LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash
with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
Rev. 5 — 12 August 2011
Product data sheet
1. General description
The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S
CPU with real-time emulation and embedded trace support, that combine the
microcontroller with embedded high-speed flash memory ranging from 32 kB to 512 kB. A
128-bit wide memory interface and a unique accelerator architecture enable 32-bit code
execution at the maximum clock rate. For critical code size applications, the alternative
16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for
applications where miniaturization is a key requirement, such as access control and
point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed
device, multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB,
make these devices very well suited for communication gateways and protocol
converters, soft modems, voice recognition and low end imaging, providing both large
buffer size and high processing power. Various 32-bit timers, single or dual 10-bit ADC(s),
10-bit DAC, PWM channels and 45 fast GPIO lines with up to nine edge or level sensitive
external interrupt pins make these microcontrollers suitable for industrial control and
medical systems.
2. Features and benefits
2.1 Key features
16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.
8 kB to 40 kB of on-chip static RAM and 32 kB to 512 kB of on-chip flash memory.
128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip boot
loader software. Single flash sector or full chip erase in 400 ms and programming of
256 B in 1 ms.
EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high-speed tracing of instruction execution.
USB 2.0 Full-speed compliant device controller with 2 kB of endpoint RAM.
In addition, the LPC2146/48 provides 8 kB of on-chip RAM accessible to USB by DMA.
One or two (LPC2141/42 vs. LPC2144/46/48) 10-bit ADCs provide a total of 6/14
analog inputs, with conversion times as low as 2.44 s per channel.
Single 10-bit DAC provides variable analog output (LPC2142/44/46/48 only).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-Time Clock (RTC) with independent power and 32 kHz clock input.
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
Up to 45 of 5 V tolerant fast general purpose I/O pins in a tiny LQFP64 package.
Up to 21 external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 s.
On-chip integrated oscillator operates with an external crystal from 1 MHz to 25 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling for
additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O
pads.
3. Ordering information
Table 1.
Ordering information
Type number
LPC2141FBD64
Package
Name
Description
Version
LQFP64
plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2142FBD64
LPC2144FBD64
LPC2146FBD64
LPC2148FBD64
3.1 Ordering options
Table 2.
Ordering options
Type number
Flash
memory
RAM
Endpoint
USB RAM
ADC (channels
overall)
DAC
Temperature
range
LPC2141FBD64
32 kB
8 kB
2 kB
1 (6 channels)
-
40 C to +85 C
LPC2142FBD64
64 kB
16 kB
2 kB
1 (6 channels)
1
40 C to +85 C
LPC2144FBD64
128 kB
16 kB
2 kB
2 (14 channels)
1
40 C to +85 C
LPC2146FBD64
256 kB
32 kB + 8 kB shared with
USB DMA[1]
2 kB
2 (14 channels)
1
40 C to +85 C
LPC2148FBD64
512 kB
32 kB + 8 kB shared with
USB DMA[1]
2 kB
2 (14 channels)
1
40 C to +85 C
[1]
While the USB DMA is the primary user of the additional 8 kB RAM, this RAM is also accessible at any time by the CPU as a general
purpose RAM for data and code storage.
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
2 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
4. Block diagram
TMS(1)
TDI(1)
TRST(1)
TCK(1)
TDO(1)
P0[31:28] and
P0[25:0]
P1[31:16]
EMULATION TRACE
MODULE
LPC2141/42/44/46/48
TEST/DEBUG
INTERFACE
FAST GENERAL
PURPOSE I/O
XTAL2
RST
XTAL1
ARM7TDMI-S
AHB BRIDGE
PLL0
SYSTEM
FUNCTIONS
system
clock
PLL1
VECTORED
INTERRUPT
CONTROLLER
USB
clock
ARM7 local bus
AMBA AHB
(Advanced High-performance Bus)
INTERNAL
SRAM
CONTROLLER
INTERNAL
FLASH
CONTROLLER
8 kB/16 kB/
32 kB
SRAM
32 kB/64 kB/128 kB/
256 kB/512 kB
FLASH
APB
DIVIDER
8 kB RAM
SHARED WITH
USB DMA(3)
AHB
DECODER
EXTERNAL
INTERRUPTS
USB 2.0 FULL-SPEED
DEVICE CONTROLLER
WITH DMA(3)
CAPTURE/COMPARE
(W/EXTERNAL CLOCK)
TIMER 0/TIMER 1
I2C-BUS SERIAL
INTERFACES 0 AND 1
A/D CONVERTERS
0 AND 1(2)
SPI AND SSP
SERIAL INTERFACES
EINT3 to EINT0
4 × CAP0
4 × CAP1
8 × MAT0
8 × MAT1
AHB TO APB
BRIDGE
AD0[7:6] and
AD0[4:1]
AD1[7:0](2)
D+
D−
UP_LED
CONNECT
VBUS
SCL0, SCL1
SDA0, SDA1
SCK0, SCK1
MOSI0, MOSI1
MISO0, MISO1
SSEL0, SSEL1
TXD0, TXD1
AOUT(4)
D/A CONVERTER
UART0/UART1
GENERAL
PURPOSE I/O
REAL-TIME CLOCK
PWM0
WATCHDOG
TIMER
P0[31:28] and
P0[25:0]
P1[31:16]
PWM6 to PWM0
RXD0, RXD1
DSR1(2),CTS1(2),
RTS1(2), DTR1(2)
DCD1(2),RI1(2)
RTXC1
RTXC2
VBAT
SYSTEM
CONTROL
002aab560
(1) Pins shared with GPIO.
(2) LPC2144/46/48 only.
(3) USB DMA controller with 8 kB of RAM accessible as general purpose RAM and/or DMA is available in LPC2146/48 only.
(4) LPC2142/44/46/48 only.
Fig 1.
Block diagram
LPC2141_42_44_46_48
Product data sheet
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Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
3 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5. Pinning information
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23/VBUS
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
5.1 Pinning
P0.21/PWM5/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/EINT2
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4
9
41 P0.14/EINT1/SDA1
LPC2141
40 P1.22/PIPESTAT1
D+ 10
39 P0.13/MAT1.1
D− 11
38 P0.12/MAT1.0
P1.17/TRACEPKT1 12
37 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 15
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
Fig 2.
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
VSS 18
P0.31/UP_LED/CONNECT 17
33 P0.8/TXD1/PWM4
002aab733
LPC2141 pinning
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
4 of 45
LPC2141/42/44/46/48
NXP Semiconductors
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23/VBUS
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
Single-chip 16-bit/32-bit microcontrollers
P0.21/PWM5/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/EINT2
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4/AOUT
9
41 P0.14/EINT1/SDA1
LPC2142
40 P1.22/PIPESTAT1
D+ 10
39 P0.13/MAT1.1
D− 11
38 P0.12/MAT1.0
P1.17/TRACEPKT1 12
37 P0.11/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/CAP1.0
P0.30/AD0.3/EINT3/CAP0.0 15
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
Fig 3.
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
VSS 18
P0.31/UP_LED/CONNECT 17
33 P0.8/TXD1/PWM4
002aab734
LPC2142 pinning
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
5 of 45
LPC2141/42/44/46/48
NXP Semiconductors
49 VBAT
50 VSS
51 VDD
52 P1.30/TMS
53 P0.18/CAP1.3/MISO1/MAT1.3
54 P0.19/MAT1.2/MOSI1/CAP1.2
55 P0.20/MAT1.3/SSEL1/EINT3
56 P1.29/TCK
57 RESET
58 P0.23/VBUS
59 VSSA
60 P1.28/TDI
61 XTAL2
62 XTAL1
63 VREF
64 P1.27/TDO
Single-chip 16-bit/32-bit microcontrollers
P0.21/PWM5/AD1.6/CAP1.3
1
48 P1.20/TRACESYNC
P0.22/AD1.7/CAP0.0/MAT0.0
2
47 P0.17/CAP1.2/SCK1/MAT1.2
RTCX1
3
46 P0.16/EINT0/MAT0.2/CAP0.2
P1.19/TRACEPKT3
4
45 P0.15/RI1/EINT2/AD1.5
RTCX2
5
44 P1.21/PIPESTAT0
VSS
6
43 VDD
VDDA
7
42 VSS
P1.18/TRACEPKT2
8
P0.25/AD0.4/AOUT
9
41 P0.14/DCD1/EINT1/SDA1
LPC2144/2146/2148
40 P1.22/PIPESTAT1
D+ 10
39 P0.13/DTR1/MAT1.1/AD1.4
D− 11
38 P0.12/DSR1/MAT1.0/AD1.3
P1.17/TRACEPKT1 12
37 P0.11/CTS1/CAP1.1/SCL1
P0.28/AD0.1/CAP0.2/MAT0.2 13
36 P1.23/PIPESTAT2
P0.29/AD0.2/CAP0.3/MAT0.3 14
35 P0.10/RTS1/CAP1.0/AD1.2
Fig 4.
P1.24/TRACECLK 32
P0.7/SSEL0/PWM2/EINT2 31
P0.6/MOSI0/CAP0.2/AD1.0 30
P0.5/MISO0/MAT0.1/AD0.7 29
P1.25/EXTIN0 28
P0.4/SCK0/CAP0.1/AD0.6 27
P0.3/SDA0/MAT0.0/EINT1 26
VSS 25
P1.26/RTCK 24
VDD 23
P0.2/SCL0/CAP0.0 22
P0.1/RXD0/PWM3/EINT0 21
P1.31/TRST 20
P0.0/TXD0/PWM1 19
33 P0.8/TXD1/PWM4/AD1.1
VSS 18
34 P0.9/RXD1/PWM6/EINT3
P1.16/TRACEPKT0 16
P0.31/UP_LED/CONNECT 17
P0.30/AD0.3/EINT3/CAP0.0 15
002aab735
LPC2144/46/48 pinning
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
6 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0.0 to P0.31
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for
each bit. Total of 31 pins of the Port 0 can be used as a general
purpose bidirectional digital I/Os while P0.31 is output only pin. The
operation of port 0 pins depends upon the pin function selected via the
pin connect block.
Pins P0.24, P0.26 and P0.27 are not available.
P0.0/TXD0/
PWM1
19[1]
P0.1/RXD0/
PWM3/EINT0
21[2]
P0.2/SCL0/
CAP0.0
22[3]
P0.3/SDA0/
MAT0.0/EINT1
26[3]
P0.4/SCK0/
CAP0.1/AD0.6
P0.5/MISO0/
MAT0.1/AD0.7
P0.6/MOSI0/
CAP0.2/AD1.0
P0.7/SSEL0/
PWM2/EINT2
LPC2141_42_44_46_48
Product data sheet
27[4]
29[4]
30[4]
31[2]
I/O
P0.0 — General purpose input/output digital pin (GPIO).
O
TXD0 — Transmitter output for UART0.
O
PWM1 — Pulse Width Modulator output 1.
I/O
P0.1 — General purpose input/output digital pin (GPIO).
I
RXD0 — Receiver input for UART0.
O
PWM3 — Pulse Width Modulator output 3.
I
EINT0 — External interrupt 0 input.
I/O
P0.2 — General purpose input/output digital pin (GPIO).
I/O
SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus
compliance).
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
P0.3 — General purpose input/output digital pin (GPIO).
I/O
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus
compliance).
O
MAT0.0 — Match output for Timer 0, channel 0.
I
EINT1 — External interrupt 1 input.
I/O
P0.4 — General purpose input/output digital pin (GPIO).
I/O
SCK0 — Serial clock for SPI0. SPI clock output from master or input
to slave.
I
CAP0.1 — Capture input for Timer 0, channel 1.
I
AD0.6 — ADC 0, input 6.
I/O
P0.5 — General purpose input/output digital pin (GPIO).
I/O
MISO0 — Master In Slave Out for SPI0. Data input to SPI master or
data output from SPI slave.
O
MAT0.1 — Match output for Timer 0, channel 1.
I
AD0.7 — ADC 0, input 7.
I/O
P0.6 — General purpose input/output digital pin (GPIO).
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master
or data input to SPI slave.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I
AD1.0 — ADC 1, input 0. Available in LPC2144/46/48 only.
I/O
P0.7 — General purpose input/output digital pin (GPIO).
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O
PWM2 — Pulse Width Modulator output 2.
I
EINT2 — External interrupt 2 input.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
7 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.8/TXD1/
PWM4/AD1.1
33[4]
I/O
P0.8 — General purpose input/output digital pin (GPIO).
O
TXD1 — Transmitter output for UART1.
O
PWM4 — Pulse Width Modulator output 4.
P0.9/RXD1/
PWM6/EINT3
P0.10/RTS1/
CAP1.0/AD1.2
P0.11/CTS1/
CAP1.1/SCL1
P0.12/DSR1/
MAT1.0/AD1.3
P0.13/DTR1/
MAT1.1/AD1.4
P0.14/DCD1/
EINT1/SDA1
34[2]
35[4]
37[3]
38[4]
39[4]
41[3]
I
AD1.1 — ADC 1, input 1. Available in LPC2144/46/48 only.
I/O
P0.9 — General purpose input/output digital pin (GPIO).
I
RXD1 — Receiver input for UART1.
O
PWM6 — Pulse Width Modulator output 6.
I
EINT3 — External interrupt 3 input.
I/O
P0.10 — General purpose input/output digital pin (GPIO).
O
RTS1 — Request to Send output for UART1. LPC2144/46/48 only.
I
CAP1.0 — Capture input for Timer 1, channel 0.
I
AD1.2 — ADC 1, input 2. Available in LPC2144/46/48 only.
I/O
P0.11 — General purpose input/output digital pin (GPIO).
I
CTS1 — Clear to Send input for UART1. Available in LPC2144/46/48
only.
I
CAP1.1 — Capture input for Timer 1, channel 1.
I/O
SCL1 — I2C1 clock input/output. Open-drain output (for I2C-bus
compliance)
I/O
P0.12 — General purpose input/output digital pin (GPIO).
I
DSR1 — Data Set Ready input for UART1. Available in
LPC2144/46/48 only.
O
MAT1.0 — Match output for Timer 1, channel 0.
I
AD1.3 — ADC 1 input 3. Available in LPC2144/46/48 only.
I/O
P0.13 — General purpose input/output digital pin (GPIO).
O
DTR1 — Data Terminal Ready output for UART1. LPC2144/46/48
only.
O
MAT1.1 — Match output for Timer 1, channel 1.
I
AD1.4 — ADC 1 input 4. Available in LPC2144/46/48 only.
I/O
P0.14 — General purpose input/output digital pin (GPIO).
I
DCD1 — Data Carrier Detect input for UART1. LPC2144/46/48 only.
I
EINT1 — External interrupt 1 input.
I/O
SDA1 — I2C1 data input/output. Open-drain output (for I2C-bus
compliance).
Note: LOW on this pin while RESET is LOW forces on-chip boot
loader to take over control of the part after reset.
P0.15/RI1/
EINT2/AD1.5
LPC2141_42_44_46_48
Product data sheet
45[4]
I/O
P0.15 — General purpose input/output digital pin (GPIO).
I
RI1 — Ring Indicator input for UART1. Available in LPC2144/46/48
only.
I
EINT2 — External interrupt 2 input.
I
AD1.5 — ADC 1, input 5. Available in LPC2144/46/48 only.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
8 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.16/EINT0/
MAT0.2/CAP0.2
46[2]
I/O
P0.16 — General purpose input/output digital pin (GPIO).
I
EINT0 — External interrupt 0 input.
O
MAT0.2 — Match output for Timer 0, channel 2.
P0.17/CAP1.2/
SCK1/MAT1.2
P0.18/CAP1.3/
MISO1/MAT1.3
P0.19/MAT1.2/
MOSI1/CAP1.2
P0.20/MAT1.3/
SSEL1/EINT3
P0.21/PWM5/
AD1.6/CAP1.3
P0.22/AD1.7/
CAP0.0/MAT0.0
P0.23/VBUS
47[1]
53[1]
54[1]
55[2]
1[4]
2[4]
58[1]
I
CAP0.2 — Capture input for Timer 0, channel 2.
I/O
P0.17 — General purpose input/output digital pin (GPIO).
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
SCK1 — Serial Clock for SSP. Clock output from master or input to
slave.
O
MAT1.2 — Match output for Timer 1, channel 2.
I/O
P0.18 — General purpose input/output digital pin (GPIO).
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
MISO1 — Master In Slave Out for SSP. Data input to SPI master or
data output from SSP slave.
O
MAT1.3 — Match output for Timer 1, channel 3.
I/O
P0.19 — General purpose input/output digital pin (GPIO).
O
MAT1.2 — Match output for Timer 1, channel 2.
I/O
MOSI1 — Master Out Slave In for SSP. Data output from SSP master
or data input to SSP slave.
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
P0.20 — General purpose input/output digital pin (GPIO).
O
MAT1.3 — Match output for Timer 1, channel 3.
I
SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave.
I
EINT3 — External interrupt 3 input.
I/O
P0.21 — General purpose input/output digital pin (GPIO).
O
PWM5 — Pulse Width Modulator output 5.
I
AD1.6 — ADC 1, input 6. Available in LPC2144/46/48 only.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
P0.22 — General purpose input/output digital pin (GPIO).
I
AD1.7 — ADC 1, input 7. Available in LPC2144/46/48 only.
I
CAP0.0 — Capture input for Timer 0, channel 0.
O
MAT0.0 — Match output for Timer 0, channel 0.
I/O
P0.23 — General purpose input/output digital pin (GPIO).
I
VBUS — Indicates the presence of USB bus power.
Note: This signal must be HIGH for USB reset to occur.
P0.25/AD0.4/
AOUT
9[5]
P0.28/AD0.1/
CAP0.2/MAT0.2
13[4]
LPC2141_42_44_46_48
Product data sheet
I/O
P0.25 — General purpose input/output digital pin (GPIO).
I
AD0.4 — ADC 0, input 4.
O
AOUT — DAC output. Available in LPC2142/44/46/48 only.
I/O
P0.28 — General purpose input/output digital pin (GPIO).
I
AD0.1 — ADC 0, input 1.
I
CAP0.2 — Capture input for Timer 0, channel 2.
O
MAT0.2 — Match output for Timer 0, channel 2.
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Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.29/AD0.2/
CAP0.3/MAT0.3
14[4]
I/O
P0.29 — General purpose input/output digital pin (GPIO).
I
AD0.2 — ADC 0, input 2.
I
CAP0.3 — Capture input for Timer 0, channel 3.
P0.30/AD0.3/
EINT3/CAP0.0
P0.31/UP_LED/
CONNECT
15[4]
17[6]
O
MAT0.3 — Match output for Timer 0, channel 3.
I/O
P0.30 — General purpose input/output digital pin (GPIO).
I
AD0.3 — ADC 0, input 3.
I
EINT3 — External interrupt 3 input.
I
CAP0.0 — Capture input for Timer 0, channel 0.
O
P0.31 — General purpose output only digital pin (GPO).
O
UP_LED — USB GoodLink LED indicator. It is LOW when device is
configured (non-control endpoints enabled). It is HIGH when the
device is not configured or during global suspend.
O
CONNECT — Signal used to switch an external 1.5 k resistor under
the software control. Used with the SoftConnect USB feature.
Important: This is an digital output only pin. This pin MUST NOT be
externally pulled LOW when RESET pin is LOW or the JTAG port will
be disabled.
P1.0 to P1.31
P1.16/
TRACEPKT0
16[6]
P1.17/
TRACEPKT1
12[6]
P1.18/
TRACEPKT2
8[6]
P1.19/
TRACEPKT3
4[6]
P1.20/
TRACESYNC
48[6]
I/O
Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction
controls for each bit. The operation of port 1 pins depends upon the
pin function selected via the pin connect block. Pins 0 through 15 of
port 1 are not available.
I/O
P1.16 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACEPKT0 — Trace Packet, bit 0.
I/O
P1.17 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACEPKT1 — Trace Packet, bit 1.
I/O
P1.18 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACEPKT2 — Trace Packet, bit 2.
I/O
P1.19 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACEPKT3 — Trace Packet, bit 3.
I/O
P1.20 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACESYNC — Trace Synchronization.
Note: LOW on this pin while RESET is LOW enables pins P1.25:16 to
operate as Trace port after reset.
P1.21/
PIPESTAT0
44[6]
P1.22/
PIPESTAT1
40[6]
LPC2141_42_44_46_48
Product data sheet
I/O
P1.21 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
PIPESTAT0 — Pipeline Status, bit 0.
I/O
P1.22 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
PIPESTAT1 — Pipeline Status, bit 1.
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Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1.23/
PIPESTAT2
36[6]
I/O
P1.23 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
PIPESTAT2 — Pipeline Status, bit 2.
P1.24/
TRACECLK
32[6]
I/O
P1.24 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
O
TRACECLK — Trace Clock.
P1.25/EXTIN0
28[6]
I/O
P1.25 — General purpose input/output digital pin (GPIO). Standard
I/O port with internal pull-up.
I
EXTIN0 — External Trigger Input.
P1.26/RTCK
24[6]
I/O
P1.26 — General purpose input/output digital pin (GPIO).
I/O
RTCK — Returned Test Clock output. Extra signal added to the JTAG
port. Assists debugger synchronization when processor frequency
varies. Bidirectional pin with internal pull-up.
Note: LOW on RTCK while RESET is LOW enables pins P1[31:26] to
operate as Debug port after reset.
P1.27/TDO
64[6]
P1.28/TDI
60[6]
I
TDI — Test Data in for JTAG interface.
P1.29/TCK
56[6]
I/O
P1.29 — General purpose input/output digital pin (GPIO).
I/O
P1.27 — General purpose input/output digital pin (GPIO).
O
TDO — Test Data out for JTAG interface.
I/O
P1.28 — General purpose input/output digital pin (GPIO).
I
TCK — Test Clock for JTAG interface. This clock must be slower than
6 of the CPU clock (CCLK) for the JTAG interface to operate.
1
P1.30/TMS
52[6]
I/O
P1.30 — General purpose input/output digital pin (GPIO).
I
TMS — Test Mode Select for JTAG interface.
I/O
P1.31 — General purpose input/output digital pin (GPIO).
I
TRST — Test Reset for JTAG interface.
P1.31/TRST
20[6]
D+
10[7]
I/O
USB bidirectional D+ line.
D
11[7]
I/O
USB bidirectional D line.
RESET
57[8]
I
External reset input: A LOW on this pin resets the device, causing
I/O ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
62[9]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
61[9]
O
Output from the oscillator amplifier.
RTCX1
3[9][10]
I
Input to the RTC oscillator circuit.
RTCX2
5[9][10]
O
VSS
6, 18, 25, 42, I
50
Ground: 0 V reference.
VSSA
59
I
Analog ground: 0 V reference. This should nominally be the same
voltage as VSS, but should be isolated to minimize noise and error.
VDD
23, 43, 51
I
3.3 V power supply: This is the power supply voltage for the core and
I/O ports.
LPC2141_42_44_46_48
Product data sheet
Output from the RTC oscillator circuit.
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Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
VDDA
7
I
Analog 3.3 V power supply: This should be nominally the same
voltage as VDD but should be isolated to minimize noise and error.
This voltage is only used to power the on-chip ADC(s) and DAC.
VREF
63
I
ADC reference voltage: This should be nominally less than or equal
to the VDD voltage but should be isolated to minimize noise and error.
Level on this pin is used as a reference for ADC(s) and DAC.
VBAT
49
I
RTC power supply voltage: 3.3 V on this pin supplies the power to
the RTC.
[1]
5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2]
5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If
configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[3]
Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality.
[4]
5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog
input function. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When
configured as an ADC input, digital section of the pad is disabled.
[5]
5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog
output function. When configured as the DAC output, digital section of the pad is disabled.
[6]
5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value typically ranges from 60 k to 300 k.
[7]
Pad is designed in accordance with the Universal Serial Bus (USB) specification, revision 2.0 (Full-speed and Low-speed mode only).
[8]
5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
[9]
Pad provides special analog functionality.
[10] When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating.
The other RTC pin, RTCX2, should be left floating.
LPC2141_42_44_46_48
Product data sheet
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6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
The particular flash implementation in the LPC2141/42/44/46/48 allows for full speed
execution also in ARM mode. It is recommended to program performance critical and
short code sections (such as interrupt service routines and DSP algorithms) in ARM
mode. The impact on the overall code size will be minimal but the speed can be increased
by 30 % over Thumb mode.
6.2 On-chip flash program memory
The LPC2141/42/44/46/48 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash
memory system respectively. This memory may be used for both code and data storage.
Programming of the flash memory may be accomplished in several ways. It may be
programmed In System via the serial port. The application program may also erase and/or
program the flash while the application is running, allowing a great degree of flexibility for
data storage field firmware upgrades, etc. Due to the architectural solution chosen for an
on-chip boot loader, flash memory available for user’s code on LPC2141/42/44/46/48 is
32 kB, 64 kB, 128 kB, 256 kB and 500 kB respectively.
The LPC2141/42/44/46/48 flash memory provides a minimum of 100000 erase/write
cycles and 20 years of data-retention.
LPC2141_42_44_46_48
Product data sheet
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6.3 On-chip static RAM
On-chip static RAM may be used for code and/or data storage. The SRAM may be
accessed as 8-bit, 16-bit, and 32-bit. The LPC2141, LPC2142/44 and LPC2146/48
provide 8 kB, 16 kB and 32 kB of static RAM respectively.
In case of LPC2146/48 only, an 8 kB SRAM block intended to be utilized mainly by the
USB can also be used as a general purpose RAM for data storage and code storage and
execution.
6.4 Memory map
The LPC2141/42/44/46/48 memory map incorporates several distinct regions, as shown
in Figure 5.
In addition, the CPU interrupt vectors may be remapped to allow them to reside in either
flash memory (the default) or on-chip static RAM. This is described in Section 6.19
“System control”.
4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
0xF000 0000
3.75 GB
VPB PERIPHERALS
0xE000 0000
3.5 GB
3.0 GB
2.0 GB
RESERVED ADDRESS SPACE
0xC000 0000
0x8000 0000
0x7FFF FFFF
BOOT BLOCK (12 kB REMAPPED FROM
ON-CHIP FLASH MEMORY
0x7FFF D000
0x7FFF CFFF
RESERVED ADDRESS SPACE
0x7FD0 2000
0x7FD0 1FFF
8 kB ON-CHIP USB DMA RAM (LPC2146/2148)
0x7FD0 0000
0x7FCF FFFF
RESERVED ADDRESS SPACE
0x4000 8000
0x4000 7FFF
32 kB ON-CHIP STATIC RAM (LPC2146/2148)
0x4000 4000
0x4000 3FFF
16 kB ON-CHIP STATIC RAM (LPC2142/2144)
0x4000 2000
0x4000 1FFF
8 kB ON-CHIP STATIC RAM (LPC2141)
0x4000 0000
0x3FFF FFFF
1.0 GB
RESERVED ADDRESS SPACE
0x0008 0000
0x0007 FFFF
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2148)
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2146)
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2144)
TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2142)
TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2141)
0.0 GB
0x0004 0000
0x0003 FFFF
0x0002 0000
0x0001 FFFF
0x0001 0000
0x0000 FFFF
0x0000 8000
0x0000 7FFF
0x0000 0000
002aab558
Fig 5.
LPC2141_42_44_46_48
Product data sheet
LPC2141/42/44/46/48 memory map
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6.5 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and
categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt ReQuest (IRQ), and
non-vectored IRQ as defined by programmable settings. The programmable assignment
scheme means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine does not need to branch into the interrupt service routine but can
run from the interrupt vector location. If more than one request is assigned to the FIQ
class, the FIQ service routine will read a word from the VIC that identifies which FIQ
source(s) is (are) requesting an interrupt.
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC
provides the address of the highest-priority requesting IRQs service routine, otherwise it
provides the address of a default routine that is shared by all the non-vectored IRQs. The
default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the Vectored Interrupt
Controller, but may have several internal interrupt flags. Individual interrupt flags may also
represent more than one interrupt source.
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
The Pin Control Module with its pin select registers defines the functionality of the
microcontroller in a given hardware environment.
After reset all pins of Port 0 and Port 1 are configured as input with the following
exceptions: If debug is enabled, the JTAG pins will assume their JTAG functionality; if
trace is enabled, the Trace pins will assume their trace functionality. The pins associated
with the I2C0 and I2C1 interface are open drain.
LPC2141_42_44_46_48
Product data sheet
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6.7 Fast general purpose parallel I/O (GPIO)
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
LPC2141/42/44/46/48 introduce accelerated GPIO functions over prior LPC2000 devices:
• GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte addressable.
• Entire port value can be written in one instruction.
6.7.1 Features
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
6.8 10-bit ADC
The LPC2141/42 contain one and the LPC2144/46/48 contain two analog to digital
converters. These converters are single 10-bit successive approximation analog to digital
converters. While ADC0 has six channels, ADC1 has eight channels. Therefore, total
number of available ADC inputs for LPC2141/42 is 6 and for LPC2144/46/48 is 14.
6.8.1 Features
•
•
•
•
•
•
•
10 bit successive approximation analog to digital converter.
Measurement range of 0 V to VREF (2.5 V VREF VDDA).
Each converter capable of performing more than 400000 10-bit samples per second.
Every analog input has a dedicated result register to reduce interrupt overhead.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or timer match signal.
Global Start command for both converters (LPC2142/44/46/48 only).
6.9 10-bit DAC
The DAC enables the LPC2141/42/44/46/48 to generate a variable analog output. The
maximum DAC output voltage is the VREF voltage.
6.9.1 Features
• 10-bit DAC.
• Buffered output.
• Power-down mode available.
LPC2141_42_44_46_48
Product data sheet
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• Selectable speed versus power.
6.10 USB 2.0 device controller
The USB is a 4-wire serial bus that supports communication between a host and a
number (127 max) of peripherals. The host controller allocates the USB bandwidth to
attached devices through a token based protocol. The bus supports hot plugging,
unplugging, and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The LPC2141/42/44/46/48 is equipped with a USB device controller that enables
12 Mbit/s data exchange with a USB host controller. It consists of a register interface,
serial interface engine, endpoint buffer memory and DMA controller. The serial interface
engine decodes the USB data stream and writes data to the appropriate end point buffer
memory. The status of a completed USB transfer or error condition is indicated via status
registers. An interrupt is also generated if enabled.
A DMA controller (available in LPC2146/48 only) can transfer data between an endpoint
buffer and the USB RAM.
6.10.1 Features
•
•
•
•
•
Fully compliant with USB 2.0 Full-speed specification.
Supports 32 physical (16 logical) endpoints.
Supports control, bulk, interrupt and isochronous endpoints.
Scalable realization of endpoints at run time.
Endpoint maximum packet size selection (up to USB maximum specification) by
software at run time.
• RAM message buffer size based on endpoint realization and maximum packet size.
• Supports SoftConnect and GoodLink LED indicator. These two functions are sharing
one pin.
•
•
•
•
Supports bus-powered capability with low suspend current.
Supports DMA transfer on all non-control endpoints (LPC2146/48 only).
One duplex DMA channel serves all endpoints (LPC2146/48 only).
Allows dynamic switching between CPU controlled and DMA modes (only in
LPC2146/48).
• Double buffer implementation for bulk and isochronous endpoints.
6.11 UARTs
The LPC2141/42/44/46/48 each contain two UARTs. In addition to standard transmit and
receive data lines, the LPC2144/46/48 UART1 also provides a full modem control
handshake interface.
Compared to previous LPC2000 microcontrollers, UARTs in LPC2141/42/44/46/48
introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers
to achieve standard baud rates such as 115200 with any crystal frequency above 2 MHz.
In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware
(UART1 in LPC2144/46/48 only).
LPC2141_42_44_46_48
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6.11.1 Features
•
•
•
•
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs.
• LPC2144/46/48 UART1 equipped with standard modem interface signals. This
module also provides full support for hardware flow control (auto-CTS/RTS).
6.12 I2C-bus serial I/O controller
The LPC2141/42/44/46/48 each contain two I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line
(SCL), and a Serial DAta line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the
capability to both receive and send information (such as memory)). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be
controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2141/42/44/46/48 supports bit rates up to 400 kbit/s
(Fast I2C-bus).
6.12.1 Features
•
•
•
•
•
•
Compliant with standard I2C-bus interface.
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
6.13 SPI serial I/O controller
The LPC2141/42/44/46/48 each contain one SPI controller. The SPI is a full duplex serial
interface, designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends a byte of data to the slave, and
the slave always sends a byte of data to the master.
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6.13.1 Features
•
•
•
•
Compliant with SPI specification.
Synchronous, Serial, Full Duplex, Communication.
Combined SPI master and slave.
Maximum data bit rate of one eighth of the input clock rate.
6.14 SSP serial I/O controller
The LPC2141/42/44/46/48 each contain one Serial Synchronous Port controller (SSP).
The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. However, only a single master and a
single slave can communicate on the bus during a given data transfer. The SSP supports
full duplex transfers, with data frames of 4 bits to 16 bits of data flowing from the master to
the slave and from the slave to the master. Often only one of these data flows carries
meaningful data.
6.14.1 Features
• Compatible with Motorola’s SPI, TI’s 4-wire SSI and National Semiconductor’s
Microwire buses.
•
•
•
•
Synchronous serial communication.
Master or slave operation.
8-frame FIFOs for both transmit and receive.
Four bits to 16 bits per frame.
6.15 General purpose timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2141/42/44/46/48 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs, or used as external
interrupts.
6.15.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• External event counter or timer operation.
• Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
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– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.16 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.16.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal pre-scaler.
Selectable time period from (Tcy(PCLK) 256 4) to (Tcy(PCLK) 232 4) in multiples of
Tcy(PCLK) 4.
6.17 Real-time clock
The RTC is designed to provide a set of counters to measure time when normal or idle
operating mode is selected. The RTC has been designed to use little power, making it
suitable for battery powered systems where the CPU is not running continuously (Idle
mode).
6.17.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the
external crystal/oscillator input at XTAL1. Programmable reference clock divider
allows fine adjustment of the RTC.
• Dedicated power supply pin can be connected to a battery or the main 3.3 V.
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6.18 Pulse width modulator
The PWM is based on the standard timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2141/42/44/46/48. The timer is designed
to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is also based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the MR0 match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
6.18.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
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• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
6.19 System control
6.19.1 Crystal oscillator
On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz.
The oscillator output frequency is called fosc and the ARM processor clock frequency is
referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same
value unless the PLL is running and connected. Refer to Section 6.19.2 “PLL” for
additional information.
6.19.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a
clock source. The PLL settling time is 100 s.
6.19.3 Reset and wake-up timer
Reset has two sources on the LPC2141/42/44/46/48: the RESET pin and watchdog reset.
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of
chip reset by any source starts the Wake-up Timer (see Wake-up Timer description
below), causing the internal chip reset to remain asserted until the external reset is
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the
on-chip flash controller has completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined values.
The Wake-up Timer ensures that the oscillator and other analog functions required for
chip operation are fully functional before the processor is allowed to execute instructions.
This is important at power on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the Wake-up Timer.
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The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.19.4 Brownout detector
The LPC2141/42/44/46/48 include 2-stage monitoring of the voltage on the VDD pins. If
this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the VIC. This signal
can be enabled for interrupt; if not, software can monitor the signal by reading dedicated
register.
The second stage of low voltage detection asserts reset to inactivate the
LPC2141/42/44/46/48 when the voltage on the VDD pins falls below 2.6 V. This reset
prevents alteration of the flash as operation of the various elements of the chip would
otherwise become unreliable due to low voltage. The BOD circuit maintains this reset
down below 1 V, at which point the POR circuitry maintains the overall reset.
Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event
loop to sense the condition.
6.19.5 Code security
This feature of the LPC2141/42/44/46/48 allow an application to control whether it can be
debugged or protected from observation.
If after reset on-chip boot loader detects a valid checksum in flash and reads 0x8765 4321
from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be
protected from observation. Once debugging is disabled, it can be enabled only by
performing a full chip erase using the ISP.
6.19.6 External interrupt inputs
The LPC2141/42/44/46/48 include up to nine edge or level sensitive External Interrupt
Inputs as selectable pin functions. When the pins are combined, external events can be
processed as four independent interrupt signals. The External Interrupt Inputs can
optionally be used to wake-up the processor from Power-down mode.
Additionally capture input pins can also be used as external interrupts without the option
to wake the device up from Power-down mode.
6.19.7 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
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6.19.8 Power control
The LPC2141/42/44/46/48 supports two reduced power modes: Idle mode and
Power-down mode.
In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip
RTC will enable the microcontroller to have the RTC active during Power-down mode.
Power-down current is increased with RTC active. However, it is significantly lower than in
Idle mode.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings during active
and Idle mode.
6.19.9 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB bus so that they can operate at
the speed chosen for the ARM processor. In order to achieve this, the APB bus may be
slowed down to 12 to 14 of the processor clock rate. Because the APB bus must work
properly at power-up (and its timing cannot be altered if it does not work since the APB
divider control registers reside on the APB bus), the default condition at reset is for the
APB bus to run at 14 of the processor clock rate. The second purpose of the APB divider
is to allow power savings when an application does not require any peripherals to run at
the full processor rate. Because the APB divider is connected to the PLL output, the PLL
remains active (if it was running) during Idle mode.
6.20 Emulation and debugging
The LPC2141/42/44/46/48 support emulation and debugging via a JTAG serial port. A
trace port allows tracing program execution. Debugging and trace functions are
multiplexed only with GPIOs on Port 1. This means that all communication, timer and
interface peripherals residing on Port 0 are available during the development and
debugging phase as they are when the application is run in the embedded system itself.
6.20.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote
debug protocol commands to the JTAG data needed to access the ARM core.
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The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S
core. The DCC allows the JTAG port to be used for sending and receiving data without
affecting the normal program flow. The DCC data and control registers are mapped in to
addresses in the EmbeddedICE logic.
This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to
operate.
6.20.2 Embedded trace
Since the LPC2141/42/44/46/48 have significant amounts of on-chip memory, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability
for deeply embedded processor cores. It outputs information about processor execution to
the trace port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.20.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2141/42/44/46/48 contain a specific
configuration of RealMonitor software programmed into the on-chip flash memory.
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7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
VDD
supply voltage (core and external rail)
VDDA
analog 3.3 V pad supply voltage
Vi(VBAT)
input voltage on pin VBAT
Vi(VREF)
input voltage on pin VREF
VIA
analog input voltage
on ADC related
pins
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD
supply voltage is
present
Max
Unit
0.5
+3.6
V
0.5
+4.6
V
0.5
+4.6
V
0.5
+4.6
V
0.5
+5.1
V
[2]
0.5
+6.0
V
other I/O pins
[2][3]
0.5
VDD + 0.5
V
per supply pin
[4]
-
100
mA
[4]
-
100
mA
-
20
mA
65
+150
C
-
1.5
W
4000
+4000
V
for the RTC
supply current
IDD
Min
ISS
ground current
per ground pin
Isink
sink current
for I2C-bus; DC;
T = 85 C
Tstg
storage temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
Vesd
electrostatic discharge voltage
human body model
[5]
[6]
all pins
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
Dependent on package type.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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8. Static characteristics
Table 5.
Static characteristics
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Symbol
Parameter
VDD
supply voltage
VDDA
analog supply voltage
Vi(VBAT)
input voltage on pin
VBAT
Vi(VREF)
input voltage on pin
VREF
Conditions
[2]
3.3 V pad
[3]
Min
Typ[1]
Max
Unit
3.0
3.3
3.6
V
3.0
3.3
3.6
V
2.0
3.3
3.6
V
2.5
3.3
VDDA
V
-
-
3
A
Standard port pins, RESET, P1.26/RTCK
IIL
LOW-level input current
VI = 0 V; no pull-up
IIH
HIGH-level input current VI = VDD; no pull-down
-
-
3
A
IOZ
OFF-state output
current
VO = 0 V; VO = VDD; no
pull-up/down
-
-
3
A
Ilatch
I/O latch-up current
(0.5VDD) < VI < (1.5VDD);
-
-
100
mA
VI
input voltage
pin configured to provide a
digital function
0
-
5.5
V
0
-
VDD
V
Tj < 125 C
[4][5][6]
[7]
VO
output voltage
output active
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Vhys
hysteresis voltage
0.4
-
-
V
VDD 0.4
-
-
V
VOH
HIGH-level output
voltage
IOH = 4 mA
[8]
VOL
LOW-level output
voltage
IOL = 4 mA
[8]
-
-
0.4
V
IOH
HIGH-level output
current
VOH = VDD 0.4 V
[8]
4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
[8]
4
-
-
mA
IOHS
HIGH-level short-circuit
output current
VOH = 0 V
[9]
-
-
45
mA
IOLS
LOW-level short-circuit
output current
VOL = VDDA
[9]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[10]
10
50
150
A
VI = 0 V
[11]
15
50
85
A
VDD < VI < 5 V
[10]
0
0
0
A
Ipu
pull-up current
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Table 5.
Static characteristics …continued
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
IDD(act)
active mode supply
current
VDD = 3.3 V; Tamb = 25 C;
code
-
15
50
Unit
while(1){}
executed from flash, no active
peripherals
CCLK = 10 MHz
mA
CCLK = 60 MHz
VDD = 3.3 V; Tamb = 25 C;
code executed from flash; USB
enabled and active; all other
peripherals disabled
-
40
70
-
27
70
-
57
90
mA
-
40
100
A
-
250
500
A
-
15
30
-
20
40
-
78
-
CCLK = 12 MHz
mA
CCLK = 60 MHz
Power-down mode
supply current
IDD(pd)
Power-down mode
battery supply current
IBATpd
VDD = 3.3 V; Tamb = 25 C
VDD = 3.3 V; Tamb = 85 C
[12]
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C
A
VDD = 3.0 V; Vi(VBAT) = 2.5 V
VDD = 3.0 V; Vi(VBAT) = 3.0 V
IBATact
active mode battery
supply current
[12]
CCLK = 60 MHz;
PCLK = 15 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C
optimized active mode
battery supply current
PCLK disabled to RTCK in the
PCONP register;
RTC clock = 32 kHz
(from RTCXn pins);
Tamb = 25 C; Vi(VBAT) = 3.3 V
[12][13]
-
23
-
-
30
-
A
V
A
CCLK = 25 MHz
CCLK = 60 MHz
I2C-bus
A
A
VDD = 3.0 V; Vi(VBAT) = 3.0 V
IBATact(opt)
mA
pins
VIH
HIGH-level input voltage
0.7VDD
-
-
VIL
LOW-level input voltage
-
-
0.3VDD
V
Vhys
hysteresis voltage
-
0.05VDD
-
V
VOL
LOW-level output
voltage
IOLS = 3 mA
[8]
-
-
0.4
V
ILI
input leakage current
VI = VDD
[14]
-
2
4
A
-
10
22
A
0.5
1.8
1.95
V
VI = 5 V
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
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Single-chip 16-bit/32-bit microcontrollers
Table 5.
Static characteristics …continued
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Min
Typ[1]
Max
Unit
output voltage on pin
XTAL2
0.5
1.8
1.95
V
Vi(RTCX1)
input voltage on pin
RTCX1
0.5
1.8
1.95
V
Vo(RTCX2)
output voltage on pin
RTCX2
0.5
1.8
1.95
V
-
-
10
A
-
-
5.25
V
Symbol
Parameter
Vo(XTAL2)
Conditions
USB pins
IOZ
OFF-state output
current
0 V < VI < 3.3 V
VBUS
VBUS line input voltage
on the USB connector
VDI
differential input
sensitivity
|(D+) (D)|
0.2
-
-
V
VCM
differential
common-mode range
includes VDI range
0.8
-
2.5
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
-
2.0
V
VOL
LOW output level
RL of 1.5 k to 3.6 V
-
-
0.3
V
VOH
HIGH output level
RL of 15 k to GND
2.8
-
3.6
V
Ctrans
transceiver capacitance
pin to GND
-
-
20
pF
29
-
44
1.1
-
1.9
k
ZDRV
driver output impedance steady state drive
for driver which is not
high-speed capable
Rpu
pull-up resistance
SoftConnect = ON
[15]
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
Core and external rail.
[3]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[4]
Including voltage on outputs in 3-state mode.
[5]
VDD supply voltages must be present.
[6]
3-state outputs go into 3-state mode when VDD is grounded.
[7]
Please also see the errata note mentioned in errata sheet.
[8]
Accounts for 100 mV voltage drop in all supply lines.
[9]
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[10] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[11] Applies to P1.16 to P1.31.
[12] On pin VBAT.
[13] Optimized for low battery consumption.
[14] To VSS.
[15] Includes external resistors of 33 ± 1 % on D+ and D.
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9. Dynamic characteristics
Table 6.
Dynamic characteristics of USB pins (full-speed)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
10 % to 90 %
4
-
20
ns
tf
fall time
10 % to 90 %
4
-
20
ns
tFRFM
differential rise and fall time
matching
(tr/tf)
90
-
110
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
tFEOPT
source SE0 interval of EOP
see Figure 7
160
-
175
ns
tFDEOP
source jitter for differential transition
to SE0 transition
see Figure 7
2
-
+5
ns
tJR1
receiver jitter to next transition
18.5
-
+18.5
ns
tJR2
receiver jitter for paired transitions
10 % to 90 %
9
-
+9
ns
tEOPR1
EOP width at receiver
must reject as
EOP; see
Figure 7
[1]
40
-
-
ns
tEOPR2
EOP width at receiver
must accept as
EOP; see
Figure 7
[1]
82
-
-
ns
Min
Typ[2]
Max
Unit
[1]
Characterized but not implemented as production test. Guaranteed by design.
Table 7.
Dynamic characteristics
Tamb = 40 C to +85 C for commercial applications, VDD over specified ranges[1]
Symbol
Parameter
Conditions
External clock
fosc
oscillator frequency
10
-
25
MHz
Tcy(clk)
clock cycle time
40
-
100
ns
tCHCX
clock HIGH time
Tcy(clk) 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0.2, P0.3, P0.11, and P0.14)
tr(o)
output rise time
-
10
-
ns
tf(o)
output fall time
-
10
-
ns
20 + 0.1 Cb[3]
-
-
ns
I2C-bus pins (P0.2, P0.3, P0.11, and P0.14)
output fall time
tf(o)
VIH to VIL
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
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9.1 Timing
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 6.
External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
TPERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: tFEOPT
differential data to
SE0/EOP skew
n × TPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 7.
Differential data-to-EOP transition skew and EOP width
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10. ADC electrical characteristics
Table 8.
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
ED
differential linearity error
EL(adj)
integral non-linearity
offset error
EO
Conditions
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
1
pF
VSSA = 0 V, VDDA = 3.3 V
[1][2]
-
-
1
LSB
VSSA = 0 V, VDDA = 3.3 V
[3]
-
-
2
LSB
VSSA = 0 V, VDDA = 3.3 V
[4]
-
-
3
LSB
EG
gain error
VSSA = 0 V, VDDA = 3.3 V
[5]
-
-
0.5
%
ET
absolute error
VSSA = 0 V, VDDA = 3.3 V
[6]
-
-
4
LSB
[7]
-
-
40
k
voltage source interface
resistance
Rvsi
[1]
The ADC is monotonic, there are no missing codes.
[2]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8.
[3]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 8.
[4]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 8.
[5]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 8.
[6]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 8.
[7]
See Figure 9.
LPC2141_42_44_46_48
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offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
1 LSB =
Vi(VREF) − VSSA
1024
002aae604
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 8.
ADC characteristics
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LPC2141/42/44/46/48
20 kΩ
ADx.y
ADx.ySAMPLE
3 pF
Rvsi
5 pF
VEXT
VSS
002aab834
Fig 9.
Suggested ADC interface - LPC2141/42/44/46/48 ADx.y pin
LPC2141_42_44_46_48
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11. DAC electrical characteristics
Table 9.
DAC electrical characteristics
VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified
Symbol
Parameter
ED
Min
Typ
Max
Unit
differential linearity error
-
1
-
LSB
EL(adj)
integral non-linearity
-
1.5
-
LSB
EO
offset error
-
0.6
-
%
EG
gain error
-
0.6
-
%
CL
load capacitance
-
200
-
pF
RL
load resistance
1
-
-
k
LPC2141_42_44_46_48
Product data sheet
Conditions
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12. Application information
12.1 Suggested USB interface solutions
VDD
CONNECT
soft-connect switch
LPC2141/42/
44/46/48
R1
1.5 kΩ
VBUS
D+
RS = 33 Ω
D−
RS = 33 Ω
USB-B
connector
VSS
002aab563
Fig 10. LPC2141/42/44/46/48 USB interface using the CONNECT function on pin 17
VDD
R2
LPC2141/42/
44/46/48
UP_LED
R1
1.5 kΩ
VBUS
D+
RS = 33 Ω
D−
RS = 33 Ω
USB-B
connector
VSS
002aab562
Fig 11. LPC2141/42/44/46/48 USB interface using the UP_LED function on pin 17
12.2 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In
slave mode, a minimum of 200 mV (RMS) is needed.
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LPC2xxx
XTAL1
Ci
100 pF
Cg
002aae718
Fig 12. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 12), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTAL2 pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 13 and in
Table 10 and Table 11. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 13 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
LPC2xxx
L
XTAL1
XTAL2
=
CL
CP
XTAL
RS
CX2
CX1
002aag469
Fig 13. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 10.
LPC2141_42_44_46_48
Product data sheet
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
1 MHz to 5 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 300
39 pF, 39 pF
30 pF
< 300
57 pF, 57 pF
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Table 10.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
5 MHz to 10 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 200
39 pF, 39 pF
30 pF
< 100
57 pF, 57 pF
10 pF
< 160
18 pF, 18 pF
20 pF
< 60
39 pF, 39 pF
10 pF
< 80
18 pF, 18 pF
10 MHz to 15 MHz
15 MHz to 20 MHz
Table 11.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180
18 pF, 18 pF
20 pF
< 100
39 pF, 39 pF
20 MHz to 25 MHz
10 pF
< 160
18 pF, 18 pF
20 pF
< 80
39 pF, 39 pF
12.3 RTC 32 kHz oscillator component selection
LPC2xxx
L
RTCX1
RTCX2
=
CL
CP
32 kHz XTAL
RS
CX1
CX2
002aaf495
Fig 14. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for CX1/CX2 evaluation
The RTC external oscillator circuit is shown in Figure 14. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected
externally to the microcontroller.
Table 12 gives the crystal parameters that should be used. CL is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
CL influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 12
LPC2141_42_44_46_48
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that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in
this table are calculated from the internal parasitic capacitances and the CL. Parasitics
from PCB and package are not taken into account.
Table 12.
Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components
Crystal load capacitance Maximum crystal series
CL
resistance RS
External load capacitors CX1/CX2
11 pF
< 100 k
18 pF, 18 pF
13 pF
< 100 k
22 pF, 22 pF
15 pF
< 100 k
27 pF, 27 pF
12.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plane. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
LPC2141_42_44_46_48
Product data sheet
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13. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y
X
A
48
33
49
32
ZE
e
E HE
A
A2
(A 3)
A1
wM
θ
bp
pin 1 index
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
1.45
1.05
1.45
1.05
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT314-2
136E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 15. Package outline SOT314-2 (LQFP64)
LPC2141_42_44_46_48
Product data sheet
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14. Abbreviations
Table 13.
LPC2141_42_44_46_48
Product data sheet
Acronym list
Acronym
Description
ADC
Analog-to-Digital Converter
APB
Advanced Peripheral Bus
BOD
Brown-Out Detection
CPU
Central Processing Unit
DAC
Digital-to-Analog Converter
DCC
Debug Communications Channel
DMA
Direct Memory Access
EOP
End Of Packet
FIFO
First In, First Out
GPIO
General Purpose Input/Output
PLL
Phase-Locked Loop
POR
Power-On Reset
PWM
Pulse Width Modulator
RAM
Random Access Memory
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSP
Synchronous Serial Port
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
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15. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
LPC2141_42_44_46_48 v.5
20110812
Product data sheet
-
Modifications:
LPC2141_42_44_46_48 v.4
Modifications:
•
•
•
LPC2141_42_44_46_48 v.4
Table 3 “Pin description”: Added Table note [10] to RTCX1 and RTCX2 pins.
Table 4 “Limiting values”: Added parameter Isink.
Table 5 “Static characteristics”, I2C-bus pins: Changed typical hysteresis voltage from
0.5VDD to 0.05VDD.
•
Table 5 “Static characteristics”: Updated min, typical and max values for oscillator pins
Vi(XTAL1), Vo(XTAL2), Vi(RTCX1), and Vo(RTCX2).
•
•
•
•
•
•
Table 5 “Static characteristics”: Updated Table note [15].
Added Section 11 “DAC electrical characteristics”.
Added Section 12.2 “Crystal oscillator XTAL input and component selection”.
Added Section 12.3 “RTC 32 kHz oscillator component selection”.
Added Section 12.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
Updated Figure 8 “ADC characteristics”.
20081117
•
•
•
•
•
•
•
Product data sheet
-
LPC2141_42_44_46_48 v.3
Replaced all occurrences of VPB with APB.
Table 3: clarified which pins do/don’t have internal pull-ups.
Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.
Table 5: added Table note 7 to input voltage spec.
Table 5: modified Table note 9.
Table 5: moved hysteresis voltage (0.4 V) from typ to min column.
Figure 8: updated figure and figure title, removed note
LPC2141_42_44_46_48 v.3
20071019
Product data sheet
-
LPC2141_42_44_46_48 v.2
LPC2141_42_44_46_48 v.2
20060828
Product data sheet
-
LPC2141_42_44_46_48 v.1
LPC2141_42_44_46_48 v.1
20051003
Preliminary data sheet
-
-
LPC2141_42_44_46_48
Product data sheet
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
43 of 45
LPC2141/42/44/46/48
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC2141_42_44_46_48
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 12 August 2011
© NXP B.V. 2011. All rights reserved.
44 of 45
NXP Semiconductors
LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
18. Contents
1
2
2.1
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.6
6.7
6.7.1
6.8
6.8.1
6.9
6.9.1
6.10
6.10.1
6.11
6.11.1
6.12
6.12.1
6.13
6.13.1
6.14
6.14.1
6.15
6.15.1
6.16
6.16.1
6.17
6.17.1
6.18
6.18.1
6.19
6.19.1
6.19.2
6.19.3
6.19.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . 13
Architectural overview . . . . . . . . . . . . . . . . . . 13
On-chip flash program memory . . . . . . . . . . . 13
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 14
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 15
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 15
Fast general purpose parallel I/O (GPIO) . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
USB 2.0 device controller . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
I2C-bus serial I/O controller . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SSP serial I/O controller . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
General purpose timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Pulse width modulator . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
System control . . . . . . . . . . . . . . . . . . . . . . . . 22
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 22
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Reset and wake-up timer . . . . . . . . . . . . . . . . 22
Brownout detector . . . . . . . . . . . . . . . . . . . . . 23
6.19.5
Code security . . . . . . . . . . . . . . . . . . . . . . . . .
6.19.6
External interrupt inputs . . . . . . . . . . . . . . . . .
6.19.7
Memory mapping control . . . . . . . . . . . . . . . .
6.19.8
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
6.19.9
APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.20
Emulation and debugging . . . . . . . . . . . . . . .
6.20.1
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
6.20.2
Embedded trace. . . . . . . . . . . . . . . . . . . . . . .
6.20.3
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
8
Static characteristics . . . . . . . . . . . . . . . . . . .
9
Dynamic characteristics. . . . . . . . . . . . . . . . .
9.1
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
ADC electrical characteristics . . . . . . . . . . . .
11
DAC electrical characteristics . . . . . . . . . . . .
12
Application information . . . . . . . . . . . . . . . . .
12.1
Suggested USB interface solutions . . . . . . . .
12.2
Crystal oscillator XTAL input and component
selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3
RTC 32 kHz oscillator component selection .
12.4
XTAL and RTCX Printed Circuit Board (PCB)
layout guidelines . . . . . . . . . . . . . . . . . . . . . .
13
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
15
Revision history . . . . . . . . . . . . . . . . . . . . . . .
16
Legal information . . . . . . . . . . . . . . . . . . . . . .
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
16.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
17
Contact information . . . . . . . . . . . . . . . . . . . .
18
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
23
24
24
24
24
25
25
26
27
30
31
32
35
36
36
36
38
39
40
41
42
43
43
43
43
44
44
45
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 August 2011
Document identifier: LPC2141_42_44_46_48
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