LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash
with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Rev. 7.1 — 16 October 2013
Product data sheet
1. General description
The LPC2364/65/66/67/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S
CPU with real-time emulation that combines the microcontroller with up to 512 kB of
embedded high-speed flash memory. A 128-bit wide memory interface and a unique
accelerator architecture enable 32-bit code execution at the maximum clock rate. For
critical performance in interrupt service routines and DSP algorithms, this increases
performance up to 30 % over Thumb mode. For critical code size applications, the
alternative 16-bit Thumb mode reduces code by more than 30 % with minimal
performance penalty.
The LPC2364/65/66/67/68 are ideal for multi-purpose serial communication applications.
They incorporate a 10/100 Ethernet Media Access Controller (MAC), USB full speed
device with 4 kB of endpoint RAM (LPC2364/66/68 only), four UARTs, two CAN channels
(LPC2364/66/68 only), an SPI interface, two Synchronous Serial Ports (SSP), three
I2C-bus interfaces, and an I2S-bus interface. This blend of serial communications
interfaces combined with an on-chip 4 MHz internal oscillator, SRAM of up to 32 kB, 16 kB
SRAM for Ethernet, 8 kB SRAM for USB and general purpose use, together with 2 kB
battery powered SRAM make these devices very well suited for communication gateways
and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, one
PWM unit, a CAN control unit (LPC2364/66/68 only), and up to 70 fast GPIO lines with up
to 12 edge or level sensitive external interrupt pins make these microcontrollers
particularly suitable for industrial control and medical systems.
2. Features and benefits
ARM7TDMI-S processor, running at up to 72 MHz
Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and
In-Application Programming (IAP) capabilities. Flash program memory is on the ARM
local bus for high performance CPU access.
8 kB/32 kB of SRAM on the ARM local bus for high performance CPU access.
16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
8 kB SRAM for general purpose DMA use also accessible by the USB.
Dual Advanced High-performance Bus (AHB) system that provides for simultaneous
Ethernet DMA, USB DMA, and program execution from on-chip flash with no
contention between those functions. A bus bridge allows the Ethernet DMA to access
the other AHB subsystem.
Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.
General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP
serial interfaces, the I2S port, and the Secure Digital/MultiMediaCard (SD/MMC) card
port, as well as for memory-to-memory transfers.
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Serial interfaces:
Ethernet MAC with associated DMA controller. These functions reside on an
independent AHB.
USB 2.0 full-speed device with on-chip PHY and associated DMA controller
(LPC2364/66/68 only).
Four UARTs with fractional baud rate generation, one with modem control I/O, one
with IrDA support, all with FIFO.
CAN controller with two channels (LPC2364/66/68 only).
SPI controller.
Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate
for the SPI port, sharing its interrupt and pins. These can be used with the GPDMA
controller.
Three I2C-bus interfaces (one with open-drain and two with standard port pins).
I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
Other peripherals:
SD/MMC memory card interface (LPC2367/68 only).
70 general purpose I/O pins with configurable pull-up/down resistors.
10-bit ADC with input multiplexing among 6 pins.
10-bit DAC.
Four general purpose timers/counters with a total of 8 capture inputs and 10
compare outputs. Each timer block has an external count input.
One PWM/timer block with support for three-phase motor control. The PWM has
two external count inputs.
Real-Time Clock (RTC) with separate power pin, clock source can be the RTC
oscillator or the APB clock.
2 kB SRAM powered from the RTC power pin, allowing data to be stored when the
rest of the chip is powered off.
WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
Standard ARM test/debug interface for compatibility with existing tools.
Emulation trace module supports real-time trace.
Single 3.3 V power supply (3.0 V to 3.6 V).
Four reduced power modes: idle, sleep, power-down, and deep power-down.
Four external interrupt inputs configurable as edge/level sensitive. All pins on Port 0
and Port 2 can be used as edge sensitive interrupt sources.
Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt).
Two independent power domains allow fine tuning of power consumption based on
needed features.
Each peripheral has its own clock divider for further power saving.
Brownout detect with separate thresholds for interrupt and forced reset.
On-chip power-on reset.
On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz.
4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
the system clock. When used as the CPU clock, does not allow CAN and USB to run.
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
2 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
Boundary scan for simplified board testing is available in LPC2364FET100 and
LPC2368FET100 (TFBGA package).
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
3. Applications
Industrial control
Medical systems
Protocol converter
Communications
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2364FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2364HBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2364FET100
TFBGA100
plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC2365FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2366FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2367FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2368FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC2368FET100
TFBGA100
plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
3 of 69
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NXP Semiconductors
LPC2364_65_66_67_68
Product data sheet
4.1 Ordering options
Table 2.
Ordering options
Type number
Flash
SRAM (kB)
(kB) Local Ethernet GP/USB RTC
bus
buffers
Total
Ethernet USB
SD/MMC GP DMA
Channels
Temp range
device +
CAN ADC DAC
4 kB
FIFO
128
8
16
8
2
34
RMII
yes
no
yes
2
6
1
40 C to +85 C
LPC2364HBD100 128
8
16
8
2
34
RMII
yes
no
yes
2
6
1
40 C to +125 C
LPC2364FET100
128
8
16
8
2
34
RMII
yes
no
yes
2
6
1
40 C to +85 C
LPC2365FBD100
256
32
16
8
2
58
RMII
no
no
yes
-
6
1
40 C to +85 C
LPC2366FBD100
256
32
16
8
2
58
RMII
yes
no
yes
2
6
1
40 C to +85 C
LPC2367FBD100
512
32
16
8
2
58
RMII
no
yes
yes
-
6
1
40 C to +85 C
LPC2368FBD100
512
32
16
8
2
58
RMII
yes
yes
yes
2
6
1
40 C to +85 C
LPC2368FET100
512
32
16
8
2
58
RMII
yes
yes
yes
2
6
1
40 C to +85 C
LPC2364FBD100
Single-chip 16-bit/32-bit microcontrollers
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LPC2364/65/66/67/68
Rev. 7.1 — 16 October 2013
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LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5. Block diagram
TMS TDI
XTAL1
XTAL2
VDDA
trace signals
LPC2364/65/66/67/68
P0, P1, P2,
P3, P4
8/32 kB
SRAM
HIGH-SPEED
GPI/O
70 PINS
TOTAL
128/256/
512 kB
FLASH
INTERNAL
CONTROLLERS
EINT3 to EINT0
P0, P2
ARM7TDMI-S
SRAM FLASH
AHB2
RMII(8)
TEST/DEBUG
INTERFACE
ETHERNET
MAC WITH
DMA
EMULATION
TRACE MODULE
TRST TCK TDO
EXTIN0
RESET
PLL
SYSTEM
FUNCTIONS
system
clock
INTERNAL RC
OSCILLATOR
AHB1
AHB
BRIDGE
MASTER AHB TO SLAVE
PORT AHB BRIDGE PORT
8 kB
SRAM
AHB TO
APB BRIDGE
USB WITH
4 kB RAM
AND DMA(2)
I2SRX_CLK
I2STX_CLK
I2SRX_WS
I2STX_WS
I2SRX_SDA
I2STX_SDA
I2S INTERFACE
CAPTURE/COMPARE
TIMER0/TIMER1/
TIMER2/TIMER3
6 × PWM1
PWM1
SPI, SSP0 INTERFACE
LEGACY GPI/O
52 PINS TOTAL
SSP1 INTERFACE
2 × PCAP1
P0, P1
6 × AD0
A/D CONVERTER
AOUT
SCK1
MOSI1
MISO1
SSEL1
MCICMD,
MCIDAT[3:0]
UART0, UART2, UART3
TXD0, TXD2, TXD3
RXD0, RXD2, RXD3
2 kB BATTERY RAM
TXD1
RXD1
DTR1, RTS1
power domain
domain 22
power
RTCX1
RTCX2
SCK, SCK0
MOSI, MOSI0
MISO, MISO0
SSEL, SSEL0
MCICLK, MCIPWR
SD/MMC CARD
INTERFACE(1)
D/A CONVERTER
VBAT
VBUS
USB_D+, USB_D−
USB_CONNECT
USB_UP_LED
GP DMA
CONTROLLER
EXTERNAL INTERRUPTS
2 × CAP0/CAP1/
CAP2/CAP3
4 × MAT2,
2 × MAT0/MAT1/
MAT3
VREF
VSSA, VSS
VDD(DCDC)(3V3)
VECTORED
INTERRUPT
CONTROLLER
AHB
BRIDGE
16 kB
SRAM
VDD(3V3)
RTC
OSCILLATOR
REALTIME
CLOCK
UART1
DSR1, CTS1, DCD1,
RI1
WATCHDOG TIMER
CAN1, CAN2(2)
RD1, RD2
TD1, TD2
SYSTEM CONTROL
I2C0, I2C1, I2C2
SCL0, SCL1, SCL2
SDA0, SDA1, SDA2
002aac566
(1) LPC2367/68 only.
(2) LPC2364/66/68 only.
Fig 1.
LPC2364/65/66/67/68 block diagram
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
5 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
6. Pinning information
76
100
6.1 Pinning
1
75
LPC2364FBD100
LPC2365FBD100
LPC2366FBD100
LPC2367FBD100
LPC2368FBD100
Fig 2.
50
51
26
25
002aac576
LPC2364/65/66/67/68 pinning
ball A1
index area
LPC2364FET100/LPC2368FET100
1
2
3
4
5
6
7
8
9 10
A
B
C
D
E
F
G
H
J
K
002aad225
Transparent top view
Fig 3.
LPC2364_65_66_67_68
Product data sheet
LPC2364/68 pinning TFBGA100 package
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
6 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin allocation table
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row A
1
TDO
2
P0[3]/RXD0
3
VDD(3V3)
4
P1[4]/ENET_TX_EN
5
P1[10]/ENET_RXD1
6
P1[16]/ENET_MDC
7
VDD(DCDC)(3V3)
8
P0[4]/I2SRX_CLK/
RD2/CAP2[0]
9
P0[7]/I2STX_CLK/
SCK1/MAT2[1]
10
P0[9]/I2STX_SDA/
MOSI1/MAT2[3]
11
-
12
-
Row B
1
TMS
2
RTCK
3
VSS
4
P1[1]/ENET_TXD1
5
P1[9]/ENET_RXD0
6
P1[17]/
ENET_MDIO
7
VSS
8
P0[6]/I2SRX_SDA/
SSEL1/MAT2[0]
9
P2[0]/PWM1[1]/
TXD1/TRACECLK
10
P2[1]/PWM1[2]/
RXD1/PIPESTAT0
11
-
12
-
Row C
1
TCK
2
TRST
3
TDI
4
P0[2]/TXD0
5
P1[8]/ENET_CRS
6
P1[15]/
ENET_REF_CLK
7
P4[28]/MAT2[0]/
TXD3
8
P0[8]/I2STX_WS/
MISO1/MAT2[2]
9
VSS
10
VDD(3V3)
11
-
12
-
Row D
1
P0[24]/AD0[1]/
I2SRX_WS/CAP3[1]
2
P0[25]/AD0[2]/
I2SRX_SDA/TXD3
3
P0[26]/AD0[3]/
AOUT/RXD3
4
DBGEN
5
P1[0]/ENET_TXD0
6
P1[14]/ENET_RX_ER
7
P0[5]/I2SRX_WS/
TD2/CAP2[1]
8
P2[2]/PWM1[3]/
CTS1/PIPESTAT1
9
P2[4]/PWM1[5]/
DSR1/TRACESYNC
10
P2[5]/PWM1[6]/
DTR1/TRACEPKT0
11
-
12
-
Row E
1
VSSA
2
VDDA
3
VREF
4
VDD(DCDC)(3V3)
5
P0[23]/AD0[0]/
I2SRX_CLK/CAP3[0]
6
P4[29]/MAT2[1]/
RXD3
7
P2[3]/PWM1[4]/
DCD1/PIPESTAT2
8
P2[6]/PCAP1[0]/RI1/
TRACEPKT1
9
P2[7]/RD2/
RTS1/TRACEPKT2
10
P2[8]/TD2/
TXD2/TRACEPKT3
11
-
12
-
Row F
1
VSS
2
RTCX1
3
RESET
4
P1[31]/SCK1/
AD0[5]
5
P1[21]/PWM1[3]/
SSEL0
6
P0[18]/DCD1/
MOSI0/MOSI
7
P2[9]/USB_CONNECT/
RXD2/EXTIN0
8
P0[16]/RXD1/
SSEL0/SSEL
9
P0[17]/CTS1/
MISO0/MISO
10
P0[15]/TXD1/
SCK0/SCK
11
-
12
-
Row G
1
RTCX2
2
VBAT
3
XTAL2
4
P0[30]/USB_D
5
P1[25]/MAT1[1]
6
P1[29]/PCAP1[1]/
MAT0[1]
7
VSS
8
P0[21]/RI1/
MCIPWR/RD1
9
P0[20]/DTR1/
MCICMD/SCL1
10
P0[19]/DSR1/
MCICLK/SDA1
11
-
12
-
Row H
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
7 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
1
P1[30]/VBUS/
AD0[4]
2
XTAL1
3
P3[25]/MAT0[0]/
PWM1[2]
4
P1[18]/USB_UP_LED/
PWM1[1]/CAP1[0]
5
P1[24]/PWM1[5]/
MOSI0
6
VDD(DCDC)(3V3)
7
P0[10]/TXD2/
SDA2/MAT3[0]
8
P2[11]/EINT1/
MCIDAT1/I2STX_CLK
9
VDD(3V3)
10
P0[22]/RTS1/
MCIDAT0/TD1
11
-
12
-
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
8 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row J
1
P0[28]/SCL0
2
P0[27]/SDA0
3
P0[29]/USB_D+
4
P1[19]/CAP1[1]
5
P1[22]/MAT1[0]
6
VSS
7
P1[28]/PCAP1[0]/
MAT0[0]
8
P0[1]/TD1/RXD3/SCL1
9
P2[13]/EINT3/
MCIDAT3/I2STX_SDA
10
P2[10]/EINT0
11
-
12
-
Row K
1
P3[26]/MAT0[1]/
PWM1[3]
2
VDD(3V3)
3
VSS
4
P1[20]/PWM1[2]/
SCK0
5
P1[23]/PWM1[4]/
MISO0
6
P1[26]/PWM1[6]/
CAP0[0]
7
P1[27]/CAP0[1]
8
P0[0]/RD1/TXD3/SDA1
9
P0[11]/RXD2/
SCL2/MAT3[1]
10
P2[12]/EINT2/
MCIDAT2/I2STX_WS
11
-
12
-
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
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9 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
6.2 Pin description
Table 4.
Pin description
Symbol
Pin
Ball
P0[0] to P0[31]
P0[0]/RD1/TXD3/ 46[1]
SDA1
P0[1]/TD1/RXD3/ 47[1]
SCL1
K8[1]
J8[1]
P0[2]/TXD0
98[1]
C4[1]
P0[3]/RXD0
99[1]
A2[1]
P0[4]/
I2SRX_CLK/
RD2/CAP2[0]
81[1]
A8[1]
P0[5]/
I2SRX_WS/
TD2/CAP2[1]
P0[6]/
I2SRX_SDA/
SSEL1/MAT2[0]
P0[7]/
I2STX_CLK/
SCK1/MAT2[1]
P0[8]/
I2STX_WS/
MISO1/MAT2[2]
LPC2364_65_66_67_68
Product data sheet
80[1]
79[1]
78[1]
77[1]
D7[1]
B8[1]
A9[1]
C8[1]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 0 pins depends upon the pin function selected via
the pin connect block. Pins 12, 13, 14, and 31 of this port are not available.
I/O
P0[0] — General purpose digital input/output pin.
I
RD1 — CAN1 receiver input. (LPC2364/66/68 only)
O
TXD3 — Transmitter output for UART3.
I/O
SDA1 — I2C1 data input/output (this is not an open-drain pin).
I/O
P0[1] — General purpose digital input/output pin.
O
TD1 — CAN1 transmitter output. (LPC2364/66/68 only)
I
RXD3 — Receiver input for UART3.
I/O
SCL1 — I2C1 clock input/output (this is not an open-drain pin).
I/O
P0[2] — General purpose digital input/output pin.
O
TXD0 — Transmitter output for UART0.
I/O
P0[3] — General purpose digital input/output pin.
I
RXD0 — Receiver input for UART0.
I/O
P0[4] — General purpose digital input/output pin.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I
RD2 — CAN2 receiver input. (LPC2364/66/68 only)
I
CAP2[0] — Capture input for Timer 2, channel 0.
I/O
P0[5] — General purpose digital input/output pin.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and received
by the slave. Corresponds to the signal WS in the I2S-bus specification.
O
TD2 — CAN2 transmitter output. (LPC2364/66/68 only)
I
CAP2[1] — Capture input for Timer 2, channel 1.
I/O
P0[6] — General purpose digital input/output pin.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
SSEL1 — Slave Select for SSP1.
O
MAT2[0] — Match output for Timer 2, channel 0.
I/O
P0[7] — General purpose digital input/output pin.
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I/O
SCK1 — Serial Clock for SSP1.
O
MAT2[1] — Match output for Timer 2, channel 1.
I/O
P0[8] — General purpose digital input/output pin.
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
I/O
MISO1 — Master In Slave Out for SSP1.
O
MAT2[2] — Match output for Timer 2, channel 2.
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10 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P0[9]/
I2STX_SDA/
MOSI1/MAT2[3]
76[1]
A10[1]
I/O
P0[9] — General purpose digital input/output pin.
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
MOSI1 — Master Out Slave In for SSP1.
O
MAT2[3] — Match output for Timer 2, channel 3.
I/O
P0[10] — General purpose digital input/output pin.
O
TXD2 — Transmitter output for UART2.
I/O
SDA2 — I2C2 data input/output (this is not an open-drain pin).
O
MAT3[0] — Match output for Timer 3, channel 0.
I/O
P0[11] — General purpose digital input/output pin.
I
RXD2 — Receiver input for UART2.
I/O
SCL2 — I2C2 clock input/output (this is not an open-drain pin).
O
MAT3[1] — Match output for Timer 3, channel 1.
I/O
P0[15] — General purpose digital input/output pin.
O
TXD1 — Transmitter output for UART1.
I/O
SCK0 — Serial clock for SSP0.
I/O
SCK — Serial clock for SPI.
I/O
P0[16] — General purpose digital input/output pin.
I
RXD1 — Receiver input for UART1.
I/O
SSEL0 — Slave Select for SSP0.
I/O
SSEL — Slave Select for SPI.
I/O
P0[17] — General purpose digital input/output pin.
I
CTS1 — Clear to Send input for UART1.
P0[10]/TXD2/
SDA2/MAT3[0]
P0[11]/RXD2/
SCL2/MAT3[1]
P0[15]/TXD1/
SCK0/SCK
P0[16]/RXD1/
SSEL0/SSEL
P0[17]/CTS1/
MISO0/MISO
P0[18]/DCD1/
MOSI0/MOSI
P0[19]/DSR1/
MCICLK/SDA1
P0[20]/DTR1/
MCICMD/SCL1
LPC2364_65_66_67_68
Product data sheet
48[1]
49[1]
62[1]
63[1]
61[1]
60[1]
59[1]
58[1]
H7[1]
K9[1]
F10[1]
F8[1]
F9[1]
F6[1]
G10[1]
G9[1]
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
MISO — Master In Slave Out for SPI.
I/O
P0[18] — General purpose digital input/output pin.
I
DCD1 — Data Carrier Detect input for UART1.
I/O
MOSI0 — Master Out Slave In for SSP0.
I/O
MOSI — Master Out Slave In for SPI.
I/O
P0[19] — General purpose digital input/output pin.
I
DSR1 — Data Set Ready input for UART1.
O
MCICLK — Clock output line for SD/MMC interface. (LPC2367/68 only)
I/O
SDA1 — I2C1 data input/output (this is not an open-drain pin).
I/O
P0[20] — General purpose digital input/output pin.
O
DTR1 — Data Terminal Ready output for UART1.
I
MCICMD — Command line for SD/MMC interface. (LPC2367/68 only)
I/O
SCL1 — I2C1 clock input/output (this is not an open-drain pin).
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
11 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P0[21]/RI1/
MCIPWR/RD1
57[1]
G8[1]
I/O
P0[21] — General purpose digital input/output pin.
I
RI1 — Ring Indicator input for UART1.
O
MCIPWR — Power Supply Enable for external SD/MMC power supply.
(LPC2367/68 only)
I
RD1 — CAN1 receiver input. (LPC2364/66/68 only)
I/O
P0[22] — General purpose digital input/output pin.
O
RTS1 — Request to Send output for UART1.
O
MCIDAT0 — Data line for SD/MMC interface. (LPC2367/68 only)
O
TD1 — CAN1 transmitter output. (LPC2364/66/68 only)
I/O
P0[23] — General purpose digital input/output pin.
I
AD0[0] — A/D converter 0, input 0.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
I
CAP3[0] — Capture input for Timer 3, channel 0.
I/O
P0[24] — General purpose digital input/output pin.
I
AD0[1] — A/D converter 0, input 1.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and received
by the slave. Corresponds to the signal WS in the I2S-bus specification.
I
CAP3[1] — Capture input for Timer 3, channel 1.
I/O
P0[25] — General purpose digital input/output pin.
I
AD0[2] — A/D converter 0, input 2.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
O
TXD3 — Transmitter output for UART3.
I/O
P0[26] — General purpose digital input/output pin.
I
AD0[3] — A/D converter 0, input 3.
O
AOUT — D/A converter output.
I
RXD3 — Receiver input for UART3.
I/O
P0[27] — General purpose digital input/output pin. Output is open-drain.
I/O
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus
compliance).
I/O
P0[28] — General purpose digital input/output pin. Output is open-drain.
I/O
SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus
compliance).
I/O
P0[29] — General purpose digital input/output pin.
I/O
USB_D+ — USB bidirectional D+ line. (LPC2364/66/68 only)
I/O
P0[30] — General purpose digital input/output pin.
I/O
USB_D — USB bidirectional D line. (LPC2364/66/68 only)
I/O
Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 1 pins depends upon the pin function selected via
the pin connect block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not
available.
P0[22]/RTS1/
MCIDAT0/TD1
56[1]
P0[23]/AD0[0]/
I2SRX_CLK/
CAP3[0]
9[2]
P0[24]/AD0[1]/
I2SRX_WS/
CAP3[1]
8[2]
P0[25]/AD0[2]/
I2SRX_SDA/
TXD3
7[2]
P0[26]/AD0[3]/
AOUT/RXD3
6[3]
P0[27]/SDA0
P0[28]/SCL0
25[4]
24[4]
H10[1]
E5[2]
D1[2]
D2[2]
D3[3]
J2[4]
J1[4]
P0[29]/USB_D+
29[5]
J3[5]
P0[30]/USB_D
30[5]
G4[5]
P1[0] to P1[31]
LPC2364_65_66_67_68
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
12 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P1[0]/
ENET_TXD0
95[1]
D5[1]
I/O
P1[0] — General purpose digital input/output pin.
O
ENET_TXD0 — Ethernet transmit data 0.
P1[1]/
ENET_TXD1
94[1]
B4[1]
I/O
P1[1] — General purpose digital input/output pin.
O
ENET_TXD1 — Ethernet transmit data 1.
P1[4]/
ENET_TX_EN
93[1]
A4[1]
I/O
P1[4] — General purpose digital input/output pin.
O
ENET_TX_EN — Ethernet transmit data enable.
P1[8]/
ENET_CRS
92[1]
C5[1]
I/O
P1[8] — General purpose digital input/output pin.
I
ENET_CRS — Ethernet carrier sense.
P1[9]/
ENET_RXD0
91[1]
B5[1]
I/O
P1[9] — General purpose digital input/output pin.
I
ENET_RXD0 — Ethernet receive data.
P1[10]/
ENET_RXD1
90[1]
A5[1]
I/O
P1[10] — General purpose digital input/output pin.
I
ENET_RXD1 — Ethernet receive data.
P1[14]/
ENET_RX_ER
89[1]
D6[1]
I/O
P1[14] — General purpose digital input/output pin.
I
ENET_RX_ER — Ethernet receive error.
P1[15]/
ENET_REF_CLK
88[1]
C6[1]
I/O
P1[15] — General purpose digital input/output pin.
I
ENET_REF_CLK — Ethernet reference clock.
P1[16]/
ENET_MDC
87[1]
A6[1]
I/O
P1[16] — General purpose digital input/output pin.
O
ENET_MDC — Ethernet MIIM clock.
P1[17]/
ENET_MDIO
86[1]
B6[1]
I/O
P1[17] — General purpose digital input/output pin.
I/O
ENET_MDIO — Ethernet MIIM data input and output.
P1[18]/
USB_UP_LED/
PWM1[1]/
CAP1[0]
32[1]
H4[1]
I/O
P1[18] — General purpose digital input/output pin.
O
USB_UP_LED — USB GoodLink LED indicator. It is LOW when device is
configured (non-control endpoints enabled), or when host is enabled and
has detected a device on the bus. It is HIGH when the device is not
configured, or when host is enabled and has not detected a device on the
bus, or during global suspend. It transitions between LOW and HIGH
(flashes) when host is enabled and detects activity on the bus.
(LPC2364/66/68 only)
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
I
CAP1[0] — Capture input for Timer 1, channel 0.
I/O
P1[19] — General purpose digital input/output pin.
I
CAP1[1] — Capture input for Timer 1, channel 1.
I/O
P1[20] — General purpose digital input/output pin.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I/O
SCK0 — Serial clock for SSP0.
I/O
P1[21] — General purpose digital input/output pin.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I/O
SSEL0 — Slave Select for SSP0.
I/O
P1[22] — General purpose digital input/output pin.
O
MAT1[0] — Match output for Timer 1, channel 0.
P1[19]/CAP1[1]
33[1]
J4[1]
P1[20]/PWM1[2]/
SCK0
34[1]
K4[1]
P1[21]/PWM1[3]/
SSEL0
35[1]
P1[22]/MAT1[0]
36[1]
LPC2364_65_66_67_68
Product data sheet
F5[1]
J5[1]
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
13 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P1[23]/PWM1[4]/
MISO0
37[1]
K5[1]
I/O
P1[23] — General purpose digital input/output pin.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I/O
MISO0 — Master In Slave Out for SSP0.
P1[24]/PWM1[5]/
MOSI0
38[1]
I/O
P1[24] — General purpose digital input/output pin.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I/O
MOSI0 — Master Out Slave in for SSP0.
P1[25]/MAT1[1]
39[1]
G5[1]
I/O
P1[25] — General purpose digital input/output pin.
O
MAT1[1] — Match output for Timer 1, channel 1.
P1[26]/PWM1[6]/
CAP0[0]
40[1]
K6[1]
I/O
P1[26] — General purpose digital input/output pin.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
I
CAP0[0] — Capture input for Timer 0, channel 0.
P1[27]/CAP0[1]
43[1]
I/O
P1[27] — General purpose digital input/output pin.
I
CAP0[1] — Capture input for Timer 0, channel 1.
I/O
P1[28] — General purpose digital input/output pin.
I
PCAP1[0] — Capture input for PWM1, channel 0.
O
MAT0[0] — Match output for Timer 0, channel 0.
I/O
P1[29] — General purpose digital input/output pin.
I
PCAP1[1] — Capture input for PWM1, channel 1.
O
MAT0[1] — Match output for Timer 0, channel 0.
I/O
P1[30] — General purpose digital input/output pin.
I
VBUS — Monitors the presence of USB bus power. (LPC2364/66/68 only)
P1[28]/
PCAP1[0]/
MAT0[0]
44[1]
P1[29]/
PCAP1[1]/
MAT0[1]
45[1]
P1[30]/VBUS/
AD0[4]
21[2]
H5[1]
K7[1]
J7[1]
G6[1]
H1[2]
Note: This signal must be HIGH for USB reset to occur.
P1[31]/SCK1/
AD0[5]
20[2]
F4[2]
P2[0] to P2[31]
P2[0]/PWM1[1]/
TXD1/
TRACECLK
75[1]
P2[1]/PWM1[2]/
RXD1/
PIPESTAT0
74[1]
P2[2]/PWM1[3]/
CTS1/
PIPESTAT1
73[1]
LPC2364_65_66_67_68
Product data sheet
B9[1]
B10[1]
D8[1]
I
AD0[4] — A/D converter 0, input 4.
I/O
P1[31] — General purpose digital input/output pin.
I/O
SCK1 — Serial Clock for SSP1.
I
AD0[5] — A/D converter 0, input 5.
I/O
Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 2 pins depends upon the pin function selected via
the pin connect block. Pins 14 through 31 of this port are not available.
I/O
P2[0] — General purpose digital input/output pin.
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
O
TXD1 — Transmitter output for UART1.
O
TRACECLK — Trace Clock.
I/O
P2[1] — General purpose digital input/output pin.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I
RXD1 — Receiver input for UART1.
O
PIPESTAT0 — Pipeline Status, bit 0.
I/O
P2[2] — General purpose digital input/output pin.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I
CTS1 — Clear to Send input for UART1.
O
PIPESTAT1 — Pipeline Status, bit 1.
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
14 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P2[3]/PWM1[4]/
DCD1/
PIPESTAT2
70[1]
E7[1]
I/O
P2[3] — General purpose digital input/output pin.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I
DCD1 — Data Carrier Detect input for UART1.
O
PIPESTAT2 — Pipeline Status, bit 2.
P2[4]/PWM1[5]/
DSR1/
TRACESYNC
69[1]
I/O
P2[4] — General purpose digital input/output pin.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I
DSR1 — Data Set Ready input for UART1.
O
TRACESYNC — Trace Synchronization.
P2[5]/PWM1[6]/
DTR1/
TRACEPKT0
68[1]
I/O
P2[5] — General purpose digital input/output pin.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
O
DTR1 — Data Terminal Ready output for UART1.
O
TRACEPKT0 — Trace Packet, bit 0.
P2[6]/PCAP1[0]/
RI1/
TRACEPKT1
67[1]
I/O
P2[6] — General purpose digital input/output pin.
I
PCAP1[0] — Capture input for PWM1, channel 0.
I
RI1 — Ring Indicator input for UART1.
O
TRACEPKT1 — Trace Packet, bit 1.
P2[7]/RD2/
RTS1/
TRACEPKT2
66[1]
I/O
P2[7] — General purpose digital input/output pin.
I
RD2 — CAN2 receiver input. (LPC2364/66/68 only)
O
RTS1 — Request to Send output for UART1.
O
TRACEPKT2 — Trace Packet, bit 2.
P2[8]/TD2/
TXD2/
TRACEPKT3
65[1]
I/O
P2[8] — General purpose digital input/output pin.
O
TD2 — CAN2 transmitter output. (LPC2364/66/68 only)
O
TXD2 — Transmitter output for UART2.
O
TRACEPKT3 — Trace Packet, bit 3.
I/O
P2[9] — General purpose digital input/output pin.
O
USB_CONNECT — Signal used to switch an external 1.5 k resistor under
software control. Used with the SoftConnect USB feature. (LPC2364/66/68
only)
I
RXD2 — Receiver input for UART2.
I
EXTIN0 — External Trigger Input.
I/O
P2[10] — General purpose digital input/output pin.
P2[9]/
64[1]
USB_CONNECT/
RXD2/EXTIN0
P2[10]/EINT0
53[6]
D9[1]
D10[1]
E8[1]
E9[1]
E10[1]
F7[1]
J10[6]
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to
take over control of the part after a reset.
P2[11]/EINT1/
MCIDAT1/
I2STX_CLK
LPC2364_65_66_67_68
Product data sheet
52[6]
H8[6]
I
EINT0 — External interrupt 0 input.
I/O
P2[11] — General purpose digital input/output pin.
I
EINT1 — External interrupt 1 input.
O
MCIDAT1 — Data line for SD/MMC interface. (LPC2367/68 only)
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
15 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
P2[12]/EINT2/
MCIDAT2/
I2STX_WS
51[6]
K10[6]
I/O
P2[12] — General purpose digital input/output pin.
I
EINT2 — External interrupt 2 input.
O
MCIDAT2 — Data line for SD/MMC interface. (LPC2367/68 only)
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
I/O
P2[13] — General purpose digital input/output pin.
P2[13]/EINT3/
MCIDAT3/
I2STX_SDA
50[6]
J9[6]
P3[0] to P3[31]
P3[25]/MAT0[0]/
PWM1[2]
27[1]
P3[26]/MAT0[1]/
PWM1[3]
26[1]
H3[1]
K1[1]
P4[0] to P4[31]
P4[28]/MAT2[0]/
TXD3
82[1]
P4[29]/MAT2[1]/
RXD3
85[1]
DBGEN
-
C7[1]
E6[1]
D4[1][8]
I
EINT3 — External interrupt 3 input.
O
MCIDAT3 — Data line for SD/MMC interface. (LPC2367/68 only)
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
I/O
Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 3 pins depends upon the pin function selected via
the pin connect block. Pins 0 through 24, and 27 through 31 of this port are
not available.
I/O
P3[25] — General purpose digital input/output pin.
O
MAT0[0] — Match output for Timer 0, channel 0.
O
PWM1[2] — Pulse Width Modulator 1, output 2.
I/O
P3[26] — General purpose digital input/output pin.
O
MAT0[1] — Match output for Timer 0, channel 1.
O
PWM1[3] — Pulse Width Modulator 1, output 3.
I/O
Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each
bit. The operation of Port 4 pins depends upon the pin function selected via
the pin connect block. Pins 0 through 27, 30, and 31 of this port are not
available.
I/O
P4[28] — General purpose digital input/output pin.
O
MAT2[0] — Match output for Timer 2, channel 0.
O
TXD3 — Transmitter output for UART3.
I/O
P4[29] — General purpose digital input/output pin.
O
MAT2[1] — Match output for Timer 2, channel 1.
I
RXD3 — Receiver input for UART3.
I
DBGEN — JTAG interface control signal. Also used for boundary scanning.
Note: This pin is available in LPC2364FET100 and LPC2368FET100
devices only (TFBGA package).
TDO
1[1][7]
A1[1][7]
O
TDO — Test Data out for JTAG interface.
TDI
2[1][8]
C3[1][8]
I
TDI — Test Data in for JTAG interface.
TMS
3[1][8]
B1[1][8]
I
TMS — Test Mode Select for JTAG interface.
TRST
4[1][8]
C2[1][8]
I
TRST — Test Reset for JTAG interface.
TCK
5[1][7]
C1[1][7]
I
TCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6 of
the CPU clock (CCLK) for the JTAG interface to operate
RTCK
100[1][8]
B2[1][8]
I/O
RTCK — JTAG interface control signal.
Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0]) to
operate as trace port after reset.
LPC2364_65_66_67_68
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
16 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 4.
Pin description …continued
Symbol
Pin
Ball
Type
Description
RSTOUT
14
-
O
RSTOUT — This is a 3.3 V pin. LOW on this pin indicates
LPC2364/65/66/67/68 being in Reset state.
Note: This pin is available in LPC2364FBD100, LPC2365FBD100,
LPC2366FBD100, LPC2367FBD100, and LPC2368FBD100 devices only
(LQFP100 package).
RESET
17[9]
F3[9]
XTAL1
22[10][11]
H2[10][11] I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
23[10][11]
G3[10][11]
O
Output from the oscillator amplifier.
RTCX1
16[10][12]
F2[10][12]
I
Input to the RTC oscillator circuit.
RTCX2
18[10]
G1[10]
O
Output from the RTC oscillator circuit.
VSS
15, 31,
41, 55,
72, 97,
83[13]
B3, B7,
C9, F1,
G7, J6,
K3 [13]
I
ground: 0 V reference.
VSSA
11[14]
E1[14]
I
analog ground: 0 V reference. This should nominally be the same voltage
as VSS, but should be isolated to minimize noise and error.
VDD(3V3)
28, 54,
71,
96[15]
A3, C10, I
H9,
K2[15]
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(DCDC)(3V3)
13, 42,
84[16]
A7, E4,
H6[16]
I
3.3 V DC-to-DC converter supply voltage: This is the supply voltage for
the on-chip DC-to-DC converter only.
VDDA
10[17]
E2[17]
I
analog 3.3 V pad supply voltage: This should be nominally the same
voltage as VDD(3V3) but should be isolated to minimize noise and error. This
voltage is used to power the ADC and DAC.
VREF
12[17]
E3[17]
I
ADC reference: This should be nominally the same voltage as VDD(3V3) but
should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT
19[17]
G2[17]
I
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
I
External reset input: A LOW on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions (LPC2364/66/68 only). It is designed in accordance with the USB specification, revision 2.0
(Full-speed and Low-speed mode only).
[6]
5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
This pin has no built-in pull-up and no built-in pull-down resistor.
[8]
This pin has a built-in pull-up resistor.
[9]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[10] Pad provides special analog functionality.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
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[12] If the RTC is not used, these pins can be left floating.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
[16] Pad provides special analog functionality.
[17] Pad provides special analog functionality.
7. Functional description
7.1 Architectural overview
The LPC2364/65/66/67/68 microcontroller consists of an ARM7TDMI-S CPU with
emulation support, the ARM7 local bus for closely coupled, high-speed access to the
majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals,
and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2364/65/66/67/68 implements two AHB in order to allow the Ethernet block to
operate without interference caused by other system activity. The primary AHB, referred
to as AHB1, includes the VIC and GPDMA controller.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB
ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the
AHB address space. Lower speed peripheral functions are connected to the APB. The
AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a
2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is
allocated a 16 kB address space within the APB address space.
The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers
high performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed complex
instruction set computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
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The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set
• A 16-bit Thumb set
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
7.2 On-chip flash programming memory
The LPC2364/65/66/67/68 incorporate a 128 kB, 256 kB, and 512 kB flash memory
system respectively. This memory may be used for both code and data storage.
Programming of the flash memory may be accomplished in several ways. It may be
programmed In System via the serial port (UART0). The application program may also
erase and/or program the flash while the application is running, allowing a great degree of
flexibility for data storage field and firmware upgrades.
The flash memory is 128 bits wide and includes pre-fetching and buffering techniques to
allow it to operate at SRAM speeds of 72 MHz. LPC2364HBD flash operates up to
72 MHz from 40 C to +85 C, up to 60 MHz from 85 C to 125 C.
7.3 On-chip SRAM
The LPC2364/65/66/67/68 include SRAM memory of 8 kB or 32 kB, reserved for the ARM
processor exclusive use. This RAM may be used for code and/or data storage and may
be accessed as 8 bits, 16 bits, and 32 bits.
A 16 kB SRAM block serving as a buffer for the Ethernet controller and an 8 kB SRAM
used by the GPDMA controller or the USB device can be used both for data and code
storage. The 2 kB RTC SRAM can be used for data storage only. The RTC SRAM is
battery powered and retains the content in the absence of the main power supply.
7.4 Memory map
The LPC2364/65/66/67/68 memory map incorporates several distinct regions as shown in
Figure 4.
In addition, the CPU interrupt vectors may be remapped to allow them to reside in either
flash memory (default), boot ROM, or SRAM (see Section 7.25.6).
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0xFFFF FFFF
4.0 GB
AHB PERIPHERALS
0xF000 0000
3.75 GB
APB PERIPHERALS
3.5 GB
0xE000 0000
3.0 GB
0xC000 0000
RESERVED ADDRESS SPACE
2.0 GB
0x8000 0000
BOOT ROM AND BOOT FLASH
(BOOT FLASH REMAPPED FROM ON-CHIP FLASH)
RESERVED ADDRESS SPACE
0x7FE0 3FFF
0x7FE0 0000
ETHERNET RAM (16 kB)
0x7FD0 1FFF
GENERAL PURPOSE OR USB RAM (8 KB)
0x7FD0 0000
RESERVED ADDRESS SPACE
0x4000 8000
0x4000 7FFF
32 kB LOCAL ON-CHIP STATIC RAM (LPC2365/66/67/68)
0x4000 2000
0x4000 1FFF
8 kB LOCAL ON-CHIP STATIC RAM (LPC2364)
1.0 GB
0x4000 0000
RESERVED FOR ON-CHIP MEMORY
0x0008 0000
0x0007 FFFF
0x0004 0000
0x0003 FFFF
0x0002 0000
0x0001 FFFF
0x0000 0000
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY (LPC2367/68)
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY (LPC2365/66)
0.0 GB
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2364)
002aac577
Fig 4.
LPC2364/65/66/67/68 memory map
7.5 Interrupt controller
The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast
Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be
programmed as FIQ or vectored IRQ types. The programmable assignment scheme
means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
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FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs
the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ
latency is achieved when only one request is classified as FIQ, because then the FIQ
service routine can simply start dealing with that device. But if more than one request is
assigned to the FIQ class, the FIQ service routine can read a word from the VIC that
identifies which FIQ source(s) is (are) requesting an interrupt.
Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a
programmable interrupt priority. When more than one interrupt is assigned the same
priority and occur simultaneously, the one connected to the lowest numbered VIC channel
will be serviced first.
The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the
ARM processor. The IRQ service routine can start by reading a register from the VIC and
jumping to the address supplied by that register.
7.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the VIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on Port 0 and Port 2 (total of 42 pins) regardless of the selected function, can be
programmed to generate an interrupt on a rising edge, a falling edge, or both. Such
interrupt request coming from Port 0 and/or Port 2 will be combined with the EINT3
interrupt requests.
7.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.7 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected
LPC2364/65/66/67/68 peripherals to have DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
example, a bidirectional port requires one stream for transmit and one for receive. The
source and destination areas can each be either a memory region or a peripheral, and
can be accessed through the AHB master.
7.7.1 Features
• Two DMA channels. Each channel can support a unidirectional transfer.
• The GPDMA can transfer data between the 8 kB SRAM and peripherals such as the
SD/MMC, two SSP, and I2S interfaces.
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• Single DMA and burst DMA request signals. Each peripheral connected to the
GPDMA can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the GPDMA.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority. Each DMA channel has a specific hardware priority.
DMA channel 0 has the highest priority and channel 1 has the lowest priority. If
requests from two channels become active at the same time the channel with the
highest priority is serviced first.
• AHB slave DMA programming interface. The GPDMA is programmed by writing to the
DMA control registers over the AHB slave interface.
• One AHB master for transferring data. This interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the
peripheral.
• Internal four-word FIFO per channel.
• Supports 8-bit, 16-bit, and 32-bit wide transactions.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Interrupt masking. The DMA error and DMA terminal count interrupt requests can be
masked.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.8 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC2364/65/66/67/68 use accelerated GPIO functions:
• GPIO registers are relocated to the ARM local bus so that the fastest possible I/O
timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte and half-word addressable.
• Entire port value can be written in one instruction.
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Additionally, any pin on Port 0 and Port 2 (total of 42 pins) providing a digital function can
be programmed to generate an interrupt on a rising edge, a falling edge, or both. The
edge detection is asynchronous, so it may operate when clocks are not present such as
during Power-down mode. Each enabled interrupt can be used to wake up the chip from
Power-down mode.
7.8.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Backward compatibility with other earlier devices is maintained with legacy Port 0 and
Port 1 registers appearing at the original addresses on the APB.
7.9 Ethernet
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.
The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access
the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic
in the LPC2364/65/66/67/68 takes place on a different AHB subsystem, effectively
separating Ethernet activity from the rest of the system. The Ethernet DMA can also
access the USB SRAM if it is not being used by the USB block.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII
(RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial
bus.
7.9.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x full duplex flow control and half duplex back pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support.
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
• Enhanced Ethernet features:
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– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic Frame Check Sequence (FCS) insertion with Circular
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.
• Physical interface:
– Attachment of external PHY chip through standard RMII interface.
– PHY register access is available via the MIIM interface.
7.10 USB interface (LPC2364/66/68 only)
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and a number (127 maximum) of peripherals. The host controller allocates the USB
bandwidth to attached devices through a token based protocol. The bus supports hot
plugging, unplugging, and dynamic configuration of the devices. All transactions are
initiated by the host controller.
7.10.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB host controller. It
consists of register interface, serial interface engine, endpoint buffer memory, and the
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate end point buffer memory. The status of a completed USB transfer or
error condition is indicated via status registers. An interrupt is also generated if enabled.
The DMA controller when enabled transfers data between the endpoint buffer and the
USB RAM.
7.10.2 Features
•
•
•
•
•
Fully compliant with USB 2.0 specification (full speed).
Supports 32 physical (16 logical) endpoints with a 4 kB USB endpoint buffer RAM.
Supports Control, Bulk, Interrupt and Isochronous endpoints.
Scalable realization of endpoints at run time.
Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, LPC2364/65/66/67/68 can enter one of the
reduced power modes and wake up on a USB activity.
• Supports DMA transfers with the DMA RAM of 8 kB on all non-control endpoints.
• Allows dynamic switching between CPU-controlled and DMA modes.
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• Double buffer implementation for Bulk and Isochronous endpoints.
7.11 CAN controller and acceptance filters (LPC2364/66/68 only)
The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router among a number of CAN buses in
industrial or automotive applications.
Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN
Library block, but the 8-bit registers of those devices have been combined in 32-bit words
to allow simultaneous access in the ARM environment. The main operational difference is
that the recognition of received Identifiers, known in CAN terminology as Acceptance
Filtering, has been removed from the CAN controllers and centralized in a global
Acceptance Filter.
7.11.1 Features
•
•
•
•
•
Two CAN controllers and buses.
Data rates to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0B, ISO 11898-1.
Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN
buses.
• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• FullCAN messages can generate interrupts.
7.12 10-bit ADC
The LPC2364/65/66/67/68 contain one ADC. It is a single 10-bit successive
approximation ADC with six channels.
7.12.1 Features
•
•
•
•
•
•
•
•
LPC2364_65_66_67_68
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10-bit successive approximation ADC.
Input multiplexing among 6 pins.
Power-down mode.
Measurement range 0 V to Vi(VREF).
10-bit conversion time 2.44 s.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition of input pin or Timer Match signal.
Individual result registers for each ADC channel to reduce interrupt overhead.
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7.13 10-bit DAC
The DAC allows the LPC2364/65/66/67/68 to generate a variable analog output. The
maximum output value of the DAC is Vi(VREF).
7.13.1 Features
•
•
•
•
•
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
7.14 UARTs
The LPC2364/65/66/67/68 each contain four UARTs. In addition to standard transmit and
receive data lines, UART1 also provides a full modem control handshake interface.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.14.1 Features
•
•
•
•
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
• UART3 includes an IrDA mode to support infrared communication.
7.15 SPI serial I/O controller
The LPC2364/65/66/67/68 each contain one SPI controller. SPI is a full duplex serial
interface designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the
slave, and the slave always sends 8 bits to 16 bits of data to the master.
7.15.1 Features
•
•
•
•
•
LPC2364_65_66_67_68
Product data sheet
Compliant with SPI specification
Synchronous, serial, full duplex communication
Combined SPI master and slave
Maximum data bit rate of one eighth of the input clock rate
8 bits to 16 bits per transfer
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7.16 SSP serial I/O controller
The LPC2364/65/66/67/68 each contain two SSP controllers. The SSP controller is
capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple
masters and slaves on the bus. Only a single master and a single slave can communicate
on the bus during a given data transfer. The SSP supports full duplex transfers, with
frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave
to the master. In practice, often only one of these data flows carries meaningful data.
7.16.1 Features
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
•
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
DMA transfers supported by GPDMA
7.17 SD/MMC card interface (LPC2367/68 only)
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD
memory cards. The SD card interface conforms to the SD Multimedia Card Specification
Version 2.11.
7.17.1 Features
• The MCI interface provides all functions specific to the SD/MMC memory card. These
include the clock generation unit, power management control, and command and data
transfer.
• Conforms to Multimedia Card Specification v2.11.
• Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.
• Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital
memory card.
• DMA supported through the GPDMA controller.
7.18 I2C-bus serial I/O controllers
The LPC2364/65/66/67/68 each contain three I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line
(SCL), and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus, it can be
controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2364/65/66/67/68 supports bit rates up to 400 kbit/s
(Fast I2C-bus).
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7.18.1 Features
• I2C0 is a standard I2C compliant bus interface with open-drain pins.
• I2C1 and I2C2 use standard I/O pins and do not support powering off of individual
devices connected to the same bus lines.
•
•
•
•
•
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
7.19 I2S-bus serial I/O controllers
The I2S-bus provides a standard communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S connection has one master, which is always the
master, and one slave. The I2S interface on the LPC2364/65/66/67/68 provides a
separate transmit and receive channel, each of which can operate as either a master or a
slave.
7.19.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
•
•
•
•
Configurable word select period in master mode (separately for I2S input and output).
Two 8-word FIFO data buffers are provided, one for transmit and one for receive.
Generates interrupt requests when buffer levels cross a programmable boundary.
Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S input and I2S output.
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7.20 General purpose 32-bit timers/external event counters
The LPC2364/65/66/67/68 include four 32-bit Timer/Counters. The Timer/Counter is
designed to count cycles of the system derived clock or an externally-supplied clock. It
can optionally generate interrupts or perform other actions at specified timer values,
based on four match registers. The Timer/Counter also includes two capture inputs to trap
the timer value when an input signal transitions, optionally generating an interrupt.
7.20.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit prescaler.
• Counter or Timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
7.21 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2364/65/66/67/68. The Timer is designed
to count cycles of the system derived clock and optionally switch pins, generate interrupts
or perform other actions when specified timer values occur, based on seven match
registers. The PWM function is in addition to these features, and is based on match
register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon
match. The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
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Three match registers can be used to provide a PWM output with both edges controlled.
Again, the PWMMR0 match register controls the PWM cycle rate. The other match
registers control the two PWM edge positions. Additional double edge controlled PWM
outputs require only two match registers each, since the repetition rate is the same for all
PWM outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.21.1 Features
• LPC2364/65/66/67/68 has one PWM block with Counter or Timer operation (may use
the peripheral clock or one of the capture inputs as the clock source).
• Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
7.22 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
7.22.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
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•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal prescaler.
Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 232 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the
Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of
potential timing choices of Watchdog operation under different power reduction
conditions. It also provides the ability to run the WDT from an entirely internal source
that is not dependent on an external crystal and its associated components and
wiring, for increased reliability.
7.23 RTC and battery RAM
The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. It uses little power in Power-down and Deep power-down modes. On the
LPC2364/65/66/67/68, the RTC can be clocked by a separate 32.768 kHz oscillator, or by
a programmable prescale divider based on the APB clock. Also, the RTC is powered by its
own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V
supply used by the rest of the device.
The VBAT pin supplies power only to the RTC and the battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
7.23.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Dedicated 32 kHz oscillator or programmable prescaler from APB clock.
• Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
• Periodic interrupts can be generated from increments of any field of the time registers,
and selected fractional second values.
• 2 kB data SRAM powered by VBAT.
• RTC and battery RAM power supply is isolated from the rest of the chip.
7.24 Clocking and power control
7.24.1 Crystal oscillators
The LPC2364/65/66/67/68 includes three independent oscillators. These are the Main
Oscillator, the Internal RC oscillator, and the RTC oscillator. Each oscillator can be used
for more than one purpose as required in a particular application. Any of the three clock
sources can be chosen by software to drive the PLL and ultimately the CPU.
Following reset, the LPC2364/65/66/67/68 will operate from the Internal RC oscillator until
switched by software. This allows systems to operate without any external crystal and the
bootloader code to operate at a known frequency.
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7.24.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is
trimmed to 1 % accuracy.
Upon power-up or any chip reset, the LPC2364/65/66/67/68 uses the IRC as the clock
source. Software may later switch to one of the other available clock sources.
7.24.1.2
Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can
be boosted to a higher frequency, up to the maximum CPU operating frequency, by the
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.24.2 for additional information.
7.24.1.3
RTC oscillator
The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the
RTC oscillator can be used to drive the PLL and the CPU.
7.24.2 PLL
The PLL accepts an input clock frequency in the range of 32 kHz to 50 MHz. The input
frequency is multiplied up to a high frequency, then divided down to provide the actual
clock used by the CPU and the USB block. The USB block is available in LPC2364/66/68
only.
The PLL input, in the range of 32 kHz to 50 MHz, may initially be divided down by a value
‘N’, which may be in the range of 1 to 256. This input division provides a wide range of
output frequencies from the same input frequency.
Following the PLL input divider is the PLL multiplier. This can multiply the input divider
output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the
range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to
550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a
phase-frequency detector to compare the divided CCO output to the multiplier input. The
error value is used to adjust the CCO frequency.
The PLL is turned off and bypassed following a chip Reset and by entering Power-down
mode. PLL is enabled by software only. The program must configure and activate the PLL,
wait for the PLL to Lock, then connect to the PLL as a clock source.
7.24.3 Wake-up timer
The LPC2364/65/66/67/68 begins operation at power-up and when awakened from
Power-down and Deep power-down modes by using the 4 MHz IRC oscillator as the clock
source. This allows chip operation to resume quickly. If the main oscillator or the PLL is
needed by the application, software will need to enable these features and wait for them
to stabilize before they are used as a clock source.
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When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of Reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down and Deep-power down
modes, any wake-up of the processor from Power-down mode makes use of the wake-up
Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
7.24.4 Power control
The LPC2364/65/66/67/68 supports a variety of power control features. There are four
special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode,
and Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
requirements. In addition, Peripheral Power Control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
The LPC2364/65/66/67/68 also implements a separate power domain in order to allow
turning off power to the bulk of the device while maintaining operation of the RTC and a
small SRAM, referred to as the battery RAM.
7.24.4.1
Idle mode
In Idle mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Idle mode and may generate
interrupts to cause the processor to resume execution. Idle mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.24.4.2
Sleep mode
In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The
processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Sleep mode and the logic levels of chip pins remain static. The
output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The
32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
The Sleep mode can be terminated and normal operation resumed by either a Reset or
certain specific interrupts that are able to function without clocks. Since all dynamic
operation of the chip is suspended, Sleep mode reduces chip power consumption to a
very low value. The flash memory is left on in Sleep mode, allowing a very quick wake-up.
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On the wake-up of Sleep mode, if the IRC was used before entering Sleep mode, the
code execution and peripherals activities will resume after 4 cycles expire. If the main
external oscillator was used, the code execution will resume when 4096 cycles expire.
The customers need to reconfigure the PLL and clock dividers accordingly.
7.24.4.3
Power-down mode
Power-down mode does everything that Sleep mode does, but also turns off the IRC
oscillator and the flash memory. This saves more power, but requires waiting for
resumption of flash operation before execution of code or data access in the flash memory
can be accomplished.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. In the meantime, the
flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 s flash start-up
time. When it times out, access to the flash will be allowed. The customers need to
reconfigure the PLL and clock dividers accordingly.
7.24.4.4
Deep power-down mode
Deep power-down mode is similar to the Power-down mode, but now the on-chip
regulator that supplies power to the internal logic is also shut off. This produces the lowest
possible power consumption without removing power from the entire chip. Since the Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full chip
reset.
If power is supplied to the LPC2364/65/66/67/68 during Deep power-down mode,
wake-up can be caused by the RTC Alarm interrupt or by external Reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2364/65/66/67/68 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the Battery RAM, as long as the external power
to the VBAT pin is maintained.
7.24.4.5
Power domains
The LPC2364/65/66/67/68 provides two independent power domains that allow the bulk
of the device to have power removed while maintaining operation of the RTC and the
battery RAM.
On the LPC2364/65/66/67/68, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while
the VDD(DCDC)(3V3) pin powers the on-chip DC-to-DC converter which in turn provides
power to the CPU and most of the peripherals.
Depending on the LPC2364/65/66/67/68 application, a design can use two power options
to manage power consumption.
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The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-to-DC
converter powered independently from the I/O pad ring enables shutting down of the I/O
pad power supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC and the battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that may be used by external hardware to restore chip power
and resume operation.
7.25 System control
7.25.1 Reset
Reset has four sources on the LPC2364/65/66/67/68: the RESET pin, the Watchdog
reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a
Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating
voltage attains a usable level, starts the Wake-up timer (see description in Section 7.24.3
“Wake-up timer”), causing reset to remain asserted until the external Reset is
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash
controller has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the Boot Block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
7.25.2 Brownout detection
The LPC2364/65/66/67/68 includes 2-stage monitoring of the voltage on the
VDD(DCDC)(3V3) pins. If this voltage falls below 2.95 V, the BOD asserts an interrupt signal
to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt
Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor
the signal by reading a dedicated status register.
The second stage of low-voltage detection asserts Reset to inactivate the
LPC2364/65/66/67/68 when the voltage on the VDD(DCDC)(3V3) pins falls below 2.65 V. This
Reset prevents alteration of the flash as operation of the various elements of the chip
would otherwise become unreliable due to low voltage. The BOD circuit maintains this
reset down below 1 V, at which point the power-on reset circuitry maintains the overall
Reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event
loop to sense the condition.
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7.25.3 Code security (Code Read Protection - CRP)
This feature of the LPC2364/65/66/67/68 allows user to enable different levels of security
in the system so that access to the on-chip flash and use of the JTAG and ISP can be
restricted. When needed, CRP is invoked by programming a specific pattern into a
dedicated flash location. IAP commands are not affected by the CRP.
There are three levels of the Code Read Protection.
CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is
required and flash field updates are needed but all sectors can not be erased.
CRP2 disables access to chip via the JTAG and only allows full flash erase and update
using a reduced set of the ISP commands.
Running an application with level CRP3 selected fully disables any access to chip via the
JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too.
It is up to the user’s application to provide (if needed) flash update mechanism using IAP
calls or call reinvoke ISP command to enable flash update via UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
7.25.4 AHB
The LPC2364/65/66/67/68 implement two AHBs in order to allow the Ethernet block to
operate without interference caused by other system activity. The primary AHB, referred
to as AHB1, includes the Vectored Interrupt Controller, GPDMA controller, USB interface,
and 8 kB SRAM primarily intended for use by the USB. The USB interface is available on
LPC2364/66/68 only.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the
GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters
with access to AHB2 are the ARM7 and the Ethernet block.
7.25.5 External interrupt inputs
The LPC2364/65/66/67/68 include up to 46 edge sensitive interrupt inputs combined with
up to four level sensitive external interrupt inputs as selectable pin functions. The external
interrupt inputs can optionally be used to wake up the processor from Power-down mode.
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7.25.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear at the
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot
ROM or the SRAM. This allows code running in different memory spaces to have control
of the interrupts.
7.26 Emulation and debugging
The LPC2364/65/66/67/68 support emulation and debugging via a JTAG serial port. A
trace port allows tracing program execution. Debugging and trace functions are
multiplexed only with GPIOs on P2[0] to P2[9]. This means that all communication, timer,
and interface peripherals residing on other pins are available during the development and
debugging phase as they are when the application is run in the embedded system itself.
7.26.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target
system requires a host computer running the debugger software and an EmbeddedICE
protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug
Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present
on the target system.
The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core.
The DCC allows the JTAG port to be used for sending and receiving data without affecting
the normal program flow. The DCC data and control registers are mapped in to addresses
in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG
interface to operate.
7.26.2 Embedded trace
Since the LPC2364/65/66/67/68 have significant amounts of on-chip memories, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The ETM provides real-time trace capability for deeply embedded
processor cores. It outputs information about processor execution to a trace port. A
software debugger allows configuration of the ETM using a JTAG interface and displays
the trace information that has been captured.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
Trace Port Analyzer captures the trace information under software debugger control. The
trace port can broadcast the Instruction trace information. Instruction trace (or PC trace)
shows the flow of execution of the processor and provides a list of all the instructions that
were executed. Instruction trace is significantly compressed by only broadcasting branch
addresses as well as a set of status signals that indicate the pipeline status on a cycle by
cycle basis. Trace information generation can be controlled by selecting the trigger
resource. Trigger resources include address comparators, counters and sequencers.
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Since trace information is compressed the software debugger requires a static image of
the code being executed. Self-modifying code can not be traced because of this
restriction.
7.26.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2364/65/66/67/68 contain a specific
configuration of RealMonitor software programmed into the on-chip ROM memory.
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8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external
rail
3.0
3.6
V
3.0
3.6
V
0.5
+4.6
V
0.5
+4.6
V
0.5
+4.6
V
0.5
+5.1
V
[2]
0.5
+6.0
V
other I/O pins
[2][3]
0.5
VDD(3V3) +
0.5
V
per supply pin
[4]
-
100
mA
-
100
mA
65
+150
C
-
1.5
W
2500
+2500
V
VDD(DCDC)(3V3) DC-to-DC converter supply voltage
(3.3 V)
VDDA
analog 3.3 V pad supply voltage
Vi(VBAT)
input voltage on pin VBAT
Vi(VREF)
input voltage on pin VREF
for the RTC
VIA
analog input voltage
on ADC related
pins
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD(3V3)
supply voltage is
present
supply current
IDD
ISS
ground current
per ground pin
[4]
Tstg
storage temperature
non-operating
[5]
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body
model; all pins
[1]
[6]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
LPC2364_65_66_67_68
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Single-chip 16-bit/32-bit microcontrollers
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
T j = T amb + P D R th j – a
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol
Parameter
Conditions
Tj(max)
maximum junction
temperature
Min
Typ
Max
Unit
-
-
125
C
Table 7.
Thermal resistance value (C/W): ±15 %
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
LQFP100
TFBGA100
ja
ja
JEDEC (4.5 in 4 in)
JEDEC (4.5 in 4 in)
0 m/s
37.3
0 m/s
53.9
1 m/s
32.2
1 m/s
45.5
2.5 m/s
29.5
2.5 m/s
39.5
Single-layer (4.5 in 3 in)
8-layer (4.5 in 3 in)
0 m/s
54.4
0 m/s
44.3
1 m/s
42.9
1 m/s
39.2
2.5 m/s
38.8
2.5 m/s
34.2
jc
6.7
jc
9.4
jb
12
jb
10.8
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Single-chip 16-bit/32-bit microcontrollers
10. Static characteristics
Table 8.
Static characteristics
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external rail
3.0
3.3
3.6
V
VDD(DCDC)(3V3)
DC-to-DC converter
supply voltage (3.3 V)
3.0
3.3
3.6
V
VDDA
analog 3.3 V pad supply
voltage
3.0
3.3
3.6
V
Vi(VBAT)
input voltage on pin
VBAT
2.0
3.3
3.6
V
Vi(VREF)
input voltage on pin
VREF
2.5
3.3
VDDA
V
CCLK = 10 MHz
-
15
-
mA
CCLK = 72 MHz
-
63
-
mA
CCLK = 10 MHz
-
21
-
mA
CCLK = 72 MHz
-
92
-
mA
-
27
-
mA
-
125
-
mA
-
113
-
A
-
20
-
A
-
20
-
A
-
20
-
A
IDD(DCDC)act(3V3) active mode DC-to-DC
converter supply
current (3.3 V)
[2]
VDD(DCDC)(3V3) = 3.3 V;
Tamb = 25 C; code
while(1){}
executed from flash; no
peripherals enabled;
PCLK = CCLK
all peripherals enabled;
PCLK = CCLK / 8
all peripherals enabled;
PCLK = CCLK
CCLK = 10 MHz
CCLK = 72 MHz
IDD(DCDC)pd(3V3)
Power-down mode
DC-to-DC converter
supply current (3.3 V)
VDD(DCDC)(3V3) = 3.3 V;
Tamb = 25 C
[3]
IDD(DCDC)dpd(3V3) Deep power-down
mode DC-to-DC
converter supply
current (3.3 V)
IBATact
IBAT
[3]
active mode battery
supply current
[4]
battery supply current
[3]
Deep power-down mode
Standard port pins, RESET, RTCK
IIL
LOW-level input current VI = 0 V; no pull-up
-
-
3
A
IIH
HIGH-level input
current
VI = VDD(3V3); no
pull-down
-
-
3
A
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(3V3);
no pull-up/down
-
-
3
A
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Single-chip 16-bit/32-bit microcontrollers
Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Ilatch
I/O latch-up current
(0.5VDD(3V3)) < VI <
(1.5VDD(3V3));
-
-
100
mA
0
-
5.5
V
Tj < 125 C
VI
input voltage
pin configured to provide
a digital function
[5][6]
[7][8]
VO
output voltage
0
-
VDD(3V3)
V
VIH
HIGH-level input
voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
output active
Vhys
hysteresis voltage
0.4
-
-
V
VOH
HIGH-level output
voltage
IOH = 4 mA
[9]
VDD(3V3)
0.4
-
-
V
VOL
LOW-level output
voltage
IOL = 4 mA
[9]
-
-
0.4
V
IOH
HIGH-level output
current
VOH = VDD(3V3) 0.4 V
[9]
4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
[9]
4
-
-
mA
IOHS
HIGH-level short-circuit VOH = 0 V
output current
[10]
-
-
45
mA
IOLS
LOW-level short-circuit
output current
VOL = VDDA
[10]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
[11]
10
50
150
A
Ipu
pull-up current
VI = 0 V; 40 C to +85 C
15
50
85
A
VI = 0 V; > 85 C
[12]
15
50
100
A
VDD(3V3) < VI < 5 V
[11]
0
0
0
A
0.7VDD(3V3) -
-
V
0.3VDD(3V3) V
I2C-bus pins (P0[27] and P0[28])
VIH
HIGH-level input
voltage
VIL
LOW-level input voltage
-
-
Vhys
hysteresis voltage
-
0.05VDD(3V3) -
V
-
-
V
VOL
LOW-level output
voltage
IOLS = 3 mA
[9]
ILI
input leakage current
VI = VDD(3V3)
[13]
VI = 5 V
0.4
-
2
4
A
-
10
22
A
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0.5
1.8
1.95
V
Vo(XTAL2)
output voltage on pin
XTAL2
0.5
1.8
1.95
V
Vi(RTCX1)
input voltage on pin
RTCX1
0.5
1.8
1.95
V
Vo(RTCX2)
output voltage on pin
RTCX2
0.5
1.8
1.95
V
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Single-chip 16-bit/32-bit microcontrollers
Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
0 V < VI < 3.3 V
-
-
10
A
-
-
5.25
V
USB pins (LPC2364/66/68 only)
IOZ
OFF-state output
current
VBUS
bus supply voltage
VDI
differential input
sensitivity voltage
(D+) (D)
0.2
-
-
V
VCM
differential common
mode voltage range
includes VDI range
0.8
-
2.5
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
-
2.0
V
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 k to 3.6 V
-
-
0.18
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 k to GND
2.8
-
3.5
V
Ctrans
transceiver capacitance pin to GND
-
-
20
pF
ZDRV
driver output
with 33 series resistor;
impedance for driver
steady state drive
which is not high-speed
capable
36
-
44.1
[14]
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3]
VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C.
[4]
On pin VBAT.
[5]
Including voltage on outputs in 3-state mode.
[6]
VDD(3V3) supply voltages must be present.
[7]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[8]
Please also see the errata note in errata sheet.
[9]
Accounts for 100 mV voltage drop in all supply lines.
[10] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[11] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[12] LPC2364HBD only.
[13] To VSS.
[14] Includes external resistors of 33 1 % on D+ and D.
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10.1 Power-down mode
002aae049
4
IDD(IO)
(μA)
2
VDD(3V3) = 3.3 V
VDD(3V3) = 3.0 V
0
−2
−4
−40
−15
10
35
60
85
temperature (°C)
Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 5.
I/O maximum supply current IDD(IO) versus temperature in Power-down mode
002aae050
40
IBAT
(μA)
30
Vi(VBAT) = 3.3 V
Vi(VBAT) = 3.0 V
20
10
0
−40
−15
10
35
60
85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 6.
LPC2364_65_66_67_68
Product data sheet
RTC battery maximum supply current IBATversus temperature in Power-down
mode
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Single-chip 16-bit/32-bit microcontrollers
002aae051
800
IDD(DCDC)pd(3v3)
(μA)
600
400
VDD(DCDC)(3V3) = 3.3 V
200
0
−40
VDD(DCDC)(3V3) = 3.0 V
−15
10
35
60
85
temperature (°C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.
Fig 7.
Total DC-to-DC converter supply current IDD(DCDC)pd(3V3) at different temperatures
in Power-down mode
10.2 Deep power-down mode
002aae046
300
IDD(IO)
(μA)
200
100
VDD(3V3) = 3.3 V
VDD(3V3) = 3.0 V
0
−40
−15
10
35
60
85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.
Fig 8.
LPC2364_65_66_67_68
Product data sheet
I/O maximum supply current IDD(IO) versus temperature in Deep power-down
mode
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Single-chip 16-bit/32-bit microcontrollers
002aae047
40
IBAT
(μA)
30
Vi(VBAT) = 3.3 V
Vi(VBAT) = 3.0 V
20
10
0
−40
−15
10
35
60
85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C
Fig 9.
RTC battery maximum supply current IBAT versus temperature in Deep
power-down mode
002aae048
100
IDD(DCDC)dpd(3v3)
(μA)
80
60
VDD(DCDC)(3V3) = 3.3 V
40
VDD(DCDC)(3V3) = 3.0 V
20
0
−40
−15
10
35
60
85
temperature (°C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.
Fig 10. Total DC-to-DC converter maximum supply current IDD(DCDC)dpd(3V3) versus
temperature in Deep power-down mode
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10.3 Electrical pin characteristics
002aaf112
3.6
VOH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2.0
0
8
16
24
IOH (mA)
Conditions: VDD(3V3) = 3.3 V; standard port pins.
Fig 11. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
002aaf111
15
IOL
(mA)
T = 85 °C
25 °C
−40 °C
10
5
0
0
0.2
0.4
0.6
VOL (V)
Conditions: VDD(3V3) = 3.3 V; standard port pins.
Fig 12. Typical LOW-level output current IOL versus LOW-level output voltage VOL
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11. Dynamic characteristics
Table 9.
Dynamic characteristics
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified; VDD(3V3)
over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
1
-
72
MHz
1
-
60
MHz
3.96
4
4.04
MHz
3.98
4.02
4.06
MHz
ARM processor clock frequency
operating frequency
foper
CCLK; 40 C to +85 C
CCLK; > 85 C
[3]
IRC; 40 C to +85 C
IRC; > 85 C
[3]
External clock
fosc
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
I2C-bus
pins (P0[27] and P0[28])
tf(o)
output fall time
VIH to VIL
20 + 0.1 Cb[4]
-
-
ns
SPI_MISO set-up time
Tamb = 25 C; measured
in SPI Master mode; see
Figure 15
-
11
-
ns
SSP interface
tsu(SPI_MISO)
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3]
LPC2364HBD only.
[4]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
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11.1 Internal oscillators
Table 10. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; 3.0 V VDD(3V3) 3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator frequency
-
3.96
4.02
4.04
MHz
fi(RTC)
RTC input frequency
-
-
32.768
-
kHz
Max
Unit
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
11.2 I/O pins
Table 11. Dynamic characteristic: I/O pins[1]
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
Symbol
Parameter
Conditions
Min
Typ
tr
rise time
pin configured as output
3.0
-
5.0
ns
tf
fall time
pin configured as output
2.5
-
5.0
ns
[1]
Applies to standard I/O pins and RESET pin.
11.3 USB interface
Table 12. Dynamic characteristics of USB pins (full-speed) (LPC2364/66/68 only)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3), unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
10 % to 90 %
8.5
-
13.8
ns
tf
fall time
10 % to 90 %
7.7
-
13.7
ns
tFRFM
differential rise and fall time
matching
tr / tf
-
-
109
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
tFEOPT
source SE0 interval of EOP
see Figure 14
160
-
175
ns
tFDEOP
source jitter for differential transition
to SE0 transition
see Figure 14
2
-
+5
ns
tJR1
receiver jitter to next transition
18.5
-
+18.5
ns
tJR2
receiver jitter for paired transitions
10 % to 90 %
9
-
+9
ns
tEOPR1
EOP width at receiver
must reject as
EOP; see
Figure 14
[1]
40
-
-
ns
tEOPR2
EOP width at receiver
must accept as
EOP; see
Figure 14
[1]
82
-
-
ns
[1]
Characterized but not implemented as production test. Guaranteed by design.
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11.4 Flash memory
Table 13. Dynamic characteristics of flash
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified;
VDD(3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground.
Symbol
Parameter
Nendu
endurance
tret
retention time
ter
erase time
tprog
programming time
Conditions
Min
[1]
Typ
Max
Unit
10000
100000
-
cycles
powered; 100 cycles
10
-
-
years
unpowered; 100 cycles
20
-
-
years
sector or multiple
consecutive sectors
95
100
105
ms
0.95
1
1.05
ms
[2]
[1]
Number of program/erase cycles.
[2]
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
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11.5 Timing
TPERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: tFEOPT
differential data to
SE0/EOP skew
n × TPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 14. Differential data-to-EOP transition skew and EOP width
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 15. MISO line set-up time in SSP Master mode
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Single-chip 16-bit/32-bit microcontrollers
12. ADC electrical characteristics
Table 14. ADC characteristics
VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C, unless otherwise specified; ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
ED
differential linearity error
Conditions
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
1
pF
[1][2][3]
-
-
1
LSB
integral non-linearity
[1][4]
-
-
2
LSB
offset error
[1][5]
-
-
3
LSB
EG
gain error
[1][6]
-
-
0.5
%
ET
absolute error
[1][7]
-
-
4
LSB
[8]
-
-
40
k
EL(adj)
EO
voltage source interface
resistance
Rvsi
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 16.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 16.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 16.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 16.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 16.
[8]
See Figure 17.
LPC2364_65_66_67_68
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offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
1 LSB =
Vi(VREF) − VSSA
1024
002aae604
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 16. ADC characteristics
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LPC23XX
20 kΩ
AD0[y]
AD0[y]SAMPLE
3 pF
Rvsi
5 pF
VEXT
VSS
002aac610
Fig 17. Suggested ADC interface - LPC2364/65/66/67/68 AD0[y] pin
LPC2364_65_66_67_68
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13. DAC electrical characteristics
Table 15. DAC electrical characteristics
VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified
Symbol
Parameter
ED
Conditions
Min
Typ
Max
Unit
differential linearity error
-
1
-
LSB
EL(adj)
integral non-linearity
-
1.5
-
LSB
EO
offset error
-
0.6
-
%
EG
gain error
-
0.6
-
%
CL
load capacitance
-
200
-
pF
RL
load resistance
1
-
-
k
14. Application information
14.1 Suggested USB interface solutions (LPC2364/66/68 only)
VDD(3V3)
USB_UP_LED
USB_CONNECT
LPC23XX
SoftConnect switch
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB_D−
USB-B
connector
RS = 33 Ω
VSS
002aac578
Fig 18. LPC2364/66/68 USB interface on a self-powered device
LPC2364_65_66_67_68
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VDD(3V3)
R2
LPC23XX
USB_UP_LED
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB-B
connector
USB_D− RS = 33 Ω
VSS
002aac579
Fig 19. LPC2364/66/68 USB interface on a bus-powered device
14.2 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In
slave mode, a minimum of 200 mV (RMS) is needed.
LPC2xxx
XTAL1
Ci
100 pF
Cg
002aae718
Fig 20. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 20), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTAL2 pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 21 and in
Table 16 and Table 17. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 21 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
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LPC2xxx
L
XTAL1
XTAL2
=
CL
CP
XTAL
RS
CX2
CX1
002aag469
Fig 21. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 16.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
1 MHz to 5 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 300
39 pF, 39 pF
30 pF
< 300
57 pF, 57 pF
10 pF
< 300
18 pF, 18 pF
20 pF
< 200
39 pF, 39 pF
5 MHz to 10 MHz
10 MHz to 15 MHz
15 MHz to 20 MHz
Table 17.
Product data sheet
< 100
57 pF, 57 pF
< 160
18 pF, 18 pF
20 pF
< 60
39 pF, 39 pF
10 pF
< 80
18 pF, 18 pF
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180
18 pF, 18 pF
20 pF
< 100
39 pF, 39 pF
10 pF
< 160
18 pF, 18 pF
20 pF
< 80
39 pF, 39 pF
20 MHz to 25 MHz
LPC2364_65_66_67_68
30 pF
10 pF
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14.3 RTC 32 kHz oscillator component selection
LPC2xxx
L
RTCX1
RTCX2
=
CL
CP
32 kHz XTAL
RS
CX1
CX2
002aaf495
Fig 22. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for CX1/CX2 evaluation
The RTC external oscillator circuit is shown in Figure 22. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected
externally to the microcontroller.
Table 18 gives the crystal parameters that should be used. CL is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
CL influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 18
that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in
this table are calculated from the internal parasitic capacitances and the CL. Parasitics
from PCB and package are not taken into account.
Table 18.
Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components
Crystal load capacitance Maximum crystal series
CL
resistance RS
External load capacitors CX1/CX2
11 pF
< 100 k
18 pF, 18 pF
13 pF
< 100 k
22 pF, 22 pF
15 pF
< 100 k
27 pF, 27 pF
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
LPC2364_65_66_67_68
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14.5 Standard I/O pin configuration
Figure 23 shows the possible pin modes for standard I/O pins with analog input function:
•
•
•
•
Digital output driver
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Analog input (for ADC input channels)
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
VDD
output enable
pin configured
as digital output
driver
ESD
output
PIN
ESD
VDD
VSS
weak
pull-up
pull-up enable
weak
pull-down
pin configured
as digital input
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aaf496
Fig 23. Standard I/O pin configuration with analog input
LPC2364_65_66_67_68
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14.6 Reset pin configuration
VDD
VDD
VDD
Rpu
reset
ESD
20 ns RC
GLITCH FILTER
PIN
ESD
VSS
002aaf274
Fig 24. Reset pin configuration
LPC2364_65_66_67_68
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15. Package outline
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
pin 1 index
L
100
detail X
26
1
25
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
1.15
0.85
1.15
0.85
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
Fig 25. Package outline SOT407-1 (LQFP100)
LPC2364_65_66_67_68
Product data sheet
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TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
B
D
SOT926-1
A
ball A1
index area
A2
E
A
A1
detail X
e1
e
∅v
∅w
b
1/2 e
C
M
M
C A B
C
y
y1 C
K
J
e
H
G
F
e2
E
D
1/2 e
C
B
A
ball A1
index area
1
2
3
4
5
6
7
8
9
10
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.2
0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
0.8
7.2
7.2
0.15
0.05
0.08
0.1
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT926-1
---
---
---
EUROPEAN
PROJECTION
ISSUE DATE
05-12-09
05-12-22
Fig 26. Package outline SOT926-1 (TFBGA100)
LPC2364_65_66_67_68
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16. Abbreviations
Table 19.
LPC2364_65_66_67_68
Product data sheet
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CAN
Controller Area Network
DAC
Digital-to-Analog Converter
DCC
Debug Communication Channel
DMA
Direct Memory Access
DSP
Digital Signal Processing
EOP
End Of Packet
ETM
Embedded Trace Macrocell
GPIO
General Purpose Input/Output
IrDA
Infrared Data Association
JTAG
Joint Test Action Group
MII
Media Independent Interface
MIIM
Media Independent Interface Management
PHY
Physical Layer
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RMII
Reduced Media Independent Interface
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
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17. Revision history
Table 20.
Revision history
Document ID
Release date
Data sheet status
Change
notice
Supersedes
LPC2364_65_66_67_68 v.7.1
20131016
Product data sheet
-
LPC2364_65_66_67_68 v.7
Modifications:
LPC2364_65_66_67_68 v.7
Modifications:
•
•
Product data sheet
Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
20111020
Product data sheet
-
LPC2364_65_66_67_68 v.6
•
•
•
Table 13 “Dynamic characteristics of flash”: Added characteristics for ter and tprog.
•
Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.”
for DBGEN, TMS, TDI, TRST, and RTCK pins.
•
Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no
built-in pull-down resistor.” for TCK and TDO pins.
•
•
Table 5 “Limiting values”: Added “non-operating” to conditions column of Tstg.
•
•
•
•
•
Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150.
•
•
•
•
•
•
•
•
LPC2364_65_66_67_68
Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns.
Table 4 “Pin description”: Updated description for USB_UP_LED.
Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can
be left floating.” for RTCX1 and RTCX2 pins.
Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating
storage temperature is different than the temperature for required shelf life which
should be determined based on required shelf lifetime. Please refer to the JEDEC
spec (J-STD-033B.1) for further details.”.
Added Table 7 “Thermal resistance value (C/W): ±15 %”.
Added Table 10 “Dynamic characteristic: internal oscillators”.
Added Table 11 “Dynamic characteristic: I/O pins[1]”.
Table 8 “Static characteristics”: Changed Vhys typ value from 0.5VDD(3V3) to
0.05VDD(3V3).
Table 13 “Dynamic characteristics of flash”: Updated table.
Added Section 9 “Thermal characteristics”.
Added Section 10.3 “Electrical pin characteristics”.
Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
Added Section 14.3 “RTC 32 kHz oscillator component selection”.
Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
Added Section 14.5 “Standard I/O pin configuration”.
Added Section 14.6 “Reset pin configuration”.
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Table 20.
Revision history …continued
Document ID
Release date
Data sheet status
Change
notice
Supersedes
LPC2364_65_66_67_68 v.6
20100201
Product data sheet
-
LPC2364_65_66_67_68 v.5
Modifications:
LPC2364_65_66_67_68 v.5
Modifications:
•
•
•
Table 5 “Limiting values”: Changed VESD min/max to 2500/+2500.
Table 6: Updated min, typical and max values for oscillator pins.
Table 6: Updated conditions and typical values for IDD(DCDC)pd(3V3), IBATact;
IDD(DCDC)dpd(3V3) and IBAT added.
•
Table 9 “Dynamic characteristics of flash”: Changed flash endurance spec from
100000 to 10000 minimum cycles.
•
•
Added Table 11 “DAC electrical characteristics”.
•
•
•
•
•
•
Added Section 7.24.4.4 “Deep power-down mode”.
Section 7.2 “On-chip flash programming memory”: Removed text regarding flash
endurance minimum specs.
Section 7.25.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).
Added Section 9.2 “Deep power-down mode”.
Added Section 13.2 “XTAL1 input”.
Added Section 13.3 “XTAL and RTC Printed-Circuit Board (PCB) layout guidelines”.
Added table note for XTAL1 and XTAL2 pins in Table 3.
20090409
•
•
•
•
•
•
•
•
•
•
•
Product data sheet
-
LPC2364_65_66_67_68 v.4
Added part LPC2364HBD100.
Section 7.2: Added sentence clarifying SRAM speeds for LPC2364HBD.
Table 5: Updated Vesd min/max.
Table 6: Updated ZDRV Table note [14].
Table 6: Vhys, moved 0.4 from typ to min column.
Table 6: Ipu, added specs for >85 C.
Table 6: Removed Rpu.
Table 7: CCLK and IRC, added specs for >85 C.
Added Table 9.
Updated Figure 14.
Updated Figure 11.
LPC2364_65_66_67_68 v.4
20080417
Product data sheet
LPC2364_66_68 v.3
20071220
Product data sheet
-
LPC2364_66_68 v.2
LPC2364_66_68 v.2
20071001
Preliminary data sheet
-
LPC2364_66_68 v.1
LPC2364_66_68 v.1
20070103
Preliminary data sheet
-
-
LPC2364_65_66_67_68
Product data sheet
-
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LPC2364_66_68 v.3
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
LPC2364_65_66_67_68
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
66 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC2364_65_66_67_68
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
67 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
20. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.5.1
7.6
7.7
7.7.1
7.8
7.8.1
7.9
7.9.1
7.10
7.10.1
7.10.2
7.11
7.11.1
7.12
7.12.1
7.13
7.13.1
7.14
7.14.1
7.15
7.15.1
7.16
7.16.1
7.17
7.17.1
7.18
7.18.1
7.19
7.19.1
7.20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10
Functional description . . . . . . . . . . . . . . . . . . 18
Architectural overview . . . . . . . . . . . . . . . . . . 18
On-chip flash programming memory . . . . . . . 19
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 19
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 19
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 20
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 21
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 21
General purpose DMA controller . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fast general purpose parallel I/O . . . . . . . . . . 22
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
USB interface (LPC2364/66/68 only) . . . . . . . 24
USB device controller . . . . . . . . . . . . . . . . . . . 24
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
CAN controller and acceptance filters
(LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 25
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SSP serial I/O controller . . . . . . . . . . . . . . . . . 27
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SD/MMC card interface (LPC2367/68 only) . . 27
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
I2C-bus serial I/O controllers. . . . . . . . . . . . . . 27
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I2S-bus serial I/O controllers. . . . . . . . . . . . . . 28
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . . 29
7.20.1
7.21
7.21.1
7.22
7.22.1
7.23
7.23.1
7.24
7.24.1
7.24.1.1
7.24.1.2
7.24.1.3
7.24.2
7.24.3
7.24.4
7.24.4.1
7.24.4.2
7.24.4.3
7.24.4.4
7.24.4.5
7.25
7.25.1
7.25.2
7.25.3
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pulse width modulator . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC and battery RAM . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking and power control . . . . . . . . . . . . . .
Crystal oscillators . . . . . . . . . . . . . . . . . . . . . .
Internal RC oscillator . . . . . . . . . . . . . . . . . . .
Main oscillator . . . . . . . . . . . . . . . . . . . . . . . .
RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . .
PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . .
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-down mode . . . . . . . . . . . . . . . . . . . . .
Deep power-down mode . . . . . . . . . . . . . . . .
Power domains . . . . . . . . . . . . . . . . . . . . . . .
System control . . . . . . . . . . . . . . . . . . . . . . . .
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Brownout detection . . . . . . . . . . . . . . . . . . . .
Code security
(Code Read Protection - CRP) . . . . . . . . . . .
7.25.4
AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.25.5
External interrupt inputs . . . . . . . . . . . . . . . . .
7.25.6
Memory mapping control . . . . . . . . . . . . . . . .
7.26
Emulation and debugging . . . . . . . . . . . . . . .
7.26.1
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
7.26.2
Embedded trace. . . . . . . . . . . . . . . . . . . . . . .
7.26.3
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
9
Thermal characteristics . . . . . . . . . . . . . . . . .
10
Static characteristics . . . . . . . . . . . . . . . . . . .
10.1
Power-down mode . . . . . . . . . . . . . . . . . . . . .
10.2
Deep power-down mode . . . . . . . . . . . . . . . .
10.3
Electrical pin characteristics. . . . . . . . . . . . . .
11
Dynamic characteristics. . . . . . . . . . . . . . . . .
11.1
Internal oscillators . . . . . . . . . . . . . . . . . . . . .
11.2
I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.3
USB interface. . . . . . . . . . . . . . . . . . . . . . . . .
11.4
Flash memory . . . . . . . . . . . . . . . . . . . . . . . .
11.5
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
ADC electrical characteristics . . . . . . . . . . . .
13
DAC electrical characteristics . . . . . . . . . . . .
14
Application information . . . . . . . . . . . . . . . . .
29
29
30
30
30
31
31
31
31
32
32
32
32
32
33
33
33
34
34
34
35
35
35
36
36
36
37
37
37
37
38
39
40
41
44
45
47
48
49
49
49
50
51
52
55
55
continued >>
LPC2364_65_66_67_68
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
68 of 69
LPC2364/65/66/67/68
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
14.1
14.2
14.3
14.4
14.5
14.6
15
16
17
18
18.1
18.2
18.3
18.4
19
20
Suggested USB interface solutions
(LPC2364/66/68 only). . . . . . . . . . . . . . . . . . .
Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC 32 kHz oscillator component selection . .
XTAL and RTCX Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . .
Standard I/O pin configuration . . . . . . . . . . . .
Reset pin configuration . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
55
56
58
58
59
60
61
63
64
66
66
66
66
67
67
68
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 October 2013
Document identifier: LPC2364_65_66_67_68
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