CBT16211DL,518

INTEGRATED CIRCUITS CBT16211 24-bit bus switch with 12-bit output enables Product data 
   2001 Jun 13 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables FEATURES CBT16211 DESCRIPTION • 5 Ω switch connection between two ports • TTL compatible control input levels • Package options include plastic shrink small outline (SSOP), The CBT16211 provides 24 bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device is organized as a dual 12-bit bus switch with separate output-enable (OE) inputs. It can be used as two 12-bit bus switches or as one 24-bit bus switch. When OE is low, the associated 12-bit bus switch is on, and port A is connected to port B. When OE is high, the switch is open, and a high-impedance state exists between the ports. thin shrink small outline (TSSOP) • ESD protection exceeds 1000 V CDM per JESD22-C101 • Latch-up testing is done to JESDEC Standard JESD78 which exceeds 100 mA The CBT16211 is characterized for operation from –40 to 85 °C. QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25 °C; GND = 0 V PARAMETER TYPICAL UNIT tPLH tPHL Propagation delay An to Yn CL = 50 pF; VCC = 5 V 0.25 ns CIN Input capacitance VI = 0 V or VCC 4.3 pF COUT Output capacitance Outputs disabled; VO = 0 V or VCC 6.9 pF ICC Total supply current Outputs disabled; VCC = 5.5 V 3.0 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE ORDER CODE DWG NUMBER 56-Pin Plastic SSOP Type III –40 to 85 °C CBT16211DL SOT371-1 56-Pin Plastic TSSOP Type II –40 to 85 °C CBT16211DGG SOT364-1 FUNCTION TABLE LOGIC SYMBOL INPUTS OUTPUTS 2 1OE 2OE 1A, 1B 2A, 2B L L 1A = 1B 2A = 2B L H 1A = 1B Z H L Z 2A = 2B H H Z Z 54 1A1 1B1 14 42 1A12 H = High voltage level L = Low voltage level Z = High impedance “off ” state 1B12 56 1OE 15 41 2B1 2A1 28 2A12 29 2B12 55 2OE SA00510 2001 Jun 13 2 853-2259 26502 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables PIN CONFIGURATION PIN DESCRIPTION PIN NUMBER SYMBOL 1 NC NAME AND FUNCTION No internal connection NC 1 56 1OE 1A1 2 55 2OE 56, 55 1OE, 2OE Output Enables 1A2 3 54 1B1 Inputs 4 53 1B2 2, 3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 14 1A1-1A12 1A3 1A4 5 52 1B3 54, 53, 52, 51, 50, 48, 47, 46, 45, 44, 43, 42 1B1-1B12 Outputs 1A5 6 51 1B4 1A6 7 50 1B5 15, 16, 18, 20, 21, 22, 23, 24, 25, 26, 27, 28 2A1-2A12 Inputs GND 8 49 GND 1A7 48 1B6 41, 40, 39, 37, 36, 35, 34, 33, 32, 31, 30, 29 2B1-2B12 Outputs 9 1A8 10 47 1B7 8, 19, 38, 49 GND Ground (0 V) 1A9 11 46 1B8 17 VCC Positive supply voltage 1A10 12 45 1B9 1A11 13 44 1B10 1A12 14 43 1B11 2A1 15 42 1B12 2A2 16 41 2B1 VCC 17 40 2B2 2A3 18 39 2B3 GND 19 38 GND 2A4 20 37 2B4 2A5 21 36 2B5 2A6 22 35 2B6 2A7 23 34 2B7 2A8 24 33 2B8 2A9 25 32 2B9 2A10 26 31 2B10 2A11 27 30 2B11 2A12 28 29 2B12 SA00509 2001 Jun 13 CBT16211 3 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables CBT16211 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC CONDITIONS RATING DC supply voltage IIK DC input diode current VI DC input voltage3 VI < 0 voltage3 VOUT DC output IOUT DC output current UNIT –0.5 to +7.0 V –50 mA –0.5 to +7.0 V output in Off or High state –0.5 to +5.5 V output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL LIMITS PARAMETER Min Max UNIT VCC DC supply voltage 4.5 5.5 V VIH High-level input voltage 2.0 — V VIL Low-level Input voltage — 0.8 V –40 +85 °C Tamb Operating free-air temperature range DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = –40 to +85 °C UNIT Min Typ1 Max VIK Input clamp voltage VCC = 4.5 V; II = –18 mA — — –1.2 V VP Output high pass voltage VIN = VCC = 5.0 V; IOUT = –100 µA 3.4 3.6 3.9 V VCC = 0 V; VI = 5.5 V — — 10 VCC = 5.5 V; VI = GND or 5.5 V — — ±1 Quiescent supply current VCC = 5.5 V; IO = 0, VI = VCC or GND — — 3 µA Additional supply current per input pin2 VCC = 5.5 V, one input at 3.4 V, other inputs at VCC or GND — — 2.5 mA Control pins VI= 3 V or 0 — 4.5 — pF Port OFF capacitance VO = 3 V or 0, OE = VCC — 6.9 — pF VCC = 4.0 V; V1 = 2.4 V; II = 15 mA — 14 20 VCC = 4.5 V; V1 = 0 V; II = 64 mA — 5 7 VCC = 4.5 V; V1 = 0 V; II = 30 mA — 5 7 VCC = 4.5 V; V1 = 2.4 V; II = –15 mA — 8 12 II ICC ∆ICC CI CI(OFF) ron3 Input leakage current NOTES: 1. All typical values are at VCC = 5 V, Tamb = 25 °C. 2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals. 2001 Jun 13 4 µA Ω Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables CBT16211 AC CHARACTERISTICS GND = 0 V; tR; CL = 50 pF SYMBOL PARAMETER FROM (INPUT) TO (OUTPUT) A or B VCC = 5.0 V ±0.5 V UNIT Min Max B or A — 0.25 ns tpd Propagation delay1 ten Output enable time to High and Low level OE A or B 1.5 6.0 ns tdis Output disable time from High and Low level OE A or B 1.5 6.0 ns NOTE: 1. This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance). AC WAVEFORMS TEST CIRCUIT AND WAVEFORMS VM = 1.5 V, VIN = GND to 3.0 V. 7V 3V 1.5 V 500 Ω From Output Under Test 1.5 V S1 Open GND INPUT 500 Ω CL = 50 pF 0V tPLH tPHL Load Circuit VOH 1.5 V 1.5 V OUTPUT VOL SA00028 Waveform 1. Input (An) to Output (Yn) Propagation Delays TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. 3V Output Control (Low-level enabling ) 1.5 V SA00012 1.5 V 0V tPLZ tPZL 3.5 V Output Waveform 1 S1 at 7 V (see Note) 1.5 V VOL tPHZ tPZH Output Waveform 2 S1 at Open (see Note) VOL + 0.3 V VOH VOH – 0.3 V 1.5 V 0V Note: Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. SA00029 Waveform 2. 3-State Output Enable and Disable Times 2001 Jun 13 5 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm 2001 Jun 13 6 CBT16211 SOT371-1 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm 2001 Jun 13 7 CBT16211 SOT364-1 Philips Semiconductors Product data 24-bit bus switch with 12-bit output enables CBT16211 Data sheet status Data sheet status [1] Product status [2] Definitions Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.  Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 06-01 Document order number: 
   2001 Jun 13 8 9397 750 08481