LPC2119

LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN Rev. 06 — 10 December 2007 Product data sheet 1. General description The LPC2109/2119/2129 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 64/128/256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. With their compact 64-pin package, low power consumption, various 32-bit timers, 4-channel 10-bit ADC, two advanced CAN channels, PWM channels and 46 fast GPIO lines with up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications, as well as medical systems and fault-tolerant maintenance buses. With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2109/2119/2129 will apply to devices with and without the /00 or /01 suffixes. The /00 or the /01 suffix will be used to differentiate from other devices only when necessary. 2. Features 2.1 Key features brought by LPC2109/2119/2129/01 devices I Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device. They also allow for a port pin to be read at any time regardless of its function. I Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are 5 V tolerant when configured for digital I/O function(s). I UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware. I Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats. I SPI programmable data length and master mode enhancement. I Diversified Code Read Protection (CRP) enables different security levels to be implemented. This feature is available in LPC2109/2119/2129/00 devices as well. I General purpose timers can operate as external event counters. 2.2 Key features common for all devices I 16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package. I 8/16 kB on-chip static RAM. NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers I 64/128/256 kB on-chip flash program memory. 128-bit wide interface/accelerator enables high speed 60 MHz operation. I In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or full chip erase takes 400 ms. I EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute while the foreground task is debugged with the on-chip RealMonitor software. I Embedded Trace Macrocell (ETM) enables non-intrusive high speed real-time tracing of instruction execution. I Two interconnected CAN interfaces (one for LPC2109) with advanced acceptance filters. I Four-channel 10-bit A/D converter with conversion time as low as 2.44 µs. I Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s) and two SPIs. I 60 MHz maximum CPU clock available from programmable on-chip Phase-Locked Loop with settling time of 100 µs. I Vectored Interrupt Controller with configurable priorities and vector addresses. I Two 32-bit timers (with four capture and four compare channels), PWM unit (six outputs), Real-Time Clock (RTC) and watchdog. I Up to forty-six 5 V tolerant general purpose I/O pins. Up to nine edge or level sensitive external interrupt pins available. I On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz. I Two low power modes, Idle and Power-down. I Processor wake-up from Power-down mode via external interrupt. I Individual enable/disable of peripheral functions for power optimization. I Dual power supply: N CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V). N I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads. 3. Ordering information Table 1. Ordering information Package Name LPC2109FBD64/00 LPC2109FBD64/01 LPC2119FBD64 LPC2119FBD64/00 LPC2119FBD64/01 LQFP64 LQFP64 LQFP64 LQFP64 LQFP64 Description plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm Version SOT314-2 SOT314-2 SOT314-2 SOT314-2 SOT314-2 Type number LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 2 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Ordering information …continued Package Name Description plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm Version SOT314-2 SOT314-2 SOT314-2 LQFP64 LQFP64 LQFP64 Table 1. Type number LPC2129FBD64 LPC2129FBD64/00 LPC2129FBD64/01 3.1 Ordering options Table 2. Ordering options Flash memory RAM CAN Fast GPIO/ Temperature range SSP/ Enhanced UART, ADC, Timer no yes no no yes no no yes −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C Type number LPC2109FBD64/00 64 kB LPC2109FBD64/01 64 kB LPC2119FBD64 128 kB LPC2119FBD64/00 128 kB LPC2119FBD64/01 128 kB LPC2129FBD64 256 kB LPC2129FBD64/00 256 kB LPC2129FBD64/01 256 kB 8 kB 8 kB 16 kB 16 kB 16 kB 16 kB 16 kB 16 kB 1 channel 1 channel 2 channels 2 channels 2 channels 2 channels 2 channels 2 channels LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 3 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 4. Block diagram TMS(2) TDI(2) RTCK TRST(2) TCK(2) TDO(2) XTAL2 XTAL1 RESET LPC2109 LPC2119 LPC2129 P0[30:27], P0[25:0] P1[31:16] TEST/DEBUG INTERFACE EMULATION TRACE MODULE PLL system clock SYSTEM FUNCTIONS VECTORED INTERRUPT CONTROLLER ARM7TDMI-S HIGH-SPEED GPI/O(4) 46 PINS TOTAL AHB BRIDGE VDD(3V3) VDD(1V8) VSS ARM7 LOCAL BUS AMBA Advanced High-performance Bus (AHB) INTERNAL SRAM CONTROLLER INTERNAL FLASH CONTROLLER AHB TO APB BRIDGE APB DIVIDER AHB DECODER SCL(1) SDA(1) SCK1(1) SPI1/SSP(4) SERIAL MOSI1(1) MISO1(1) SSEL1(1) SCK0(1) SPI0 SERIAL INTERFACE MOSI0(1) MISO0(1) SSEL0(1) 8/16 kB SRAM 64/128/256 kB FLASH I2C-BUS SERIAL INTERFACE EINT[3:0](1) EXTERNAL INTERRUPTS INTERFACE 4 × CAP0(1) 4 × CAP1(1) 4 × MAT0(1) 4 × MAT1(1) CAPTURE/ COMPARE TIMER 0/TIMER 1 AIN[3:0](1) A/D CONVERTER UART0/UART1 TXD[1:0](1) RXD[1:0](1) P0[30:27], P0[25:0] P1[31:16] GENERAL PURPOSE I/O DSR1(1), CTS1(1), RTS1(1), DTR1(1), DCD1(1), RI1(1) WATCHDOG TIMER PWM[6:1](1) PWM0 SYSTEM CONTROL RD[2:1](1) TD[2:1](1) CAN INTERFACE 1 AND 2 ACCEPTANCE FILTERS(3) REAL-TIME CLOCK 002aad172 (1) Shared with GPIO. (2) When test/debug interface is used, GPIO/other functions sharing these pins are not available. (3) Only 1 for LPC2109. (4) SSP interface and high-speed GPIO are available on LPC2109/01, LPC2119/01, and LPC2129/01 only. Fig 1. Block diagram LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 4 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 5. Pinning information 5.1 Pinning 54 P0[19]/MAT1[2]/MOSI1/CAP1[2] 53 P0[18]/CAP1[3]/MISO1/MAT1[3] 55 P0[20]/MAT1[3]/SSEL1/EINT3 52 P1[30]/TMS 64 P1[27]/TDO 56 P1[29]/TCK 60 P1[28]/TDI 63 VDDA(1V8) 62 XTAL1 58 VSSA(PLL) 57 RESET 51 VDD(3V3) 50 VSS P0[21]/PWM5/CAP1[3] P0[22]/CAP0[0]/MAT0[0] P0[23]/RD2(1) P1[19]/TRACEPKT3 P0[24]/TD2(1) VSS VDDA(3V3) P1[18]/TRACEPKT2 P0[25]/RD1 1 2 3 4 5 6 7 8 9 49 VDD(1V8) 48 P1[20]/TRACESYNC 47 P0[17]/CAP1[2]/SCK1/MAT1[2] 46 P0[16]/EINT0/MAT0[2]/CAP0[2] 45 P0[15]/RI1/EINT2 44 P1[21]/PIPESTAT0 43 VDD(3V3) 42 VSS 41 P0[14]/DCD1/EINT1 40 P1[22]/PIPESTAT1 39 P0[13]/DTR1/MAT1[1] 38 P0[12]/DSR1/MAT1[0] 37 P0[11]/CTS1/CAP1[1] 36 P1[23]/PIPESTAT2 35 P0[10]/RTS1/CAP1[0] 34 P0[9]/RXD1/PWM6/EINT3 33 P0[8]/TXD1/PWM4 P1[24]/TRACECLK 32 002aad173 61 XTAL2 59 VSSA P0[2]/SCL/CAP0[0] 22 LPC2109 LPC2119 LPC2129(2) TD1 10 P0[27]/AIN0/CAP0[1]/MAT0[1] 11 P1[17]/TRACEPKT1 12 P0[28]/AIN1/CAP0[2]/MAT0[2] 13 P0[29]/AIN2/CAP0[3]/MAT0[3] 14 P0[30]/AIN3/EINT3/CAP0[0] 15 P1[16]/TRACEPKT0 16 VDD(1V8) 17 VSS 18 P0[0]/TXD0/PWM1 19 P1[31]/TRST 20 P0[1]/RXD0/PWM3/EINT0 21 VDD(3V3) 23 P1[26]/RTCK 24 VSS 25 P0[3]/SDA/MAT0[0]/EINT1 26 P0[4]/SCK0/CAP0[1] 27 P1[25]/EXTIN0 28 P0[5]/MISO0/MAT0[1] 29 P0[6]/MOSI0/CAP0.2 30 (1) No TD2 and RD2 for LPC2109. (2) Pin configuration is identical for devices with and without /00 and /01 suffixes. Fig 2. Pin configuration LPC2109_2119_2129_6 P0[7]/SSEL0/PWM2/EINT2 31 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 5 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 5.2 Pin description Table 3. Symbol P0[0] to P0[31] Pin description Pin Type Description I/O Port 0 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect Block. Pins 26 and 31 of port 0 are not available. TXD0 — Transmitter output for UART0. PWM1 — Pulse Width Modulator output 1. RXD0 — Receiver input for UART0. PWM3 — Pulse Width Modulator output 3. EINT0 — External interrupt 0 input SCL — I2C-bus clock input/output. Open-drain output (for I2C-bus compliance). CAP0[0] — Capture input for Timer 0, channel 0. SDA — I2C-bus data input/output. Open-drain output (for I2C-bus compliance). MAT0[0] — Match output for Timer 0, channel 0. EINT1 — External interrupt 1 input. SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave. CAP0[1] — Capture input for Timer 0, channel 1. MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data output from SPI slave. MAT0[1] — Match output for Timer 0, channel 1. MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. CAP0[2] — Capture input for Timer 0, channel 2. SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave. PWM2 — Pulse Width Modulator output 2. EINT2 — External interrupt 2 input. TXD1 — Transmitter output for UART1. PWM4 — Pulse Width Modulator output 4. RXD1 — Receiver input for UART1. PWM6 — Pulse Width Modulator output 6. EINT3 — External interrupt 3 input. RTS1 — Request to Send output for UART1. CAP1[0] — Capture input for Timer 1, channel 0. CTS1 — Clear to Send input for UART1. CAP1[1] — Capture input for Timer 1, channel 1. DSR1 — Data Set Ready input for UART1. MAT1[0] — Match output for Timer 1, channel 0. DTR1 — Data Terminal Ready output for UART1. MAT1[1] — Match output for Timer 1, channel 1. DCD1 — Data Carrier Detect input for UART1. EINT1 — External interrupt 1 input. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take control of the part after reset. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. P0[0]/TXD0/ PWM1 P0[1]/RXD0/ PWM3/EINT0 19 21 O O I O I P0[2]/SCL/ CAP0[0] P0[3]/SDA/ MAT0[0]/EINT1 22 26 I/O I I/O O I P0[4]/SCK0/ CAP0[1] P0[5]/MISO0/ MAT0[1] P0[6]/MOSI0/ CAP0[2] P0[7]/SSEL0/ PWM2/EINT2 27 29 I/O I I/O O 30 I/O I 31 I O I P0[8]/TXD1/ PWM4 P0[9]/RXD1/ PWM6/EINT3 33 34 O O I O I P0[10]/RTS1/ CAP1[0] P0[11]/CTS1/ CAP1[1] P0[12]/DSR1/ MAT1[0] P0[13]/DTR1/ MAT1[1] P0[14]/DCD1/ EINT1 35 37 38 39 41 O I I I I O O O I I Product data sheet Rev. 06 — 10 December 2007 6 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Table 3. Symbol Pin description …continued Pin 45 46 Type Description I I I O I 47 I I/O O RI1 — Ring Indicator input for UART1. EINT2 — External interrupt 2 input. EINT0 — External interrupt 0 input. MAT0[2] — Match output for Timer 0, channel 2. CAP0[2] — Capture input for Timer 0, channel 2. CAP1[2] — Capture input for Timer 1, channel 2. SCK1 — Serial Clock for SPI1/SSP[1]. SPI clock output from master or input to slave. MAT1[2] — Match output for Timer 1, channel 2. CAP1[3] — Capture input for Timer 1, channel 3. MISO1 — Master In Slave Out for SPI1/SSP[1]. Data input to SPI master or data output from SPI slave. MAT1[3] — Match output for Timer 1, channel 3. MAT1[2] — Match output for Timer 1, channel 2. MOSI1 — Master Out Slave In for SPI1/SSP[1]. Data output from SPI master or data input to SPI slave. CAP1[2] — Capture input for Timer 1, channel 2. MAT1[3] — Match output for Timer 1, channel 3. SSEL1 — Slave Select for SPI1/SSP[1]. Selects the SPI interface as a slave. EINT3 — External interrupt 3 input. PWM5 — Pulse Width Modulator output 5. CAP1[3] — Capture input for Timer 1, channel 3. CAP0[0] — Capture input for Timer 0, channel 0. MAT0[0] — Match output for Timer 0, channel 0. CAN2 receiver input (not available on LPC2109). CAN2 transmitter output (not available on LPC2109). CAN1 receiver input. AIN0 — A/D converter, input 0. This analog input is always connected to its pin. CAP0[1] — Capture input for Timer 0, channel 1. MAT0[1] — Match output for Timer 0, channel 1. AIN1 — A/D converter, input 1. This analog input is always connected to its pin. CAP0[2] — Capture input for Timer 0, channel 2. MAT0[2] — Match output for Timer 0, channel 2. AIN2 — A/D converter, input 2. This analog input is always connected to its pin. CAP0[3] — Capture input for Timer 0, Channel 3. MAT0[3] — Match output for Timer 0, channel 3. AIN3 — A/D converter, input 3. This analog input is always connected to its pin. EINT3 — External interrupt 3 input. CAP0[0] — Capture input for Timer 0, channel 0. Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect Block. Pins 0 through 15 of port 1 are not available. © NXP B.V. 2007. All rights reserved. P0[15]/RI1/EINT2 P0[16]/EINT0/ MAT0[2]/CAP0[2] P0[17]/CAP1[2]/ SCK1/MAT1[2] P0[18]/CAP1[3]/ MISO1/MAT1[3] 53 I I/O O P0[19]/MAT1[2]/ MOSI1/CAP1[2] 54 O I/O I P0[20]/MAT1[3]/ SSEL1/EINT3 55 O I I P0[21]/PWM5/ CAP1[3] P0[22]/CAP0[0]/ MAT0[0] P0[23]/RD2 P0[24]/TD2 P0[25]/RD1 P0[27]/AIN0/ CAP0[1]/MAT0[1] 1 2 3 5 9 11 O I I O I O I I I O P0[28]/AIN1/ CAP0[2]/MAT0[2] 13 I I O P0[29]/AIN2/ CAP0[3]/MAT0[3] 14 I I O P0[30]/AIN3/ EINT3/CAP0[0] 15 I I I I/O P1[0] to P1[31] LPC2109_2119_2129_6 Product data sheet Rev. 06 — 10 December 2007 7 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Table 3. Symbol Pin description …continued Pin 16 12 8 4 48 Type Description O O O O O Trace Packet, bit 0. Standard I/O port with internal pull-up. Trace Packet, bit 1. Standard I/O port with internal pull-up. Trace Packet, bit 2. Standard I/O port with internal pull-up. Trace Packet, bit 3. Standard I/O port with internal pull-up. Trace Synchronization. Standard I/O port with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to operate as Trace port after reset. 44 40 36 32 28 24 O O O O I I/O Pipeline Status, bit 0. Standard I/O port with internal pull-up. Pipeline Status, bit 1. Standard I/O port with internal pull-up. Pipeline Status, bit 2. Standard I/O port with internal pull-up. Trace Clock. Standard I/O port with internal pull-up. External Trigger Input. Standard I/O with internal pull-up. Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to operate as Debug port after reset. P1[16]/ TRACEPKT0 P1[17]/ TRACEPKT1 P1[18]/ TRACEPKT2 P1[19]/ TRACEPKT3 P1[20]/ TRACESYNC P1[21]/ PIPESTAT0 P1[22]/ PIPESTAT1 P1[23]/ PIPESTAT2 P1[24]/ TRACECLK P1[25]/EXTIN0 P1[26]/RTCK P1[27]/TDO P1[28]/TDI P1[29]/TCK P1[30]/TMS P1[31]/TRST TD1 RESET 64 60 56 52 20 10 57 O I I I I O I Test Data out for JTAG interface. Test Data in for JTAG interface. Test Clock for JTAG interface. This clock must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate. Test Mode Select for JTAG interface. Test Reset for JTAG interface. CAN1 transmitter output. External reset input; a LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Ground: 0 V reference. Analog ground; 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. PLL analog ground; 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 1.8 V core power supply; this is the power supply voltage for internal circuitry. XTAL1 XTAL2 VSS VSSA VSSA(PLL) VDD(1V8) 62 61 6, 18, 25, 42, 50 59 58 17, 49 I O I I I I LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 8 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Table 3. Symbol VDDA(1V8) Pin description …continued Pin 63 Type Description I Analog 1.8 V core power supply; this is the power supply voltage for internal circuitry. This should be nominally the same voltage as VDD(1V8) but should be isolated to minimize noise and error. 3.3 V pad power supply; this is the power supply voltage for the I/O ports. Analog 3.3 V pad power supply; this should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. VDD(3V3) VDDA(3V3) 23, 43, 51 7 I I [1] SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 9 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 6. Functional description Details of the LPC2109/2119/2129 systems and peripheral functions are described in the following sections. 6.1 Architectural overview The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • The standard 32-bit ARM set. • A 16-bit Thumb set. The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. 6.2 On-chip flash program memory The LPC2109/2119/2129 incorporate a 64/128/256 kB flash memory system, respectively. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port. The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. When on-chip bootloader is used, 60/120/248 kB of flash memory is available for user code. The LPC2109/2119/2129 flash memory provides a minimum of 100000 erase/write cycles and 20 years of data retention. On-chip bootloader (as of revision 1.60) provides Code Read Protection (CRP) for the LPC2109/2119/2129 on-chip flash memory. When the CRP is enabled, the JTAG debug port and ISP commands accessing either the on-chip RAM or flash memory are disabled. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 10 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers However, the ISP flash erase command can be executed at any time (no matter whether the CRP is on or off). Removal of CRP is achieved by erasure of full on-chip user flash. With the CRP off, full access to the chip via the JTAG and/or ISP is restored. 6.3 On-chip static RAM On-chip static RAM may be used for code and/or data storage. The SRAM may be accessed as 8 bit, 16 bit, and 32 bit. The LPC2109/2119/2129 provide 8 kB of static RAM for the LPC2109 and 16 kB for the LPC2119 and LPC2129. 6.4 Memory map The LPC2109/2119/2129 memory maps incorporate several distinct regions, as shown in Figure 3. In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either flash memory (the default) or on-chip static RAM. This is described in Section 6.18 “System control”. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 11 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB 0xFFFF FFFF 0xF000 0000 0xEFFF FFFF 0xE000 0000 0xDFFF FFFF 3.0 GB RESERVED ADDRESS SPACE 0xC000 0000 2.0 GB BOOT BLOCK (RE-MAPPED FROM ON-CHIP FLASH MEMORY) 0x8000 0000 0x7FFF FFFF 0x7FFF E000 0x7FFF DFFF RESERVED ADDRESS SPACE 0x4000 4000 0x4000 3FFF 16 kB ON-CHIP STATIC RAM (LPC2119/2129) 0x4000 1FFF 8 kB ON-CHIP STATIC RAM (LPC2109) 1.0 GB 0x4000 0000 0x3FFF FFFF RESERVED ADDRESS SPACE 0x0004 0000 0x0003 FFFF 256 kB ON-CHIP FLASH MEMORY (LPC2129) 128 kB ON-CHIP FLASH MEMORY (LPC2119) 64 kB ON-CHIP FLASH MEMORY (LPC2109) 0.0 GB 0x0002 0000 0x0001 FFFF 0x0001 0000 0x0000 FFFF 0x0000 0000 002aad174 Fig 3. LPC2109/2119/2129 memory map 6.5 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt Request (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 12 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are requesting, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active. 6.5.1 Interrupt sources Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has one interrupt line connected to the Vectored Interrupt Controller, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Table 4. Block WDT ARM Core ARM Core Timer 0 Timer 1 UART0 Interrupt sources Flag(s) Watchdog Interrupt (WDINT) Reserved for software interrupts only EmbeddedICE, DbgCommRx EmbeddedICE, DbgCommTx Match 0 to 3 (MR0, MR1, MR2, MR3) Capture 0 to 3 (CR0, CR1, CR2, CR3) Match 0 to 3 (MR0, MR1, MR2, MR3) Capture 0 to 3 (CR0, CR1, CR2, CR3) Rx Line Status (RLS) Transmit Holding Register empty (THRE) Rx Data Available (RDA) Character Time-out Indicator (CTI) UART1 Rx Line Status (RLS) Transmit Holding Register empty (THRE) Rx Data Available (RDA) Character Time-out Indicator (CTI) Modem Status Interrupt (MSI) PWM0 I2C-bus SPI0 SPI1 and PLL RTC SSP[1] Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6) SI (state change) SPIF, MODF SPIF, MODF and TXRIS, RXRIS, RTRIS, RORRIS PLL Lock (PLOCK) RTCCIF (Counter Increment), RTCALF (Alarm) 8 9 10 11 12 13 7 6 5 VIC channel # 0 1 2 3 4 LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 13 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Interrupt sources …continued Flag(s) External Interrupt 0 (EINT0) External Interrupt 1 (EINT1) External Interrupt 2 (EINT2) External Interrupt 3 (EINT3) VIC channel # 14 15 16 17 18 19 to 23 Table 4. Block System Control ADC CAN [1] A/D Converter CAN1, CAN2 and Acceptance Filter SSP interface available on LPC2109/01, LPC2119/01, and LPC2129/01 only. 6.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 6.7 General purpose parallel I/O (GPIO) and Fast I/O Device pins that are not connected to a specific peripheral function are controlled by the parallel I/O registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins. 6.7.1 Features • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • Separate control of output set and clear. • All I/O default to inputs after reset. 6.7.2 Features added with the Fast GPIO set of registers available on LPC2109/2119/2129/01 only • Fast GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing, enabling port pin toggling up to 3.5 times faster than earlier LPC2000 devices. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All Fast GPIO registers are byte addressable. • Entire port value can be written in one instruction. • Ports are accessible via either the legacy group of registers (GPIOs) or the group of registers providing accelerated port access (Fast GPIOs). LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 14 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 6.8 10-bit ADC The LPC2109/2119/2129 each contain a single 10-bit successive approximation ADC with four multiplexed channels. 6.8.1 Features • • • • Measurement range of 0 V to 3 V. Capable of performing more than 400000 10-bit samples per second. Burst conversion mode for single or multiple inputs. Optional conversion on transition on input pin or Timer Match signal. 6.8.2 ADC features available in LPC2109/2119/2129/01 only • Every analog input has a dedicated result register to reduce interrupt overhead. • Every analog input can generate an interrupt once the conversion is completed. • The ADC pads are 5 V tolerant when configured for digital I/O function(s). 6.9 CAN controllers and acceptance filter The LPC2119 and LPC2129 each contain two CAN controllers, while the LPC2109 has one CAN controller. The CAN is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low-cost multiplex wiring. 6.9.1 Features • • • • • Data rates up to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit Rx identifiers for all CAN buses. Acceptance Filter can provide FullCAN-style automatic reception for selected Standard identifiers. 6.10 UARTs The LPC2109/2119/2129 each contain two UARTs. In addition to standard transmit and receive data lines, the UART1 also provides a full modem control handshake interface. 6.10.1 Features • • • • 16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. control on both UARTs. • Transmission FIFO control enables implementation of software (XON/XOFF) flow LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 15 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers • UART1 is equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). 6.10.2 UART features available in LPC2109/2119/2129/01 only Compared to previous LPC2000 microcontrollers, UARTs in LPC2109/2119/2129/01 introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers to achieve standard baud rates such as 115200 Bd with any crystal frequency above 2 MHz. In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware. • Fractional baud rate generator enables standard baud rates such as 115200 Bd to be achieved with any crystal frequency above 2 MHz. • Auto-bauding. • Auto-CTS/RTS flow-control fully implemented in hardware. 6.11 I2C-bus serial I/O controller The I2C-bus is a bidirectional bus for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g. an LCD driver or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus; it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2109/2119/2129 supports a bit rate up to 400 kbit/s (Fast I2C-bus). 6.11.1 Features • Standard I2C-bus compliant interface. • Easy to configure as Master, Slave, or Master/Slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus may be used for test and diagnostic purposes. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 16 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 6.12 SPI serial I/O controller The LPC2109/2119/2129 each contain two SPIs. The SPI is a full duplex serial interface, designed to be able to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. 6.12.1 Features • Compliant with Serial Peripheral Interface (SPI) specification. • Synchronous, Serial, Full Duplex communication. • Combined SPI master and slave. • Maximum data bit rate of 1⁄8 of the input clock rate. 6.12.2 Features available in LPC2109/2119/2129/01 only • Eight to 16 bits per frame. • When the SPI interface is used in Master mode, the SSELn pin is not needed (can be used for a different function). 6.13 SSP controller (LPC2109/2119/2129/01 only) Remark: This peripheral is available in LPC2109/2119/2129/01 only. The SSP is a controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. Data transfers are in principle full duplex, with frames of four to 16 bits of data flowing from the master to the slave and from the slave to the master. While the SSP and SPI1 peripherals share the same physical pins, it is not possible to have both of these two peripherals active at the same time. Application can switch on the fly from SPI1 to SSP and back. 6.13.1 Features • Compatible with Motorola’s SPI, Texas Instrument’s 4-wire SSI, and National Semiconductor’s Microwire buses. • • • • Synchronous serial communication. Master or slave operation. 8-frame FIFOs for both transmit and receive. Four to 16 bits per frame. 6.14 General purpose timers The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an externally supplied clock and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 17 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them. 6.14.1 Features • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. • Timer or external event counter operation • Four 32-bit capture channels per timer that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Four external outputs per timer corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 6.14.2 Features available in LPC2109/2119/2129/01 only The LPC2109/2119/2129/01 can count external events on one of the capture inputs if the external pulse lasts at least one half of the period of the PCLK. In this configuration, unused capture lines can be selected as regular timer capture inputs, or used as external interrupts. • Timer can count cycles of either the peripheral clock (PCLK) or an externally supplied clock. • When counting cycles of an externally supplied clock, only one of the timer’s capture inputs can be selected as the timer’s clock. The rate of such a clock is limited to PCLK / 4. Duration of HIGH/LOW levels on the selected CAP input cannot be shorter than 1 / (2PCLK). 6.15 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 6.15.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 18 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect/incomplete feed sequence causes reset/interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 32-bit timer with internal pre-scaler. • Selectable time period from (Tcy(PCLK) × 256 × 4) to (Tcy(PCLK) × 232 × 4) in multiples of Tcy(PCLK) × 4. 6.16 Real-time clock The RTC is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode). 6.16.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Programmable reference clock divider allows adjustment of the RTC to match various crystal frequencies. 6.17 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2109/2119/2129. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 19 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 6.17.1 Features • Seven match registers allow up to six single edge controlled or three double edge controlled PWM outputs, or a mix of both types. • The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 6.18 System control 6.18.1 Crystal oscillator The oscillator supports crystals in the range of 1 MHz to 30 MHz. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc.. fosc and CCLK are the same value unless the PLL is running and connected. Refer to Section 6.18.2 “PLL” for additional information. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 20 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 6.18.2 PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip Reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100 µs. 6.18.3 Reset and wake-up timer Reset has two sources on the LPC2109/2119/2129: the RESET pin and Watchdog Reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip Reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is the Reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The wake-up timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 6.18.4 Code security (Code Read Protection - CRP) This feature of the LPC2109/2119/2129 allows the user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of the Code Read Protection. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 21 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using P0[14] pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. Remark: Devices without the suffix /00 or /01 have only a security level equivalent to CRP2 available. 6.18.5 External interrupt inputs The LPC2109/2119/2129 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode. 6.18.6 Memory mapping control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip flash memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts. 6.18.7 Power control The LPC2109/2119/2129 support two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 22 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 6.18.8 APB The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB may be slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB must work properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB), the default condition at reset is for the APB to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode. 6.19 Emulation and debugging The LPC2109/2119/2129 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself. 6.19.1 EmbeddedICE Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM core. The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The debug communication channel is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The debug communication channel allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The debug communication channel data and control registers are mapped in to addresses in the EmbeddedICE logic. The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate. 6.19.2 Embedded trace macrocell Since the LPC2109/2119/2129 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 23 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 6.19.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC (Debug Communications Channel), which is present in the EmbeddedICE logic. The LPC2109/2119/2129 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 24 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(1V8) VDD(3V3) VDDA(3V3) VIA VI IDD ISS Tj Tstg Ptot(pack) Parameter supply voltage (1.8 V) supply voltage (3.3 V) analog supply voltage (3.3 V) analog input voltage input voltage supply current ground current junction temperature storage temperature total power dissipation (per package) electrostatic discharge voltage based on package heat transfer, not device power consumption human body model; all pins [11] [10] Conditions [2] [3] Min −0.5 −0.5 −0.5 −0.5 Max +2.5 +3.6 +4.6 +5.1 +6.0 VDD(3V3) + 0.5 100 100 150 +150 1.5 Unit V V V V V V mA mA °C °C W 5 V tolerant I/O pins other I/O pins [4][5] [4][6] [7][8] [8][9] −0.5 −0.5 −65 - Vesd −2000 +2000 V [1] The following applies to Table 5: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Internal rail. External rail. Including voltage on outputs in 3-state mode. Only valid when the VDD(3V3) supply voltage is present. Not to exceed 4.6 V. Per supply pin. The peak current is limited to 25 times the corresponding maximum current. Per ground pin. [2] [3] [4] [5] [6] [7] [8] [9] [10] Dependent on package type. [11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 25 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 8. Static characteristics Table 6. Static characteristics Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified. Symbol VDD(1V8) VDD(3V3) VDDA(3V3) Parameter supply voltage (1.8 V) supply voltage (3.3 V) analog supply voltage (3.3 V) LOW-level input current HIGH-level input current OFF-state output current I/O latch-up current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage IOH = −4 mA LOW-level output voltage LOW-level output current HIGH-level short-circuit output current LOW-level short-circuit output current pull-down current pull-up current IOL = 4 mA VOL = 0.4 V VOH = 0 V VOL = VDD(3V3) VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V IDD(act) active mode supply current VDD(1V8) = 1.8 V; CCLK = 60 MHz; Tamb = 25 °C; code HIGH-level output current VOH = VDD(3V3) − 0.4 V [7] [7] [7] [7] [8] Conditions [2] [3] Min 1.65 3.0 2.5 Typ[1] 1.8 3.3 3.3 Max 1.95 3.6 3.6 Unit V V V Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS IOLS Ipd Ipu VI = 0 V; no pull-up VI = VDD(3V3); no pull-down VO = 0 V; VO = VDD(3V3); no pull-up/down −(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 °C [4][5][6] 100 0 0 2.0 −4 4 10 −15 0 - 0.4 50 −50 0 60 3 3 3 5.5 VDD(3V3) 0.8 0.4 −45 50 150 −85 0 - µA µA µA mA V V V V V V V mA mA mA mA µA µA µA mA output active VDD(3V3) − 0.4 - [8] [9] [10] [9] Power consumption LPC2109/00, LPC2119, LPC2119/00, LPC2129, LPC2129/00 while(1){} executed from flash; all peripherals enabled via PCONP[11] register but not configured to run IDD(pd) Power-down mode supply VDD(1V8) = 1.8 V; current Tamb = 25 °C VDD(1V8) = 1.8 V; Tamb = 85 °C 10 110 500 µA µA LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 26 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Table 6. Static characteristics …continued Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified. Symbol IDD(act) Parameter active mode supply current Conditions VDD(1V8) = 1.8 V; CCLK = 60 MHz; Tamb = 25 °C; code Min Typ[1] 41.5 Max Unit mA Power consumption LPC2109/01, LPC2119/01, LPC2129/01 while(1){} executed from flash; all peripherals enabled via PCONP[11] register but not configured to run IDD(idle) Idle mode supply current VDD(1V8) = 1.8 V; CCLK = 60 MHz; Tamb = 25 °C; executed from flash; all peripherals enabled via PCONP[11] register but not configured to run IDD(pd) Power-down mode supply VDD(1V8) = 1.8 V; current Tamb = 25 °C VDD(1V8) = 1.8 V; Tamb = 85 °C I2C-bus pins VIH VIL Vhys VOL ILI HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD(3V3) VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2) input voltage on pin XTAL1 output voltage on pin XTAL2 0 0 1.8 1.8 V V [7] [12] - 9 - mA - 10 - 180 µA µA 0.7VDD(3V3) - 2 10 - V V V µA µA 0.3VDD(3V3) V 0.4 4 22 0.5VDD(3V3) - [1] [2] [3] [4] [5] [6] [7] [8] [9] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. Internal rail. External rail. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [10] Applies to P1[25:16]. [11] See LPC2119/2129/2194/2292/2294 User Manual. [12] To VSS. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 27 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Table 7. ADC static characteristics VDDA = 2.5 V to 3.6 V unless otherwise specified; Tamb = −40 °C to +85 °C unless otherwise specified. ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO EG ET [1] [2] [3] [4] [5] [6] [7] Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error Conditions Min 0 [1][2][3] Typ - Max VDDA 1 ±1 ±2 ±3 ±0.5 ±4 Unit V pF LSB LSB LSB % LSB - [1][4] [1][5] [1][6] [1][7] Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute voltage error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 4. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 28 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers offset error EO 1023 gain error EG 1022 1021 1020 1019 1018 (2) 7 code out 6 (1) 5 (5) 4 (4) 3 (3) 2 1 1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024 0 1 2 3 4 5 6 7 VIA (LSBideal) offset error EO 1 LSB = VDDA − VSSA 1024 002aaa668 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 4. ADC characteristics LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 29 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 8.1 Power consumption measurements for LPC2109/01, LPC2119/01, LPC2129/01 devices The power consumption measurements represent typical values for the given conditions. The peripherals were enabled through the PCONP register, but for these measurements, the peripherals were not configured to run. Peripherals were disabled through the PCONP register. Refer to the LPC2119/2129/2194/2292/2294 User Manual for a description of the PCONP register. 45 IDD(act) (mA) 35 all peripherals enabled all peripherals disabled 25 002aad127 15 5 12 20 28 36 44 52 frequency (MHz) 60 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V. Fig 5. Typical LPC2109/01 IDD(act) measured at different frequencies 45 IDD(act) (mA) 35 60 MHz 002aad128 48 MHz 25 15 12 MHz 5 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V; all peripherals enabled. Fig 6. Typical LPC2109/01 IDD(act) measured at different voltages LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 30 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 10 IDD(idle) (mA) 8 002aad129 all peripherals enabled 6 all peripherals disabled 4 2 0 12 20 28 36 44 52 frequency (MHz) 60 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V. Fig 7. Typical LPC2109/01 IDD(idle) measured at different frequencies 10 IDD(idle) (mA) 60 MHz 7.5 48 MHz 002aad130 5.0 2.5 12 MHz 0 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V; all peripherals enabled. Fig 8. Typical LPC2109/01 IDD(idle) measured at different voltages LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 31 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 45 IDD(act) (mA) 35 all peripherals enabled all peripherals disabled 25 002aad131 15 5 12 20 28 36 44 52 frequency (MHz) 60 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V. Fig 9. Typical LPC2119/01 and LPC2129/01 IDD(act) measured at different frequencies 50 IDD(act) (mA) 40 48 MHz 30 60 MHz 002aad132 20 12 MHz 10 0 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V; all peripherals enabled. Fig 10. Typical LPC2119/01 and LPC2129/01 IDD(act) measured at different voltages LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 32 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 10 IDD(idle) (mA) 8 all peripherals enabled 6 all peripherals disabled 002aad133 4 2 0 12 20 28 36 44 52 frequency (MHz) 60 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V. Fig 11. Typical LPC2119/01 and LPC2129/01 IDD(idle) measured at different frequencies 10 IDD(idle) (mA) 8 60 MHz 002aad134 48 MHz 6 4 12 MHz 2 0 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Tamb = 25 °C; core voltage 1.8 V; all peripherals enabled. Fig 12. Typical LPC2119/01 and LPC2129/01 IDD(idle) measured at different voltages LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 33 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 45 IDD(act) (mA) 35 60 MHz 002aad135 48 MHz 25 15 12 MHz 5 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Temp = 25 °C; core voltage 1.8 V; all peripherals disabled. Fig 13. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(act) measured at different voltages 8 IDD(idle) (mA) 6 60 MHz 48 MHz 4 002aad136 2 12 MHz 0 1.65 1.70 1.75 1.80 1.85 1.90 voltage (V) 1.95 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; Temp = 25 °C; core voltage 1.8 V; all peripherals disabled. Fig 14. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(idle) measured at different voltages LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 34 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 45 IDD(act) (mA) 35 60 MHz 002aad137 48 MHz 25 15 12 MHz 5 −40 −15 10 35 60 temperature (°C) 85 Test conditions: Active mode entered executing code from on-chip flash; PCLK = CCLK⁄4; core voltage 1.8 V; all peripherals disabled. Fig 15. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(act) measured at different temperatures 6 IDD(idle) (mA) 5 60 MHz 002aad138 48 MHz 4 3 2 12 MHz 1 −40 −15 10 35 60 temperature (°C) 85 Test conditions: Idle mode entered executing code from on-chip flash; PCLK = CCLK⁄4; core voltage 1.8 V; all peripherals disabled. Fig 16. Typical LPC2109/01, LPC2119/01, and LPC2129/01 IDD(idle) measured at different temperatures LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 35 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 200 IDD(pd) (µA) 160 1.95 V 1.8 V 1.65 V 120 002aad139 80 40 0 −40 −15 10 35 60 temperature (°C) 85 Test conditions: Power-down mode entered executing code from on-chip flash. Fig 17. Typical LPC2109/01, LPC2119/01, and LPC2129/01 core power-down current IDD(pd) measured at different temperatures Table 8. Typical LPC2109/01 peripheral power consumption in active mode Core voltage 1.8 V; Tamb = 25 °C; all measurements in µA; PCLK = CCLK⁄4. Peripheral Timer0 Timer1 UART0 UART1 PWM0 I2C-bus SPI0/1 RTC ADC CAN1 Table 9. CCLK = 12 MHz 43 46 98 103 103 9 6 16 33 230 CCLK = 48 MHz 141 150 320 351 341 37 27 55 128 764 CCLK = 60 MHz 184 180 398 421 407 53 29 78 167 914 Typical LPC2119/01 and LPC2129/01 peripheral power consumption in active mode Core voltage 1.8 V; Tamb = 25 °C; all measurements in µA; PCLK = CCLK⁄4. Peripheral Timer0 Timer1 UART0 UART1 PWM0 I2C-bus SPI0/1 CCLK = 12 MHz 43 46 98 103 103 9 6 CCLK = 48 MHz 141 150 320 351 341 37 27 CCLK = 60 MHz 184 180 398 421 407 53 29 LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 36 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers Typical LPC2119/01 and LPC2129/01 peripheral power consumption in active mode …continued Core voltage 1.8 V; Tamb = 25 °C; all measurements in µA; PCLK = CCLK⁄4. Peripheral RTC ADC CAN1/2 CCLK = 12 MHz 16 33 229 CCLK = 48 MHz 55 128 771 CCLK = 60 MHz 78 167 914 Table 9. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 37 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 9. Dynamic characteristics Table 10. Dynamic characteristics Tamb = −40 °C to +85 °C for industrial applications; VDD(1V8), VDD(3V3) over specified ranges.[1] Symbol External clock fosc oscillator frequency supplied by an external oscillator (signal generator) external clock frequency supplied by an external crystal oscillator external clock frequency if on-chip PLL is used external clock frequency if on-chip bootloader is used for initial code download Tcy(clk) tCHCX tCLCX tCLCH tCHCL tr tf tf [1] [2] Parameter Conditions Min 1 1 Typ - Max 50 30 Unit MHz MHz 10 10 - 25 25 MHz MHz clock cycle time clock HIGH time clock LOW time clock rise time clock fall time rise time fall time fall time VIH to VIL [2] 20 Tcy(clk) × 0.4 Tcy(clk) × 0.4 - 10 10 1000 5 5 - ns ns ns ns ns ns ns ns Port pins (except P0[2] and P0[3]) I2C-bus pins (P0[2] and P0[3]) 20 + 0.1 × Cb - Parameters are valid over operating temperature range unless otherwise specified. Bus capacitance Cb in pF, from 10 pF to 400 pF. LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 38 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 9.1 Timing VDD − 0.5 V 0.45 V 0.2VDD + 0.9 V 0.2VDD − 0.1 V tCHCL tCLCX Tcy(clk) 002aaa907 tCHCX tCLCH Fig 18. External clock timing LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 39 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 10. Package outline LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 49 33 32 ZE e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B vM B vM A 17 detail X L Lp A A2 A1 (A 3) θ e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 θ 7o o 0 12.15 12.15 11.85 11.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC 136E10 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 19. Package outline SOT314-2 (LQFP64) LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 40 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 11. Abbreviations Table 11. Acronym ADC AMBA APB CAN CPU DCC FIFO GPIO I/O PLL PWM RAM SPI SRAM SSI SSP TTL UART Abbreviations Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Controller Area Network Central Processing Unit Debug Communications Channel First In, First Out General Purpose Input/Output Input/Output Phase-Locked Loop Pulse Width Modulator Random Access Memory Serial Peripheral Interface Static Random Access Memory Synchronous Serial Interface Synchronous Serial Port Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 41 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 12. Revision history Table 12. Revision history Release date 20071210 Data sheet status Product data sheet Change notice Supersedes LPC2109_2119_2129_5 Document ID LPC2109_2119_2129_6 Modifications: • • • • • • Type number LPC2109FBD64/01 has been added. Type number LPC2119FBD64/01 has been added. Type number LPC2129FBD64/01 has been added. Details introduced with /01 devices on new peripherals/features (Fast I/O Ports, SSP, CRP) and enhancements to existing ones (UART0/1, Timers, ADC, and SPI) have been added. Power measurements for LPC2109/2119/2129/01 devices have been added. Description of JTAG pin TCK has been updated. Product data sheet Product data sheet Product data Preliminary data Preliminary data LPC2119_2129_4 LPC2119_2129-03 LPC2119_2129-02 LPC2119_2129-01 - LPC2109_2119_2129_5 LPC2119_2129_4 LPC2119_2129-03 LPC2119_2129-02 LPC2119_2129-01 20070627 20060714 20041222 20040202 20031118 LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 42 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com LPC2109_2119_2129_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 10 December 2007 43 of 44 NXP Semiconductors LPC2109/2119/2129 Single-chip 16/32-bit microcontrollers 15. Contents 1 2 2.1 2.2 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 6.5.1 6.6 6.7 6.7.1 6.7.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key features brought by LPC2109/2119/2129/01 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key features common for all devices . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional description . . . . . . . . . . . . . . . . . . 10 Architectural overview. . . . . . . . . . . . . . . . . . . 10 On-chip flash program memory . . . . . . . . . . . 10 On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 11 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 11 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 12 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 13 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 14 General purpose parallel I/O (GPIO) and Fast I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Features added with the Fast GPIO set of registers available on LPC2109/2119/2129/01 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ADC features available in LPC2109/2119/2129/01 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 CAN controllers and acceptance filter . . . . . . 15 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 UART features available in LPC2109/2119/2129/01 only . . . . . . . . . . . . . 16 I2C-bus serial I/O controller . . . . . . . . . . . . . . 16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Features available in LPC2109/2119/2129/01 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SSP controller (LPC2109/2119/2129/01 only) 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 General purpose timers . . . . . . . . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Features available in LPC2109/2119/2129/01 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.15 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 6.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.16 Real-time clock. . . . . . . . . . . . . . . . . . . . . . . . 6.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.17 Pulse width modulator . . . . . . . . . . . . . . . . . . 6.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.18 System control . . . . . . . . . . . . . . . . . . . . . . . . 6.18.1 Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . . 6.18.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.18.3 Reset and wake-up timer . . . . . . . . . . . . . . . . 6.18.4 Code security (Code Read Protection - CRP) 6.18.5 External interrupt inputs . . . . . . . . . . . . . . . . . 6.18.6 Memory mapping control . . . . . . . . . . . . . . . . 6.18.7 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 6.18.8 APB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.19 Emulation and debugging. . . . . . . . . . . . . . . . 6.19.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 6.19.2 Embedded trace macrocell . . . . . . . . . . . . . . 6.19.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 8 Static characteristics . . . . . . . . . . . . . . . . . . . 8.1 Power consumption measurements for LPC2109/01, LPC2119/01, LPC2129/01 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 9.1 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information . . . . . . . . . . . . . . . . . . . . . . 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information . . . . . . . . . . . . . . . . . . . . 15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 19 19 19 20 20 20 21 21 21 22 22 22 23 23 23 23 24 25 26 6.8 6.8.1 6.8.2 6.9 6.9.1 6.10 6.10.1 6.10.2 6.11 6.11.1 6.12 6.12.1 6.12.2 6.13 6.13.1 6.14 6.14.1 6.14.2 30 38 39 40 41 42 43 43 43 43 43 43 44 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 December 2007 Document identifier: LPC2109_2119_2129_6