; see Figure 5 - 1.4 1.7 V VR = 500 V; Tj = 100 °C - 0.9 3 mA VR = 500 V - 9 40 µA IF = 1 A; VR = 30 V; dIF/dt = 50 A/µs; Tj = 25 °C; see Figure 6 - 15 30 ns IF = 5 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 25 °C; see Figure 6 - 16 - ns IF = 5 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 100 °C; see Figure 6 - 9.5 11 A IF = 5 A; VR = 400 V; dIF/dt = 50 A/µs; Tj = 125 °C; see Figure 6 - 0.9 3 A IF = 5 A; dIF/dt = 100 A/µs; Tj = 25 °C; see Figure 7 - 9 11 V 7. Characteristics Table 7. Characteristics Symbol Parameter Static characteristics VF IR forward voltage reverse current Dynamic characteristics trr IRM VFR reverse recovery time peak reverse recovery current forward recovery voltage BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 5 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 003aag304 10 IF (A) IF 8 dlF dt trr 6 (3) (2) (1) 4 time 25 % 0 Fig 5. 100 % Qr 2 IR 0 1 2 VF (V) IRM 3 003aac562 Forward current as a function of forward voltage Fig 6. Reverse recovery definitions; ramp recovery IF time VF VFRM VF time 001aab912 Fig 7. Forward recovery definitions BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 6 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 8. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 'full pack' SOD113 A A1 E z P q m T D HE L2 j L1(1) k Q L 1 b1 2 b w c M e 0 10 z(2) 20 mm scale 0.8 DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 c D E e HE max j k L L 1(1) L2 max m P Q q T w mm 4.6 4.0 2.9 2.5 0.9 0.7 1.1 0.9 0.7 0.4 15.8 15.2 10.3 9.7 5.08 19.0 2.7 1.7 0.6 0.4 14.4 13.5 3.3 2.8 0.5 6.5 6.3 3.2 3.0 2.6 2.3 2.6 2.55 0.4 Notes 1. Terminals are uncontrolled within zone L1. 2. z is depth of T. OUTLINE VERSION SOD113 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-04-09 07-06-18 2-lead TO-220F Package outline SOD113 (TO-220F) BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 7 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BYC5DX-500 v.1 20110706 Product data sheet - - BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 8 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 10. Legal information 10.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. BYC5DX-500 Product data sheet Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 9 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BYC5DX-500 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 6 July 2011 © NXP B.V. 2011. All rights reserved. 10 of 11 BYC5DX-500 NXP Semiconductors Hyperfast power diode 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Isolation characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Contact information. . . . . . . . . . . . . . . . . . . . . .10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 July 2011 Document identifier: BYC5DX-500