Freescale Semiconductor
Technical Data
Document Number: MC13192
Rev. 3.3, 04/2008
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
MC13192
MC13192
Package Information
Plastic Package
Case 1311-03
(QFN-32)
2.4 GHz Low Power Transceiver
for the IEEE® 802.15.4 Standard
Ordering Information
1
Introduction
Device
Device Marking
Package
MC13192FC
13192
QFN-32
MC13192FCR2
(Tape and reel)
13192
QFN-32
Contents
1
2
3
4
5
6
7
8
9
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 4
Data Transfer Modes . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics . . . . . . . . . . . . . . . 7
Functional Description . . . . . . . . . . . . . . . . 11
Pin Connections . . . . . . . . . . . . . . . . . . . . . . 14
Applications Information . . . . . . . . . . . . . . . 17
Packaging Information . . . . . . . . . . . . . . . . . 23
for
The MC13192 is a short range, low power, 2.4 GHz
Industrial, Scientific, and Medical (ISM) band
transceivers. The MC13192 contains a complete
802.15.4 physical layer (PHY) modem designed for the
IEEE® 802.15.4 Standard which supports peer-to-peer,
star, and mesh networking.
.
ns
sig
De
When combined with an appropriate microcontroller
(MCU), the MC13192 provide a cost-effective solution
for short-range data links and networks. Interface with
the MCU is accomplished using a four wire serial
peripheral interface (SPI) connection and an interrupt
request output which allows for the use of a variety of
processors. The software and processor can be scaled to
fit applications ranging from simple point-to-point
systems, through complete ZigBee™ networking.
w
Ne
The MC13192 includes the 802.15.4 PHY/MAC for use
with the HCS08 Family of MCUs. The MC13192 can be
used with Freescale’s IEEE 802.15.4 MAC and
BeeStack, which is Freescale’s ZigBee 2006 compliant
protocol stack.
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2004, 2005, 2006, 2007, 2008. All rights reserved.
Features
For more detailed information about MC13192 operation, refer to the MC13192 Reference Manual,
(MC13192RM).
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
Applications include, but are not limited to, the following:
• Remote control and wire replacement in industrial systems such as wireless sensor networks
• Factory automation and motor control
• Energy Management (lighting, HVAC, etc.)
• Asset tracking and monitoring
Potential consumer applications include:
• Home automation and control (lighting, thermostats, etc.)
• Human interface devices (keyboard, mice, etc.)
• Remote control
• Wireless toys
The transceiver includes a low noise amplifier, 1.0 mW power amplifier (PA), PLL with internal voltage
controlled oscillator (VCO), on-board power supply regulation, and full spread-spectrum encoding and
decoding. The device supports 250 kbps Offset-Quadrature Phase Shift Keying (O-QPSK) data in 2.0
MHz channels with 5.0 MHz channel spacing per the 802.15.4 Standard. The SPI port and interrupt request
output are used for receive (RX) and transmit (TX) data transfer and control.
2
Features
•
.
ns
sig
De
•
•
•
w
Ne
•
•
•
for
•
•
•
•
•
•
Supports 250 kbps O-QPSK data in 5.0 MHz channels and full spread-spectrum encode and decode
(compatible with the 802.15.4 Standard)
Operates on one of 16 selectable channels in the 2.4 GHz band
RX sensitivity of = 15 MHz
-
25
31
42
41
49
-
dB
dB
dB
dB
dB
Frequency Error Tolerance
-
-
200
kHz
Symbol Rate Error Tolerance
-
-
80
ppm
Sensitivity for 1% Packet Error Rate (PER) (-40 to +85 °C)
Sensitivity for 1% Packet Error Rate (PER) (+25 °C)
Saturation (maximum input level)
SENSmax
for
Table 5. Transmitter AC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.
Parameters measured at connector J5 of evaluation circuit.)
w
Ne
Characteristic
Symbol
Power Spectral Density (-40 to +85 °C) Absolute limit
Power Spectral Density (-40 to +85 °C) Relative limit
Pout
Maximum Output Power2
EVM
Output Power Control Range (-27 dBm to +4 dBm typical)
Over the Air Data Rate
2nd Harmonic
3rd Harmonic
2
Max
Unit
-
-47
-
dBm
-
47
-
-3
0
3
4
Error Vector Magnitude
1
Typ
.
ns
sig
De
Nominal Output Power1
Min
dBm
dBm
-
20
35
%
-
31
-
dB
-
250
-
kbps
-
-42
-
dBc
-
-44
-
dBc
SPI Register 12 programmed to 0x00BC which sets output power to nominal (0 dBm typical).
SPI Register 12 programmed to 0x00FF which sets output power to maximum.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
9
Electrical Characteristics
Table 6. Digital Timing Specifications
(VBATT, VDDINT = 2.7 V, TA = 25 °C, frequency = 16 MHz, unless otherwise noted.
SPI timing parameters are referenced to Figure 8.
Symbol
T1
T2
T3
T4
T5
T6
T7
Min
Typ
Max
Unit
SPICLK period
125
nS
Pulse width, SPICLK low
50
nS
Pulse width, SPICLK high
50
nS
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
T0
Parameter
Delay time, MISO data valid from falling SPICLK
15
nS
Setup time, CE low to rising SPICLK
15
nS
Delay time, MISO valid from CE low
15
nS
Setup time, MOSI valid to rising SPICLK
15
nS
Hold time, MOSI valid from rising SPICLK
15
nS
RST minimum pulse width low (asserted)
250
nS
Figure 6 shows a typical AC parameter evaluation circuit.
J5
SMA
J6
SMA
2
Y1
TSX-10A@16Mhz
1
1
2
4
2
3
T2
+
C1
220pF
+
C2
220pF
L1
8.2nH
1
2
3
4
5
6
7
8
RFINRFIN+
GND
GND
PAO+
PAOGND
GPIO4
GPIO6
GPIO5
VDDINT
VDDD
IRQ
CE
MISO
MOSI
24
23
22
21
20
19
18
17
J1
R1
47k
GPIO1
R3
10k
+
IRQ
w
Ne
MC13192
GPIO3
GPIO2
GPIO1
RST
RXTXEN
ATTN
CLKO
SPICLK
6.8nH
R2 200
C6
0.1uF
for
L2
VDDA
VBATT
VDDVCO
VDDLO1
VDDLO2
XTAL2
XTAL1
GPIO7
U1
32
31
30
29
28
27
26
25
C8
10pF
C3
220pF
Baud SEL
9
10
11
12
13
14
15
16
C7
10pF
C5
9pF
5
1
5
T1
2450BL15B200
4
3
2450BL15B200
2
1
C4
9pF
RTXENi
RTXENi
GPIO2
GPIO1
MOSI
CE
VCC
R4
47k
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
J3
PA2
GPIO2
2
1
MCU RESET
ATTN
SPI_CLK
MISO
CLOCK Sel
J7
1
2
3
MCU Interface
ABEL RESET
CLKO
RESET
.
ns
sig
De
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
HEADER 10X2
Wake Up
J4
16 MHz CLK
R6
47k
J2
1
2
RXD
R5
47k
Figure 6. Parameter Evaluation Circuit
MC13192 Technical Data, Rev. 3.3
10
Freescale Semiconductor
Functional Description
6
Functional Description
6.1
MC13192 Operational Modes
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
The MC13192 has a number of operational modes that allow for low-current operation. Transition from
the Off to Idle mode occurs when RST is negated. Once in Idle, the SPI is active and is used to control the
IC. Transition to Hibernate and Doze modes is enabled via the SPI. These modes are summarized, along
with the transition times, in Table 7. Current drain in the various modes is listed in Table 3, DC Electrical
Characteristics.
Table 7. MC13192 Mode Definitions and Transition Times
Mode
Off
Transition Time
To or From Idle
Definition
All IC functions Off, Leakage only. RST asserted. Digital outputs are tri-stated including 10 - 25 ms to Idle
IRQ
Hibernate
Doze
Idle
Crystal Reference Oscillator Off. (SPI not functional.) IC Responds to ATTN. Data is
retained.
7 - 20 ms to Idle
Crystal Reference Oscillator On but CLKO output available only if Register 7, Bit 9 = 1
for frequencies of 1 MHz or less. (SPI not functional.) Responds to ATTN and can be
programmed to enter Idle Mode through an internal timer comparator.
(300 + 1/CLKO) µs
to Idle
Crystal Reference Oscillator On with CLKO output available. SPI active.
Receive
Crystal Reference Oscillator On. Receiver On.
144 µs from Idle
Transmit
Crystal Reference Oscillator On. Transmitter On.
144 µs from Idle
for
6.2
Serial Peripheral Interface (SPI)
w
Ne
The host microcontroller directs the MC13192, checks its status, and reads/writes data to the device
through the 4-wire SPI port. The transceiver operates as a SPI slave device only. A transaction between
the host and the MC13192 occurs as multiple 8-bit bursts on the SPI. The SPI signals are:
1. Chip Enable (CE) - A transaction on the SPI port is framed by the active low CE input signal. A
transaction is a minimum of 3 SPI bursts and can extend to a greater number of bursts.
2. SPI Clock (SPICLK) - The host drives the SPICLK input to the MC13192. Data is clocked into the
master or slave on the leading (rising) edge of the return-to-zero SPICLK and data out changes
state on the trailing (falling) edge of SPICLK.
.
ns
sig
De
NOTE
For Freescale microcontrollers, the SPI clock format is the clock phase
control bit CPHA = 0 and the clock polarity control bit CPOL = 0.
3. Master Out/Slave In (MOSI) - Incoming data from the host is presented on the MOSI input.
4. Master In/Slave Out (MISO) - The MC13192 presents data to the master on the MISO output.
A typical interconnection to a microcontroller is shown in Figure 7.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
11
Functional Description
MCU
MC13192
Shift Register
MISO
TxD
MOSI
Sclk
SPICLK
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
RxD
Baud Rate
Generator
Chip Enable (CE)
Shift Register
CE
Figure 7. SPI Interface
Although the SPI port is fully static, internal memory, timer and interrupt arbiters require an internal clock
(CLKcore), derived from the crystal reference oscillator, to communicate from the SPI registers to internal
registers and memory.
6.2.1
SPI Burst Operation
The SPI port of an MCU transfers data in bursts of 8 bits with most significant bit (MSB) first. The master
(MCU) can send a byte to the slave (transceiver) on the MOSI line and the slave can send a byte to the
master on the MISO line. Although an MC13192 transaction is three or more SPI bursts long, the timing
of a single SPI burst is shown in Figure 8.
SPI Burst
1
2
3
4
for
CE
5
T4
Valid
T6
T5
T1
T3
Valid
Valid
T0
.
ns
sig
De
MOSI
8
T2
T7
MISO
7
w
Ne
SPICLK
6
Figure 8. SPI Single Burst Timing Diagram
SPI digital timing specifications are shown in Table 6.
MC13192 Technical Data, Rev. 3.3
12
Freescale Semiconductor
Functional Description
6.2.2
SPI Transaction Operation
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
Although the SPI port of an MCU transfers data in bursts of 8 bits, the MC13192 requires that a complete
SPI transaction be framed by CE, and there will be three (3) or more bursts per transaction. The assertion
of CE to low signals the start of a transaction. The first SPI burst is a write of an 8-bit header to the
transceiver (MOSI is valid) that defines a 6-bit address of the internal resource being accessed and
identifies the access as being a read or write operation. In this context, a write is data written to the
MC13192 and a read is data written to the SPI master. The following SPI bursts will be either the write
data (MOSI is valid) to the transceiver or read data from the transceiver (MISO is valid).
Although the SPI bus is capable of sending data simultaneously between master and slave, the MC13192
never uses this mode. The number of data bytes (payload) will be a minimum of 2 bytes and can extend to
a larger number depending on the type of access. After the final SPI burst, CE is negated to high to signal
the end of the transaction. Refer to the MC13192 Reference Manual, (MC13192RM) for more details on
SPI registers and transaction types.
An example SPI read transaction with a 2-byte payload is shown in Figure 9.
CE
Clock Burst
SPICLK
MISO
MOSI
Valid
Valid
Valid
for
Header
Read data
Figure 9. SPI Read Transaction Diagram
w
Ne
.
ns
sig
De
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
13
Pin Connections
7
Pin Connections
Table 8. Pin Function Description
Pin #
2
3
4
5
6
7
Type
Description
RFIN-
RF Input
LNA negative differential input.
RFIN+
RF Input
LNA positive differential input.
Functionality
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
1
Pin Name
Not Used
Tie to Ground.
Not Used
Tie to Ground.
PAO+
RF Output /DC Input
Power Amplifier Positive Output. Open drain. Connect
to VDDA.
PAO-
RF Output/DC Input
Power Amplifier Negative Output. Open drain.
Connect to VDDA.
SM
Test mode pin. Tie to Ground
Tie to Ground for
normal operation
Digital Input/ Output
General Purpose Input/Output 4.
See Footnote 1
GPIO31
Digital Input/ Output
General Purpose Input/Output 3.
See Footnote 1
GPIO21
Digital Input/ Output
General Purpose Input/Output 2. When gpio_alt_en,
Register 9, Bit 7 = 1, GPIO2 functions as a “CRC
Valid” indicator.
See Footnote 1
GPIO11
Digital Input/ Output
General Purpose Input/Output 1. When gpio_alt_en,
Register 9, Bit 7 = 1, GPIO1 functions as an “Out of
Idle” indicator.
See Footnote 1
12
RST
Digital Input
Active Low Reset. While held low, the IC is in Off Mode
and all internal information is lost from RAM and SPI
registers. When high, IC goes to IDLE Mode, with SPI
in default state.
13
RXTXEN2
Digital Input
Active High. Low to high transition initiates RX or TX See Footnote 2
sequence depending on SPI setting. Should be taken
high after SPI programming to start RX or TX
sequence and should be held high through the
sequence. After sequence is complete, return
RXTXEN to low. When held low, forces Idle Mode.
14
ATTN2
Digital Input
Active Low Attention. Transitions IC from either
Hibernate or Doze Modes to Idle.
15
CLKO
Digital Output
Clock output to host MCU. Programmable frequencies
of:
16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 62.5 kHz,
32.786+ kHz (default),
and 16.393+ kHz.
16
SPICLK2
Digital Clock Input
External clock input for the SPI interface.
See Footnote 2
17
MOSI2
Digital Input
Master Out/Slave In. Dedicated SPI data input.
See Footnote 2
18
MISO3
Digital Output
Master In/Slave Out. Dedicated SPI data output.
See Footnote 3
19
CE2
Digital Input
Active Low Chip Enable. Enables SPI transfers.
See Footnote 2
9
10
11
for
GPIO41
8
w
Ne
.
ns
sig
De
See Footnote 2
MC13192 Technical Data, Rev. 3.3
14
Freescale Semiconductor
Pin Connections
Table 8. Pin Function Description (continued)
Pin #
20
IRQ
Type
Description
Digital Output
Functionality
Active Low Interrupt Request.
Open drain device.
Programmable 40
kΩ internal pull-up.
Interrupt can be
serviced every 6 µs
with 4
kΩ.
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
21
Pin Name
Power Output
Digital regulated supply bypass.
Decouple to ground.
VDDINT
Power Input
Digital interface supply & digital regulator input.
Connect to Battery.
2.0 to 3.4 V.
Decouple to ground.
GPIO51
Digital Input/Output
General Purpose Input/Output 5.
See Footnote 1
GPIO61
Digital Input/Output
General Purpose Input/Output 6.
See Footnote 1
GPIO71
Digital Input/Output
General Purpose Input/Output 7.
See Footnote 1
XTAL1
Input
Crystal Reference oscillator input.
Connect to 16 MHz
crystal and load
capacitor.
XTAL2
Input/Output
Crystal Reference oscillator output
Note: Do not load this pin by using it as a 16 MHz
source. Measure 16 MHz output at Pin 15,
CLKO, programmed for 16 MHz. See the
MC13192 Reference Manual for details.
Connect to 16 MHz
crystal and load
capacitor.
28
VDDLO2
Power Input
LO2 VDD supply. Connect to VDDA externally.
29
VDDLO1
Power Input
LO1 VDD supply. Connect to VDDA externally.
30
VDDVCO
Power Output
VCO regulated supply bypass.
Decouple to ground.
31
VBATT
Power Input
Analog voltage regulators Input. Connect to Battery.
Decouple to ground.
32
VDDA
Power Output
Analog regulated supply Output. Connect to directly Decouple to ground.
VDDLO1 and VDDLO2 externally and to PAO±
through a frequency trap.
Note: Do not use this pin to supply circuitry external to
the chip.
EP
Ground
22
23
24
25
26
27
for
VDDD
w
Ne
1
.
ns
sig
De
External paddle / flag ground.
Connect to ground.
The transceiver GPIO pins default to inputs at reset. There are no programmable pullups on these pins. Unused GPIO pins
should be tied to ground if left as inputs, or if left unconnected, they should be programmed as outputs set to the low state.
2 During low power modes, input must remain driven by MCU.
3 By default MISO is tri-stated when CE is negated. For low power operation, miso_hiz_en (Bit 11, Register 07) should be set
to zero so that MISO is driven low when CE is negated.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
15
Pin Connections
PAO+
GPIO7
IRQ
MC13192
PAO-
CE
GPIO4
9
10
11
12
13
14
MISO
15
SPICLK
SM
CLKO
8
EP
ATTN
7
VDDD
RXTXEN
6
NC
RST
5
GPIO5
VDDINT
GPIO1
4
GPIO6
NC
GPIO2
3
25
RFIN+
GPIO3
2
RFIN-
26
XTAL1
27
XTAL2
28
VDDLO2
29
VDDLO1
VDDVCO
VBATT
30
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
1
31
VDDA
32
MOSI
24
23
22
21
20
19
18
17
16
for
Figure 10. Pin Connections (Top View)
w
Ne
.
ns
sig
De
MC13192 Technical Data, Rev. 3.3
16
Freescale Semiconductor
Applications Information
8
Applications Information
This section provides application specific information regarding crystal oscillator reference frequency, a
basic design example for interfacing the MC13192 to an MCU and recommended crystal usage.
Crystal Oscillator Reference Frequency
ed
nd
me .
om 0x
ec 32
t R C1
No e M
Us
8.1
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC13192 transceiver provides onboard crystal trim capacitors to assist in meeting this
performance.
for
The primary determining factor in meeting this specification is the tolerance of the crystal oscillator
reference frequency. A number of factors can contribute to this tolerance and a crystal specification will
quantify each of them:
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
w
Ne
Freescale requires the use of a 16 MHz crystal with a