CGD1044HI

CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler Rev. 01 — 21 September 2009 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V Direct Current (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs dies. 1.2 Features I I I I I I I I I Excellent linearity Superior levels of ESD protection Extremely low noise Excellent return loss properties Gain compensation over temperature Rugged construction Unconditionally stable Thermally optimized design Compliant to Directive 2002/95/EC, regarding Restriction of the use of certain Hazardous Substances (RoHS) I Integrated ring wave surge protection 1.3 Applications I CATV systems operating in the 40 MHz to 1003 MHz frequency range 1.4 Quick reference data Table 1. Quick reference data Bandwidth 40 MHz to 1003 MHz; VB = 24 V (DC); ZS = ZL = 75 Ω; Tmb = 35 °C; unless otherwise specified. Symbol Parameter Gp CTB CCN Itot [1] [2] Conditions f = 50 MHz f = 1003 MHz Vo = 56.4 dBmV at 1003 MHz Vo = 56.4 dBmV at 1003 MHz [1] [1] [2] Min 57 - Typ Max Unit dB dBc dBc mA power gain composite triple beat carrier-to-composite noise total current 23.2 −75 63 440 −69 460 23.5 24.4 25.5 dB 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (−6 dB offset); tilt extrapolated to 13.5 dB at 1003 MHz. Direct Current (DC). NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 2. Pinning information Table 2. Pin 1 2, 3 5 7, 8 9 Pinning Description input common +VB common output 2378 sym095 Simplified outline Graphic symbol 5 1 9 13579 3. Ordering information Table 3. Ordering information Package Name CGD1044HI Description rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads Version SOT115J Type number 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VB Vi(RF) VESD supply voltage RF input voltage electrostatic discharge voltage single tone Human Body Model (HBM); According JEDEC standard 22-A114E Biased; According IEC61000-4-2 Tstg Tmb [1] [1] Conditions Min Max 30 75 Unit V dBmV 2000 V - 1500 V storage temperature mounting base temperature The ESD pulse of 2000 V corresponds to a class 2 sensitivity level. −40 +100 °C −20 +100 °C CGD1044HI_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 September 2009 2 of 7 NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 1003 MHz; VB = 24 V (DC); ZS = ZL = 75 Ω; Tmb = 35 °C; unless otherwise specified. Symbol Parameter Gp SLsl FL RLin power gain slope straight line flatness of frequency response input return loss Conditions f = 50 MHz f = 1003 MHz f = 40 MHz to 1003 MHz f = 40 MHz to 1003 MHz f = 40 MHz to 160 MHz f = 160 MHz to 320 MHz f = 320 MHz to 640 MHz f = 640 MHz to 870 MHz f = 870 MHz to 1003 MHz RLout output return loss f = 40 MHz to 160 MHz f = 160 MHz to 320 MHz f = 320 MHz to 640 MHz f = 640 MHz to 870 MHz f = 870 MHz to 1003 MHz NF Itot CTB CSO Xmod CCN CTB CSO Xmod [1] [2] [3] [4] [5] [1] [2] Min 23.5 0.5 20 20 19 17 16 20 20 19 18 17 [3] Typ 23.2 24.4 4.5 5 440 −75 −77 −68 63 −70 −75 −64 Max 25.5 2 1 5.5 6 460 −69 −65 - Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB mA dBc dBc dB dBc dBc dBc dB noise figure total current composite triple beat cross modulation carrier-to-composite noise composite triple beat cross modulation f = 50 MHz f = 1003 MHz 57 - 79 NTSC channels + 75 digital channels Vo = 56.4 dBmV at 1003 MHz Vo = 56.4 dBmV at 1003 MHz Vo = 56.4 dBmV at 1003 MHz Vo = 58.4 dBmV at 1003 MHz Vo = 58.4 dBmV at 1003 MHz [4] [4] [4] [4] composite second-order distortion Vo = 56.4 dBmV at 1003 MHz 79 NTSC channels [5] [5] [5] composite second-order distortion Vo = 58.4 dBmV at 1003 MHz Gp at 1003 MHz minus Gp at 40 MHz. Flatness is defined as peak deviation to straight line. Direct Current (DC). 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (−6 dB offset); tilt extrapolated to 13.5 dB at 1003 MHz. 79 NTSC channels [f = 54 MHz to 550 MHz]; tilt extrapolated to 13.5 dB at 1003 MHz. CGD1044HI_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 September 2009 3 of 7 NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J D E Z p A2 1 A L F S W d U2 B yMB p Q e e1 q2 q1 yM B xM B b wM 2 3 5 7 8 9 c U1 q 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. 9.1 b c d D E max. max. max. e e1 F L min. p Q max. q q1 q2 S U1 U2 W w x y 0.1 Z max. 3.8 mm 20.8 4.15 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 3.85 0.38 2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7 44.25 7.8 UNC OUTLINE VERSION SOT115J REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-02-06 04-02-04 Fig 1. CGD1044HI_1 Package outline SOT115J © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 September 2009 4 of 7 NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 7. Abbreviations Table 6. Acronym CATV ESD GaAs NTSC RF UNC Abbreviations Description Community Antenna TeleVision ElectroStatic Discharge Gallium-Arsenide National Television Standard Committee Radio Frequency UNified Coarse 8. Revision history Table 7. Revision history Release date 20090921 Data sheet status Product data sheet Change notice Supersedes Document ID CGD1044HI_1 CGD1044HI_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 September 2009 5 of 7 NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 9.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com CGD1044HI_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 September 2009 6 of 7 NXP Semiconductors CGD1044HI 1 GHz, 25 dB gain GaAs high output power doubler 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 September 2009 Document identifier: CGD1044HI_1