LPC2210/2220
16/32-bit ARM microcontrollers; flashless with 64 kB, with 10-bit ADC and external memory interface
Rev. 04 — 2 October 2007 Product data sheet
1. General description
The LPC2210/2220 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, PWM channels, and up to nine external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. The LPC2210/2220 can provide up to 76 GPIOs depending on bus configuration. With a wide range of serial communications interfaces, it is also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.
2. Features
2.1 Key features
I 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 and TFBGA144 package. I 16/64 kB on-chip static RAM (LPC2210/2220). I Serial bootloader using UART0 provides in-system download and programming capabilities. I EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software as well as high-speed real-time tracing of instruction execution. I Eight channel 10-bit ADC with conversion time as low as 2.44 µs. I Two 32-bit timers (LPC2220 also external event counters) with four capture and four compare channels, PWM unit (six outputs), Real-Time Clock (RTC), and watchdog. I Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s) and two SPIs. On the LPC2220, a Synchronous Serial Port (SSP) with data buffers and variable length transfers can be selected to replace one SPI. I Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses. I Configurable external memory interface with up to four banks, each up to 16 MB and 8/16/32-bit data width. I Up to 76 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive external interrupt pins available.
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
I 60/75 MHz (LPC2210/2220) maximum CPU clock available from programmable on-chip Phase-Locked Loop (PLL) with settling time of 100 µs. I On-chip integrated oscillator operates with external crystal in range of 1 MHz to 30 MHz and with external oscillator up to 50 MHz. I Power saving modes include Idle and Power-down. I Processor wake-up from Power-down mode via external interrupt. I Individual enable/disable of peripheral functions for power optimization. I Dual power supply: N CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V). N I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads. 16/32-bit ARM7TDMI-S processor.
3. Ordering information
Table 1. Ordering information Package Name LPC2210FBD144 LPC2220FBD144 LPC2220FET144 LPC2220FET144/G LQFP144 LQFP144 TFBGA144 TFBGA144 Description Version plastic low profile quad flat package; 144 leads; SOT486-1 body 20 × 20 × 1.4 mm plastic low profile quad flat package; 144 leads; SOT486-1 body 20 × 20 × 1.4 mm plastic thin fine-pitch ball grid array package; 144 balls; body 12 × 12 × 0.8 mm plastic thin fine-pitch ball grid array package; 144 balls; body 12 × 12 × 0.8 mm SOT569-1 SOT569-1 Type number
3.1 Ordering options
Table 2. Ordering options RAM 16 kB 64 kB 64 kB 64 kB Temperature range −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C Type number LPC2210FBD144 LPC2220FBD144 LPC2220FET144 LPC2220FET144/G
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
2 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
4. Block diagram
TMS(1) TDI(1) TRST(1) TCK(1) TDO(1) XTAL2 XTAL1 RESET
LPC2210 LPC2220
P0[30:27], P0[25:0] P1[31:16], P1[1:0]
TEST/DEBUG INTERFACE
EMULATION TRACE MODULE
PLL system clock
SYSTEM FUNCTIONS VECTORED INTERRUPT CONTROLLER
ARM7TDMI-S
FAST GENERAL PURPOSE I/O AHB BRIDGE
ARM7 local bus
AMBA AHB (Advanced High-performance Bus)
INTERNAL SRAM CONTROLLER
AHB DECODER AHB TO APB BRIDGE APB DIVIDER CS3 to CS0(2) A23 to A0(2) BLS[3:0](2) OE, WE(2) D31 to D0(2) SCL SDA SCK0, SCK1
16/64 kB SRAM
EXTERNAL MEMORY CONTROLLER
APB (advanced peripheral bus) EINT3 to EINT0 EXTERNAL INTERRUPTS I2C SERIAL INTERFACE
4 × CAP0 4 × CAP1 4 × MAT0 4 × MAT1
CAPTURE/ COMPARE TIMER 0/TIMER 1
SPI AND SSP SERIAL INTERFACES 0 AND 1
MOSI0, MOSI1 MISO0, MISO1 SSEL0, SSEL1 TXD0, TXD1
AIN7 to AIN0
A/D CONVERTER
UART0/UART1
P0[30:27], P0[25:0] P1[31:16], P1[1:0] P2[31:0] P3[31:0] WATCHDOG TIMER GENERAL PURPOSE I/O REAL TIME CLOCK
RXD0, RXD1 DSR1, CTS1, RTS, DTR DCD1, RI1
PWM6 to PWM1
PWM0
SYSTEM CONTROL
002aaa793
(1) When test/debug interface is used, GPIO/other functions sharing these pins are not available. (2) Shared with GPIO.
Fig 1. Block diagram
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
3 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
5. Pinning information
5.1 Pinning
144 109 108 73 37 72
002aaa794
1
LPC2210FBD144 LPC2220FBD144
36
Fig 2. Pin configuration for LQFP144
ball A1 index area
LPC2220FET144
1 2 3 4 5 6 7 8 9 10 11 12 13
A B C D E F G H J K L M N
002aab245
Transparent top view
Fig 3. Ball configuration diagram for TFBGA144
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
4 of 49
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Table 3. 1 A B P2.22/ D22 VDD(3V3) Ball allocation 2 VDDA(1V8) P1.27/ TDO 3 P1.28/ TDI XTAL2 4 P2.21/ D21 VSSA(PLL) 5 P2.18/ D18 P2.19/ D19 6 P2.14/ D14 P2.15/ D15 7 P1.29/ TCK P2.12/ D12 8 P2.11/ D11 P0.20/ MAT1.3/ SSEL1/ EINT3 P0.19/ MAT1.2/ MOSI1/ CAP1.2 P0.18/ CAP1.3/ MISO1/ MAT1.3 9 P2.10/ D10 VDD(3V3) 10 P2.7/D7 P2.6/D6 11 VDD(3V3) VSS 12 VDD(1V8) P2.3/D3 13 P2.4/D4 VSS
Product data sheet Rev. 04 — 2 October 2007
© NXP B.V. 2007. All rights reserved. LPC2210_2220_4
NXP Semiconductors
Row Column
C
P0.21/ PWM5/ CAP1.3 P0.24
VSS
XTAL1
VSSA
RESET
P2.16/ D16
P2.13/ D13
P2.9/D9
P2.5/D5
P2.2/D2
P2.1/D1
VDD(3V3)
D
P1.19/ TRACEP KT3 P2.24/ D24
P0.23
P0.22/ CAP0.0/ MAT0.0 VSS
P2.20/ D20
P2.17/ D17
VSS
P2.8/D8
P1.30/ TMS
VSS
P1.20/ TRACES YNC P2.0/D0
P0.17/ CAP1.2/ SCK1/ MAT1.2 P3.30/ BLS1
16/32-bit ARM microcontrollers with external memory interface
E
P2.25/ D25
P2.23
P0.16/ EINT0/ MAT0.2/ CAP0.2 P3.31/ BLS0 P0.14/ DCD1/ EINT1 P0.13/ DTR1/ MAT1.1 P3.3/A3
P0.15/ RI1/ EINT2
F
P2.27/ D27/ BOOT1 P2.29/ D29 P0.25
P1.18/ TRACEP KT2 P2.28/ D28 n.c.
VDDA(3V3)
P2.26/ D26/ BOOT0
P1.21/ VDD(3V3) PIPESTAT 0 P1.0/CS0 VSS
VSS
G
P2.30/ P2.31/ D30/AIN4 D31/AIN5 P0.27/ AIN0/ CAP0.1/ MAT0.1 P3.29/ BLS2/ AIN6 VDD(3V3) P1.17/ TRACEP KT1 P3.28/ BLS3/ AIN7 P3.22/ A22 P3.20/ A20 P0.1/ RXD0/ PWM3/ EINT0 P3.14/ A14 P1.25/ EXTIN0 P3.11/ A11
P1.1/OE
H
P1.22/ P3.2/A2 PIPESTAT 1 P1.23/ P0.11/ PIPESTAT CTS1/ 2 CAP1.1 P0.10/ RTS1/ CAP1.0 VSS
P3.1/A1
LPC2210/2220
J
P0.28/ AIN1/ CAP0.2/ MAT0.2
VSS
P0.12/ DSR1/ MAT1.0 P3.4/A4
K
P3.27/WE P3.26/ CS1
VDD(3V3)
5 of 49
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Table 3. 1 L P0.29/ AIN2/ CAP0.3/ MAT0.3 P3.25/ CS2 Ball allocation …continued 2 P0.30/ AIN3/ EINT3/ CAP0.0 P3.24/ CS3 3 P1.16/ TRACEP KT0 VDD(3V3) 4 P0.0/ TXD0/ PWM1 P1.31/ TRST 5 P3.19/ A19 6 P0.2/ SCL/ CAP0.0 VDD(3V3) 7 P3.15/ A15 8 P0.4/ SCK0/ CAP0.1 P0.3/ SDA/ MAT0.0/ EINT1 VDD(3V3) 9 P3.12/ A12 10 VSS 11 P1.24/ TRACEC LK P0.7/ SSEL0/ PWM2/ EINT2 P0.6/ MOSI0/ CAP0.2 12 P0.8/ TXD1/ PWM4 P3.7/A7 13 P0.9/ RXD1/ PWM6/ EINT3 P3.5/A5
Product data sheet Rev. 04 — 2 October 2007
© NXP B.V. 2007. All rights reserved. LPC2210_2220_4
NXP Semiconductors
Row Column
M
P3.18/ A18
P3.16/ A16
P3.13/ A13
P3.9/A9
N
VDD(1V8)
VSS
P3.23/ A23/ XCLK
P3.21/ A21
P3.17/ A17
P1.26/ RTCK
VSS
P0.5/ MISO0/ MAT0.1
P3.10/ A10
P3.8/A8
P3.6/A6
16/32-bit ARM microcontrollers with external memory interface
LPC2210/2220
6 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
5.2 Pin description
Table 4. Symbol P0.0 to P0.31 Pin description Pin (LQFP) Pin (TFBGA) Type I/O Description Port 0: Port 0 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect Block. Pins 26 and 31 of port 0 are not available. P0.0/TXD0/ PWM1 P0.1/RXD0/ PWM3/EINT0 42[1] 49[2] L4[1] K6[2] O O I O I P0.2/SCL/ CAP0.0 P0.3/SDA/ MAT0.0/EINT1 50[3] L6[3] I/O I 58[3] M8[3] I/O O I P0.4/SCK0/ CAP0.1 P0.5/MISO0/ MAT0.1 P0.6/MOSI0/ CAP0.2 P0.7/SSEL0/ PWM2/EINT2 59[1] L8[1] I/O I 61[1] N9[1] I/O O 68[1] N11[1] I/O I 69[2] M11[2] I O I P0.8/TXD1/ PWM4 P0.9/RXD1/ PWM6/EINT3 75[1] 76[2] L12[1] L13[2] O O I O I P0.10/RTS1/ CAP1.0 P0.11/CTS1/ CAP1.1 P0.12/DSR1/ MAT1.0 78[1] 83[1] 84[1] K11[1] J12[1] J13[1] O I I I I O TXD0 — Transmitter output for UART0. PWM1 — Pulse Width Modulator output 1. RXD0 — Receiver input for UART0. PWM3 — Pulse Width Modulator output 3. EINT0 — External interrupt 0 input SCL — I2C-bus clock input/output. Open-drain output (for I2C-bus compliance). CAP0.0 — Capture input for Timer 0, channel 0. SDA — I2C-bus data input/output. Open-drain output (for I2C-bus compliance). MAT0.0 — Match output for Timer 0, channel 0. EINT1 — External interrupt 1 input. SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave. CAP0.1 — Capture input for Timer 0, channel 1. MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data output from SPI slave. MAT0.1 — Match output for Timer 0, channel 1. MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. CAP0.2 — Capture input for Timer 0, channel 2. SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave. PWM2 — Pulse Width Modulator output 2. EINT2 — External interrupt 2 input. TXD1 — Transmitter output for UART1. PWM4 — Pulse Width Modulator output 4. RXD1 — Receiver input for UART1. PWM6 — Pulse Width Modulator output 6. EINT3 — External interrupt 3 input. RTS1 — Request to Send output for UART1. CAP1.0 — Capture input for Timer 1, channel 0. CTS1 — Clear to Send input for UART1. CAP1.1 — Capture input for Timer 1, channel 1. DSR1 — Data Set Ready input for UART1. MAT1.0 — Match output for Timer 1, channel 0.
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
7 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol
Pin description …continued Pin (LQFP) 85[1] 92[2] Pin (TFBGA) Type H10[1] G10[2] O O I I Description DTR1 — Data Terminal Ready output for UART1. MAT1.1 — Match output for Timer 1, channel 1. DCD1 — Data Carrier Detect input for UART1. EINT1 — External interrupt 1 input. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take over control of the part after reset.
P0.13/DTR1/ MAT1.1 P0.14/DCD1/ EINT1
P0.15/RI1/ EINT2
99[2]
E11[2] E10[2]
I I I O I
RI1 — Ring Indicator input for UART1. EINT2 — External interrupt 2 input. EINT0 — External interrupt 0 input. MAT0.2 — Match output for Timer 0, channel 2. CAP0.2 — Capture input for Timer 0, channel 2. CAP1.2 — Capture input for Timer 1, channel 2. SCK1 — Serial Clock for SPI1/SSI/Microwire. SPI/SSI/Microwire clock output from master or input to slave. MAT1.2 — Match output for Timer 1, channel 2. CAP1.3 — Capture input for Timer 1, channel 3. MISO1 — Master In Slave Out for SPI1. Data input to SPI master or data output from SPI slave. MAT1.3 — Match output for Timer 1, channel 3. MAT1.2 — Match output for Timer 1, channel 2. MOSI1 — Master Out Slave In for SPI1. Data output from SPI master or data input to SPI slave.
P0.16/EINT0/ 100[2] MAT0.2/CAP0.2
P0.17/CAP1.2/ SCK1/MAT1.2
101[1]
D13[1]
I I/O O
P0.18/CAP1.3/ MISO1/MAT1.3
121[1]
D8[1]
I I/O O
P0.19/MAT1.2/ MOSI1/CAP1.2
122[1]
C8[1]
O I/O
• • •
I P0.20/MAT1.3/ SSEL1/ EINT3 123[2] B8[2] O I
SPI interface: MOSI line. SSI: DX/RX line (SPI1 as a master/slave). Microwire: SO/SI line (SPI1 as a master/slave).
CAP1.2 — Capture input for Timer 1, channel 2. MAT1.3 — Match output for Timer 1, channel 3. SSEL1 — Slave Select for SPI1/Microwire. Used to select the SPI or Microwire interface as a slave. Frame synchronization in case of 4-wire SSI. EINT3 — External interrupt 3 input. PWM5 — Pulse Width Modulator output 5. CAP1.3 — Capture input for Timer 1, channel 3. CAP0.0 — Capture input for Timer 0, channel 0. MAT0.0 — Match output for Timer 0, channel 0. General purpose bidirectional digital port only. General purpose bidirectional digital port only. General purpose bidirectional digital port only. AIN0 — ADC, input 0. This analog input is always connected to its pin. CAP0.1 — Capture input for Timer 0, channel 1. MAT0.1 — Match output for Timer 0, channel 1.
I P0.21/PWM5/ CAP1.3 P0.22/CAP0.0/ MAT0.0 P0.23 P0.24 P0.25 P0.27/AIN0/ CAP0.1/MAT0.1 4[1] 5[1] 6[1] 8[1] 21[1] 23[4] C1[1] D4[1] D3[1] D1[1] H1[1] H3[4] O I I O I/O I/O I/O I I O
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
8 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol
Pin description …continued Pin (LQFP) Pin (TFBGA) Type J1[4] I I O Description AIN1 — ADC, input 1. This analog input is always connected to its pin. CAP0.2 — Capture input for Timer 0, channel 2. MAT0.2 — Match output for Timer 0, channel 2. AIN2 — ADC, input 2. This analog input is always connected to its pin. CAP0.3 — Capture input for Timer 0, Channel 3. MAT0.3 — Match output for Timer 0, channel 3. AIN3 — ADC, input 3. This analog input is always connected to its pin. EINT3 — External interrupt 3 input. CAP0.0 — Capture input for Timer 0, channel 0. Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect Block. Pins 0 through 15 of port 1 are not available. CS0 — LOW-active Chip Select 0 signal. (Bank 0 addresses range 8000 0000 to 80FF FFFF) OE — LOW-active Output Enable signal. TRACEPKT0 — Trace Packet, bit 0. Standard I/O port with internal pull-up. TRACEPKT1 — Trace Packet, bit 1. Standard I/O port with internal pull-up. TRACEPKT2 — Trace Packet, bit 2. Standard I/O port with internal pull-up. TRACEPKT3 — Trace Packet, bit 3. Standard I/O port with internal pull-up. TRACESYNC — Trace Synchronization. Standard I/O port with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to operate as Trace port after reset.
P0.28/AIN1/ 25[4] CAP0.2/MAT0.2
P0.29/AIN2/ 32[4] CAP0.3/MAT0.3
L1[4]
I I O
P0.30/AIN3/ EINT3/CAP0.0
33[4]
L2[4]
I I I
P1.0 to P1.31
I/O
P1.0/CS0 P1.1/OE P1.16/ TRACEPKT0 P1.17/ TRACEPKT1 P1.18/ TRACEPKT2 P1.19/ TRACEPKT3 P1.20/ TRACESYNC
91[5] 90[5] 34[5] 24[5] 15[5] 7[5] 102[5]
G11[5] G13[5] L3[5] H4[5] F2[5] D2[5] D12[5]
O O O O O O O
P1.21/ PIPESTAT0 P1.22/ PIPESTAT1 P1.23/ PIPESTAT2 P1.24/ TRACECLK P1.25/EXTIN0
95[5] 86[5] 82[5] 70[5] 60[5]
F11[5] H11[5] J11[5] L11[5] K8[5]
O O O O I
PIPESTAT0 — Pipeline Status, bit 0. Standard I/O port with internal pull-up. PIPESTAT1 — Pipeline Status, bit 1. Standard I/O port with internal pull-up. PIPESTAT2 — Pipeline Status, bit 2. Standard I/O port with internal pull-up. TRACECLK — Trace Clock. Standard I/O port with internal pull-up. EXTIN0 — External Trigger Input. Standard I/O with internal pull-up.
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
9 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol
Pin description …continued Pin (LQFP) 52[5] Pin (TFBGA) Type N6[5] I/O Description RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to operate as Debug port after reset.
P1.26/RTCK
P1.27/TDO P1.28/TDI P1.29/TCK P1.30/TMS P1.31/TRST P2.0 to P2.31
144[5] 140[5] 126[5] 113[5] 43[5]
B2[5] A3[5] A7[5] D10[5] M4[5]
O I I I I I/O
TDO — Test Data out for JTAG interface. TDI — Test Data in for JTAG interface. TCK — Test Clock for JTAG interface. TMS — Test Mode Select for JTAG interface. TRST — Test Reset for JTAG interface. Port 2 — Port 2 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the Pin Connect Block. D0 — External memory data line 0. D1 — External memory data line 1. D2 — External memory data line 2. D3 — External memory data line 3. D4 — External memory data line 4. D5 — External memory data line 5. D6 — External memory data line 6. D7 — External memory data line 7. D8 — External memory data line 8. D9 — External memory data line 9. D10 — External memory data line 10. D11 — External memory data line 11. D12 — External memory data line 12. D13 — External memory data line 13. D14 — External memory data line 14. D15 — External memory data line 15. D16 — External memory data line 16. D17 — External memory data line 17. D18 — External memory data line 18. D19 — External memory data line 19. D20 — External memory data line 20. D21 — External memory data line 21. D22 — External memory data line 22. D23 — External memory data line 23. D24 — External memory data line 24. D25 — External memory data line 25.
P2.0/D0 P2.1/D1 P2.2/D2 P2.3/D3 P2.4/D4 P2.5/D5 P2.6/D6 P2.7/D7 P2.8/D8 P2.9/D9 P2.10/D10 P2.11/D11 P2.12/D12 P2.13/D13 P2.14/D14 P2.15/D15 P2.16/D16 P2.17/D17 P2.18/D18 P2.19/D19 P2.20/D20 P2.21/D21 P2.22/D22 P2.23/D23 P2.24/D24 P2.25/D25
98[5] 105[5] 106[5] 108[5] 109[5] 114[5] 115[5] 116[5] 117[5] 118[5] 120[5] 124[5] 125[5] 127[5] 129[5] 130[5] 131[5] 132[5] 133[5] 134[5] 136[5] 137[5] 1[5] 10[5] 11[5] 12[5]
E12[5] C12[5] C11[5] B12[5] A13[5] C10[5] B10[5] A10[5] D9[5] C9[5] A9[5] A8[5] B7[5] C7[5] A6[5] B6[5] C6[5] D6[5] A5[5] B5[5] D5[5] A4[5] A1[5] E3[5] E2[5] E1[5]
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
10 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol P2.26/D26/ BOOT0
Pin description …continued Pin (LQFP) 13[5] Pin (TFBGA) Type F4[5] I/O I Description D26 — External memory data line 26. BOOT0 — While RESET is LOW, together with BOOT1 controls booting and internal operation. Internal pull-up ensures HIGH state if pin is left unconnected. D27 — External memory data line 27. BOOT1 — While RESET is LOW, together with BOOT0 controls booting and internal operation. Internal pull-up ensures HIGH state if pin is left unconnected. BOOT1:0 = 00 selects 8-bit memory on CS0 for boot. BOOT1:0 = 01 selects 16-bit memory on CS0 for boot. BOOT1:0 = 10 selects 32-bit memory on CS0 for boot. BOOT1:0 = 11 selects 16-bit memory on CS0 for boot.
P2.27/D27/ BOOT1
16[5]
F1[5]
I/O I
P2.28/D28 P2.29/D29 P2.30/D30/ AIN4 P2.31/D31/ AIN5 P3.0 to P3.31
17[5] 18[5] 19[2]
G2[5] G1[5] G3[2]
I/O I/O I/O I
D28 — External memory data line 28. D29 — External memory data line 29. D30 — External memory data line 30. AIN4 — ADC, input 4. This analog input is always connected to its pin. D31 — External memory data line 31. AIN5 — ADC, input 5. This analog input is always connected to its pin. Port 3 — Port 3 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the Pin Connect Block. A0 — External memory address line 0. A1 — External memory address line 1. A2 — External memory address line 2. A3 — External memory address line 3. A4 — External memory address line 4. A5 — External memory address line 5. A6 — External memory address line 6. A7 — External memory address line 7. A8 — External memory address line 8. A9 — External memory address line 9. A10 — External memory address line 10. A11 — External memory address line 11. A12 — External memory address line 12. A13 — External memory address line 13. A14 — External memory address line 14. A15 — External memory address line 15. A16 — External memory address line 16. A17 — External memory address line 17. A18 — External memory address line 18.
20[2]
G4[2]
I/O I I/O
P3.0/A0 P3.1/A1 P3.2/A2 P3.3/A3 P3.4/A4 P3.5/A5 P3.6/A6 P3.7/A7 P3.8/A8 P3.9/A9 P3.10/A10 P3.11/A11 P3.12/A12 P3.13/A13 P3.14/A14 P3.15/A15 P3.16/A16 P3.17/A17 P3.18/A18
89[5] 88[5] 87[5] 81[5] 80[5] 74[5] 73[5] 72[5] 71[5] 66[5] 65[5] 64[5] 63[5] 62[5] 56[5] 55[5] 53[5] 48[5] 47[5]
G12[5] H13[5] H12[5] J10[5] K13[5] M13[5] N13[5] M12[5] N12[5] M10[5] N10[5] K9[5] L9[5] M9[5] K7[5] L7[5] M7[5] N5[5] M5[5]
O O O O O O O O O O O O O O O O O O O
LPC2210_2220_4
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Product data sheet
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol P3.19/A19 P3.20/A20 P3.21/A21 P3.22/A22 P3.23/A23/ XCLK P3.24/CS3 P3.25/CS2 P3.26/CS1 P3.27/WE
Pin description …continued Pin (LQFP) 46[5] 45[5] 44[5] 41[5] 40[5] 36[5] 35[5] 30[5] 29[5] 28[2] Pin (TFBGA) Type L5[5] K5[5] N4[5] K4[5] N3[5] M2[5] M1[5] K2[5] K1[5] J4[2] O O O O O O O O O O O I 27[4] J3[4] O I 97[4] 96[4] 22[5] 135[6] E13[4] F10[4] H2[5] C5[6] I O O Description A19 — External memory address line 19. A20 — External memory address line 20. A21 — External memory address line 21. A22 — External memory address line 22. A23 — External memory address line 23. XCLK — Clock output. CS3 — LOW-active Chip Select 3 signal. (Bank 3 addresses range 8300 0000 to 83FF FFFF) CS2 — LOW-active Chip Select 2 signal. (Bank 2 addresses range 8200 0000 to 82FF FFFF) CS1 — LOW-active Chip Select 1 signal. (Bank 1 addresses range 8100 0000 to 81FF FFFF) WE — LOW-active Write enable signal. BLS3 — LOW-active Byte Lane Select signal (Bank 3). AIN7 — ADC, input 7. This analog input is always connected to its pin. BLS2 — LOW-active Byte Lane Select signal (Bank 2). AIN6 — ADC, input 6. This analog input is always connected to its pin. BLS1 — LOW-active Byte Lane Select signal (Bank 1). BLS0 — LOW-active Byte Lane Select signal (Bank 0). Not connected. This pin MUST NOT be pulled LOW or the device might not operate properly. External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Ground: 0 V reference.
P3.28/BLS3/ AIN7 P3.29/BLS2/ AIN6 P3.30/BLS1 P3.31/BLS0 n.c. RESET
XTAL1 XTAL2 VSS
142[7] 141[7] 3, 9, 26, 38, 54, 67, 79, 93, 103, 107, 111, 128 139
C3[7] B3[7] C2, E4, J2, N2, N7, L10, K12, F13, D11, B13, B11, D7 C4
I O I
VSSA
I
Analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. PLL analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 1.8 V core power supply: This is the power supply voltage for internal circuitry.
VSSA(PLL)
138
B4
I
VDD(1V8)
37, 110
N1, A12
I
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 4. Symbol VDDA(1V8)
Pin description …continued Pin (LQFP) 143 Pin (TFBGA) Type A2 I Description Analog 1.8 V core power supply: This is the power supply voltage for internal circuitry. This should be nominally the same voltage as VDD(1V8) but should be isolated to minimize noise and error. 3.3 V pad power supply: This is the power supply voltage for the I/O ports.
VDD(3V3)
I 2, 31, 39, 51, B1, K3, M3, M6, N8, K10, 57, 77, 94, 104, 112, 119 F12, C13, A11, B9 14 F3 I
VDDA(3V3)
Analog 3.3 V pad power supply: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error.
[1] [2] [3] [4]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. Open drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output functionality. 5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured for a digital input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital section of the pad is disabled. 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. The pull-up resistor’s value ranges from 60 kΩ to 300 kΩ. 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only. Pad provides special analog functionality.
[5] [6] [7]
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on RISC principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed CISC. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set. • A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-chip SRAM
On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed as 8 bit, 16 bit, and 32 bit. The LPC2210/2220 provide 16 kB of static RAM and the LPC2220 provides 64 kB of static RAM.
6.3 Memory map
The LPC2210/2220 memory maps incorporate several distinct regions, as shown in Figure 4. In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either on-chip bootloader, external memory BANK0 or on-chip static RAM. This is described in Section 6.20 “System control”.
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB
0xFFFF FFFF 0xF000 0000 0xEFFF FFFF 0xE000 0000 0xDFFF FFFF RESERVED ADDRESS SPACE
3.0 GB EXTERNAL MEMORY BANK3 EXTERNAL MEMORY BANK2 EXTERNAL MEMORY BANK1 EXTERNAL MEMORY BANK0 2.0 GB BOOT BLOCK (RE-MAPPED FROM ON-CHIP ROM MEMORY RESERVED ADDRESS SPACE
0x8400 0000 0x83FF FFFF 0x8300 0000 0x82FF FFFF 0x8200 0000 0x81FF FFFF 0x8100 0000 0x80FF FFFF 0x8000 0000 0x7FFF FFFF 0x7FFF E000 0x7FFF DFFF
64 KBYTE ON-CHIP STATIC RAM (LPC2220) 16 KBYTE ON-CHIP STATIC RAM (LPC2210) 1.0 GB
0x4001 0000 0x4000 FFFF 0x4000 4000 0x4000 3FFF 0x4000 0000 0x3FFF FFFF
RESERVED ADDRESS SPACE
0.0 GB
0x0000 0000
002aaa795
Fig 4. LPC2210/2220 memory map
6.4 Interrupt controller
The VIC accepts all of the interrupt request inputs and categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
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16/32-bit ARM microcontrollers with external memory interface
Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are requesting, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active.
6.4.1 Interrupt sources
Table 5 lists the interrupt sources for each peripheral function. Each peripheral device has one interrupt line connected to the VIC, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source.
Table 5. Block WDT ARM Core ARM Core TIMER0 TIMER1 UART0 Interrupt sources Flag(s) Watchdog Interrupt (WDINT) Reserved for software interrupts only EmbeddedICE, DbgCommRX EmbeddedICE, DbgCommTX Match 0 to 3 (MR0, MR1, MR2, MR3) Match 0 to 3 (MR0, MR1, MR2, MR3) RX Line Status (RLS) Transmit Holding Register empty (THRE) RX Data Available (RDA) Character Time-out Indicator (CTI) UART1 RX Line Status (RLS) Transmit Holding Register empty (THRE) RX Data Available (RDA) Character Time-out Indicator (CTI) Modem Status Interrupt (MSI) PWM0 I2C SPI0 SPI1 and SSP PLL RTC System Control Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6) SI (state change) SPIF, MODF SPIF, MODF and TXRIS, RXRIS, RTRIS, RORRIS PLL Lock (PLOCK) RTCCIF (Counter Increment), RTCALF (Alarm) External Interrupt 0 (EINT0) External Interrupt 1 (EINT1) External Interrupt 2 (EINT2) External Interrupt 3 (EINT3) A/D ADC 8 9 10 11 12 13 14 15 16 17 18 7 VIC channel # 0 1 2 3 4 5 6
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16/32-bit ARM microcontrollers with external memory interface
6.5 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. The pin control module contains three registers as shown in Table 6.
Table 6. Address 0xE002 C000 0xE002 C004 0xE002 C014 Pin control module registers Name PINSEL0 PINSEL1 PINSEL2 Description pin function select register 0 pin function select register 1 pin function select register 2 Access read/write read/write read/write
6.6 Pin function select register 0 (PINSEL0 - 0xE002 C000)
The PINSEL0 register controls the functions of the pins as per the settings listed in Table 7. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions, direction is controlled automatically. Settings other than those shown in Table 7 are reserved, and should not be used
Table 7. PINSEL0 1:0 Pin function select register 0 (PINSEL0 - 0xE002 C000) Pin name P0.0 Value 0 0 1 1 3:2 P0.1 0 0 1 1 5:4 P0.2 0 0 1 1 7:6 P0.3 0 0 1 1 9:8 P0.4 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.0 TXD (UART0) PWM1 reserved GPIO Port 0.1 RXD (UART0) PWM3 EINT0 GPIO Port 0.2 SCL (I2C-bus) Capture 0.0 (Timer 0) reserved GPIO Port 0.3 SDA (I2C-bus) Match 0.0 (Timer 0) EINT1 GPIO Port 0.4 SCK (SPI0) Capture 0.1 (Timer 0) reserved 0 0 0 0 Value after reset 0
LPC2210_2220_4
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Pin function select register 0 (PINSEL0 - 0xE002 C000) …continued Pin name P0.5 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.5 MISO (SPI0) Match 0.1 (Timer 0) reserved GPIO Port 0.6 MOSI (SPI0) Capture 0.2 (Timer 0) reserved GPIO Port 0.7 SSEL (SPI0) PWM2 EINT2 GPIO Port 0.8 TXD UART1 PWM4 reserved GPIO Port 0.9 RXD (UART1) PWM6 EINT3 GPIO Port 0.10 RTS (UART1) Capture 1.0 (Timer 1) reserved GPIO Port 0.11 CTS (UART1) Capture 1.1 (Timer 1) reserved GPIO Port 0.12 DSR (UART1) Match 1.0 (Timer 1) reserved GPIO Port 0.13 DTR (UART1) Match 1.1 (Timer 1) reserved GPIO Port 0.14 DCD (UART1) EINT1 reserved 0 0 0 0 0 0 0 0 0 Value after reset 0
Table 7. PINSEL0 11:10
13:12
P0.6
0 0 1 1
15:14
P0.7
0 0 1 1
17:16
P0.8
0 0 1 1
19:18
P0.9
0 0 1 1
21:20
P0.10
0 0 1 1
23:22
P0.11
0 0 1 1
25:24
P0.12
0 0 1 1
27:26
P0.13
0 0 1 1
29:28
P0.14
0 0 1 1
LPC2210_2220_4
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Pin function select register 0 (PINSEL0 - 0xE002 C000) …continued Pin name P0.15 Value 0 0 1 1 0 1 0 1 Function GPIO Port 0.15 RI (UART1) EINT2 reserved Value after reset 0
Table 7. PINSEL0 31:30
6.7 Pin function select register 1 (PINSEL1 - 0xE002 C004)
The PINSEL1 register controls the functions of the pins as per the settings listed in Table 8. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions direction is controlled automatically. Settings other than those shown in the Table 8 are reserved, and should not be used.
Table 8. PINSEL1 1:0 Pin function select register 1 (PINSEL1 - 0xE002 C004) Pin name P0.16 Value 0 0 1 1 3:2 P0.17 0 0 1 1 5:4 P0.18 0 0 1 1 7:6 P0.19 0 0 1 1 9:8 P0.20 0 0 1 1 11:10 P0.21 0 0 1 1 13:12 P0.22 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.16 EINT0 Match 0.2 (Timer 0) Capture 0.2 (Timer 0) GPIO Port 0.17 Capture 1.2 (Timer 1) SCK (SPI1) Match 1.2 (Timer 1) GPIO Port 0.18 Capture 1.3 (Timer 1) MISO (SPI1) Match 1.3 (Timer 1) GPIO Port 0.19 Match 1.2 (Timer 1) MOSI (SPI1) Capture 1.2 (Timer 1) GPIO Port 0.20 Match 1.3 (Timer 1) SSEL (SPI1) EINT3 GPIO Port 0.21 PWM5 reserved Capture 1.3 (Timer 1) GPIO Port 0.22 reserved Capture 0.0 (Timer 0) Match 0.0 (Timer 0) 0 0 0 0 0 0 Value after reset 0
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Pin function select register 1 (PINSEL1 - 0xE002 C004) …continued Pin name P0.23 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.23 reserved reserved reserved GPIO Port 0.24 reserved reserved reserved GPIO Port 0.25 reserved reserved reserved reserved reserved reserved reserved GPIO Port 0.27 AIN0 (A/D input 0) Capture 0.1 (Timer 0) Match 0.1 (Timer 0) GPIO Port 0.28 AIN1 (A/D input 1) Capture 0.2 (Timer 0) Match 0.2 (Timer 0) GPIO Port 0.29 AIN2 (A/D input 2) Capture 0.3 (Timer 0) Match 0.3 (Timer 0) GPIO Port 0.30 AIN3 (A/D input 0) EINT3 Capture 0.0 (Timer 0) reserved reserved reserved reserved 0 1 1 1 1 0 0 0 Value after reset 0
Table 8. PINSEL1 15:14
17:16
P0.24
0 0 1 1
19:18
P0.25
0 0 1 1
21:20
P0.26
0 0 1 1
23:22
P0.27
0 0 1 1
25:24
P0.28
0 0 1 1
27:26
P0.29
0 0 1 1
29:28
P0.30
0 0 1 1
31:30
P0.31
0 0 1 1
LPC2210_2220_4
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
6.8 Pin function select register 2 (PINSEL2 - 0xE002 C014)
The PINSEL2 register controls the functions of the pins as per the settings listed in Table 9. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions direction is controlled automatically. Settings other than those shown in Table 9 are reserved, and should not be used.
Table 9. 1:0 2 3 5:4 Pin function select register 2 (PINSEL2 - 0xE002 C014) Description reserved When 0, pins P1[36:26] are used as GPIO pins. When 1, P1[31:26] are used as a Debug port. When 0, pins P1[25:16] are used as GPIO pins. When 1, P1[25:16] are used as a Trace port. Controls the use of the data bus and strobe pins: Pins P2[7:0] Pin P1.0 Pin P1.1 Pin P3.31 Pins P2[15:8] Pin P3.30 Pins P2[27:16] Pins P2[29:28] Pins P2[31:30] Pins P3[29:28] 6 7 8 10:9 11 12 13 15:14 17:16 19:18 20 21 22 11 = P2[7:0] 11 = P1.0 11 = P1.1 11 = P3.31 00 or 11 = P2[15:8] 00 or 11 = P3.30 0x or 11 = P2[27:16] 0x or 11 = P2[29:28] 0x or 11 = P2[31:30] or AIN5 to AIN4 0x or 11 = P3[29:28] or AIN7 to AIN6 0x or 10 = D7 to D0 0x or 10 = CS0 0x or 10 = OE 0x or 10 = BLS0 01 or 10 = D15 to D8 01 or 10 = BLS1 10 = D27 to D16 10 = D29, D28 10 = D31, D30 10 = BLS2, BLS3 1 1 0 0 Reset value P1.26/RTCK P1.20/ TRACESYNC BOOT1:0
PINSEL2 bits
If bits 5:4 are not 10, controls the use of pin P3.29: 0 enables P3.29, 1 enables AIN6. If bits 5:4 are not 10, controls the use of pin P3.28: 0 enables P3.28, 1 enables AIN7. Controls the use of pin P3.27: 0 enables P3.27, 1 enables WE. reserved Controls the use of pin P3.26: 0 enables P3.26, 1 enables CS1. reserved
If bits 27:25 are not 111, controls the use of pin P3.23/A23/XCLK: 0 enables P3.23, 0 1 enables XCLK. Controls the use of pin P3.25: 00 enables P3.25, 01 enables CS2, 10 and 11 are reserved values. Controls the use of pin P3.24: 00 enables P3.24, 01 enables CS3, 10 and 11 are reserved values. reserved If bits 5:4 are not 10, controls the use of pin P2[29:28]: 0 enables P2[29:28], 1 is reserved If bits 5:4 are not 10, controls the use of pin P2.30: 0 enables P2.30, 1 enables AIN4. If bits 5:4 are not 10, controls the use of pin P2.31: 0 enables P2.31, 1 enables AIN5. 00 00 0 1 1
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16/32-bit ARM microcontrollers with external memory interface
Table 9. 23
Pin function select register 2 (PINSEL2 - 0xE002 C014) …continued Description Controls whether P3.0/A0 is a port pin (0) or an address line (1). Reset value 1 if BOOT1:0 = 00 at RESET = 0, 0 otherwise BOOT1 during reset 000 if BOOT1:0 = 11 at reset, 111 otherwise
PINSEL2 bits
24 27:25
Controls whether P3.1/A1 is a port pin (0) or an address line (1). Controls the number of pins among P3.23/A23/XCLK and P3[22:2]/A2[22:2] that are address lines: 000 = None 001 = A3 to A2 are address lines. 010 = A5 to A2 are address lines. 011 = A7 to A2 are address lines. 100 = A11 to A2 are address lines. 101 = A15 to A2 are address lines. 110 = A19 to A2 are address lines. 111 = A23 to A2 are address lines.
31:28
reserved
6.9 External memory controller
The external Static Memory Controller is a module which provides an interface between the system bus and external (off-chip) memory devices. It provides support for up to four independently configurable memory banks (16 MB each with byte lane enable control) simultaneously. Each memory bank is capable of supporting SRAM, ROM, flash EPROM, burst ROM memory, or some external I/O devices. Each memory bank may be 8-bit, 16-bit, or 32-bit wide.
6.10 General purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins.
6.10.1 Features
• Direction control of individual bits. • Separate control of output set and clear. • All I/O default to inputs after reset. 6.11 10-bit ADC
The LPC2210/2220 each contain a single 10-bit successive approximation ADC with eight multiplexed channels.
6.11.1 Features
• Measurement range of 0 V to 3 V. • Capable of performing more than 400000 10-bit samples per second. • Burst conversion mode for single or multiple inputs.
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• Optional conversion on transition on input pin or Timer Match signal. 6.12 UARTs
The LPC2210/2220 each contain two UARTs. One UART provides a full modem control handshake interface, the other provides only transmit and receive data lines.
6.12.1 Features
• • • • • •
16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in baud rate generator. Standard modem interface signals included on UART1. LPC2220 provides enhanced UARTs with fractional baud-rate generators, mechanism for software flow control, and hardware (CTS/RTS) flow control on UART1 only.
6.13 I2C-bus serial I/O controller
The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the capability to both receive and send information (such as memory)). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2210/2220 supports a bit rate up to 400 kbit/s (Fast I2C-bus).
6.13.1 Features
• • • • • •
Compliant with standard I2C-bus interface. Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. one serial bus.
• Serial clock synchronization allows devices with different bit rates to communicate via • Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus may be used for test and diagnostic purposes.
LPC2210_2220_4
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16/32-bit ARM microcontrollers with external memory interface
6.14 SPI serial I/O controller
The LPC2210/2220 each contain two SPIs. The SPI is a full duplex serial interface, designed to be able to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master.
6.14.1 Features
• • • •
Compliant with SPI specification. Synchronous, serial, full duplex, communication. Combined SPI master and slave. Maximum data bit rate of one eighth of the input clock rate.
6.15 SSP controller
This peripheral is available in LPC2220 only.
6.15.1 Features
• Compatible with Motorola’s SPI, TI’s 4-wire SSI, and National Semiconductor’s
Microwire buses.
• • • •
Synchronous serial communication. Master or slave operation. 8-frame FIFOs for both transmit and receive. Four to 16 bits per frame.
6.15.2 Description
The SSP is a controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. Data transfers are in principle full duplex, with frames of four to 16 bits of data flowing from the master to the slave and from the slave to the master. While the SSP and SPI1 peripherals share the same physical pins, it is not possible to have both of these two peripherals active at the same time. Application can switch on the fly from SPI1 to SSP and back.
6.16 General purpose timers
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an externally supplied clock and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them. The LPC2220 can count external events on one of the capture inputs if the minimum external pulse is equal or longer than a period of the PCLK. In this configuration, unused capture lines can be selected as regular timer capture inputs.
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6.16.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit prescaler. • Timer operation (LPC2210/2220) or external Event Counter (LPC2220 only). • Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match.
6.17 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time.
6.17.1 Features
• Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• • • •
Incorrect/incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 32-bit timer with internal prescaler. Selectable time period from (Tcy(PCLK) × 256 × 4) to (Tcy(PCLK) × 232 × 4) in multiples of Tcy(PCLK) × 4.
6.18 Real-time clock
The Real-Time Clock (RTC) is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode).
6.18.1 Features
• Measures the passage of time to maintain a calendar and clock.
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• Ultra-low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
• Programmable Reference Clock Divider allows adjustment of the RTC to match
various crystal frequencies.
6.19 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2210/2220. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge).
6.19.1 Features
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
• The match registers also allow:
– Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses.
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• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become effective.
• May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 6.20 System control
6.20.1 Crystal oscillator
The oscillator supports crystals in the range of 1 MHz to 30 MHz and up to 50 MHz with the external oscillator. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value unless the PLL is running and connected. Refer to Section 6.20.2 “PLL” for additional information.
6.20.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60/75 MHz (LPC2210/2220) with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100 µs.
6.20.3 Reset and wake-up timer
Reset has two sources on the LPC2210/2220: the RESET pin and watchdog reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip circuitry has completed its initialization. When the internal reset is removed, the processor begins executing at address 0, which is the reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The Wake-up Timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power-on, all types of reset, and whenever any of the aforementioned
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functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions.
6.20.4 External interrupt inputs
The LPC2210/2220 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode.
6.20.5 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the BANK0 external memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts.
6.20.6 Power control
The LPC2210/2220 support two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down, and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode, and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings.
6.20.7 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB bus so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB bus may be slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB bus must work
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properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB bus), the default condition at reset is for the APB bus to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode.
6.21 Emulation and debugging
The LPC2210/2220 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself.
6.21.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol converter. EmbeddedICE protocol converter converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM core. The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The debug communication channel is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The debug communication channel allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The debug communication channel data and control registers are mapped in to addresses in the EmbeddedICE logic.
6.21.2 Embedded trace
Since the LPC2210/2220 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code cannot be traced because of this restriction.
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6.21.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the Debug Communications Channel (DCC), which is present in the EmbeddedICE logic. The LPC2210/2220 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory.
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7. Limiting values
Table 10. Limiting values reset In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(1V8) VDD(3V3) VDDA(3V3) VIA VI IDD ISS Tstg Ptot(pack) Parameter supply voltage (1.8 V) supply voltage (3.3 V) analog supply voltage (3.3 V) analog input voltage input voltage supply current ground current storage temperature total power dissipation (per package) electrostatic discharge voltage based on package heat transfer, not device power consumption human body model all pins
[1]
[11]
Conditions
[2] [3]
Min −0.5 −0.5 −0.5 −0.5
Max +2.5 +3.6 +4.6 +5.1 +6.0 VDD(3V3) + 0.5 100 100 +150 1.5
Unit V V V V V V mA mA °C W
5 V tolerant I/O pins other I/O pins
[4][5] [4][6] [7][8] [8][9] [10]
−0.5 −0.5 −65 -
Vesd
−2000
+2000
V
The following applies to Table 10: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Internal rail. External rail. Including voltage on outputs in 3-state mode. Only valid when the VDD(3V3) supply voltage is present. Not to exceed 4.6 V. Per supply pin. The peak current is limited to 25 times the corresponding maximum current. Per ground pin.
[2] [3] [4] [5] [6] [7] [8] [9]
[10] Dependent on package type. [11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
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8. Static characteristics
Table 11. Static characteristics Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol VDD(1V8) VDD(3V3) Parameter supply voltage (1.8 V) supply voltage (3.3 V) Conditions
[2] [3]
Min 1.65 3.0 2.5
Typ[1] 1.8 3.3 3.3
Max 1.95 3.6 3.6
Unit V V V
VDDA(3V3) analog supply voltage (3.3 V) Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS IOLS Ipd Ipu IDD(act) LOW-level input current HIGH-level input current OFF-state output current I/O latch-up current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current HIGH-level short circuit current LOW-level short circuit current pull-down current pull-up current active mode supply current IOH = −4 mA IOL = −4 mA VOH = VDD(3V3) − 0.4 V VOL = 0.4 V VOH = 0 V VOL = VDD(3V3) VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V VDD(1V8) = 1.8 V, Tamb = 25 °C, code
[7]
VI = 0 V; no pull-up VI = VDD(3V3); no pull-down VO = 0 V, VO = VDD(3V3); no pull-up/down −(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 °C
[4][5][6]
100 0 0 2.0 VDD(3V3) − 0.4 −4 4 10 −15 0
0.4 50 −50 0
3 3 3 5.5 VDD(3V3) 0.8 0.4 −45 50 150 −85 0
µA µA µA mA V V V V V V V mA mA mA mA µA µA µA
output active
[7] [7] [7] [8]
[8]
[9] [10] [9]
while(1){}
executed from on-chip RAM, no active peripherals CCLK = 60 MHz (LPC2210) CCLK = 75 MHz (LPC2220) 50 50 70 70 mA mA
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Table 11. Static characteristics …continued Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol IDD(pd) Parameter Power-down mode supply current Conditions VDD(1V8) = 1.8 V, Tamb = 25 °C, VDD(1V8) = 1.8 V, Tamb = 85 °C I2C-bus pins VIH VIL Vhys VOL ILI HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD(3V3) VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2)
[1] [2] [3] [4] [5] [6] [7] [8] [9]
[7] [11]
Min -
Typ[1] 10 110
Max 500
Unit µA µA
0.7VDD(3V3) 0 0
2 10 -
-
V V V µA µA V V
0.3VDD(3V3) V 0.4 4 22 1.8 1.8
0.5VDD(3V3) -
input voltage on pin XTAL1 output voltage on pin XTAL2
Typical ratings are not guaranteed. The values listed are at room temperature (+25 °C), nominal supply voltages. Internal rail. External rail. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[10] Applies to P1[25:16]. [11] To VSS.
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Table 12. ADC static characteristics VDDA(3V3) = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified. ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO EG ET
[1] [2] [3] [4] [5] [6] [7]
Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error
Conditions
Min 0 [1][2][3] [1][4] [1][5] [1][6] [1][7]
Typ -
Max VDDA(3V3) 1 ±1 ±2 ±3 ±0.5 ±4
Unit V pF LSB LSB LSB % LSB
-
Conditions: VSSA = 0 V, VDDA(3V3) = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 5. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 5. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 5. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 5. The absolute voltage error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 5.
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offset error EO 1023
gain error EG
1022
1021
1020
1019
1018
(2)
7 code out 6 (1)
5 (5) 4 (4) 3 (3) 2
1
1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024
0 1 2 3 4 5 6 7 VIA (LSBideal) offset error EO
1 LSB =
VDDA − VSSA 1024
002aaa668
(1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve.
Fig 5. ADC characteristics
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9. Dynamic characteristics
Table 13. Dynamic characteristics Tamb = 0 °C to +70 °C for commercial applications, −40 °C to +85 °C for industrial applications, VDD(1V8), VDD(3V3) over specified ranges[1] Symbol External clock fosc oscillator frequency supplied by an external oscillator (signal generator) external clock frequency supplied by an external crystal oscillator external clock frequency if on-chip PLL is used external clock frequency if on-chip bootloader is used for initial code download Tcy(clk) tCHCX tCLCX tCLCH tCHCL tr tf I2C-bus tf
[1] [2]
Parameter
Conditions
Min 1 1
Typ -
Max 50 30
Unit MHz MHz
10 10
-
25 25
MHz MHz
clock cycle time clock HIGH time clock LOW time clock rise time clock fall time rise time fall time pins (P0.2 and P0.3) fall time VIH to VIL
[2]
20 Tcy(clk) × 0.4 Tcy(clk) × 0.4 -
10 10
1000 5 5 -
ns ns ns ns ns ns ns ns
Port pins (except P0.2 and P0.3)
20 + 0.1 × Cb -
Parameters are valid over operating temperature range unless otherwise specified. Bus capacitance Cb in pF, from 10 pF to 400 pF.
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Table 14. External memory interface dynamic characteristics CL = 25 pF, Tamb = 40 °C Symbol tCHAV tCHCSL tCHCSH tCHANV Parameter XCLK HIGH to address valid time XCLK HIGH to CS LOW time XCLK HIGH to CS HIGH time XCLK HIGH to address invalid time CS LOW to address valid time OE LOW to address valid time CS LOW to OE LOW time memory access time memory access time (initial burst-ROM) memory access time (subsequent burst-ROM) data hold time CS HIGH to OE HIGH time OE HIGH to address invalid time XCLK HIGH to OE LOW time XCLK HIGH to OE HIGH time address valid to CS LOW time CS LOW to data valid time CS LOW to WE LOW time CS LOW to BLS LOW time WE LOW to data valid time CS LOW to data valid time WE LOW to WE HIGH time BLS LOW to BLS HIGH time WE HIGH to address invalid time WE HIGH to data invalid time BLS HIGH to address invalid time
[2] [1] [2][3] [1]
Conditions
Min -
Typ Max 10 10 10 10
Unit ns ns ns ns
Common to read and write cycles
Read cycle parameters tCSLAV tOELAV tCSLOEL tam tam(ibr) tam(sbr) th(D) tCSHOEH tOEHANV tCHOEL tCHOEH −5 −5 −5 (Tcy(CCLK) × (2 + WST1)) + (−20) (Tcy(CCLK) × (2 + WST1)) + (−20) Tcy(CCLK) + (−20) 0 −5 −5 −5 −5 +10 +10 +5 +5 +5 +5 +5 ns ns ns ns ns ns ns ns ns ns ns
[1]
[2][3]
[2][4]
[5]
Write cycle parameters tAVCSL tCSLDV tCSLWEL tCSLBLSL tWELDV tCSLDV tWELWEH tBLSLBLSH tWEHANV tWEHDNV tBLSHANV Tcy(CCLK) − 10 −5 −5 −5 −5 −5 Tcy(CCLK) × (1 + WST2) − 5 Tcy(CCLK) × (1 + WST2) − 5 Tcy(CCLK) − 5 (2 × Tcy(CCLK)) − 5 Tcy(CCLK) − 5 +5 +5 +5 +5 +5 Tcy(CCLK) × (1 + WST2) + 5 Tcy(CCLK) × (1 + WST2) + 5 Tcy(CCLK) + 5 ns ns ns ns ns ns ns ns ns
[2]
[2]
[2] [2]
(2 × Tcy(CCLK)) + 5 ns Tcy(CCLK) + 5 ns
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LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
Table 14. External memory interface dynamic characteristics …continued CL = 25 pF, Tamb = 40 °C Symbol tBLSHDNV tCHDV tCHWEL tCHBLSL tCHWEH tCHBLSH tCHDNV Parameter BLS HIGH to data invalid time XCLK HIGH to data valid time XCLK HIGH to WE LOW time XCLK HIGH to BLS LOW time XCLK HIGH to WE HIGH time XCLK HIGH to BLS HIGH time XCLK HIGH to data invalid time Conditions
[2]
Min (2 × Tcy(CCLK)) − 5 -
Typ Max -
Unit
(2 × Tcy(CCLK)) + 5 ns 10 10 10 10 10 10 ns ns ns ns ns ns
[1] [2] [3] [4] [5]
Except on initial access, in which case the address is set up Tcy(CCLK) earlier. Tcy(CCLK) = 1⁄CCLK. Latest of address valid, CS LOW, OE LOW to data valid. Address valid to data valid. Earliest of CS HIGH, OE HIGH, address change to data invalid.
Table 15.
Standard read access specifications Max frequency WST setting WST ≥ 0; round up to integer Memory access time requirement
Access cycle
standard read
2 + WST 1 f MAX ≤ -------------------------------t RAM + 20 ns 1 + WST 2 f MAX ≤ --------------------------------t WRITE + 5 ns 2 + WST 1 f MAX ≤ ------------------------------t INIT + 20 ns 1 f MAX ≤ -------------------------------t ROM + 20 ns
t RAM + 20 ns WST 1 ≥ -------------------------------- – 2 t cy ( CCLK ) t WRITE – t CYC + 5 WST 2 ≥ ------------------------------------------t cy ( CCLK ) t INIT + 20 ns W ST 1 ≥ ------------------------------- – 2 t cy ( CCLK ) N/A
t RAM ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns t WRITE ≤ t cy ( CCLK ) × ( 1 + WST 2 ) – 5 ns t INIT ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns t ROM ≤ t cy ( CCLK ) – 20 ns
standard write
burst read - initial
burst read - subsequent 3×
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
9.1 Timing
XCLK tCSLAV CS tCSHOEH
addr tam data tCSLOEL tOELAV OE tCHOEL tCHOEH
002aaa749
th(D)
tOEHANV
Fig 6. External memory read access
XCLK tCSLDV CS
tAVCSL tWELWEH tBLSLBLSH tWEHANV tCSLBLSL tWELDV tBLSHANV
tCSLWEL BLS/WE
addr tCSLDV data tWEHDNV tBLSHDNV
OE
002aaa750
Fig 7. External memory write access
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
VDD − 0.5 V 0.45 V
0.2VDD + 0.9 V 0.2VDD − 0.1 V tCHCX tCHCL tCLCX Tclk
002aaa416
tCLCH
Fig 8. External clock timing
9.2 LPC2210 power consumption measurements
60 IDD current (mA) 40
002aab452
(1) (2)
20
0 0 10 20 30 40 50 frequency (MHz) 60
Test conditions: code executed from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK/4. (1) 1.8 V core at 25 °C (typical) (2) 1.65 V core at 25 °C (typical)
Fig 9. LPC2210 IDD(1V8) active measured at different frequencies (CCLK) and temperatures
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
15 IDD current (mA) 10
002aab453
(1) (2)
5
0 0 10 20 30 40 50 frequency (MHz) 60
Test conditions: Idle mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK/4. (1) 1.8 V core at 25 °C (typical) (2) 1.65 V core at 25 °C (typical)
Fig 10. LPC2210 IDD(1V8) idle measured at different frequencies (CCLK) and temperatures
500 IDD current (µA) 400
002aab454
(1) (2) (3)
300
200
100
0 −100
−50
0
50
100
temp (°C)
150
Test conditions: Power-down mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register. (1) 1.95 V core (2) 1.8 V core (3) 1.65 V core
Fig 11. LPC2210 IDD(1V8) power-down measured at different temperatures
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
9.3 LPC2220 power consumption measurements
002aab455
(1)
40 IDD current (mA) 30
(2) (3)
20
10
0 0 10 20 30 40 50 frequency (MHz) 60
Test conditions: code executed from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK/4. (1) 1.8 V core at 85 °C (typical) (2) 1.8 V core at 25 °C (typical) (3) 1.65 V core at 25 °C (typical)
Fig 12. LPC2220 IDD(1V8) active measured at different frequencies (CCLK) and temperatures
10 IDD current (mA) 8
(3) (1) (2)
002aab456
6
4
2
0 0 10 20 30 40 50 frequency (MHz) 60
Test conditions: Idle mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK/4. (1) 1.8 V core at 85 °C (typical) (2) 1.8 V core at 25 °C (typical) (3) 1.65 V core at 25 °C (typical)
Fig 13. LPC2220 IDD(1V8) idle measured at different frequencies (CCLK) and temperatures
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
800 IDD current (mA) 600
002aab457
(1)
(2)
400
200
0 0
−20
20
60
100
temp (°C)
140
Test conditions: Power-down mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register. (1) 1.8 V core (typical) (2) 1.65 V core (typical)
Fig 14. LPC2220 IDD(1V8) power-down measured at different temperatures
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
10. Package outline
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1
c
y X
A 108 109 73 72 ZE
e
E HE
A A2
A1
(A 3) θ Lp L detail X
wM bp pin 1 index 144 1 wM D HD ZD B vM B 36 bp vM A 37
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 20.1 19.9 E (1) 20.1 19.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D(1) Z E(1) 1.4 1.1 1.4 1.1 θ 7 o 0
o
22.15 22.15 21.85 21.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT486-1 REFERENCES IEC 136E23 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-03-14 03-02-20
Fig 15. Package outline SOT486-1 (LQFP144)
LPC2210_2220_4 © NXP B.V. 2007. All rights reserved.
Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm
SOT569-1
D D1
B A
ball A1 index area A E1 E A2 A1 detail X
C e1 e b
∅v M C A B ∅w M C
y1 C
y
ball A1 index area
N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13
e
e2
shape optional (4 ×)
X
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.2 A1 0.36 0.24 A2 0.84 0.74 b 0.53 0.43 D 12.2 11.8 D1 11.9 11.7 E 12.2 11.8 E1 11.9 11.7 e 0.8 e1 9.6 e2 9.6 v 0.15 w 0.08 y 0.1 y1 0.1
OUTLINE VERSION SOT569-1
REFERENCES IEC JEDEC MO-216 JEITA
EUROPEAN PROJECTION
ISSUE DATE 03-07-09 05-09-14
Fig 16. Package outline SOT569-1 (TFBGA144)
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
11. Abbreviations
Table 16. Acronym ADC AMBA APB CISC FIFO GPIO PWM RISC SPI SSI SRAM TTL UART Acronym list Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Complex Instruction Set Computer First In, First Out General Purpose Input/Output Pulse Width Modulator Reduced Instruction Set Computer Serial Peripheral Interface Serial Synchronous Interface Static Random Access Memory Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter
LPC2210_2220_4
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Product data sheet
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
12. Revision history
Table 17. Revision history Release date 20071002 Data sheet status Product data sheet Product data sheet Change notice Supersedes LPC2210_2220_3 LPC2210_2220_2 Document ID LPC2210_2220_4 Modifications: LPC2210_2220_3 Modifications:
• • • •
Figure 1: changed incorrect character font The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added new device LPC2220FET144/G. Product data sheet Preliminary data LPC2210-01
20070213
LPC2210_2220_2 LPC2210-01
20050530 20040209
LPC2210_2220_4
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Product data sheet
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47 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V.
14. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
LPC2210_2220_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 2 October 2007
48 of 49
NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
15. Contents
1 2 2.1 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.4.1 6.5 6.6 6.7 6.8 6.9 6.10 6.10.1 6.11 6.11.1 6.12 6.12.1 6.13 6.13.1 6.14 6.14.1 6.15 6.15.1 6.15.2 6.16 6.16.1 6.17 6.17.1 6.18 6.18.1 6.19 6.19.1 6.20 6.20.1 6.20.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . 14 Architectural overview. . . . . . . . . . . . . . . . . . . 14 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 17 Pin function select register 0 (PINSEL0 - 0xE002 C000) . . . . . . . . . . . . . . . 17 Pin function select register 1 (PINSEL1 - 0xE002 C004) . . . . . . . . . . . . . . . 19 Pin function select register 2 (PINSEL2 - 0xE002 C014) . . . . . . . . . . . . . . . 21 External memory controller. . . . . . . . . . . . . . . 22 General purpose parallel I/O. . . . . . . . . . . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 I2C-bus serial I/O controller . . . . . . . . . . . . . . 23 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 24 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 SSP controller. . . . . . . . . . . . . . . . . . . . . . . . . 24 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 General purpose timers . . . . . . . . . . . . . . . . . 24 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 25 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 25 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Pulse width modulator . . . . . . . . . . . . . . . . . . 26 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 System control . . . . . . . . . . . . . . . . . . . . . . . . 27 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 27 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6.20.3 6.20.4 6.20.5 6.20.6 6.20.7 6.21 6.21.1 6.21.2 6.21.3 7 8 9 9.1 9.2 9.3 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Reset and wake-up timer . . . . . . . . . . . . . . . . External interrupt inputs . . . . . . . . . . . . . . . . . Memory mapping control . . . . . . . . . . . . . . . . Power control . . . . . . . . . . . . . . . . . . . . . . . . . APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Emulation and debugging. . . . . . . . . . . . . . . . EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . Embedded trace. . . . . . . . . . . . . . . . . . . . . . . RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LPC2210 power consumption measurements LPC2220 power consumption measurements Package outline . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 28 28 28 28 29 29 29 30 31 32 36 39 40 42 44 46 47 48 48 48 48 48 48 49
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 October 2007 Document identifier: LPC2210_2220_4
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