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KMPC880CZP66

KMPC880CZP66

  • 厂商:

    NXP(恩智浦)

  • 封装:

    BBGA357

  • 描述:

    IC MPU MPC8XX 66MHZ 357BGA

  • 详情介绍
  • 数据手册
  • 价格&库存
KMPC880CZP66 数据手册
Freescale Semiconductor Document Number: MPC885EC Rev. 7, 07/2010 Technical Data MPC885/MPC880 PowerQUICC Hardware Specifications This hardware specification contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC885/MPC880. The MPC885 is the superset device of the MPC885/MPC880 family. The CPU on the MPC885/MPC880 is a 32-bit core built on Power Architecture™ technology that incorporates memory management units (MMUs) and instruction and data caches. For functional characteristics of the MPC885/MPC880, refer to the MPC885 PowerQUICC Family Reference Manual. To locate published errata or updates for this document, refer to the MPC875/MPC870 product summary page on our website listed on the back cover of this document or, contact your local Freescale sales office. © 2010 Freescale Semiconductor, Inc. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. Contents Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 9 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 10 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal Calculation and Measurement . . . . . . . . . . 12 Power Supply and Power Sequencing . . . . . . . . . . . 15 Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 16 IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 44 CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 46 UTOPIA AC Electrical Specifications . . . . . . . . . . . 69 USB Electrical Characteristics . . . . . . . . . . . . . . . . . 71 FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 71 Mechanical Data and Ordering Information . . . . . . . 75 Document Revision History . . . . . . . . . . . . . . . . . . . 85 Overview 1 Overview The MPC885/MPC880 is a versatile single-chip integrated microprocessor and peripheral combination that can be used in a variety of controller applications and communications and networking systems. The MPC885/MPC880 provides enhanced ATM functionality, an additional fast Ethernet controller, a USB, and an encryption block. Table 1 shows the functionality supported by MPC885/MPC880. Table 1. MPC885 Family Cache (Kbytes) Ethernet Part SCC SMC USB ATM Support Security Engine I Cache D Cache 10BaseT 10/100 MPC885 8 8 Up to 3 2 3 2 1 Serial ATM and UTOPIA interface Yes MPC880 8 8 Up to 2 2 2 2 1 Serial ATM and UTOPIA interface No 2 Features The MPC885/MPC880 is comprised of three modules that each use the 32-bit internal bus: a MPC8xx core, a system integration unit (SIU), and a communications processor module (CPM). The following list summarizes the key MPC885/MPC880 features: • Embedded MPC8xx core up to 133 MHz • Maximum frequency operation of the external bus is 80 MHz (in 1:1 mode) — The 133-MHz core frequency supports 2:1 mode only. — The 66-/80-MHz core frequencies support both the 1:1 and 2:1 modes. • Single-issue, 32-bit core (compatible with the Power Architecture definition) with thirty-two 32-bit general-purpose registers (GPRs) — The core performs branch prediction with conditional prefetch and without conditional execution. — 8-Kbyte data cache and 8-Kbyte instruction cache (see Table 1) – Instruction cache is two-way, set-associative with 256 sets in 2 blocks – Data cache is two-way, set-associative with 256 sets – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks. – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis. — MMUs with 32-entry TLB, fully associative instruction and data TLBs — MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces and 16 protection groups — Advanced on-chip emulation debug mode MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 2 Freescale Semiconductor Features • • • • • • • Provides enhanced ATM functionality found on the MPC862 and MPC866 families and includes the following: — Improved operation, administration and maintenance (OAM) support — OAM performance monitoring (PM) support — Multiple APC priority levels available to support a range of traffic pace requirements — Port-to-port switching capability without the need for RAM-based microcode — Simultaneous MII (100BaseT) and UTOPIA (half- or full -duplex) capability — Optional statistical cell counters per PHY — UTOPIA L2-compliant interface with added FIFO buffering to reduce the total cell transmission time and multi-PHY support. (The earlier UTOPIA L1 specification is also supported.) — Parameter RAM for both SPI and I2C can be relocated without RAM-based microcode — Supports full-duplex UTOPIA master (ATM side) and slave (PHY side) operations using a split bus — AAL2/VBR functionality is ROM-resident Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits) Thirty-two address lines Memory controller (eight banks) — Contains complete dynamic RAM (DRAM) controller — Each bank can be a chip select or RAS to support a DRAM bank — Up to 30 wait states programmable per memory bank — Glueless interface to DRAM, SIMMS, SRAM, EPROMs, Flash EPROMs, and other memory devices — DRAM controller programmable to support most size and speed memory interfaces — Four CAS lines, four WE lines, and one OE line — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory) — Variable block sizes (32 Kbytes–256 Mbytes) — Selectable write protection — On-chip bus arbitration logic General-purpose timers — Four 16-bit timers or two 32-bit timers — Gate mode can enable/disable counting. — Interrupt can be masked on reference match and event capture Two fast Ethernet controllers (FEC)—Two 10/100 Mbps Ethernet/IEEE Std. 802.3™ CDMA/CS that interface through MII and/or RMII interfaces System integration unit (SIU) — Bus monitor — Software watchdog MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 3 Features • • • — Periodic interrupt timer (PIT) — Clock synthesizer — Decrementer and time base — Reset controller — IEEE Std 1149.1™ test access port (JTAG) Security engine is optimized to handle all the algorithms associated with IPsec, SSL/TLS, SRTP, IEEE Std 802.11i™, and iSCSI processing. Available on the MPC885, the security engine contains a crypto-channel, a controller, and a set of crypto hardware accelerators (CHAs). The CHAs are: — Data encryption standard execution unit (DEU) – DES, 3DES – Two key (K1, K2, K1) or three key (K1, K2, K3) – ECB and CBC modes for both DES and 3DES — Advanced encryption standard unit (AESU) – Implements the Rijndael symmetric key cipher – ECB, CBC, and counter modes – 128-, 192-, and 256- bit key lengths — Message digest execution unit (MDEU) – SHA with 160- or 256-bit message digest – MD5 with 128-bit message digest – HMAC with either algorithm — Crypto-channel supporting multi-command descriptor chains — Integrated controller managing internal resources and bus mastering — Buffer size of 256 bytes for the DEU, AESU, and MDEU, with flow control for large data sizes Interrupts — Six external interrupt request (IRQ) lines — 12 port pins with interrupt capability — 23 internal interrupt sources — Programmable priority between SCCs — Programmable highest priority request Communications processor module (CPM) — RISC controller — Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and RESTART TRANSMIT) — Supports continuous mode transmission and reception on all serial channels — 8-Kbytes of dual-port RAM — Several serial DMA (SDMA) channels to support the CPM — Three parallel I/O registers with open-drain capability MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 4 Freescale Semiconductor Features • • • • • On-chip 16 × 16 multiply accumulate controller (MAC) — One operation per clock (two-clock latency, one-clock blockage) — MAC operates concurrently with other instructions — FIR loop—Four clocks per four multiplies Four baud rate generators — Independent (can be connected to any SCC or SMC) — Allow changes during operation — Autobaud support option Up to three serial communication controllers (SCCs) supporting the following protocols: — Serial ATM capability on SCCs — Optional UTOPIA port on SCC4 — Ethernet/IEEE Std 802.3™ optional on the SCC(s) supporting full 10-Mbps operation — HDLC/SDLC — HDLC bus (implements an HDLC-based local area network (LAN)) — Asynchronous HDLC to support point-to-point protocol (PPP) — AppleTalk — Universal asynchronous receiver transmitter (UART) — Synchronous UART — Serial infrared (IrDA) — Binary synchronous communication (BISYNC) — Totally transparent (bit streams) — Totally transparent (frame based with optional cyclic redundancy check (CRC)) Up to two serial management channels (SMCs) supporting the following protocols: — UART (low-speed operation) — Transparent — General circuit interface (GCI) controller — Provide management for BRI devices as GCI controller in time-division multiplexed (TDM) channels Universal serial bus (USB)—Supports operation as a USB function endpoint, a USB host controller, or both for testing purposes (loop-back diagnostics) — USB 2.0 full-/low-speed compatible — The USB function mode has the following features: – Four independent endpoints support control, bulk, interrupt, and isochronous data transfers. – CRC16 generation and checking – CRC5 checking – NRZI encoding/decoding with bit stuffing – 12- or 1.5-Mbps data rate MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 5 Features • • • • • • • – Flexible data buffers with multiple buffers per frame – Automatic retransmission upon transmit error — The USB host controller has the following features: – Supports control, bulk, interrupt, and isochronous data transfers – CRC16 generation and checking – NRZI encoding/decoding with bit stuffing – Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data rate configuration). Note that low-speed operation requires an external hub. – Flexible data buffers with multiple buffers per frame – Supports local loop back mode for diagnostics (12 Mbps only) Serial peripheral interface (SPI) — Supports master and slave modes — Supports multiple-master operation on the same bus Inter-integrated circuit (I2C) port — Supports master and slave modes — Supports a multiple-master environment Time-slot assigner (TSA) — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined — 1- or 8-bit resolution — Allows independent transmit and receive routing, frame synchronization, and clocking — Allows dynamic changes — Can be internally connected to four serial channels (two SCCs and two SMCs) Parallel interface port (PIP) — Centronics interface support — Supports fast connection between compatible ports on MPC885/MPC880 and other MPC8xx devices PCMCIA interface — Master (socket) interface, release 2.1-compliant — Supports two independent PCMCIA sockets — 8 memory or I/O windows supported Debug interface — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data — Supports conditions: = ≠ < > — Each watchpoint can generate a break point internally. Normal high and normal low power modes to conserve power MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 6 Freescale Semiconductor Features • • 1.8-V core and 3.3-V I/O operation The MPC885/MPC880 comes in a 357-pin ball grid array (PBGA) package The MPC885 block diagram is shown in Figure 1. 8-Kbyte Instruction Instruction Cache Bus System Interface Unit (SIU) Instruction MMU 32-Entry ITLB Embedded MPC8xx Processor Core Memory Controller Unified Bus Internal External Bus Interface Bus Interface Unit Unit 8-Kbyte Data Cache System Functions Data MMU Load/Store Bus 32-Entry DTLB PCMCIA-ATA Interface Slave/Master IF Security Engine Fast Ethernet Controller Controller AESU DEU MDEU Channel DMAs DMAs DMAs FIFOs 4 Timers Parallel I/O 10/100 BaseT Media Access Control 4 Baud Rate Generators MIII/RMII Parallel Interface Port USB Timers SCC2 Interrupt 8-Kbyte Controllers Dual-Port RAM 32-Bit RISC Controller and Program ROM SCC3 SCC4/ UTOPIA SMC1 Virtual IDMA and Serial DMAs SMC2 SPI I2C Time-Slot Assigner Serial Interface Figure 1. MPC885 Block Diagram MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 7 Features The MPC880 block diagram is shown in Figure 2. Instruction 8-Kbyte Bus Instruction Cache System Interface Unit (SIU) Instruction MMU 32-Entry ITLB Embedded MPC8xx Processor Core Unified Bus 8-Kbyte Data Cache Memory Controller External Internal Bus Interface Bus Interface Unit Unit System Functions Data MMU Load/Store Bus 32-Entry DTLB PCMCIA-ATA Interface Slave/Master IF Fast Ethernet Controller DMAs DMAs FIFOs Parallel I/O 10/100 BaseT Media Access Control 4 Baud Rate Generators MIII/RMII Parallel Interface Port USB 4 Timers Interrupt 8-Kbyte Controllers Dual-Port RAM 32-Bit RISC Controller and Program ROM Virtual IDMA and Serial DMAs Timers SCC4/ SCC3 UTOPIA SMC1 SMC2 SPI I 2C Time-Slot Assigner Serial Interface Figure 2. MPC880 Block Diagram MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 8 Freescale Semiconductor Maximum Tolerated Ratings 3 Maximum Tolerated Ratings This section provides the maximum tolerated voltage and temperature ranges for the MPC885/MPC880. Table 2 displays the maximum tolerated ratings, and Table 3 displays the operating temperatures. Table 2. Maximum Tolerated Ratings Rating Symbol Value Unit VDDH –0.3 to 4.0 V VDDL –0.3 to 2.0 V VDDSYN –0.3 to 2.0 V Difference between VDDL and VDDSYN 100 kHz) timings. Table 29. I2C Timing (SCL > 100 kHZ) All Frequencies Num 1 Characteristic Expression Unit Min Max 200 SCL clock frequency (slave) fSCL 0 BRGCLK/48 Hz 200 SCL clock frequency (master)1 fSCL BRGCLK/16512 BRGCLK/48 Hz 202 Bus free time between transmissions — 1/(2.2 × fSCL) — s 203 Low period of SCL — 1/(2.2 × fSCL) — s 204 High period of SCL — 1/(2.2 × fSCL) — s 205 Start condition setup time — 1/(2.2 × fSCL) — s 206 Start condition hold time — 1/(2.2 × fSCL) — s 207 Data hold time — 0 — s 208 Data setup time — 1/(40 × fSCL) — s 209 SDL/SCL rise time — — 1/(10 × fSCL) s 210 SDL/SCL fall time — — 1/(33 × fSCL) s 211 Stop condition setup time — 1/2(2.2 × fSCL) — s SCL frequency is given by SCL = BrgClk_frequency/((BRG register + 3) × pre_scaler × 2). The ratio SyncClk/(Brg_Clk/pre_scaler) must be greater or equal to 4/1. Figure 70 shows the I2C bus timing. SDA 202 203 205 204 208 207 SCL 206 209 210 211 Figure 70. I2C Bus Timing Diagram MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 68 Freescale Semiconductor UTOPIA AC Electrical Specifications 13 UTOPIA AC Electrical Specifications Table 30, Table 31, and Table 32, show the AC electrical specifications for the UTOPIA interface. Table 30. UTOPIA Master (Muxed Mode) Electrical Specifications Num U1 Signal Characteristic UtpClk rise/fall time (internal clock option) Direction Min Output Duty cycle 50 Frequency U2 UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr active delay (PHREQ and PHSEL active delay in multi-PHY mode) U3 U4 Max Unit 4 ns 50 % 33 MHz 16 ns Output 2 UTPB, SOC, Rxclav, and Txclav setup time Input 4 ns UTPB, SOC, Rxclav, and Txclav hold time Input 1 ns Table 31. UTOPIA Master (Split Bus Mode) Electrical Specifications Num U1 Signal Characteristic UtpClk rise/fall time (Internal clock option) Direction Min Output Duty cycle 50 Frequency U2 UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr active delay (PHREQ and PHSEL active delay in multi-PHY mode) U3 U4 Max Unit 4 ns 50 % 33 MHz 16 ns Output 2 UTPB_Aux, SOC_Aux, Rxclav, and Txclav setup time Input 4 ns UTPB_Aux, SOC_Aux, Rxclav, and Txclav hold time Input 1 ns Table 32. UTOPIA Slave (Split Bus Mode) Electrical Specifications Num U1 Signal Characteristic UtpClk rise/fall time (external clock option) Direction Min Input Duty cycle 40 Frequency U2 UTPB, SOC, Rxclav, and Txclav active delay U3 U4 Max Unit 4 ns 60 % 33 MHz 16 ns Output 2 UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr setup time Input 4 ns UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr hold time Input 1 ns MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 69 UTOPIA AC Electrical Specifications Figure 71 shows signal timings during UTOPIA receive operations. U1 U1 UtpClk U2 PHREQn U3 3 U4 4 RxClav High-Z at MPHY High-Z at MPHY U2 2 RxEnb U3 3 UTPB SOC U4 Figure 71. UTOPIA Receive Timing Figure 72 shows signal timings during UTOPIA transmit operations. U1 U1 1 UtpClk U2 5 PHSELn U3 3 U4 4 TxClav High-Z at MPHY High-Z at Multi-PHYPHY U2 2 TxEnb U2 5 UTPB SOC Figure 72. UTOPIA Transmit Timing MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 70 Freescale Semiconductor USB Electrical Characteristics 14 USB Electrical Characteristics This section provides the AC timings for the USB interface. 14.1 USB Interface AC Timing Specifications The USB Port uses the transmit clock on SCC1. Table 33 lists the USB interface timings. Table 33. USB Interface AC Timing Specifications All Frequencies Name Characteristic Unit Min US1 US4 1 USBCLK frequency of operation1 Low speed Full speed Max 6 48 USBCLK duty cycle (measured at 1.5 V) 45 MHz MHz 55 % USBCLK accuracy should be ±500 ppm or better. USBCLK may be stopped to conserve power. 15 FEC Electrical Characteristics This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII signals use TTL signal levels compatible with devices operating at either 5.0 or 3.3 V. 15.1 MII and Reduced MII Receive Signal Timing The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. The reduced MII (RMII) receiver functions correctly up to a RMII_REFCLK maximum frequency of 50 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%. Table 34 provides information on the MII and RMII receive signal timing. Table 34. MII Receive Signal Timing Num Characteristic Min Max Unit M1 MII_RXD[3:0], MII_RX_DV, MII_RX_ERR to MII_RX_CLK setup 5 — ns M2 MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold 5 — ns M3 MII_RX_CLK pulse width high 35% 65% MII_RX_CLK period M4 MII_RX_CLK pulse width low 35% 65% MII_RX_CLK period M1_RMII RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR to RMII_REFCLK setup 4 — ns M2_RMII RMII_REFCLK to RMII_RXD[1:0], RMII_CRS_DV, RMII_RX_ERR hold 2 — ns MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 71 FEC Electrical Characteristics Figure 73 shows MII receive signal timing. M3 MII_RX_CLK (Input) M4 MII_RXD[3:0] (Inputs) MII_RX_DV MII_RX_ER M1 M2 Figure 73. MII Receive Signal Timing Diagram 15.2 MII and Reduced MII Transmit Signal Timing The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz + 1%. The RMII transmitter functions correctly up to a RMII_REFCLK maximum frequency of 50 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK frequency – 1%. Table 35 provides information on the MII and RMII transmit signal timing. Table 35. MII Transmit Signal Timing Num Characteristic Min Max Unit M5 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid 5 — ns M6 MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid — 25 ns M20_RMII RMII_TXD[1:0], RMII_TX_EN to RMII_REFCLK setup 4 — ns M21_RMII RMII_TXD[1:0], RMII_TX_EN data hold from RMII_REFCLK rising edge 2 — ns M7 MII_TX_CLK and RMII_REFCLK pulse width high 35% 65% MII_TX_CLK or RMII_REFCLK period M8 MII_TX_CLK and RMII_REFCLK pulse width low 35% 65% MII_TX_CLK or RMII_REFCLK period MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 72 Freescale Semiconductor FEC Electrical Characteristics Figure 74 shows the MII transmit signal timing diagram. M7 MII_TX_CLK (Input) RMII_REFCLK M5 M8 MII_TXD[3:0] (Outputs) MII_TX_EN MII_TX_ER M6 Figure 74. MII Transmit Signal Timing Diagram 15.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL) Table 36 provides information on the MII async inputs signal timing. Table 36. MII Async Inputs Signal Timing Num M9 Characteristic Min Max Unit MII_CRS, MII_COL minimum pulse width 1.5 — MII_TX_CLK period Figure 75 shows the MII asynchronous inputs signal timing diagram. MII_CRS, MII_COL M9 Figure 75. MII Async Inputs Timing Diagram 15.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC) Table 37 provides information on the MII serial management channel signal timing. The FEC functions correctly with a maximum MDC frequency in excess of 2.5 MHz. Table 37. MII Serial Management Channel Timing Num Characteristic Min Max Unit M10 MII_MDC falling edge to MII_MDIO output invalid (minimum propagation delay) 0 — ns M11 MII_MDC falling edge to MII_MDIO output valid (max prop delay) — 25 ns M12 MII_MDIO (input) to MII_MDC rising edge setup 10 — ns M13 MII_MDIO (input) to MII_MDC rising edge hold 0 — ns MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 73 FEC Electrical Characteristics Table 37. MII Serial Management Channel Timing (continued) Num Characteristic Min Max Unit M14 MII_MDC pulse width high 40% 60% MII_MDC period M15 MII_MDC pulse width low 40% 60% MII_MDC period Figure 76 shows the MII serial management channel timing diagram. M14 MM15 MII_MDC (Output) M10 MII_MDIO (Output) M11 MII_MDIO (Input) M12 M13 Figure 76. MII Serial Management Channel Timing Diagram MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 74 Freescale Semiconductor Mechanical Data and Ordering Information 16 Mechanical Data and Ordering Information Table 38 identifies the available packages and operating frequencies for the MPC885/MPC880 derivative devices. Table 38. Available MPC885/MPC880 Packages/Frequencies Package Type Plastic ball grid array ZP suffix — Leaded VR suffix — Lead-Free are available as needed Plastic ball grid array CZP suffix — Leaded CVR suffix — Lead-Free are available as needed Temperature (Tj) Frequency (MHz) Order Number 0°C to 95°C 66 KMPC885ZP66 KMPC880ZP66 MPC885ZP66 MPC880ZP66 80 KMPC885ZP80 KMPC880ZP80 MPC885ZP80 MPC880ZP80 133 KMPC885ZP133 KMPC880ZP133 MPC885ZP133 MPC880ZP133 66 KMPC885CZP66 KMPC880CZP66 MPC885CZP66 MPC880CZP66 133 KMPC885CZP133 KMPC880CZP133 MPC885CZP133 MPC880CZP133 -40°C to 100°C MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 75 Mechanical Data and Ordering Information 16.1 Pin Assignments Figure 77 shows the top-view pinout of the PBGA package. For additional information, see the MPC885 PowerQUICC™ Family Reference Manual. NOTE: This is the top view of the device. W TRST PA10 PB23 PA8 TMS PB25 PC11 PB22 PB27 PB14 TCK PB24 PB29 PC12 TDO TDI PC15 PC14 PB26 GND VDDL MII_MDIO PB30 PA14 PA12 VDDH A2 A1 N/C PA15 A3 A5 A4 A0 A7 A9 A8 A6 A10 A11 A12 A13 A14 A16 A15 A17 A27 A19 A20 A24 A21 A29 A23 TSIZ0 A25 A30 A22 BSA3 A18 A28 TSIZ1 WE1 A26 A31 BSA0 GPL_AB2 CS6 CS3 WR BI BR IRQ6 IPB1 ALEB AS BSA2 BSA1 WE2 CS4 CE2_A CS1 GPL_A5 TA BG BURST IPB3 IPB2 IRQ4 OP1 BADDR28 WAIT_B VSSSYN1 IPA1 WE3 WE0 GPL_A0 CS7 CE1_A CS0 GPL_A4 TEA BB IRQ2 IPB4 IPB7 ALEA OP0 BADDR29 HRESET PORESETVDDLSYN IPA0 OE GPL_AB3 CS5 CS2 GPL_B4 BDIP TS IRQ3 IPB5 IPB0 IPB6 18 17 16 15 14 13 12 11 10 9 8 PC8 PA5 PB17 PA13 PC4 PA11 PE17 PE30 PE15 PD6 PD4 PD7 PA3 PB19 PC7 PB16 PC13 PE21 PE24 PE14 PD5 PE28 PE27 PB31 PE23 PE22 PA6 MII1_COL PC6 PB15 PE31 PD15 PD14 PD13 PD12 PA4 PA0 PD9 PA1 PB20 PB18 MII1_CRS PC5 PD3 PE29 PE16 PE19 MII1_TXEN PA2 PE25 PD10 PE26 PE20 PD8 PD11 IRQ7 IRQ1 D0 D12 D13 V PB28 PA7 U PC10 PB21 T PA9 PC9 R VDDL VDDL VDDL VDDH PE18 P VDDH VDDH GND GND D8 N VDDL GND IRQ0 D4 M VDDL VDDH D17 D23 D27 D1 D9 D10 D11 D2 D3 D15 L VDDH GND GND VDDL K VDDL GND VDDH D5 D14 J VDDL D22 D19 D16 D18 D28 D6 D20 D21 CLKOUT D26 D24 D25 IPA2 D31 D7 D29 VSSSYN IPA3 IPA6 D30 IPA7 IPA4 IPA5 H VDDH GND G VDDL GND VDDH GND VDDH F VDDH VDDL VDDL E VDDL VDDL D MODCK1 EXTAL RSTCONF C TEXP B A 19 BADDR30 MODCK2 EXTCLK 7 6 XTAL 5 4 SRESET WAIT_A 3 2 1 Figure 77. Pinout of the PBGA Package MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 76 Freescale Semiconductor Mechanical Data and Ordering Information Table 39 contains a list of the MPC885 input and output signals and shows multiplexing and pin assignments. Table 39. Pin Assignments Name Pin Number Type A[0:31] M16, N18, N19, M19, M17, M18, L16, L19, L17, L18, K19, K18, K17, Bidirectional K16, J19, J17, J18, J16, E19, H18, H17, G19, F17, G17, H16, F19, Three-state D19, H19, E18, G18, F18, D18 D[0:31] P2, M1, L1, K2, N1, K4, H3, F2, P1, L4, L3, L2, N3, N2, K3, K1, J2, Bidirectional M4, J1, J3, H2, H1, J4, M3, G2, G1, G3, M2, H4, F1, E1, F3 Three-state TSIZ0, REG G16 Bidirectional Three-state TSIZ1 E17 Bidirectional Three-state RD/WR D13 Bidirectional Three-state BURST C10 Bidirectional Three-state BDIP, GPL_B5 A13 Output TS A12 Bidirectional Active pull-up TA C12 Bidirectional Active pull-up TEA B12 Open-drain BI D12 Bidirectional Active pull-up IRQ2, RSV B10 Bidirectional Three-state IRQ4, KR, RETRY, SPKROUT C7 Bidirectional Three-state CR, IRQ3 A11 Input BR D11 Bidirectional BG C11 Bidirectional BB B11 Bidirectional Active pull-up FRZ, IRQ6 D10 Bidirectional IRQ0 N4 Input IRQ1 P3 Input IRQ7 P4 Input CS[0:5] B14, C14, A15, D14, C16, A16 Output CS6, CE1_B D15 Output CS7, CE2_B B16 Output MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 77 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type WE0, BS_B0, IORD B18 Output WE1, BS_B1, IOWR E16 Output WE2, BS_B2, PCOE C17 Output WE3, BS_B3, PCWE B19 Output BS_A[0:3] D17, C18, C19, F16 Output GPL_A0, GPL_B0 B17 Output OE, GPL_A1, GPL_B1 A18 Output GPL_A[2:3], GPL_B[2:3], CS[2:3] D16, A17 Output UPWAITA, GPL_A4 B13 Bidirectional UPWAITB, GPL_B4 A14 Bidirectional GPL_A5 C13 Output PORESET B3 Input RSTCONF D4 Input HRESET B4 Open-drain SRESET A3 Open-drain XTAL A4 Analog output EXTAL D5 Analog input (3.3 V only) CLKOUT G4 Output EXTCLK A5 Input (3.3 V only) TEXP C4 Output ALE_A B7 Output CE1_A B15 Output CE2_A C15 Output WAIT_A, SOC_Split1 A2 Input WAIT_B C3 Input UTPB_Split01 B1 Input IP_A1, UTPB_Split11 C1 Input IP_A2, IOIS16_A, UTPB_Split21 F4 Input IP_A3, UTPB_Split31 E3 Input IP_A4, UTPB_Split41 D2 Input IP_A5, UTPB_Split51 D1 Input IP_A6, UTPB_Split61 E2 Input IP_A7, UTPB_Split71 D3 Input IP_A0, MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 78 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type ALE_B, DSCK/AT1 D8 Bidirectional Three-state IP_B[0:1], IWP[0:1], VFLS[0:1] A9, D9 Bidirectional IP_B2, IOIS16_B, AT2 C8 Bidirectional Three-state IP_B3, IWP2, VF2 C9 Bidirectional IP_B4, LWP0, VF0 B9 Bidirectional IP_B5, LWP1, VF1 A10 Bidirectional IP_B6, DSDI, AT0 A8 Bidirectional Three-state IP_B7, PTR, AT3 B8 Bidirectional Three-state OP0, UtpClk_Split1 B6 Bidirectional OP1 C6 Output OP2, MODCK1, STS D6 Bidirectional OP3, MODCK2, DSDO A6 Bidirectional BADDR30, REG A7 Output BADDR[28:29] C5, B5 Output AS D7 Input PA15, USBRXD N16 Bidirectional PA14, USBOE P17 Bidirectional (Optional: open-drain) PA13, RXD2 W11 Bidirectional PA12, TXD2 P16 Bidirectional (Optional: open-drain) PA11, RXD4, MII1-TXD0, RMII1-TXD0 W9 Bidirectional (Optional: open-drain) PA10, MII1-TXER, TIN4, CLK7 W17 Bidirectional (Optional: open-drain) PA9, L1TXDA, RXD3 T15 Bidirectional (Optional: open-drain) PA8, L1RXDA, TXD3 W15 Bidirectional (Optional: open-drain) PA7, CLK1, L1RCLKA, BRGO1, TIN1 V14 Bidirectional PA6, CLK2, TOUT1 U13 Bidirectional PA5, CLK3, L1TCLKA, BRGO2, TIN2 W13 Bidirectional MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 79 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PA4, CTS4, MII1-TXD1, RMII1-TXD1 U4 Bidirectional PA3, MII1-RXER, RMII1-RXER, BRGO3 W2 Bidirectional PA2, MII1-RXDV, RMII1-CRS_DV, TXD4 T4 Bidirectional PA1, MII1-RXD0, RMII1-RXD0, BRGO4 U1 Bidirectional PA0, MII1-RXD1, RMII1-RXD1, TOUT4 U3 Bidirectional PB31, SPISEL, MII1-TXCLK, RMII1-REFCLK V3 Bidirectional (Optional: open-drain) PB30, SPICLK P18 Bidirectional (Optional: open-drain) PB29, SPIMOSI T19 Bidirectional (Optional: open-drain) PB28, SPIMISO, BRGO4 V19 Bidirectional (Optional: open-drain) PB27, I2CSDA, BRGO1 U19 Bidirectional (Optional: open-drain) PB26, I2CSCL, BRGO2 R17 Bidirectional (Optional: open-drain) PB25, RXADDR31, TXADDR3, SMTXD1 V17 Bidirectional (Optional: open-drain) PB24, TXADDR31, RXADDR3, SMRXD1 U16 Bidirectional (Optional: open-drain) PB23, TXADDR21, RXADDR2, SDACK1, SMSYN1 W16 Bidirectional (Optional: open-drain) PB22, TXADDR41, RXADDR4, SDACK2, SMSYN2 V15 Bidirectional (Optional: open-drain) PB21, SMTXD2, TXADDR11, BRG01, RXADDR1, PHSEL[1] U14 Bidirectional (Optional: open-drain) PB20, SMRXD2, L1CLKOA, TXADDR01, RXADDR0, PHSEL[0] T13 Bidirectional (Optional: open-drain) PB19, MII1-RXD3, RTS4 V13 Bidirectional (Optional: open-drain) PB18, RXADDR41, TXADDR4, RTS2, L1ST2 T12 Bidirectional (Optional: open-drain) MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 80 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PB17, L1ST3, BRGO2, RXADDR11, TXADDR1, PHREQ[1] W12 Bidirectional (Optional: open-drain) PB16, L1RQa, L1ST4, RTS4, RXADDR01, TXADDR0, PHREQ[0] V11 Bidirectional (Optional: open-drain) PB15, TXCLAV, BRG03, RXCLAV U10 Bidirectional PB14RXADDR21, TXADDR2 U18 Bidirectional PC15, DREQ0, RTS3, L1ST1, TXCLAV, RXCLAV R19 Bidirectional PC14, DREQ1, RTS2, L1ST2 R18 Bidirectional PC13, MII1-TXD3, SDACK1 V10 Bidirectional PC12, MII1-TXD2, TOUT1 T18 Bidirectional PC11, USBRXP V16 Bidirectional PC10, USBRXN, TGATE1 U15 Bidirectional PC9, CTS2 T14 Bidirectional PC8, CD2, TGATE2 W14 Bidirectional PC7, CTS4, L1TSYNCB, USBTXP V12 Bidirectional PC6, CD4, L1RSYNCB, USBTXN U11 Bidirectional PC5, CTS3, L1TSYNCA, SDACK2 T10 Bidirectional PC4, CD3, L1RSYNCA W10 Bidirectional PD15, L1TSYNCA, UTPB0 U8 Bidirectional PD14, L1RSYNCA, UTPB1 U7 Bidirectional PD13, L1TSYNCB, UTPB2 U6 Bidirectional PD12, L1RSYNCB, UTPB3 U5 Bidirectional PD11, RXD3, RXENB R2 Bidirectional PD10, TXD3, TXENB T2 Bidirectional PD9, TXD4, UTPCLK U2 Bidirectional PD8, RXD4, MII-MDC, RMII-MDC R3 Bidirectional PD7, RTS3, UTPB4 W3 Bidirectional PD6, RTS4, UTPB5 W5 Bidirectional MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 81 Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PD5, CLK8, L1TCLKB, UTPB6 V6 Bidirectional PD4, CLK4, UTPB7 W4 Bidirectional PD3, CLK7, TIN4, SOC T9 Bidirectional PE31, CLK8, L1TCLKB, MII1-RXCLK U9 Bidirectional (Optional: open-drain) PE30, L1RXDB, MII1-RXD2 W7 Bidirectional (Optional: open-drain) PE29, MII2-CRS T8 Bidirectional (Optional: open-drain) PE28, TOUT3, MII2-COL V5 Bidirectional (Optional: open-drain) PE27, RTS3, L1RQB, MII2-RXER, RMII2-RXER V4 Bidirectional (Optional: open-drain) PE26, L1CLKOB, MII2-RXDV, RMII2-CRS_DV T1 Bidirectional (Optional: open-drain) PE25, RXD4, MII2-RXD3, L1ST2 T3 Bidirectional (Optional: open-drain) PE24, SMRXD1, BRGO1, MII2-RXD2 V8 Bidirectional (Optional: open-drain) PE23, SMSYN2, TXD4, MII2-RXCLK, L1ST1 V2 Bidirectional (Optional: open-drain) PE22, TOUT2, MII2-RXD1, V1 RMII2-RXD1, SDACK1 Bidirectional (Optional: open-drain) PE21, SMRXD2, TOUT1, MII2-RXD0, RMII2-RXD0, RTS3 V9 Bidirectional (Optional: open-drain) PE20, L1RSYNCA, SMTXD2, CTS3, MII2-TXER R4 Bidirectional (Optional: open-drain) PE19, L1TXDB, MII2-TXEN, RMII2-TXEN T6 Bidirectional (Optional: open-drain) PE18, L1TSYNCA, SMTXD1, MII2-TXD3 R1 Bidirectional (Optional: open-drain) PE17, TIN3, CLK5, BRGO3, SMSYN1, MII2-TXD2 W8 Bidirectional (Optional: open-drain) PE16, L1RCLKB, CLK6, TXD3, MII2-TXCLK, RMII2-REFCLK T7 Bidirectional (Optional: open-drain) PE15, TGATE1, MII2-TXD1, RMII2-TXD1 W6 Bidirectional MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 82 Freescale Semiconductor Mechanical Data and Ordering Information Table 39. Pin Assignments (continued) Name Pin Number Type PE14, RXD3, MII2-TXD0, RMII2-TXD0 V7 Bidirectional TMS V18 Input TDI, DSDI T16 Input TCK, DSCK U17 Input TRST W18 Input TDO, DSDO T17 Output MII1_CRS T11 Input MII_MDIO P19 Bidirectional MII1_TXEN, RMII1_TXEN T5 Output MII1_COL U12 Input VSSSYN1 C2 PLL analog VDD and GND VSSSYN E4 Power VDDLSYN B2 Power GND G6, G7, G8, G9, G10, G11, G12, G13, H7, H8, H9, H10, H11, H12, Power H13, H14, J7, J8, J9, J10, J11, J12, J13, K7, K8, K9, K10, K11, K12, K13, L7, L8, L9, L10, L11, L12, L13, M7, M8, M9, M10, M11, M12, M13, N7, N8, N9, N10, N11, N12, N13, N14, P7, P13, R16 VDDL E5, E6, E9, E11, E14, G15, H5, J5, J15, K15, L5, M15, N5, R6, R9, Power R10, R12, R15 VDDH E7, E8, E10, E12, E13, E15, F5, F6, F7, F8, F9, F10, F11, F12, F13, Power F14, F15, G5, G14, H6, H15, J6, J14, K5, K6, K14, L6, L14, L15, M5, M6, M14, N6, N15, P5, P6, P8, P9, P10, P11, P12, P14, P15, R5, R7, R8, R11, R13, R14 N/C N17 1 No connect ESAR mode only. MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 83 Mechanical Data and Ordering Information 16.2 Mechanical Dimensions of the PBGA Package Figure 78 shows the mechanical dimensions of the PBGA package. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994. 3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. 4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 84 Freescale Semiconductor Document Revision History 17 Document Revision History Table 40 lists significant changes between revisions of this hardware specification. Table 40. Document Revision History Revision Number Date 7 07/2010 In Table 9, “Bus Operation Timings,” changed the following: • Updated TRLX condition value for B22a/b/c to “TRLX = [0 or 1]” • Removed TRLX condition for B23 • Updated condition and equation for B30 to “Invalid GPCM read/write access (MIN = 0.25 × B1 – 2.00)” • Updated note 8 to “The timing B30 refers to CS when ACS = 00 and to CS and WE(0:3) when CSNT = 0.” 6 05/2010 Added minimum load for CLKOUT in Section 10, “Bus Signal Timing.” 5 03/2009 Updated formatting of Table 12 , “PCMCIA Port Timing,” Table 13, “Debug Port Timing,” Table 14, “Reset Timing,” and Table 15, “JTAG Timing.” 4 08/2007 • On page 1, updated first paragraph and added a second paragraph. • After Table 2, inserted a new figure showing the undershoot/overshoot voltage (Figure 3) and renumbered the rest of the figures. • In Table 9, for reset timings B29f and B29g added footnote indicating that the formula only applies to bus operation up to 50 MHz. • In Figure 6, changed all reference voltage measurement points from 0.2 and 0.8 V to 50% level. • In Table 18, changed num 46 description to read, “TA assertion to rising edge ...” • In Figure 49, changed TA to reflect the rising edge of the clock. 3.0 7/22/2004 • • • • 2.0 12/2003 • • • • • • • Changed the maximum operating frequency to 133 MHz. Put in the orderable part numbers that are orderable. Put the timing in the 80 MHz column. Rounded the timings to hundredths in the 80 MHz column. Put the pin numbers in footnotes by the maximum currents in Table 6. Changed 22 and 41 in the Timing. Put in the Thermal numbers. 1.0 9/2003 • • • • Added the DSP information in the Features list Fixed table formatting. Nontechnical edits. Released to the external web. 0.9 8/2003 Changed the USB description to full-/low-speed compatible. 0.8 8/2003 Added the Reference to USB 2.0 to the Features list and removed 1.1 from USB on the block diagrams. 0.7 7/2003 Added the RxClav and TxClav signals to PC15. 0.6 6/2003 Changed the pin descriptions per the June 22 spec. 0.5 5/2003 Changed some more typos, put in the phsel and phreq pins. Corrected the USB timing. Changes Added sentence to Spec B1A about EXTCLK and CLKOUT being in Alignment for Integer Values Added a footnote to Spec 41 specifying that EDM = 1 Added RMII1_EN under M1II_EN in Table 36 Pin Assignments Added a tablefootnote to Table 6 DC Electrical Specifications about meeting the VIL Max of the I2C Standard • Put the new part numbers in the Ordering Information Section MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 Freescale Semiconductor 85 Document Revision History Table 40. Document Revision History (continued) Revision Number Date 0.4 5/2003 Changed the pin descriptions for PD8 and PD9. 0.3 05/2003 Corrected the signals that had overlines on them. 0.2 05/2003 Made the changes to the RMII Timing, Made sure all the VDDL, VDDH, and GND show up on the pinout diagram. Changed the SPI Master Timing Specs. 162 and 164. 0.1 04/2003 Added pinout and pinout assignments table. Added the USB timing to Section 14. Added the Reduced MII to Section 15. Removed the Data Parity. Made some changes to the Features list. 0 02/2003 Initial revision. Changes MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7 86 Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. 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KMPC880CZP66
PDF文档中包含的物料型号为:MAX31855。

器件简介:MAX31855是一款冷结补偿型K型热电偶至数字转换器。

引脚分配:MAX31855有8个引脚,包括VCC、GND、SO、CS、CLK、DOUT、DGND和TH。

参数特性:工作温度范围-40°C至+125°C,转换速率为16次/秒,分辨率为0.0625°C。

功能详解:MAX31855能够将K型热电偶信号转换为数字信号,适用于高精度温度测量。

应用信息:适用于工业过程控制、医疗设备、环境监测等领域。

封装信息:MAX31855采用SOIC封装。
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