DC6M60xX6 family
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Rev. 2 — 29 January 2013
Product data sheet
1. Product profile
1.1 General description
The DC6M60xX6 family consists of highly efficient 6 MHz, 650 mA step-down DC-to-DC
converters. The devices convert input voltages between 2.3 V and 5.5 V to fixed output
voltages of 1.2 V, 1.5 V, 1.8 V or 2.85 V.
The devices of DC6M60xX6 family are optimized for battery-driven applications. Their
high efficiency of up to 95 % enables an extended battery life in all portable designs. Buck
operation at a switching frequency of 6 MHz allows using only a small low-cost 470 nH
coil and two capacitors. Besides working with standard chip inductors, the DC6M60xX6
family devices also support Printed-Circuit Board (PCB) coils and air coils.
Product versions with and without automatic mode selection between Pulse Frequency
Modulation (PFM) and Pulse Width Modulation (PWM) are available. Optionally the
devices can be switched to forced PWM mode.
1.2 Features and benefits
Efficiency up to 95 %
Extremely low output ripple in PWM and PFM mode
2 % total DC output voltage accuracy
Soft start function for limiting inrush current
Short circuit and over-temperature protection
Integrated flyback diode
Enable input operates with an active HIGH or with a clock signal
Optional power good indicator output (XSHUTDOWN version)
Wafer-Level Chip-Size Package (WLCSP) with 0.4 mm pitch
1.3 Applications
Smartphones
Mobile handsets
Digital Still Cameras (DSC)
Tablet PCs
Mobile Internet Devices (MID)
Portable Media Players (PMP)
1.4 Quick reference data
IO = 650 mA (max)
VO = 1.2 V, 1.5 V, 1.8 V or 2.85 V
Supply current ICC = 0.2 A in standby
mode
Switching frequency fclk(PWM) = 6 MHz
VI = 2.3 V to 5.5 V
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
2. Pinning information
bump A1
index area
MODE
A1
A2
IN
SW
B1
B2
EN
FB
C1
C2
GND
018aaa210
Transparent top view
solder balls facing down
Fig 1.
Pin configuration WLCSP6
Table 1.
Symbol
Description
A1
voltage select/mode select/XSHUTDOWN
A2
supply input voltage
SW
B1
output voltage switch regulator
EN
B2
enable
FB
C1
control feedback
GND
C2
ground
[1]
Product data sheet
Pin
IN
MODE
DC6M60XX6_FAM
[1]
Pin description
Mode function depends on the chosen version of the buck converter as listed in Table 3.
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
2 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
3. Ordering information
DC6M60xX6 family is available with different modes or output voltages and can be
supplied upon request and acceptance from NXP Semiconductors. For more details, see
Section 19.
Table 2.
Ordering information
Type number
Package
DC6M60xX6 family
[1]
Name
Description
Version
WLCSP6
wafer-level chip-size package; 6 bumps (3 2)
[1]
-
Size 1.36 0.96 0.47 mm
3.1 Ordering options
Table 3.
Ordering options for DC6M601X6 and DC6M603X6 [1]
Type number
Mode option
Nominal output
voltage (VO(nom))
DC6M601X6/12S
select automatic PWM/PFM or forced PWM mode
1.2 V
DC6M601X6/15S
select automatic PWM/PFM or forced PWM mode
1.5 V
DC6M601X6/18S
select automatic PWM/PFM or forced PWM mode
1.8 V
DC6M601X6/285S
select automatic PWM/PFM or forced PWM mode
2.85 V
DC6M603X6/12A
power good (XSHUTDOWN) output; automatic PWM/PFM mode
1.2 V
DC6M603X6/15A
power good (XSHUTDOWN) output; automatic PWM/PFM mode
1.5 V
DC6M603X6/18A
power good (XSHUTDOWN) output; automatic PWM/PFM mode
1.8 V
[1]
For detail information about options see Section 5, about functional selection see Section 5.6.
Table 4.
Ordering options for DC6M602X6 [1]
Type number
Mode option
Nominal output voltage (VO(nom))
MODE = LOW
MODE = HIGH
DC6M602X6/1215A
output voltage select; automatic PWM/PFM mode
1.2 V
1.5 V
DC6M602X6/1218A
output voltage select; automatic PWM/PFM mode
1.2 V
1.8 V
DC6M602X6/1518A
output voltage select; automatic PWM/PFM mode
1.5 V
1.8 V
DC6M602X6/1215F
output voltage select; forced PWM mode
1.2 V
1.5 V
DC6M602X6/1218F
output voltage select; forced PWM mode
1.2 V
1.8 V
DC6M602X6/1518F
output voltage select; forced PWM mode
1.5 V
1.8 V
[1]
For detail information about options see Section 5, about functional selection see Section 5.6.
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
3 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
3.1.1 Naming convention
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Fig 2.
DDD
Naming convention
4. Block diagram
DDD
Fig 3.
DC6M60XX6_FAM
Product data sheet
Block diagram
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
4 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
5. Functional description
The step-down converter (Figure 4) generates a regulated constant output voltage behind
an externally connected coil at pin SW. For this operation only the inductor and two filter
capacitors are required. No additional flyback diode is needed. Place the pick-off pin for
FB behind the inductor to sense the output voltage.
9,
$
%
&L H[W
&
,1
02'(
(1
*1'
6:
)%
$
%
&
/R H[W
92
&R H[W
DDD
Fig 4.
Simple application schematic
The step-down converter starts a switching cycle with an active P-channel MOS (PMOS)
which allows rising the output voltage until a defined value is reached. Then the feedback
circuit turns off the PMOS switch and turns on the N-channel MOS (NMOS) as active
rectification.
The step-down converter (Figure 3) consists of an integrated oscillator. It runs at high
frequency to compare the return path and to control the PWM/PFM logic block and the
break-before-make circuit of the integrated NMOS and PMOS transistor. This allows
reaching constant output voltage with high efficiency and low output ripple.
5.1 Automatic PWM/PFM mode
Battery-driven applications need power-saving options. Therefore the DC-to-DC converter
provides a current-sensing circuit which detects the output current. If the current is below
a certain threshold, the system switches to PFM mode. In this operation, the converter
uses less current and saves battery operation time. This automode can be switched off to
the forced PFM mode (see Section 5.6).
5.2 Inrush current limiter (soft start)
The DC6M60xX6 family has an integrated soft start function to limit the maximum inrush
current and to reduce an input voltage dip. Therefore the system has a turn-on procedure
which starts up step-by-step over 300 s and limits the inrush current via a duty cycle
control up to the maximum current capability.
5.3 Thermal protection
The DC6M60xX6 family products have an integrated thermal protection. The protection
circuit senses the internal temperature of the chip and switches off the integrated PMOS
power switch transistor when a defined maximum temperature is reached. After the
temperature returns to a safe value, the system restarts with a soft start.
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
5 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
5.4 Short-circuit and overcurrent protection
The short-circuit and overcurrent protection senses the current through the integrated
PMOS high-side driver. If the diagnostic circuit detects an overcurrent, the system
switches off the PMOS to break the current flow.
5.5 Enable (EN)
All products have an enable pin EN which enables the device by a constant logic HIGH
signal but also by applying an alternating (clock) signal to the enable pin. All devices start
with a soft start (Section 5.2).
If EN is forced to a LOW level, the system is in Power-down mode. Then the input current
is negligible and the output voltage sets to LOW via a resistor.
It is possible to enable all DC6M60xX6 family products by applying a clock signal which is
used to enable other parts of a certain circuit such as camera modules based on the
Standard Mobile Imaging Architecture (SMIA) specification. The required signal frequency
has to be in the range of 5 MHz to 27 MHz with a duty cycle between 40 % and 60 %.
Table 5.
Function selection
EN logic level
Description
HIGH or clock signal
operation
LOW
shut down
5.6 Function selection (MODE)
Depending on the product version, three different operation modes are available for the
MODE pin.
5.6.1 Automatic PWM/PFM and forced PWM mode
The default operation mode is the automatic selection mode. This mode switches the
device between PWM and PFM to reduce power consumption as described in
Section 5.1.
The automatic mode of DC6M601X6 can be switched off to use only the PWM mode.
DC6M602X6 does not have this option but is available with fix mode (automatic or forced
PWM).
Table 6.
Function selection DC6M601X6
MODE logic level
Description
LOW
automatic PWM/PFM mode
HIGH
forced PWM mode
5.6.2 Output voltage select
DC6M602X6 offers the option to select the output voltage VO depending on the logic level
applied to the MODE pin. Depending on the logic input level either the LOW or the HIGH
output voltage is selected. Table 7 illustrates this behavior.
DC6M60XX6_FAM
Product data sheet
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© NXP B.V. 2013. All rights reserved.
6 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Table 7.
Output voltage selection DC6M602X6
MODE logic level
Output voltage
LOW
low voltage
HIGH
high voltage
The MODE input pin has no default level. To prevent undefined states, it has to be applied
with a clear LOW or HIGH level.
5.6.3 Power good output (XSHUTDOWN)
DC6M603X6 has an XSHUTDOWN or power good output. This function is often used
when the converter is turned on by a clock signal (CLK) available at pin MODE.
The basic timing is depicted in Figure 5 and Table 8 where EXTCLK is the clock signal at
the enable input and VO the DC-to-DC converter output voltage. The XSHUTDOWN is the
power good signal and has the same signal output level as VO.
(;7&/.
(1
7
7
92
7
;6+87'2:1
02'(
7
7
DDD
Fig 5.
Table 8.
DC6M60XX6_FAM
Product data sheet
Timing XSHUTDOWN enable/disable
Timing XSHUTDOWN
Symbol
Description
Min
Max
Unit
T1
EXTCLK active - VO rising
10
100
s
T2
VO settled - XSHUTDOWN rising
0
100
s
T3
VO down time; Co(ext) = 10 pF; load current IL = 20 mA
0
1000
s
T4
EXTCLK inactive - XSHUTDOWN down
0
100
s
T5
VO rising time (no-load)
30
200
s
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© NXP B.V. 2013. All rights reserved.
7 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
6. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VIN
voltage on pin IN
4 ms transient
0.5
+6.0
V
VI
input voltage
on pins EN, MODE, FB
0.5
+5.5
V
VO
output voltage
on pin SW
0.5
+5.5
V
Ptot
total power dissipation
-
800
mW
Tstg
storage temperature
55
+150
C
Tj
junction temperature
30
+125
C
Tamb
ambient temperature
40
+85
C
VESD
electrostatic discharge
voltage
human body model
(JESD22-001)
2
+2
kV
machine model
(JESD22-A115)
200
+200
V
7. Recommended operating conditions
Table 10. Operating conditions
At recommended operating conditions; Tamb = 25 C; voltages are referenced to GND (0 V); unless
otherwise specified.
Symbol
Parameter
VIN
voltage on pin IN
VI
input voltage
Product data sheet
on pins EN, MODE, FB
Min
Typ
Max
Unit
2.3
-
5.5
V
-0.5
-
VIN +
0.3
V
IO
output current
0
-
650
mA
Ci(ext)
external input
capacitance
[1]
-
4.7
10
F
Co(ext)
external output
capacitance
[1]
2.2
4.7
-
F
Lo(ext)
external output
inductance
[1]
-
0.47
-
H
[1]
DC6M60XX6_FAM
Conditions
See Section 10 “Application information”.
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
8 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
8. Static characteristics
Table 11. Characteristics
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VO = 1.2 V
2.3
-
5.5
V
VO = 1.5 V
2.3
-
5.5
V
VO = 1.8 V
2.8
-
5.5
V
Input voltage and input current
VI
ICC
input voltage
supply current
VO = 2.85 V
3.7
-
5.5
V
operating; PWM mode;
IO = 0 A
-
8
-
mA
operating; PFM mode;
IO = 0 A
-
180
-
A
disabled
-
0.2
-
A
Output voltage and output current
VO
IO(max)
Vo(ripple)(p-p)
output voltage
IO 15 mA
[1]
0.98
VO(nom)
VO(nom)
1.02
VO(nom)
V
0 mA < IO < 15 mA;
auto PWM/PFM mode
[1]
0.98
VO(nom)
VO(nom)
1.04
VO(nom)
V
650
-
-
mA
0 mA < IO < 100 mA;
VI = VO(nom) + 1.2 V
[1]
-
-
10
mV
100 mA < IO < 650 mA;
VI = VO(nom) + 1.2 V
[1]
-
7
15
mV
2.3 V < VI < 5.5 V;
I = 200 mA
-
0.03
-
%/V
0 A < IO < 650 mA
-
0.003
-
%/mA
1
-
-
V
-
-
0.4
V
-
-
1
A
1
-
-
V
-
-
0.4
V
-
-
1
A
maximum output current
peak-to-peak ripple output voltage
Line regulation
VO/VI
output voltage variation as a
function of input voltage variation
Load regulation
VO/IL
output voltage variation as a
function of load current variation
Pin EN
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
VIH = 1.2 V
Pin MODE
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
VOH
VOL
VIH = 1.2 V
HIGH-level output voltage
[2]
0.9 VO -
1.1 VO V
LOW-level output voltage
[2]
0.1
-
0.3
V
Clock frequency and duty cycle
fclk(PWM)
PWM clock frequency
5.4
6.0
6.6
MHz
fclk(PFM)
PFM clock frequency
0
-
6.6
MHz
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
9 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Table 11. Characteristics …continued
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
duty cycle
forced PWM mode
DC6M601X6/285S
2
-
100
%
all other devices
2
-
92
%
DC6M601X6/285S
0
-
100
%
all other devices
0
-
92
%
-
C
automatic forced PWM /
PFM mode
Overtemperature and overcurrent protection
Tsd
shutdown temperature
-
150
Tsd(hys)
shutdown temperature hysteresis
-
40
-
K
IOlim
output current limit
1.0
1.3
-
A
Iinrush(lim)
inrush current limit
-
0.3
-
A
Switches
drain-source on-state resistance
RDSon
leakage current
Ileak
P-channel FET; VDS = 3.6 V
-
0.15
-
N-channel FET; VDS = 3.6 V
-
0.3
-
VDS = 5 V
-
-
1
A
[1]
VO(nom) = nominal output voltage (device specific).
[2]
Only for product versions with power good output (DC6M603X6).
9. Dynamic characteristics
9.1 Efficiency
DDD
HIILFLHQF\
9,
9,
9,
9,
9,
9
9
9
9
9
9
9
9
9
9
,2 P$
VO = 2.85 V
Fig 6.
9,
9,
9,
9,
9,
DDD
HIILFLHQF\
Product data sheet
,2 P$
VO = 1.8 V
DC6M60xX6/285x: Efficiency as a function of
output current
DC6M60XX6_FAM
Fig 7.
DC6M60xX6/18x: Efficiency as a function of
output current
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
10 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
DDD
HIILFLHQF\
9,
9,
9,
9,
9,
9
9
9
9
9
,2 P$
VO = 1.2 V
Fig 8.
DC6M60xX6/12x: Efficiency as a function of output current
9.2 Output voltage ripple
DDD
9R ULSSOH SS
P9
P9
9,
9,
9,
9,
9
9
9
9
,2 P$
VO = 1.8 V
Fig 9.
DC6M60XX6_FAM
Product data sheet
DC6M60xX6/18x: Peak-to-peak output voltage ripple as a function of output
current
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
11 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.3 Output voltage variation
DDD
92
9
7DPE &
7DPE &
7DPE &
,2 P$
VI = 3.6 V
Fig 10. DC6M60xX6/18x: Output voltage as function of output current
9.4 Line transient response
9,
9
DDD
92
9,
WLPH PV
92
9
9,
9
DDD
92
9,
IO = 10 mA
IO = 200 mA
VI = 3.3 V 3.9 V 3.3 V
DC6M60XX6_FAM
Product data sheet
92
9
VI = 3.3 V 3.9 V 3.3 V
Fig 11. DC6M60xX6/18x: Line transient response
WLPH PV
Fig 12. DC6M60xX6/18x: Line transient response
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Rev. 2 — 29 January 2013
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12 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.5 Load transient response
DDD
,2
P$
DDD
,2
P$
92
,2
WLPH PV
92
9
,2
WLPH PV
VI = 3.6 V
VI = 3.6 V
IO = 50 mA 350 mA 50 mA
,2
92
9
92
Fig 14. DC6M60xX6/18x: Load transient response
DDD
,2
P$
92
9
92
IO = 0 mA 150 mA 0 mA
Fig 13. DC6M60xX6/18x: Load transient response
WLPH PV
VI = 3.6 V
IO = 150 mA 500 mA 150 mA
Fig 15. DC6M60xX6/18x: Load transient response
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
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13 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
9.6 Start-up/enable
The start-up sequence is described by time-dependent current and voltage behavior.
018aaa217
4.5
V
(1)
3.5
2.5
(2)
1.5
0.5
-0.5
-0.4
0.0
0.4
0.8
time (ms)
IO = 200 mA
(1) VEN
(2) VO
Fig 16. Start-up
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
14 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
10. Application information
The DC-to-DC converter requires an external coil and two decoupling capacitors.
9,
$
,1
02'(
$
&L H[W
(1$%/(
%
&
(1
*1'
6:
)%
%
&
/R H[W
92
&R H[W
DDD
Fig 17. Application diagram
10.1 Recommended inductors
Table 12.
Recommended inductors (Figure 17)
Manufacture
Series
Dimensions (mm)
MURATA
LQM21PN1R0NGR
2.0 1.2 1.0 maximum height
LQM21PNR54MG0
2.0 1.2 1.0 maximum height
LQM21PNR47MC0
2.0 1.2 0.55 maximum height
FDK
LQM21PN1R0MC0
2.0 1.2 0.55 maximum height
MIPSZ2012DOR5
2.0 1.2 1.0 maximum height
MIPS2012D1R0
2.0 1.2 1.0 maximum height
10.2 Input capacitor
To eliminate unwanted voltage transients at the input, place an input decoupling capacitor
of more than 4.7 F as close as possible to the input pin. Use therefore a capacitor with a
low Equivalent Series Resistance (ESR).
10.3 Output capacitor
Use a suppressor capacitor of more that 10 F for the output (Figure 17). Because of the
narrow spread, high temperature stability and low ESR at high frequencies use the
dielectric X7R or X5R.
DC6M60XX6_FAM
Product data sheet
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Rev. 2 — 29 January 2013
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15 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
11. Marking
$ %&
217 C
30
-
150
s
t5
time 5
dT/dt
rate of change of
temperature
Conditions
-
-
540
s
cooling rate
-
-
6
C/s
preheat
2.5
-
4.0
C/s
16. References
DC6M60XX6_FAM
Product data sheet
[1]
IEC60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[2]
IEC61340-3-1 — Method for simulation of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms
[3]
JESD22-A115C — Electrostatic discharge (ESD) Sensitivity Testing Machine Model
(MM)
[4]
NX2-00001 — NXP Semiconductors Quality and Reliability Specification
[5]
AN10365 — NXP Semiconductors application note ”Surface mount reflow soldering
description”
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
22 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
17. Revision history
Table 20.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
DC6M60XX6_FAM v.2
20130129
Product data sheet
-
DC6M60XX6_FAM v.1
Modifications:
DC6M60XX6_FAM v.1
DC6M60XX6_FAM
Product data sheet
•
•
•
Section 1 “Product profile”: updated
Table 11: output voltage VO and drain-source on-state resistance RDSon updated
Section 9 “Dynamic characteristics”: updated
20120921
Preliminary data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 January 2013
-
© NXP B.V. 2013. All rights reserved.
23 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
DC6M60XX6_FAM
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
24 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
DC6M60XX6_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
25 of 26
DC6M60xX6 family
NXP Semiconductors
6 MHz, 650 mA, ultra small DC-to-DC buck converter
20. Contents
1
1.1
1.2
1.3
1.4
2
3
3.1
3.1.1
4
5
5.1
5.2
5.3
5.4
5.5
5.6
5.6.1
5.6.2
5.6.3
6
7
8
9
9.1
9.2
9.3
9.4
9.5
9.6
10
10.1
10.2
10.3
11
12
13
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
14.3.4
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Naming convention . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Automatic PWM/PFM mode . . . . . . . . . . . . . . . 5
Inrush current limiter (soft start) . . . . . . . . . . . . 5
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5
Short-circuit and overcurrent protection . . . . . . 6
Enable (EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Function selection (MODE). . . . . . . . . . . . . . . . 6
Automatic PWM/PFM and forced PWM mode . 6
Output voltage select . . . . . . . . . . . . . . . . . . . . 6
Power good output (XSHUTDOWN). . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output voltage ripple. . . . . . . . . . . . . . . . . . . . 11
Output voltage variation . . . . . . . . . . . . . . . . . 12
Line transient response . . . . . . . . . . . . . . . . . 12
Load transient response . . . . . . . . . . . . . . . . . 13
Start-up/enable . . . . . . . . . . . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 15
Recommended inductors . . . . . . . . . . . . . . . . 15
Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . 15
Output capacitor . . . . . . . . . . . . . . . . . . . . . . . 15
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering of WLCSP packages. . . . . . . . . . . . 18
Introduction to soldering WLCSP packages . . 18
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 18
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Quality of solder joint . . . . . . . . . . . . . . . . . . . 20
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
15
15.1
15.2
16
17
18
18.1
18.2
18.3
18.4
19
20
Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
PCB design guidelines. . . . . . . . . . . . . . . . . . 21
PCB assembly guidelines for Pb-free soldering. .
21
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Contact information . . . . . . . . . . . . . . . . . . . . 25
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 January 2013
Document identifier: DC6M60XX6_FAM
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