FXPS7550A4
Analog absolute pressure sensor, 20 kPa to 550 kPa
Rev. 5 — 29 July 2022
1
Product data sheet
General description
The FXPS7550A4 high-performance, high-precision absolute pressure sensor consists of
a compact capacitive micro-electro-mechanical systems (MEMS) device coupled with a
digital integrated circuit (IC) producing a fully calibrated analog output.
This sensor is ideal for many automotive applications such as manifold air pressure
(MAP), turbo MAP, comfort seating, and other applications requiring operating absolute
pressure ranges up to 550 kPa.
The sensing element is based on NXP's high precision capacitive pressure cell
technology. The architecture benefits from redundant pressure transducers as an
expanded quality measure. It delivers highly accurate ratiometric analog readings of
absolute pressure while operating from either a 3.3 V or 5.0 V power supply.
The sensor operates over a pressure range of 20 kPa to 550 kPa and over a wide
temperature range of –40 ºC to 130 ºC.
The sensor comes in an industry-leading 4 mm x 4 mm x 1.98 mm, restriction of
hazardous substances (RoHS) compliant, high-power quad flat no-lead (HQFN)
[1]
[2]
package suitable for small printed circuit board (PCB) integration. Its AEC-Q100
compliance, high accuracy, reliable performance, and high media resistivity make it ideal
for use in automotive, industrial, and consumer applications.
2
Features and benefits
•
•
•
•
•
•
•
•
3
Absolute pressure range: 20 kPa to 550 kPa
Operating temperature range: –40 °C to 130 °C
Analog output for monitoring of the absolute pressure signal
Pressure transducer and digital signal processor (DSP)
– Internal self-test
Capacitance to voltage converter with anti-aliasing filter
Sigma delta ADC plus sinc filter
800 Hz or 1000 Hz low-pass filter for absolute pressure
Lead-free, 16-pin HQFN, 4 mm x 4 mm x 1.98 mm package
Applications
3.1 Automotive
• Manifold air pressure
– MAP, TurboMAP
• Small engine control
• Liquid propane gas (LPG) or compressed natural gas (CNG) engine management
FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
3.2 Industrial
•
•
•
•
Compressed air
Manufacturing line control
Gas metering
Weather stations
3.3 Medical/Consumer
• Blood pressure monitor
• Medicine dispensing systems
• White goods
4
Ordering information
Table 1. Ordering information
Type number
FXPS7550A4
Package
Name
Description
Version
HQFN16
HQFN16, plastic, thermal enhanced quad flat pack; no leads; 16 terminals; 0.8 mm
pitch; 4 mm x 4 mm x 1.98 mm body
SOT1573-1
4.1 Ordering options
Table 2. Ordering options
FXPS7550A4
Product data sheet
Device
Range (kPa)
FXPS7550A4T1
20 kPa to 550 kPa
Packing
Packing Tape and Reel
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 July 2022
Temperature range
–40 °C to 130 °C
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
5
Block diagram
VCC
INTERNAL VOLTAGE
REGULATOR
VSS
VREG
VREGA
LOW VOLTAGE
DETECTION
VREF
REFERENCE
VOLTAGE
OSCILLATOR
LOW VOLTAGE
DETECTION
OTP
ARRAY
CONTROL
LOGIC
TEST
TEST
I/O
TEST
TEST
VREF
TEST
VREG
TEST
P-CELL 0
VREF
C2V
GAIN
AAF
PABS Σ
CONVERTER
SINC
FILTER
TRIM
IIR
LPF
USER
OFFSET
ADJUST
PCM
ENCODER
PABS
ANALOG
FILTER
AND
BUFFER
ANALOG_OUT
P-CELL 1
COMMON
MODE
ERROR
DETECTION
DSP
aaa-029725
Figure 1. Block diagram of FXPS7550A4
6
Pinning information
VSS
NC
VCC
14
13
ANALOG_OUT
2
11
TEST
TEST
3
10
TEST
VSS
4
9
TEST
6
7
8
NC
NC
TEST
TEST
15
12
17
5
1
TEST
VCC
VCC
terminal 1
index area
16
6.1 Pinning
aaa-029728
Transparent top view
Figure 2. Pin configuration for 16-pin HQFN
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
6.2 Pin description
Table 3. Pin description
7
Pin
Pin name
Description
2, 8, 9, 10
TEST
Pins 2, 8, 9, and 10 are test pins and must be left unterminated in the application.
3
TEST
Pin 3 is required to be tied to VCC for device operation.
4, 15
VSS
Pins 4 and 15 are the supply return nodes and are connected internally to the die
attach pad (pin 17).
5, 11
TEST
Pins 5 and 11 are test pins and must be tied to VSS
6, 7, 14
NC
Pins 6, 7 and 14 are not internally connected and can be left unconnected in the
application.
12
ANALOG_OUT
Pin 12 provides a ratiometric analog output proportional to the absolute pressure
sensor data.
1, 13, 16
VCC
Pins 1, 13 and 16 supply power to the device. An external capacitor must be
connected between these pins and VSS, as shown in the application diagram.
17
PAD
Pin 17 is the die attach flag and must be connected to VSS.
Functional description
7.1 Voltage regulators
The device derives its internal supply voltage from the VCC and VSS pins. An external
filter capacitor is required for VCC, as shown in Figure 12.
A reference generator provides a reference voltage for the ΣΔ converter.
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
VCC
VREGA
BANDGAP
REFERENCE
VREF
VREGA
VOLTAGE
REGULATOR
BIAS
GENERATOR
OSCILLATOR
TRIM
TRIM
TRIM
C2V
REFERENCE
GENERATOR
VREG_MOD
OTP
ARRAY
VCC
VREF
VOLTAGE
REGULATOR
Σ
CONVERTER
VREG
DIGITAL
LOGIC
DSP
VCC
VREG
VREGA
VREF
COMPARATOR
VCC_UV_ERR
COMPARATOR
POR
COMPARATOR
aaa-029736
Figure 3. Voltage regulation and monitoring
7.2 Pressure sensor signal path
7.2.1 ΣΔ converter
A second order sigma delta modulator converts the voltage from the analog front end to a
data stream that is input to the DSP. A simplified block diagram is shown in Figure 4.
FXPS7550A4
Product data sheet
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Rev. 5 — 29 July 2022
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
α1 =
first
integrator
VX
CINT1
z-1
1 - z-1
second
integrator
α2 = 1
1 - bit
quantizer
z-1
1 - z-1
Y(Z) = {0,1}
ADC
β1 = 1
β2 = 1
V = +VREF, 0 V, -VREF
DAC
V = C x Vx/CINT1
aaa-023446
Figure 4. ΣΔ converter block diagram
The sigma delta modulator operates at a frequency of 1 MHz, with the transfer function in
Equation 1.
(1)
7.2.2 Digital signal processor (DSP)
A DSP is used to perform signal filtering and compensation. A diagram illustrating the
signal processing flow within the DSP is shown in Figure 5.
Σ OUT = Y(Z)
SINC
FILTER
TRIM
IIR
LPF
OFFSET
AND
GAIN ADJUST
PABS
aaa-029737
Figure 5. Signal chain diagram
7.2.2.1 Decimation sinc filter
In Equation 2, the output of the ΣΔ modulator is decimated and converted to a parallel
value by two third-order sinc filters; the first with a decimation ratio of 24 and the second
with a decimation ratio of 4.
(2)
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
aaa-023449
20
magnitude
(dB)
0
-20
-40
-60
-80
minimum
typical
maximum
-100
-120
103
104
105
frequency (Hz)
Figure 6. Sinc filter response
7.2.2.2 Signal trim and compensation
The device includes digital trim to compensate for sensor offset, sensitivity, and
nonlinearity over temperature.
7.2.2.3 Low-pass filter
Data from the sinc filter is processed by an infinite impulse response (IIR) low-pass filter
with the transfer function and coefficients shown in Equation 3.
(3)
Table 4. IIR low pass filter coefficients
Filter
number
Typical –3 dB
frequency
Filter
order
1
800 Hz
4
2
1000 Hz
FXPS7550A4
Product data sheet
4
Filter coefficients (24 bit)
a0
0.088642612609670
—
—
n11
0.029638050039039
d11
1
n12
0.087543281056143
d12
–1.422792640957290
n13
0.029695285913601
d13
0.511435253566960
n21
0.250241278804809
d21
1
n22
0.499999767379068
d22
–1.503329908017845
n23
0.249758953816089
d23
0.621996524706640
a0
0.129604264748411
—
—
n11
0.043719804402508
d11
1
n12
0.087543281056143
d12
–1.300502656562698
n13
0.043823599710731
d13
0.430106921311110
n21
0.250296586927511
d21
1
n22
0.499999648540934
d22
–1.379959571988366
n23
0.249703764531484
d23
0.555046257157745
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Rev. 5 — 29 July 2022
Group
delay (μs)
Typical
attenuation @
1000 Hz (dB)
418
4.95
333
2.99
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
aaa-029738
0
magnitude
(dB)
-20
-40
-60
-80
-100
minimum
typical
maximum
1
10
102
103
frequency (Hz)
104
Figure 7. 800 Hz, 4-pole, low-pass filter response
aaa-029891
1000
delay
(µs)
800
600
400
200
0
minimum
typical
maximum
1
10
102
103
frequency (Hz)
104
Figure 8. 800 Hz, 4-pole output signal delay
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
aaa-029739
0
magnitude
(dB)
-20
-40
-60
-80
-100
minimum
typical
maximum
1
10
102
103
frequency (Hz)
104
Figure 9. 1000 Hz, 4-pole, low-pass filter response
aaa-029892
1000
delay
(µs)
800
600
400
200
0
minimum
typical
maximum
1
10
102
103
frequency (Hz)
104
Figure 10. 1000 Hz, 4-pole output signal delay
7.3 Analog output function
7.3.1 Analog output signal chain
The device provides an analog output ratiometric to the supply voltage. The analog
output is enabled by default. Selecting the analog output enables the following functions:
• The non-interpolated PABS sensor data output is saturated to 10 bits and converted to
an unsigned value.
• The 10-bit sensor value is input into a summer clocked at 10 MHz.
• The carry from the summer circuit generates a PCM output.
• The PCM signal is filtered by a 2-pole active low pass filter to generate an analog
signal.
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
7.3.2 Analog output transfer function
The FXPS7550A4 device provides an analog output voltage ratiometric to the supply
voltage.
If using a supply voltage other than 5 V, the general form of the transfer function should
be applied as described in equation Equation 4:
(4)
In addition, the absolute pressure analog offset, POFF and output voltage span, VFSS,
then becomes a ratio of their magnitude by applying the ratio of (VCC / 5 V) to each of
these parameters.
There can be slight variations in the POFF and VFSS based on the temperature. The
minimum and maximum variation of POFF and VFSS can be assessed by applying
the same ratio (VCC / 5 V) to both of these parameters and then applying the error
percentages to obtain these variations if needed.
The analog output transfer function for a 5.0 V supply is as shown in Figure 11.
aaa-029745
5
analog
output
(V) 4
3
2
1
0
0
50
100
150
200
250
300
350
400
450
500
550
absolute pressure (kPa)
Figure 11. Analog output transfer function
8
Maximum ratings
Absolute maximum ratings are the limits that the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods might affect device reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. NXP advises that normal precautions be taken to avoid application of any
voltages higher than maximum-rated voltages to this high-impedance circuit.
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Table 5. Maximum ratings
Symbol
Parameter
Conditions
Min
Max
Unit
VCCMAX
Supply Voltage
VCC, VCCIO
[1]
—
+6.0
V
VIOMAX
Input/Output Max on pins
ANALOG_OUT
TESTx
[1]
–0.3
VCC + 0.3
V
hDROP
Drop shock
To concrete, tile or steel surface, 10 drops,
any orientation
[2]
—
1.2
m
Tstg
Temperature range
Storage
[2]
–40
+130
°C
Junction
[3]
–40
+150
°C
Continuous
[3]
—
600
kPa
Burst (tested at 100 ms)
[2]
—
1650
kPa
Continuous
[1]
—
20
kPa
Applied to top face of package
[1]
—
10
N
[4]
—
120
°C/W
[2]
–2000
2000
V
–500
500
V
TJ
PMAX
Maximum absolute pressure
PBURST
PMIN
Minimum absolute pressure
fSEAL
Pressure sealing force
θJA
Thermal resistance
ESD and latch-up protection characteristics
VESD
Electrostatic discharge (per
AEC-Q100, Rev H)
VESD
[1]
[2]
[3]
[4]
[5]
Human body model (HBM)
Charge device model (CDM)
[2] [5]
Parameter verified by parametric and functional validation.
Parameter verified by qualification testing (Per AEC-Q100 Rev H or per NXP specification).
Functionality verified by modeling, simulation and/or design verification.
[1]
Thermal resistance provided with device mounted to a two-layer, 1.6 mm FR-4 PCB as documented in AN1902
layer.
CDM tested at ±750 V for corner pins and ±500 V for all other pins.
with one signal layer and one ground
Caution
This device is sensitive to mechanical shock. Improper handling can cause permanent damage to the part.
Caution
This is an ESD sensitive device. Improper handling can cause permanent damage to the part.
msc896
9
Operating range
Table 6. Electrical characteristics — supply and I/O
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol
Parameter
Conditions
VCC
Supply voltage
Measured at VCC
TA
Operating temperature range
VCC = 5.0 V, unless otherwise stated.
Production tested operating temperature
range
TA
Guaranteed operating temperature range
VCC_RAMP
[1]
[1]
[1]
[1]
[2] [3]
Supply power on ramp rate
Min
Max
Units
3.10
5.25
V
TL
–40
TH
+130
°C
–40
+130
°C
0.00001
10
V/μs
Parameter tested at final test.
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
[2]
[3]
Functionality verified by modeling, simulation and/or design verification.
Parameter verified by parametric and functional validation.
10 Static characteristics
Table 7. Static characteristics
VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol
Parameter
Condition
Supply current
VCC = 5.0 V
Min
Typ
Max
Units
[1]
—
—
8.0
mA
Supply and I/O
Iq
Temperature sensor signal chain
VOH_ANA
Output high voltage
ANALOG_OUT,
ILoad = –100 µA
[1]
Vcc – 0.2
—
—
V
VOL_ANA
Output low voltage
ANALOG_OUT,
ILoad = 100 µA
[1]
—
—
0.2
V
VOUT_3dB
Analog output low-pass filter frequency –3 dB, 2-pole
typical value
[2]
8
—
20
kHz
VOUT_3dBTol
Analog output low-pass filter frequency –3 dB, 2-pole
typical tolerance
[2]
–5
—
5
%
[1] [3]
20
—
550
kPa
—
8.68
—
mV/
kPa
Absolute pressure sensor signal chain
PABS
Absolute pressure range
PSENS
Absolute pressure output sensitivity
VCC = 5.0 V.
Tested at PA = 300 kPa
and 400 kPa
[2]
PACC_HiT
Absolute pressure accuracy
VCC = 5.0 V.
85 °C < TA ≤ 130 °C
[4]
–3
—
+3
%FSS
PACC_Typ
Absolute pressure accuracy
VCC = 5.0 V.
0 °C ≤ TA ≤ 85 °C
[4]
–2
—
+2
%FSS
PACC_LoT
Absolute pressure accuracy
VCC = 5.0 V.
–40 °C ≤ TA< 0 °C
[4]
–3
—
+3
%FSS
POFF
Absolute pressure analog offset
At pressure span extremes
VCC = 5.0 V.
[4]
—
0.2
—
V
VFSS
Output voltage span
At pressure span extremes
VCC = 5.0 V.
[5]
—
4.6
—
V
Min
Typ
Max
Units
[1]
[2]
[3]
[4]
[5]
Parameter verified by pass/fail testing at final test.
Functionality verified by modeling, simulation and/or design verification.
Parameter verified by characterization.
Parameter tested at final test.
Parameter verified by functional evaluation.
11 Dynamic characteristics
Table 8. Dynamic characteristics
VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol
Parameter
Condition
PABS low-pass filter
Signal chain sample time
Signal chain
tSigChain
[1]
—
48
—
μs
—
800
—
Hz
fc0
Cutoff frequency, filter
option #0, 4-pole
[1] [2]
fc1
Cutoff frequency, filter
option #1, 4-pole
[1] [2]
—
1000
—
Hz
[1]
—
—
128
μs
tSigDelay
FXPS7550A4
Product data sheet
Signal delay (sinc filter to output delay,
excluding the PABS LPF)
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Table 8. Dynamic characteristics...continued
VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified.
Symbol
Parameter
Condition
Min
Typ
Max
Units
tDelay_DataValid
Supply recovery
VCC to sensor data valid
300
—
—
ms
27.1
—
—
kHz
fPackage
[1]
[2]
[1]
Package resonance frequency
Functionality verified by modeling, simulation and/or design verification.
Parameter verified by functional evaluation.
12 Media compatibility—pressure sensors only
For more information regarding media compatibility information, contact your local sales
representative.
13 Application information
Note: A gel is used to provide media protection against corrosive elements which
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas
molecules may permeate through the gel and then occupy boundaries between material
surfaces within the sensor package. When decompression occurs, the gas molecules
may collect, form bubbles and possibly result in delamination of the gel from the material
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,
the sensor measurement may shift from its calibrated transfer function. In some cases,
these temporary shifts could be outside the tolerances listed in the data sheet. In rare
cases, the bubble may bend the bond wires and result in a permanent shift.
VCC
VCC
VCC
TEST (pin3)
FXPS7xxxA4
C1
ADCREF+
ANALOG_OUT
ADC_IN
ADC
C2
R1
VSS
ADCREF-
aaa-029731
Figure 12. Application diagram of FXPS7550A4
Table 9. External component recommendations
FXPS7550A4
Product data sheet
Name
Type
Description
Purpose
C1
Ceramic
0.1 μF, 10 %, 10 V minimum, X7R
VCC power supply decoupling
C2
Ceramic
47 pF, 10 %, 10 V minimum, X7R
Analog output filtering
R1
General purpose 51 kΩ, 5 %, 200 PPM
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Analog output pull-down resistor
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
14 Package outline
Figure 13. Package outline HQFN (SOT1573-1)
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Figure 14. Package outline detail HQFN (SOT1573-1)
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Figure 15. Package outline note HQFN (SOT1573-1)
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
15 Soldering
Figure 16. SOT1573-1 PCB design guidelines - Solder mask opening pattern
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Figure 17. SOT1573-1 PCB design guidelines - I/O pads and solderable area
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Figure 18. SOT1573-1 PCB design guidelines - Solder paste stencil
FXPS7550A4
Product data sheet
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FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
16 Mounting recommendations
The package should be mounted with the pressure port pointing away from sources of
debris which might otherwise plug the sensor.
A plugged port exhibits no change in pressure and can be cross checked in the user
software.
Refer to NXP application note AN1902
recommendations.
[1]
for proper printed circuit board attributes and
17 References
[1]
AN1902 - Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages
https://www.nxp.com/docs/en/application-note/AN1902.pdf
[2]
AEC documents on Automotive Electronics Council Component Technical Committee’s site:
http://www.aecouncil.com/AECDocuments.html
18 Revision history
Table 10. Revision history
Document ID
Release date
Data sheet status
Change notice
Supercedes
FXPS7550A4 v.5
20220729
Product data sheet
—
FXPS7550A4 v.4.1
Modifications:
• Global: Performed the following global changes:
– Performed minor grammatical and typographic changes throughout.
– Updated the image on the first page.
• Section 6.2, Table 3, moved pins 5 and 11 from the first row into a separate table row.
• Section 7.2.1, Figure 4, revised the image.
• Section 7.2.2, Figure 5, revised the image.
• Section 7.3.2, added new content to the section, including Equation 4, and revised Figure 11.
• Section 9, Table 6, revised the table note "Parameter tested 100 % at final test." to "Parameter
tested at final test."
• Section 10, Table 7, Iq: revised the parameter from "Quiescent supply current" to "Supply current".
and revised table note from "Parameter tested 100 % at final test." to "Parameter tested at final
test."
• Section 11, Table 8, inserted new row "tDelay_DataValid" in the table.
• Section 15 "Soldering", inserted new section.
• Section 16 "Mounting recommendations", inserted new section.
• Section 17, updated the reference section content.
FXPS7550A4 v.4.1 20190529
Product data sheet
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FXPS7550A4 v.4
FXPS7550A4 v.4
20190507
Product data sheet
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FXPS7550A4 v.3
FXPS7550A4 v.3
20190506
Preliminary data sheet
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FXPS7550A4 v.2
FXPS7550A4 v.2
20190408
Preliminary data sheet
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FXPS7550A4 v.1
FXPS7550A4 v.1
20180913
Preliminary data sheet
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FXPS7550A4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 July 2022
© 2022 NXP B.V. All rights reserved.
20 / 24
FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
19 Legal information
19.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may result
in modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have no
liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
FXPS7550A4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 July 2022
© 2022 NXP B.V. All rights reserved.
21 / 24
FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Suitability for use in automotive applications — This NXP product has
been qualified for use in automotive applications. If this product is used
by customer in the development of, or for incorporation into, products or
services (a) used in safety critical applications or (b) in which failure could
lead to death, personal injury, or severe physical or environmental damage
(such products and services hereinafter referred to as “Critical Applications”),
then customer makes the ultimate design decisions regarding its products
and is solely responsible for compliance with all legal, regulatory, safety,
and security related requirements concerning its products, regardless of
any information or support that may be provided by NXP. As such, customer
assumes all risk related to use of any products in Critical Applications and
NXP and its suppliers shall not be liable for any such use by customer.
Accordingly, customer will indemnify and hold NXP harmless from any
claims, liabilities, damages and associated costs and expenses (including
attorneys’ fees) that NXP may incur related to customer’s incorporation of
any product in a Critical Application.
FXPS7550A4
Product data sheet
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document, including
the legal information in that document, is for reference only. The English
version shall prevail in case of any discrepancy between the translated and
English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names, and
trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 July 2022
© 2022 NXP B.V. All rights reserved.
22 / 24
FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................4
IIR low pass filter coefficients ............................7
Maximum ratings ............................................. 11
Tab. 6.
Tab. 7.
Tab. 8.
Tab. 9.
Tab. 10.
Electrical characteristics — supply and I/O ..... 11
Static characteristics ....................................... 12
Dynamic characteristics .................................. 12
External component recommendations ........... 13
Revision history ...............................................20
Fig. 12.
Fig. 13.
Fig. 14.
Fig. 15.
Fig. 16.
Application diagram of FXPS7550A4 .............. 13
Package outline HQFN (SOT1573-1) ..............14
Package outline detail HQFN (SOT1573-1) .... 15
Package outline note HQFN (SOT1573-1) ...... 16
SOT1573-1 PCB design guidelines - Solder
mask opening pattern ......................................17
SOT1573-1 PCB design guidelines - I/O
pads and solderable area ............................... 18
SOT1573-1 PCB design guidelines - Solder
paste stencil .................................................... 19
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Fig. 7.
Fig. 8.
Fig. 9.
Fig. 10.
Fig. 11.
Block diagram of FXPS7550A4 .........................3
Pin configuration for 16-pin HQFN .................... 3
Voltage regulation and monitoring .....................5
ΣΔ converter block diagram .............................. 6
Signal chain diagram ........................................ 6
Sinc filter response ........................................... 7
800 Hz, 4-pole, low-pass filter response ........... 8
800 Hz, 4-pole output signal delay ....................8
1000 Hz, 4-pole, low-pass filter response ......... 9
1000 Hz, 4-pole output signal delay ..................9
Analog output transfer function ....................... 10
FXPS7550A4
Product data sheet
Fig. 17.
Fig. 18.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 29 July 2022
© 2022 NXP B.V. All rights reserved.
23 / 24
FXPS7550A4
NXP Semiconductors
Analog absolute pressure sensor, 20 kPa to 550 kPa
Contents
1
2
3
3.1
3.2
3.3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.2.1
7.2.2.2
7.2.2.3
7.3
7.3.1
7.3.2
8
9
10
11
12
13
14
15
16
17
18
19
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................1
Automotive ......................................................... 1
Industrial ............................................................ 2
Medical/Consumer ............................................. 2
Ordering information .......................................... 2
Ordering options ................................................ 2
Block diagram ..................................................... 3
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 4
Functional description ........................................4
Voltage regulators ..............................................4
Pressure sensor signal path .............................. 5
ΣΔ converter ...................................................... 5
Digital signal processor (DSP) ...........................6
Decimation sinc filter ......................................... 6
Signal trim and compensation ........................... 7
Low-pass filter ................................................... 7
Analog output function .......................................9
Analog output signal chain ................................ 9
Analog output transfer function ........................10
Maximum ratings ...............................................10
Operating range ................................................ 11
Static characteristics ........................................ 12
Dynamic characteristics ...................................12
Media compatibility—pressure sensors
only ..................................................................... 13
Application information .................................... 13
Package outline .................................................14
Soldering ............................................................17
Mounting recommendations ............................ 20
References ......................................................... 20
Revision history ................................................ 20
Legal information .............................................. 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© 2022 NXP B.V.
All rights reserved.
For more information, please visit: http://www.nxp.com
Date of release: 29 July 2022
Document identifier: FXPS7550A4