HTMS1101FUG/AM,005

HTMS1x01; HTMS8x01 HITAG μ transponder IC Rev. 3.4 — 21 May 2015 152934 Product data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various manufacturers well established for both the transponders/cards as well as the read/write devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs. With the new HITAG μ family, this existing infrastructure is extended with the next generation of ICs being substantially smaller in mechanical size, lower in cost, offering more operation distance and speed, but still being operated with the same reader infrastructure and transponder manufacturing equipment. The protocol and command structure for HITAG μ is design to support Reader Talks First (RTF) operation, including anti-collision algorithm. Different memory sizes are offered and can be operated using exactly the same protocol. 1.1 Target markets 1.1.1 Animal identification The ISO standards ISO 11784 and ISO 11785 are well established in this market and HITAG μ is especially designed to deliver the optimum performance compliant to these standards. The HITAG μ advanced ICs are offering additional memory for storage of customized offline data like further breeding details. 1.1.2 Laundry automation • Identify 200 pcs of garment with one read/write device • Long operation distance with typical small shaped laundry button transponders • Insensitive to harsh conditions like pressure, heat and water HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 1.1.3 Beer keg and gas cylinder logistic • Recognizing a complete pallet of gas cylinders at one time • Long writing distance • Voluntarily change between TTF Mode with user defined data length and read/write modes without changing the configuration on the transponder • Authenticity check at the beer pubs - between beer bumper and supplied beer keg, provides a safe protection of the beer brand 1.1.4 Brand protection • Authenticity check for high level brands or for original refilling e.g. toner for fax machines. 2. Features and benefits 2.1 Features „ Integrated circuit for contactless identification transponders and cards „ Integrated resonance capacitor of 210 pF with r3 % tolerance or 280 pF with r5 % tolerance over full production „ Frequency range 100 kHz to 150 kHz 2.2 Protocol „ Modulation read/write device o transponder: 100 % ASK and binary pulse length coding „ Modulation transponder o read/write device: Strong ASK modulation with anti-collision, Manchester and Biphase coding „ Fast anti-collision protocol „ Cyclic Redundancy Check (CRC) „ Transponder Talks First (TTF) mode „ Temporary switch from Transponder Talks First into Reader Talks First (RTF) Mode „ Data rate read/write device to transponder: 5.2 kbit/s „ Data rates transponder to read/write device: 2 kbit/s, 4 kbit/s, 8 kbit/s 2.3 Memory „ „ „ „ „ Different memory options Up to 10000 erase/write cycles 10 years non-volatile data retention Memory Lock functionality 32-bit password feature 2.4 Supported standards „ Full compliant to ISO 11784 and ISO 11785 Animal ID „ Designed to support ISO/IEC 14223 Animal ID with anticollision and read/write functionality HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 2.5 Security features „ 48-bit Unique Identification Number (UID) 2.6 Delivery types „ Sawn, gold-bumped 8” wafer „ HVSON2 „ SOT-1122 3. Applications „ „ „ „ Animal identification Laundry automation Beer keg and gas cylinder logistic Brand protection 4. Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit Tamb d 55 qC 10 - - year 100000 - - cycle Wafer EEPROM characteristics tret retention time Nendu(W) write endurance Interface characteristics Ci HTMS1x01_8x01 Product data sheet COMPANY PUBLIC input capacitance between LA and LB HTMS1x01 [1][2] 203.7 210 216.3 pF HTMS8x01 [1][3] 266 280 294 pF [1] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25qC); VIN1-IN2 = 0.5 V (RMS) [2] Integrated Resonance Capacitor: 210 pF r 3 % [3] Integrated Resonance Capacitor: 280 pF r 5 % All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 5. Ordering information Table 2. Ordering information Type number Package Name Description Type Version HTMS1001FUG/AM Wafer sawn, megabumped wafer, 150 μm, 8 inch, UV HITAG P, 210 pF - HTMS8001FUG/AM Wafer sawn, megabumped wafer, 150 μm, 8 inch, UV HITAG P, 280pF - HTMS8101FUG/AM Wafer sawn, megabumped wafer, 150 μm, 8 inch, UV HITAG P Advanced, 280 pF - HTMS8201FUG/AM Wafer sawn, megabumped wafer, 150 μm, 8 inch, UV HITAG P Advanced+, 280 pF - HTMS8001FTB/AF XSON3 plastic extremely thin small outline package; no HITAG P, 280 pF leads; 4 terminals; body 1 u 1.45 u 0.5 mm SOT1122 HTMS8101FTB/AF XSON3 plastic extremely thin small outline package; no HITAG P Advanced, leads; 4 terminals; body 1 u 1.45 u 0.5 mm 280 pF SOT1122 HTMS8201FTB/AF XSON3 plastic extremely thin small outline package; no HITAG P Advanced+, leads; 4 terminals; body 1 u 1.45 u 0.5 mm 280 pF SOT1122 HTMS8001FTK/AF HVSON2 plastic thermal enhanced very thin small outline HITAG P, 280 pF package; no leads; 2 terminals; body 3 u 2 u 0.85 mm SOT899-1 HTMS8101FTK/AF HVSON2 plastic thermal enhanced very thin small outline HITAG P Advanced, package; no leads; 2 terminals; body 3 u 2 u 280 pF 0.85 mm SOT899-1 HTMS8201FTK/AF HVSON2 plastic thermal enhanced very thin small outline HITAG P Advanced+, package; no leads; 2 terminals; body 3 u 2 u 280 pF 0.85 mm SOT899-1 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 6. Block diagram The HITAG μ transponder ICs require no external power supply. The contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the Read/Write Device (RWD). The interface also demodulates data transmitted from the RWD to the HITAG μ transponder IC, and modulates the magnetic field for data transmission from the HITAG μ transponder IC to the RWD. Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of up to 1760 bit and is organized in blocks. ANALOGUE RF INTERFACE DIGITAL CONTROL EEPROM VREG PAD VDD RECT ANTICOLLISION DEMOD READ/WRITE CONTROL data in TRANSPONDER Cres ACCESS CONTROL MOD data out EEPROM INTERFACE CONTROL R/W CLK PAD clock RF INTERFACE CONTROL SEQUENCER CHARGE PUMP 001aai334 Fig 1. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Block diagram of HITAG μ transponder IC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 7. Pinning information (4) (4) (3) (5) (2) (1) (1) (Y) LA LB (6) (6) (X) 001aaj823 Fig 2. Table 3. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC HITAG μ - Mega bumps bondpad locations HITAG μ - Mega bumps dimensions Description Dimension (X) chip size 550 Pm (Y) chip size 550 Pm (1) pad center to chip edge 100.5 Pm (2) pad center to chip edge 48.708 Pm (3) pad center to chip edge 180.5 Pm (4) pad center to chip edge 55.5 Pm (5) pad center to chip edge 48.508 Pm All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC Table 3. HITAG μ - Mega bumps dimensions Description Dimension (6) pad center to chip edge 165.5 Pm Bump Size: LA, LB 294 x 164 Pm Remaining pads 60 x 60 Pm Note: All pads except LA and LB are electrically disconnected after dicing. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 8. Mechanical specification 8.1 Wafer specification See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”. Table 4. Wafer specification Wafer Designation each wafer is scribed with batch number and wafer number Diameter 200 mm (8 inches) Thickness 150 Pm ± 15 Pm Process CMOS 0.14 Pm Batch size 25 wafers PGDW 91981 Wafer backside Material Si Treatment ground and stress release Roughness Ra max. 0.5 Pm, Rt max. 5 Pm Chip dimensions 550 Pm x 550 Pm = 302500 Pm2 Die size without scribe Scribe line width X-dimension 15 Pm (scribe line width measured between nitride edges) Y-dimension 15 Pm (scribe line width measured between nitride edges) Number of pads 5 Passivation on front Type sandwich structure Material PE-nitride (on top) Thickness 1.75 Pm total thickness of passivation Au bump Material >99.9 % pure Au Hardness 35 HV to 80 HV 0.005 Shear strength >70 MPa Height 18 Pm Height uniformity r2 Pm within a die within a wafer r3 Pm wafer to wafer r4 Pm r1.5 Pm Bump flatness Bump size 294 Pm u 164 Pm LA, LB TEST, GND, VDD 60 Pm u 60 Pm variation r5 Pm Under bump metallization HTMS1x01_8x01 Product data sheet COMPANY PUBLIC sputtered TiW All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 8.1.1 Fail die identification No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”. 8.1.2 Map file distribution See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 9. Functional description 9.1 Memory organization The EEPROM has a capacity of up to 1760 bit and is organized in blocks of 4 bytes each (1 block = 32 bits). A block is the smallest access unit. The HITAG μ transponder IC is available with different memory sizes as shown in Table 5 “Memory organization HITAG m (128-bit)”, Table 6 “Memory organization HITAG μ Advanced (512 bit)” and Table 7 “Memory organization HITAG μ Advanced+ (1760 bit)”. For permanent lock of blocks please refer to Section 14.9 “LOCK BLOCK”. 9.1.1 Memory organization HITAG P transponder ICs Table 5. Memory organization HITAG P (128-bit) Block address Content FFh User Config FEh PWD Password Access 03h 02h 01h ISO 11784/ISO 11785 128 bit TTF data bit3=0 R/W[2] bit3=1 RO[1] 00h HTMS1x01_8x01 Product data sheet COMPANY PUBLIC [1] RO: Read without password, write with password [2] R/W: Read and write without password All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 9.1.2 Memory organization HITAG μ Advanced Table 6. Memory organization HITAG μ Advanced (512 bit) Block address Content FFh User Config FEh PWD Password Access 0Fh 0Eh 0Dh 0Ch 0Bh 0Ah 09h User Memory bit4=0 R/W[2] bit4=1 RO[1] ISO 11784/ISO 11785 128-bit TTF data bit3=0 R/W[2] bit3=1 RO[1] 08h 07h 06h 05h 04h 03h 02h 01h 00h HTMS1x01_8x01 Product data sheet COMPANY PUBLIC [1] RO: Read without password, write with password [2] R/W: Read and write without password All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 9.1.3 Memory organization HITAG μ Advanced + Table 7. Memory organization HITAG μ Advanced+ (1760 bit) Block address Content FFh User Config FEh PWD Password Access 36h 35h ... 14h User Memory 13h 12h bit6=0 bit5=0 R/W[2] bit6=0 bit5=1 RO[1] bit6=1 bit5=0 R/W(P)[3] bit6=1 bit5=1 R/W(P)[3] 11h 10h 0Fh 0Eh 0Dh 0Ch 0Bh 0Ah 09h User Memory bit4=0 R/W[2] bit4=1 RO[1] ISO 11784/ISO 11785 128-bit TTF data bit3=0 R/W[2] bit3=1 RO[1] 08h 07h 06h 05h 04h 03h 02h 01h 00h HTMS1x01_8x01 Product data sheet COMPANY PUBLIC [1] RO: Read without password, write with password [2] R/W: Read and write without password [3] R/W(P): Read and write with password All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 9.2 Memory configuration The user configuration block consists of one configurable byte (Byte0) and three reserved bytes (Byte1 to Byte3) The bits in the user configuration block enable a customized configuration of the HITAG μ transponder ICs. In TTF mode the user can choose Bi-phase or Manchester encoding and also the data rate for the return link (bit0 to bit2). In RTF mode data rate and coding are fixed with 4 kbit/s Manchester encoding. Fitting to ISO 11785 standard the default values are set for 4 kbit/s Bi-Phase encoding. The next four bits (bit 3 to bit 6) are used for password settings. Three areas (TTF area(128bit), lower 512 bits and upper memory) can be restricted to read/write access. The user configuration block (User Config) is programmable by using WRITE SINGLE BLOCK command at address FFh. Bits 7 to 31 (Byte1 to Byte3) are reserved for further usage. The user configuration block (block address FFh) and the password block (block address FEh) can be locked with the LOCK BLOCK command. Attention: • Pre-programmed default values are not locked ! • Configuration block has to be locked to make data unalterable! • The lock of the blocks is permanently and therefore irreversible! Table 8. User configuration block to Byte0 Byte0 bit6 bit5 [2] PWD (r/w) Bit512… Max bit4 [1] PWD (w) Bit512… Max Description bit3 [1] PWD (w) Bit128… 511 [1] PWD (w) Bit0… 127 bit2 bit1 ... 0 Encoding Data rate 0… MCH ’00’… 2kbit/s 1… Bi-Ph. ’01’… 4kbit/s Bit-no. Value/meaning ’10’… 8kbit/s [1] PWD(w)=1: read without password and write with password [2] PWD(r/w)=1: read and write with password HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 10. General requirements The HITAG P transponder ICs are compatible with ISO 11785. At the time a HITAG P transponder IC is in the interrogator field it will respond according to ISO 11785. A HITAG P advanced/advanced+ can be identified as a transponder being in the data exchange mode (advanced mode) by the type information in the reserved bit field sent to the RWD. • Bit 15 of the ISO 11784 frame shall be set to ’1’ indicating that this is an HITAG μ advanced/advanced+ in data exchange mode. • Bit 16 of the ISO 11784 frame (additional data flag set to ’1’, indicating that the HITAG μ advanced/advanced+ in data exchange mode contains additional data in the user memory area. To bring the HITAG μ transponder ICs into the data exchange mode, the RWD needs to send a valid request or a valid switch command within the defined listening window. A HITAG μ transponder IC in data exchange mode only responds when requested by the RWD (RTF mode). The identification code, all communication from reader to HITAG μ transponder ICs and vice versa and the CRC error detection bits (if applicable) are transmitted starting with LSB first. In the case that multiple HITAG μ advanced/advanced+ in data exchange mode are in the interrogation field which cause collisions the RWD has to start the anticollision procedure as described in this document. Depending in which part of the ISO 11785 timing frame the collision is detected the RWD will start with the anticollision request. The HITAG P transponder IC in data exchange mode switches back to the standard ISO 11785 mode when it : • is no longer in the interrogation field • has terminated the data exchange mode operations and the interrogation field was switched off for at least 5 ms afterwards 11. HITAG P transponder IC air interface 11.1 Downlink description To transfer the HITAG μ transponder ICs into the data exchange mode, the RWD's interrogation field needs be switched off. After this off-period, the interrogation field is switched on again, and either the SOF at the start of a valid request or the special switch command needs to be sent to the HITAG μ transponder IC within the specified switch time window. The HITAG μ transponder IC switches itself into the data exchange mode upon reception of any of the switch commands. In this mode, the HITAG μ transponder IC respond when requested by the RWD (reader driven protocol). The HITAG μ transponder IC in data exchange mode switches back to the ISO 11785 mode after the interrogation field has been switched off for at least 5 ms. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC The steps necessary to transfer the HITAG P transponder IC into the data exchange mode are shown in Figure 3. The downlink communication takes place in period C and D. The example in Figure 3 shows two data blocks (#1 and #2) being selected by the RWD, which then are transmitted by the HITAG μ transponder IC. HITAG μ ISO11785 ISO11785 5 .. 20 ms 5 .. 20 ms min 5 ms A B C D D E A B A reader field HITAG μ response ISO11785 #1 #2 ISO11785 time 001aaj824 Fig 3. Table 9. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC RF interface for HITAG μ RF interface for HITAG μ Cycle A: The RWD reads the ISO 11785 frame. Cycle B: The RWD switches off the interrogation field for at least 5 ms in order to reset the HITAG μ transponder IC. Cycle C: The RWD sends either the SOF at the start of a valid request or the SWITCH command to the HITAG μ transponder IC in order to put it into the data exchange mode. Any of these has to be issued within the switch window after reset - as defined in Section 11.2 “Mode switching protocol” Cycle D: Read/Write (for HITAG μ transponder ICs) or Inventory (HITAG μ advanced/advanced+ transponder ICs) operation in the data exchange mode. Cycle E: After all operations are finished or the HITAG μ transponder IC left the antenna field, the RWD switches off the field for at least 5 ms in order to poll for new incoming HITAG μ or HITAG μ advanced/advanced+. All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.2 Mode switching protocol After powering the HITAG μ transponder IC switches to the data exchange mode after receiving one of the two possible switch commands from the RWD during the specified switch window (see Table 10 and Figure 4 for details). 312.5 × Tc 232 × Tc TTF operation in case of no command during switching window 001aak278 Fig 4. Switching window timing Table 10. HITAG μ transponder IC air interface parameters [1] Parameter Description Interrogation field modulation Amplitude modulation (ASK), 90 - 100% Encoding Pulse Interval Encoding; Least Significant Bit (LSB) first Bit rate 5.2 kbit/s typically Mode switching Either a specific 5 bit switch command or the detection of the SOF as part of a valid HITAG μ transponder IC command, transmitted after the interruption of the interrogation field for at least 5 ms Mode switch timing HITAG μ transponder IC settling time: 312.5 u TC switch command window after HITAG μ transponder IC settling: 232.5 u TC All within cycle C in Figure 3. Mode switch command [1] HTMS1x01_8x01 Product data sheet COMPANY PUBLIC 00011 or SOF sequence TC...Carrier period time (kHz = 7.45 Ps nominal) All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC The RWD sends either the SOF at the start of a valid request or a special switch command to the HITAG μ (as shown in Figure 5) in order to transfer it into the data exchange mode. carrier on 0 SOF code violation 0 0 FDX ADV command carrier off transceiver carrier on 0 switch command 1 1 carrier off stop condition time 001aaj825 Fig 5. Reader downlink modulation for SWITCH command 11.2.1 SWITCH Setting the transponder into data exchange mode (advanced mode) is done by sending SOF pattern or the switch command within the listening window (232.5 x TC). The SWITCH command itself does not contain SOF and EOF. Table 11. SWITCH Command Command Description 5 No. of bits 00011 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 17 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.3 Downlink communication signal interface - RWD to HITAG μ transponder IC 11.3.1 Modulation parameters Communications between RWD and HITAG μ transponder IC takes place using ASK modulation with a modulation index of m > 90%. TF1 TF2 TF3 y a x b envelope of transceiver field Fig 6. Table 12. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC 001aaj826 Modulation details of data transmission from RWD to HITAG μ transponder IC Modulation coding times[1][2] Symbol Min Max m = (a-b)/(a+b) 90% 100% TF1 4u Tc 10 u Tc TF2 0 0.5 u TF1 TF3 0 0.5 u TFd0 x 0 0.05 u a y 0 0.05 u a [1] TF3 shall not exceed TFd0 - TF1 - 3 u Tc [2] TC...Carrier period time (kHz = 7.45 Ps nominal) All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 18 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.3.2 Data rate and data coding The RWD to HITAG μ transponder IC communication uses Pulse Interval Encoding. The RWD creates pulses by switching the carrier off as described in Figure 7. The time between the falling edges of the pulses determines either the value of the data bit ’0’, the data bit ’1’, a code violation or a stop condition. data "0'' TFd0 TF1 TF1 carrier on carrier off data "1'' TFd1 TF1 TF1 carrier on carrier off "code violation'' TFcv TF1 TF1 carrier on carrier off "stop condition'' TFsc TF1 carrier on carrier off 001aaj827 Fig 7. Reader to HITAG μ transponder IC: Pulse Interval Encoding Assuming equal distributed data bits ’0’ and ’1’, the data rate is in the range of about 5.2 kbit/s. Table 13. Meaning Symbol Min Max Carrier off time TF1 4 u Tc 10 u Tc Data “0” time TFd0 18 u Tc 22 u Tc Data “1” time TFd1 26 u Tc 30 u Tc Code violation time TFcv 34 u Tc 38 u Tc Stop condition time TFsc t 42 u Tc n/a [1] HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Data coding times [1] TC...Carrier period time (kHz = 7.45 Ps nominal) All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 19 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.3.3 RWD - Start of frame pattern The RWD requests in the data exchange mode always a start with a SOF pattern for ease of synchronization. The SOF pattern consists of an encoded data bit ’0’ and a ’code violation’. data "0" "code violation" TFcv TFd0 TF1 TF1 TF1 carrier on carrier off TFpSOF 001aaj828 Fig 8. Start of frame pattern The HITAG μ advanced/advanced+ is ready to receive a SOF from the RWD within 1.2 ms after having sent a response to the RWD. The HITAG μ advanced/advanced+ is ready to receive a SOF or switch command from the RWD within 2.33 ms after the RWD has established the powering field. 11.3.4 RWD - End of frame pattern For slot switching during a multi-slot anticollision sequence, the RWD request is an EOF pattern. The EOF pattern is represented by a RWD ’Stop condition’. "stop condition'' TFsc TF1 carrier on carrier off TFpEOF 001aaj829 Fig 9. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC End of frame pattern All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 20 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.4 Communication signal interface - HITAG μ transponder IC to RWD 11.4.1 Data rate and data coding The HITAG μ transponder IC accepts the following data rates and encoding schemes: • 1/TFd Differential bi-phase coded data signal in the ISO 11785 mode, without SOF and EOF • 1/TFd Manchester coded data signal on the response to the HITAG μ advanced/advanced+ commands in data exchange mode • 1/(2 uTFd) dual pattern data coding when responding within the inventory process • TTF mode (not ISO 11785 compliant): 1/(2 u TFd), 2/TFd Manchester or bi-phase coded TFd = 32 / fc = 32 u Tc Remark: The slower data rate used during the inventory process allows for improving the collision detection when several HITAG μ transponder ICs are present in the RWD field, especially if some HITAG μ transponder ICs are in the near field and others in the far field. data element response encoding in INVENTORY mode response encoding to a RWD request in data exchange mode TFd data "0" load off load off load on load on TFd data "1" load off load off load on load on TFd TFd TFd TFd 001aaj830 Fig 10. HITAG μ transponder IC - Load modulation coding data 1 0 1 1 1 0 0 1 Bi-phase 001aaj831 Fig 11. HITAG μ transponder IC - Differential Bi-Phase Modulation Differential Bi-phase (or FM0 respectively) contains a transition in the center of bit conversion representing Data ’0’ and no one for Data ’1’. At the beginning of every bit modulation a level transition must be performed. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 21 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 11.4.2 Start of frame pattern The HITAG μ transponder IC response - if not in ISO 11785 compliant mode - always starts with a SOF pattern. The SOF is a Manchester encoded bit sequence of ’110’. data "1" data "1" data "0" TFd TFd TFd load off load on 001aaj832 Fig 12. Start of fame pattern 11.4.3 End of frame pattern A specific EOF pattern is neither used nor specified for the HITAG μ transponder IC response. An EOF is detected by the reader if there is no load modulation for more than two data bit periods (TFd). HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 22 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 12. General protocol timing specification For requests where an EEPROM erase and/or programming operation is required, the transponder IC returns its response when it has completed the write/lock operation. This will be after 20 ms upon detection of the last falling edge of the interrogator request or after the interrogator has switched off the field. 12.1 Waiting time before transmitting a response after an EOF from the RWD When the HITAG advanced/advanced+ in data exchange mode has detected an EOF of a valid RWD request or when this EOF is in the normal sequence of a valid RWD request, it waits for TFp1 before starting to transmit its response to a RWD request or when switching to the next slot in an inventory process. TFp1 starts from the detection of the falling edge of the EOF received from the RWD. Remark: The synchronization on the falling edge from the RWD to the EOF of the HITAG μ transponder ICs is necessary to ensure the required synchronization of the HITAG μ transponder IC responses. carrier on request request (or EOF) transceiver carrier off TFp1 HITAG μ TNRT TFp2 load off load on response 001aaj833 Fig 13. General protocol timing diagram The minimum value of TFp1 is TFp1min = 204 u TC The typical value of TFp1 is TFp1typ = 209 u TC The maximum value of TFp1 is TFp1max = 213 u TC If the HITAG μ transponder IC detects a carrier modulation during this time (TFp1), it shall reset its TFp1-timer and wait for a further time (TFp1) before starting to transmit its response to a RWD request or to switch to the next slot when in an inventory process. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 23 of 57 NXP Semiconductors HTMS1x01; HTMS8x01 HITAG μ transponder IC 12.2 RWD waiting time before sending a subsequent request • When the RWD has received a HITAG μ advanced/advanced+ response to a previous request other than inventory and quiet, it needs to wait TFp2 before sending a subsequent request. TFp2 starts from the time the last bit has been received from the HITAG μ advanced/advanced+. • When the RWD has sent a quiet request, it needs to wait TFp2 before sending a subsequent request. TFp2 starts from the end of the quiet request's EOF (falling edge of EOF pulse + 42 u TC). This results in awaiting time of (150 u TC + 42 u TC) before the next request. The minimum value of TFp2 is TFp2min = 150 u TC ensures that the HITAG μ advanced/advanced+ICs are ready to receive a subsequent request. Remark: The RWD needs to wait at least 2.33 ms after it has activated the electromagnetic field before sending the first request, to ensure that the HITAG μ transponder ICs are ready to receive a request. • When the RWD has sent an inventory request, it is in an inventory process. 12.3 RWD waiting time before switching to next inventory slot An inventory process is started when the RWD sends an inventory request. For a detailed explanation of the inventory process refer to Section 14.3 and Section 14.4. To switch to the next slot, the RWD sends an EOF after waiting a time period specified in the following sub-clauses. 12.3.1 RWD started to receive one or more HITAG μ transponder IC responses During an inventory process, when the RWD has started to receive one or more HITAG μ advanced/advanced+ transponder IC responses (i.e. it has detected a HITAG μ advanced/advanced+ transponder IC SOF and/or a collision), it shall • wait for the complete reception of the HITAG μ advanced/advanced+ transponder IC responses (i.e. when a last bit has been received or when the nominal response time TNRT has elapsed), • wait an additional time TFp2 and then send an EOF to switch to the next slot, if a 16 slot anticollision request is processed, or send a subsequent request (which could be again an inventory request). TFp2 starts from the time the last bit has been received from the HITAG μ advanced/advanced+ transponder IC. The minimum value of TFp2 is TFp2min = 150 u TC. TNRT is dependant on the anticollisions current mask value and on the setting of the CRCT flag. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 24 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 12.3.2 RWD receives no HITAG μ transponder IC response During an inventory process, when the RWD has received no HITAG μ advanced/advanced+ transponder IC response, it needs to wait TFp3 before sending a subsequent EOF to switch to the next slot, if a 16 slot anticollision request is processed, or sending a subsequent request (which could be again an inventory request). TFp3 starts from the time the RWD has generated the falling edge of the last sent EOF. The minimum value of TFp3 is TFp3min = TFp1max + TFpSOF. TFpSOF is the time duration for a HITAG μ advanced/advanced+ transponder to transmit an SOF to the reader. request carrier on request (or EOF) reader carrier off TFp1MAX HITAG μ TFpSOF TFp3 load off load on no response 001aaj834 Fig 14. Protocol timing diagram without HITAG μ transponder IC response Table 14. Symbol Min Max TFpSOF 3 u TFd 3 u TFd TFp1 204 uTC 213 u TC TFp2 150 u TC - TFp3 TFp1max + TFpSOF - [1] HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Overview timing parameters [1] TC...Carrier period time (kHz = 7.45 Ps nominal) All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 25 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 13. State diagram 13.1 General description of states RF Off The powering magnetic field is switched off or the HITAG μ transponder IC is out of the field. WAIT After start up phase, the HITAG μ transponder IC is ready to receive the first command. READY The HITAG μ transponder IC enters this state after a valid command, except of the STAY QUIET, SELECT or WRITE-ISO11785 command. If there are several HITAG μ transponder ICs at the same time in the field of the RWD antenna, the anticollision sequence can be started to determine the UID of every HITAG μ transponder IC. SELECTED The HITAG μ transponder IC enters the Selected state after receiving the SELECT command with a matching UID. In the Selected state the respective commands with SEL=1 are valid only for selected transponder. Only one HITAG μ transponder IC can be selected at one time. If one transponder is selected and a second transponder receives the SELECT Command, the first transponder will automatically change to Quiet state. QUIET The HITAG μ transponder IC enters this state after receiving a STAY QUIET command or when he was in selected state and receives a SELECT command addressed to another transponder. In this state, the HITAG μ transponder IC reacts to any request commandos where the ADR flag is set. ISO 11785 STATE In this state the HITAG μ transponder IC replies according to the ISO 11785 protocol. Remark: In case of an invalid command the transponder will remain in his actual state. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 26 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 13.2 State diagram HITAG P advanced/advanced+ out of field or RF off RF on RF Off No request and RF on WAIT for time-out RF on ISO 11785 FDX-B Invalid Request (reset time-out) valid request „read UID“ or any other request with SEL flag not set out of field or RF off out of field or RF off READY „STAY QUIET“ (UID) Anticollision „INVENTORY“ „INVENTORY ISO-11785“ „READ MULTIPLE BLOCK in inventory mode“ „SELECT“ (UID) RF-off: „go to RF-off state“ „SELECT“ (UID) SELECTED QUIET any other request with ADR flag set „STAY QUIET“ or „SELECT“ (non-matching-UID) any other request with ADR flag set or SEL flag set aaa-000326 Fig 15. State diagram of HITAG μ advanced/advanced+ transponder ICs HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 27 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 13.3 State diagram HITAG P out of field or RF off RF on No request and RF on RF Off WAIT for time-out RF on ISO 11785 FDX-B Invalid Request (reset time-out) valid request „read UID“ or any other request with SEL flag not set out of field or RF off READY aaa-000325 Fig 16. State diagram of HITAG μ transponder IC HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 28 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 13.4 Modes 13.4.1 ISO 11785 Mode This mode is also named TTF (Transponder Talks First). Every time a transponder IC is activated by the field it starts executing this mode. After waiting the maximum listening window time (see Section 11.2) the transponder IC sends continuously its TTF data (128-bit). The TTF data stored in the memory will be not checked for ISO compliance, therefore data will be sent as stored in the EEPROM. Receiving a valid command or a switch command within the listening window sets the transponder IC into RTF (Reader Talks First) mode. 13.4.2 RTF Mode In this mode the transponder IC reacts only to RWD request commands as presented in Section 14. A valid request consists of a command sent to the transponder IC being in matching state (therefore see tables in Section 14 and transponder ICs state machine in Section 13). 13.4.3 Anticollision The RWD is the master of the communication with one or multiple transponder ICs. It starts the anticollision sequence by issuing the inventory request (see Section 14.3). Within the RWD command the NOS flag must be set to the desired setting (1 or 16 slots) and add the mask length and the mask value after the command field. The mask length n indicates the number of significant bits of the mask value. It can have any value between 0 and 44 when 16 slots are used and any value between 0 and 48 when 1 slot is used. The next two subsections summarize the actions done by the transponder IC during an inventory round. 13.4.3.1 Anticollision with 1 slot The transponder IC will receive one ore more inventory commands with NOS = '1'. Every time the transponder ICs fractional or whole UID matches the mask value of RWD's request it responses with remaining UID without mask value. Transponder ICs responses are modulated by dual pattern data coding as described in Section 11.4. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 29 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 13.4.3.2 Anticollision with 16 slots The transponder IC will receive several inventory commands with NOS = '0' defining an amount of 16 slots. Within the request there is the mask specified by length and value (sent LSB first). In case of mask length = '0' the four least significant bits of transponder ICs UID become the starting value of transponder IC's slot counter. In case of mask length z '0' the received fractional mask is compared to transponder IC's UID. If it matches the starting value for transponder IC's slot number will be calculated. Starting at last significant bit of the sent mask the next four less significant bits of UID are used for this value. At the same time transponder IC's slot counter is reset to '0'. Now the RWD begins its anticollision algorithm. Every time the transponder IC receives an EOF it increments slot-counter. Now if mask value and slot-counter value are matching the transponder IC responses with the remaining UID without mask value but with slot number In case of collision within one slot the RWD changes the mask value and starts again running its algorithm. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 30 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14. Command set The first part of this section (Section 14.1) describes the flags used in every RWD command. The following subsections (Section 14.3 until Section 14.13) explain all implemented commands and their suitable transponder IC responses which are done with tables showing the command itself and suitable responses. Within tables flags, parameter bits and parts of a response written in braces are optional. That means if the suitable flag is set resulting transponder IC's action will be performed according to Section 14.1. Every command except the Switch command is embedded in SOF and EOF pattern. As described in Table 15 and Table 16 sending and receiving data is done with the least significant bit of every field on first position. Important information: In this document the fields (i.e. command codes) are written with most significant bit first. Reader - Transponder IC transmission [1][2] Table 15. SOF Flags Commands Parameters Data CRC-16 EOF - 5 6 var. var. (16) - - LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB - [1] values in braces are optional [2] data is sent with least significant bit first Table 16. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Transponder IC - Reader transmission [1][2] SOF Error flag Data/Error code CRC-16 EOF - 1 var. (16) - - - LSB ... MSB LSB ... MSB - [1] values in braces are optional [2] data is sent with least significant bit first All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 31 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.1 Flags Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5 (MSB). The specific meaning depends on the context. Table 17. Command Flags Bit Flag Full name Value Description 1 Protocol EXTension 0 No protocol format extension 1 RFU PEXT 2 INV INVentory 0 Flag 4 and Flag 5 are ’SEL’ and ’ADR’ Flag 1 Flag 4 and Flag 5 are ’RFU’ and ’NOS’ Flag 3 CRCT CRC-Transponder 0 Transponder IC respond without CRC 1 Transponder IC respond contains CRC 4 SEL SELect (INV==0) in combination with ADR (see Table 19) 5 ADR ADdRess (INV==0) in combination with SEL (see Table 19) 4 RFU Reserved for future (INV==1) use 0 this flag is not used and set to '0' 5 NOS (INV==1) 0 16 slots while performing anti-collision 1 1 slot while performing anti-collision Table 18. Command Flags - Bit order MSB bit5 bit4 INV==0 ADR SEL INV==1 NOS RFU Table 19. bit2 LSB bit1 CRCT INV PEXT CRCT INV PEXT bit3 Meaning of ADR and SEL flag ADR SEL Meaning 0 0 Request without UID, all transponder ICs in READY state shall respond 1 0 Request contains UID, one transponder IC (with corresponding UID) shall respond 0 1 Request without UID, the transponder IC in SELECTED state shall respond 1 1 Reserved for future use Note: For HITAG μ inventory (INV) flag and select (SEL) flag must be set to ’0’ HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 32 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.2 Error handling In case an error has been occurred the transponder IC responses with the set error flag and the three bit code ’111’ (meaning ’unknown error’). The general response format in case of an error response is shown in Table 20 whereas commands not supporting error responses are excluded. In case of an unsupported command there will be no response. The format is embedded into SOF and EOF. Table 20. Response format in error case Error flag Error code CRC-16 Description 1 3 (16) No. of bits 1 111 SOF Error Flag ''0'' Data (CRC) EOF 001aak260 Fig 17. HITAG μ transponder IC response - in case of no error SOF Error Flag ''1'' Error Code ''111'' (CRC) EOF 001aak262 Fig 18. HITAG μ transponder IC response - in error case HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 33 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.3 INVENTORY [Advanced, Advanced+] Upon reception of this command without error, all transponder ICs in the ready state shall perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS flag determines whether 1 or 16 slots are used. If a transponder IC detects any error, it shall remain silent. Table 21. INVENTORY - Request format (00h) Flags Command Mask length Mask value CRC-16 Description 5 6 6 n (16) No. of bits 10(1)10 000000 0 dn dUID length UID Mask AC with 1 timeslot 00(1)10 000000 0 dn dUID length UID Mask AC with 16 timeslot Table 22. Response to a successful INVENTORY request [1][2] Error Flag Data CRC-16 Description 1 48 - n (16) No. of bits 0 Remaining UID without mask value [1] Error and CRC are Manchester coded, UID is dual pattern coded [2] Response within the according time slot Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 34 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.4 INVENTORY ISO 11785 [Advanced, Advanced+] Upon reception of this command without error, all transponder ICs in the ready state are performing the anticollision sequence. The inventory (INV) flag is set to '1'. The NOS flag determines whether 1 or 16 slots are used. In contrast to INVENTORY command the transponder IC (holding requested slot) sends the 64-bit ISO 11785 number in addition to remaining UID. The 64-bit number is taken from a fixed area of EEPROM. It will not be checked on ISO 11785 compliance before sending. If a transponder IC detects any error, it remains silent. Table 23. INVENTORY ISO 11785 - request format (23h) Flags Command Mask length Mask value CRC-16 Description 5 6 6 n (16) No. of bits 10(1)10 100011 0 dn dUID length UID Mask AC with 1 timeslot 00(1)10 100011 0 dn dUID length UID Mask AC with 16 timeslot Table 24. Response to a successful INVENTORY ISO 11785 request[1] Error Flag Data 1 Data 2 CRC-16 Description 1 48 - n 64 (16) No. of bits 0 Remaining UID without mask value ISO 11785 number [1] Error, CRC and ISO 11785 number are Manchester coded, UID is dual pattern coded 14.5 STAY QUIET [Advanced, Advanced+] Upon reception of this command without error, a transponder IC in either ready state or selected state enters the quiet state and shall not send back a response. The STAY QUIET command with both SEL and ADR flag set to '0' or both set to '1' is not allowed. There is no response to the STAY QUIET request, even if the transponder detects an error Table 25. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC STAY QUIET - request format(01h) Flags Command Data CRC-16 Description 5 6 (48) (16) No. of bits: 00(1)00 000001 - without UID 11(1)00 000001 UID with UID All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 35 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.6 READ UID [P, Advanced, Advanced+] Upon reception of this command without error all transponder ICs in the ready state are sending their UID. The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to '0'. Table 26. Flags READ UID - request format (02h) Command CRC-16 Description 5 6 (16) No. of bits 00(1)00 000010 Table 27. Response to a successful READ UID request Error flag Data CRC-16 Description 1 48 (16) No. of bits 0 UID Error flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 36 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.7 READ MULTIPLE BLOCK [P, Advanced, Advanced+] Upon reception of this command without error, the transponder reads the requested block(s) and sends back their value in the response. The blocks are numbered from 0 to 255. The number of blocks in the request is one less than the number of blocks that the transponder returns in its response i.e. a value of '6' in the ’Number of blocks’ field requests to read 7 blocks. A value '0' requests to read a single block. Table 28. READ MULTIPLE BLOCKS (advanced/advanced+) - request format (12h) Flags Command Data 1 Data 2 Data 3 CRC-16 Description 5 6 (48) 8 8 (16) No. of bits 00(1)00 010010 - First block number Number of blocks without UID in READY state 10(1)00 010010 UID First block number Number of blocks with UID in READY state 01(1)00 010010 - First block number Number of blocks without UID in SELECTED state Table 29. READ MULTIPLE BLOCKS (μ) - request format (12h) Flags Command Data 1 Data 2 Data 3 CRC-16 Description 5 6 (48) 8 8 (16) No. of bits 00(1)00 010010 - First block number Number of blocks without UID in READY state 10(1)00 010010 UID First block number Number of blocks with UID in READY state Table 30. Response to a successful READ MULTIPLE BLOCKS request Error Flag Data CRC-16 Description 1 32 x Number of blocks (16) No. of bits 0 User memory block data Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 37 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.7.1 READ MULTIPLE BLOCKS in INVENTORY mode [Advanced, Advanced+] The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is marked by INV-Flag = '1' within the request). Here request and response will change as shown in following tables. If the transponder detects an error during the inventory sequence, it shall remain silent. Table 31. Flags READ MULTIPLE BLOCKS - request format (12h) Command Mask length Mask value Parameter 1 Parameter 2 CRC-16 Description 5 6 6 n 8 8 10(1)10 010010 0 dn dUID length First block number Number of blocks AC with 1 timeslot 00(1)10 010010 0 dn dUID length First block number Number of blocks AC with 16 timeslot (16) No. of bits After receiving RWD's command without error the transponder IC transmits the remaining section of the UID in dual pattern code. The following data (Error Flag, Data 2, optional CRC in no error case; Error Flag, Error Code, optional CRC in error case) is transmitted in Manchester Code. Table 32. Error Flag Data 1 Data 2 CRC-16 Description 1 48 - n 32 x number of blocks (16) 0 Remaining section of UID (without mask value) User memory block data [1] HTMS1x01_8x01 Product data sheet COMPANY PUBLIC READ MULTIPLE BLOCKS in INVENTORY mode Response format [1] No.of bits Error, CRC and Data are Manchester coded, UID is dual pattern coded All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 38 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.8 WRITE SINGLE BLOCK [P, Advanced, Advanced+] Upon reception of this command without error, the transponder IC writes 32-bit of data into the requested user memory block and report the success of the operation in the response. Table 33. Flags WRITE SINGLE BLOCK (advanced/advanced+) - request format (14h) Command Data 1 Data 2 Data 3 CRC-16 32 (16) Description 5 6 (48) 8 (1)0(1)00 010100 - block number block data without UID in READY state 0(1)(1)00 010100 UID block number block data with UID in READY state 01(1)00 010100 - block number block data without UID in SELECTED state Table 34. Flags No. of bits WRITE SINGLE BLOCK (μ) - request format (14h) Command Data 1 Data 2 Data 3 CRC-16 32 (16) Description 5 6 (48) 8 00(1)00 010100 - block number block data without UID in READY state 10(1)00 010100 UID block number block data with UID in READY state Table 35. No. of bits Response to a successful WRITE SINGLE BLOCK request Error Flag CRC-16 Description 1 (16) No. of bits 0 Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 39 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.9 LOCK BLOCK [P, Advanced, Advanced+] Upon reception of this command without error, the transponder IC is write locking the requested block (block size = 32-bit) permanently. Blocks within the block address range from 00h to 17h as well as FEh and FFh can be locked individually. For HITAG μ advanced+ transponder IC a LOCK BLOCK command with a block number value between 18h to 36h will lock all blocks within the block address range 18h to 36h. In case a password is applied to the memory a lock is only possible after a successful login. Table 36. Flags LOCK BLOCK (advanced/advanced+) - request format (16h) Command Data 1 Data 2 CRC-16 (16) Description 5 6 (48) 8 00(1)00 010110 - block number without UID in READY state 10(1)00 010110 UID block number with UID in READY state 01(1)00 010110 - block number without UID in SELECTED state Table 37. Flags No. of bits LOCK BLOCK (μ) - request format (16h) Command Data 1 Data 2 CRC-16 (16) Description 5 6 (48) 8 00(1)00 010110 UID block number without UID in READY state 10(1)00 010110 - block number with UID in READY state Table 38. No. of bits Response to a successful LOCK BLOCK request Error flag CRC-16 Description 1 (16) No. of bits 0 Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 40 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.10 SELECT [Advanced, Advanced+] The SELECT command is always be executed with SEL flag set to '0' and ADR flag set to '1'. There are several possibilities upon reception of this command without error: • If the UID, received by the transponder IC, is equal to its own UID, the transponder IC enters the Selected state and shall send a response. • If the received UID is different there are two possibilities – A transponder IC in a non-selected state (QUIET or READY) is keeping its state and not sending a response. – The transponder IC in the Selected state enters the Quiet state and does not send a response. Table 39. SELECT - request format (18h) Flags Command Data 1 CRC-16 Description 5 6 48 (16) No. of bits 10(1)00 011000 UID Error flag CRC-16 Description 1 (16-bit) No. of bits Table 40. Response to a successful SELECT request 0 Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 41 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.11 WRITE ISO 11785 (custom command) [P, Advanced, Advanced+] Upon reception of this command without error, the transponder IC (in Ready state) writes 128-bit of ISO 11785 TTF data into suitable reserved memory block and report the success of the operation in the response. The user does not have to attend whether the data is compliant to ISO 11785 or not. The command data block is sent exactly the same way as it is sent by the transponder IC in TTF mode (Header, 64-bit ID, CRC…) after entering the field again. There are two different command codes one for locking the TTF area after successful write command and one without locking. The command must be completed by a reset of the IC. After entering the RF field the ISO 11785 data is sent when the transponder is in ISO 11785 state. Table 41. WRITE ISO 11785 - request format (38h, 39h) Flags Command Data 1 CRC-16 Description 5 6 128 (16) No. of bits 00(1)00 111000 ISO 11785 TTF data 00(1)00 111001 ISO 11785 TTF data Table 42. inc. LOCK Response to a successful WRITE ISO 11785 request Error flag CRC-16 Description 1 (16) No. of bits 0 Error Flag set to ’0’ indicates no error. carrier on request request (or EOF) transceiver carrier off TFp1 HITAG μ TNRT TFp2 load off load on response 001aaj833 Fig 19. Waiting time before a response for WRITE ISO 11785 command The minimum value of TFp1 is 20 ms. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 42 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.12 GET SYSTEM INFORMATION [Advanced, Advanced+] Upon reception of this command without error, the transponder IC reads the requested system memory block(s) and sends back their values in the response. Table 43. GET SYSTEM INFORMATION - request format (17h) Flags Command Data 1 CRC-16 5 6 (48) (16) 00(1)00 010111 10(1)00 010111 Table 44. Data 1 40 UID 8 8 with UID 8 8 8 8 8 8 0 0 CRC-16 Description (16) No. of bits system memory block data MSN MFC ICR(1) 0 [1] No. of bits without UID GET SYSTEM INFORMATION - response format Error flag 0 Description 0 0 0 ICR: Hitag μ: 10h, Hitag μ advanced: 20h, Hitag μ advanced+: 30h Error Flag set to ’0’ indicates no error. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 43 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 14.13 LOGIN [P, Advanced, Advanced+] Upon reception of this command without error, the transponder IC compares received password with PWD in memory block (FEh) and if correct it permits write (opt. read) access to the protected memory area (defined in User config, see Table 8) and reports the success of the operation in the response. In case a wrong password is issued in a further login request no access to protected memory blocks will be granted. Default password: FFFFFFFFh Table 45. LOGIN (advanced/advanced+) - request format Flags Command IC MFC Parameter 1 Password CRC-16 Description 5 6 8 (48) 32 (16) No. of bits 00(1)00 101000 MFC - password without UID in READY state 10(1)00 101000 MFC UID password with UID in READY state 01(1)00 101000 MFC - password without UID in SELECTED state IC MFC Parameter 1 Password CRC-16 (16) Table 46. Flags LOGIN (μ) - request format Command Description 5 6 8 (48) 32 00(1)00 101000 MFC - password without UID in READY state 10(1)00 101000 MFC UID password with UID in READY state Table 47. No. of bits Response to a successful LOGIN request Error flag CRC-16 Description 1 (16) No. of bits 0 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 44 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 15. Transponder Talks First (TTF) mode This mode of the HITAG μ transponder enables data transmission to a RWD without sending any command. Every time the transponder IC is activated by the field it starts executing this mode. The transponder in TTF mode sends the data stored in the EEPROM independent if the data is ISO compliant or not. If the transponder IC is configured in TTF mode a SWITCH command or SOF sent by the RWD within the defined listening window sets the transponder into RTF mode. 16. Data integrity/calculation of CRC The following explanations show the features of the HITAG μ protocol to protect read and write access to transponders from undetected errors. The CRC is an 16-bit CRC according to ISO 11785. 16.1 Data transmission: RWD to HITAG μ transponder IC Data stream transmitted by the RWD to the HITAG μ transponder may include an optional 16-bit Cyclic Redundancy Check (CRC-16). The data stream is first verified for data errors by the HITAG μ transponder IC and then executed. The generator polynomial for the CRC-16 is: u16 + u12 + u5+ 1 = 1021h The CRC pre set value is: 0000h 16.2 Data transmission: HITAG μ transponder IC to RWD The HITAG μ transponder calculates the CRC on all received bits of the request. Whether the HITAG μ transponder IC calculated CRC is appended to the response depends on the setting of the CRCT flag. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 45 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 17. Limiting values Table 48. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tstg storage temperature VESD electrostatic discharge voltage JEDEC JESD 22-A114-AB Human Body Model 55 +125 qC r2 - kV Ii(max) maximum input current IN1-IN2  r20 mA Tj junction temperature 40 +85 qC [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated maxima 18. Characteristics Table 49. Characteristics Symbol Parameter foper operating frequency VI input voltage IN1-IN2 II input current IN1-IN2 Ci input capacitance between IN1-IN2 [1] Conditions Min Typ Max Unit 100 125 150 kHz 4 5 6 V - - r10 mA HTMS1x01 [2][3] 203.7 210 216.3 pF HTMS8x01 [2][4] 266 280 294 pF Typical ratings are not guaranteed. Values are at 25 qC. [2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25qC); VIN1-IN2 = 0.5 V (RMS) [3] Integrated Resonance Capacitor: 210pF r3% [4] Integrated Resonance Capacitor: 280pF r5% HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 46 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 19. Marking 19.1 Marking SOT1122 Table 50. Type code HTMS8001FTB/AF 80 HTMS8101FTB/AF 81 HTMS8201FTB/AF 82 Table 51. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Marking SOT1122 Type Pin description SOT1122 Pin Description 1 IN 1 2 IN 2 3 n.c not connected All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 47 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 19.2 Marking HVSON2 Only two lines are available for marking (Figure 20). A:5 B:4 0 3 aaa-004170 Fig 20. Marking overview First line consists on five digits and contains the diffusion lot number. Second line consists on four digits and describes the product type, HTMS8001FTK, HTMS8101FTK or HTMS8201FTK (see example in Table 52). Table 52. Marking example Line Marking Description A 70960 5 digits, Diffusion Lot Number, First letter truncated B HM80 4 digits, Type: Table 53 “Marking HVSON2” Table 53. Marking HVSON2 Type HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Type code HTMS8001FTK/AF HM80 HTMS8101FTK/AF HM81 HTMS8201FTK/AF HM82 All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 48 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 20. Package outline XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm b SOT1122 b1 1 4× (2) L1 3 L e 2 e1 e1 4× A (2) A1 D type code E terminal 1 index area pin 1 indication 0 1 Dimensions Unit A(1) max 0.50 nom min mm 2 mm scale A1 b b1 D E 0.04 0.45 0.40 0.37 0.55 0.50 0.47 1.50 1.45 1.40 1.05 1.00 0.95 e e1 L 0.35 0.55 0.425 0.30 0.27 L1 0.30 0.25 0.22 Notes 1. Dimension A is including plating thickness. 2. Can be visible in some manufacturing processes. Outline version sot1122_po References IEC SOT1122 JEDEC JEITA European projection Issue date 09-10-09 MO-252 Fig 21. Package outline SOT1122 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 49 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC HVSON2: plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 × 2 × 0.85 mm D SOT899-1 A B A E A1 detail X terminal 1 index area C ∅v ∅w b terminal 1 index area M M y1 C C A B C y 1 L e Eh 2 X Dh 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D Dh E Eh e L v w y y1 mm 1 0.05 0 0.9 0.7 2.1 1.9 1.35 1.05 3.1 2.9 1.35 1.05 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.75 mm maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-02-25 05-05-09 SOT899-1 Fig 22. Package outline HVSON2 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 50 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 21. Abbreviations Table 54. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Abbreviations Abbreviation Definition AC Anticollision Code ASK Amplitude Shift Keying BC Bi-phase Code BPLC Binary Pulse Length Coding CRC Cyclic Redundancy Check DSFID Data Storage Format Identifier EEPROM Electrically Erasable Programmable Read-Only Memory EOF End Of Frame IC Integrated Circuit ICR Integrated Circuit Reference number LSB Least Significant Bit LSByte Least Significant Byte m Modulation Index MC Manchester Code MFC integrated circuit Manufacturer Code MSB Most Significant Bit MSByte Most Significant Byte MSN Manufacturer Serial Number NA No Access NOB Number Of Block NOP Number Of Pages NOS Number Of Slots NSS Number Of Sensors OTP One Time Programmable PID Product Identifier PWD Password RF Radio Frequency RFU Reserved for Future Use RND Random Number RO Read Only RTF Reader Talks First R/W Read/Write RWD Read Write Device SOF Start of Frame TTF Transponder Talks First UID Unique IDentifier All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 51 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 22. References 1. [1] Application note — AN10214, HITAG Coil Design Guide, Transponder IC BU-ID Doc.No.: 0814**1 [2] General specification for 8” wafer on UV-tape with electronic fail die marking — Delivery type description, BU-ID Doc.No.: 1093**1 ** ... document version number HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 52 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 23. Revision history Table 55: Revision history Document ID Release date Data sheet status Change notice Supersedes HTMS1x01_8x01 v. 3.4 20150521 Product data sheet - HTMS1x01_8x01 v. 3.3 Modifications: HTMS1x01_8x01 v. 3.3 Modifications: HTMS1x01_8x01 v. 3.2 Modifications: 152931 Modifications: 152930 Modifications: 152912 Modifications: 152911 Modifications: 152910 HTMS1x01_8x01 Product data sheet COMPANY PUBLIC • • • • Section 5 “Ordering information”: 210 pF product versions removed Section 14.12 Table 44 “GET SYSTEM INFORMATION - response format”: ICR codes added Section 19.1 Table 50 “Marking SOT1122”: 210 pF product versions removed Section 19.2 Table 53 “Marking HVSON2”: update and 210 pF product versions removed 20141017 • - HTMS1x01_8x01 v. 3.2 Section 24 “Legal information”: License statement “ICs with HITAG functionality” removed 20120703 • • • Product data sheet Product data sheet - H152931_HITAGμ Section 9.2 “Memory configuration”: updated Section 14.9 “LOCK BLOCK”: updated Some modifications done to comply with HTMS1x01_HTSMS8x01 short data sheet 20100114 Product data sheet • • Section 6 “Ordering information”: updated • A number of tables have been redesigned. 152930 Section 10 “Mechanical specification”, Section 21 “Marking” and Section 22 “Package outline”: added 20090716 Product data sheet 152912 • • Section 3.6 “Delivery types”: remove delivery types • • • • Section 15.2 “State diagram HITAG m advanced/advanced+”: Note added Section 6 “Ordering information”: remove delivery types SOT1122 and SOT732-1 Section 19 “Limiting values”: move input current to table 42 Section 17 “Package outline”: removed Section 20 “Legal information”: update 20090619 • • 152911 General update The drawings have been redesigned to comply with the new identity guidelines of NXP Semiconductors. 20090225 • Objective data sheet Objective data sheet - 152910 Objective data sheet - - General update 20090114 All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 53 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 24. Legal information 24.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 24.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 24.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. HTMS1x01_8x01 Product data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 54 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 24.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. HITAG — is a trademark of NXP Semiconductors N.V. 25. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 55 of 57 HTMS1x01; HTMS8x01 NXP Semiconductors HITAG μ transponder IC 26. Contents 1 1.1 1.1.1 1.1.2 1.1.3 1.1.4 2 2.1 2.2 2.3 2.4 2.5 2.6 3 4 5 6 7 8 8.1 8.1.1 8.1.2 9 9.1 9.1.1 9.1.2 9.1.3 9.2 10 11 11.1 11.2 11.2.1 11.3 11.3.1 11.3.2 11.3.3 11.3.4 11.4 11.4.1 11.4.2 11.4.3 12 General description . . . . . . . . . . . . . . . . . . . . . . 1 Target markets . . . . . . . . . . . . . . . . . . . . . . . . . 1 Animal identification . . . . . . . . . . . . . . . . . . . . . 1 Laundry automation . . . . . . . . . . . . . . . . . . . . . 1 Beer keg and gas cylinder logistic . . . . . . . . . . 2 Brand protection . . . . . . . . . . . . . . . . . . . . . . . 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Supported standards . . . . . . . . . . . . . . . . . . . . 2 Security features. . . . . . . . . . . . . . . . . . . . . . . . 3 Delivery types . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 Mechanical specification . . . . . . . . . . . . . . . . . 8 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8 Fail die identification . . . . . . . . . . . . . . . . . . . . 9 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9 Functional description . . . . . . . . . . . . . . . . . . 10 Memory organization . . . . . . . . . . . . . . . . . . . 10 Memory organization HITAG m transponder ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Memory organization HITAG μ Advanced . . . 11 Memory organization HITAG μ Advanced + . . 12 Memory configuration . . . . . . . . . . . . . . . . . . . 13 General requirements . . . . . . . . . . . . . . . . . . . 14 HITAG m transponder IC air interface . . . . . . 14 Downlink description. . . . . . . . . . . . . . . . . . . . 14 Mode switching protocol . . . . . . . . . . . . . . . . . 16 SWITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Downlink communication signal interface - RWD to HITAG μ transponder IC . . . . . . . . . 18 Modulation parameters . . . . . . . . . . . . . . . . . . 18 Data rate and data coding . . . . . . . . . . . . . . . 19 RWD - Start of frame pattern . . . . . . . . . . . . . 20 RWD - End of frame pattern . . . . . . . . . . . . . . 20 Communication signal interface - HITAG μ transponder IC to RWD . . . . . . . . . . . . . . . . . 21 Data rate and data coding . . . . . . . . . . . . . . . 21 Start of frame pattern . . . . . . . . . . . . . . . . . . . 22 End of frame pattern . . . . . . . . . . . . . . . . . . . . 22 General protocol timing specification . . . . . . 23 12.1 Waiting time before transmitting a response after an EOF from the RWD. . . . . . . . . . . . . . 23 12.2 RWD waiting time before sending a subsequent request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.3 RWD waiting time before switching to next inventory slot . . . . . . . . . . . . . . . . . . . . . . . . . 24 12.3.1 RWD started to receive one or more HITAG μ transponder IC responses . . . . . . . . . . . . . . . 24 12.3.2 RWD receives no HITAG μ transponder IC response . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 13 State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 26 13.1 General description of states . . . . . . . . . . . . . 26 13.2 State diagram HITAG m advanced/advanced+ 27 13.3 State diagram HITAG m . . . . . . . . . . . . . . . . . 28 13.4 Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 13.4.1 ISO 11785 Mode . . . . . . . . . . . . . . . . . . . . . . 29 13.4.2 RTF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 13.4.3 Anticollision . . . . . . . . . . . . . . . . . . . . . . . . . . 29 13.4.3.1 Anticollision with 1 slot . . . . . . . . . . . . . . . . . . 29 13.4.3.2 Anticollision with 16 slots . . . . . . . . . . . . . . . . 30 14 Command set . . . . . . . . . . . . . . . . . . . . . . . . . 31 14.1 Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 14.2 Error handling . . . . . . . . . . . . . . . . . . . . . . . . 33 14.3 INVENTORY . . . . . . . . . . . . . . . . . . . . . . . . . 34 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 34 14.4 INVENTORY ISO 11785 . . . . . . . . . . . . . . . . 35 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 35 14.5 STAY QUIET . . . . . . . . . . . . . . . . . . . . . . . . . 35 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 35 14.6 READ UID . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 [m, Advanced, Advanced+] . . . . . . . . . . . . . . . 36 14.7 READ MULTIPLE BLOCK . . . . . . . . . . . . . . . 37 [m, Advanced, Advanced+] . . . . . . . . . . . . . . . 37 14.7.1 READ MULTIPLE BLOCKS in INVENTORY mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 38 14.8 WRITE SINGLE BLOCK . . . . . . . . . . . . . . . . 39 [m, Advanced, Advanced+] . . . . . . . . . . . . . . . 39 14.9 LOCK BLOCK . . . . . . . . . . . . . . . . . . . . . . . . 40 [m, Advanced, Advanced+] . . . . . . . . . . . . . . . 40 14.10 SELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 41 14.11 WRITE ISO 11785 (custom command) . . . . . 42 [m, Advanced, Advanced+] . . . . . . . . . . . . . . . 42 14.12 GET SYSTEM INFORMATION . . . . . . . . . . . 43 [Advanced, Advanced+] . . . . . . . . . . . . . . . . . . 43 14.13 LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 continued >> HTMS1x01_8x01 Product data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.4 — 21 May 2015 152934 © NXP Semiconductors N.V. 2015. All rights reserved. 56 of 57 NXP Semiconductors HTMS1x01; HTMS8x01 HITAG μ transponder IC 15 16 16.1 16.2 17 18 19 19.1 19.2 20 21 22 23 24 24.1 24.2 24.3 24.4 25 26 [m, Advanced, Advanced+]. . . . . . . . . . . . . . . .44 Transponder Talks First (TTF) mode . . . . . . . 45 Data integrity/calculation of CRC . . . . . . . . . . 45 Data transmission: RWD to HITAG μ transponder IC . . . . . . . . . . . . . . . . . . . . . . . . 45 Data transmission: HITAG μ transponder IC to RWD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 46 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 46 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Marking SOT1122. . . . . . . . . . . . . . . . . . . . . . 47 Marking HVSON2 . . . . . . . . . . . . . . . . . . . . . . 48 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 49 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 51 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 53 Legal information. . . . . . . . . . . . . . . . . . . . . . . 54 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 54 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Contact information. . . . . . . . . . . . . . . . . . . . . 55 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 May 2015 152934