BYC8D-600

TO -22 0A C BYC8D-600 Hyperfast power diode Rev. 01 — 27 December 2010 Product data sheet 1. Product profile 1.1 General description Hyperfast power diode in a SOD59 (2-lead TO-220AC) plastic package. 1.2 Features and benefits Low reverse recovery current and low thermal resistance Reduces switching losses in associated MOSFET 1.3 Applications Continuous Current Mode (CCM) Power Factor Correction (PFC) Half-bridge/full-bridge switched-mode power supplies Half-bridge lighting ballasts 1.4 Quick reference data Table 1. Symbol VRRM IF(AV) Quick reference data Parameter repetitive peak reverse voltage average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 103 °C; see Figure 1; see Figure 2 IF = 8 A; Tj = 25 °C IF = 8 A; Tj = 150 °C; see Figure 4 Dynamic characteristics trr reverse recovery time IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 25 °C; see Figure 5 20 ns Conditions Min Typ Max Unit 600 8 V A Static characteristics VF forward voltage 2 1.5 2.9 V 1.85 V NXP Semiconductors BYC8D-600 Hyperfast power diode 2. Pinning information Table 2. Pin 1 2 mb Pinning information Symbol Description K A mb cathode anode mounting base; connected to cathode mb K A 001aaa020 Simplified outline Graphic symbol 1 2 SOD59 (TO-220AC) 3. Ordering information Table 3. Ordering information Package Name BYC8D-600 TO-220AC Description plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC Version SOD59 Type number 4. Limiting values Table 4. Symbol VRRM VRWM VR IF(AV) IFRM IFSM Tstg Tj Limiting values Parameter repetitive peak reverse voltage crest working reverse voltage reverse voltage average forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature DC square-wave pulse; δ = 0.5 ; Tmb ≤ 103 °C; see Figure 1; see Figure 2 square-wave pulse; δ = 0.5 ; tp = 25 µs; Tmb ≤ 103 °C tp = 8.3 ms; sine-wave pulse; Tj(init) = 150 °C tp = 10 ms; sine-wave pulse; Tj(init) = 150 °C Conditions Min -40 Max 600 600 600 8 16 60 55 150 150 Unit V V V A A A A °C °C In accordance with the Absolute Maximum Rating System (IEC 60134). BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 2 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 30 Ptot (W) 25 0.5 003aab472 20 Ptot (W) 16 2.8 12 4.0 1.9 2.2 003aab471 a = 1.57 δ =1 20 0.2 0.1 15 8 10 4 5 0 0 4 8 IF(AV) (A) 12 0 0 2 4 6 IF(AV) (A) 8 Fig 1. Forward power dissipation as a function of average forward current; square waveform; maximum values Fig 2. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 3 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 5. Thermal characteristics Table 5. Symbol Rth(j-mb) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to mounting base thermal resistance from junction to ambient free air Conditions see Figure 3 in free air Min Typ 60 Max 2.5 Unit K/W K/W 10 Zth(j-mb) (K/W) 1 001aag913 10−1 P δ= tp T 10−2 tp t T 10−3 10−6 10−5 10−4 10−3 10−2 10−1 1 10 tp (s) Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 4 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 6. Characteristics Table 6. Symbol VF IR Characteristics Parameter forward voltage reverse current Conditions IF = 8 A; Tj = 25 °C IF = 8 A; Tj = 150 °C; see Figure 4 VR = 600 V VR = 500 V; Tj = 100 °C Dynamic characteristics Qr trr recovered charge reverse recovery time IF = 1 A; VR = 100 V; dIF/dt = 100 A/µs; Tj = 25 °C IF = 1 A; VR = 30 V; dIF/dt = 50 A/µs; Tj = 25 °C IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 100 °C IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 25 °C; see Figure 5 IRM peak reverse recovery current IF = 8 A; VR = 400 V; dIF/dt = 50 A/µs; Tj = 125 °C IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 100 °C VFR forward recovery voltage IF = 10 A; dIF/dt = 100 A/µs; Tj = 25 °C; see Figure 6 13 30 32 20 1.5 9.5 8 52 40 5.5 12 10 nC ns ns ns A A V Min Typ 2 1.5 9 1.1 Max 2.9 1.85 40 3 Unit V V µA mA Static characteristics 20 IF (A) 16 003aac976 IF dlF dt trr 12 time 8 25 % (1) (2) (3) Qr 100 % 4 IR IRM 003aac562 0 0 1 2 3 VF (V) 4 Fig 4. Forward current as a function of forward voltage Fig 5. Reverse recovery definitions; ramp recovery BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 5 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode IF time VF VFRM VF time 001aab912 Fig 6. Forward recovery definitions BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 6 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59 E P A1 A q D1 D H Q b1 L 1 2 b e c 0 Dimensions Unit mm max nom min A 4.7 4.3 A1 b b1(1) 1.7 1.3 c D D1 E e 5.08 (REF) 5 scale H L P 10 mm Q 2.6 2.2 q 2.9 2.7 sod059_po 1.40 0.95 1.15 0.70 0.65 15.8 0.45 15.6 6.8 10.30 6.4 9.65 16.25 15.0 15.70 12.5 3.7 3.5 Note 1. Protruded dambar are included in the dimension. Outline version SOD59 References IEC JEDEC 2-lead TO-220AC JEITA European projection Issue date 09-08-17 09-08-25 Fig 7. Package outline SOD59 (TO-220AC) BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 7 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 8. Revision history Table 7. Revision history Release date 20101227 Data sheet status Product data sheet Change notice Supersedes Document ID BYC8D-600 v.1 BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 8 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 9 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BYC8D-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 December 2010 10 of 11 NXP Semiconductors BYC8D-600 Hyperfast power diode 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Contact information. . . . . . . . . . . . . . . . . . . . . .10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 December 2010 Document identifier: BYC8D-600