LPC1342

LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device Rev. 01 — 11 December 2009 Product data sheet 1. General description The LPC1311/13/42/43 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1311/13/42/43 operate at CPU frequencies of up to 72 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. The peripheral complement of the LPC1311/13/42/43 includes up to 32 kB of flash memory, up to 8 kB of data memory, USB Device (LPC1342/43 only), one Fast-mode Plus I2C-bus interface, one UART, four general purpose timers, and up to 42 general purpose I/O pins. 2. Features I ARM Cortex-M3 processor, running at frequencies of up to 72 MHz. I ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC). I 32 kB (LPC1343/13)/16 kB (LPC1342)/8 kB (LPC1311) on-chip flash programming memory. I 8 kB (LPC1343/13)/4 kB (LPC1342/11) SRAM. I In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. I Selectable boot-up: UART or USB (USB on LPC134x only). I Serial interfaces: N USB 2.0 full-speed device controller with on-chip PHY for device (LPC1342/43 only). N UART with fractional baud rate generation, modem, internal FIFO, and RS-485/EIA-485 support. N SSP controller with FIFO and multi-protocol capabilities. N I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a data rate of 1 Mbit/s with multiple address recognition and monitor mode. I Other peripherals: NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller I I I I I I I I I I I I I I I I I N Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors. N Four general purpose timers/counters with a total of four capture inputs and 13 match outputs. N Programmable WatchDog Timer (WDT). N System tick timer. Serial Wire Debug and Serial Wire Trace port. High-current output driver (20 mA) on one pin. High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus. Integrated PMU (Power Management Unit) to minimize power consumption during Sleep, Deep-sleep, and Deep power-down modes. Three reduced power modes: Sleep, Deep-sleep, and Deep power-down. Single 3.3 V power supply (2.0 V to 3.6 V). 10-bit ADC with input multiplexing among 8 pins. GPIO pins can be used as edge and level sensitive interrupt sources. Clock output function with divider that can reflect the system oscillator clock, IRC clock, CPU clock, or the watchdog clock. Processor wake-up from Deep-sleep mode via a dedicated start logic using up to 40 of the functional pins. Brownout detect with four separate thresholds for interrupt and one threshold for forced reset. Power-On Reset (POR). Crystal oscillator with an operating range of 1 MHz to 25 MHz. 12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a system clock. PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the watchdog oscillator. Code Read Protection (CRP) with different security levels. Available as 48-pin LQFP package and 33-pin HVQFN package. 3. Applications I I I I I eMetering Lighting Industrial networking Alarm systems White goods LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 2 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 4. Ordering information Table 1. Ordering information Package Name LPC1311FHN33 HVQFN33 LPC1313FBD48 LQFP48 LPC1313FHN33 HVQFN33 LPC1342FHN33 HVQFN33 LPC1343FBD48 LQFP48 LPC1343FHN33 HVQFN33 Description HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm Version n/a Type number LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 n/a n/a LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 n/a 4.1 Ordering options Table 2. Ordering options for LPC1311/13/42/43 Flash 8 kB 32 kB 32 kB 16 kB 32 kB 32 kB Total SRAM 4 kB 8 kB 8 kB 4 kB 8 kB 8 kB USB Device Device Device UART RS-485 1 1 1 1 1 1 I2C/ Fast+ 1 1 1 1 1 1 SSP 1 1 1 1 1 1 ADC channels 8 8 8 8 8 8 Pins 33 48 33 33 48 33 Package HVQFN33 LQFP48 HVQFN33 HVQFN33 LQFP48 HVQFN33 Type number LPC1311FHN33 LPC1313FBD48 LPC1313FHN33 LPC1342FHN33 LPC1343FBD48 LPC1343FHN33 LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 3 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 5. Block diagram XTALIN XTALOUT RESET SWD USB pins LPC1311/13/42/43 USB PHY(1) IRC CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS clocks and controls slave ROM AHB-LITE BUS CLKOUT TEST/DEBUG INTERFACE ARM CORTEX-M3 I-code bus D-code bus system bus USB DEVICE CONTROLLER(1) POR slave slave SRAM 4/8 kB GPIO ports PIO0/1/2/3 HIGH-SPEED GPIO slave slave AHB TO APB BRIDGE slave FLASH 8/16/32 kB RXD TXD DTR, DSR(2), CTS, DCD(2), RI(2), RTS CT32B0_MAT[3:0] CT32B0_CAP0 CT32B1_MAT[3:0] CT32B1_CAP0 CT16B0_MAT[2:0] CT16B0_CAP0 CT16B1_MAT[1:0] CT16B1_CAP0 UART 10-bit ADC AD[7:0] SCK SSEL MISO MOSI SCL SDA SSP 32-bit COUNTER/TIMER 0 32-bit COUNTER/TIMER 1 16-bit COUNTER/TIMER 0 16-bit COUNTER/TIMER 1 I2C-BUS WDT IOCONFIG SYSTEM CONTROL 002aae722 (1) LPC1342/43 only. (2) LQFP48 package only. Fig 1. Block diagram LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 4 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 6. Pinning information 6.1 Pinning 40 PIO1_4/AD5/CT32B1_MAT3/WAKEUP 39 SWDIO/PIO1_3/AD4/CT32B1_MAT2 46 PIO1_6/RXD/CT32B0_MAT0 47 PIO1_7/TXD/CT32B0_MAT1 45 PIO1_5/RTS/CT32B0_CAP0 42 PIO1_11/AD7 38 PIO2_3/RI 44 VDD(3V3) 48 PIO3_3 43 PIO3_2 PIO2_6 PIO2_0/DTR RESET/PIO0_0 PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE VSSIO XTALIN XTALOUT VDD(IO) PIO1_8/CT16B1_CAP0 1 2 3 4 5 6 7 8 9 37 PIO3_1 36 PIO3_0 35 TRST/PIO1_2/AD3/CT32B1_MAT1 34 TDO/PIO1_1/AD2/CT32B1_MAT0 33 TMS/PIO1_0/AD1/CT32B1_CAP0 32 TDI/PIO0_11/AD0/CT32B0_MAT3 31 PIO2_11/SCK 30 PIO1_10/AD6/CT16B1_MAT1 29 SWCLK/PIO0_10/SCK/CT16B0_MAT2 28 PIO0_9/MOSI/CT16B0_MAT1/SWO 27 PIO0_8/MISO/CT16B0_MAT0 26 PIO2_2/DCD 25 PIO2_10 PIO2_9 24 002aae505 LPC1343FBD48 PIO0_2/SSEL/CT16B0_CAP0 10 PIO2_7 11 PIO2_8 12 PIO2_1/DSR 13 PIO0_3/USB_VBUS 14 PIO0_4/SCL 15 PIO0_5/SDA 16 PIO1_9/CT16B1_MAT0 17 PIO2_4 18 USB_DM 19 USB_DP 20 PIO2_5 21 PIO0_6/USB_CONNECT/SCK 22 PIO0_7/CTS 23 Fig 2. LPC1343 LQFP48 package LPC1311_13_42_43_1 41 VSS © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 5 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller PIO1_4/AD5/CT32B1_MAT3/WAKEUP 26 terminal 1 index area PIO2_0/DTR RESET/PIO0_0 PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE XTALIN XTALOUT VDD(IO) PIO1_8/CT16B1_CAP0 PIO0_2/SSEL/CT16B0_CAP0 1 2 3 4 5 6 7 8 32 31 30 29 28 27 25 24 23 22 SWDIO/PIO1_3/AD4/CT32B1_MAT2 PIO1_6/RXD/CT32B0_MAT0 PIO1_7/TXD/CT32B0_MAT1 PIO1_5/RTS/CT32B0_CAP0 PIO1_11/AD7 VDD(3V3) PIO3_2 TRST/PIO1_2/AD3/CT32B1_MAT1 TDO/PIO1_1/AD2/CT32B1_MAT0 TMS/PIO1_0/AD1/CT32B1_CAP0 TDI/PIO0_11/AD0/CT32B0_MAT3 PIO1_10/AD6/CT16B1_MAT1 SWCLK/PIO0_10/SCK/CT16B0_MAT2 PIO0_9/MOSI/CT16B0_MAT1/SWO PIO0_8/MISO/CT16B0_MAT0 LPC1342FHN33 LPC1343FHN33 33 VSS 10 11 12 13 14 15 PIO0_6/USB_CONNECT/SCK 16 PIO0_7/CTS 9 21 20 19 18 17 PIO0_4/SCL PIO0_5/SDA PIO1_9/CT16B1_MAT0 PIO0_3/USB_VBUS USB_DM USB_DP 002aae516 Transparent top view Fig 3. LPC1342/43 HVQFN33 package LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 6 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 40 PIO1_4/AD5/CT32B1_MAT3/WAKEUP 39 SWDIO/PIO1_3/AD4/CT32B1_MAT2 46 PIO1_6/RXD/CT32B0_MAT0 47 PIO1_7/TXD/CT32B0_MAT1 45 PIO1_5/RTS/CT32B0_CAP0 42 PIO1_11/AD7 38 PIO2_3/RI 44 VDD(3V3) 48 PIO3_3 43 PIO3_2 PIO2_6 PIO2_0/DTR RESET/PIO0_0 PIO0_1/CLKOUT/CT32B0_MAT2 VSSIO XTALIN XTALOUT VDD(IO) PIO1_8/CT16B1_CAP0 1 2 3 4 5 6 7 8 9 37 PIO3_1 36 PIO3_0 35 TRST/PIO1_2/AD3/CT32B1_MAT1 34 TDO/PIO1_1/AD2/CT32B1_MAT0 33 TMS/PIO1_0/AD1/CT32B1_CAP0 32 TDI/PIO0_11/AD0/CT32B0_MAT3 31 PIO2_11/SCK 30 PIO1_10/AD6/CT16B1_MAT1 29 SWCLK/PIO0_10/SCK/CT16B0_MAT2 28 PIO0_9/MOSI/CT16B0_MAT1/SWO 27 PIO0_8/MISO/CT16B0_MAT0 26 PIO2_2/DCD 25 PIO2_10 PIO2_9 24 002aae513 LPC1313FBD48 PIO0_2/SSEL/CT16B0_CAP0 10 PIO2_7 11 PIO2_8 12 PIO2_1/DSR 13 PIO0_3 14 PIO0_4/SCL 15 PIO0_5/SDA 16 PIO1_9/CT16B1_MAT0 17 PIO3_4 18 PIO2_4 19 PIO2_5 20 PIO3_5 21 PIO0_6/SCK 22 PIO0_7/CTS 23 Fig 4. LPC1313 LQFP48 package LPC1311_13_42_43_1 41 VSS © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 7 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller PIO1_4/AD5/CT32B1_MAT3/WAKEUP 26 PIO1_6/RXD/CT32B0_MAT0 PIO1_7/TXD/CT32B0_MAT1 PIO1_5/RTS/CT32B0_CAP0 VDD(3V3) terminal 1 index area PIO2_0/DTR RESET/PIO0_0 PIO0_1/CLKOUT/CT32B0_MAT2 XTALIN XTALOUT VDD(IO) PIO1_8/CT16B1_CAP0 PIO0_2/SSEL/CT16B0_CAP0 1 2 3 4 5 6 7 8 32 31 30 29 28 27 25 24 23 22 SWDIO/PIO1_3/AD4/CT32B1_MAT2 PIO1_11/AD7 PIO3_2 TRST/PIO1_2/AD3/CT32B1_MAT1 TDO/PIO1_1/AD2/CT32B1_MAT0 TMS/PIO1_0/AD1/CT32B1_CAP0 TDI/PIO0_11/AD0/CT32B0_MAT3 PIO1_10/AD6/CT16B1_MAT1 SWCLK/PIO0_10/SCK/CT16B0_MAT2 PIO0_9/MOSI/CT16B0_MAT1/SWO PIO0_8/MISO/CT16B0_MAT0 LPC1311FHN33 LPC1313FHN33 33 VSS 10 11 12 13 14 15 PIO0_6/SCK 16 PIO0_7/CTS 9 21 20 19 18 17 PIO0_3 PIO0_4/SCL PIO3_4 PIO0_5/SDA PIO1_9/CT16B1_MAT0 PIO3_5 002aae517 Transparent top view Fig 5. LPC1311/13 HVQFN33 package 6.2 Pin description Table 3. Symbol RESET/PIO0_0 LPC1313/43 LQFP48 pin description table Pin 3 Type I Description RESET — External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. PIO0_0 — General purpose digital input/output pin. PIO0_1 — General purpose digital input/output pin. A LOW level on this pin during reset starts the ISP command handler or the USB device enumeration (USB on LPC1343 only, see description of PIO0_3). CLKOUT — Clockout pin. CT32B0_MAT2 — Match output 2 for 32-bit timer 0. USB_FTOGGLE — USB 1 ms Start-of-Frame signal (LPC1343 only). PIO0_2 — General purpose digital input/output pin. SSEL — Slave select for SSP. CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. © NXP B.V. 2009. All rights reserved. I/O PIO0_1/CLKOUT/ CT32B0_MAT2/ USB_FTOGGLE 4[1] I/O O O O PIO0_2/SSEL/ CT16B0_CAP0 10[1] I/O O I LPC1311_13_42_43_1 Product data sheet Rev. 01 — 11 December 2009 8 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 3. Symbol LPC1313/43 LQFP48 pin description table …continued Pin 14[1] Type I/O Description PIO0_3 — General purpose digital input/output pin. LPC1343 only: A LOW level on this pin during reset starts the ISP command handler, a HIGH level starts the USB device enumeration. USB_VBUS — Monitors the presence of USB bus power (LPC1343 only). PIO0_4 — General purpose digital input/output pin. SCL — I2C-bus clock input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. PIO0_5 — General purpose digital input/output pin. SDA — I2C-bus data input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. PIO0_6 — General purpose digital input/output pin. USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under software control. Used with the SoftConnect USB feature (LPC1343 only). SCK — Serial clock for SSP. PIO0_7 — General purpose digital input/output pin (high-current output driver). CTS — Clear To Send input for UART. PIO0_8 — General purpose digital input/output pin. MISO — Master In Slave Out for SSP. CT16B0_MAT0 — Match output 0 for 16-bit timer 0. PIO0_9 — General purpose digital input/output pin. MOSI — Master Out Slave In for SSP. CT16B0_MAT1 — Match output 1 for 16-bit timer 0. SWO — Serial wire trace output. SWCLK — Serial wire clock and test clock TCK for JTAG interface. PIO0_10 — General purpose digital input/output pin. SCK — Serial clock for SSP. CT16B0_MAT2 — Match output 2 for 16-bit timer 0. TDI — Test Data In for JTAG interface. PIO0_11 — General purpose digital input/output pin. AD0 — A/D converter, input 0. CT32B0_MAT3 — Match output 3 for 32-bit timer 0. TMS — Test Mode Select for JTAG interface. PIO1_0 — General purpose digital input/output pin. AD1 — A/D converter, input 1. CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. TDO — Test Data Out for JTAG interface. PIO1_1 — General purpose digital input/output pin. AD2 — A/D converter, input 2. CT32B1_MAT0 — Match output 0 for 32-bit timer 1. PIO0_3/USB_VBUS I PIO0_4/SCL 15[2] I/O I/O PIO0_5/SDA 16[2] I/O I/O PIO0_6/USB_CONNECT/ 22[1] SCK I/O O I/O PIO0_7/CTS 23[1] I/O I PIO0_8/MISO/ CT16B0_MAT0 27[1] I/O I/O O PIO0_9/MOSI/ CT16B0_MAT1/ SWO 28[1] I/O I/O O O SWCLK/PIO0_10/ SCK/CT16B0_MAT2 29[1] I I/O O O TDI/PIO0_11/ AD0/CT32B0_MAT3 32[3] I I/O I O TMS/PIO1_0/ AD1/CT32B1_CAP0 33[3] I I/O I I TDO/PIO1_1/ AD2/CT32B1_MAT0 34[3] O I/O I O LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 9 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 3. Symbol LPC1313/43 LQFP48 pin description table …continued Pin 35[3] Type I I/O I O Description TRST — Test Reset for JTAG interface. PIO1_2 — General purpose digital input/output pin. AD3 — A/D converter, input 3. CT32B1_MAT1 — Match output 1 for 32-bit timer 1. SWDIO — Serial wire debug input/output. PIO1_3 — General purpose digital input/output pin. AD4 — A/D converter, input 4. CT32B1_MAT2 — Match output 2 for 32-bit timer 1. PIO1_4 — General purpose digital input/output pin. AD5 — A/D converter, input 5. CT32B1_MAT3 — Match output 3 for 32-bit timer 1. WAKEUP — Deep power-down mode wake-up pin. This pin must be pulled HIGH externally to enter Deep power-down mode and pulled LOW to exit Deep power-down mode. PIO1_5 — General purpose digital input/output pin. RTS — Request To Send output for UART. CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. PIO1_6 — General purpose digital input/output pin. RXD — Receiver input for UART. CT32B0_MAT0 — Match output 0 for 32-bit timer 0. PIO1_7 — General purpose digital input/output pin. TXD — Transmitter output for UART. CT32B0_MAT1 — Match output 1 for 32-bit timer 0. PIO1_8 — General purpose digital input/output pin. CT16B1_CAP0 — Capture input 0 for 16-bit timer 1. PIO1_9 — General purpose digital input/output pin. CT16B1_MAT0 — Match output 0 for 16-bit timer 1. PIO1_10 — General purpose digital input/output pin. AD6 — A/D converter, input 6. CT16B1_MAT1 — Match output 1 for 16-bit timer 1. PIO1_11 — General purpose digital input/output pin. AD7 — A/D converter, input 7. PIO2_0 — General purpose digital input/output pin. DTR — Data Terminal Ready output for UART. PIO2_1 — General purpose digital input/output pin. DSR — Data Set Ready input for UART. PIO2_2 — General purpose digital input/output pin. DCD — Data Carrier Detect input for UART. PIO2_3 — General purpose digital input/output pin. RI — Ring Indicator input for UART. PIO2_4 — General purpose digital input/output pin (LPC1343 only). © NXP B.V. 2009. All rights reserved. TRST/PIO1_2/ AD3/CT32B1_MAT1 SWDIO/PIO1_3/AD4/ CT32B1_MAT2 39[3] I/O I/O I O PIO1_4/AD5/ CT32B1_MAT3/WAKEUP 40[3] I/O I O I PIO1_5/RTS/ CT32B0_CAP0 45[1] I/O O I PIO1_6/RXD/ CT32B0_MAT0 46[1] I/O I O PIO1_7/TXD/ CT32B0_MAT1 47[1] I/O O O PIO1_8/CT16B1_CAP0 PIO1_9/CT16B1_MAT0 PIO1_10/AD6/ CT16B1_MAT1 9[1] 17[1] 30[3] I/O I I/O O I/O I O PIO1_11/AD7 PIO2_0/DTR PIO2_1/DSR PIO2_2/DCD PIO2_3/RI PIO2_4 LPC1311_13_42_43_1 42[3] 2[1] 13[1] 26[1] 38[1] 18[1] I/O I I/O O I/O I I/O I I/O I I/O Product data sheet Rev. 01 — 11 December 2009 10 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 3. Symbol PIO2_4 PIO2_5 PIO2_5 PIO2_6 PIO2_7 PIO2_8 PIO2_9 PIO2_10 LPC1313/43 LQFP48 pin description table …continued Pin 19[1] 21[1] 20[1] 1[1] 11[1] 12[1] 24[1] 25[1] 31[1] 36[1] 37[1] 43[1] 48[1] 18[1] 21[1] 19[4] 20[4] 8[5] 44[5] 5 6[6] 7[6] 41 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I I O I Description PIO2_4 — General purpose digital input/output pin (LPC1313 only). PIO2_5 — General purpose digital input/output pin (LPC1343 only). PIO2_5 — General purpose digital input/output pin (LPC1313 only). PIO2_6 — General purpose digital input/output pin. PIO2_7 — General purpose digital input/output pin. PIO2_8 — General purpose digital input/output pin. PIO2_9 — General purpose digital input/output pin. PIO2_10 — General purpose digital input/output pin. PIO2_11 — General purpose digital input/output pin. SCK — Serial clock for SSP. PIO3_0 — General purpose digital input/output pin. PIO3_1 — General purpose digital input/output pin. PIO3_2 — General purpose digital input/output pin. PIO3_3 — General purpose digital input/output pin. PIO3_4 — General purpose digital input/output pin (LPC1313 only). PIO3_5 — General purpose digital input/output pin (LPC1313 only). USB_DM — USB bidirectional D− line (LPC1343 only). USB_DP — USB bidirectional D+ line (LPC1343 only). 3.3 V input/output supply voltage. 3.3 V supply voltage to the internal regulator and the ADC. Also used as the ADC reference voltage. Ground. Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.8 V. Output from the oscillator amplifier. Ground. PIO2_11/SCK PIO3_0 PIO3_1 PIO3_2 PIO3_3 PIO3_4 PIO3_5 USB_DM USB_DP VDD(IO) VDD(3V3) VSSIO XTALIN XTALOUT VSS [1] [2] [3] [4] [5] [6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis. I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus. 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input. When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant. Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). Tie together VDD(3V3) and VDD(IO) externally. If separate supplies are used for VDD(3V3) and VDD(IO), ensure that the voltage difference between both supplies is smaller than or equal to 0.5 V. When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 11 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 4. Symbol LPC1311/13/42/43 HVQFN33 pin description table Pin 2 Type I Description RESET — External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. PIO0_0 — General purpose digital input/output pin. PIO0_1 — General purpose digital input/output pin. A LOW level on this pin during reset starts the ISP command handler or the USB device enumeration (USB on LPC1342/43 only, see description of PIO0_3). CLKOUT — Clock out pin. CT32B0_MAT2 — Match output 2 for 32-bit timer 0. USB_FTOGGLE — USB 1 ms Start-of-Frame signal (LPC1342/43 only). PIO0_2 — General purpose digital input/output pin. SSEL — Slave select for SSP. CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. PIO0_3 — General purpose digital input/output pin. LPC1342/43 only: A LOW level on this pin during reset starts the ISP command handler, a HIGH level starts the USB device enumeration. USB_VBUS — Monitors the presence of USB bus power (LPC1342/43 only). PIO0_4 — General purpose digital input/output pin. SCL — I2C-bus clock input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. PIO0_5 — General purpose digital input/output pin. SDA — I2C-bus data input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. PIO0_6 — General purpose digital input/output pin. USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under software control. Used with the SoftConnect USB feature (LPC1342/43 only). SCK — Serial clock for SSP. PIO0_7 — General purpose digital input/output pin (high-current output driver). CTS — Clear To Send input for UART. PIO0_8 — General purpose digital input/output pin. MISO — Master In Slave Out for SSP. CT16B0_MAT0 — Match output 0 for 16-bit timer 0. PIO0_9 — General purpose digital input/output pin. MOSI — Master Out Slave In for SSP. CT16B0_MAT1 — Match output 1 for 16-bit timer 0. SWO — Serial wire trace output. SWCLK — Serial wire clock and test clock TCK for JTAG interface. PIO0_10 — General purpose digital input/output pin. SCK — Serial clock for SSP. CT16B0_MAT2 — Match output 2 for 16-bit timer 0. RESET/PIO0_0 I/O PIO0_1/CLKOUT/ CT32B0_MAT2/ USB_FTOGGLE 3[1] I/O O O O PIO0_2/SSEL/ CT16B0_CAP0 8[1] I/O O I PIO0_3/USB_VBUS 9[1] I/O I PIO0_4/SCL 10[2] I/O I/O PIO0_5/SDA 11[2] I/O I/O PIO0_6/USB_CONNECT/ SCK 15[1] I/O O I/O PIO0_7/CTS 16[1] I/O I PIO0_8/MISO/ CT16B0_MAT0 17[1] I/O I/O O PIO0_9/MOSI/ CT16B0_MAT1/ SWO 18[1] I/O I/O O O SWCLK/PIO0_10/SCK/ CT16B0_MAT2 19[1] I I/O O O LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 12 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 4. Symbol LPC1311/13/42/43 HVQFN33 pin description table …continued Pin 21[3] Type I I/O I O Description TDI — Test Data In for JTAG interface. PIO0_11 — General purpose digital input/output pin. AD0 — A/D converter, input 0. CT32B0_MAT3 — Match output 3 for 32-bit timer 0. TMS — Test Mode Select for JTAG interface. PIO1_0 — General purpose digital input/output pin. AD1 — A/D converter, input 1. CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. TDO — Test Data Out for JTAG interface. PIO1_1 — General purpose digital input/output pin. AD2 — A/D converter, input 2. CT32B1_MAT0 — Match output 0 for 32-bit timer 1. TRST — Test Reset for JTAG interface. PIO1_2 — General purpose digital input/output pin. AD3 — A/D converter, input 3. CT32B1_MAT1 — Match output 1 for 32-bit timer 1. SWDIO — Serial wire debug input/output. PIO1_3 — General purpose digital input/output pin. AD4 — A/D converter, input 4. CT32B1_MAT2 — Match output 2 for 32-bit timer 1. PIO1_4 — General purpose digital input/output pin. AD5 — A/D converter, input 5. CT32B1_MAT3 — Match output 3 for 32-bit timer 1. WAKEUP — Deep power-down mode wake-up pin. This pin must be pulled HIGH externally to enter Deep power-down mode and pulled LOW to exit Deep power-down mode. PIO1_5 — General purpose digital input/output pin. RTS — Request To Send output for UART. CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. PIO1_6 — General purpose digital input/output pin. RXD — Receiver input for UART. CT32B0_MAT0 — Match output 0 for 32-bit timer 0. PIO1_7 — General purpose digital input/output pin. TXD — Transmitter output for UART. CT32B0_MAT1 — Match output 1 for 32-bit timer 0. PIO1_8 — General purpose digital input/output pin. CT16B1_CAP0 — Capture input 0 for 16-bit timer 1. PIO1_9 — General purpose digital input/output pin. CT16B1_MAT0 — Match output 0 for 16-bit timer 1. TDI/PIO0_11/AD0/ CT32B0_MAT3 TMS/PIO1_0/AD1/ CT32B1_CAP0 22[3] I I/O I I TDO/PIO1_1/AD2/ CT32B1_MAT0 23[3] O I/O I O TRST/PIO1_2/AD3/ CT32B1_MAT1 24[3] I I/O I O SWDIO/PIO1_3/AD4/ CT32B1_MAT2 25[3] I/O I/O I O PIO1_4/AD5/ CT32B1_MAT3/WAKEUP 26[3] I/O I O I PIO1_5/RTS/ CT32B0_CAP0 30[1] I/O O I PIO1_6/RXD/ CT32B0_MAT0 31[1] I/O I O PIO1_7/TXD/ CT32B0_MAT1 32[1] I/O O O PIO1_8/CT16B1_CAP0 PIO1_9/CT16B1_MAT0 7[1] 12[1] I/O I I/O O LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 13 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 4. Symbol LPC1311/13/42/43 HVQFN33 pin description table …continued Pin 20[3] Type I/O I O 27[3] 1[1] 28[1] 13[1] 14[1] 13[4] 14[4] 6[5] 29[5] 4[6] 5[6] 33 I/O I I/O O I/O I/O I/O I/O I/O I I I O Description PIO1_10 — General purpose digital input/output pin. AD6 — A/D converter, input 6. CT16B1_MAT1 — Match output 1 for 16-bit timer 1. PIO1_11 — General purpose digital input/output pin. AD7 — A/D converter, input 7. PIO2_0 — General purpose digital input/output pin. DTR — Data Terminal Ready output for UART. PIO3_2 — General purpose digital input/output pin. PIO3_4 — General purpose digital input/output pin (LPC1311/13 only). PIO3_5 — General purpose digital input/output pin (LPC1311/13 only). USB_DM — USB bidirectional D− line (LPC1342/43 only). USB_DP — USB bidirectional D+ line (LPC1342/43 only). 3.3 V input/output supply voltage. 3.3 V supply voltage to the internal DC-DC converter and the ADC. Also used as the ADC reference voltage. Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.8 V. Output from the oscillator amplifier. Thermal pad. Connect to ground. PIO1_10/AD6/ CT16B1_MAT1 PIO1_11/AD7 PIO2_0/DTR PIO3_2 PIO3_4 PIO3_5 USB_DM USB_DP VDD(IO) VDD(3V3) XTALIN XTALOUT VSS [1] [2] [3] [4] [5] [6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis. I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus. 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input. When configured as a ADC input, digital section of the pad is disabled, and the pin is not 5 V tolerant. Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). Tie together VDD(3V3) and VDD(IO) externally. If separate supplies are used for VDD(3V3) and VDD(IO), ensure that the voltage difference between both supplies is smaller than or equal to 0.5 V. When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating. 7. Functional description 7.1 Architectural overview The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the system bus and are used similarly to TCM interfaces: one bus dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for simultaneous operations if concurrent operations target different devices. 7.2 ARM Cortex-M3 processor The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. The ARM Cortex-M3 offers many new features, including a Thumb-2 instruction set, low interrupt latency, hardware divide, LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 14 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller interruptible/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller, and multiple core buses capable of simultaneous accesses. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical Reference Manual which is available on the official ARM website. 7.3 On-chip flash program memory The LPC1311/13/42/43 contain 32 kB (LPC1313 and LPC1343), 16 kB (LPC1342), or 8 kB (LPC1311) of on-chip flash memory. 7.4 On-chip SRAM The LPC1311/13/42/43 contain a total of 8 kB (LPC1343 and LPC1313) or 4 kB (LPC1342 and LPC1311) on-chip static RAM memory. 7.5 Memory map The LPC134x incorporates several distinct memory regions, shown in the following figures. Figure 6 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB peripheral area is 2 MB in size and is divided to allow for up to 128 peripherals. The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals. Each peripheral of either type is allocated 16 kB of space. This allows simplifying the address decoding for each peripheral. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 15 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 4 GB LPC1311/13/42/43 0xFFFF FFFF AHB peripherals 0x5020 0000 127- 4 reserved reserved 0x5004 0000 3 0x5020 0000 AHB peripherals 0x5000 0000 2 1 0 reserved APB peripherals 0x4008 0000 GPIO PIO3 GPIO PIO2 GPIO PIO1 GPIO PIO0 0x5003 0000 0x5002 0000 0x5001 0000 0x5000 0000 0x4008 0000 1 GB APB peripherals reserved 0x2400 0000 AHB SRAM bit-band alias addressing 0x2200 0000 0x4000 0000 18 17 16 15 14 0x2000 0000 31 - 19 reserved 0x4004 C000 system control IOCONFIG SSP reserved PMU 10 - 13 reserved 0x4004 8000 0x4004 4000 0x4004 0000 0x4003 C000 0x4003 8000 reserved 0.5 GB reserved 0x1FFF 4000 16 kB boot ROM 0x1FFF 0000 0x4002 8000 9 8 7 reserved USB (LPC1342/43 only) ADC 32-bit counter/timer 1 32-bit counter/timer 0 16-bit counter/timer 1 16-bit counter/timer 0 UART WDT I2C-bus 0x4002 4000 0x4002 0000 0x4001 C000 0x4001 8000 0x4001 4000 0x4001 0000 0x4000 C000 0x4000 8000 0x4000 4000 0x4000 0000 reserved 0x1000 2000 I-code/D-code memory space 8 kB SRAM (LPC1313/1343) 4 kB SRAM (LPC1311/1342) 0x1000 1000 0x1000 0000 6 5 4 3 2 1 0 0x0000 8000 reserved 32 kB on-chip flash (LPC1313/43) 16 kB on-chip flash (LPC1342) 0 GB 8 kB on-chip flash (LPC1311) 0x0000 4000 0x0000 2000 0x0000 0000 + 512 byte active interrupt vectors 0x0000 0200 0x0000 0000 002aae723 Fig 6. LPC1311/13/42/43 memory map 7.6 Nested Vectored Interrupt Controller (NVIC) The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.6.1 Features • Controls system exceptions and peripheral interrupts. • On the LPC1311/13/42/43, the NVIC supports 16 vectored interrupts. In addition, up to 40 of the individual GPIO inputs are NVIC-vector capable. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 16 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller • 8 programmable interrupt priority levels, with hardware priority level masking • Relocatable vector table. • Software interrupt generation. 7.6.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any GPIO pin (total of up to 42 pins) regardless of the selected function, can be programmed to generate an interrupt on a level, or rising edge or falling edge, or both. 7.7 IOCONFIG block The IOCONFIG block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 7.8 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC1311/13/42/43 use accelerated GPIO functions: • GPIO registers are a dedicated AHB peripheral and are accessed through the AHB so that the fastest possible I/O timing can be achieved. • Entire port value can be written in one instruction. Additionally, any GPIO pin (total of up to 42 pins) providing a digital function can be programmed to generate an interrupt on a level, a rising or falling edge, or both. 7.8.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs with pull-up resistors enabled after reset. • Pull-up/pull-down resistor configuration can be programmed through the IOCONFIG block for each GPIO pin. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 17 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 7.9 USB interface (LPC1342/43 only) The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot-plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. The LPC1342/43 USB interface is a device controller with on-chip PHY for device functions. 7.9.1 Full-speed USB device controller The device controller enables 12 Mbit/s data exchange with a USB Host controller. It consists of a register interface, serial interface engine, and endpoint buffer memory. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. 7.9.1.1 Features • Fully compliant with USB 2.0 specification (full speed). • Supports 10 physical (5 logical) endpoints with up to 64 bytes buffer RAM per endpoint (see Table 5). • Supports Control, Bulk, Isochronous, and Interrupt endpoints. • Supports SoftConnect feature. • Double buffer implementation for Bulk and Isochronous endpoints. Table 5. Logical endpoint 0 0 1 1 2 2 3 3 4 4 USB device endpoint configuration Physical endpoint 0 1 2 3 4 5 6 7 8 9 Endpoint type Control Control Interrupt/Bulk Interrupt/Bulk Interrupt/Bulk Interrupt/Bulk Interrupt/Bulk Interrupt/Bulk Isochronous Isochronous Direction out in out in out in out in out in Packet size (byte) 64 64 64 64 64 64 64 64 512 512 Double buffer no no no no no no yes yes yes yes 7.10 UART The LPC1311/13/42/43 contains one UART. Support for RS-485/9-bit mode allows both software address detection and automatic address detection using 9-bit mode. The UART includes a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 18 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 7.10.1 Features • • • • 16-byte receive and transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. mechanism that enables software flow control implementation. • Fractional divider for baud rate control, auto baud capabilities and FIFO control • Support for RS-485/9-bit mode. • Support for modem control. 7.11 SSP serial I/O controller The LPC1311/13/42/43 contain one SSP controller. The SSP controller is capable of operation on a SSP, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.11.1 Features • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • • • • Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame 7.12 I2C-bus serial I/O controller The LPC1311/13/42/43 contain one I2C-bus controller. The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line (SCL) and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 7.12.1 Features • The I2C-bus interface is a standard I2C-bus compliant interface with open-drain pins. The I2C-bus interface also supports Fast-mode Plus with bit rates up to 1 Mbit/s. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 19 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • The I2C-bus controller supports multiple address recognition and a bus monitor mode. 7.13 10-bit ADC The LPC1311/13/42/43 contains one ADC. It is a single 10-bit successive approximation ADC with eight channels. 7.13.1 Features • • • • • • • • 10-bit successive approximation ADC. Input multiplexing among 8 pins. Power-down mode. Measurement range 0 V to VDD(3V3). 10-bit conversion time ≥ 2.44 µs. Burst conversion mode for single or multiple inputs. Optional conversion on transition of input pin or timer match signal. Individual result registers for each ADC channel to reduce interrupt overhead. 7.14 General purpose external event counters/timers The LPC1311/13/42/43 includes two 32-bit counter/timers and two 16-bit counter/timers. The counter/timer is designed to count cycles of the system derived clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. Each counter/timer also includes one capture input to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.14.1 Features • A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler. • Counter or timer operation. • One capture channel per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four match registers per timer that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 20 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 7.15 System tick timer The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception, normally set to a 10 ms interval. 7.16 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 7.16.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect/incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 32-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in multiples of Tcy(WDCLK) × 4. (IRC), the watchdog oscillator, or the main clock. This gives a wide range of potential timing choices of watchdog operation under different power reduction conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring for increased reliability. • The Watchdog Clock (WDCLK) source can be selected from the Internal RC oscillator 7.17 Clocking and power control 7.17.1 Crystal oscillators The LPC1311/13/42/43 include three independent oscillators. These are the system oscillator, the Internal RC oscillator (IRC), and the watchdog oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Following reset, the LPC1311/13/42/43 will operate from the internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. See Figure 7 for an overview of the LPC1311/13/42/43 clock generation. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 21 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller SYSTEM CLOCK DIVIDER system clock AHB clock 0 (system) AHB clock 1 (ROM) AHBCLKCTRL (AHB clock enable) 14 AHB clocks 2 to 15 (memories and peripherals) AHB clock 16 (IOCONFIG) AHBCLKCTRL AHBCLKCTRL SSP PERIPHERAL CLOCK DIVIDER main clock UART PERIPHERAL CLOCK DIVIDER ARM TRACE CLOCK DIVIDER SYSTICK TIMER CLOCK DIVIDER SYSTEM PLL IRC oscillator WDT CLOCK DIVIDER watchdog oscillator WDTUEN (WDT clock update enable) system oscillator USB PLL USB 48 MHz CLOCK DIVIDER WDT UART SSP IRC oscillator watchdog oscillator MAINCLKSEL (main clock select) IRC oscillator system oscillator watchdog oscilllator SYSPLLCLKSEL (system PLL clock select) ARM trace clock SYSTICK timer USB USBPLLCLKSEL (USB clock select) USBUEN (USB clock update enable) IRC oscillator system oscillator watchdog oscillator CLKOUT PIN CLOCK DIVIDER CLKOUT pin CLKOUTUEN (CLKOUT update enable) 002aae859 The USB clock is available on LPC1342/43 only. Fig 7. LPC1311/13/42/43 clocking generation block diagram 7.17.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the system PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 22 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Upon power-up, any chip reset, or wake-up from Deep power-down mode, the LPC1311/13/42/43 use the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.17.1.2 System oscillator The system oscillator can be used as the clock source for the CPU, with or without using the PLL. On the LPC134x, the system oscillator must be used to provide the clock source to USB. The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the system PLL. 7.17.2 System PLL and USB PLL The LPC134x contain a system PLL and a dedicated PLL for generating the 48 MHz USB clock. The LPC131x contain the system PLL only. The system and USB PLLs are identical. The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 µs. 7.17.3 Clock output The LPC1311/13/42/43 features a clock output function that routes the IRC oscillator, the system oscillator, the watchdog oscillator, or the main clock to an output pin. 7.17.4 Wake-up process The LPC1311/13/42/43 begin operation at power-up and when awakened from Deep power-down mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. 7.17.5 Power control The LPC1311/13/42/43 support a variety of power control features. There are three special modes of processor power reduction: Sleep mode, Deep-sleep mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, a register is provided for shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Selected peripherals have their own clock divider which provides even better power control. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 23 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 7.17.5.1 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence but re-enabling the clock to the ARM core. In Sleep mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 7.17.5.2 Deep-sleep mode In Deep-sleep mode, the chip is in Sleep mode, and in addition analog blocks are shut down for increased power savings. The user can configure the Deep-sleep mode to a large extend, selecting any of the oscillators, any of the PLLs, the USB PHY (LPC134x only), BOD, the ADC, and the flash to be shut down or remain powered during Deep-sleep mode. The user can also select which of the oscillators and analog blocks will be powered up after the chip exits from Deep-sleep mode. The GPIO pins (up to 40 pins total) serve as external wake-up pins to a dedicated start logic to wake up the chip from Deep-sleep mode. The timing of the wake-up process from Deep-sleep mode depends on which blocks are selected to be powered down during deep-sleep. For lowest power consumption, the clock source should be switched to IRC before entering Deep-sleep mode, all oscillators and PLLs should be turned off during deep-sleep, and the IRC should be selected as clock source when the chip wakes up from deep-sleep. The IRC can be switched on and off glitch-free and provides a clean clock signal after start-up. If power consumption is not a concern, any of the oscillators and/or PLLs can be left running in Deep-sleep mode to obtain short wake-up times when waking up from deep-sleep. 7.17.5.3 Deep power-down mode In Deep power-down mode, power is shut off to the entire chip with the exception of the WAKEUP pin. The LPC1311/13/42/43 can wake up from Deep power-down mode via the WAKEUP pin. 7.18 System control 7.18.1 Reset Reset has four sources on the LPC1311/13/42/43: the RESET pin, the Watchdog reset, power-on reset (POR), and the Brown-Out Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip reset by any source, once the operating voltage attains a usable level, starts the IRC and initializes the flash controller. When the internal reset is removed, the processor begins executing at address 0, which is initially the reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 24 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 7.18.2 Brownout detection The LPC1311/13/42/43 includes four levels for monitoring the voltage on the VDD(3V3) pin. If this voltage falls below one of the four selected levels, the BOD asserts an interrupt signal to the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. An additional threshold level can be selected to cause a forced reset of the chip. 7.18.3 Code security (Code Read Protection - CRP) This feature of the LPC1311/13/42/43 allows user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of Code Read Protection: 1. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. 2. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. 3. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using PIO0_1 pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be disabled. For details see the LPC13xx user manual. 7.18.4 Boot loader The boot loader controls initial operation after reset and also provides the means to program the flash memory. This could be initial programming of a blank device, erasure and re-programming of a previously programmed device, or programming of the flash memory by the application program in a running system. The boot loader code is executed every time the part is reset or powered up. The loader can either execute the ISP command handler or the user application code, or, on the LPC134x, it can obtain the boot image as an attached MSC device through USB. A LOW level during reset at the PIO0_1 pin is considered an external hardware request to start the ISP command handler or the USB device enumeration. The state of PIO0_3 determines whether the UART or USB interface will be used (LPC134x only). LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 25 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 7.18.5 APB interface The APB peripherals are located on one APB bus. 7.18.6 AHB-Lite The AHB-Lite connects the instruction (I-code) and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the main static RAM, and the boot ROM. 7.18.7 External interrupt inputs All GPIO pins can be level or edge sensitive interrupt inputs. 7.18.8 Memory mapping control The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table to alternate locations in the memory map. This is controlled via the Vector Table Offset Register contained in the NVIC. The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address space. The vector table must be located on a 128 word (512 byte) boundary because the NVIC on the LPC1311/13/42/43 is configured for 128 total interrupts. 7.19 Emulation and debugging Debug functions are integrated into the ARM Cortex-M3. Serial wire debug is supported. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 26 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(3V3) VDD(IO) VI Parameter supply voltage (3.3 V) input/output supply voltage input voltage 5 V tolerant I/O pins; only valid when the VDD(IO) supply voltage is present per supply pin per ground pin −(0.5VDD(IO)) < VI < (1.5VDD(IO)); Tj < 125 °C Tstg Tj(max) Ptot(pack) VESD [1] [5] Conditions core and external rail [2] [2] [3] Min 2.0 2.0 −0.5 Max 3.6 3.6 +5.5 Unit V V V IDD ISS Ilatch supply current ground current I/O latch-up current storage temperature maximum junction temperature total power dissipation (per package) electrostatic discharge voltage [4] [4] −65 - 100 100 100 +150 150 1.5 +5000 mA mA mA °C °C W V based on package heat transfer, not device power consumption human body model; all pins [6] −5000 The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Tie together VDD(3V3) and VDD(IO) externally. If separate supplies are used for VDD(3V3) and VDD(IO), ensure that the voltage difference between both supplies is smaller than or equal to 0.5 V. Including voltage on outputs in 3-state mode. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] [3] [4] [5] [6] LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 27 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 9. Static characteristics Table 7. Static characteristics Tamb = −40 °C to +85 °C, unless otherwise specified. Symbol VDD(3V3) VDD(IO) IDD Parameter supply voltage (3.3 V) input/output supply voltage supply current Active mode; VDD(3V3) = 3.3 V; Tamb = 25 °C; code Conditions [2] [2] Min 2.0 2.0 Typ[1] 3.3 3.3 Max 3.6 3.6 Unit V V while(1){} executed from flash; system clock = 12 MHz system clock = 72 MHz Sleep mode; VDD(3V3) = 3.3 V; Tamb = 25 °C; system clock = 12 MHz Deep-sleep mode; VDD(3V3) = 3.3 V; Tamb = 25 °C Deep power-down mode; VDD(3V3) = 3.3 V; VDD(IO) = 3.3 V; Tamb = 25 °C IDD(IO) I/O supply current Deep power-down mode; VDD(3V3) = 3.3 V; VDD(IO) = 3.3 V; Tamb = 25 °C [7] [3][4][5] [4][5][6] [3][4][5] - 4 17 2 - mA mA mA - 30 220 - µA nA [8] [8][9] - 20 - nA Standard port pins and RESET pin; see Figure 16, Figure 17, Figure 18 and Figure 19 IIL IIH IOZ VI VO VIH VIL Vhys VOH VOL IOH IOL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled OFF-state output current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current IOH = −4 mA IOL = 4 mA VOH = VDD(IO) − 0.4 V VOL = 0.4 V [13] [10][11] [12] - 3 3 3 5.0 VDD(IO) 0.8 0.4 - µA µA µA V V V V V V V mA mA VO = 0 V; VO = VDD(IO); on-chip pull-up/down resistors disabled pin configured to provide a digital function output active 0 0 2.0 0.4 VDD(IO) − 0.4 −4 4 [13] [13] [13] LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 28 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 7. Static characteristics …continued Tamb = −40 °C to +85 °C, unless otherwise specified. Symbol IOHS IOLS Ipd Ipu Parameter Conditions [14] Min 10 −15 0 [10][11] [12] Typ[1] 50 −50 0 50 −50 0 Max −45 50 150 −85 0 3 3 3 5.0 VDD(IO) 0.8 0.4 150 −85 0 - Unit mA mA µA µA µA µA µA µA V V V V V V V mA mA µA µA µA V HIGH-level short-circuit VOH = 0 V output current LOW-level short-circuit output current pull-down current pull-up current VOL = VDD(IO) VI = 5 V VI = 0 V VDD(IO) < VI < 5 V [14] High-drive output pin (PIO0_7); see Figure 14 and Figure 16 IIL IIH IOZ VI VO VIH VIL Vhys VOH VOL IOH IOL Ipd Ipu I2C-bus VIH VIL Vhys VOL ILI LOW-level input current VI = 0 V; on-chip pull-up resistor disabled HIGH-level input current VI = VDD(IO); on-chip pull-down resistor disabled OFF-state output current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current pull-down current pull-up current IOH = −20 mA IOL = 4 mA VOH = VDD(IO) − 0.4 V; VDD(IO) ≥ 2.5 V VOL = 0.4 V VI = 5 V VI = 0 V VDD(IO) < VI < 5 V pins (PIO0_4 and PIO0_5); see Figure 15 HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 20 mA VI = VDD(IO) VI = 5 V Oscillator pins Vi(xtal) Vo(xtal) crystal input voltage crystal output voltage Rev. 01 — 11 December 2009 [13] [13] VO = 0 V; VO = VDD(IO); on-chip pull-up/down resistors disabled pin configured to provide a digital function output active 0 0 2.0 0.4 VDD(IO) − 0.4 20 4 10 −15 0 [13] [13] [13] 0.7VDD(IO) 0 0 2 10 1.8 1.8 0.3VDD(IO) V V V µA µA V V 29 of 53 0.5VDD(IO) 0.4 4 22 1.95 1.95 [15] LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 7. Static characteristics …continued Tamb = −40 °C to +85 °C, unless otherwise specified. Symbol IOZ VBUS VDI VCM Vth(rs)se Parameter OFF-state output current bus supply voltage differential input sensitivity voltage differential common mode voltage range single-ended receiver switching threshold voltage LOW-level output voltage HIGH-level output voltage for low-/full-speed; RL of 1.5 kΩ to 3.6 V driven; for low-/full-speed; RL of 15 kΩ to GND [16] Conditions 0 V < VI < 3.3 V Min - Typ[1] - Max ±10 5.25 2.5 2.0 Unit µA V V V V USB pins (LPC1342/43 only) |(D+) − (D−)| includes VDI range 0.2 0.8 0.8 VOL VOH Ctrans ZDRV 2.8 36 - 0.18 3.5 20 44.1 V V pF Ω transceiver capacitance pin to GND with 33 Ω series resistor; steady driver output state drive impedance for driver which is not high-speed capable [1] [2] [3] [4] [5] [6] [7] [8] [9] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. Tie together VDD(3V3) and VDD(IO) externally. If separate supplies are used for VDD(3V3) and VDD(IO), ensure that the voltage difference between both supplies is smaller than or equal to 0.5 V. IRC enabled; system oscillator disabled; system PLL disabled. BOD disabled. All peripherals disabled in the AHBCLKCTRL register. Peripheral clocks to UART, SSP, trace clock, and SysTick timer disabled in the syscon block. IRC disabled; system oscillator enabled; system PLL enabled. All oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0xFFFF FFFF WAKEUP pin pulled HIGH externally. For LPC134x: USB_DP and USB_DM pulled LOW externally. [10] Including voltage on outputs in 3-state mode. [11] VDD(3V3) and VDD(IO) supply voltages must be present. [12] 3-state outputs go into 3-state mode when VDD(IO) is grounded. [13] Accounts for 100 mV voltage drop in all supply lines. [14] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [15] To VSS. [16] Includes external resistors of 33 Ω ± 1 % on USB_DP and USB_DM. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 30 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 8. ADC static characteristics Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz, VDD(3V3) = 2.5 V to 3.6 V. Symbol VIA Cia ED EL(adj) EO EG ET [1] [2] [3] [4] [5] [6] Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error Conditions Min 0 [1][2] [3] [4] [5] [6] Typ - Max VDD(3V3) 1 ±1 ± 1.5 ± 3.5 0.6 ±4 Unit V pF LSB LSB LSB % LSB - The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 8. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 8. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 8. The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 8. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 31 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller offset error EO 1023 gain error EG 1022 1021 1020 1019 1018 (2) 7 code out 6 (1) 5 (5) 4 (4) 3 (3) 2 1 1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024 0 1 offset error EO 2 3 4 5 6 7 VIA (LSBideal) 1 LSB = VDD(3V3) − VSS 1024 002aae787 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 8. ADC characteristics LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 32 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 9.1 BOD static characteristics Table 9. BOD static characteristics[1] Tamb = 25 °C. Symbol Vth Parameter threshold voltage Conditions interrupt level 0 assertion de-assertion interrupt level 1 assertion de-assertion interrupt level 2 assertion de-assertion interrupt level 3 assertion de-assertion reset level 0 assertion de-assertion [1] Min - Typ 1.69 1.84 2.29 2.44 2.59 2.74 2.87 2.98 1.49 1.64 Max - Unit V V V V V V V V V V Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see LPC13xx user manual. 9.2 Power consumption 18 IDD (mA) 15 72 MHz 002aae993 12 48 MHz 9 36 MHz 24 MHz 6 12 MHz 3 2.0 2.4 2.8 3.2 VDD(3V3) (V) 3.6 Conditions: Tamb = 25 °C; active mode entered executing code while(1){} from flash; VDD(3V3) = 3.3 V; internal pull-up resistors disabled; system oscillator and system PLL enabled; IRC, BOD disabled; all peripherals disabled in the AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks disabled. Fig 9. Typical supply current versus regulator supply voltage VDD(3V3) in active mode LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 33 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 18 IDD (mA) 15 72 MHz 002aae994 12 48 MHz 9 36 MHz 24 MHz 6 12 MHz 3 −40 −15 10 35 60 85 temperature (°C) Conditions: Active mode entered executing code while(1){} from flash; VDD(3V3) = 3.3 V; internal pull-up resistors disabled; system oscillator and system PLL enabled; IRC, BOD disabled; all peripherals disabled in the AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks disabled. Fig 10. Typical supply current versus temperature in active mode 10 IDD (mA) 8 48 MHz 6 36 MHz 4 24 MHz 12 MHz 2 72 MHz 002aae995 0 −40 −15 10 35 60 85 temperature (°C) Conditions: VDD(3V3) = 3.3 V; Sleep mode entered from flash; internal pull-up resistors disabled; system oscillator and system PLL enabled; IRC, BOD disabled; all peripherals disabled in the AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks disabled. Fig 11. Typical supply current versus temperature in Sleep mode LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 34 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 80 IDD (µA) 60 VDD(3V3) = 3.6 V 3.3 V 2.0 V 002aae998 40 20 0 −40 −15 10 35 60 85 temperature (°C) Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0xFFFF FFFF. Fig 12. Typical supply current versus temperature in Deep-sleep mode (analog blocks disabled) 1000 IDD (nA) 800 002aae996 600 VDD(3V3) = 3.6 V 3.3 V 2.0 V 400 200 0 −40 −15 10 35 60 85 temperature (°C) Fig 13. Typical supply current versus temperature in Deep power-down mode LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 35 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Table 10. Power consumption in Deep-sleep mode for individual analog blocks Tamb = 25 °C; VDD(3V3) = 3.3 V. Analog block enabled in PDSLEEPCFG register USB PLL System PLL System oscillator BOD IRC IRC output [1] [2] Conditions [2] [2] [2] [2] [2] [2] Typical IDD[1] 39 µA 39 µA 197 µA 74 µA 36 µA 27 µA Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. All other blocks disabled in the PDSLEEPCFG register. 9.3 Electrical pin characteristics 3.6 VOH (V) 3.2 T = 85 °C 25 °C −40 °C 002aae990 2.8 2.4 2 0 10 20 30 40 50 IOH (mA) 60 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; on pin PIO0_7. Fig 14. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level output current IOH. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 36 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 60 IOL (mA) 40 T = 85 °C 25 °C −40 °C 002aaf019 20 0 0 0.2 0.4 VOL (V) 0.6 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; on pins PIO0_4 and PIO0_5. Fig 15. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus LOW-level output voltage VOL 15 IOL (mA) 10 T = 85 °C 25 °C −40 °C 002aae991 5 0 0 0.2 0.4 VOL (V) 0.6 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; standard port pins and PIO0_7. Fig 16. Typical LOW-level output current IOL versus LOW-level output voltage VOL LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 37 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 3.6 VOH (V) 3.2 002aae992 T = 85 °C 25 °C −40 °C 2.8 2.4 2 0 8 16 IOH (mA) 24 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; standard port pins. Fig 17. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH 10 Ipu (µA) −10 002aae988 −30 T = 85 °C 25 °C −40 °C −50 −70 0 1 2 3 4 VI (V) 5 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; standard port pins. Fig 18. Typical pull-up current Ipu versus input voltage Vi LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 38 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 80 Ipd (µA) 60 T = 85 °C 25 °C −40 °C 002aae989 40 20 0 0 1 2 3 4 VI (V) 5 Conditions: VDD(3V3) = VDD(IO) = 3.3 V; standard port pins. Fig 19. Typical pull-down current Ipd versus input voltage Vi LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 39 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 10. Dynamic characteristics 10.1 Flash memory Table 11. Flash characteristics Tamb = −40 °C to +85 °C, unless otherwise specified. Symbol Nendu tret Parameter endurance retention time powered unpowered [1] Number of program/erase cycles. Conditions [1] Min 10000 10 20 Typ - Max - Unit cycles years years 10.2 External clock Table 12. Dynamic characteristic: external clock Tamb = −40 °C to +85 °C; VDD(3V3) over specified ranges.[1] Symbol fosc Tcy(clk) tCHCX tCLCX tCLCH tCHCL [1] [2] Parameter oscillator frequency clock cycle time clock HIGH time clock LOW time clock rise time clock fall time Conditions Min 1 40 Tcy(clk) × 0.4 Tcy(clk) × 0.4 - Typ[2] - Max 25 1000 5 5 Unit MHz ns ns ns ns ns Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. tCHCL tCLCX Tcy(clk) tCHCX tCLCH 002aaa907 Fig 20. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 40 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 10.3 Internal oscillators Table 13. Dynamic characteristic: internal oscillators Tamb = −40 °C to +85 °C; 2.7 V ≤ VDD(3V3) ≤ 3.6 V[1]. Symbol fosc(RC) [1] [2] Parameter internal RC oscillator frequency Conditions - Min 11.88 Typ[2] 12 Max 12.12 Unit MHz Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. 12.15 f (MHz) 12.05 VDD(3V3) = 3.6 V 3.3 V 3.0 V 2.7 V 2.4 V 2.0 V 002aae987 11.95 11.85 −40 −15 10 35 60 85 temperature (°C) Conditions: Frequency values are typical values. 12 MHz ± 1 % accuracy is guaranteed for 2.7 V ≤ VDD(3V3) ≤ 3.6 V and Tamb = −40 °C to +85 °C. Variations between parts may cause the IRC to fall outside the 12 MHz ± 1 % accuracy specification for voltages below 2.7 V. Fig 21. Internal RC oscillator frequency f versus temperature 10.4 I2C-bus Table 14. Dynamic characteristic: I2C-bus pins (Fast-mode Plus) Tamb = −40 °C to +85 °C; VDD(3V3) = VDD(IO) = 3.3 V.[1][2][3] Symbol fSCL tf tSU;DAT [1] [2] [3] Parameter SCL clock frequency fall time data set-up time Conditions Min 50 Typ - Max 1 45 - Unit MHz ns ns Parameters are valid over operating temperature range unless otherwise specified. Main clock frequency 10 MHz; system clock divider AHBCLKDIV = 0x1; I2C-bus interface configured in master mode. Bus capacitance Cb = 550 pF; external pull-up resistance of 103 Ω. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 41 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller SDA tf SCL P S tSU;DAT 002aae860 Fig 22. I2C-bus pins clock timing 10.5 SSP interface Table 15. Symbol Tcy(PCLK) Tcy(clk) SSP master tDS tDH tv(Q) th(Q) SSP slave tDS tDH tv(Q) th(Q) [1] Dynamic characteristics of SSP pins in SPI mode Parameter PCLK cycle time clock cycle time data set-up time data hold time data output valid time data output hold time data set-up time data hold time data output valid time data output hold time in SPI mode in SPI mode in SPI mode in SPI mode in SPI mode in SPI mode in SPI mode in SPI mode [1] Conditions Min 13.9 27.8 15 0 3 × Tcy(PCLK) + 4 - Max Tcy(clk) 0 10 0 3 × Tcy(PCLK) + 11 2 × Tcy(PCLK) + 5 Unit ns ns ns ns ns ns ns ns ns ns [2] [2] [2] [2] [3][4] [3][4] [3][4] [3][4] Tcy(clk) = (SSPCLKDIV × (1 + SCR) × CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the SSP SCR parameter (specified in the SSP0CR0 register), and the SSP CPSDVSR parameter (specified in the SSP clock prescale register). Tamb = −40 °C to 85 °C; VDD(3V3) = 2.0 V to 3.6 V; VDD(IO) = 2.0 V to 3.6 V. Tcy(clk) = 12 × Tcy(PCLK). Tamb = 25 °C; VDD(3V3) = 3.3 V; VDD(IO) = 3.3 V. [2] [3] [4] LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 42 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Tcy(clk) tclk(H) tclk(L) SCK (CPOL = 0) SCK (CPOL = 1) tv(Q) MOSI DATA VALID DATA VALID tDS MISO DATA VALID tDH DATA VALID CPHA = 1 th(Q) tv(Q) MOSI DATA VALID DATA VALID tDS MISO DATA VALID tDH DATA VALID th(Q) CPHA = 0 002aae829 Fig 23. SSP master timing in SPI mode LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 43 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Tcy(clk) tclk(H) tclk(L) SCK (CPOL = 0) SCK (CPOL = 1) tDS MOSI DATA VALID tv(Q) MISO DATA VALID DATA VALID tDH DATA VALID th(Q) CPHA = 1 tDS MOSI DATA VALID tv(Q) MISO DATA VALID tDH DATA VALID th(Q) DATA VALID CPHA = 0 002aae830 Fig 24. SSP slave timing in SPI mode LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 44 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 10.6 USB interface (LPC1342/43 only) Table 16. Dynamic characteristics: USB pins (full-speed) CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3), unless otherwise specified. Symbol tr tf tFRFM VCRS tFEOPT tFDEOP tJR1 tJR2 tEOPR1 Parameter rise time fall time differential rise and fall time matching output signal crossover voltage source SE0 interval of EOP source jitter for differential transition to SE0 transition receiver jitter to next transition receiver jitter for paired transitions EOP width at receiver 10 % to 90 % must reject as EOP; see Figure 25 must accept as EOP; see Figure 25 [1] Conditions 10 % to 90 % 10 % to 90 % tr / tf Min 8.5 7.7 1.3 Typ - Max 13.8 13.7 109 2.0 175 +5 +18.5 +9 - Unit ns ns % V ns ns ns ns ns see Figure 25 see Figure 25 160 −2 −18.5 −9 40 tEOPR2 EOP width at receiver [1] 82 - - ns [1] Characterized but not implemented as production test. Guaranteed by design. TPERIOD crossover point differential data lines crossover point extended source EOP width: tFEOPT differential data to SE0/EOP skew n × TPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 25. Differential data-to-EOP transition skew and EOP width LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 45 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 11. Application information 11.1 Suggested USB interface solutions (LPC1342/43 only) VDD(IO) USB_CONNECT LPC134x soft-connect switch R1 1.5 kΩ USB_VBUS USB_DP RS = 33 Ω USB_DM VSSIO 002aae608 RS = 33 Ω USB-B connector Fig 26. LPC1342/43 USB interface on a self-powered device VDD(IO) LPC134x USB_VBUS USB_DP RS = 33 Ω USB_DM RS = 33 Ω VSSIO R1 1.5 kΩ USB-B connector 002aae609 Fig 27. LPC1342/43 USB interface on a bus-powered device 11.2 XTAL input The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV(RMS) is needed. LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 46 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller LPC1xxx XTALIN Ci 100 pF Cg 002aae788 Fig 28. Slave mode operation of the on-chip oscillator 11.3 XTAL Printed-Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. 11.4 Standard I/O pad configuration Figure 29 shows the possible pin modes for standard I/O pins. The pull-up and pull-down resistors (Rpu and Rpd) can be enabled or disabled. The default value for each standard port pin is input with Rpu enabled. For details on pin modes and hysteresis control, see the LPC13xx user manual. VDD(IO) Rpu enable output PIN input Rpd hysteresis control VSS 002aae828 Fig 29. Standard I/O pad configuration LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 47 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 12. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 37 25 24 ZE A e E HE A A2 A1 (A 3) θ Lp L detail X wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 θ 7 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC 136E05 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 30. Package outline SOT313-2 (LQFP48) LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 48 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm D B A terminal 1 index area E A A1 c detail X e1 e 9 L 8 17 e b 16 v w CAB C y1 C C y Eh e2 1 33 24 X terminal 1 index area 32 Dh 25 0 Dimensions Unit mm A(1) A1 b c 0.2 D(1) 7.1 7.0 6.9 Dh 4.85 4.70 4.55 E(1) 7.1 7.0 6.9 Eh e 2.5 scale e1 e2 L 5 mm v 0.1 w y y1 0.1 max 1.00 0.05 0.35 nom 0.85 0.02 0.28 min 0.80 0.00 0.23 0.75 4.85 4.70 0.65 4.55 4.55 0.60 0.45 4.55 0.05 0.08 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version References IEC JEDEC JEITA --European projection hvqfn33_po Issue date 09-03-17 09-03-23 Fig 31. Package outline (HVQFN33) LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 49 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 13. Abbreviations Table 17. Acronym A/D ADC AHB AMBA APB BOD EOP ETM FIFO GPIO I/O LSB MSC PHY PLL SE0 SPI SSI SSP SoF TCM TTL UART USB Abbreviations Description Analog-to-Digital Analog-to-Digital Converter Advanced High-performance Bus Advanced Microcontroller Bus Architecture Advanced Peripheral Bus BrownOut Detection End Of Packet Embedded Trace Macrocell First-In, First-Out General Purpose Input/Output Input/Output Least Significant Bit Mass Storage Class Physical Layer Phase-Locked Loop Single Ended Zero Serial Peripheral Interface Serial Synchronous Interface Synchronous Serial Port Start-of-Frame Tightly-Coupled Memory Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter Universal Serial Bus LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 50 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 14. Revision history Table 18. Revision history Release date 20091211 Data sheet status Product data sheet Change notice Supersedes Document ID LPC1311_13_42_43_1 LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 51 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 52 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller 17. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8 Functional description . . . . . . . . . . . . . . . . . . 14 Architectural overview. . . . . . . . . . . . . . . . . . . 14 ARM Cortex-M3 processor . . . . . . . . . . . . . . . 14 On-chip flash program memory . . . . . . . . . . . 15 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 15 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 15 Nested Vectored Interrupt Controller (NVIC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.6.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 17 7.7 IOCONFIG block. . . . . . . . . . . . . . . . . . . . . . . 17 7.8 Fast general purpose parallel I/O . . . . . . . . . . 17 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.9 USB interface (LPC1342/43 only). . . . . . . . . . 18 7.9.1 Full-speed USB device controller . . . . . . . . . . 18 7.9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.10 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.11 SSP serial I/O controller . . . . . . . . . . . . . . . . . 19 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.12 I2C-bus serial I/O controller . . . . . . . . . . . . . . 19 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.14 General purpose external event counters/timers . . . . . . . . . . . . . . . . . . . . . . . . 20 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.15 System tick timer . . . . . . . . . . . . . . . . . . . . . . 21 7.16 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 21 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.17 Clocking and power control. . . . . . . . . . . . . . . 21 7.17.1 Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 21 7.17.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 22 7.17.1.2 System oscillator. . . . . . . . . . . . . . . . . . . . . . . 23 7.17.2 System PLL and USB PLL . . . . . . . . . . . . . . . 23 7.17.3 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.17.4 Wake-up process . . . . . . . . . . . . . . . . . . . . . . 23 7.17.5 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.17.5.1 7.17.5.2 7.17.5.3 7.18 7.18.1 7.18.2 7.18.3 7.18.4 7.18.5 7.18.6 7.18.7 7.18.8 7.19 8 9 9.1 9.2 9.3 10 10.1 10.2 10.3 10.4 10.5 10.6 11 11.1 11.2 11.3 11.4 12 13 14 15 15.1 15.2 15.3 15.4 16 17 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . Deep power-down mode . . . . . . . . . . . . . . . . System control . . . . . . . . . . . . . . . . . . . . . . . . Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brownout detection . . . . . . . . . . . . . . . . . . . . Code security (Code Read Protection - CRP). . . . . . . . . . . . Boot loader. . . . . . . . . . . . . . . . . . . . . . . . . . . APB interface . . . . . . . . . . . . . . . . . . . . . . . . . AHB-Lite . . . . . . . . . . . . . . . . . . . . . . . . . . . . External interrupt inputs . . . . . . . . . . . . . . . . . Memory mapping control . . . . . . . . . . . . . . . . Emulation and debugging. . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . BOD static characteristics . . . . . . . . . . . . . . . Power consumption . . . . . . . . . . . . . . . . . . . . Electrical pin characteristics. . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Flash memory . . . . . . . . . . . . . . . . . . . . . . . . External clock. . . . . . . . . . . . . . . . . . . . . . . . . Internal oscillators . . . . . . . . . . . . . . . . . . . . . I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . USB interface (LPC1342/43 only) . . . . . . . . . Application information . . . . . . . . . . . . . . . . . Suggested USB interface solutions (LPC1342/43 only) . . . . . . . . . . . . . . . . . . . . . XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . XTAL Printed-Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . Standard I/O pad configuration . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 24 24 24 25 25 25 26 26 26 26 26 27 28 33 33 36 40 40 40 41 41 42 45 46 46 46 47 47 48 50 51 52 52 52 52 52 52 53 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 December 2009 Document identifier: LPC1311_13_42_43_1