BYV25D-600

BYV25D-600 Rectifier diode, ultrafast Rev. 01 — 29 July 2008 Product data sheet 1. Product profile 1.1 General description Ultrafast, epitaxial rectifier diode in a SOT428 (DPAK) surface-mountable plastic package. 1.2 Features I Fast switching I Soft recovery characteristic I Low forward voltage drop I Low thermal resistance I High thermal cycling performance 1.3 Applications I High frequency switched-mode power supplies I Discontinuous Current Mode (DCM) Power Factor Correction (PFC) 1.4 Quick reference data I VRRM ≤ 600 V I VF ≤ 1.11 V I IF(AV) ≤ 5 A I trr ≤ 60 ns 2. Pinning information Table 1. Pin 1 2 3 mb Pinning Description no connection cathode (k) anode (a) mounting base; cathode (k) 2 1 3 [1] Simplified outline mb Graphic symbol k a 001aaa020 SOT428 (DPAK) [1] It is not possible to connect to pin 2 of the SOT428 package. NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 3. Ordering information Table 2. Ordering information Name BYV25D-600 DPAK Description plastic single-ended surface-mounted package (DPAK); 3-leads (one lead cropped) Version SOT428 Type number Package 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VRRM VRWM VR IF(AV) IFRM IFSM Tstg Tj Parameter repetitive peak reverse voltage crest working reverse voltage reverse voltage average forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature square waveform; δ = 1.0; Tmb ≤ 100 °C square waveform; δ = 0.5; Tmb ≤ 131 °C square waveform; δ = 0.5; Tmb ≤ 131 °C t = 10 ms; sinusoidal waveform t = 8.3 ms; sinusoidal waveform Conditions Min −40 Max 600 600 600 5 10 60 66 +150 150 Unit V V V A A A A °C °C BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 2 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 5. Thermal characteristics Table 4. Symbol Rth(j-mb) Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to mounting base Conditions with heatsink compound; see Figure 1 [1] Min - Typ 50 Max 3.0 - Unit K/W K/W thermal resistance from junction to ambient in free air Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 10 Zth(j-mb) (K/W) 1 003aac235 10−1 P δ= tp T 10−2 tp t T 10−3 10−6 10−5 10−4 10−3 10−2 10−1 1 10 tp (s) Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse width BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 3 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified. Symbol VF IR Parameter forward voltage reverse current Conditions IF = 5 A; Tj = 150 °C; see Figure 2 IF = 5 A VR = 600 V VR = 600 V; Tj = 100 °C Dynamic characteristics Qr trr IRM recovered charge reverse recovery time peak reverse recovery current forward recovery voltage IF = 2 A to VR ≥ 30 V; dIF/dt = 20 A/µs; see Figure 3 IF = 1 A to VR ≥ 30 V; dIF/dt = 100 A/µs; see Figure 3 IF = 10 A to VR ≥ 30 V; dIF/dt = 50 A/µs; Tj = 100 °C; see Figure 3 IF = 10 A; dIF/dt = 10 A/µs; see Figure 4 40 50 3 70 60 5.5 nC ns A Min Typ 0.97 1.12 2 0.1 Max 1.11 1.30 50 0.35 Unit V V µA mA Static characteristics VFR - 3.2 - V 15 IF (A) 003aac232 10 (1) (2) (3) 5 0 0 0.4 0.8 1.2 VF (V) 1.6 (1) Tj = 150 °C; typical values (2) Tj = 150 °C; maximum values (3) Tj = 25 °C; maximum values Fig 2. Forward current as a function of forward voltage BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 4 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast IF IF dlF dt trr time time 10 % Qr 100 % VF IR IRM 001aab911 VF VFR time 001aab912 Fig 3. Reverse recovery definitions Fig 4. Forward recovery definitions 10 Ptot (W) 8 003aac233 8 Ptot (W) a = 1.57 6 003aac234 δ=1 0.5 6 0.2 4 0.1 2 2 4 4.0 2.8 2.2 1.9 0 0 2 4 6 IF(AV) (A) 8 0 0 2 4 IF(AV) (A) 6 IF(AV) = IF(RMS) × √δ a = form factor = IF(RMS) / IF(AV) Fig 5. Forward power dissipation as a function of average forward current; square waveform; maximum values Fig 6. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 5 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 7. Package outline Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428 y E b2 A A1 A E1 mounting base D1 HD D2 2 L2 1 3 L L1 b1 e e1 b w M A c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 2.38 2.22 A1 0.93 0.46 b 0.89 0.71 b1 1.1 0.9 b2 5.46 5.00 c 0.56 0.20 D1 6.22 5.98 D2 min 4.0 E 6.73 6.47 E1 min 4.45 e 2.285 e1 4.57 HD 10.4 9.6 L 2.95 2.55 L1 min 0.5 L2 0.9 0.5 w 0.2 y max 0.2 OUTLINE VERSION SOT428 REFERENCES IEC JEDEC TO-252 JEITA SC-63 EUROPEAN PROJECTION ISSUE DATE 06-02-14 06-03-16 Fig 7. BYV25D-600_1 Package outline SOT428 (TO-252) © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 6 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 8. Revision history Table 6. Revision history Release date 20080729 Data sheet status Product data sheet Change notice Supersedes Document ID BYV25D-600_1 BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 7 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 9.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BYV25D-600_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 29 July 2008 8 of 9 NXP Semiconductors BYV25D-600 Rectifier diode, ultrafast 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 3 4 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 July 2008 Document identifier: BYV25D-600_1