BZA868AVL

DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD127 BZA800AVL series Quadruple low capacitance ESD suppressor Product data sheet Supersedes data of 2003 Apr 01 2003 Oct 20 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor FEATURES • Low diode capacitance • Low leakage current • SOT353 (SC-88A) surface mount package • Common anode configuration. APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment. DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT353 (SC-88A) package for 4-bit wide ESD transient suppression. MARKING TYPE NUMBER BZA856AVL BZA862AVL BZA868AVL ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BZA856AVL BZA862AVL BZA868AVL − − − DESCRIPTION plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads MARKING CODE R3 R2 R1 Fig.1 1 2 3 5 handbook, halfpage 4 BZA800AVL series PINNING PIN 1 2 3 4 5 cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION 1 3 2 4 5 MGT580 Simplified outline (SOT353; SC-88A) and symbol. VERSION SOT353 SOT353 SOT353 2003 Oct 20 2 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM Ptot PZSM Tstg Tj ESD working current continuous forward current non-repetitive peak forward current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature electrostatic discharge HBM MIL-Std 883 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD IEC 61000-4-2, level 4 (ESD) HBM MIL-Std 883, class 3 THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point; note 1 CONDITIONS all diodes loaded one diode loaded all diodes loaded >4 kV Tamb = 25 °C Tamb = 25 °C tp = 1 ms; square pulse Tamb = 25 °C; note 2; see Fig.5 square pulse; tp = 1 ms PARAMETER CONDITIONS BZA800AVL series MIN. − − − − − −65 − MAX. UNIT note 1 200 3.5 300 6 +150 150 − − mA mA A mW W °C °C kV kV IEC 61000-4-2 (contact discharge) 15 10 CONDITIONS >15 kV (air); >8 kV (contact discharge) VALUE 410 200 185 UNIT K/W K/W K/W Note 1. Solder point of common anode (pin 2). 2003 Oct 20 3 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current BZA856AVL BZA862AVL BZA868AVL VZ working voltage BZA856AVL BZA862AVL BZA868AVL rdif differential resistance BZA856AVL BZA862AVL BZA868AVL SZ temperature coefficient BZA856AVL BZA862AVL BZA868AVL Cd diode capacitance BZA856AVL BZA862AVL BZA868AVL diode capacitance BZA856AVL BZA862AVL BZA868AVL IZSM non-repetitive peak reverse current BZA856AVL BZA862AVL BZA868AVL tp = 1 ms; Tamb = 25 °C − − − f = 1 MHz; VR = 5 V − − − f = 1 MHz; VR = 0 − − − I Z = 1 mA − − − I Z = 1 mA − − − VR = 3 V VR = 4 V VR = 4.3 V I Z = 1 mA 5.32 5.89 6.46 − − − CONDITIONS IF = 200 mA − MIN. BZA800AVL series TYP. − − − − 5.6 6.2 6.8 − − − 1.3 2.4 2.9 22 18 16 12 9 8 − − − MAX. 1.2 200 100 20 5.88 6.51 7.14 200 150 100 − − − 28 22 19 17 12 11 0.90 0.85 0.80 UNIT V nA nA nA V V V Ω Ω Ω mV/K mV/K mV/K pF pF pF pF pF pF A A A 2003 Oct 20 4 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA800AVL series handbook, halfpage 10 MLD997 102 handbook, halfpage MLD999 IZSM (A) PZSM (W) BZA856AVL BZA856AVL 1 10 BZA868AVL BZA862AVL/BZA868AVL BZA862AVL 10−1 10−2 10−1 1 tp (ms) 10 1 10−2 10−1 1 tp (ms) 10 Fig.3 Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). handbook, halfpage 26 Cd 22 MLD998 handbook, halfpage 400 MLD793 (pF) Ptot (mW) 300 18 200 BZA856AVL 14 BZA862AVL 100 10 BZA868AVL 6 0 1 2 3 4 VR (V) 5 0 0 50 100 Tamb (°C) 150 Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. Fig.5 Power derating curve. 2003 Oct 20 5 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor BZA800AVL series handbook, full pagewidth ESD TESTER RZ CZ 450 Ω RG 223/U 50 Ω coax 10 × ATTENUATOR note 1 DIGITIZING OSCILLOSCOPE 50 Ω IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω 1/4 BZA800AVL Note 1: attenuator is only used for open socket high voltage measurements vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div BZA868AVL GND3 BZA862AVL GND2 GND GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) BZA856AVL clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND GND vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) MLE004 Fig.6 ESD clamping test set-up and waveforms. 2003 Oct 20 6 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor APPLICATION INFORMATION Typical common anode application BZA800AVL series A quadruple transient suppressor in a SOT353 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8. handbook, full pagewidth keyboard, terminal, printer, etc. I/O A B C D FUNCTIONAL DECODER BZA800AVL GND MLE006 Fig.7 Computer interface protection. handbook, full pagewidth VDD address bus VGG RAM ROM I/O data bus CPU CLOCK control bus BZA800AVL GND MLE007 Fig.8 Microprocessor protection. 2003 Oct 20 7 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA800AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. BZA800AVL series 2003 Oct 20 8 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor PACKAGE OUTLINE BZA800AVL series Plastic surface mounted package; 5 leads SOT353 D B E A X y HE vMA 5 4 Q A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT353 REFERENCES IEC JEDEC EIAJ SC-88A EUROPEAN PROJECTION ISSUE DATE 97-02-28 2003 Oct 20 9 NXP Semiconductors Product data sheet Quadruple low capacitance ESD suppressor DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION BZA800AVL series This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 2003 Oct 20 10 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/02/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11934