KMPC860DEVR80D4

Freescale Semiconductor MPC860EC Rev. 10, 09/2015 Technical Data MPC860 PowerQUICC Family Hardware Specifications This hardware specification contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC860 family. To locate published errata or updates for this document, see the MPC860 product summary page on the website listed on the back cover of this document or contact your local Freescale sales office. Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2007-2015 Freescale Semiconductor, Inc. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 8 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Calculation and Measurement . . . . . . . . . . 12 Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15 IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 41 CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 43 UTOPIA AC Electrical Specifications . . . . . . . . . . . 65 FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67 Mechanical Data and Ordering Information . . . . . . . 70 Document Revision History . . . . . . . . . . . . . . . . . . . 76 Overview 1 Overview The MPC860 power quad integrated communications controller (PowerQUICC™) is a versatile one-chip integrated microprocessor and peripheral combination designed for a variety of controller applications. It particularly excels in communications and networking systems. The PowerQUICC unit is referred to as the MPC860 in this hardware specification. The MPC860 implements Power Architecture™ technology and contains a superset of Freescale’s MC68360 quad integrated communications controller (QUICC), referred to here as the QUICC, RISC communications proccessor module (CPM). The CPU on the MPC860 is a 32-bit core built on Power Architecture technology that incorporates memory management units (MMUs) and instruction and data caches.. The CPM from the MC68360 QUICC has been enhanced by the addition of the inter-integrated controller (I2C) channel. The memory controller has been enhanced, enabling the MPC860 to support any type of memory, including high-performance memories and new types of DRAMs. A PCMCIA socket controller supports up to two sockets. A real-time clock has also been integrated. Table 1 shows the functionality supported by the MPC860 family. Table 1. MPC860 Family Functionality Cache (Kbytes) Ethernet ATM SCC Reference1 — — 2 1 Up to 2 1 Yes 2 1 8 Up to 2 1 Yes 2 1 4 4 Up to 4 — — 4 1 MPC860SR 4 4 Up to 4 — Yes 4 1 MPC860T 4 4 Up to 4 1 Yes 4 1 MPC860P 16 8 Up to 4 1 Yes 4 1 MPC855T 4 4 1 1 Yes 1 2 Part Instruction Cache Data Cache 10T 10/100 MPC860DE 4 4 Up to 2 MPC860DT 4 4 MPC860DP 16 MPC860EN 1 Supporting documentation for these devices refers to the following: 1. MPC860 PowerQUICC Family User’s Manual (MPC860UM, Rev. 3) 2. MPC855T User’s Manual (MPC855TUM, Rev. 1) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 2 Freescale Semiconductor Features 2 Features The following list summarizes the key MPC860 features: • Embedded single-issue, 32-bit core (implementing the Power Architecture technology) with thirty-two 32-bit general-purpose registers (GPRs) — The core performs branch prediction with conditional prefetch without conditional execution. — 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1) – 16-Kbyte instruction caches are four-way, set-associative with 256 sets; 4-Kbyte instruction caches are two-way, set-associative with 128 sets. – 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are two-way, set-associative with 128 sets. – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks. – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis. — MMUs with 32-entry TLB, fully-associative instruction, and data TLBs — MMUs support multiple page sizes of 4-, 16-, and 512-Kbytes, and 8-Mbytes; 16 virtual address spaces and 16 protection groups — Advanced on-chip-emulation debug mode • Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits) • 32 address lines • Operates at up to 80 MHz • Memory controller (eight banks) — Contains complete dynamic RAM (DRAM) controller — Each bank can be a chip select or RAS to support a DRAM bank. — Up to 15 wait states programmable per memory bank — Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and other memory devices — DRAM controller programmable to support most size and speed memory interfaces — Four CAS lines, four WE lines, and one OE line — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory) — Variable block sizes (32 Kbytes to 256 Mbytes) — Selectable write protection — On-chip bus arbitration logic • General-purpose timers — Four 16-bit timers or two 32-bit timers — Gate mode can enable/disable counting — Interrupt can be masked on reference match and event capture. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 3 Features • • • • • System integration unit (SIU) — Bus monitor — Software watchdog — Periodic interrupt timer (PIT) — Low-power stop mode — Clock synthesizer — Decrementer, time base, and real-time clock (RTC) — Reset controller — IEEE 1149.1™ Std. test access port (JTAG) Interrupts — Seven external interrupt request (IRQ) lines — 12 port pins with interrupt capability — 23 internal interrupt sources — Programmable priority between SCCs — Programmable highest priority request 10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u® Standard (not available when using ATM over UTOPIA interface) ATM support compliant with ATM forum UNI 4.0 specification — Cell processing up to 50–70 Mbps at 50-MHz system clock — Cell multiplexing/demultiplexing — Support of AAL5 and AAL0 protocols on a per-VC basis. AAL0 support enables OAM and software implementation of other protocols. — ATM pace control (APC) scheduler, providing direct support for constant bit rate (CBR) and unspecified bit rate (UBR) and providing control mechanisms enabling software support of available bit rate (ABR) — Physical interface support for UTOPIA (10/100-Mbps is not supported with this interface) and byte-aligned serial (for example, T1/E1/ADSL) — UTOPIA-mode ATM supports level-1 master with cell-level handshake, multi-PHY (up to four physical layer devices), connection to 25-, 51-, or 155-Mbps framers, and UTOPIA/system clock ratios of 1/2 or 1/3. — Serial-mode ATM connection supports transmission convergence (TC) function for T1/E1/ADSL lines, cell delineation, cell payload scrambling/descrambling, automatic idle/unassigned cell insertion/stripping, header error control (HEC) generation, checking, and statistics. Communications processor module (CPM) — RISC communications processor (CP) — Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and RESTART TRANSMIT) — Supports continuous mode transmission and reception on all serial channels MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 4 Freescale Semiconductor Features • • • • • • — Up to 8 Kbytes of dual-port RAM — 16 serial DMA (SDMA) channels — Three parallel I/O registers with open-drain capability Four baud-rate generators (BRGs) — Independent (can be tied to any SCC or SMC) — Allows changes during operation — Autobaud support option Four serial communications controllers (SCCs) — Ethernet/IEEE 802.3® standard optional on SCC1–4, supporting full 10-Mbps operation (available only on specially programmed devices) — HDLC/SDLC (all channels supported at 2 Mbps) — HDLC bus (implements an HDLC-based local area network (LAN)) — Asynchronous HDLC to support point-to-point protocol (PPP) — AppleTalk — Universal asynchronous receiver transmitter (UART) — Synchronous UART — Serial infrared (IrDA) — Binary synchronous communication (BISYNC) — Totally transparent (bit streams) — Totally transparent (frame-based with optional cyclic redundancy check (CRC)) Two SMCs (serial management channels) — UART — Transparent — General circuit interface (GCI) controller — Can be connected to the time-division multiplexed (TDM) channels One SPI (serial peripheral interface) — Supports master and slave modes — Supports multimaster operation on the same bus One I2C (inter-integrated circuit) port — Supports master and slave modes — Multiple-master environment support Time-slot assigner (TSA) — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined — 1- or 8-bit resolution — Allows independent transmit and receive routing, frame synchronization, and clocking MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 5 Features • • • • • • — Allows dynamic changes — Can be internally connected to six serial channels (four SCCs and two SMCs) Parallel interface port (PIP) — Centronics interface support — Supports fast connection between compatible ports on the MPC860 or the MC68360 PCMCIA interface — Master (socket) interface, release 2.1 compliant — Supports two independent PCMCIA sockets — Supports eight memory or I/O windows Low power support — Full on—all units fully powered — Doze—core functional units disabled except time base decrementer, PLL, memory controller, RTC, and CPM in low-power standby — Sleep—all units disabled except RTC and PIT, PLL active for fast wake up — Deep sleep—all units disabled including PLL except RTC and PIT — Power down mode—all units powered down except PLL, RTC, PIT, time base, and decrementer Debug interface — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data — Supports conditions: = ≠ < > — Each watchpoint can generate a break-point internally. 3.3-V operation with 5-V TTL compatibility except EXTAL and EXTCLK 357-pin ball grid array (BGA) package MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 6 Freescale Semiconductor Maximum Tolerated Ratings 3 Maximum Tolerated Ratings This section provides the maximum tolerated voltage and temperature ranges for the MPC860. Table 2 provides the maximum ratings. This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VDD). Table 2. Maximum Tolerated Ratings (GND = 0 V) Rating Supply voltage1 Input voltage2 Temperature3 Temperature3 (standard) (extended) Storage temperature range Symbol Value Unit VDDH –0.3 to 4.0 V VDDL –0.3 to 4.0 V KAPWR –0.3 to 4.0 V VDDSYN –0.3 to 4.0 V Vin GND – 0.3 to VDDH V TA(min) 0 °C Tj(max) 95 °C TA(min) –40 °C Tj(max) 95 °C Tstg –55 to 150 °C 1 The power supply of the device must start its ramp from 0.0 V. Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage to the device. Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be applied to its inputs). 3 Minimum temperatures are guaranteed as ambient temperature, T . Maximum temperatures are guaranteed as junction A temperature, Tj. 2 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 7 Thermal Characteristics Figure 1 shows the undershoot and overshoot voltages at the interface of the MPC860. VDDH/VDDL + 20% VDDH/VDDL + 5% VDDH/VDDL VIH GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of tinterface1 Note: 1. tinterface refers to the clock period associated with the bus clock interface. Figure 1. Undershoot/Overshoot Voltage for VDDH and VDDL 4 Thermal Characteristics Table 3. Package Description Package Designator Package Code (Case No.) Package Description ZP 5050 (1103-01) PBGA 357 25*25*0.9P1.27 ZQ/VR 5058 (1103D-02) PBGA 357 25*25*1.2P1.27 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 8 Freescale Semiconductor Thermal Characteristics Table 4 shows the thermal characteristics for the MPC860. Table 4. MPC860 Thermal Resistance Data Rating Environment Symbol Mold Compound Thickness Junction-to-ambient 1 Natural convection Airflow (200 ft/min) Junction-to-board 4 Junction-to-case 5 Junction-to-package top 6 Natural convection 1 2 3 4 5 6 ZP MPC860P ZQ / VR MPC860P Unit 0.85 1.15 mm °C/W Single-layer board (1s) RθJA2 34 34 Four-layer board (2s2p) RθJMA3 22 22 Single-layer board (1s) RθJMA3 27 27 Four-layer board (2s2p) RθJMA3 18 18 RθJB 14 13 RθJC 6 8 ΨJT 2 2 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. Per JEDEC JESD51-6 with the board horizontal. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the exposed pad without contact resistance. Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 9 Power Dissipation 5 Power Dissipation Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1, where CPU frequency is twice the bus speed. Table 5. Power Dissipation (PD) Frequency (MHz) Typical 1 Maximum 2 Unit D.4 (1:1 mode) 50 656 735 mW 66 TBD TBD mW D.4 (2:1 mode) 66 722 762 mW 80 851 909 mW Die Revision 1 2 Typical power dissipation is measured at 3.3 V. Maximum power dissipation is measured at 3.5 V. NOTE Values in Table 5 represent VDDL-based power dissipation and do not include I/O power dissipation over VDDH. I/O power dissipation varies widely by application due to buffer current, depending on external circuitry. 6 DC Characteristics Table 6 provides the DC electrical characteristics for the MPC860. Table 6. DC Electrical Specifications Characteristic Symbol Min Max Unit VDDH, VDDL, VDDSYN 3.0 3.6 V KAPWR (power-down mode) 2.0 3.6 V KAPWR (all other operating modes) VDDH – 0.4 VDDH V VDDH, VDDL, KAPWR, VDDSYN 3.135 3.465 V KAPWR (power-down mode) 2.0 3.6 V KAPWR (all other operating modes) VDDH – 0.4 VDDH V Input high voltage (all inputs except EXTAL and EXTCLK) VIH 2.0 5.5 V Input low voltage1 VIL GND 0.8 V VIHC 0.7 × (VDDH) VDDH + 0.3 V Iin — 100 µA Operating voltage at 40 MHz or less Operating voltage greater than 40 MHz EXTAL, EXTCLK input high voltage Input leakage current, Vin = 5.5 V (except TMS, TRST, DSCK, and DSDI pins) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 10 Freescale Semiconductor DC Characteristics Table 6. DC Electrical Specifications (continued) Characteristic Symbol Min Max Unit Input leakage current, Vin = 3.6 V (except TMS, TRST, DSCK, and DSDI pins) IIn — 10 µA Input leakage current, Vin = 0 V (except TMS, TRST, DSCK, and DSDI pins) IIn — 10 µA Input capacitance2 Cin — 20 pF Output high voltage, IOH = –2.0 mA, VDDH = 3.0 V (except XTAL, XFC, and open-drain pins) VOH 2.4 — V Output low voltage IOL = 2.0 mA, CLKOUT IOL = 3.2 mA 3 IOL = 5.3 mA 4 IOL = 7.0 mA, TXD1/PA14, TXD2/PA12 IOL = 8.9 mA, TS, TA, TEA, BI, BB, HRESET, SRESET VOL — 0.5 V 1 VIL(max) for the I2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard. Input capacitance is periodically sampled. 3 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IP_B(0:1)/IWP(0:1)/VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3, RXD1/PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9, L1RXDA/PA8, TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5, TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3, BRGCLK2/ L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1, L1TCLKB/TOUT4/CLK8/PA0, REJCT1/SPISEL/PB31, SPICLK/ PB30,SPIMOSI/PB29, BRGO4/SPIMISO/PB28, BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/ PB24, SMSYN1/SDACK1/PB23, SMSYN2/SDACK2/PB22, SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/ RTS1/PB19, L1ST2/RTS2/PB18, L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/ DREQ0/PC15, L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11, TGATE1/CD1/PC10, CTS2/PC9, TGATE2/CD2/PC8, SDACK2/L1TSYNCB/PC7, L1RSYNCB/PC6, SDACK1/L1TSYNCA/PC5, L1RSYNCA/PC4, PD15, PD14, PD13, PD12, PD11, PD10, PD9, PD8, PD5, PD6, PD7, PD4, PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, and MII_TXD[0:3] 4 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD, WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1, GPL_A(2:3)/GPL_B(2:3)/ CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A, ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, and BADDR(28:30) 2 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 11 Thermal Calculation and Measurement 7 Thermal Calculation and Measurement For the following discussions, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 7.1 Estimation with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, in ºC can be obtained from the equation: TJ = TA + (RθJA × PD) where: TA = ambient temperature (ºC) RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 7.2 Estimation with Junction-to-Case Thermal Resistance Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (ºC/W) RθJC = junction-to-case thermal resistance (ºC/W) RθCA = case-to-ambient thermal resistance (ºC/W) RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required. 7.3 Estimation with Junction-to-Board Thermal Resistance A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed-circuit board. It has been observed that the thermal performance of most plastic packages, especially PBGA packages, is strongly dependent on the board temperature; see Figure 2. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 12 Freescale Semiconductor Junction Temperature Rise Above Ambient Divided by Package Power Thermal Calculation and Measurement Board Temperature Rise Above Ambient Divided by Package Power Figure 2. Effect of Board Temperature Rise on Thermal Behavior If the board temperature is known, an estimate of the junction temperature in the environment can be made using the following equation: TJ = TB + (RθJB × PD) where: RθJB = junction-to-board thermal resistance (ºC/W) TB = board temperature (ºC) PD = power dissipation in package If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. For this method to work, the board and board mounting must be similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground plane. 7.4 Estimation Using Simulation When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the package can be used in the thermal simulation. 7.5 Experimental Determination To determine the junction temperature of the device in the application after prototypes are available, the thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT × PD) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 13 Layout Practices where: ΨJT = thermal characterization parameter TT = thermocouple temperature on top of package PD = power dissipation in package The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. 7.6 References Semiconductor Equipment and Materials International 805 East Middlefield Rd. Mountain View, CA 94043 (415) 964-5111 MIL-SPEC and EIA/JESD (JEDEC) Specifications (Available from Global Engineering Documents) 800-854-7179 or 303-397-7956 JEDEC Specifications http://www.jedec.org 1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54. 2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220. 8 Layout Practices Each VDD pin on the MPC860 should be provided with a low-impedance path to the board’s supply. Each GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on the chip. The VDD power supply should be bypassed to ground using at least four 0.1 µF-bypass capacitors located as close as possible to the four sides of the package. The capacitor leads and associated printed circuit traces connecting to chip VDD and GND should be kept to less than half an inch per capacitor lead. A four-layer board employing two inner layers as VCC and GND planes is recommended. All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace interconnection length should be minimized in order to minimize undershoot and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of 6 inches are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 14 Freescale Semiconductor Bus Signal Timing 9 Bus Signal Timing Table 7 provides the bus operation timing for the MPC860 at 33, 40, 50, and 66 MHz. The maximum bus speed supported by the MPC860 is 66 MHz. Higher-speed parts must be operated in half-speed bus mode (for example, an MPC860 used at 80 MHz must be configured for a 40-MHz bus). The timing for the MPC860 bus shown assumes a 50-pF load for maximum delays and a 0-pF load for minimum delays. Table 7. Bus Operation Timings 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B1 CLKOUT period 30.30 30.30 25.00 30.30 20.00 30.30 15.15 30.30 ns B1a EXTCLK to CLKOUT phase skew (EXTCLK > 15 MHz and MF 10 MHz and MF < 10) –2.30 2.30 –2.30 2.30 –2.30 2.30 –2.30 2.30 ns B1c CLKOUT phase jitter (EXTCLK > 15 MHz and MF 500)1 — 3.00 — 3.00 — 3.00 — 3.00 % B1h Frequency jitter on EXTCLK2 — 0.50 — 0.50 — 0.50 — 0.50 % B2 CLKOUT pulse width low 12.12 — 10.00 — 8.00 — 6.06 — ns B3 CLKOUT width high 12.12 — 10.00 — 8.00 — 6.06 — ns B4 CLKOUT rise time3 — 4.00 — 4.00 — 4.00 — 4.00 ns B533 CLKOUT fall time3 — 4.00 — 4.00 — 4.00 — 4.00 ns B7 CLKOUT to A(0:31), BADDR(28:30), RD/WR, BURST, D(0:31), DP(0:3) invalid 7.58 — 6.25 — 5.00 — 3.80 — ns B7a CLKOUT to TSIZ(0:1), REG, RSV, AT(0:3), BDIP, PTR invalid 7.58 — 6.25 — 5.00 — 3.80 — ns B7b CLKOUT to BR, BG, FRZ, VFLS(0:1), VF(0:2) IWP(0:2), LWP(0:1), STS invalid 4 7.58 — 6.25 — 5.00 — 3.80 — ns B8 CLKOUT to A(0:31), BADDR(28:30) RD/WR, BURST, D(0:31), DP(0:3) valid 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns B8a CLKOUT to TSIZ(0:1), REG, RSV, AT(0:3) BDIP, PTR valid 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns B8b CLKOUT to BR, BG, VFLS(0:1), VF(0:2), IWP(0:2), FRZ, LWP(0:1), STS valid 4 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 15 Bus Signal Timing Table 7. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B9 CLKOUT to A(0:31), BADDR(28:30), RD/WR, BURST, D(0:31), DP(0:3), TSIZ(0:1), REG, RSV, AT(0:3), PTR High-Z 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns B11 CLKOUT to TS, BB assertion 7.58 13.58 6.25 12.25 5.00 11.00 3.80 11.29 ns B11a CLKOUT to TA, BI assertion (when driven by the memory controller or PCMCIA interface) 2.50 9.25 2.50 9.25 2.50 9.25 2.50 9.75 ns B12 CLKOUT to TS, BB negation 7.58 14.33 6.25 13.00 5.00 11.75 3.80 8.54 ns B12a CLKOUT to TA, BI negation (when driven by the memory controller or PCMCIA interface) 2.50 11.00 2.50 11.00 2.50 11.00 2.50 9.00 ns B13 CLKOUT to TS, BB High-Z 7.58 21.58 6.25 20.25 5.00 19.00 3.80 14.04 ns B13a CLKOUT to TA, BI High-Z (when driven by the memory controller or PCMCIA interface) 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns B14 CLKOUT to TEA assertion 2.50 10.00 2.50 10.00 2.50 10.00 2.50 9.00 ns B15 CLKOUT to TEA High-Z 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns B16 TA, BI valid to CLKOUT (setup time) 9.75 — 9.75 — 9.75 — 6.00 — ns B16a TEA, KR, RETRY, CR valid to CLKOUT (setup time) 10.00 — 10.00 — 10.00 — 4.50 — ns B16b BB, BG, BR, valid to CLKOUT (setup time)5 8.50 — 8.50 — 8.50 — 4.00 — ns B17 CLKOUT to TA, TEA, BI, BB, BG, BR valid (hold time) 1.00 — 1.00 — 1.00 — 2.00 — ns B17a CLKOUT to KR, RETRY, CR valid (hold time) 2.00 — 2.00 — 2.00 — 2.00 — ns B18 D(0:31), DP(0:3) valid to CLKOUT rising edge (setup time)6 6.00 — 6.00 — 6.00 — 6.00 — ns B19 CLKOUT rising edge to D(0:31), DP(0:3) valid (hold time)6 1.00 — 1.00 — 1.00 — 2.00 — ns B20 D(0:31), DP(0:3) valid to CLKOUT falling edge (setup time)7 4.00 — 4.00 — 4.00 — 4.00 — ns B21 CLKOUT falling edge to D(0:31), DP(0:3) valid (hold time)7 2.00 — 2.00 — 2.00 — 2.00 — ns B22 CLKOUT rising edge to CS asserted GPCM ACS = 00 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns B22a CLKOUT falling edge to CS asserted GPCM ACS = 10, TRLX = 0 — 8.00 — 8.00 — 8.00 — 8.00 ns B22b CLKOUT falling edge to CS asserted GPCM ACS = 11, TRLX = 0, EBDF = 0 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B22c CLKOUT falling edge to CS asserted GPCM ACS = 11, TRLX = 0, EBDF = 1 10.86 17.99 8.88 16.00 7.00 14.13 5.18 12.31 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 16 Freescale Semiconductor Bus Signal Timing Table 7. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B23 CLKOUT rising edge to CS negated GPCM read access, GPCM write access ACS = 00, TRLX = 0, and CSNT = 0 2.00 8.00 2.00 8.00 2.00 8.00 2.00 8.00 ns B24 A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 10, TRLX = 0 5.58 — 4.25 — 3.00 — 1.79 — ns B24a A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 11, TRLX = 0 13.15 — 10.50 — 8.00 — 5.58 — ns B25 CLKOUT rising edge to OE, WE(0:3) asserted — 9.00 — 9.00 — 9.00 — 9.00 ns B26 CLKOUT rising edge to OE negated 2.00 9.00 2.00 9.00 2.00 9.00 2.00 9.00 ns B27 A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 10, TRLX = 1 35.88 — 29.25 — 23.00 — 16.94 — ns B27a A(0:31) and BADDR(28:30) to CS asserted GPCM ACS = 11, TRLX = 1 43.45 — 35.50 — 28.00 — 20.73 — ns B28 CLKOUT rising edge to WE(0:3) negated GPCM write access CSNT = 0 — 9.00 — 9.00 — 9.00 — 9.00 ns B28a CLKOUT falling edge to WE(0:3) negated GPCM write access TRLX = 0, 1, CSNT = 1, EBDF = 0 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B28b CLKOUT falling edge to CS negated GPCM write access TRLX = 0, 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 — 14.33 — 13.00 — 11.75 — 10.54 ns B28c CLKOUT falling edge to WE(0:3) negated GPCM write access TRLX = 0, 1, CSNT = 1 write access TRLX = 0, CSNT = 1, EBDF = 1 10.86 17.99 8.88 16.00 7.00 14.13 5.18 12.31 ns B28d CLKOUT falling edge to CS negated GPCM write access TRLX = 0, 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 1 — 17.99 — 16.00 — 14.13 — 12.31 ns B29 WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access CSNT = 0, EBDF = 0 5.58 — 4.25 — 3.00 — 1.79 — ns B29a WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, EBDF = 0 13.15 — 10.5 — 8.00 — 5.58 — ns B29b CS negated to D(0:31), DP(0:3), High-Z GPCM write access, ACS = 00, TRLX = 0, 1, and CSNT = 0 5.58 — 4.25 — 3.00 — 1.79 — ns B29c CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 13.15 — 10.5 — 8.00 — 5.58 — ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 17 Bus Signal Timing Table 7. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B29d WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, EBDF = 0 43.45 — 35.5 — 28.00 — 20.73 — ns B29e CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 43.45 — 35.5 — 28.00 — 29.73 — ns B29f WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, EBDF = 1 8.86 — 6.88 — 5.00 — 3.18 — ns B29g CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 0, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 1 8.86 — 6.88 — 5.00 — 3.18 — ns B29h WE(0:3) negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, EBDF = 1 38.67 — 31.38 — 24.50 — 17.83 — ns B29i CS negated to D(0:31), DP(0:3) High-Z GPCM write access, TRLX = 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 1 38.67 — 31.38 — 24.50 — 17.83 — ns B30 CS, WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access 8 5.58 — 4.25 — 3.00 — 1.79 — ns B30a WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM, write access, TRLX = 0, CSNT = 1, CS negated to A(0:31) invalid GPCM write access, TRLX = 0, CSNT = 1 ACS = 10, or ACS = 11, EBDF = 0 13.15 — 10.50 — 8.00 — 5.58 — ns B30b WE(0:3) negated to A(0:31), invalid GPCM BADDR(28:30) invalid GPCM write access, TRLX = 1, CSNT = 1. CS negated to A(0:31), Invalid GPCM, write access, TRLX = 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 0 43.45 — 35.50 — 28.00 — 20.73 — ns B30c WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access, TRLX = 0, CSNT = 1. CS negated to A(0:31) invalid GPCM write access, TRLX = 0, CSNT = 1, ACS = 10, ACS = 11, EBDF = 1 8.36 — 6.38 — 4.50 — 2.68 — ns B30d WE(0:3) negated to A(0:31), BADDR(28:30) invalid GPCM write access, TRLX = 1, CSNT =1. CS negated to A(0:31) invalid GPCM write access TRLX = 1, CSNT = 1, ACS = 10, or ACS = 11, EBDF = 1 38.67 — 31.38 — 24.50 — 17.83 — ns B31 CLKOUT falling edge to CS valid—as requested by control bit CST4 in the corresponding word in UPM 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 18 Freescale Semiconductor Bus Signal Timing Table 7. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B31a CLKOUT falling edge to CS valid—as requested by control bit CST1 in the corresponding word in UPM 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B31b CLKOUT rising edge to CS valid—as requested by control bit CST2 in the corresponding word in UPM 1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00 ns B31c CLKOUT rising edge to CS valid—as requested by control bit CST3 in the corresponding word in UPM 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.04 ns B31d CLKOUT falling edge to CS valid—as requested by control bit CST1 in the corresponding word in UPM, EBDF = 1 13.26 17.99 11.28 16.00 9.40 14.13 7.58 12.31 ns B32 CLKOUT falling edge to BS valid—as requested by control bit BST4 in the corresponding word in UPM 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns B32a CLKOUT falling edge to BS valid—as requested by control bit BST1 in the corresponding word in UPM, EBDF = 0 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B32b CLKOUT rising edge to BS valid—as requested by control bit BST2 in the corresponding word in UPM 1.50 8.00 1.50 8.00 1.50 8.00 1.50 8.00 ns B32c CLKOUT rising edge to BS valid—as requested by control bit BST3 in the corresponding word in UPM 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B32d CLKOUT falling edge to BS valid—as requested by control bit BST1 in the corresponding word in UPM, EBDF = 1 13.26 17.99 11.28 16.00 9.40 14.13 7.58 12.31 ns B33 CLKOUT falling edge to GPL valid—as requested by control bit GxT4 in the corresponding word in UPM 1.50 6.00 1.50 6.00 1.50 6.00 1.50 6.00 ns B33a CLKOUT rising edge to GPL valid—as requested by control bit GxT3 in the corresponding word in UPM 7.58 14.33 6.25 13.00 5.00 11.75 3.80 10.54 ns B34 A(0:31), BADDR(28:30), and D(0:31) to CS valid—as requested by control bit CST4 in the corresponding word in UPM 5.58 — 4.25 — 3.00 — 1.79 — ns B34a A(0:31), BADDR(28:30), and D(0:31) to CS valid—as requested by control bit CST1 in the corresponding word in UPM 13.15 — 10.50 — 8.00 — 5.58 — ns B34b A(0:31), BADDR(28:30), and D(0:31) to CS valid—as requested by control bit CST2 in the corresponding word in UPM 20.73 — 16.75 — 13.00 — 9.36 — ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 19 Bus Signal Timing Table 7. Bus Operation Timings (continued) 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max B35 A(0:31), BADDR(28:30) to CS valid—as requested by control bit BST4 in the corresponding word in UPM 5.58 — 4.25 — 3.00 — 1.79 — ns B35a A(0:31), BADDR(28:30), and D(0:31) to BS valid—as requested by control bit BST1 in the corresponding word in UPM 13.15 — 10.50 — 8.00 — 5.58 — ns B35b A(0:31), BADDR(28:30), and D(0:31) to BS valid—as requested by control bit BST2 in the corresponding word in UPM 20.73 — 16.75 — 13.00 — 9.36 — ns B36 A(0:31), BADDR(28:30), and D(0:31) to GPL valid—as requested by control bit GxT4 in the corresponding word in UPM 5.58 — 4.25 — 3.00 — 1.79 — ns B37 UPWAIT valid to CLKOUT falling edge9 6.00 — 6.00 — 6.00 — 6.00 — ns B38 CLKOUT falling edge to UPWAIT valid9 1.00 — 1.00 — 1.00 — 1.00 — ns 7.00 — 7.00 — 7.00 — 7.00 — ns edge10 B39 AS valid to CLKOUT rising B40 A(0:31), TSIZ(0:1), RD/WR, BURST, valid to CLKOUT rising edge 7.00 — 7.00 — 7.00 — 7.00 — ns B41 TS valid to CLKOUT rising edge (setup time) 7.00 — 7.00 — 7.00 — 7.00 — ns B42 CLKOUT rising edge to TS valid (hold time) 2.00 — 2.00 — 2.00 — 2.00 — ns B43 AS negation to memory controller signals negation — TBD — TBD — TBD — TBD ns 1 Phase and frequency jitter performance results are only valid if the input jitter is less than the prescribed value. If the rate of change of the frequency of EXTAL is slow (that is, it does not jump between the minimum and maximum values in one cycle) or the frequency of the jitter is fast (that is, it does not stay at an extreme value for a long time) then the maximum allowed jitter on EXTAL can be up to 2%. 3 The timings specified in B4 and B5 are based on full strength clock. 4 The timing for BR output is relevant when the MPC860 is selected to work with external bus arbiter. The timing for BG output is relevant when the MPC860 is selected to work with internal bus arbiter. 5 The timing required for BR input is relevant when the MPC860 is selected to work with internal bus arbiter. The timing for BG input is relevant when the MPC860 is selected to work with external bus arbiter. 6 The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of the CLKOUT in which the TA input signal is asserted. 7 The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of the CLKOUT. This timing is valid only for read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats where DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.) 8 The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0. 9 The signal UPWAIT is considered asynchronous to the CLKOUT and synchronized internally. The timings specified in B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 18. 10 The AS signal is considered asynchronous to the CLKOUT. The timing B39 is specified in order to allow the behavior specified in Figure 21. 2 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 20 Freescale Semiconductor Bus Signal Timing Figure 3 is the control timing diagram. CLKOUT A B Outputs A B Outputs D C Inputs D C Inputs A Maximum output delay specification. B Minimum output hold time. C Minimum input setup time specification. D Minimum input hold time specification. Figure 3. Control Timing Figure 4 provides the timing for the external clock. CLKOUT B1 B3 B1 B4 B2 B5 Figure 4. External Clock Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 21 Bus Signal Timing Figure 5 provides the timing for the synchronous output signals. CLKOUT B8 B7 B9 Output Signals B8a B7a B9 Output Signals B8b B7b Output Signals Figure 5. Synchronous Output Signals Timing Figure 6 provides the timing for the synchronous active pull-up and open-drain output signals. CLKOUT B13 B11 B12 TS, BB B13a B11a B12a TA, BI B14 B15 TEA Figure 6. Synchronous Active Pull-Up Resistor and Open-Drain Outputs Signals Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 22 Freescale Semiconductor Bus Signal Timing Figure 7 provides the timing for the synchronous input signals. CLKOUT B16 B17 TA, BI B16a B17a TEA, KR, RETRY, CR B16b B17 BB, BG, BR Figure 7. Synchronous Input Signals Timing Figure 8 provides normal case timing for input data. It also applies to normal read accesses under the control of the UPM in the memory controller. CLKOUT B16 B17 TA B18 B19 D[0:31], DP[0:3] Figure 8. Input Data Timing in Normal Case MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 23 Bus Signal Timing Figure 9 provides the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.) CLKOUT TA B20 B21 D[0:31], DP[0:3] Figure 9. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1 Figure 10 through Figure 13 provide the timing for the external bus read controlled by various GPCM factors. CLKOUT B11 B12 TS B8 A[0:31] B22 B23 CSx B25 B26 OE B28 WE[0:3] B19 B18 D[0:31], DP[0:3] Figure 10. External Bus Read Timing (GPCM Controlled—ACS = 00) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 24 Freescale Semiconductor Bus Signal Timing CLKOUT B11 B12 TS B8 A[0:31] B23 B22a CSx B24 B25 B26 OE B18 B19 D[0:31], DP[0:3] Figure 11. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 10) CLKOUT B11 B12 TS B8 B22b A[0:31] B23 B22c CSx B24a B25 B26 OE B18 B19 D[0:31], DP[0:3] Figure 12. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 11) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 25 Bus Signal Timing CLKOUT B11 B12 TS B8 A[0:31] B23 B22a CSx B27 OE B26 B27a B22b B22c B18 B19 D[0:31], DP[0:3] Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10, ACS = 11) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 26 Freescale Semiconductor Bus Signal Timing Figure 14 through Figure 16 provide the timing for the external bus write controlled by various GPCM factors. CLKOUT B11 B12 TS B8 B30 A[j0:31] B22 B23 CSx B25 B28 WE[0:3] B26 B29b OE B29 B8 B9 D[0:31], DP[0:3] Figure 14. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 0) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 27 Bus Signal Timing CLKOUT B11 B12 TS B8 B30a B30c A[0:31] B22 B23 B28b B28d CSx B25 B29c B29g WE[0:3] B26 B29a B29f OE B28a B28c B8 B9 D[0:31], DP[0:3] Figure 15. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 1) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 28 Freescale Semiconductor Bus Signal Timing CLKOUT B11 B12 TS B8 B30b B30d A[0:31] B22 B23 B28b B28d CSx B25 B29e B29i WE[0:3] B26 B29d B29h OE B29b B8 B28a B28c B9 D[0:31], DP[0:3] Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 1) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 29 Bus Signal Timing Figure 17 provides the timing for the external bus controlled by the UPM. CLKOUT B8 A[0:31] B31a B31d B31 B31c B31b CSx B34 B34a B34b B32a B32d B32 B32c B32b BS_A[0:3], BS_B[0:3] B35 B36 B35a B33a B35b B33 GPL_A[0:5], GPL_B[0:5] Figure 17. External Bus Timing (UPM Controlled Signals) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 30 Freescale Semiconductor Bus Signal Timing Figure 18 provides the timing for the asynchronous asserted UPWAIT signal controlled by the UPM. CLKOUT B37 UPWAIT B38 CSx BS_A[0:3], BS_B[0:3] GPL_A[0:5], GPL_B[0:5] Figure 18. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing Figure 19 provides the timing for the asynchronous negated UPWAIT signal controlled by the UPM. CLKOUT B37 UPWAIT B38 CSx BS_A[0:3], BS_B[0:3] GPL_A[0:5], GPL_B[0:5] Figure 19. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 31 Bus Signal Timing Figure 20 provides the timing for the synchronous external master access controlled by the GPCM. CLKOUT B41 B42 TS B40 A[0:31], TSIZ[0:1], R/W, BURST B22 CSx Figure 20. Synchronous External Master Access Timing (GPCM Handled ACS = 00) Figure 21 provides the timing for the asynchronous external master memory access controlled by the GPCM. CLKOUT B39 AS B40 A[0:31], TSIZ[0:1], R/W B22 CSx Figure 21. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00) Figure 22 provides the timing for the asynchronous external master control signals negation. AS B43 CSx, WE[0:3], OE, GPLx, BS[0:3] Figure 22. Asynchronous External Master—Control Signals Negation Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 32 Freescale Semiconductor Bus Signal Timing Table 8 provides interrupt timing for the MPC860. Table 8. Interrupt Timing All Frequencies Characteristic1 Num 1 Unit Min Max I39 IRQx valid to CLKOUT rising edge (setup time) 6.00 — ns I40 IRQx hold time after CLKOUT 2.00 — ns I41 IRQx pulse width low 3.00 — ns I42 IRQx pulse width high 3.00 — ns I43 IRQx edge-to-edge time 4 × TCLOCKOUT — — The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as level-sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference to the CLKOUT. The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry and have no direct relation with the total system interrupt latency that the MPC860 is able to support. Figure 23 provides the interrupt detection timing for the external level-sensitive lines. CLKOUT I39 I40 IRQx Figure 23. Interrupt Detection Timing for External Level Sensitive Lines Figure 24 provides the interrupt detection timing for the external edge-sensitive lines. CLKOUT I41 I42 IRQx I43 I43 Figure 24. Interrupt Detection Timing for External Edge Sensitive Lines MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 33 Bus Signal Timing Table 9 shows the PCMCIA timing for the MPC860. Table 9. PCMCIA Timing 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max P44 A(0:31), REG valid to PCMCIA Strobe asserted1 20.73 — 16.75 — 13.00 — 9.36 — ns P45 A(0:31), REG valid to ALE negation1 28.30 — 23.00 — 18.00 — 13.15 — ns P46 CLKOUT to REG valid 7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84 ns P47 CLKOUT to REG invalid 8.58 — 7.25 — 6.00 — 4.84 — ns P48 CLKOUT to CE1, CE2 asserted 7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84 ns P49 CLKOUT to CE1, CE2 negated 7.58 15.58 6.25 14.25 5.00 13.00 3.79 11.84 ns P50 CLKOUT to PCOE, IORD, PCWE, IOWR assert time — 11.00 11.00 — 11.00 — 11.00 ns P51 CLKOUT to PCOE, IORD, PCWE, IOWR negate time 2.00 11.00 2.00 11.00 2.00 11.00 2.00 11.00 ns P52 CLKOUT to ALE assert time 7.58 15.58 6.25 14.25 5.00 13.00 3.79 10.04 ns P53 CLKOUT to ALE negate time — 15.58 14.25 — 13.00 — 11.84 ns 5.58 — 4.25 — 3.00 — 1.79 — ns invalid1 P54 PCWE, IOWR negated to D(0:31) P55 WAITA and WAITB valid to CLKOUT rising edge1 8.00 — 8.00 — 8.00 — 8.00 — ns P56 CLKOUT rising edge to WAITA and WAITB invalid1 2.00 — 2.00 — 2.00 — 2.00 — ns 1 PSST = 1. Otherwise add PSST times cycle time. PSHT = 0. Otherwise add PSHT times cycle time. These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the PCMCIA current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL timer expiration. See Chapter 16, “PCMCIA Interface,” in the MPC860 PowerQUICC™ Family User’s Manual. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 34 Freescale Semiconductor Bus Signal Timing Figure 25 provides the PCMCIA access cycle timing for the external bus read. CLKOUT TS P44 A[0:31] P46 P45 P47 REG P48 P49 CE1/CE2 P50 P51 P53 P52 PCOE, IORD P52 ALE B18 B19 D[0:31] Figure 25. PCMCIA Access Cycle Timing External Bus Read MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 35 Bus Signal Timing Figure 26 provides the PCMCIA access cycle timing for the external bus write. CLKOUT TS P44 A[0:31] P46 P45 P47 REG P48 P49 CE1/CE2 P50 P51 P54 P53 P52 B8 B9 PCWE, IOWR P52 ALE D[0:31] Figure 26. PCMCIA Access Cycle Timing External Bus Write Figure 27 provides the PCMCIA WAIT signal detection timing. CLKOUT P55 P56 WAITx Figure 27. PCMCIA WAIT Signal Detection Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 36 Freescale Semiconductor Bus Signal Timing Table 10 shows the PCMCIA port timing for the MPC860. Table 10. PCMCIA Port Timing 33 MHz Num P57 1 40 MHz 50 MHz 66 MHz Characteristic Unit CLKOUT to OPx valid 1 Min Max Min Max Min Max Min Max — 19.00 — 19.00 — 19.00 — 19.00 ns 25.73 — 21.75 — 18.00 — 14.36 — ns P58 HRESET negated to OPx drive P59 IP_Xx valid to CLKOUT rising edge 5.00 — 5.00 — 5.00 — 5.00 — ns P60 CLKOUT rising edge to IP_Xx invalid 1.00 — 1.00 — 1.00 — 1.00 — ns OP2 and OP3 only. Figure 28 provides the PCMCIA output port timing for the MPC860. CLKOUT P57 Output Signals HRESET P58 OP2, OP3 Figure 28. PCMCIA Output Port Timing Figure 29 provides the PCMCIA output port timing for the MPC860. CLKOUT P59 P60 Input Signals Figure 29. PCMCIA Input Port Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 37 Bus Signal Timing Table 11 shows the debug port timing for the MPC860. Table 11. Debug Port Timing All Frequencies Num Characteristic Unit Min Max 3 × TCLOCKOUT — — P61 DSCK cycle time P62 DSCK clock pulse width 1.25 × TCLOCKOUT — — P63 DSCK rise and fall times 0.00 3.00 ns P64 DSDI input data setup time 8.00 — ns P65 DSDI data hold time 5.00 — ns P66 DSCK low to DSDO data valid 0.00 15.00 ns P67 DSCK low to DSDO invalid 0.00 2.00 ns Figure 30 provides the input timing for the debug port clock. DSCK D61 D62 D61 D62 D63 D63 Figure 30. Debug Port Clock Input Timing Figure 31 provides the timing for the debug port. DSCK D64 D65 DSDI D66 D67 DSDO Figure 31. Debug Port Timings MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 38 Freescale Semiconductor Bus Signal Timing Table 12 shows the reset timing for the MPC860. Table 12. Reset Timing 33 MHz Num 40 MHz 50 MHz 66 MHz Characteristic Unit Min Max Min Max Min Max Min Max R69 CLKOUT to HRESET high impedance — 20.00 — 20.00 — 20.00 — 20.00 ns R70 CLKOUT to SRESET high impedance — 20.00 — 20.00 — 20.00 — 20.00 ns R71 RSTCONF pulse width 515.15 — 425.00 340.00 — 257.58 — ns R72 — — — — — — — — — R73 Configuration data to HRESET rising edge setup time 504.55 — 425.00 — 350.00 — 277.27 — ns R74 Configuration data to RSTCONF rising edge setup time 350.00 — 350.00 — 350.00 — 350.00 — ns R75 Configuration data hold time after RSTCONF negation 0.00 — 0.00 — 0.00 — 0.00 — ns R76 Configuration data hold time after HRESET negation 0.00 — 0.00 — 0.00 — 0.00 — ns R77 HRESET and RSTCONF asserted to data out drive — 25.00 25.00 — 25.00 — 25.00 ns R78 RSTCONF negated to data out high impedance — 25.00 — 25.00 — 25.00 — 25.00 ns R79 CLKOUT of last rising edge before chip three-state HRESET to data out high impedance — 25.00 — 25.00 — 25.00 — 25.00 ns R80 DSDI, DSCK setup 90.91 — 75.00 — 60.00 — 45.45 — ns R81 DSDI, DSCK hold time 0.00 — 0.00 — 0.00 — 0.00 — ns R82 SRESET negated to CLKOUT rising edge for DSDI and DSCK sample 242.42 — 200.00 — 160.00 — 121.21 — ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 39 Bus Signal Timing Figure 32 shows the reset timing for the data bus configuration. HRESET R71 R76 RSTCONF R73 R74 R75 D[0:31] (IN) Figure 32. Reset Timing—Configuration from Data Bus Figure 33 provides the reset timing for the data bus weak drive during configuration. CLKOUT R69 HRESET R79 RSTCONF R77 R78 D[0:31] (OUT) (Weak) Figure 33. Reset Timing—Data Bus Weak Drive During Configuration MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 40 Freescale Semiconductor IEEE 1149.1 Electrical Specifications Figure 34 provides the reset timing for the debug port configuration. CLKOUT R70 R82 SRESET R80 R80 R81 R81 DSCK, DSDI Figure 34. Reset Timing—Debug Port Configuration 10 IEEE 1149.1 Electrical Specifications Table 13 provides the JTAG timings for the MPC860 shown in Figure 35 through Figure 38. Table 13. JTAG Timing All Frequencies Num Characteristic Unit Min Max J82 TCK cycle time 100.00 — ns J83 TCK clock pulse width measured at 1.5 V 40.00 — ns J84 TCK rise and fall times 0.00 10.00 ns J85 TMS, TDI data setup time 5.00 — ns J86 TMS, TDI data hold time 25.00 — ns J87 TCK low to TDO data valid — 27.00 ns J88 TCK low to TDO data invalid 0.00 — ns J89 TCK low to TDO high impedance — 20.00 ns J90 TRST assert time 100.00 — ns J91 TRST setup time to TCK low 40.00 — ns J92 TCK falling edge to output valid — 50.00 ns J93 TCK falling edge to output valid out of high impedance — 50.00 ns J94 TCK falling edge to output high impedance — 50.00 ns J95 Boundary scan input valid to TCK rising edge 50.00 — ns J96 TCK rising edge to boundary scan input invalid 50.00 — ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 41 IEEE 1149.1 Electrical Specifications TCK J82 J83 J82 J83 J84 J84 Figure 35. JTAG Test Clock Input Timing TCK J85 J86 TMS, TDI J87 J88 J89 TDO Figure 36. JTAG Test Access Port Timing Diagram TCK J91 J90 TRST Figure 37. JTAG TRST Timing Diagram TCK J92 J94 Output Signals J93 Output Signals J95 J96 Output Signals Figure 38. Boundary Scan (JTAG) Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 42 Freescale Semiconductor CPM Electrical Characteristics 11 CPM Electrical Characteristics This section provides the AC and DC electrical specifications for the communications processor module (CPM) of the MPC860. 11.1 PIP/PIO AC Electrical Specifications Table 14 provides the PIP/PIO AC timings as shown in Figure 39 through Figure 43. Table 14. PIP/PIO Timing All Frequencies Num 1 Characteristic Unit Min Max 21 Data-in setup time to STBI low 0 — ns 22 Data-in hold time to STBI high 2.5 – t31 — CLK 23 STBI pulse width 1.5 — CLK 24 STBO pulse width 1 CLK – 5 ns — ns 25 Data-out setup time to STBO low 2 — CLK 26 Data-out hold time from STBO high 5 — CLK 27 STBI low to STBO low (Rx interlock) — 2 CLK 28 STBI low to STBO high (Tx interlock) 2 — CLK 29 Data-in setup time to clock high 15 — ns 30 Data-in hold time from clock high 7.5 — ns 31 Clock low to data-out valid (CPU writes data, control, or direction) — 25 ns t3 = Specification 23. DATA-IN 21 22 23 STBI 27 24 STBO Figure 39. PIP Rx (Interlock Mode) Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 43 CPM Electrical Characteristics DATA-OUT 25 26 24 STBO (Output) 28 23 STBI (Input) Figure 40. PIP Tx (Interlock Mode) Timing Diagram DATA-IN 21 22 23 STBI (Input) 24 STBO (Output) Figure 41. PIP Rx (Pulse Mode) Timing Diagram DATA-OUT 25 26 24 STBO (Output) 23 STBI (Input) Figure 42. PIP TX (Pulse Mode) Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 44 Freescale Semiconductor CPM Electrical Characteristics CLKO 29 30 DATA-IN 31 DATA-OUT Figure 43. Parallel I/O Data-In/Data-Out Timing Diagram 11.2 Port C Interrupt AC Electrical Specifications Table 15 provides the timings for port C interrupts. Table 15. Port C Interrupt Timing ≥ 33.34 MHz1 Num 1 Characteristic Unit Min Max 35 Port C interrupt pulse width low (edge-triggered mode) 55 — ns 36 Port C interrupt minimum time between active edges 55 — ns External bus frequency of greater than or equal to 33.34 MHz. Figure 44 shows the port C interrupt detection timing. 36 Port C (Input) 35 Figure 44. Port C Interrupt Detection Timing 11.3 IDMA Controller AC Electrical Specifications Table 16 provides the IDMA controller timings as shown in Figure 45 through Figure 48. Table 16. IDMA Controller Timing All Frequencies Num Characteristic Unit Min Max 40 DREQ setup time to clock high 7 — ns 41 DREQ hold time from clock high 3 — ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 45 CPM Electrical Characteristics Table 16. IDMA Controller Timing (continued) All Frequencies Num Characteristic Unit Min Max 42 SDACK assertion delay from clock high — 12 ns 43 SDACK negation delay from clock low — 12 ns 44 SDACK negation delay from TA low — 20 ns 45 SDACK negation delay from clock high — 15 ns 46 TA assertion to rising edge of the clock setup time (applies to external TA) 7 — ns CLKO (Output) 41 40 DREQ (Input) Figure 45. IDMA External Requests Timing Diagram CLKO (Output) TS (Output) R/W (Output) 42 43 DATA 46 TA (Input) SDACK Figure 46. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 46 Freescale Semiconductor CPM Electrical Characteristics CLKO (Output) TS (Output) R/W (Output) 42 44 DATA TA (Output) SDACK Figure 47. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA CLKO (Output) TS (Output) R/W (Output) 42 45 DATA TA (Output) SDACK Figure 48. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 47 CPM Electrical Characteristics 11.4 Baud Rate Generator AC Electrical Specifications Table 17 provides the baud rate generator timings as shown in Figure 49. Table 17. Baud Rate Generator Timing All Frequencies Num Characteristic Unit Min Max 50 BRGO rise and fall time — 10 ns 51 BRGO duty cycle 40 60 % 52 BRGO cycle 40 — ns 50 50 BRGOX 51 51 52 Figure 49. Baud Rate Generator Timing Diagram 11.5 Timer AC Electrical Specifications Table 18 provides the general-purpose timer timings as shown in Figure 50. Table 18. Timer Timing All Frequencies Num Characteristic Unit Min Max 61 TIN/TGATE rise and fall time 10 — ns 62 TIN/TGATE low time 1 — CLK 63 TIN/TGATE high time 2 — CLK 64 TIN/TGATE cycle time 3 — CLK 65 CLKO low to TOUT valid 3 25 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 48 Freescale Semiconductor CPM Electrical Characteristics CLKO 60 61 63 62 TIN/TGATE (Input) 61 64 65 TOUT (Output) Figure 50. CPM General-Purpose Timers Timing Diagram 11.6 Serial Interface AC Electrical Specifications Table 19 provides the serial interface timings as shown in Figure 51 through Figure 55. Table 19. SI Timing All Frequencies Num 70 Characteristic L1RCLK, L1TCLK frequency (DSC = 0)1, 2 0)2 Unit Min Max — SYNCCLK/2.5 MHz P + 10 — ns P + 10 — ns — 15.00 ns 71 L1RCLK, L1TCLK width low (DSC = 71a L1RCLK, L1TCLK width high (DSC = 0)3 72 L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time 73 L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC setup time) 20.00 — ns 74 L1CLK edge to L1RSYNC, L1TSYNC, invalid (SYNC hold time) 35.00 — ns 75 L1RSYNC, L1TSYNC rise/fall time — 15.00 ns 76 L1RXD valid to L1CLK edge (L1RXD setup time) 17.00 — ns 77 L1CLK edge to L1RXD invalid (L1RXD hold time) 13.00 — ns 4 10.00 45.00 ns 78A L1SYNC valid to L1ST(1–4) valid 10.00 45.00 ns 79 L1CLK edge to L1ST(1–4) invalid 10.00 45.00 ns 80 L1CLK edge to L1TXD valid 10.00 55.00 ns 10.00 55.00 ns 78 80A L1CLK edge to L1ST(1–4) valid L1TSYNC valid to L1TXD valid 4 81 L1CLK edge to L1TXD high impedance 0.00 42.00 ns 82 L1RCLK, L1TCLK frequency (DSC =1 ) — 16.00 or SYNCCLK/2 MHz 83 L1RCLK, L1TCLK width low (DSC = 1) P + 10 — ns P + 10 — ns 83a L1RCLK, L1TCLK width high (DSC = 1) 3 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 49 CPM Electrical Characteristics Table 19. SI Timing (continued) All Frequencies Num Characteristic Unit Min Max — 30.00 ns 84 L1CLK edge to L1CLKO valid (DSC = 1) 85 L1RQ valid before falling edge of L1TSYNC4 1.00 — L1TCL K 86 L1GR setup time2 42.00 — ns 87 L1GR hold time 42.00 — ns 88 L1CLK edge to L1SYNC valid (FSD = 00) CNT = 0000, BYT = 0, DSC = 0) — 0.00 ns 1 The ratio SYNCCLK/L1RCLK must be greater than 2.5/1. These specs are valid for IDL mode only. 3 Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns. 4 These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever comes later. 2 L1RCLK (FE = 0, CE = 0) (Input) 71 70 71a 72 L1RCLK (FE = 1, CE = 1) (Input) RFSD=1 75 L1RSYNC (Input) 73 74 L1RXD (Input) 77 BIT0 76 78 79 L1ST(4–1) (Output) Figure 51. SI Receive Timing Diagram with Normal Clocking (DSC = 0) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 50 Freescale Semiconductor CPM Electrical Characteristics L1RCLK (FE = 1, CE = 1) (Input) 72 83a 82 L1RCLK (FE = 0, CE = 0) (Input) RFSD=1 75 L1RSYNC (Input) 73 74 L1RXD (Input) 77 BIT0 76 78 79 L1ST(4–1) (Output) 84 L1CLKO (Output) Figure 52. SI Receive Timing with Double-Speed Clocking (DSC = 1) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 51 CPM Electrical Characteristics L1TCLK (FE = 0, CE = 0) (Input) 71 70 72 L1TCLK (FE = 1, CE = 1) (Input) 73 TFSD=0 75 L1TSYNC (Input) 74 80a L1TXD (Output) 81 BIT0 80 78 79 L1ST(4–1) (Output) Figure 53. SI Transmit Timing Diagram (DSC = 0) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 52 Freescale Semiconductor CPM Electrical Characteristics L1RCLK (FE = 0, CE = 0) (Input) 72 83a 82 L1RCLK (FE = 1, CE = 1) (Input) TFSD=0 75 L1RSYNC (Input) 73 74 L1TXD (Output) 81 BIT0 80 78a 79 L1ST(4–1) (Output) 78 84 L1CLKO (Output) Figure 54. SI Transmit Timing with Double Speed Clocking (DSC = 1) MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 53 54 L1GR (Input) L1RQ (Output) L1ST(4–1) (Output) L1RXD (Input) L1TXD (Output) L1RSYNC (Input) L1RCLK (Input) 80 77 74 2 3 5 72 B15 B14 B13 71 71 4 86 85 76 6 87 B17 B16 B15 B14 B13 B17 B16 73 1 8 78 B12 B11 B10 B12 B11 B10 7 9 D1 D1 10 A A 12 14 15 16 17 18 B25 B24 B23 B22 B21 B20 13 B27 B26 B25 B24 B23 B22 B21 B20 81 B27 B26 11 19 D2 D2 20 M M CPM Electrical Characteristics Figure 55. IDL Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor CPM Electrical Characteristics 11.7 SCC in NMSI Mode Electrical Specifications Table 20 provides the NMSI external clock timing. Table 20. NMSI External Clock Timing All Frequencies Num 1 2 Characteristic Unit Min Max 1/SYNCCLK — ns 1/SYNCCLK + 5 — ns — 15.00 ns 100 RCLK1 and TCLK1 width high1 101 RCLK1 and TCLK1 width low 102 RCLK1 and TCLK1 rise/fall time 103 TXD1 active delay (from TCLK1 falling edge) 0.00 50.00 ns 104 RTS1 active/inactive delay (from TCLK1 falling edge) 0.00 50.00 ns 105 CTS1 setup time to TCLK1 rising edge 5.00 — ns 106 RXD1 setup time to RCLK1 rising edge 5.00 — ns 107 RXD1 hold time from RCLK1 rising edge2 5.00 — ns 108 CD1 setup Time to RCLK1 rising edge 5.00 — ns The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 2.25/1. Also applies to CD and CTS hold time when they are used as external sync signals. Table 21 provides the NMSI internal clock timing. Table 21. NMSI Internal Clock Timing All Frequencies Num 1 2 Characteristic Unit Min Max 100 RCLK1 and TCLK1 frequency1 0.00 SYNCCLK/3 MHz 102 RCLK1 and TCLK1 rise/fall time — — ns 103 TXD1 active delay (from TCLK1 falling edge) 0.00 30.00 ns 104 RTS1 active/inactive delay (from TCLK1 falling edge) 0.00 30.00 ns 105 CTS1 setup time to TCLK1 rising edge 40.00 — ns 106 RXD1 setup time to RCLK1 rising edge 40.00 — ns 107 RXD1 hold time from RCLK1 rising edge2 0.00 — ns 108 CD1 setup time to RCLK1 rising edge 40.00 — ns The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 3/1. Also applies to CD and CTS hold time when they are used as external sync signals. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 55 CPM Electrical Characteristics Figure 56 through Figure 58 show the NMSI timings. RCLK1 102 102 101 106 100 RxD1 (Input) 107 108 CD1 (Input) 107 CD1 (SYNC Input) Figure 56. SCC NMSI Receive Timing Diagram TCLK1 102 102 101 100 TxD1 (Output) 103 105 RTS1 (Output) 104 104 CTS1 (Input) 107 CTS1 (SYNC Input) Figure 57. SCC NMSI Transmit Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 56 Freescale Semiconductor CPM Electrical Characteristics TCLK1 102 102 101 100 TxD1 (Output) 103 RTS1 (Output) 104 107 104 105 CTS1 (Echo Input) Figure 58. HDLC Bus Timing Diagram 11.8 Ethernet Electrical Specifications Table 22 provides the Ethernet timings as shown in Figure 59 through Figure 63. Table 22. Ethernet Timing All Frequencies Num Characteristic Unit Min Max 120 CLSN width high 40 — ns 121 RCLK1 rise/fall time — 15 ns 122 RCLK1 width low 40 — ns 123 RCLK1 clock period1 80 120 ns 124 RXD1 setup time 20 — ns 125 RXD1 hold time 5 — ns 126 RENA active delay (from RCLK1 rising edge of the last data bit) 10 — ns 127 RENA width low 100 — ns 128 TCLK1 rise/fall time — 15 ns 129 TCLK1 width low 40 — ns 99 101 ns period1 130 TCLK1 clock 131 TXD1 active delay (from TCLK1 rising edge) 10 50 ns 132 TXD1 inactive delay (from TCLK1 rising edge) 10 50 ns 133 TENA active delay (from TCLK1 rising edge) 10 50 ns 134 TENA inactive delay (from TCLK1 rising edge) 10 50 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 57 CPM Electrical Characteristics Table 22. Ethernet Timing (continued) All Frequencies Num 2 Unit Min Max 135 RSTRT active delay (from TCLK1 falling edge) 10 50 ns 136 RSTRT inactive delay (from TCLK1 falling edge) 10 50 ns 137 REJECT width low 1 — CLK 138 CLKO1 low to SDACK asserted2 — 20 ns — 20 ns 139 1 Characteristic 2 CLKO1 low to SDACK negated The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 2/1. SDACK is asserted whenever the SDMA writes the incoming frame DA into memory. CLSN(CTS1) (Input) 120 Figure 59. Ethernet Collision Timing Diagram RCLK1 121 121 124 123 RxD1 (Input) Last Bit 125 126 127 RENA(CD1) (Input) Figure 60. Ethernet Receive Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 58 Freescale Semiconductor CPM Electrical Characteristics TCLK1 128 128 129 131 121 TxD1 (Output) 132 133 134 TENA(RTS1) (Input) RENA(CD1) (Input) (Note 2) Notes: 1. Transmit clock invert (TCI) bit in GSMR is set. 2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the CSL bit is set in the buffer descriptor at the end of the frame transmission. Figure 61. Ethernet Transmit Timing Diagram RCLK1 RxD1 (Input) 0 1 1 BIT1 Start Frame Delimiter BIT2 136 125 RSTRT (Output) Figure 62. CAM Interface Receive Start Timing Diagram REJECT 137 Figure 63. CAM Interface REJECT Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 59 CPM Electrical Characteristics 11.9 SMC Transparent AC Electrical Specifications Table 23 provides the SMC transparent timings as shown in Figure 64. Table 23. SMC Transparent Timing All Frequencies Num Characteristic Unit Min Max 150 SMCLK clock period1 100 — ns 151 SMCLK width low 50 — ns 151A SMCLK width high 50 — ns 152 SMCLK rise/fall time — 15 ns 153 SMTXD active delay (from SMCLK falling edge) 10 50 ns 154 SMRXD/SMSYNC setup time 20 — ns 155 RXD1/SMSYNC hold time 5 — ns 1 SYNCCLK must be at least twice as fast as SMCLK. SMCLK 152 152 151 151A 150 SMTXD (Output) Note 1 154 153 155 SMSYNC 154 155 SMRXD (Input) Note: 1. This delay is equal to an integer number of character-length clocks. Figure 64. SMC Transparent Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 60 Freescale Semiconductor CPM Electrical Characteristics 11.10 SPI Master AC Electrical Specifications Table 24 provides the SPI master timings as shown in Figure 65 and Figure 66. Table 24. SPI Master Timing All Frequencies Num Characteristic Unit Min Max 160 MASTER cycle time 4 1024 tcyc 161 MASTER clock (SCK) high or low time 2 512 tcyc 162 MASTER data setup time (inputs) 50 — ns 163 Master data hold time (inputs) 0 — ns 164 Master data valid (after SCK edge) — 20 ns 165 Master data hold time (outputs) 0 — ns 166 Rise time output — 15 ns 167 Fall time output — 15 ns SPICLK (CI = 0) (Output) 161 167 161 166 160 SPICLK (CI = 1) (Output) 163 167 162 SPIMISO (Input) msb 166 Data 165 lsb msb 164 167 SPIMOSI (Output) msb 166 Data lsb msb Figure 65. SPI Master (CP = 0) Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 61 CPM Electrical Characteristics SPICLK (CI = 0) (Output) 161 167 166 161 160 SPICLK (CI = 1) (Output) 163 167 162 166 SPIMISO (Input) msb Data 165 lsb msb 164 167 SPIMOSI (Output) 166 msb Data lsb msb Figure 66. SPI Master (CP = 1) Timing Diagram 11.11 SPI Slave AC Electrical Specifications Table 25 provides the SPI slave timings as shown in Figure 67 and Figure 68. Table 25. SPI Slave Timing All Frequencies Num Characteristic Unit Min Max 170 Slave cycle time 2 — tcyc 171 Slave enable lead time 15 — ns 172 Slave enable lag time 15 — ns 173 Slave clock (SPICLK) high or low time 1 — tcyc 174 Slave sequential transfer delay (does not require deselect) 1 — tcyc 175 Slave data setup time (inputs) 20 — ns 176 Slave data hold time (inputs) 20 — ns 177 Slave access time — 50 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 62 Freescale Semiconductor CPM Electrical Characteristics SPISEL (Input) 172 171 174 SPICLK (CI = 0) (Input) 173 182 173 181 170 SPICLK (CI = 1) (Input) 177 181 182 180 SPIMISO (Output) msb 178 Data 175 lsb msb 179 176 SPIMOSI (Input) Undef 181 182 msb Data lsb msb Figure 67. SPI Slave (CP = 0) Timing Diagram SPISEL (Input) 172 171 174 170 SPICLK (CI = 0) (Input) 173 182 181 173 181 SPICLK (CI = 1) (Input) 177 182 180 SPIMISO (Output) Undef msb 175 lsb msb 179 176 SPIMOSI (Input) Data 178 msb 181 182 Data lsb msb Figure 68. SPI Slave (CP = 1) Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 63 CPM Electrical Characteristics 11.12 I2C AC Electrical Specifications Table 26 provides the I2C (SCL < 100 kHz) timings. Table 26. I2C Timing (SCL < 100 kHZ) All Frequencies Num 200 Characteristic Unit Min Max 0 100 kHz 1.5 100 kHz SCL clock frequency (slave) (master)1 200 SCL clock frequency 202 Bus free time between transmissions 4.7 — μs 203 Low period of SCL 4.7 — μs 204 High period of SCL 4.0 — μs 205 Start condition setup time 4.7 — μs 206 Start condition hold time 4.0 — μs 207 Data hold time 0 — μs 208 Data setup time 250 — ns 209 SDL/SCL rise time — 1 μs 210 SDL/SCL fall time — 300 ns 211 Stop condition setup time 4.7 — μs SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3 × pre_scaler × 2). The ratio SYNCCLK/(BRGCLK/pre_scaler) must be greater than or equal to 4/1. 1 Table 27 provides the I2C (SCL > 100 kHz) timings. Table 27. . I2C Timing (SCL > 100 kHZ) All Frequencies Num Characteristic Expression Unit Min 1 Max 200 SCL clock frequency (slave) fSCL 0 BRGCLK/48 Hz 200 SCL clock frequency (master)1 fSCL BRGCLK/16512 BRGCLK/48 Hz 202 Bus free time between transmissions 1/(2.2 * fSCL) — s 203 Low period of SCL 1/(2.2 * fSCL) — s 204 High period of SCL 1/(2.2 * fSCL) — s 205 Start condition setup time 1/(2.2 * fSCL) — s 206 Start condition hold time 1/(2.2 * fSCL) — s 207 Data hold time 0 — s 208 Data setup time 1/(40 * fSCL) — s 209 SDL/SCL rise time — 1/(10 * fSCL) s 210 SDL/SCL fall time — 1/(33 * fSCL) s 211 Stop condition setup time 1/2(2.2 * fSCL) — s SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) × pre_scaler × 2). The ratio SYNCCLK/(BRGCLK / pre_scaler) must be greater than or equal to 4/1. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 64 Freescale Semiconductor UTOPIA AC Electrical Specifications Figure 69 shows the I2C bus timing. SDA 202 203 204 205 208 207 SCL 206 209 210 211 Figure 69. I2C Bus Timing Diagram 12 UTOPIA AC Electrical Specifications Table 28 shows the AC electrical specifications for the UTOPIA interface. Table 28. UTOPIA AC Electrical Specifications Num U1 U1a Signal Characteristic Direction Min Max Unit Output — 3.5 ns Duty cycle 50 50 % Frequency — 50 MHz — 3.5 ns Duty cycle 40 60 % Frequency — 50 MHz Output 2 16 ns UtpClk rise/fall time (Internal clock option) UtpClk rise/fall time (external clock option) Input U2 RxEnb and TxEnb active delay U3 UTPB, SOC, Rxclav and Txclav setup time Input 8 — ns U4 UTPB, SOC, Rxclav and Txclav hold time Input 1 — ns U5 UTPB, SOC active delay (and PHREQ and PHSEL active delay in MPHY mode) Output 2 16 ns MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 65 UTOPIA AC Electrical Specifications Figure 70 shows signal timings during UTOPIA receive operations. U1 U1 UtpClk U5 PHREQn U3 3 U4 4 RxClav U2 2 RxEnb U3 3 UTPB SOC U4 Figure 70. UTOPIA Receive Timing Figure 71 shows signal timings during UTOPIA transmit operations. U1 U1 1 UtpClk U5 5 PHSELn U3 3 U4 4 TxClav U2 2 TxEnb U5 5 UTPB SOC Figure 71. UTOPIA Transmit Timing MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 66 Freescale Semiconductor FEC Electrical Characteristics 13 FEC Electrical Characteristics This section provides the AC electrical specifications for the Fast Ethernet controller (FEC). Note that the timing specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V. 13.1 MII Receive Signal Timing (MII_RXD[3:0], MII_RX_DV, MII_RX_ER, MII_RX_CLK) The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%. Table 29 provides information on the MII receive signal timing. Table 29. MII Receive Signal Timing Num Characteristic Min Max Unit M1 MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup 5 — ns M2 MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold 5 — ns M3 MII_RX_CLK pulse width high 35% 65% MII_RX_CLK period M4 MII_RX_CLK pulse width low 35% 65% MII_RX_CLK period Figure 72 shows MII receive signal timing. M3 MII_RX_CLK (Input) M4 MII_RXD[3:0] (Inputs) MII_RX_DV MII_RX_ER M1 M2 Figure 72. MII Receive Signal Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 67 FEC Electrical Characteristics 13.2 MII Transmit Signal Timing (MII_TXD[3:0], MII_TX_EN, MII_TX_ER, MII_TX_CLK) The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK frequency – 1%. Table 30 provides information on the MII transmit signal timing. Table 30. MII Transmit Signal Timing Num Characteristic Min Max Unit ns M5 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid 5 — M6 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid — 25 M7 MII_TX_CLK pulse width high 35 65% MII_TX_CLK period M8 MII_TX_CLK pulse width low 35% 65% MII_TX_CLK period Figure 73 shows the MII transmit signal timing diagram. M7 MII_TX_CLK (Input) RMII_REFCLK M5 M8 MII_TXD[3:0] (Outputs) MII_TX_EN MII_TX_ER M6 Figure 73. MII Transmit Signal Timing Diagram MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 68 Freescale Semiconductor FEC Electrical Characteristics 13.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL) Table 31 provides information on the MII async inputs signal timing. Table 31. MII Async Inputs Signal Timing Num M9 Characteristic MII_CRS, MII_COL minimum pulse width Min Max Unit 1.5 — MII_TX_CLK period Figure 74 shows the MII asynchronous inputs signal timing diagram. MII_CRS, MII_COL M9 Figure 74. MII Async Inputs Timing Diagram 13.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC) Table 32 provides information on the MII serial management channel signal timing. The FEC functions correctly with a maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation. Table 32. MII Serial Management Channel Timing Num Characteristic Min Max Unit M10 MII_MDC falling edge to MII_MDIO output invalid (minimum propagation delay) 0 — ns M11 MII_MDC falling edge to MII_MDIO output valid (max prop delay) — 25 ns M12 MII_MDIO (input) to MII_MDC rising edge setup 10 — ns M13 MII_MDIO (input) to MII_MDC rising edge hold 0 — ns M14 MII_MDC pulse width high 40% 60% MII_MDC period M15 MII_MDC pulse width low 40% 60% MII_MDC period MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 69 Mechanical Data and Ordering Information Figure 75 shows the MII serial management channel timing diagram. M14 MM15 MII_MDC (Output) M10 MII_MDIO (Output) M11 MII_MDIO (Input) M12 M13 Figure 75. MII Serial Management Channel Timing Diagram 14 Mechanical Data and Ordering Information 14.1 Ordering Information Table 33 provides information on the MPC860 Revision D.4 derivative devices. Table 33. MPC860 Family Revision D.4 Derivatives Number of SCCs1 Ethernet Support2 (Mbps) Multichannel HDLC Support ATM Support MPC855T 1 10/100 Yes Yes MPC860DE 2 10 N/A N/A MPC860DT 10/100 Yes Yes MPC860DP 10/100 Yes Yes 10 N/A N/A 10 Yes Yes MPC860T 10/100 Yes Yes MPC860P 10/100 Yes Yes Device MPC860EN MPC860SR 1 2 4 Serial communications controller (SCC) Up to 4 channels at 40 MHz or 2 channels at 25 MHz MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 70 Freescale Semiconductor Mechanical Data and Ordering Information Table 34 identifies the packages and operating frequencies available for the MPC860. Table 34. MPC860 Family Package/Frequency Availability Package Type Ball grid array ZP suffix—leaded ZQ suffix—leaded VR suffix—lead-free Freq. (MHz) / Temp. (Tj) 50 0° to 95°C Package ZP/ZQ1 Tape and Reel 66 0° to 95°C Order Number MPC855TZQ50D4 MPC860DEZQ50D4 MPC860DTZQ50D4 MPC860ENZQ50D4 MPC860SRZQ50D4 MPC860TZQ50D4 MPC860DPZQ50D4 MPC860PZQ50D4 MPC855TZQ50D4R2 MPC860DEZQ50D4R2 MPC860ENZQ50D4R2 MPC860SRZQ50D4R2 MPC860TZQ50D4R2 MPC860DPZQ50D4R2 MPC855TVR50D4R2 MPC860ENVR50D4R2 MPC860SRVR50D4R2 MPC860TVR50D4R2 VR MPC855TVR50D4 MPC860DEVR50D4 MPC860DPVR50D4 MPC860DTVR50D4 MPC860ENVR50D4 MPC860PVR50D4 MPC860SRVR50D4 MPC860TVR50D4 ZP/ZQ1 MPC855TZQ66D4 MPC860DEZQ66D4 MPC860DTZQ66D4 MPC860ENZQ66D4 MPC860SRZQ66D4 MPC860TZQ66D4 MPC860DPZQ66D4 MPC860PZQ66D4 Tape and Reel VR MPC860SRZQ66D4R2 MPC860PZQ66D4R2 MPC855TVR66D4 MPC860DEVR66D4 MPC860DPVR66D4 MPC860DTVR66D4 MPC860ENVR66D4 MPC860PVR66D4 MPC860SRVR66D4 MPC860TVR66D4 MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 71 Mechanical Data and Ordering Information Table 34. MPC860 Family Package/Frequency Availability (continued) Package Type Ball grid array (continued) ZP suffix—leaded ZQ suffix—leaded VR suffix—lead-free Ball grid array (CZP suffix) CZP suffix—leaded CZQ suffix—leaded CVR suffix—lead-free Freq. (MHz) / Temp. (Tj) 80 0° to 95°C 50 –40° to 95°C Package ZP/ZQ1 MPC855TZQ80D4 MPC860DEZQ80D4 MPC860DTZQ80D4 MPC860ENZQ80D4 MPC860SRZQ80D4 MPC860TZQ80D4 MPC860DPZQ80D4 MPC860PZQ80D4 Tape and Reel MPC860PZQ80D4R2 MPC860PVR80D4R2 VR MPC855TVR80D4 MPC860DEVR80D4 MPC860DPVR80D4 MPC860ENVR80D4 MPC860PVR80D4 MPC860SRVR80D4 MPC860TVR80D4 ZP/ZQ1 Tape and Reel 66 –40° to 95°C 1 Order Number MPC855TCZQ50D4 MPC855TCVR50D4 MPC860DECZQ50D4 MPC860DTCZQ50D4 MPC860ENCZQ50D4 MPC860SRCZQ50D4 MPC860TCZQ50D4 MPC860DPCZQ50D4 MPC860PCZQ50D4 MPC855TCZQ50D4R2 MC860ENCVR50D4R2 CVR MPC860DECVR50D4 MPC860DTCVR50D4 MPC860ENCVR50D4 MPC860PCVR50D4 MPC860SRCVR50D4 MPC860TCVR50D4 ZP/ZQ1 MPC855TCZQ66D4 MPC855TCVR66D4 MPC860ENCZQ66D4 MPC860SRCZQ66D4 MPC860TCZQ66D4 MPC860DPCZQ66D4 MPC860PCZQ66D4 CVR MPC860DTCVR66D4 MPC860ENCVR66D4 MPC860PCVR66D4 MPC860SRCVR66D4 MPC860TCVR66D4 The ZP package is no longer recommended for use. The ZQ package replaces the ZP package. MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 72 Freescale Semiconductor Mechanical Data and Ordering Information 14.2 Pin Assignments Figure 76 shows the top view pinout of the PBGA package. For additional information, see the MPC860 PowerQUICC User’s Manual, or the MPC855T User’s Manual. NOTE: This is the top view of the device. W PD10 PD8 PD3 PD9 PD6 PA0 PB14 PD15 PD4 PA1 PC5 PC4 PC6 PA2 PB15 PD12 PA4 PB17 PA3 VDDL PB19 PA5 PB18 PB16 HRESET TEXP EXTCLK EXTAL PA7 PC8 PA6 PC7 MODCK2 BADDR28 BADDR29 VDDL PB22 PC9 PA8 PB20 PC10 PA9 PB23 PB21 PC11 PB24 PA10 PB25 IRQ7 D0 D4 D1 D2 D3 D5 VDDL D6 D7 D29 DP2 CLKOUT IPA3 M_Tx_EN IRQ0 D13 D27 D10 D14 D18 D20 D24 D28 DP1 DP3 DP0 N/C VSSSYN1 D23 D11 D16 D19 D21 D26 D30 IPA5 IPA4 IPA2 N/C VSSSYN D17 D9 D15 D22 D25 D31 IPA6 IPA0 IPA1 IPA7 XFC VDDSYN V PD14 PD13 U PD5 IRQ1 D8 T PD11 PD7 VDDH D12 R VDDH WAIT_B WAIT_A PORESET KAPWR VDDH P GND GND VDDL RSTCONF SRESET XTAL N M L OP0 AS OP1 MODCK1 K GND BADDR30 IPB6 ALEA IRQ4 J IPB5 IPB1 IPB2 ALEB M_COL IRQ2 IPB0 IPB7 IPB4 IPB3 H VDDL M_MDIO TDI TCK TRST TMS TDO PA11 PB26 PC12 PA12 VDDL PB27 PC13 PA13 PB29 PB28 PC14 PA14 PC15 A8 N/C N/C A15 A19 A25 PB30 PA15 PB31 A3 A9 A12 A16 A20 A24 A26 TSIZ1 BSA1 A0 A1 A4 A6 A10 A13 A17 A21 A23 A22 TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5 A2 A5 A7 A11 A14 A27 A29 A30 A28 A31 18 17 16 15 14 13 12 11 10 9 G GND GND BR IRQ6 VDDL TS CS3 BI F VDDH VDDH IRQ3 BURST E BG BB D A18 BSA0 GPLA0 N/C CS6 CS2 GPLA5 BDIP TEA C WE0 GPLA1 GPLA3 CS7 CS0 TA GPLA4 CE1A WR GPLB4 B A 19 VDDL BSA2 8 7 WE1 WE3 CS4 CE2A CS1 6 5 4 3 2 1 Figure 76. Pinout of the PBGA Package MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 73 Mechanical Data and Ordering Information 14.3 Mechanical Dimensions of the PBGA Package Figure 77 shows the mechanical dimensions of the ZP PBGA package. 4X 0.2 D C 0.2 C A 0.25 C 0.35 C E2 E D2 B TOP VIEW A2 A3 A1 A D1 SIDE VIEW 18X e W V U T R P N M L K J H G F E D C B A E1 DIM A 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 A1 357X b 0.3 M C A B BOTTOM VIEW 0.15 M C A2 A3 b D D1 D2 e NOTE 1. Dimensions and tolerance per ASME Y14.5M, 1994. 2. Dimensions in millimeters. 3. Dimension b is the maximum solder ball diameter measured parallel to data C. E E1 E2 MILLIMETERS MIN MAX --2.05 0.50 0.70 0.95 1.35 0.70 0.90 0.60 0.90 25.00 BSC 22.86 BSC 22.40 22.60 1.27 BSC 25.00 BSC 22.86 BSC 22.40 22.60 Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 74 Freescale Semiconductor Mechanical Data and Ordering Information Figure 78 shows the mechanical dimensions of the ZQ PBGA package. NOTE 1. All Dimensions in millimeters. 2. Dimensions and tolerance per ASME Y14.5M, 1994. 3. Maximum Solder Ball Diameter measured parallel to Datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 Freescale Semiconductor 75 Document Revision History 15 Document Revision History Table 35 lists significant changes between revisions of this hardware specification. Table 35. Document Revision History Revision Date Changes 10 09/2015 In Table 34, moved MPC855TCVR50D4 and MPC855TCVR66D4 under the extended temperature (–40° to 95°C) and removed MC860ENCVR50D4R2 from the normal temperature Tape and Reel. 9 10/2011 Updated orderable part numbers in Table 34, “MPC860 Family Package/Frequency Availability.” 8 08/2007 • Updated template. • On page 1, added a second paragraph. • After Table 2, inserted a new figure showing the undershoot/overshoot voltage (Figure 1) and renumbered the rest of the figures. • In Figure 3, changed all reference voltage measurement points from 0.2 and 0.8 V to 50% level. • In Table 16, changed num 46 description to read, “TA assertion to rising edge ...” • In Figure 46, changed TA to reflect the rising edge of the clock. 7.0 9/2004 • Added a tablefootnote to Table 6 DC Electrical Specifications about meeting the VIL Max of the I2C Standard • Replaced the thermal characteristics in Table 4 by the ZQ package • Add the new parts to the Ordering and Availablity Chart in Table 34 • Added the mechanical spec of the ZQ package in Figure 78 • Removed all of the old revisions from Table 5 6.3 9/2003 • Added Section 11.2 on the Port C interrupt pins • Nontechnical reformatting 6.2 8/2003 • Changed B28a through B28d and B29d to show that TRLX can be 0 or 1 • Changed reference documentation to reflect the Rev 2 MPC860 PowerQUICC Family Users Manual • Nontechnical reformatting 6.1 11/2002 • Corrected UTOPIA RXenb* and TXenb* timing values • Changed incorrect usage of Vcc to Vdd • Corrected dual port RAM to 8 Kbytes 6 10/2002 • Added the MPC855T. Corrected Figure 26 on page -36. 5.1 11/2001 • Revised template format, removed references to MAC functionality, changed Table 7 B23 max value @ 66 MHz from 2ns to 8ns, added this revision history table MPC860 PowerQUICC Family Hardware Specifications, Rev. 10 76 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. 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Freescale, the Freescale logo, CodeWarrior, ColdFire, PowerQUICC, QorIQ, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. CoreNet, QorIQ Qonverge, QUICC Engine, and VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. © 2007-2015 Freescale Semiconductor, Inc. Document Number: MPC860EC Rev. 10 09/2015