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LPC2378

LPC2378

  • 厂商:

    NXP(恩智浦)

  • 封装:

  • 描述:

    LPC2378 - Single-chip 16-bit/32-bit microcontroller; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, C...

  • 数据手册
  • 价格&库存
LPC2378 数据手册
LPC2377/78 Single-chip 16-bit/32-bit microcontroller; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC Rev. 04 — 19 November 2008 Product data sheet 1. General description The LPC2377/78 microcontroller is based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. The LPC2377/78 is ideal for multi-purpose serial communication applications. It incorporates a 10/100 Ethernet Media Access Controller (MAC), USB full speed device with 4 kB of endpoint RAM (LPC2378 only), four UARTs, two CAN channels (LPC2378 only), an SPI interface, two Synchronous Serial Ports (SSP), three I2C-bus interfaces, an I2S-bus interface, and an External Memory Controller (EMC). This blend of serial communications interfaces combined with an on-chip 4 MHz internal oscillator, SRAM of 32 kB, 16 kB SRAM for Ethernet, 8 kB SRAM for USB and general purpose use, together with 2 kB battery powered SRAM make this device very well suited for communication gateways and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, PWM unit, a CAN control unit, and up to 104 fast GPIO lines with up to 50 edge and up to four level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems. 2. Features I ARM7TDMI-S processor, running at up to 72 MHz. I Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. Flash program memory is on the ARM local bus for high performance CPU access. I 32 kB of SRAM on the ARM local bus for high performance CPU access. I 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM. I 8 kB SRAM for general purpose DMA use also accessible by the USB. I Dual Advanced High-performance Bus (AHB) system that provides for simultaneous Ethernet DMA, USB DMA, and program execution from on-chip flash with no contention between those functions. A bus bridge allows the Ethernet DMA to access the other AHB subsystem. I EMC provides support for static devices such as flash and SRAM as well as off-chip memory mapped peripherals. I Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts. NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller I General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP serial interfaces, the I2S port, and the Secure Digital/MultiMediaCard (SD/MMC) card port, as well as for memory-to-memory transfers. I Serial Interfaces: N Ethernet MAC with associated DMA controller. These functions reside on an independent AHB. N USB 2.0 full-speed device with on-chip PHY and associated DMA controller (LPC2378 only). N Four UARTs with fractional baud rate generation, one with modem control I/O, one with IrDA support, all with FIFO. N CAN controller with two channels (LPC2378 only). N SPI controller. N Two SSP controllers with FIFO and multi-protocol capabilities. One is an alternate for the SPI port, sharing its interrupt and pins. These can be used with the GPDMA controller. N Three I2C-bus interfaces (one with open-drain and two with standard port pins). N I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA. I Other peripherals: N SD/MMC memory card interface. N 104 General purpose I/O pins with configurable pull-up/down resistors. N 10-bit ADC with input multiplexing among 8 pins. N 10-bit DAC. N Four general purpose timers/counters with 8 capture inputs and 10 compare outputs. Each timer block has an external count input. N One PWM/timer block with support for three-phase motor control. The PWM has two external count inputs. N Real-Time Clock (RTC) with separate power pin, clock source can be the RTC oscillator or the APB clock. N 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the rest of the chip is powered off. N WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock. I Standard ARM test/debug interface for compatibility with existing tools. I Emulation trace module supports real-time trace. I Single 3.3 V power supply (3.0 V to 3.6 V). I Three reduced power modes: idle, sleep, and power-down. I Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0 and PORT2 can be used as edge sensitive interrupt sources. I Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt). I Two independent power domains allow fine tuning of power consumption based on needed features. I Each peripheral has its own clock divider for further power saving. I Brownout detect with separate thresholds for interrupt and forced reset. I On-chip power-on reset. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 2 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller I On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz. I 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as the system clock. When used as the CPU clock, does not allow CAN and USB to run. I On-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator. I Boundary scan for simplified board testing. I Versatile pin function selections allow more possibilities for using on-chip peripheral functions. 3. Applications I I I I Industrial control Medical systems Protocol converter Communications 4. Ordering information Table 1. Ordering information Package Name LPC2377FBD144 LPC2378FBD144 LQFP144 LQFP144 Description plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm Version SOT486-1 SOT486-1 Type number 4.1 Ordering options Table 2. Ordering options Flash (kB) Local bus SRAM (kB) Ethernet buffer External bus Ether net USB device + 4 kB FIFO SD/ GP MMC DMA CAN channels ADC channels yes yes 8 yes yes 8 DAC channels 1 −40 °C to +85 °C −40 °C to +85 °C 1 Temp range Type number GP/USB LPC2377FBD144 512 32 16 8 2 58 MiniBus: 8 data, 16 address, and 2 chip select lines 58 MiniBus: 8 data, 16 address, and 2 chip select lines Total RTC RMII no - LPC2378FBD144 512 32 16 8 2 RMII yes 2 LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 3 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 5. Block diagram XTAL1 VDD(3V3) XTAL2 TMS TDI trace signals TRST TCK TDO EXTIN0 DBGEN RESET VDDA VREF VSSA, VSS VDD(DCDC)(3V3) TEST/DEBUG INTERFACE EMULATION TRACE MODULE P0, P1, P2, P3, P4 LPC2377/78 32 kB SRAM 512 kB FLASH PLL system clock SYSTEM FUNCTIONS INTERNAL RC OSCILLATOR HIGH-SPEED GPI/O 104 PINS TOTAL INTERNAL CONTROLLERS SRAM FLASH ARM7TDMI-S VECTORED INTERRUPT CONTROLLER AHB BRIDGE EXTERNAL MEMORY CONTROLLER D[7:0] A[15:0] OE, CS0, CS1, BLS0 AHB2 AHB BRIDGE AHB1 RMII(8) ETHERNET MAC WITH DMA 16 kB SRAM MASTER AHB TO SLAVE PORT AHB BRIDGE PORT AHB TO APB BRIDGE 8 kB SRAM USB WITH 4 kB RAM AND DMA(1) VBUS 2 × USB_D+/USB_D− 2 × USB_CONNECT 2 × USB_UP_LED GP DMA CONTROLLER I2SRX_CLK I2STX_CLK I2SRX_WS I2STX_WS I2SRX_SDA I2STX_SDA SCK, SCK0 MOSI, MOSI0 MISO, MISO0 SSEL, SSEL0 SCK1 MOSI1 MISO1 SSEL1 MCICLK, MCIPWR MCICMD, MCIDAT[3:0] TXD0, TXD2, TXD3 RXD0, RXD2, RXD3 TXD1 RXD1 DTR1, RTS1 DSR1, CTS1, DCD1, RI1 CAN1, CAN2(1) RD1, RD2 TD1, TD2 SCL0, SCL1, SCL2 SDA0, SDA1, SDA2 EINT3 to EINT0 P0, P2 2 × CAP0/CAP1/ CAP2/CAP3 4 × MAT2, 2 × MAT0/MAT1/ MAT3 6 × PWM1 2 × PCAP1 EXTERNAL INTERRUPTS CAPTURE/COMPARE TIMER0/TIMER1/ TIMER2/TIMER3 I2S INTERFACE PWM1 SPI, SSP0 INTERFACE P0, P1 LEGACY GPI/O 56 PINS TOTAL SSP1 INTERFACE 8 × AD0 A/D CONVERTER SD/MMC CARD INTERFACE AOUT VBAT power domain 2 RTCX1 RTCX2 ALARM D/A CONVERTER UART0, UART2, UART3 2 kB BATTERY RAM RTC OSCILLATOR REALTIME CLOCK UART1 WATCHDOG TIMER SYSTEM CONTROL I2C0, I2C1, I2C2 002aac574 (1) LPC2378 only. Fig 1. LPC2377/78 block diagram LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 4 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 6. Pinning information 6.1 Pinning 144 109 108 73 37 72 002aac584 1 LPC2377FBD144 LPC2378FBD144 36 Fig 2. LPC2377/78 pinning 6.2 Pin description Table 3. Symbol P0[0] to P0[31] Pin description Pin Type I/O Description Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the pin connect block. P0[0] — General purpose digital input/output pin. RD1 — CAN1 receiver input. (LPC2378 only) TXD3 — Transmitter output for UART3. SDA1 — I2C1 data input/output (this is not an open-drain pin). P0[1] — General purpose digital input/output pin. TD1 — CAN1 transmitter output. (LPC2378 only) RXD3 — Receiver input for UART3. SCL1 — I2C1 clock input/output (this is not an open-drain pin). P0[2] — General purpose digital input/output pin. TXD0 — Transmitter output for UART0. P0[3] — General purpose digital input/output pin. RXD0 — Receiver input for UART0. P0[4] — General purpose digital input/output pin. I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. RD2 — CAN2 receiver input. (LPC2378 only) CAP2[0] — Capture input for Timer 2, channel 0. P0[0]/RD1/TXD/ SDA1 66[1] I/O I O I/O P0[1]/TD1/RXD3/ SCL1 67[1] I/O O I I/O P0[2]/TXD0 P0[3]/RXD0 P0[4]/ I2SRX_CLK/ RD2/CAP2[0] 141[1] 142[1] 116[1] I/O O I/O I I/O I/O I I LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 5 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin 115[1] Type I/O I/O O I Description P0[5] — General purpose digital input/output pin. I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. TD2 — CAN2 transmitter output. (LPC2378 only) CAP2[1] — Capture input for Timer 2, channel 1. P0[6] — General purpose digital input/output pin. I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. SSEL1 — Slave Select for SSP1. MAT2[0] — Match output for Timer 2, channel 0. P0[7] — General purpose digital input/output pin. I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. SCK1 — Serial Clock for SSP1. MAT2[1] — Match output for Timer 2, channel 1. P0[8] — General purpose digital input/output pin. I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. MISO1 — Master In Slave Out for SSP1. MAT2[2] — Match output for Timer 2, channel 2. P0[9] — General purpose digital input/output pin. I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. MOSI1 — Master Out Slave In for SSP1. MAT2[3] — Match output for Timer 2, channel 3. P0[10] — General purpose digital input/output pin. TXD2 — Transmitter output for UART2. SDA2 — I2C2 data input/output (this is not an open-drain pin). MAT3[0] — Match output for Timer 3, channel 0. P0[11] — General purpose digital input/output pin. RXD2 — Receiver input for UART2. SCL2 — I2C2 clock input/output (this is not an open-drain pin). MAT3[1] — Match output for Timer 3, channel 1. P0[12] — General purpose digital input/output pin. MISO1 — Master In Slave Out for SSP1. AD0[6] — A/D converter 0, input 6. P0[13] — General purpose digital input/output pin. USB_UP_LED2 — USB2 Good Link LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. (LPC2378 only) MOSI1 — Master Out Slave In for SSP1. AD0[7] — A/D converter 0, input 7. P0[5]/ I2SRX_WS/ TD2/CAP2[1] P0[6]/ I2SRX_SDA/ SSEL1/MAT2[0] 113[1] I/O I/O I/O O P0[7]/ I2STX_CLK/ SCK1/MAT2[1] 112[1] I/O I/O I/O O P0[8]/ I2STX_WS/ MISO1/MAT2[2] 111[1] I/O I/O I/O O P0[9]/ I2STX_SDA/ MOSI1/MAT2[3] 109[1] I/O I/O I/O O P0[10]/TXD2/ SDA2/MAT3 [0] 69[1] I/O O I/O O P0[11]/RXD2/ SCL2/MAT3[1] 70[1] I/O I I/O O P0[12]/MISO1/ AD0[6] 29[2] I/O I/O I P0[13]/ USB_UP_LED2/ MOSI1/AD0[7] 32[2] I/O O I/O I LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 6 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin Type I/O O Description P0[14] — General purpose digital input/output pin. USB_CONNECT2 — USB2 Soft Connect control. Signal used to switch an external 1.5 kΩ resistor under software control. Used with the SoftConnect USB feature. (LPC2378 only) SSEL1 — Slave Select for SSP1. P0[15] — General purpose digital input/output pin. TXD1 — Transmitter output for UART1. SCK0 — Serial clock for SSP0. SCK — Serial clock for SPI. P0 [16] — General purpose digital input/output pin. RXD1 — Receiver input for UART1. SSEL0 — Slave Select for SSP0. SSEL — Slave Select for SPI. P0[17] — General purpose digital input/output pin. CTS1 — Clear to Send input for UART1. MISO0 — Master In Slave Out for SSP0. MISO — Master In Slave Out for SPI. P0[18] — General purpose digital input/output pin. DCD1 — Data Carrier Detect input for UART1. MOSI0 — Master Out Slave In for SSP0. MOSI — Master Out Slave In for SPI. P0[19] — General purpose digital input/output pin. DSR1 — Data Set Ready input for UART1. MCICLK — Clock output line for SD/MMC interface. SDA1 — I2C1 data input/output (this is not an open-drain pin). P0[20] — General purpose digital input/output pin. DTR1 — Data Terminal Ready output for UART1. MCICMD — Command line for SD/MMC interface. SCL1 — I2C1 clock input/output (this is not an open-drain pin). P0[21] — General purpose digital input/output pin. RI1 — Ring Indicator input for UART1. MCIPWR — Power Supply Enable for external SD/MMC power supply. RD1 — CAN1 receiver input. (LPC2378 only) P0[22] — General purpose digital input/output pin. RTS1 — Request to Send output for UART1. MCIDAT0 — Data line for SD/MMC interface. TD1 — CAN1 transmitter output. (LPC2378 only) P0[23] — General purpose digital input/output pin. AD0[0] — A/D converter 0, input 0. I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. CAP3[0] — Capture input for Timer 3, channel 0. © NXP B.V. 2008. All rights reserved. P0[14]/ 48[1] USB_CONNECT2/ SSEL1 I/O P0[15]/TXD1/ SCK0/SCK 89[1] I/O O I/O I/O P0[16]/RXD1/ SSEL0/SSEL 90[1] I/O I I/O I/O P0[17]/CTS1/ MISO0/MISO 87[1] I/O I I/O I/O P0[18]/DCD1/ MOSI0/MOSI 86[1] I/O I I/O I/O P0[19]/DSR1/ MCICLK/SDA1 85[1] I/O I O I/O P0[20]/DTR1/ MCICMD/SCL1 83[1] I/O O I I/O P0[21]/RI1/ MCIPWR/RD1 82[1] I/O I O I P0[22]/RTS1/ MCIDAT0/TD1 80[1] I/O O O O P0[23]/AD0[0]/ I2SRX_CLK/ CAP3[0] 13[2] I/O I I/O I LPC2377_78_4 Product data sheet Rev. 04 — 19 November 2008 7 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin 11[3] Type I/O I I/O I Description P0[24] — General purpose digital input/output pin. AD0[1] — A/D converter 0, input 1. I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. CAP3[1] — Capture input for Timer 3, channel 1. P0[25] — General purpose digital input/output pin. AD0[2] — A/D converter 0, input 2. I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. TXD3 — Transmitter output for UART3. P0[26] — General purpose digital input/output pin. AD0[3] — A/D converter 0, input 3. AOUT — D/A converter output. RXD3 — Receiver input for UART3. P0[27] — General purpose digital input/output pin. Output is open-drain. SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance). P0[28] — General purpose digital input/output pin. Output is open-drain. SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance). P0[29] — General purpose digital input/output pin. USB_D+1 — USB1 port bidirectional D+ line. (LPC2378 only) P0[30] — General purpose digital input/output pin. USB_D−1 — USB1 port bidirectional D− line. (LPC2378 only) P0[31] — General purpose digital input/output pin. USB_D+2 — USB2 port bidirectional D+ line. (LPC2378 only) Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available. P1[0] — General purpose digital input/output pin. ENET_TXD0 — Ethernet transmit data 0. P1[1] — General purpose digital input/output pin. ENET_TXD1 — Ethernet transmit data 1. P1[4] — General purpose digital input/output pin. ENET_TX_EN — Ethernet transmit data enable. P1[8] — General purpose digital input/output pin. ENET_CRS — Ethernet carrier sense. P1[9] — General purpose digital input/output pin. ENET_RXD0 — Ethernet receive data. P1[10] — General purpose digital input/output pin. ENET_RXD1 — Ethernet receive data. P1[14] — General purpose digital input/output pin. ENET_RX_ER — Ethernet receive error. P0[24]/AD0[1]/ I2SRX_WS/ CAP3[1] P0[25]/AD0[2]/ I2SRX_SDA/ TXD3 10[2] I/O I I/O O P0[26]/AD0[3]/ AOUT/RXD3 8[2] I/O I O I P0[27]/SDA0 P0[28]/SCL0 P0[29]/USB_D+1 P0[30]/USB_D−1 P0[31]/USB_D+2 P1[0] to P1[31] 35[4] 34[4] 42[5] 43[5] 36[5] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P1[0]/ ENET_TXD0 P1[1]/ ENET_TXD1 P1[4]/ ENET_TX_EN P1[8]/ ENET_CRS P1[9]/ ENET_RXD0 P1[10]/ ENET_RXD1 P1[14]/ ENET_RX_ER 136[1] 135[1] 133[1] 132[1] 131[1] 129[1] 128[1] I/O O I/O O I/O O I/O I I/O I I/O I I/O I LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 8 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin 126[1] 125[1] 123[1] 46[1] Type I/O I I/O O I/O I/O I/O O Description P1[15] — General purpose digital input/output pin. ENET_REF_CLK/ENET_RX_CLK — Ethernet receiver clock. P1[16] — General purpose digital input/output pin. ENET_MDC — Ethernet MIIM clock. P1[17] — General purpose digital input/output pin. ENET_MDIO — Ethernet MIIM data input and output. P1[18] — General purpose digital input/output pin. USB_UP_LED1 — USB1 port Good Link LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. (LPC2378 only) PWM1[1] — Pulse Width Modulator 1, channel 1 output. CAP1[0] — Capture input for Timer 1, channel 0. P1[19] — General purpose digital input/output pin. CAP1[1] — Capture input for Timer 1, channel 1. P1[20] — General purpose digital input/output pin. PWM1[2] — Pulse Width Modulator 1, channel 2 output. SCK0 — Serial clock for SSP0. P1[21] — General purpose digital input/output pin. PWM1[3] — Pulse Width Modulator 1, channel 3 output. SSEL0 — Slave Select for SSP0. P1[22] — General purpose digital input/output pin. MAT1[0] — Match output for Timer 1, channel 0. P1[23] — General purpose digital input/output pin. PWM1[4] — Pulse Width Modulator 1, channel 4 output. MISO0 — Master In Slave Out for SSP0. P1[24] — General purpose digital input/output pin. PWM1[5] — Pulse Width Modulator 1, channel 5 output. MOSI0 — Master Out Slave in for SSP0. P1[25] — General purpose digital input/output pin. MAT1[1] — Match output for Timer 1, channel 1. P1[26] — General purpose digital input/output pin. PWM1[6] — Pulse Width Modulator 1, channel 6 output. CAP0[0] — Capture input for Timer 0, channel 0. P1[27] — General purpose digital input/output pin. CAP0[1] — Capture input for Timer 0, channel 1. P1[28] — General purpose digital input/output pin. PCAP1[0] — Capture input for PWM1, channel 0. MAT0[0] — Match output for Timer 0, channel 0. P1[29] — General purpose digital input/output pin. PCAP1[1] — Capture input for PWM1, channel 1. MAT0[1] — Match output for Timer 0, channel 0. © NXP B.V. 2008. All rights reserved. P1[15]/ ENET_REF_CLK P1[16]/ ENET_MDC P1[17]/ ENET_MDIO P1[18]/ USB_UP_LED1/ PWM1[1]/ CAP1[0] O I P1[19]/CAP1[1] P1[20]/PWM1[2]/ SCK0 47[1] 49[1] I/O I I/O O I/O P1[21]/PWM1[3]/ SSEL0 50[1] I/O O I/O P1[22]/MAT1[0] P1[23]/PWM1[4]/ MISO0 51[1] 53[1] I/O O I/O O I/O P1[24]/PWM1[5]/ MOSI0 54[1] I/O O I/O P1[25]/MAT1[1] P1[26]/PWM1[6]/ CAP0[0] 56[1] 57[1] I/O O I/O O I P1[27]/CAP0[1] P1[28]/ PCAP1[0]/ MAT0[0] P1[29]/ PCAP1[1]/ MAT0[1] 61[1] 63[1] I/O I I/O I O 64[1] I/O I O LPC2377_78_4 Product data sheet Rev. 04 — 19 November 2008 9 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin 30[2] Type I/O I I Description P1[30] — General purpose digital input/output pin. VBUS — Monitors the presence of USB bus power. (LPC2378 only) Note: This signal must be HIGH for USB reset to occur. AD0[4] — A/D converter 0, input 4. P1[31] — General purpose digital input/output pin. SCK1 — Serial Clock for SSP1. AD0[5] — A/D converter 0, input 5. Port 2: Port 2 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the pin connect block. Pins 14 through 31 of this port are not available. P2[0] — General purpose digital input/output pin. PWM1[1] — Pulse Width Modulator 1, channel 1 output. TXD1 — Transmitter output for UART1. TRACECLK — Trace Clock. P2[1] — General purpose digital input/output pin. PWM1[2] — Pulse Width Modulator 1, channel 2 output. RXD1 — Receiver input for UART1. PIPESTAT0 — Pipeline Status, bit 0. P2[2] — General purpose digital input/output pin. PWM1[3] — Pulse Width Modulator 1, channel 3 output. CTS1 — Clear to Send input for UART1. PIPESTAT1 — Pipeline Status, bit 1. P2[3] — General purpose digital input/output pin. PWM1[4] — Pulse Width Modulator 1, channel 4 output. DCD1 — Data Carrier Detect input for UART1. PIPESTAT2 — Pipeline Status, bit 2. P2[4] — General purpose digital input/output pin. PWM1[5] — Pulse Width Modulator 1, channel 5 output. DSR1 — Data Set Ready input for UART1. TRACESYNC — Trace Synchronization. P2[5] — General purpose digital input/output pin. PWM1[6] — Pulse Width Modulator 1, channel 6 output. DTR1 — Data Terminal Ready output for UART1. TRACEPKT0 — Trace Packet, bit 0. P2[6] — General purpose digital input/output pin. PCAP1[0] — Capture input for PWM1, channel 0. RI1 — Ring Indicator input for UART1. TRACEPKT1 — Trace Packet, bit 1. P1[30]/ VBUS/AD0[4] P1[31]/SCK1/ AD0[5] 28[2] I/O I/O I I/O P2[0] to P2[31] P2[0]/PWM1[1]/ TXD1/ TRACECLK 107[1] I/O O O O P2[1]/PWM1[2]/ RXD1/ PIPESTAT0 106[1] I/O O I O P2[2]/PWM1[3]/ CTS1/ PIPESTAT1 105[1] I/O O I O P2[3]/PWM1[4]/ DCD1/ PIPESTAT2 100[1] I/O O I O P2[4]/PWM1[5]/ DSR1/ TRACESYNC 99[1] I/O O I O P2[5]/PWM1[6]/ DTR1/ TRACEPKT0 97[1] I/O O O O P2[6]/PCAP1[0]/ RI1/ TRACEPKT1 96[1] I/O I I O LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 10 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol Pin description …continued Pin 95[1] Type I/O I O O 93[1] I/O O O O I/O O Description P2[7] — General purpose digital input/output pin. RD2 — CAN2 receiver input. (LPC2378 only) RTS1 — Request to Send output for UART1. TRACEPKT2 — Trace Packet, bit 2. P2[8] — General purpose digital input/output pin. TD2 — CAN2 transmitter output. (LPC2378 only) TXD2 — Transmitter output for UART2. TRACEPKT3 — Trace Packet, bit 3. P2[9] — General purpose digital input/output pin. USB_CONNECT1 — USB1 Soft Connect control. Signal used to switch an external 1.5 kΩ resistor under the software control. Used with the SoftConnect USB feature. (LPC2378 only) RXD2 — Receiver input for UART2. EXTIN0 — External Trigger Input. P2[10] — General purpose digital input/output pin. Note: LOW on this pin while RESET is LOW forces on-chip boot-loader to take over control of the part after a reset. I EINT0 — External interrupt 0 input. P2[11] — General purpose digital input/output pin. EINT1 — External interrupt 1 input. MCIDAT1 — Data line for SD/MMC interface. I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. P2[12] — General purpose digital input/output pin. EINT2 — External interrupt 2 input. MCIDAT2 — Data line for SD/MMC interface. I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. P2[13] — General purpose digital input/output pin. EINT3 — External interrupt 3 input. MCIDAT3 — Data line for SD/MMC interface. I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. Port 3: Port 3 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the pin connect block. Pins 8 through 22, and 27 through 31 of this port are not available. P3[0] — General purpose digital input/output pin. D0 — External memory data line 0. P3[1] — General purpose digital input/output pin. D1 — External memory data line 1. P3[2] — General purpose digital input/output pin. D2 — External memory data line 2. P2[7]/RD2/ RTS1/ TRACEPKT2 P2[8]/TD2/ TXD2/ TRACEPKT3 92[1] P2[9]/ USB_CONNECT1/ RXD2/ EXTIN0 I I P2[10]/EINT0 76[6] I/O P2[11]/EINT1/ MCIDAT1/ I2STX_CLK 75[6] I/O I O I/O P2[12]/EINT2/ MCIDAT2/ I2STX_WS 73[6] I/O I O I/O P2[13]/EINT3/ MCIDAT3/ I2STX_SDA 71[6] I/O I O I/O P3[0] to P3[31] I/O P3[0]/D0 P3[1]/D1 P3[2]/D2 137[1] 140[1] 144[1] I/O I/O I/O I/O I/O I/O LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 11 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol P3[3]/D3 P3[4]/D4 P3[5]/D5 P3[6]/D6 P3[7]/D7 Pin description …continued Pin 2[1] 9[1] 12[1] 16[1] 19[1] 45[1] Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I 40[1] I/O I O 39[1] I/O O O 38[1] I/O O O I/O Description P3[3] — General purpose digital input/output pin. D3 — External memory data line 3. P3[4] — General purpose digital input/output pin. D4 — External memory data line 4. P3[5] — General purpose digital input/output pin. D5 — External memory data line 5. P3[6] — General purpose digital input/output pin. D6 — External memory data line 6. P3[7] — General purpose digital input/output pin. D7 — External memory data line 7. P3[23] — General purpose digital input/output pin. CAP0[0] — Capture input for Timer 0, channel 0. PCAP1[0] — Capture input for PWM1, channel 0. P3[24] — General purpose digital input/output pin. CAP0[1] — Capture input for Timer 0, channel 1. PWM1[1] — Pulse Width Modulator 1, output 1. P3[25] — General purpose digital input/output pin. MAT0[0] — Match output for Timer 0, channel 0. PWM1[2] — Pulse Width Modulator 1, output 2. P3[26] — General purpose digital input/output pin. MAT0[1] — Match output for Timer 0, channel 1. PWM1[3] — Pulse Width Modulator 1, output 3. Port 4: Port 4 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the pin connect block. Pins 16 through 23, 26, and 27 of this port are not available. P4[0] — ]General purpose digital input/output pin. A0 — External memory address line 0. P4[1] — General purpose digital input/output pin. A1 — External memory address line 1. P4[2] — General purpose digital input/output pin. A2 — External memory address line 2. P4[3] — General purpose digital input/output pin. A3 — External memory address line 3. P4[4] — General purpose digital input/output pin. A4 — External memory address line 4. P4[5] — General purpose digital input/output pin. A5 — External memory address line 5. P4[6] — General purpose digital input/output pin. A6 — External memory address line 6. P4[7] — General purpose digital input/output pin. A7 — External memory address line 7. © NXP B.V. 2008. All rights reserved. P3[23]/CAP0[0]/ PCAP1[0] P3[24]/CAP0[1]/ PWM1[1] P3[25]/MAT0[0]/ PWM1[2] P3[26]/MAT0[1]/ PWM1[3] P4[0] to P4[31] P4[0]/A0 P4[1]/A1 P4[2]/A2 P4[3]/A3 P4[4]/A4 P4[5]/A5 P4[6]/A6 P4[7]/A7 52[1] 55[1] 58[1] 68[1] 72[1] 74[1] 78[1] 84[1] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O LPC2377_78_4 Product data sheet Rev. 04 — 19 November 2008 12 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol P4[8]/A8 P4[9]/A9 P4[10]/A10 P4[11]/A11 P4[12]/A12 P4[13]/A13 P4[14]/A14 P4[15]/A15 P4[24]/OE Pin description …continued Pin 88[1] 91[1] 94[1] 101[1] 104[1] 108[1] 110[1] 120[1] 127[1] 124[1] 118[1] Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O I/O O I/O O O 122[1] I/O O I 130[1] 134[1] 26[8] 37 6[1] 1[1] 3[1] 4[1] 5[1] 7[1] I/O O I/O O O I/O I O I I I I Description P4[8] — General purpose digital input/output pin. A8 — External memory address line 8. P4[9] — General purpose digital input/output pin. A9 — External memory address line 9. P4[10] — General purpose digital input/output pin. A10 — External memory address line 10. P4[11] — General purpose digital input/output pin. A11 — External memory address line 11. P4[12] — General purpose digital input/output pin. A12 — External memory address line 12. P4[13] — General purpose digital input/output pin. A13 — External memory address line 13. P4[14] — General purpose digital input/output pin. A14 — External memory address line 14. P4[15] — General purpose digital input/output pin. A15 — External memory address line 15. P4[24] — General purpose digital input/output pin. OE — LOW active Output Enable signal. P4[25] — General purpose digital input/output pin. BLS0 — LOW active Byte Lane select signal 0. P4 [28] — General purpose digital input/output pin. MAT2[0] — Match output for Timer 2, channel 0. TXD3 — Transmitter output for UART3. P4[29] — General purpose digital input/output pin. MAT2[1] — Match output for Timer 2, channel 1. RXD3 — Receiver input for UART3. P4[30] — General purpose digital input/output pin. CS0 — LOW active Chip Select 0 signal. P4[31] — General purpose digital input/output pin. CS1 — LOW active Chip Select 1 signal. ALARM — RTC controlled output. This is a 1.8 V pin. It goes HIGH when a RTC alarm is generated. USB_D−2 — USB2 port bidirectional D− line. LPC2378 only. This pin is not connected on the LPC2377. DBGEN — JTAG interface control signal. Also used for boundary scanning. TDO — Test Data out for JTAG interface. TDI — Test Data in for JTAG interface. TMS — Test Mode Select for JTAG interface. TRST — Test Reset for JTAG interface. TCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate. P4[25]/BLS0 P4[28]/MAT2[0]/ TXD3 P4[29]/MAT2[1]/ RXD3 P4[30]/CS0 P4[31]/CS1 ALARM USB_D−2 DBGEN TDO TDI TMS TRST TCK LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 13 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 3. Symbol RTCK Pin description …continued Pin 143[1] Type I/O Description RTCK — JTAG interface control signal. Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0]) to operate as Trace port after reset. RSTOUT RESET 20 24[7] O I RSTOUT — This is a 3.3 V pin. LOW on this pin indicates LPC2377/78 being in Reset state. external reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Input to the RTC oscillator circuit. Output from the RTC oscillator circuit. ground: 0 V reference. XTAL1 XTAL2 RTCX1 RTCX2 VSS 31[8] 33[8] 23[8] 25[8] I O I O 22, 44, I 59, 65, 79, 103, 117,119, 139[9] 15[10] I VSSA VDD(3V3) analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 3.3 V supply voltage: This is the power supply voltage for the I/O ports. 41, 62, I 77, 102, 114, 138[11] 21, 81, 98[12] 18, 60, 121[13] 14[14] I I I n.c. VDD(DCDC)(3V3) VDDA Leave these pins unconnected. 3.3 V DC-to-DC converter supply voltage: This is the power supply for the on-chip DC-to-DC converter only. analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. ADC reference: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. The level on this pin is used as a reference for ADC and DAC. RTC pin power supply: 3.3 V on this pin supplies the power to the RTC peripheral. VREF 17[14] I VBAT [1] [2] [3] [4] 27[14] I 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input, digital section of the pad is disabled. 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. Open-drain, 5 V tolerant digital I/O pad compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. Pad provides digital I/O and USB functions (LPC2378 only). It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). 5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. Pad provides special analog functionality. Pad provides special analog functionality. © NXP B.V. 2008. All rights reserved. [5] [6] [7] [8] [9] LPC2377_78_4 Product data sheet Rev. 04 — 19 November 2008 14 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller [10] Pad provides special analog functionality. [11] Pad provides special analog functionality. [12] Pad provides special analog functionality. [13] Pad provides special analog functionality. [14] Pad provides special analog functionality. 7. Functional description 7.1 Architectural overview The LPC2377/78 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external memory, and the AMBA APB for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order. The LPC2377/78 implements two AHB in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the VIC, GPDMA controller, and EMC. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1. In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the AHB address space. Lower speed peripheral functions are connected to the APB bus. The AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a 2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is allocated a 16 kB address space within the APB address space. The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed complex instruction set computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 15 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • the standard 32-bit ARM set • a 16-bit Thumb set The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. 7.2 On-chip flash programming memory The LPC2377/78 incorporates 512 kB flash memory system. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port (UART0). The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field and firmware upgrades. The flash memory is 128 bits wide and includes pre-fetching and buffering techniques to allow it to operate at SRAM speeds of 72 MHz. The LPC2377/78 provides a minimum of 100000 write/erase cycles and 20 years of data retention. 7.3 On-chip SRAM The LPC2377/78 includes a SRAM memory of 32 kB reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits. A 16 kB SRAM block serving as a buffer for the Ethernet controller and an 8 kB SRAM used by the GPDMA controller or the USB device can be used for data and code storage. The 2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered and retains the content in the absence of the main power supply. 7.4 Memory map The LPC2377/78 memory map incorporates several distinct regions as shown in Figure 3. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (default), boot ROM, or SRAM (see Section 7.26.6). LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 16 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB 0xFFFF FFFF 0xF000 0000 0xE000 0000 RESERVED ADDRESS SPACE 3.0 GB 0xC000 0000 EXTERNAL MEMORY BANK 1 (64 kB) 0x8100 FFFF 0x8100 0000 0x8000 FFFF 0x8000 0000 2.0 GB EXTERNAL MEMORY BANK 0 (64 kB) BOOT ROM AND BOOT FLASH (BOOT FLASH REMAPPED FROM ON-CHIP FLASH) RESERVED ADDRESS SPACE ETHERNET RAM (16 kB) GENERAL PURPOSE OR USB RAM (8 kB) 0x7FE0 3FFF 0x7FE0 0000 0x7FD0 1FFF 0x7FD0 0000 RESERVED ADDRESS SPACE 0x4000 8000 0x4000 7FFF 1.0 GB 32 kB LOCAL ON-CHIP STATIC RAM 0x4000 0000 RESERVED ADDRESS SPACE 0x0008 0000 0x0007 FFFF TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY 0.0 GB 0x0000 0000 002aac585 Fig 3. LPC2377/78 memory map 7.5 Interrupt controller The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The VIC takes 32 interrupt request inputs which can be programmed as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 17 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority. When more than one interrupt is assigned the same priority and occur simultaneously, the one connected to the lowest numbered VIC channel will be serviced first. The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping to the address supplied by that register. 7.5.1 Interrupt sources Each peripheral device has one interrupt line connected to the VIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on PORT0 and PORT2 (total of 46 pins) regardless of the selected function, can be programmed to generate an interrupt on a rising edge, a falling edge, or both. Such interrupt request coming from PORT0 and/or PORT2 will be combined with the EINT3 interrupt requests. 7.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 7.7 External memory controller The LPC2377/78 EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant peripheral. 7.7.1 Features • Asynchronous static memory device support including RAM, ROM, and flash, with or without asynchronous page mode • • • • LPC2377_78_4 Low transaction latency Read and write buffers to reduce latency and to improve performance 8 data and 16 address lines wide static memory support Two chip selects for static memory devices © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 18 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller • Static memory features include: – Asynchronous page mode read – Programmable Wait States (WST) – Bus turnaround delay – Output enable and write enable delays – Extended wait 7.8 General purpose DMA controller The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2377/78 peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receive. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the AHB master. 7.8.1 Features • Two DMA channels. Each channel can support a unidirectional transfer. • The GPDMA can transfer data between the 8 kB SRAM and peripherals such as the SD/MMC, two SSP, and I2S-bus interfaces. • Single DMA and burst DMA request signals. Each peripheral connected to the GPDMA can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the GPDMA. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. Each DMA channel has a specific hardware priority. DMA channel 0 has the highest priority and channel 1 has the lowest priority. If requests from two channels become active at the same time, the channel with the highest priority is serviced first. • AHB slave DMA programming interface. The GPDMA is programmed by writing to the DMA control registers over the AHB slave interface. • One AHB master for transferring data. This interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral. • Internal four-word FIFO per channel. • Supports 8-bit, 16-bit, and 32-bit wide transactions. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 19 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Interrupt masking. The DMA error and DMA terminal count interrupt requests can be masked. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.9 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC2377/78 use accelerated GPIO functions: • GPIO registers are relocated to the ARM local bus so that the fastest possible I/O timing can be achieved. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte and half-word addressable. • Entire port value can be written in one instruction. Additionally, any pin on PORT0 and PORT2 (total of 46 pins) providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode. 7.9.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Backward compatibility with other earlier devices is maintained with legacy PORT0 and PORT1 registers appearing at the original addresses on the APB bus. 7.10 Ethernet The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2377/78 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 20 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller memory via the EMC, as well as the SRAM located on another AHB, if it is not being used by the USB block. However, using memory other than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to memory and increase the loading of its AHB. The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 7.10.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x full duplex flow control and half duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support. • Memory management: – Independent transmit and receive buffers memory mapped to shared SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter. • Physical interface: – Attachment of external PHY chip through standard RMII interface. – PHY register access is available via the MIIM interface. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 21 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 7.11 USB interface (LPC2378 only) The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and a number (127 maximum) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, unplugging and dynamic configuration of the devices. All transactions are initiated by the host controller. The two sets of pins needed by a USB device are named VBUS, USB_D+1, USB_D−1, USB_UP_LED1, USB_CONNECT1, and USB_D+2, USB_D−2, USB_UP_LED2, and USB_CONNECT2 respectively. At any given time only one of these two sets can be active and used by the application. 7.11.1 USB device controller The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of register interface, serial interface engine, endpoint buffer memory, and the DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. The DMA controller when enabled transfers data between the endpoint buffer and the USB RAM. 7.11.1.1 Features • • • • • Fully compliant with USB 2.0 specification (full speed). Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM. Supports Control, Bulk, Interrupt and Isochronous endpoints. Scalable realization of endpoints at run time. Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • Supports SoftConnect and GoodLink features. • While USB is in the Suspend mode, the LPC2377/78 can enter one of the reduced power modes and wake up on a USB activity. • Supports DMA transfers with the DMA RAM of 8 kB on all non-control endpoints. • Allows dynamic switching between CPU-controlled and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 7.12 CAN controller and acceptance filters (LPC2378 only) The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router among a number of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 22 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter. 7.12.1 Features • • • • • Two CAN controllers and buses. Data rates to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN buses. Standard Identifiers. • Acceptance Filter can provide FullCAN-style automatic reception for selected • Full CAN messages can generate interrupts. 7.13 10-bit ADC The LPC2377/78 contains one ADC. It is a single 10-bit successive approximation ADC with eight channels. 7.13.1 Features • • • • • • • • 10-bit successive approximation ADC Input multiplexing among 8 pins Power-down mode Measurement range 0 V to Vi(VREF) 10-bit conversion time ≥ 2.44 µs Burst conversion mode for single or multiple inputs Optional conversion on transition of input pin or Timer Match signal Individual result registers for each ADC channel to reduce interrupt overhead 7.14 10-bit DAC The DAC allows the LPC2377/78 to generate a variable analog output. The maximum output value of the DAC is Vi(VREF). 7.14.1 Features • • • • • 10-bit DAC Resistor string architecture Buffered output Power-down mode Selectable output drive LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 23 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 7.15 UARTs The LPC2377/78 contains four UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 can be achieved with any crystal frequency above 2 MHz. 7.15.1 Features • • • • 16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. mechanism that enables software flow control implementation. • Fractional divider for baud rate control, auto baud capabilities and FIFO control • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • UART3 includes an IrDA mode to support infrared communication. 7.16 SPI serial I/O controller The LPC2377/78 contains one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master. 7.16.1 Features • • • • • Compliant with SPI specification Synchronous, Serial, Full Duplex Communication Combined SPI master and slave Maximum data bit rate of one eighth of the input clock rate 8 bits to 16 bits per transfer 7.17 SSP serial I/O controller The LPC2377/78 contains two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.17.1 Features • Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire buses LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 24 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller • • • • • Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame DMA transfers supported by GPDMA 7.18 SD/MMC card interface The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11. 7.18.1 Features • The MCI provides all functions specific to the SD/MMC memory card. These include the clock generation unit, power management control, and command and data transfer. • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • DMA supported through the GPDMA controller. 7.19 I2C-bus serial I/O controllers The LPC2377/78 contains three I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus and can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2377/78 supports bit rates up to 400 kbit/s (Fast I2C-bus). 7.19.1 Features • I2C0 is a standard I2C compliant bus interface with open-drain pins. • I2C1 and I2C2 use standard I/O pins and do not support powering off of individual devices connected to the same bus lines. • • • • LPC2377_78_4 Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 25 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. 7.20 I2S-bus serial I/O controllers The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC2377/78 provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.20.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz ((16, 22.05, 32, 44.1, 48) kHz). • • • • Configurable word select period in master mode (separately for I2S input and output). Two 8 word FIFO data buffers are provided, one for transmit and one for receive. Generates interrupt requests when buffer levels cross a programmable boundary. Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S input and I2S output. 7.21 General purpose 32-bit timers/external event counters The LPC2377/78 includes four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.21.1 Features • A 32-bit Timer/Counter with a programmable 32-bit prescaler. • Counter or Timer operation. • Up to four 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 26 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 7.22 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2377/78. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 7.22.1 Features • LPC2377/78 has one PWM block with Counter or Timer operation (may use the peripheral clock or one of the capture inputs as the clock source). • Seven match registers allow up to 6 single edge controlled or 3 double edge controlled PWM outputs, or a mix of both types. The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 27 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 7.23 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 7.23.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 32-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in multiples of Tcy(WDCLK) × 4. Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring, for increased reliability. • The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the 7.24 RTC and battery RAM The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. It uses little power in Power-down mode. On the LPC2377/78, the RTC can be clocked by a separate 32.768 kHz oscillator or by a programmable prescale divider LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 28 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller based on the APB clock. Also, the RTC is powered by its own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V supply used by the rest of the device. The VBAT pin supplies power only to the RTC and the battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that can be used by external hardware to restore chip power and resume operation. 7.24.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Dedicated 32 kHz oscillator or programmable prescaler from APB clock. • Dedicated power supply pin can be connected to a battery or to the main 3.3 V. • An alarm output pin is included to assist in waking up from Power-down mode, or when the chip has had power removed to all functions except the RTC and battery RAM. • Periodic interrupts can be generated from increments of any field of the time registers, and selected fractional second values. • 2 kB data SRAM powered by VBAT. • RTC and battery RAM power supply is isolated from the rest of the chip. 7.25 Clocking and power control 7.25.1 Crystal oscillators The LPC2377/78 includes three independent oscillators. These are the Main Oscillator, the Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Any of the three clock sources can be chosen by software to drive the PLL and ultimately the CPU. Following reset, the LPC2377/78 will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. 7.25.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is trimmed to 1 % accuracy. Upon power-up or any chip reset, the LPC2377/78 uses the IRC as the clock source. Software may later switch to one of the other available clock sources. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 29 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 7.25.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.25.2 for additional information. 7.25.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the RTC oscillator can be used to drive the PLL and the CPU. 7.25.2 PLL The PLL accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input frequency is multiplied up to a high frequency, then divided down to provide the actual clock used by the CPU and the USB block. The PLL input, in the range of 32 kHz to 25 MHz, may initially be divided down by a value ‘N’, which may be in the range of 1 to 256. This input division provides a wide range of output frequencies from the same input frequency. Following the PLL input divider is the PLL multiplier. This can multiply the input divider output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to 550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a phase-frequency detector to compare the divided CCO output to the multiplier input. The error value is used to adjust the CCO frequency. The PLL is turned off and bypassed following a chip Reset and by entering Power-down mode. PLL is enabled by software only. The program must configure and activate the PLL, wait for the PLL to lock, then connect to the PLL as a clock source. 7.25.3 Wake-up timer The LPC2377/78 begins operation at power-up and when awakened from Power-down mode by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 30 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 7.25.4 Power control The LPC2377/78 supports a variety of power control features. There are three special modes of processor power reduction: Idle mode, Sleep mode, and Power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, Peripheral Power Control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The LPC2377/78 also implements a separate power domain in order to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small SRAM, referred to as the battery RAM. 7.25.4.1 Idle mode In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 7.25.4.2 Sleep mode In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The 32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The CCLK and USB clock dividers automatically get reset to zero. The Sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Sleep mode reduces chip power consumption to a very low value. The flash memory is left on in Sleep mode, allowing a very quick wake-up. On the wake-up of Sleep mode, if the IRC was used before entering Sleep mode, the code execution and peripherals activities will resume after 4 cycles expire. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. The customers need to reconfigure the PLL and clock dividers accordingly. 7.25.4.3 Power-down mode Power-down mode does everything that Sleep mode does, but also turns off the IRC oscillator and the flash memory. This saves more power, but requires waiting for resumption of flash operation before execution of code or data access in the flash memory can be accomplished. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 31 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller On the wake-up of power-down mode, if the IRC was used before entering power-down mode, it will take IRC 60 µs to start-up. After this 4 IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 µs flash start-up time. When it times out, access to the flash will be allowed. The customers need to reconfigure the PLL and clock dividers accordingly. 7.25.4.4 Power domains The LPC2377/78 provides two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the battery RAM. On the LPC2377/78, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the VDD(DCDC)(3V3) pin powers the on-chip DC-to-DC converter which in turn provides power to the CPU and most of the peripherals. Depending on the LPC2377/78 application, a design can use two power options to manage power consumption. The first option assumes that power consumption is not a concern and the design ties the VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires only one 3.3 V power supply for both pads, the CPU, and peripherals. While this solution is simple, it does not support powering down the I/O pad ring “on the fly” while keeping the CPU and peripherals alive. The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-to-DC converter powered independently from the I/O pad ring enables shutting down of the I/O pad power supply “on the fly”, while the CPU and peripherals stay active. The VBAT pin supplies power only to the RTC and the battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery. When the CPU and the rest of chip functions are stopped and power removed, the RTC can supply an alarm output that may be used by external hardware to restore chip power and resume operation. 7.26 System control 7.26.1 Reset Reset has four sources on the LPC2377/78: the RESET pin, the Watchdog reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the Wake-up timer (see description in Section 7.25.3 “Wake-up timer”), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the Boot Block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 32 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 7.26.2 Brownout detection The LPC2377/78 includes 2-stage monitoring of the voltage on the VDD(3V3) pins. If this voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts Reset to inactivate the LPC2377/78 when the voltage on the VDD(3V3) pins falls below 2.65 V. This Reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall Reset. Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event loop to sense the condition. 7.26.3 Code security (Code Read Protection - CRP) This feature of the LPC2377/78 allows user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of the Code Read Protection. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. 7.26.4 AHB The LPC2377/78 implements two AHBs in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 8 kB SRAM primarily intended for use by the USB. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 33 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1. In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. 7.26.5 External interrupt inputs The LPC2377/78 includes up to 50 edge sensitive interrupt inputs combined with up to four level sensitive external interrupt inputs as selectable pin functions. The external interrupt inputs can optionally be used to wake up the processor from Power-down mode. 7.26.6 Memory mapping control The memory mapping control alters the mapping of the interrupt vectors that appear at the beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot ROM, the SRAM, or external memory. This allows code running in different memory spaces to have control of the interrupts. 7.27 Emulation and debugging The LPC2377/78 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface peripherals residing on other pins are available during the development and debugging phase as they are when the application is run in the embedded system itself. 7.27.1 EmbeddedICE The EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present on the target system. The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic. The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate. 7.27.2 Embedded trace Since the LPC2377/78 has significant amounts of on-chip memories, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 34 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external Trace Port Analyzer captures the trace information under software debugger control. The trace port can broadcast the Instruction trace information. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 7.27.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2377/78 contain a specific configuration of RealMonitor software programmed into the on-chip ROM memory. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 35 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD(3V3) Parameter supply voltage (3.3 V) Conditions core and external rail Min 3.0 3.0 −0.5 for the RTC on ADC related pins 5 V tolerant I/O pins; only valid when the VDD(3V3) supply voltage is present other I/O pins IDD ISS Tstg Ptot(pack) supply current ground current storage temperature total power dissipation (per package) based on package heat transfer, not device power consumption human body model; all pins [6] [2] Max 3.6 3.6 +4.6 +4.6 +4.6 +5.1 +6.0 Unit V V V V V V V VDD(DCDC)(3V3) DC-to-DC converter supply voltage (3.3 V) VDDA Vi(VBAT) Vi(VREF) VIA VI analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF analog input voltage input voltage −0.5 −0.5 −0.5 −0.5 [2][3] −0.5 −65 - VDD(3V3) + 0.5 100 100 +150 1.5 V mA mA °C W per supply pin per ground pin [4] [4] [5] Vesd electrostatic discharge voltage −2000 +2000 V [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Including voltage on outputs in 3-state mode. Not to exceed 4.6 V. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] [3] [4] [5] [6] LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 36 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 9. Static characteristics Table 5. Static characteristics Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol VDD(3V3) VDD(DCDC)(3V3) VDDA Vi(VBAT) Vi(VREF) Parameter supply voltage (3.3 V) DC-to-DC converter supply voltage (3.3 V) analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF LOW-level input current HIGH-level input current OFF-state output current I/O latch-up current VI = 0 V; no pull-up VI = VDD(3V3); no pull-down VO = 0 V; VO = VDD(3V3); no pull-up/down −(0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 °C VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current HIGH-level short-circuit output current IOH = −4 mA IOL = −4 mA VOH = VDD(3V3) − 0.4 V VOL = 0.4 V VOH = 0 V [7] [2] Conditions core and external rail Min 3.0 3.0 3.0 2.0 2.5 Typ[1] 3.3 3.3 3.3 3.3 3.3 Max 3.6 3.6 3.6 3.6 VDDA Unit V V V V V Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch 3 3 3 100 µA µA µA mA pin configured to provide a digital function output active [3][4][5] [6] 0 0 2.0 0.4 VDD(3V3) − 0.4 −4 4 - - 5.5 VDD(3V3) 0.8 0.4 −45 V V V V V V V mA mA mA [7] [7] [7] [8] IOLS Ipd Ipu LOW-level short-circuit VOL = VDDA output current pull-down current pull-up current VI = 5 V VI = 0 V VDD(3V3) < VI < 5 V [8] 10 −15 0 50 −50 0 50 150 −85 0 mA µA µA µA [9] [9] LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 37 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 5. Static characteristics …continued Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IDD(DCDC)act(3V3) active mode DC-to-DC VDD(DCDC)(3V3) = 3.3 V; converter supply Tamb = 25 °C; code current (3.3 V) while(1){} executed from flash; no peripherals enabled; PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled; PCLK = CCLK / 8 CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled; PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz IDD(DCDC)pd(3V3) power-down mode DC-to-DC converter supply current (3.3 V) active mode battery supply current HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD(3V3) VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2) Vi(RTCX1) Vo(RTCX2) input voltage on pin XTAL1 output voltage on pin XTAL2 input voltage on pin RTCX1 output voltage on pin RTCX2 OFF-state output current bus supply voltage 0 V < VI < 3.3 V 0 0 0 0 1.8 1.8 1.8 1.8 V V V V [7] - 15 63 - mA mA - 21 92 - mA mA - 27 125 150 - mA mA µA VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 °C [10] 20 µA IBATact I2C-bus pins (P0[27] and P0[28]) VIH VIL Vhys VOL ILI 0.7VDD(3V3) V 0.3VDD(3V3) V V V µA µA 0.5VDD(3V3) 2 10 0.4 4 22 [11] USB pins (LPC2378 only) IOZ VBUS LPC2377_78_4 - - ±10 5.25 µA V © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 38 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 5. Static characteristics …continued Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified. Symbol VDI VCM Vth(rs)se Parameter differential input sensitivity differential common mode voltage range single-ended receiver switching threshold voltage LOW-level output voltage for low-/full-speed HIGH-level output voltage (driven) for low-/full-speed transceiver capacitance driver output impedance for driver which is not high-speed capable pull-up resistance RL of 1.5 kΩ to 3.6 V Conditions |(D+) − (D−)| includes VDI range Min 0.2 0.8 0.8 Typ[1] Max 2.5 2.0 Unit V V V VOL - - 0.18 V VOH RL of 15 kΩ to GND 2.8 - 3.5 V Ctrans ZDRV pin to GND with 33 Ω series resistor; steady state drive [12] 36 - 20 44.1 pF Ω Rpu [1] [2] [3] [4] [5] [6] [7] [8] [9] SoftConnect = ON 1.1 - 1.9 kΩ Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages The RTC typically fails when Vi(VBAT) drops below 1.6 V. Including voltage on outputs in 3-state mode. VDD(3V3) supply voltages must be present. 3-state outputs go into 3-state mode when VDD(3V3) is grounded. Please also see the errata note in errata sheet. Accounts for 100 mV voltage drop in all supply lines. Allowed as long as the current limit does not exceed the maximum current allowed by the device. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [10] On pin VBAT. [11] To VSS. [12] Includes external resistors of 18 Ω ± 1 % on D+ and D−. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 39 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller Table 6. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO EG ET Rvsi Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error gain error absolute error voltage source interface resistance Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 4. See Figure 5. [1][2][3] [1][4] [1][5] [1][6] [1][7] [8] Conditions Min 0 - Typ - Max VDDA 1 ±1 ±2 ±3 ±0.5 ±4 40 Unit V pF LSB LSB LSB % LSB kΩ [1] [2] [3] [4] [5] [6] [7] [8] LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 40 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller offset error EO 1023 gain error EG 1022 1021 1020 1019 1018 (2) 7 code out 6 (1) 5 (5) 4 (4) 3 (3) 2 1 1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024 0 1 offset error EO 2 3 4 5 6 7 Via (LSBideal) 1 LSB = VDDA − VSSA 1024 002aab136 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 4. ADC characteristics LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 41 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller LPC23XX 20 kΩ AD0[y]SAMPLE 3 pF 5 pF AD0[y] Rvsi VEXT VSS 002aac610 Fig 5. Suggested ADC interface - LPC2377/78 AD0[y] pin LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 42 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 10. Dynamic characteristics Table 7. Dynamic characteristics of USB pins (full-speed; LPC2378 only) CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3),unless otherwise specified. Symbol tr tf tFRFM VCRS tFEOPT tFDEOP tJR1 tJR2 tEOPR1 Parameter rise time fall time differential rise and fall time matching output signal crossover voltage source SE0 interval of EOP source jitter for differential transition to SE0 transition receiver jitter to next transition receiver jitter for paired transitions EOP width at receiver 10 % to 90 % must reject as EOP; see Figure 9 must accept as EOP; see Figure 9 [1] Conditions 10 % to 90 % 10 % to 90 % tr / tf Min 8.5 7.7 1.3 Typ - Max 13.8 13.7 109 2.0 175 +5 +18.5 +9 - Unit ns ns % V ns ns ns ns ns see Figure 9 see Figure 9 160 −2 −18.5 −9 40 tEOPR2 EOP width at receiver [1] 82 - - ns [1] Characterized but not implemented as production test. Guaranteed by design. Table 8. Dynamic characteristics Tamb = −40 °C to +85 °C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol External clock fosc Tcy(clk) tCHCX tCLCX tCLCH tCHCL I2C-bus tf(o) SSP interface tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 °C; measured in SPI Master mode; see Figure 10 11 ns oscillator frequency clock cycle time clock HIGH time clock LOW time clock rise time clock fall time pins (P0[27] and P0[28]) output fall time VIH to VIL 20 + 0.1 × Cb[3] ns 1 42 Tcy(clk) × 0.4 Tcy(clk) × 0.4 25 1000 5 5 MHz ns ns ns ns ns Parameter Conditions Min Typ[2] Max Unit [1] [2] [3] Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. Bus capacitance Cb in pF, from 10 pF to 400 pF. LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 43 of 55 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Product data sheet Rev. 04 — 19 November 2008 © NXP B.V. 2008. All rights reserved. LPC2377_78_4 NXP Semiconductors Table 9. Dynamic characteristics: Static external memory interface CL = 30 pF, Tamb = −40 °C to 85 °C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, AHB clock = 1 MHz Symbol tCSLAV Parameter CS LOW to address valid time OE LOW to address valid time CS LOW to OE LOW time memory access time data input hold time CS HIGH to OE HIGH time OE HIGH to address invalid time OE LOW to OE HIGH time BLS LOW to address valid time CS HIGH to BLS HIGH time parameters[1][6] −0.88 + Tcy(CCLK) × (1 + WAITWEN) −0.88 0.68 0 [3] [3][4] Conditions Min −0.29 Typ 0.20 Max 2.54 Unit ns Common to read and write cycles[1] Read cycle parameters[1][2] tOELAV tCSLOEL tam th(D) tCSHOEH tOEHANV tOELOEH tBLSLAV tCSHBLSH tCSLWEL tCSLBLSL tWELDV tCSLDV tWELWEH −0.29 0.20 2.54 0.49 + Tcy(CCLK) × WAITOEN (WAITRD − WAITOEN + 1) × Tcy(CCLK) − 12.70 5.20 0.20 2.44 0.10 + (WAITRD − WAITOEN + 1) × Tcy(CCLK) 2.54 0.68 0.20 + Tcy(CCLK) × (1 + WAITWEN) 0.98 5.86 4.79 0.10 + Tcy(CCLK) × (WAITWR − WAITWEN + 1) 0.59 + Tcy(CCLK) × (WAITWR − WAITWEN + 3) 2.74 + Tcy(CCLK) ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns −0.78 + Tcy(CCLK) × WAITOEN 0 + Tcy(CCLK) × WAITOEN (WAITRD − WAITOEN + 1) × Tcy(CCLK) − 8.11 1.29 −0.49 −0.20 −0.59 + (WAITRD − WAITOEN + 1) × Tcy(CCLK) −0.39 −0.88 (WAITRD − WAITOEN + 1) × Tcy(CCLK) − 9.57 4.22 0 0.20 0 + (WAITRD − WAITOEN + 1) × Tcy(CCLK) 0 0.49 0.10 + Tcy(CCLK) × (1 + WAITWEN) 0.49 2.54 2.64 0 + Tcy(CCLK) × (WAITWR − WAITWEN + 1) 0 + Tcy(CCLK) × (WAITWR − WAITWEN + 3) 0.20 + Tcy(CCLK) [5] Write cycle CS LOW to WE LOW time CS LOW to BLS LOW time WE LOW to data valid time CS LOW to data valid time WE LOW to WE HIGH time Single-chip 16-bit/32-bit microcontroller −0.78 + Tcy(CCLK) × (WAITWR − WAITWEN + 1) −0.88 + Tcy(CCLK) × (WAITWR − WAITWEN + 3) 0 + Tcy(CCLK) LPC2377/78 tBLSLBLSH BLS LOW to BLS HIGH time tWEHANV WE HIGH to address invalid time [3] [3] 44 of 55 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Table 9. Dynamic characteristics: Static external memory interface …continued CL = 30 pF, Tamb = −40 °C to 85 °C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, AHB clock = 1 MHz Symbol tWEHDNV tBLSHANV tBLSHDNV Parameter WE HIGH to data invalid time BLS HIGH to address invalid time BLS HIGH to data invalid time Conditions [3] Product data sheet Rev. 04 — 19 November 2008 45 of 55 LPC2377_78_4 © NXP B.V. 2008. All rights reserved. NXP Semiconductors Min 0.78 −0.29 0 Typ 2.54 0.20 2.54 Max 5.96 2.54 5.37 Unit ns ns ns [3] [3] [1] [2] [3] [4] [5] [6] VOH = 2.5 V, VOL = 0.2 V. VIH = 2.5 V, VIL = 0.5 V. Tcy(CCLK) = 1⁄CCLK. Latest of address valid, CS LOW, OE LOW to data valid. Earliest of CS HIGH, OE HIGH, address change to data invalid. Byte lane state bit (PB) = 1. Single-chip 16-bit/32-bit microcontroller LPC2377/78 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 10.1 Timing tCHCL tCLCX Tcy(clk) tCHCX tCLCH 002aaa907 Fig 6. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCSLAV CS tCSHOEH addr tam data tCSLOEL tOELAV tOELOEH OE tOEHANV th(D) tBLSLAV BLS tCSHBLSH 002aad955 Fig 7. External memory read access LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 46 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller CS tAVCSL tWELWEH tBLSLBLSH tWEHANV tCSLBLSL tWELDV tBLSHANV tCSLWEL BLS/WE addr tCSLDV data tWEHDNV tBLSHDNV OE 002aad956 Fig 8. External memory write access tPERIOD crossover point differential data lines crossover point extended source EOP width: tFEOPT differential data to SE0/EOP skew n × tPERIOD + tFDEOP receiver EOP width: tEOPR1, tEOPR2 002aab561 Fig 9. Differential data-to-EOP transition skew and EOP width LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 47 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller shifting edges SCK sampling edges MOSI MISO tsu(SPI_MISO) 002aad326 Fig 10. MISO line set-up time in SSP Master mode 11. Application information 11.1 Suggested USB interface solutions (LPC2378 only) VDD(3V3) USB_UP_LED USB_CONNECT LPC23XX soft-connect switch R1 1.5 kΩ VBUS USB_D+ RS = 33 Ω USB_D− VSS 002aac578 RS = 33 Ω USB-B connector Fig 11. LPC2378 USB interface on a self-powered device LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 48 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller VDD(3V3) R2 LPC23XX USB_UP_LED VBUS USB_D+ RS = 33 Ω USB_D− RS = 33 Ω VSS R1 1.5 kΩ USB-B connector 002aac579 Fig 12. LPC2378 USB interface on a bus-powered device LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 49 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 12. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 108 109 73 72 ZE e E HE A A2 A1 (A 3) θ Lp L detail X wM bp pin 1 index 144 1 wM D HD ZD B vM B 36 bp vM A 37 e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 20.1 19.9 E (1) 20.1 19.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D(1) Z E(1) 1.4 1.1 1.4 1.1 θ 7 o 0 o 22.15 22.15 21.85 21.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT486-1 REFERENCES IEC 136E23 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-03-14 03-02-20 Fig 13. Package outline SOT486-1 (LQFP144) LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 50 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 13. Abbreviations Table 10. Acronym ADC AHB AMBA APB BLS BOD CAN CTS DAC DCC DMA DSP EOP ETM GPIO JTAG MII MIIM PHY PLL PWM RMII RTS SE0 SPI SSI SSP TTL UART USB Acronym list Description Analog-to-Digital Converter Advanced High-performance Bus Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Byte Lane Select BrownOut Detection Controller Area Network Clear To Send Digital-to-Analog Converter Debug Communication Channel Direct Memory Access Digital Signal Processing End Of Packet Embedded Trace Macrocell General Purpose Input/Output Joint Test Action Group Media Independent Interface Media Independent Interface Management Physical Layer Phase-Locked Loop Pulse Width Modulator Reduced Media Independent Interface Request To Send Single Ended Zero Serial Peripheral Interface Synchronous Serial Interface Synchronous Serial Port Transistor-Transistor Logic Universal Asynchronous Receiver/Transmitter Universal Serial Bus LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 51 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 14. Revision history Table 11. Revision history Release date 20081119 Data sheet status Product data sheet Change notice Supersedes LPC2378_3 Document ID LPC2377_78_4 Modifications: • • • • • • • • • • • Changed status to Product data sheet. Part LPC2377FBD144 added. Table 5 “Static characteristics”, Vhys, moved 0.4 from Typ to Min column. Table 5 “Static characteristics”, VI, added Table note 6. Table 5 “Static characteristics”, updated Table note 8. Added Table 9 “Dynamic characteristics: Static external memor y interface”. Figure 6 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)”, removed figure note, modified figure and title. Added Figure 7 “External memor y read access” and Figure 8 “External memor y write access”. RSTOUT pin description updated: This is a 3.3 V pin. Updated description of pins RESET, RSTOUT and VBAT. Updated Figure 1 “LPC2377/78 block diagram”. Preliminary data sheet Preliminary data sheet LPC2378_2 LPC2378_1 Font in graphics updated. Removed references to VDD(1V8). Removed Deep power-down mode chapter and related references. Preliminary data sheet - LPC2378_3 Modifications: LPC2378_2 Modifications: LPC2378_1 20070927 • • • 20070501 20061206 LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 52 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. SoftConnect — is a trademark of NXP B.V. GoodLink — is a trademark of NXP B.V. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 53 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . 15 7.1 Architectural overview. . . . . . . . . . . . . . . . . . . 15 7.2 On-chip flash programming memory . . . . . . . 16 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 16 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 17 7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 18 7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 18 7.7 External memory controller. . . . . . . . . . . . . . . 18 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.8 General purpose DMA controller . . . . . . . . . . 19 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.9 Fast general purpose parallel I/O . . . . . . . . . . 20 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.11 USB interface (LPC2378 only) . . . . . . . . . . . . 22 7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 22 7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.12 CAN controller and acceptance filters (LPC2378 only). . . . . . . . . . . . . . . . . . . . . . . . 22 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.15 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 24 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 24 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 25 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.19 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 25 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . . 26 7.20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.21 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 7.21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 7.22.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 7.23.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 7.24.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25 Clocking and power control . . . . . . . . . . . . . . 7.25.1 Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7.25.1.3 RTC oscillator. . . . . . . . . . . . . . . . . . . . . . . . . 7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 7.25.4.4 Power domains. . . . . . . . . . . . . . . . . . . . . . . . 7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.26.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 7.26.3 Code security (Code Read Protection - CRP) 7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 7.27 Emulation and debugging. . . . . . . . . . . . . . . . 7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 10.1 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information . . . . . . . . . . . . . . . . . 11.1 Suggested USB interface solutions (LPC2378 only) . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information . . . . . . . . . . . . . . . . . . . . . . 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26 26 27 27 28 28 28 29 29 29 29 30 30 30 30 31 31 31 31 32 32 32 33 33 33 34 34 34 34 34 35 36 37 43 46 48 48 50 51 52 53 53 53 53 continued >> LPC2377_78_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 19 November 2008 54 of 55 NXP Semiconductors LPC2377/78 Single-chip 16-bit/32-bit microcontroller 15.4 16 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Contact information. . . . . . . . . . . . . . . . . . . . . 53 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 November 2008 Document identifier: LPC2377_78_4
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