LPC2290

LPC2290 16/32-bit ARM microcontroller with CAN, 10-bit ADC and external memory interface Rev. 03 — 16 November 2006 Product data sheet 1. General description The LPC2290 microcontroller is based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. With its 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, two advanced CAN channels, PWM channels and up to nine external interrupt pins this microcontroller is particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The LPC2290 provides up to 76 GPIOs depending on bus configuration. With a wide range of additional serial communications interfaces, it is also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term ‘LPC2290’ will apply to devices with and without the /01 suffix. New devices will use the /01 suffix to differentiate from the original devices only when necessary. 2. Features 2.1 Enhancements introduced with LPC2290/01 device I CPU clock up to 72 MHz and 64 kB of on-chip static RAM. I Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original LPC2290. A port pin can be read at any time regardless of its function. I Dedicated result registers for ADC reduce interrupt overhead. I UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware. I SSP serial controller supporting SPI, 4-wire SSI, and Microwire buses. 2.2 Key features common for LPC2290 and LPC2290/01 I 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 package. I 16/64 kB on-chip static RAM. I Serial bootloader using UART0 provides in-system download and programming capabilities. I EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software as well as high-speed real-time tracing of instruction execution. I Two interconnected CAN interfaces with advanced acceptance filters. Additional serial interfaces include two UARTs (16C550), Fast I2C-bus (400 kbit/s) and two SPIs. NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface I Eight channel 10-bit ADC with conversion time as low as 2.44 µs. I Two 32-bit timers (with four capture and four compare channels), PWM unit (six outputs), Real-Time Clock (RTC) and watchdog. I Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses. I Configurable external memory interface with up to four banks, each up to 16 MB and 8/16/32-bit data width. I Up to 76 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive external interrupt pins available. I 60/72 MHz maximum CPU clock available from programmable on-chip PLL with settling time of 100 µs. I On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz. I Power saving modes include Idle and Power-down. I Processor wake-up from Power-down mode via external interrupt. I Individual enable/disable of peripheral functions for power optimization. I Dual power supply: N CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V). N I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads. 3. Ordering information Table 1. Ordering information Package Name LPC2290FBD144 LPC2290FBD144/01 LQFP144 LQFP144 Description plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm Version SOT486-1 SOT486-1 Type number 3.1 Ordering options Table 2. Ordering options RAM 16 kB CAN Enhancements Temperature range −40 °C to +85 °C −40 °C to +85 °C 2 channels None 2 channels Higher CPU clock, more on-chip SRAM, Fast I/Os, improved UARTs, added SSP, upgraded ADC Type number LPC2290FBD144 LPC2290FBD144/01 64 kB LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 2 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 4. Block diagram TMS(1) TDI(1) TRST(1) TCK(1) TDO(1) XTAL2 RST XTAL1 LPC2290 LPC2290/01 P0[31:0] P1[31:16], P1[1:0] TEST/DEBUG INTERFACE EMULATION TRACE MODULE PLL system clock SYSTEM FUNCTIONS VECTORED INTERRUPT CONTROLLER ARM7TDMI-S FAST GENERAL PURPOSE I/O(3) ARM7 local bus AHB BRIDGE AMBA Advanced High-performance Bus(AHB) INTERNAL SRAM CONTROLLER AHB DECODER AHB TO APB BRIDGE APB DIVIDER CS3 to CS0(2) A23 to A0(2) BLS3 to BLS0(2) OE, WE(2) D31 to D0(2) SCL SDA SCK0, SCK1 16/64 kB SRAM EXTERNAL MEMORY CONTROLLER Advanced Peripheral Bus (APB) EINT3 to EINT0 EXTERNAL INTERRUPTS I2C-BUS SERIAL INTERFACE 4 × CAP0 4 × CAP1 4 × MAT0 4 × MAT1 CAPTURE/ COMPARE TIMER 0/TIMER 1 SPI AND SSP(3) SERIAL INTERFACES 0 AND 1 MOSI0, MOSI1 MISO0, MISO1 SSEL0, SSEL1 TXD0, TXD1 AIN3 to AIN0 A/D CONVERTER AIN7 to AIN4 P0[30:0] P1[31:16], P1[1:0] P2[31:0] P3[31:0] PWM6 to PWM1 PWM0 WATCHDOG TIMER SYSTEM CONTROL GENERAL PURPOSE I/O CAN UART0/UART1 RXD0, RXD1 DSR1, CTS1, DCD1, RI1 TD2, TD1 RD2, RD1 REAL-TIME CLOCK 002aaa796 (1) When test/debug interface is used, GPIO/other functions sharing these pins are not available. (2) Pins shared with GPIO. (3) Available in LPC2290/01 only. Fig 1. Block diagram LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 3 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 5. Pinning information 5.1 Pinning 144 109 108 1 LPC2290 36 37 72 73 002aaa797 Fig 2. LQFP144 pinning LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 4 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 5.2 Pin description Table 3. Symbol P0.0 to P0.31 Pin description Pin Type I/O Description Port 0: Port 0 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect Block. Pins 26 and 31 of port 0 are not available. P0.0/TXD0/ PWM1 42[1] I/O O O P0.1/RXD0/ PWM3/EINT0 49[2] I/O I O I P0.2/SCL/ CAP0.0 50[3] I/O I/O I P0.3/SDA/ MAT0.0/EINT1 58[3] I/O I/O O I P0.4/SCK0/ CAP0.1 59[1] I/O I/O I P0.5/MISO0/ MAT0.1 61[1] I/O I/O O P0.6/MOSI0/ CAP0.2 68[1] I/O I/O I P0.7/SSEL0/ PWM2/EINT2 69[2] I/O I O I P0.8/TXD1/ PWM4 75[1] I/O O O P0.0 — General purpose digital input/output pin. TXD0 — Transmitter output for UART0. PWM1 — Pulse Width Modulator output 1. P0.1 — General purpose digital input/output pin. RXD0 — Receiver input for UART0. PWM3 — Pulse Width Modulator output 3. EINT0 — External interrupt 0 input P0.2 — General purpose digital input/output pin. SCL — I2C-bus clock input/output. Open-drain output (for I2C-bus compliance). CAP0.0 — Capture input for Timer 0, channel 0. P0.3 — General purpose digital input/output pin. SDA — I2C-bus data input/output. Open-drain output (for I2C-bus compliance). MAT0.0 — Match output for Timer 0, channel 0. EINT1 — External interrupt 1 input. P0.4 — General purpose digital input/output pin. SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave. CAP0.1 — Capture input for Timer 0, channel 1. P0.5 — General purpose digital input/output pin. MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data output from SPI slave. MAT0.1 — Match output for Timer 0, channel 1. P0.6 — General purpose digital input/output pin. MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. CAP0.2 — Capture input for Timer 0, channel 2. P0.7 — General purpose digital input/output pin. SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave. PWM2 — Pulse Width Modulator output 2. EINT2 — External interrupt 2 input. P0.8 — General purpose digital input/output pin. TXD1 — Transmitter output for UART1. PWM4 — Pulse Width Modulator output 4. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 5 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol Pin description …continued Pin 76[2] Type I/O I O I Description P0.9 — General purpose digital input/output pin. RXD1 — Receiver input for UART1. PWM6 — Pulse Width Modulator output 6. EINT3 — External interrupt 3 input. P0.10 — General purpose digital input/output pin. RTS1 — Request to Send output for UART1. CAP1.0 — Capture input for Timer 1, channel 0. P0.11 — General purpose digital input/output pin. CTS1 — Clear to Send input for UART1. CAP1.1 — Capture input for Timer 1, channel 1. P0.12 — General purpose digital input/output pin. DSR1 — Data Set Ready input for UART1. MAT1.0 — Match output for Timer 1, channel 0. P0.13 — General purpose digital input/output pin. DTR1 — Data Terminal Ready output for UART1. MAT1.1 — Match output for Timer 1, channel 1. P0.14 — General purpose digital input/output pin. DCD1 — Data Carrier Detect input for UART1. EINT1 — External interrupt 1 input. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take over control of the part after reset. P0.9/RXD1/ PWM6/EINT3 P0.10/RTS1/ CAP1.0 78[1] I/O O I P0.11/CTS1/ CAP1.1 83[1] I/O I I P0.12/DSR1/ MAT1.0 84[1] I/O I O P0.13/DTR1/ MAT1.1 85[1] I/O O O P0.14/DCD1/ EINT1 92[2] I/O I I P0.15/RI1/ EINT2 99[2] I/O I I I/O I O I P0.15 — General purpose digital input/output pin. RI1 — Ring Indicator input for UART1. EINT2 — External interrupt 2 input. P0.16 — General purpose digital input/output pin. EINT0 — External interrupt 0 input. MAT0.2 — Match output for Timer 0, channel 2. CAP0.2 — Capture input for Timer 0, channel 2. P0.17 — General purpose digital input/output pin. CAP1.2 — Capture input for Timer 1, channel 2. SCK1 — Serial Clock for SPI1/SSP. SPI clock output from master or input to slave (SSP is available in LPC2290/01 only). MAT1.2 — Match output for Timer 1, channel 2. P0.18 — General purpose digital input/output pin. CAP1.3 — Capture input for Timer 1, channel 3. MISO1 — Master In Slave Out for SPI1/SSP. Data input to SPI master or data output from SPI slave (SSP is available in LPC2290/01 only). MAT1.3 — Match output for Timer 1, channel 3. P0.16/EINT0/ 100[2] MAT0.2/CAP0.2 P0.17/CAP1.2/ SCK1/MAT1.2 101[1] I/O I I/O O P0.18/CAP1.3/ MISO1/MAT1.3 121[1] I/O I I/O O LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 6 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol Pin description …continued Pin 122[1] Type I/O O I/O I Description P0.19 — General purpose digital input/output pin. MAT1.2 — Match output for Timer 1, channel 2. MOSI1 — Master Out Slave In for SPI1/SSP. Data output from SPI master or data input to SPI slave (SSP is available in LPC2290/01 only). CAP1.2 — Capture input for Timer 1, channel 2. P0.20 — General purpose digital input/output pin. MAT1.3 — Match output for Timer 1, channel 3. SSEL1 — Slave Select for SPI1/SSP. Selects the SPI interface as a slave (SSP is available in LPC2290/01 only). EINT3 — External interrupt 3 input. P0.21 — General purpose digital input/output pin. PWM5 — Pulse Width Modulator output 5. CAP1.3 — Capture input for Timer 1, channel 3. P0.22 — General purpose digital input/output pin. CAP0.0 — Capture input for Timer 0, channel 0. MAT0.0 — Match output for Timer 0, channel 0. P0.23 — General purpose digital input/output pin. RD2 — CAN2 receiver input. P0.24 — General purpose digital input/output pin. TD2 — CAN2 transmitter output. P0.25 — General purpose digital input/output pin. RD1 — CAN1 receiver input. P0.27 — General purpose digital input/output pin. AIN0 — ADC, input 0. This analog input is always connected to its pin. CAP0.1 — Capture input for Timer 0, channel 1. MAT0.1 — Match output for Timer 0, channel 1. P0.28 — General purpose digital input/output pin. AIN1 — ADC, input 1. This analog input is always connected to its pin. CAP0.2 — Capture input for Timer 0, channel 2. MAT0.2 — Match output for Timer 0, channel 2. P0.29 — General purpose digital input/output pin. AIN2 — ADC, input 2. This analog input is always connected to its pin. CAP0.3 — Capture input for Timer 0, Channel 3. MAT0.3 — Match output for Timer 0, channel 3. P0.30 — General purpose digital input/output pin. AIN3 — ADC, input 3. This analog input is always connected to its pin. EINT3 — External interrupt 3 input. CAP0.0 — Capture input for Timer 0, channel 0. Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect Block. Pins 2 through 15 of port 1 are not available. P0.19/MAT1.2/ MOSI1/CAP1.2 P0.20/MAT1.3/ SSEL1/EINT3 123[2] I/O O I I P0.21/PWM5/ CAP1.3 4[1] I/O O I P0.22/CAP0.0/ MAT0.0 5[1] I/O I O P0.23/RD2 P0.24/TD2 P0.25 P0.27/AIN0/ CAP0.1/MAT0.1 6[1] 8[1] 21[1] 23[4] I/O I I/O O I/O I I/O I I O P0.28/AIN1/ CAP0.2/MAT0.2 25[4] I/O I I O P0.29/AIN2/ CAP0.3/MAT0.3 32[4] I/O I I O P0.30/AIN3/ EINT3/CAP0.0 33[4] I/O I I I P1.0 to P1.31 I/O LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 7 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol P1.0/CS0 Pin description …continued Pin 91[5] Type I/O O Description P1.0 — General purpose digital input/output pin. CS0 — LOW-active Chip Select 0 signal. (Bank 0 addresses range 0x8000 0000 to 0x80FF FFFF) P1.1 — General purpose digital input/output pin. OE — LOW-active Output Enable signal. P1.16 — General purpose digital input/output pin. TRACEPKT0 — Trace Packet, bit 0. Standard I/O port with internal pull-up. P1.17 — General purpose digital input/output pin. TRACEPKT1 — Trace Packet, bit 1. Standard I/O port with internal pull-up. P1.18 — General purpose digital input/output pin. TRACEPKT2 — Trace Packet, bit 2. Standard I/O port with internal pull-up. P1.19 — General purpose digital input/output pin. TRACEPKT3 — Trace Packet, bit 3. Standard I/O port with internal pull-up. P1.20 — General purpose digital input/output pin. TRACESYNC — Trace Synchronization. Standard I/O port with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[25:16] to operate as Trace port after reset. P1.1/OE P1.16/ TRACEPKT0 P1.17/ TRACEPKT1 P1.18/ TRACEPKT2 P1.19/ TRACEPKT3 P1.20/ TRACESYNC 90[5] 34[5] 24[5] 15[5] 7[5] 102[5] I/O O I/O O I/O O I/O O I/O O I/O O P1.21/ PIPESTAT0 P1.22/ PIPESTAT1 P1.23/ PIPESTAT2 P1.24/ TRACECLK P1.25/EXTIN0 P1.26/RTCK 95[5] 86[5] 82[5] 70[5] 60[5] 52[5] I/O O I/O O I/O O I/O O I/O I I/O I/O P1.21 — General purpose digital input/output pin. PIPESTAT0 — Pipeline Status, bit 0. Standard I/O port with internal pull-up. P1.22 — General purpose digital input/output pin. PIPESTAT1 — Pipeline Status, bit 1. Standard I/O port with internal pull-up. P1.23 — General purpose digital input/output pin. PIPESTAT2 — Pipeline Status, bit 2. Standard I/O port with internal pull-up. P1.24 — General purpose digital input/output pin. TRACECLK — Trace Clock. Standard I/O port with internal pull-up. P1.25 — General purpose digital input/output pin. EXTIN0 — External Trigger Input. Standard I/O with internal pull-up. P1.26 — General purpose digital input/output pin. RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up. Note: LOW on this pin while RESET is LOW, enables pins P1[31:26] to operate as Debug port after reset. P1.27/TDO P1.28/TDI P1.29/TCK P1.30/TMS 144[5] 140[5] 126[5] 113[5] I/O O I/O I I/O I I/O I P1.27 — General purpose digital input/output pin. TDO — Test Data out for JTAG interface. P1.28 — General purpose digital input/output pin. TDI — Test Data in for JTAG interface. P1.29 — General purpose digital input/output pin. TCK — Test Clock for JTAG interface. P1.30 — General purpose digital input/output pin. TMS — Test Mode Select for JTAG interface. © NXP B.V. 2006. All rights reserved. LPC2290_3 Product data sheet Rev. 03 — 16 November 2006 8 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol Pin description …continued Pin 43[5] Type I/O I I/O Description P1.31 — General purpose digital input/output pin. TRST — Test Reset for JTAG interface. Port 2 — Port 2 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the Pin Connect Block. P2.0 — General purpose digital input/output pin. D0 — External memory data line 0. P2.1 — General purpose digital input/output pin. D1 — External memory data line 1. P2.2 — General purpose digital input/output pin. D2 — External memory data line 2. P2.3 — General purpose digital input/output pin. D3 — External memory data line 3. P2.4 — General purpose digital input/output pin. D4 — External memory data line 4. P2.5 — General purpose digital input/output pin. D5 — External memory data line 5. P2.6 — General purpose digital input/output pin. D6 — External memory data line 6. P2.7 — General purpose digital input/output pin. D7 — External memory data line 7. P2.8 — General purpose digital input/output pin. D8 — External memory data line 8. P2.9 — General purpose digital input/output pin. D9 — External memory data line 9. P2.10 — General purpose digital input/output pin. D10 — External memory data line 10. P2.11 — General purpose digital input/output pin. D11 — External memory data line 11. P2.12 — General purpose digital input/output pin. D12 — External memory data line 12. P2.13 — General purpose digital input/output pin. D13 — External memory data line 13. P2.14 — General purpose digital input/output pin. D14 — External memory data line 14. P2.15 — General purpose digital input/output pin. D15 — External memory data line 15. P2.16 — General purpose digital input/output pin. D16 — External memory data line 16. P2.17 — General purpose digital input/output pin. D17 — External memory data line 17. © NXP B.V. 2006. All rights reserved. P1.31/TRST P2.0 to P2.31 P2.0/D0 P2.1/D1 P2.2/D2 P2.3/D3 P2.4/D4 P2.5/D5 P2.6/D6 P2.7/D7 P2.8/D8 P2.9/D9 P2.10/D10 P2.11/D11 P2.12/D12 P2.13/D13 P2.14/D14 P2.15/D15 P2.16/D16 P2.17/D17 98[5] 105[5] 106[5] 108[5] 109[5] 114[5] 115[5] 116[5] 117[5] 118[5] 120[5] 124[5] 125[5] 127[5] 129[5] 130[5] 131[5] 132[5] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O LPC2290_3 Product data sheet Rev. 03 — 16 November 2006 9 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol P2.18/D18 P2.19/D19 P2.20/D20 P2.21/D21 P2.22/D22 P2.23/D23 P2.24/D24 P2.25/D25 P2.26/D26/ BOOT0 Pin description …continued Pin 133[5] 134[5] 136[5] 137[5] 1[5] 10[5] 11[5] 12[5] 13[5] Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I Description P2.18 — General purpose digital input/output pin. D18 — External memory data line 18. P2.19 — General purpose digital input/output pin. D19 — External memory data line 19. P2.20 — General purpose digital input/output pin. D20 — External memory data line 20. P2.21 — General purpose digital input/output pin. D21 — External memory data line 21. P2.22 — General purpose digital input/output pin. D22 — External memory data line 22. P2.23 — General purpose digital input/output pin. D23 — External memory data line 23. P2.24 — General purpose digital input/output pin. D24 — External memory data line 24. P2.25 — General purpose digital input/output pin. D25 — External memory data line 25. P2.26 — General purpose digital input/output pin. D26 — External memory data line 26. BOOT0 — While RESET is low, together with BOOT1 controls booting and internal operation. Internal pull-up ensures high state if pin is left unconnected. P2.27 — General purpose digital input/output pin. D27 — External memory data line 27. BOOT1 — While RESET is low, together with BOOT0 controls booting and internal operation. Internal pull-up ensures high state if pin is left unconnected. BOOT1:0 = 00 selects 8-bit memory on CS0 for boot. BOOT1:0 = 01 selects 16-bit memory on CS0 for boot. BOOT1:0 = 10 selects 32-bit memory on CS0 for boot. BOOT1:0 = 11 selects internal flash memory. P2.27/D27/ BOOT1 16[5] I/O I/O I P2.28/D28 P2.29/D29 P2.30/D30/ AIN4 17[5] 18[5] 19[2] I/O I/O I/O I/O I/O I/O I P2.28 — General purpose digital input/output pin. D28 — External memory data line 28. P2.29 — General purpose digital input/output pin. D29 — External memory data line 29. P2.30 — General purpose digital input/output pin. D30 — External memory data line 30. AIN4 — ADC, input 4. This analog input is always connected to its pin. P2.31 — General purpose digital input/output pin. D31 — External memory data line 31. AIN5 — ADC, input 5. This analog input is always connected to its pin. Port 3 — Port 3 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the Pin Connect Block. © NXP B.V. 2006. All rights reserved. P2.31/D31/ AIN5 20[2] I/O I/O I I/O P3.0 to P3.31 LPC2290_3 Product data sheet Rev. 03 — 16 November 2006 10 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol P3.0/A0 P3.1/A1 P3.2/A2 P3.3/A3 P3.4/A4 P3.5/A5 P3.6/A6 P3.7/A7 P3.8/A8 P3.9/A9 P3.10/A10 P3.11/A11 P3.12/A12 P3.13/A13 P3.14/A14 P3.15/A15 P3.16/A16 P3.17/A17 P3.18/A18 P3.19/A19 Pin description …continued Pin 89[5] 88[5] 87[5] 81[5] 80[5] 74[5] 73[5] 72[5] 71[5] 66[5] 65[5] 64[5] 63[5] 62[5] 56[5] 55[5] 53[5] 48[5] 47[5] 46[5] Type I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O Description P3.0 — General purpose digital input/output pin. A0 — External memory address line 0. P3.1 — General purpose digital input/output pin. A1 — External memory address line 1. P3.2 — General purpose digital input/output pin. A2 — External memory address line 2. P3.3 — General purpose digital input/output pin. A3 — External memory address line 3. P3.4 — General purpose digital input/output pin. A4 — External memory address line 4. P3.5 — General purpose digital input/output pin. A5 — External memory address line 5. P3.6 — General purpose digital input/output pin. A6 — External memory address line 6. P3.7 — General purpose digital input/output pin. A7 — External memory address line 7. P3.8 — General purpose digital input/output pin. A8 — External memory address line 8. P3.9 — General purpose digital input/output pin. A9 — External memory address line 9. P3.10 — General purpose digital input/output pin. A10 — External memory address line 10. P3.11 — General purpose digital input/output pin. A11 — External memory address line 11. P3.12 — General purpose digital input/output pin. A12 — External memory address line 12. P3.13 — General purpose digital input/output pin. A13 — External memory address line 13. P3.14 — General purpose digital input/output pin. A14 — External memory address line 14. P3.15 — General purpose digital input/output pin. A15 — External memory address line 15. P3.16 — General purpose digital input/output pin. A16 — External memory address line 16. P3.17 — General purpose digital input/output pin. A17 — External memory address line 17. P3.18 — General purpose digital input/output pin. A18 — External memory address line 18. P3.19 — General purpose digital input/output pin. A19 — External memory address line 19. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 11 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol P3.20/A20 P3.21/A21 P3.22/A22 P3.23/A23/ XCLK Pin description …continued Pin 45[5] 44[5] 41[5] 40[5] Type I/O O I/O O I/O O I/O I/O O 36[5] I/O O Description P3.20 — General purpose digital input/output pin. A20 — External memory address line 20. P3.21 — General purpose digital input/output pin. A21 — External memory address line 21. P3.22 — General purpose digital input/output pin. A22 — External memory address line 22. P3.23 — General purpose digital input/output pin. A23 — External memory address line 23. XCLK — Clock output. P3.24 — General purpose digital input/output pin. CS3 — LOW-active Chip Select 3 signal. (Bank 3 addresses range 0x8300 0000 to 0x83FF FFFF) P3.25 — General purpose digital input/output pin. CS2 — LOW-active Chip Select 2 signal. (Bank 2 addresses range 0x8200 0000 to 0x82FF FFFF) P3.26 — General purpose digital input/output pin. CS1 — LOW-active Chip Select 1 signal. (Bank 1 addresses range 0x8100 0000 to 0x81FF FFFF) P3.27 — General purpose digital input/output pin. WE — LOW-active Write enable signal. P3.28 — General purpose digital input/output pin. BLS3 — LOW-active Byte Lane Select signal (Bank 3). AIN7 — ADC, input 7. This analog input is always connected to its pin. P3.29 — General purpose digital input/output pin. BLS2 — LOW-active Byte Lane Select signal (Bank 2). AIN6 — ADC, input 6. This analog input is always connected to its pin. P3.30 — General purpose digital input/output pin. BLS1 — LOW-active Byte Lane Select signal (Bank 1). P3.31 — General purpose digital input/output pin. BLS0 — LOW-active Byte Lane Select signal (Bank 0). TD1: CAN1 transmitter output. External Reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Ground: 0 V reference. P3.24/CS3 P3.25/CS2 35[5] I/O O P3.26/CS1 30[5] I/O O P3.27/WE P3.28/BLS3/ AIN7 29[5] 28[2] I/O O I/O O I P3.29/BLS2/ AIN6 27[4] I/O O I P3.30/BLS1 P3.31/BLS0 TD1 RESET 97[4] 96[4] 22[5] 135[6] I/O O I/O O O I XTAL1 XTAL2 VSS 142[7] 141[7] I O 3, 9, 26, 38, I 54, 67, 79, 93, 103, 107, 111, 128 139 I VSSA Analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 12 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 3. Symbol VSSA(PLL) VDD(1V8) VDDA(1V8) Pin description …continued Pin 138 37, 110 143 Type I I I Description PLL analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 1.8 V core power supply: This is the power supply voltage for internal circuitry. Analog 1.8 V core power supply: This is the power supply voltage for internal circuitry. This should be nominally the same voltage as VDD(1V8) but should be isolated to minimize noise and error. 3.3 V pad power supply: This is the power supply voltage for the I/O ports. VDD(3V3) 2, 31, 39, 51, I 57, 77, 94, 104, 112, 119 14 I VDDA(3V3) Analog 3.3 V pad power supply: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. [1] [2] [3] [4] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output functionality. 5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured for a digital input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital section of the pad is disabled. 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. The pull-up resistor’s value ranges from 60 kΩ to 300 kΩ. 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only. Pad provides special analog functionality. [5] [6] [7] LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 13 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 6. Functional description 6.1 Architectural overview The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on RISC principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed CISC. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • The standard 32-bit ARM set. • A 16-bit Thumb set. The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. 6.2 On-chip SRAM On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed as 8-bit, 16-bit, and 32-bit. The LPC2290 provides 16 kB of SRAM and the LPC2290/01 provides 64 kB of SRAM. 6.3 Memory map The LPC2290 memory maps incorporate several distinct regions, as shown in Figure 3. In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either on-chip bootloader, external memory BANK0 or on-chip static RAM. This is described in Section 6.18 “System control”. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 14 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 4.0 GB AHB PERIPHERALS 3.75 GB VPB PERIPHERALS 3.5 GB 0xFFFF FFFF 0xF000 0000 0xEFFF FFFF 0xE000 0000 0xDFFF FFFF RESERVED ADDRESS SPACE 3.0 GB EXTERNAL MEMORY BANK3 EXTERNAL MEMORY BANK2 EXTERNAL MEMORY BANK1 EXTERNAL MEMORY BANK0 2.0 GB BOOT BLOCK (RE-MAPPED FROM ON-CHIP ROM MEMORY RESERVED ADDRESS SPACE 64 KBYTE ON-CHIP STATIC RAM (/01 ONLY) 0x8400 0000 0x83FF FFFF 0x8300 0000 0x82FF FFFF 0x8200 0000 0x81FF FFFF 0x8100 0000 0x80FF FFFF 0x8000 0000 0x7FFF FFFF 0x7FFF E000 0x7FFF DFFF 0x4001 0000 0x4000 FFFF 0x4000 4000 0x4000 3FFF 16 KBYTE ON-CHIP STATIC RAM 1.0 GB 0x4000 0000 0x3FFF FFFF RESERVED ADDRESS SPACE 0.0 GB 0x0000 0000 002aaa798 Fig 3. LPC2290 and LPC2290/01 memory map 6.4 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 15 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are requesting, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active. 6.4.1 Interrupt sources Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has one interrupt line connected to the VIC, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Table 4. Block WDT ARM Core ARM Core Timer 0 Timer 1 UART0 Interrupt sources Flag(s) Watchdog Interrupt (WDINT) Reserved for software interrupts only EmbeddedICE, DbgCommRx EmbeddedICE, DbgCommTx Match 0 to 3 (MR0, MR1, MR2, MR3) Capture 0 to 3 (CR0, CR1, CR2, CR3) Match 0 to 3 (MR0, MR1, MR2, MR3) Capture 0 to 3 (CR0, CR1, CR2, CR3) RX Line Status (RLS) Transmit Holding Register Empty (THRE) RX Data Available (RDA) Character Time-out Indicator (CTI) Auto-Baud Time-Out (ABTO) (available in LPC2290/01 only) End of Auto-Baud (ABEO) UART1 RX Line Status (RLS) Transmit Holding Register empty (THRE) RX Data Available (RDA) Character Time-out Indicator (CTI) Modem Status Interrupt (MSI) Auto-Baud Time-Out (ABTO) (available in LPC2290/01 only) End of Auto-Baud (ABEO) PWM0 I2C-bus SPI0 Match 0 to 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6) SI (state change) SPIF, MODF 8 9 10 7 6 5 VIC channel # 0 1 2 3 4 LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 16 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Interrupt sources …continued Flag(s) Source: SPI1 SPI Interrupt Flag (SPIF), Mode Fault (MODF) Source: SSP (available in LPC2290/01 only) TX FIFO at least half empty (TXRIS) RX FIFO at least half full (RXRIS) Receive Timeout condition (RTRIS) Receive Overrun (RORRIS) VIC channel # 11 Table 4. Block SPI1/SSP PLL RTC System Control PLL Lock (PLOCK) RTCCIF (Counter Increment), RTCALF (Alarm) External Interrupt 0 (EINT0) External Interrupt 1 (EINT1) External Interrupt 2 (EINT2) External Interrupt 3 (EINT3) 12 13 14 15 16 17 18 19 20, 21 22, 23 A/D CAN ADC 1 ORed CAN Acceptance Filter CAN1 (TX int, RX int) CAN2 (TX int, RX int) 6.5 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 6.6 External memory controller The external Static Memory Controller is a module which provides an interface between the system bus and external (off-chip) memory devices. It provides support for up to four independently configurable memory banks (16 MB each with byte lane enable control) simultaneously. Each memory bank is capable of supporting SRAM, ROM, flash EPROM, burst ROM memory, or some external I/O devices. Each memory bank may be 8-bit, 16-bit, or 32-bit wide. 6.7 General purpose parallel I/O and Fast I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins. 6.7.1 Features • Direction control of individual bits. • Separate control of output set and clear. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 17 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface • All I/O default to inputs after reset. 6.7.2 Fast I/O features available in LPC2290/01 only • • • • Fast I/O registers are located on the ARM local bus for the fastest possible I/O timing. All GPIO registers are byte addressable. Entire port value can be written in one instruction. Mask registers allow single instruction to set or clear any number of bits in one port. 6.8 10-bit ADC The LPC2290 each contain a single 10-bit successive approximation ADC with eight multiplexed channels. 6.8.1 Features • • • • Measurement range of 0 V to 3.3 V. Capable of performing more than 400000 10-bit samples per second. Burst conversion mode for single or multiple inputs. Optional conversion on transition on input pin or Timer Match signal. 6.8.2 ADC features available in LPC2290/01 only • Every analog input has a dedicated result register to reduce interrupt overhead. • Every analog input can generate an interrupt once the conversion is completed. 6.9 CAN controllers and acceptance filter The LPC2290 contains two CAN controllers. The CAN is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. 6.9.1 Features • • • • • Data rates up to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit RX identifiers for all CAN buses. Acceptance Filter can provide FullCAN-style automatic reception for selected Standard identifiers. • Full CAN messages can generate interrupts. 6.10 UARTs The LPC2290 contains two UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface. 6.10.1 Features • 16 B Receive and Transmit FIFOs. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 18 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface • • • • Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in baud rate generator. Standard modem interface signals included on UART1. 6.10.2 UART features available in LPC2290/01 only • The transmission FIFO control enables implementation of software (XON/XOFF) flow control on both UARTs and hardware (CTS/RTS) flow control on UART1 only. • Fractional baud rate generator enables standard baud rates such as 115200 to be achieved with any crystal frequency above 2 MHz. • Auto-bauding. • Auto-CTS/RTS flow-control fully implemented in hardware. 6.11 I2C-bus serial I/O controller The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2290 supports bit rate up to 400 kbit/s (Fast I2C-bus). 6.11.1 Features • • • • • • Compliant with standard I2C-bus interface. Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. one serial bus. • Serial clock synchronization allows devices with different bit rates to communicate via • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus may be used for test and diagnostic purposes. 6.12 SPI serial I/O controller The LPC2290 contains two SPIs. The SPI is a full duplex serial interface, designed to be able to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 19 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 6.12.1 Features • • • • Compliant with SPI specification. Synchronous, serial, full duplex, communication. Combined SPI master and slave. Maximum data bit rate of one eighth of the input clock rate. 6.13 SSP serial I/O controller (available in LPC2290/01 only) The LPC2290/01 contains one Serial Synchronous Port controller (SSP). The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. However, only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. Often only one of these data flows carries meaningful data. The SSP and SPI1 share the same pins on LPC2290/01. After a reset, SPI1 is enabled and SSP is disabled. 6.13.1 Features • Synchronous Serial Communication. • 8-frame FIFOs for both transmit and receive. • Compatible with Motorola SPI, 4-wire TI SSI and National Semiconductor Microwire buses. • Master or slave operation. • Four bits to 16 bits per SPI frame. 6.14 General purpose timers The TIMER0 and TIMER1 are designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them. 6.14.1 Features • A 32-bit Timer/Counter with a programmable 32-bit prescaler. • Four 32-bit capture channels per timer that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 20 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface • Four external outputs per timer corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 6.14.2 Timer features available in LPC2290/01 only • Timers can count cycles of the externally supplied clock providing external event counting functionality 6.15 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 6.15.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect/incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 32-bit timer with internal pre-scaler. Selectable time period from (Tcy(PCLK) × 256 × 4) to (Tcy(PCLK) × 232 × 4) in multiples of Tcy(PCLK) × 4. 6.16 Real-time clock The Real-Time Clock (RTC) is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode). 6.16.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra-low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Programmable Reference Clock Divider allows adjustment of the RTC to match various crystal frequencies. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 21 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 6.17 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2290. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 6.17.1 Features • Seven match registers allow up to six single edge controlled or three double edge controlled PWM outputs, or a mix of both types. • The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 22 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit prescaler. 6.18 System control 6.18.1 Crystal oscillator The oscillator supports crystals in the range of 1 MHz to 30 MHz. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value unless the PLL is running and connected. Refer to Section 6.18.2 “PLL” for additional information. 6.18.2 PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle.The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100 µs. 6.18.3 Reset and wake-up timer Reset has two sources on the LPC2290: the RESET pin and watchdog reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip flash controller has completed its initialization. When the internal reset is removed, the processor begins executing at address 0, which is the reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The Wake-up Timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power-on, all types of reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 23 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power-on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 6.18.4 External interrupt inputs The LPC2290 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode. 6.18.5 Memory mapping control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip flash memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts. 6.18.6 Power control The LPC2290 support two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings. 6.18.7 APB bus The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB bus so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB bus may be slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB bus must work properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB bus), the default condition at reset is for the APB bus to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 24 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 6.19 Emulation and debugging The LPC2290 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself. 6.19.1 EmbeddedICE Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote debug protocol commands to the JTAG data needed to access the ARM core. The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The debug communication channel is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core. The debug communication channel allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The debug communication channel data and control registers are mapped in to addresses in the EmbeddedICE logic. 6.19.2 Embedded trace Since the LPC2290 has significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 6.19.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC (Debug Communications Channel), which is present in the EmbeddedICE logic. The LPC2290 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 25 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(1V8) VDD(3V3) VDDA(3V3) VIA VI IDD ISS Tstg Ptot(pack) Parameter supply voltage (1.8 V) supply voltage (3.3 V) analog supply voltage (3.3 V) analog input voltage input voltage supply current ground current storage temperature total power dissipation (per package) electrostatic discharge voltage based on package heat transfer, not device power consumption human body model; all pins [7] Conditions internal rail external rail Min −0.5 −0.5 −0.5 −0.5 Max +2.5 +3.6 +4.6 +5.1 +6.0 VDD(3V3) + 0.5 100 100 +150 1.5 Unit V V V V V V mA mA °C W 5 V tolerant I/O pins other I/O pins per supply pin per ground pin [2][3] [2][4] [5] [5] [6] −0.5 −0.5 −65 - Vesd −2000 +2000 V [1] The following applies to Table 5: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Including voltage on outputs in 3-state mode. Only valid when the VDD(3V3) supply voltage is present. Not to exceed 4.6 V. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] [3] [4] [5] [6] [7] LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 26 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 8. Static characteristics Table 6. Static characteristics Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified. Symbol VDD(1V8) VDD(3V3) Parameter supply voltage (1.8 V) supply voltage (3.3 V) Conditions internal rail external rail Min 1.65 3.0 2.5 Typ[1] 1.8 3.3 3.3 Max 1.95 3.6 3.6 Unit V V V VDDA(3V3) analog supply voltage (3.3 V) Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS IOLS Ipd Ipu IDD(act) LOW-level input current HIGH-level input current OFF-state output current I/O latch-up current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage IOH = −4 mA LOW-level output voltage LOW-level output current HIGH-level short-circuit output current LOW-level short-circuit output current pull-down current pull-up current active mode supply current IOL = −4 mA VOL = 0.4 V VOH = 0 V VOL = VDD(3V3) VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V VDD(1V8) = 1.8 V, CCLK = 60 MHz, Tamb = 25 °C, code HIGH-level output current VOH = VDD(3V3) − 0.4 V [5] [5] [5] [5] [6] VI = 0 V; no pull-up VI = VDD(3V3); no pull-down VO = 0 V, VO = VDD(3V3); no pull-up/down −(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 °C [2][3][4] 100 0 0 2.0 −4 4 10 −15 0 - 0.4 50 −50 0 50 3 3 3 5.5 VDD(3V3) 0.8 0.4 −45 50 150 −85 0 - µA µA µA mA V V V V V V V mA mA mA mA µA µA µA mA output active VDD(3V3) − 0.4 - [6] [7] [8] [7] while(1){} executed from flash, no active peripherals IDD(pd) Power-down mode supply VDD(1V8) = 1.8 V, current Tamb = 25 °C, VDD(1V8) = 1.8 V, Tamb = 85 °C VDD(1V8) = 1.8 V, Tamb = 125 °C 10 110 300 500 1000 µA µA µA LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 27 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 6. Static characteristics …continued Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified. Symbol I2C-bus VIH VIL Vhys VOL ILI Parameter pins HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD(3V3); to VSS VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2) input voltage on pin XTAL1 output voltage on pin XTAL2 0 0 1.8 1.8 V V [5] Conditions Min 0.7VDD(3V3) - Typ[1] 2 10 Max - Unit V V V µA µA 0.3VDD(3V3) V 0.4 4 22 0.5VDD(3V3) - [1] [2] [3] [4] [5] [6] [7] [8] Typical ratings are not guaranteed. The values listed are at room temperature (+25 °C), nominal supply voltages. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. Applies to P1[25:16]. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 28 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 7. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +125 °C unless otherwise specified. ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO EG ET [1] [2] [3] [4] [5] [6] [7] Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error Conditions Min 0 [1][2][3] [1][4] [1][5] [1][6] [1][7] Typ - Max VDDA 1 ±1 ±2 ±3 ±0.5 ±4 Unit V pF LSB LSB LSB % LSB - Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute voltage error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 4. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 29 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface offset error EO 1023 gain error EG 1022 1021 1020 1019 1018 (2) 7 code out 6 (1) 5 (5) 4 (4) 3 (3) 2 1 1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024 0 1 2 3 4 5 6 7 VIA (LSBideal) offset error EO 1 LSB = VDDA − VSSA 1024 002aaa668 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 4. ADC characteristics LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 30 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 9. Dynamic characteristics Table 8. Dynamic characteristics Tamb = −40 °C to +125 °C; VDD(1V8), VDD(3V3) over specified ranges.[1] Symbol External clock fosc oscillator frequency supplied by an external oscillator (signal generator) external clock frequency supplied by an external crystal oscillator external clock frequency if on-chip PLL is used external clock frequency if on-chip bootloader is used for initial code download Tcy(clk) tCHCX tCLCX tCLCH tCHCL tr tf tf [1] [2] Parameter Conditions Min 1 1 Typ - Max 50 30 Unit MHz MHz 10 10 - 25 25 MHz MHz clock cycle time clock HIGH time clock LOW time clock rise time clock fall time rise time fall time fall time VIH to VIL [2] 20 Tcy(clk) × 0.4 Tcy(clk) × 0.4 - 10 10 1000 5 5 - ns ns ns ns ns ns ns ns Port pins (except P0.2 and P0.3) I2C-bus pins (P0.2 and P0.3) 20 + 0.1 × Cb - Parameters are valid over operating temperature range unless otherwise specified. Bus capacitance Cb in pF, from 10 pF to 400 pF. LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 31 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 9. External memory interface dynamic characteristics CL = 25 pF, Tamb = 40 °C Symbol tCHAV tCHCSL tCHCSH tCHANV Parameter XCLK HIGH to address valid time XCLK HIGH to CS LOW time XCLK HIGH to CS HIGH time XCLK HIGH to address invalid time CS LOW to address valid time OE LOW to address valid time CS LOW to OE LOW time memory access time memory access time (initial burst-ROM) memory access time (subsequent burst-ROM) data hold time CS HIGH to OE HIGH time OE HIGH to address invalid time XCLK HIGH to OE LOW time XCLK HIGH to OE HIGH time address valid to CS LOW time CS LOW to data valid time CS LOW to WE LOW time CS LOW to BLS LOW time WE LOW to data valid time CS LOW to data valid time WE LOW to WE HIGH time BLS LOW to BLS HIGH time WE HIGH to address invalid time WE HIGH to data invalid time BLS HIGH to address invalid time [2] [1] [2][3] [1] Conditions Min - Typ Max 10 10 10 10 Unit ns ns ns ns Common to read and write cycles Read cycle parameters tCSLAV tOELAV tCSLOEL tam tam(ibr) tam(sbr) th(D) tCSHOEH tOEHANV tCHOEL tCHOEH −5 −5 −5 (Tcy(CCLK) × (2 + WST1)) + (−20) (Tcy(CCLK) × (2 + WST1)) + (−20) Tcy(CCLK) + (−20) 0 −5 −5 −5 −5 +10 +10 +5 +5 +5 +5 +5 ns ns ns ns ns ns ns ns ns ns ns [1] [2][3] [2][4] [5] Write cycle parameters tAVCSL tCSLDV tCSLWEL tCSLBLSL tWELDV tCSLDV tWELWEH tBLSLBLSH tWEHANV tWEHDNV tBLSHANV Tcy(CCLK) − 10 −5 −5 −5 −5 −5 Tcy(CCLK) × (1 + WST2) − 5 Tcy(CCLK) × (1 + WST2) − 5 Tcy(CCLK) − 5 (2 × Tcy(CCLK)) − 5 Tcy(CCLK) − 5 +5 +5 +5 +5 +5 Tcy(CCLK) × (1 + WST2) + 5 Tcy(CCLK) × (1 + WST2) + 5 Tcy(CCLK) + 5 ns ns ns ns ns ns ns ns ns [2] [2] [2] [2] (2 × Tcy(CCLK)) + 5 ns Tcy(CCLK) + 5 ns LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 32 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface Table 9. External memory interface dynamic characteristics …continued CL = 25 pF, Tamb = 40 °C Symbol tBLSHDNV tCHDV tCHWEL tCHBLSL tCHWEH tCHBLSH tCHDNV Parameter BLS HIGH to data invalid time XCLK HIGH to data valid time XCLK HIGH to WE LOW time XCLK HIGH to BLS LOW time XCLK HIGH to WE HIGH time XCLK HIGH to BLS HIGH time XCLK HIGH to data invalid time Conditions [2] Min (2 × Tcy(CCLK)) − 5 - Typ Max - Unit (2 × Tcy(CCLK)) + 5 ns 10 10 10 10 10 10 ns ns ns ns ns ns [1] [2] [3] [4] [5] Except on initial access, in which case the address is set up Tcy(CCLK) earlier. Tcy(CCLK) = 1⁄CCLK. Latest of address valid, CS LOW, OE LOW to data valid. Address valid to data valid. Earliest of CS HIGH, OE HIGH, address change to data invalid. Table 10. Standard read access specifications Max frequency WST setting WST ≥ 0; round up to integer Memory access time requirement Access cycle standard read 2 + WST 1 f MAX ≤ -------------------------------t RAM + 20 ns 1 + WST 2 f MAX ≤ --------------------------------t WRITE + 5 ns 2 + WST 1 f MAX ≤ ------------------------------t INIT + 20 ns 1 f MAX ≤ -------------------------------t ROM + 20 ns t RAM + 20 ns WST 1 ≥ -------------------------------- – 2 t cy ( CCLK ) t WRITE – t CYC + 5 WST 2 ≥ ------------------------------------------t cy ( CCLK ) t INIT + 20 ns W ST 1 ≥ ------------------------------- – 2 t cy ( CCLK ) N/A t RAM ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns t WRITE ≤ t cy ( CCLK ) × ( 1 + WST 2 ) – 5 ns t INIT ≤ t cy ( CCLK ) × ( 2 + WST 1 ) – 20 ns t ROM ≤ t cy ( CCLK ) – 20 ns standard write burst read - initial burst read - subsequent 3× LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 33 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 9.1 Timing XCLK tCSLAV CS tCSHOEH addr tam data tCSLOEL tOELAV OE tCHOEL tCHOEH 002aaa749 th(D) tOEHANV Fig 5. External memory read access XCLK tCSLDV CS tAVCSL tWELWEH tBLSLBLSH tWEHANV tCSLBLSL tWELDV tBLSHANV tCSLWEL BLS/WE addr tCSLDV data tWEHDNV tBLSHDNV OE 002aaa750 Fig 6. External memory write access LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 34 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface VDD − 0.5 V 0.45 V 0.2VDD + 0.9 V 0.2VDD − 0.1 V tCHCL tCLCX Tcy(clk) 002aaa907 tCHCX tCLCH Fig 7. External clock timing 9.2 LPC2290 power consumption measurements 60 IDD current (mA) 40 002aab452 (1) (2) 20 0 0 10 20 30 40 50 frequency (MHz) 60 Test conditions: code executed from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK⁄4. (1) 1.8 V core at 25 °C (typical) (2) 1.65 V core at 25 °C (typical) Fig 8. LPC2290 IDD(act) measured at different frequencies (CCLK) and temperatures LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 35 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 15 IDD current (mA) 10 002aab453 (1) (2) 5 0 0 10 20 30 40 50 frequency (MHz) 60 Test conditions: Idle mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = CCLK⁄4. (1) 1.8 V core at 25 °C (typical) (2) 1.65 V core at 25 °C (typical) Fig 9. LPC2290 IDD idle measured at different frequencies (CCLK) and temperatures 500 IDD current (µA) 400 002aab454 (1) (2) (3) 300 200 100 0 −100 −50 0 50 100 temp (°C) 150 Test conditions: Power-down mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register. (1) 1.95 V core (2) 1.8 V core (3) 1.65 V core Fig 10. LPC2290 IDD(pd) measured at different temperatures LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 36 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 10. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 108 109 73 72 ZE e E HE A A2 A1 (A 3) θ Lp L detail X wM bp pin 1 index 144 1 wM D HD ZD B vM B 36 bp vM A 37 e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 20.1 19.9 E (1) 20.1 19.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D(1) Z E(1) 1.4 1.1 1.4 1.1 θ 7 o 0 o 22.15 22.15 21.85 21.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT486-1 REFERENCES IEC 136E23 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-03-14 03-02-20 Fig 11. Package outline SOT486-1 (LQFP144) LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 37 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 11. Abbreviations Table 11. Acronym ADC AMBA APB CAN CISC CPU FIFO GPIO PLL PWM RAM RISC SPI SRAM SSP TTL UART Abbreviations Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture AMBA Peripheral Bus Controller Area Network Complex Instruction Set Computer Central Processing Unit First In, First Out General Purpose Input/Output Phase-Locked Loop Pulse Width Modulator Random Access Memory Reduced Instruction Set Computer Serial Peripheral Interface Static Random Access Memory Synchronous Serial Port Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 38 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 12. Revision history Table 12. Revision history Release date 20061116 Data sheet status Product data sheet Change notice Supersedes LPC2290-02 Document ID LPC2290_3 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. New features specific to the LPC2290/01 have been added throughout. Product data Preliminary data LPC2290-01 - LPC2290-02 LPC2290-01 20041223 20040209 LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 39 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com LPC2290_3 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 03 — 16 November 2006 40 of 41 NXP Semiconductors LPC2290 16/32-bit ARM microcontroller with external memory interface 15. Contents 1 2 2.1 2.2 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.4.1 6.5 6.6 6.7 6.7.1 6.7.2 6.8 6.8.1 6.8.2 6.9 6.9.1 6.10 6.10.1 6.10.2 6.11 6.11.1 6.12 6.12.1 6.13 6.13.1 6.14 6.14.1 6.14.2 6.15 6.15.1 6.16 6.16.1 6.17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Enhancements introduced with LPC2290/01 device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key features common for LPC2290 and LPC2290/01 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . 14 Architectural overview. . . . . . . . . . . . . . . . . . . 14 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 17 External memory controller. . . . . . . . . . . . . . . 17 General purpose parallel I/O and Fast I/O . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Fast I/O features available in LPC2290/01 only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ADC features available in LPC2290/01 only . . 18 CAN controllers and acceptance filter . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 UART features available in LPC2290/01 only . 19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SSP serial I/O controller (available in LPC2290/01 only) . . . . . . . . . . . . . . . . . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 General purpose timers . . . . . . . . . . . . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Timer features available in LPC2290/01 only . 21 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Pulse width modulator . . . . . . . . . . . . . . . . . . 22 6.17.1 6.18 6.18.1 6.18.2 6.18.3 6.18.4 6.18.5 6.18.6 6.18.7 6.19 6.19.1 6.19.2 6.19.3 7 8 9 9.1 9.2 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System control . . . . . . . . . . . . . . . . . . . . . . . . Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . . PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset and wake-up timer . . . . . . . . . . . . . . . . External interrupt inputs . . . . . . . . . . . . . . . . . Memory mapping control . . . . . . . . . . . . . . . . Power control . . . . . . . . . . . . . . . . . . . . . . . . . APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Emulation and debugging. . . . . . . . . . . . . . . . EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . Embedded trace. . . . . . . . . . . . . . . . . . . . . . . RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LPC2290 power consumption measurements Package outline . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 23 23 23 23 24 24 24 24 25 25 25 25 26 27 31 34 35 37 38 39 40 40 40 40 40 40 41 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 November 2006 Document identifier: LPC2290_3