LPC2364

LPC2364/66/68 Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC Rev. 02 — 1 October 2007 Preliminary data sheet 1. General description The LPC2364/66/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. The LPC2364/66/68 are ideal for multi-purpose serial communication applications. They incorporate a 10/100 Ethernet Media Access Controller (MAC), USB full speed device with 4 kB of endpoint RAM, four UARTs, two CAN channels, an SPI interface, two Synchronous Serial Ports (SSP), three I2C interfaces, and an I2S interface. This blend of serial communications interfaces combined with an on-chip 4 MHz internal oscillator, SRAM of up to 32 kB, 16 kB SRAM for Ethernet, 8 kB SRAM for USB and general purpose use, together with 2 kB battery powered SRAM make these devices very well suited for communication gateways and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, one PWM unit, a CAN control unit, and up to 70 fast GPIO lines with up to 12 edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems. 2. Features I ARM7TDMI-S processor, running at up to 72 MHz. I Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. Flash program memory is on the ARM local bus for high performance CPU access. I 8/32 kB of SRAM on the ARM local bus for high performance CPU access. I 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM. I 8 kB SRAM for general purpose DMA use also accessible by the USB. I Dual Advanced High-performance Bus (AHB) system that provides for simultaneous Ethernet DMA, USB DMA, and program execution from on-chip flash with no contention between those functions. A bus bridge allows the Ethernet DMA to access the other AHB subsystem. I Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts. I General Purpose AHB DMA controller (GPDMA) that can be used with the SSP serial interfaces, the I2S port, and the Secure Digital/MultiMediaCard (SD/MMC) card port, as well as for memory-to-memory transfers. NXP Semiconductors LPC2364/66/68 Fast communication chip I Serial interfaces: N Ethernet MAC with associated DMA controller. These functions reside on an independent AHB bus. N USB 2.0 full-speed device with on-chip PHY and associated DMA controller. N Four UARTs with fractional baud rate generation, one with modem control I/O, one with IrDA support, all with FIFO. N CAN controller with two channels. N SPI controller. N Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate for the SPI port, sharing its interrupt and pins. These can be used with the GPDMA controller. N Three I2C-bus interfaces (one with open-drain and two with standard port pins). N I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA. I Other peripherals: N SD/MMC memory card interface (LPC2368 only). N 70 general purpose I/O pins with configurable pull-up/down resistors. N 10-bit ADC with input multiplexing among 6 pins. N 10-bit DAC. N Four general purpose timers/counters with a total of 8 capture inputs and 10 compare outputs. Each timer block has an external count input. N One PWM/timer block with support for three-phase motor control. The PWM has two external count inputs. N Real-Time Clock (RTC) with separate power pin, clock source can be the RTC oscillator or the APB clock. N 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the rest of the chip is powered off. N WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock. I Standard ARM test/debug interface for compatibility with existing tools. I Emulation trace module supports real-time trace. I Single 3.3 V power supply (3.0 V to 3.6 V). I Four reduced power modes: idle, sleep, power-down, and deep power-down. I Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0 and PORT2 can be used as edge sensitive interrupt sources. I Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt). I Two independent power domains allow fine tuning of power consumption based on needed features. I Each peripheral has its own clock divider for further power saving. I Brownout detect with separate thresholds for interrupt and forced reset. I On-chip power-on reset. I On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz. I 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as the system clock. When used as the CPU clock, does not allow CAN and USB to run. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 2 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip I On-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator. I Versatile pin function selections allow more possibilities for using on-chip peripheral functions. 3. Applications I I I I Industrial control Medical systems Protocol converter Communications 4. Ordering information Table 1. Ordering information Package Name LPC2364FBD100 LPC2366FBD100 LPC2368FBD100 LQFP100 Description plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm Version SOT407-1 Type number 4.1 Ordering options Table 2. Ordering options Flash (kB) Local bus 8 Ether USB SD/ GP Channels Temp net device MMC DMA CAN ADC DAC range Ethernet GP/ RTC Total + 4 kB buffers USB FIFO 16 8 2 34 RMII yes no yes 2 6 1 −40 °C to +85 °C −40 °C to +85 °C −40 °C to +85 °C SRAM (kB) Type number LPC2364FBD100 128 LPC2366FBD100 256 32 16 8 2 58 RMII yes no yes 2 6 1 LPC2368FBD100 512 32 16 8 2 58 RMII yes yes yes 2 6 1 LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 3 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 5. Block diagram XTAL1 XTAL2 VDDA TMS TDI trace signals TRST TCK TDO EXTIN0 RESET VDD(3V3) VREF VSSA, VSS VDD(DCDC)(3V3) LPC2364/66/68 P0, P1, P2, P3, P4 HIGH-SPEED GPI/O 70 PINS TOTAL 8/32 kB SRAM TEST/DEBUG INTERFACE EMULATION TRACE MODULE 128/256/ 512 kB FLASH PLL system clock SYSTEM FUNCTIONS INTERNAL RC OSCILLATOR INTERNAL CONTROLLERS SRAM FLASH ARM7TDMI-S VECTORED INTERRUPT CONTROLLER AHB BRIDGE 8 kB SRAM AHB1 AHB2 AHB BRIDGE RMII(8) ETHERNET MAC WITH DMA 16 kB SRAM MASTER AHB TO SLAVE PORT APB BRIDGE PORT AHB TO APB BRIDGE USB WITH 4 kB RAM AND DMA VBUS USB_D+, USB_D− USB_CONNECT USB_UP_LED GP DMA CONTROLLER I2SRX_CLK I2STX_CLK I2SRX_WS I2STX_WS I2SRX_SDA I2STX_SDA SCK, SCK0 MOSI, MOSI0 MISO, MISO0 SSEL, SSEL1 SCK1 MOSI1 MIS01 SSEL1 MCICLK, MCIPWR MCICMD, MCIDAT[3:0] TXD0, TXD2, TXD3 RXD0, RXD2, RXD3 TXD1 RXD1 DTR1, RTS1 DSR1, CTS1, DCD1, RI1 CAN1, CAN2 I2C0, I2C1, I2C2 RD1, RD2 TD1, TD2 SCL0, SCL1, SCL2 SDA0, SDA1, SDA2 EINT3 to EINT0 P0, P2 2 × CAP0/CAP1/ CAP2/CAP3 4 × MAT2, 2 × MAT0/MAT1/ MAT3 6 × PWM1 2 × PCAP1 P0, P1 EXTERNAL INTERRUPTS CAPTURE/COMPARE TIMER0/TIMER1/ TIMER2/TIMER3 I2S INTERFACE PWM1 SPI, SSP0 INTERFACE LEGACY GPI/O 52 PINS TOTAL SSP1 INTERFACE 6 × AD0 A/D CONVERTER SD/MMC CARD INTERFACE(1) AOUT D/A CONVERTER UART0, UART2, UART3 VBAT power domain 2 power domain 2 RTCX1 RTCX2 2 kB BATTERY RAM RTC OSCILLATOR REALTIME CLOCK UART1 WATCHDOG TIMER SYSTEM CONTROL 002aac566 (1) LPC2368 only. Fig 1. LPC2364/66/68 block diagram LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 4 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 6. Pinning information 6.1 Pinning 100 76 75 51 26 50 002aac576 1 LPC2364FBD100 LPC2366FBD100 LPC2368FBD100 25 Fig 2. LPC2364/66/68 pinning 6.2 Pin description Table 3. Symbol P0[0] to P0[31] Pin description Pin Type I/O Description Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect block. Pins 12, 13, 14, and 31 of this port are not available. P0[0] — General purpose digital input/output pin. RD1 — CAN1 receiver input. TXD3 — Transmitter output for UART3. SDA1 — I2C1 data input/output (this is not an open-drain pin). P0[1] — General purpose digital input/output pin. TD1 — CAN1 transmitter output. RXD3 — Receiver input for UART3. SCL1 — I2C1 clock input/output (this is not an open-drain pin). P0[2] — General purpose digital input/output pin. TXD0 — Transmitter output for UART0. P0[3] — General purpose digital input/output pin. RXD0 — Receiver input for UART0. P0[4] — General purpose digital input/output pin. I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. RD2 — CAN2 receiver input. CAP2[0] — Capture input for Timer 2, channel 0. P0[0]/RD1/TXD3/ 46[1] SDA1 I/O I O I/O P0[1]/TD1/RXD3/ 47[1] SCL1 I/O O I I/O P0[2]/TXD0 P0[3]/RXD0 P0[4]/ I2SRX_CLK/ RD2/CAP2[0] 98[1] 99[1] 81[1] I/O O I/O I I/O I/O I I LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 5 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 80[1] Type I/O I/O O I Description P0[5] — General purpose digital input/output pin. I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. TD2 — CAN2 transmitter output. CAP2[1] — Capture input for Timer 2, channel 1. P0[6] — General purpose digital input/output pin. I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. SSEL1 — Slave Select for SSP1. MAT2[0] — Match output for Timer 2, channel 0. P0[7] — General purpose digital input/output pin. I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. SCK1 — Serial Clock for SSP1. MAT2[1] — Match output for Timer 2, channel 1. P0[8] — General purpose digital input/output pin. I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. MISO1 — Master In Slave Out for SSP1. MAT2[2] — Match output for Timer 2, channel 2. P0[9] — General purpose digital input/output pin. I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. MOSI1 — Master Out Slave In for SSP1. MAT2[3] — Match output for Timer 2, channel 3. P0[10] — General purpose digital input/output pin. TXD2 — Transmitter output for UART2. SDA2 — I2C2 data input/output (this is not an open-drain pin). MAT3[0] — Match output for Timer 3, channel 0. P0[11] — General purpose digital input/output pin. RXD2 — Receiver input for UART2. SCL2 — I2C2 clock input/output (this is not an open-drain pin). MAT3[1] — Match output for Timer 3, channel 1. P0[15] — General purpose digital input/output pin. TXD1 — Transmitter output for UART1. SCK0 — Serial clock for SSP0. SCK — Serial clock for SPI. P0[16] — General purpose digital input/output pin. RXD1 — Receiver input for UART1. SSEL0 — Slave Select for SSP0. SSEL — Slave Select for SPI. P0[5]/ I2SRX_WS/ TD2/CAP2[1] P0[6]/ I2SRX_SDA/ SSEL1/MAT2[0] 79[1] I/O I/O I/O O P0[7]/ I2STX_CLK/ SCK1/MAT2[1] 78[1] I/O I/O I/O O P0[8]/ I2STX_WS/ MISO1/MAT2[2] 77[1] I/O I/O I/O O P0[9]/ I2STX_SDA/ MOSI1/MAT2[3] 76[1] I/O I/O I/O O P0[10]/TXD2/ SDA2/MAT3[0] 48[1] I/O O I/O O P0[11]/RXD2/ SCL2/MAT3[1] 49[1] I/O I I/O O P0[15]/TXD1/ SCK0/SCK 62[1] I/O O I/O I/O P0[16]/RXD1/ SSEL0/SSEL 63[1] I/O I I/O I/O LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 6 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 61[1] Type I/O I I/O I/O Description P0[17] — General purpose digital input/output pin. CTS1 — Clear to Send input for UART1. MISO0 — Master In Slave Out for SS1 MISO — Master In Slave Out for SPI. P0[18] — General purpose digital input/output pin. DCD1 — Data Carrier Detect input for UART1. MOSI0 — Master Out Slave In for SSP0. MOSI — Master Out Slave In for SPI. P0[19] — General purpose digital input/output pin. DSR1 — Data Set Ready input for UART1. MCICLK — Clock output line for SD/MMC interface. (LPC2368 only) SDA1 — I2C1 data input/output (this is not an open-drain pin). P0[20] — General purpose digital input/output pin. DTR1 — Data Terminal Ready output for UART1. MCICMD — Command line for SD/MMC interface. (LPC2368 only) SCL1 — I2C1 clock input/output (this is not an open-drain pin). P0[21] — General purpose digital input/output pin. RI1 — Ring Indicator input for UART1. MCIPWR — Power Supply Enable for external SD/MMC power supply. (LPC2368 only) RD1 — CAN1 receiver input. P0[22] — General purpose digital input/output pin. RTS1 — Request to Send output for UART1. MCIDAT0 — Data line for SD/MMC interface. (LPC2368 only) TD1 — CAN1 transmitter output. P0[23] — General purpose digital input/output pin. AD0[0] — A/D converter 0, input 0. I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. CAP3[0] — Capture input for Timer 3, channel 0. P0[24] — General purpose digital input/output pin. AD0[1] — A/D converter 0, input 1. I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. CAP3[1] — Capture input for Timer 3, channel 1. P0[25] — General purpose digital input/output pin. AD0[2] — A/D converter 0, input 2. I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. TXD3 — Transmitter output for UART3. P0[17]/CTS1/ MISO0/MISO P0[18]/DCD1/ MOSI0/MOSI 60[1] I/O I I/O I/O P0[19]/DSR1/ MCICLK/SDA1 59[1] I/O I O I/O P0[20]/DTR1/ MCICMD/SCL1 58[1] I/O O I I/O P0[21]/RI1/ MCIPWR/RD1 57[1] I/O I O I P0[22]/RTS1/ MCIDAT0/TD1 56[1] I/O O O O P0[23]/AD0[0]/ I2SRX_CLK/ CAP3[0] 9[2] I/O I I/O I P0[24]/AD0[1]/ I2SRX_WS/ CAP3[1] 8[2] I/O I I/O I P0[25]/AD0[2]/ I2SRX_SDA/ TXD3 7[2] I/O I I/O O LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 7 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 6[3] Type I/O I O I Description P0[26] — General purpose digital input/output pin. AD0[3] — A/D converter 0, input 3. AOUT — D/A converter output. RXD3 — Receiver input for UART3. P0[27] — General purpose digital input/output pin. SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance). P0[28] — General purpose digital input/output pin. SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance). P0[29] — General purpose digital input/output pin. USB_D+ — USB bidirectional D+ line. P0[30] — General purpose digital input/output pin. USB_D− — USB bidirectional D− line. Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available. P1[0] — General purpose digital input/output pin. ENET_TXD0 — Ethernet transmit data 0. P1[1] — General purpose digital input/output pin. ENET_TXD1 — Ethernet transmit data 1. P1[4] — General purpose digital input/output pin. ENET_TX_EN — Ethernet transmit data enable. P1[8] — General purpose digital input/output pin. ENET_CRS — Ethernet carrier sense. P1[9] — General purpose digital input/output pin. ENET_RXD0 — Ethernet receive data. P1[10] — General purpose digital input/output pin. ENET_RXD1 — Ethernet receive data. P1[14] — General purpose digital input/output pin. ENET_RX_ER — Ethernet receive error. P1[15] — General purpose digital input/output pin. ENET_REF_CLK/ENET_RX_CLK — Ethernet receiver clock. P1[16] — General purpose digital input/output pin. ENET_MDC — Ethernet MIIM clock. P1[17] — General purpose digital input/output pin. ENET_MDIO — Ethernet MI data input and output. P1[18] — General purpose digital input/output pin. USB_UP_LED — USB GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. PWM1[1] — Pulse Width Modulator 1, channel 1 output. CAP1[0] — Capture input for Timer 1, channel 0. P0[26]/AD0[3]/ AOUT/RXD3 P0[27]/SDA0 P0[28]/SCL0 P0[29]/USB_D+ P0[30]/USB_D− P1[0] to P1[31] 25[4] 24[4] 29[5] 30[5] I/O I/O I/O I/O I/O I/O I/O I/O I/O P1[0]/ ENET_TXD0 P1[1]/ ENET_TXD1 P1[4]/ ENET_TX_EN P1[8]/ ENET_CRS P1[9]/ ENET_RXD0 P1[10]/ ENET_RXD1 P1[14]/ ENET_RX_ER P1[15]/ ENET_REF_CLK P1[16]/ ENET_MDC P1[17]/ ENET_MDIO P1[18]/ USB_UP_LED/ PWM1[1]/ CAP1[0] 95[1] 94[1] 93[1] 92[1] 91[1] 90[1] 89[1] 88[1] 87[1] 86[1] 32[1] I/O O I/O O I/O O I/O I I/O I I/O I I/O I I/O I I/O I I/O I/O I/O O O I LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 8 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 33[1] 34[1] Type I/O I I/O O I/O 35[1] I/O O I/O 36[1] 37[1] I/O O I/O O I/O 38[1] I/O O I/O 39[1] 40[1] I/O O I/O O I 43[1] 44[1] I/O I I/O I O 45[1] I/O I O 21[2] I/O I I Description P1[19] — General purpose digital input/output pin. CAP1[1] — Capture input for Timer 1, channel 1. P1[20] — General purpose digital input/output pin. PWM1[2] — Pulse Width Modulator 1, channel 2 output. SCK0 — Serial clock for SSP0. P1[21] — General purpose digital input/output pin. PWM1[3] — Pulse Width Modulator 1, channel 3 output. SSEL0 — Slave Select for SSP0. P1[22] — General purpose digital input/output pin. MAT1[0] — Match output for Timer 1, channel 0. P1[23] — General purpose digital input/output pin. PWM1[4] — Pulse Width Modulator 1, channel 4 output. MISO0 — Master In Slave Out for SSP0. P1[24] — General purpose digital input/output pin. PWM1[5] — Pulse Width Modulator 1, channel 5 output. MOSI0 — Master Out Slave in for SSP0. P1[25] — General purpose digital input/output pin. MAT1[1] — Match output for Timer 1, channel 1. P1[26] — General purpose digital input/output pin. PWM1[6] — Pulse Width Modulator 1, channel 6 output. CAP0[0] — Capture input for Timer 0, channel 0. P1[27] — General purpose digital input/output pin. CAP0[1] — Capture input for Timer 0, channel 1. P1[28] — General purpose digital input/output pin. PCAP1[0] — Capture input for PWM1, channel 0. MAT0[0] — Match output for Timer 0, channel 0. P1[29] — General purpose digital input/output pin. PCAP1[1] — Capture input for PWM1, channel 1. MAT0[1] — Match output for Timer 0, channel 0. P1[30] — General purpose digital input/output pin. VBUS — Indicates the presence of USB bus power. Note: This signal must be HIGH for USB reset to occur. AD0[4] — A/D converter 0, input 4. P1[31] — General purpose digital input/output pin. SCK1 — Serial Clock for SSP1. AD0[5] — A/D converter 0, input 5. Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the Pin Connect block. Pins 14 through 31 of this port are not available. P1[19]/CAP1[1] P1[20]/PWM1[2]/ SCK0 P1[21]/PWM1[3]/ SSEL0 P1[22]/MAT1[0] P1[23]/PWM1[4]/ MISO0 P1[24]/PWM1[5]/ MOSI0 P1[25]/MAT1[1] P1[26]/PWM1[6]/ CAP0[0] P1[27]/CAP0[1] P1[28]/ PCAP1[0]/ MAT0[0] P1[29]/ PCAP1[1]/ MAT0[1] P1[30]/VBUS/ AD0[4] P1[31]/SCK1/ AD0[5] 20[2] I/O I/O I I/O P2[0] to P2[31] LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 9 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 75[1] Type I/O O O O 74[1] I/O O I O 73[1] I/O O I O 70[1] I/O O I O 69[1] I/O O I O 68[1] I/O O O O 67[1] I/O I I O 66[1] I/O I O O 65[1] I/O O O O I/O O I I Description P2[0] — General purpose digital input/output pin. PWM1[1] — Pulse Width Modulator 1, channel 1 output. TXD1 — Transmitter output for UART1. TRACECLK — Trace Clock. P2[1] — General purpose digital input/output pin. PWM1[2] — Pulse Width Modulator 1, channel 2 output. RXD1 — Receiver input for UART1. PIPESTAT0 — Pipeline Status, bit 0. P2[2] — General purpose digital input/output pin. PWM1[3] — Pulse Width Modulator 1, channel 3 output. CTS1 — Clear to Send input for UART1. PIPESTAT1 — Pipeline Status, bit 1. P2[3] — General purpose digital input/output pin. PWM1[4] — Pulse Width Modulator 1, channel 4 output. DCD1 — Data Carrier Detect input for UART1. PIPESTAT2 — Pipeline Status, bit 2. P2[4] — General purpose digital input/output pin. PWM1[5] — Pulse Width Modulator 1, channel 5 output. DSR1 — Data Set Ready input for UART1. TRACESYNC — Trace Synchronization. P2[5] — General purpose digital input/output pin. PWM1[6] — Pulse Width Modulator 1, channel 6 output. DTR1 — Data Terminal Ready output for UART1. TRACEPKT0 — Trace Packet, bit 0. P2[6] — General purpose digital input/output pin. PCAP1[0] — Capture input for PWM1, channel 0. RI1 — Ring Indicator input for UART1. TRACEPKT1 — Trace Packet, bit 1. P2[7] — General purpose digital input/output pin. RD2 — CAN2 receiver input. RTS1 — Request to Send output for UART1. TRACEPKT2 — Trace Packet, bit 2. P2[8] — General purpose digital input/output pin. TD2 — CAN2 transmitter output. TXD2 — Transmitter output for UART2. TRACEPKT3 — Trace Packet, bit 3. P2[9] — General purpose digital input/output pin. USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under software control. Used with the SoftConnect USB feature. RXD2 — Receiver input for UART2. EXTIN0 — External Trigger Input. © NXP B.V. 2007. All rights reserved. P2[0]/PWM1[1]/ TXD1/ TRACECLK P2[1]/PWM1[2]/ RXD1/ PIPESTAT0 P2[2]/PWM1[3]/ CTS1/ PIPESTAT1 P2[3]/PWM1[4]/ DCD1/ PIPESTAT2 P2[4]/PWM1[5]/ DSR1/ TRACESYNC P2[5]/PWM1[6]/ DTR1/ TRACEPKT0 P2[6]/PCAP1[0]/ RI1/ TRACEPKT1 P2[7]/RD2/ RTS1/ TRACEPKT2 P2[8]/TD2/ TXD2/ TRACEPKT3 64[1] P2[9]/ USB_CONNECT/ RXD2/ EXTIN0 LPC2364_66_68_2 Preliminary data sheet Rev. 02 — 1 October 2007 10 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol Pin description …continued Pin 53[6] Type I/O Description P2[10] — General purpose digital input/output pin. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take over control of the part after a reset. I EINT0 — External interrupt 0 input. P2[11] — General purpose digital input/output pin. EINT1 — External interrupt 1 input. MCIDAT1 — Data line for SD/MMC interface. (LPC2368 only) I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. P2[12] — General purpose digital input/output pin. EINT2 — External interrupt 2 input. MCIDAT2 — Data line for SD/MMC interface. (LPC2368 only) I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. P2[13] — General purpose digital input/output pin. EINT3 — External interrupt 3 input. MCIDAT3 — Data line for SD/MMC interface. (LPC2368 only) I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the Pin Connect block. Pins 0 through 24, and 27 through 31 of this port are not available. P3[25] — General purpose digital input/output pin. MAT0[0] — Match output for Timer 0, channel 0. PWM1[2] — Pulse Width Modulator 1, output 2. P3[26] — General purpose digital input/output pin. MAT0[1] — Match output for Timer 0, channel 1. PWM1[3] — Pulse Width Modulator 1, output 3. Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the Pin Connect block. Pins 0 through 27, 30, and 31 of this port are not available. P4[28] — General purpose digital input/output pin. MAT2[0] — Match output for Timer 2, channel 0. TXD3 — Transmitter output for UART3. P4[29] — General purpose digital input/output pin. MAT2[1] — Match output for Timer 2, channel 1. RXD3 — Receiver input for UART3. TDO — Test Data out for JTAG interface. TDI — Test Data in for JTAG interface. TMS — Test Mode Select for JTAG interface. TRST — Test Reset for JTAG interface. TCK — Test Clock for JTAG interface. P2[10]/EINT0 P2[11]/EINT1/ MCIDAT1/ I2STX_CLK 52[6] I/O I O I/O P2[12]/EINT2/ MCIDAT2/ I2STX_WS 51[6] I/O I O I/O P2[13]/EINT3/ MCIDAT3/ I2STX_SDA 50[6] I/O I O I/O P3[0] to P3[31] I/O P3[25]/MAT0[0]/ PWM1[2] 27[1] I/O O O P3[26]/MAT0[1]/ PWM1[3] 26[1] I/O O O I/O P4[0] to P4[31] P4[28]/MAT2[0]/ TXD3 82[1] I/O O O P4[29]/MAT2[1]/ RXD3 85[1] I/O O I TDO TDI TMS TRST TCK 1[1] 2[1] 3[1] 4[1] 5[1] O I I I I LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 11 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 3. Symbol RTCK Pin description …continued Pin 100[1] Type I/O Description RTCK — JTAG interface control signal. Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0]) to operate as Trace port after reset. RSTOUT RESET 14[1] 17[7] O I RSTOUT — This is a 1.8 V pin. LOW on this pin indicates LPC2364/66/68 being in Reset state. external reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Input to the RTC oscillator circuit. Output from the RTC oscillator circuit. ground: 0 V reference. XTAL1 XTAL2 RTCX1 RTCX2 VSS 22[8] 23[8] 16[8] 18[8] 15, 31, 41, 55, 72, 97, 83[9] 11[10] 28, 54, 71, 96[11] 13, 42, 84[12] 10[13] I O I O I VSSA VDD(3V3) I I analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 3.3 V supply voltage: This is the power supply voltage for the I/O ports. VDD(DCDC)(3V3) VDDA I I 3.3 V DC-to-DC converter supply voltage: This is the supply voltage for the on-chip DC-to-DC converter only. analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. ADC reference: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC and DAC. RTC power supply: 3.3 V on this pin supplies the power to the RTC. VREF 12[13] I VBAT [1] [2] [3] [4] [5] [6] [7] [8] [9] 19[13] I 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input, digital section of the pad is disabled. 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). 5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis Pad provides special analog functionality. Pad provides special analog functionality. [10] Pad provides special analog functionality. [11] Pad provides special analog functionality. [12] Pad provides special analog functionality. [13] Pad provides special analog functionality. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 12 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7. Functional description 7.1 Architectural overview The LPC2364/66/68 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals, and the AMBA APB for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order. The LPC2364/66/68 implements two AHB buses in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the VIC and GPDMA controller. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1. In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the AHB address space. Lower speed peripheral functions are connected to the APB bus. The AHB to APB bridge interfaces the APB bus to the AHB bus. APB peripherals are also allocated a 2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is allocated a 16 kB address space within the APB address space. The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed complex instruction set computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • The standard 32-bit ARM set • A 16-bit Thumb set LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 13 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. 7.2 On-chip flash programming memory The LPC2364/66/68 incorporate a 128 kB, 256 kB, and 512 kB flash memory system respectively. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port (UART0). The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field and firmware upgrades. The flash memory is 128 bits wide and includes pre-fetching and buffering techniques to allow it to operate at SRAM speeds of 72 MHz. The LPC2364/66/68 provides a minimum of 100000 write/erase cycles and 20 years of data retention. 7.3 On-chip SRAM The LPC2364/66/68 includes a SRAM memory of 8 kB, 32 kB, and 32 kB respectively, reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits. A 16 kB SRAM block serving as a buffer for the Ethernet controller and an 8 kB SRAM associated with the USB device can be used both for data and code storage, too. Remaining SRAM such as a 4 kB USB FIFO and a 2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered and retains the content in the absence of the main power supply. 7.4 Memory map The LPC2364/66/68 memory map incorporates several distinct regions as shown in Figure 3. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (default), boot ROM, or SRAM (see Section 7.25.6). LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 14 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB 0xFFFF FFFF 0xF000 0000 0xE000 0000 3.0 GB RESERVED ADDRESS SPACE 0xC000 0000 2.0 GB BOOT ROM AND BOOT FLASH (BOOT FLASH REMAPPED FROM ON-CHIP FLASH) RESERVED ADDRESS SPACE ETHERNET RAM (16 kB) USB RAM (8 KB) 0x8000 0000 0x7FE0 3FFF 0x7FE0 0000 0x7FD0 1FFF 0x7FD0 0000 RESERVED ADDRESS SPACE 0x4000 8000 0x4000 7FFF 32 kB LOCAL ON-CHIP STATIC RAM (LPC2366/LPC2368) 0x4000 2000 0x4000 1FFF 8 kB LOCAL ON-CHIP STATIC RAM (LPC2364) 1.0 GB 0x4000 0000 RESERVED FOR ON-CHIP MEMORY 0x0008 0000 0x0007 FFFF 0x0004 0000 0x0003 FFFF 0x0002 0000 0x0001 FFFF 0x0000 0000 TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY (LPC2368) TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY (LPC2366) 0.0 GB TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2364) 002aac577 Fig 3. LPC2364/66/68 memory map 7.5 Interrupt controller The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be programmed as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 15 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority. When more than one interrupt is assigned the same priority and occur simultaneously, the one connected to the lowest numbered VIC channel will be serviced first. The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping to the address supplied by that register. 7.5.1 Interrupt sources Each peripheral device has one interrupt line connected to the VIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on PORT0 and PORT2 (total of 42 pins) regardless of the selected function, can be programmed to generate an interrupt on a rising edge, a falling edge, or both. Such interrupt request coming from PORT0 and/or PORT2 will be combined with the EINT3 interrupt requests. 7.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 7.7 General purpose DMA controller The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2364/66/68 peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receive. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the AHB master. 7.7.1 Features • Two DMA channels. Each channel can support a unidirectional transfer. • The GPDMA can transfer data between the 8 kB SRAM and peripherals such as the SD/MMC, two SSP, and I2S interfaces. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 16 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip • Single DMA and burst DMA request signals. Each peripheral connected to the GPDMA can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the GPDMA. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. Each DMA channel has a specific hardware priority. DMA channel 0 has the highest priority and channel 1 has the lowest priority. If requests from two channels become active at the same time the channel with the highest priority is serviced first. • AHB slave DMA programming interface. The GPDMA is programmed by writing to the DMA control registers over the AHB slave interface. • One AHB bus master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral. • Internal four-word FIFO per channel. • Supports 8-bit, 16-bit, and 32-bit wide transactions. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Interrupt masking. The DMA error and DMA terminal count interrupt requests can be masked. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.8 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC2364/66/68 use accelerated GPIO functions: • GPIO registers are relocated to the ARM local bus so that the fastest possible I/O timing can be achieved. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte and half-word addressable. • Entire port value can be written in one instruction. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 17 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Additionally, any pin on PORT0 and PORT2 (total of 42 pins) providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode. 7.8.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Backward compatibility with other earlier devices is maintained with legacy PORT0 and PORT1 registers appearing at the original addresses on the APB bus. 7.9 Ethernet The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2364/66/68 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access the USB SRAM if it is not being used by the USB block. The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 7.9.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support. • Memory management: – Independent transmit and receive buffers memory mapped to shared SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 18 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter. • Physical interface: – Attachment of external PHY chip through standard RMII interface. – PHY register access is available via the MIIM interface. 7.10 USB interface The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and a number (127 maximum) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, unplugging, and dynamic configuration of the devices. All transactions are initiated by the host controller. 7.10.1 USB device controller The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of register interface, serial interface engine, endpoint buffer memory, and the DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. The DMA controller when enabled transfers data between the endpoint buffer and the USB RAM. 7.10.2 Features • • • • • Fully compliant with USB 2.0 specification (full speed). Supports 32 physical (16 logical) endpoints with a 4 kB USB buffer. Supports Control, Bulk, Interrupt and Isochronous endpoints. Scalable realization of endpoints at run time. Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • Supports SoftConnect and GoodLink features. • While USB is in the Suspend mode, LPC2364/66/68 can enter one of the reduced Power-down modes and wake up on a USB activity. • Supports DMA transfers with the DMA RAM of 8 kB on all non-control endpoints. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 19 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip • Allows dynamic switching between CPU-controlled and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 7.11 CAN controller and acceptance filters The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router among a number of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter. 7.11.1 Features • • • • • Two CAN controllers and buses. Data rates to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN buses. Standard Identifiers. • Acceptance Filter can provide FullCAN-style automatic reception for selected • Full CAN messages can generate interrupts. 7.12 10-bit ADC The LPC2364/66/68 contain one ADC. It is a single 10-bit successive approximation ADC with six channels. 7.12.1 Features • • • • • • • • 10-bit successive approximation ADC. Input multiplexing among 6 pins. Power-down mode. Measurement range 0 V to Vi(VREF). 10-bit conversion time ≥ 2.44 µs. Burst conversion mode for single or multiple inputs. Optional conversion on transition of input pin or Timer Match signal. Individual result registers for each ADC channel to reduce interrupt overhead. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 20 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.13 10-bit DAC The DAC allows the LPC2364/66/68 to generate a variable analog output. The maximum output value of the DAC is Vi(VREF). 7.13.1 Features • • • • • 10-bit DAC Resistor string architecture Buffered output Power-down mode Selectable output drive 7.14 UARTs The LPC2364/66/68 each contain four UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 can be achieved with any crystal frequency above 2 MHz. 7.14.1 Features • • • • 16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. mechanism that enables software flow control implementation. • Fractional divider for baud rate control, auto baud capabilities and FIFO control • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • UART3 includes an IrDA mode to support infrared communication. 7.15 SPI serial I/O controller The LPC2364/66/68 each contain one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master. 7.15.1 Features • • • • • LPC2364_66_68_2 Compliant with SPI specification Synchronous, serial, full duplex communication Combined SPI master and slave Maximum data bit rate of one eighth of the input clock rate 8 bits to 16 bits per transfer © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 21 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.16 SSP serial I/O controller The LPC2364/66/68 each contain two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.16.1 Features • Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire buses • • • • • Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame DMA transfers supported by GPDMA 7.17 SD/MMC card interface (LPC2368 only) The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11. 7.17.1 Features • The MCI interface provides all functions specific to the SD/MMC memory card. These include the clock generation unit, power management control, and command and data transfer. • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • DMA supported through the GPDMA controller. 7.18 I2C-bus serial I/O controllers The LPC2364/66/68 each contain three I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus, it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2364/66/68 supports bit rates up to 400 kbit/s (Fast I2C-bus). LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 22 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.18.1 Features • I2C0 is a standard I2C compliant bus interface with open-drain pins. • I2C1 and I2C2 use standard I/O pins and do not support powering off of individual devices connected to the same bus lines. • • • • • Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. one serial bus. • Serial clock synchronization allows devices with different bit rates to communicate via • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. 7.19 I2S-bus serial I/O controllers The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC2364/66/68 provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.19.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • • • • Configurable word select period in master mode (separately for I2S input and output). Two 8-word FIFO data buffers are provided, one for transmit and one for receive. Generates interrupt requests when buffer levels cross a programmable boundary. Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S input and I2S output. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 23 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.20 General purpose 32-bit timers/external event counters The LPC2364/66/68 include four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.20.1 Features • A 32-bit Timer/Counter with a programmable 32-bit prescaler. • Counter or Timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 7.21 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2364/66/68. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 24 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 7.21.1 Features • LPC2364/66/68 has one PWM block with Counter or Timer operation (may use the peripheral clock or one of the capture inputs as the clock source). • Seven match registers allow up to 6 single edge controlled or 3 double edge controlled PWM outputs, or a mix of both types. The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 7.22 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 7.22.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 32-bit timer with internal prescaler. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 25 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip • Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in multiples of Tcy(WDCLK) × 4. • The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring, for increased reliability. 7.23 RTC and battery RAM The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. It uses little power in Power-down mode. On the LPC2364/66/68, the RTC can be clocked by a separate 32.768 kHz oscillator, or by a programmable prescale divider based on the APB clock. Also, the RTC is powered by its own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V supply used by the rest of the device. The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. 7.23.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Dedicated 32 kHz oscillator or programmable prescaler from APB clock. • Dedicated power supply pin can be connected to a battery or to the main 3.3 V. • Periodic interrupts can be generated from increments of any field of the time registers, and selected fractional second values. • 2 kB data SRAM powered by VBAT. • RTC and Battery RAM power supply is isolated from the rest of the chip. 7.24 Clocking and power control 7.24.1 Crystal oscillators The LPC2364/66/68 includes three independent oscillators. These are the Main Oscillator, the Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Any of the three clock sources can be chosen by software to drive the PLL and ultimately the CPU. Following reset, the LPC2364/66/68 will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 26 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.24.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is trimmed to 1 % accuracy. Upon power-up or any chip reset, the LPC2364/66/68 uses the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.24.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator operates at frequencies of 1 MHz to 24 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.24.2 for additional information. 7.24.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU. 7.24.2 PLL The PLL accepts an input clock frequency in the range of 32 kHz to 50 MHz. The input frequency is multiplied up to a high frequency, then divided down to provide the actual clock used by the CPU and the USB block. The PLL input, in the range of 32 kHZ to 50 MHz, may initially be divided down by a value ‘N’, which may be in the range of 1 to 256. This input division provides a wide range of output frequencies from the same input frequency. Following the PLL input divider is the PLL multiplier. This can multiply the input divider output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to 550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a phase-frequency detector to compare the divided CCO output to the multiplier input. The error value is used to adjust the CCO frequency. The PLL is turned off and bypassed following a chip Reset and by entering Power-down mode. PLL is enabled by software only. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. 7.24.3 Wake-up timer The LPC2364/66/68 begins operation at power-up and when awakened from Power-down mode or Deep power-down mode by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 27 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 7.24.4 Power control The LPC2364/66/68 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, Peripheral Power Control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The LPC2364/66/68 also implements a separate power domain in order to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small SRAM, referred to as the Battery RAM. 7.24.4.1 Idle mode In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 7.24.4.2 Sleep mode In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The 32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The CCLK and USB clock dividers automatically get reset to zero. The Sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Sleep mode reduces chip power consumption to a very low value. The flash memory is left on in Sleep mode, allowing a very quick wake-up. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 28 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip On the wake-up of Sleep mode, if the IRC was used before entering Sleep mode, the code execution and peripherals activities will resume after 4 cycles expire. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. The customers need to reconfigure the PLL and clock dividers accordingly. 7.24.4.3 Power-down mode Power-down mode does everything that Sleep mode does, but also turns off the IRC oscillator and the flash memory. This saves more power, but requires waiting for resumption of flash operation before execution of code or data access in the flash memory can be accomplished. On the wake-up of Power-down mode, if the IRC was used before entering Power-down mode, it will take IRC 60 µs to start-up. After this 4 IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 µs flash start-up time. When it times out, access to the flash will be allowed. The customers need to reconfigure the PLL and clock dividers accordingly. 7.24.4.4 Deep power-down mode Deep power-down mode is like Power-down mode, but the on-chip regulator that supplies power to internal logic is also shut off. This produces the lowest possible power consumption without actually removing power from the entire chip. Since Deep power-down mode shuts down the on-chip logic power supply, there is no register or memory retention, and resumption of operation involves the same activities as a full-chip reset. If power is supplied to the LPC2364/66/68 during Deep power-down mode, wake-up can be caused by external Reset. While in Deep power-down mode, external device power may be removed. In this case, the LPC2364/66/68 will start up when external power is restored. Essential data may be retained through Deep power-down mode (or through complete powering off of the chip) by storing data in the Battery RAM, as long as the external power to the VBAT pin is maintained. 7.24.4.5 Power domains The LPC2364/66/68 provides two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the Battery RAM. The 3.3 V (VDD(3V3)) pins power both the on-chip DC-to-DC converter and the I/O pads. These pins provide the power for the CPU and most of the peripherals. If power is removed from the VDD(3V3) pins, the CPU and related peripherals stop. The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 29 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 7.25 System control 7.25.1 Reset Reset has four sources on the LPC2364/66/68: the RESET pin, the Watchdog reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the Wake-up timer (see description in Section 7.24.3 “Wake-up timer”), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the Boot Block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. 7.25.2 Brownout detection The LPC2364/66/68 includes 2-stage monitoring of the voltage on the VDD(3V3) pins. If this voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts Reset to inactivate the LPC2364/66/68 when the voltage on the VDD(3V3) pins falls below 2.65 V. This Reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall Reset. Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event loop to sense the condition. 7.25.3 Code security This feature of the LPC2364/66/68 allows an application to control whether it can be debugged or protected from observation. If after reset the on-chip bootloader detects a valid checksum in flash and reads 0x8765 4321 from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be protected from observation. Once debugging is disabled, it can be enabled by performing a full chip erase using the ISP. 7.25.4 AHB bus The LPC2364/66/68 implements two AHB buses in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 8 kB SRAM primarily intended for use by the USB. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into unused space in memory residing on AHB1. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 30 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. 7.25.5 External interrupt inputs The LPC2364/66/68 include up to 46 edge sensitive interrupt inputs combined with up to to four level sensitive external interrupt inputs as selectable pin functions. The external interrupt inputs can optionally be used to wake up the processor from Power-down mode. 7.25.6 Memory mapping control The memory mapping control alters the mapping of the interrupt vectors that appear at the beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot ROM or the SRAM. This allows code running in different memory spaces to have control of the interrupts. 7.26 Emulation and debugging The LPC2364/66/68 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface peripherals residing on other pins are available during the development and debugging phase as they are when the application is run in the embedded system itself. 7.26.1 EmbeddedICE The EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present on the target system. The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic. 7.26.2 Embedded trace Since the LPC2364/66/68 have significant amounts of on-chip memories, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external Trace Port Analyzer captures the trace information under software debugger control. The trace port can broadcast the Instruction trace information. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 31 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 7.26.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2364/66/68 contain a specific configuration of RealMonitor software programmed into the on-chip ROM memory. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 32 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(3V3) Parameter supply voltage (3.3 V) Conditions core and external rail Min 3.0 3.0 −0.5 for the RTC on ADC related pins 5 V tolerant I/O pins; only valid when the VDD(3V3) supply voltage is present other I/O pins IDD ISS Tstg Ptot(pack) supply current ground current storage temperature total power dissipation (per package) based on package heat transfer, not device power consumption human body model; all pins [6] [2] Max 3.6 3.6 +4.6 +4.6 +4.6 +5.1 +6.0 Unit V V V V V V V VDD(DCDC)(3V3) DC-to-DC converter supply voltage (3.3 V) VDDA Vi(VBAT) Vi(VREF) VIA VI analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF analog input voltage input voltage −0.5 −0.5 −0.5 −0.5 [2][3] −0.5 −40 - VDD(3V3) + 0.5 100 100 +125 1.5 V mA mA °C W per supply pin per ground pin [4] [4] [5] Vesd electrostatic discharge voltage −2000 +2000 V [1] The following applies to the Limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Including voltage on outputs in 3-state mode. Not to exceed 4.6 V. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] [3] [4] [5] [6] LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 33 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 9. Static characteristics Table 5. Static characteristics Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol VDD(3V3) VDD(DCDC)(3V3) VDDA Vi(VBAT) Vi(VREF) Parameter supply voltage (3.3 V) DC-to-DC converter supply voltage (3.3 V) analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF LOW-level input current VI = 0 V; no pull-up HIGH-level input current VI = VDD(3V3); no pull-down OFF-state output current I/O latch-up current VO = 0 V; VO = VDD(3V3); no pull-up/down −(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 °C VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS IOLS Ipd Ipu input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current IOH = −4 mA IOL = −4 mA VOH = VDD(3V3) − 0.4 V VOL = 0.4 V [6] [2] Conditions core and external rail Min 3.0 3.0 3.0 2.0 2.5 Typ[1] 3.3 3.3 3.3 3.3 3.3 Max 3.6 3.6 3.6 3.6 VDDA Unit V V V V V Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch 3 3 3 100 µA µA µA mA pin configured to provide a digital function output active [3][4][5] 0 0 2.0 VDD(3V3) − 0.4 −4 4 10 −15 0 0.4 50 −50 0 5.5 VDD(3V3) 0.8 0.4 −45 50 150 −85 0 V V V V V V V mA mA mA mA µA µA µA [6] [6] [6] HIGH-level short-circuit VOH = 0 V output current LOW-level short-circuit output current pull-down current pull-up current VOL = VDDA VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V [7] [7] [8] [8] LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 34 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 5. Static characteristics …continued Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol Parameter Conditions VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 °C; code Min Typ[1] Max Unit IDD(DCDC)act(3V3) active mode DC-to-DC converter supply current (3.3 V) while(1){} executed from flash; no peripherals enabled; PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled; PCLK = CCLK / 8 CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled; PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz 27 125 150 mA mA µA 21 92 mA mA 15 63 mA mA IDD(DCDC)pd(3V3) power-down mode DC-to-DC converter supply current (3.3 V) VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 °C VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 °C IDD(DCDC)dpd(3V3) deep power-down mode DC-to-DC converter supply current (3.3 V) IBATact I2C-bus VIH VIL Vhys VOL ILI Oscillator pins Vi(XTAL1) Vo(XTAL2) Vi(RTCX1) Vo(RTCX2) input voltage on pin XTAL1 output voltage on pin XTAL2 input voltage on pin RTCX1 output voltage on pin RTCX2 active mode battery supply current pins (P0[27] and P0[28]) HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current - 15 - µA DC-to-DC converter on DC-to-DC converter off [9] [9] - 20 28 - µA µA V 0.7VDD(3V3) IOLS = 3 mA VI = VDD(3V3) VI = 5 V [6] 2 10 - 0.3VDD(3V3) V V V µA µA V V V V 0.4 4 22 1.8 1.8 1.8 1.8 0.5VDD(3V3) - 0 0 0 0 [10] LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 35 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 5. Static characteristics …continued Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol USB pins IOZ VBUS VDI VCM Vth(rs)se OFF-state output current bus supply voltage differential input sensitivity voltage differential common mode voltage range single-ended receiver switching threshold voltage LOW-level output voltage for low-/full-speed HIGH-level output voltage (driven) for low-/full-speed RL of 1.5 kΩ to 3.6 V |(D+) − (D−)| includes VDI range 0 V < VI < 3.3 V 0.2 0.8 0.8 ±10 5.25 2.5 2.0 µA V V V V Parameter Conditions Min Typ[1] Max Unit VOL - - 0.18 V VOH RL of 15 kΩ to GND 2.8 - 3.5 V Ctrans ZDRV transceiver capacitance pin to GND with 33 Ω series resistor; driver output steady state drive impedance for driver which is not high-speed capable pull-up resistance SoftConnect = ON [11] 36 - 20 44.1 pF Ω Rpu [1] [2] [3] [4] [5] [6] [7] [8] [9] 1.1 - 1.9 kΩ Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. The RTC typically fails when Vi(VBAT) drops below 1.6 V. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. On pin VBAT. [10] To VSS. [11] Includes external resistors of 18 Ω ± 1 % on D+ and D−. Table 6. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error [1][2][3] [1][4] [1][5] Conditions Min 0 - Typ - Max VDDA 1 ±1 ±2 ±3 Unit V pF LSB LSB LSB LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 36 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip Table 6. ADC static characteristics …continued VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz. Symbol EG ET Rvsi Parameter gain error absolute error voltage source interface resistance Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 4. See Figure 5. Conditions [1][6] [1][7] [8] Min - Typ - Max ±0.5 ±4 40 Unit % LSB kΩ [1] [2] [3] [4] [5] [6] [7] [8] LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 37 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip offset error EO 1023 gain error EG 1022 1021 1020 1019 1018 (2) 7 code out 6 (1) 5 (5) 4 (4) 3 (3) 2 1 1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024 0 1 offset error EO 2 3 4 5 6 7 VIA (LSBideal) 1 LSB = VDDA − VSSA 1024 002aac046 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 4. ADC characteristics LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 38 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip LPC2364/66/68 20 kΩ ADx[y]SAMPLE 3 pF 5 pF ADx[y] Rvsi VEXT VSS 002aac575 Fig 5. Suggested ADC interface - LPC2364/66/68 AD0[y] pin LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 39 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 10. Dynamic characteristics Table 7. Dynamic characteristics of USB pins (full-speed) CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3), unless otherwise specified. Symbol tr tf tFRFM VCRS tFEOPT tFDEOP tJR1 tJR2 tEOPR1 Parameter rise time fall time differential rise and fall time matching output signal crossover voltage source SE0 interval of EOP source jitter for differential transition to SE0 transition receiver jitter to next transition receiver jitter for paired transitions EOP width at receiver 10 % to 90 % must reject as EOP; see Figure 7 must accept as EOP; see Figure 7 [1] Conditions 10 % to 90 % 10 % to 90 % tr / tf Min 8.5 7.7 1.3 Typ - Max 13.8 13.7 109 2.0 175 +5 +18.5 +9 - Unit ns ns % V ns ns ns ns ns see Figure 7 see Figure 7 160 −2 −18.5 −9 40 tEOPR2 EOP width at receiver [1] 82 - - ns [1] Characterized but not implemented as production test. Guaranteed by design. Table 8. Dynamic characteristics Tamb = −40 °C to +85 °C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol External clock fosc Tcy(clk) tCHCX tCLCX tCLCH tCHCL I2C-bus tf(o) [1] [2] [3] Parameter oscillator frequency clock cycle time clock HIGH time clock LOW time clock rise time clock fall time pins (P0[27] and P0[28]) output fall time Conditions Min 10 40 Tcy(clk) × 0.4 Tcy(clk) × 0.4 - Typ[2] - Max 25 100 5 5 - Unit MHz ns ns ns ns ns ns VIH to VIL 20 + 0.1 × Cb[3] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. Bus capacitance Cb in pF, from 10 pF to 400 pF. LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 40 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 10.1 Timing VDD − 0.5 V 0.45 V 0.2VDD + 0.9 V 0.2VDD − 0.1 V tCHCL tCLCX Tcy(clk) 002aaa907 tCHCX tCLCH Fig 6. External clock timing tPERIOD crossover point differential data lines crossover point extended source EOP width: tFEOPT differential data to SEO/EOP skew n × tPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 7. Differential data-to-EOP transition skew and EOP width LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 41 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 11. Application information 11.1 Suggested USB interface solutions VDD(3V3) USB_UP_LED USB_CONNECT LPC23XX soft-connect switch R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB_D− VSS 002aac578 RS = 33 Ω USB-B connector Fig 8. LPC2364/66/68 USB interface on a self-powered device VDD(3V3) R2 LPC23XX USB_UP_LED VBUS USB_D+ RS = 33 Ω USB_D− RS = 33 Ω VSS R1 1.5 kΩ USB-B connector 002aac579 Fig 9. LPC2364/66/68 USB interface on a bus-powered device LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 42 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 12. Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 c y X 75 76 51 50 ZE A e E HE wM bp pin 1 index 100 1 ZD bp D HD wM B vM B 25 vM A 26 detail X L θ Lp A A2 (A 3) A1 e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 14.1 13.9 E (1) 14.1 13.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 θ 7o o 0 16.25 16.25 15.75 15.75 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT407-1 REFERENCES IEC 136E20 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-02-01 03-02-20 Fig 10. Package outline SOT407-1 (LQFP100) LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 43 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 13. Abbreviations Table 9. Acronym ADC AHB AMBA APB BOD CAN DAC DCC DMA DSP EOP ETM GPIO JTAG MII PHY PLL PWM RMII SE0 SPI SSI SSP TTL UART USB Abbreviations Description Analog-to-Digital Converter Advanced High-performance Bus Advanced Microcontroller Bus Architecture Advanced Peripheral Bus BrownOut Detection Controller Area Network Digital-to-Analog Converter Debug Communication Channel Direct Memory Access Digital Signal Processing End Of Packet Embedded Trace Macrocell General Purpose Input/Output Joint Test Action Group Media Independent Interface Physical Layer Phase-Locked Loop Pulse Width Modulator Reduced Media Independent Interface Single Ended Zero Serial Peripheral Interface Serial Synchronous Interface Synchronous Serial Port Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter Universal Serial Bus LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 44 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 14. Revision history Table 10. Revision history Release date 20071001 Data sheet status Preliminary data sheet Preliminary data sheet Change notice Supersedes LPC2364_66_68_1 Document ID LPC2364_66_68_2 Modifications: LPC2364_66_68_1 • Figure 1, 7, 8 and 9: changed incorrect character font 20070103 LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 45 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. SoftConnect — is a trademark of NXP B.V. GoodLink — is a trademark of NXP B.V. 16. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 46 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 17. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.5.1 7.6 7.7 7.7.1 7.8 7.8.1 7.9 7.9.1 7.10 7.10.1 7.10.2 7.11 7.11.1 7.12 7.12.1 7.13 7.13.1 7.14 7.14.1 7.15 7.15.1 7.16 7.16.1 7.17 7.17.1 7.18 7.18.1 7.19 7.19.1 7.20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . 13 Architectural overview. . . . . . . . . . . . . . . . . . . 13 On-chip flash programming memory . . . . . . . 14 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 16 General purpose DMA controller . . . . . . . . . . 16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Fast general purpose parallel I/O . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 19 USB device controller . . . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 CAN controller and acceptance filters . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SSP serial I/O controller . . . . . . . . . . . . . . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SD/MMC card interface (LPC2368 only) . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 I2S-bus serial I/O controllers . . . . . . . . . . . . . . 23 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 24 7.20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.21 Pulse width modulator . . . . . . . . . . . . . . . . . . 7.21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.22 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 7.22.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.23 RTC and battery RAM . . . . . . . . . . . . . . . . . . 7.23.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24 Clocking and power control . . . . . . . . . . . . . . 7.24.1 Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7.24.1.3 RTC oscillator. . . . . . . . . . . . . . . . . . . . . . . . . 7.24.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 7.24.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 7.24.4.5 Power domains. . . . . . . . . . . . . . . . . . . . . . . . 7.25 System control . . . . . . . . . . . . . . . . . . . . . . . . 7.25.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 7.25.3 Code security . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4 AHB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.5 External interrupt inputs . . . . . . . . . . . . . . . . . 7.25.6 Memory mapping control . . . . . . . . . . . . . . . . 7.26 Emulation and debugging. . . . . . . . . . . . . . . . 7.26.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 7.26.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 7.26.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 10.1 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information . . . . . . . . . . . . . . . . . 11.1 Suggested USB interface solutions . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information . . . . . . . . . . . . . . . . . . . . . . 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 17 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 25 25 25 26 26 26 26 27 27 27 27 27 28 28 28 29 29 29 30 30 30 30 30 31 31 31 31 31 32 33 34 40 41 42 42 43 44 45 46 46 46 46 46 46 47 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 October 2007 Document identifier: LPC2364_66_68_2