BZA868A

DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD127 BZA800A-series Quadruple ESD transient voltage suppressor Product data sheet Supersedes data of 2000 May 01 2000 Sep 25 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor FEATURES • ESD rating >8 kV, according to IEC1000-4-2 • SOT353 (SC-88A) surface mount package • Common anode configuration. APPLICATIONS • Computers and peripherals • Audio and video equipment • Communication systems. DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT353 (SC-88A) package for 4-bit wide ESD transient suppression. MARKING 1 2 3 5 handbook, halfpage 4 BZA800A-series PINNING PIN 1 2 3 4 5 cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION 1 3 2 4 5 TYPE NUMBER BZA856A BZA862A BZA868A BZA820A MARKING CODE Z1 Z2 Z3 Z4 MGT580 Fig.1 Simplified outline SOT353 (SC-88A). 2000 Sep 25 2 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM Ptot PZSM working current continuous forward current total power dissipation non repetitive peak reverse power dissipation: BZA856A, BZA862A, BZA868A, BZA820A Tstg Tj Note 1. DC working current limited by Ptot(max). THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS all diodes loaded storage temperature junction temperature Tamb = 25 °C Tamb = 25 °C Tamb = 25 °C square pulse; tp = 1 ms; see Fig.3 − − − − − − PARAMETER CONDITIONS BZA800A-series MIN. MAX. UNIT note 1 200 3.75 335 mA mA A mW non-repetitive peak forward current tp = 1 ms; square pulse 24 17 +150 150 W W °C °C −65 − VALUE 370 UNIT K/W 2000 Sep 25 3 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current BZA856A BZA862A BZA868A BZA820A VZ working voltage BZA856A BZA862A BZA868A BZA820A rdiff differential resistance BZA856A BZA862A BZA868A BZA820A SZ temperature coefficient BZA856A BZA862A BZA868A BZA820A Cd diode capacitance BZA856A BZA862A BZA868A BZA820A IZSM non-repetitive peak reverse current BZA856A BZA862A BZA868A BZA820A tp = 1 ms; Tamb = 25 °C − − − − f = 1 MHz; VR = 0 − − − − I Z = 1 mA − − − − I Z = 1 mA − − − − VR = 3 V VR = 4 V VR = 4.3 V VR = 15 V I Z = 1 mA 5.32 5.89 6.46 19 − − − − CONDITIONS IF = 200 mA − MIN. BZA800A-series TYP. − − − − − 5.6 6.2 6.8 20 − − − − −0.2 1.8 3 16 − − − − − − − − MAX. 1.3 2 000 700 200 100 5.88 6.51 7.14 21 400 300 200 125 − − − − 240 200 180 50 3.2 2.9 2.6 0.6 UNIT V nA nA nA nA V V V V Ω Ω Ω Ω mV/K mV/K mV/K mV/K pF pF pF pF A A A A 2000 Sep 25 4 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA800A-series handbook, halfpage 10 MGT583 102 handbook, halfpage PZSM (W) MGT584 BZA856A I ZSM (A) BZA862A BZA856A, BZA862A, BZA868A BZA820A BZA868A 1 10 BZA820A 10−1 10− 2 10−1 1 t p (ms) 10 1 10−2 10−1 1 t p (ms) 10 PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Fig.3 Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). MGT585 MGT586 handbook, halfpage 200 Cd 160 handbook, halfpage 400 (pF) Ptot (mW) 300 120 BZA856A 80 BZA862A BZA868A 100 40 BZA820A 0 0 5 10 15 0 0 50 100 Tamb (°C) 150 200 VR (V) Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. Fig.5 Power derating curve. 2000 Sep 25 5 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor BZA800A-series handbook, full pagewidth ESD TESTER RZ CZ 450 Ω RG 223/U 50 Ω coax 10× ATTENUATOR note 1 DIGITIZING OSCILLOSCOPE 50 Ω IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω 1/4 BZA800A Note 1: attenuator is only used for open socket high voltage measurements vertical scale = 100 V/div horizontal scale = 50 ns/div BZA820A GND-4 BZA868A GND-3 BZA862A GND-2 BZA856A GND unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND-1 vertical scale = 10 V/div horizontal scale = 50 ns/div clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND GND vertical scale = 100 V/div horizontal scale = 50 ns/div vertical scale = 10 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) MGT587 Fig.6 ESD clamping test set-up and waveforms. 2000 Sep 25 6 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor APPLICATION INFORMATION Typical common anode application BZA800A-series A quadruple transient suppressor in a SOT353 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs 7 and 8. handbook, full pagewidth keyboard, terminal, printer, etc. I/O A B C D FUNCTIONAL DECODER BZA800A GND MGT581 Fig.7 Computer interface protection. handbook, full pagewidth VDD address bus VGG RAM ROM I/O data bus CPU CLOCK control bus BZA800A GND MGT582 Fig.8 Microprocessor protection. 2000 Sep 25 7 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA800A is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. BZA800A-series 2000 Sep 25 8 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor PACKAGE OUTLINE BZA800A-series Plastic surface mounted package; 5 leads SOT353 D B E A X y HE vMA 5 4 Q A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT353 REFERENCES IEC JEDEC EIAJ SC-88A EUROPEAN PROJECTION ISSUE DATE 97-02-28 2000 Sep 25 9 NXP Semiconductors Product data sheet Quadruple ESD transient voltage suppressor DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION BZA800A-series This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2000 Sep 25 10 above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/03/pp11 Date of release: 2000 Sep 25 Document order number: 9397 750 07142