LD6816 series
Ultra low dropout regulators, low noise, 150 mA
Rev. 1 — 28 September 2012
Product data sheet
1. Product profile
1.1 General description
The LD6816 series is a small-size Low DropOut regulator (LDO) family with a typical
voltage drop of 45 mV at 150 mA current rating. Operating voltages can range from 2.3 V
to 5.5 V. The devices are available with fixed output voltages between 1.2 V and 3.6 V.
In disabled mode the LD6816CX4/xxH devices show a high-ohmic state at the output pin,
while the LD6816CX4/xxP and LD6816CX4/CxxP devices contain a pull-down switching
transistor to provide a low-ohmic output state (auto discharge function).
All devices of the LD6816 series are available in a 0.4 mm pitch Wafer-Level Chip-Scale
Package (WLCSP) making them ideal for use in portable applications requiring
component miniaturization. All devices are manufactured in monolithic silicon technology.
1.2 Features and benefits
150 mA output current rating
Input voltage range from 2.3 V to 5.5 V
Fixed output voltage between 1.2 V and 3.6 V
Dropout voltage 45 mV at 150 mA output rating
Low quiescent current in shutdown mode (typical 0.1 A)
30 V RMS output noise voltage (typical value) at 10 Hz to 100 kHz
Turn-on time < 150 s
55 dB Power Supply Rejection Ratio (PSRR) at 1 kHz
Over-temperature protection
Output current limiter
LD6816CX4/xxH: high-ohmic (3-state) output state when disabled
LD6816CX4/xxP and LD6816CX4/CxxP: low-ohmic output state when disabled (auto
discharge function)
Integrated ESD protection up to 10 kV Human Body Model (HBM)
WLCSP with 0.4 mm pitch and package size of 0.76 mm 0.76 mm 0.47 mm
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (dark green compliant)
1.3 Applications
Analog and digital interfaces requiring lower than standard supply voltages in mobile
appliances such as smart phones, mobile phone handsets and cordless telephones.
Other typical applications are digital still cameras, mobile internet devices, personal
navigation devices and portable media players.
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
2. Pinning information
2.1 Pinning
bump A1
index area
1
2
A
B
001aao107
transparent top view,
solder balls facing down
Fig 1.
Pin configuration
2.2 Pin description
Table 1.
Pin description
Symbol
Pin
Description
GND
A1
supply ground
EN
A2
device enable input; active HIGH
OUT
B1
regulator output voltage
IN
B2
regulator input voltage
3. Ordering information
Table 2.
Ordering information
Type number
LD6816CX4/xxx
Package
Name
Description
WLCSP4
wafer-level chip-scale package; 4 bumps (2 2)
LD6816CX4/CxxP WLCSP4
[1]
LD6816_SER
Product data sheet
Version
[1]
-
wafer-level chip-scale package with backside coating; 4 bumps (2 2) [1]
Size 0.76 mm 0.76 mm.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
2 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
3.1 Ordering options
Further information on output voltage is available on request; see Section 18 “Contact
information”.
Table 3.
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6816CX4/12H
1.2 V
LD6816CX4/25H
2.5 V
LD6816CX4/13H
1.3 V
LD6816CX4/27H
2.7 V
LD6816CX4/14H
1.4 V
LD6816CX4/28H
2.8 V
LD6816CX4/16H
1.6 V
LD6816CX4/29H
2.9 V
LD6816CX4/18H
1.8 V
LD6816CX4/30H
3.0 V
LD6816CX4/20H
2.0 V
LD6816CX4/33H
3.3 V
LD6816CX4/22H
2.2 V
LD6816CX4/36H
3.6 V
LD6816CX4/23H
2.3 V
-
-
Table 4.
Product data sheet
Type number extension of pull-down output in WLCSP4
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6816CX4/12P
1.2 V
LD6816CX4/23P
2.3 V
LD6816CX4/13P
1.3 V
LD6816CX4/25P
2.5 V
LD6816CX4/14P
1.4 V
LD6816CX4/27P
2.7 V
LD6816CX4/16P
1.6 V
LD6816CX4/28P
2.8 V
LD6816CX4/18P
1.8 V
LD6816CX4/29P
2.9 V
LD6816CX4/20P
2.0 V
LD6816CX4/30P
3.0 V
LD6816CX4/21P
2.1 V
LD6816CX4/33P
3.3 V
LD6816CX4/22P
2.2 V
LD6816CX4/36P
3.6 V
Table 5.
LD6816_SER
Type number extension of high-ohmic output in WLCSP4
Type number extension of pull-down output in WLCSP4 with backside coating
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6816CX4/C12P
1.2 V
LD6816CX4/C23P
2.3 V
LD6816CX4/C13P
1.3 V
LD6816CX4/C25P
2.5 V
LD6816CX4/C14P
1.4 V
LD6816CX4/C27P
2.7 V
LD6816CX4/C16P
1.6 V
LD6816CX4/C28P
2.8 V
LD6816CX4/C18P
1.8 V
LD6816CX4/C29P
2.9 V
LD6816CX4/C20P
2.0 V
LD6816CX4/C30P
3.0 V
LD6816CX4/C21P
2.1 V
LD6816CX4/C33P
3.3 V
LD6816CX4/C22P
2.2 V
LD6816CX4/C36P
3.6 V
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
3 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
4. Block diagram
VIN
VOUT
R1
VEN
Vreference
GENERATOR
THERMAL
PROTECTION
R2
OVERCURRENT
PROTECTION
GND
001aan756
Fig 2.
Block diagram of LD6816CX4/xxH
VIN
VOUT
R1
VEN
Vreference
GENERATOR
THERMAL
PROTECTION
R2
OVER CURRENT
PROTECTION
GND
Fig 3.
LD6816_SER
Product data sheet
001aan299
Block diagram of LD6816CX4/xxP and LD6816CX4/CxxP (auto discharge
function)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
4 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VIN
voltage on pin IN
4 ms transient
[1]
Min
Max
Unit
0.5
+6.0
V
Ptot
total power dissipation
-
770
mW
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+125
C
Tamb
ambient temperature
VESD
electrostatic discharge voltage
40
+85
C
human body model level 6
[2]
-
10
kV
machine model class 3
[3]
-
400
V
[1]
The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed with lower
ambient temperatures. The conditions to determine the specified values are Tamb = 25 C and the use of a two layer Printed-Circuit
Board (PCB).
[2]
According to IEC 61340-3-1.
[3]
According to JESD22-A115C.
6. Recommended operating conditions
Table 7.
Operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Tamb
Tj
Conditions
Min
Typ
Max
Unit
ambient temperature
40
-
+85
C
junction temperature
-
-
+125
C
voltage on pin IN
2.3
-
5.5
V
voltage on pin EN
0
-
VIN
V
0.7
1.0
-
F
Pin IN
VIN
Pin EN
VEN
Pin OUT
CL(ext)
[1]
[1]
external load capacitance
See Section 10.1 “Output capacitor values”.
7. Thermal characteristics
Table 8.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to ambient
[1][2]
Typ
Unit
130
K/W
[1]
The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to
larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a
large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer
connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip.
[2]
Use the measurement data given for a rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value can vary in applications
using different layer stacks and layouts.
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
5 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
8. Characteristics
Table 9.
Electrical characteristics
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V);
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vdo
dropout voltage
IOUT = 150 mA; VIN < VO(nom)
-
45
75
mV
VO
output voltage variation
VOUT < 1.8 V; IOUT = 1 mA
Tamb = +25 C
3
0.5
+3
%
30 C Tamb +85 C
4
-
+4
%
Tamb = +25 C
2
0.5
+2
%
30 C Tamb +85 C
3
-
+3
%
0.1
-
+0.1
%/V
-
0.0025 0.01
%/mA
-
-
150
mA
300
-
-
mA
300
-
-
mA
pin OUT
-
600
-
mA
VEN = 1.4 V; IOUT = 0 mA
-
70
100
A
VEN = 1.4 V; 1 mA IOUT 150 mA
-
155
250
A
VEN 0.4 V
-
0.1
1
A
-
55
-
dB
Output voltage
[1]
VOUT 1.8 V; IOUT = 1 mA
Line regulation error
VO/(VOxVI)
relative output voltage
variation with input voltage
VIN = (VO(nom) + 0.2 V) to 5.5 V
[1]
Load regulation error
VO/(VOxIO)
relative output voltage
variation with output current
1 mA IOUT 150 mA
Output current
IOUT
IOM
current on pin OUT
peak output current
VIN = (VO(nom) + 0.2 V) to 5.5 V
[1]
VO(nom) 1.8 V;
VOUT = 0.95 VO(nom)
VO(nom) < 1.8 V;
VOUT = 0.9 VO(nom)
Isc
short-circuit current
Regulator quiescent current
Iq
quiescent current
Ripple rejection and output noise
[1]
PSRR
power supply rejection ratio
VIN = VO(nom) + 1.0 V; IOUT = 1 mA;
fripple = 1 kHz
Vn(o)(RMS)
RMS output noise voltage
fripple = 10 Hz to 100 kHz;
CL(ext) = 1 F
-
30
-
V
0
-
0.4
V
1.1
-
5.5
V
-
150
-
s
Enable input and timing
VIL
LOW-level input voltage
pin EN
VIH
HIGH-level input voltage
pin EN
regulator start-up time
VIN = 5.5 V; VOUT = 0.95 VO(nom);
IOUT = 150 mA; CL(ext) = 1 F
tstartup(reg)
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
[1]
© NXP B.V. 2012. All rights reserved.
6 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
Table 9.
Electrical characteristics …continued
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V);
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
300
-
s
-
100
-
LD6816CX4/xxP and LD6816CX4/CxxP; auto discharge function
tsd(reg)
regulator shutdown time
Rpd
pull-down resistance
VIN = 5.5 V; VOUT = 0.05 VO(nom);
CL(ext) = 1 F
Over-temperature protection
Tsd
shutdown temperature
-
160
-
C
Tsd(hys)
shutdown temperature
hysteresis
-
20
-
K
[1]
VO(nom) = nominal output voltage (device specific).
9. Dynamic behavior
9.1 Power Supply Rejection Ratio (PSRR)
PSRR stands for the capability of the regulator to suppress unwanted signals on the input
voltage like noise or ripples.
V out ripple
for all frequencies.
PSRR dB = 20 log -------------------------V in ripple
DDD
3655
G%
-20
-30
018aaa189
0
PSRR
(dB)
-10
(1)
(2)
(3)
(4)
-40
-50
-60
-70
102
IUHTXHQF\ +]
103
(1) IOUT = 1 mA
(1) IOUT = 1 mA
(2) IOUT = 50 mA
(2) IOUT = 50 mA
(3) IOUT = 100 mA
(3) IOUT = 100 mA
(4) IOUT = 150 mA
(4) IOUT = 150 mA
Fig 4.
PSRR for LD6816CX4/12H
LD6816_SER
Product data sheet
Fig 5.
104
105
frequency (Hz)
PSRR for LD6816CX4/25x and
LD6816CX4/C25P
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
7 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
DDD
3655
G%
IUHTXHQF\ +]
(1) IOUT = 1 mA
(2) IOUT = 50 mA
(3) IOUT = 100 mA
(4) IOUT = 150 mA
Fig 6.
PSRR for LD6816CX4/36H
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
8 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.2 Dropout
The dropout voltage is defined as the smallest input to output voltage difference at a
specified load current when the regulator operates within its linear region. This means that
the input voltage is below the nominal output voltage value and the pass transistor works
as a plain resistor.
A small dropout voltage guarantees lower power consumption and efficiency
maximization.
018aaa182
100
Vdo
(mV)
018aaa183
100
Vdo
(mV)
80
80
60
60
(1)
40
40
(2)
(3)
20
(1)
(2)
20
(3)
0
0
50
100
IOUT (mA)
0
150
0
(1) Tamb = +85 C
(1) Tamb = +85 C
(2) Tamb = +25 C
(2) Tamb = +25 C
(3) Tamb = 40 C
Fig 7.
Product data sheet
100
IOUT (mA)
150
(3) Tamb = 40 C
Dropout voltage as a function of output
current for LD6816CX4/25x and
LD6816CX4/C25P
LD6816_SER
50
Fig 8.
Dropout voltage as a function of output
current for LD6816CX4/36x and
LD6816CX4/C36P
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
9 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.3 Accuracy
The LD6816 series guarantees high accuracy of the nominal output voltage.
001aan942
1.24
VOUT
(V)
001aan943
2.54
VOUT
(V)
1.22
2.52
(1)
(2)
(3)
(1)
(2)
(3)
1.20
2.50
1.18
2.48
1.16
-60
-20
20
60
100
140
Tamb (°C)
2.46
-60
-20
(1) IOUT = 1 mA
(1) IOUT = 1 mA
(2) IOUT = 100 mA
(2) IOUT = 100 mA
(3) IOUT = 150 mA
Fig 9.
Product data sheet
60
100
140
Tamb (°C)
(3) IOUT = 150 mA
Working voltage tolerance for LD6816CX4/12x
and LD6816CX4/C12P
LD6816_SER
20
Fig 10. Working voltage tolerance for LD6816CX4/25x
and LD6816CX4/C25P
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
10 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.4 Quiescent current
Quiescent (or ground) current is the difference between input and output current of the
regulator.
DDD
,*1'
$
7DPE &
(1) IOUT = 150 mA
(2) IOUT = 100 mA
(3) IOUT = 10 mA
(4) IOUT = 1 mA
(5) IOUT = 0 mA
Fig 11. Quiescent current for LD6816CX4/25x and LD6816CX4/C25P
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
11 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.5 Noise
Output noise voltage of an LDO circuit is given as noise density or RMS output noise
voltage over a defined frequency spectrum (10 Hz to 100 kHz). Permanent conditions are
a constant output current and a ripple-free input voltage. The output noise voltage is
generated by the LDO regulator.
018aaa184
10-2
noise
(μV/√Hz)
10-3
(1)
(2)
(3)
(4)
(5)
10-4
10-5
10
102
103
104
105
frequency (Hz)
(1) IOUT = 0 mA
(2) IOUT = 1 mA
(3) IOUT = 50 mA
(4) IOUT = 100 mA
(5) IOUT = 150 mA
Fig 12. Noise density for LD6816CX4/25x and LD6816CX4/C25P
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
12 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.6 Line Regulation
Line regulation is the capability of the circuit to maintain the nominal output voltage while
varying the input voltage.
DDD
9287
9
9,1
9
DDD
9,1
9
9287
9
WLPH PV
(1) VIN
(1) VIN
(2) VOUT
(2) VOUT
Fig 13. Line regulation for LD6816CX4/12H
WLPH PV
Fig 14. Line regulation for LD6816CX4/25P and
LD6816CX4/C25P
DDD
9,1
9
9287
9
WLPH PV
(1) VIN
(2) VOUT
Fig 15. Line regulation for LD6816CX4/36H
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
13 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.7 Load Regulation
Load regulation is the capability of the circuit to maintain the nominal output voltage while
varying the output current.
018aaa186
0.5
IOUT
(A)
018aaa187
0.5
1.30
VOUT
(V)
IOUT
(A)
2.6
VOUT
(V)
1.25
(2)
0.3
0.3
(2)
2.5
1.20
(1)
(1)
0.1
0.1
2.4
1.15
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-0.1
0.0
1.10
0.6
0.7
time (ms)
0.1
(1) VIN
(1) VIN
(2) VOUT
(2) VOUT
Fig 16. Load regulation for LD6816CX4/12H
0.2
0.3
0.4
0.5
2.3
0.6
0.7
time (ms)
Fig 17. Load regulation for LD6816CX4/25P and
LD6816CX4/C25P
018aaa188
0.5
3.8
VOUT
(V)
IOUT
(A)
3.7
0.3
(2)
3.6
(1)
0.1
3.5
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
3.4
0.6
0.7
time (ms)
(1) VIN
(2) VOUT
Fig 18. Load regulation for LD6816CX4/36H
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
14 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.8 Start-up and shutdown
Start-up time defines the time needed for the LDO to achieve 95 % of its typical output
voltage level after activation via the enable pin. Shutdown time defines the time needed
for the LDO to pull-down the output voltage to 10 % of its nominal output voltage after
deactivation via the enable pin.
018aaa191
1.6
VOUT
(V)
2.5
(1)
Venable
(V)
3
1.2
2
(2)
001aan947
1.4
Venable
(V)
1.2
3
VOUT
(V)
2.5
1
2
0.8
0.8
1.5
(1)
1.5
(2)
0.6
1
0.5
0
1
0.4
0.4
0
0.05
0.1
0
0.15
0.2
time (ms)
0.5
0.2
0
0
(1) VEN
(1) VEN
(2) VOUT
(2) VOUT
Fig 19. Start-up for LD6816CX4/25x and
LD6816CX4/C25P
LD6816_SER
Product data sheet
0.1
0.2
0.3
time (ms)
0
0.4
Fig 20. Shutdown for LD6816CX4/25P and
LD6816CX4/C25P
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
15 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
9.9 Enable threshold voltage
An active HIGH signal enables the LDO when the signal exceeds the minimum input
HIGH voltage threshold. The LDO is in Off state as long the signal is below the maximum
LOW threshold. The input voltage threshold is independent from the LDO input voltage.
001aan808
3.5
VOUT
(V)
2.5
1.5
(2)
(1)
0.5
-0.5
0.3
0.5
0.7
0.9
1.1
1.3
VEN (V)
1.5
(1) LOW to HIGH
(2) HIGH to LOW
Fig 21. Enable threshold voltage
10. Application information
10.1 Output capacitor values
The LD6816 series requires external capacitors at the output to guarantee a stable
regulator behavior. Do not under-run the specified minimum Equivalent Series Resistance
(ESR). The absolute value of the total capacitance attached to the output pin OUT
influences the shutdown time (tsd(reg)) of the LD6816 series.
Table 10.
External load capacitor
Symbol
Parameter
CL(ext)
external load capacitance
ESR
equivalent series resistance
[1]
LD6816_SER
Product data sheet
Conditions
[1]
Min
Typ
Max
Unit
-
1.0
-
F
5
-
500
m
The minimum value of capacitance for stability and correct operation is 0.7 F. The specified capacitor
tolerance is 30 % or better over the temperature and operating conditions range. The recommended
capacitor type is X7R to meet the full device temperature specification of 40 C to +125 C.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
16 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
IN
IN
OUT
EN
GND
1μF
OUT
1μF
001aan647
Fig 22. Application diagram
11. Test information
11.1 Quality information
This product has been qualified in accordance with NX1-00023 NXP Semiconductors
Quality and Reliability Specification and is suitable for use in consumer applications.
12. Marking
WLCSP dies are laser marked with the following information (see Table 11 to 13 and
Figure 23):
1. Shaded area: marking of pin A1
2. The character N gives the version code and describes the output mode of the LDO. If
the code is legible, the LDO has an integrated pull down transistor (“P“ version). If the
character N is rotated counterclockwise by 90°, the LDO is a “H“ version.
3. “YYY” symbolizes a placeholder for some characters of the lot ID
7UDQVSDUHQWWRSYLHZ
DDD
Fig 23. Marking WLCSP4
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
17 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
Table 11.
Marking code of high-ohmic output
Type number
Nominal
Marking
output voltage code
A
LD6816CX4/27H 2.7 V
P
LD6816CX4/14H 1.4 V
C
LD6816CX4/28H 2.8 V
Q
LD6816CX4/16H 1.6 V
D
LD6816CX4/29H 2.9 V
R
LD6816CX4/18H 1.8 V
E
LD6816CX4/30H 3.0 V
S
LD6816CX4/22H 2.2 V
K
LD6816CX4/33H 3.3 V
V
LD6816CX4/23H 2.3 V
L
LD6816CX4/36H 3.6 V
Y
LD6816CX4/25H 2.5 V
N
-
-
-
Type number
Nominal
Marking
output voltage code
Marking of pull-down output
Type number
Nominal
Marking
output voltage code
LD6816CX4/12P 1.2 V
A
LD6816CX4/23P 2.3 V
L
LD6816CX4/13P 1.3 V
B
LD6816CX4/25P 2.5 V
N
LD6816CX4/14P 1.4 V
C
LD6816CX4/27P 2.7 V
P
LD6816CX4/16P 1.6 V
E
LD6816CX4/28P 2.8 V
Q
LD6816CX4/18P 1.8 V
G
LD6816CX4/29P 2.9 V
R
LD6816CX4/20P 2.0 V
I
LD6816CX4/30P 3.0 V
S
LD6816CX4/21P 2.1 V
J
LD6816CX4/33P 3.3 V
V
LD6816CX4/22P 2.2 V
K
LD6816CX4/36P 3.6 V
Y
Table 13.
Marking code of pull-down output with backside coating
Type number
Product data sheet
Type number
LD6816CX4/12H 1.2 V
Table 12.
LD6816_SER
Nominal
Marking
output voltage code
Nominal
Marking
output voltage code
Type number
Nominal
Marking
output voltage code
LD6816CX4/C12P 1.2 V
A
LD6816CX4/C23P 2.3 V
L
LD6816CX4/C13P 1.3 V
B
LD6816CX4/C25P 2.5 V
N
LD6816CX4/C14P 1.4 V
C
LD6816CX4/C27P 2.7 V
P
LD6816CX4/C16P 1.6 V
E
LD6816CX4/C28P 2.8 V
Q
LD6816CX4/C18P 1.8 V
G
LD6816CX4/C29P 2.9 V
R
LD6816CX4/C20P 2.0 V
I
LD6816CX4/C30P 3.0 V
S
LD6816CX4/C21P 2.1 V
J
LD6816CX4/C33P 3.3 V
V
LD6816CX4/C22P 2.2 V
K
LD6816CX4/C36P 3.6 V
Y
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
18 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
13. Package outline
WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)
D
bump A1
index area
A2
A
E
A1
detail X
e
b
B
e
A
1
2
X
European
projection
wlcsp4_2x2_po
Fig 24. Package outline WLCSP4
Table 14.
Dimensions for Figure 24
Symbol
Min
Typ
Max
Unit
A
0.44
0.47
0.50
mm
A1
0.18
0.20
0.22
mm
A2
0.26
0.27
0.28
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
19 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
WLCSP4: wafer level chip-size package with backside coating; 4 bumps (2 x 2)
D
A3
bump A1
index area
A2
A
E
A1
detail X
e
b
B
e
A
1
2
X
European
projection
wlcsp4_2x2_c_po
Fig 25. Package outline WLCSP4 with backside coating
Table 15.
Dimensions for Figure 25
Symbol
Min
Typ
Max
Unit
A
0.47
0.51
0.55
mm
A1
0.18
0.20
0.22
mm
A2
0.26
0.27
0.28
mm
A3
0.03
0.04
0.05
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
20 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
14. Soldering
D
e
c
(4×)
e
solder resist
E
solder paste = solderland
f
(4×)
occupied area
Dimensions in mm
wlcsp4_2x2_fr
Fig 26. Reflow soldering footprint WLCSP4
Table 16.
Dimensions of for Figure 26
Symbol
Min
Typ
Max
Unit
c
-
0.25
-
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
f
-
0.325
-
mm
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
21 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 27) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 17 and 18
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
22 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
Table 17.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 18.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 27.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 27. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
23 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
16. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LD6816_SER v.1
20120928
Product data sheet
-
-
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
24 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
LD6816_SER
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
25 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LD6816_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2012
© NXP B.V. 2012. All rights reserved.
26 of 27
LD6816 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 150 mA
19. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
3.1
4
5
6
7
8
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10
10.1
11
11.1
12
13
14
15
15.1
15.2
15.3
15.4
16
17
17.1
17.2
17.3
17.4
18
19
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 7
Power Supply Rejection Ratio (PSRR). . . . . . . 7
Dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Quiescent current . . . . . . . . . . . . . . . . . . . . . . 11
Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Line Regulation. . . . . . . . . . . . . . . . . . . . . . . . 13
Load Regulation . . . . . . . . . . . . . . . . . . . . . . . 14
Start-up and shutdown . . . . . . . . . . . . . . . . . . 15
Enable threshold voltage . . . . . . . . . . . . . . . . 16
Application information. . . . . . . . . . . . . . . . . . 16
Output capacitor values . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Quality information . . . . . . . . . . . . . . . . . . . . . 17
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2012
Document identifier: LD6816_SER
工商网监
湘ICP备2023018690号
