MC33580BAPNAR2

Freescale Semiconductor Advance Information Document Number: MC33580 Rev. 6.0, 4/2007 Quad High-Side Switch (Quad 15 mΩ) 33580 The 33580 is one in a family of devices designed for low-voltage automotive and industrial lighting and motor control applications. Its four low RDS(ON) MOSFETs (four 15 mΩ) can control the high sides of four separate resistive or inductive loads. Programming, control, and diagnostics are accomplished using a 16-bit SPI interface. Additionally, each output has its own parallel input for pulse-width modulation (PWM) control if desired. The 33580 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush or motor stall intervals. Such programmability allows tight control of fault currents and can protect wiring harnesses and circuit boards as well as loads. The 33580 is packaged in a power-enhanced 12 x 12 nonleaded Power QFN package with exposed tabs. HIGH-SIDE SWITCH Features • Quad 15 mΩ High-Side Switches (at 25°C) • Operating Voltage Range of 6.0 V to 27 V with Standby Current < 5.0 µA • SPI Control of Overcurrent Limit, Overcurrent Fault Blanking Time, Output OFF Open Load Detection, Output ON / OFF Control, Watchdog Timeout, Slew Rates, and Fault Status Reporting • SPI Status Reporting of Overcurrent, Open and Shorted Loads, Overtemperature, Undervoltage and Overvoltage Shutdown, Fail-Safe Pin Status, and Program Status • Analog Current Feedback with Selectable Ratio • Analog Board Temperature Feedback • Enhanced -16 V Reverse Polarity VPWR Protection • Pb-Free Packaging Designated by Suffix Code PNA VDD VDD VPWR VDD PNA SUFFIX (Pb-FREE) 98ART10510D 24-PIN PQFN (12 x 12) ORDERING INFORMATION Device Temperature Range (TA) Package MC33580BAPNA/R2 - 40°C to 125°C 24 PQFN VPWR 33580 SO SCLK CS SI I/O MCU I/O I/O I/O I/O I/O A/D A/D GND VDD WAKE SI SCLK CS SO RST FS IN0 IN1 IN2 IN3 CSNS TEMP FSI VPWR HS0 GND LOAD 0 HS1 LOAD 1 HS2 LOAD 2 HS3 LOAD 3 GND Figure 1. 33580 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2007. All rights reserved. BLOCK DIAGRAM BLOCK DIAGRAM VDD VPWR VIC Internal Regulator IUP CS SCLK Selectable Slew Rate Gate Drive VIC SPI 3.0 MHz IDWN Over/Undervoltage Protection Selectable Overcurrent High Detection HS[0:3]: 70 A or 100 A SO SI RST WAKE FS IN0 Logic IN1 IN2 Selectable Overcurrent Low Detection Blanking Time 0.15 ms–155 ms HS0 Selectable Overcurrent Low Detection HS[0:3]: 4.8 A–18.2 A Open Load Detection IN3 Overtemperature Detection RDWN HS0 IDWN HS1 Programmable Watchdog 279 ms–2250 ms HS1 VIC HS2 HS2 FSI HS3 HS3 TEMP Temperature Feedback Selectable Output Current Recopy (Analog MUX) HS[0:3]: 1/13000 or 1/38000 GND CSNS Figure 2. 33580 Simplified Internal Block Diagram 33580 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS RST WAKE FS IN3 IN2 TEMP IN1 IN0 CSNS 9 8 7 6 5 4 3 2 1 SI SO 16 GND 17 HS3 18 SCLK 13 12 11 10 VDD CS Transparent Top View of Package 14 GND 24 FSI 23 GND 22 HS2 15 VPWR 19 20 21 HS1 NC HS0 Figure 3. 33580 Pin Connections Table 1. 33580 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 16. Pin Number Pin Name Pin Function 1 CSNS Output Output Current Monitoring 2 3 5 6 IN0 IN1 IN2 IN3 Input Serial Inputs The IN0 : IN3 high-side input pins are used to directly control HS0 : HS3 highside output pins, respectively. 4 TEMP Output Temperature Feedback This pin reports an analog value proportional to the temperature of the GND flag (pins 14, 17, 23). It is used by the MCU to monitor board temperature. 7 FS Output Fault Status (Active Low) This pin is an open drain configured output requiring an external pullup resistor to VDD for fault reporting. 8 WAKE Input Wake This input pin controls the device mode and watchdog timeout feature if enabled. 9 RST Input Reset This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current sleep mode. 10 CS Input Chip Select (Active Low) This input pin is connected to a chip select output of a master microcontroller (MCU). 11 SCLK Input Serial Clock This input pin is connected to the MCU providing the required bit shift clock for SPI communication. 12 SI Input Serial Input This pin is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy-chain of devices. Formal Name Definition The Current Sense pin sources a current proportional to the designated HS0 : HS3 output. 33580 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 33580 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 16. Pin Number Pin Name Pin Function 13 VDD 14, 17, 23 Formal Name Definition Power Digital Drain Voltage (Power) This pin is an external voltage input pin used to supply power to the SPI circuit. GND Ground Ground 15 VPWR Power Positive Power Supply This pin connects to the positive power supply and is the source of operational power for the device. 16 SO Output Serial Output This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy-chain of devices. 18 19 21 22 HS3 HS1 HS0 HS2 Output High-Side Outputs 20 NC N/A No Connect 24 FSI Input Fail-Safe Input These pins are the ground for the logic and analog circuitry of the device. Protected 15 mΩ high-side power output pins to the load. This pin may not be connected. The value of the resistance connected between this pin and ground determines the state of the outputs after a Watchdog timeout occurs. 33580 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Operating Voltage Range V VPWR(SS) Steady-State -16 to 41 VDD Supply Voltage VDD Input / Output Voltage (1) See note SO Output Voltage (1) (1) -0.3 to 5.5 V - 0.3 to 7.0 V VSO - 0.3 to VDD + 0.3 V WAKE Input Clamp Current ICL(WAKE) 2.5 mA CSNS Input Clamp Current ICL(CSNS) 10 mA HS [0:3] Voltage V VHS Positive 41 Negative -16 Output Current (2) IHS[0:3] 22.8 A ECL [0:3] 0.2 J Human Body Model (HBM) VESD1 ± 2000 Charge Device Model (CDM) VESD2 Output Clamp Energy ESD Voltage (3) (4) V Corner Pins (1, 13, 19, 21) ± 750 All Other Pins (2-12, 14-18, 20, 22-24) ± 500 THERMAL RATINGS °C Operating Temperature Ambient TA - 40 to 125 Junction TJ - 40 to 150 TSTG - 55 to 150 RθJC 0.7 VDD, RST = VLOGIC HIGH Sleep State Supply Current (VPWR = 14 V, RST < 0.5 V, WAKE < 0.5 V) mA – – 5.0 µA IPWR(SLEEP) TA = 25°C – 1.0 10 TA = 85°C – – 50 4.5 5.0 5.5 VDD Supply Voltage VDD(ON) VDD Supply Current IDD(ON) V mA No SPI Communication – – 1.0 3.0 MHz SPI Communication(8) – – 5.0 IDDSLEEP – – 5.0 µA VOV 28 32 36 V VOVHYS 0.2 0.8 1.5 V VUV 4.75 5.25 5.75 V VUVHYS – 0.25 – V VUVPOR – – 4.75 V VDD Sleep State Current Overvoltage Shutdown Threshold Overvoltage Shutdown Hysteresis Undervoltage Shutdown Threshold Undervoltage Hysteresis (9) Undervoltage Power-ON Reset (7) Notes 7. The undervoltage fault condition is reported to SPI register as long as the external VDD supply is within specification and the VRWR voltage level does not go below the undervoltage Power-ON Reset threshold. 8. Not guaranteed in production. 9. This applies when the undervoltage fault is not latched (IN[0:3] = 0). 33580 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 27 V, 4.5 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max VPWR = 6.0 V – – 23 VPWR = 10 V – – 15 VPWR = 13 V – – 15 Unit OUTPUTS (HS0, HS1, HS2, HS3) Output Drain-to-Source ON Resistance (IHS = 10 A, TA = 25°C) Output Drain-to-Source ON Resistance (IHS = 10 A, TA = 150°C) RDS(ON) mΩ RDS(ON) mΩ VPWR = 6.0 V – – 38 VPWR = 10 V – – 25.5 VPWR = 13 V – – 25.5 – – 30 Output Source-to-Drain ON Resistance (10) IHS = 5.0 A, TA = 25°C, VPWR = -12 V mΩ RSD(ON) Output Overcurrent High Detection Levels (9.0 V < VPWR < 16 V) A SOCH = 0 (11) IOCH0 80 100 120 SOCH = 1 IOCH1 56 70 84 14.6 18.2 22.8 Overcurrent Low Detection Levels (9.0 V < VPWR < 16 V) A SOCL[2:0] : 000 IOCL0 SOCL[2:0] : 001 IOCL1 13 16.3 20.4 IOCL2 11.5 14.4 18 IOCL3 10 12.5 15.7 SOCL[2:0] : 101 IOCL4 8.4 10.5 13.2 SOCL[2:0] : 110 IOCL5 6.9 8.6 10.8 SOCL[2:0] : 111 IOCL6 5.4 6.7 8.4 3.8 4.8 6.0 SOCL[2:0] : 010 SOCL[2:0] : 011 SOCL[2:0] : 100 IOCL7 Current Sense Ratio (9.0 V < VPWR < 16 V, CSNS < 4.5 V) – DICR D2 = 0 CSR0 – 1/13000 – DICR D2 = 1 CSR1 – 1/38000 – Current Sense Ratio (CSR0) Accuracy CSR0_ACC % Output Current 2.0 to 10 A Current Sense Ratio (CSR1) Accuracy - 15 – 15 CSR1_ACC % Output Current 10 A to 20 A Current Sense Clamp Voltage – 19 4.5 6.0 7.0 30 – 100 V VCL(CSNS) CSNS Open; IHS[0:3] = 22 A Open Load Detection Current (12) - 19 IOLDC µA Notes 10. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR. 11. 12. Guaranteed by process monitoring. Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence of an open load condition when the specific output is commanded OFF. 33580 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 27 V, 4.5 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit 2.0 3.0 4.0 - 20 – -16 TSD 155 175 190 °C TSD(HYS) 5.0 – 20 °C VIH 0.7 VDD – – V VIL – – 0.2 VDD V VIN(HYS) 100 850 1200 mV Input Logic Pulldown Current (SCLK, SI, IN[0:3], VIN>0.2 VDD) IDWN 5.0 – 20 µA RST Input Voltage Range VRST 4.5 5.0 5.5 V CSO – – 20 pF RDWN 100 200 400 kΩ CIN – 4.0 12 pF 7.0 – 14 - 2.0 – - 0.3 0.8 VDD – – OUTPUTS (HS0, HS1, HS2, HS3) (continued) Output Fault Detection Threshold Output Negative Clamp Voltage V VCL 0.5 A < IHS[0:3] < 2.0 A, Output OFF Overtemperature Shutdown (13) Overtemperature Shutdown Hysteresis V VOFD(THRES) Output Programmed OFF (13) CONTROL INTERFACE (SCLK, SI, SO, IN[0:3], RST, WAKE, FS, CS, FSI) Input Logic High Voltage (14) Input Logic Low Voltage (14) Input Logic Voltage Hysteresis SO, FS Tri-State Capacitance (15) (15) Input Logic Pulldown Resistor (RST) and WAKE Input Capacitance (15) Wake Input Clamp Voltage (16) VCL(WAKE) ICL(WAKE) < 2.5 mA Wake Input Forward Voltage VF(WAKE) ICL(WAKE) = -2.5 mA SO High-State Output Voltage Vin < 0.7 VDD V – 0.2 0.4 - 5.0 0 5.0 5.0 – 20 µA ISO(LEAK) CS>=0.7VDD, 0