MC33988CPNA

Freescale Semiconductor Technical Data Document Number: MC33988 Rev. 8.0, 06/2012 Dual Intelligent High-current Self-protected Silicon High Side Switch (8.0 mOhm) 33988 The 33988 is a dual self-protected 8.0 mΩ silicon switch used to replace electromechanical relays, fuses and discrete devices in power management applications. The 33988 is designed for harsh environment and includes self-recovery features. The device is suitable for loads with high inrush current, as well as motors and all types of resistive and inductive loads. Programming, control and diagnostics are implemented via the serial peripheral interface (SPI). A dedicated parallel input is available for alternate and pulse-width modulation (PWM) control of each output. SPI-programmable fault trip thresholds allow the device to be adjusted for optimal performance in the application. The 33988 is packaged in a power-enhanced 12 x 12 mm nonleaded PQFN package with exposed tabs. HIGH SIDE SWITCH BOTTOM VIEW FK SUFFIX 98ARL10521D 16-PIN PQFN Features • • • • Dual 8.0 mΩ max high side switch with parallel input or SPI control 6.0 V to 27 V operating voltage with standby currents < 5.0 μA Output current monitoring with two SPI-selectable current ratios SPI control of over-current limit, over-current fault blanking time, output OFF open load detection, output ON/OFF control, watchdog timeout, slew-rates, and fault status reporting • SPI status reporting of over-current, open and shorted loads, overtemperature, under-voltage and over-voltage shutdown, fail-safe pin status, and program status • Enhanced -16 V reverse polarity VPWR protection VDD VDD VDD ORDERING INFORMATION Device (For Tape and Reel, add an R2 Suffix) Temperature Range (TA) Package MC33988CHFK - 40 °C to 125 °C 16 PQFN VPWR 33988 VDD I/O FS I/O WAKE SO SI SCLK MCU GND HS1 SCLK CS CS SI SO I/O RST I/O INO I/O IN1 A/D VPWR HS0 LOAD LOAD CSNS FSI GND Figure 1. 33988 Simplified Application Diagram Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2010-2012. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM VPWR VDD Internal Regulator IUP VIC Over-voltage Protection CS Programmable Switch Delay 0ms –525ms SO SPI 3.0 MHz Selectable Slew Rate Gate Drive HS0 Selectable Over-current High Detection 50A or 37.5A SI SCLK FS IN[0:1] RST WAKE Logic Selectable Overcurrent Low Detection Blanking Time 0.15ms–155ms Selectable Over-current Low Detection 3.75A –12.5A Open Load Detection IDWN Over-temperature Detection RDWN HS0 HS1 HS1 Programmable Watchdog 310ms–2500ms VIC IUP Selectable Output Current Recopy 1/10250 or 1/20500 FSI CSNS GND Figure 2. 33988 Simplified Internal Block Diagram 33988 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS CSNS 5 WAKE 6 IN0 FS 7 RST CS FSI SI SLCK VDD SO 8 IN1 12 11 10 9 4 3 2 1 13 GND TRANSPARENT TOP VIEW 14 VPWR 15 HS1 16 HS0 Figure 3. 33988 Pin Connections (Transparent Top View) Table 1. Pin Definitions Functional descriptions of many of these pins can be found in the Functional Pin Description section beginning on page 16. Pin Pin Name Pin Function Formal Name 1 CSNS Output Output Current Monitoring 2 WAKE Input Wake 3 RST Input Reset (Active Low) 4 IN0 Input Direct Input 0 5 FS Output Fault Status (Active Low) This is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. 6 FSI Input Fail-Safe Input The value of the resistance connected between this pin and ground determines the state of the outputs after a watchdog timeout occurs. 7 CS Input Chip Select (Active Low) 8 SCLK Input Serial Clock This input pin is connected to the MCU providing the required bit shift clock for SPI communication. 9 SI Input Serial Input This is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy chain of devices. 10 VDD Input Digital Drain Voltage (Power) This is an external voltage input pin used to supply power to the SPI circuit. Definition This pin is used to output a current proportional to the designated HS0-1 output. This pin is used to input a Logic [1] signal so as to enable the watchdog timer function. This input pin is used to initialize the device configuration and fault registers, as well as place the device in a low-current Sleep mode. This input pin is used to directly control the output HS0. This input pin is connected to a chip select output of a master microcontroller (MCU). 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. Pin Definitions (continued) Functional descriptions of many of these pins can be found in the Functional Pin Description section beginning on page 16. Pin Pin Name Pin Function Formal Name Definition 11 SO Output Serial Output This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy chain of devices. 12 IN1 Input Direct Input 1 This input pin is used to directly control the output HS1. 13 GND Ground Ground This pin is the ground for the logic and analog circuitry of the device. 14 VPWR Input Positive Power Supply This pin connects to the positive power supply and is the source input of operational power for the device. 15 HS1 Output High Side Output 1 Protected 8.0mΩ high side power output to the load. 16 HS0 Output High Side Output 0 Protected 8.0mΩ high side power output to the load. 33988 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit ELECTRICAL RATINGS Operating Voltage Range VPWR Steady-State VDD Supply Voltage V -16 to 41 VDD -0.3 to 5.5 V VIN[0:1], RST, FSI - 0.3 to 7.0 V VSO - 0.3 to VDD + 0.3 V WAKE Input Clamp Current ICL(WAKE) 2.5 mA CSNS Input Clamp Current ICL(CSNS) 10 mA Input/Output Voltage(1) CSNS, SI, SCLK, CS, FS SO Output Voltage(1) Output Voltage Positive VHS V 41 Negative -15 Output Current(2) IHS[0:1] 30 A ECL[0:1] 0.37 J Human Body Model (HBM) VESD1 ± 2000 Charge Device Model (CDM) VESD3 Output Clamp ESD Voltage Energy(3) (4) V Corner Pins (1, 12, 15, 16) ±750 All Other Pins (2, 11, 13, 14) ±500 Notes 1. Exceeding this voltage limit may cause permanent damage to the device. 2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 3. Active clamp energy using single-pulse method (L = 16mH, RL = 0, VPWR = 12V, TJ = 150°C). 4. ESD1 testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω); ESD3 testing is performed in accordance with the Charge Device Model (CDM), Robotic (Czap=4.0pF). 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Ambient TA - 40 to 125 Junction TJ - 40 to 150 TSTG - 55 to 150 RθJC 0.7 x VDD, RST = VLOGIC HIGH mA – – 5.0 TJ = 25°C – – 10 TJ = 85°C – – 50 4.5 5.0 5.5 No SPI Communication – – 1.0 3.0MHz SPI Communication – – 5.0 Sleep State Supply Current (VPWR < 14V, RST < 0.5V, WAKE < 0.5V) μA IPWR(SLEEP) VDD Supply Voltage VDD(ON) VDD Supply Current IDD(ON) V mA VDD Sleep State Current IDD(SLEEP) – – 5.0 μA Over-voltage Shutdown Threshold VPWR(OV) 28 32 36 V Over-voltage Shutdown Hysteresis VPWR(OVHYS) 0.2 0.8 1.5 V VPWR(UV) 5.0 5.5 6.0 V Under-voltage Hysteresis(9) VPWR(UVHYS) – 0.25 – V Under-voltage Power-ON Reset VPWR(UVPOR) – – 5.0 V Under-voltage Output Shutdown Threshold(8) Notes 8. This applies to all internal device logic supplied by VPWR and assumes the external VDD supply is within specification. 9. This applies when the under-voltage fault is not latched (IN[0 : 1] = 0). 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max VPWR = 6.0V – – 12.0 VPWR = 10V – – 8.0 VPWR = 13V – – 8.0 Unit POWER OUTPUT Output Drain-to-Source ON Resistance (IHS[0:1] = 7.5A, TJ = 25°C) Output Drain-to-Source ON Resistance (IHS[0:1] = 7.5A, TJ = 150°C) RDS(ON) mΩ RDS(ON) mΩ VPWR = 6.0V – – 20.4 VPWR = 10V – – 13.6 VPWR = 13V – – 13.6 Output Source-to-Drain ON Resistance IHS[0:1] = 7.5A, TJ = 25°C(10) RDS(ON) VPWR = -12V mΩ – – 16.0 Output Over-current High Detection Levels (9.0V < VPWR < 16V) A SOCH = 0 IOCH0 40 50 60 SOCH = 1 IOCH1 30 37.5 45 000 IOCL0 10.5 12.5 14.5 001 IOCL1 9.0 11.25 13.5 010 IOCL2 8.0 10.0 12.0 011 IOCL3 7.0 8.75 10.5 IOCL4 6.0 7.5 9.0 IOCL5 5.0 6.25 7.5 IOCL6 4.0 5.0 6.0 IOCL7 3.0 3.75 4.5 DICR D2 = 0 CSR0 – 1/10250 – DICR D2 = 1 CSR1 – 1/20500 – Over-current Low Detection Levels (SOCL[2:0]) 100 101 110 111 A Current Sense Ratio (9.0V < VPWR < 16V, CSNS < 4.5V) Current Sense Ratio (CSR0) Accuracy – CSR0_ACC % Output Current 2.5A - 20 – 20 5.0A -14 – 14 6.25A -13 – 13 7.5A -12 – 12 10.0A -13 – 13 12.5A -13 – 13 Notes 10. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR. 33988 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT (CONTINUED) Current Sense Ratio (CSR1) Accuracy CSR1_ACC % Output Current 2.5A - 25 – 25 5.0A -19 – 19 6.25A -18 – 18 7.5A -17 – 17 10.0A -18 – 18 12.5A -18 – 18 4.5 6.0 7.0 30 – 100 2.0 3.0 4.0 - 20 – -15 TSD 160 175 190 °C TSD(HYS) 5.0 – 20 °C Current Sense Clamp Voltage VCL(CSNS) CSNS Open; IHS[0:1] = 15A Open Load Detection Current(11) IOLDC Output Fault Detection Threshold VOLD(THRES) Output Programmed OFF Output Negative Clamp Voltage Over-temperature Shutdown(12) (12) μA V VCL 0.5A < IHS[0:1] < 2.0A, Output OFF Over-temperature Shutdown Hysteresis V V Notes 11. Output OFF Open Load Detection Current is the current required to flow through the load for the purpose of detecting the existence of an open load condition when the specific output is commanded OFF. 12. Guaranteed by process monitoring. Not production tested. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VIH 0.7 VDD – – V VIL – – 0.2 VDD V VIN[0:1] (HYS) 100 600 1200 mV Input Logic Pull-down Current (SCLK, IN, SI) IDWN 5.0 – 20 μA RST Input Voltage Range VRST 4.5 5.0 5.5 V SO, FS Tri-state Capacitance(15) CSO – – 20 pF RDWN 100 200 400 kΩ CIN – 4.0 12 pF 7.0 – 14 - 2.0 – - 0.3 CONTROL INTERFACE Input Logic High-voltage(13) Input Logic Low-voltage(13) Input Logic Voltage Hysteresis (14) Input Logic Pull-down Resistor (RST) and WAKE Input Capacitance(15) WAKE Input Clamp Voltage(16) VCL(WAKE) ICL(WAKE) < 2.5 mA WAKE Input Forward Voltage VF(WAKE) ICL(WAKE) = - 2.5mA SO High-state Output Voltage V VSOH IOH = 1.0mA V 0.8 VDD FS, SO Low-state Output Voltage 0 5.0 μA IUP CS, VIN[0:1] > 0.7 x VDD FSI Disabled, HS[0:1] Indeterminate 0.4 μA - 5.0 FSI Input Pin External Pull-down Resistance 0.2 ISO(LEAK) CS > 0.7 x VDD Current(17) – V – SO Tri-state Leakage Current – VSOL IOL = -1.6mA Input Logic Pull-up V 5.0 – 20 RFS kΩ RFSDIS – 0 1.0 FSI Enabled, HS[0:1] OFF RFSOFFOFF 6.0 6.5 7.0 FSI Enabled, HS0 ON, HS1 OFF RFSONOFF 15 17 19 FSI Enabled, HS[0:1] ON RFSONON 40 Infinite – Notes 13. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN[0:1], and WAKE input signals. The WAKE and RST signals may be supplied by a derived voltage reference to VPWR. 14. 15. 16. 17. No hysteresis on FSI and wake pins. Parameter is guaranteed by processing monitoring but is not production tested. Input capacitance of SI, CS, SCLK, RST, and WAKE. This parameter is guaranteed by process monitoring but is not production tested. The current must be limited by a series resistance when using voltages > 7.0V. Pull-up current is with CS OPEN. CS has an active internal pull-up to VDD. 33988 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT TIMING Output Rising Slow Slew Rate A (DICR D3 = 0)(18) SRRA_SLOW 9.0V < VPWR < 16V 0.3 Output Rising Slow Slew Rate B (DICR D3 = 0) (19) 4.8 V/μs 0.3 1.0 2.0 SRFB_SLOW V/μs 0.12 1)(18) 0.4 1.2 SRFA_FAST 9.0V < VPWR < 16V V/μs 1.2 1)(19) 3.2 6.4 SRFB_FAST 9.0V < VPWR < 16V (20) Output Turn-OFF Delay Time in Slow Slew Rate Mode(21) 0.4 1.4 4.8 1.0 8.0 30 5 57 125 2.0 15 50 – 300 – μs μs t DLY_SLOW(OFF) DICR = 0 Output Turn-OFF Delay Time in Fast Slew Rate Mode(21) V/μs t DLY(ON) DICR = 0, DICR = 1 μs t DLY_FAST(OFF) DICR = 1 Direct Input Switching Frequency (DICR D3 = 0) 0.4 SRFA_SLOW 0)(19) Output Turn-ON Delay Time in Fast/Slow Slew Rate 6.4 V/μs 0.12 0)(18) 9.0V < VPWR < 16V Output Falling Fast Slew Rate B (DICR D3 = 1.6 SRRB_FAST 9.0V < VPWR < 16V Output Falling Fast Slew Rate A (DICR D3 = 1.2 V/μs 0.6 (19) 9.0V < VPWR < 16V Output Falling Slow Slew Rate B (DICR D3 = 0.4 SRRA_FAST 9.0V < VPWR < 16V Output Falling Slow Slew Rate A (DICR D3 = 2.0 V/μs 0.12 1)(18) Output Rising Fast Slew Rate B (DICR D3 = 1) 1.0 SRRB_SLOW 9.0V < VPWR < 16V Output Rising Fast Slew Rate A (DICR D3 = V/μs f PWM Hz Notes 18. Rise and Fall Slew Rates A measured across a 5.0Ω resistive load at high side output = 0.5V to VPWR - 3.5V. These parameters are guaranteed by process monitoring. 19. Rise and Fall Slew Rates B measured across a 5.0Ω resistive load at high side output = VPWR - 3.5V to VPWR - 0.5V. These parameters are guaranteed by process monitoring. 20. Turn-ON delay time measured from rising edge of IN[0:1] signal that would turn the output ON to VHS[0:1] = 0.5V with RL = 5.0Ω resistive load. 21. Turn-OFF delay time measured from falling edge that would turn the output OFF to VHS[0:1] = VPWR - 0.5V with RL = 5.0Ω resistive load. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 11 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max t OCL0 t OCL1 t OCL2 t OCL3 108 155 202 Unit POWER OUTPUT TIMING (CONTINUED) Overcurrent Detection Blanking Time (OCLT [1:0]) 00 01 10 11 Overcurrent High Detection Blanking Time CS to CSNS Valid Time (22) ms 7.0 10 13 0.8 1.2 1.6 0.08 0.15 0.25 t OCH 1.0 10 20 μs t CNSVAL – – 10 μs t OSD0 t OSD1 t OSD2 t OSD3 t OSD4 t OSD5 t OSD6 t OSD7 – 0 – 55 75 95 110 150 190 165 225 285 220 300 380 275 375 475 330 450 570 385 525 665 HS1 Switching Delay Time (OSD[2:0]) 000 001 010 011 100 101 110 111 ms HS0 Switching Delay Time (OSD[2:0]) 000 001 010 011 100 101 110 111 ms t OSD0 t OSD1 t OSD2 t OSD3 t OSD4 t OSD5 t OSD6 t OSD7 – 0 – 0 – – 110 150 190 110 150 190 220 300 380 220 300 380 330 450 570 330 450 570 434 620 806 Watchdog Timeout (WD [1:0])(23) 00 01 10 11 ms t WDTO0 t WDTO1 t WDTO2 t WDTO3 207 310 403 1750 2500 3250 875 1250 1625 Notes 22. Time necessary for the CSNS to be within ±5% of the targeted value. 23. Watchdog timeout delay measured from the rising edge of WAKE to RST from a sleep state condition to output turn-ON with the output driven OFF and FSI floating. The values shown are for WDR setting of [00]. The accuracy of tWDTO is consistent for all configured watchdog timeouts. 33988 12 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 6.0V ≤ VPWR ≤ 27V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit f SPI – – 3.0 MHz t WRST – 50 350 ns t CS – – 300 ns t ENBL – – 5.0 μs t LEAD – 50 167 ns Required High State Duration of SCLK (Required Setup Time)(25) t WSCLKh – – 167 ns (25) t WSCLKl – – 167 ns SPI INTERFACE CHARACTERISTICS Recommended Frequency of SPI Operation Required Low State Duration for RST(24) Rising Edge of CS to Falling Edge of CS (Required Setup Time) (25) Rising Edge of RST to Falling Edge of CS (Required Setup Time)(25) Falling Edge of CS to Rising Edge of SCLK (Required Setup Time) Required Low State Duration of SCLK (Required Setup Time) (25) Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)(25) t LAG – 50 167 ns SI to Falling Edge of SCLK (Required Setup Time)(26) t SI(SU) – 25 83 ns Falling Edge of SCLK to SI (Required Setup Time)(26) t SI(HOLD) – 25 83 ns – 25 50 – 25 50 t RSI – – 50 ns t RSI – – 50 ns Time from Falling Edge of CS to SO Low-impedance(27) t SO(EN) – – 145 ns High-impedance(28) t SO(DIS) – 65 145 ns – 65 105 SO Rise Time t RSO CL = 200pF SO Fall Time t FSO CL = 200pF SI, CS, SCLK, Incoming Signal Rise Time(26) SI, CS, SCLK, Incoming Signal Fall Time from Rising Edge of CS to SO Time(26) Time from Rising Edge of SCLK to SO Data Valid(29) 0.2 x VDD ≤ SO ≤ 0.8 x VDD, CL = 200pF Notes 24. 25. 26. 27. 28. 29. ns ns t VALID ns RST low duration measured with outputs enabled and going to OFF or disabled condition. Maximum setup time required for the 33988 is the minimum guaranteed time needed from the microcontroller. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. Time required for output status data to be available for use at SO. 1.0kΩ on pull-up on CS. Time required for output status data to be terminated at SO. 1.0kΩ on pull-up on CS. Time required to obtain valid data out from SO following the rise of SCLK. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 13 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS CS VPWR VPWR VPWR 0.5V VPWR- -0.5V SRfB SRFB_SLOW & SRFB_FAST SRRB_SLOW & SRRB_FAST SRrB VVPWR - 3V PWR -3.5V SRfA SRFA_SLOW & SRFA_FAST SRRA_SLOW & SRRA_FAST SRrA HS 0.5V 0.5V t DLY_SLOW(OFF) & tDLY_FAST(OFF) Tdly(off) t DLY(ON) Tdly (on) Figure 4. Output Slew Rate and Time Delays IOCHx Load Current IOCLx t OCH Time t OCLx Figure 5. Overcurrent Shutdown IOCH0 IOCH1 IOCL0 IOCL1 Load Current IOCL2 IOCL3 IOCL4 IOCL5 IOCL6 IOCL7 Time t OCHx t OCL3 t OCL2 t OCL1 t OCL0 Figure 6. Over-current Low and High Detection 33988 14 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS • During tOCHX, the device can reach up to IOCH0 overcurrent level. • During tOCL3 or tOCL2 or tOCL1 or tOCL0, the device can be programmed to detect up to IOCL0. Figure 6 illustrates the over-current detection level (IOCLX, IOCHX) the device can reach for each over-current detection blanking time (tOCHX, tOCLX): VIH V IH RSTB RST 0.2 x VDD 0.2 VDD VIL VIL TwRSTB t ENBL t WRST tTCSB CS TENBL VIH V 0.7 x VDD 0.7VDD CS CSB IH 0.2 x VDD 0.7VDD VIL V t WSCLKh TwSCLKh tTlead LEAD IL t RSI TrSI t LAG Tlag 0.70.7VDD x VDD SCLK SCLK VIH VIH 0.2 x VDD 0.2VDD VIL V IL t TSIsu SI(SU) t WSCLKl TwSCLKl tTfSI FSI t SI(HOLD) TSI(hold) SI SI VIH V IH 0.7 VDD 0.7 xVDD 0.2VDD 0.2 x VDD Don’t Care Don’t Care Valid Don’t Care Valid VIH VIL Figure 7. Input Timing Switching Characteristics t FSI t RSI TrSI TfSI VOH VOH 3.5V 3.5V 50% SCLK SCLK 1.0V 1.0V VOL VOL t SO(EN) TdlyLH SO SO 0.7 xVDD VDD 0.20.2 VDD x VDD VOH VOH VOL VOL Low-to-High Low to High TrSO t RSO VALID tTVALID SO TfSO t FSO SO VOH VOH 0.7VDD x VDD High to Low 0.7 High-to-Low 0.2VDD 0.2 x VDD TdlyHL VOL VOL t SO(DIS) Figure 8. SCLK Waveform and Valid SO Data Delay Time 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33988 is a dual self-protected 8.0mΩ silicon switch used to replace electromechanical relays, fuses, and discrete devices in power management applications. The 33988 is designed for harsh environments, and includes self-recovery features. The device is suitable for loads with high inrush current, as well as motors and all types of resistive and inductive loads. Programming, control, and diagnostics are implemented via the Serial Peripheral Interface (SPI). A dedicated parallel input is available for alternate and Pulse Width Modulation (PWM) control of each output. SPI-programmable fault trip thresholds allow the device to be adjusted for optimal performance in the application. The 33988 is packaged in a power-enhanced 12 x 12 nonleaded PQFN package with exposed tabs. FUNCTIONAL PIN DESCRIPTION OUTPUT CURRENT MONITORING (CSNS) This pin is used to output a current proportional to the designated HS0-1 output. That current is fed into a groundreferenced resistor and its voltage is monitored by an MCU's A/D. The channel to be monitored is selected via the SPI. This pin can be tri-stated through the SPI. watchdog timeout occurs. Depending on the resistance value, either all outputs are OFF, ON, or the output HS0 only is ON. When the FSI pin is connected to GND, the watchdog circuit and fail-safe operation are disabled. This pin incorporates an active internal pull-up current source. CHIP SELECT (CS) WAKE (WAKE) This pin is used to input a Logic [1] signal so as to enable the watchdog timer function. An internal clamp protects this pin from high damaging voltages when the output is current limited with an external resistor. This input has a passive internal pull-down. RESET (RST) This input pin is used to initialize the device configuration and fault registers, as well as place the device in a lowcurrent Sleep mode. The pin also starts the watchdog timer when transitioning from Logic LOW to Logic HIGH. This pin should not be allowed to be Logic HIGH until VDD is in regulation. This pin has a passive internal pull-down. DIRECT IN 0 & 1 (INx) This input pin is used to directly control the output HS0 and 1. This input has an active internal pull-down current source and requires CMOS logic levels. This input may be configured via the SPI. FAULT STATUS (FS) This is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. When a device fault condition is detected, this pin is active LOW. Specific device diagnostic faults are reported via the SPI SO pin. FAIL-SAFE INPUT (FSI) This input pin is connected to a chip select output of a master microcontroller (MCU). The MCU determines which device is addressed (selected) to receive data by pulling the CS pin of the selected device Logic LOW, enabling SPI communication with the device. Other unselected devices on the serial link having their CS pins pulled-up Logic HIGH disregard the SPI communication data sent. This pin incorporates an active internal pull-up current source. SERIAL CLOCK (SCLK) This input pin is connected to the MCU providing the required bit shift clock for SPI communication. It transitions one time per bit transferred at an operating frequency, fSPI, defined by the communication interface. The 50 percent duty cycle CMOS-level serial clock signal is idle between command transfers. The signal is used to shift data into and out of the device. This input has an active internal pull-down current source. SERIAL INPUT (SI) This is a command data input pin connected to the SPI Serial Data Output of the MCU or to the SO pin of the previous device of a daisy chain of devices. The input requires CMOS logic-level signals and incorporates an active internal pull-down current source. Device control is facilitated by the input's receiving the MSB first of a serial 8-bit control command. The MCU ensures data is available upon the falling edge of SCLK. The logic state of SI present upon the rising edge of SCLK loads that bit command into the internal command shift register. The value of the resistance connected between this pin and ground determines the state of the outputs after a 33988 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION DIGITAL DRAIN VOLTAGE (VDD) This is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost, an internal supply provides power to a portion of the logic, ensuring limited functionality of the device. All device configuration registers are reset. SERIAL OUTPUT (SO) This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin of the next device of a daisy chain of devices. This output will remain tri-stated (highimpedance OFF condition) so long as the CS pin of the device is Logic HIGH. SO is only active when the CS pin of the device is asserted Logic LOW. The generated SO output signals are CMOS logic levels. SO output data is available on the falling edge of SCLK and transitions immediately on the rising edge of SCLK. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source input of operational power for the device. The VPWR pin is a backside surface mount tab of the package. HIGH-SIDE OUTPUT 0 & 1 (HSx) This pin protects 8.0mΩ high-side power output to the load. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 17 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION POWER SUPPLY SELF-PROTECTED HIGH SIDE SWITCH MCU INTERFACE AND OUTPUT CONTROL HS [0:1] SPI INTERFACE MCU INTERFACE PARALLEL CONTROL INPUTS Figure 9. Functional Internal Block Diagram POWER SUPPLY The 33988 is designed to operate from 4.0V to 28V on the VPWR pin. Characteristics are provided from 6.0V to 20V for the device. The VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for Serial Peripheral Interface (SPI) communication in order to configure and diagnose the device. This IC architecture provides a low quiescent current sleep mode. Applying VPWR and VDD to the device will place the device in the Normal mode. The device will transit to Fail-safe mode in case of failures on the SPI (watchdog timeout). HIGH-SIDE SWITCH: HS[0:1] Those pins are the high side outputs controlling multiple automotive loads with high inrush current, as well as motors and all types of resistive and inductive loads. This N-channel MOSFET with 8mΩ RDS(ON), is self-protected and each Nchannel presents extended diagnostics in order to detect load disconnections and short-circuit fault conditions. The HS[0:1] outputs are actively clamped during a turn-off of inductive loads. MCU INTERFACE AND OUTPUT CONTROL In Normal mode, the loads are controlled directly from the MCU through the SPI. With a dedicated SPI command, it is possible to independently turn on and off several loads that are PWM’d at the same frequency, and duty cycles with only one PWM signal. An analog feedback output provides a current proportional to each load current. The SPI is used to configure and to read the diagnostic status (faults) of the high side output. The reported fault conditions are: open load, short-circuit to ground (OCLO-resistive and OCHI-severe short-circuit), thermal shutdown, and under/over-voltage. In Fail-safe mode, the loads are controlled with dedicated parallel input pins. The device is configured in default mode. 33988 18 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES The 33988 has four operating modes: Sleep, Normal, Fault, and Fail-safe. Table 5 summarizes details contained in succeeding paragraphs. Table 5. Fail-Safe Operation and Transitions to Other 33988 Modes Mode FS WAKE Sleep x 0 0 x Device is in Sleep mode. All outputs are OFF. Normal 1 x 1 No Normal mode. Watchdog is active if enabled. Fault 0 1 x No 0 x 1 The device is currently in Fault mode. The faulted output(s) is (are) OFF. 1 0 1 Yes 1 1 1 1 1 0 Watchdog has timed out and the device is in Failsafe mode. The outputs are as configured with the RFS resistor connected to FSI. RST and WAKE must be transitioned to Logic [0] simultaneously to bring the device out of the Failsafe mode or momentarily tied the FSI pin to ground. Failsafe RST WDTO Comments x = Don’t care. SLEEP MODE The default mode of the 33988 is the Sleep mode. This is the state of the device after first applying battery voltage (VPWR), prior to any I/O transitions. This is also the state of the device when the WAKE and RST are both Logic [0]. In the Sleep mode, the output and all unused internal circuitry, such as the internal 5.0 V regulator, are off to minimize current draw. In addition, all SPI-configurable features of the device are as if set to Logic [0]. The device will transition to the Normal or Fail-safe operating modes based on the WAKE and RST inputs as defined in Table 5. NORMAL MODE The 33988 is in Normal mode when: • VPWR is within the normal voltage range. • RST pin is Logic [1]. • No fault has occurred. FAIL-SAFE AND WATCHDOG If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or RST input pin transitions from Logic [0] to Logic [1]. The WAKE input is capable of being pulled up to VPWR with a series of limiting resistance that limits the internal clamp current according to the specification. The watchdog timeout is a multiple of an internal oscillator and is specified in Table 14. As long as the WD bit (D7) of an incoming SPI message is toggled within the minimum watchdog timeout period (WDTO), based on the programmed value of the WDR the device will operate normally. If an internal watchdog timeout occurs before the WD bit, the device will revert to a Fail-safe mode until the device is reinitialized. During the Fail-safe mode, the outputs will be ON or OFF depending upon the resistor RFS connected to the FSI pin, regardless of the state of the various direct inputs and modes (Table 6). In this mode, the SPI register content is retained except for over-current high and low detection levels and timing, which are reset to their default value (SOCL, SOCH, and OCLT). Then the watchdog, over-voltage, overtemperature, and over-current circuitry (with default value) are fully operational. Table 6. Output State During Fail-safe Mode RFS (kΩ) High Side State 0 Fail-safe mode Disabled 6.0 Both HS0 and HS1 OFF 17 HS0 ON, HS1 OFF Open Both HS0 and HS1 ON The Fail-safe mode can be detected by monitoring the WDTO bit D2 of the WD register. This bit is Logic [1] when the device is in Fail-safe mode. The device can be brought out of the Fail-safe mode by transitioning the WAKE and RST pins from Logic [1] to Logic [0] or forcing the FSI pin to Logic [0]. Table 5 summarizes the various methods for resetting the device from the latched Fail-safe mode. If the FSI pin is tied to GND, the Watchdog Fail-safe operation is disabled. LOSS OF VDD If the external 5.0V supply is not within specification, or even disconnected, all register content is reset. The two outputs can still be driven by the direct inputs IN 1:IN0. The 33988 uses the battery input to power the output MOSFETrelated current sense circuitry and any other internal logic providing Fail-safe device operation with no VDD supplied. In this state, the watchdog, over-voltage, over-temperature, and over-current circuitry are fully operational with default values. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 19 FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSIS FEATURES FAULT MODE The 33988 indicates the following faults as they occur by driving the FS pin to Logic [0]: • Over-temperature fault • Open load fault • Over-current fault (high and low) • Over-voltage and under-voltage fault The FS pin will automatically return to Logic [1] when the fault condition is removed, except for over-current and in some cases under-voltage. Fault information is retained in the fault register and is available (and reset) via the SO pin during the first valid SPI communication (refer to Table 16). PROTECTION AND DIAGNOSIS FEATURES OVER-TEMPERATURE FAULT (NON-LATCHING) The 33988 incorporates over-temperature detection and shutdown circuitry in each output structure. Overtemperature detection is enabled when an output is in the ON state. For the output, an over-temperature fault (OTF) condition results in the faulted output turning OFF until the temperature falls below the TSD(HYS). This cycle will continue indefinitely until action is taken by the MCU to shut OFF the output, or until the offending load is removed. When experiencing this fault, the OTF fault bit will be set in the status register and cleared after either a valid SPI read or a power reset of the device. OVER-VOLTAGE FAULT (NON-LATCHING) The 33988 shuts down the output during an over-voltage fault (OVF) condition on the VPWR pin. The output remains in the OFF state until the over-voltage condition is removed. When experiencing this fault, the OVF fault bit is set in the bit OD1 and cleared after either a valid SPI read or a power reset of the device. The over-voltage protection and diagnostic can be disabled trough SPI (bit OV_dis). UNDER-VOLTAGE SHUTDOWN (LATCHING OR NON-LATCHING) The output(s) will latch off at some battery voltage below 6.0 V. As long as the VDD level stays within the normal specified range, the internal logic states within the device will be sustained. In the case where the battery voltage drops below the under-voltage threshold (VPWRUV) output will turn off, FS will go to Logic [0], and the fault register UVF bit will be set to 1. Two cases need to be considered when the battery level recovers: • If output(s) command is (are) low, FS will go to Logic [1] but the UVF bit will remain set to 1 until the next read operation. • If the output command is ON, then FS will remain at Logic [0]. The output must be turned OFF and ON again to re-enable the state of output and release FS . The UVF bit will remain set to 1 until the next read operation. The under-voltage protection can be disabled through the SPI (bit UV_dis = 1). In this case, the FS and UVF bit do not report any under-voltage fault condition and the output state will not be changed as long as the battery voltage does not drop any lower than 2.5V. OPEN LOAD FAULT (NON-LATCHING) The 33988 incorporates open load detection circuitry on each output. Output open load fault (OLF) is detected and reported as a fault condition when that output is disabled (OFF). The open load fault is detected and latched into the status register after the internal gate voltage is pulled low enough to turn OFF the output. The OLF fault bit is set in the status register. If the open load fault is removed, the status register will be cleared after reading the register. The open load protection can be disabled trough SPI (bit OL_dis). It is recommended to disable the open load detection circuitry (OL_dis bit sets to logic [1]) in case of permanent open load fault condition. OVER-CURRENT FAULT (LATCHING) The device has eight programmable over-current low detection levels (IOCL) and two programmable over-current high detection levels (IOCH) for maximum device protection. The two selectable, simultaneously active over-current detection levels, defined by IOCH and IOCL, are illustrated in Figure 6. The eight different over-current low detect levels (IOCL0 : IOCL7) are likewise illustrated in Figure 6. If the load current level ever reaches the selected overcurrent low detect level and the over-current condition exceeds the programmed over-current time period (tOCx), the device will latch the effected output OFF. If at any time the current reaches the selected IOCH level, then the device will immediately latch the fault and turn OFF the output, regardless of the selected tOCL driver. For both cases, the device output will stay off indefinitely until the device is commanded OFF and then ON again. REVERSE BATTERY The output survives the application of reverse voltage as low as -16V. Under these conditions, the output’s gates are enhanced to keep the junction temperature less than 150°C. The ON resistance of the output is fairly similar to that in the Normal mode. No additional passive components are required. 33988 20 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION GROUND DISCONNECT PROTECTION In the event the 33988 ground is disconnected from load ground, the device protects itself and safely turns OFF the output regardless the state of the output at the time of disconnection. A 10K resistor needs to be added between the wake pin and the rest of the circuitry in order to ensure that the device turns off in case of ground disconnect and to prevent this pin to exceed its maximum ratings Table 7. Device Behavior in Case of Under-voltage High Side Switch (VPWR Battery Voltage) ∗∗ VPWR > VPWRUV VPWRUV > VPWR > UVPOR UVPOR > VPWR > 2.5V ∗ State Output State UV Enable UV Enable UV Enable UV Enable IN = 0 IN = 0 IN∗∗∗ = 1 IN∗∗∗ = 1 (Falling VPWR) (Rising VPWR) (Falling VPWR) (Rising VPWR) UV Disable IN = 0 (Falling or Rising VPWR) UV Disable IN∗∗∗ = 1 (Falling or Rising VPWR) OFF OFF ON OFF OFF ON FS State 1 1 1 0 1 1 SPI Fault Register UVF Bit 0 1 until next read 0 1 0 0 Output State OFF OFF OFF OFF OFF ON FS State 0 0 0 0 1 1 SPI Fault Register UVF Bit 1 1 1 1 0 0 Output State OFF OFF OFF OFF OFF ON 1 1 1 1 1 1 1 until next read 1 0 0 OFF OFF OFF OFF OFF OFF 1 1 1 1 1 1 0 0 FS State SPI Fault Register UVF Bit 2.5V > VPWR > Output State 0V FS State SPI Fault Register UVF Bit Comments 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read 1 until next read UV fault is not latched UV fault is not latched UV fault is latched ∗ Typical value; not guaranteed ∗∗ While VDD remains within specified range. ∗∗∗ = IN is equivalent to IN direct input or IN_spi SPI input. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 21 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS SPI PROTOCOL DESCRIPTION to D0. The internal registers of the 33988 are configured and controlled using a 4-bit addressing scheme, as shown in Table 8. Register addressing and configuration are described in Table 9. The SI input has an active internal pull-down, IDWN. The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Clock (SCLK), Serial Input (SI), Serial Output (SO), and Chip Select (CS). The SI / SO pins of the 33988 follow a first-in first-out (D7/ D0) protocol with both input and output words transferring the most significant bit (MSB) first. All inputs are compatible with 5.0 V CMOS logic levels. The SPI lines perform the following functions: SERIAL OUTPUT (SO) The SO data pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CS pin is put into a Logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, and the state of the key inputs. The SO pin changes states on the rising edge of SCLK and reads out on the falling edge of SCLK. Fault and Input Status descriptions are provided in Table 5. SERIAL CLOCK (SCLK) Serial clocks (SCLK) the internal shift registers of the 33988 device. The serial input (SI) pin accepts data into the input shift register on the falling edge of the SCLK signal while the serial output (SO) pin shifts data information out of the SO line driver on the rising edge of the SCLK signal. It is important that the SCLK pin be in a logic low state whenever CS makes any transition. For this reason, it is recommended that the SCLK pin be in a Logic [0] state whenever the device is not accessed (CS Logic [1] state). SCLK has an active internal pull-down, IDWN. When CS is Logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (highimpedance). See Figure 10 and Figure 11. CHIP SELECT (CS) The CS pin enables communication with the master microcontroller (MCU). When this pin is in a Logic [0] state, the device is capable of transferring information to, and receiving information from, the MCU. The 33988 device latches in data from the Input shift registers to the addressed registers on the rising edge of CS. The device transfers status information from the power output to the shift register on the falling edge of CS. The SO output driver is enabled when CS is Logic [0]. CS should transition from a Logic [1] to a Logic [0] state only when SCLK is a Logic [0]. CS has an active internal pull-up, IUP. SERIAL INPUT (SI) This is a serial interface (SI) command data input pin. SI instruction is read on the falling edge of SCLK. An 8-bit stream of serial data is required on the SI pin, starting with D7 CSB CS SCLK SI SO SO NOTES: 1. D7 OD7 D6 OD6 D5 OD5 D4 OD4 D3 OD3 D2 OD2 D1 OD1 D0 OD0 RSTB RST is in a logic 1 state during the above operation. Logic [1] relate state to during therecent above operation. Notes 2. 1. D0,RST D1, is D2,a ..., and D7 the most ordered entry of data into the SPSS D7:D0 to and the OD7 mostrelate recent ordered entry of datafault intoand thestatus device. 3. 2. OD0, OD1,relate OD2, ..., to the first 8 bits of ordered data out of the device. 3. OD7:OD0 relate to the first 8 bits of ordered fault and status data out of the device. Figure 10. Single 8-Bit Word SPI Communication 33988 22 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS C S B CS SSCLK C L K SI S I D 7 SSO O O D 7 D 6 D 5 O D 6 D 2 O D 5 O D 2 D 1 D 0 O D 1 O D 0 D 7 * D 6 * D 7 D 5 * D 6 D 2 * D 5 D 1 * D 2 D 0 * D 1 D 0 . ST T B i s i n a l o g i c 1 s t a t e d u r i n g t h e a b o v e o p e r a t i o n . RRSis Notes 1.12 RST a Logic [1] state during the above operation. . D 0 , D 1 , D 2 , . .., a n d D 7 r e la t e t o t h e m o s t r e c e n t o r d e r e d e n tr y o f d a ta in to th e S P S S . O D 0 , O D 1 , O D 2 , . . ., a n d O D 7 r e la t e t o t h e fir s t 8 b it s o f o r d e r e d f a u lt a n d s t a t u s d a t a o u t o f t h e d e v ic e . 2.34 D7:D0 relate to the most recent ordered entry of data into the device. . O D 0 , O D 1 , O D 2 , .. ., a n d O D 7 r e p r e s e n t t h e f ir s t 8 b its o f o r d e r e d f a u lt a n d s t a t u s d a t a o u t o f t h e S P S S 3. D7*:D0* relate to the previous 8 bits (last command word) of data that was previously shifted into the device. 4. OD7:OD0 relate to the Ffirst 8 bits of ordered fault and status data out of the device. I G U R E 4 b . M U L T I P L E 8 b it W O R D S P I C O M M U N I C A T I O N N O T E S : Figure 11. Multiple 8-Bit Word SPI Communication SERIAL INPUT COMMUNICATION SPI communication is accomplished using 8-bit messages. A message is transmitted by the MCU starting with the MSB, D7, and ending with the LSB, D0 (Table 8). Each incoming command message on the SI pin can be interpreted using the following bit assignments: the MSB (D7) is the watchdog bit and in some cases a register address bit common to both outputs or specific to an output; the next three bits, D6 : D4, are used to select the command register; and the remaining four bits, D3 : D0, are used to configure and control the outputs and their protection features. Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable, or to confirm transmitted data, as long as the messages are all multiples of eight bits. Any attempt made to latch in a message that is not eight bits will be ignored. The 33988 has defined registers, which are used to configure the device and to control the state of the output. Table 9, summarizes the SI registers. The registers are addressed via D6 : D4 of the incoming SPI word (Table 8). Table 8. SI Message Bit Assignment Bit Sig SI Msg Bit MSB LSB D7 Message Bit Description Register address bit for output selection. Also used for Watchdog: toggled to satisfy watchdog requirements. D6 : D4 Register address bits. D3 : D1 Used to configure the inputs, outputs, and the device protection features and SO status content. D0 Used to configure the inputs, outputs, and the device protection features and SO status content. Table 9. Serial Input Address and Configuration Bit Map SI Register D7 D6 D5 D4 Serial Input Data D3 D2 D1 D0 SOA2 SOA1 SOA0 STATR s 0 0 0 0 OCR x 0 0 1 CSNS1 IN1_SPI CSNS0 IN0_SPI EN EN SOCHLR s 0 1 0 SOCHs SOCL2s SOCL1s SOCL0s CDTOLR s 0 1 1 OL_DIS CD_DIS OCLT1s OCLT0 s s s DICR s 1 0 0 FAST SR s CSNS high s IN DIS s A/Os OSDR 0 1 0 1 0 OSD2 OSD1 OSD0 WDR 1 1 0 1 0 0 WD1 WD0 NAR 0 1 1 0 0 0 0 0 UOVR 1 1 1 0 0 0 UV_dis OV_dis TEST x 1 1 1 Freescale Internal Use (Test) x = Don’t care. s (SOA3 bit) = Selection of output: Logic [0] = HS0, Logic [1] = HS1. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 23 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS DEVICE REGISTER ADDRESSING The following section describes the possible register addresses and their impact on device operation. Table 10. Over-current Low Detection Levels SOCL2 (D2) SOCL1 (D1) SOCL0 (D0) Over-current Low Detection (Amperes) Address x000 — Status Register (STATR) 0 0 0 12.5 The STATR register is used to read the device status and the various configuration register contents without disrupting the device operation or the register contents. The register bits D2:D0, determine the content of the first eight bits of SO data. When register content is specific to one of the two outputs, bit D7 is used to select the desired output (SOA3). In addition to the device status, this feature provides the ability to read the content of the OCR, SOCHLR, CDTOLR, DICR, OSDR, WDR, NAR, and UOVR registers. (Refer to the section entitled Serial Output Communication (Device Status Return Data).) 0 0 1 11.25 0 1 0 10.0 0 1 1 8.75 1 0 0 7.5 1 0 1 6.25 1 1 0 5.0 1 1 1 3.75 Address x001 — Output Control Register (OCR) The OCR register allows the MCU to control the outputs through the SPI. Incoming message bit D0 reflects the desired states of the high side output HS0 (IN0_SPI): a Logic [1] enables the output switch and a Logic [0] turns it OFF. A Logic [1] on message bit D1 enables the Current Sense (CSNS) pin. Similarly, incoming message bit D2 reflects the desired states of the high side output HS1 (IN1_SPI): Logic [1] enables the output switch and a Logic [0] turns it OFF. A Logic [1] on message bit D3 enables the CSNS pin. In the event that the current sense is enabled for both outputs, the current will be summed. Bit D7 is used to feed the watchdog if enabled. Address x010— Select Over-current High and Low Register (SOCHLR) The SOCHLR register allows the MCU to configure the output over-current low and high detection levels, respectively. Each output is independently selected for configuration based on the state of the D7 bit; a write to this register when D7 is Logic [0] will configure the current detection levels for the HS0. Similarly, if D7 is Logic [1] when this register is written, HS1 is configured. Each output can be configured to different levels. In addition to protecting the device, this slow blow fuse emulation feature can be used to optimize the load requirements matching system characteristics. Bits D2 : D0 set the over-current low detection level to one of eight possible levels, as shown in Table 10. Bit D3 sets the over-current high detection level to one of two levels, which is described inTable 11. Table 11. Over-current High Detection Levels SOCH (D3) Over-current High Detection (Amperes) 0 50 1 37.5 Address x011 — Current Detection Time and Open Load Register (CDTOLR) The CDTOLR register is used by the MCU to determine the amount of time the device will allow an over-current low condition before output latches OFF occurs. Each output is independently selected for configuration based on the state of the D7 bit. A write to this register when bit 7 is Logic [0] will configure the timeout for the HS0. Similarly, if D7 is Logic [1] when this register is written, then HS1 is configured. Bits D1: D0 allow the MCU to select one of four fault blanking times defined in Table 12. Note that these timeouts apply only to the over-current low detection levels. If the selected over-current high level is reached, the device will latch off within 20μs. Table 12. Over-current Low Detection Blanking Time OCLT [1:0] Timing 00 155ms 01 10ms 10 1.2ms 11 150μs A Logic [1] on bit D2 disables the over-current low (CD_dis) detection timeout feature. A Logic [1] on bit D3 disables the open load (OL) detection feature. 33988 24 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Address x100 — Direct Input Control Register (DICR) The DICR register is used by the MCU to enable, disable, or configure the direct IN pin control of each output. Each output is independently selected for configuration based on the state of bit D7. A write to this register when bit D7 is Logic [0] will configure the direct input control for the HS0. Similarly, if D7 is Logic [1] when this register is written, then HS1 is configured. A Logic [0] on bit D1 will enable the output for direct control by the IN pin. A Logic [1] on bit D1 will disable the output from direct control. While addressing this register, if the input was enabled for direct control, a Logic [1] for the D0 bit will result in a Boolean AND of the IN pin with its corresponding D0 message bit when addressing the OCR register. Similarly, a Logic [0] on the D0 pin results in a Boolean OR of the IN pin with the corresponding message bits when addressing the OCR register. The DICR register is useful if there is a need to independently turn on and off several loads that are PWM’d at the same frequency and duty cycle with only one PWM signal. This type of operation can be accomplished by connecting the pertinent direct IN pins of several devices to a PWM output port from the MCU and configuring each of the outputs to be controlled via their respective direct IN pin. The DICR is then used to Boolean AND the direct IN(s) of each of the outputs with the dedicated SPI bit that also controls the output. Each configured SPI bit can now be used to enable and disable the common PWM signal from controlling its assigned output. A Logic [1] on bit D2 is used to select the high ratio (CSR1, 1/20500) on the CSNS pin for the selected output. The default value [0] is used to select the low ratio (CSR0, 1/10250). A Logic [1] on bit D3 is used to select the high speed slew rate for the selected output. The default value [0] corresponds to the low speed slew rate. Address 0101 — Output Switching Delay Register (OSDR) The OSDR register configures the device with a programmable time delay that is active during Output ON transitions initiated via SPI (not via direct input). A write to this register configures both outputs for different delay. Whenever the input is commanded to transition from Logic [0] to Logic [1], both outputs will be held OFF for the time delay configured in the OSDR. The programming of the contents of this register have no effect on device Fail-safe mode operation. The default value of the OSDR register is 000, equating to no delay. This feature allows the user a way to minimize inrush currents, or surges, thereby allowing loads to be switched ON with a single command. There are eight selectable output switching delay times that range from 0ms to 525ms. Refer to Table 13. Table 13. Switching Delay OSD [2:0] (D2 : D0) Turn ON Delay (ms) Turn ON Delay (ms) HS0 HS1 000 0 0 001 0 75 010 150 150 011 150 225 100 300 300 101 300 375 110 450 450 111 450 525 Address 1101 — Watchdog Register (WDR) The WDR register is used by the MCU to configure the watchdog timeout. Watchdog timeout is configured using bits D1:D0. When D1:D0 bits are programmed for the desired watchdog timeout period, the WD bit (D7) should be toggled as well, ensuring the new timeout period is programmed at the beginning of a new count sequence. Refer to Table 14. Table 14. Watchdog Timeout WD [1:0] (D1: D0) Timing (ms) 00 620 01 310 10 2500 11 1250 Address 0110 — No Action Register (NAR) The NAR register can be used to no-operation fill SPI data packets in a daisy chain SPI configuration. This allows devices to not be affected by commands being clocked over a daisy-chained SPI configuration, and by toggling the WD bit (D7), the watchdog circuitry will continue to be reset while no programming or data readback functions are being requested from the device. Address 1110 — Under-voltage/Over-voltage Register (UOVR) The UOVR register can be used to disable or enable overvoltage and/or under-voltage protection. By default (Logic [0]), both protections are active. When disabled, an under-voltage or over-voltage condition fault will not be reported in the output fault register. Address x111 — TEST The TEST register is reserved for test and is not accessible with the SPI during normal operation. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 25 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SERIAL OUTPUT COMMUNICATION (DEVICE STATUS RETURN DATA) to the MCU during the first SPI communication following this condition should be ignored. When the CS pin is pulled low, the output status register is loaded. Meanwhile, the data is clocked out MSB- (OD7-) first as the new message data is clocked into the SI pin. The first eight bits of data clocking out of the SO, and following a CS transition, are dependant upon the previously written SPI word. Any bits clocked out of the SO pin after the first eight will be representative of the initial message bits clocked into the SI pin since the CS pin first transitioned to a Logic [0]. This feature is useful for daisy chaining devices as well as message verification. A valid message length is determined following a CS transition of Logic [0] to Logic [1]. If there is a valid message length, the data is latched into the appropriate registers. A valid message length is a multiple of eight bits. At this time, the SO pin is tri-stated and the fault status register is now able to accept new fault status information. The output status register correctly reflects the status of the STATR-selected register data at the time that the CS is pulled to a Logic [0] during SPI communication and / or for the period of time since the last valid SPI communication, with the following exceptions: • The previous SPI communication was determined to be invalid. In this case, the status will be reported as though the invalid SPI communication never occurred. • Battery transients below 6.0V resulting in an undervoltage shutdown of the outputs may result in incorrect data loaded into the status register. The SO data transmitted to the MCU during the first SPI communication following an under-voltage VPWR condition should be ignored. • The RST pin transition from a Logic [0] to Logic [1] while the WAKE pin is at Logic [0] may result in incorrect data loaded into the status register. The SO data transmitted SERIAL OUTPUT BIT ASSIGNMENT The 8 bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 15 summarizes the SO register content. Bit OD7 reflects the state of the watchdog bit (D7) addressed during the prior communication. The value of the previous D7 will determine which output the status information applies to for the Fault (FLTR), SOCHLR, CDTOLR, and DICR registers. SO data will represent information ranging from fault status to register contents, user selected by writing to the STATR bits D2:D0. Note that the SO data will continue to reflect the information for each output (depending on the previous D7 state) that was selected during the most recent STATR write until changed with an updated STATR write. Previous Address SOA[2:0] = 000 If the previous three MSBs are 000, bits OD6 : OD0 will reflect the current state of the Fault register (FLTR) corresponding to the output previously selected with the bit OD7 (Table 16). Previous Address SOA[2:0] = 001 Data in bits OD1:OD0 contain CSNS0 EN and IN0_SPI programmed bits, respectively. Data in bits OD3:OD2 contain CSNS0 EN and IN0_SPI programmed bits, respectively. Previous Address SOA[2:0] = 010 The data in bit OD3 contain the programmed over-current high detection level (refer to Table 11), and the data in bits OD2:OD0 contain the programmed over-current low detection levels (refer to Table 12). Table 15. Serial Output Bit Map Description Previous STATR D7, D2, D1, D0 Serial Output Returned Data SOA3 SOA2 SOA1 SOA0 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0 s 0 0 0 s OTFs OCHFs OCLFs OLFs UVF OVF FAULT x 0 0 1 x 0 0 1 CSNS1 EN IN1_SPI CSNS0 EN IN0_SPI s 0 1 0 s 0 1 0 SOCHs SOCL2s SOCL1s SOCL0s s 0 1 1 s 0 1 1 OL_DIS s CD_DIS s OCLT1s OCLT0s s 1 0 0 s 1 0 0 FAST SR s CSNS high s 0 1 0 1 0 1 0 1 FSM_HS0 1 1 0 1 1 1 0 1 FSM_HS1 WDTO WD1 WD0 0 1 1 0 0 1 1 0 IN1 Pin IN0 Pin FSI Pin WAKE Pin 1 1 1 0 1 1 1 0 – – UV_dis OV_dis x 1 1 1 – – – – – – – – OSD2 IN DIS s A/O s OSD1 OSD0 s = Selection of output: Logic [0] = HS0, Logic [1] = HS1. x = Don’t care. 33988 26 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Previous Address SOA[2:0] = 101 Table 16. Fault Register OD7 OD6 s OTF OD5 OD4 OCHFs OCLFs OD3 OD2 OD1 OD0 OLFs UVF OVF FAULT OD7 (s) = Selection of output: Logic [0] = HS0, Logic [1] = HS1. OD6 (OTF) = Over-temperature Flag. OD5 (OCHFs) = Over-current High Flag. (This fault is latched.) OD4 (OCLFs) = Over-current Low Flag. (This fault is latched.) OD3 (OLFs) = Open Load Flag. OD2 (UVF) = Under-voltage Flag. (This fault is latched or not latched.) OD1 (OVF) = Over-voltage Flag. OD0 (FAULT) = This flag reports a fault and is reset by a read operation. FAULT report of any fault on HS0 or HS1 Note The FS pin reports a fault. For latched faults, this pin is reset by a new Switch ON command (via SPI or direct input IN). • SOA3 = 0. The returned data contain the programmed values in the OSDR. Bit OD3 (FSM_HS0) reflects the state of the output HS0 in the Fail-safe mode after a watchdog timeout occurs. • SOA3 = 1. The returned data contain the programmed values in the WDR. Bit OD2 (WDTO) reflects the status of the watchdog circuitry. If WDTO bit is Logic [1], the watchdog has timed out and the device is in Fail-safe mode. If WDTO is Logic [0], the device is in Normal mode (assuming the device is powered and not in Sleep mode), with the watchdog either enabled or disabled. Bit OD3 (FSM_HS1) reflects the state of the output HS1 in the Fail-safe mode after a watchdog timeout occurs. Previous Address SOA[2:0] = 110 • SOA3 = 0. OD3:OD0 return the state of the IN1, IN0, FSI, and WAKE pins, respectively (Table 17). Table 17. Pin Register Previous Address SOA[2:0] = 011 Data returned in bits OD1 and OD0 are current values for the over-current fault blanking time, illustrated in Table 12. Bit OD2 reports if the over-current detection timeout feature is active. OD3 reports if the open load circuitry is active. Previous Address SOA[2:0] =100 The returned data contain the programmed values in the DICR. OD3 OD2 OD1 OD0 IN1 Pin IN0 Pin FSI Pin WAKE Pin • SOA3 = 1. The returned data contain the programmed values in the UOVR. Bit OD1 reflects the state of the under-voltage protection and bit OD0 reflects the state of the over-voltage protection. Refer to Table 15). Previous Address SOA[2:0] =111 Null Data. No previous register Read Back command received, so bits OD2:OD0 are null, or 000. 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 27 TYPICAL APPLICATIONS TYPICAL APPLICATIONS The 33988 can be configured in several applications. The figure below shows the 33988 in a typical main switch application. VPWR VDD Voltage Regulator VDD VDD NC VPWR 2.2k VDD VPWR 10k MCU 10 100nF 10k 4 10k 12 10k 10k 8 10k 7 3 11 10k 9 5 1 6 1k VPWR 14 2.5µF 2 I/O I/O SCLK CS I/O SI SO I/O A/D VDD 10µF WAKE IN0 IN1 SCLK CS RST SO SI FS CSNS FSI HS1 10nF 15 33988 HS0 16 LOAD GND LOAD 13 RFS Figure 12. Typical Applications Two application notes are available in order to: • propose safe configurations of the eXtreme Switch devices in case of application faults and protect all circuitry with minimum external components (AN 3274), • provide guidelines for Printed Circuit Board (PCB) design and assembly (AN 2469). Development effort will be required by the end users to optimize the board design and PCB layout in order to reach electromagnetic compatibility standards (emission and immunity). The loads must be chosen in order to guarantee the device normal operating condition as junction temperature from -40 to 150°C. In case of permanent short-circuit conditions, the duration and number of activation cycles must be limited with a dedicated MCU fault management using the fault reporting through SPI. Figure 13 describes the maximum turn-off current versus load inductance for single-pulse method, based on lab characterization results. When driving DC motor or Solenoid loads demanding multiple switching, an external recirculation device must be used to maintain the device in its Safe Operating Area. 33988 28 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS Figure 13. Maximum Turn-off Current Versus Inductive Load (Single Pulse for RL = 0 and VPWR = 12 V at TJ = 150°C Initial) 33988 29 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION SOLDERING INFORMATION The 33988 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board. The AN2467 provides guidelines for Printed Circuit Board design and assembly. 33988 30 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGE DIMENSIONS For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ARL10521D. Dimensions shown are provided for reference ONLY. FK SUFFIX 16-PIN PQFN 98ARL10521D ISSUE C 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 31 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) FK SUFFIX 16-PIN PQFN 98ARL10521D ISSUE C 33988 32 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 1.0 1/2007 • Initial release 2.0 5/2007 3.0 8/2007 • Changed typ and max number on Output Turn-ON Delay Time in Fast/Slow Slew Rate(20) • Changed min on Output Turn-OFF Delay Time in Fast Slew Rate Mode(21) • Changed labels on HS1 Switching Delay Time (OSD[2:0]) and HS0 Switching Delay Time (OSD[2:0]) • Corrected labels on Figure 12, Typical Applications • Updated Freescale format and style • Updated Junction-to-Ambient • Added Functional Internal Block Description • Updated Device Behavior in Case of Under-voltage 4.0 11/2009 • Added one paragraph and figure to Typical Applications 5.0 7/2010 • Corrected typo in Tables 15 and 16 (Faults to Fault) and added “FAULT report of any fault on HS0 or HS1” to Table 16. 6.0 9/2010 • Corrected Logic on bit 2, Address x100 — Direct Input Control Register (DICR) on page 25. 7.0 5/2012 • • • • 8.0 6/2012 • Updated values in Table 13. Changed orderable part number from MC33988CPNA to MC33988CHFK Updated (6) Updated soldering information Updated Freescale form and style 33988 Analog Integrated Circuit Device Data Freescale Semiconductor 33 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits on the Freescale reserves the right to make changes without further notice to any products herein. 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Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm Freescale, the Freescale logo, AltiVec, C-5, CodeTest, CodeWarrior, ColdFire, C-Ware, Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, Qorivva, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, Processor expert, QorIQ Qonverge, QUICC Engine, Ready Play, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. Document Number: MC33988 Rev. 8.0 06/2012