MC33289DWR2

Freescale Semiconductor Advance Information Document Number: MC33289 Rev. 4.0, 6/2006 Dual High-Side Switch 40 mΩ 33289 The 33289 is a Dual High Side Switch (DHSS) dedicated for use in automotive applications. It is designed to drive typical inductive loads such as solenoid valves. This device consists of two independent 40 mΩ RDSON MOSFET channels plus corresponding control circuitry in a surface mount package. The 33289 can be interfaced directly to a microcontroller for input control and monitoring of diagnostic output. Each switch offers independent protection and diagnosis during overcurrent, overvoltage, and undervoltage conditions, as well as an overtemperature shutdown feature. A logic low on the Open Load Detect Enable pin (OLDE) minimizes bias current drain by disabling the open load circuitry current source. The device also has a very low quiescent current in standby mode. DUAL HIGH-SIDE SWITCH FEATURES • • • • • • • • • • • • DW SUFFIX) 98ASB42343B 20-PIN SOICW Designed to drive Automotive Inductive loads Operating Voltage Range from 6.0 V to 27 V Maximum Breakdown Voltage greater than 40 V 40 mΩ RDSON at 25°C Overtemperature Protection with Hysteresis Overcurrent protection Under Voltage Shutdown Over Voltage Shutdown Open Load Detection in Off-State Independent Diagnostic Output ESD Protection 2.0 kV Standby Current less than 5.0 µA at VBAT below 14 V ORDERING INFORMATION Device Temperature Range (TA) Package MC33289DW/R2 - 40°C to 125°C 20 SOICW VPWR 5.0 V 33289 VBAT MCU ST1 ST2 IN1 IN2 OLDE OUT1 OUT2 GND Figure 1. 33289 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006. All rights reserved. PIN CONNECTIONS PIN CONNECTIONS PIN ASSIGNMENT VBAT 1 20 VBAT VBAT 2 19 VBAT OUT1 3 18 OUT2 OUT1 4 17 OUT2 VBAT 5 16 VBAT VBAT 6 15 VBAT NC 7 14 NC IN1 8 13 IN2 ST1 9 12 ST2 OLDE 10 11 GND Figure 2. 33289 Pin Connections Table 1. Pin Function Description Pin Number Pin Name 1, 2, 5, 6, 15, 16, 19, 20 VBAT Supply Voltage These are the power supply pins of the device. These pins are directly connected with the lead frame of the package and are tied to the drain of the switching MOSFET. These pins can be directly connected to the battery voltage. In addition to their supply function, these pins participate to the thermal behavior of the device in conducting the heat from the switching MOSFET to the printed circuit board. 3, 4, 18, 17 OUT1 OUTPUT Channel 1 OUT2 OUTPUT Channel 2 Pins 3 and 4 are the output 1 pins. Pins 17 and 18 are the output 2 pins. They are directly connected to the source of the power MOSFET. These pins are used by the control circuitry to sense the device output voltage. The RDSON is 40 mΩ max per output at 25°C and will increase to a maximum of 75 mΩ at 150°C junction temperature. 8, 13 Pin Function IN1 INPUT Channel 1 IN2 INPUT Channel 2 Definition These are the device input pins which directly control their associated outputs. The levels are CMOS compatible. When the input is a logic low, the associated output MOSFET is in the off state. When input is high, the MOSFET is turned on and the load is activated. When both inputs are low, the device is in standby mode and its supply current is reduced. Each input pin has an internal active pull down, so that it will not float if disconnected. ST1 Status for Channel 1 ST2 Status for Channel 2 10 OLDE Open Load Detection Enable This pin is a digital input which enables the open load current diagnostic circuitry. When OLDE is a logic low, the open load circuitry is not powered and the device’s bias current draw is at a minimum. If OLDE is a logic high, the open load circuitry is functional at the price of a higher bias current draw. OLDE pin has a pull down resistor. 11 GND GROUND This is the GND pin of the device. 9, 12 These pins are the channel 1 and channel 2 fault detection flags. Their internal structure is an open drain architecture with an internal clamp at 6.0 V. An external pull up resistor connected to VDD (5.0 V) is needed. This is an active low output. If the device is in its normal condition the status lines will be high. If open load or other fault occurs, the associated channel status flag will be pulled low. See Functional Truth Table. 33289 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS VBAT VBAT VBAT VBAT VBAT VBAT VBAT VBAT OUT2 OUT2 Thermal Sensor Over Temp Charge Pump ST2 IN2 CHANNEL 2 OUT1 OUT1 Input Trigger IN1 OLDE U.V.& O.V. Lockout Open Load Over Current ST1 CHANNEL 1 GND Figure 3. Simplified Internal Block Diagram 33289 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VBAT and VBATC Voltage: Continuous/Pulse VBAT -0.3 to 41 V OUT1, OUT2 Voltage with Respect to GND: Continuous/Pulse VOUT -4.0 to 41 V OUT1, OUT2 to VBTAP Voltage: Continuous VOUT 41 V ST1, ST2 Voltage: Continuous/Pulse VST -0.3 to 7.0 V IN1, IN2 Voltage: Continuous VIN -0.3 to 7.0 V IN1, IN2, ST1, ST2, OLDE Current IIN +/-4.0 mA Human Body Model (1) VESD1 +/-2000 V Machine Model (1) VESD2 +/-200 V TJ -40 to 150 °C TST -55 to 150 °C RTHJA 70 °C/W Thermal Resistance Junction to lead: Both Channel on RTHJL1 15 °C/W Thermal Resistance Junction to lead: One Channel on RTHJL2 15 °C/W Thermal Resistance Junction to lead: Logic Die RTHJL3 30 °C/W ELECTRICAL RATINGS ESD all Pins THERMAL RATINGS Operating Junction Temperature Storage Temperature Thermal Resistance Junction to Ambient (2) Notes 1. EDS1 testing is performed in accordance with the Human Body Model (Czap = 100 pF, Rzap = 1500 Ω) EDS2 testing is performed in accordance with the Machine Model (Czap = 100 pF, Rzap = 0 Ω) 2. With minimum PCB dimensions. 33289 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Operating Voltage VBAT 6.0 Supply Current: Both Channels On IBAT1 Typ Max Unit VOV V POWER INPUT mA VBAT = 13.5 V; OLDE High Supply Current: One Channel On 6.0 IBAT2 5.0 VBAT = 13.5 V; OLDE High Supply Current: Both Channels Off µA IBAT3 5.0 IBAT_MAX mA VBAT = 13.5 V Output Off state leakage current per channel 30 µA IDSS VBAT = 13.5 V; IN1, 2, OLDE low, Both output grounded, TJ < 125°C Drain-Source On Resistance 0.1 mΩ 40 RDSON2 mΩ VBAT > 10 V, TAMB = 150°C Negative Inductive Clamp Voltage 5.0 RDSON1 VBAT > 10 V, TAMB = 25°C Drain-Source On Resistance mA 10 VBAT = 12.6 V; OLDE Low, TJ < 125°C Supply Current: Any State 16 75 VCLAMP IOUT = 1 A V -4.0 -1.0 INPUT CHARACTERISTICS High Input Voltage (IN1, IN2) High Input Voltage (OLDE) Low Input Voltage (IN1, IN2, OLDE) Logic Input Hysteresis IN1, IN2 Logic Input Current VIH 3.25 V VOLDEH 3.5 V VIL VHYST V 3.0 µA IIN 32.5 VCLMP At IIN = 1 mA Input Capacitance IN1, IN2 0.8 µA VIN = 3.25 V Logic Input Clamp Voltage 0.6 V IIN VIN = 1.5 V Logic Input Current 0.4 1.5 V 5.5 7.0 CIN RIN = 47 kΩ @ 100 kHz pF 80 STATUS CHARACTERISTICS Status Voltage VST IST = 1 mA; Output in fault Status Leakage Current VST = 5 V V 0.5 µA ISTLK 10 33289 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Status Pin Capacitance Symbol Min Typ Max CST Unit pF VST = 5 V 80 OVERLOAD PROTECTION CHARACTERISTICS Overcurrent latchoff threshold IOCT VBAT = 13.5 V 4.0 Thermal Shutdown TSHUT Thermal Shutdown Hysteresis THYST Overvoltage Shutdown Threshold 175 °C 10 °C V 27 38 0.1 2.0 V VUV Both IN1, IN2 logic high Undervoltage Shutdown Hysteresis 165 VOVHYST Both IN1, IN2 logic high Undervoltage Shutdown Threshold 150 9.0 VOV Both IN1, IN2 logic high Overvoltage Shutdown Hysteresis A V 4.75 6.0 VUVHYST Both IN1, IN2 logic high V 0.3 0.6 1.0 200 290 400 VOL 1.5 2.4 3.5 V VINOL 1.5 2.5 3.5 V OPEN CIRCUIT DETECTION CHARACTERISTICS Open Load Detect Current Open Load Threshold Voltage Openload threshold voltage µA IOL VOUT = 3.5 V, OLDE = 4.0 V 33289 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Description Symbol Min Typ Max Unit OVERLOAD PROTECTION CHARACTERISTICS Overcurrent latchoff delay µs TOCTDLY From OverCurrent Treshold achieved to Output Voltage = 10% VBAT Overcurrent latchoff status delay 30 µs TOCTSTDLY From Output Voltage = 10% VBAT to Status Flag < 1 V 50 OPEN CIRCUIT DETECTION CHARACTERISTICS Open Load to Status Low Delay Time µs TOLSTDT From IN = 1.5 to Status Flag < 1.5 V Open Load Detect BlankingTime 100 µs TOLDBT From IN = 1.5 to Openload circuitry enable 3.0 10 50 SWITCHING CHARACTERISTICS (3) Turn-on Slew Rate SRPOUT1 From 10% to VBAT -3.0 V Turn-on Slew Rate From VIN/2 to 90% VBAT 0.1 3.0 1.0 20 V/µs µs tDON From VIN/2 to 10% VBAT Turn-off Delay Time V/µs SRNOUT From 90% to 10% Turn-on Delay Time 20 SRPOUT2 From VBAT -3.0 V to 90% Turn-off Slew Rate V/µs 1.0 1.0 2.5 15 1.0 5.0 15 µs tDOFF Notes 3. 8 V < VBAT < 18 V, RLOAD = 7 Ω 33289 7 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS TYPICAL APPLICATIONS Battery VBAT VBAT VBAT VBAT VBAT VBAT VBAT VBAT OUT2 OUT2 Load 2 Thermal Sensor 5.0 V Over Temp Status pull-up resistors Charge Pump ST2 10 KΩ 10 KΩ IN2 CHANNEL 2 OUT1 OUT1 Input Trigger IN1 MCU U.V.& O.V. Lockout OLDE Over Current Open Load LOAD ST1 CHANNEL 1 GND Figure 4. MC33289 Typical Application Table 5. Functional Truth Table Conditions Normal Operating Conditions Overtemperature Channel 1 IN1 IN2 OUT1 OUT2 ST1 ST2 L L L L H H H L H L H H L H L H H H H H H H H H H X L X L H Overtemperature Channel 2 X H X L H L Overtemperature Channel 1/Channel 2 H H L L L L Open Load Channel 1 L X H X L H Open Load Channel 2 X L X H H L Overcurrent Channel 1 H X L X L H Overcurrent Channel 2 X H X L H L Undervoltage Condition X X L L H H Overvoltage Condition X X L L H H L = ‘Low level’; H = ‘High level’; X = ‘don’t care 33289 8 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below DW SUFFIX 20-PIN PLASTIC PACKAGE 98ASB42343B ISSUE J 33289 Analog Integrated Circuit Device Data Freescale Semiconductor 9 REVISION HISTORY REVISION HISTORY REVISION 4.0 DATE 6/2006 DESCRIPTION OF CHANGES • Implemented Revision History page • Converted to Freescale format • Updated to the prevailing form and style 33289 10 Analog Integrated Circuit Device Data Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MC33289 Rev. 4.0 6/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2006. All rights reserved.