Freescale Semiconductor
MPC866EC
Rev. 2, 2/2006
Technical Data
MPC866/MPC859
Hardware Specifications
This document contains detailed information on power
considerations, DC/AC electrical characteristics, and AC timing
specifications for the MPC866/859 family (refer to Table 1 for a
list of devices). The MPC866P is the superset device of the
MPC866/859 family.This document describes pertinent electrical
and physical characteristics of the MPC8245. For functional
characteristics of the processor, refer to the MPC866
PowerQUICC Family Users Manual (MPC866UM/D).
1
Overview
The MPC866/859 is a derivative of Freescale’s MPC860
PowerQUICC™ family of devices. It is a versatile single-chip
integrated microprocessor and peripheral combination that can be
used in a variety of controller applications and communications
and networking systems. The MPC866/859/859DSL provides
enhanced ATM functionality over that of other ATM-enabled
members of the MPC860 family.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 8
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal Calculation and Measurement . . . . . . . . . . 12
Power Supply and Power Sequencing . . . . . . . . . . . 15
Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 16
IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 46
CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 48
UTOPIA AC Electrical Specifications . . . . . . . . . . . 72
FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 74
Mechanical Data and Ordering Information . . . . . . . 78
Document Revision History . . . . . . . . . . . . . . . . . . . 93
Features
Table 1 shows the functionality supported by the members of the MPC866/859 family.
2
Features
Table 1. MPC866 Family Functionality
Cache
Ethernet
Part
SCC
SMC
1
4
2
Up to 4
1
4
2
8 Kbytes
1
1
1
2
4 Kbytes
1
1
1
2
12
1
Instruction
Data
10T
10/100
MPC866P
16 Kbytes
8 Kbytes
Up to 4
MPC866T
4 Kbytes
4 Kbytes
MPC859P
16 Kbytes
MPC859T
4 Kbytes
MPC859DSL
4 Kbytes
4 Kbytes
1
1
11
MPC852T 3
4 KBytes
4 Kbytes
2
1
2
1
On the MPC859DSL, the SCC (SCC1) is for ethernet only. Also, the MPC859DSL does not support the Time Slot
Assigner (TSA).
2
On the MPC859DSL, the SMC (SMC1) is for UART only.
3
For more details on the MPC852T, please refer to the MPC852T Hardware Specifications.
The following list summarizes the key MPC866/859 features:
•
•
Embedded single-issue, 32-bit PowerPC™ core (implementing the PowerPC architecture) with
thirty-two 32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch, without conditional execution
— 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
– 16-Kbyte instruction cache (MPC866P and MPC859P) is four-way, set-associative with 256 sets;
4-Kbyte instruction cache (MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative
with 128 sets.
– 8-Kbyte data cache (MPC866P and MPC859P) is two-way, set-associative with 256 sets; 4-Kbyte
data cache(MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative with 128 sets.
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces
and 16 protection groups.
— Advanced on-chip-emulation debug mode
The MPC866/859 provides enhanced ATM functionality over that of the MPC860SAR. The MPC866/859
adds major new features available in 'enhanced SAR' (ESAR) mode, including the following:
— Improved operation, administration, and maintenance (OAM) support
— OAM performance monitoring (PM) support
— Multiple APC priority levels available to support a range of traffic pace requirements
MPC866/MPC859 Hardware Specifications, Rev. 2
2
Freescale Semiconductor
Features
—
—
—
—
•
•
•
•
•
•
ATM port-to-port switching capability without the need for RAM-based microcode
Simultaneous MII (10/100Base-T) and UTOPIA (half-duplex) capability
Optional statistical cell counters per PHY
UTOPIA level 2 compliant interface with added FIFO buffering to reduce the total cell transmission
time. (The earlier UTOPIA level 1 specification is also supported.)
– Multi-PHY support on the MPC866, MPC859P, and MPC859T
– Four PHY support on the MPC866/859
— Parameter RAM for both SPI and I2C can be relocated without RAM-based microcode
— Supports full-duplex UTOPIA both master (ATM side) and slave (PHY side) operation using a 'split' bus
— AAL2/VBR functionality is ROM-resident.
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
Thirty-two address lines
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank
— Up to 30 wait states programmable per memory bank
— Glueless interface to page mode/EDO/SDRAM, SRAM, EPROMs, flash EPROMs, and other memory
devices.
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbytes–256 Mbytes)
— Selectable write protection
— On-chip bus arbitration logic
General-purpose timers
— Four 16-bit timers cascadable to be two 32-bit timers
— Gate mode can enable/disable counting
— Interrupt can be masked on reference match and event capture
Fast Ethernet controller (FEC)
— Simultaneous MII (10/100Base-T) and UTOPIA operation when using the UTOPIA multiplexed bus
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Low-power stop mode
— Clock synthesizer
— Decrementer and time base from the PowerPC architecture
— Reset controller
— IEEE 1149.1 test access port (JTAG)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
3
Features
•
•
•
•
•
Interrupts
— Seven external interrupt request (IRQ) lines
— Twelve port pins with interrupt capability
— The MPC866P and MPC866T have 23 internal interrupt sources; the MPC859P, MPC859T, and
MPC859DSL have 20 internal interrupt sources.
— Programmable priority between SCCs (MPC866P and MPC866T)
— Programmable highest priority request
Communications processor module (CPM)
— RISC controller
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and
RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— Up to 8-Kbytes of dual-port RAM
— MPC866P and MPC866T have 16 serial DMA (SDMA) channels; MPC859P, MPC859T, and
MPC859DSL have 10 serial DMA (SDMA) channels.
— Three parallel I/O registers with open-drain capability
Four baud rate generators
— Independent (can be connected to any SCC or SMC)
— Allow changes during operation
— Autobaud support option
MPC866P and MPC866T have four SCCs (serial communication controller); MPC859P, MPC859T, and
MPC859DSL have one SCC; and SCC1 on MPC859DSL supports Ethernet only.
— Serial ATM capability on all SCCs
— Optional UTOPIA port on SCC4
— Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation
— HDLC/SDLC
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support PPP (point-to-point protocol)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC)
Two SMCs (serial management channels) (MPC859DSL has one SMC (SMC1) for UART.)
— UART
— Transparent
— General circuit interface (GCI) controller
— Can be connected to the time-division multiplexed (TDM) channels
MPC866/MPC859 Hardware Specifications, Rev. 2
4
Freescale Semiconductor
Features
•
•
•
•
•
•
•
•
•
•
One serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
One inter-integrated circuit (I2C) port
— Supports master and slave modes
— Multiple-master environment support
Time slot assigner (TSA) (MPC859DSL does not have TSA.)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user-defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— On MPC866P and MPC866T, can be internally connected to six serial channels (four SCCs and two
SMCs); on MPC859P and MPC859T, can be connected to three serial channels (one SCC and two
SMCs).
Parallel interface port (PIP)
— Centronics interface support
— Supports fast connection between compatible ports on MPC866/859 or MC68360
PCMCIA interface
— Master (socket) interface, compliant with PCI Local Bus Specification (Rev 2.1)
— Supports one or two PCMCIA sockets whether ESAR functionality is enabled
— Eight memory or I/O windows supported
Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two operate on
data.
— Supports conditions: = ≠ < >
— Each watchpoint can generate a breakpoint internally
Normal high and normal low power modes to conserve power
1.8 V core and 3.3 V I/O operation with 5-V TTL compatibility; refer to Table 6 for a listing of the 5-V
tolerant pins.
357-pin plastic ball grid array (PBGA) package
Operation up to 133 MHz
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
5
Features
The MPC866/859 is comprised of three modules that each use a 32-bit internal bus: MPC8xx core, system
integration unit (SIU), and communication processor module (CPM). The MPC866P block diagram is shown in
Figure 1. The MPC859P/859T/859DSL block diagram is shown in Figure 2.
16-Kbyte
Instruction Cache
Instruction
Bus
Embedded
MPC8xx
Processor
Core
System Interface Unit (SIU)
Unified
Bus
Instruction MMU
32-Entry ITLB
Load/Store
Bus
Memory Controller
Internal
External
Bus Interface Bus Interface
Unit
Unit
8-Kbyte
Data Cache
System Functions
Data MMU
32-Entry DTLB
PCMCIA/ATA Interface
Fast Ethernet
Controller
DMAs
FIFOs
10/100
Base-T
Media Access
Control
Parallel I/O
4
Timers
4 Baud Rate
Generators
Parallel Interface Port
Timers
and UTOPIA
Interrupt
8-Kbyte
Controllers Dual-Port RAM
32-Bit RISC Controller
and Program
ROM
16 Virtual
Serial
and
2
Independent
DMA
Channels
MII
SCC1
SCC2
SCC3
SCC4
SMC1
SMC2
SPI
I 2C
Time
TimeSlot
Slot Assigner
Assigner
Serial Interface
Figure 1. MPC866P Block Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
6
Freescale Semiconductor
Features
Instruction
Bus
Embedded
MPC8xx
Processor
Core
4-Kbyte †
Instruction Cache
System Interface Unit (SIU)
Unified
Bus
Instruction MMU
32-Entry ITLB
Load/Store
Bus
Memory Controller
Internal
External
Bus Interface Bus Interface
Unit
Unit
4-Kbyte †
Data Cache
System Functions
Data MMU
32-Entry DTLB
PCMCIA/ATA Interface
Fast Ethernet
Controller
DMAs
FIFOs
10/100
Base-T
Media Access
Control
Parallel I/O
4
Timers
4 Baud Rate
Generators
Parallel Interface Port
Timers
and UTOPIA
Interrupt
8-Kbyte
Controllers Dual-Port RAM
32-Bit RISC Controller
and Program
ROM
10 Virtual
Serial
and
2
Independent
DMA
Channels
MII
SCC1
SMC1
SMC2*
SPI
I2C
Time
TimeSlot
Slot Assigner*
Assigner
Serial Interface
†
The MPC859P has a 16-Kbyte instruction cache and a 8-Kbyte data cache.
* The MPC859DSL does not contain SMC2 nor the time slot assigner, and provides eight SDMA
controllers.
Figure 2. MPC859P/859T/MPC859DSL Block Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
7
Maximum Tolerated Ratings
3
Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the MPC866/859. Table 2 shows
the maximum tolerated ratings, and Table 3 shows the operating temperatures.
Table 2. Maximum Tolerated Ratings
Rating
Symbol
Supply voltage 1
Value
Unit
VDDH
– 0.3 to 4.0
V
VDDL
– 0.3 to 2.0
V
VDDSYN
– 0.3 to 2.0
V
100
mV
Difference between VDDL to VDDSYN
Input voltage 2
Vin
GND – 0.3 to VDDH
V
Storage temperature range
Tstg
–55 to +150
°C
1
2
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device. See page 15.
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than VDDH. This restriction applies to
power-up and normal operation (that is, if the MPC866/859 is unpowered, a voltage greater than 2.5 V must not be
applied to its inputs).
Table 3. Operating Temperatures
Rating
Temperature 1 (standard)
Temperature (extended)
1
Symbol
Value
Unit
TA(min)
0
°C
Tj(max)
95
°C
TA(min)
–40
°C
Tj(max)
100
°C
Minimum temperatures are guaranteed as ambient temperature, TA. Maximum temperatures are guaranteed as
junction temperature, Tj.
This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it
is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (for example, either GND or V DD).
MPC866/MPC859 Hardware Specifications, Rev. 2
8
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC866/859.
Table 4. MPC866/859 Thermal Resistance Data
Rating
Junction-to-ambient 1
Environment
Natural Convection
Single-layer board (1s)
Symbol
Value
Unit
RθJA 2
37
°C/W
Four-layer board (2s2p)
RθJMA
3
23
Single-layer board (1s)
RθJMA3
30
Four-layer board (2s2p)
RθJMA3
19
Junction-to-board 4
RθJB
13
5
RθJC
6
Natural Convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
Airflow (200 ft/min)
Junction-to-case
Junction-to-package top 6
1
2
3
4
5
6
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and junction
temperature per JEDEC JESD51-2.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
9
Power Dissipation
5
Power Dissipation
Table 5 shows power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice the bus speed.
Table 5. Power Dissipation (PD)
Die Revision
Bus Mode
CPU
Frequency
Typical 1
Maximum 2
Unit
0
1:1
50 MHz
110
140
mW
66 MHz
150
180
mW
66 MHz
140
160
mW
80 MHz
170
200
mW
100 MHz
210
250
mW
133 MHz
260
320
mW
2:1
1
2
Typical power dissipation at VDDL and VDDSYN is at 1.8 V. and VDDH is at 3.3 V.
Maximum power dissipation at VDDL and VDDSYN is at 1.9 V, and VDDH is at 3.465 V.
NOTE
Values in Table 5 represent VDDL based power dissipation and
do not include I/O power dissipation over VDDH. I/O power
dissipation varies widely by application due to buffer current,
depending on external circuitry. The VDDSYN power
dissipation is negligible.
6
DC Characteristics
Table 6 shows the DC electrical characteristics for the MPC866/859.
Table 6. DC Electrical Specifications
Characteristic
Operating voltage
Symbol
Min
Max
Unit
VDDL (core)
1.7
1.9
V
VDDH (I/O)
3.135
3.465
V
1.7
1.9
V
Difference between
VDDL to VDDSYN
—
100
mV
VIH
2.0
3.465
V
VDDSYN
Input high voltage (all inputs except EXTAL and
EXTCLK) 2
1
MPC866/MPC859 Hardware Specifications, Rev. 2
10
Freescale Semiconductor
DC Characteristics
Table 6. DC Electrical Specifications (continued)
Characteristic
Symbol
Min
Max
Unit
GND
0.8
V
0.7*(VDDH)
VDDH
V
Input low voltage
VIL
EXTAL, EXTCLK input high voltage
VIHC
Input leakage current, Vin = 5.5V (except TMS, TRST,
DSCK and DSDI pins) for 5 Volts Tolerant Pins 2
Iin
—
100
µA
Input leakage current, Vin = VDDH (except TMS, TRST,
DSCK, and DSDI)
IIn
—
10
µA
Input leakage current, Vin = 0 V (except TMS, TRST,
DSCK and DSDI pins)
IIn
—
10
µA
Input capacitance 3
Cin
—
20
pF
Output high voltage, IOH = – 2.0 mA,
except XTAL, and Open drain pins
VOH
2.4
—
V
Output low voltage
VOL
• IOL = 2.0 mA (CLKOUT)
• IOL = 3.2 mA 4
• IOL = 5.3 mA 5
• IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
• IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
—
0.5
V
1
The difference between VDDL and VDDSYN can not be more than 100 m V.
The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, MII_MDIO are 5 V
tolerant.
3 Input capacitance is periodically sampled.
4 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2,
IP_B(0:1)/IWP(0:1)/VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1,
IP_B6/DSDI/AT0, IP_B7/PTR/AT3, RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9,
L1RXDA/PA8, TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6,
TIN2/L1TCLKA/BRGO2/CLK3/PA5, TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3,
BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1, L1TCLKB/TOUT4/CLK8/PA0,
REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/PB28, BRGO1/I2CSDA/PB27,
BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/PB23, SMSYN2/SDACK2/PB22,
SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19, L1ST2/RTS2/PB18,
L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/DREQ0/PC15,
L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11, TGATE1/CD1/PC10,
CTS2/PC9, TGATE2/CD2/PC8, CTS3/SDACK2/L1TSYNCB/PC7, CD3/L1RSYNCB/PC6,
CTS4/SDACK1/L1TSYNCA/PC5, CD4/L1RSYNCA/PC4, PD15/L1TSYNCA, PD14/L1RSYNCA, PD13/L1TSYNCB,
PD12/L1RSYNCB, PD11/RXD3, PD10/TXD3, PD9/RXD4, PD8/TXD4, PD5/REJECT2, PD6/RTS4, PD7/RTS3,
PD4/REJECT3, PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3].
5
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD,
WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30).
2
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
11
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers.
The VDDSYN power dissipation is negligible.
7.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA +(RθJA x PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ-TA) are possible.
7.2
Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a
heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the
printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation
where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed-circuit board. It has been observed that the thermal performance of most plastic packages and especially
PBGA packages is strongly dependent on the board temperature; see Figure 3.
MPC866/MPC859 Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Thermal Calculation and Measurement
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
TJ = TB +(RθJB x PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature ºC
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
7.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
13
Thermal Calculation and Measurement
7.5
Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT +(ΨJT x PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a 40
gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by cooling effects of the thermocouple wire.
7.6
References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or
(Available from Global Engineering Documents)303-397-7956
JEDEC Specifications http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
MPC866/MPC859 Hardware Specifications, Rev. 2
14
Freescale Semiconductor
Power Supply and Power Sequencing
8
Power Supply and Power Sequencing
This section provides design considerations for the MPC866/859 power supply. The MPC866/859 has a core voltage
(VDDL) and PLL voltage (VDDSYN) that operates at a lower voltage than the I/O voltage VDDH. The I/O section
of the MPC866/859 is supplied with 3.3 V across VDDH and VSS (GND).
Signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, and MII_MDIO
are 5-V tolerant. All inputs cannot be more than 2.5 V greater than VDDH. In addition, 5-V tolerant pins cannot
exceed 5.5 V and the remaining input pins cannot exceed 3.465 V. This restriction applies to power up/down and
normal operation.
One consequence of multiple power supplies is that when power is initially applied the voltage rails ramp up at
different rates. The rates depend on the nature of the power supply, the type of load on each power supply, and the
manner in which different voltages are derived. The following restrictions apply:
•
•
VDDL must not exceed VDDH during power up and power down.
VDDL must not exceed 1.9 V and VDDH must not exceed 3.465 V.
These cautions are necessary for the long term reliability of the part. If they are violated, the electrostatic discharge
(ESD) protection diodes are forward-biased and excessive current can flow through these diodes. If the system
power supply design does not control the voltage sequencing, the circuit shown in Figure 4 can be added to meet
these requirements. The MUR420 Schottky diodes control the maximum potential difference between the external
bus and core power supplies on powerup and the 1N5820 diodes regulate the maximum potential difference on
powerdown.
VDDH
VDDL
MUR420
1N5820
Figure 4. Example Voltage Sequencing Circuit
9
Layout Practices
Each VDD pin on the MPC866/859 should be provided with a low-impedance path to the board’s supply.
Furthermore, each GND pin should be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The VDD power supply should be bypassed to ground using at least four 0.1 µF
bypass capacitors located as close as possible to the four sides of the package. Each board designed should be
characterized and additional appropriate decoupling capacitors should be used if required. The capacitor leads and
associated printed-circuit traces connecting to chip V DD and GND should be kept to less than 1/2” per capacitor lead.
At a minimum, a four-layer board employing two inner layers as VDD and GND planes should be used.
All output pins on the MPC866/859 have fast rise and fall times. Printed-circuit (PC) trace interconnection length
should be minimized in order to minimize undershoot and reflections caused by these fast output switching times.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
15
Bus Signal Timing
This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of 6” are
recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the
PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all unused
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins. For more information, please refer to Section 14.4.3, Clock Synthesizer Power (VDDSYN,
VSSSYN, VSSSYN1), in the MPC866 User’s Manual.
10 Bus Signal Timing
The maximum bus speed supported by the MPC866/859 is 66 MHz. Higher-speed parts must be operated in
half-speed bus mode (for example, an MPC866/859 used at 100 MHz must be configured for a 50-MHz bus).
Table 7 and Table 8 show the frequency ranges for standard part frequencies.
Table 7. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode)
Part Freq
50 MHz
66 MHz
Min
Max
Min
Max
Core
40
50
40
66.67
Bus
40
50
40
66.67
Table 8. Frequency Ranges for Standard Part Frequencies (2:1 Bus Mode)
Part
Freq
50 MHz
66 MHz
100 MHz
133 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Core
40
50
40
66.67
40
100
40
133.34
Bus
20
25
20
33.33
20
50
20
66.67
Table 9 shows the timings for the MPC866/859 at 33, 40, 50, and 66 MHz bus operation. The timing for the
MPC866/859 bus shown in this table assumes a 50-pF load for maximum delays and a 0-pF load for minimum
delays. CLKOUT assumes a 100-pF load maximum delay.
Table 9. Bus Operation Timings
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B1
Bus Period (CLKOUT) See Table 7
—
—
—
—
—
—
—
—
ns
B1a
EXTCLK to CLKOUT phase skew
–2
+2
–2
+2
–2
+2
–2
+2
ns
B1b
CLKOUT frequency jitter peak-to-peak
—
1
—
1
—
1
—
1
ns
B1c
Frequency jitter on EXTCLK
—
0.50
—
0.50
—
0.50
—
0.50
%
MPC866/MPC859 Hardware Specifications, Rev. 2
16
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
B1d
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT phase jitter peak-to-peak
for OSCLK ≥ 15 MHz
—
4
—
4
—
4
—
4
ns
CLKOUT phase jitter peak-to-peak
for OSCLK < 15 MHz
—
5
—
5
—
5
—
5
ns
B2
CLKOUT pulse width low (MIN = 0.4 x
B1, MAX = 0.6 x B1)
12.1
18.2
10.0
15.0
8.0
12.0
6.1
9.1
ns
B3
CLKOUT pulse width high (MIN = 0.4 x
B1, MAX = 0.6 x B1)
12.1
18.2
10.0
15.0
8.0
12.0
6.1
9.1
ns
B4
CLKOUT rise time
—
4.00
—
4.00
—
4.00
—
4.00
ns
B5
CLKOUT fall time
—
4.00
—
4.00
—
4.00
—
4.00
ns
B7
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3)
output hold (MIN = 0.25 x B1)
7.60
—
6.30
—
5.00
—
3.80
—
ns
B7a
CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR output hold (MIN =
0.25 x B1)
7.60
—
6.30
—
5.00
—
3.80
—
ns
B7b
CLKOUT to BR, BG, FRZ, VFLS(0:1),
VF(0:2), IWP(0:2), LWP(0:1), STS
output hold (MIN = 0.25 x B1)
7.60
—
6.30
—
5.00
—
3.80
—
ns
B8
CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31), DP(0:3),
valid (MAX = 0.25 x B1 + 6.3)
—
13.80
—
12.50
—
11.30
—
10.00
ns
B8a
CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR valid (MAX = 0.25
x B1 + 6.3)
—
13.80
—
12.50
—
11.30
—
10.00
ns
B8b
CLKOUT to BR, BG, VFLS(0:1),
VF(0:2), IWP(0:2), FRZ, LWP(0:1),
STS valid 4 (MAX = 0.25 x B1 + 6.3)
—
13.80
—
12.50
—
11.30
—
10.00
ns
B9
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3),
TSIZ(0:1), REG, RSV, AT(0:3), PTR
High-Z (MAX = 0.25 x B1 + 6.3)
7.60
13.80
6.30
12.50
5.00
11.30
3.80
10.00
ns
B11
CLKOUT to TS, BB assertion (MAX =
0.25 x B1 + 6.0)
7.60
13.60
6.30
12.30
5.00
11.00
3.80
9.80
ns
B11a CLKOUT to TA, BI assertion (when
driven by the memory controller or
PCMCIA interface) (MAX = 0.00 x B1 +
9.30 1)
2.50
9.30
2.50
9.30
2.50
9.30
2.50
9.80
ns
B12
7.60
12.30
6.30
11.00
5.00
9.80
3.80
8.50
ns
CLKOUT to TS, BB negation (MAX =
0.25 x B1 + 4.8)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
17
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B12a CLKOUT to TA, BI negation (when
driven by the memory controller or
PCMCIA interface) (MAX = 0.00 x B1 +
9.00)
2.50
9.00
2.50
9.00
2.50
9.00
2.50
9.00
ns
B13
CLKOUT to TS, BB High-Z (MIN = 0.25
x B1)
7.60
21.60
6.30
20.30
5.00
19.00
3.80
14.00
ns
B13a CLKOUT to TA, BI High-Z (when driven
by the memory controller or PCMCIA
interface) (MIN = 0.00 x B1 + 2.5)
2.50
15.00
2.50
15.00
2.50
15.00
2.50
15.00
ns
B14
CLKOUT to TEA assertion (MAX =
0.00 x B1 + 9.00)
2.50
9.00
2.50
9.00
2.50
9.00
2.50
9.00
ns
B15
CLKOUT to TEA High-Z (MIN = 0.00 x
B1 + 2.50)
2.50
15.00
2.50
15.00
2.50
15.00
2.50
15.00
ns
B16
TA, BI valid to CLKOUT (setup time)
(MIN = 0.00 x B1 + 6.00)
6.00
—
6.00
—
6.00
—
6.00
—
ns
B16a TEA, KR, RETRY, CR valid to CLKOUT
(setup time) (MIN = 0.00 x B1 + 4.5)
4.50
—
4.50
—
4.50
—
4.50
—
ns
B16b BB, BG, BR, valid to CLKOUT (setup
time) 2 (4 MIN = 0.00 x B1 + 0.00 )
4.00
—
4.00
—
4.00
—
4.00
—
ns
B17
1.00
—
1.00
—
1.00
—
2.00
—
ns
B17a CLKOUT to KR, RETRY, CR valid (hold
time) (MIN = 0.00 x B1 + 2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
B18
D(0:31), DP(0:3) valid to CLKOUT
rising edge (setup time) 4 (MIN = 0.00
x B1 + 6.00)
6.00
—
6.00
—
6.00
—
6.00
—
ns
B19
CLKOUT rising edge to D(0:31),
DP(0:3) valid (hold time) 4 (MIN = 0.00
x B1 + 1.00 5)
1.00
—
1.00
—
1.00
—
2.00
—
ns
B20
D(0:31), DP(0:3) valid to CLKOUT
falling edge (setup time) 6(MIN = 0.00
x B1 + 4.00)
4.00
—
4.00
—
4.00
—
4.00
—
ns
B21
CLKOUT falling edge to D(0:31),
DP(0:3) valid (hold Time) 6 (MIN = 0.00
x B1 + 2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
B22
CLKOUT rising edge to CS asserted
GPCM ACS = 00 (MAX = 0.25 x B1 +
6.3)
7.60
13.80
6.30
12.50
5.00
11.30
3.80
10.00
ns
—
8.00
—
8.00
—
8.00
—
8.00
ns
CLKOUT to TA, TEA, BI, BB, BG, BR
valid (hold time) (MIN = 0.00 x B1 +
1.00 3)
B22a CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0 (MAX =
0.00 x B1 + 8.00)
MPC866/MPC859 Hardware Specifications, Rev. 2
18
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B22b CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 0
(MAX = 0.25 x B1 + 6.3)
7.60
13.80
6.30
12.50
5.00
11.30
3.80
10.00
ns
B22c CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 1
(MAX = 0.375 x B1 + 6.6)
10.90
18.00
10.90
16.00
7.00
14.10
5.20
12.30
ns
B23
CLKOUT rising edge to CS negated
GPCM read access, GPCM write
access ACS = 00, TRLX = 0 & CSNT =
0 (MAX = 0.00 x B1 + 8.00)
2.00
8.00
2.00
8.00
2.00
8.00
2.00
8.00
ns
B24
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 0
(MIN = 0.25 x B1 - 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B24a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 0
(MIN = 0.50 x B1 - 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B25
CLKOUT rising edge to OE, WE(0:3)
asserted (MAX = 0.00 x B1 + 9.00)
—
9.00
—
9.00
—
9.00
—
9.00
ns
B26
CLKOUT rising edge to OE negated
(MAX = 0.00 x B1 + 9.00)
2.00
9.00
2.00
9.00
2.00
9.00
2.00
9.00
ns
B27
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25 x B1 - 2.00)
35.90
—
29.30
—
23.00
—
16.90
—
ns
B27a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50 x B1 - 2.00)
43.50
—
35.50
—
28.00
—
20.70
—
ns
—
9.00
—
9.00
—
9.00
—
9.00
ns
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
—
14.30
—
13.00
—
11.80
—
10.50
ns
10.90
18.00
10.90
18.00
7.00
14.30
5.20
12.30
ns
B28
CLKOUT rising edge to WE(0:3)
negated GPCM write access CSNT =
0 (MAX = 0.00 x B1 + 9.00)
B28a CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0,1, CSNT = 1, EBDF = 0 (MAX = 0.25
x B1 + 6.80)
B28b CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
CSNT = 1, ACS = 10 or ACS = 11,
EBDF = 0 (MAX = 0.25 x B1 + 6.80)
B28c CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0, CSNT = 1 write access TRLX = 0,1,
CSNT = 1, EBDF = 1 (MAX = 0.375 x
B1 + 6.6)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
19
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
—
18.00
—
18.00
—
14.30
—
12.30
ns
WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, CSNT = 0,
EBDF = 0 (MIN = 0.25 x B1 - 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B29a WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 0 (MIN = 0.50 x B1
– 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B29b CS negated to D(0:31), DP(0:3), High
Z GPCM write access, ACS = 00,
TRLX = 0,1 & CSNT = 0 (MIN = 0.25 x
B1– 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B29c CS negated to D(0:31), DP(0:3) High-Z
GPCM write access, TRLX = 0, CSNT
= 1, ACS = 10, or ACS = 11, EBDF = 0
(MIN = 0.50 x B1 – 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B29d WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 0 (MIN = 1.50 x B1
– 2.00)
43.50
—
35.50
—
28.00
—
20.70
—
ns
B29e CS negated to D(0:31), DP(0:3) High-Z
GPCM write access, TRLX = 1, CSNT
= 1, ACS = 10, or ACS = 11, EBDF = 0
(MIN = 1.50 x B1 – 2.00)
43.50
—
35.50
—
28.00
—
20.70
—
ns
B29f WE(0:3) negated to D(0:31), DP(0:3)
High Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 1 (MIN = 0.375 x
B1 – 6.30)
5.00
—
3.00
—
1.10
—
0.00
—
ns
B29g CS negated to D(0:31), DP(0:3) High-Z
GPCM write access, TRLX = 0, CSNT
= 1 ACS = 10 or ACS = 11, EBDF = 1
(MIN = 0.375 x B1 – 6.30)
5.00
—
3.00
—
1.10
—
0.00
—
ns
B29h WE(0:3) negated to D(0:31), DP(0:3)
High Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 1 (MIN = 0.375 x
B1 – 3.30)
38.40
—
31.10
—
24.20
—
17.50
—
ns
B29i CS negated to D(0:31), DP(0:3) High-Z
GPCM write access, TRLX = 1, CSNT
= 1, ACS = 10 or ACS = 11, EBDF = 1
(MIN = 0.375 x B1 – 3.30)
38.40
—
31.10
—
24.20
—
17.50
—
ns
B28d CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
CSNT = 1, ACS = 10, or ACS = 11,
EBDF = 1 (MAX = 0.375 x B1 + 6.6)
B29
MPC866/MPC859 Hardware Specifications, Rev. 2
20
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
5.60
—
4.30
—
3.00
—
1.80
—
ns
B30a WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM, write
access, TRLX = 0, CSNT = 1, CS
negated to A(0:31) invalid GPCM write
access TRLX = 0, CSNT =1 ACS = 10,
or ACS == 11, EBDF = 0 (MIN = 0.50 x
B1 – 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B30b WE(0:3) negated to A(0:31) invalid
GPCM BADDR(28:30) invalid GPCM
write access, TRLX = 1, CSNT = 1. CS
negated to A(0:31) invalid GPCM write
access TRLX = 1, CSNT = 1, ACS =
10, or ACS == 11 EBDF = 0 (MIN =
1.50 x B1 – 2.00)
43.50
—
35.50
—
28.00
—
20.70
—
ns
B30c WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1. CS
negated to A(0:31) invalid GPCM write
access, TRLX = 0, CSNT = 1 ACS =
10, ACS == 11, EBDF = 1 (MIN = 0.375
x B1 – 3.00)
8.40
—
6.40
—
4.50
—
2.70
—
ns
B30d WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access TRLX = 1, CSNT =1, CS
negated to A(0:31) invalid GPCM write
access TRLX = 1, CSNT = 1, ACS = 10
or 11, EBDF = 1
38.67
—
31.38
—
24.50
—
17.83
—
ns
B31
CLKOUT falling edge to CS valid, as
requested by control bit CST4 in the
corresponding word in the UPM (MAX
= 0.00 X B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B31a CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B31b CLKOUT rising edge to CS valid, as
requested by control bit CST2 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c CLKOUT rising edge to CS valid, as
requested by control bit CST3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.30)
7.60
13.80
6.30
12.50
5.00
11.30
3.80
10.00
ns
B30
CS, WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access 7 (MIN = 0.25 x B1 – 2.00)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
21
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B31d CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF
= 1 (MAX = 0.375 x B1 + 6.6)
13.30
18.00
11.30
16.00
9.40
14.10
7.60
12.30
ns
B32
CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 0 (MAX = 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B32b CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B32d CLKOUT falling edge to BS valid- as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 1 (MAX = 0.375 x B1 + 6.60)
13.30
18.00
11.30
16.00
9.40
14.10
7.60
12.30
ns
B33
CLKOUT falling edge to GPL valid, as
requested by control bit GxT4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B33a CLKOUT rising edge to GPL valid, as
requested by control bit GxT3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60
14.30
6.30
13.00
5.00
11.80
3.80
10.50
ns
B34
A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST4 in the corresponding word in the
UPM (MIN = 0.25 x B1 - 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B34a A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST1 in the corresponding word in the
UPM (MIN = 0.50 x B1 – 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B34b A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by CST2 in
the corresponding word in UPM (MIN =
0.75 x B1 – 2.00)
20.70
—
16.70
—
13.00
—
9.40
—
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
22
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
A(0:31), BADDR(28:30) to CS valid, as
requested by control bit BST4 in the
corresponding word in the UPM (MIN =
0.25 x B1 – 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B35a A(0:31), BADDR(28:30), and D(0:31)
to BS valid, as Requested by BST1 in
the corresponding word in the UPM
(MIN = 0.50 x B1 – 2.00)
13.20
—
10.50
—
8.00
—
5.60
—
ns
B35b A(0:31), BADDR(28:30), and D(0:31)
to BS valid, as requested by control bit
BST2 in the corresponding word in the
UPM (MIN = 0.75 x B1 – 2.00)
20.70
—
16.70
—
13.00
—
9.40
—
ns
B36
A(0:31), BADDR(28:30), and D(0:31)
to GPL valid as requested by control bit
GxT4 in the corresponding word in the
UPM (MIN = 0.25 x B1 – 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
B37
UPWAIT valid to CLKOUT falling
edge 8 (MIN = 0.00 x B1 + 6.00)
6.00
—
6.00
—
6.00
—
6.00
—
ns
B38
CLKOUT falling edge to UPWAIT
valid8 (MIN = 0.00 x B1 + 1.00)
1.00
—
1.00
—
1.00
—
1.00
—
ns
B39
AS valid to CLKOUT rising edge 9 (MIN
= 0.00 x B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B40
A(0:31), TSIZ(0:1), RD/WR, BURST,
valid to CLKOUT rising edge (MIN =
0.00 x B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B41
TS valid to CLKOUT rising edge (setup
time) (MIN = 0.00 x B1 + 7.00)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B42
CLKOUT rising edge to TS valid (hold
time) (MIN = 0.00 x B1 + 2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
B43
AS negation to memory controller
signals negation (MAX = TBD)
—
TBD
—
TBD
—
TBD
—
TBD
ns
B35
1
2
3
4
5
6
7
For part speeds above 50 MHz, use 9.80 ns for B11a.
The timing required for BR input is relevant when the MPC866/859 is selected to work with the internal bus arbiter.
The timing for BG input is relevant when the MPC866/859 is selected to work with the external bus arbiter.
For part speeds above 50 MHz, use 2 ns for B17.
The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of CLKOUT, in which the TA input signal
is asserted.
For part speeds above 50 MHz, use 2 ns for B19.
The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of CLKOUT. This timing is valid only for
read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats, where
DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
23
Bus Signal Timing
8
The signal UPWAIT is considered asynchronous to CLKOUT and synchronized internally. The timings specified in
B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 20.
9
The AS signal is considered asynchronous to CLKOUT. The timing B39 is specified in order to allow the behavior
specified in Figure 23.
Figure 5 shows the control timing diagram.
2.0 V
CLKOUT
2.0 V
0.8 V
0.8 V
A
B
2.0 V
0.8 V
Outputs
2.0 V
0.8 V
A
B
2.0 V
0.8 V
Outputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
A
Maximum output delay specification
B
Minimum output hold time
C
Minimum input setup time specification
D
Minimum input hold time specification
2.0 V
0.8 V
Figure 5. Control Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
24
Freescale Semiconductor
Bus Signal Timing
Figure 6 shows the timing for the external clock.
CLKOUT
B1
B3
B1
B4
B2
B5
Figure 6. External Clock Timing
Figure 7 shows the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
Output
Signals
B8a
B7a
B9
Output
Signals
B8b
B7b
Output
Signals
Figure 7. Synchronous Output Signals Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
25
Bus Signal Timing
Figure 8 shows the timing for the synchronous active pull-up and open-drain output signals.
CLKOUT
B13
B11
B12
TS, BB
B13a
B11a
B12a
TA, BI
B14
B15
TEA
Figure 8. Synchronous Active Pull-Up Resistor and Open-Drain Output Signals Timing
Figure 9 shows the timing for the synchronous input signals.
CLKOUT
B16
B17
TA, BI
B16a
B17a
TEA, KR,
RETRY, CR
B16b
B17
BB, BG, BR
Figure 9. Synchronous Input Signals Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
26
Freescale Semiconductor
Bus Signal Timing
Figure 10 shows normal case timing for input data. It also applies to normal read accesses under the control of the
UPM in the memory controller.
CLKOUT
B16
B17
TA
B18
B19
D[0:31],
DP[0:3]
Figure 10. Input Data Timing in Normal Case
Figure 11 shows the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM
RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
CLKOUT
TA
B20
B21
D[0:31],
DP[0:3]
Figure 11. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
27
Bus Signal Timing
Figure 12 through Figure 15 show the timing for the external bus read controlled by various GPCM factors.
CLKOUT
B11
B12
TS
B8
A[0:31]
B22
B23
CSx
B25
B26
OE
B28
WE[0:3]
B19
B18
D[0:31],
DP[0:3]
Figure 12. External Bus Read Timing (GPCM Controlled—ACS = 00)
MPC866/MPC859 Hardware Specifications, Rev. 2
28
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B24
B25
B26
OE
B18
B19
D[0:31],
DP[0:3]
Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10)
CLKOUT
B11
B12
TS
B8
B22b
A[0:31]
B22c
B23
CSx
B24a
B25
B26
OE
B18
B19
D[0:31],
DP[0:3]
Figure 14. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 11)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
29
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B27
OE
B26
B27a
B22b B22c
B18
B19
D[0:31],
DP[0:3]
Figure 15. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10, ACS = 11)
MPC866/MPC859 Hardware Specifications, Rev. 2
30
Freescale Semiconductor
Bus Signal Timing
Figure 16 through Figure 18 show the timing for the external bus write controlled by various GPCM factors.
CLKOUT
B11
B12
TS
B8
B30
A[0:31]
B22
B23
CSx
B25
B28
WE[0:3]
B26
B29b
OE
B29
B8
B9
D[0:31],
DP[0:3]
Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
31
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30a B30c
A[0:31]
B22
B28b B28d
B23
CSx
B25
B29c B29g
WE[0:3]
B26
B29a B29f
OE
B28a B28c
B8
B9
D[0:31],
DP[0:3]
Figure 17. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
32
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30b B30d
A[0:31]
B22
B28b B28d
B23
CSx
B25
B29e B29i
WE[0:3]
B26
B29d B29h
OE
B29b
B8
B28a B28c
B9
D[0:31],
DP[0:3]
Figure 18. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
33
Bus Signal Timing
Figure 19 shows the timing for the external bus controlled by the UPM.
CLKOUT
B8
A[0:31]
B31a
B31d
B31
B31c
B31b
CSx
B34
B34a
B34b
B32a B32d
B32
B32c
B32b
BS_A[0:3],
BS_B[0:3]
B35 B36
B35a
B33a
B35b
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 19. External Bus Timing (UPM Controlled Signals)
MPC866/MPC859 Hardware Specifications, Rev. 2
34
Freescale Semiconductor
Bus Signal Timing
Figure 20 shows the timing for the asynchronous asserted UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 20. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing
Figure 21 shows the timing for the asynchronous negated UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 21. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
35
Bus Signal Timing
Figure 22 shows the timing for the synchronous external master access controlled by the GPCM.
CLKOUT
B41
B42
TS
B40
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 22. Synchronous External Master Access Timing (GPCM Handled ACS = 00)
MPC866/MPC859 Hardware Specifications, Rev. 2
36
Freescale Semiconductor
Bus Signal Timing
Figure 23 shows the timing for the asynchronous external master memory access controlled by the GPCM.
CLKOUT
B39
AS
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 23. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00)
Figure 24 shows the timing for the asynchronous external master control signals negation.
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 24. Asynchronous External Master—Control Signals Negation Timing
Table 10 shows the interrupt timing for the MPC866/859.
Table 10. Interrupt Timing
All Frequencies
Characteristic 1
Num
1
Unit
Min
Max
I39
IRQx valid to CLKOUT rising edge (setup time)
6.00
—
ns
I40
IRQx hold time after CLKOUT
2.00
—
ns
I41
IRQx pulse width low
3.00
—
ns
I42
IRQx pulse width high
3.00
—
ns
I43
IRQx edge-to-edge time
4xTCLOCKOUT
—
—
The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as
level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry, and has
no direct relation with the total system interrupt latency that the MPC866/859 is able to support.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
37
Bus Signal Timing
Figure 25 shows the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 25. Interrupt Detection Timing for External Level Sensitive Lines
Figure 26 shows the interrupt detection timing for the external edge-sensitive lines.
CLKOUT
I41
I42
IRQx
I43
I43
Figure 26. Interrupt Detection Timing for External Edge Sensitive Lines
Table 11 shows the PCMCIA timing for the MPC866/859.
Table 11. PCMCIA Timing
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
A(0:31), REG valid to PCMCIA
Strobe asserted 1 (MIN = 0.75 x B1
– 2.00)
20.70
—
16.70
—
13.00
—
9.40
—
ns
P44
P45
A(0:31), REG valid to ALE
28.30
negation1 (MIN = 1.00 x B1 – 2.00)
—
23.00
—
18.00
—
13.20
—
ns
P46
CLKOUT to REG valid (MAX = 0.25
x B1 + 8.00)
7.60
15.60
6.30
14.30
5.00
13.00
3.80
11.80
ns
P47
CLKOUT to REG invalid (MIN =
0.25 x B1 + 1.00)
8.60
—
7.30
—
6.00
—
4.80
—
ns
P48
CLKOUT to CE1, CE2 asserted
(MAX = 0.25 x B1 + 8.00)
7.60
15.60
6.30
14.30
5.00
13.00
3.80
11.80
ns
P49
CLKOUT to CE1, CE2 negated
(MAX = 0.25 x B1 + 8.00)
7.60
15.60
6.30
14.30
5.00
13.00
3.80
11.80
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
38
Freescale Semiconductor
Bus Signal Timing
Table 11. PCMCIA Timing (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT to PCOE, IORD, PCWE,
IOWR assert time (MAX = 0.00 x
B1 + 11.00)
—
11.00
—
11.00
—
11.00
—
11.00
ns
P50
CLKOUT to PCOE, IORD, PCWE,
IOWR negate time (MAX = 0.00 x
B1 + 11.00)
2.00
11.00
2.00
11.00
2.00
11.00
2.00
11.00
ns
P51
P52
CLKOUT to ALE assert time (MAX
= 0.25 x B1 + 6.30)
7.60
13.80
6.30
12.50
5.00
11.30
3.80
10.00
ns
P53
CLKOUT to ALE negate time (MAX
= 0.25 x B1 + 8.00)
—
15.60
—
14.30
—
13.00
—
11.80
ns
P54
PCWE, IOWR negated to D(0:31)
invalid1 (MIN = 0.25 x B1 – 2.00)
5.60
—
4.30
—
3.00
—
1.80
—
ns
WAITA and WAITB valid to
CLKOUT rising edge1 (MIN = 0.00
x B1 + 8.00)
8.00
—
8.00
—
8.00
—
8.00
—
ns
P55
CLKOUT rising edge to WAITA and
WAITB invalid1 (MIN = 0.00 x B1 +
2.00)
2.00
—
2.00
—
2.00
—
2.00
—
ns
P56
1
PSST = 1. Otherwise, add PSST times cycle time.
PSHT = 0. Otherwise, add PSHT times cycle time.
These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the PCMCIA
current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL timer expiration. See
PCMCIA Interface in the MPC866 PowerQUICC User’s Manual.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
39
Bus Signal Timing
Figure 27 shows the PCMCIA access cycle timing for the external bus read.
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
PCOE, IORD
P52
ALE
B18
B19
D[0:31]
Figure 27. PCMCIA Access Cycles Timing External Bus Read
MPC866/MPC859 Hardware Specifications, Rev. 2
40
Freescale Semiconductor
Bus Signal Timing
Figure 28 shows the PCMCIA access cycle timing for the external bus write.
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
B8
B9
P54
PCWE, IOWR
P52
ALE
D[0:31]
Figure 28. PCMCIA Access Cycles Timing External Bus Write
Figure 29 shows the PCMCIA WAIT signals detection timing.
CLKOUT
P55
P56
WAITx
Figure 29. PCMCIA WAIT Signals Detection Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
41
Bus Signal Timing
Table 12 shows the PCMCIA port timing for the MPC866/859.
Table 12. PCMCIA Port Timing
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
P57
CLKOUT to OPx, valid (MAX = 0.00 x B1
+ 19.00)
—
19.00
—
19.00
—
19.00
—
19.00
ns
P58
HRESET negated to OPx drive 1(MIN =
0.75 x B1 + 3.00)
25.70
—
21.70
—
18.00
—
14.40
—
ns
P59
IP_Xx valid to CLKOUT rising edge (MIN
= 0.00 x B1 + 5.00)
5.00
—
5.00
—
5.00
—
5.00
—
ns
P60
CLKOUT rising edge to IP_Xx invalid
(MIN = 0.00 x B1 + 1.00)
1.00
—
1.00
—
1.00
—
1.00
—
ns
1
OP2 and OP3 only.
Figure 30 shows the PCMCIA output port timing for the MPC866/859.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 30. PCMCIA Output Port Timing
Figure 31 shows the PCMCIA output port timing for the MPC866/859.
CLKOUT
P59
P60
Input
Signals
Figure 31. PCMCIA Input Port Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
42
Freescale Semiconductor
Bus Signal Timing
Table 13 shows the debug port timing for the MPC866/859.
Table 13. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
3xT CLOCKOUT
—
D61
DSCK cycle time
D62
DSCK clock pulse width
1.25xT CLOCKOUT
—
D63
DSCK rise and fall times
0.00
3.00
ns
D64
DSDI input data setup time
8.00
—
ns
D65
DSDI data hold time
5.00
—
ns
D66
DSCK low to DSDO data valid
0.00
15.00
ns
D67
DSCK low to DSDO invalid
0.00
2.00
ns
Figure 32 shows the input timing for the debug port clock.
DSCK
D61
D62
D61
D62
D63
D63
Figure 32. Debug Port Clock Input Timing
Figure 33 shows the timing for the debug port.
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 33. Debug Port Timings
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
43
Bus Signal Timing
Table 14 shows the reset timing for the MPC866/859.
Table 14. Reset Timing
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
R69
CLKOUT to HRESET high impedance
(MAX = 0.00 x B1 + 20.00)
—
20.00 —
20.00 —
20.00 —
20.00 ns
R70
CLKOUT to SRESET high impedance
(MAX = 0.00 x B1 + 20.00)
—
20.00 —
20.00 —
20.00 —
20.00 ns
R71
RSTCONF pulse width (MIN = 17.00 x
B1)
515.20 —
425.00 —
340.00 —
257.60 —
ns
R72
—
—
—
—
—
—
—
Configuration data to HRESET rising
edge setup time (MIN = 15.00 x B1 +
50.00)
504.50 —
425.00 —
350.00 —
277.30 —
ns
R73
Configuration data to RSTCONF rising
edge setup time (MIN = 0.00 x B1 +
350.00)
350.00 —
350.00 —
350.00 —
350.00 —
ns
R74
Configuration data hold time after
0.00
RSTCONF negation (MIN = 0.00 x B1 +
0.00)
—
0.00
—
0.00
—
0.00
—
ns
R75
Configuration data hold time after
HRESET negation (MIN = 0.00 x B1 +
0.00)
0.00
—
0.00
—
0.00
—
0.00
—
ns
R76
HRESET and RSTCONF asserted to
data out drive (MAX = 0.00 x B1 +
25.00)
—
25.00 —
25.00 —
25.00 —
25.00 ns
R77
R78
RSTCONF negated to data out high
impedance (MAX = 0.00 x B1 + 25.00)
—
25.00 —
25.00 —
25.00 —
25.00 ns
CLKOUT of last rising edge before chip —
three-states HRESET to data out high
impedance (MAX = 0.00 x B1 + 25.00)
25.00 —
25.00 —
25.00 —
25.00 ns
R79
R80
DSDI, DSCK setup (MIN = 3.00 x B1)
—
75.00
—
60.00
—
45.50
—
ns
R81
DSDI, DSCK hold time (MIN = 0.00 x B1 0.00
+ 0.00)
—
0.00
—
0.00
—
0.00
—
ns
242.40 —
SRESET negated to CLKOUT rising
edge for DSDI and DSCK sample (MIN
= 8.00 x B1)
121.20 —
ns
R82
90.90
—
—
200.00 —
—
160.00 —
MPC866/MPC859 Hardware Specifications, Rev. 2
44
Freescale Semiconductor
Bus Signal Timing
Figure 34 shows the reset timing for the data bus configuration.
HRESET
R71
R76
RSTCONF
R73
R74
R75
D[0:31] (IN)
Figure 34. Reset Timing—Configuration from Data Bus
Figure 35 shows the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 35. Reset Timing—Data Bus Weak Drive During Configuration
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
45
IEEE 1149.1 Electrical Specifications
Figure 36 shows the reset timing for the debug port configuration.
CLKOUT
R70
R82
SRESET
R80
R80
R81
R81
DSCK, DSDI
Figure 36. Reset Timing—Debug Port Configuration
11 IEEE 1149.1 Electrical Specifications
Table 15 shows the JTAG timings for the MPC866/859 shown in Figure 37 through Figure 40.
Table 15. JTAG Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
J82
TCK cycle time
100.00
—
ns
J83
TCK clock pulse width measured at 1.5 V
40.00
—
ns
J84
TCK rise and fall times
0.00
10.00
ns
J85
TMS, TDI data setup time
5.00
—
ns
J86
TMS, TDI data hold time
25.00
—
ns
J87
TCK low to TDO data valid
—
27.00
ns
J88
TCK low to TDO data invalid
0.00
—
ns
J89
TCK low to TDO high impedance
—
20.00
ns
J90
TRST assert time
100.00
—
ns
J91
TRST setup time to TCK low
40.00
—
ns
J92
TCK falling edge to output valid
—
50.00
ns
J93
TCK falling edge to output valid out of high impedance
—
50.00
ns
J94
TCK falling edge to output high impedance
—
50.00
ns
J95
Boundary scan input valid to TCK rising edge
50.00
—
ns
J96
TCK rising edge to boundary scan input invalid
50.00
—
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
46
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 37. JTAG Test Clock Input Timing
TCK
J85
J86
TMS, TDI
J87
J88
J89
TDO
Figure 38. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 39. JTAG TRST Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
47
CPM Electrical Characteristics
TCK
J92
J94
Output
Signals
J93
Output
Signals
J95
J96
Output
Signals
Figure 40. Boundary Scan (JTAG) Timing Diagram
12 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module (CPM) of
the MPC866/859.
12.1 PIP/PIO AC Electrical Specifications
Table 16 shows the PIP/PIO AC timings as shown in Figure 41 through Figure 45.
Table 16. PIP/PIO Timing
All Frequencies
Num
Characteristic
Unit
Min
21
1
Data-in setup time to STBI low
Max
0
2.5 – t3
1
—
ns
—
clk
22
Data-In hold time to STBI high
23
STBI pulse width
1.5
—
clk
24
STBO pulse width
1 clk – 5ns
—
ns
25
Data-out setup time to STBO low
2
—
clk
26
Data-out hold time from STBO high
5
—
clk
27
STBI low to STBO low (Rx interlock)
—
2
clk
28
STBI low to STBO high (Tx interlock)
2
—
clk
29
Data-in setup time to clock high
15
—
ns
30
Data-in hold time from clock high
7.5
—
ns
31
Clock low to data-out valid (CPU writes data, control, or direction)
—
25
ns
t3 = Specification 23
MPC866/MPC859 Hardware Specifications, Rev. 2
48
Freescale Semiconductor
CPM Electrical Characteristics
DATA-IN
21
22
23
STBI
27
24
STBO
Figure 41. PIP Rx (Interlock Mode) Timing Diagram
DATA-OUT
25
26
24
STBO
(Output)
28
23
STBI
(Input)
Figure 42. PIP Tx (Interlock Mode) Timing Diagram
DATA-IN
21
22
23
STBI
(Input)
24
STBO
(Output)
Figure 43. PIP Rx (Pulse Mode) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
49
CPM Electrical Characteristics
DATA-OUT
25
26
24
STBO
(Output)
23
STBI
(Input)
Figure 44. PIP TX (Pulse Mode) Timing Diagram
CLKO
29
30
DATA-IN
31
DATA-OUT
Figure 45. Parallel I/O Data-In/Data-Out Timing Diagram
12.2 Port C Interrupt AC Electrical Specifications
Table 17 shows timings for port C interrupts.
Table 17. Port C Interrupt Timing
33.34 MHz
Num
Characteristic
Unit
Min
Max
35
Port C interrupt pulse width low (edge-triggered mode)
55
—
ns
36
Port C interrupt minimum time between active edges
55
—
ns
Figure 46 shows the port C interrupt detection timing.
MPC866/MPC859 Hardware Specifications, Rev. 2
50
Freescale Semiconductor
CPM Electrical Characteristics
36
Port C
(Input)
35
Figure 46. Port C Interrupt Detection Timing
12.3 IDMA Controller AC Electrical Specifications
Table 18 shows the IDMA controller timings as shown in Figure 47 through Figure 50.
Table 18. IDMA Controller Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
40
DREQ setup time to clock high
7
—
ns
41
DREQ hold time from clock high
3
—
ns
42
SDACK assertion delay from clock high
—
12
ns
43
SDACK negation delay from clock low
—
12
ns
44
SDACK negation delay from TA low
—
20
ns
45
SDACK negation delay from clock high
—
15
ns
46
TA assertion to falling edge of the clock setup time (applies to external TA)
7
—
ns
CLKO
(Output)
41
40
DREQ
(Input)
Figure 47. IDMA External Requests Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
51
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 48. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 49. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
MPC866/MPC859 Hardware Specifications, Rev. 2
52
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 50. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
12.4 Baud Rate Generator AC Electrical Specifications
Table 19 shows the baud rate generator timings as shown in Figure 51.
Table 19. Baud Rate Generator Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
50
BRGO rise and fall time
—
10
ns
51
BRGO duty cycle
40
60
%
52
BRGO cycle
40
—
ns
50
50
BRGOX
51
51
52
Figure 51. Baud Rate Generator Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
53
CPM Electrical Characteristics
12.5 Timer AC Electrical Specifications
Table 20 shows the general-purpose timer timings as shown in Figure 52.
Table 20. Timer Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
61
TIN/TGATE rise and fall time
10
—
ns
62
TIN/TGATE low time
1
—
clk
63
TIN/TGATE high time
2
—
clk
64
TIN/TGATE cycle time
3
—
clk
65
CLKO low to TOUT valid
3
25
ns
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 52. CPM General-Purpose Timers Timing Diagram
12.6 Serial Interface AC Electrical Specifications
Table 21 shows the serial interface timings as shown in Figure 53 through Figure 57.
Table 21. SI Timing
All Frequencies
Num
70
Characteristic
Unit
L1RCLK, L1TCLK frequency (DSC = 0) 1, 2
2
71
L1RCLK, L1TCLK width low (DSC = 0)
71a
L1RCLK, L1TCLK width high (DSC = 0) 3
72
L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time
73
L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC
setup time)
Min
Max
—
SYNCCLK/2.5
MHz
P + 10
—
ns
P + 10
—
ns
—
15.00
ns
20.00
—
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
54
Freescale Semiconductor
CPM Electrical Characteristics
Table 21. SI Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
35.00
—
ns
—
15.00
ns
74
L1CLK edge to L1RSYNC, L1TSYNC, invalid
(SYNC hold time)
75
L1RSYNC, L1TSYNC rise/fall time
76
L1RXD valid to L1CLK edge (L1RXD setup time)
17.00
—
ns
77
L1CLK edge to L1RXD invalid (L1RXD hold time)
13.00
—
ns
78
L1CLK edge to L1ST(1–4) valid 4
10.00
45.00
ns
78A
L1SYNC valid to L1ST(1–4) valid
10.00
45.00
ns
79
L1CLK edge to L1ST(1–4) invalid
10.00
45.00
ns
80
L1CLK edge to L1TXD valid
10.00
55.00
ns
L1TSYNC valid to L1TXD valid 4
10.00
55.00
ns
80A
81
L1CLK edge to L1TXD high impedance
0.00
42.00
ns
82
L1RCLK, L1TCLK frequency (DSC =1)
—
16.00 or SYNCCLK/2
MHz
83
L1RCLK, L1TCLK width low (DSC =1)
P + 10
—
ns
83a
L1RCLK, L1TCLK width high (DSC = 1)3
P + 10
—
ns
84
L1CLK edge to L1CLKO valid (DSC = 1)
—
30.00
ns
85
L1RQ valid before falling edge of L1TSYNC4
1.00
—
L1TCLK
42.00
—
ns
42.00
—
ns
—
0.00
ns
time2
86
L1GR setup
87
L1GR hold time
88
L1CLK edge to L1SYNC valid (FSD = 00) CNT =
0000, BYT = 0, DSC = 0)
1
The ratio SyncCLK/L1RCLK must be greater than 2.5/1.
These specs are valid for IDL mode only.
3 Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns.
4 These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever is later.
2
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
55
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLK
(FE=1, CE=1)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
L1RXD
(Input)
77
BIT0
76
78
79
L1ST(4-1)
(Output)
Figure 53. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
56
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLK
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
L1RXD
(Input)
77
BIT0
76
78
79
L1ST(4-1)
(Output)
84
L1CLKO
(Output)
Figure 54. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
57
CPM Electrical Characteristics
L1TCLK
(FE=0, CE=0)
(Input)
71
70
72
L1TCLK
(FE=1, CE=1)
(Input)
73
TFSD=0
75
L1TSYNC
(Input)
74
80a
L1TXD
(Output)
81
BIT0
80
78
79
L1ST(4-1)
(Output)
Figure 55. SI Transmit Timing Diagram (DSC = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
58
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLK
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNC
(Input)
73
74
L1TXD
(Output)
81
BIT0
80
78a
79
L1ST(4-1)
(Output)
78
84
L1CLKO
(Output)
Figure 56. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
59
60
L1GR
(Input)
L1RQ
(Output)
L1ST(4-1)
(Output)
L1RXD
(Input)
L1TXD
(Output)
L1RSYNC
(Input)
L1RCLK
(Input)
80
77
74
2
3
5
72
B15 B14 B13
71
71
4
86
85
76
6
87
B17 B16 B15 B14 B13
B17 B16
73
1
8
78
B12 B11 B10
B12 B11 B10
7
9
D1
D1
10
A
A
11
14
15
16
17
18
B25 B24 B23 B22 B21 B20
13
B27 B26 B25 B24 B23 B22 B21 B20
81
B27 B26
12
19
D2
D2
20
M
M
CPM Electrical Characteristics
Figure 57. IDL Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
CPM Electrical Characteristics
12.7 SCC in NMSI Mode Electrical Specifications
Table 22 shows the NMSI external clock timings.
Table 22. NMSI External Clock Timings
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
1/SYNCCLK
—
ns
1/SYNCCLK +5
—
ns
—
15.00
ns
100
RCLK1 and TCLK1 width high 1
101
RCLK1 and TCLK1 width low
102
RCLK1 and TCLK1 rise/fall time
103
TXD1 active delay (from TCLK1 falling edge)
0.00
50.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
50.00
ns
105
CTS1 setup time to TCLK1 rising edge
5.00
—
ns
106
RXD1 setup time to RCLK1 rising edge
5.00
—
ns
5.00
—
ns
5.00
—
ns
edge 2
107
RXD1 hold time from RCLK1 rising
108
CD1 setup time to RCLK1 rising edge
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2.25/1.
Also applies to CD and CTS hold time when they are used as an external sync signal.
Table 23 shows the NMSI internal clock timings.
Table 23. NMSI Internal Clock Timings
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
100
RCLK1 and TCLK1 frequency 1
0.00
SYNCCLK/3
MHz
102
RCLK1 and TCLK1 rise/fall time
—
—
ns
103
TXD1 active delay (from TCLK1 falling edge)
0.00
30.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
30.00
ns
105
CTS1 setup time to TCLK1 rising edge
40.00
—
ns
106
RXD1 setup time to RCLK1 rising edge
40.00
—
ns
107
RXD1 hold time from RCLK1 rising edge 2
0.00
—
ns
108
CD1 setup time to RCLK1 rising edge
40.00
—
ns
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 3/1.
Also applies to CD and CTS hold time when they are used as an external sync signals.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
61
CPM Electrical Characteristics
Figure 58 through Figure 60 show the NMSI timings.
RCLK1
102
102
101
106
100
RxD1
(Input)
107
108
CD1
(Input)
107
CD1
(SYNC Input)
Figure 58. SCC NMSI Receive Timing Diagram
TCLK1
102
102
101
100
TxD1
(Output)
103
105
RTS1
(Output)
104
104
CTS1
(Input)
107
CTS1
(SYNC Input)
Figure 59. SCC NMSI Transmit Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
62
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
102
102
101
100
TxD1
(Output)
103
RTS1
(Output)
104
107
104
105
CTS1
(Echo Input)
Figure 60. HDLC Bus Timing Diagram
12.8 Ethernet Electrical Specifications
Table 24 shows the Ethernet timings as shown in Figure 61 through Figure 65.
Table 24. Ethernet Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
120
CLSN width high
40
—
ns
121
RCLK1 rise/fall time
—
15
ns
122
RCLK1 width low
40
—
ns
123
RCLK1 clock period 1
80
120
ns
124
RXD1 setup time
20
—
ns
125
RXD1 hold time
5
—
ns
126
RENA active delay (from RCLK1 rising edge of the last data bit)
10
—
ns
127
RENA width low
100
—
ns
128
TCLK1 rise/fall time
—
15
ns
129
TCLK1 width low
40
—
ns
99
101
ns
1
130
TCLK1 clock period
131
TXD1 active delay (from TCLK1 rising edge)
—
50
ns
132
TXD1 inactive delay (from TCLK1 rising edge)
6.5
50
ns
133
TENA active delay (from TCLK1 rising edge)
10
50
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
63
CPM Electrical Characteristics
Table 24. Ethernet Timing (continued)
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
134
TENA inactive delay (from TCLK1 rising edge)
10
50
ns
135
RSTRT active delay (from TCLK1 falling edge)
10
50
ns
136
RSTRT inactive delay (from TCLK1 falling edge)
10
50
ns
137
REJECT width low
1
—
CLK
138
CLKO1 low to SDACK asserted 2
—
20
ns
139
2
—
20
ns
CLKO1 low to SDACK negated
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 61. Ethernet Collision Timing Diagram
RCLK1
121
121
124
123
RxD1
(Input)
Last Bit
125
126
127
RENA(CD1)
(Input)
Figure 62. Ethernet Receive Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
64
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
128
128
129
131
121
TxD1
(Output)
132
133
134
TENA(RTS1)
(Input)
RENA(CD1)
(Input)
Notes:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 63. Ethernet Transmit Timing Diagram
RCLK1
RxD1
(Input)
0
1
1
BIT1
Start Frame Delimiter
BIT2
136
125
RSTRT
(Output)
Figure 64. CAM Interface Receive Start Timing Diagram
REJECT
137
Figure 65. CAM Interface REJECT Timing Diagram
12.9 SMC Transparent AC Electrical Specifications
Table 25 shows the SMC transparent timings as shown in Figure 66.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
65
CPM Electrical Characteristics
Table 25. SMC Transparent Timing
All Frequencies
Num
1
Characteristic
Unit
Min
Max
150
SMCLK clock period 1
100
—
ns
151
SMCLK width low
50
—
ns
151A
SMCLK width high
50
—
ns
152
SMCLK rise/fall time
—
15
ns
153
SMTXD active delay (from SMCLK falling edge)
10
50
ns
154
SMRXD/SMSYNC setup time
20
—
ns
155
RXD1/SMSYNC hold time
5
—
ns
Sync CLK must be at least twice as fast as SMCLK.
SMCLK
152
152
151
151A
150
SMTXD
(Output)
NOTE 1
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 66. SMC Transparent Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
66
Freescale Semiconductor
CPM Electrical Characteristics
12.10SPI Master AC Electrical Specifications
Table 26 shows the SPI master timings as shown in Figure 67 and Figure 68.
Table 26. SPI Master Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
160
MASTER cycle time
4
1024
tcyc
161
MASTER clock (SCK) high or low time
2
512
tcyc
162
MASTER data setup time (inputs)
15
—
ns
163
Master data hold time (inputs)
0
—
ns
164
Master data valid (after SCK edge)
—
10
ns
165
Master data hold time (outputs)
0
—
ns
166
Rise time output
—
15
ns
167
Fall time output
—
15
ns
SPICLK
(CI=0)
(Output)
161
167
161
166
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
msb
166
Data
165
lsb
msb
164
167
SPIMOSI
(Output)
msb
166
Data
lsb
msb
Figure 67. SPI Master (CP = 0) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
67
CPM Electrical Characteristics
SPICLK
(CI=0)
(Output)
161
167
166
161
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
166
msb
Data
lsb
165
msb
164
167
SPIMOSI
(Output)
166
msb
Data
lsb
msb
Figure 68. SPI Master (CP = 1) Timing Diagram
12.11SPI Slave AC Electrical Specifications
Table 27 shows the SPI slave timings as shown in Figure 69 and Figure 70.
Table 27. SPI Slave Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
170
Slave cycle time
2
—
tcyc
171
Slave enable lead time
15
—
ns
172
Slave enable lag time
15
—
ns
173
Slave clock (SPICLK) high or low time
1
—
tcyc
174
Slave sequential transfer delay (does not require deselect)
1
—
tcyc
175
Slave data setup time (inputs)
20
—
ns
176
Slave data hold time (inputs)
20
—
ns
177
Slave access time
—
50
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
68
Freescale Semiconductor
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
173
181
170
SPICLK
(CI=1)
(Input)
177
181
182
180
SPIMISO
(Output)
msb
178
Data
175
msb
Undef
msb
179
176
SPIMOSI
(Input)
lsb
181 182
Data
lsb
msb
Figure 69. SPI Slave (CP = 0) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
69
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
170
SPICLK
(CI=0)
(Input)
173
182
181
173
181
SPICLK
(CI=1)
(Input)
177
182
180
SPIMISO
(Output)
Undef
msb
175
lsb
msb
179
176
SPIMOSI
(Input)
Data
178
msb
181 182
Data
lsb
msb
Figure 70. SPI Slave (CP = 1) Timing Diagram
12.12I2C AC Electrical Specifications
MPC866/MPC859 Hardware Specifications, Rev. 2
70
Freescale Semiconductor
CPM Electrical Characteristics
Table 28 shows the I2C (SCL < 100 kHz) timings.
Table 28. I2C Timing (SCL < 100 kHz)
All Frequencies
Num
200
1
Characteristic
Unit
SCL clock frequency (slave)
(master) 1
Min
Max
0
100
kHz
1.5
100
kHz
200
SCL clock frequency
202
Bus free time between transmissions
4.7
—
μs
203
Low period of SCL
4.7
—
μs
204
High period of SCL
4.0
—
μs
205
Start condition setup time
4.7
—
μs
206
Start condition hold time
4.0
—
μs
207
Data hold time
0
—
μs
208
Data setup time
250
—
ns
209
SDL/SCL rise time
—
1
μs
210
SDL/SCL fall time
—
300
ns
211
Stop condition setup time
4.7
—
μs
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) * pre_scaler * 2).
The ratio SyncClk/(BRGCLK/pre_scaler) must be greater or equal to 4/1.
Table 29 shows the I2C (SCL > 100 kHz) timings.
Table 29. I2C Timing (SCL > 100 kHz)
All Frequencies
Num
1
Characteristic
Expression
Unit
Min
Max
200
SCL clock frequency (slave)
fSCL
0
BRGCLK/48
Hz
200
SCL clock frequency (master) 1
fSCL
BRGCLK/16512
BRGCLK/48
Hz
202
Bus free time between transmissions
—
1/(2.2 * fSCL)
—
s
203
Low period of SCL
—
1/(2.2 * fSCL)
—
s
204
High period of SCL
—
1/(2.2 * fSCL)
—
s
205
Start condition setup time
—
1/(2.2 * fSCL)
—
s
206
Start condition hold time
—
1/(2.2 * fSCL)
—
s
207
Data hold time
—
0
—
s
208
Data setup time
—
1/(40 * fSCL)
—
s
209
SDL/SCL rise time
—
—
1/(10 * fSCL)
s
210
SDL/SCL fall time
—
—
1/(33 * fSCL)
s
211
Stop condition setup time
—
1/2(2.2 * fSCL)
—
s
SCL frequency is given by SCL = BrgClk_frequency / ((BRG register + 3) * pre_scaler * 2).
The ratio SyncClk/(Brg_Clk/pre_scaler) must be greater or equal to 4/1.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
71
UTOPIA AC Electrical Specifications
Figure 71 shows the I2C bus timing.
SDA
202
203
205
204
208
207
SCL
206
209
210
211
Figure 71. I2C Bus Timing Diagram
13 UTOPIA AC Electrical Specifications
Table 30 through Table 32 show the AC electrical specifications for the UTOPIA interface.
Table 30. UTOPIA Master (Muxed Mode) Electrical Specifications
Num
U1
Signal Characteristic
Direction
Min
Max
Unit
Output
—
4
ns
Duty cycle
50
50
%
Frequency
—
33
MHz
Output
2
16
ns
UtpClk rise/fall time (Internal clock option)
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr-active
delay (and PHREQ and PHSEL active delay in MPHY mode)
U3
UTPB, SOC, Rxclav and Txclav setup time
Input
4
—
ns
U4
UTPB, SOC, Rxclav and Txclav hold time
Input
1
—
ns
Table 31. UTOPIA Master (Split Bus Mode) Electrical Specifications
Num
U1
Signal Characteristic
Direction
Min
Max
Unit
Output
—
4
ns
Duty cycle
50
50
%
Frequency
—
33
MHz
Output
2
16
ns
UtpClk rise/fall time (Internal clock option)
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr and TxAddr active
delay (PHREQ and PHSEL active delay in MPHY mode)
U3
UTPB_Aux, SOC_Aux, Rxclav, and Txclav setup time
Input
4
—
ns
U4
UTPB_Aux, SOC_Aux, Rxclav, and Txclav hold time
Input
1
—
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
72
Freescale Semiconductor
UTOPIA AC Electrical Specifications
Table 32. UTOPIA Slave (Split Bus Mode) Electrical Specifications
Num
U1
U2
Signal Characteristic
Direction
Min
Max
Unit
Input
—
4
ns
Duty cycle
40
60
%
Frequency
—
33
MHz
Output
2
16
ns
UtpClk rise/fall time (external clock option)
UTPB, SOC, Rxclav and Txclav active delay
U3
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr
setup time
Input
4
—
ns
U4
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr
hold time
Input
1
—
ns
Figure 72 shows signal timings during UTOPIA receive operations.
U1
U1
UtpClk
U2
PHREQn
U3
3
RxClav
RxEnb
U4
4
HighZ at MPHY
HighZ at MPHY
U2
2
UTPB
SOC
U3
3
U4
4
Figure 72. UTOPIA Receive Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
73
FEC Electrical Characteristics
Figure 73 shows signal timings during UTOPIA transmit operations.
U1
U1
1
UtpClk
U2
5
PHSELn
U3
3
U4
4
TxClav
HighZ at MPHY
High-Z at MPHY
U2
2
TxEnb
UTPB
SOC
U2
5
Figure 73. UTOPIA Transmit Timing
14 FEC Electrical Characteristics
This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing
specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII
signals use TTL signal levels compatible with devices operating at either 5.0 or 3.3 V.
14.1 MII Receive Signal Timing (MII_RXD [3:0], MII_RX_DV,
MII_RX_ER, MII_RX_CLK)
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum
frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%.
Table 33 shows the timings for MII receive signal.
Table 33. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup
5
—
ns
M2
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
5
—
ns
M3
MII_RX_CLK pulse width high
35%
65%
MII_RX_CLK period
M4
MII_RX_CLK pulse width low
35%
65%
MII_RX_CLK period
Figure 74 shows the timings for MII receive signal.
MPC866/MPC859 Hardware Specifications, Rev. 2
74
Freescale Semiconductor
FEC Electrical Characteristics
M3
MII_RX_CLK (input)
M4
MII_RXD[3:0] (inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 74. MII Receive Signal Timing Diagram
14.2 MII Transmit Signal Timing (MII_TXD[3:0], MII_TX_EN,
MII_TX_ER, MII_TX_CLK)
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK
frequency - 1%.
Table 34 shows information on the MII transmit signal timing.
Table 34. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER
invalid
5
—
ns
M6
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER
valid
—
25
—
M7
MII_TX_CLK pulse width high
35%
65%
MII_TX_CLK period
M8
MII_TX_CLK pulse width low
35%
65%
MII_TX_CLK period
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
75
FEC Electrical Characteristics
Figure 75 shows the MII transmit signal timing diagram.
M7
MII_TX_CLK (input)
M5
M8
MII_TXD[3:0] (outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 75. MII Transmit Signal Timing Diagram
14.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 35 shows the timing for on the MII async inputs signal.
Table 35. MII Async Inputs Signal Timing
Num
Characteristic
Min
Max
Unit
M9
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK period
Figure 76 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 76. MII Async Inputs Timing Diagram
14.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
Table 36 shows the timing for the MII serial management channel signal. The FEC functions correctly with a
maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation.
Table 36. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10
MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11
MII_MDC falling edge to MII_MDIO output valid (maximum
propagation delay)
—
25
ns
M12
MII_MDIO (input) to MII_MDC rising edge setup
10
—
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
76
Freescale Semiconductor
FEC Electrical Characteristics
Table 36. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
0
—
ns
M13
MII_MDIO (input) to MII_MDC rising edge hold
M14
MII_MDC pulse width high
40%
60%
MII_MDC period
M15
MII_MDC pulse width low
40%
60%
MII_MDC period
Figure 77 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (output)
M10
MII_MDIO (output)
M11
MII_MDIO (input)
M12
M13
Figure 77. MII Serial Management Channel Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Mechanical Data and Ordering Information
15 Mechanical Data and Ordering Information
Table 37 shows information on the MPC866/859 derivative devices.
Table 37. MPC866/859 Derivatives
Number
of
SCCs 1
Ethernet
Support
Multi-Channel
HDLC Support
ATM Support
MPC866T
4
10/100 Mbps
Yes
MPC866P
4
10/100 Mbps
MPC859T
1 (SCC1)
MPC859DSL
1 (SCC1)
Device
1
Cache Size
Instruction
Data
Yes
4 Kbyte
4 Kbytes
Yes
Yes
16 Kbyte
8 Kbytes
10/100 Mbps
Yes
Yes
4 Kbyte
4 Kbytes
10/100 Mbps
No
Up to 4 addresses
4 Kbyte
4 Kbytes
Serial communications controller (SCC).
Table 38 identifies the packages and operating frequencies orderable for the MPC866/859 derivative devices.
Table 38. MPC866/859 Package/Frequency Orderable
Package Type
Plastic ball grid array
(ZP suffix)
Non lead free
Plastic ball grid array
(CZP suffix)
Non lead free
Temperature (Tj)
Frequency (MHz)
Order Number
0° to 95°C
50
MPC859DSLZP50A
66
MPC859DSLZP66A
100
MPC859PZP100A
MPC859TZP100A
MPC866PZP100A
MPC866TZP100A
133
MPC859PZP133A
MPC859TZP133A
MPC866PZP133A
MPC866TZP133A
50
MPC859DSLCZP50A
66
MPC859DSLCZP66A
100
MPC859PCZP100A
MPC859TCZP100A
MPC866PCZP100A
MPC866TCZP100A
–40° to 100°C
MPC866/MPC859 Hardware Specifications, Rev. 2
78
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 38. MPC866/859 Package/Frequency Orderable (continued)
Plastic ball grid array
(VR suffix)
Lead free
Plastic ball grid array
(CVR suffix)
Lead free
0° to 95°C
–40° to 100°C
50
MPC859DSLVR50A
66
MPC859DSLVR66A
100
MPC859PVR100A
MPC859TVR100A
MPC866PVR100A
MPC866TVR100A
133
MPC859PVR133A
MPC859TVR133A
MPC866PVR133A
MPC866TVR133A
50
MPC859DSLCVR50A
66
MPC859DSLCVR66A
100
MPC859PCVR100A
MPC859TCVR100A
MPC866PCVR100A
MPC866TCVR100A
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
79
Mechanical Data and Ordering Information
15.1 Pin Assignments
Figure 78 shows the top view pinout of the PBGA package. For additional information, see the MPC866
PowerQUICC Family User’s Manual.
NOTE: This is the top view of the device.
W
PD10
PD8
PD3
PD9
PD6
PA0
PB14 PD15
PD4
PA1
PC5
PC4
PD11
PC6
PA2
PB15
PD12
PA4
PB17
PA3
VDDL
PB19
PA5
PB18
PB16
HRESET TEXP EXTCLK EXTAL
PA7
PC8
PA6
PC7
MODCK2 BADDR28 BADDR29 VDDL
PB22
PC9
PA8
PB20
PC10
PA9
PB23
PB21
PC11
PB24
PA10
PB25
IRQ7
D0
D4
D1
D2
D3
D5
VDDL
D6
D7
D29
DP2 CLKOUT IPA3
M_Tx_EN IRQ0 D13
D27
D10
D14
D18
D20
D24
D28
DP1
DP3
DP0
N/C VSSSYN1
D23
D11
D16
D19
D21
D26
D30
IPA5
IPA4
IPA2
N/C VSSSYN
D17
D9
D15
D22
D25
D31
IPA6
IPA0
IPA1
IPA7
N/C VDDSYN
V
PD14
PD13
U
PD5
IRQ1
D8
T
PD7
VDDH D12
R
VDDH
VDDH WAIT_B WAIT_A PORESET VDDL
P
GND
VDDL RSTCONF SRESET XTAL
GND
N
M
L
OP0
AS
OP1 MODCK1
K
GND
BADDR30 IPB6 ALEA
IRQ4
J
IPB5
IPB1
IPB2
ALEB
M_COL IRQ2
IPB0
IPB7
BR
IRQ6
IPB4
IPB3
VDDL
TS
CS3
BI
H
VDDL M_MDIO TDI
TCK
TRST
TMS
TDO
PA11
PB26
PC12
PA12
VDDL
PB27
PC13
PA13
PB29
PB28
PC14
PA14
PC15
A8
N/C
N/C
A15
A19
A25
PB30
PA15
PB31
A3
A9
A12
A16
A20
A24
A26
TSIZ1 BSA1
A0
A1
A4
A6
A10
A13
A17
A21
A23
A22
TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5
A2
A5
A7
A11
A14
A27
A29
A30
A28
A31
18
17
16
15
14
13
12
11
10
9
G
GND
GND
F
VDDH
VDDH
IRQ3 BURST
E
BG
BB
D
A18
BSA0 GPLA0
N/C
CS6
CS2 GPLA5 BDIP
TEA
C
WE0 GPLA1 GPLA3 CS7
CS0
TA
GPLA4
CE1A
WR
GPLB4
B
A
19
VDDL BSA2
8
7
WE1
WE3
CS4
CE2A
CS1
6
5
4
3
2
1
Figure 78. Pinout of the PBGA Package
MPC866/MPC859 Hardware Specifications, Rev. 2
80
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39 contains a list of the MPC866 input and output signals and shows multiplexing and pin assignments.
Table 39. Pin Assignments
Name
Pin Number
Type
A[0:31]
B19, B18, A18, C16, B17, A17, B16, A16, D15, C15, B15, A15,
C14, B14, A14, D12, C13, B13, D9, D11, C12, B12, B10, B11, C11,
D10, C10, A13, A10, A12, A11, A9
Bidirectional
Three-state
TSIZ0
REG
B9
Bidirectional
Three-state
TSIZ1
C9
Bidirectional
Three-state
RD/WR
B2
Bidirectional
Three-state
BURST
F1
Bidirectional
Three-state
BDIP
GPL_B5
D2
Output
TS
F3
Bidirectional
Active Pull-up
TA
C2
Bidirectional
Active Pull-up
TEA
D1
Open-drain
BI
E3
Bidirectional
Active Pull-up
IRQ2
RSV
H3
Bidirectional
Three-state
IRQ4
KR
RETRY
SPKROUT
K1
Bidirectional
Three-state
CR
IRQ3
F2
Input
D[0:31]
W14, W12, W11, W10, W13, W9, W7, W6, U13, T11, V11, U11,
T13, V13, V10, T10, U10, T12, V9, U9, V8, U8, T9, U12, V7, T8,
U7, V12, V6, W5, U6, T7
Bidirectional
Three-state
DP0
IRQ3
V3
Bidirectional
Three-state
DP1
IRQ4
V5
Bidirectional
Three-state
DP2
IRQ5
W4
Bidirectional
Three-state
DP3
IRQ6
V4
Bidirectional
Three-state
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
81
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
BR
G4
Bidirectional
BG
E2
Bidirectional
BB
E1
Bidirectional
Active Pull-up
FRZ
IRQ6
G3
Bidirectional
IRQ0
V14
Input
IRQ1
U14
Input
M_TX_CLK
IRQ7
W15
Input
CS[0:5]
C3, A2, D4, E4, A4, B4
Output
CS6
CE1_B
D5
Output
CS7
CE2_B
C4
Output
WE0
BS_B0
IORD
C7
Output
WE1
BS_B1
IOWR
A6
Output
WE2
BS_B2
PCOE
B6
Output
WE3
BS_B3
PCWE
A5
Output
BS_A[0:3]
D8, C8, A7, B8
Output
GPL_A0
GPL_B0
D7
Output
OE
GPL_A1
GPL_B1
C6
Output
GPL_A[2:3]
GPL_B[2:3]
CS[2–3]
B5, C5
Output
UPWAITA
GPL_A4
C1
Bidirectional
MPC866/MPC859 Hardware Specifications, Rev. 2
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Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
UPWAITB
GPL_B4
B1
Bidirectional
GPL_A5
D3
Output
PORESET
R2
Input
RSTCONF
P3
Input
HRESET
N4
Open-drain
SRESET
P2
Open-drain
XTAL
P1
Analog Output
EXTAL
N1
Analog Input (3.3V only)
CLKOUT
W3
Output
EXTCLK
N2
Input (3.3V only)
TEXP
N3
Output
ALE_A
MII-TXD1
K2
Output
CE1_A
MII-TXD2
B3
Output
CE2_A
MII-TXD3
A3
Output
WAIT_A
SOC_Split2
R3
Input
WAIT_B
R4
Input
IP_A0
UTPB_Split02
MII-RXD3
T5
Input
IP_A1
UTPB_Split12
MII-RXD2
T4
Input
IP_A2
IOIS16_A
UTPB_Split22
MII-RXD1
U3
Input
IP_A3
UTPB_Split32
MII-RXD0
W2
Input
IP_A4
UTPB_Split42
MII-RXCLK
U4
Input
MPC866/MPC859 Hardware Specifications, Rev. 2
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83
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
IP_A5
UTPB_Split52
MII-RXERR
U5
Input
IP_A6
UTPB_Split62
MII-TXERR
T6
Input
IP_A7
UTPB_Split72
MII-RXDV
T3
Input
ALE_B
DSCK/AT1
J1
Bidirectional
Three-state
IP_B[0:1]
IWP[0:1]
VFLS[0:1]
H2, J3
Bidirectional
IP_B2
IOIS16_B
AT2
J2
Bidirectional
Three-state
IP_B3
IWP2
VF2
G1
Bidirectional
IP_B4
LWP0
VF0
G2
Bidirectional
IP_B5
LWP1
VF1
J4
Bidirectional
IP_B6
DSDI
AT0
K3
Bidirectional
Three-state
IP_B7
PTR
AT3
H1
Bidirectional
Three-state
OP0
MII-TXD0
UtpClk_Split2
L4
Bidirectional
OP1
L2
Output
OP2
MODCK1
STS
L1
Bidirectional
MPC866/MPC859 Hardware Specifications, Rev. 2
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Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
OP3
MODCK2
DSDO
M4
Bidirectional
BADDR30
REG
K4
Output
BADDR[28:29]
M3, M2
Output
AS
L3
Input
PA15
RXD1
RXD4
C18
Bidirectional
PA14
TXD1
TXD4
D17
Bidirectional
(Optional: Open-drain)
PA13
RXD2
E17
Bidirectional
PA12
TXD2
F17
Bidirectional
(Optional: Open-drain)
PA11
L1TXDB
RXD3
G16
Bidirectional
(Optional: Open-drain)
PA10
L1RXDB
TXD3
J17
Bidirectional
(Optional: Open-drain)
PA9
L1TXDA
K18
Bidirectional
(Optional: Open-drain)
PA8
L1RXDA
TXD4
L17
Bidirectional
(Optional: Open-drain)
PA7
CLK1
L1RCLKA
BRGO1
TIN1
M19
Bidirectional
PA6
CLK2
TOUT1
M17
Bidirectional
RXD4
MPC866/MPC859 Hardware Specifications, Rev. 2
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85
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PA5
CLK3
L1TCLKA
BRGO2
TIN2
N18
Bidirectional
PA4
CLK4
TOUT2
P19
Bidirectional
PA3
CLK5
BRGO3
TIN3
P17
Bidirectional
PA2
CLK6
TOUT3
L1RCLKB
R18
Bidirectional
PA1
CLK7
BRGO4
TIN4
T19
Bidirectional
PA0
CLK8
TOUT4
L1TCLKB
U19
Bidirectional
PB31
SPISEL
REJECT1
C17
Bidirectional
(Optional: Open-drain)
PB30
SPICLK
RSTRT2
C19
Bidirectional
(Optional: Open-drain)
PB29
SPIMOSI
E16
Bidirectional
(Optional: Open-drain)
PB28
SPIMISO
BRGO4
D19
Bidirectional
(Optional: Open-drain)
PB27
I2CSDA
BRGO1
E19
Bidirectional
(Optional: Open-drain)
PB26
I2CSCL
BRGO2
F19
Bidirectional
(Optional: Open-drain)
MPC866/MPC859 Hardware Specifications, Rev. 2
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Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PB25
RXADDR32
SMTXD1
J16
Bidirectional
(Optional: Open-drain)
PB24
TXADDR32
SMRXD1
J18
Bidirectional
(Optional: Open-drain)
PB23
TXADDR22
SDACK1
SMSYN1
K17
Bidirectional
(Optional: Open-drain)
PB22
TXADDR42
SDACK2
SMSYN2
L19
Bidirectional
(Optional: Open-drain)
PB21
SMTXD2
L1CLKOB
PHSEL1 1
TXADDR1 2
K16
Bidirectional
(Optional: Open-drain)
PB20
SMRXD2
L1CLKOA
PHSEL01
TXADDR02
L16
Bidirectional
(Optional: Open-drain)
PB19
RTS1
L1ST1
N19
Bidirectional
(Optional: Open-drain)
PB18
RXADDR42
RTS2
L1ST2
N17
Bidirectional
(Optional: Open-drain)
PB17
L1RQb
L1ST3
RTS3
PHREQ11
RXADDR12
P18
Bidirectional
(Optional: Open-drain)
MPC866/MPC859 Hardware Specifications, Rev. 2
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87
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PB16
L1RQa
L1ST4
RTS4
PHREQ01
RXADDR02
N16
Bidirectional
(Optional: Open-drain)
PB15
BRGO3
TxClav
RxClav
R17
Bidirectional
PB14
RXADDR22
RSTRT1
U18
Bidirectional
PC15
DREQ0
RTS1
L1ST1
RxClav
TxClav
D16
Bidirectional
PC14
DREQ1
RTS2
L1ST2
D18
Bidirectional
PC13
L1RQb
L1ST3
RTS3
E18
Bidirectional
PC12
L1RQa
L1ST4
RTS4
F18
Bidirectional
PC11
CTS1
J19
Bidirectional
PC10
CD1
TGATE1
K19
Bidirectional
PC9
CTS2
L18
Bidirectional
PC8
CD2
TGATE2
M18
Bidirectional
MPC866/MPC859 Hardware Specifications, Rev. 2
88
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PC7
CTS3
L1TSYNCB
SDACK2
M16
Bidirectional
PC6
CD3
L1RSYNCB
R19
Bidirectional
PC5
CTS4
L1TSYNCA
SDACK1
T18
Bidirectional
PC4
CD4
L1RSYNCA
T17
Bidirectional
PD15
L1TSYNCA
MII-RXD3
UTPB0
U17
Bidirectional
PD14
L1RSYNCA
MII-RXD2
UTPB1
V19
Bidirectional
PD13
L1TSYNCB
MII-RXD1
UTPB2
V18
Bidirectional
PD12
L1RSYNCB
MII-MDC
UTPB3
R16
Bidirectional
PD11
RXD3
MII-TXERR
RXENB
T16
Bidirectional
PD10
TXD3
MII-RXD0
TXENB
W18
Bidirectional
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
89
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PD9
RXD4
MII-TXD0
UTPCLK
V17
Bidirectional
PD8
TXD4
MII-MDC
MII-RXCLK
W17
Bidirectional
PD7
RTS3
MII-RXERR
UTPB4
T15
Bidirectional
PD6
RTS4
MII-RXDV
UTPB5
V16
Bidirectional
PD5
REJECT2
MII-TXD3
UTPB6
U15
Bidirectional
PD4
REJECT3
MII-TXD2
UTPB7
U16
Bidirectional
PD3
REJECT4
MII-TXD1
SOC
W16
Bidirectional
TMS
G18
Input
TDI
DSDI
H17
Input
TCK
DSCK
H16
Input
TRST
G19
Input
TDO
DSDO
G17
Output
MII_CRS
B7
Input
MII_MDIO
H18
Bidirectional
MII_TXEN
V15
Output
MPC866/MPC859 Hardware Specifications, Rev. 2
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Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
1
2
Pin Number
Type
MII_COL
H4
Input
VSSSYN1
V1
PLL analog VDD and
GND
VSSSYN
U1
Power
VDDSYN
T1
Power
GND
F6, F7, F8, F9, F10, F11, F12, F13, F14, G6, G7, G8, G9, G10,
G11, G12, G13, G14, H6, H7, H8, H9, H10, H11, H12, H13, H14,
J6, J7, J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11,
K12, K13, K14, L6, L7, L8, L9, L10, L11, L12, L13, L14, M6, M7,
M8, M9, M10, M11, M12, M13, M14, N6, N7, N8, N9, N10, N11,
N12, N13, N14, P6, P7, P8, P9, P10, P11, P12, P13, P14
Power
VDDL
A8, M1, W8, H19, F4, F16, P4, P16, R1
Power
VDDH
E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, F5, F15, G5,
G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, P5,
P15, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, T14
Power
N/C
D6, D13, D14, U2, V2, T2
No-connect
Classic SAR mode only
ESAR mode only
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
91
Mechanical Data and Ordering Information
15.2 Mechanical Dimensions of the PBGA Package
For more information on the printed-circuit board layout of the PBGA package, including thermal via design and
suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available
from your local Freescale sales office. Figure 79 shows the mechanical dimensions of the PBGA package.
Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP
is 62%Sn 36%Pb 2%Ag
Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC866/MPC859 Hardware Specifications, Rev. 2
92
Freescale Semiconductor
Document Revision History
16 Document Revision History
Table 40 lists significant changes between revisions of this document.
Table 40. Document Revision History
Revision
Number
Date
0
5/2002
Initial revision
1
11/2002
Added the 5-V tolerant pins, new package dimensions, and other changes.
1.1
4/2003
Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere
composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb
2%Ag to Figure 15-79.
1.2
4/2003
Added the MPC859P.
1.3
5/2003
Changed the SPI Master Timing Specs. 162 and 164.
1.4
7-8/2003
• Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and
B29b to show that TRLX can be 0 or 1.
• Added nontechnical reformatting.
1.5
3/14/2005
• Updated document template.
2
2/10/2006
• Updated orderable parts table.
Substantive Changes
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93
Document Revision History
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Document Revision History
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95
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