Archived by Freescale Semiconductor, Inc., 2009
Freescale Semiconductor
Technical Data
MC145011
Rev. 5.0, 11/2006
The CMOS MC145011 is an advanced smoke detector component containing
sophisticated very-low-power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light
from minute smoke particles or other aerosols. When detection occurs, a pulsating
alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer.
The variable-gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors C1 and C2, C1 being the larger, determine the
gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local-smoke condition. High gain is used during push
button test. During standby, the special monitor circuit which periodically checks for
degraded chamber sensitivity uses high gain, also.
The I/O pin, in combination with VSS, can be used to interconnect up to 40 units
for common signaling. An on-chip current sink provides noise immunity when the I/
O is an input. A local-smoke condition activates the short-circuit-protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/
O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/
or initiate auto-dialers.
While in standby, the low-supply detection circuitry conducts periodic checks using a load current from the LED pin. The trip point is set using two external resistors.
The supply for the MC145011 must be a dc power source capable of supplying 35
mA continuously and 45 mA peak. When the MC145011 is in standby, an external
LED is continuously illuminated to indicate that the device is receiving power.
An extinguished LED accompanied by a pulsating audible alarm indicates a local-smoke condition. A pulsating audible alarm with the LED illuminated indicates
a remote-smoke condition. A beep or chirp indicates a low-supply condition or degraded chamber sensitivity. A low-supply condition does not affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low-supply condition and degraded
chamber sensitivity can be distinguished by performing a push button (chamber)
test. This circuit is designed to operate in smoke detector systems that comply with
UL217 and UL268 specifications.
Features
•
•
•
•
•
•
•
Operating Voltage Range: 6 to 12 V
Operating Temperature Range: -10 to 60°C
Average Standby Supply Current (Visible LED Illuminated): 20 mA
Power-On Reset Places IC in Standby Mode (Non-Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors
Pb-Free Packaging Designated by Suffix Code ED
MC145011
PHOTOELECTRIC SMOKE
DETECTOR IC WITH I/O FOR
LINE-POWERED APPLICATIONS
P SUFFIX
ED SUFFIX (PB-FREE)
PLASTIC DIP
CASE 648-08
DW SUFFIX
PLASTIC SOIC
CASE 751G-04
C1 1
C2 2
DETECT 3
14 VSS
STROBE 4
13 R1
VDD 5
12 OSC
IRED 6
11 LED
I/O 7
BRASS 8
MC145011P
MC145011ED
MCZ145011DW
Package
Plastic Dip
SOIC Package
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to
permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
10 FEEDBACK
9 SILVER
Figure 1. Pin Connections
ORDERING INFORMATION
Device
16 TEST
LOW-SUPPLY
15
TRIP
Archive Information
Archive Information
Photoelectric Smoke Detector IC
with I/O For Line-Powered
Applications
Archived by Freescale Semiconductor, Inc., 2009
C1 C2
1 2
OSC
R1
Archive Information
TEST
12 OSC
13
16
-
GAIN
VDD - 3.5 V
REF
STROBE
LOW-SUPPLY
TRIP
15
Smoke
GATE
ON/OFF
Timing
Logic
Gate
On/Off
4
COMP
+
7
Alarm
Logic
Horn Modulator
And Driver
VDD - 5 V
REF
8
9
BRass
SILVER
10
6
FEEDBACK
IRED
11
COMP
+
I/O
LED
PIN 5 = VDD
PIN 14 = VSS
Figure 2. Block Diagram
Table 1. Maximum Ratings(1)
(Voltages referenced to VSS)
Parameter
DC Supply Voltage
DC Input Voltage
C1, C2, DETECT
OSC, LOW-SUPPLY TRIP
I/O
FEEDBACK
Test
DC Input Current, per Pin
Symbol
Value
Unit
VDD
-0.5 to +12
V
VIN
-0.25 to VDD +0.25
-0.25 to VDD +0.25
-0.25 to VDD +10
-15 to +25
-1.0 to VDD +0.25
V
IIN
±10
mA
DC Output Current, per Pin
IOUT
±25
mA
DC Supply Current, VDD and VSS Pins
IDD
+25 / -150
mA
PD
1200(2)
350(3)
mW
TSTG
-55 to +125
°C
TL
260
°C
Power Dissipation in Still Air
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
5 Seconds
Continuous
1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits
in the Electrical Characteristics tables.
2. Derating: -12 mW/°C from 25° to 60°C.
3. Derating: - 3.5 mW/°C from 25° to 60°C.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin
and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD except for the I/O, which can exceed VDD, and the Test input, which
can go below VSS.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs and/or an unused I/O
must be left open.
MC145011
2
Sensors
Freescale Semiconductor
Archive Information
AMP
LOW SUPPLY
3
ZERO
DETECT
Archived by Freescale Semiconductor, Inc., 2009
Archive Information
Characteristic
Symbol
Test Condition
VDD/VDC
Min
Max
Unit
—
6.0
12
V
—
6.5
7.8
V
Power Supply Voltage Range
VDD
Supply Threshold Voltage, Low-Supply Alarm
VTH
Low-Supply Trip: VIN = VDD/3
Average Operating Supply Current,
Excluding the Visible LED Current
(per Package)
IDD
Standby
Configured per Figure 8
12.0
—
12
μA
Peak Supply Current,
Excluding the Visible LED Current
(per Package)
IDD
During Strobe On, IRED Off
Configured per Figure 8
12.0
—
2.0
mA
During Strobe On, IRED On
Configured per Figure 8
12.0
—
3.0
Low-Level Input Voltage
I/O
FEEDBACK
Test
VIL
9.0
9.0
9.0
—
—
—
1.5
2.7
7.0
V
High-Level Input Voltage
I/O
FEEDBACK
Test
VIH
9.0
9.0
9.0
3.2
6.3
8.5
—
—
—
V
OSC, DETECT
LOW-SUPPLY TRIP
FEEDBACK
IIN
VIN = VSS or VDD
VIN = VSS or VDD
VIN = VSS or VDD
12.0
12.0
12.0
—
—
—
±100
±100
± 00
nA
Low-Level Input Current
Test
IIL
VIN = VSS
12.0
—
-1
μA
Pull-Down Current
Test
I/O
IIH
VIN = VDD
No Local Smoke, VIN = VDD
No Local Smoke, VIN = 17 V
9.0
9.0
12.0
0.5
25
—
10
100
140
μA
Input Current
Low-Level Output Voltage
LED
SILVER, BRASS
VOL
IOUT = 10 mA
IOUT = 16 mA
6.5
6.5
—
—
0.6
1.0
V
High-Level Output Voltage
SILVER, BRASS
VOH
IOUT = -16 mA
6.5
5.5
—
V
STROBE
VOUT
Inactive, IOUT = -1 μA
Active, IOUT = 100 μA to 500 μA
(Load Regulation)
—
9.0
VDD - 0.1
VDD - 4.4
—
VDD - 5.6
V
Inactive, IOUT = 1 μA
Active, IOUT = 6 mA
(Load Regulation)
—
9.0
—
2.25(1)
0.1
3.75(1)
Local Smoke, VOUT = 4.5 V
6.5
-4
—
Local Smoke, VOUT = VSS
(Short Circuit Current)
12.0
—
-16
12.0
—
±1
μA
Output Voltage
(For Line Regulation, see
Pin Descriptions)
IRED
High-Level Output Current
I/O
Off-State Output Leakage Current
Common Mode
Voltage Range
Smoke Comparator
Reference Voltage
IOH
Archive Information
Table 2. Electrical Characteristics
(TA = -10 to 60°C Unless Otherwise Indicated, Voltages Referenced to VSS)
mA
LED
IOZ
VOUT = VSS or VDD
C1, C2, DETECT
VIC
Local Smoke, Push button Test, or
Chamber Sensitivity Test
—
VDD - 4
VDD - 2
V
Internal
Vref
Local Smoke, Push button Test, or
Chamber Sensitivity Test
—
VDD 3.08
VDD - 3.92
V
1. TA = 25°C only.
MC145011
Sensors
Freescale Semiconductor
3
Archived by Freescale Semiconductor, Inc., 2009
Table 3. AC Electrical Characteristics
(Reference Timing Diagram Figure 6 and Figure 7) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 8: R1 = 100.0 KΩ,
C3 = 1500.0 pF, R2 = 10.0 MΩ)
Characteristic
1
Oscillator Period
2
LED Status
(1)
Symbol
1/fOSC
tLED
Test Condition
Free-Running Sawtooth
Measured at Pin 12
Min
Max
Unit
9.5
11.5
ms
No Local Smoke, and
No Remote Smoke
Illuminated
3
Remote Smoke, but
No Local Smoke
Illuminated
4
Local Smoke or Push
button Test
5
STROBE Pulse Width
6
IRED Pulse Period
9.5
11.5
ms
Smoke Test
9.67
11.83
s
7
Chamber Sensitivity Test,
without Local Smoke
38.9
47.1
8
Push button Test
0.302
0.370
tw(IRED)
94
116
μs
tR
—
30
μs
9
IRED Pulse Width
10
IRED Rise Time
IRED Fall Time
11
11, 12
SILVER and BRASS Modulation Period
SILVER and BRASS Duty Cycle
tW(STB)
Extinguished
tIRED
—
200
tMOD
tF
Local or Remote Smoke
297
363
ms
tON/tMOD
Local or Remote Smoke
73
77
%
13
SILVER and BRASS Chirp Pulse Period
tCH
Low Supply or Degraded
Chamber Sensitivity
38.9
47.1
s
14
SILVER and BRASS Chirp Pulse Width
tW(CH)
Low Supply or Degraded
Chamber Sensitivity
9.5
11.5
ms
15
Rising Edge on I/O to Smoke Alarm Response Time
tRR
Remote Smoke,
No Local Smoke
—
800
ms
16
Strobe Pulse Period
tSTB
s
Smoke Test
9.67
11.83
17
Chamber Sensitivity Test,
without Local Smoke
38.9
47.1
18
Low Supply Test,
without Local Smoke
38.9
47.1
19
Push button Test
0.302
0.370
1. Oscillator period T (= TR + TF) is determined by the external components R1, R2, and C3 where TR = (0.6931) R2 C3 and
TF = (0.6931) R1 C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table.
Table 4. Pin Description
Pin No.
Pin Name
Description
1
C1
A capacitor connected to this pin as shown in Figure 8. determines the gain of the on-chip photo amplifier during push
button test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from
background reflections in the chamber during push button test.
Av ≈ 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000.
2
C2
A capacitor connected to this pin as shown in Figure 8. determines the gain of the on-chip photo amplifier except during
push button or chamber sensitivity tests.
Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the IRED pulse, after two consecutive local
smoke detections.
Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads.
3
DETECT
This input to the high-gain pulse amplifier is tied to the cathode of an external photodiode. The photodiode should have
low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero
bias.
The Detect input must be ac/dc decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this
pin must be minimized, also. See Figure 9.
MC145011
4
Sensors
Freescale Semiconductor
Archive Information
Archive Information
No.
Archived by Freescale Semiconductor, Inc., 2009
Pin No.
Pin Name
Description
4
STROBE
This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is
± 0.2% °C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to
12 V. Strobe is tied to external resistor string R8, R9, and R10.
5
VDD
This pin is connected to the positive supply potential and may range from + 6 to + 12 V with respect to VSS.
6
IRED
This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must
have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The
supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6 to 12 V. The IRED pulse width (active-high) is
determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 μs.
To minimize noise impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the
end of Strobe pulses for Smoke Tests, Chamber Sensitivity Test, and Push button Test.
7
I/O
This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used
as the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for
an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive
current from a sending unit at a higher supply voltage.
I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers.
As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 625 ms during
standby (using the recommended component values). A local-smoke condition or the push button-test mode forces this
current-limited output to source current. All input signals are ignored when I/O is sourcing current.
If unused, I/O must be left unconnected.
8
BRASS
This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer
and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either
local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity.
9
SILVER
This half of the push-pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the
horn-starting capacitor.
10
FEEDBACK This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting
resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD.
11
LED
This active-low open-drain output directly drives an external visible LED.
The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests,
chamber sensitivity test, push button test, or any alarm signals.
The LED also provides a visual indication of the detector status as follows, assuming the component values shown in
Figure 8:
Standby (includes low-supply and chamber sensitivity tests) - constantly illuminated
Local Smoke - constantly extinguished
Remote Smoke - constantly illuminated
Push button Test - constantly extinguished (system OK); constantly illuminated (system problem)
12
OSC
This pin is used in conjunction with external resistor R2 (10 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to
form an oscillator with a nominal period of 10.5 ms.
13
R1
This pin is used in conjunction with resistor R1 (100 kΩ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine
the IRED pulse width. With this RC combination, the nominal pulse width is 105 μs.
14
VSS
15
LOWSUPPLY
TRIP
This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground.
This pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is
obtained through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage
(in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units.
16
TEST
This input has an on-chip pull-down device and is used to manually invoke a test mode.
The Push button Test mode is initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally-open push
button switch to VDD). After one oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence
of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background
reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. After the
second IRED pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling
for system testing. When the Push button Test switch is released, the Test input returns to VSS due to the on-chip pulldown device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke
condition. After two additional IRED pulses, less than a second, the IC exits the alarm mode and returns to standby
timing.
MC145011
Sensors
Freescale Semiconductor
5
Archive Information
Archive Information
Table 4. Pin Description (Continued)
1.04
1.02
Pulse Width Of IRED
1.00
Period Or Pulse Width
Of Other Parameters
0.98
TA = 25°C
0.96
Archive Information
6.0
7.0
8.0
9.0
11.0
10.0
12.0
VDD, Power Supply Voltage (V)
AC Parameter (Normalized To 25oC Value)
Figure 3. AC Characteristics versus Supply
1.02
1.01
Pulse Width Of IRED
1.00
Period Or Pulse Width
Of Other Parameters
0.99
VDD = 9.0 V
0.98
-10
0
10
30
20
40
50
60
TA, Ambient Temperature (°C)
NOTE: Includes external component variations. See Figure 5.
Figure 4. AC Characteristics versus Temperature
Component Value (Normalized To
25oC Value)
1.03
1.02
1.01
10 MΩ Carbon Composition
1.00
100 kΩ Metal Film
1500 pF Dipped Mica
0.99
0.98
-10
0
10
20
30
40
50
60
TA, Ambient Temperature (°C)
NOTE: These components were used to generate Figure 4.
Figure 5. RC Component Variation Over Temperature
MC145011
6
Sensors
Freescale Semiconductor
Archive Information
AC Parameter (Normalized To 9.0 V Value)
Archived by Freescale Semiconductor, Inc., 2009
Sensors
Freescale Semiconductor
16
6
Power-on
Reset
2
17
No Low Supply
Chamber Sensitivity Ok
(Continuously Illuminated)
6
7
NOTES: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
SILVER, BRASS
Enable
(Internal)
LED
(Pin 11)
STROBE
(Pin 4)
IRED
(Pin 6)
Smoke Test
(Internal)
Chamber Test
(Internal)
Low Supply Test
(Internal)
OSC
(Pin 12)
1
9
14
Archive Information
Chirps
Indicate
Low Supply
13
18
Archive Information
Chirps
Indicate
Degraded
Chamber
Sensitivity
13
Archived by Freescale Semiconductor, Inc., 2009
Figure 6. Standby Timing Diagram
MC145011
7
8
No
Smoke
4
90%
12
10%
10
11
(Remote Smoke = Don't Care)
Local Smoke
(EXTINGUISHED)
5
6
10
(As Output)
(Not Performed)
(Not Performed)
NOTES: Numbers refer to the AC Electrical Characteristics Table.
Illustration is not to scale.
SILVER, BRASS
Enable
(Internal)
I/O
(Pin 7)
LED
(Pin 11)
STROBE
(Pin 4)
IRED
(Pin 6)
Chamber
Test
(Internal)
Low Supply
Test
(Internal)
IRED
9
Remote Smoke
(No Local Smoke)
Archive Information
No Smoke
15
3
(As Input)
(Continuously Illuminated)
Archive Information
Test
Push button
(As Output)
4
19
8
Archived by Freescale Semiconductor, Inc., 2009
Figure 7. Smoke Timing Diagram
MC145011
Sensors
Freescale Semiconductor
Archived by Freescale Semiconductor, Inc., 2009
1
2
R11 250 k
R9†
5k
3
R10
4.7 k
D1
IR DETECTOR
4
R12
1k
D2
IR Emitter
+
To Other
MC145011(S),
Escape Light (S),
Auxiliary Alarm (S),
Remote Alarm (S),
And/or Auto-dialer
5
6
Q1
IR
Current
TEST
C1
Push button
Test
16
R6
100 k
R14
560 Ω
R8
8.2 k
Archive Information
SW1
C2*
4700 pF
V+
C5
100 μF
+
1 TO 22 μF
C4**
R13*
4.7 TO 22
7
8
LOW-SUPPLY 15
TRIP
C2
VSS
DETECT
MC145011
STROBE
R1
VDD
OSC
IRED
LED
I/O
FEEDBACK
BRASS
SILVER
R7
47 k
14
Archive Information
C1
0.047 μF
13
12
R1
100 k
R2
10 M
C3
1500 pF
D3
Visible
LED
R3
11
470
10
R4
9
100 k
0.01 μF
C6
Horn
X1
2.2 M
R5
Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.
* C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.
† R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise
pickup is increased due to antenna effects. Shielding may be required.
** C4 should be 22 μF if B1 is a carbon battery. C4 could be reduced to 1 μF when an alkaline battery is used.
Figure 8. Typical Application
MC145011
Sensors
Freescale Semiconductor
9
Archived by Freescale Semiconductor, Inc., 2009
CALIBRATION
pin with 100 μA continuously drawn out of the pin for at least
one cycle on the OSC pin. To exit this mode, the Test pin is
floated for at least one OSC cycle.
In the calibration mode, the IRED pulse rate is increased
to one for every OSC cycle. Also, Strobe is always active low.
To facilitate checking the sensitivity and calibrating smoke
detectors, the MC145011 can be placed in a calibration
mode. In this mode, certain device pins are controlled/
reconfigure as shown in Table 5. To place the part in the
calibration mode, Pin 16 (Test) must be pulled below the VSS
Table 5. Configuration of Pins in the Calibration Mode
Comment
I/O
Disabled as an output. Forcing this pin high places the photo amp output on pin 1 or 2, as determined
by Low-Supply Trip. The amp's output appears as pulses and is referenced to VDD.
15
LOW-SUPPLY TRIP
If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on
pin 1. High: supervisory gain, amp output on pin 2.
10
FEEDBACK
Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low.
12
OSC
Driving this input high brings the internal clock high. Driving the input low brings the internal clock low.
If desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to
the normal mode of operation.
9
SILVER
This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate
that smoke has been detected. A static low level indicates no smoke.
8
BRASS
This pin becomes the smoke integrator output. That is, 2 consecutive smoke detections are required
for “on” (static high level) and 2 consecutive no-detections for “off” (static low level).
Do Not Run Any
Additional Traces
In This Region
C1
Pin 1
R14
C2
Pin 16
R8
R11
R10
D2
MOUNTED IN
CHAMBER
Pin 9
Pin 8
NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image.
Optional potentiometer R9 is not included.
Drawing is not to scale.
Leads on D1, R11, R8, and R10 and their associated traces must be kept as short as possible.
This practice minimizes noise pick up.
Pin 3 must be decoupled from all other traces.
Figure 9. Recommended PCB Layout
MC145011
10
Sensors
Freescale Semiconductor
Archive Information
Description
7
C2
Archive Information
Pin
Archived by Freescale Semiconductor, Inc., 2009
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
9
1
8
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
SEATING
PLANE
Archive Information
-TK
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
M
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
CATHODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
ANODE
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
INCHES
MILLIMETERS
MIN
MAX MIN MAX
0.740
0.770 18.80 19.55
0.250
0.270
6.35
6.85
0.145
0.175
3.69
4.44
0.015
0.021
0.39
0.53
0.040
0.70
1.02
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.008
0.015
0.21
0.38
0.110
0.130
2.80
3.30
0.295
0.305
7.50
7.74
0
10
0
10
0.020
0.040
0.51
1.01
Archive Information
-A-
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
COMMON DRAIN
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
GATE
SOURCE
CASE 648-08
ISSUE R
16-LEAD PLASTIC DIP
0.25
8X
PIN'S
NUMBER
M
B
A
10.55
10.05
2.65
2.35
0.25
0.10
16X
16
1
0.49
0.35
0.25
6
M
T A B
PIN 1 INDEX
14X
10.45
4 10.15
A
A
8
1.27
9
7.6
7.4
T
B
SEATING
PLANE
16X
0.1 T
5
0.75
0.25
X45˚
0.32
0.23
1.0
0.4
SECTION A-A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSTION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62mm.
7˚
0˚
CASE 751G-04
ISSUE D
16-LEAD SOIC
MC145011
Sensors
Freescale Semiconductor
11
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
support@freescale.com
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
MC145011
Rev. 5.0
11/2006
RoHS-compliant and/or Pb-free versions of Freescale products have the functionality
and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.
For information on Freescale’s Environmental Products program, go to http://
www.freescale.com/epp.
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2006. All rights reserved.
Archive Information
Archive Information
Archived by Freescale Semiconductor, Inc., 2009
工商网监
湘ICP备2023018690号
