MC34717EPR2

Freescale Semiconductor Advance Information Document Number: MC34717 Rev 5.0, 12/2014 5.0 A 1.0 MHz Fully Integrated Dual Switch-Mode Power Supply 34717 The 34717 is a highly integrated, space-efficient, low cost, dual synchronous buck switching regulator with integrated N-channel power MOSFETs. It is a high performance dual point-of-load (PoL) power supply with many desired features for the 3.3 and 5.0 V environments. Both channels can provide up to 5.0 A of continuous output current capability with high efficiency and tight output regulation. The second channel has the ability to track an external reference voltage in different configurations. The 34717 SMARTMOS device offers the designer the flexibility of many control, supervisory, and protection functions to allow for easy implementation of complex designs. It is housed in a Pb-free, thermally enhanced, and space efficient 26 pin exposed pad QFN. Features • 50 m integrated N-channel power MOSFETs • Input voltage operating range from 3.0 to 6.0 V • 1% accurate output voltages, ranging from 0.7 to 3.6 V • The second output has voltage tracking capability in different configurations • Programmable switching frequency range from 200 kHz to 1.0 MHz • Programmable soft start timing • Over-current limit and short-circuit protection • Thermal shutdown • Output overvoltage and undervoltage detection • Active low power good output signal • Active low shutdown input. 3.0 TO 6.0 V VIN EP SUFFIX (PB_FREE) 98ASA00702D 26-PIN QFN ORDERING INFORMATION Device Temperature Range (TA) Package MC34717EP/R2 -40 °C to 85 °C 26 QFN 34717 VIN PVIN1 BOOT1 VOUT1 DUAL SWITCH-MODE POWER SUPPLY SW1 VOUT1 INV1 PVIN2 BOOT2 VOUT2 VOUT2 INV2 COMP1 COMP2 PGND1 PGND2 VDDI PG FREQ SD ILIM1 ILIM2 VOUT1 SW2 VIN VMASTER VREFIN GND Optional Figure 1. 34717 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2007-2014. All rights reserved. MCU INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM SD PG System Reset M1 System Control Oscillator FREQ Thermal Monitoring FSW Bandgap Regulator VBG Buck Control Logic Discharge ILIM2 ISENSE2 ISENSE1 Current Monitoring VDDI Internal Voltage Regulator ILIM1 VIN ILIM2 ILIM1 BOOT1 M3 BOOT2 VIN PVIN2 M2 VIN PVIN1 M4 SW1 M6 Gate Driver ISENSE FSW FSW Gate I Driver SENSE M5 M7 – M8 VOUT1 + + – + VBG INV1 Discharge Reference Selection VBG PGND2 – + Error Amplifier PWM Comparator Ramp Generator – PWM Comparator Ramp Generator PGND1 COMP1 SW2 Error Amplifier COMP2 INV2 M9 Discharge VOUT2 VREFIN GND CHANNEL 1 CHANNEL 2 Figure 2. 34717 Simplified Internal Block Diagram 34717 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS ILIM1 ILIM2 FREQ VIN VIN GND VDDI NC PIN CONNECTIONS 26 25 24 23 22 21 20 19 BOOT1 1 18 BOOT2 2 17 PVIN1 PVIN2 PVIN1 SW1 SW1 PGND1 Transparent Top View 3 16 PIN 27 SW2 SW2 PGND2 4 15 5 14 VOUT2 PGND1 8 9 10 11 12 13 VREFIN NC PG SD INV2 7 COMP2 6 COMP1 PGND2 INV1 VOUT1 PVIN2 Figure 3. 34717 Pin Connections Table 1. 34717 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Name Pin Function Formal Name Definition 1 BOOT1 Passive Bootstrap Channel 1 Bootstrap capacitor input pin 2 PVIN1 Supply Power Input Voltage Channel 1 Buck converter power input 3 SW1 Output Switching Node Channel 1 Buck converter switching node 4 PGND1 Ground Power Ground Channel 1 Buck converter and discharge MOSFETs power ground 5 VOUT1 Output Output Voltage Discharge Path Channel 1 Buck converter output voltage discharge pin 6 INV1 Input Error Amplifier Inverting Input Channel 1 Buck converter error amplifier inverting input 7 COMP1 Input Buck Convertor Compensation Input 8 VREFIN Input Reference Voltage Input 9, 26 NC None No Connect 10 PG Output Power Good Output Signal 11 SD Input Shutdown Input 12 COMP2 Input Buck Convertor Compensation Input 13 INV2 Input Error Amplifier Inverting Input Channel 1 Buck converter external compensation network input Voltage tracking reference voltage input No internal connections to this pin. Recommend attaching a 0.1 µF capacitor from pin 9 to GND. It is an active low open drain power good status reporting output Shutdown mode input control pin Channel 2 Buck converter external compensation network input Channel 2 Buck converter error amplifier inverting input 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 34717 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Name Pin Function Formal Name Definition 14 VOUT2 Output Output Voltage Discharge Path Channel 2 Buck converter output voltage discharge pin 15 PGND2 Ground Power Ground Channel 2 Buck converter and discharge MOSFETs power ground 16 SW2 Output Switching Node Channel 2 Buck converter switching node 17 PVIN2 Power Power Input Voltage Channel 2 Buck converter power input 18 BOOT2 Input Bootstrap Input Channel 2 Bootstrap capacitor input pin 19 ILIM1 Input Soft Start Adjustment Input CH 1 Channel 1 soft start adjustment 20 ILIM2 Input Soft Start Adjustment Input CH 2 Channel 2 soft start adjustment 21 FREQ Input Frequency Adjustment Input The buck converters switching frequency adjustment input 22,23 VIN Power Input Supply Voltage 24 GND Ground Signal Ground Analog ground of the IC 25 VDDI Output Internal Supply Voltage Internal Supply Voltage Output 27 GND Ground Thermal Pad Power supply voltage of the IC Thermal pad for heat transfer. Connect the thermal pad to the analog ground and the ground plane for heat sinking. 34717 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VIN -0.3 to 7.0 V High-side MOSFET Drain Voltage (PVIN1, PVIN2) Pins PVIN -0.3 to 7.0 V Switching Node (SW1, SW2) Pins VSW -0.3 to 7.0 V ELECTRICAL RATINGS Input Supply Voltage (VIN) Pin BOOT1, BOOT2 Pins (Referenced to SW1, SW2 Pins Respectively) VBOOT - VSW -0.3 to 7.0 V PG, VOUT1, VOUT2, and SD Pins - -0.3 to 7.0 V VDDI, FREQ, ILIM1, ILIM2, INV1, INV2, COMP1, COMP2, and VREFIN Pins - -0.3 to 3.0 V Channel 1 Continuous Output Current(1) IOUT1 +5.0 A Channel 2 Continuous Output Current(1) IOUT2 +5.0 A Human Body Model VESD1 ±2000 Machine Model (MM) VESD2 ±200 VESD3 ±750 TA -40 to 85 °C Storage Temperature TSTG -65 to +150 °C Peak Package Reflow Temperature During Reflow(4),(5) TPPRT Note 5 °C Maximum Junction Temperature TJ(MAX) +150 °C Power Dissipation (TA = 85°C)(6) PD 2.03 W ESD Voltage(2) Charge Device Model V THERMAL RATINGS Operating Ambient Temperature(3) Notes 1. Continuous output current capability so long as TJ is TJ(MAX). 2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF). 3. 4. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Maximum power dissipation at indicated ambient temperature. 5. 6. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit RJA 93 °C/W RqJMA 32 °C/W RqJB 13.6 °C/W THERMAL RESISTANCE(7) Thermal Resistance, Junction to Ambient, Single-Layer Board (1s)(8) Thermal Resistance, Junction to Ambient, Four-Layer Board (2s2p) (10) Thermal Resistance, Junction to Board (9) Notes 7. The PVIN, SW, and PGND pins comprise the main heat conduction paths. 8. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal. 9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are thermal vias connecting the package to the two planes in the board. (per JESD51-5) 10. Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 34717 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 3.0 V  VIN  6.0 V, - 40 C  TA  85 C, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VIN 3.0 - 6.0 V IIN - - 35 mA IINOFF - - 100 µA VDDI 2.35 2.5 2.65 V PVIN 2.5 - 6.0 V VOUTHI1 0.7 - 3.6 V - -1.0 - 1.0 % REGLN1 -1.0 - 1.0 % REGLD1 -1.0 - 1.0 % Error Amplifier Reference Voltage(12) VREF1 - 0.7 - V Output Under-voltage Threshold VUVR1 -8.0 - -1.5 % Output Over-voltage Threshold VOVR1 1.5 - 8.0 % Continuous Output Current IOUT1 - - 5.0 A Over-current Limit ILIM1 - 6.5 - A VILIM1 1.25 - VDDI V ISHORT1 - 8.5 - A RDS(on)HS1 10 - 50 m RDS(on)LS1 10 - 50 m RDS(on)M2 2.0 - 4.0  IC INPUT SUPPLY VOLTAGE (VIN) Input Supply Voltage Operating Range Input DC Supply Current(11) (Normal Mode: SD = 1, Unloaded Outputs) Input DC Supply Current(11) (Shutdown Mode, SD = 0) INTERNAL SUPPLY VOLTAGE OUTPUT (VDDI) Internal Supply Voltage Range CHANNEL 1 BUCK CONVERTER (PVIN1, SW1, PGND1, BOOT1, INV1, COMP1, ILIM1) Channel 1 High-side MOSFET Drain Voltage Range Output Voltage Adjustment Range(12) Output Voltage Accuracy(12),(13) Line Regulation(12) (Normal Operation, VIN = 3.0 to 6.0 V, IOUT1 = 2.5 A) Load Regulation(12) (Normal Operation, IOUT1 = 0.0 to 5.0 A) Soft Start Adjusting Reference Voltage Range Short-circuit Current Limit High-side N-CH Power MOSFET (M4) RDS(on) (12) (IOUT1 = 1.0 A, VBOOT1 - VSW1= 3.3 V) Low-side N-CH Power MOSFET (M5) RDS(on)(12) (IOUT1 = 1.0 A, VIN = 3.3 V) M2 RDS(ON) (VIN = 3.3 V, M2 is on) Notes 11. Section “MODES OF OPERATION”, page 16 has a detailed description of the different operating modes of the 34717 12. Design information only, this parameter is not production tested. 13. This is directly affected by the accuracy of the external feedback network, 1% feedback resistors are recommended. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 3.0 V  VIN  6.0 V, - 40 C  TA  85 C, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic SW1 Leakage Current (Standby and Shutdown modes) PVIN1 Pin Leakage Current (Shutdown Mode) Error Amplifier DC Gain(14) Error Amplifier Unit Gain Bandwidth Error Amplifier Slew Rate(14) Error Amplifier Input Offset(14) (14) INV1 Pin Leakage Current Symbol Min Typ Max Unit ISW -10 - 10 µA IPVIN1 -10 - 10 µA AEA - 150 - dB UGBWEA - 3.0 - MHz SREA - 7.0 - V/µs OFFSETEA -3.0 0 3.0 mV IINV1 -1.0 - 1.0 µA Thermal Shutdown Threshold(14) TSDFET1 - 170 - °C Thermal Shutdown Hysteresis(14) TSDHYFET1 - 25 - °C PVIN 2.5 - 6.0 V VOUTHI2 0.7 - 3.6 V - -1.0 - 1.0 % REGLN2 -1.0 - 1.0 % REGLD2 -1.0 - 1.0 % Error Amplifier Reference Voltage(14) VREF2 - 0.7 - V Output Under-voltage Threshold VUVR2 -8.0 - -1.5 % Output Over-voltage Threshold VOVR2 1.5 - 8.0 % Continuous Output Current IOUT2 - - 5.0 A Over-current Limit ILIM2 - 6.5 - A VILIM2 1.25 - VDDI V CHANNEL 2 BUCK CONVERTER (PVIN2, SW2, PGND2, BOOT2, INV2, COMP2, ILIM2) Channel 2 High-side MOSFET Drain Voltage Range Output Voltage Adjustment Range (14) (14),(15),(16) Output Voltage Accuracy Line Regulation(14) (Normal Operation, VIN = 3.0 to 6.0 V, IOUT2 = 2.5 A) Load Regulation(14) (Normal Operation, IOUT2 = 0.0 to 5.0 A) Soft Start Adjusting Reference Voltage Range Short-circuit Current Limit ISHORT2 - 8.5 - A (14) RDS(on)HS2 10 - 50 m Low-side N-CH Power MOSFET (M7) RDS(on)(14) RDS(on)LS2 10 - 50 m RDS(on)M3 2.0 - 4.0  ISW -10 - 10 A IPVIN2 -10 - 10 µA High-side N-CH Power MOSFET (M6) RDS(on) (IOUT2 = 1.0 A, VBOOT2 - VSW2= 3.3 V) (IOUT2 = 1.0 A, VIN = 3.3 V) M3 RDS(ON) (VIN = 3.3 V, M3 is on) SW2 Leakage Current (Standby and Shutdown modes) PVIN2 Pin Leakage Current (Shutdown Mode) Notes 14. Design information only, this parameter is not production tested. 15. This is directly affected by the accuracy of the external feedback network, 1% feedback resistors are recommended. 16. ±1% is assured at room temperature 34717 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions 3.0 V  VIN  6.0 V, - 40 C  TA  85 C, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Error Amplifier DC Gain(17) Error Amplifier Unit Gain Bandwidth Error Amplifier Slew (17) Rate(17) Error Amplifier Input Offset (17) INV2 Pin Leakage Current Thermal Shutdown Threshold(17) Thermal Shutdown Hysteresis (17) Symbol Min Typ Max Unit AEA - 150 - dB UGBWEA - 3.0 - MHz SREA - 7.0 - V/µs OFFSETEA -3.0 0 3.0 mV IINV2 -1.0 - 1.0 µA TSDFET2 - 170 - °C TSDHYFET2 - 25 - °C VFREQ 0.0 - VDDI V OSCILLATOR (FREQ) Oscillator Frequency Adjusting Reference Voltage Range TRACKING (VREFIN, VOUT1, VOUT2) VREFIN External Reference Voltage Range(17) VREFIN 0.0 - 1.35 V VOUT1 Total Discharge Resistance(17) RTDS(M8) - 50 -  VOUT2 Total Discharge Resistance(17) RTDS(M9) - 50 -  SD High Level Input Voltage VSDHI 2.0 - - V SD Low Level Input Voltage VSDLO - - 0.4 V SD Pin Internal Pull-up Resistor RSDUP 1.0 - 2.0 M VPGLO - - 0.4 V IPGLKG -1.0 - 1.0 µA CONTROL AND SUPERVISORY (SD, PG) PG Low Level Output Voltage (IPG = 3.0 mA) PG Pin Leakage Current (M1 is off, Pulled up to VIN) Notes 17. Design information only, this parameter is not production tested. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 3.0 V  VIN  6.0 V, - 40 C  TA  85 C, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max - 8.0 - - 5.0 - Unit CHANNEL 1 BUCK CONVERTER (PVIN1, SW1, PGND1, BOOT1, INV1, COMP1, ILIM1) Switching Node (SW1) Rise Time(18) tRISE1 (PVIN = 3.3 V, IOUT1 = 5.0 A) Switching Node (SW1) Fall Time(18) tFALL1 (PVIN = 3.3 V, IOUT1 = 5.0 A) ns ns Minimum OFF Time tOFFMIN - 150 - ns Minimum ON Time tONMIN - 0(19) - ns ILIM1: 1.25 to 1.49 V - 3.2 - 1.5 to 1.81 V - 1.6 - 1.82 to 2.13 V - 0.8 - 2.14 to 2.5 V - 0.4 - tLIM1 - 10 - ms tTIMEOUT1 80 - 120 ms tFILTER1 5.0 - 25 µs - 28 - - 12.0 - - 150 - ns - (19) - ns Soft Start Duration (Normal Mode) tSS1 Over-current Limit Timer Over-current Limit Retry Timeout Period Output Under-voltage/Over-voltage Filter Delay Timer ms CHANNEL 2 BUCK CONVERTER (PVIN2, SW2, PGND2, BOOT2, INV2, COMP2, ILIM2) Switching Node (SW2) Rise Time(18) tRISE2 (PVIN = 3.3 V, IOUT2 = 5.0 A) Switching Node (SW2) Fall Time(18) tFALL2 (PVIN = 3.3 V, IOUT2 = 5.0 A) Minimum OFF Time tOFFMIN Minimum ON Time tONMIN Soft Start Duration (Normal Mode) Over-current Limit Timer Over-current Limit Retry Timeout Period Output Under-voltage/Over-voltage Filter Delay Timer 0 tSS2 ns ns ms ILIM2: 1.25 to 1.49 V - 3.2 - 1.5 to 1.81 V - 1.6 - 1.82 to 2.13 V - 0.8 - 2.14 to 2.5 V - 0.4 - tLIM2 - 10 - ms tTIMEOUT2 80 - 120 ms tFILTER2 5.0 - 25 µs Notes 18. Design information only, this parameter is not production tested. 19. The regulator has the ability to enter into pulse skip mode when the inductor current ripple reaches the threshold for the LS zero detect, which has a typical value of 500 mA. 34717 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions 3.0 V  VIN  6.0 V, - 40 C  TA  85 C, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit (FREQ = GND) FSW - 1.0 - MHz Oscillator Switching Frequency Range FSW 200 - 1000 kHz PG Reset Delay tPGRESET 8.0 - 12 ms Thermal Shutdown Retry Timeout Period(21) tTIMEOUT 80 - 120 ms OSCILLATOR (FREQ)(20) Oscillator Default Switching Frequency CONTROL AND SUPERVISORY (SD, PG) Notes 20. Oscillator frequency is ±10% 21. Design information only, this parameter is not production tested. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 11 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION Today’s advanced systems are increasingly requiring more efficient and accurate power supplies. They present a set of challenges that include highly accurate voltage regulation, high current and fast transient response capability, voltage monitoring (power sequencing), and increased operating frequency. Point of Load power supplies offer adequate solutions to these challenges. They are non-isolated DC to DC converters that are located near their load and take their input voltage from an intermediate not, necessarily, regulated bus. their close proximity to the load is of a high importance with newer device requirements. While meeting the challenges, they allow for higher efficiency, localized protection, and minimum distribution losses. Their compact design and value makes them cost effective. The 34717 is a PoL dual output power supply. Its integrated solution offers a cost effective system and reliable operation. It utilizes a voltage mode synchronous buck switching converter topology with integrated low RDS(on) (50 m) N-channel power MOSFETs for higher efficiency operation. It provides an output voltage with an accuracy of less than ±2.0%, and capable of supplying up to 5.0 A of continuous current from both channels. The second output tracking abilities makes it ideal for systems with multiple related supply rails. It has a programmable switching frequency that allows for flexibility and optimization over the operating conditions and can operate at up to 1.0 MHz to significantly reduce the external components size and cost. It also provides the ability to program the over-current limit for both channels. It protects against output over-current, over-voltage, under-voltage, and over-temperature conditions. It also protects the system from short-circuit events. It incorporates a power good output signal to alert the host when a fault occurs. It can be enabled and disabled by controlling the SD pin, which offers power sequencing capabilities. By integrating the control/supervisory circuitry along with the Power MOSFET switches for the buck converter into a spaceefficient package, the 34717 offers a complete, small-size, cost-effective, and simple solution to satisfy the needs of today’s systems. FUNCTIONAL PIN DESCRIPTION BOOTSTRAP INPUT (BOOT1, BOOT2) Bootstrap capacitor input pin. Connect a capacitor (as discussed in Bootstrap capacitor on page 23) between this pin and the SW pin of the respective channel to enhance the gate of the high-side Power MOSFET during switching. POWER INPUT VOLTAGE (PVIN1, PVIN2) Buck converter power input voltage. This is the drain of the buck converter high-side power MOSFET. SWITCHING NODE (SW1, SW2) Buck converter switching node. This pin is connected to the output inductor. POWER GROUND (PGND1, PGND2) Buck converter and discharge MOSFETs power ground. It is the source of the buck converter low-side power MOSFET. COMPENSATION INPUT (COMP1, COMP2) Buck converter external compensation network connects to this pin. Use a type III compensation network. ERROR AMPLIFIER INVERTING INPUT (INV1, INV2) Buck converter error amplifier inverting input. Connect the VDDQ voltage (channel 1) to INV1 pin through a resistor divider and connect the VTT voltage (channel 2) directly to INV2 pin. INTERNAL SUPPLY VOLTAGE OUTPUT (VDDI) This is the output of the internal bias voltage regulator. Connect a 1.0 µF, 6.0 V low ESR ceramic filter capacitor between this pin and the GND pin. Filtering any spikes on this output is essential to the internal circuitry stable operation. SIGNAL GROUND (GND) Analog ground of the IC. Internal analog signals are referenced to this pin voltage. 34717 12 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION INPUT SUPPLY VOLTAGE (VIN) IC power supply input voltage. Input filtering is required for the device to operate properly. POWER GOOD OUTPUT SIGNAL (PG) This is an active low open drain output that is used to report the status of the device to a host. This output activates after a successful power up sequence and stays active as long as the device is in normal operation and is not experiencing any faults. This output activates after a 10 ms delay and must be pulled up by an external resistor to a supply voltage like VIN. SHUTDOWN INPUT (SD) If this pin is tied to the GND pin, the device will be in Shutdown mode. If left unconnected or tied to the VIN pin, the device will be in Normal mode. The pin has an internal pull-up of 1.5 M. REFERENCE VOLTAGE INPUT (VREFIN) The output of channel two will track the voltage applied at this pin. FREQUENCY ADJUSTMENT INPUT (FREQ) The buck converters switching frequency can be adjusted by connecting this pin to an external resistor divider between VDDI and GND pins. The default switching frequency (FREQ pin connected to ground, GND) is set at 1.0 MHz. SOFT START ADJUSTMENT INPUT (ILIM1, ILIM2) Soft Start can be adjusted by applying a voltage between 1.25 V and VDDI on each ILIM pin. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 13 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC34717 - Functional Block Diagram Internal Bias Circuits System Control and Logic Oscillator Protection Functions Control and Supervisory Functions Tracking and Sequencing 2 x Buck Converter Figure 4. Block Illustration INTERNAL BIAS CIRCUITS This block contains all circuits that provide the necessary supply voltages and bias currents for the internal circuitry. It consists of: • Internal voltage supply regulator: This regulator supplies the VDDI voltage that is used to drive the digital/analog internal circuits. It is equipped with a Power-On-Reset (POR) circuit that watches for the right regulation levels. External filtering is needed on the VDDI pin. This block will turn off during the shutdown mode. • Internal bandgap reference voltage: This supplies the reference voltage to some of the internal circuitry. • Bias circuit: This block generates the bias currents necessary to run all of the blocks in the IC. SYSTEM CONTROL AND LOGIC This block is the brain of the IC where the device processes data and reacts to it. Based on the status of the SD pin, the system control reacts accordingly and orders the device into the right status. It also takes inputs from all of the monitoring/protection circuits and initiates power up or power down commands. It communicates with the buck converter to manage the switching operation and protects it against any faults. OSCILLATOR This block generates the clock cycles necessary to run the IC digital blocks. It also generates the buck converters switching frequency. The switching frequency can be programmed by connecting a resistor divider to the FREQ pin, between VDDI and GND pins (See Figure 1). PROTECTION FUNCTIONS This block contains the following circuits: • Over-current limit and short-circuit detection: This block monitors the output of the buck converters for over-current conditions and short-circuit events and alerts the system control for further command. • Thermal limit detection: This block monitors the temperature of the device for overheating events. If the temperature rises above the thermal shutdown threshold, this block will alert the system control for further commands. • Output over-voltage and under-voltage monitoring: This block monitors the buck converters output voltages to ensure they are within regulation boundaries. If not, this block alerts the system control for further commands. 34717 14 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION CONTROL AND SUPERVISORY FUNCTIONS This block is used to interface with an outside host. It contains the following circuits. • Shutdown control input: An outside host can put the 34717 device into shutdown mode by sending a logic “0” to the SD pin. • Power good output signal: The 34717 can communicate to an outside host that a fault has occurred by pulling the voltage on the PG pin high. TRACKING AND SEQUENCING This block allows the second output of the 34717 to track the voltage applied at the VREFIN pin in different tracking configurations. This will be discussed in further details later in this document. For power down during a shutdown mode, the 34717 uses internal discharge MOSFETs (M8 and M9 on Figure 2, page 2) to discharge the first and second output respectively. The discharge MOSFETs are only active during shutdown mode. Using this block along with controlling the SD pin can offer the user power sequencing capabilities by controlling when to turn the 34717 outputs on or off. BUCK CONVERTER This block provides the main function of the 34717: DC to DC conversion from an un-regulated input voltage to a regulated output voltage used by the loads for reliable operation. The buck converter is a high performance, fixed frequency (externally adjustable), synchronous buck PWM voltage-mode control. It drives integrated 50mN-channel power MOSFETs saving board space and enhancing efficiency. The switching regulator output voltage is adjustable with an accuracy of less than ±2% to meet today’s requirements. The second channel’s output has the ability to track the voltage applied at the VREFIN pin. The regulator's voltage control loop is compensated using a type III compensation network, with external components to allow for optimizing the loop compensation, for a wide range of operating conditions. A typical Bootstrap circuit with an internal PMOS switch is used to provide the voltage necessary to properly enhance the high-side MOSFET gate. The 34717 has the ability to supply up to 5.0 A of continuous current from each channel, making it suitable for many high current applications. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES VIN < 3.0 V SD = 0 VOUT2=VOVR2 VOUT2 Over-voltage VOUT1=ON VOUT2=ON PG = 1 TJ >= 170°C Shutdown FSW is programmed VOUT1 = Discharge VOUT2 = Discharge PG = 1 SD =1 Power Off VOUT1=OFF VOUT2=OFF PG = 1 3.0 V=VOVR1 VOUT2=10 ms For>=10 ms IOUT2>=ISHORT2 IOUT1>=ISHORT1 Figure 5. Operation Modes Diagram MODES OF OPERATION The 34717 has two primary modes of operation: Normal Mode In Normal mode, all functions and outputs are fully operational. To be in this mode, the VIN needs to be within its operating range, Shutdown input is high, and no faults are present. This mode consumes the most amount of power. Shutdown Mode In this mode, activated by pulling the SD pin low, the chip is in a shutdown state and the output is disabled and discharged. In this mode, the 34717 consumes the least amount of power since almost all of the internal blocks are disabled. START-UP SEQUENCE When power is first applied, the 34717 checks the status of the SD pin. If the device is in a shutdown mode, no block will power up and the output will not attempt to ramp. Once the SD pin is set to high, the VDDI internal supply voltage and the bias currents will be established, so the internal VDDI POR signal can be released. The rest of the internal blocks will be enabled and the buck converter switching frequency and soft start timing values are determined by reading the FREQ, ILIM1, and ILIM2 pins. A soft start cycle is then initiated to ramp up the output of the buck converter. The first channel uses an internal 0.7 V reference for its error amplifier while the second channel’s error amplifier uses the voltage on the VREFIN pin as its reference voltage until VREFIN is equal to 0.7 V, then the error amplifier defaults to the internal 0.7 V reference voltage. This method allows the second output to achieve multiple tracking configurations as will be explained later in this document. 34717 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Soft start is used to prevent the output voltage from overshooting during startup. At initial startup, the output capacitor is at zero volts; VOUT = 0 V. Therefore, the voltage across the inductor will be PVIN during the capacitor charge phase which will create a very sharp di/dt ramp. Allowing the inductor current to rise too high can result in a large difference between the charging current and the actual load current that can result in an undesired voltage spike once the capacitor is fully charged. The soft start is active each time the IC goes out of standby or shutdown mode, power is recycled, or after a fault retry. After a successful start-up cycle where the device is enabled, no faults have occurred, and the output voltage has reached its regulation point, the 34717 pulls the power good output signal low after a 10 ms reset delay, to indicate to the host that the device is in normal operation. PROTECTION FUNCTIONS The 34717 monitors the application for several fault conditions to protect the load from overstress. The reaction of the IC to these faults ranges from turning off the outputs to just alerting the host that something is wrong. In the following paragraphs, each fault condition is explained: Output Over-voltage An over-voltage condition occurs once the output voltage goes higher than the rising over-voltage threshold (VOVR). In this case, the power good output signal is pulled high, alerting the host that a fault is present, but the output will stay active. To avoid erroneous over-voltage conditions, a 20 µs filter is implemented. The buck converter will use its feedback loop to attempt to correct the fault. Once the output voltage falls below the falling over-voltage threshold (VOVF), the fault is cleared and the power good output signal is pulled low, the device is back in normal operation. Output Under-voltage An under-voltage condition occurs once the output voltage falls below the falling under-voltage threshold (VUVF). In this case, the power good output signal is pulled high, alerting the host that a fault is present, but the output will stay active. To avoid erroneous under-voltage conditions, a 20 µs filter is implemented. The buck converter will use its feedback loop to attempt to correct the fault. Once the output voltage rises above the rising under-voltage threshold (VUVR), the fault is cleared and the power good output signal is pulled low, the device is back in normal operation. Output Over-current This block detects over-current in the Power MOSFETs of the buck converter. It is comprised of a sense MOSFET and a comparator. The sense MOSFET acts as a current detecting device by sampling a ratio of the load current. That sample is compared via the comparator with an internal reference to determine if the output is in over-current or not. If the peak current in the output inductor reaches the over current limit (ILIM), the converter will start a cycle-by-cycle operation to limit the current, and a 10 ms over-current limit timer (tLIM) starts. The converter will stay in this mode of operation until one of the following occurs: • The current is reduced back to the normal level before tLIM expires, and in this case normal operation is regained. • tLIM expires without regaining normal operation, at which point the device turns off the output and the power good output signal is pulled high. At the end of a time-out period of 100 ms (tTIMEOUT), the device will attempt another soft start cycle. • The device reaches the thermal shutdown limit (TSDFET) and turns off the output. The power good output signal is pulled high. • The output current keeps increasing until it reaches the short-circuit current limit (ISHORT). See below for more details. Short-circuit Current Limit This block uses the same current detection mechanism as the over-current limit detection block. If the load current reaches the ISHORT value, the device reacts by shutting down the output immediately. This is necessary to prevent damage in case of a permanent short-circuit. Then, at the end of a timeout period of 100 ms (tTIMEOUT), the device will attempt another soft start cycle. Thermal Shutdown Thermal limit detection block monitors the temperature of the device and protects against excessive heating. If the temperature reaches the thermal shutdown threshold (TSDFET), the converter output switches off and the power good output signal indicates a fault by pulling high. The device will stay in this state until the temperature has decreased by the hysteresis value and then After a timeout period (tTIMEOUT) of 100 ms, the device will retry automatically and the output will go through a soft start cycle. If successful normal operation is regained, the power good output signal is asserted low to indicate it. 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 17 TYPICAL APPLICATIONS TYPICAL APPLICATIONS VIN FREQ ILIM2 ILIM1 5 C27 0.1 F VOUT1 FREQ VIN VIN 7 8 9 10 PG C13 0.1 F Compensation Network SW1 PGND2 15 14 VOUT2 C11 0.1 F VOUT2 11 12 13 INV1 COMP1 VREFIN 15 PGND2 6 VOUT1 SW2 16 PGND2 PGND1 PVIN2 INV2 4 17 16 SW2 PGND1 SW2 0.1 F 17 SW2 MC34717 SW1 COMP2 4 PGND1 SW1 SD 3 PG SW1 PVIN2 NC 3 PVIN2 PVIN1 C15 18 BOOT2 PVIN1 VREFIN 2 PVIN1 BOOT2 21 20 19 BOOT1 COMP1 2 GND NC 1 INV1 C28 SW1 0.1 F 24 23 22 VDDI 26 25 ILIM1 VDDI BOOT1 ILIM2 C14 0.1 F INV2 SD COMP2 C12 0.1 F Compensation Network SW2 VO1 VO2 INV2 COMP1 C18 15 pF R15 22 k C19 0.75 nF R14 560 INV2 C20 0.910 nF R1 20 k C21 20 pF COMP2 R19 15 k C22 1.8 nF R2 12.7 k Buck Converter 1 SW1 D3 PMEG2010EA _nopop L1 1 H R4 20 k R2 17.4 k Buck Converter 2 Vo1_2 Vo1_1 R18 300 C230 1.0 nF VO1 R20 4.7_nopop C10 C24 C26 100 F100 F C25 100 F 1 nF_nopop SW2 D2 OMEG2010EA _nopop L1 1.5 H Vo2_2 Vo2_1 VO2 R30 4.7_nopop C7 C6 C8 C9 100 F100 F 100 F 1 nF_nopop 34717 18 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS Figure 6. 34717 Typical Application I/O Signals GND GND PVIN1 VO1 3 2 1 PVIN2 VO2 3 2 1 VM VIN 3 2 1 GND VIN Capacitors PGOOD LED VIN J2 VM VIN C17 10 F C16 0.1 F R7 1k J3 R8 10k D1 LED VMASTER R9 10k LED J4 ILIM1, ILIM2, FREQ Jumpers VO1 VMASTER STBY_nopop LED 1 2 2 1 VMASTER 1 3 5 7 9 J1 2 4 6 8 10 VREFIN SD CON10A SD VDDI R10 10 k R16 10 k PG x VDDI ILIM1 R22 10 k_nopop VDDI R12 10 k ILIM2 R13 10 k_nopop FREQ R11 10 k_nopop PVIN2 Capacitors PVIN1 Capacitors PVIN1 PVIN2 C1 0.1 F C2 1 F C3 C4 C5 100 F 100 F 100 F C30 0.1 F C31 1 F C32 C33 C29 1002 F 100 F 100 F Trimpots nopop VDDI ILIM1 ILIM2 FREQ R21 R5 R6 POT_50 k_nopop POT_50 k_nopop POT_50 k_nopop Figure 7. 34717 Typical Application 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 19 TYPICAL APPLICATIONS CONFIGURING THE OUTPUT VOLTAGE: Both channels for the 34717 are general purpose DC-DC converters. The resistor divider to the INV node is responsible for setting the output voltage. The equation is:  R1  VOUT  V REF   1  R2  For channel 1: VREF=VBG=0.7V. For channel 2: The second channel of the 34717 has an internal reference selector, thus VREF can be either the voltage at VREFIN pin or the internal reference voltage VBG. The reference value is given by the following condition: VREF=VREFIN if VREFIN is less than VBG=0.7 V. Otherwise, VREF=VBG. Usually the output regulation voltage is calculated using the internal reference VBG, and the condition VREF=VREFIN is used for tracking purposes. SWITCHING FREQUENCY CONFIGURATION The switching frequency will have a value of 1.0MHz by connecting the FREQ pin to the GND. If the smallest frequency value of 200 kHz is desired, then connect the FREQ pin to VDDI. To program the switching frequency to another value, an external resistor divider must be connected to the FREQ pin to achieve the voltages given by Table 5. Table 5. Frequency Selection FREQUENCY VOLTAGE APPLIED TO PIN FREQ 200 2.341 – 2.500 253 2.185 - 2.340 307 2.029 - 2.184 360 1.873 - 2.028 413 1.717 – 1.872 466 1.561 – 1.716 520 1.405 - 1.560 573 1.249 - 1.404 627 1.093 - 1.248 680 0.936 - 1.092 733 0.781 - 0.936 787 0.625 - 0.780 840 0.469 - 0.624 893 0.313 - 0.468 947 0.157 - 0.312 1000 0.000 - 0.156 34717 20 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS SOFT START ADJUSTMENT Table 6 shows the voltage that should be applied to the ILIM1and ILIM2 pins to get the desired soft start timing. Table 6. Soft Start Configurations SOFT START [MS] VOLTAGE APPLIED TO ILIM 3.2 1.19 - 1.49 V 1.6 1.50 - 1.81 V 0.8 1.82 - 2.13 V 0.4 2.14 - 2.50 V RFQH CVDDI RIL RIL RIH RIH RFQL VDDI FREQ ILIM1 GND Figure 8. Resistor Divider for Frequency and Soft Start Adjustment 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 21 TYPICAL APPLICATIONS SELECTING INDUCTOR The Inductor calculation process is the same for both Channels. The equation is the following: (VOUT  I OUT * ( Rds (on) _ ls  r _ w)) I OUT VOUT Maximum Off Time Percentage  1 Vin _ max L  D'MAX T  D 'MAX T Switching Period Rds(on) _ ls Drain – to – Source Resistance of FET r_w I OUT Winding Resistance of Inductor Output Current Ripple SELECTING THE OUTPUT FILTER CAPACITOR The following considerations are most important for the output capacitor, and not the actual Farad value: the physical size, the ESR of the capacitor, and the voltage rating. Calculate the minimum output capacitor using the following formula: Co  I OUT * dt _ I _ rise TR _ V _ dip Transient Response percentage: TR_% (Use a recommended value of 2 to 4% to assure a good transient response.) Maximum Transient Voltage: TR_V_dip = VOUT*TR_% Maximum Current Step: Iout _ step  (Vin _ min  Vout ) * D _ max Fsw * L Inductor Current Rise Time: dt _ I _ rise  T * I OUT I OUT _ step 34717 22 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS The following formula is helpful to find the maximum allowed ESR. ESRmax  VOUT * Fsw * L VOUT (1  D min) The effects of the ESR is often neglected by the designers and may present a hidden danger to the ultimate supply stability. Poor quality capacitors have a widely disparate ESR value, which can make the closed loop response inconsistent. BOOTSTRAP CAPACITOR The bootstrap capacitor is needed to supply the gate voltage for the high-side MOSFET. This N-Channel MOSFET needs a voltage difference between its gate and source to be able to turn on. The high-side MOSFET source is the SW node, so it is not at ground and it is floating and shifting in voltage. We cannot just apply a voltage directly to the gate of the high-side that is referenced to ground. We need a voltage referenced to the SW node. This is why the bootstrap capacitor is needed. This capacitor charges during the high- side off time. The low-side will be on during that time. The SW node and the bottom of the bootstrap capacitor will be connected to ground, and the top of the capacitor will be connected to a voltage source. The capacitor will charge up to that voltage source (for example 5.0 V). Now when the low- side MOSFET switches off and the high-side MOSFET switches on, the SW nodes will rise to VIN, and the voltage on the boot pin will be VCAP + VIN. The gate of the highside will have VCAP across it and it will be able to stay enhanced. A 0.1 F capacitor is a good value for this bootstrap element. TYPE III COMPENSATION NETWORK Power supplies are desired to offer accurate and tight regulation output voltages. A high DC gain is required to accomplish this, but with high gain comes the possibility of instability. The purpose of adding compensation to the internal error amplifier is to counteract some of the gains and phases contained in the control-to-output transfer function that could jeopardized the stability of the power supply. The Type III compensation network used for the 34717 comprises two poles (one integrator and one high frequency to cancel the zero generated from the ESR of the output capacitor) and two zeros to cancel the two poles generated from the LC filter as shown in Figure 9. SWx VOUTx INVx COMPx Lx RSx COx R1x CSx CXx RFx R2x CFx Figure 9. Type III compensation network 1. Choose a value for R1 2. Consider a Crossover frequency of one tenth of the switching frequency, set the Zero pole frequency to Fcross/10 FP 0  1 1 FCROSS  10 2 * R1C F CF  1 2 * R1 FPO 3. Knowing the LC frequency, the Frequency of Zero 1 and Zero 2 in the compensation network are equal to FLC 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 23 TYPICAL APPLICATIONS FLC  1  FZ 1  FZ 2 2 LX Co X 1 2 * RF C F FZ 1  FZ 2  1 2 * R1C S This gives the result RF  1 2 * C F FZ 1 CS  1 2 * R1 FZ 2 4. Calculate RS by placing the first pole at the ESR zero frequency 1  FP1 2 * Co X * ESR 1 1 RS  FP1  2 * FP1C S 2 * RS C S FESR  5. Equating pole 2 to 5 times the Crossover Frequency achieves a faster response and a proper phase margin 5  F CROSS = F 1 --------------------------------------P2 = CF CX 2  R F -------------------CF + Cx CX  CF 2 * R F C F FP 2  1 TRACKING CONFIGURATIONS. This device allows two tracking configurations: Ratiometric and Co-incidental Tracking. Vmaster Different Slope Vslave Figure 10. Ratiometric Tracking 34717 24 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS Vmaster Slave Regulation Point Same Slope Vslave Figure 11. Co-incidental Tracking RATIOMETRIC TRACKING CIRCUIT CONFIGURATION The master voltage feedback resistor divider network is used in place of R3 and R4 as shown in Figure 12. The slave output is connected through its own feedback resistor divider network to the INV- pin, resistors R1 and R2. All four resistors will affect the accuracy of the system and must be 1% accurate resistors. To achieve this tracking configuration, the master voltage must be connected in the way shown and cannot be directly connected to the VREFIN pin. VMASTER VBG VREFIN R3 R4 To INV- of Vmaster Reference selector VSLAVE Rs + EA - INV R1 Cs CX RF CF CO R2 COMP Figure 12. Ratiometric Tracking Circuit Connections EQUATIONS • • • • VM = VBG_M(1+R3/R4) VREFIN = VM * R4/(R3+R4) VREFOUT = VREFIN VS = VREFOUT(1+R1/R2) = VM* R4/(R3+R4)*(R2+R1)/R2,  if VREFOUT < VBG_S • VS = VBG_S(1+R1/R2), if VREFOUT  VBG_S 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 25 TYPICAL APPLICATIONS Figure 13. Ratiometric Tracking Plot CO-INCIDENTAL TRACKING CIRCUIT CONFIGURATION: Connect a three resistor divider to the master voltage (VM) and Route the upper tap point of the divider to the VREFIN pin, resistors R3, R4, and R5 as shown in Figure 14. This resistor divider must be the same ratio as the slave output’s (VS) feedback resistor divider, which in turn connects to the INV- pin, resistors R1 and R2 below (Condition: R1 = R3 and R2 = R4 + R5). The master’s feedback resistor divider would be (R3+R4) and R5. All five resistors will affect the accuracy of the system and must be 1% accurate resistors. To achieve this tracking configuration, the master voltage must be connected in the way shown and cannot be directly connected to the VREFIN pin. VMASTER VBG VREFIN R3 R4 Reference selector To INV- of Vmaster R5 VSLAVE Rs + EA - INV R1 Cs CX RF CF CO R2 COMP Figure 14. Co-incidental Tracking Circuit Connections EQUATIONS • • • • • VM = VBG_M[1+(R3+R4)/R5] VREFIN = VM*(R4+R5)/(R3+R4+R5) VREFOUT = VREFIN VS = VREFOUT(1+R1/R2) = VM*(R4+R5)/(R3+R4+R5)*(R2+R1)/R2 = VM if VREFOUT < VBG_S VS = VBG_S(1+R1/R2), if VREFOUT  VBG_S 34717 26 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS Figure 15. Co-incidental Tracking Plot Not-DDR Mode (Source Only Mode) is the case when no tracking is needed. VREFIN should be connected to VDDI and the reference selection block will use the internal band gap voltage as the error amplifier’s reference voltage. A user can potentially apply a voltage to the VREFIN pin directly or through a resistor divider to get a buffered output for use in the application. The condition here is, the voltage applied to the VREFIN pin is greater than VBG to guarantee that the reference selection block will not switch back to the VREFOUT voltage. LAYOUT GUIDELINES The layout of any switching regulator requires careful consideration. First, there are high di/dt signals present, and the traces carrying these signals need to be kept as short and as wide as possible to minimize the trace inductance, and therefore reduce the voltage spikes they can create. To do this, an understanding of the major current carrying loops is important. See Figure 16. These loops, and their associated components, should be placed in such a way as to minimize the loop size to prevent coupling to other parts of the circuit. Also, the current carrying power traces and their associated return traces should run adjacent to one another, to minimize the amount of noise coupling. If sensitive traces must cross the current carrying traces, they should be made perpendicular to one another to reduce field interaction. Second, small signal components which connect to sensitive nodes need consideration. The critical small signal components are the ones associated with the feedback circuit. The high impedance input of the error amp is especially sensitive to noise, and the feedback and compensation components should be placed as far from the switch node, and as close to the input of the error amplifier as possible. Other critical small signal components include the bypass capacitors for VIN, VREFIN, and VDDI. Locate the bypass capacitors as close to the pin as possible. The use of a multi-layer printed circuit board is recommended. Dedicate one layer, usually the layer under the top layer, as a ground plane. Make all critical component ground connections with vias to this layer. Make sure that the power grounds, PGND1 and PGND2 are connected directly to the ground plane and not routed through the thermal pad or analog ground. Dedicate another layer as a power plane and split this plane into local areas for common voltage nets. The IC input supply (VIN) should be connected with a dedicated trace to the input supply. This will help prevent noise on the buck regulator's power inputs (PVIN1 and PVIN2) from injecting switching noise into the IC’s analog circuitry. In order to effectively transfer heat from the top layer to the ground plane and other layers of the printed circuit board, thermal vias need to be used in the thermal pad design. It is recommended that 5 to 9 vias be spaced evenly and have a finished diameter of 0.3 mm. VIN1 PVIN1 VIN2and and 23 Loop Curr ent HS ON HS SW1 SW2and and 2 3 SW1 SD Loop Curr ent HS ON HS Loop Current SD ON Loop Current LS ON LS GND2and and23 PGND1 BUCK CONVERTER 1 Buck Converter 1 and 2 BUCK CONVERTER 2 and 3 Figure 16. Current Loop 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 27 PACKAGING PACKAGING DIMENSIONS PACKAGING PACKAGING DIMENSIONS 34717 28 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGING DIMENSIONS 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 29 PACKAGING PACKAGING DIMENSIONS 34717 30 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 1.0 2/2006 • • Pre-release version Implemented Revision History page 2.0 1/2007 • • • Initial release Converted format from Market Assessment to Product Preview Major updates to the data, form, and style 3.0 5/2007 • • • • • • • Changed Feature from 2% to 1%, relabeled to include soft start Change references for 45 m Integrated N-Channel Power MOSFETs to 50 m Removed Machine Model in Maximum Ratings Added Channel 1 High-side MOSFET Drain Voltage Range Changed Output Voltage Accuracy(12),(13) Changed Soft Start Adjusting Reference Voltage Range and Short-circuit Current Limit Changed High-side N-CH Power MOSFET (M4) RDS(on)(12) and Low-side N-CH Power MOSFET (M5) RDS(on)(12) Changed M2 RDS(ON) and PVIN1 Pin Leakage Current Added Channel 2 High-side MOSFET Drain Voltage Range Changed Soft Start Adjusting Reference Voltage Range Changed Short-circuit Current Limit Changed High-side N-CH Power MOSFET (M6) RDS(on)(14) and Low-side N-CH Power MOSFET (M7) RDS(on)(14) Changed M3 RDS(ON) and PVIN2 Pin Leakage Current Changed SD Pin Internal Pull-up Resistor Changed Channel 1 Soft Start Duration (Normal Mode), Over-current Limit Retry Timeout Period, and Output Under-voltage/Over-voltage Filter Delay Timer Changed Channel 2 Soft Start Duration (Normal Mode), Over-current Limit Retry Timeout Period, and Output Under-voltage/Over-voltage Filter Delay Timer Changed Oscillator Default Switching Frequency Changed PG Reset Delay and Thermal Shutdown Retry Timeout Period(21) Changed definition for Soft Start ADJUStment input (ILIM1, ILIM2) Changed drawings in 34717 Typical Application Changed table for Soft Start Adjustment Removed PC34717EP/R2 from the ordering information and added MC34717EP/R2 Changed data sheet status to Advance Information • • • • • • • • • • • • • • • • 4.0 12/2008 • • • • Made changes to Switching Node (SW1, SW2) Pins, BOOT1, BOOT2 Pins (Referenced to SW1, SW2 Pins Respectively), Output Under-voltage Threshold, Output Over-voltage Threshold, Both channels of High-side N-CH Power MOSFET (M4) RDS(on)(12), Both channels of Low-side N-CH Power MOSFET (M5) RDS(on)(12), Charge Device Model Added Machine Model (MM), Both channels of SW2 Leakage Current (Standby and Shutdown modes), Both channels of (Error Amplifier DC Gain(14), Error Amplifier Unit Gain Bandwidth(14), Error Amplifier Slew Rate(14), Error Amplifier Input Offset(14)) Fixed drawing for Type III compensation network Added pin 27 to Figure 3 and the 34717 Pin Definitions Added the section Layout Guidelines • Updated case outline (changed 98ASA10728D to 98ASA00702D) as per PCN 16331 • 5.0 12/2014 34717 Analog Integrated Circuit Device Data Freescale Semiconductor 31 How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. Home Page: freescale.com There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based Web Support: freescale.com/support Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no on the information in this document. warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. SMARTMOS is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc. Document Number: MC34717 Rev 5.0 12/2014