KMZ41

KMZ41 Magnetic field sensor Rev. 05 — 27 November 2006 Product data sheet 1. Product profile 1.1 General description The KMZ41 is a sensitive magnetic field sensor, employing the magneto-resistive effect of thin film permalloy. The sensor contains two galvanic separated Wheatstone bridges, which enclose an angle of 45 degrees. A rotating magnetic field strength > 40 kA/m (recommended field strength > 100 kA/m) in the surface parallel to the chip (x-y plane) will deliver two independent sinusoidal output signals, one following a cos(2α) and the second following a sin(2α) function. The sensor can be operated at any frequency between DC and 1 MHz. Application notes AN00023 (contactless angle measurement using KMZ41 and UZZ9000) and AN00004 (contactless angle measurement using KMZ41 and UZZ9001) are available. 1.2 Features I I I I I Accurate and reliable angle measurement Mechanical robustness, contactless principle Wear-free operation Accuracy independent on mechanical tolerances Extended temperature range 1.3 Quick reference data Table 1. Quick reference data Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified. Symbol VCC Vpeak Voffset Rbridge [1] [2] Parameter supply voltage peak voltage offset voltage bridge resistance Conditions [1] Min 70 −2 2.0 [1] [1] Typ 5 78 2.5 Max 9 86 +2 3.0 Unit V mV mV/V kΩ see Figure 2 per supply voltage; see Figure 2 [1][2] Applicable for bridge 1 and bridge 2. Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 5 to pin 1 and pin 6 to pin 2. NXP Semiconductors KMZ41 Magnetic field sensor 2. Pinning information Table 2. Pin 1 2 3 4 5 6 7 8 ON1 ON2 VCC2 VCC1 OP1 OP2 GND2 GND1 Pinning Description output voltage bridge 1 output voltage bridge 2 supply voltage bridge 2 supply voltage bridge 1 output voltage bridge 1 output voltage bridge 2 supply voltage bridge 2 supply voltage bridge 1 1 4 mgd790 Symbol Simplified outline 8 5 x y 3. Ordering information Table 3. Ordering information Package Name KMZ41 SO8 Description Version plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 Type number 4. Circuit diagram KMZ41 R11 bridge 1 bridge 2 cos R12 R21 sin R22 R13 R14 R23 R24 VCC1 OP1 GND1 VO1 V ON1 OP2 GND2 VO2 V ON2 VCC2 VCC1 V VOP1 VON1 V V VOP2 V VON2 VCC2 006aaa529 Fig 1. Device and test circuit diagram KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 2 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Hext Tamb Tstg [1] Parameter supply voltage external magnetic field strength ambient temperature storage temperature Conditions [1] Min 40 −40 −65 Max 9 +150 +150 Unit V kA/m °C °C Applicable for bridge 1 and bridge 2. 6. Thermal characteristics Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions Typ 155 Unit K/W KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 3 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 7. Characteristics Table 6. Characteristics Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified. Symbol VCC Vpeak TCVpeak Rbridge TCRbridge Voffset TCVoffset Parameter supply voltage peak voltage see Figure 2 temperature coefficient of peak Tamb = −40 °C to +150 °C voltage bridge resistance temperature coefficient of bridge resistance offset voltage temperature coefficient of offset voltage hysteresis of output voltage amplitude synchronism temperature coefficient of amplitude synchronism angular inaccuracy Applicable for bridge 1 and bridge 2. Conditions [1] [1] [1][2] Min 70 −0.38 2.0 0.31 −2 −2 Typ 5 78 −0.41 2.5 0.33 - Max 9 86 −0.44 3.0 0.35 +2 +2 Unit V mV %/K kΩ %/K mV/V (µV/V)/K [1][3] Tamb = −40 °C to +150 °C per supply voltage; see Figure 2 per supply voltage; Tamb = −40 °C to +150 °C; see Figure 2 see Figure 3 Tamb = −40 °C to +150 °C [1][4] [1] [1][5] FH k TCk ∆α [1] [2] [3] [4] [1][6] [7] [8] 0 99 −0.005 0 0.01 100 0 0.1 0.04 101 +0.005 0.25 %FS % %/K deg [9] V peak ( at 150 ° C ) – V peak ( at – 40 ° C ) T CV peak = 100 × --------------------------------------------------------------------------------------------------V peak ( at 25 ° C ) × ( 150 ° C – ( – 40 ° C ) ) Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 5 to pin 1 and pin 6 to pin 2. R bridge ( at 150 ° C ) – R bridge ( at – 40 ° C ) TCR bridge = 100 × ------------------------------------------------------------------------------------------------------R bridge ( at 25 ° C ) × ( 150 ° C – ( – 40 ° C ) ) V offset ( at 150 ° C ) – V offset ( at – 40 ° C ) T CV offset = --------------------------------------------------------------------------------------------------150 ° C – ( – 40 ° C ) V O1 ( 67 . 5 ° ) 135 °→ 45 ° – V O1 ( 67 . 5 ° ) 45 °→ 135 ° FH 1 = 100 × ----------------------------------------------------------------------------------------------------------------------2 × V peak1 V O2 ( 22 . 5 ° ) 90 °→ 0 ° – V O2 ( 22 . 5 ° ) 0 °→ 90 ° F H 2 = 100 × ----------------------------------------------------------------------------------------------------------2 × V peak2 [5] [6] [7] V peak1 k = 100 × ---------------V peak2 k ( at 150 ° C ) – k ( at – 40 ° C ) TCk = 100 × ---------------------------------------------------------------------------------------k ( at 25 ° C ) × ( 150 ° C – ( – 40 ° C ) ) ∆α = |αreal − αmeas|; Voffset = 0 V; inaccuracy of angular measurement due to deviations from ideal sinusoidal characteristics, calculated from the third and fifth harmonies of the spectrum of VO. [8] [9] KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 4 of 10 NXP Semiconductors KMZ41 Magnetic field sensor VO (mV) VO2 α = 0° α ON1 0 ON2 VCC2 VCC1 VO1 direction of magnetic field Vpeak2 Voffset2 GND1 GND2 OP2 OP1 mgu175 0 90 180 270 α (deg) 360 Fig 2. Output signals related to the direction of the magnetic field 006aaa530 VO (mV) FH2 0 FH1 VO1 VO2 0 45 90 α (deg) 135 Fig 3. Definition of hysteresis KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 5 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 8. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index θ Lp 1 e bp 4 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8o o 0 ISSUE DATE 99-12-27 03-02-18 Fig 4. Package outline SOT96-1 (SO8/MS-012) KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 6 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 9. Packing information Table 7. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number KMZ41 [1] Package SOT96-1 Description 8 mm pitch, 12 mm tape and reel Packing quantity 2500 -118 12NC ordering code: 9340 372 10118. For further information and the availability of packing methods, see Section 12. KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 7 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 10. Revision history Table 8. KMZ41_5 Modifications: Revision history Release date 20061127 Data sheet status Product data sheet Change notice Supersedes KMZ41_4 Document ID • • • • • • • • • • • • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 1.1 “General description”: amended Section 1.2 “Features”: added Table 1 “Quick reference data”: Vpeak peak voltage added Table 1: Rbridge bridge resistance Table note 2 added Table 2 “Pinning”: amended Section 3 “Ordering information”: added Figure 1 “Device and test circuit diagram”: amended Table 4 “Limiting values”: Hext external magnetic field strength added Table 4: Tbridge bridge operating temperature redefined to Tamb ambient temperature Table 6 “Characteristics”: Hrotation redefined to Hext external magnetic field strength Figure 3 “Definition of hysteresis”: added Section 9 “Packing information”: added Preliminary specification KMZ41_3 KMZ41_4 20000418 KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 8 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com KMZ41_5 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 05 — 27 November 2006 9 of 10 NXP Semiconductors KMZ41 Magnetic field sensor 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Circuit diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 November 2006 Document identifier: KMZ41_5