Freescale Semiconductor, Inc.
Datasheet: Technical Data
Document Number: DSP56F803
Rev. 17, 10/2015
56F803 Datasheet with Addendum
Rev.17 of the 56F803 Datasheet has two parts:
• The addendum to revision 16 of the datasheet, immediately following this cover page.
• Revision 16 of the datasheet, following the addendum. The changes described in the addendum have
not been implemented in the specified pages.
© 2015 Freescale Semiconductor, Inc. All rights reserved.
Freescale Semiconductor, Inc.
Datasheet Addendum
Document Number: DSP56F803AD
Rev. 0, 10/2015
Addendum to Rev. 16 of the 56F803
datasheet
This addendum identifies changes to Rev.16 of the 56F803 datasheet. The changes described in this
addendum have not been implemented in the specified pages.
1
Update the incomplete Thermal Design
Considerations section
Location: Section 5.1, Page 51
Thermal Considerations section in 56F803 datasheet Rev.16 is incomplete. The complete Thermal
Design Consideration section should be as follows:
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA + (PD x RJA)
Eqn. 1
where:
TA = ambient temperature °C
RJA = package junction-to-ambient thermal resistance °C/W
PD = power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RJA = RJC + RCA
© 2015 Freescale Semiconductor, Inc. All rights reserved.
Eqn. 2
Update the incomplete Thermal Design Considerations section
where
RJA = package junction-to-ambient thermal resistance °C/W
RJC = package junction-to-case thermal resistance °C/W
RCA = package case-to-ambient thermal resistance °C/W
RJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance,RCA . For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
Definitions
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
•
•
•
Measure the thermal resistance from the junction to the outside surface of the package (case)
closest to the chip mounting area when that surface has a proper heat sink. This is done to minimize
temperature variation across the surface.
Measure the thermal resistance from the junction to where the leads are attached to the case. This
definition is approximately equal to a junction to board thermal resistance.
Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package
case determined by a thermocouple.
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at
theinterface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
Addendum to Rev.16 of 56F803 Technical Data, Rev. 0, 10/2015
Freescale Semiconductor, Inc.
3
Add missing Electrical Design Considerations section
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
2
Add missing Electrical Design Considerations section
Location: Section 5.2, Page 52
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or
electrical fields. However, normal precautions are
advised to avoid application of any voltages higher
than maximum rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate voltage level.
Use the following list of considerations to assure correct DSP operation:
• Provide a low-impedance path from the board power supply to each VDD pin on the DSP, and from
the board ground to each VSS (GND) pin.
• The minimum bypass requirement is to place six 0.01–0.1 mF capacitors positioned as close as
possible to the package supply pins. The recommended bypass configuration is to place one bypass
capacitor on each of the seven VDD/VSS pairs, including VDDA/VSSA. The VCAP capacitors
must be 150 milliohm or less ESR capacitors.
• Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and
VSS (GND) pins are less than 0.5 inch per capacitor lead.
• Use at least a four-layer Printed Circuit Board (PCB) with two inner layers for VDD and VSS .
• Bypass the VDD and VSS layers of the PCB with approximately 100 mF, preferably with a
highgrade capacitor such as a tantalum capacitor.
• Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal
3
Add missing Ordering part section
Location:
Section 6, Page 53
Table 1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor sales
office or authorized distributor to determine availability and to order parts.
Table 1. 56F803 Ordering Information
Part
Supply
Voltage
56F803
3.0–3.6 V
Package Type
Low Profile Plastic Quad Flat
Pack (LQFP)
Pin Count
Ambient
Frequency
(MHz)
Order Number
100
80
DSP56F803BU80
Addendum to Rev.16 of 56F803 Technical Data, Rev. 0, 10/2015
4
Freescale Semiconductor, Inc.
Add missing Ordering part section
Table 1. 56F803 Ordering Information
1
Part
Supply
Voltage
56F803
3.0–3.6 V
Package Type
Low Profile Plastic Quad Flat
Pack (LQFP)
Pin Count
Ambient
Frequency
(MHz)
Order Number
100
80
DSP56F803BU80E1
This package is RoHS compliant
Addendum to Rev.16 of 56F803 Technical Data, Rev. 0, 10/2015
Freescale Semiconductor, Inc.
5
56F803
Data Sheet
Preliminary Technical Data
56F800
16-bit Digital Signal Controllers
DSP56F803
Rev. 16
09/2007
freescale.com
Document Revision History
Version History
Rev. 16
Description of Change
Added revision history.
Added this text to footnote 2 in Table 3-8: “However, the high pulse width does not have to
be any particular percent of the low pulse width.”
56F803 General Description
•
Up to 40 MIPS at 80MHz core frequency
•
6-channel PWM module
•
DSP and MCU functionality in a unified,
C-efficient architecture
•
Two 4-channel 12-bit ADCs
•
Quadrature Decoder
•
Hardware DO and REP loops
•
CAN 2.0 B module
•
MCU-friendly instruction set supports both DSP and
controller functions: MAC, bit manipulation unit, 14
addressing modes
•
Serial Communication Interface (SCI)
•
Serial Peripheral Interface (SPI)
•
31.5K × 16-bit words (64KB) Program Flash
•
Up to two General Purpose Quad Timers
•
512 × 16-bit words (1KB) Program RAM
•
JTAG/OnCETM port for debugging
•
4K × 16-bit words (8KB) Data Flash
•
16 shared GPIO lines
•
2K × 16-bit words (4KB) Data RAM
•
100–pin LQFP package
•
2K × 16-bit words (4KB) Boot Flash
•
Up to 64K × 16-bit words each of external Program
and Data memory
6
3
3
PWM Outputs
Current Sense Inputs
PWMA
EXTBOOT
RESET
Fault Inputs
IRQB
IRQA
VCAPC VDD
6
2
6
JTAG/
OnCE
Port
4
4
4
A/D1
A/D2
Digital Reg
VSSA
Analog Reg
Low Voltage
Supervisor
ADC
Quadrature
Decoder 0 /
Quad Timer A
Quad Timer B
Interrupt
Controller
Quad Timer D
2
Program Controller
and
Hardware Looping Unit
•
Data Memory
4096 x 16 Flash
2048 x 16 SRAM
CAN 2.0A/B
•
•
CGDB
XAB1
XAB2
SPI
or
GPIO
16-Bit
56800
Core
•
•
INTERRUPT
CONTROLS
16
COP/
Watchdog
Application-Specific
Memory &
Peripherals
CLKO
XTAL
Clock Gen
EXTAL
•
•
IPBB
CONTROLS
16
COP RESET
MODULE CONTROLS
ADDRESS BUS [8:0]
Bit
Manipulation
Unit
PLL
•
XDB2
2
SCI
or
GPIO
Data ALU
16 x 16 + 36 → 36-Bit MAC
Three 16-bit Input Registers
Two 36-bit Accumulators
Address
Generation
Unit
PAB
PDB
Boot Flash
2048 x 16 Flash
Quad Timer C
4
VDDA
VREF
Program Memory
32252 x 16 Flash
512 x 16 SRAM
2
VSS
6*
IPBus Bridge
(IPBB)
DATA BUS [15:0]
External
Bus
Interface
Unit
External
Address Bus
Switch
External
Data Bus
Switch
Bus
Control
A[00:05]
6
10
A[06:15] or
GPIO-E2:E3 &
GPIO-A0:A7
D[00:15]
16
PS Select
DS Select
WR Enable
RD Enable
56F803 Block Diagram
*includes TCS pin which is reserved for factory use and is tied to VSS
56F803 Technical Data, Rev. 16
Freescale Semiconductor
3
Part 1 Overview
1.1 56F803 Features
1.1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.1.2
•
•
Processing Core
Efficient 16-bit 56800 family controller engine with dual Harvard architecture
As many as 40 Million Instructions Per Second (MIPS) at 80MHz core frequency
Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
Two 36-bit accumulators, including extension bits
16-bit bidirectional barrel shifter
Parallel instruction set with unique processor addressing modes
Hardware DO and REP loops
Three internal address buses and one external address bus
Four internal data buses and one external data bus
Instruction set supports both DSP and controller functions
Controller style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/OnCE debug programming interface
Memory
Harvard architecture permits as many as three simultaneous accesses to Program and Data memory
On-chip memory including a low-cost, high-volume Flash solution
— 31.5K × 16-bit words of Program Flash
— 512K × 16-bit words of Program RAM
— 4K × 16-bit words of Data Flash
— 2K × 16-bit words of Data RAM
— 2K × 16-bit words of Boot Flash
•
Off-chip memory expansion capabilities programmable for 0, 4, 8, or 12 wait states
— As much as 64K × 16 bits of Data memory
— As much as 64K × 16 bits of Program memory
1.1.3
•
•
•
Peripheral Circuits for 56F803
Pulse Width Modulator module (PWM) with six PWM outputs, three Current Sense inputs, and three Fault
inputs, fault-tolerant design with dead time insertion, supports both center- and edge- aligned modes,
supports Freescale’s patented dead time distortion correction
Two 12-bit Analog-to-Digital Converters (ADCs), which support two simultaneous conversions; ADC and
PWM modules can be synchronized
Quadrature Decoder with four inputs (shares pins with Quad Timer)
56F803 Technical Data, Rev. 16
4
Freescale Semiconductor
56F803 Description
•
•
•
•
•
•
•
•
•
•
1.1.4
•
•
•
•
Four General Purpose Quad Timers: Timer A (sharing pins with Quad Dec0), Timers B &C without external
pins and Timer D with two pins
CAN 2.0 B module with 2-pin ports for transmit and receive
Serial Communication Interface (SCI) with two pins (or two additional GPIO lines)
Serial Peripheral Interface (SPI) with configurable 4-pin port (or four additional GPIO lines)
Computer Operating Properly (COP) Watchdog timer
Two dedicated external interrupt pins
Sixteen multiplexed General Purpose I/O (GPIO) pins
External reset input pin for hardware reset
JTAG/On-Chip Emulation (OnCE™) for unobtrusive, processor speed-independent debugging
Software-programmable, Phase Locked Loop-based frequency synthesizer for the controller core clock
Energy Information
Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs
Uses a single 3.3V power supply
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
Wait and Stop modes available
1.2 56F803 Description
The 56F803 is a member of the 56800 core-based family of processors. It combines, on a single chip, the
processing power of a DSP and the functionality of a microcontroller with a flexible set of peripherals to
create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and compact
program code, the 56F803 is well-suited for many applications. The 56F803 includes many peripherals
that are especially useful for applications such as motion control, smart appliances, steppers, encoders,
tachometers, limit switches, power supply and control, automotive control, engine management, noise
suppression, remote utility metering, and industrial control for power, lighting, and automation.
The 56800 core is based on a Harvard-style architecture consisting of three execution units operating in
parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and
optimized instruction set allow straightforward generation of efficient, compact device and control code.
The instruction set is also highly efficient for C compilers to enable rapid development of optimized
control applications.
The 56F803 supports program execution from either internal or external memories. Two data operands can
be accessed from the on-chip Data RAM per instruction cycle. The 56F803 also provides two external
dedicated interrupt lines, and up to 16 General Purpose Input/Output (GPIO) lines, depending on
peripheral configuration.
The 56F803 controller includes 31.5K words (16-bit) of Program Flash and 4K words of Data Flash (each
programmable through the JTAG port) with 512 words of Program RAM and 2K words of Data RAM. It
also supports program execution from external memory.
A total of 2K words of Boot Flash is incorporated for easy customer-inclusion of field-programmable
56F803 Technical Data, Rev. 16
Freescale Semiconductor
5
software routines that can be used to program the main Program and Data Flash memory areas. Both
Program and Data Flash memories can be independently bulk–erased or erased in page sizes of 256 words.
The Boot Flash memory can also be either bulk- or page-erased.
A key application-specific feature of the 56F803 is the inclusion of a Pulse Width Modulator (PWM)
module. This module incorporates three complementary, individually programmable PWM signal outputs
(the module is also capable of supporting three independent PWM functions, for a total of six PWM
outputs) to enhance motor control functionality. Complementary operation permits programmable dead
time insertion, distortion correction via current sensing by software, and separate top and bottom output
polarity control. The up-counter value is programmable to support a continuously variable PWM
frequency. Edge- and center-aligned synchronous pulse width control (0% to 100% modulation) is
supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors), both
BDC and BLDC (Brush and Brushless DC motors), SRM and VRM (Switched and Variable Reluctance
Motors), and stepper motors. The PWM incorporates fault protection and cycle-by-cycle current limiting
with sufficient output drive capability to directly drive standard opto-isolators. A “smoke-inhibit”,
write-once protection feature for key parameters and patented PWM waveform distortion correction
circuit are also provided. The PWM is double-buffered and includes interrupt controls to permit integral
reload rates to be programmable from 1 to 16. The PWM module provides a reference output to
synchronize the ADC.
The 56F803 incorporates a separate Quadrature Decoder capable of capturing all four transitions on the
two-phase inputs, permitting generation of a number proportional to actual position. Speed computation
capabilities accommodate both fast and slow moving shafts. The integrated watchdog timer in the
Quadrature Decoder can be programmed with a time-out value to alarm when no shaft motion is detected.
Each input is filtered to ensure only true transitions are recorded.
This controller also provides a full set of standard programmable peripherals that include a Serial
Communications Interface (SCI), one Serial Peripheral Interface (SPI), and four Quad Timers. Any of
these interfaces can be used as General Purpose Input/Outputs (GPIO) if that function is not required. A
Controller Area Network interface (CAN Version 2.0 A/B-compliant) and an internal interrupt controller
are also included on the 56F803.
1.3 State of the Art Development Environment
•
•
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The Code Warrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards
will support concurrent engineering. Together, PE, Code Warrior and EVMs create a complete, scalable
tools solution for easy, fast, and efficient development.
56F803 Technical Data, Rev. 16
6
Freescale Semiconductor
Product Documentation
1.4 Product Documentation
The four documents listed in Table 1-1 are required for a complete description and proper design with the
56F803. Documentation is available from local Freescale distributors, Freescale Semiconductor sales
offices, Freescale Literature Distribution Centers, or online at: www.freescale.com
Table 1-1 56F803 Chip Documentation
Topic
Description
Order Number
56800E
Family Manual
Detailed description of the 56800 family architecture, and
16-bit core processor and the instruction set
56800EFM
DSP56F801/803/805/807
User’s Manual
Detailed description of memory, peripherals, and interfaces
of the 56F801, 56F803, 56F803, and 56F807
DSP56F801-7UM
56F803
Technical Data Sheet
Electrical and timing specifications, pin descriptions, and
package descriptions (this document)
DSP56F803
56F803
Errata
Details any chip issues that might be present
DSP56F803E
1.5 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
“asserted”
A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”
A high true (active high) signal is low or a low true (active low) signal is high.
Examples:
Signal/Symbol
Logic State
Signal State
Voltage1
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
7
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F803 are organized into functional groups, as shown in Table 2-1
and as illustrated in Figure 2-1. In Table 2-2 through Table 2-17, each table row describes the signal or
signals present on a pin.
Table 2-1 Functional Group Pin Allocations
Number of
Pins
Detailed
Description
Power (VDD or VDDA)
7
Table 2-2
Ground (VSS or VSSA)
7
Table 2-3
Supply Capacitors
2
Table 2-4
PLL and Clock
3
Table 2-5
Address Bus1
16
Table 2-6
Data Bus
16
Table 2-7
Bus Control
4
Table 2-8
Interrupt and Program Control
4
Table 2-9
Pulse Width Modulator (PWM) Port
12
Table 2-10
Serial Peripheral Interface (SPI) Port1
4
Table 2-11
Quadrature Decoder Port2
4
Table 2-12
Serial Communications Interface (SCI) Port1
2
Table 2-13
CAN Port
2
Table 2-14
Analog to Digital Converter (ADC) Port
9
Table 2-15
Quad Timer Module Port
2
Table 2-16
JTAG/On-Chip Emulation (OnCE)
6
Table 2-17
Functional Group
1. Alternately, GPIO pins
2. Alternately, Quad Timer pins
56F803 Technical Data, Rev. 16
8
Freescale Semiconductor
Introduction
Power Port
VDD
6
Ground Port
VSS
6*
Power Port
VDDA
1
Ground Port
VSSA
1
Other
Supply
Ports
VCAPC
PLL
and
Clock
EXTAL
XTAL
CLKO
A0-A5
External
Address Bus or
GPIO
External
Data Bus
A6-7 (GPIOE2-E3)
A8-15 (GPIOA0-A7)
D0–D15
PS
DS
External
Bus Control
RD
WR
PHASEA0 (TA0)
Quadrature
Decoder or
Quad Timer A
PHASEB0 (TA1)
INDEX0 (TA2)
HOME0 (TA3)
6
3
2
3
TCK
JTAG/OnCE™
Port
TDI
TDO
TRST
DE
ISA0-2
FAULTA0-2
PWMA
Port
1
1
56F803
1
1
6
2
8
16
1
1
1
1
1
SCLK (GPIOE4)
MOSI (GPIOE5)
MISO (GPIOE6)
SPI Port
or GPIO
SS (GPIOE7)
TXD0 (GPIOE0)
RXD0 (GPIOE1)
SCI0 Port
or GPIO
1
1
1
1
8
1
1
ANA0-7
VREF
ADCA
Port
1
1
1
1
1
TMS
PWMA0-5
2
MSCAN_RX
MSCAN_TX
TD1-2
CAN
Quad
Timer D
1
1
1
1
1
1
1
1
IRQA
IRQB
RESET
EXTBOOT
Interrupt/
Program
Control
1
1
*includes TCS pin which is reserved for factory use and is tied to VSS
Figure 2-1 56F803 Signals Identified by Functional Group1
1. Alternate pin functionality is shown in parenthesis.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
9
2.2 Power and Ground Signals
Table 2-2 Power Inputs
No. of Pins
Signal Name
Signal Description
6
VDD
Power—These pins provide power to the internal structures of the chip, and should all
be attached to VDD.
1
VDDA
Analog Power—This pin is a dedicated power pin for the analog portion of the chip and
should be connected to a low noise 3.3V supply.
Table 2-3 Grounds
No. of Pins
Signal Name
Signal Description
5
VSS
GND—These pins provide grounding for the internal structures of the chip, and should all
be attached to VSS.
1
VSSA
Analog Ground—This pin supplies an analog ground.
1
TCS
TCS—This Schmitt pin is reserved for factory use and must be tied to VSS for normal use.
In block diagrams, this pin is considered an additional VSS.
Table 2-4 Supply Capacitors
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
2
VCAPC
Supply
Supply
Signal Description
VCAPC—Connect each pin to a 2.2 μF or greater bypass capacitor in
order to bypass the core logic voltage regulator (required for proper chip
operation). For more information, please refer to Section 5.2.
56F803 Technical Data, Rev. 16
10
Freescale Semiconductor
Clock and Phase Locked Loop Signals
2.3 Clock and Phase Locked Loop Signals
Table 2-5 PLL and Clock
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
EXTAL
Input
Input
1
XTAL
Input/
Output
Chip-driven
Signal Description
External Crystal Oscillator Input—This input should be connected to
an 8MHz external crystal or ceramic resonator. For more information,
please refer to Section 3.5.
Crystal Oscillator Output—This output should be connected to an
8MHz external crystal or ceramic resonator. For more information,
please refer to Section 3.5.
This pin can also be connected to an external clock source. For more
information, please refer to Section 3.5.3.
1
CLKO
Output
Chip-driven
Clock Output—This pin outputs a buffered clock signal. By
programming the CLKOSEL[4:0] bits in the CLKO Select Register
(CLKOSR), the user can select between outputting a version of the
signal applied to XTAL and a version of the device’s master clock at the
output of the PLL. The clock frequency on this pin can also be disabled
by programming the CLKOSEL[4:0] bits in CLKOSR.
2.4 Address, Data, and Bus Control Signals
Table 2-6 Address Bus Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
6
A0–A5
Output
Tri-stated
Address Bus—A0–A5 specify the address for external Program or Data
memory accesses.
2
A6–A7
Output
Tri-stated
Address Bus—A6–A7 specify the address for external Program or Data
memory accesses.
GPIOE2–
GPIOE3
Input/O
utput
Input
Port E GPIO—These two pins are General Purpose I/O (GPIO) pins that
can be individually programmed as input or output pins.
Signal Description
After reset, the default state is Address Bus.
8
A8–A15
Output
Tri-stated
GPIOA0–
GPIOA7
Input/O
utput
Input
Address Bus—A8–A15 specify the address for external Program or
Data memory accesses.
Port A GPIO—These eight pins are General Purpose I/O (GPIO) pins
that can be individually programmed as input or output pins.
After reset, the default state is Address Bus.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
11
Table 2-7 Data Bus Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
16
D0–D15
Input/O
utput
Tri-stated
Signal Description
Data Bus— D0–D15 specify the data for external Program or Data
memory accesses. D0–D15 are tri-stated when the external bus is
inactive. Internal pull-ups may be active.
Table 2-8 Bus Control Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
PS
Output
Tri-stated
Program Memory Select—PS is asserted low for external Program memory
access.
1
DS
Output
Tri-stated
Data Memory Select—DS is asserted low for external Data memory access.
1
WR
Output
Tri-stated
Write Enable—WR is asserted during external memory write cycles. When
WR is asserted low, pins D0–D15 become outputs and the device puts data
on the bus. When WR is deasserted high, the external data is latched inside
the external device. When WR is asserted, it qualifies the A0–A15, PS, and
DS pins. WR can be connected directly to the WE pin of a Static RAM.
1
RD
Output
Tri-stated
Read Enable—RD is asserted during external memory read cycles. When
RD is asserted low, pins D0–D15 become inputs and an external device is
enabled onto the device data bus. When RD is deasserted high, the external
data is latched inside the controller. When RD is asserted, it qualifies the
A0–A15, PS, and DS pins. RD can be connected directly to the OE pin of a
Static RAM or ROM.
Signal Description
2.5 Interrupt and Program Control Signals
Table 2-9 Interrupt and Program Control Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
IRQA
Input
(Schmitt)
Input
External Interrupt Request A—The IRQA input is a synchronized
external interrupt request indicating an external device is requesting
service. It can be programmed to be level-sensitive or
negative-edge- triggered.
1
IRQB
Input
(Schmitt)
Input
External Interrupt Request B—The IRQB input is an external
interrupt request indicating an external device is requesting service.
It can be programmed to be level-sensitive or
negative-edge-triggered.
Signal Description
56F803 Technical Data, Rev. 16
12
Freescale Semiconductor
Pulse Width Modulator (PWM) Signals
Table 2-9 Interrupt and Program Control Signals (Continued)
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
RESET
Input
(Schmitt)
Input
Signal Description
Reset—This input is a direct hardware reset on the processor.
When RESET is asserted low, the controller is initialized and placed
in the Reset state. A Schmitt trigger input is used for noise immunity.
When the RESET pin is deasserted, the initial chip operating mode
is latched from the EXTBOOT pin. The internal reset signal will be
deasserted synchronous with the internal clocks, after a fixed
number of internal clocks.
To ensure a complete hardware reset, RESET and TRST should be
asserted together. The only exception occurs in a debugging
environment when a hardware device reset is required and it is
necessary not to reset the OnCE/JTAG module. In this case, assert
RESET, but do not assert TRST.
1
EXTBOOT
Input
(Schmitt)
Input
External Boot—This input is tied to VDD to force device to boot from
off-chip memory. Otherwise, it is tied to VSS.
2.6 Pulse Width Modulator (PWM) Signals
Table 2-10 Pulse Width Modulator (PWMA) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
6
PWMA0–5
Output
Tri-stated
3
ISA0–2
Input
(Schmitt)
Input
ISA0–2— These three input current status pins are used for
top/bottom pulse width correction in complementary channel
operation for PWMA.
3
FAULTA0–2
Input
(Schmitt)
Input
FAULTA0–2— These three fault input pins are used for disabling
selected PWMA outputs in cases where fault conditions originate
off-chip.
Signal Description
PWMA0–5— These are six PWMA output pins.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
13
2.7 Serial Peripheral Interface (SPI) Signals
Table 2-11 Serial Peripheral Interface (SPI) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
MISO
Input/Out
put
Input
SPI Master In/Slave Out (MISO)—This serial data pin is an input to a
master device and an output from a slave device. The MISO line of a
slave device is placed in the high impedance state if the slave device
is not selected.
GPIOE6
Input/Out
put
Input
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
Signal Description
After reset, the default state is MISO.
1
MOSI
Input/Out
put
Input
GPIOE5
Input/Out
put
Input
SPI Master Out/Slave In (MOSI)—This serial data pin is an output
from a master device and an input to a slave device. The master
device places data on the MOSI line a half-cycle before the clock
edge that the slave device uses to latch the data.
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
After reset, the default state is MOSI.
1
SCLK
Input/Out
put
Input
SPI Serial Clock—In master mode, this pin serves as an output,
clocking slaved listeners. In slave mode, this pin serves as the data
clock input.
GPIOE4
Input/Out
put
Input
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
After reset, the default state is SCLK.
1
SS
Input
Input
GPIOE7
Input/Out
put
Input
SPI Slave Select—In master mode, this pin is used to arbitrate
multiple masters. In slave mode, this pin is used to select the slave.
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
After reset, the default state is SS.
56F803 Technical Data, Rev. 16
14
Freescale Semiconductor
Quadrature Decoder Signals
2.8 Quadrature Decoder Signals
Table 2-12 Quadrature Decoder (Quad Dec0) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
PHASEA0
Input
Input
Phase A—Quadrature Decoder #0 PHASEA input
TA0
Input/Output
Input
TA0—Timer A Channel 0
PHASEB0
Input
Input
Phase B—Quadrature Decoder #0 PHASEB input
TA1
Input/Output
Input
TA1—Timer A Channel 1
INDEX0
Input
Input
Index—Quadrature Decoder #0 INDEX input
TA2
Input/Output
Input
TA2—Timer A Channel 2
HOME0
Input
Input
Home—Quadrature Decoder #0 HOME input
TA3
Input/Output
Input
TA3—Timer A Channel 3
1
1
1
Signal Description
2.9 Serial Communications Interface (SCI) Signals
Table 2-13 Serial Communications Interface (SCI0) Signals
No. of
Pins
Signal
Name
Signal Type
State During
Reset
1
TXD0
Output
Input
Transmit Data (TXD0)—SCI0 transmit data output
GPIOE0
Input/Output
Input
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
Signal Description
After reset, the default state is SCI output.
1
RXD0
Input
Input
Receive Data (RXD0)— SCI0 receive data input
GPIOE1
Input/Output
Input
Port E GPIO—This General Purpose I/O (GPIO) pin can be
individually programmed as an input or output pin.
After reset, the default state is SCI input.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
15
2.10 CAN Signals
Table 2-14 CAN Module Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
MSCAN_ RX
Input
(Schmitt)
Input
1
MSCAN_ TX
Output
Output
Signal Description
MSCAN Receive Data—This is the MSCAN input. This pin has an
internal pull-up resistor.
MSCAN Transmit Data—MSCAN output. CAN output is
open-drain output and a pull-up resistor is needed.
2.11 Analog-to-Digital Converter (ADC) Signals
Table 2-15 Analog to Digital Converter Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
4
ANA0–3
Input
Input
ANA0–3—Analog inputs to ADC channel 1
4
ANA4–7
Input
Input
ANA4–7—Analog inputs to ADC channel 2
1
VREF
Input
Input
VREF—Analog reference voltage for ADC. Must be set to VDDA-0.3V
for optimal performance.
Signal Description
2.12 Quad Timer Module Signals
Table 2-16 Quad Timer Module Signals
No. of Pins
Signal Name
Signal Type
State During Reset
2
TD1–2
Input/Output
Input
Signal Description
TD1–2— Timer D Channel 1–2
56F803 Technical Data, Rev. 16
16
Freescale Semiconductor
JTAG/OnCE
2.13 JTAG/OnCE
Table 2-17 JTAG/On-Chip Emulation (OnCE) Signals
No. of
Pins
Signal
Name
Signal
Type
State During
Reset
1
TCK
Input
Input, pulled low Test Clock Input—This input pin provides a gated clock to synchronize the
(Schmitt)
internally
test logic and shift serial data to the JTAG/OnCE port. The pin is connected
internally to a pull-down resistor.
1
TMS
Input
(Schmitt)
Input, pulled
high internally
Signal Description
Test Mode Select Input—This input pin is used to sequence the JTAG
TAP controller’s state machine. It is sampled on the rising edge of TCK and
has an on-chip pull-up resistor.
Note:
Always tie the TMS pin to VDD through a 2.2K resistor.
1
TDI
Input
(Schmitt)
Input, pulled
high internally
Test Data Input—This input pin provides a serial input data stream to the
JTAG/OnCE port. It is sampled on the rising edge of TCK and has an
on-chip pull-up resistor.
1
TDO
Output
Tri-stated
Test Data Output—This tri-statable output pin provides a serial output data
stream from the JTAG/OnCE port. It is driven in the Shift-IR and Shift-DR
controller states, and changes on the falling edge of TCK.
1
TRST
Input
(Schmitt)
Input, pulled
high internally
Test Reset—As an input, a low signal on this pin provides a reset signal to
the JTAG TAP controller. To ensure complete hardware reset, TRST
should be asserted at power-up and whenever RESET is asserted. The
only exception occurs in a debugging environment when a hardware device
reset is required and it is necessary not to reset the OnCE/JTAG module. In
this case, assert RESET, but do not assert TRST.
Note: For normal operation, connect TRST directly to VSS. If the design is to be
used in a debugging environment, TRST may be tied to VSS through a 1K resistor.
1
DE
Output
Output
Debug Event—DE provides a low pulse on recognized debug events.
Part 3 Specifications
3.1 General Characteristics
The 56F803 is fabricated in high-density CMOS with 5-V tolerant TTL-compatible digital inputs. The
term “5-V tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process technology,
to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices
designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V and 5V-compatible
I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during
normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings
of 3.3V I/O levels while being able to receive 5V levels without being damaged.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
17
Absolute maximum ratings given in Table 3-1 are stress ratings only, and functional operation at the
maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent
damage to the device.
The 56F803 DC/AC electrical specifications are preliminary and are from design simulations. These
specifications may not be fully tested or guaranteed at this early stage of the product life cycle. Finalized
specifications will be published after complete characterization and device qualifications have been
completed.
CAUTION
This device contains protective circuitry to guard against damage due
to high static voltage or electrical fields. However, normal precautions
are advised to avoid application of any voltages higher than maximum
rated voltages to this high-impedance circuit. Reliability of operation is
enhanced if unused inputs are tied to an appropriate voltage level.
Table 3-1 Absolute Maximum Ratings
Characteristic
Symbol
Min
Max
Unit
Supply voltage
VDD
VSS – 0.3
VSS + 4.0
V
All other input voltages, excluding Analog inputs
VIN
VSS – 0.3
VSS + 5.5V
V
Voltage difference VDD to VDDA
ΔVDD
- 0.3
0.3
V
Voltage difference VSS to VSSA
ΔVSS
- 0.3
0.3
V
Analog inputs ANA0-7 and VREF
VIN
VSSA– 0.3
VDDA+ 0.3
V
Analog inputs EXTAL and XTAL
VIN
VSSA– 0.3
VSSA+ 3.0
V
I
—
10
mA
Current drain per pin excluding VDD, VSS, PWM outputs, TCS,
VPP, VDDA, VSSA
Table 3-2 Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Supply voltage, digital
VDD
3.0
3.3
3.6
V
Supply Voltage, analog
VDDA
3.0
3.3
3.6
V
Voltage difference VDD to VDDA
ΔVDD
-0.1
-
0.1
V
56F803 Technical Data, Rev. 16
18
Freescale Semiconductor
General Characteristics
Table 3-2 Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Voltage difference VSS to VSSA
ΔVSS
-0.1
-
0.1
V
ADC reference voltage
VREF
2.7
–
VDDA
V
TA
–40
–
85
°C
Ambient operating temperature
Table 3-3 Thermal Characteristics6
Value
Characteristic
Comments
Symbol
Unit
Notes
100-pin LQFP
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
RθJA
41.7
°C/W
2
RθJMA
37.2
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
34.2
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
32
°C/W
1,2
Junction to case
RθJC
10.2
°C/W
3
Junction to center of case
ΨJT
0.8
°C/W
4, 5
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
PD
P D = (IDD x VDD + P I/O)
W
PDMAX
(TJ - TA) /RθJA
W
Junction to center of case
7
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2.
Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
3.
Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
19
4.
Thermal Characterization Parameter, Psi-JT (ΨJT ), is the “resistance” from junction to reference point
thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction
temperature in steady state customer environments.
5.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
6.
See Section 5.1 from more details on thermal design considerations.
7.
TJ = Junction Temperature
TA = Ambient Temperature
3.2 DC Electrical Characteristic
Table 3-4 DC Electrical Characteristics
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz
Characteristic
Symbol
Min
Typ
Max
Unit
Input high voltage (XTAL/EXTAL)
VIHC
2.25
—
2.75
V
Input low voltage (XTAL/EXTAL)
VILC
0
—
0.5
V
Input high voltage (Schmitt trigger inputs)1
VIHS
2.2
—
5.5
V
Input low voltage (Schmitt trigger inputs)1
VILS
-0.3
—
0.8
V
Input high voltage (all other digital inputs)
VIH
2.0
—
5.5
V
Input low voltage (all other digital inputs)
VIL
-0.3
—
0.8
V
Input current high (pullup/pulldown resistors
disabled, VIN=VDD)
IIH
-1
—
1
μA
Input current low (pullup/pulldown resistors
disabled, VIN=VSS)
IIL
-1
—
1
μA
Input current high (with pullup resistor, VIN=VDD)
IIHPU
-1
—
1
μA
Input current low (with pullup resistor, VIN=VSS)
IILPU
-210
—
-50
μA
Input current high (with pulldown resistor, VIN=VDD)
IIHPD
20
—
180
μA
Input current low (with pulldown resistor, VIN=VSS)
IILPD
-1
—
1
μA
Nominal pullup or pulldown resistor value
RPU, RPD
30
KΩ
Output tri-state current low
IOZL
-10
—
10
μA
Output tri-state current high
IOZH
-10
—
10
μA
56F803 Technical Data, Rev. 16
20
Freescale Semiconductor
DC Electrical Characteristic
Table 3-4 DC Electrical Characteristics (Continued)
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz
Characteristic
Symbol
Min
Typ
Max
Unit
Input current high (analog inputs, VIN=VDDA)2
IIHA
-15
—
15
μA
Input current low (analog inputs, VIN=VSSA)2
IILA
-15
—
15
μA
Output High Voltage (at IOH)
VOH
VDD – 0.7
—
—
V
Output Low Voltage (at IOL)
VOL
—
—
0.4
V
Output source current
IOH
4
—
—
mA
Output sink current
IOL
4
—
—
mA
PWM pin output source current3
IOHP
10
—
—
mA
PWM pin output sink current4
IOLP
16
—
—
mA
Input capacitance
CIN
—
8
—
pF
Output capacitance
COUT
—
12
—
pF
VDD supply current
IDDT5
Run 6
—
126
152
mA
Wait7
—
105
129
mA
Stop
—
60
84
mA
Low Voltage Interrupt, external power supply8
VEIO
2.4
2.7
3.0
V
Low Voltage Interrupt, internal power supply9
VEIC
2.0
2.2
2.4
V
Power on Reset10
VPOR
—
1.7
2.0
V
1.
1. Schmitt Trigger inputs are: EXTBOOT, IRQA, IRQB, RESET, ISA0-2, FAULTA0-3, TCS, TCK, TRST, TMS, TDI, and
MSCAN_RX
2. Analog inputs are: ANA[0:7], XTAL and EXTAL. Specification assumes ADC is not sampling.
3. PWM pin output source current measured with 50% duty cycle.
4. PWM pin output sink current measured with 50% duty cycle.
5. IDDT = IDD + IDDA (Total supply current for VDD + VDDA)
6. Run (operating) IDD measured using 8MHz clock source. All inputs 0.2V from rail; outputs unloaded. All ports configured
as inputs; measured with all modules enabled.
7. Wait IDD measured using external square wave clock source (fosc = 8MHz) into XTAL; all inputs 0.2V from rail; no DC
loads; less than 50pF on all outputs. CL = 20pF on EXTAL; all ports configured as inputs; EXTAL capacitance linearly affects
wait IDD; measured with PLL enabled.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
21
8. This low-voltage interrupt monitors the VDDA external power supply. VDDA is generally connected to the same potential
as VDD via separate traces. If VDDA drops below VEIO, an interrupt is generated. Functionality of the device is guaranteed
under transient conditions when VDDA>VEIO (between the minimum specified VDD and the point when the VEIO interrupt is
generated).
9. This low voltage interrupt monitors the internally regulated core power supply. If the output from the internal voltage is
regulator drops below VEIC, an interrupt is generated. Since the core logic supply is internally regulated, this interrupt will not
be generated unless the external power supply drops below the minimum specified value (3.0V).
10. Power–on reset occurs whenever the internally regulated 2.5V digital supply drops below 1.5V typical. While power is
ramping up, this signal remains active as long as the internal 2.5V is below 1.5V typical, no matter how long the ramp-up rate
is. The internally regulated voltage is typically 100mV less than VDD during ramp-up, until 2.5V is reached, at which time it
self-regulates.
180
IDD Digital
IDD Analog
IDD Total
150
IDD (mA)
120
90
60
30
0
20
40
60
80
Freq. (MHz)
Figure 3-1 Maximum Run IDD vs. Frequency (see Note 6. in Table 3-14)
3.3 AC Electrical Characteristics
Timing waveforms in Section 3.3 are tested using the VIL and VIH levels specified in the DC Characteristics
table. In Figure 3-2 the levels of VIH and VIL for an input signal are shown.
56F803 Technical Data, Rev. 16
22
Freescale Semiconductor
Flash Memory Characteristics
Low
VIH
Input Signal
High
90%
50%
10%
Midpoint1
VIL
Fall Time
Rise Time
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 3-2 Input Signal Measurement References
Figure 3-3 shows the definitions of the following signal states:
•
•
•
Active state, when a bus or signal is driven, and enters a low impedance state
Tri-stated, when a bus or signal is placed in a high impedance state
Data Valid state, when a signal level has reached VOL or VOH
•
Data Invalid state, when a signal level is in transition between VOL and VOH
Data2 Valid
Data1 Valid
Data1
Data3 Valid
Data2
Data3
Data
Tri-stated
Data Invalid State
Data Active
Data Active
Figure 3-3 Signal States
3.4 Flash Memory Characteristics
Table 3-5 Flash Memory Truth Table
XE1
YE2
SE3
OE4
PROG5
ERASE6
MAS17
NVSTR8
Standby
L
L
L
L
L
L
L
L
Read
H
H
H
H
L
L
L
L
Word Program
H
H
L
L
H
L
L
H
Page Erase
H
L
L
L
L
H
L
H
Mass Erase
H
L
L
L
L
H
H
H
Mode
1. X address enable, all rows are disabled when XE = 0
2. Y address enable, YMUX is disabled when YE = 0
3. Sense amplifier enable
4. Output enable, tri-state Flash data out bus when OE = 0
56F803 Technical Data, Rev. 16
Freescale Semiconductor
23
5. Defines program cycle
6. Defines erase cycle
7. Defines mass erase cycle, erase whole block
8. Defines non-volatile store cycle
Table 3-6 IFREN Truth Table
Mode
IFREN = 1
IFREN = 0
Read information block
Read main memory block
Program information block
Program main memory block
Page erase
Erase information block
Erase main memory block
Mass erase
Erase both block
Erase main memory block
Read
Word program
Table 3-7 Flash Timing Parameters
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Typ
Max
Unit
Figure
Program time
Tprog*
20
–
–
us
Figure 3-4
Erase time
Terase*
20
–
–
ms
Figure 3-5
Mass erase time
Tme*
100
–
–
ms
Figure 3-6
Endurance1
ECYC
10,000
20,000
–
cycles
Data Retention1
DRET
10
30
–
years
The following parameters should only be used in the Manual Word Programming Mode
PROG/ERASE to NVSTR set up time
Tnv*
–
5
–
us
Figure 3-4,
Figure 3-5,
Figure 3-6
NVSTR hold time
Tnvh*
–
5
–
us
Figure 3-4,
Figure 3-5
NVSTR hold time (mass erase)
Tnvh1*
–
100
–
us
Figure 3-6
NVSTR to program set up time
Tpgs*
–
10
–
us
Figure 3-4
Recovery time
Trcv*
–
1
–
us
Figure 3-4,
Figure 3-5,
Figure 3-6
56F803 Technical Data, Rev. 16
24
Freescale Semiconductor
Flash Memory Characteristics
Table 3-7 Flash Timing Parameters (Continued)
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Typ
Max
Unit
Figure
Cumulative program
HV period2
Thv
–
3
–
ms
Figure 3-4
Program hold time3
Tpgh
–
–
–
Figure 3-4
Address/data set up time3
Tads
–
–
–
Figure 3-4
Address/data hold time3
Tadh
–
–
–
Figure 3-4
1. One cycle is equal to an erase program and read.
2. Thv is the cumulative high voltage programming time to the same row before next erase. The same address cannot be programmed
twice before next erase.
3. Parameters are guaranteed by design in smart programming mode and must be one cycle or greater.
*The Flash interface unit provides registers for the control of these parameters.
IFREN
XADR
XE
Tadh
YADR
YE
DIN
Tads
PROG
Tnvs
Tprog
Tpgh
NVSTR
Tpgs
Tnvh
Trcv
Thv
Figure 3-4 Flash Program Cycle
56F803 Technical Data, Rev. 16
Freescale Semiconductor
25
IFREN
XADR
XE
YE=SE=OE=MAS1=0
ERASE
Tnvs
NVSTR
Tnvh
Trcv
Terase
Figure 3-5 Flash Erase Cycle
IFREN
XADR
XE
MAS1
YE=SE=OE=0
ERASE
Tnvs
NVSTR
Tnvh1
Tme
Trcv
Figure 3-6 Flash Mass Erase Cycle
56F803 Technical Data, Rev. 16
26
Freescale Semiconductor
External Clock Operation
3.5 External Clock Operation
The 56F803 system clock can be derived from an external crystal or an external system clock signal. To
generate a reference frequency using the internal oscillator, a reference crystal must be connected between
the EXTAL and XTAL pins.
3.5.1
Crystal Oscillator
The internal oscillator is also designed to interface with a parallel-resonant crystal resonator in the
frequency range specified for the external crystal in Table 3-9. In Figure 3-7 a recommended crystal
oscillator circuit is shown. Follow the crystal supplier’s recommendations when selecting a crystal,
because crystal parameters determine the component values required to provide maximum stability and
reliable start-up. The crystal and associated components should be mounted as close as possible to the
EXTAL and XTAL pins to minimize output distortion and start-up stabilization time. The internal
56F80x oscillator circuitry is designed to have no external load capacitors present. As shown in
Figure 3-8 no external load capacitors should be used.
The 56F80x components internally are modeled as a parallel resonant oscillator circuit to provide a
capacitive load on each of the oscillator pins (XTAL and EXTAL) of 10pF to 13pF over temperature and
process variations. Using a typical value of internal capacitance on these pins of 12pF and a value of 3pF
as a typical circuit board trace capacitance the parallel load capacitance presented to the crystal is 9pF as
determined by the following equation:
CL1 * CL2
CL =
CL1 + CL2
12 * 12
+ Cs =
+ 3 = 6 + 3 = 9pF
12 + 12
This is the value load capacitance that should be used when selecting a crystal and determining the actual
frequency of operation of the crystal oscillator circuit.
EXTAL XTAL
Rz
Recommended External Crystal
Parameters:
Rz = 1 to 3 MΩ
fc = 8MHz (optimized for 8MHz)
fc
Figure 3-7 Connecting to a Crystal Oscillator
56F803 Technical Data, Rev. 16
Freescale Semiconductor
27
3.5.2
Ceramic Resonator
It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system
design can tolerate the reduced signal integrity. In Figure 3-8, a typical ceramic resonator circuit is
shown. Refer to supplier’s recommendations when selecting a ceramic resonator and associated
components. The resonator and components should be mounted as close as possible to the EXTAL and
XTAL pins. The internal 56F80x oscillator circuitry is designed to have no external load capacitors
present. As shown in Figure 3-7 no external load capacitors should be used.
EXTAL XTAL
Rz
Recommended Ceramic Resonator
Parameters:
Rz = 1 to 3 MΩ
fc = 8MHz (optimized for 8MHz)
fc
Figure 3-8 Connecting a Ceramic Resonator
Note: Freescale recommends only two terminal ceramic resonators vs. three terminal resonators
(which contain an internal bypass capacitor to ground).
3.5.3
External Clock Source
The recommended method of connecting an external clock is given in Figure 3-9. The external clock
source is connected to XTAL and the EXTAL pin is grounded.
56F803
XTAL
EXTAL
External
Clock
VSS
Figure 3-9 Connecting an External Clock Signal
56F803 Technical Data, Rev. 16
28
Freescale Semiconductor
External Clock Operation
Table 3-8 External Clock Operation Timing Requirements3
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation (external clock driver)1
fosc
0
—
80
MHz
Clock Pulse Width2, 3
tPW
6.25
—
—
ns
1. See Figure 3-9 for details on using the recommended connection of an external clock driver.
2. The high or low pulse width must be no smaller than 6.25ns or the chip will not function. However, the high pulse width
does not have to be any particular percent of the low pulse width.
3. Parameters listed are guaranteed by design.
VIH
External
Clock
90%
50%
10%
tPW
tPW
90%
50%
10%
VIL
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 3-10 External Clock Timing
56F803 Technical Data, Rev. 16
Freescale Semiconductor
29
3.5.4
Phase Locked Loop Timing
Table 3-9 PLL Timing
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C
Characteristic
Symbol
Min
Typ
Max
Unit
fosc
4
8
10
MHz
fout/2
40
—
110
MHz
PLL stabilization time 3 0o to +85oC
tplls
—
1
10
ms
PLL stabilization time3 -40o to 0oC
tplls
—
100
200
ms
External reference crystal frequency for the PLL1
PLL output frequency 2
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work
correctly. The PLL is optimized for 8MHz input crystal.
2. ZCLK may not exceed 80MHz. For additional information on ZCLK and fout/2, please refer to the OCCS chapter in the
User Manual. ZCLK = fop
3. This is the minimum time required after the PLL set-up is changed to ensure reliable operation.
3.6 External Bus Asynchronous Timing
Table 3-10 External Bus Asynchronous Timing1, 2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz
Characteristic
Symbol
Min
Max
Unit
Address Valid to WR Asserted
tAWR
6.5
—
ns
WR Width Asserted
Wait states = 0
Wait states > 0
tWR
7.5
(T*WS) + 7.5
—
—
ns
ns
WR Asserted to D0–D15 Out Valid
tWRD
—
4.2
ns
Data Out Hold Time from WR Deasserted
tDOH
4.8
—
ns
Data Out Set Up Time to WR Deasserted
Wait states = 0
Wait states > 0
tDOS
2.2
(T*WS) + 6.4
—
—
ns
ns
RD Deasserted to Address Not Valid
tRDA
0
—
ns
Address Valid to RD Deasserted
Wait states = 0
Wait states > 0
tARDD
—
18.7
(T*WS) + 18.7
ns
ns
56F803 Technical Data, Rev. 16
30
Freescale Semiconductor
External Bus Asynchronous Timing
Table 3-10 External Bus Asynchronous Timing1, 2 (Continued)
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fop = 80MHz
Characteristic
Symbol
Min
Max
Unit
Input Data Hold to RD Deasserted
tDRD
0
—
ns
RD Assertion Width
Wait states = 0
Wait states > 0
tRD
19
(T*WS) + 19
—
—
ns
ns
Address Valid to Input Data Valid
Wait states = 0
Wait states > 0
tAD
—
—
1
(T*WS) + 1
ns
ns
-4.4
—
ns
—
—
2.4
(T*WS) + 2.4
ns
ns
Address Valid to RD Asserted
tARDA
RD Asserted to Input Data Valid
Wait states = 0
Wait states > 0
tRDD
WR Deasserted to RD Asserted
tWRRD
6.8
—
ns
RD Deasserted to RD Asserted
tRDRD
0
—
ns
WR Deasserted to WR Asserted
tWRWR
14.1
—
ns
RD Deasserted to WR Asserted
tRDWR
12.8
—
ns
56F803 Technical Data, Rev. 16
Freescale Semiconductor
31
1. Timing is both wait state and frequency dependent. In the formulas listed, WS = the number of wait states and
T = Clock Period. For 80MHz operation, T = 12.5ns.
2. Parameters listed are guaranteed by design.
To calculate the required access time for an external memory for any frequency < 80Mhz, use this formula:
Top = Clock period @ desired operating frequency
WS = Number of wait states
Memory Access Time = (Top*WS) + (Top- 11.5)
A0–A15,
PS, DS
(See Note)
tARDD
tRDA
tARDA
RD
tRDRD
tRD
tAWR
tWRWR
tWRRD
tWR
tRDWR
WR
tRDD
tAD
tWRD
tDRD
tDOS
tDOH
Data In
Data Out
D0–D15
Note: During read-modify-write instructions and internal instructions, the address lines do not change state.
Figure 3-11 External Bus Asynchronous Timing
3.7 Reset, Stop, Wait, Mode Select, and Interrupt Timing
Table 3-11 Reset, Stop, Wait, Mode Select, and Interrupt Timing 1, 5
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
See Figure
RESET Assertion to Address, Data and Control
Signals High Impedance
tRAZ
—
21
ns
Figure 3-12
Minimum RESET Assertion Duration2
OMR Bit 6 = 0
OMR Bit 6 = 1
tRA
275,000T
128T
—
—
ns
ns
RESET De-assertion to First External Address Output
tRDA
33T
34T
ns
Figure 3-12
Figure 3-12
56F803 Technical Data, Rev. 16
32
Freescale Semiconductor
Reset, Stop, Wait, Mode Select, and Interrupt Timing
Table 3-11 Reset, Stop, Wait, Mode Select, and Interrupt Timing (Continued)1, 5
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF
Characteristic
Symbol
Min
Max
Unit
See Figure
Edge-sensitive Interrupt Request Width
tIRW
1.5T
—
ns
Figure 3-13
IRQA, IRQB Assertion to External Data Memory
Access Out Valid, caused by first instruction execution
in the interrupt service routine
tIDM
15T
—
ns
Figure 3-14
IRQA, IRQB Assertion to General Purpose Output
Valid, caused by first instruction execution in the
interrupt service routine
tIG
16T
—
ns
Figure 3-14
IRQA Low to First Valid Interrupt Vector Address Out
recovery from Wait State3
tIRI
13T
—
ns
Figure 3-15
IRQA Width Assertion to Recover from Stop State4
tIW
2T
—
ns
Figure 3-16
Delay from IRQA Assertion to Fetch of first instruction
(exiting Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
tIF
Duration for Level Sensitive IRQA Assertion to Cause
the Fetch of First IRQA Interrupt Instruction (exiting
Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
tIRQ
Delay from Level Sensitive IRQA Assertion to First
Interrupt Vector Address Out Valid (exiting Stop)
OMR Bit 6 = 0
OMR Bit 6 = 1
Figure 3-16
—
—
275,000T
12T
ns
ns
Figure 3-17
—
—
275,000T
12T
ns
ns
Figure 3-17
tII
—
—
275,000T
12T
ns
ns
1. In the formulas, T = clock cycle. For an operating frequency of 80MHz, T = 12.5ns.
2. Circuit stabilization delay is required during reset when using an external clock or crystal oscillator in two cases:
• After power-on reset
• When recovering from Stop state
3. The minimum is specified for the duration of an edge-sensitive IRQA interrupt required to recover from the Stop state. This is
not the minimum required so that the IRQA interrupt is accepted.
4. The interrupt instruction fetch is visible on the pins only in Mode 3.
5. Parameters listed are guaranteed by design.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
33
RESET
tRA
tRAZ
tRDA
A0–A15,
D0–D15
First Fetch
PS, DS,
RD, WR
First Fetch
Figure 3-12 Asynchronous Reset Timing
IRQA,
IRQB
tIRW
Figure 3-13 External Interrupt Timing (Negative-Edge-Sensitive)
56F803 Technical Data, Rev. 16
34
Freescale Semiconductor
Reset, Stop, Wait, Mode Select, and Interrupt Timing
A0–A15,
PS, DS,
RD, WR
First Interrupt Instruction Execution
tIDM
IRQA,
IRQB
a) First Interrupt Instruction Execution
General
Purpose
I/O Pin
tIG
IRQA,
IRQB
b) General Purpose I/O
Figure 3-14 External Level-Sensitive Interrupt Timing
IRQA,
IRQB
tIRI
A0–A15,
PS, DS,
RD, WR
First Interrupt Vector
Instruction Fetch
Figure 3-15 Interrupt from Wait State Timing
tIW
IRQA
tIF
A0–A15,
PS, DS,
RD, WR
First Instruction Fetch
Not IRQA Interrupt Vector
Figure 3-16 Recovery from Stop State Using Asynchronous Interrupt Timing
56F803 Technical Data, Rev. 16
Freescale Semiconductor
35
tIRQ
IRQA
tII
A0–A15
PS, DS,
RD, WR
First IRQA Interrupt
Instruction Fetch
Figure 3-17 Recovery from Stop State Using IRQA Interrupt Service
3.8 Serial Peripheral Interface (SPI) Timing
Table 3-12 SPI Timing1
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Cycle time
Master
Slave
Min
Max
Unit
50
25
—
—
ns
ns
—
25
—
—
ns
ns
—
100
—
—
ns
ns
17.6
12.5
—
—
24.1
25
—
—
ns
ns
20
0
—
—
ns
ns
0
2
—
—
ns
ns
4.8
15
ns
3.7
15.2
ns
tC
Enable lead time
Master
Slave
tELD
Enable lag time
Master
Slave
tELG
Clock (SCLK) high time
Master
Slave
tCH
Clock (SCLK) low time
Master
Slave
tCL
Data set-up time required for inputs
Master
Slave
tDS
Data hold time required for inputs
Master
Slave
tDH
Access time (time to data active from high-impedance
state)
Slave
tA
Disable time (hold time to high-impedance state)
Slave
tD
See Figure
Figures 3-18, ,
3-20, 3-21
Figure 3-21
Figure 3-21
ns
ns
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
Figure 3-21
Figure 3-21
56F803 Technical Data, Rev. 16
36
Freescale Semiconductor
Serial Peripheral Interface (SPI) Timing
Table 3-12 SPI Timing1
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Data Valid for outputs
Master
Slave (after enable edge)
tDV
Data invalid
Master
Slave
tDI
Rise time
Master
Slave
tR
Fall time
Master
Slave
tF
Min
Max
Unit
—
—
4.5
20.4
ns
ns
0
0
—
—
ns
ns
—
—
11.5
10.0
ns
ns
—
—
9.7
9.0
ns
ns
See Figure
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
Figures 3-18, ,
3-20, 3-21
1. Parameters listed are guaranteed by design.
SS
SS is held High on master
(Input)
tC
tR
tF
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tR
tCL
SCLK (CPOL = 1)
(Output)
tDH
tCH
tDS
MISO
(Input)
MSB in
Bits 14–1
tDI
MOSI
(Output)
Master MSB out
LSB in
tDV
Bits 14–1
tF
tDI(ref)
Master LSB out
tR
Figure 3-18 SPI Master Timing (CPHA = 0)
56F803 Technical Data, Rev. 16
Freescale Semiconductor
37
SS
(Input)
SS is held High on master
tC
tF
tR
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tCL
SCLK (CPOL = 1)
(Output)
tCH
tDS
tDH
tR
MISO
(Input)
MSB in
tDI
tDV(ref)
MOSI
(Output)
Bits 14–1
Master MSB out
LSB in
tDV
Bits 14– 1
tF
Master LSB out
tR
Figure 3-19 SPI Master Timing (CPHA = 1)
56F803 Technical Data, Rev. 16
38
Freescale Semiconductor
Serial Peripheral Interface (SPI) Timing
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tELG
tR
tCH
tELD
tCL
SCLK (CPOL = 1)
(Input)
tCH
tA
MISO
(Output)
Slave MSB out
Bits 14–1
tDS
tDV
tDH
MOSI
(Input)
MSB in
tF
tR
Bits 14–1
tD
Slave LSB out
tDI
tDI
LSB in
Figure 3-20 SPI Slave Timing (CPHA = 0)
56F803 Technical Data, Rev. 16
Freescale Semiconductor
39
SS
(Input)
tC
tF
tR
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELD
SCLK (CPOL = 1)
(Input)
tDV
tELG
tCL
tCH
tR
tD
tF
tA
MISO
(Output)
Slave MSB out
Bits 14–1
Slave LSB out
tDV
tDS
tDI
tDH
MOSI
(Input)
MSB in
Bits 14–1
LSB in
Figure 3-21 SPI Slave Timing (CPHA = 1)
3.9 Quad Timer Timing
Table 3-13 Timer Timing1, 2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Min
Max
Unit
PIN
4T+6
—
ns
Timer input high/low period
PINHL
2T+3
—
ns
Timer output period
POUT
2T
—
ns
Timer input period
56F803 Technical Data, Rev. 16
40
Freescale Semiconductor
Quadrature Decoder Timing
Table 3-13 Timer Timing1, 2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Timer output high/low period
1.
POUTHL
1T
—
ns
In the formulas listed, T = clock cycle. For 80MHz operation, T = 12.5ns.
2. Parameters listed are guaranteed by design.
Timer Inputs
PIN
PINHL
PINHL
Timer Outputs
POUT
POUTHL
POUTHL
Figure 3-22 Timer Timing
3.10 Quadrature Decoder Timing
Table 3-14 Quadrature Decoder Timing1,2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Min
Max
Unit
Quadrature input period
PIN
8T+12
—
ns
Quadrature input high/low period
PHL
4T+6
—
ns
Quadrature phase period
PPH
2T+3
—
ns
1. In the formulas listed, T = clock cycle. For 80MHz operation, T = 12. ns. VSS = 0 V, VDD = 3.0 – 3.6V,
TA = –40° to +85°C, CL ≤ 50pF.
2. Parameters listed are guaranteed by design.
56F803 Technical Data, Rev. 16
Freescale Semiconductor
41
PPH
PPH
PPH
PPH
Phase A
(Input)
PIN
PHL
PHL
Phase B
(Input)
PIN
PHL
PHL
Figure 3-23 Quadrature Decoder Timing
3.11 Serial Communication Interface (SCI) Timing
Table 3-15 SCI Timing4
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Min
Max
Unit
BR
—
(fMAX*2.5)/(80)
Mbps
RXD2 Pulse Width
RXDPW
0.965/BR
1.04/BR
ns
TXD3 Pulse Width
TXDPW
0.965/BR
1.04/BR
ns
Baud Rate1
1. fMAX is the frequency of operation of the system clock in MHz.
2. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1.
3. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1.
4. Parameters listed are guaranteed by design.
RXD
SCI receive
data pin
(Input)
RXDPW
Figure 3-24 RXD Pulse Width
56F803 Technical Data, Rev. 16
42
Freescale Semiconductor
Analog-to-Digital Converter (ADC) Characteristics
TXD
SCI receive
data pin
(Input)
TXDPW
Figure 3-25 TXD Pulse Width
3.12 Analog-to-Digital Converter (ADC) Characteristics
Table 3-16 ADC Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
VADCIN
01
—
VREF2
V
Resolution
RES
12
—
12
Bits
Integral Non-Linearity3
INL
—
+/- 2.5
+/- 4
LSB4
Differential Non-Linearity
DNL
—
+/- 0.9
+/- 1
LSB4
ADC input voltages
Monotonicity
GUARANTEED
ADC internal clock5
fADIC
0.5
—
5
MHz
Conversion range
RAD
VSSA
—
VDDA
V
Power-up time
tADPU
—
16
—
tAIC cycles6
Conversion time
tADC
—
6
—
tAIC cycles6
Sample time
tADS
—
1
—
tAIC cycles6
Input capacitance
CADI
—
5
—
pF6
Gain Error (transfer gain)5
EGAIN
0.95
1.00
1.10
—
VOFFSET
-80
-15
+20
mV
THD
60
64
—
dB
Signal-to-Noise plus Distortion5
SINAD
55
60
—
dB
Effective Number of Bits5
ENOB
9
10
—
bit
Spurious Free Dynamic Range5
SFDR
65
70
—
dB
BW
—
100
—
KHz
Offset Voltage5
Total Harmonic Distortion5
Bandwidth
56F803 Technical Data, Rev. 16
Freescale Semiconductor
43
Table 3-16 ADC Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
ADC Quiescent Current (both ADCs)
IADC
—
50
—
mA
VREF Quiescent Current (both ADCs)
IVREF
—
12
16.5
mA
1. For optimum ADC performance, keep the minimum VADCIN value > 25mV. Inputs less than 25mV may convert to a digital
output code of 0.
2. VREF must be equal to or less than VDDA and must be greater than 2.7V. For optimal ADC performance, set VREF to VDDA-0.3V.
3. Measured in 10-90% range.
4. LSB = Least Significant Bit.
5. Guaranteed by characterization.
6. tAIC = 1/fADIC
3
ADC analog input
1
2
4
1. Parasitic capacitance due to package, pin to pin, and pin to package base coupling. (1.8pf)
2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing. (2.04pf)
3. Equivalent resistance for the ESD isolation resistor and the channel select mux. (500 ohms)
4. Sampling capacitor at the sample and hold circuit. (1pf)
Figure 3-26 Equivalent Analog Input Circuit
3.13 Controller Area Network (CAN) Timing
Table 3-17 CAN Timing2
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40× to +85×C, CL £ 50pF, MSCAN Clock = 30MHz
Characteristic
Baud Rate
Bus Wakeup detection 1
Symbol
Min
Max
Unit
BRCAN
—
1
Mbps
T WAKEUP
5
—
μs
56F803 Technical Data, Rev. 16
44
Freescale Semiconductor
Controller Area Network (CAN) Timing
1. If Wakeup glitch filter is enabled during the design initialization and also CAN is put into SLEEP mode then, any bus event
(on MSCAN_RX pin) whose duration is less than 5 micro seconds is filtered away. However, a valid CAN bus wakeup detection takes place for a wakeup pulse equal to or greater than 5 microseconds. The value of 5 microseconds originates from the
fact that the CAN wakeup message consists of 5 dominant bits at the highest possible baud rate of 1Mbps.
2. Parameters listed are guaranteed by design.
MSCAN_RX
CAN receive
data pin
(Input)
T WAKEUP
Figure 3-27 Bus Wakeup Detection
56F803 Technical Data, Rev. 16
Freescale Semiconductor
45
3.14 JTAG Timing
Table 3-18 JTAG Timing1, 3
Operating Conditions: VSS = VSSA = 0 V, VDD = VDDA = 3.0–3.6 V, TA = –40° to +85°C, CL ≤ 50pF, fOP = 80MHz
Characteristic
Symbol
Min
Max
Unit
TCK frequency of operation2
fOP
DC
10
MHz
TCK cycle time
tCY
100
—
ns
TCK clock pulse width
tPW
50
—
ns
TMS, TDI data set-up time
tDS
0.4
—
ns
TMS, TDI data hold time
tDH
1.2
—
ns
TCK low to TDO data valid
tDV
—
26.6
ns
TCK low to TDO tri-state
tTS
—
23.5
ns
tTRST
50
—
ns
tDE
4T
—
ns
TRST assertion time
DE assertion time
1. Timing is both wait state and frequency dependent. For the values listed, T = clock cycle. For 80MHz
operation, T = 12.5ns.
2. TCK frequency of operation must be less than 1/8 the processor rate.
3. Parameters listed are guaranteed by design.
tCY
tPW
tPW
VM
VM
VIH
TCK
(Input)
VM = VIL + (VIH – VIL)/2
VIL
Figure 3-28 Test Clock Input Timing Diagram
56F803 Technical Data, Rev. 16
46
Freescale Semiconductor
JTAG Timing
TCK
(Input)
tDS
TDI
TMS
(Input)
tDH
Input Data Valid
tDV
TDO
(Output)
Output Data Valid
tTS
TDO
(Output)
tDV
TDO
(Output)
Output Data Valid
Figure 3-29 Test Access Port Timing Diagram
TRST
(Input)
tTRST
Figure 3-30 TRST Timing Diagram
DE
tDE
Figure 3-31 OnCE—Debug Event
56F803 Technical Data, Rev. 16
Freescale Semiconductor
47
Part 4 Packaging
4.1 Package and Pin-Out Information 56F803
D9
D8
D7
D6
D5
D4
D3
VSS
VDD
D2
D1
D0
VCAPC
SCLK
MOSI
MISO
SS
TD2
TD1
CLKO
DE
RESET
EXTBOOT
RXD0
TXD0
This section contains package and pin-out information for the 100-pin LQFP configuration of the 56F803.
PIN 76
PIN 1
ORIENTATION
MARK
PIN 51
PIN 26
PWMA5
PWMA4
PWMA3
PWMA2
PWMA1
PWMA0
HOME0
INDEX0
VSS
VDD
PHASEB0
PHASEA0
VSS
VDD
VDD
VDDA
VSSA
EXTAL
XTAL
AN7
AN6
AN5
AN4
AN3
AN2
A14
A15
VSS
WR
RD
IRQA
IRQB
TCS
TCK
TMS
TDI
TDO
TRST
VCAPC
ISA0
ISA1
ISA2
FAULTA0
MSCAN_TX
FAULTA1
MSCAN_RX
FAULTA2
VREF
AN0
AN1
D10
D11
D12
D13
D14
D15
A0
VDD
VSS
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
VDD
PS
DS
Figure 4-1 Top View, 56F803 100-pin LQFP Package
56F803 Technical Data, Rev. 16
48
Freescale Semiconductor
Package and Pin-Out Information 56F803
Table 4-1 56F803 Pin Identification By Pin Number
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
Pin No.
Signal Name
1
D10
26
A14
51
AN2
76
TXD0
2
D11
27
A15
52
AN3
77
RXD0
3
D12
28
VSS
53
AN4
78
EXTBOOT
4
D13
29
WR
54
AN5
79
RESET
5
D14
30
RD
55
AN6
80
DE
6
D15
31
IRQA
56
AN7
81
CLKO
7
A0
32
IRQB
57
XTAL
82
TD1
8
VDD
33
TCS
58
EXTAL
83
TD2
9
VSS
34
TCK
59
VSSA
84
SS
10
A1
35
TMS
60
VDDA
85
MISO
11
A2
36
TDI
61
VDD
86
MOSI
12
A3
37
TDO
62
VDD
87
SCLK
13
A4
38
TRST
63
VSS
88
VCAPC
14
A5
39
VCAPC
64
PHASEA0
89
D0
15
A6
40
ISA0
65
PHASEB0
90
D1
16
A7
41
ISA1
66
VDD
91
D2
17
A8
42
ISA2
67
VSS
92
VDD
18
A9
43
FAULTA0
68
INDEX0
93
VSS
19
A10
44
MSCAN_TX
69
HOME0
94
D3
20
A11
45
FAULTA1
70
PWMA0
95
D4
21
A12
46
MSCAN_RX
71
PWMA1
96
D5
22
A13
47
FAULTA2
72
PWMA2
97
D6
23
VDD
48
VREF
73
PWMA3
98
D7
24
PS
49
AN0
74
PWMA4
99
D8
25
DS
50
AN1
75
PWMA5
100
D9
56F803 Technical Data, Rev. 16
Freescale Semiconductor
49
S
0.15 (0.006) S AC T-U
Z
S
S
-T-
B
0.15
0.15 (0.006) S AC Z
-Z-
(0.006) S
V
AC Z
S
S
T-U
T-U
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
-UA
9
0.15
(0.006) S
AB T-U
S
AE
Z
MILLIMETERS
DIM MIN MAX
A 13.950 14.050
B 13.950 14.050
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G
0.500 BSC
H 0.050 0.150
J
0.090 0.200
K 0.500 0.700
M
12° REF
N 0.090 0.160
Q
1°
5°
R 0.150 0.250
S 15.950 16.050
V 15.950 16.050
W
0.200 REF
X
1.000 REF
S
AD
-AB-AC96X
G
SEATING
PLANE
(24X PER SIDE)
AE
0.100 (0.004) AC
M°
C
R
0.25 (0.010)
E
GAUGE PLANE
D
F
J
N
H
INCHES
MIN MAX
0.549 0.553
0.549 0.553
0.055 0.063
0.007 0.011
0.053 0.057
0.007 0.009
0.020 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12° REF
0.004 0.006
1°
5°
0.006 0.010
0.628 0.632
0.628 0.632
0.008 REF
0.039 REF
Q°
W
K
X
0.20 (0.008) M AC T-U
S
Z
S
SECTION AE-AE
DETAIL AD
Figure 4-2 100-pin LQPF Mechanical Information
56F803 Technical Data, Rev. 16
50
Freescale Semiconductor
Thermal Design Considerations
Please see www.freescale.com for the most current case outline.
Part 5 Design Considerations
5.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
Equation 1: TJ = T A + ( P D × RθJA )
Where:
TA = ambient temperature °C
RθJA = package junction-to-ambient thermal resistance °C/W
PD = power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance:
Equation 2: RθJA = R θJC + R θCA
Where:
RθJA = package junction-to-ambient thermal resistance °C/W
RθJC = package junction-to-case thermal resistance °C/W
RθCA = package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where
the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the
device thermal performance may need the additional modeling capability of a system level thermal
simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which
the package is mounted. Again, if the estimations obtained from RθJA do not satisfactorily answer whether
the thermal performance is adequate, a system level model may be appropriate.
Definitions:
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
•
Measure the thermal resistance from the junction to the outside surface of the package (case) closest to the
chip mounting area when that surface has a proper heat sink. This is done to minimize temperature variation
56F803 Technical Data, Rev. 16
Freescale Semiconductor
51
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© 2005, 2007,2015 Freescale Semiconductor, Inc. All rights reserved.
Document Number: DSP56F803
Rev. 17
10/2015
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