CBT3244AD,112

CBT3244A Octal bus switch with quad output enables Rev. 02 — 15 September 2005 Product data sheet 1. General description The CBT3244A provides eight bits of high-speed TTL-compatible bus switching in a standard '244 device pinout. The low ON-state resistance of the switch allows connections to be made with minimal propagation delay. The CBT3244A device is organized as two 4-bit low-impedance switches with separate output-enable (OE) inputs. When OE is LOW, the switch is on and data can flow from port A to port B, or vice versa. When OE is HIGH, the switch is open and high-impedance state exists between the two ports. The CBT3244A is characterized for operation from −40 °C to +85 °C. 2. Features ■ ■ ■ ■ Standard '244-type pinout 5 Ω switch connection between two ports TTL compatible control input levels Package options include: ◆ plastic small outline (SO20) ◆ shrink small outline (SSOP20) ◆ shrink small outline, QSOP (SSOP20) ◆ thin shrink small outline (TSSOP20) ◆ depopulated heatsink very thin quad flat package, no leads (DHVQFN20) ■ Latch-up protection exceeds 500 mA per JESD78 ■ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 3. Ordering information Table 1: Ordering information Tamb = −40 °C to +85 °C Type number Topside mark Package Name Description Version CBT3244ABQ CT3244A DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat SOT764-1 package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm CBT3244APW CT3244A TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 CBT3244ADS CT3244ADS SSOP20 [1] plastic shrink small outline package; 20 leads; body width 3.9 mm; SOT724-1 lead pitch 0.635 mm CBT3244ADB CT3244A plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 CBT3244AD [1] SSOP20 CBT3244AD SO20 Also known as QSOP20. Standard packing quantities and other packaging data are available at www.standardics.philips.com/packaging. 4. Functional diagram CBT3244A 1A1 1B1 1A4 1B4 1OE 2A1 2B1 2A4 2B4 2OE 002aab655 Fig 1. Logic diagram of CBT3244A 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 2 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 5. Pinning information 5.1 Pinning 1OE 1 1 2 20 VCC 19 2OE 1OE 1A1 1A1 2 20 VCC 19 2OE 2B4 3 18 1B1 2B4 3 18 1B1 1A2 4 17 2A4 1A2 4 17 2A4 2B3 5 16 1B2 2B3 5 1A3 6 15 2A3 1A3 6 2B2 7 14 1B3 2B2 7 14 1B3 1A4 8 13 2A2 1A4 8 13 2A2 2B1 9 12 1B4 2B1 9 12 1B4 GND 10 11 2A1 GND 10 11 2A1 CBT3244APW 002aab651 Fig 2. Pin configuration for TSSOP20 16 1B2 15 2A3 002aab654 Fig 3. Pin configuration for SO20 1OE 1 20 VCC 1A1 2 19 2OE 1OE 1 20 VCC 2B4 3 18 1B1 1A1 2 19 2OE 1A2 4 17 2A4 2B4 3 18 1B1 2B3 5 16 1B2 1A2 4 17 2A4 1A3 6 15 2A3 2B3 5 2B2 7 14 1B3 1A3 6 1A4 8 13 2A2 2B2 7 14 1B3 2B1 9 12 1B4 1A4 8 13 2A2 GND 10 11 2A1 2B1 9 12 1B4 GND 10 11 2A1 CBT3244ADS 002aab652 Fig 4. Pin configuration for SSOP20 (QSOP) CBT3244ADB 16 1B2 15 2A3 002aab653 Fig 5. Pin configuration for SSOP20 9397 750 13362 Product data sheet CBT3244AD © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 3 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 1 terminal 1 index area 20 VCC 1OE CBT3244ABQ 1A1 2 19 2OE 2B4 3 18 1B1 1A2 4 17 2A4 2B3 5 16 1B2 1A3 6 15 2A3 2B2 7 14 1B3 1A4 8 2B1 9 GND(1) 13 2A2 2A1 11 GND 10 12 1B4 002aab650 Transparent top view (1) The die substrate is attached to this pad using conductive die attach material. It cannot be used as a supply pin or input. Fig 6. Pin configuration for DHVQFN20 5.2 Pin description Table 2: Pin description Symbol Pin Description 1OE 1 output enable (active LOW) 1A1, 1A2, 1A3, 1A4 2, 4, 6, 8 inputs 2A1, 2A2, 2A3, 2A4 11, 13, 15, 17 inputs 1B1, 1B2, 1B3, 1B4 18, 16, 14, 12 outputs 2B1, 2B2, 2B3, 2B4 9, 7, 5, 3 outputs GND 10 ground (0 V) 2OE 19 output enable (active LOW) VCC 20 positive supply voltage 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 4 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 6. Functional description Refer to Figure 1 “Logic diagram of CBT3244A”. 6.1 Function table Table 3: Function selection H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF state Inputs Outputs 1OE 2OE 1An, 1Bn 2An, 2Bn L L 1An = 1Bn 2An = 2Bn L H 1An = 1Bn Z H L Z 2An = 2Bn H H Z Z 7. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Symbol Parameter VCC supply voltage Conditions IIK input clamping current VI input voltage IOK output clamping current VO < 0 V output voltage output in OFF or HIGH state IO output current output in LOW state Tstg storage temperature Max Unit +7.0 V - −18 mA [2] −1.2 +7.0 V - −50 mA [2] −0.5 +7.0 V - 128 mA −65 +150 °C VI < 0 V VO Min −0.5 [1] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 8. Recommended operating conditions Table 5: Operating conditions Symbol Parameter VCC VIH Conditions Min Typ Max Unit supply voltage 4.5 - 5.5 V HIGH-state input voltage 2.0 - - V VIL LOW-state input voltage - - 0.8 V Tamb ambient temperature −40 - +85 °C operating in free-air 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 5 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 9. Static characteristics Table 6: Static characteristics Tamb = −40 °C to +85 °C Symbol Parameter Conditions Min Typ [1] Max Unit VIK input clamping voltage VCC = 4.5 V; II = −18 mA - - −1.2 V ILI input leakage current VCC = 5.5 V; VI = GND or 5.5 V - - ±1 µA ICC quiescent supply current VCC = 5.5 V; IO = 0 mA; VI = VCC or GND - 1 3 µA ∆ICC [2] additional quiescent supply current (per input) VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND - - 2.5 mA Ci input capacitance (control pins) VI = 3 V or 0 V; nOE = VCC - 3 - pF input/output capacitance nOE = VCC = 5.0 V - 3 - pF ON-state resistance VCC = 4.5 V; VI = 0 V; II = 64 mA - 4 7 Ω VCC = 4.5 V; VI = 0 V; II = 30 mA - 4 7 Ω VCC = 4.5 V; VI = 2.4 V; II = 15 mA - 8 15 Ω Cio Ron [1] [3] All typical values are at VCC = 5 V; Tamb = 25 °C. [2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. [3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON-state resistance is determined by the lowest voltage of the two (A or B) terminals. 10. Dynamic characteristics Table 7: Dynamic characteristics Tamb = −40 °C to +85 °C; VCC = 5.0 V ± 0.5 V; GND = 0 V; CL = 50 pF; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tPD propagation delay [1] from nAn input to nBn output, or from nBn input to nAn output - - 0.25 ns ten enable time [2] from nOE input to nAn or nBn output 1.0 - 5.6 ns tdis time [3] from nOE input to nAn or nBn output 1.0 - 6.0 ns disable [1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance). [2] Output enable time to HIGH and LOW level. [3] Output disable time from HIGH and LOW level. 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 6 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 10.1 AC waveforms VM = 1.5 V; VI = GND to 3.0 V tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. tPLH and tPHL are the same as tPD. 3.0 V input 1.5 V 1.5 V tPLH tPHL 0V VOH output 1.5 V 1.5 V VOL 002aab665 Fig 7. Input to output propagation delays 3V output control (LOW-level enabling) 1.5 V 1.5 V tPZL tPLZ 0V 3.5 V output waveform 1 S1 at 7 V(1) 1.5 V VOL + 0.3 V tPZH output waveform 2 S1 open(2) tPHZ 1.5 V VOL − 0.3 V 002aab666 VOL VOH 0V (1) Waveform 1 is for an output with internal conditions such that the output is LOW except when disabled by the output control. (2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when disabled by the output control. Fig 8. 3-state output enable and disable times 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 7 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 11. Test information 500 Ω from output under test CL 50 pF S1 7V open GND 500 Ω 002aab667 Test data are given inTable 8. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns. The outputs are measured one at a time with one transition per measurement. CL = load capacitance includes jig and probe capacitance. RL = load resistance. Fig 9. Test circuit Table 8: Test Test data Load Switch CL RL tPD 50 pF 500 Ω open tPLZ/tPZL 50 pF 500 Ω 7V tPHZ/tPZH 50 pF 500 Ω open 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 8 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 12. Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 10. Package outline SOT764-1 (DHVQFN20) 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 9 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT360-1 (TSSOP20) 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 10 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A (A3) A1 θ Lp L 10 1 1/2 e e bp detail X w M 0 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.73 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 6.2 5.8 1 0.89 0.41 0.25 0.18 0.1 1.67 1.28 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT724-1 REFERENCES IEC JEDEC JEITA MO-137 EUROPEAN PROJECTION ISSUE DATE 01-07-04 03-02-18 Fig 12. Package outline SOT724-1 (SSOP20) (QSOP20) 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 11 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 13. Package outline SOT339-1 (SSOP20) 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 12 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 14. Package outline SOT163-1 (SO20) 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 13 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 14 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 13.5 Package related soldering information Table 9: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 13362 Product data sheet not suitable © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 15 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 14. Abbreviations Table 10: Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model PRR Pulse Rate Repetition TTL Transistor-Transistor Logic 15. Revision history Table 11: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes CBT3244_2 20050915 Product data sheet - 9397 750 13362 CBT3244A_1 Modifications: CBT3244A_1 • The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering information”, Section 5 “Pinning information”, and Section 12 “Package outline” • Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds 2000 V HBM ...’ • added Section 14 “Abbreviations” on page 16 20040526 Product data sheet - 9397 750 13362 Product data sheet 9397 750 13281 - © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 16 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 19. Trademarks 18. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 13362 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 15 September 2005 17 of 18 CBT3244A Philips Semiconductors Octal bus switch with quad output enables 21. Contents 1 2 3 4 5 5.1 5.2 6 6.1 7 8 9 10 10.1 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 Package related soldering information . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information . . . . . . . . . . . . . . . . . . . . 17 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 15 September 2005 Document number: 9397 750 13362 Published in The Netherlands