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KMPC859PZP133A

KMPC859PZP133A

  • 厂商:

    NXP(恩智浦)

  • 封装:

    BBGA357

  • 描述:

    IC MPU MPC8XX 133MHZ 357BGA

  • 数据手册
  • 价格&库存
KMPC859PZP133A 数据手册
Freescale Semiconductor MPC866EC Rev. 2, 2/2006 Technical Data MPC866/MPC859 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC866/859 family (refer to Table 1 for a list of devices). The MPC866P is the superset device of the MPC866/859 family.This document describes pertinent electrical and physical characteristics of the MPC8245. For functional characteristics of the processor, refer to the MPC866 PowerQUICC Family Users Manual (MPC866UM/D). 1 Overview The MPC866/859 is a derivative of Freescale’s MPC860 PowerQUICC™ family of devices. It is a versatile single-chip integrated microprocessor and peripheral combination that can be used in a variety of controller applications and communications and networking systems. The MPC866/859/859DSL provides enhanced ATM functionality over that of other ATM-enabled members of the MPC860 family. © Freescale Semiconductor, Inc., 2006. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 8 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Calculation and Measurement . . . . . . . . . . 12 Power Supply and Power Sequencing . . . . . . . . . . . 15 Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 16 IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 46 CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 48 UTOPIA AC Electrical Specifications . . . . . . . . . . . 72 FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 74 Mechanical Data and Ordering Information . . . . . . . 78 Document Revision History . . . . . . . . . . . . . . . . . . . 93 Features Table 1 shows the functionality supported by the members of the MPC866/859 family. 2 Features Table 1. MPC866 Family Functionality Cache Ethernet Part SCC SMC 1 4 2 Up to 4 1 4 2 8 Kbytes 1 1 1 2 4 Kbytes 1 1 1 2 12 1 Instruction Data 10T 10/100 MPC866P 16 Kbytes 8 Kbytes Up to 4 MPC866T 4 Kbytes 4 Kbytes MPC859P 16 Kbytes MPC859T 4 Kbytes MPC859DSL 4 Kbytes 4 Kbytes 1 1 11 MPC852T 3 4 KBytes 4 Kbytes 2 1 2 1 On the MPC859DSL, the SCC (SCC1) is for ethernet only. Also, the MPC859DSL does not support the Time Slot Assigner (TSA). 2 On the MPC859DSL, the SMC (SMC1) is for UART only. 3 For more details on the MPC852T, please refer to the MPC852T Hardware Specifications. The following list summarizes the key MPC866/859 features: • • Embedded single-issue, 32-bit PowerPC™ core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs) — The core performs branch prediction with conditional prefetch, without conditional execution — 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1) – 16-Kbyte instruction cache (MPC866P and MPC859P) is four-way, set-associative with 256 sets; 4-Kbyte instruction cache (MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative with 128 sets. – 8-Kbyte data cache (MPC866P and MPC859P) is two-way, set-associative with 256 sets; 4-Kbyte data cache(MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative with 128 sets. – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis. — MMUs with 32-entry TLB, fully associative instruction and data TLBs — MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces and 16 protection groups. — Advanced on-chip-emulation debug mode The MPC866/859 provides enhanced ATM functionality over that of the MPC860SAR. The MPC866/859 adds major new features available in 'enhanced SAR' (ESAR) mode, including the following: — Improved operation, administration, and maintenance (OAM) support — OAM performance monitoring (PM) support — Multiple APC priority levels available to support a range of traffic pace requirements MPC866/MPC859 Hardware Specifications, Rev. 2 2 Freescale Semiconductor Features — — — — • • • • • • ATM port-to-port switching capability without the need for RAM-based microcode Simultaneous MII (10/100Base-T) and UTOPIA (half-duplex) capability Optional statistical cell counters per PHY UTOPIA level 2 compliant interface with added FIFO buffering to reduce the total cell transmission time. (The earlier UTOPIA level 1 specification is also supported.) – Multi-PHY support on the MPC866, MPC859P, and MPC859T – Four PHY support on the MPC866/859 — Parameter RAM for both SPI and I2C can be relocated without RAM-based microcode — Supports full-duplex UTOPIA both master (ATM side) and slave (PHY side) operation using a 'split' bus — AAL2/VBR functionality is ROM-resident. Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits) Thirty-two address lines Memory controller (eight banks) — Contains complete dynamic RAM (DRAM) controller — Each bank can be a chip select or RAS to support a DRAM bank — Up to 30 wait states programmable per memory bank — Glueless interface to page mode/EDO/SDRAM, SRAM, EPROMs, flash EPROMs, and other memory devices. — DRAM controller programmable to support most size and speed memory interfaces — Four CAS lines, four WE lines, and one OE line — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory) — Variable block sizes (32 Kbytes–256 Mbytes) — Selectable write protection — On-chip bus arbitration logic General-purpose timers — Four 16-bit timers cascadable to be two 32-bit timers — Gate mode can enable/disable counting — Interrupt can be masked on reference match and event capture Fast Ethernet controller (FEC) — Simultaneous MII (10/100Base-T) and UTOPIA operation when using the UTOPIA multiplexed bus System integration unit (SIU) — Bus monitor — Software watchdog — Periodic interrupt timer (PIT) — Low-power stop mode — Clock synthesizer — Decrementer and time base from the PowerPC architecture — Reset controller — IEEE 1149.1 test access port (JTAG) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 3 Features • • • • • Interrupts — Seven external interrupt request (IRQ) lines — Twelve port pins with interrupt capability — The MPC866P and MPC866T have 23 internal interrupt sources; the MPC859P, MPC859T, and MPC859DSL have 20 internal interrupt sources. — Programmable priority between SCCs (MPC866P and MPC866T) — Programmable highest priority request Communications processor module (CPM) — RISC controller — Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and RESTART TRANSMIT) — Supports continuous mode transmission and reception on all serial channels — Up to 8-Kbytes of dual-port RAM — MPC866P and MPC866T have 16 serial DMA (SDMA) channels; MPC859P, MPC859T, and MPC859DSL have 10 serial DMA (SDMA) channels. — Three parallel I/O registers with open-drain capability Four baud rate generators — Independent (can be connected to any SCC or SMC) — Allow changes during operation — Autobaud support option MPC866P and MPC866T have four SCCs (serial communication controller); MPC859P, MPC859T, and MPC859DSL have one SCC; and SCC1 on MPC859DSL supports Ethernet only. — Serial ATM capability on all SCCs — Optional UTOPIA port on SCC4 — Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation — HDLC/SDLC — HDLC bus (implements an HDLC-based local area network (LAN)) — Asynchronous HDLC to support PPP (point-to-point protocol) — AppleTalk — Universal asynchronous receiver transmitter (UART) — Synchronous UART — Serial infrared (IrDA) — Binary synchronous communication (BISYNC) — Totally transparent (bit streams) — Totally transparent (frame based with optional cyclic redundancy check (CRC) Two SMCs (serial management channels) (MPC859DSL has one SMC (SMC1) for UART.) — UART — Transparent — General circuit interface (GCI) controller — Can be connected to the time-division multiplexed (TDM) channels MPC866/MPC859 Hardware Specifications, Rev. 2 4 Freescale Semiconductor Features • • • • • • • • • • One serial peripheral interface (SPI) — Supports master and slave modes — Supports multiple-master operation on the same bus One inter-integrated circuit (I2C) port — Supports master and slave modes — Multiple-master environment support Time slot assigner (TSA) (MPC859DSL does not have TSA.) — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user-defined — 1- or 8-bit resolution — Allows independent transmit and receive routing, frame synchronization, and clocking — Allows dynamic changes — On MPC866P and MPC866T, can be internally connected to six serial channels (four SCCs and two SMCs); on MPC859P and MPC859T, can be connected to three serial channels (one SCC and two SMCs). Parallel interface port (PIP) — Centronics interface support — Supports fast connection between compatible ports on MPC866/859 or MC68360 PCMCIA interface — Master (socket) interface, compliant with PCI Local Bus Specification (Rev 2.1) — Supports one or two PCMCIA sockets whether ESAR functionality is enabled — Eight memory or I/O windows supported Debug interface — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data. — Supports conditions: = ≠ < > — Each watchpoint can generate a breakpoint internally Normal high and normal low power modes to conserve power 1.8 V core and 3.3 V I/O operation with 5-V TTL compatibility; refer to Table 6 for a listing of the 5-V tolerant pins. 357-pin plastic ball grid array (PBGA) package Operation up to 133 MHz MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 5 Features The MPC866/859 is comprised of three modules that each use a 32-bit internal bus: MPC8xx core, system integration unit (SIU), and communication processor module (CPM). The MPC866P block diagram is shown in Figure 1. The MPC859P/859T/859DSL block diagram is shown in Figure 2. 16-Kbyte Instruction Cache Instruction Bus Embedded MPC8xx Processor Core System Interface Unit (SIU) Unified Bus Instruction MMU 32-Entry ITLB Load/Store Bus Memory Controller Internal External Bus Interface Bus Interface Unit Unit 8-Kbyte Data Cache System Functions Data MMU 32-Entry DTLB PCMCIA/ATA Interface Fast Ethernet Controller DMAs FIFOs 10/100 Base-T Media Access Control Parallel I/O 4 Timers 4 Baud Rate Generators Parallel Interface Port Timers and UTOPIA Interrupt 8-Kbyte Controllers Dual-Port RAM 32-Bit RISC Controller and Program ROM 16 Virtual Serial and 2 Independent DMA Channels MII SCC1 SCC2 SCC3 SCC4 SMC1 SMC2 SPI I 2C Time TimeSlot Slot Assigner Assigner Serial Interface Figure 1. MPC866P Block Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 6 Freescale Semiconductor Features Instruction Bus Embedded MPC8xx Processor Core 4-Kbyte † Instruction Cache System Interface Unit (SIU) Unified Bus Instruction MMU 32-Entry ITLB Load/Store Bus Memory Controller Internal External Bus Interface Bus Interface Unit Unit 4-Kbyte † Data Cache System Functions Data MMU 32-Entry DTLB PCMCIA/ATA Interface Fast Ethernet Controller DMAs FIFOs 10/100 Base-T Media Access Control Parallel I/O 4 Timers 4 Baud Rate Generators Parallel Interface Port Timers and UTOPIA Interrupt 8-Kbyte Controllers Dual-Port RAM 32-Bit RISC Controller and Program ROM 10 Virtual Serial and 2 Independent DMA Channels MII SCC1 SMC1 SMC2* SPI I2C Time TimeSlot Slot Assigner* Assigner Serial Interface † The MPC859P has a 16-Kbyte instruction cache and a 8-Kbyte data cache. * The MPC859DSL does not contain SMC2 nor the time slot assigner, and provides eight SDMA controllers. Figure 2. MPC859P/859T/MPC859DSL Block Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 7 Maximum Tolerated Ratings 3 Maximum Tolerated Ratings This section provides the maximum tolerated voltage and temperature ranges for the MPC866/859. Table 2 shows the maximum tolerated ratings, and Table 3 shows the operating temperatures. Table 2. Maximum Tolerated Ratings Rating Symbol Supply voltage 1 Value Unit VDDH – 0.3 to 4.0 V VDDL – 0.3 to 2.0 V VDDSYN – 0.3 to 2.0 V 100 mV Difference between VDDL to VDDSYN Input voltage 2 Vin GND – 0.3 to VDDH V Storage temperature range Tstg –55 to +150 °C 1 2 The power supply of the device must start its ramp from 0.0 V. Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage to the device. See page 15. Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than VDDH. This restriction applies to power-up and normal operation (that is, if the MPC866/859 is unpowered, a voltage greater than 2.5 V must not be applied to its inputs). Table 3. Operating Temperatures Rating Temperature 1 (standard) Temperature (extended) 1 Symbol Value Unit TA(min) 0 °C Tj(max) 95 °C TA(min) –40 °C Tj(max) 100 °C Minimum temperatures are guaranteed as ambient temperature, TA. Maximum temperatures are guaranteed as junction temperature, Tj. This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or V DD). MPC866/MPC859 Hardware Specifications, Rev. 2 8 Freescale Semiconductor Thermal Characteristics 4 Thermal Characteristics Table 4 shows the thermal characteristics for the MPC866/859. Table 4. MPC866/859 Thermal Resistance Data Rating Junction-to-ambient 1 Environment Natural Convection Single-layer board (1s) Symbol Value Unit RθJA 2 37 °C/W Four-layer board (2s2p) RθJMA 3 23 Single-layer board (1s) RθJMA3 30 Four-layer board (2s2p) RθJMA3 19 Junction-to-board 4 RθJB 13 5 RθJC 6 Natural Convection ΨJT 2 Airflow (200 ft/min) ΨJT 2 Airflow (200 ft/min) Junction-to-case Junction-to-package top 6 1 2 3 4 5 6 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. Per JEDEC JESD51-6 with the board horizontal. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the exposed pad without contact resistance. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC JESD51-2. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 9 Power Dissipation 5 Power Dissipation Table 5 shows power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1 mode, where CPU frequency is twice the bus speed. Table 5. Power Dissipation (PD) Die Revision Bus Mode CPU Frequency Typical 1 Maximum 2 Unit 0 1:1 50 MHz 110 140 mW 66 MHz 150 180 mW 66 MHz 140 160 mW 80 MHz 170 200 mW 100 MHz 210 250 mW 133 MHz 260 320 mW 2:1 1 2 Typical power dissipation at VDDL and VDDSYN is at 1.8 V. and VDDH is at 3.3 V. Maximum power dissipation at VDDL and VDDSYN is at 1.9 V, and VDDH is at 3.465 V. NOTE Values in Table 5 represent VDDL based power dissipation and do not include I/O power dissipation over VDDH. I/O power dissipation varies widely by application due to buffer current, depending on external circuitry. The VDDSYN power dissipation is negligible. 6 DC Characteristics Table 6 shows the DC electrical characteristics for the MPC866/859. Table 6. DC Electrical Specifications Characteristic Operating voltage Symbol Min Max Unit VDDL (core) 1.7 1.9 V VDDH (I/O) 3.135 3.465 V 1.7 1.9 V Difference between VDDL to VDDSYN — 100 mV VIH 2.0 3.465 V VDDSYN Input high voltage (all inputs except EXTAL and EXTCLK) 2 1 MPC866/MPC859 Hardware Specifications, Rev. 2 10 Freescale Semiconductor DC Characteristics Table 6. DC Electrical Specifications (continued) Characteristic Symbol Min Max Unit GND 0.8 V 0.7*(VDDH) VDDH V Input low voltage VIL EXTAL, EXTCLK input high voltage VIHC Input leakage current, Vin = 5.5V (except TMS, TRST, DSCK and DSDI pins) for 5 Volts Tolerant Pins 2 Iin — 100 µA Input leakage current, Vin = VDDH (except TMS, TRST, DSCK, and DSDI) IIn — 10 µA Input leakage current, Vin = 0 V (except TMS, TRST, DSCK and DSDI pins) IIn — 10 µA Input capacitance 3 Cin — 20 pF Output high voltage, IOH = – 2.0 mA, except XTAL, and Open drain pins VOH 2.4 — V Output low voltage VOL • IOL = 2.0 mA (CLKOUT) • IOL = 3.2 mA 4 • IOL = 5.3 mA 5 • IOL = 7.0 mA (TXD1/PA14, TXD2/PA12) • IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET) — 0.5 V 1 The difference between VDDL and VDDSYN can not be more than 100 m V. The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, MII_MDIO are 5 V tolerant. 3 Input capacitance is periodically sampled. 4 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IP_B(0:1)/IWP(0:1)/VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3, RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9, L1RXDA/PA8, TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5, TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3, BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1, L1TCLKB/TOUT4/CLK8/PA0, REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/PB28, BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/PB23, SMSYN2/SDACK2/PB22, SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19, L1ST2/RTS2/PB18, L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/DREQ0/PC15, L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11, TGATE1/CD1/PC10, CTS2/PC9, TGATE2/CD2/PC8, CTS3/SDACK2/L1TSYNCB/PC7, CD3/L1RSYNCB/PC6, CTS4/SDACK1/L1TSYNCA/PC5, CD4/L1RSYNCA/PC4, PD15/L1TSYNCA, PD14/L1RSYNCA, PD13/L1TSYNCB, PD12/L1RSYNCB, PD11/RXD3, PD10/TXD3, PD9/RXD4, PD8/TXD4, PD5/REJECT2, PD6/RTS4, PD7/RTS3, PD4/REJECT3, PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3]. 5 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD, WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1, GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A, ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30). 2 MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 11 Thermal Calculation and Measurement 7 Thermal Calculation and Measurement For the following discussions, PD = (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers. The VDDSYN power dissipation is negligible. 7.1 Estimation with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation: TJ = TA +(RθJA x PD) where: TA = ambient temperature (ºC) RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ-TA) are possible. 7.2 Estimation with Junction-to-Case Thermal Resistance Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (ºC/W) RθJC = junction-to-case thermal resistance (ºC/W) RθCA = case-to-ambient thermal resistance (ºC/W) RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required. 7.3 Estimation with Junction-to-Board Thermal Resistance A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed-circuit board. It has been observed that the thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the board temperature; see Figure 3. MPC866/MPC859 Hardware Specifications, Rev. 2 12 Freescale Semiconductor Thermal Calculation and Measurement Figure 3. Effect of Board Temperature Rise on Thermal Behavior If the board temperature is known, an estimate of the junction temperature in the environment can be made using the following equation: TJ = TB +(RθJB x PD) where: RθJB = junction-to-board thermal resistance (ºC/W) TB = board temperature ºC PD = power dissipation in package If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. For this method to work, the board and board mounting must be similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a power and a ground plane) and vias attaching the thermal balls to the ground plane. 7.4 Estimation Using Simulation When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the package can be used in the thermal simulation. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 13 Thermal Calculation and Measurement 7.5 Experimental Determination To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT +(ΨJT x PD) where: ΨJT = thermal characterization parameter TT = thermocouple temperature on top of package PD = power dissipation in package The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 7.6 References Semiconductor Equipment and Materials International(415) 964-5111 805 East Middlefield Rd. Mountain View, CA 94043 MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or (Available from Global Engineering Documents)303-397-7956 JEDEC Specifications http://www.jedec.org 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54. 2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220. MPC866/MPC859 Hardware Specifications, Rev. 2 14 Freescale Semiconductor Power Supply and Power Sequencing 8 Power Supply and Power Sequencing This section provides design considerations for the MPC866/859 power supply. The MPC866/859 has a core voltage (VDDL) and PLL voltage (VDDSYN) that operates at a lower voltage than the I/O voltage VDDH. The I/O section of the MPC866/859 is supplied with 3.3 V across VDDH and VSS (GND). Signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, and MII_MDIO are 5-V tolerant. All inputs cannot be more than 2.5 V greater than VDDH. In addition, 5-V tolerant pins cannot exceed 5.5 V and the remaining input pins cannot exceed 3.465 V. This restriction applies to power up/down and normal operation. One consequence of multiple power supplies is that when power is initially applied the voltage rails ramp up at different rates. The rates depend on the nature of the power supply, the type of load on each power supply, and the manner in which different voltages are derived. The following restrictions apply: • • VDDL must not exceed VDDH during power up and power down. VDDL must not exceed 1.9 V and VDDH must not exceed 3.465 V. These cautions are necessary for the long term reliability of the part. If they are violated, the electrostatic discharge (ESD) protection diodes are forward-biased and excessive current can flow through these diodes. If the system power supply design does not control the voltage sequencing, the circuit shown in Figure 4 can be added to meet these requirements. The MUR420 Schottky diodes control the maximum potential difference between the external bus and core power supplies on powerup and the 1N5820 diodes regulate the maximum potential difference on powerdown. VDDH VDDL MUR420 1N5820 Figure 4. Example Voltage Sequencing Circuit 9 Layout Practices Each VDD pin on the MPC866/859 should be provided with a low-impedance path to the board’s supply. Furthermore, each GND pin should be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on chip. The VDD power supply should be bypassed to ground using at least four 0.1 µF bypass capacitors located as close as possible to the four sides of the package. Each board designed should be characterized and additional appropriate decoupling capacitors should be used if required. The capacitor leads and associated printed-circuit traces connecting to chip V DD and GND should be kept to less than 1/2” per capacitor lead. At a minimum, a four-layer board employing two inner layers as VDD and GND planes should be used. All output pins on the MPC866/859 have fast rise and fall times. Printed-circuit (PC) trace interconnection length should be minimized in order to minimize undershoot and reflections caused by these fast output switching times. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 15 Bus Signal Timing This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of 6” are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. For more information, please refer to Section 14.4.3, Clock Synthesizer Power (VDDSYN, VSSSYN, VSSSYN1), in the MPC866 User’s Manual. 10 Bus Signal Timing The maximum bus speed supported by the MPC866/859 is 66 MHz. Higher-speed parts must be operated in half-speed bus mode (for example, an MPC866/859 used at 100 MHz must be configured for a 50-MHz bus). Table 7 and Table 8 show the frequency ranges for standard part frequencies. Table 7. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode) Part Freq 50 MHz 66 MHz Min Max Min Max Core 40 50 40 66.67 Bus 40 50 40 66.67 Table 8. Frequency Ranges for Standard Part Frequencies (2:1 Bus Mode) Part Freq 50 MHz 66 MHz 100 MHz 133 MHz Min Max Min Max Min Max Min Max Core 40 50 40 66.67 40 100 40 133.34 Bus 20 25 20 33.33 20 50 20 66.67 Table 9 shows the timings for the MPC866/859 at 33, 40, 50, and 66 MHz bus operation. The timing for the MPC866/859 bus shown in this table assumes a 50-pF load for maximum delays and a 0-pF load for minimum delays. CLKOUT assumes a 100-pF load maximum delay. Table 9. Bus Operation Timings 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B1 Bus Period (CLKOUT) See Table 7 — — — — — — — — ns B1a EXTCLK to CLKOUT phase skew –2 +2 –2 +2 –2 +2 –2 +2 ns B1b CLKOUT frequency jitter peak-to-peak — 1 — 1 — 1 — 1 ns B1c Frequency jitter on EXTCLK — 0.50 — 0.50 — 0.50 — 0.50 % MPC866/MPC859 Hardware Specifications, Rev. 2 16 Freescale Semiconductor Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num B1d 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max CLKOUT phase jitter peak-to-peak for OSCLK ≥ 15 MHz — 4 — 4 — 4 — 4 ns CLKOUT phase jitter peak-to-peak for OSCLK < 15 MHz — 5 — 5 — 5 — 5 ns B2 CLKOUT pulse width low (MIN = 0.4 x B1, MAX = 0.6 x B1) 12.1 18.2 10.0 15.0 8.0 12.0 6.1 9.1 ns B3 CLKOUT pulse width high (MIN = 0.4 x B1, MAX = 0.6 x B1) 12.1 18.2 10.0 15.0 8.0 12.0 6.1 9.1 ns B4 CLKOUT rise time — 4.00 — 4.00 — 4.00 — 4.00 ns B5 CLKOUT fall time — 4.00 — 4.00 — 4.00 — 4.00 ns B7 CLKOUT to A(0:31), BADDR(28:30), RD/WR, BURST, D(0:31), DP(0:3) output hold (MIN = 0.25 x B1) 7.60 — 6.30 — 5.00 — 3.80 — ns B7a CLKOUT to TSIZ(0:1), REG, RSV, AT(0:3), BDIP, PTR output hold (MIN = 0.25 x B1) 7.60 — 6.30 — 5.00 — 3.80 — ns B7b CLKOUT to BR, BG, FRZ, VFLS(0:1), VF(0:2), IWP(0:2), LWP(0:1), STS output hold (MIN = 0.25 x B1) 7.60 — 6.30 — 5.00 — 3.80 — ns B8 CLKOUT to A(0:31), BADDR(28:30) RD/WR, BURST, D(0:31), DP(0:3), valid (MAX = 0.25 x B1 + 6.3) — 13.80 — 12.50 — 11.30 — 10.00 ns B8a CLKOUT to TSIZ(0:1), REG, RSV, AT(0:3), BDIP, PTR valid (MAX = 0.25 x B1 + 6.3) — 13.80 — 12.50 — 11.30 — 10.00 ns B8b CLKOUT to BR, BG, VFLS(0:1), VF(0:2), IWP(0:2), FRZ, LWP(0:1), STS valid 4 (MAX = 0.25 x B1 + 6.3) — 13.80 — 12.50 — 11.30 — 10.00 ns B9 CLKOUT to A(0:31), BADDR(28:30), RD/WR, BURST, D(0:31), DP(0:3), TSIZ(0:1), REG, RSV, AT(0:3), PTR High-Z (MAX = 0.25 x B1 + 6.3) 7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns B11 CLKOUT to TS, BB assertion (MAX = 0.25 x B1 + 6.0) 7.60 13.60 6.30 12.30 5.00 11.00 3.80 9.80 ns B11a CLKOUT to TA, BI assertion (when driven by the memory controller or PCMCIA interface) (MAX = 0.00 x B1 + 9.30 1) 2.50 9.30 2.50 9.30 2.50 9.30 2.50 9.80 ns B12 7.60 12.30 6.30 11.00 5.00 9.80 3.80 8.50 ns CLKOUT to TS, BB negation (MAX = 0.25 x B1 + 4.8) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 17 Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B12a CLKOUT to TA, BI negation (when driven by the memory controller or PCMCIA interface) (MAX = 0.00 x B1 + 9.00) 2.50 9.00 2.50 9.00 2.50 9.00 2.50 9.00 ns B13 CLKOUT to TS, BB High-Z (MIN = 0.25 x B1) 7.60 21.60 6.30 20.30 5.00 19.00 3.80 14.00 ns B13a CLKOUT to TA, BI High-Z (when driven by the memory controller or PCMCIA interface) (MIN = 0.00 x B1 + 2.5) 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns B14 CLKOUT to TEA assertion (MAX = 0.00 x B1 + 9.00) 2.50 9.00 2.50 9.00 2.50 9.00 2.50 9.00 ns B15 CLKOUT to TEA High-Z (MIN = 0.00 x B1 + 2.50) 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns B16 TA, BI valid to CLKOUT (setup time) (MIN = 0.00 x B1 + 6.00) 6.00 — 6.00 — 6.00 — 6.00 — ns B16a TEA, KR, RETRY, CR valid to CLKOUT (setup time) (MIN = 0.00 x B1 + 4.5) 4.50 — 4.50 — 4.50 — 4.50 — ns B16b BB, BG, BR, valid to CLKOUT (setup time) 2 (4 MIN = 0.00 x B1 + 0.00 ) 4.00 — 4.00 — 4.00 — 4.00 — ns B17 1.00 — 1.00 — 1.00 — 2.00 — ns B17a CLKOUT to KR, RETRY, CR valid (hold time) (MIN = 0.00 x B1 + 2.00) 2.00 — 2.00 — 2.00 — 2.00 — ns B18 D(0:31), DP(0:3) valid to CLKOUT rising edge (setup time) 4 (MIN = 0.00 x B1 + 6.00) 6.00 — 6.00 — 6.00 — 6.00 — ns B19 CLKOUT rising edge to D(0:31), DP(0:3) valid (hold time) 4 (MIN = 0.00 x B1 + 1.00 5) 1.00 — 1.00 — 1.00 — 2.00 — ns B20 D(0:31), DP(0:3) valid to CLKOUT falling edge (setup time) 6(MIN = 0.00 x B1 + 4.00) 4.00 — 4.00 — 4.00 — 4.00 — ns B21 CLKOUT falling edge to D(0:31), DP(0:3) valid (hold Time) 6 (MIN = 0.00 x B1 + 2.00) 2.00 — 2.00 — 2.00 — 2.00 — ns B22 CLKOUT rising edge to CS asserted GPCM ACS = 00 (MAX = 0.25 x B1 + 6.3) 7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns — 8.00 — 8.00 — 8.00 — 8.00 ns CLKOUT to TA, TEA, BI, BB, BG, BR valid (hold time) (MIN = 0.00 x B1 + 1.00 3) B22a CLKOUT falling edge to CS asserted GPCM ACS = 10, TRLX = 0 (MAX = 0.00 x B1 + 8.00) MPC866/MPC859 Hardware Specifications, Rev. 2 18 Freescale Semiconductor Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B22b CLKOUT falling edge to CS asserted GPCM ACS = 11, TRLX = 0, EBDF = 0 (MAX = 0.25 x B1 + 6.3) 7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns B22c CLKOUT falling edge to CS asserted GPCM ACS = 11, TRLX = 0, EBDF = 1 (MAX = 0.375 x B1 + 6.6) 10.90 18.00 10.90 16.00 7.00 14.10 5.20 12.30 ns B23 CLKOUT rising edge to CS negated GPCM read access, GPCM write access ACS = 00, TRLX = 0 & CSNT = 0 (MAX = 0.00 x B1 + 8.00) 2.00 8.00 2.00 8.00 2.00 8.00 2.00 8.00 ns B24 A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 10, TRLX = 0 (MIN = 0.25 x B1 - 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B24a A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 11, TRLX = 0 (MIN = 0.50 x B1 - 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B25 CLKOUT rising edge to OE, WE(0:3) asserted (MAX = 0.00 x B1 + 9.00) — 9.00 — 9.00 — 9.00 — 9.00 ns B26 CLKOUT rising edge to OE negated (MAX = 0.00 x B1 + 9.00) 2.00 9.00 2.00 9.00 2.00 9.00 2.00 9.00 ns B27 A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 10, TRLX = 1 (MIN = 1.25 x B1 - 2.00) 35.90 — 29.30 — 23.00 — 16.90 — ns B27a A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 11, TRLX = 1 (MIN = 1.50 x B1 - 2.00) 43.50 — 35.50 — 28.00 — 20.70 — ns — 9.00 — 9.00 — 9.00 — 9.00 ns 7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns — 14.30 — 13.00 — 11.80 — 10.50 ns 10.90 18.00 10.90 18.00 7.00 14.30 5.20 12.30 ns B28 CLKOUT rising edge to WE(0:3) negated GPCM write access CSNT = 0 (MAX = 0.00 x B1 + 9.00) B28a CLKOUT falling edge to WE(0:3) negated GPCM write access TRLX = 0,1, CSNT = 1, EBDF = 0 (MAX = 0.25 x B1 + 6.80) B28b CLKOUT falling edge to CS negated GPCM write access TRLX = 0,1, CSNT = 1, ACS = 10 or ACS = 11, EBDF = 0 (MAX = 0.25 x B1 + 6.80) B28c CLKOUT falling edge to WE(0:3) negated GPCM write access TRLX = 0, CSNT = 1 write access TRLX = 0,1, CSNT = 1, EBDF = 1 (MAX = 0.375 x B1 + 6.6) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 19 Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max — 18.00 — 18.00 — 14.30 — 12.30 ns WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, CSNT = 0, EBDF = 0 (MIN = 0.25 x B1 - 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B29a WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, EBDF = 0 (MIN = 0.50 x B1 – 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B29b CS negated to D(0:31), DP(0:3), High Z GPCM write access, ACS = 00, TRLX = 0,1 & CSNT = 0 (MIN = 0.25 x B1– 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B29c CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 (MIN = 0.50 x B1 – 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B29d WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, EBDF = 0 (MIN = 1.50 x B1 – 2.00) 43.50 — 35.50 — 28.00 — 20.70 — ns B29e CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 (MIN = 1.50 x B1 – 2.00) 43.50 — 35.50 — 28.00 — 20.70 — ns B29f WE(0:3) negated to D(0:31), DP(0:3) High Z GPCM write access, TRLX = 0, CSNT = 1, EBDF = 1 (MIN = 0.375 x B1 – 6.30) 5.00 — 3.00 — 1.10 — 0.00 — ns B29g CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1 ACS = 10 or ACS = 11, EBDF = 1 (MIN = 0.375 x B1 – 6.30) 5.00 — 3.00 — 1.10 — 0.00 — ns B29h WE(0:3) negated to D(0:31), DP(0:3) High Z GPCM write access, TRLX = 1, CSNT = 1, EBDF = 1 (MIN = 0.375 x B1 – 3.30) 38.40 — 31.10 — 24.20 — 17.50 — ns B29i CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, ACS = 10 or ACS = 11, EBDF = 1 (MIN = 0.375 x B1 – 3.30) 38.40 — 31.10 — 24.20 — 17.50 — ns B28d CLKOUT falling edge to CS negated GPCM write access TRLX = 0,1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 1 (MAX = 0.375 x B1 + 6.6) B29 MPC866/MPC859 Hardware Specifications, Rev. 2 20 Freescale Semiconductor Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max 5.60 — 4.30 — 3.00 — 1.80 — ns B30a WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM, write access, TRLX = 0, CSNT = 1, CS negated to A(0:31) invalid GPCM write access TRLX = 0, CSNT =1 ACS = 10, or ACS == 11, EBDF = 0 (MIN = 0.50 x B1 – 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B30b WE(0:3) negated to A(0:31) invalid GPCM BADDR(28:30) invalid GPCM write access, TRLX = 1, CSNT = 1. CS negated to A(0:31) invalid GPCM write access TRLX = 1, CSNT = 1, ACS = 10, or ACS == 11 EBDF = 0 (MIN = 1.50 x B1 – 2.00) 43.50 — 35.50 — 28.00 — 20.70 — ns B30c WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access, TRLX = 0, CSNT = 1. CS negated to A(0:31) invalid GPCM write access, TRLX = 0, CSNT = 1 ACS = 10, ACS == 11, EBDF = 1 (MIN = 0.375 x B1 – 3.00) 8.40 — 6.40 — 4.50 — 2.70 — ns B30d WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access TRLX = 1, CSNT =1, CS negated to A(0:31) invalid GPCM write access TRLX = 1, CSNT = 1, ACS = 10 or 11, EBDF = 1 38.67 — 31.38 — 24.50 — 17.83 — ns B31 CLKOUT falling edge to CS valid, as requested by control bit CST4 in the corresponding word in the UPM (MAX = 0.00 X B1 + 6.00) 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns B31a CLKOUT falling edge to CS valid, as requested by control bit CST1 in the corresponding word in the UPM (MAX = 0.25 x B1 + 6.80) 7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns B31b CLKOUT rising edge to CS valid, as requested by control bit CST2 in the corresponding word in the UPM (MAX = 0.00 x B1 + 8.00) 1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00 ns B31c CLKOUT rising edge to CS valid, as requested by control bit CST3 in the corresponding word in the UPM (MAX = 0.25 x B1 + 6.30) 7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns B30 CS, WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access 7 (MIN = 0.25 x B1 – 2.00) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 21 Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B31d CLKOUT falling edge to CS valid, as requested by control bit CST1 in the corresponding word in the UPM EBDF = 1 (MAX = 0.375 x B1 + 6.6) 13.30 18.00 11.30 16.00 9.40 14.10 7.60 12.30 ns B32 CLKOUT falling edge to BS valid, as requested by control bit BST4 in the corresponding word in the UPM (MAX = 0.00 x B1 + 6.00) 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns B32a CLKOUT falling edge to BS valid, as requested by control bit BST1 in the corresponding word in the UPM, EBDF = 0 (MAX = 0.25 x B1 + 6.80) 7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns B32b CLKOUT rising edge to BS valid, as requested by control bit BST2 in the corresponding word in the UPM (MAX = 0.00 x B1 + 8.00) 1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00 ns B32c CLKOUT rising edge to BS valid, as requested by control bit BST3 in the corresponding word in the UPM (MAX = 0.25 x B1 + 6.80) 7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns B32d CLKOUT falling edge to BS valid- as requested by control bit BST1 in the corresponding word in the UPM, EBDF = 1 (MAX = 0.375 x B1 + 6.60) 13.30 18.00 11.30 16.00 9.40 14.10 7.60 12.30 ns B33 CLKOUT falling edge to GPL valid, as requested by control bit GxT4 in the corresponding word in the UPM (MAX = 0.00 x B1 + 6.00) 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns B33a CLKOUT rising edge to GPL valid, as requested by control bit GxT3 in the corresponding word in the UPM (MAX = 0.25 x B1 + 6.80) 7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns B34 A(0:31), BADDR(28:30), and D(0:31) to CS valid, as requested by control bit CST4 in the corresponding word in the UPM (MIN = 0.25 x B1 - 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B34a A(0:31), BADDR(28:30), and D(0:31) to CS valid, as requested by control bit CST1 in the corresponding word in the UPM (MIN = 0.50 x B1 – 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B34b A(0:31), BADDR(28:30), and D(0:31) to CS valid, as requested by CST2 in the corresponding word in UPM (MIN = 0.75 x B1 – 2.00) 20.70 — 16.70 — 13.00 — 9.40 — ns MPC866/MPC859 Hardware Specifications, Rev. 2 22 Freescale Semiconductor Bus Signal Timing Table 9. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max A(0:31), BADDR(28:30) to CS valid, as requested by control bit BST4 in the corresponding word in the UPM (MIN = 0.25 x B1 – 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B35a A(0:31), BADDR(28:30), and D(0:31) to BS valid, as Requested by BST1 in the corresponding word in the UPM (MIN = 0.50 x B1 – 2.00) 13.20 — 10.50 — 8.00 — 5.60 — ns B35b A(0:31), BADDR(28:30), and D(0:31) to BS valid, as requested by control bit BST2 in the corresponding word in the UPM (MIN = 0.75 x B1 – 2.00) 20.70 — 16.70 — 13.00 — 9.40 — ns B36 A(0:31), BADDR(28:30), and D(0:31) to GPL valid as requested by control bit GxT4 in the corresponding word in the UPM (MIN = 0.25 x B1 – 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns B37 UPWAIT valid to CLKOUT falling edge 8 (MIN = 0.00 x B1 + 6.00) 6.00 — 6.00 — 6.00 — 6.00 — ns B38 CLKOUT falling edge to UPWAIT valid8 (MIN = 0.00 x B1 + 1.00) 1.00 — 1.00 — 1.00 — 1.00 — ns B39 AS valid to CLKOUT rising edge 9 (MIN = 0.00 x B1 + 7.00) 7.00 — 7.00 — 7.00 — 7.00 — ns B40 A(0:31), TSIZ(0:1), RD/WR, BURST, valid to CLKOUT rising edge (MIN = 0.00 x B1 + 7.00) 7.00 — 7.00 — 7.00 — 7.00 — ns B41 TS valid to CLKOUT rising edge (setup time) (MIN = 0.00 x B1 + 7.00) 7.00 — 7.00 — 7.00 — 7.00 — ns B42 CLKOUT rising edge to TS valid (hold time) (MIN = 0.00 x B1 + 2.00) 2.00 — 2.00 — 2.00 — 2.00 — ns B43 AS negation to memory controller signals negation (MAX = TBD) — TBD — TBD — TBD — TBD ns B35 1 2 3 4 5 6 7 For part speeds above 50 MHz, use 9.80 ns for B11a. The timing required for BR input is relevant when the MPC866/859 is selected to work with the internal bus arbiter. The timing for BG input is relevant when the MPC866/859 is selected to work with the external bus arbiter. For part speeds above 50 MHz, use 2 ns for B17. The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of CLKOUT, in which the TA input signal is asserted. For part speeds above 50 MHz, use 2 ns for B19. The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of CLKOUT. This timing is valid only for read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats, where DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.) The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 23 Bus Signal Timing 8 The signal UPWAIT is considered asynchronous to CLKOUT and synchronized internally. The timings specified in B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 20. 9 The AS signal is considered asynchronous to CLKOUT. The timing B39 is specified in order to allow the behavior specified in Figure 23. Figure 5 shows the control timing diagram. 2.0 V CLKOUT 2.0 V 0.8 V 0.8 V A B 2.0 V 0.8 V Outputs 2.0 V 0.8 V A B 2.0 V 0.8 V Outputs 2.0 V 0.8 V D C 2.0 V 0.8 V Inputs 2.0 V 0.8 V D C 2.0 V 0.8 V Inputs A Maximum output delay specification B Minimum output hold time C Minimum input setup time specification D Minimum input hold time specification 2.0 V 0.8 V Figure 5. Control Timing MPC866/MPC859 Hardware Specifications, Rev. 2 24 Freescale Semiconductor Bus Signal Timing Figure 6 shows the timing for the external clock. CLKOUT B1 B3 B1 B4 B2 B5 Figure 6. External Clock Timing Figure 7 shows the timing for the synchronous output signals. CLKOUT B8 B7 B9 Output Signals B8a B7a B9 Output Signals B8b B7b Output Signals Figure 7. Synchronous Output Signals Timing MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 25 Bus Signal Timing Figure 8 shows the timing for the synchronous active pull-up and open-drain output signals. CLKOUT B13 B11 B12 TS, BB B13a B11a B12a TA, BI B14 B15 TEA Figure 8. Synchronous Active Pull-Up Resistor and Open-Drain Output Signals Timing Figure 9 shows the timing for the synchronous input signals. CLKOUT B16 B17 TA, BI B16a B17a TEA, KR, RETRY, CR B16b B17 BB, BG, BR Figure 9. Synchronous Input Signals Timing MPC866/MPC859 Hardware Specifications, Rev. 2 26 Freescale Semiconductor Bus Signal Timing Figure 10 shows normal case timing for input data. It also applies to normal read accesses under the control of the UPM in the memory controller. CLKOUT B16 B17 TA B18 B19 D[0:31], DP[0:3] Figure 10. Input Data Timing in Normal Case Figure 11 shows the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.) CLKOUT TA B20 B21 D[0:31], DP[0:3] Figure 11. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1 MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 27 Bus Signal Timing Figure 12 through Figure 15 show the timing for the external bus read controlled by various GPCM factors. CLKOUT B11 B12 TS B8 A[0:31] B22 B23 CSx B25 B26 OE B28 WE[0:3] B19 B18 D[0:31], DP[0:3] Figure 12. External Bus Read Timing (GPCM Controlled—ACS = 00) MPC866/MPC859 Hardware Specifications, Rev. 2 28 Freescale Semiconductor Bus Signal Timing CLKOUT B11 B12 TS B8 A[0:31] B23 B22a CSx B24 B25 B26 OE B18 B19 D[0:31], DP[0:3] Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10) CLKOUT B11 B12 TS B8 B22b A[0:31] B22c B23 CSx B24a B25 B26 OE B18 B19 D[0:31], DP[0:3] Figure 14. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 11) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 29 Bus Signal Timing CLKOUT B11 B12 TS B8 A[0:31] B23 B22a CSx B27 OE B26 B27a B22b B22c B18 B19 D[0:31], DP[0:3] Figure 15. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10, ACS = 11) MPC866/MPC859 Hardware Specifications, Rev. 2 30 Freescale Semiconductor Bus Signal Timing Figure 16 through Figure 18 show the timing for the external bus write controlled by various GPCM factors. CLKOUT B11 B12 TS B8 B30 A[0:31] B22 B23 CSx B25 B28 WE[0:3] B26 B29b OE B29 B8 B9 D[0:31], DP[0:3] Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 0) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 31 Bus Signal Timing CLKOUT B11 B12 TS B8 B30a B30c A[0:31] B22 B28b B28d B23 CSx B25 B29c B29g WE[0:3] B26 B29a B29f OE B28a B28c B8 B9 D[0:31], DP[0:3] Figure 17. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1) MPC866/MPC859 Hardware Specifications, Rev. 2 32 Freescale Semiconductor Bus Signal Timing CLKOUT B11 B12 TS B8 B30b B30d A[0:31] B22 B28b B28d B23 CSx B25 B29e B29i WE[0:3] B26 B29d B29h OE B29b B8 B28a B28c B9 D[0:31], DP[0:3] Figure 18. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 33 Bus Signal Timing Figure 19 shows the timing for the external bus controlled by the UPM. CLKOUT B8 A[0:31] B31a B31d B31 B31c B31b CSx B34 B34a B34b B32a B32d B32 B32c B32b BS_A[0:3], BS_B[0:3] B35 B36 B35a B33a B35b B33 GPL_A[0:5], GPL_B[0:5] Figure 19. External Bus Timing (UPM Controlled Signals) MPC866/MPC859 Hardware Specifications, Rev. 2 34 Freescale Semiconductor Bus Signal Timing Figure 20 shows the timing for the asynchronous asserted UPWAIT signal controlled by the UPM. CLKOUT B37 UPWAIT B38 CSx BS_A[0:3], BS_B[0:3] GPL_A[0:5], GPL_B[0:5] Figure 20. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing Figure 21 shows the timing for the asynchronous negated UPWAIT signal controlled by the UPM. CLKOUT B37 UPWAIT B38 CSx BS_A[0:3], BS_B[0:3] GPL_A[0:5], GPL_B[0:5] Figure 21. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 35 Bus Signal Timing Figure 22 shows the timing for the synchronous external master access controlled by the GPCM. CLKOUT B41 B42 TS B40 A[0:31], TSIZ[0:1], R/W, BURST B22 CSx Figure 22. Synchronous External Master Access Timing (GPCM Handled ACS = 00) MPC866/MPC859 Hardware Specifications, Rev. 2 36 Freescale Semiconductor Bus Signal Timing Figure 23 shows the timing for the asynchronous external master memory access controlled by the GPCM. CLKOUT B39 AS B40 A[0:31], TSIZ[0:1], R/W B22 CSx Figure 23. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00) Figure 24 shows the timing for the asynchronous external master control signals negation. AS B43 CSx, WE[0:3], OE, GPLx, BS[0:3] Figure 24. Asynchronous External Master—Control Signals Negation Timing Table 10 shows the interrupt timing for the MPC866/859. Table 10. Interrupt Timing All Frequencies Characteristic 1 Num 1 Unit Min Max I39 IRQx valid to CLKOUT rising edge (setup time) 6.00 — ns I40 IRQx hold time after CLKOUT 2.00 — ns I41 IRQx pulse width low 3.00 — ns I42 IRQx pulse width high 3.00 — ns I43 IRQx edge-to-edge time 4xTCLOCKOUT — — The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference to the CLKOUT. The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry, and has no direct relation with the total system interrupt latency that the MPC866/859 is able to support. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 37 Bus Signal Timing Figure 25 shows the interrupt detection timing for the external level-sensitive lines. CLKOUT I39 I40 IRQx Figure 25. Interrupt Detection Timing for External Level Sensitive Lines Figure 26 shows the interrupt detection timing for the external edge-sensitive lines. CLKOUT I41 I42 IRQx I43 I43 Figure 26. Interrupt Detection Timing for External Edge Sensitive Lines Table 11 shows the PCMCIA timing for the MPC866/859. Table 11. PCMCIA Timing 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max A(0:31), REG valid to PCMCIA Strobe asserted 1 (MIN = 0.75 x B1 – 2.00) 20.70 — 16.70 — 13.00 — 9.40 — ns P44 P45 A(0:31), REG valid to ALE 28.30 negation1 (MIN = 1.00 x B1 – 2.00) — 23.00 — 18.00 — 13.20 — ns P46 CLKOUT to REG valid (MAX = 0.25 x B1 + 8.00) 7.60 15.60 6.30 14.30 5.00 13.00 3.80 11.80 ns P47 CLKOUT to REG invalid (MIN = 0.25 x B1 + 1.00) 8.60 — 7.30 — 6.00 — 4.80 — ns P48 CLKOUT to CE1, CE2 asserted (MAX = 0.25 x B1 + 8.00) 7.60 15.60 6.30 14.30 5.00 13.00 3.80 11.80 ns P49 CLKOUT to CE1, CE2 negated (MAX = 0.25 x B1 + 8.00) 7.60 15.60 6.30 14.30 5.00 13.00 3.80 11.80 ns MPC866/MPC859 Hardware Specifications, Rev. 2 38 Freescale Semiconductor Bus Signal Timing Table 11. PCMCIA Timing (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max CLKOUT to PCOE, IORD, PCWE, IOWR assert time (MAX = 0.00 x B1 + 11.00) — 11.00 — 11.00 — 11.00 — 11.00 ns P50 CLKOUT to PCOE, IORD, PCWE, IOWR negate time (MAX = 0.00 x B1 + 11.00) 2.00 11.00 2.00 11.00 2.00 11.00 2.00 11.00 ns P51 P52 CLKOUT to ALE assert time (MAX = 0.25 x B1 + 6.30) 7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns P53 CLKOUT to ALE negate time (MAX = 0.25 x B1 + 8.00) — 15.60 — 14.30 — 13.00 — 11.80 ns P54 PCWE, IOWR negated to D(0:31) invalid1 (MIN = 0.25 x B1 – 2.00) 5.60 — 4.30 — 3.00 — 1.80 — ns WAITA and WAITB valid to CLKOUT rising edge1 (MIN = 0.00 x B1 + 8.00) 8.00 — 8.00 — 8.00 — 8.00 — ns P55 CLKOUT rising edge to WAITA and WAITB invalid1 (MIN = 0.00 x B1 + 2.00) 2.00 — 2.00 — 2.00 — 2.00 — ns P56 1 PSST = 1. Otherwise, add PSST times cycle time. PSHT = 0. Otherwise, add PSHT times cycle time. These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the PCMCIA current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL timer expiration. See PCMCIA Interface in the MPC866 PowerQUICC User’s Manual. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 39 Bus Signal Timing Figure 27 shows the PCMCIA access cycle timing for the external bus read. CLKOUT TS P44 A[0:31] P46 P45 P47 REG P48 P49 CE1/CE2 P50 P51 P53 P52 PCOE, IORD P52 ALE B18 B19 D[0:31] Figure 27. PCMCIA Access Cycles Timing External Bus Read MPC866/MPC859 Hardware Specifications, Rev. 2 40 Freescale Semiconductor Bus Signal Timing Figure 28 shows the PCMCIA access cycle timing for the external bus write. CLKOUT TS P44 A[0:31] P46 P45 P47 REG P48 P49 CE1/CE2 P50 P51 P53 P52 B8 B9 P54 PCWE, IOWR P52 ALE D[0:31] Figure 28. PCMCIA Access Cycles Timing External Bus Write Figure 29 shows the PCMCIA WAIT signals detection timing. CLKOUT P55 P56 WAITx Figure 29. PCMCIA WAIT Signals Detection Timing MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 41 Bus Signal Timing Table 12 shows the PCMCIA port timing for the MPC866/859. Table 12. PCMCIA Port Timing 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max P57 CLKOUT to OPx, valid (MAX = 0.00 x B1 + 19.00) — 19.00 — 19.00 — 19.00 — 19.00 ns P58 HRESET negated to OPx drive 1(MIN = 0.75 x B1 + 3.00) 25.70 — 21.70 — 18.00 — 14.40 — ns P59 IP_Xx valid to CLKOUT rising edge (MIN = 0.00 x B1 + 5.00) 5.00 — 5.00 — 5.00 — 5.00 — ns P60 CLKOUT rising edge to IP_Xx invalid (MIN = 0.00 x B1 + 1.00) 1.00 — 1.00 — 1.00 — 1.00 — ns 1 OP2 and OP3 only. Figure 30 shows the PCMCIA output port timing for the MPC866/859. CLKOUT P57 Output Signals HRESET P58 OP2, OP3 Figure 30. PCMCIA Output Port Timing Figure 31 shows the PCMCIA output port timing for the MPC866/859. CLKOUT P59 P60 Input Signals Figure 31. PCMCIA Input Port Timing MPC866/MPC859 Hardware Specifications, Rev. 2 42 Freescale Semiconductor Bus Signal Timing Table 13 shows the debug port timing for the MPC866/859. Table 13. Debug Port Timing All Frequencies Num Characteristic Unit Min Max 3xT CLOCKOUT — D61 DSCK cycle time D62 DSCK clock pulse width 1.25xT CLOCKOUT — D63 DSCK rise and fall times 0.00 3.00 ns D64 DSDI input data setup time 8.00 — ns D65 DSDI data hold time 5.00 — ns D66 DSCK low to DSDO data valid 0.00 15.00 ns D67 DSCK low to DSDO invalid 0.00 2.00 ns Figure 32 shows the input timing for the debug port clock. DSCK D61 D62 D61 D62 D63 D63 Figure 32. Debug Port Clock Input Timing Figure 33 shows the timing for the debug port. DSCK D64 D65 DSDI D66 D67 DSDO Figure 33. Debug Port Timings MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 43 Bus Signal Timing Table 14 shows the reset timing for the MPC866/859. Table 14. Reset Timing 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max R69 CLKOUT to HRESET high impedance (MAX = 0.00 x B1 + 20.00) — 20.00 — 20.00 — 20.00 — 20.00 ns R70 CLKOUT to SRESET high impedance (MAX = 0.00 x B1 + 20.00) — 20.00 — 20.00 — 20.00 — 20.00 ns R71 RSTCONF pulse width (MIN = 17.00 x B1) 515.20 — 425.00 — 340.00 — 257.60 — ns R72 — — — — — — — Configuration data to HRESET rising edge setup time (MIN = 15.00 x B1 + 50.00) 504.50 — 425.00 — 350.00 — 277.30 — ns R73 Configuration data to RSTCONF rising edge setup time (MIN = 0.00 x B1 + 350.00) 350.00 — 350.00 — 350.00 — 350.00 — ns R74 Configuration data hold time after 0.00 RSTCONF negation (MIN = 0.00 x B1 + 0.00) — 0.00 — 0.00 — 0.00 — ns R75 Configuration data hold time after HRESET negation (MIN = 0.00 x B1 + 0.00) 0.00 — 0.00 — 0.00 — 0.00 — ns R76 HRESET and RSTCONF asserted to data out drive (MAX = 0.00 x B1 + 25.00) — 25.00 — 25.00 — 25.00 — 25.00 ns R77 R78 RSTCONF negated to data out high impedance (MAX = 0.00 x B1 + 25.00) — 25.00 — 25.00 — 25.00 — 25.00 ns CLKOUT of last rising edge before chip — three-states HRESET to data out high impedance (MAX = 0.00 x B1 + 25.00) 25.00 — 25.00 — 25.00 — 25.00 ns R79 R80 DSDI, DSCK setup (MIN = 3.00 x B1) — 75.00 — 60.00 — 45.50 — ns R81 DSDI, DSCK hold time (MIN = 0.00 x B1 0.00 + 0.00) — 0.00 — 0.00 — 0.00 — ns 242.40 — SRESET negated to CLKOUT rising edge for DSDI and DSCK sample (MIN = 8.00 x B1) 121.20 — ns R82 90.90 — — 200.00 — — 160.00 — MPC866/MPC859 Hardware Specifications, Rev. 2 44 Freescale Semiconductor Bus Signal Timing Figure 34 shows the reset timing for the data bus configuration. HRESET R71 R76 RSTCONF R73 R74 R75 D[0:31] (IN) Figure 34. Reset Timing—Configuration from Data Bus Figure 35 shows the reset timing for the data bus weak drive during configuration. CLKOUT R69 HRESET R79 RSTCONF R77 R78 D[0:31] (OUT) (Weak) Figure 35. Reset Timing—Data Bus Weak Drive During Configuration MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 45 IEEE 1149.1 Electrical Specifications Figure 36 shows the reset timing for the debug port configuration. CLKOUT R70 R82 SRESET R80 R80 R81 R81 DSCK, DSDI Figure 36. Reset Timing—Debug Port Configuration 11 IEEE 1149.1 Electrical Specifications Table 15 shows the JTAG timings for the MPC866/859 shown in Figure 37 through Figure 40. Table 15. JTAG Timing All Frequencies Num Characteristic Unit Min Max J82 TCK cycle time 100.00 — ns J83 TCK clock pulse width measured at 1.5 V 40.00 — ns J84 TCK rise and fall times 0.00 10.00 ns J85 TMS, TDI data setup time 5.00 — ns J86 TMS, TDI data hold time 25.00 — ns J87 TCK low to TDO data valid — 27.00 ns J88 TCK low to TDO data invalid 0.00 — ns J89 TCK low to TDO high impedance — 20.00 ns J90 TRST assert time 100.00 — ns J91 TRST setup time to TCK low 40.00 — ns J92 TCK falling edge to output valid — 50.00 ns J93 TCK falling edge to output valid out of high impedance — 50.00 ns J94 TCK falling edge to output high impedance — 50.00 ns J95 Boundary scan input valid to TCK rising edge 50.00 — ns J96 TCK rising edge to boundary scan input invalid 50.00 — ns MPC866/MPC859 Hardware Specifications, Rev. 2 46 Freescale Semiconductor IEEE 1149.1 Electrical Specifications TCK J82 J83 J82 J83 J84 J84 Figure 37. JTAG Test Clock Input Timing TCK J85 J86 TMS, TDI J87 J88 J89 TDO Figure 38. JTAG Test Access Port Timing Diagram TCK J91 J90 TRST Figure 39. JTAG TRST Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 47 CPM Electrical Characteristics TCK J92 J94 Output Signals J93 Output Signals J95 J96 Output Signals Figure 40. Boundary Scan (JTAG) Timing Diagram 12 CPM Electrical Characteristics This section provides the AC and DC electrical specifications for the communications processor module (CPM) of the MPC866/859. 12.1 PIP/PIO AC Electrical Specifications Table 16 shows the PIP/PIO AC timings as shown in Figure 41 through Figure 45. Table 16. PIP/PIO Timing All Frequencies Num Characteristic Unit Min 21 1 Data-in setup time to STBI low Max 0 2.5 – t3 1 — ns — clk 22 Data-In hold time to STBI high 23 STBI pulse width 1.5 — clk 24 STBO pulse width 1 clk – 5ns — ns 25 Data-out setup time to STBO low 2 — clk 26 Data-out hold time from STBO high 5 — clk 27 STBI low to STBO low (Rx interlock) — 2 clk 28 STBI low to STBO high (Tx interlock) 2 — clk 29 Data-in setup time to clock high 15 — ns 30 Data-in hold time from clock high 7.5 — ns 31 Clock low to data-out valid (CPU writes data, control, or direction) — 25 ns t3 = Specification 23 MPC866/MPC859 Hardware Specifications, Rev. 2 48 Freescale Semiconductor CPM Electrical Characteristics DATA-IN 21 22 23 STBI 27 24 STBO Figure 41. PIP Rx (Interlock Mode) Timing Diagram DATA-OUT 25 26 24 STBO (Output) 28 23 STBI (Input) Figure 42. PIP Tx (Interlock Mode) Timing Diagram DATA-IN 21 22 23 STBI (Input) 24 STBO (Output) Figure 43. PIP Rx (Pulse Mode) Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 49 CPM Electrical Characteristics DATA-OUT 25 26 24 STBO (Output) 23 STBI (Input) Figure 44. PIP TX (Pulse Mode) Timing Diagram CLKO 29 30 DATA-IN 31 DATA-OUT Figure 45. Parallel I/O Data-In/Data-Out Timing Diagram 12.2 Port C Interrupt AC Electrical Specifications Table 17 shows timings for port C interrupts. Table 17. Port C Interrupt Timing 33.34 MHz Num Characteristic Unit Min Max 35 Port C interrupt pulse width low (edge-triggered mode) 55 — ns 36 Port C interrupt minimum time between active edges 55 — ns Figure 46 shows the port C interrupt detection timing. MPC866/MPC859 Hardware Specifications, Rev. 2 50 Freescale Semiconductor CPM Electrical Characteristics 36 Port C (Input) 35 Figure 46. Port C Interrupt Detection Timing 12.3 IDMA Controller AC Electrical Specifications Table 18 shows the IDMA controller timings as shown in Figure 47 through Figure 50. Table 18. IDMA Controller Timing All Frequencies Num Characteristic Unit Min Max 40 DREQ setup time to clock high 7 — ns 41 DREQ hold time from clock high 3 — ns 42 SDACK assertion delay from clock high — 12 ns 43 SDACK negation delay from clock low — 12 ns 44 SDACK negation delay from TA low — 20 ns 45 SDACK negation delay from clock high — 15 ns 46 TA assertion to falling edge of the clock setup time (applies to external TA) 7 — ns CLKO (Output) 41 40 DREQ (Input) Figure 47. IDMA External Requests Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 51 CPM Electrical Characteristics CLKO (Output) TS (Output) R/W (Output) 42 43 DATA 46 TA (Input) SDACK Figure 48. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA CLKO (Output) TS (Output) R/W (Output) 42 44 DATA TA (Output) SDACK Figure 49. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA MPC866/MPC859 Hardware Specifications, Rev. 2 52 Freescale Semiconductor CPM Electrical Characteristics CLKO (Output) TS (Output) R/W (Output) 42 45 DATA TA (Output) SDACK Figure 50. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA 12.4 Baud Rate Generator AC Electrical Specifications Table 19 shows the baud rate generator timings as shown in Figure 51. Table 19. Baud Rate Generator Timing All Frequencies Num Characteristic Unit Min Max 50 BRGO rise and fall time — 10 ns 51 BRGO duty cycle 40 60 % 52 BRGO cycle 40 — ns 50 50 BRGOX 51 51 52 Figure 51. Baud Rate Generator Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 53 CPM Electrical Characteristics 12.5 Timer AC Electrical Specifications Table 20 shows the general-purpose timer timings as shown in Figure 52. Table 20. Timer Timing All Frequencies Num Characteristic Unit Min Max 61 TIN/TGATE rise and fall time 10 — ns 62 TIN/TGATE low time 1 — clk 63 TIN/TGATE high time 2 — clk 64 TIN/TGATE cycle time 3 — clk 65 CLKO low to TOUT valid 3 25 ns CLKO 60 61 63 62 TIN/TGATE (Input) 61 64 65 TOUT (Output) Figure 52. CPM General-Purpose Timers Timing Diagram 12.6 Serial Interface AC Electrical Specifications Table 21 shows the serial interface timings as shown in Figure 53 through Figure 57. Table 21. SI Timing All Frequencies Num 70 Characteristic Unit L1RCLK, L1TCLK frequency (DSC = 0) 1, 2 2 71 L1RCLK, L1TCLK width low (DSC = 0) 71a L1RCLK, L1TCLK width high (DSC = 0) 3 72 L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time 73 L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC setup time) Min Max — SYNCCLK/2.5 MHz P + 10 — ns P + 10 — ns — 15.00 ns 20.00 — ns MPC866/MPC859 Hardware Specifications, Rev. 2 54 Freescale Semiconductor CPM Electrical Characteristics Table 21. SI Timing (continued) All Frequencies Num Characteristic Unit Min Max 35.00 — ns — 15.00 ns 74 L1CLK edge to L1RSYNC, L1TSYNC, invalid (SYNC hold time) 75 L1RSYNC, L1TSYNC rise/fall time 76 L1RXD valid to L1CLK edge (L1RXD setup time) 17.00 — ns 77 L1CLK edge to L1RXD invalid (L1RXD hold time) 13.00 — ns 78 L1CLK edge to L1ST(1–4) valid 4 10.00 45.00 ns 78A L1SYNC valid to L1ST(1–4) valid 10.00 45.00 ns 79 L1CLK edge to L1ST(1–4) invalid 10.00 45.00 ns 80 L1CLK edge to L1TXD valid 10.00 55.00 ns L1TSYNC valid to L1TXD valid 4 10.00 55.00 ns 80A 81 L1CLK edge to L1TXD high impedance 0.00 42.00 ns 82 L1RCLK, L1TCLK frequency (DSC =1) — 16.00 or SYNCCLK/2 MHz 83 L1RCLK, L1TCLK width low (DSC =1) P + 10 — ns 83a L1RCLK, L1TCLK width high (DSC = 1)3 P + 10 — ns 84 L1CLK edge to L1CLKO valid (DSC = 1) — 30.00 ns 85 L1RQ valid before falling edge of L1TSYNC4 1.00 — L1TCLK 42.00 — ns 42.00 — ns — 0.00 ns time2 86 L1GR setup 87 L1GR hold time 88 L1CLK edge to L1SYNC valid (FSD = 00) CNT = 0000, BYT = 0, DSC = 0) 1 The ratio SyncCLK/L1RCLK must be greater than 2.5/1. These specs are valid for IDL mode only. 3 Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns. 4 These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever is later. 2 MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 55 CPM Electrical Characteristics L1RCLK (FE=0, CE=0) (Input) 71 70 71a 72 L1RCLK (FE=1, CE=1) (Input) RFSD=1 75 L1RSYNC (Input) 73 74 L1RXD (Input) 77 BIT0 76 78 79 L1ST(4-1) (Output) Figure 53. SI Receive Timing Diagram with Normal Clocking (DSC = 0) MPC866/MPC859 Hardware Specifications, Rev. 2 56 Freescale Semiconductor CPM Electrical Characteristics L1RCLK (FE=1, CE=1) (Input) 72 83a 82 L1RCLK (FE=0, CE=0) (Input) RFSD=1 75 L1RSYNC (Input) 73 74 L1RXD (Input) 77 BIT0 76 78 79 L1ST(4-1) (Output) 84 L1CLKO (Output) Figure 54. SI Receive Timing with Double-Speed Clocking (DSC = 1) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 57 CPM Electrical Characteristics L1TCLK (FE=0, CE=0) (Input) 71 70 72 L1TCLK (FE=1, CE=1) (Input) 73 TFSD=0 75 L1TSYNC (Input) 74 80a L1TXD (Output) 81 BIT0 80 78 79 L1ST(4-1) (Output) Figure 55. SI Transmit Timing Diagram (DSC = 0) MPC866/MPC859 Hardware Specifications, Rev. 2 58 Freescale Semiconductor CPM Electrical Characteristics L1RCLK (FE=0, CE=0) (Input) 72 83a 82 L1RCLK (FE=1, CE=1) (Input) TFSD=0 75 L1RSYNC (Input) 73 74 L1TXD (Output) 81 BIT0 80 78a 79 L1ST(4-1) (Output) 78 84 L1CLKO (Output) Figure 56. SI Transmit Timing with Double Speed Clocking (DSC = 1) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 59 60 L1GR (Input) L1RQ (Output) L1ST(4-1) (Output) L1RXD (Input) L1TXD (Output) L1RSYNC (Input) L1RCLK (Input) 80 77 74 2 3 5 72 B15 B14 B13 71 71 4 86 85 76 6 87 B17 B16 B15 B14 B13 B17 B16 73 1 8 78 B12 B11 B10 B12 B11 B10 7 9 D1 D1 10 A A 11 14 15 16 17 18 B25 B24 B23 B22 B21 B20 13 B27 B26 B25 B24 B23 B22 B21 B20 81 B27 B26 12 19 D2 D2 20 M M CPM Electrical Characteristics Figure 57. IDL Timing MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor CPM Electrical Characteristics 12.7 SCC in NMSI Mode Electrical Specifications Table 22 shows the NMSI external clock timings. Table 22. NMSI External Clock Timings All Frequencies Num 1 2 Characteristic Unit Min Max 1/SYNCCLK — ns 1/SYNCCLK +5 — ns — 15.00 ns 100 RCLK1 and TCLK1 width high 1 101 RCLK1 and TCLK1 width low 102 RCLK1 and TCLK1 rise/fall time 103 TXD1 active delay (from TCLK1 falling edge) 0.00 50.00 ns 104 RTS1 active/inactive delay (from TCLK1 falling edge) 0.00 50.00 ns 105 CTS1 setup time to TCLK1 rising edge 5.00 — ns 106 RXD1 setup time to RCLK1 rising edge 5.00 — ns 5.00 — ns 5.00 — ns edge 2 107 RXD1 hold time from RCLK1 rising 108 CD1 setup time to RCLK1 rising edge The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2.25/1. Also applies to CD and CTS hold time when they are used as an external sync signal. Table 23 shows the NMSI internal clock timings. Table 23. NMSI Internal Clock Timings All Frequencies Num 1 2 Characteristic Unit Min Max 100 RCLK1 and TCLK1 frequency 1 0.00 SYNCCLK/3 MHz 102 RCLK1 and TCLK1 rise/fall time — — ns 103 TXD1 active delay (from TCLK1 falling edge) 0.00 30.00 ns 104 RTS1 active/inactive delay (from TCLK1 falling edge) 0.00 30.00 ns 105 CTS1 setup time to TCLK1 rising edge 40.00 — ns 106 RXD1 setup time to RCLK1 rising edge 40.00 — ns 107 RXD1 hold time from RCLK1 rising edge 2 0.00 — ns 108 CD1 setup time to RCLK1 rising edge 40.00 — ns The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 3/1. Also applies to CD and CTS hold time when they are used as an external sync signals. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 61 CPM Electrical Characteristics Figure 58 through Figure 60 show the NMSI timings. RCLK1 102 102 101 106 100 RxD1 (Input) 107 108 CD1 (Input) 107 CD1 (SYNC Input) Figure 58. SCC NMSI Receive Timing Diagram TCLK1 102 102 101 100 TxD1 (Output) 103 105 RTS1 (Output) 104 104 CTS1 (Input) 107 CTS1 (SYNC Input) Figure 59. SCC NMSI Transmit Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 62 Freescale Semiconductor CPM Electrical Characteristics TCLK1 102 102 101 100 TxD1 (Output) 103 RTS1 (Output) 104 107 104 105 CTS1 (Echo Input) Figure 60. HDLC Bus Timing Diagram 12.8 Ethernet Electrical Specifications Table 24 shows the Ethernet timings as shown in Figure 61 through Figure 65. Table 24. Ethernet Timing All Frequencies Num Characteristic Unit Min Max 120 CLSN width high 40 — ns 121 RCLK1 rise/fall time — 15 ns 122 RCLK1 width low 40 — ns 123 RCLK1 clock period 1 80 120 ns 124 RXD1 setup time 20 — ns 125 RXD1 hold time 5 — ns 126 RENA active delay (from RCLK1 rising edge of the last data bit) 10 — ns 127 RENA width low 100 — ns 128 TCLK1 rise/fall time — 15 ns 129 TCLK1 width low 40 — ns 99 101 ns 1 130 TCLK1 clock period 131 TXD1 active delay (from TCLK1 rising edge) — 50 ns 132 TXD1 inactive delay (from TCLK1 rising edge) 6.5 50 ns 133 TENA active delay (from TCLK1 rising edge) 10 50 ns MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 63 CPM Electrical Characteristics Table 24. Ethernet Timing (continued) All Frequencies Num 1 2 Characteristic Unit Min Max 134 TENA inactive delay (from TCLK1 rising edge) 10 50 ns 135 RSTRT active delay (from TCLK1 falling edge) 10 50 ns 136 RSTRT inactive delay (from TCLK1 falling edge) 10 50 ns 137 REJECT width low 1 — CLK 138 CLKO1 low to SDACK asserted 2 — 20 ns 139 2 — 20 ns CLKO1 low to SDACK negated The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 2/1. SDACK is asserted whenever the SDMA writes the incoming frame DA into memory. CLSN(CTS1) (Input) 120 Figure 61. Ethernet Collision Timing Diagram RCLK1 121 121 124 123 RxD1 (Input) Last Bit 125 126 127 RENA(CD1) (Input) Figure 62. Ethernet Receive Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 64 Freescale Semiconductor CPM Electrical Characteristics TCLK1 128 128 129 131 121 TxD1 (Output) 132 133 134 TENA(RTS1) (Input) RENA(CD1) (Input) Notes: 1. Transmit clock invert (TCI) bit in GSMR is set. 2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the CSL bit is set in the buffer descriptor at the end of the frame transmission. Figure 63. Ethernet Transmit Timing Diagram RCLK1 RxD1 (Input) 0 1 1 BIT1 Start Frame Delimiter BIT2 136 125 RSTRT (Output) Figure 64. CAM Interface Receive Start Timing Diagram REJECT 137 Figure 65. CAM Interface REJECT Timing Diagram 12.9 SMC Transparent AC Electrical Specifications Table 25 shows the SMC transparent timings as shown in Figure 66. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 65 CPM Electrical Characteristics Table 25. SMC Transparent Timing All Frequencies Num 1 Characteristic Unit Min Max 150 SMCLK clock period 1 100 — ns 151 SMCLK width low 50 — ns 151A SMCLK width high 50 — ns 152 SMCLK rise/fall time — 15 ns 153 SMTXD active delay (from SMCLK falling edge) 10 50 ns 154 SMRXD/SMSYNC setup time 20 — ns 155 RXD1/SMSYNC hold time 5 — ns Sync CLK must be at least twice as fast as SMCLK. SMCLK 152 152 151 151A 150 SMTXD (Output) NOTE 1 154 153 155 SMSYNC 154 155 SMRXD (Input) NOTE: 1. This delay is equal to an integer number of character-length clocks. Figure 66. SMC Transparent Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 66 Freescale Semiconductor CPM Electrical Characteristics 12.10SPI Master AC Electrical Specifications Table 26 shows the SPI master timings as shown in Figure 67 and Figure 68. Table 26. SPI Master Timing All Frequencies Num Characteristic Unit Min Max 160 MASTER cycle time 4 1024 tcyc 161 MASTER clock (SCK) high or low time 2 512 tcyc 162 MASTER data setup time (inputs) 15 — ns 163 Master data hold time (inputs) 0 — ns 164 Master data valid (after SCK edge) — 10 ns 165 Master data hold time (outputs) 0 — ns 166 Rise time output — 15 ns 167 Fall time output — 15 ns SPICLK (CI=0) (Output) 161 167 161 166 160 SPICLK (CI=1) (Output) 163 167 162 SPIMISO (Input) msb 166 Data 165 lsb msb 164 167 SPIMOSI (Output) msb 166 Data lsb msb Figure 67. SPI Master (CP = 0) Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 67 CPM Electrical Characteristics SPICLK (CI=0) (Output) 161 167 166 161 160 SPICLK (CI=1) (Output) 163 167 162 SPIMISO (Input) 166 msb Data lsb 165 msb 164 167 SPIMOSI (Output) 166 msb Data lsb msb Figure 68. SPI Master (CP = 1) Timing Diagram 12.11SPI Slave AC Electrical Specifications Table 27 shows the SPI slave timings as shown in Figure 69 and Figure 70. Table 27. SPI Slave Timing All Frequencies Num Characteristic Unit Min Max 170 Slave cycle time 2 — tcyc 171 Slave enable lead time 15 — ns 172 Slave enable lag time 15 — ns 173 Slave clock (SPICLK) high or low time 1 — tcyc 174 Slave sequential transfer delay (does not require deselect) 1 — tcyc 175 Slave data setup time (inputs) 20 — ns 176 Slave data hold time (inputs) 20 — ns 177 Slave access time — 50 ns MPC866/MPC859 Hardware Specifications, Rev. 2 68 Freescale Semiconductor CPM Electrical Characteristics SPISEL (Input) 172 171 174 SPICLK (CI=0) (Input) 173 182 173 181 170 SPICLK (CI=1) (Input) 177 181 182 180 SPIMISO (Output) msb 178 Data 175 msb Undef msb 179 176 SPIMOSI (Input) lsb 181 182 Data lsb msb Figure 69. SPI Slave (CP = 0) Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 69 CPM Electrical Characteristics SPISEL (Input) 172 171 174 170 SPICLK (CI=0) (Input) 173 182 181 173 181 SPICLK (CI=1) (Input) 177 182 180 SPIMISO (Output) Undef msb 175 lsb msb 179 176 SPIMOSI (Input) Data 178 msb 181 182 Data lsb msb Figure 70. SPI Slave (CP = 1) Timing Diagram 12.12I2C AC Electrical Specifications MPC866/MPC859 Hardware Specifications, Rev. 2 70 Freescale Semiconductor CPM Electrical Characteristics Table 28 shows the I2C (SCL < 100 kHz) timings. Table 28. I2C Timing (SCL < 100 kHz) All Frequencies Num 200 1 Characteristic Unit SCL clock frequency (slave) (master) 1 Min Max 0 100 kHz 1.5 100 kHz 200 SCL clock frequency 202 Bus free time between transmissions 4.7 — μs 203 Low period of SCL 4.7 — μs 204 High period of SCL 4.0 — μs 205 Start condition setup time 4.7 — μs 206 Start condition hold time 4.0 — μs 207 Data hold time 0 — μs 208 Data setup time 250 — ns 209 SDL/SCL rise time — 1 μs 210 SDL/SCL fall time — 300 ns 211 Stop condition setup time 4.7 — μs SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) * pre_scaler * 2). The ratio SyncClk/(BRGCLK/pre_scaler) must be greater or equal to 4/1. Table 29 shows the I2C (SCL > 100 kHz) timings. Table 29. I2C Timing (SCL > 100 kHz) All Frequencies Num 1 Characteristic Expression Unit Min Max 200 SCL clock frequency (slave) fSCL 0 BRGCLK/48 Hz 200 SCL clock frequency (master) 1 fSCL BRGCLK/16512 BRGCLK/48 Hz 202 Bus free time between transmissions — 1/(2.2 * fSCL) — s 203 Low period of SCL — 1/(2.2 * fSCL) — s 204 High period of SCL — 1/(2.2 * fSCL) — s 205 Start condition setup time — 1/(2.2 * fSCL) — s 206 Start condition hold time — 1/(2.2 * fSCL) — s 207 Data hold time — 0 — s 208 Data setup time — 1/(40 * fSCL) — s 209 SDL/SCL rise time — — 1/(10 * fSCL) s 210 SDL/SCL fall time — — 1/(33 * fSCL) s 211 Stop condition setup time — 1/2(2.2 * fSCL) — s SCL frequency is given by SCL = BrgClk_frequency / ((BRG register + 3) * pre_scaler * 2). The ratio SyncClk/(Brg_Clk/pre_scaler) must be greater or equal to 4/1. MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 71 UTOPIA AC Electrical Specifications Figure 71 shows the I2C bus timing. SDA 202 203 205 204 208 207 SCL 206 209 210 211 Figure 71. I2C Bus Timing Diagram 13 UTOPIA AC Electrical Specifications Table 30 through Table 32 show the AC electrical specifications for the UTOPIA interface. Table 30. UTOPIA Master (Muxed Mode) Electrical Specifications Num U1 Signal Characteristic Direction Min Max Unit Output — 4 ns Duty cycle 50 50 % Frequency — 33 MHz Output 2 16 ns UtpClk rise/fall time (Internal clock option) U2 UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr-active delay (and PHREQ and PHSEL active delay in MPHY mode) U3 UTPB, SOC, Rxclav and Txclav setup time Input 4 — ns U4 UTPB, SOC, Rxclav and Txclav hold time Input 1 — ns Table 31. UTOPIA Master (Split Bus Mode) Electrical Specifications Num U1 Signal Characteristic Direction Min Max Unit Output — 4 ns Duty cycle 50 50 % Frequency — 33 MHz Output 2 16 ns UtpClk rise/fall time (Internal clock option) U2 UTPB, SOC, RxEnb, TxEnb, RxAddr and TxAddr active delay (PHREQ and PHSEL active delay in MPHY mode) U3 UTPB_Aux, SOC_Aux, Rxclav, and Txclav setup time Input 4 — ns U4 UTPB_Aux, SOC_Aux, Rxclav, and Txclav hold time Input 1 — ns MPC866/MPC859 Hardware Specifications, Rev. 2 72 Freescale Semiconductor UTOPIA AC Electrical Specifications Table 32. UTOPIA Slave (Split Bus Mode) Electrical Specifications Num U1 U2 Signal Characteristic Direction Min Max Unit Input — 4 ns Duty cycle 40 60 % Frequency — 33 MHz Output 2 16 ns UtpClk rise/fall time (external clock option) UTPB, SOC, Rxclav and Txclav active delay U3 UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr setup time Input 4 — ns U4 UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr hold time Input 1 — ns Figure 72 shows signal timings during UTOPIA receive operations. U1 U1 UtpClk U2 PHREQn U3 3 RxClav RxEnb U4 4 HighZ at MPHY HighZ at MPHY U2 2 UTPB SOC U3 3 U4 4 Figure 72. UTOPIA Receive Timing MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 73 FEC Electrical Characteristics Figure 73 shows signal timings during UTOPIA transmit operations. U1 U1 1 UtpClk U2 5 PHSELn U3 3 U4 4 TxClav HighZ at MPHY High-Z at MPHY U2 2 TxEnb UTPB SOC U2 5 Figure 73. UTOPIA Transmit Timing 14 FEC Electrical Characteristics This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII signals use TTL signal levels compatible with devices operating at either 5.0 or 3.3 V. 14.1 MII Receive Signal Timing (MII_RXD [3:0], MII_RX_DV, MII_RX_ER, MII_RX_CLK) The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%. Table 33 shows the timings for MII receive signal. Table 33. MII Receive Signal Timing Num Characteristic Min Max Unit M1 MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup 5 — ns M2 MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold 5 — ns M3 MII_RX_CLK pulse width high 35% 65% MII_RX_CLK period M4 MII_RX_CLK pulse width low 35% 65% MII_RX_CLK period Figure 74 shows the timings for MII receive signal. MPC866/MPC859 Hardware Specifications, Rev. 2 74 Freescale Semiconductor FEC Electrical Characteristics M3 MII_RX_CLK (input) M4 MII_RXD[3:0] (inputs) MII_RX_DV MII_RX_ER M1 M2 Figure 74. MII Receive Signal Timing Diagram 14.2 MII Transmit Signal Timing (MII_TXD[3:0], MII_TX_EN, MII_TX_ER, MII_TX_CLK) The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK frequency - 1%. Table 34 shows information on the MII transmit signal timing. Table 34. MII Transmit Signal Timing Num Characteristic Min Max Unit M5 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid 5 — ns M6 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid — 25 — M7 MII_TX_CLK pulse width high 35% 65% MII_TX_CLK period M8 MII_TX_CLK pulse width low 35% 65% MII_TX_CLK period MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 75 FEC Electrical Characteristics Figure 75 shows the MII transmit signal timing diagram. M7 MII_TX_CLK (input) M5 M8 MII_TXD[3:0] (outputs) MII_TX_EN MII_TX_ER M6 Figure 75. MII Transmit Signal Timing Diagram 14.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL) Table 35 shows the timing for on the MII async inputs signal. Table 35. MII Async Inputs Signal Timing Num Characteristic Min Max Unit M9 MII_CRS, MII_COL minimum pulse width 1.5 — MII_TX_CLK period Figure 76 shows the MII asynchronous inputs signal timing diagram. MII_CRS, MII_COL M9 Figure 76. MII Async Inputs Timing Diagram 14.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC) Table 36 shows the timing for the MII serial management channel signal. The FEC functions correctly with a maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation. Table 36. MII Serial Management Channel Timing Num Characteristic Min Max Unit M10 MII_MDC falling edge to MII_MDIO output invalid (minimum propagation delay) 0 — ns M11 MII_MDC falling edge to MII_MDIO output valid (maximum propagation delay) — 25 ns M12 MII_MDIO (input) to MII_MDC rising edge setup 10 — ns MPC866/MPC859 Hardware Specifications, Rev. 2 76 Freescale Semiconductor FEC Electrical Characteristics Table 36. MII Serial Management Channel Timing Num Characteristic Min Max Unit 0 — ns M13 MII_MDIO (input) to MII_MDC rising edge hold M14 MII_MDC pulse width high 40% 60% MII_MDC period M15 MII_MDC pulse width low 40% 60% MII_MDC period Figure 77 shows the MII serial management channel timing diagram. M14 MM15 MII_MDC (output) M10 MII_MDIO (output) M11 MII_MDIO (input) M12 M13 Figure 77. MII Serial Management Channel Timing Diagram MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 77 Mechanical Data and Ordering Information 15 Mechanical Data and Ordering Information Table 37 shows information on the MPC866/859 derivative devices. Table 37. MPC866/859 Derivatives Number of SCCs 1 Ethernet Support Multi-Channel HDLC Support ATM Support MPC866T 4 10/100 Mbps Yes MPC866P 4 10/100 Mbps MPC859T 1 (SCC1) MPC859DSL 1 (SCC1) Device 1 Cache Size Instruction Data Yes 4 Kbyte 4 Kbytes Yes Yes 16 Kbyte 8 Kbytes 10/100 Mbps Yes Yes 4 Kbyte 4 Kbytes 10/100 Mbps No Up to 4 addresses 4 Kbyte 4 Kbytes Serial communications controller (SCC). Table 38 identifies the packages and operating frequencies orderable for the MPC866/859 derivative devices. Table 38. MPC866/859 Package/Frequency Orderable Package Type Plastic ball grid array (ZP suffix) Non lead free Plastic ball grid array (CZP suffix) Non lead free Temperature (Tj) Frequency (MHz) Order Number 0° to 95°C 50 MPC859DSLZP50A 66 MPC859DSLZP66A 100 MPC859PZP100A MPC859TZP100A MPC866PZP100A MPC866TZP100A 133 MPC859PZP133A MPC859TZP133A MPC866PZP133A MPC866TZP133A 50 MPC859DSLCZP50A 66 MPC859DSLCZP66A 100 MPC859PCZP100A MPC859TCZP100A MPC866PCZP100A MPC866TCZP100A –40° to 100°C MPC866/MPC859 Hardware Specifications, Rev. 2 78 Freescale Semiconductor Mechanical Data and Ordering Information Table 38. MPC866/859 Package/Frequency Orderable (continued) Plastic ball grid array (VR suffix) Lead free Plastic ball grid array (CVR suffix) Lead free 0° to 95°C –40° to 100°C 50 MPC859DSLVR50A 66 MPC859DSLVR66A 100 MPC859PVR100A MPC859TVR100A MPC866PVR100A MPC866TVR100A 133 MPC859PVR133A MPC859TVR133A MPC866PVR133A MPC866TVR133A 50 MPC859DSLCVR50A 66 MPC859DSLCVR66A 100 MPC859PCVR100A MPC859TCVR100A MPC866PCVR100A MPC866TCVR100A MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 79 Mechanical Data and Ordering Information 15.1 Pin Assignments Figure 78 shows the top view pinout of the PBGA package. For additional information, see the MPC866 PowerQUICC Family User’s Manual. NOTE: This is the top view of the device. W PD10 PD8 PD3 PD9 PD6 PA0 PB14 PD15 PD4 PA1 PC5 PC4 PD11 PC6 PA2 PB15 PD12 PA4 PB17 PA3 VDDL PB19 PA5 PB18 PB16 HRESET TEXP EXTCLK EXTAL PA7 PC8 PA6 PC7 MODCK2 BADDR28 BADDR29 VDDL PB22 PC9 PA8 PB20 PC10 PA9 PB23 PB21 PC11 PB24 PA10 PB25 IRQ7 D0 D4 D1 D2 D3 D5 VDDL D6 D7 D29 DP2 CLKOUT IPA3 M_Tx_EN IRQ0 D13 D27 D10 D14 D18 D20 D24 D28 DP1 DP3 DP0 N/C VSSSYN1 D23 D11 D16 D19 D21 D26 D30 IPA5 IPA4 IPA2 N/C VSSSYN D17 D9 D15 D22 D25 D31 IPA6 IPA0 IPA1 IPA7 N/C VDDSYN V PD14 PD13 U PD5 IRQ1 D8 T PD7 VDDH D12 R VDDH VDDH WAIT_B WAIT_A PORESET VDDL P GND VDDL RSTCONF SRESET XTAL GND N M L OP0 AS OP1 MODCK1 K GND BADDR30 IPB6 ALEA IRQ4 J IPB5 IPB1 IPB2 ALEB M_COL IRQ2 IPB0 IPB7 BR IRQ6 IPB4 IPB3 VDDL TS CS3 BI H VDDL M_MDIO TDI TCK TRST TMS TDO PA11 PB26 PC12 PA12 VDDL PB27 PC13 PA13 PB29 PB28 PC14 PA14 PC15 A8 N/C N/C A15 A19 A25 PB30 PA15 PB31 A3 A9 A12 A16 A20 A24 A26 TSIZ1 BSA1 A0 A1 A4 A6 A10 A13 A17 A21 A23 A22 TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5 A2 A5 A7 A11 A14 A27 A29 A30 A28 A31 18 17 16 15 14 13 12 11 10 9 G GND GND F VDDH VDDH IRQ3 BURST E BG BB D A18 BSA0 GPLA0 N/C CS6 CS2 GPLA5 BDIP TEA C WE0 GPLA1 GPLA3 CS7 CS0 TA GPLA4 CE1A WR GPLB4 B A 19 VDDL BSA2 8 7 WE1 WE3 CS4 CE2A CS1 6 5 4 3 2 1 Figure 78. Pinout of the PBGA Package MPC866/MPC859 Hardware Specifications, Rev. 2 80 Freescale Semiconductor Mechanical Data and Ordering Information Table 39 contains a list of the MPC866 input and output signals and shows multiplexing and pin assignments. Table 39. Pin Assignments Name Pin Number Type A[0:31] B19, B18, A18, C16, B17, A17, B16, A16, D15, C15, B15, A15, C14, B14, A14, D12, C13, B13, D9, D11, C12, B12, B10, B11, C11, D10, C10, A13, A10, A12, A11, A9 Bidirectional Three-state TSIZ0 REG B9 Bidirectional Three-state TSIZ1 C9 Bidirectional Three-state RD/WR B2 Bidirectional Three-state BURST F1 Bidirectional Three-state BDIP GPL_B5 D2 Output TS F3 Bidirectional Active Pull-up TA C2 Bidirectional Active Pull-up TEA D1 Open-drain BI E3 Bidirectional Active Pull-up IRQ2 RSV H3 Bidirectional Three-state IRQ4 KR RETRY SPKROUT K1 Bidirectional Three-state CR IRQ3 F2 Input D[0:31] W14, W12, W11, W10, W13, W9, W7, W6, U13, T11, V11, U11, T13, V13, V10, T10, U10, T12, V9, U9, V8, U8, T9, U12, V7, T8, U7, V12, V6, W5, U6, T7 Bidirectional Three-state DP0 IRQ3 V3 Bidirectional Three-state DP1 IRQ4 V5 Bidirectional Three-state DP2 IRQ5 W4 Bidirectional Three-state DP3 IRQ6 V4 Bidirectional Three-state MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 81 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type BR G4 Bidirectional BG E2 Bidirectional BB E1 Bidirectional Active Pull-up FRZ IRQ6 G3 Bidirectional IRQ0 V14 Input IRQ1 U14 Input M_TX_CLK IRQ7 W15 Input CS[0:5] C3, A2, D4, E4, A4, B4 Output CS6 CE1_B D5 Output CS7 CE2_B C4 Output WE0 BS_B0 IORD C7 Output WE1 BS_B1 IOWR A6 Output WE2 BS_B2 PCOE B6 Output WE3 BS_B3 PCWE A5 Output BS_A[0:3] D8, C8, A7, B8 Output GPL_A0 GPL_B0 D7 Output OE GPL_A1 GPL_B1 C6 Output GPL_A[2:3] GPL_B[2:3] CS[2–3] B5, C5 Output UPWAITA GPL_A4 C1 Bidirectional MPC866/MPC859 Hardware Specifications, Rev. 2 82 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type UPWAITB GPL_B4 B1 Bidirectional GPL_A5 D3 Output PORESET R2 Input RSTCONF P3 Input HRESET N4 Open-drain SRESET P2 Open-drain XTAL P1 Analog Output EXTAL N1 Analog Input (3.3V only) CLKOUT W3 Output EXTCLK N2 Input (3.3V only) TEXP N3 Output ALE_A MII-TXD1 K2 Output CE1_A MII-TXD2 B3 Output CE2_A MII-TXD3 A3 Output WAIT_A SOC_Split2 R3 Input WAIT_B R4 Input IP_A0 UTPB_Split02 MII-RXD3 T5 Input IP_A1 UTPB_Split12 MII-RXD2 T4 Input IP_A2 IOIS16_A UTPB_Split22 MII-RXD1 U3 Input IP_A3 UTPB_Split32 MII-RXD0 W2 Input IP_A4 UTPB_Split42 MII-RXCLK U4 Input MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 83 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type IP_A5 UTPB_Split52 MII-RXERR U5 Input IP_A6 UTPB_Split62 MII-TXERR T6 Input IP_A7 UTPB_Split72 MII-RXDV T3 Input ALE_B DSCK/AT1 J1 Bidirectional Three-state IP_B[0:1] IWP[0:1] VFLS[0:1] H2, J3 Bidirectional IP_B2 IOIS16_B AT2 J2 Bidirectional Three-state IP_B3 IWP2 VF2 G1 Bidirectional IP_B4 LWP0 VF0 G2 Bidirectional IP_B5 LWP1 VF1 J4 Bidirectional IP_B6 DSDI AT0 K3 Bidirectional Three-state IP_B7 PTR AT3 H1 Bidirectional Three-state OP0 MII-TXD0 UtpClk_Split2 L4 Bidirectional OP1 L2 Output OP2 MODCK1 STS L1 Bidirectional MPC866/MPC859 Hardware Specifications, Rev. 2 84 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type OP3 MODCK2 DSDO M4 Bidirectional BADDR30 REG K4 Output BADDR[28:29] M3, M2 Output AS L3 Input PA15 RXD1 RXD4 C18 Bidirectional PA14 TXD1 TXD4 D17 Bidirectional (Optional: Open-drain) PA13 RXD2 E17 Bidirectional PA12 TXD2 F17 Bidirectional (Optional: Open-drain) PA11 L1TXDB RXD3 G16 Bidirectional (Optional: Open-drain) PA10 L1RXDB TXD3 J17 Bidirectional (Optional: Open-drain) PA9 L1TXDA K18 Bidirectional (Optional: Open-drain) PA8 L1RXDA TXD4 L17 Bidirectional (Optional: Open-drain) PA7 CLK1 L1RCLKA BRGO1 TIN1 M19 Bidirectional PA6 CLK2 TOUT1 M17 Bidirectional RXD4 MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 85 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PA5 CLK3 L1TCLKA BRGO2 TIN2 N18 Bidirectional PA4 CLK4 TOUT2 P19 Bidirectional PA3 CLK5 BRGO3 TIN3 P17 Bidirectional PA2 CLK6 TOUT3 L1RCLKB R18 Bidirectional PA1 CLK7 BRGO4 TIN4 T19 Bidirectional PA0 CLK8 TOUT4 L1TCLKB U19 Bidirectional PB31 SPISEL REJECT1 C17 Bidirectional (Optional: Open-drain) PB30 SPICLK RSTRT2 C19 Bidirectional (Optional: Open-drain) PB29 SPIMOSI E16 Bidirectional (Optional: Open-drain) PB28 SPIMISO BRGO4 D19 Bidirectional (Optional: Open-drain) PB27 I2CSDA BRGO1 E19 Bidirectional (Optional: Open-drain) PB26 I2CSCL BRGO2 F19 Bidirectional (Optional: Open-drain) MPC866/MPC859 Hardware Specifications, Rev. 2 86 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PB25 RXADDR32 SMTXD1 J16 Bidirectional (Optional: Open-drain) PB24 TXADDR32 SMRXD1 J18 Bidirectional (Optional: Open-drain) PB23 TXADDR22 SDACK1 SMSYN1 K17 Bidirectional (Optional: Open-drain) PB22 TXADDR42 SDACK2 SMSYN2 L19 Bidirectional (Optional: Open-drain) PB21 SMTXD2 L1CLKOB PHSEL1 1 TXADDR1 2 K16 Bidirectional (Optional: Open-drain) PB20 SMRXD2 L1CLKOA PHSEL01 TXADDR02 L16 Bidirectional (Optional: Open-drain) PB19 RTS1 L1ST1 N19 Bidirectional (Optional: Open-drain) PB18 RXADDR42 RTS2 L1ST2 N17 Bidirectional (Optional: Open-drain) PB17 L1RQb L1ST3 RTS3 PHREQ11 RXADDR12 P18 Bidirectional (Optional: Open-drain) MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 87 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PB16 L1RQa L1ST4 RTS4 PHREQ01 RXADDR02 N16 Bidirectional (Optional: Open-drain) PB15 BRGO3 TxClav RxClav R17 Bidirectional PB14 RXADDR22 RSTRT1 U18 Bidirectional PC15 DREQ0 RTS1 L1ST1 RxClav TxClav D16 Bidirectional PC14 DREQ1 RTS2 L1ST2 D18 Bidirectional PC13 L1RQb L1ST3 RTS3 E18 Bidirectional PC12 L1RQa L1ST4 RTS4 F18 Bidirectional PC11 CTS1 J19 Bidirectional PC10 CD1 TGATE1 K19 Bidirectional PC9 CTS2 L18 Bidirectional PC8 CD2 TGATE2 M18 Bidirectional MPC866/MPC859 Hardware Specifications, Rev. 2 88 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PC7 CTS3 L1TSYNCB SDACK2 M16 Bidirectional PC6 CD3 L1RSYNCB R19 Bidirectional PC5 CTS4 L1TSYNCA SDACK1 T18 Bidirectional PC4 CD4 L1RSYNCA T17 Bidirectional PD15 L1TSYNCA MII-RXD3 UTPB0 U17 Bidirectional PD14 L1RSYNCA MII-RXD2 UTPB1 V19 Bidirectional PD13 L1TSYNCB MII-RXD1 UTPB2 V18 Bidirectional PD12 L1RSYNCB MII-MDC UTPB3 R16 Bidirectional PD11 RXD3 MII-TXERR RXENB T16 Bidirectional PD10 TXD3 MII-RXD0 TXENB W18 Bidirectional MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 89 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PD9 RXD4 MII-TXD0 UTPCLK V17 Bidirectional PD8 TXD4 MII-MDC MII-RXCLK W17 Bidirectional PD7 RTS3 MII-RXERR UTPB4 T15 Bidirectional PD6 RTS4 MII-RXDV UTPB5 V16 Bidirectional PD5 REJECT2 MII-TXD3 UTPB6 U15 Bidirectional PD4 REJECT3 MII-TXD2 UTPB7 U16 Bidirectional PD3 REJECT4 MII-TXD1 SOC W16 Bidirectional TMS G18 Input TDI DSDI H17 Input TCK DSCK H16 Input TRST G19 Input TDO DSDO G17 Output MII_CRS B7 Input MII_MDIO H18 Bidirectional MII_TXEN V15 Output MPC866/MPC859 Hardware Specifications, Rev. 2 90 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name 1 2 Pin Number Type MII_COL H4 Input VSSSYN1 V1 PLL analog VDD and GND VSSSYN U1 Power VDDSYN T1 Power GND F6, F7, F8, F9, F10, F11, F12, F13, F14, G6, G7, G8, G9, G10, G11, G12, G13, G14, H6, H7, H8, H9, H10, H11, H12, H13, H14, J6, J7, J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11, K12, K13, K14, L6, L7, L8, L9, L10, L11, L12, L13, L14, M6, M7, M8, M9, M10, M11, M12, M13, M14, N6, N7, N8, N9, N10, N11, N12, N13, N14, P6, P7, P8, P9, P10, P11, P12, P13, P14 Power VDDL A8, M1, W8, H19, F4, F16, P4, P16, R1 Power VDDH E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, F5, F15, G5, G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, P5, P15, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, T14 Power N/C D6, D13, D14, U2, V2, T2 No-connect Classic SAR mode only ESAR mode only MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 91 Mechanical Data and Ordering Information 15.2 Mechanical Dimensions of the PBGA Package For more information on the printed-circuit board layout of the PBGA package, including thermal via design and suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available from your local Freescale sales office. Figure 79 shows the mechanical dimensions of the PBGA package. Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package MPC866/MPC859 Hardware Specifications, Rev. 2 92 Freescale Semiconductor Document Revision History 16 Document Revision History Table 40 lists significant changes between revisions of this document. Table 40. Document Revision History Revision Number Date 0 5/2002 Initial revision 1 11/2002 Added the 5-V tolerant pins, new package dimensions, and other changes. 1.1 4/2003 Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb 2%Ag to Figure 15-79. 1.2 4/2003 Added the MPC859P. 1.3 5/2003 Changed the SPI Master Timing Specs. 162 and 164. 1.4 7-8/2003 • Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and B29b to show that TRLX can be 0 or 1. • Added nontechnical reformatting. 1.5 3/14/2005 • Updated document template. 2 2/10/2006 • Updated orderable parts table. Substantive Changes MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 93 Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC866/MPC859 Hardware Specifications, Rev. 2 94 Freescale Semiconductor Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC866/MPC859 Hardware Specifications, Rev. 2 Freescale Semiconductor 95 How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the Japan: Freescale Semiconductor Japan Ltd. Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-0047 Japan 0120 191014 +81 3 3440 3569 support.japan@freescale.com data sheets and/or specifications can and do vary in different applications and actual performance Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate, Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com where personal injury or death may occur. Should Buyer purchase or use Freescale For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 (800) 441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@ hibbertgroup.com MPC866EC Rev. 2 2/2006 information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor may vary over time. 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Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The described product contains a PowerPC processor core. The PowerPC name is a trademark of IBM Corp. and used under license. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
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