CBT3384D,112

CBT3384 10-bit bus switch with 5-bit output enables Rev. 06 — 2 November 2009 Product data sheet 1. General description The CBT3384 provides ten bits of high-speed TTL-compatible bus switching. The low ON resistance of the switch allows connections to be made with minimal propagation delay. The CBT3384 device is organized as two 5-bit bus switches with two separate output enable (1OE, 2OE) inputs. When nOE is LOW, the switch is on and port A is connected to the B port. When nOE is HIGH, each switch is disabled. The CBT3384 is characterized for operation from −40 °C to +85 °C. 2. Features n n n n n n 5 Ω switch connection between two ports TTL-compatible control input levels Multiple package options See CBTD3384 for CBT3384 with level shifting diodes Latch-up protection exceeds 100 mA per JESD78 ESD protection: u HBM JESD22-A114E exceeds 2000 V u CDM JESD22-C101C exceeds 1000 V 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version CBT3384D −40 °C to +85 °C SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 CBT3384DB −40 °C to +85 °C SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 CBT3384DK −40 °C to +85 °C SSOP24[1] plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm SOT556-1 CBT3384PW −40 °C to +85 °C TSSOP24 SOT355-1 [1] Also known as QSOP24 package plastic thin shrink small outline package; 24 leads; body width 4.4 mm CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 4. Functional diagram 1A1 1A5 1OE 2A1 2A5 2OE Fig 1. 3 2 11 10 1B1 1B5 1 14 15 22 23 2B1 2B5 13 001aak877 Logic diagram 5. Pinning information 5.1 Pinning CBT3384 CBT3384 1OE 1 24 VCC 1OE 1 24 VCC 1B1 2 23 2B5 1B1 2 23 2B5 1A1 3 22 2A5 1A1 3 22 2A5 1A2 4 21 2A4 1A2 4 21 2A4 1B2 5 20 2B4 1B2 5 20 2B4 1B3 6 19 2B3 1B3 6 19 2B3 1A3 7 18 2A3 1A3 7 18 2A3 1A4 8 17 2A2 1A4 8 17 2A2 1B4 9 16 2B2 1B4 9 16 2B2 1B5 10 15 2B1 1B5 10 15 2B1 1A5 11 14 2A1 1A5 11 14 2A1 GND 12 13 2OE GND 12 13 2OE 001aak878 Fig 2. 001aak879 Pin configuration for SO24 (SOT137-1) Fig 3. Pin configuration for SSOP24 (SOT340-1) and TSSOP24 (SOT355-1) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 2 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables CBT3384 1OE 1 24 VCC 1B1 2 23 2B5 1A1 3 22 2A5 1A2 4 21 2A4 1B2 5 20 2B4 1B3 6 19 2B3 1A3 7 18 2A3 1A4 8 17 2A2 1B4 9 16 2B2 1B5 10 15 2B1 1A5 11 14 2A1 GND 12 13 2OE 001aak880 Fig 4. Pin configuration for SSOP24 (SOT556-1) 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE, 2OE 1, 13 output enable input (active LOW) 1A1 to 1A5 3, 4, 7, 8, 11 data input/output (A port) 2A1 to 2A5 14, 17, 18, 21, 22 data input/output (A port) 1B1 to 1B5 2, 5, 6, 9, 10 data input/output (B port) 2B1 to 2B5 15, 16, 19, 20, 23 data input/output (B port) GND 12 ground (0 V) VCC 24 positive supply voltage 6. Functional description Table 3. Function selection[1] Input Input/output 1OE 2OE 1An, 1Bn 2An, 2Bn L L 1An = 1Bn 2An = 2Bn L H 1An = 1Bn Z H L Z 2An = 2Bn H H Z Z [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 3 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Tamb = −40 °C to +85 °C, unless otherwise specified. Symbol Parameter Conditions Min Max Unit −0.5 +7.0 V −0.5 +7.0 V VCC supply voltage VI input voltage IO output current VO < 0 V - ±128 mA IIK input clamping current VI/O = 0 V −50 - mA Tstg storage temperature −65 +150 °C [2] [1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Section 8. is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 8. Recommended operating conditions Table 5. Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Symbol Parameter VCC VIH Conditions Min Typ Max Unit supply voltage 4.5 - 5.5 V HIGH-state input voltage 2.0 - - V VIL LOW-state input voltage - - 0.8 V Tamb ambient temperature −40 - +85 °C operating in free air 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = −40 °C to +85 °C Conditions Min Typ[1] Max Unit VIK input clamping voltage VCC = 4.5 V; II = −18 mA - - −1.2 V II input leakage current VCC = 5.5 V; VI = GND or 5.5 V - - ±1 µA ICC supply current VCC = 5.5 V; IO = 0 mA; VI = VCC or GND - - 3 µA ∆ICC additional supply current per input pin; VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND - - 2.5 mA Vpass pass voltage output HIGH; VI = VCC = 5.0 V; IO = −100 µA 3.6 3.9 4.2 V CI input capacitance control pins; VI = 3 V or 0 V - 4.0 - pF Cio(off) off-state input/output capacitance port off; VI = 3 V or 0 V; nOE = VCC - 10.0 - pF CBT3384_6 Product data sheet [2] © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 4 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables Table 6. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol RON Parameter Tamb = −40 °C to +85 °C Conditions ON resistance Unit Min Typ[1] VCC = 4.5 V; VI = 0 V; II = 64 mA [3] - 5 VCC = 4.5 V; VI = 0 V; II = 30 mA [3] - 5 7 Ω VCC = 4.5 V; VI = 2.4 V; II = −15 mA [3] - 10 15 Ω Max 7 Ω All typical values are at VCC = 5 V, Tamb = 25 °C. [1] [2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. [3] Measured by the voltage drop between the nAn and the nBn terminals at the indicated current through the switch. ON resistance is determined by the lowest voltage of the two (nAn or nBn) terminals. 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7. Symbol Parameter Tamb = 25 °C Conditions tpd propagation delay nAn, nBn to nBn, nAn; see Figure 5 tPZH OFF-state to HIGH propagation delay nOE to nAn or nBn; see Figure 6 VCC = 5.0 V ± 0.5 V VCC = 5.0 V ± 0.5 V OFF-state to LOW propagation delay tPZL HIGH to OFF-state propagation delay LOW to OFF-state propagation delay Max Min Max - - 0.25 - 0.25 ns 1.2 2.3 5.7 1.2 5.6 ns 1.2 2.3 5.7 1.2 6.0 ns 1.7 3.6 5.2 1.7 5.5 ns 1.7 2.7 5.2 1.7 6.6 ns [1][2] nOE to nAn or nBn; see Figure 6 VCC = 5.0 V ± 0.5 V tPLZ Typ nOE to nAn or nBn; see Figure 6 VCC = 5.0 V ± 0.5 V tPHZ Tamb = −40 °C to +85 °C Unit Min nOE to nAn or nBn; see Figure 6 VCC = 5.0 V ± 0.5 V [1] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). [2] tpd is the same as tPLH and tPHL. CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 5 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 11. Waveforms VI VM nAn, nBn input VM GND tPHL tPLH VOH VM nBn, nAn output VM VOL 001aak881 Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 5. The data input (nAn, nBn) to output (nBn, nAn) propagation delay times VI VM nOE input VM GND tPZL tPLZ 3.5 V output LOW to OFF OFF to LOW VM VX VOL tPZH tPHZ VOH VY output HIGH to OFF OFF to HIGH VM GND outputs enabled outputs disabled outputs enabled 001aak298 Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. Table 8. Enable and disable times Measurement points Supply voltage Input Output VCC VI VM VM VX VY VCC = 5.0 V ± 0.5 V GND to 3.0 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 6 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 12. Test information VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VCC VI RL VO G DUT RT CL RL 001aae331 Test data is given in Table 9. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo = 50 Ω. The outputs are measured one at a time with one transition per measurement. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 7. Table 9. Test circuit for measuring switching times Test data Supply voltage Input VI VCC = 5.0 V ± 0.5 V Load tr, tf GND to 3.0 V ≤ 2.5 ns VEXT CL RL tPLH, tPHL tPLZ, tPZL tPHZ, tPZH 50 pF 500 Ω open 7.0 V open CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 7 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 13. Package outline SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 8. Package outline SOT137-1 (SO24) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 8 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC JEITA MO-150 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 9. Package outline SOT340-1 (SSOP24) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 9 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT556-1 A X c y HE v M A Z 13 24 A2 A (A 3) A1 θ Lp L 12 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.73 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 6.2 5.8 1 0.89 0.41 0.25 0.18 0.1 1.05 0.66 8o o 0 inches 0.068 0.0098 0.061 0.0040 0.055 0.01 0.012 0.0098 0.344 0.157 0.244 0.035 0.025 0.041 0.008 0.0075 0.337 0.150 0.228 0.016 0.01 0.007 0.004 0.040 0.026 8o o 0 Note 1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included. OUTLINE VERSION SOT556-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-137 Fig 10. Package outline SOT556-1 (SSOP24) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 10 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm D SOT355-1 E A X c HE y v M A Z 13 24 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8o 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC JEITA MO-153 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT355-1 (TSSOP24) CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 11 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 14. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge FET Field Effect Transistor HBM Human Body Model PRR Pulse Rate Repetition TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes CBT3384_6 20091102 Product data sheet - CBT3384_5 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Changed: Table 6 “Static characteristics” a. Pass voltage values have changed. b. Undershoot static current protection removed. • Changed: Table 7 “Dynamic characteristics” a. Enable and disable times values have changed. CBT3384_5 20011220 Product specification - CBT3384_4 CBT3384_4 20010319 Product specification - CBT3384_3 CBT3384_3 20001113 Product specification - CBT3384_2 CBT3384_2 20000128 Product specification - - CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 12 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com CBT3384_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 2 November 2009 13 of 14 CBT3384 NXP Semiconductors 10-bit bus switch with 5-bit output enables 18. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 November 2009 Document identifier: CBT3384_6