GTL2034
4-bit GTL to GTL buffer
Rev. 1.1 — 20 December 2021
1
Product data sheet
General description
The GTL2034 is a 4-bit GTL-/GTL/GTL+ bus buffer.
The GTL2034 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used
in higher voltage open-drain output applications.
2
Features
•
•
•
•
•
•
Operates as a 4-bit GTL-/GTL/GTL+ to GTL-/GTL/GTL+ bus buffer
3.0 V to 3.6 V operation
GTL input and output 3.6 V tolerant
Vref adjustable from 0.5 V to VCC / 2
Partial power-down permitted
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115,
and 1000 V CDM per JESD22-CC101
• Latch-up protection exceeds 500 mA per JESD78
• Package offered: TSSOP14
3
Quick reference data
Table 1. Quick reference data
Tamb = 25 °C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPLH
LOW-to-HIGH propagation delay
-
3.1
8
ns
tPHL
HIGH-to-LOW propagation delay
GTL; BIn to BOn; CL =
50 pF; VCC = 3.3 V
-
4.1
10
ns
Ci
input capacitance
GTL; outputs disabled;
VI/O = 0 V or 3.0 V
-
4.5
-
pF
4
Ordering information
Table 2. Ordering information
Type number
GTL2034PW
Topside
marking
Package
Name
Description
Version
GTL2034
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4
mm
SOT402-1
GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
4.1 Ordering options
Table 3. Ordering options
Type number
Orderable part
number
GTL2034PW
GTL2034PW,118
[2]
GTL2034PWZ
[1]
[2]
[3]
[1]
Package
Packing method
Minimum order
quantity
Temperature
TSSOP14
REEL 13" Q1/T1 NDP
2500
Tamb = -40 °C to +85 °C
TSSOP14
REEL 13" Q1/T1 NDP SSB 2500
Tamb = -40 °C to +85 °C
[3]
Standard packing quantities and other packaging data are available at www.nxp.com/packages/.
Discontinued in 202111031DN; drop in replacement is GTL2034PWZ
This packing method uses a Static Shielding Bag (SSB) solution. Material should be kept in the sealed bag between uses.
5
Functional diagram
GTL2034
BI0
BO0
BI1
BO1
BI2
BO2
BI3
BO3
VREF
002aab148
Figure 1. Logic diagram of GTL2034
6
Pinning information
6.1 Pinning
n.c.
1
BO0
2
14 VCC
13 BI0
BO1
3
VREF
4
12 BI1
BO2
5
10 BI2
BO3
6
9
BI3
GND
7
8
GND
GTL2034PW
11 GND
002aab147
Figure 2. Pin configuration for TSSOP14
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
6.2 Pin description
Table 4. Pin description
7
Symbol
Pin
Description
n.c.
1
not connected
BO0
2
data outputs (GTL)
BO1
3
BO2
5
BO3
6
BI0
13
BI1
12
BI2
10
BI3
9
VREF
4
GTL reference voltage
GND
7, 8, 11
ground (0 V)
VCC
14
positive supply voltage
data inputs (GTL)
Functional description
Refer to Figure 1.
7.1 Function table
Table 5. Function table
Input/output
8
BIn (GTL)
BOn (GTL)
Input
BOn = BIn
Limiting values
Table 6. Limiting values
[1]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
Conditions
VI < 0 V
Min
Max
Unit
-0.5
+4.6
V
-
-50
mA
[2]
VI
input voltage
B port
-0.5
+4.6
V
IOK
output clamping current
VO < 0 V
-
-50
mA
-0.5
+4.6
V
-
80
mA
-60
+150
°C
VO
output voltage
IOL
LOW-state output current
Tstg
output in OFF or HIGH
state; B port
[3]
B port
[4]
storage temperature
GTL2034
Product data sheet
[2]
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Rev. 1.1 — 20 December 2021
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3 / 14
GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
[1]
[2]
[3]
[4]
Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these
or any other conditions beyond those indicated under Section 9 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
Current into any output in the LOW state.
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which
are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
9
Recommended operating conditions
Table 7. Recommended operating conditions
Unused inputs must be held HIGH or LOW to prevent them from floating.
Symbol
Parameter
VCC
supply voltage
VTT
termination voltage
Vref
Conditions
[1]
reference voltage
Min
Typ
Max
Unit
3.0
-
3.6
V
GTL-
0.85
0.9
0.95
V
GTL
1.14
1.2
1.26
V
GTL+
1.35
1.5
1.65
V
overall
0.5
2
VCC / 2
V
GTL-
0.5
0.6
0.63
V
GTL
0.76
0.8
0.84
V
GTL+
0.87
1.0
1.10
V
⁄3VTT
VI
input voltage
B port
0
VTT
3.6
V
VIH
HIGH-state input voltage
B port
Vref + 0.050
-
-
V
VIL
LOW-state input voltage
B port
-
-
Vref - 0.050
V
IOL
LOW-state output current
B port
-
-
40
mA
Tamb
ambient temperature
operating in free air
-40
-
+85
°C
[1]
VTT maximum of 3.6 V with resistor sized so IOL maximum is not exceeded.
10 Static characteristics
Table 8. Static characteristics
Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = -40 °C to +85 °C
Symbol
Parameter
Conditions
[2]
Min
Typ
-
[1]
Max
Unit
0.2
0.4
V
VOL
LOW-state output voltage
B port; VCC = 3.0 V; IOL = 40 mA
II
input current
B port; VCC = 3.6 V; VI = VTT or
GND
-
-
±1
μA
ILO
output leakage current
B port; VCC = 3.6 V; VO = VTT
-
-
±1
μA
ICC
quiescent supply current
B port; VCC = 3.6 V; VI = VCC or
GND; IO = 0 mA
-
4
8
mA
Ci
input capacitance
port BIn; VO = VTT or 0 V
-
4.5
-
pF
Co
output capacitance
port BOn; VO = VTT or 0 V
-
5.5
-
pF
[1]
[2]
All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
10.1 Performance curves
002aab144
1200
Vth+
and
Vth(mV)
1000
Vth+
VthVref
800
Vth+
VthVref
800
600
400
0.5
002aab145
1200
Vth+
and
Vth(mV)
1000
600
0.6
0.7
0.8
0.9
400
0.5
1.0
Vref (V)
a. VCC = 3.0 V; Tamb = -40 °C
0.6
0.7
0.8
0.9
1.0
Vref (V)
b. VCC = 3.3 V; Tamb = 25 °C
002aab146
1200
Vth+
and
Vth(mV)
1000
Vth+
VthVref
800
600
400
0.5
0.6
0.7
0.8
0.9
1.0
Vref (V)
c. VCC = 3.6 V; Tamb = 85 °C
Figure 3. GTL Vth+ and Vth- versus Vref
11 Dynamic characteristics
Table 9. Dynamic characteristics
VCC = 3.3 V ± 0.3 V
Symbol
Parameter
Conditions
Min
Typ
BIn to BOn; see
Figure 4
-
[1]
Max
Unit
2.8
8
ns
5.2
10
ns
GTL-; Vref = 0.6 V; VTT = 0.9 V
tPLH
LOW-to-HIGH propagation delay
tPHL
HIGH-to-LOW propagation delay
GTL; Vref = 0.8 V; VTT = 1.2 V
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
Table 9. Dynamic characteristics...continued
VCC = 3.3 V ± 0.3 V
Symbol
Parameter
Conditions
Min
Typ
tPLH
LOW-to-HIGH propagation delay
-
tPHL
HIGH-to-LOW propagation delay
BIn to BOn; see
Figure 4
BIn to BOn; see
Figure 4
[1]
Max
Unit
3.1
8
ns
-
4.1
10
ns
-
3.3
8
ns
-
3.6
10
ns
GTL+; Vref = 1.0 V; VTT = 1.5 V
tPLH
LOW-to-HIGH propagation delay
tPHL
HIGH-to-LOW propagation delay
[1]
All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
11.1 Waveforms
VM = Vref for B ports.
VTT
input
Vref
Vref1
1/ V
3 TT
tPLH
tp
VM
tPHL
VOH
3.0 V
output
VM
002aab140
Vref
0V
Vref2
002aab149
a. Pulse duration
VOL
b. Propagation delay times
Figure 4. Voltage waveforms
12 Test information
VTT
VCC
PULSE
GENERATOR
VI
DUT
25 Ω
VO
CL
30 pF
RT
002aab143
CL = load capacitance; includes jig and probe capacitance.
RT = termination resistance; should be equal to Zo of pulse generator.
Figure 5. Load circuit for B outputs
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
13 Package outline
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
D
SOT402-1
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
pin 1 index
(A 3 )
A1
A
θ
Lp
1
L
7
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Figure 6. Package outline SOT402-1 (TSSOP14)
GTL2034
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
14 Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached
to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides
both the mechanical and the electrical connection. There is no single soldering method
that is ideal for all IC packages. Wave soldering is often preferred when through-hole
and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is
not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming
from a standing wave of liquid solder. The wave soldering process is suitable for the
following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 7) than a SnPb process, thus reducing
the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board
is heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder
paste characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and Table 11
Table 10. SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm³)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 11. Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm³)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 7.
GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Figure 7. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15 Abbreviations
Table 12. Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
TTL
Transistor-Transistor Logic
16 Revision history
Table 13. Revision history
Document ID
GTL2034 v.1.1
Modifications
Release date
20211220
GTL2034 v.1.0
20051111
GTL2034
Product data sheet
Data sheet status
Product data sheet
Change notice
-
Supersedes
DOC_ID v.1.0
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors. Legal texts have been adapted to the new company
name where appropriate.
• Added orderable part number GTL2034PWZ.
Product data sheet
-
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Rev. 1.1 — 20 December 2021
-
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10 / 14
GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
17 Legal information
17.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
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GTL2034
Product data sheet
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GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
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GTL2034
Product data sheet
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specifications with known limitations. Customer is responsible for the design
and operation of its applications and products throughout their lifecycles
to reduce the effect of these vulnerabilities on customer’s applications
and products. Customer’s responsibility also extends to other open and/or
proprietary technologies supported by NXP products for use in customer’s
applications. NXP accepts no liability for any vulnerability. Customer should
regularly check security updates from NXP and follow up appropriately.
Customer shall select products with security features that best meet rules,
regulations, and standards of the intended application and make the
ultimate design decisions regarding its products and is solely responsible
for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may be
provided by NXP.
NXP has a Product Security Incident Response Team (PSIRT) (reachable
at PSIRT@nxp.com) that manages the investigation, reporting, and solution
release to security vulnerabilities of NXP products.
17.4 Trademarks
Notice: All referenced brands, product names, service names, and
trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 20 December 2021
© NXP B.V. 2021. All rights reserved.
12 / 14
GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Quick reference data .........................................1
Ordering information ..........................................1
Ordering options ................................................2
Pin description ...................................................3
Function table ....................................................3
Limiting values .................................................. 3
Recommended operating conditions ................. 4
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Static characteristics ......................................... 4
Dynamic characteristics .................................... 5
SnPb eutectic process (from J-STD-020D) ....... 9
Lead-free process (from J-STD-020D) .............. 9
Abbreviations ...................................................10
Revision history ...............................................10
Fig. 5.
Fig. 6.
Fig. 7.
Load circuit for B outputs .................................. 6
Package outline SOT402-1 (TSSOP14) ............7
Temperature profiles for large and small
components ..................................................... 10
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Logic diagram of GTL2034 ............................... 2
Pin configuration for TSSOP14 ......................... 2
GTL Vth+ and Vth- versus Vref .........................5
Voltage waveforms ............................................ 6
GTL2034
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 20 December 2021
© NXP B.V. 2021. All rights reserved.
13 / 14
GTL2034
NXP Semiconductors
4-bit GTL to GTL buffer
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
8
9
10
10.1
11
11.1
12
13
14
14.1
14.2
14.3
14.4
15
16
17
General description ............................................ 1
Features ............................................................... 1
Quick reference data .......................................... 1
Ordering information .......................................... 1
Ordering options ................................................ 2
Functional diagram ............................................. 2
Pinning information ............................................ 2
Pinning ............................................................... 2
Pin description ................................................... 3
Functional description ........................................3
Function table .................................................... 3
Limiting values .................................................... 3
Recommended operating conditions ................ 4
Static characteristics .......................................... 4
Performance curves ...........................................5
Dynamic characteristics .....................................5
Waveforms ......................................................... 6
Test information .................................................. 6
Package outline ...................................................7
Soldering ..............................................................8
Introduction to soldering .................................... 8
Wave and reflow soldering ................................ 8
Wave soldering .................................................. 8
Reflow soldering ................................................ 8
Abbreviations .................................................... 10
Revision history ................................................ 10
Legal information .............................................. 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2021.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 December 2021
Document identifier: GTL2034