Freescale Semiconductor, Inc.
User’s Guide
Document Number: FRDMKW019032UG
Rev. 0, 11/2015
FRDM-KW019032 Freescale Freedom
Development Board
User's Guide
1
Introduction
This manual describes the hardware for the Freescale
Freedom development board, FRDM-KW019032. The
FRDM-KW019032 Freedom development board is a small,
low-power, cost-effective evaluation and development board
for application prototyping and demonstration of the
MKW01Z128 family of devices.
The Kinetis MKW01Z128 wireless MCU is a highly
integrated RF transceiver that operates over a wide
frequency range including 315 MHz, 433 MHz, 470 MHz,
868 MHz, 915 MHz, 928 MHz, and 955 MHz in the
license-free Industrial, Scientific and Medical (ISM)
frequency bands.
1.1
Audience
This manual is intended for system designers.
2
2.1
Safety information
FCC guidelines
This equipment is for use by developers for evaluation
purposes only and must not be incorporated into any other
© 2015 Freescale Semiconductor, Inc. All rights reserved.
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2.Regulatory approval for Canada (IC RSS 210) . . . 2
2.3.Electrostatic discharge considerations . . . . . . . . . . 3
2.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3
3. FRDM-KW019032 overview and description . . . . . . 3
3.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.Software and driver considerations . . . . . . . . . . . . 6
4. FRDM-KW019032 development board . . . . . . . . . . . 7
4.1.FRDM-KW019032 board overview . . . . . . . . . . . 7
4.2.Functional description . . . . . . . . . . . . . . . . . . . . . 10
4.3.Schematic, board layout, and bill of material . . . 17
5. PCB manufacturing specifications . . . . . . . . . . . . . . 27
5.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 27
5.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 29
5.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.8.Hole specification/tool table . . . . . . . . . . . . . . . . 29
5.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Safety information
device or system. This device may not be sold to the general public. Integrators will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1
Labeling
FCC labels are physically located on the back of the board.
2.1.2
Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
2.1.3
Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least
8 inches (20 cm) from all persons.
2.1.4
Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE Standard 802.15.4. Further, this requirement does not apply to intentional radiators that
must be professionally installed, such as perimeter protection systems and some field disturbance sensors,
or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the
installation site. However, the installer is responsible for ensuring that the proper antenna is employed so
that the limits in this Part are not exceeded.
2.2
Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
1. This board may not cause interference, and
2. This board must accept any interference, including interference that may cause undesired operation
of the device.
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2.2.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3
Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps.
• Static control workstations, static control monitors and table or floor static control systems.
• Static control packaging and transportation materials and environmental systems.
2.4
Disposal instructions
This product may be subject to special disposal requirements. For product disposal instructions, see
freescale.com/productdisposal.
3
3.1
FRDM-KW019032 overview and description
Introduction
The FRDM-KW019032 development board is an evaluation environment based on the Freescale
MKW01Z128 device. The MKW01Z128 is a highly-integrated RF transceiver that operates over a wide
frequency range including 315 MHz, 433 MHz, 470 MHz, 868 MHz, 915 MHz, 928 MHz, and 955 MHz
in the license-free Industrial, Scientific and Medical (ISM) frequency bands. This configuration allows
users to minimize the use of external components.
The MKW01Z128 is targeted for the following low-power wireless applications:
• Automated Meter Reading
• Wireless Sensor Networks
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FRDM-KW019032 overview and description
• Home and Building Automation
• Wireless Alarm and Security Systems
• Industrial Monitoring and Control
• Wireless MBUS Standard (EN13757-4:2005)
Freescale supplements the MKW01Z128 with tools and software that include hardware evaluation and
development boards, software development IDE and applications, drivers, custom PHY usable with
Freescale’s IEEE Std. 802.15.4 compatible MAC, SMAC, Thread and an available wireless MBUS
solution.
3.2
3.2.1
Board features
FRDM-KW019032 board
The FRDM-KW019032 development board is part of the Freescale Freedom development (FRDM)
platform. It has a diverse reference design containing the MKW01Z128 device and all necessary I/O
connections for use as a self-contained board or for connection to an application, and also has the
capability to connect with other Freedom development boards.
FRDM-KW019032 evaluation board can operate in the 915MHz or 868MHz frequency bands with a 32
MHz clock source. The operation band may be changed to a different band but RF matching network needs
to be optimized per BOM section (reference to chapter 4.3.1).
Figure 1 shows the FRDM-KW019032 development board.
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Figure 1. FRDM-KW019032 Freedom development board
The FRDM-KW019032 development board includes the following features:
• Based on Freescale’s low-cost MKW01Z128 sub-GHz wireless node solution with an FSK, GFSK,
MSK, or OOK modulation-capable transceiver and low-power ARM® Cortex® M0+CPU
microcontroller, and a functional set of MCU peripherals into a 60-pin LGA package.
• Reference design area with small footprint, low-cost RF node:
— Power Amplifier Output
— Unbalanced I/O port
— Flexible RF-Front End for different bands operation
— Programmable output power from -18 dBm to +17 dBm in 1 dB steps
— High Sensitivity: down to -120 dBm at 1.2 Kbps
• Integrated chip antenna for RFIO port, and footprint for SMA RFIO and PA_BOOST ports
• 32 MHz reference oscillator depending on regional configuration
• 32 kHz clock oscillator
• Master reset switch
• Full power regulation and management
• Cortex 10-pin (0.05 inches) SWD debug port for target MCU
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•
•
•
•
•
Cortex 10-pin (0.05 inches) JTAG port for OpenSDA updates
Integrated open-standard serial and debug interface (OpenSDA)
1 RGB LED indicator
1 Blue LED indicator
4 Push button switches
Figure 2 shows the main board features and I/O headers for the Freescale FRDM-KW019032 board.
Figure 2. FRDM-KW019032 components
3.3
Software and driver considerations
The FRDM-KW019032 board includes an OpenSDAv2.1 (CMSIS-DAP), a serial and debug adapter
circuit that includes an open-source bootloader, and debug interface software. It bridges serial and debug
communications between a USB host and an embedded target processor. The hardware circuit is based on
the Kinetis K20 family. More related information can be found in the following documentation:
• KW019032 Quick Start Guide
For additional information about our sub-GHz Kinetis family platforms, see the following:
• Freescale.com/FRDM-KW019032
For ARM mbed™ drivers, see:
• https://developer.mbed.org/handbook/Windows-serial-configuration
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4.1
FRDM-KW019032 development board
FRDM-KW019032 board overview
The FRDM-KW019032 is an evaluation board based on the Freescale MKW01Z128 transceiver. The
FRDM-KW019032 provides a platform to evaluate the MKW01Z128, develop software, and applications.
The core device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry including a chip
antenna, and supporting circuitry.
The FRDM-KW019032 board is intended as the primary PCB for MKW01Z128 device evaluation and
application development, and can be used in the following modes:
• Simple standalone evaluation platform
• Daughter card to other development platform boards (Freedom development platform)
• Mother card to an application specific daughter card such as a shield card
4.1.1
PCB features
The FRDM-KW019032 board provides the following features:
• The Freescale Freedom development platform form factor
• 4-Layer metal, 0.062 inch thick FR4 board
• LGA footprint and power supply bypass
• Chip antenna for RFIO port and footprint for installing (user supplied) SMA connectors on RFIO
and PA_BOOST ports
• 32 MHz reference oscillator crystal
• 32.768 kHz crystal provided for optional timing oscillator
• Standard FRDM daughter card mounting interface
4.1.2
Form factor
Figure 3 shows the FRDM-KW019032 connector and header locations.
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Figure 3. FRDM-KW019032 connector and header locations
Figure 4 shows a footprint of the FRDM-KW019032 with the location of the IO headers. The parameters
of these headers are as follows:
• J1, J2, J3 and J4:
— Headers have standard 0.1 inch / 2.54 mm pin spacing
— J1 and J3 are 16-pin
— J2 is 20-pin
— J4 is 12-pin
— Pin headers mounted on the top side of the FRDM-KW019032 and are intended to plug into
matching receptacles on the Freescale Freedom Platform board.
• J41, J42, J10, J5, J35, J31, J44, J43, J45, J40, J47, J46, J28, J11, J8, J9, and J18:
— Headers have standard 0.1 inch / 2.54 mm pin spacing
— J41, J42, J10, J5, J35, J31, J44, J43, J45, J40, J47, J46, J28, and J11 are 2 x1 pin
— J8 and J9 are 3 x 1 pin
— J18 is a 4x1 pin
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Figure 4. FRDM-KW019032 top side (component side) footprint
4.1.3
Board level specifications
Table 1. FRDM-KW019032 specifications
Parameter
Min
Typ
Max
Units
Notes/Conditions
General
Size (PCB: X, Y)
—
—
82.8 x 53.3
3.26 x 2.10
Layer build (PCB)
—
1.57
0.062
—
Dielectric material (PCB)
—
—
—
mm —
inches
mm 4-Layer
inches
—
FR4
mA
Varies with operational mode, see
datasheet.
Power
Current consumption
—
—
—
Temperature
Operating temperature (see note)
-40
+25
+70
°C
Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Storage temperature
-30
+25
+70
°C
—
dBm
—
RF Receiver
FSK Sensitivity
—
-105
to
-120
—
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Table 1. FRDM-KW019032 specifications (continued)
Parameter
Min
Typ
Max
Units
OOK Sensitivity
—
-112
—
dBm
—
Adjacent channel Rejection (Offset =
±25 kHz or 50 kHz)
—
-42
—
dB
—
2nd order Intercept point
—
+75
—
dBm —
+20
—
dBm
—
—
0
—
—
3rd order Intercept point
RSSI dynamic range
-115
Notes/Conditions
RF Transmitter
RF Power Output (RFIO pin)
-18
—
+13
dBm Programmable in 1 dB steps
RF Power Output (PA_Boost pin)
—
+17
—
dBm —
Adjacent channel Power (25 KHz
offset)
—
—
-37
dBm —
Regulatory Approval
FCC
—
—
—
—
Product is approved according to the FCC
part 15 standard
CE (ETSI)
—
—
—
—
Product is approved according to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC)
—
—
—
—
Product is approved according to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
—
Product is approved according to the IEC
60950-1 and EN 60950-1, First Edition
standards
Safety
UL
—
—
—
Environment
4.2
RoHS
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
—
—
—
—
Product complies with the EU Directive
2002/95/EC of 27 January 2003
Frequency range
290
—
340
MHz
Programmable, using a 32 MHz clock.
424
—
510
MHz
862
—
1020
MHz
Functional description
The FRDM-KW019032 board is built around the Freescale MKW01Z128 transceiver in a 60-pin LGA
package. It features a highly-integrated, cost-effective sub-GHz radio frequency transceiver and a Kinetis
family ultra-low-power, mixed-signal ARM Cortex-M0+ MCU in a single package. The
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FRDM-KW019032 board is intended as a simple evaluation platform and as a building block for
application development. The four-layer board provides the MKW01Z128 transceiver with the required
RF circuitry and a 32 MHz reference oscillator crystal. The layout for this base level functionality can be
used as a reference layout for your target board. Figure 5 shows a simple block diagram.
Figure 5. FRDM-KW019032 block diagram
4.2.1
RF performance and considerations
The MKW01Z128 transceiver is a single-chip integrated circuit ideally suited for high performance ISM
band RF applications. It is intended for use as a high-performance, low-cost FSK and OOK RF transceiver
for robust, frequency agile, half-duplex bi-directional RF links. The MKW01Z128CHN is intended for
applications over a wide frequency range, including the 433 MHz and 868 MHz European and the 902–928
MHz North American ISM bands.
• Output power -18 to +17 dBm, depending on output and setting
The FRDM-KW019032 uses a flexible RF path topology that make it suitable for working in different
frequency bands by replacing a minimum number of components while providing good RF performance.
The tables in Section 4.3.1, “Bill of materials” show the different BOM according to different frequency
bands of operation.
Figure 6 shows the typical topology for the RF circuitry. A footprint is available to install SMA connector
J49 for measurement purposes. When using J49, C58 must be installed and C50 must be removed.
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Figure 6. FRDM-KW019032 RF circuitry
4.2.2
Clocks
The FRDM-KW019032 board provides two clocks:
• 32 MHz Reference Oscillator: Figure 7 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the MKW01Z128 specifications.
— Capacitors C22 and C21 provide the bulk of the crystal load capacitance. At 25 °C it is desired
to have the frequency accurate to ±10 ppm or less to allow for temperature variation.
— Signal DIO5/CLKOUT can be used to supply an external clock to MCU die and to measure the
32 MHz oscillator frequency.
— The FRDM-KW019032 has provision for injecting an external 32 MHz clock source as an
alternative to use of the onboard crystal:
— The 0 Ohm shunt SH44 must be removed to disconnect Y1
— C20 must be mounted
— The external 32 MHz source is connected to the 2-pin header J5
• Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal
Y4 (see Figure 8). This oscillator can be used as a low power accurate time base.
— To disconnect Y4 and use PTC1 as a GPIO port:
— The 0 Ohm resistor R96 must be removed
— The 0 Ohm resistor R97 must be populated
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Figure 7. FRDM-KW019032 32 MHz reference oscillator circuit
Figure 8. FRDM-KW019032 32.768 kHz optional oscillator circuit
4.2.3
Power management
There are several different ways to power and measure current on the FRDM-KW019032 board. The
FRDM-KW019032 power management circuit is shown in Figure 9.
Figure 9. FRDM-KW019032 board’s power management circuit
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The FRDM-KW019032 board has the flexibility to be powered in several configurations:
• The board can be supplied through the mini USB type B connector (J15) which provides 5V_USB
to LDO 3V3.
• The board can be supplied through the development board’s headers which provides either P3.3V
or P5-9V_VIN on header J3 pin 16 to LDO 3V3.
• The board can be supplied from an external DC supply in the following ways:
— Connect an adaptor capable of suppling 3.3 VDC to J28 pins, J8 selector 1-2.
— Connect an adaptor capable of suppling more than 3.3 VDC (15 V maximum) to J28 pins, J8
selector 2-3.
Additionally, J40 and J47 , a 2-pin cut-trace headers, provides current to MCU and transceiver. Red LED
marked as LED D4 is available as a power indicator.
Power headers provide the means to supply either the MCU, transceiver, external J3 connector, or
LED/peripheral circuits. Current measurements can be made by inserting a current meter in place of a
designated jumper.
Traces may be cut to make current measurements.
Connections configurations are described in Table 2.
Table 2. Power distribution headers
Supply
Designation
Header
Pins
V_MCU
J40
1-2
Supply voltage to MCU, Reset, JTAG/SWD interface, XTAL 32KHz
• Jumper is shorted by a cut-trace on bottom layer.
• Usage: Measure MCU current.
P3V3
J46
1-2
Supply voltage to header
• Jumper is shorted by a cut-trace on bottom layer.
P3V3_BRD
J45
1-2
Supply voltage to LEDs, switches and other modules
• Normally traced.
V_RF
J47
1-2
Supply voltage to transceiver
• Jumper is shorted by a cut-trace on bottom layer.
• Usage: Measure radio current.
4.2.4
Description
FRDM-KW019032 peripheral functions
The FRDM-KW019032 development board includes the Freescale Freedom board headers to interface
with the general purpose functions and to assist in implementing targeted applications. The
FRDM-KW019032 board also has alternate port functions routed to those interface headers where
off-board FRDM development board peripherals can be used.
4.2.4.1
Interface Connectors J1, J2, J3 and J4
The four connectors J1, J2, J3, and J4 are 100 mil pin headers mounted on the front (component side)
supporting the Freedom standard connector.
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•
P3V3, 5V_USB, and P5-9V_VIN provide the headers connector its supply voltage
— Peripheral IO to the FRDM-KW019032 and the Freedom development platform supply should
use this same voltage avoiding potential damage.
The pin definitions for the headers are shown in Table 3 and Table 4.
Table 3. J2 and J1 connector
J1
J2
Header
Pin No
MKW01Z128 Pin
Name
Description
Header
Pin No
Description
MKW01Z128 Pin Name
1
NC
NC
1
NC
NC
2
PTA0/SWD_CLK
D8/Int
2
PTA2/UART0_TX
D0/RX/INT
3
NC
NC
3
DIO0/PTE2
DIO0
4
PTA3/SWD_DIO
D9/Int
4
PTA1/UART0_RX
D1/TX/INT
5
NC
NC
5
DIO1/PTE3
DIO1
6
PTD4/SPI1_PCS0
D10/SPI_SS
6
PTB17/UART0_CTS
D2/INT
7
NC
NC
7
DIO2
DIO2
8
PTE1/SPI1_MOSI
D11/MOSI
8
PTB2/UART0_RTS
D3/PWM/INT
9
NC
NC
9
DIO3
DIO3
10
PTE0/SPI1_MISO
D12/MISO
10
PTB1
D4/INT
11
NC
NC
11
DIO4
DIO4
12
PTD5/SPI1_SCK
D13/SCK
12
PTC1
D5/PWM/INT
13
NC
NC
13
NC
NC
14
GND
GND
14
PTC2
D6/PWM/INT
15
NC
NC
15
NC
NC
16
P3V3
P3V3
16
PTD7
D7/CMP/INT
17
NC
NC
—
—
—
18
PTE18/I2C0_SDA
PTE18/I2C0_SDA
—
—
—
19
NC
NC
—
—
—
20
PTE19/I2C0_SCL
PTE19/I2C0_SCL
—
—
—
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Table 4. J3 and J4 connector
J4
J3
Header
Pin No
Description
Header
Pin No
MKW01Z128 Pin Name
MKW01Z128 Pin
Name
Description
1
NC
NC
1
NC
NC
2
NC
NC
2
PTA19
A0/INT
3
NC
NC
3
NC
NC
4
IO_REF
IO_REF
4
PTE16
A1/INT
5
NC
NC
5
NC
NC
6
RST_B
RST_TGTMCU_B
6
PTE17
A2/INT
7
NC
NC
7
NC
NC
8
P3V3
P3V3
8
PTD6/LLWU_P15
A3/INT
9
NC
NC
9
NC
NC
10
P5V
P5V
10
PTA4/NMI
A4/SDA/INT
11
NC
NC
11
NC
NC
12
GND
GND
12
PTB0
A5/SCL/INT
13
NC
NC
—
—
—
14
GND
GND
—
—
—
15
NC
NC
—
—
—
16
P5-9V_VIN
Unregulated voltage
—
—
—
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FRDM-KW019032 development board
4.3
Schematic, board layout, and bill of material
Figure 10. FRDM-KW019032 schematic rev. A
Freescale Freedom Development Board FRDM-KW019032 User’s Guide, Rev. 0, 11/2015
Freescale Semiconductor, Inc.
17
18
UUUUUU
UUUUUUUU
UU
UUU
UUUUUUUU
U
UU
UUUUU
UUUUU
UU
U
UU
UUU
UUUUU
UUUU
U
UU
U
UUUUUU
UUUUU
U
UU
UUU
UUUUUUUUUU
U
U
UU
UUUUUUU
UUUUU
UUU
UU
UUU
UUU
U
U
UU
UUUUU
UUU
UUUUU
UUU
U
UUUUUUU
UUUUU
UUUUU
UUUUU
UUU
U
UUUUUU
UUU
UUUUUUU
UUU
UUUUUUU
UUUUUUU
U
UUUU
UU
U
UUUUUU
UUU
UU
UUU
U
UUUUUU
UU
U
U
U
UU
U
UUUUU
U
UUU
UU
UU
UU
U
UU
UUUUUUU
UU
UU
UUUUU
U
U
U
UUUU
UU
UU
U
UUUUUUU
FRDM-KW019032 development board
Freescale Freedom Development Board FRDM-KW019032 User’s Guide, Rev. 0, 11/2015
Freescale Semiconductor, Inc.
UU
U
UU
U
UU
U
U
FRDM-KW019032 development board
Freescale Freedom Development Board FRDM-KW019032 User’s Guide, Rev. 0, 11/2015
Freescale Semiconductor, Inc.
19
FRDM-KW019032 development board
Figure 11. FRDM-KW019032 PCB component location (top view)
Figure 12. FRDM-KW019032 PCB test points
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FRDM-KW019032 development board
Figure 13. FRDM-KW019032 PCB layout (top view)
Figure 14. FRDM-KW019032 PCB layout (bottom view)
Freescale Freedom Development Board FRDM-KW019032 User’s Guide, Rev. 0, 11/2015
Freescale Semiconductor, Inc.
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FRDM-KW019032 development board
4.3.1
Bill of materials
The following three tables detail the bill of materials. Table 5 details the common parts for all frequency
bands, Table 6 details the parts for the 915 MHz and 868 MHz frequency bands (default), Table 7 details
the parts for the 433 MHz frequency band, and Table 8 details the parts for the 315 MHz frequency band.
CAUTION:
The ANT1 component is designed to be used in the 900 MHz and 800 MHz
frequencies. The values for the components L4, C67, and C68 are calculated
for those frequencies and this particular chip antenna. In case another
antenna is required, those values need to be re-adjusted according to new
antenna and manufacturer recommendations.
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 1 of 4)
Item
Qty
Reference
Value
Description
Mfg. Name
Mfg. Part Number
1
2
C1,C7 DNP
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
2
2
C21,C22
11PF
CAP CER 11PF 50V 1% C0G 0402
KEMET
CBR04C110F5GAC
3
1
C20 DNP
11PF
CAP CER 11PF 50V 1% C0G 0402
KEMET
CBR04C110F5GAC
4
1
C34 DNP
18PF
CAP CER 18PF 50V 5% C0G 0603
YAGEO AMERICA
CC0603JRNPO9BN180
5
2
C30,C31 DNP
22PF
CAP CER 22PF 50V 5% C0G 0402
AVX
04025A220JAT2A
6
2
C47, C58
100PF
CAP CER 100PF 50V 5% C0G 0402
KEMET
C0402C101J5GAC
7
2
C16,C18
220PF
CAP CER 220PF 50V 5% C0G 0402
KEMET
C0402C221J5GAC
8
1
C56
470PF
CAP CER 470PF 16V 10% X7R 0402 KEMET
C0402C471K4RACTU
9
1
C60
1000PF
CAP CER 1000PF 50V 5% C0G 0402 MURATA
GRM1555C1H102JA01D
10
4
C51,C52,C53,C54 DNP
1000PF
CAP CER 1000PF 50V 5% C0G 0402 MURATA
GRM1555C1H102JA01D
11
2
C17,C43
0.01UF
CAP CER 0.01UF 50V 10% X7R 0402 KEMET
C0402C103K5RAC
12
14
C14,C19,C25,C28,C33,
C36,C41,C42,C44,C48,
C59,C61,C62,C63
0.1UF
CAP CER 0.1UF 16V 10% X7R 0402
KEMET
C0402C104K4RAC
13
1
C66 DNP
0.1UF
CAP CER 0.1UF 16V 10% X7R 0402
KEMET
C0402C104K4RAC
14
2
C26,C49
1.0UF
CAP CER 1.0UF 10V 10% X5R 0402
YAGEO AMERICA
CC0402KRX5R6BB105
15
1
C55
1UF
CAP CER 1UF 10V 10% X7R 0805
MURATA
GRM21BR71A105KA01L
16
3
C32,C37,C57
2.2UF
CAP CER 2.2UF 10V 10% X7R 0603
TAIYO YUDEN
LMK107B7225KA-T
17
4
C29,C35,C64,C65
4.7UF
CAP CER 4.7UF 6.3V 20% X5R 0402 MURATA
GRM155R60J475ME47D
18
2
C5,C27
10UF
CAP CER 10UF 10V 10% X7R 0805
MURATA
GRM21BR71A106KE51L
19
4
C6,C38,C39,C40 DNP
10UF
CAP CER 10UF 10V 10% X7R 0805
MURATA
GRM21BR71A106KE51L
20
9
D1,D2,D3,D6,D7,D9,
D10,D12,D18
MSS1P3L
DIODE SCH 1A 20V MICROSMP
SMT
VISHAY
INTERTECHNOLOGY
MSS1P3L-M3/89A
21
2
D4,D5
RED
LED RED SGL 20MA SMT 0805
LITE ON
LTST-C171KRKT
22
1
D8
BLUE
LED BLUE SGL 20MA SMT 0805
LITE ON
LTST-C171TBKT
23
1
D11
LED GREEN
LED GRN SGL 20MA 0603
OSRAM
LG L29K-G2J1-24-Z
24
1
D17
CLV1A-FKB-CJ1M
1F1BB7R4S3
LED - RGB,
CLV1A-FKB-CJ1M1F1BB7R4S3,
675/527/470MCD(TYP.), SMD
CREE
CLV1A-FKB-CJ1M1F1BB
7R4S3
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Table 5. Bill of materials (common parts for all frequency bands) (Sheet 2 of 4)
Item
Qty
Reference
Value
Description
Mfg. Name
Mfg. Part Number
25
2
J1,J3
CON_2X8_0.1"
CON 2X8 FEMALE 100MIL SP 335H
394LL AU
SAMTEC
SSQ-108-03-G-D
26
1
J2
CON_2X10_0.1"
CON 2X10 FEMALE 100MIL SP 335H
394LL AU
SAMTEC
SSQ-110-03-G-D
27
1
J4
CON_2X6_0.1"
CON 2X6 FEMALE 100MIL SP 335H
394LL AU
SAMTEC
SSQ-106-03-G-D
28
3
J5,J28,J31
HDR 1X2
HDR 1X2 TH 100MIL SP 330H SN
115L
SAMTEC
TSW-102-23-T-S
29
1
J7 DNP
HDR TH 1X3
HDR 1X3 TH 100MIL SP 339H AU
100L
SAMTEC
TSW-103-07-G-S
30
2
J8,J9
HDR TH 1X3
HDR 1X3 TH 100MIL SP 339H AU
100L
SAMTEC
TSW-103-07-G-S
31
11
J10,J11,J35,J40,J41,
J42,J43,J44,J45,J46,
J47 DNP
SH HDR 1X2
HDR 1X2 TH 100MIL SP 330H SN
115L (BOTTOM SIDE SHORT)
SAMTEC
TSW-102-23-T-S
32
2
J13,J14
HDR 2X5
CONN,HEAD,2X5,STR,50/50
CON-2RH-10-50
SAMTEC
FTS-105-01-F-D
33
1
J15
CONN USB MINI-B CON 5 USB_MINI_B_RECEPTACLE
RA SMT 0.8MM 168H AU
TE CONNECTIVITY
1734035-2
34
1
J18
HDR_1X4
HDR 1X4 TH 100MIL SP 205H AU
130L
SAMTEC
TSW-104-05-G-S
35
2
J48,J49 DNP
SMA
CON, SMA, EDGE 0.062IN, 50 OHM
FEMALE 18GHZ
JOHNSON
COMPONENTS INC
142-0701-851
36
2
L6,L7
330 OHM
IND FER BEAD 330OHM@100MHZ
2.5A -- SMT
TDK
MPZ2012S331A
37
1
L11
33NH
IND -- 0.033UH@100MHZ 200MA 5%
0402
MURATA
LQG15HS33NJ02D
38
1
Q1
BSS138PS
MOSFET - BSS138PS, N-CH, 60V,
0.32A, 1.6 OHM, SC-88
NXP
BSS138PS,115
39
3
R3,R12,R96
0
RES MF ZERO OHM 1/16W 5% 0402 VISHAY
CRCW04020000Z0ED
40
23
R14,R97,R118,R119,
0
R120,R121,R122,R123,
R124,R127,R128,R129,
R130,R131,R132,R133,
R134,R135,R136,R137,
R138,R139,R140 DNP
RES MF ZERO OHM 1/16W 5% 0402 VISHAY
CRCW04020000Z0ED
41
3
R1,R8,R9
0
RES MF ZERO OHM 1/10W -- 0603
VISHAY
INTERTECHNOLOGY
CRCW06030000Z0EA
42
1
R6 DNP
0
RES MF ZERO OHM 1/10W -- 0603
VISHAY
INTERTECHNOLOGY
CRCW06030000Z0EA
43
2
R50,R51
33
RES MF 33.0 OHM 1/16W 1% 0402
VISHAY
CRCW040233R0FKED
44
1
R85
100
RES MF 100 OHM 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW0402100RJNED
45
7
R10,R11,R17,R18,R28,
R29,R30
220
RES MF 220 OHM 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW0402220RJNED
46
7
R88,R89,R90,R91,R92,
R93,R551
1.0K
RES MF 1.0K 1/16W 1% 0402
YAGEO AMERICA
RC0402FR-071KL
47
5
R52,R116,R117,R125,
R126
4.7K
RES MF 4.7K 1/10W 5% 0603
VISHAY
INTERTECHNOLOGY
CRCW06034K70JNEA
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FRDM-KW019032 development board
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 3 of 4)
Item
Qty
Reference
Value
Description
Mfg. Name
Mfg. Part Number
48
1
R5 DNP
4.7K
RES MF 4.7K 1/10W 5% 0603
VISHAY
INTERTECHNOLOGY
CRCW06034K70JNEA
49
6
R16,R19,R20,R21,R25,
R110
10.0K
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
50
5
R108,R556,R557,R558, 10.0K
R559 DNP
RES MF 10.0K 1/16W 1% AEC-Q200
0402
VISHAY
INTERTECHNOLOGY
CRCW040210K0FKED
51
3
R100,R105,R107
10K
RES MF 10K 1/10W 5% 0603
KOA SPEER
RK73B1JTTD103J
52
1
R109
15K
RES MF 15.0K 1/16W 1% 0402
BOURNS
CR0402-FX-1502GLF
53
1
R113 DNP
15K
RES MF 15.0K 1/16W 1% 0402
BOURNS
CR0402-FX-1502GLF
54
1
R106
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
55
1
R112 DNP
27K
RES MF 27K 1/16W 5% 0402
VISHAY
INTERTECHNOLOGY
CRCW040227K0JNED
56
1
R13
180K
RES MF 180K 1/16W 1% 0402
VISHAY
CRCW0402180KFKED
57
2
SHUNT1,SHUNT2
SHUNT
SHUNT 2.54MM 2POS
3M
969102-0000-DA
58
19
SH1,SH3,SH6,SH7,
SH8,SH9,SH10,SH11,
SH12,SH13,SH14,
SH15,SH16,SH40,
SH41,SH42,SH43,
SH44,SH45 DNP
0
CUT TRACE RESISTOR
NOT A COMPONENT
NOT A COMPONENT
59
5
SW1,SW2,SW3,SW4,
SW5
TL1015AF160QG
SW SPST-NO 0.05A, 12V, SMT
E-SWITCH
TL1015AF160QG
60
1
S1 DNP
BMIS-S-102
SHEILD 0.65"X0.65" 1 PIECE SMD
LAIRD
TECHNOLOGIES EMI
BMI-S-102
61
2
TL1,TL2
TESTLOOP
TEST POINT PAD SIZE 3.4MM X
1.8MM SMT
KEYSTONE
ELECTRONICS
5015
62
52
TP2,TP4,TP6,TP7,TP8, TPAD_040
TP9,TP10,TP11,TP12,
TP13,TP17,TP18,TP19,
TP20,TP23,TP24,TP29,
TP30,TP31,TP32,TP33,
TP35,TP36,TP37,TP38,
TP39,TP40,TP41,TP42,
TP43,TP44,TP45,TP46,
TP47,TP48,TP49,TP50,
TP51,TP104,TP109,
TP110,TP111,TP112,
TP113,TP114,TP115,
TP119,TP120,TP121,
TP122,TP123,TP124
TEST POINT PAD 40MIL DIA SMT,
NO PART TO ORDER
NOT A COMPONENT
NOT A COMPONENT
63
17
TP3,TP5,TP14,TP15,
TP100,TP101,TP102,
TP103,TP105,TP106,
TP107,TP108,TP508,
TP509,TP510,TP511,
TP512
TPAD_030
TEST POINT PAD 30MIL DIA SMT,
NO PART TO ORDER
NOT A COMPONENT
NOT A COMPONENT
64
1
TP507
TESTLOOP_BLAC TEST POINT PC MULTI PURPOSE
K
BLK TH
KEYSTONE
ELECTRONICS
5011
65
1
U1
MKW01Z128
IC MCU ARM 48MHZ 128KB FLASH
16KB RAM 1.8-3.6V LGA60
FREESCALE
SEMICONDUCTOR
MKW01Z128CHN
66
2
U3,U5
NTSX2102GU8H
IC DUAL SUPPLY XCVR 50 MBPS
5.5V XQFN8
NXP
SEMICONDUCTORS
NTSX2102GU8H
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Table 5. Bill of materials (common parts for all frequency bands) (Sheet 4 of 4)
Item
Qty
Reference
Value
Description
Mfg. Name
Mfg. Part Number
67
1
U4
74LVC125ADB
IC BUF QUAD TS 1.2-3.6V SSOP14
NXP
SEMICONDUCTORS
74LVC125ADB
68
1
U6
MK20DX128VFM5
IC MCU FLASH 128KB 50MHZ
1.71-3.6V QFN32
FREESCALE
SEMICONDUCTOR
MK20DX128VFM5
69
1
U7
MIC2005-0.8YM6
IC LIN SW PWR 0.8A 2.5-5.5V
SOT23-6
MICREL
MIC2005-0.8YM6
70
3
U10,U11,U12
0402ESDA-MLP
DIODE TVS BIDIR -- 30V 0402
COOPER BUSSMANN 0402ESDA-MLP1
71
2
U16,U17
TXB0108
IC - LEVEL TRANSLATOR,
BIDIRECTIONAL, 1.65V-5.5V,
TSSOP-20
TEXAS
INSTRUMENTS
TXB0108PWR
72
1
U18
MIC5205-3.3
LDO 3.3V FIXED 150MA 16V
SOT23-5
MICREL
MIC5205-3.3YM5
73
1
Y1
32MHZ
XTAL 32MHZ 9PF -- SMT 3.2X2.5MM NDK
EXS00A-CS02368
74
1
Y3
8MHZ
XTAL 8MHZ 20PPM PAR 18PF ESR
200OHM SMT
ABRACON CORP
ABM3B-8.000MHZ-B2-T
75
1
Y4
32.768KHZ
XTAL - 32.768KHZ, CMOS,
0.9V-3.6V, +10/-120PPM
EPSON
SG-3040LC
Table 6. Bill of materials (FRDM-KW01 900/800 frequency bands)
Item
Qty
Reference
Value
Description
Mfg. Name
1
1
ANT1
0900AT43A0070
ANTENNA CER CHIP WIDE BAND
868-915MHZ
2
1
C50
100PF
CAP CER 100PF 50V 5% C0G 0402 KEMET
C0402C101J5GAC
3
3
C2, C67, C68
3.3PF
CAP CER 3.3PF 25V 0.1PF -- 0402
AVX
04023J3R3BBSTR
4
1
C4
5.6PF
CAP CER 5.6PF 50V ±0.25PF C0G
CC0402
MURATA
GJM1555C1H5R6CB01D
5
2
L2,L5
0.0068UH
IND -- 0.0068UH@100MHZ 300MA
5% 0402
MURATA
LQG15HS6N8J02D
6
1
C9
7.5PF
CAP CER 7.5PF 50V 0.5PF C0G
0402
MURATA
GRM1555C1H7R5DA01
D
7
4
C8,C11,C45,C46 DNP
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
8
3
C3,C12,C13
6.8PF
CAP CER 6.8PF 50V 0.5PF C0G
0402
MURATA
GRM1555C1H6R8DZ01J
9
1
C15
2.0PF
CAP CER 2PF 50V 0.25PF C0G
0402
MURATA
GRM1555C1H2R0CA01B
10
2
L1,L3
5.6NH
IND AIR 5.6NH@100MHZ 300MA
0.3NH 0402
MURATA
LQG15HN5N6S02D
11
1
L9
0.0047UH
IND -- 0.0047UH@100MHZ 300MA
±0.3NF 0402
MURATA
LQG15HS4N7S02D
12
1
L12
0.002UH
IND -- 0.002UH@100MHZ 300MA
15% 0402
MURATA
LQG15HS2N0S02
13
1
L10
33NH
IND -- 0.033UH@100MHZ 200MA
5% 0402
MURATA
LQG15HS33NJ02D
14
1
C10
47PF
CAP CER 47PF 50V 5% C0G 0402
MURATA
GRM1555C1H470JA01D
JOHANSON
Mfg. Part Number
0900AT43A0070
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FRDM-KW019032 development board
Table 7. Bill of materials (FRDM-KW01 400 MHz frequency bands)
Item
Qty
Reference
Value
Description
Mfg. Name
Mfg. Part Number
1
2
C2,C4
8.2PF
CAP CER 8.2PF 50V 0.5PF C0G
0402
AVX
04025A8R2CAT2A
2
4
C3,C9,C12,C15
15PF
CAP CER 15PF 50V 1% C0G 0402
VENKEL COMPANY
C0402C0G500-150FNE
3
2
C8,C11
2.4PF
CAP TF 2.4PF 50V 0.25PF -- 0402
MURATA
GJM1555C1H2R4BB01
4
2
C10,C13
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
5
3
L1,L3, L5
12 NH
IND -- 0.012UH@100MHZ 300MA
5% 0402
MURATA
LQW15AN12NJ00D
6
1
L10
22NH
IND -- 22NH@100MHZ 310MA 5%
0402
MURATA
LQW15AN22NG00D
7
1
L2
10 NH
IND -- 0.010UH@100MHZ 300MA
5% 0402
MURATA
LQW15AN10NJ00D
8
2
L9,L12
0 ohms
RES MF ZERO OHM 1/10W 0402
PANASONIC
ERJ-2GE0R00X
9
2
C45, C46 DNP
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
Table 8. Bill of materials (FRDM-KW01 300 MHz frequency bands)
Item
Qty
Reference
1
2
C2,C4
12PF
CAP CER 12PF 50V 5% C0G 0402
MURATA
GRM1555C1H120JZ01D
2
1
C9
15PF
CAP CER 15PF 50V 5% C0G 0402
VENKEL COMPANY
C0402C0G250-150JNP
3
4
C8,C11,C45,C46 DNP
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
4
4
C15, C10,C3,C12
22pF
CAP CER 22pF 50V 5% C0G
AEC-Q200 0402
MURATA
GCM1555C1H220JA16
5
1
C13
10PF
CAP CER 10PF 50V 5% C0G 0402
AVX
04025A100JAT2A
6
2
L1,L10
33NH
IND -- 0.033UH@100MHZ 200MA
5% 0402
MURATA
LQG15HS33NJ02D
7
2
L3, L5
22 NH
IND -- 22NH@100MHZ 310MA 2%
0402
MURATA
LQW15AN22NG00D
8
1
L2
18 NH
IND AIR 18NH@100MHZ 370MA
3% 0402
MURATA
LQW15AN18NH00D
9
1
L12
1.5NH
IND -- 1.5NH@500MHZ 280MA
7% 0402
MURATA
LQP15MN1N5B02D
10
1
L9
4.7NH
IND -- 4.7NH@100MHZ 300MA
±0.3nH 0402
MURATA
LQG15HN4N7S02D
•
•
•
•
Value
Description
Mfg. Name
Mfg. Part Number
NOTES
The FRDM-KW019032 includes neither J48, J49 (the SMA
connectors), nor the external antenna.
For external measurements and/or external antenna usage, J48/J49
should be installed and soldered in place.
A 50 Ohm SMA jack connector is required; recommended part number
142-0701-851 from Emmerson/Johanson.
When selecting an external antenna to connect to the SMA connector,
choose an antenna designed for the desired frequency band. Operation
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PCB manufacturing specifications
with an external antenna may require a separate certification of your
product.
5
PCB manufacturing specifications
This section provides the specifications used to manufacture the FRDM-KW019032 development printed
circuit board (PCB) described in this guide.
The FRDM-KW019032 PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/).
• The PCB manufacturer’s logo is required.
• The PCB production week and year code is required.
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask.
— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating.
— The level is 94V-0 (http://ulstandards.ul.com/standard/?id=94).
— The UL information must be stamped on the back of the PCB solder mask.
•
•
•
5.1
NOTE
A complete set of design files is available for the FRDM-KW019032
transceiver at the Freescale website (freescale.com/KW01) under
“Software and Tools.” These reference designs should be used as a
starting point for a custom application.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
For more information, see Hardware Design Considerations for
MC12311 and MKW01x Sub-GHz Devices (AN4958) to provide
additional design guidance.
Single PCB construction
This section describes individual PCB construction details.
• The FRDM-KW019032 PCBs are four-layer, multi-layer designs.
• The PCBs contain no blind, buried, or micro vias.
• PCB data:
— FRDM-KW019032 board’s size: Approximately 82 x 53 mm (3.26 x 2.10 inches).
— FRDM-KW019032 board’s final thickness (Cu/Cu): 1.57 mm (0.62 inches) ±10% (excluding
solder mask).
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PCB manufacturing specifications
Table 9 defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
Table 9. FRDM-KW019032 layer by layer overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Ground Layer
L2_GND.art
4
Signal Layer
L3_INT_1.art
5
Bottom Layer Metal
L4_SS.art
6
Silkscreen Bottom
SSS.art
CAUTION:
The FRDM-KW019032 development board contains high frequency
sub-GHz RF circuitry. As a result, RF component placement, line
geometries and layout, and spacing to the ground plane are critical
parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL.
Dielectric and copper thicknesses and spacing must not be changed; follow
the stackup (see Figure 15) information provided with the reference design.
The current board thickness is 64 mils. For a 1 dB improvement, change the
thickness to 32 mils (change the intermediate dialectic on inner layer
B-Target to 8 mils). The board may become fragile.
Figure 15. FRDM-KW019032 PCB stackup cross-section (four layer)
•
•
5.2
Solder mask is required.
Silk screen is required.
Panelization
The panel size can be negotiated depending on the production volume.
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PCB manufacturing specifications
5.3
Materials
The PCB composite materials must meet the following requirements:
• Laminate: the base material (laminate) must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade RF performance.
• Copper foil:
— Top and bottom copper layers must be 1 oz. copper.
— Interior layers must be 1 oz. copper.
• Plating: All pad plating must be Hot Air Levelling (HAL).
5.4
Solder mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent.
• Solder mask thickness: 10–30 µm.
5.5
Silk screen
The silk screen must meet the following requirements:
• Silk screen color: White.
• Silk screen must be applied after application of solder mask if solder mask is required.
• The silk screen ink must not extend into any plated-through-holes.
• The silk screen must be clipped back to the line of resistance.
5.6
•
•
5.7
Electrical PCB testing
All PCBs must be 100 percent tested for opens and shorts.
Impedance measurement: An impedance measurement report is not mandatory.
Packaging
Packaging for the PCBs must meet the following requirements:
• Finished PCBs must remain in panel.
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
5.8
Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28745.pdf file.
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Revision history
5.9
File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-28745.pdf—FRDM-KW019032 board fabrication drawing.
• GRB-28745.zip—FRDM-KW019032 board metal layers, solder mask, solder paste, and silk
screen.
• SPF-28745.pdf—FRDM-KW019032 board schematic diagram.
Design files are in Allegro format with OrCAD schematic capture.
6
Revision history
Revision number
Date
Substantive changes
0
11/2015
Initial release
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Home Page:
freescale.com
implementers to use Freescale products. There are no express or implied copyright
Web Support:
freescale.com/support
information in this document.
licenses granted hereunder to design or fabricate any integrated circuits based on the
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address: freescale.com/SalesTermsandConditions.
Freescale, the Freescale logo, and Kinetis are trademarks of Freescale
Seminconductor, Inc. Reg. U.S. Pat. & Tm. Off. All other products or service names are
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© 2015 Freescale Semiconductor, Inc.
Document Number: FRDMKW019032UG
Rev. 0
11/2015
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