MC07XS6517BEK

Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name M86291G12 FCPBGA 625 21*21*2.4 P.8 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2017-09-12 00KGK50008S341A1.6 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 support@freescale.com Daniel Binyon EPP Customer Response 512-895-3406 eppanlst@freescale.com www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 M86291G12 FCPBGA 625 21*21*2.4 P.8 ALL 3.114000 g EACH 3 250 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Bonding Agent 0.0425 Bonding Agent Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.019125 g Bonding Agent Glass Silica, crystalline - quartz (SiO2) 14808-60-7 0.017 g Bonding Agent Solvents, additives, and other materials Dimethylvinylated and trimethylated silica 68988-89-6 0.006375 g Gel Die Encapsulant Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 450000 45 6141 0.6141 400000 40 5459 0.5459 150000 15 2047 0.2047 g 0.0061 g Gel Die Encapsulant Metals Aluminum Oxides (Al2O3) 1344-28-1 0.00427 g 700000 70 1371 0.1371 Gel Die Encapsulant Solvents, additives, and other materials Siloxanes and silicones, di-Me, vinyl group-terminated 68083-19-2 0.00183 g 300000 30 587 0.0587 Pb-free Bumped Semiconductor D 0.08315 g Pb-free Bumped Semiconductor D Nickel (external applications only) Nickel 7440-02-0 0.00041575 g 5000 0.5 133 0.0133 Pb-free Bumped Semiconductor D Metals Silver, metal 7440-22-4 0.00026192 g 3150 0.315 84 0.0084 Pb-free Bumped Semiconductor D Metals Tin, metal 7440-31-5 0.00722158 g 86850 8.685 2319 0.2319 Pb-free Bumped Semiconductor D Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00074835 g 9000 0.9 240 0.024 Pb-free Bumped Semiconductor D Glass Silicon, doped - 0.0745024 g 896000 89.6 23924 2.3924 Organic Substrate, Halogen-fre 0.628 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00597605 g 9516 0.9516 1919 0.1919 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.23942311 g 381247 38.1247 76886 7.6886 Organic Substrate, Halogen-fre Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00342888 g 5460 0.546 1101 0.1101 Organic Substrate, Halogen-fre Plastics/polymers Other Epoxy resins - 0.01241368 g 19767 1.9767 3986 0.3986 Organic Substrate, Halogen-fre Metals Talc 14807-96-6 0.00069143 g 1101 0.1101 222 0.0222 Organic Substrate, Halogen-fre Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.00342888 g 5460 0.546 1101 0.1101 Organic Substrate, Halogen-fre Plastics/polymers Other polymers - 0.01542996 g 24570 2.457 4955 0.4955 Organic Substrate, Halogen-fre Glass Fibrous-glass-wool 65997-17-3 0.16148518 g 257142 25.7142 51857 5.1857 Organic Substrate, Halogen-fre Glass Silicon dioxide 7631-86-9 0.10708844 g 170523 17.0523 34389 3.4389 Organic Substrate, Halogen-fre Metals Silver, metal 7440-22-4 0.00055578 g 885 0.0885 178 0.0178 Organic Substrate, Halogen-fre Metals Tin, metal 7440-31-5 0.01787728 g 28467 2.8467 5740 0.574 Organic Substrate, Halogen-fre Metals Copper phthalocyanine 147-14-8 0.00004019 g 64 0.0064 12 0.0012 Organic Substrate, Halogen-fre Solvents, additives, and other materials Oxirane, 2,2,2,2-[1,2ethanediylidenetetrakis(4,1phenyleneoxymethylene)]tetra kis 7328-97-4 0.06016114 g 95798 9.5798 19319 1.9319 Heat Spreader Metals Copper, metal 7440-50-8 1.89276102 g 950062 95.0062 607839 60.7839 Heat Spreader Nickel (external applications only) Nickel 7440-02-0 0.09948898 g 49938 4.9938 31948 3.1948 Heat Spreader Solder Balls - Lead Free 1.99225 g 0.3105 g Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.00155529 g 5009 0.5009 499 0.0499 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00933177 g 30054 3.0054 2996 0.2996 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.29961294 g 964937 96.4937 96214 9.6214 Underfill 0.0515 g Underfill Solvents, additives, and other materials Proprietary Material-Other aliphatic amines - 0.00419725 g 81500 8.15 1347 0.1347 Underfill Metals Proprietary Material-Other bismuth compounds - 0.00048925 g 9500 0.95 157 0.0157 Underfill Plastics/polymers 1,6-Bis(2,3-epoxypropoxy) naphthalene 27610-48-6 0.00824 g 160000 16 2646 0.2646 Underfill Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00515 g 100000 10 1653 0.1653 Underfill Solvents, additives, and other materials Carbon Black 1333-86-4 0.0000515 g 1000 0.1 16 0.0016 Underfill Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.0012875 g 25000 2.5 413 0.0413 Underfill Glass Silica, vitreous 60676-86-0 0.0309 g 600000 60 9922 0.9922 Underfill Solvents, additives, and other materials Bis(methylthio)toluenediamine 106264-79-3 0.0011845 g 23000 2.3 380 0.038 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/M86291G12_IPC1752_v11.xml http://www.freescale.com/mcds/M86291G12_IPC1752A.xml