MC33664
Isolated network high-speed transceiver
Rev. 1.0 — 23 May 2018
1
Short data sheet: technical data
General description
The MC33664 is a SMARTMOS transceiver physical layer transformer driver designed
to interface a microcontroller conveniently to a high speed isolated communication
network. MCU serial peripheral interface (SPI) data bits are directly converted to pulse bit
information and transferred to the bus network.
Slave response messages use the same structure to send pulse bit information to the
MC33664, which is converted and sent back to the MCU as a SPI bit stream.
2
Features and benefits
•
•
•
•
•
•
2.0 Mbit/s isolated network communication rate
Dual SPI architecture for message confirmation
Robust conducted and radiated immunity with wake-up
3.3 V and 5.0 V compatible logic thresholds
Low sleep mode current with automatic bus wake-up
Ultra-low radiated emissions
3.3 V/5.0 V
5.0 V
VIO
VCC5
AGND
INT
MCU
INTB
SCLK_0
SCLK_TX
GPIO_0
CSB_TX
MOSI_0
DATA_TX
SCLK_1
SCLK_RX
GPIO_1
CSB_RX
MOSI_1
DATA_RX
GPIO
RDTX+
T1
MC33664
RDTX-
1:1
GNDS
GNDT
DGND
EN
aaa-027339
Figure 1. Typical application circuit
MC33664
NXP Semiconductors
Isolated network high-speed transceiver
3
Applications
•
•
•
•
•
4
Automotive communication network
Industrial communication network
Utility vehicle battery systems
Forklift/mining battery systems
Battery backup systems
Ordering information
Table 1. Ordering information
Type number
MC33664ATL1EG
[1]
Package
[1]
Name
Description
Tamb [°C]
Version
SO16
plastic small outline package; 16 leads;
1.27 mm pitch; body 9.9 mm × 3.9 mm × 1.75 mm
−40 to +125
SOT109-5
To order parts in tape and reel, add R2 suffix to the part number.
MC33664_SDS
Short data sheet: technical data
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MC33664
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Isolated network high-speed transceiver
5
Pinning information
5.1 Pinning
SCLK_TX
1
16 VCC5
CSB_TX
2
15 AGND
DATA_TX
3
14 RDTX+
EN
4
SCLK_RX
5
CSB_RX
6
11 GNDT
DATA_RX
7
10 DGND
INTB
8
MC33664
13 RDTX12 GNDS
9
VIO
aaa-027341
Figure 2. Pin configuration for SO16
5.2 Pin description
Table 2. Pin description
Symbol
Pin
Type
Description
SCLK_TX
1
input
SPI transmit clock from the microcontroller to the MC33664
CSB_TX
2
input
SPI transmit chip select from the microcontroller to the MC33664
DATA_TX
3
input
SPI transmit data from the microcontroller to the MC33664
EN
4
input
enable control pin for the MCU to control the MC33664 to Sleep mode or
Normal mode
SCLK_RX
5
output
message receive SPI clock output to the microcontroller
CSB_RX
6
output
message receive SPI chip select output to the microcontroller
DATA_RX
7
output
message receive SPI data output to the microcontroller
INTB
8
output
digital interrupt pin used to trigger MCU wake-ups
VIO
9
power
digital 3.3 V/5.0 V power to the IC
DGND
10
ground
digital ground
GNDT
11
ground
terminate to ground
GNDS
12
ground
substrate ground; terminate to ground
RDTX-
13
I/O
transformer communication bi-directional bus
RDTX+
14
I/O
transformer communication bi-directional bus
AGND
15
ground
analog ground
VCC5
16
input
5.0 V input supply
MC33664_SDS
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MC33664
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Isolated network high-speed transceiver
6
Ratings and operating requirements relationship
The operating voltage range pertains to the VCC5 and VIO pins referenced to the AGND
and DGND pins.
Table 3. Ratings versus operating requirements
Fatal range
Lower limited
operating range
Normal operating
range
VPWR < −0.3 V
Permanent failure
may occur
4.5 V ≤ VCC5 ≤ 4.75 V 4.75 V ≤ VCC5 ≤ 5.5 V
no permanent failure, 3.1 V ≤ VIO ≤ 5.5 V
but IC functionality is 100 % functional
not guaranteed
Upper limited
operating range
Fatal range
5.5 V ≤ VCC5 ≤ 7.0 V
5.5 V ≤ VIO ≤ 7.0 V
7.0 V ≤ VCC5
7.0 V ≤ VIO
permanent failure
may occur
0 V ≤ VCC5 ≤ 4.5 V
0 V ≤ VIO ≤ 3.1 V
reset
handling range; no permanent failure
7
Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
All voltages are respect to reference ground (AGND and DGND) unless otherwise noted. Exceeding these ratings may
cause malfunction or permanent damage to the device.
Symbol
Parameter
VIO
Min
Max
Unit
supply input voltage
−0.3
+7.0
V
VCC5
supply input voltage
−0.3
+7.0
V
EN
digital enable pin for Sleep or
Normal mode
−0.3
VIO + 0.3
V
RDTX+,
RDTX−
communication bus
−10
+10
V
INTB
interrupt pin
−0.3
VIO + 0.3
V
SCLK_TX,
SCLK_RX,
CSB_TX,
CSB_RX,
DATA_TX,
DATA_RX
serial peripheral interface
communication ports
−0.3
VIO + 0.3
V
VESD
electrostatic discharge
voltage
±2000
-
V
charge device model (CDM)
±500
-
V
CDM corner pins
±750
-
V
machine model (MM)
±200
-
V
RDTX+, RDTX−; HBM
±4000
-
V
RDTX+, RDTX−; MM
±200
-
V
[1]
Conditions
human body model (HBM)
[1]
Electrostatic discharge (ESD) testing is performed in accordance with the HBM (CZAP = 100 pF, RZAP = 1500 Ω).
MC33664_SDS
Short data sheet: technical data
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MC33664
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Isolated network high-speed transceiver
8
Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Tamb
ambient temperature
Tj
junction temperature
Tstg
storage temperature
Conditions
[1]
Rth(j-pcb)
[1]
[2]
[3]
[4]
[5]
thermal resistance from junction to ambient
thermal resistance from junction to printed-circuit board
Max
Unit
−40
+125
°C
−40
+150
°C
−55
+150
°C
[2] [3]
-
260
°C
single layer (1s)
[4]
-
125
°C/W
multi layer (2s2p)
[5]
-
62
°C/W
Treflow(peak) peak reflow temperature
Rth(j-a)
Min
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction
or permanent damage to the device.
Package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For peak package reflow temperature and moisture sensitivity
levels (MSL), go to http://www.nxp.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts
(i.e. MC33xxxD enter 33xxx)], and review parametric.
Per SEMI G38-87 and JEDEC standard JESD51-2 with the single-layer board horizontal.
Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the cold plate temperature used for the case temperature.
9
Characteristics
Table 6. Characteristics
Characteristic noted under conditions 4.75 V ≤ VCC5 ≤ 5.5 V, 3.1 V ≤ VIO ≤ 5.5 V, −40 °C ≤ Tamb ≤ 125 °C, unless otherwise
noted. Typical values noted reflect the approximate parameter mean at VCC5 = 5.0 V, VIO = 3.3 V/5.0 V, Tamb = 25 °C and
device operating under nominal conditions unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fully operational
4.75
—
5.5
V
limited operation
4.5
—
4.75
V
Power supply VCC5
VCC5
IVCC5(NORMAL)
supply voltage
supply current
Normal mode; EN = 1;
continuous transmit;
50 Ω load
40
mA
Normal mode; EN = 1;
continuous receive
3.0
mA
Sleep mode; EN = 0;
INTB = 5.0 V
30
μA
IVCC5(SLEEP)
supply current
VCC5UV
VCC5 undervoltage POR
threshold
VCC5UV_FLT
VCC5 undervoltage POR filter
2.5
μs
VCC5UVHYS
VCC5 undervoltage POR
hysteresis
100
mV
4.0
—
4.5
V
Power supply VIO
VIO
supply voltage
3.1
—
5.5
V
VIOUV
VIO undervoltage POR
threshold
2.2
—
3.1
V
MC33664_SDS
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MC33664
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Isolated network high-speed transceiver
Symbol
Parameter
Conditions
Min
VIOUV_FLT
VIO undervoltage POR filter
2.5
μs
VIOUVHYS
VIO undervoltage POR
hysteresis
100
mV
IVIO(SLEEP)
VIO sleep current
EN = 0; INTB = 1
IVIO(NORMAL)
VIO Normal mode current
EN = 1;
continuous communication;
SPI_1 open
0.1
Typ
—
Max
4.5
1.0
Unit
μA
mA
Logic transmit EN, CSB_TX, SCLK_TX, DATA_TX
VIH
HIGH-level input voltage
1.7
—
VIO + 0.3
V
VIL
LOW-level input voltage
—
—
0.95
V
Vhys
hysteresis voltage
Rpd
pull-down resistance
Rpu
150
mV
EN, SCLK_TX,
DATA_TX
100
kΩ
pull-up resistance
CSB_TX
100
kΩ
tREADY
Sleep mode to Normal mode
EN LOW to HIGH
transition to device
ready to transmit
tINTB_PULSE_DELAY
EN LOW to HIGH transition to
INTB verification pulse
—
—
100
μs
—
—
100
μs
—
100
—
μs
INTB
EN
tINTB_PULSE
INTB verification pulse
duration
INTB
EN
fSCLK_TX
SPI_0 frequency
SCLK_TX
2.0
MHz
a
SCLK_TX HIGH
see Figure 3
250
ns
b
SCLK_TX LOW
see Figure 3
250
ns
e
SCLK_TX to CSB_TX
see Figure 3
L
CSB_TX to start of message
—
250
—
ns
—
—
1.1
μs
CSB_TX
RDTX+
RDTX–
MC33664_SDS
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MC33664
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Isolated network high-speed transceiver
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
f
falling edge of CSB_TX to
rising edge SCLK_TX
see Figure 3
1.75
—
—
μs
—
80
150
ns
CSB_TX
SCLK_TX
tRDTX_DLY
propagation delay
SCLK_TX LOW to sine
out
[1]
SCLK_TX
RDTX+
RDTX–
g
SCLK_TX LOW to CSB_TX
HIGH
see Figure 3
600
—
—
ns
c
DATA_TX to SCLK_TX setup
see Figure 3
40
—
—
ns
d
DATA_TX hold
see Figure 3
40
—
—
ns
—
—
150
ns
tCSB_TX_HIGH_EOM
propagation delay
CSB_TX LOW to HIGH
to end of message
[1]
CSB_TX
t1
t2
CSB_TX wake#up pulse
sequence timing
t1
t2
CSB_TX LOW period
21
μs
CSB_TX HIGH period
600
μs
t1
CSB_TX
11
h
00
11
00
time between consecutive
transmit messages
see Figure 3
1.0
3.0
—
μs
Logic receive pins (CSB_RX, SCLK_RX, DATA_RX)
VOH
HIGH-level output voltage
IOH = −2.0 mA;
VIO = 3.1 V
VIO − 0.4
—
—
V
VOL
LOW-level output voltage
IOL = −2.0 mA;
VIO = 3.1 V
—
—
0.4
V
fSPI
SPI_1 frequency
SCLK_RX
q
pulse frequency
see Figure 4
MHz
4.0
MHz
[1]
500
ns
o
start of message
a
SCLK_RX HIGH
[1]
250
ns
SCLK_RX LOW
[1]
250
ns
b
MC33664_SDS
Short data sheet: technical data
see Figure 4
2.0
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MC33664
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Isolated network high-speed transceiver
Symbol
Parameter
Conditions
tSOM_CSB_RX
start of message to CSB_RX
Min
Typ
Max
Unit
[1]
160
ns
[1]
60
ns
[1]
280
ns
CSB_RX
RDTX+
RDTX–
tEOM_CSB_RX
end of message to CSB_RX
CSB_RX
RDTX+
RDTX–
tPDB_SCLK_DATA_RX pulse data bit to DATA_RX
and SCLK_RX
DATA_RX
SCLK_RX
RDTX+
RDTX–
r
p
start of message to MSB
(receive)
p
m
see Figure 4
[1]
—
250
—
ns
see Figure 4
[1]
—
600
—
ns
1.0
3.0
—
μs
r
time between consecutive
messages received
see Figure 4
Bus differential transmitter/receiver
VRDTX(PK_DIFF)
RDTX± differential output
voltage
RL = 50 Ω;
VCC5 = 4.75 V
IRDTX
RDTX± current limit
sinking/sourcing to 2.5 V
VRDTX_IN(TH)
RDTX± differential receiver
threshold voltage
rising edge
0.74
falling edge
0.61
VRDTX_IN_HYST
RDTX± differential receiver
threshold voltage hysteresis
VRDTX_BIAS
transformer bias voltage
fRDTX
transmit/receive pulse
frequency
2.5
65
—
V
300
mA
V
0.70
V
130
mV
2.5
V
4.0
MHz
rising edge
0.6
V
falling edge
0.6
V
100
mV
transmitter in 3-state
Wake-up receiver
VRDTXWU_TH
VRDTXWU_TH_HYS
RDTX± wake#up differential
receiver threshold voltage
RDTX± wake#up differential
receiver threshold hysteresis
MC33664_SDS
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MC33664
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Isolated network high-speed transceiver
Symbol
Parameter
VRDTXWU_FLT
RDTX± wake#up filter
[1]
Conditions
Min
Typ
Max
Unit
50
ns
All bus network signals to SPI timing are referenced to 0.8 V differential threshold.
9.1 Timing diagrams
CSB_TX
h
e
f
a
b
g
e
SCLK_TX
c
DATA_TX
d
MSB
LSB
aaa-027342
Figure 3. SPI transmit timing
3.75 V
RDTX+
RDTX-
o
start of
message
p
r
q
bit 39
logic 1
bit 38
logic 1
bit 37
logic 0
bit 36
logic 0
bit 2
logic 1
bit 1
logic 0
bit 0
logic 0
end of
message
m
2.5 V
1.25 V
two pulses
positive
sine
500 ns/bit + 2 µs
two pulses
negative
sine
aaa-027343
Figure 4. Transformer receive communication timing
MC33664_SDS
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MC33664
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Isolated network high-speed transceiver
CSB_TX
SCLK_TX
RDTX+
RDTXtransmitter
receiver
CSB_RX
SCLK_RX
aaa-027344
Figure 5. Transmit/receive signal propagation
MC33664_SDS
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Isolated network high-speed transceiver
10 Package outline
Figure 6. Package outline SOT109-5 (SO16)
11 Revision history
Table 7. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
MC33664_SDS v.1.0
20180523
Technical data
—
—
MC33664_SDS
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Isolated network high-speed transceiver
12 Legal information
12.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
[short] Data sheet: product preview
Development
This document contains certain information on a product under development.
NXP reserves the right to change or discontinue this product without notice.
[short] Data sheet: advance information
Qualification
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
[short] Data sheet: technical data
Production
This document contains the product specification. NXP Semiconductors
reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a
technical data data sheet shall define the specification of the product as
agreed between NXP Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed otherwise in writing.
In no event however, shall an agreement be valid in which the NXP
Semiconductors product is deemed to offer functions and qualities beyond
those described in the technical data data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
MC33664_SDS
Short data sheet: technical data
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
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MC33664
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applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
MC33664_SDS
Short data sheet: technical data
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
POR — is a trademark of NXP B.V.
SMARTMOS — is a trademark of NXP B.V.
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Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Ordering information ..........................................2
Pin description ...................................................3
Ratings versus operating requirements .............4
Limiting values .................................................. 4
Tab. 5.
Tab. 6.
Tab. 7.
Thermal characteristics ..................................... 5
Characteristics ...................................................5
Revision history ...............................................11
Fig. 4.
Fig. 5.
Fig. 6.
Transformer receive communication timing .......9
Transmit/receive signal propagation ................10
Package outline SOT109-5 (SO16) .................11
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Typical application circuit .................................. 1
Pin configuration for SO16 ................................3
SPI transmit timing ............................................9
MC33664_SDS
Short data sheet: technical data
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 23 May 2018
© NXP B.V. 2018. All rights reserved.
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MC33664
NXP Semiconductors
Isolated network high-speed transceiver
Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
9.1
10
11
12
General description ............................................ 1
Features and benefits .........................................1
Applications .........................................................2
Ordering information .......................................... 2
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 3
Ratings and operating requirements
relationship .......................................................... 4
Limiting values .................................................... 4
Thermal characteristics ......................................5
Characteristics .................................................... 5
Timing diagrams ................................................ 9
Package outline .................................................11
Revision history ................................................ 11
Legal information .............................................. 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2018.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 May 2018
Document identifier: MC33664_SDS
