BYT28-300,127

TO -22 0A B BYT28 series Dual rectifier diodes ultrafast Rev. 5 — 3 November 2011 Product data sheet 1. Product profile 1.1 General description Dual, common cathode, ultrafast, epitaxial rectifier diodes in the SOT78 (TO-220AB) leaded package. 1.2 Features and benefits  Low forward voltage drop  Soft recovery characteristics  Low thermal resistance.  Fast switching  High thermal cycling performance 1.3 Applications  Output rectifiers in high frequency switched-mode power supplies. 1.4 Quick reference data  VR  300 V (BYT28-300)  VR  500 V (BYT28-500)  VF  1.05 V.  IO(AV)  10 A  trr  60 ns 2. Pinning information Table 1. Pinning Pin Description 1 anode 1 2 cathode 3 anode 2 mb mounting base; connected to cathode Simplified outline Symbol mb 1 3 2 sym084 1 2 3 SOT78 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 3. Ordering information Table 2. Ordering information Type number Package BYT28-300 Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 BYT28-500 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VRRM repetitive peak reverse voltage BYT28-300 - 300 V BYT28-500 - 500 V - 300 V - 500 V - 10 A continuous reverse voltage VR BYT28-300 Tmb  147 C BYT28-500 Tmb  147 C [1] IO(AV) average rectified output current both diodes conducting; square wave;  = 0.5; Tmb  115 C IFSM non-repetitive peak forward current per diode t = 10 ms - 50 A t = 8.3 ms sinusoidal; with reapplied VRRM(max) - 55 A Tstg storage temperature 40 +150 C Tj junction temperature - 150 C [1] Neglecting switching and reverse current losses. 5. Thermal characteristics Table 4. Characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base per diode; see Figure 1 - - 4.5 K/W both diodes conducting - - 3 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 2 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 001aab919 10 Zth(j-mb) (K/W) 1 10−1 Ptot 10−2 δ= tp 10−5 10−4 10−3 10−2 10−1 T t T 10−3 10−6 tp 1 10 tp (s) Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse duration 6. Characteristics Table 5. Characteristics Tj = 25 C; unless otherwise stated. Symbol Parameter Conditions Min Typ Max Unit IF = 5 A; Tj = 150 C - 0.95 1.05 V IF = 10 A - 1.3 1.4 V VR = VRRM - 2 10 A VR = VRRM; Tj = 100 C - 10 200 A Characteristics are per diode VF IR forward voltage reverse current QS reverse recovery charge IF = 2 A; VR  30 V; dIF/dt = 20 A/s; see Figure 9 - 50 60 nC trr reverse recovery time IF = 1 A; VR  30 V; dIF/dt = 100 A/s; see Figure 6 - 50 60 ns IRRM repetitive peak reverse current IF = 5 A; VR  30 V; dIF/dt = 50 A/s; Tj = 100 C; see Figure 7 - 2 3 A Vfr forward recovery voltage IF = 1 A; dIF/dt = 10 A/s - 2.5 - V BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 3 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast IF dlF IF dt trr time time VF 10 % 100 % Qr IR VFRM VF IRM 001aab911 time 001aab912 Fig 2. Reverse recovery definitions Fig 3. 001aab913 10 PF (W) δ = 1.0 8 105 Tmb(max) (°C) 114 0.5 001aab914 6 a = 1.57 PF (W) 1.9 4 132 2.8 123 127.5 0.2 4 136.5 4 132 0.1 I δ= tp tp 2 136.5 141 T 2 141 t T Vo = 0.945 V Rs = 0.021 Ω 145.5 0 0 150 0 2 4 6 8 1 2 3 Per diode. Per diode. IF(AV) = IF(RMS)  . a = form factor = IF(RMS) / IF(AV). Forward power dissipation as a function of average forward current; maximum values BYT28_SER Product data sheet Fig 5. 145.5 150 0 IF(AV) (A) Fig 4. 123 Tmb(max) (°C) 127.5 2.2 118.5 6 Forward recovery definitions 4 5 IF(AV) (A) Forward power dissipation as a function of average forward current; maximum values All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 4 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 001aab915 103 t rr (ns) 001aab916 10 IRRM (A) IF = 5 A 102 IF = 5 A IF = 5 A 1 IF = 1 A IF = 1 A IF = 1 A 10−1 10 Tj = 25 °C Tj = 100 °C Tj = 25 °C Tj = 100 °C 1 10 1 −dIF/dt (A/μs) 102 10−2 1 Per diode. Fig 6. −dIF/dt (A/μs) 102 Per diode. Reverse recovery time as a function of time differential forward current; maximum values 001aab917 15 Tj = 25 °C Tj = 150 °C IF (A) 10 Fig 7. Repetitive peak reverse current as a function of time differential forward current; maximum values 001aab918 103 QS (nC) IF = 5 A 102 10 typ max IF = 2 A 10 5 1 0 0 0.5 1 1 1.5 VF (V) 10 −dIF/dt (A/μs) 102 Per diode. Tj = 25 C. Fig 8. Forward current as a function of forward voltage Fig 9. Reverse recovery charge as a function of time differential forward current; maximum values 7. Package information Epoxy meets UL94 V0 at 1⁄8 inch. BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 8. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig 10. Package outline SOT78 (SC-46) BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 9. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes BYT28_SER v.5 20111103 Product data sheet - BYT28_SER v.4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BYT28_SER v.4 20041122 Product data sheet - BYT28_SERIES v.3 BYT28_SERIES v.3 19981001 Product specification - BYT28_SERIES v.2 BYT28_SERIES v.2 19980901 Product specification - BYT28_SERIES v.1 BYT28_SERIES v.1 19960201 Product specification - - BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 7 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 8 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BYT28_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 9 of 10 BYT28 series NXP Semiconductors Dual rectifier diodes ultrafast 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package information . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 November 2011 Document identifier: BYT28_SER