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MC68HC11A8
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HCMOS Single-Chip Microcontroller
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TABLE OF CONTENTS
Paragraph
Number
Title
Page
Number
1 INTRODUCTION
1.1
1.1.1
1.1.2
1.2
1.3
1.4
Features .................................................................................................... 1-1
Hardware Features ............................................................................ 1-1
Software Features ............................................................................. 1-1
General Description ................................................................................... 1-1
Programmer’s Model ................................................................................. 1-2
Summary of M68HC11 Family .................................................................. 1-3
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2 SIGNAL DESCRIPTIONS AND OPERATING MODES
2.1
Signal Pin Descriptions ............................................................................. 2-1
2.1.1
Input Power (VDD) and Ground (VSS) ................................................ 2-1
2.1.2
Reset (RESET) .................................................................................. 2-1
2.1.3
Crystal Driver and External Clock Input (XTAL, EXTAL) ................... 2-1
2.1.4
E Clock Output (E) ............................................................................ 2-3
2.1.5
Interrupt Request (IRQ) ..................................................................... 2-3
2.1.6
Non-Maskable Interrupt (XIRQ) ......................................................... 2-3
2.1.7
Mode A/Load Instruction Register and Mode B/Standby Voltage (MODA/
LIR, MODB/VSTBY) 2-3
2.1.8
A/D Converter Reference Voltages (VRL, VRH) ................................. 2-4
2.1.9
Strobe B and Read/Write (STRB/R/W) ............................................. 2-4
2.1.10
Strobe A and Address Strobe (STRA/AS) ......................................... 2-4
2.1.11
Port Signals ....................................................................................... 2-4
2.1.11.1
Port A ........................................................................................ 2-5
2.1.11.2
Port B ........................................................................................ 2-5
2.1.11.3
Port C ........................................................................................ 2-5
2.1.11.4
Port D ........................................................................................ 2-5
2.1.11.5
Port E ........................................................................................ 2-6
2.2
Operating Modes ....................................................................................... 2-6
2.2.1
Single-Chip Operating Mode ............................................................. 2-6
2.2.2
Expanded Multiplexed Operating Mode ............................................ 2-6
2.2.3
Special Bootstrap Operating Mode ................................................... 2-8
2.2.4
Additional Boot Loader Program Options ........................................ 2-10
2.2.5
Special Test Operating Mode .......................................................... 2-10
3 ON-CHIP MEMORY
3.1
3.2
3.3
3.4
3.5
3.5.1
Memory Maps ............................................................................................ 3-1
RAM and I/O Mapping Register (INIT) ...................................................... 3-4
ROM .......................................................................................................... 3-5
RAM .......................................................................................................... 3-5
EEPROM ................................................................................................... 3-5
EEPROM Programming Control Register (PPROG) ......................... 3-6
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3.5.2
3.5.2.1
3.5.2.2
3.5.2.3
3.5.2.4
3.5.2.5
3.5.3
3.5.3.1
3.5.3.2
Programming/Erasing Internal EEPROM .......................................... 3-7
Read .......................................................................................... 3-7
Programming ............................................................................. 3-7
Bulk Erase ................................................................................. 3-8
Row Erase ................................................................................. 3-8
Byte Erase ................................................................................. 3-9
System Configuration Register (CONFIG) ........................................ 3-9
Programming and Erasure of the CONFIG Register ............... 3-10
Operation of the Configuration Mechanism ............................. 3-12
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4 PARALLEL I/O
4.1
4.2
4.3
4.3.1
4.3.2
4.4
4.4.1
4.4.2
4.5
General-Purpose I/O (Ports C and D) ....................................................... 4-1
Fixed Direction I/O (Ports A, B, and E) ...................................................... 4-1
Simple Strobed I/O .................................................................................... 4-2
Strobed Input Port C .......................................................................... 4-2
Strobed Output Port B ....................................................................... 4-2
Full Handshake I/O .................................................................................... 4-2
Input Handshake Protocol ................................................................. 4-3
Output Handshake Protocol .............................................................. 4-3
Parallel I/O Control Register (PIOC) ......................................................... 4-4
5 SERIAL COMMUNICATIONS INTERFACE
5.1
5.1.1
5.1.2
5.1.3
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.8.1
5.8.2
5.8.3
5.8.4
5.8.5
Overview and Features ............................................................................. 5-1
SCI Two-Wire System Features ........................................................ 5-1
SCI Receiver Features ...................................................................... 5-1
SCI Transmitter Features .................................................................. 5-1
Data Format .............................................................................................. 5-1
Wake-Up Feature ...................................................................................... 5-2
Receive Data (RxD) .................................................................................. 5-2
Start Bit Detection ..................................................................................... 5-3
Transmit Data (TxD) .................................................................................. 5-5
Functional Description ............................................................................... 5-5
SCI Registers ............................................................................................ 5-5
Serial Communications Data Register (SCDR) ................................. 5-6
Serial Communications Control Register 1 (SCCR1) ........................ 5-8
Serial Communications Control Register 2 (SCCR2) ........................ 5-8
Serial Communications Status Register (SCSR) ............................ 5-10
Baud Rate Register (BAUD) ............................................................ 5-11
6 SERIAL PERIPHERAL INTERFACE
6.1
6.2
6.2.1
6.2.2
6.2.3
Overview and Features ............................................................................. 6-1
SPI Signal Descriptions ............................................................................. 6-1
Master In Slave Out (MISO) .............................................................. 6-1
Master Out Slave In (MOSI) .............................................................. 6-1
Serial Clock (SCK) ............................................................................ 6-2
MC68HC11A8
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6.2.4
6.3
6.4
6.4.1
6.4.2
6.4.3
Slave Select (SS) .............................................................................. 6-2
Functional Description ............................................................................... 6-3
SPI Registers ............................................................................................ 6-4
Serial Peripheral Control Register (SPCR) ....................................... 6-4
Serial Peripheral Status Register (SPSR) ......................................... 6-5
Serial Peripheral Data l/O Register (SPDR) ...................................... 6-6
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7 ANALOG-TO-DIGITAL CONVERTER
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
Conversion Process .................................................................................. 7-1
Channel Assignments ............................................................................... 7-1
Single-Channel Operation ......................................................................... 7-2
Multiple-Channel Operation ....................................................................... 7-2
Operation in STOP and WAIT Modes ....................................................... 7-3
A/D Control/Status Register (ADCTL) ....................................................... 7-3
A/D Result Registers 1, 2, 3, and 4 (ADR1, ADR2, ADR3, and ADR4) .... 7-5
A/D Power-Up and Clock Select ............................................................... 7-5
8 PROGRAMMABLE TIMER, RTI, AND PULSE ACCUMULATOR
8.1
Programmable Timer ................................................................................. 8-1
8.1.1
Counter .............................................................................................. 8-1
8.1.2
Input Capture ..................................................................................... 8-1
8.1.3
Output Compare ................................................................................ 8-2
8.1.4
Output Compare 1 I/O Pin Control .................................................... 8-2
8.1.5
Timer Compare Force Register (CFORC) ......................................... 8-3
8.1.6
Output Compare 1 Mask Register (OC1M) ....................................... 8-3
8.1.7
Output Compare 1 Data Register (OC1D) ........................................ 8-4
8.1.8
Timer Control Register 1 (TCTL1) ..................................................... 8-4
8.1.9
Timer Control Register 2 (TCTL2) ..................................................... 8-5
8.1.10
Timer Interrupt Mask Register 1 (TMSK1) ........................................ 8-5
8.1.11
Timer Interrupt Flag Register 1 (TFLG1) ........................................... 8-5
8.1.12
Timer Interrupt Mask Register 2 (TMSK2) ........................................ 8-6
8.1.13
Timer Interrupt Flag Register 2 (TFLG2) ........................................... 8-7
8.2
Real-Time Interrupt ................................................................................... 8-8
8.3
Pulse Accumulator .................................................................................... 8-8
8.3.1
Pulse Accumulator Control Register (PACTL) .................................. 8-8
9 RESETS, INTERRUPTS, AND LOW POWER MODES
9.1
Resets ....................................................................................................... 9-1
9.1.1
External RESET Pin .......................................................................... 9-1
9.1.2
Power-On Reset ................................................................................ 9-1
9.1.2.1
CPU ........................................................................................... 9-2
9.1.2.2
Memory Map ............................................................................. 9-3
9.1.2.3
Parallel l/O ................................................................................. 9-3
9.1.2.4
Timer ......................................................................................... 9-3
9.1.2.5
Real-Time Interrupt ................................................................... 9-4
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9.1.2.6
Pulse Accumulator .................................................................... 9-4
9.1.2.7
COP .......................................................................................... 9-4
9.1.2.8
SCI Serial l/O ............................................................................ 9-4
9.1.2.9
SPI Serial l/O ............................................................................. 9-4
9.1.2.10
A/D Converter ........................................................................... 9-4
9.1.2.11
System ...................................................................................... 9-4
9.1.3
Computer Operating Properly (COP) Reset ...................................... 9-5
9.1.4
Clock Monitor Reset .......................................................................... 9-6
9.1.5
Configuration Options Register (OPTION) ........................................ 9-6
9.2
Interrupts ................................................................................................... 9-7
9.2.1
Software Interrupt (SWI) .................................................................... 9-9
9.2.2
Illegal Opcode Trap ........................................................................... 9-9
9.2.3
Interrupt Mask Bits in Condition Code Register ................................ 9-9
9.2.4
Priority Structure .............................................................................. 9-10
9.2.5
Highest Priority I Interrupt Register (HPRIO) .................................. 9-10
9.3
Low-Power Modes ................................................................................... 9-17
9.3.1
WAIT Instruction .............................................................................. 9-17
9.3.2
STOP Instruction ............................................................................. 9-17
10 CPU, ADDRESSING MODES, AND INSTRUCTION SET
10.1
CPU Registers ......................................................................................... 10-1
10.1.1
Accumulators A and B ..................................................................... 10-1
10.1.2
Index Register X (IX) ....................................................................... 10-1
10.1.3
Index Register Y (IY) ....................................................................... 10-2
10.1.4
Stack Pointer (SP) ........................................................................... 10-2
10.1.5
Program Counter (PC) .................................................................... 10-2
10.1.6
Condition Code Register (CCR) ...................................................... 10-2
10.1.6.1
Carry/Borrow (C) ..................................................................... 10-3
10.1.6.2
Overflow (V) ............................................................................ 10-3
10.1.6.3
Zero (Z) ................................................................................... 10-3
10.1.6.4
Negative (N) ............................................................................ 10-3
10.1.6.5
Interrupt Mask (I) ..................................................................... 10-3
10.1.6.6
Half Carry (H) .......................................................................... 10-3
10.1.6.7
X Interrupt Mask (X) ................................................................ 10-3
10.1.6.8
Stop Disable (S) ...................................................................... 10-3
10.2
Addressing Modes ................................................................................... 10-3
10.2.1
Immediate Addressing ..................................................................... 10-4
10.2.2
Direct Addressing ............................................................................ 10-4
10.2.3
Extended Addressing ...................................................................... 10-4
10.2.4
Indexed Addressing ......................................................................... 10-4
10.2.5
Inherent Addressing ........................................................................ 10-4
10.2.6
Relative Addressing ........................................................................ 10-4
10.2.7
Prebyte ............................................................................................ 10-5
10.3
Instruction Set ......................................................................................... 10-5
A ELECTRICAL CHARACTERISTICS
MC68HC11A8
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B MECHANICAL DATA AND ORDERING INFORMATION
B.1
B.2
Pin Assignments ....................................................................................... B-1
Package Dimensions ................................................................................ B-3
C DEVELOPMENT SUPPORT
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C.1
C.1.1
C.2
C.2.1
C.3
C.3.1
C.4
C.4.1
M68HC11EVB — Evaluation Board ......................................................... C-1
EVB Features ................................................................................... C-1
M68HC11EVBU — Universal Evaluation Board ...................................... C-1
EVBU Features ................................................................................ C-1
M68HC11EVM — Evaluation Module ...................................................... C-2
EVM Features .................................................................................. C-2
MMDS11 — Modular Development System ............................................. C-2
MMDS11Features ............................................................................ C-3
SUMMARY OF CHANGES
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MC68HC11A8
TECHNICAL DATA
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LIST OF ILLUSTRATIONS
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Figure
Page
1-1
Block Diagram ................................................................................................ 1-2
1-2
Programming Model ....................................................................................... 1-3
2-1
Common Crystal Connections ........................................................................ 2-2
2-2
External Oscillator Connections ..................................................................... 2-2
2-3
One Crystal Driving Two MCUs ..................................................................... 2-2
2-4
Address/Data Demultiplexing ......................................................................... 2-8
3-1
Memory Maps ................................................................................................. 3-1
5-1
Data Format ................................................................................................... 5-2
5-2
Sampling Technique Used on All Bits ............................................................ 5-3
5-3
Examples of Start Bit Sampling Techniques .................................................. 5-4
5-4
SCI Artificial Start Following a Framing Error ................................................. 5-4
5-5
SCI Start Bit Following a Break ...................................................................... 5-4
5-6
Serial Communications Interface Block Diagram ........................................... 5-7
5-7
Rate Generator Division ............................................................................... 5-12
6-1
Data Clock Timing Diagram ........................................................................... 6-2
6-2
Serial Peripheral Interface Block Diagram ..................................................... 6-3
6-3
Serial Peripheral Interface Master-Slave Interconnection .............................. 6-4
7-1
A/D Conversion Sequence ............................................................................. 7-2
7-2
A/D Pin Model ................................................................................................ 7-2
9-1
Reset Timing .................................................................................................. 9-2
9-2
Simple LVI Reset Circuit ................................................................................ 9-3
9-3
Interrupt Stacking Order ................................................................................. 9-9
9-4
Processing Flow Out of Resets (Sheet 1 of 2) ............................................. 9-12
9-4
Processing Flow Out of Resets (Sheet 2 of 2) ............................................. 9-13
9-5
Interrupt Priority Resolution (Sheet 1 of 2) ................................................... 9-14
9-5
Interrupt Priority Resolution (Sheet 2 of 2) ................................................... 9-15
9-6
Interrupt Source Resolution Within SCI ........................................................ 9-16
10-1
Programming Model ..................................................................................... 10-2
10-2
Special Operations ..................................................................................... 10-12
A-1
Test Methods .................................................................................................. A-4
A-2
Timer Inputs ................................................................................................... A-7
A-3
POR and External Reset Timing Diagram ...................................................... A-8
A-4
STOP Recovery Timing Diagram ................................................................... A-9
A-5
WAIT Recovery Timing Diagram .................................................................. A-10
A-6
Interrupt Timing Diagram .............................................................................. A-11
A-7
Port Write Timing Diagram ........................................................................... A-14
A-8
Port Read Timing Diagram ........................................................................... A-14
A-9
Simple Output Strobe Timing Diagram ......................................................... A-14
A-10
Simple Input Strobe Timing Diagram ........................................................... A-15
A-11
Port C Input Handshake Timing Diagram ..................................................... A-15
A-12
Port C Output Handshake Timing Diagram .................................................. A-15
A-13
Three-State Variation of Output Handshake Timing Diagram
(STRA Enables Output Buffer) A-16
A-14
Multiplexed Expansion Bus Timing Diagram ................................................ A-21
A-8
a) SPI Master Timing (CPHA = 0) ................................................................ A-24
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b) SPI Master Timing (CPHA = 1) ................................................................ A-24
SPI Timing Diagram (1 of 2) ......................................................................... A-24
c) SPI Slave Timing (CPHA = 0) .................................................................. A-25
d) SPI Slave Timing (CPHA = 1) .................................................................. A-25
SPI Timing Diagrams (2 of 2) ....................................................................... A-25
52-Pin PLCC .................................................................................................. B-1
48-Pin DIP ...................................................................................................... B-2
64-Pin QFP ..................................................................................................... B-3
M68HC11 P/N Options ................................................................................... B-5
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A-8
A-15
A-15
A-15
A-15
B-1
B-2
B-3
B-4
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LIST OF TABLES
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Table
Page
1-1 M68HC11 Family Devices ..................................................................................... 1-4
2-1 Operating Modes vs. MODA and MODB ............................................................... 2-3
2-2 Port Signal Summary............................................................................................. 2-7
2-3 Bootstrap Mode Interrupt Vectors.......................................................................... 2-9
3-1 Register and Control Bit Assignments ................................................................... 3-2
4-1 Handshake l/O Operations Summary .................................................................... 4-4
5-1 First Prescaler Stage ........................................................................................... 5-11
5-2 Second Prescaler Stage ...................................................................................... 5-12
5-3 Prescaler Highest Baud Rate Frequency Output................................................. 5-12
5-4 Transmit Baud Rate Output for a Given Prescaler Output .................................. 5-13
6-1 Serial Peripheral Rate Selection............................................................................ 6-5
7-1 Analog-to-Digital Channel Assignments ................................................................ 7-4
8-1 Real Time Interrupt Rate versus RTR1 and RTR0 ................................................ 8-9
9-1 COP Timeout Period versus CR1 and CR0........................................................... 9-5
9-2 IRQ Vector Interrupts............................................................................................. 9-8
9-3 Interrupt Vector Assignments ................................................................................ 9-8
9-4 SCI Serial System Interrupts ................................................................................. 9-9
9-5 Mode Bits Relationship ........................................................................................ 9-11
9-6 Highest Priority I Interrupt versus PSEL[3:0] ....................................................... 9-17
9-7 Pin State Summary for RESET, STOP, and WAIT.............................................. 9-18
10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times............. 10-6
10-2 Cycle-by-Cycle Operation — Inherent Mode ................................................... 10-13
10-3 Cycle-by-Cycle Operation — Immediate Mode ............................................... 10-16
10-4 Cycle-by-Cycle Operation — Direct Mode....................................................... 10-16
10-5 Cycle-by-Cycle Operation — Extended Mode ................................................. 10-18
10-6 Cycle-by-Cycle Operation — Indexed X Mode ................................................ 10-19
10-7 Cycle-by-Cycle Operation — Indexed Y Mode ................................................ 10-21
10-8 Cycle-by-Cycle Operation — Relative Mode ................................................... 10-22
A-1 Maximum Rating ................................................................................................... A-1
A-2 Thermal Characteristics ........................................................................................ A-1
A-3 DC Electrical Characteristics................................................................................. A-2
A-3 DC Electrical Characteristics (MC68L11A8) ........................................................ A-3
A-4 Control Timing ....................................................................................................... A-5
A-4 Control Timing (MC68L11A8) ............................................................................... A-6
A-5 Peripheral Port Timing......................................................................................... A-12
A-5 Peripheral Port Timing (MC68L11A8) ................................................................ A-13
A-6 Analog-To-Digital Converter Characteristics ....................................................... A-17
A-6 Analog-To-Digital Converter Characteristics (MC68L11A8) ............................... A-18
A-7 Expansion Bus Timing......................................................................................... A-19
A-7 Expansion Bus Timing (MC68L11A8) ................................................................ A-20
A-8 Serial Peripheral Interface (SPI) Timing.............................................................. A-22
A-8 Serial Peripheral Interface (SPI) Timing (MC68L11A8) ..................................... A-23
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A-9 EEPROM Characteristics .................................................................................... A-26
A-9 EEPROM Characteristics (MC68L11A8) ............................................................ A-26
B-1 Ordering Information ............................................................................................. B-4
MC68HC11A8
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1 INTRODUCTION
The HCMOS MC68HC11A8 is an advanced 8-bit microcontroller (MCU) with highly
sophisticated on-chip peripheral capabilities. A fully static design and high-density
complementary metal-oxide semiconductor (HCMOS) fabrication process allow E-series devices to operate at frequencies from 3 MHz to dc, with very low power consumption.
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1.1 Features
The following are some of the hardware and software highlights.
1.1.1 Hardware Features
• 8 Kbytes of ROM
• 512 Bytes of EEPROM
• 256 Bytes of RAM (All Saved During Standby) Relocatable to Any 4K Boundary
• Enhanced 16-Bit Timer System:
— Four Stage Programmable Prescaler
— Three Input Capture Functions
— Five Output Compare Functions
• 8-Bit Pulse Accumulator Circuit
• Enhanced NRZ Serial Communications Interface (SCI)
• Serial Peripheral Interface (SPI)
• Eight Channel, 8-Bit Analog-to-Digital Converter
• Real Time Interrupt Circuit
• Computer Operating Properly (COP) Watchdog System
• Available in Dual-In-Line or Leaded Chip Carrier Packages
1.1.2 Software Features
• Enhanced M6800/M6801 Instruction Set
• 16 x 16 Integer and Fractional Divide Features
• Bit Manipulation
• WAIT Mode
• STOP Mode
1.2 General Description
The high-density CMOS technology (HCMOS) used on the MC68HC11A8 combines
smaller size and higher speeds with the low power and high noise immunity of CMOS.
On-chip memory systems include 8 Kbytes of ROM, 512 bytes of electrically erasable
programmable ROM (EEPROM), and 256 bytes of static RAM.
A block diagram of the MC68HC11A8 is shown in Figure 1-1. Major peripheral functions are provided on-chip. An eight channel analog-to-digital (A/D) converter is included with eight bits of resolution. An asynchronous serial communications interface
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MOTOROLA
1-1
1
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(SCI) and a separate synchronous serial peripheral interface (SPI) are included. The main
16-bit free-running timer system has three input capture lines, five output compare lines, and
a real-time interrupt function. An 8-bit pulse accumulator subsystem can count external
events or measure external periods.
Self monitoring circuitry is included on-chip to protect against system errors. A computer operating properly (COP) watchdog system protects against software failures. A clock monitor
system generates a system reset in case the clock is lost or runs too slow. An illegal opcode
detection circuit provides a non-maskable interrupt if an illegal opcode is detected.
MODA/
LIR
MODB/
VSTBY
XTAL EXTAL
IRQ
E
XIRQ
RESET
8 KBYTES ROM
VDD
VSS
INTERRUPT LOGIC
512 BYTES EEPROM
CPU
VRH
VRL
256 BYTES RAM
SCI
TxD
RxD
PORT E
PE3/AN3
PE2/AN2
PE1/AN1
PE0/AN0
PD5/SS
PD4/SCK
PD3/MOSI
PD2/MISO
CONTROL
PORT D
STRB/R/W
STRA/AS
PC7/A7/D7
PC6/A6/D6
PC5/A5/D5
PC4/A4/D4
PC3/A3/D3
PC2/A2/D2
PC1/A1/D1
PC0/A0/D0
PORT B
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
CONTROL
PORT C
PORT A
A/D CONVERTER
*PE7/AN7
*PE6/AN6
*PE5/AN5
*PE4/AN4
STROBE AND HANDSHAKE
PARALLEL I/O
SPI
PD1/TxD
PD0/RxD
ADDRESS/DATA
TIMER
SYSTEM
SS
SCK
MOSI
MISO
BUS EXPANSION
ADDRESS
R/W
AS
PERIODIC INTERRUPT
COP
PULSE ACCUMULATOR
1
OSCILLATOR
CLOCK LOGIC
MODE
CONTROL
PA7/PAI/OC1
PA6/OC2/OC1
PA5/OC3/OC1
PA4/OC4/OC1
PA3/OC5/OC1
PA2/IC1
PA1/IC2
PA0/IC3
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Two software controlled operating modes, WAIT and STOP, are available to conserve additional power.
* NOT BONDED ON 48-PIN VERSION.
A8 BLOCK
Figure 1-1 Block Diagram
1.3 Programmer’s Model
In addition to being able to execute all M6800 and M6801 instructions, the MC68HC11A8 allows execution of 91 new opcodes. Figure 1-2 shows the seven CPU registers which are
available to the programmer.
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7
15
A
0
7
B
0
0
D
8-BIT ACCUMULATORS A & B
OR 16-BIT DOUBLE ACCUMULATOR D
IX
INDEX REGISTER X
IY
INDEX REGISTER Y
SP
STACK POINTER
PC
PROGRAM COUNTER
7
S
0
X
H
I
N
Z
V
C
CONDITION CODES
Freescale Semiconductor, Inc...
CARRY/BORROW FROM MSB
OVERFLOW
ZERO
NEGATIVE
I-INTERRUPT MASK
HALF CARRY (FROM BIT 3)
X-INTERRUPT MASK
STOP DISABLE
Figure 1-2 Programming Model
1.4 Summary of M68HC11 Family
Table 1-1 and the following paragraphs summarize the current members of the
M68HC11 family of MCUs. This technical data book describes the MC68HC11A8 version and can be used as a primary reference for several other versions of the
M68HC11 family. However, with the exception of the CPU, some newer members differ greatly from the MC68HC11A8 MCU and their respective technical literature
should be referenced.
Several of the device series within the M68HC11 family have ′x1 and ′x0 versions.
These are identical to the main member of the series but have some of their on-chip
resources disabled. For instance, an MC68HC11A1 is identical to the MC68HC11A8
except that its ROM is disabled. An MC68HC11A0 has disabled EPROM and EEPROM arrays. Refer to Table 1-1.
Nearly all series within the M68HC11 family have both a ROM version and an EPROM
version. Any device in the M68HC11 family that has a 7 preceding the 11 is a device
containing EPROM instead of ROM (e.g., MC68HC711E9). These devices operate
exactly as the custom ROM-based version (e.g., MC68HC11E9) but can be programmed by the user. EPROM-based devices in a windowed package can be erased
and reprogrammed indefinitely. EPROM-based devices in standard packages are
one-time-programmable (OTP). Refer to Table 1-1.
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Table 1-1 M68HC11 Family Devices
1
Device
MC68HC11A8
MC68HC11A7
MC68HC11A1
MC68HC11A0
MC68HC11D3
MC68HC711D3
MC68HC11D0
MC68HC11ED0
MC68HC11E9
MC68HC711E9
MC68HC11E8
MC68HC11E1
MC68HC11E0
MC68HC811E2
MC68HC11E20
MC68HC711E20
MC68HC11F1
RAM
256
256
256
256
192
192
192
512
512
512
512
512
512
256
768
768
1024
ROM
8K
8K
0
0
4K
0
0
0
12K
0
12K
0
0
0
20K
0
0
EPROM
0
0
0
0
0
4K
0
0
0
12K
0
0
0
0
0
20K
0
MC68HC11G7
512
24K
0
MC68HC11G5
MC68HC711G5
MC68HC11G0
MC68HC11K4
MC68HC711K4
MC68HC11K3
MC68HC11K1
MC68HC11K0
MC68HC11KA4
MC68HC711KA4
MC68HC11KA2
MC68HC711KA2
MC68HC11L6
512
512
512
768
768
768
768
768
768
768
1024
1024
512
16K
0
0
24K
0
24K
0
0
24K
0
32K
0
16K
0
16K
0
0
24K
0
0
0
0
24K
0
32K
0
MC68HC711L6
MC68HC11L5
MC68HC11L1
MC68HC11L0
MC68HC11M2
512
512
512
512
1280
0
16K
0
0
32K
16K
0
0
0
0
MC68HC711M2
MC68HC11N4
1280
768
0
24K
32K
0
MC68HC711N4
MC68HC11P2
768
1024
0
32K
24K
0
MC68HC711P2
1024
0
32K
EEPROM
COMMENTS
512
16-bit timer; 8 channel 8-bit A/D, SCI, SPI
0
512
0
0
16-bit timer; SCI, SPI
0
0
0
16-bit timer; SCI, SPI
512
16-bit timer; SCI, SPI, 8 channel 8-bit A/D
512
0
512
0
2048
16-bit timer; SCI, SPI, 8 channel 8-bit A/D, 2K EEPROM
512
16-bit timer; SCl, SPI, 8 channel 8-bit A/D,
512
20K ROM/EPROM
512
nonmultiplexed bus, 8 channel 8-bit A/D,
4 chip selects, SCI, SPI
0
nonmultiplexed bus, 8 channel 10-bit A/D, 4 channel
PWM,
0
SCI, SPI, 66 I/O pins
0
0
640
nonmultiplexed bus, memory expansion to 1MB,
640
8 channel 8-bit A/D, 4 channel PWM, 4 chip selects
0
640
0
640
nonmultiplexed bus, 8 channel 8-bit A/D, SCI, SPI,
640
4 channel PWM
640
640
512
multiplexed bus, 16-bit timer; 8 channel 8-bit A/D, SCI,
SPI
512
0
512
0
640
nonmultiplexed bus, 8 channel 8-bit A/D, 4 channel
PWM,
640
DMA, on-chip math coprocessor, SCI, 2 SPI
640
nonmultiplexed bus, 12 channel 8-bit A/D, 2 channel 8bit D/A,
640
6 channel PWM, on-chip math coprocessor, SCI, SPI
640
nonmultiplexed bus, PLL, 8 channel 8-bit A/D, 4 channel
PWM,
640
3 SCI (2 with Ml bus), SPI, 62 I/O pins
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2 SIGNAL DESCRIPTIONS AND OPERATING MODES
The signal descriptions and operating modes are presented in this section. When the
microcontroller is in an expanded multiplexed operating mode, 18 pins change function to support a multiplexed address/data bus.
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2.1 Signal Pin Descriptions
The following paragraphs provide a description of the input/output signals. Reference
is made, where applicable, to other sections that contain more detail about the function
being performed.
2.1.1 Input Power (VDD) and Ground (VSS)
Power is supplied to the microcontroller using these pins. VDD is the positive power input and VSS is ground. Although the MC68HC11A8 is a CMOS device, very fast signal
transitions are present on many of its pins. Short rise and fall times are present even
when the microcontroller is operating at slow clock rates. Special care must be taken
to provide good power supply bypassing at the MCU. Recommended bypassing would
include a 0.1 µF ceramic capacitor between the VDD and VSS pins and physically adjacent to one of the two pins. A bulk capacitance, whose size depends on the other circuitry in the system, should also be present on the circuit board.
2.1.2 Reset (RESET)
This active low bidirectional control signal is used as an input to initialize the
MC68HC11A8 to a known start-up state, and as an open-drain output to indicate that
an internal failure has been detected in either the clock monitor or computer operating
properly (COP) watchdog circuit. This reset signal is significantly different from the reset signal used on other Motorola MCUs. Please refer to 9 RESETS, INTERRUPTS,
AND LOW POWER MODES before designing circuitry to generate or monitor this signal.
2.1.3 Crystal Driver and External Clock Input (XTAL, EXTAL)
These two pins provide the interface for either a crystal or a CMOS compatible clock
to control the internal clock generator circuitry. The frequency applied to these pins
shall be four times higher than the desired E clock rate. The XTAL pin is normally left
unterminated when using an external CMOS compatible clock input to the EXTAL pin.
However, a 10K to 100K load resistor to ground may be used to reduce RFI noise
emission. The XTAL output is normally intended to drive only a crystal.
The XTAL output may be buffered with a high-input-impedance buffer such as the
74HC04, or it may be used to drive the EXTAL input of another M68HC11.
In all cases take extra care in the circuit board layout around the oscillator pins. Load
capacitances shown in the oscillator circuits include all stray layout capacitances. Refer to Figure 2-1, Figure 2-2, and Figure 2-3 for diagrams of oscillator circuits.
SIGNAL DESCRIPTIONS AND OPERATING MODES
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25 pF *
EXTAL
4xE
CRYSTAL
10 MΩ
MCU
25 pF *
XTAL
* THIS VALUE INCLUDES ALL STRAY CAPACITANCES.
COMMON XTAL CONN
Freescale Semiconductor, Inc...
Figure 2-1 Common Crystal Connections
2
4xE
CMOS-COMPATIBLE
EXTERNAL OSCILLATOR
EXTAL
MCU
XTAL
NC
EXT EXTAL CONN
Figure 2-2 External Oscillator Connections
25 pF *
220 Ω
EXTAL
EXTAL
10 MΩ
FIRST
MCU
SECOND
MCU
4xE
CRYSTAL
25 pF *
XTAL
NC
XTAL
* THIS VALUE INCLUDES ALL STRAY CAPACITANCES.
DUAL-MCU XTAL CONN
Figure 2-3 One Crystal Driving Two MCUs
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2.1.4 E Clock Output (E)
This is the output connection for the internally generated E clock which can be used
as a timing reference. The frequency of the E clock output is actually one fourth that
of the input frequency at the XTAL and EXTAL pins. When the E clock output is low
an internal process is taking place and, when high, data is being accessed. The E
clock signal is halted when the MCU is in STOP mode.
2.1.5 Interrupt Request (IRQ)
The IRQ input provides a means for requesting asynchronous interrupts to the
MC68HC11A8. It is program selectable (OPTION register) with a choice of either negative edge-sensitive or level-sensitive triggering, and is always configured to levelsensitive triggering by reset. The IRQ pin requires an external pull-up resistor to VDD
(typically 4.7K ohm).
2.1.6 Non-Maskable Interrupt (XIRQ)
This input provides a means for requesting a non-maskable interrupt, after reset initialization. During reset, the X bit in the condition code register is set and any interrupt
is masked until MCU software enables it. The XIRQ input is level sensitive and requires an external pull-up resistor to VDD.
2.1.7 Mode A/Load Instruction Register and Mode B/Standby Voltage (MODA/LIR,
MODB/VSTBY)
During reset, MODA and MODB are used to select one of the four operating modes.
Refer to Table 2-1. Paragraph 2.2 Operating Modes provides additional information.
Table 2-1 Operating Modes vs. MODA and MODB
MODB
MODA
Mode Selected
1
0
Single Chip
1
1
Expanded Multiplexed
0
0
Special Bootstrap
0
1
Special Test
After the operating mode has been selected, the LIR pin provides an open-drain output
to indicate that an instruction is starting. All instructions are made up of a series of E
clock cycles. The LIR signal goes low during the first E clock cycle of each instruction
(opcode fetch). This output is provided as an aid in program debugging.
The VSTBY signal is used as the input for RAM standby power. When the voltage on
this pin is more than one MOS threshold (about 0.7 volts) above the VDD voltage, the
internal 256-byte RAM and part of the reset logic are powered from this signal rather
than the VDD input. This allows RAM contents to be retained without VDD power applied
to the MCU. Reset must be driven low before VDD is removed and must remain low
until VDD has been restored to a valid level.
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2.1.8 A/D Converter Reference Voltages (VRL, VRH)
These two inputs provide the reference voltages for the analog-to-digital converter circuitry.
2.1.9 Strobe B and Read/Write (STRB/R/W)
This signal acts as a strobe B output or as a data bus direction indicator depending on
the operating mode.
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In single-chip operating mode, the STRB output acts as a programmable strobe for
handshake with other parallel l/O devices. Refer to 4 PARALLEL I/O for additional information.
2
In expanded multiplexed operating mode, R/W is used to control the direction of transfers on the external data bus. A low on the R/W signal indicates data is being written
to the external data bus. A high on this signal indicates that a read cycle is in progress.
R/W will stay low during consecutive data bus write cycles, such as in a double-byte
store. The NAND of inverted R/W with the E clock should be used as the write enable
signal for an external static RAM.
2.1.10 Strobe A and Address Strobe (STRA/AS)
This signal acts as an edge detecting strobe A input or as an address strobe bus control output depending on the operating mode.
In single-chip operating mode, the STRA input acts as a programmable strobe for
handshake with other parallel l/O devices. Refer to 4 PARALLEL I/O for additional information.
In expanded multiplexed operating mode, the AS output is used to demultiplex the address and data signals at port C. Refer to 2.2.2 Expanded Multiplexed Operating
Mode for additional information.
2.1.11 Port Signals
Ports A, D, and E signals are independent of the operating mode. Port B provides eight
general purpose output signals in single-chip operating modes and provides eight
high-order address signals when the microcontroller is in expanded multiplexed operating modes. Port C provides eight general purpose input/output signals when the microcontroller is in singlechip operating modes. When the microcontroller is in
expanded multiplexed operating modes, port C is used for a multiplexed address/data
bus. Table 2-2 shows a summary of the 40 port signals as they relate to the operating
modes. Unused inputs and l/O pins configured as inputs should be terminated high or
low.
SIGNAL DESCRIPTIONS AND OPERATING MODES
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2.1.11.1 Port A
Port A may be configured for: three input capture functions (IC1, IC2, IC3), four output
compare functions (OC2, OC3, OC4, OC5), and either a pulse accumulator input (PAI)
or a fifth output compare function (OC1). Refer to 8.1 Programmable Timer for additional information.
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Any port A pin that is not used for its alternate timer function may be used as a generalpurpose input or output line.
2.1.11.2 Port B
While in single-chip operating modes, all of the port B pins are general-purpose output
pins. During MCU reads of this port, the level sensed at the input side of the port B
output drivers is read. Port B may also be used in a simple strobed output mode where
an output pulse appears at the STRB signal each time data is written to port B.
When in expanded multiplexed operating modes, all of the port B pins act as high order
address output signals. During each MCU cycle, bits 8 through 15 of the address are
output on the PB0-PB7 lines respectively.
2.1.11.3 Port C
While in single-chip operating modes, all port C pins are general-purpose input/output
pins. Port C inputs can be latched by providing an input transition to the STRA signal.
Port C may also be used in full handshake modes of parallel l/O where the STRA input
and STRB output act as handshake control lines.
When in expanded multiplexed operating modes, all port C pins are configured as multiplexed address/data signals. During the address portion of each MCU cycle, bits 0
through 7 of the address are output on the PC0-PC7 lines. During the data portion of
each MCU cycle (E high), pins 0 through 7 are bidirectional data signals (D0-D7). The
direction of data at the port C pins is indicated by the R/W signal.
2.1.11.4 Port D
Port D pins 0-5 may be used for general-purpose l/O signals. Port D pins alternately
serve as the serial communications interface (SCI) and serial peripheral interface
(SPI) signals when those subsystems are enabled.
Pin PD0 is the receive data input (RxD) signal for the serial communication interface
(SCI).
Pin PD1 is the transmit data output (TxD) signal for the SCI.
Pins PD2 through PD5 are dedicated to the SPI. PD2 is the master-in-slave-out (MISO) signal. PD3 is the master-out-slave-in (MOSI) signal. PD4 is the serial clock
(SCK) signal and PD5 is the slave select (SS) input.
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2.1.11.5 Port E
Port E is used for general-purpose inputs and/or analog-to-digital (A/D) input channels. Reading port E during the sampling portion of an A/D conversion could cause
very small disturbances and affect the accuracy of that result. If very high accuracy is
required, avoid reading port E during conversions.
2.2 Operating Modes
There are four operating modes for the MC68HC11A8: single-chip operating mode,
expanded multiplexed operating mode, special bootstrap operating mode, and special
test operating mode.
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Table 2-1 shows how the operating mode is selected. The following paragraphs describe these operating modes.
2.2.1 Single-Chip Operating Mode
In single-chip operating mode, the MC68HC11A8 functions as a monolithic microcontroller without external address or data buses. Port B, port C, strobe A, and strobe B
function as general purpose l/O and handshake signals. Refer to 4 PARALLEL I/O for
additional information.
2
2.2.2 Expanded Multiplexed Operating Mode
In expanded multiplexed operating mode, the MC68HC11A8 has the capability of accessing a 64 Kbyte address space. This total address space includes the same onchip memory addresses used for single-chip operating mode plus external peripheral
and memory devices. The expansion bus is made up of port B and port C, and control
signals AS and R/W. Figure 2-4 shows a recommended way of demultiplexing low order addresses from data at port C. The address, R/W, and AS signals are active and
valid for all bus cycles including accesses to internal memory locations.
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Table 2-2 Port Signal Summary
Port-Bit
Single Chip and
Bootstrap Mode
Expanded Multiplexed
and Special Test Mode
A-0
A-1
A-2
A-3
A-4
A-5
A-6
A-7
PA0/IC3
PA1/IC2
PA2/IC1
PA3/OC5/OC1
PA4/OC4/OC1
PA5/OC3/OC1
PA6/OC2/OC1
PA7/PAI/OC1
PA0/IC3
PA1/IC2
PA2/IC1
PA3/OC5/OC1
PA4/OC4/OC1
PA5/OC3/OC1
PA6/OC2/OC1
PA7/PAI/OC1
B-0
B-1
B-2
B-3
B-4
B-5
B-6
B-7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
A8
A9
A10
A11
A12
A13
A14
A15
C-0
C-1
C-2
C-3
C-4
C-5
C-6
C-7
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
A0/D0
A1/D1
A2/D2
A3/D3
A4/D4
A5/D5
A6/D6
A7/D7
D-0
D-1
D-2
D-3
D-4
D-5
PD0/RXD
PD1/TXD
PD2/MISO
PD3/MOSI
PD4/SCK
PD5/SS
STRA
STRB
PD0/RXD
PD1/TXD
PD2/MISO
PD3/MOSI
PD4/SCK
PD5/SS
AS
R/W
E-0
E-1
E-2
E-3
E-4
E-5
E-6
E-7
PE0/AN0
PE1/AN1
PE2/AN2
PE3/AN3
PE4/AN4##
PE5/AN5##
PE6/AN6##
PE7/AN7##
PE0/AN0
PE1/AN1
PE2/AN2
PE3/AN3
PE4/AN4##
PE5/AN5##
PE6/AN6##
PE7/AN7##
2
## Not bonded in 48-pin versions
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A15
A14
A13
A12
A11
A10
A9
A8
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3/A11
PB2/A10
PB1/A9
PB0/A8
HC373
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PC7/A7/D7
PC6/A6/D6
PC5/A5/D5
PC4/A4/D4
PC3/A3/D3
PC2/A2/D2
PC1/A1/D1
PC0/A0/D0
AS
D1
D2
D3
D4
D5
D6
D7
D8
LE
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
OE
R/W
WE
E
2
A7
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
MC68HC11A8
ADDR/DATA DEMUX
Figure 2-4 Address/Data Demultiplexing
2.2.3 Special Bootstrap Operating Mode
The bootstrap mode is considered a special operating mode as distinguished from the
normal single-chip operating mode. This is a very versatile operating mode since there
are essentially no limitations on the special purpose program that can be loaded into
the internal RAM. The boot loader program is contained in the 192 byte bootstrap
ROM. This ROM is enabled only if the MCU is reset in special bootstrap operating
mode, and appears as internal memory space at locations $BF40-$BFFF. The boot
loader program will use the SCI to read a 256 byte program into on-chip RAM at locations $0000-$00FF. After the character for address $00FF is received, control is automatically passed to that program at location $0000.
The MC68HC11A8 communicates through the SCI port. After reset in special bootstrap operating mode, the SCI is running at E clock/16 (7812 baud for E clock equal 2
MHz). If the security feature was specified and the security bit is set, $FF is output by
the SCI transmitter. The EEPROM is then erased. If erasure is unsuccessful, $FF is
output again and erasure is attempted again. Upon successful erasure of the EEPROM, all internal RAM is written over with $FF. The CONFIG register is then erased.
The boot loader program now proceeds as though the part had not been in security
mode.
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If the part is not in security mode (or has completed the above erase sequence), a
break character is output by the SCI transmitter. For normal use of the boot loader program, the user sends $FF to the SCI receiver at either E clock/16 (7812 baud for E
clock = 2 MHz) or E clock/104 (1200 baud for E clock = 2 MHz).
NOTE
This $FF is not echoed through the SCI transmitter.
Now the user must download 256 bytes of program data to be put into RAM starting
at location $0000. These characters are echoed through the transmitter. When loading
is complete, the program jumps to location $0000 and begins executing that code.
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If the SCI transmitter pin is to be used, an external pull-up resistor is required because
port D pins are configured for wire-OR operation.
In special bootstrap operating mode the interrupt vectors are directed to RAM as
shown in Table 2-3. This allows the user to use interrupts by way of a jump table. For
example: to use the SWI interrupt, a jump instruction would be placed in RAM at locations $00F4, $00F5, and $00F6. When an SWI is encountered, the vector (which is in
the boot loader ROM program) will direct program control to location $00F4 in RAM
which in turn contains a JUMP instruction to the interrupt service routine.
Table 2-3 Bootstrap Mode Interrupt Vectors
Address
00C4
00C7
00CA
00CD
00D0
00D3
00D6
00D9
00DC
00DF
00E2
00E5
00E8
00EB
00EE
00F1
00F4
00F7
00FA
00FD
BF40
(Boot)
Vector
SCI
SPI
Pulse Accumulator Input Edge
Pulse Accumulator Overflow
Timer Overflow
Timer Output Compare 5
Timer Output Compare 4
Timer Output Compare 3
Timer Output Compare 2
Timer Output Compare 1
Timer Input Capture 3
Timer Input Capture 2
Timer Input Capture 1
Real Time Interrupt
IRQ
XIRQ
SWI
Illegal Opcode
COP Fail
Clock Monitor
Reset
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2.2.4 Additional Boot Loader Program Options
The user may transmit a $55 (only at E clock/16) as the first character rather than the
normal $FF. This will cause the program to jump directly to location $0000, skipping
the download.
The user may tie the receiver to the transmitter (with an external pull-up resistor). This
will cause the program to jump directly to the beginning of EEPROM ($B600). Another
way to cause the program to jump directly to EEPROM is to transmit either a break or
$00 as the first character rather than the normal $FF.
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Note that none of these options bypass the security check and so do not compromise
those customers using security.
2
Keep in mind that upon entry to the downloaded program at location $0000, some registers have been changed from their reset states. The SCI transmitter and receiver are
enabled which cause port D pins 0 and 1 to be dedicated to SCI use. Also port D is
configured for wired-OR operation. It may be necessary for the user to write to the
SCCR2 and SPCR registers to disable the SCI and/or port D wire-OR operation.
2.2.5 Special Test Operating Mode
The test mode is a special operating mode intended primarily for factory testing. This
mode is very similar to the expanded multiplexed operating mode. In special test operating mode, the reset and interrupt vectors are fetched from external memory locations $BFC0–$BFFF rather than $FFC0–$FFFF. There are no time limits for protection
of the TMSK2, OPTION, and INIT registers, so these registers may be written repeatedly. Also a special TEST1 register is enabled which allows several factory test functions to be invoked.
The special test operating mode is not recommended for use by an end user because
of the reduced system security; however, an end user may wish to come out of reset
in special test operating mode. Then, after some initialization, the SMOD and MDA bits
could be rewritten to select a normal operating mode to re-enable the protection features.
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3 ON-CHIP MEMORY
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This section describes the on-chip ROM, RAM, and EEPROM memories. The memory
maps for each mode of operation are shown and the RAM and l/O mapping register
(INIT) is described. The INIT register allows the on-chip RAM and the 64 control registers to be moved to suit the needs of a particular application.
3.1 Memory Maps
Composite memory maps for each mode of operation are shown in Figure 3-1. Memory locations are shown in the shaded areas and the contents of these shaded areas
are shown to the right. These modes include single-chip, expanded multiplexed, special bootstrap, and special test.
Single-chip operating modes do not generate external addresses. Refer to Table 3-1
for a full list of the registers.
$0000
0000
EXT
EXT
256 BYTES RAM
00FF
$1000
1000
64-BYTE REGISTER BLOCK
103F
EXT
EXT
B600
$B600
512 BYTES EEPROM
B7FF
EXT
EXT
BF40
BOOT
ROM
BFFF
$E000
E000
BFC0
BFFF
8 KBYTES ROM
FFC0
FFFF
$FFFF
SINGLE
CHIP
EXPANDED
BOOTSTRAP
SPECIAL MODES
INTERRUPT
VECTORS
FFFF
NORMAL
MODES
INTERRUPT
VECTORS
SPECIAL
TEST
A8 MEM MAP
Figure 3-1 Memory Maps
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Table 3-1 Register and Control Bit Assignments (Sheet 1 of 2)
$1000
Bit 7
Bit 7
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
—
Bit 2
—
Bit 1
—
Bit 0
Bit 0
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$1001
3
PORTA
I/O Port A
Reserved
$1002
STAF
STAI
CWOM
HNDS
OIN
PLS
EGA
INVB
PIOC
Parallel I/O Control Register
$1003
Bit 7
—
—
—
—
—
—
Bit 0
PORTC
I/O Port C
$1004
Bit 7
—
—
—
—
—
—
Bit 0
PORTB
Output Port B
$1005
Bit 7
—
—
—
—
—
—
Bit 0
PORTCL Alternate Latched Port C
$1006
$1007
Reserved
Bit 7
—
—
—
—
—
—
Bit 0
DDRC
Data Direction for Port C
$1008
Bit 5
—
—
—
—
Bit 0
PORTD
I/O Port D
$1009
Bit 5
—
—
—
—
Bit 0
DDRD
Data Direction for Port D
—
—
Bit 0
PORTE
Input Port E
$100A
Bit 7
—
—
—
—
$100B
FOC1
FOC2
FOC3
FOC4
FOC5
CFORC
Compare Force Register
$100C
OC1M7
OC1M6
OC1M5
OC1M4
OC1M3
OC1M
OC1 Action Mask Register
$100D
OC1D7
OC1D6
OC1D5
OC1D4
OC1D3
OC1D
OC1 Action Data Register
$100E
$100F
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TCNT
Timer Counter Register
$1010
$1011
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TIC1
Input Capture 1 Register
$1012
$1013
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TIC2
Input Capture 2 Register
$1014
$1015
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TIC3
Input Capture 3 Register
$1016
$1017
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TOC1
Output Compare 1 Register
$1018
$1019
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TOC2
Output Compare 2 Register
$101A
$101B
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TOC3
Output Compare 3 Register
$101C
$101D
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TOC4
Output Compare 4 Register
$101E
$101F
Bit 15
Bit 7
—
—
—
—
—
—
—
—
—
—
—
—
Bit 8
Bit 0
TCO5
Output Compare 5 Register
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Table 3-1 Register and Control Bit Assignments (Sheet 2 of 2)
$1020
Bit 7
OM2
Bit 6
OL2
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$1021
Bit 5
OM3
Bit 4
OL3
Bit 3
OM4
Bit 2
OL4
Bit 1
OM5
Bit 0
OL5
TCTL1
Timer Control Register 1
EDG1B
EDG1A
EDG2B
EDG2A
EDG3B
EDG3A
TCTL2
Timer Control Register 2
$1022
OC1I
OC2I
OC3I
OC4I
OC5I
IC1I
IC2I
IC3I
TMSK1
Timer Interrupt Mask Register 1
$1023
OC1F
OC2F
OC3F
OC4F
OC5F
IC1F
IC2F
IC3F
TFLG1
Timer Interrupt Flag Register 1
$1024
TOI
RTII
PAOVI
PAII
PR1
PR0
TMSK2
Timer Interrupt Mask Register 2
$1025
TOF
RTIF
PAOVF
PAIF
TFLG2
Timer Interrupt Flag Register 2
$1026
DDRA7
PAEN
PAMOD
PEDGE
$1027
Bit 7
—
—
—
—
$1028
SPIE
SPE
DWOM
MSTR
CPOL
$1029
SPIF
WCOL
$102A
Bit 7
—
$102B
TCLR
$102C
R8
T8
$102D
TIE
TCIE
$102E
TRDE
$102F
Bit 7
$1030
CCF
$1031
Bit 7
$1032
RTR1
RTR0
PACTL
Pulse Accumulator Control Register
—
—
Bit 0
PACNT
Pulse Accumulator Count Register
CPHA
SPR1
SPR0
SPCR
SPI Control Register
SPSR
SPI Status Register
MODF
—
—
—
—
—
Bit 0
SPDR
SPI Data Register
SCP1
SCP0
RCKB
SCR2
SCR1
SCR0
BAUD
SCI Baud Rate Control
M
WAKE
SCCR1
SCI Control Register 1
RIE
ILIE
TE
RE
RWU
SCCR2
SCI Control Register 2
TC
RDRF
IDLE
OR
NF
FE
SCSR
SCI Status Register
—
—
—
—
—
—
Bit 0
SCDR
SCI Data (Read RDR, Write TDR)
SCAN
MULT
CD
CC
CB
CA
ADCTL
A/D Control Register
—
—
—
—
—
—
Bit 0
ADR1
A/D Result Register 1
Bit 7
—
—
—
—
—
—
Bit 0
ADR2
A/D Result Register 2
$1033
Bit 7
—
—
—
—
—
—
Bit 0
ADR3
A/D Result Register 3
$1034
Bit 7
—
—
—
—
—
—
Bit 0
ADR4
A/D Result Register 4
SBK
$1035
thru
$1038
Reserved
$1039
ADPU
CSEL
IRQE
DLY
CME
$103A
Bit 7
—
—
—
—
$103B
ODD
EVEN
BYTE
$103C
RBOOT
SMOD
MDA
$103D
RAM3
RAM2
$103E
TILOP
$103F
—
—
CR1
CR0
OPTION
—
—
Bit 0
COPRST Arm/Reset COP Timer Circuitry
ROW
ERASE
EELAT
EEPGM
PPROG
EEPROM Program Control Register
IRV
PSEL3
PSEL2
PSEL1
PSEL0
HPRIO
Highest Priority I-Bit Int and Misc
RAM1
RAM0
REG3
REG2
REG1
REG0
INIT
RAM and I/O Mapping Register
OCCR
CBYP
DISR
FCM
FCOP
TCON
TEST1
Factory TEST Control Register
—
—
NOSEC
NOCOP
ROMON
EEON
CONFIG
COP, ROM, and EEPROM Enables
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In expanded multiplexed operating modes, memory locations are basically the same
as the single- chip operating modes; however, the locations between the shaded areas (designated EXT) are for externally addressed memory and l/O. If an external
memory or l/O device is located to overlap an enabled internal resource, the internal
resource will take priority. For reads of such an address the data (if any) driving the
port C data inputs is ignored and will not result in any harmful conflict with the internal
read. For writes to such an address data is driven out of the port C data pins as well
as to the internal location. No external devices should drive port C during write accesses to internal locations; however, there is normally no conflict since the external address decode and/ or data direction control should incorporate the R/W signal in their
development. The R/W, AS, address, and write data signals are valid for all accesses
including accesses to internal memory and registers.
The special bootstrap operating mode memory locations are similar to the single-chip
operating mode memory locations except that a bootstrap program at memory locations $BF40 through $BFFF is enabled. The reset and interrupt vectors are addressed
at $BFC0–$BFFF while in the special bootstrap operating mode. These vector addresses are within the 192 byte memory used for the bootstrap program.
3
The special test operating mode memory map is the same as the expanded multiplexed operating mode memory map except that the reset and interrupt vectors are
located at external memory locations $BFC0–$BFFF.
3.2 RAM and I/O Mapping Register (INIT)
There are 64 internal registers which are used to control the operation of the MCU.
These registers can be relocated on 4K boundaries within the memory space, using
the INIT register. Refer to Table 3-1 for a complete list of the registers. The registers
and control bits are explained throughout this document.
The INIT register is a special-purpose 8-bit register which may be used during initialization to change the default locations of RAM and control registers within the MCU
memory map. It may be written to only once within the initial 64 E clock cycles after a
reset and thereafter becomes a read-only register.
$103D
RESET
7
RAM3
0
6
RAM2
0
5
RAM1
0
4
RAM0
0
3
REG3
0
2
REG2
0
1
REG1
0
0
REG0
1
INIT
The default starting address for internal RAM is $0000 and the default starting address
for the 64 control registers is $1000 (the INIT register is set to $01 at reset). The upper
four bits of the INIT register specify the starting address for the 256 byte RAM and the
lower four bits of INIT specify the starting address for the 64 control registers. These
four bits are matched to the upper four bits of the 16-bit address.
Throughout this document, the control register addresses will be displayed with the
high-order digit shown as a bold “1” to indicate that the register block may be relocated
to some 4K memory page other than its default position of $1000-$103F.
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Note that if the RAM is relocated to either $E000 or $F000, which is in conflict with the
internal ROM, (no conflict if the ROMON bit in the configuration register is zero), RAM
will take priority and the conflicting ROM will become inaccessible. Also, if the 64 control registers are relocated so that they conflict with the RAM and/or ROM, then the 64
control registers take priority and the RAM and/or ROM at those locations become inaccessible. No harmful conflicts result, the lower priority resources simply become inaccessible. Similarly, if an internal resource conflicts with an external device no
harmful conflict results. Data from the external device will not be applied to the internal
data bus and cannot interfere with the internal read.
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Note that there are unused register locations in the 64 byte control register block.
Reads of these unused registers will return data from the undriven internal data bus
and not from another resource that happens to be located at the same address.
3.3 ROM
The internal 8K ROM occupies the highest 8K of the memory map ($E000–$FFFF).
This ROM is disabled when the ROMON bit in the CONFIG register is clear. The
ROMON bit is implemented with an EEPROM cell and is programmed using the same
procedures for programming the on-chip EEPROM. For further information refer to
3.5.3 System Configuration Register (CONFIG).
In the single-chip operating mode, internal ROM is enabled regardless of the state of
the ROMON bit.
There is also a 192 byte mask programmed boot ROM in the MC68HC11A8. This
bootstrap program ROM controls the operation of the special bootstrap operating
mode and is only enabled following reset in the special bootstrap operating mode. For
more information refer to 2.2.3 Special Bootstrap Operating Mode.
3.4 RAM
The 256 byte internal RAM may be relocated during initialization by writing to the INIT
register. The reset default position is $0000 through $00FF. This RAM is implemented
with static cells and retains its contents during the WAIT and STOP modes.
The contents of the 256-byte RAM can also be retained by supplying a low current
backup power source to the MODB/VSTBY pin. When using a standby power source,
VDD may be removed; however, RESET must go low before VDD is removed and remain low until VDD has been restored.
3.5 EEPROM
The 512 bytes of EEPROM are located at $B600 through $B7FF and have the same
read cycle time as the internal ROM. The write (or programming) mechanism for the
EEPROM is controlled by the PPROG register. The EEPROM is disabled when the
EEON bit in the CONFIG register is zero. The EEON bit is implemented with an EEPROM cell.
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The erased state of an EEPROM byte is $FF. Programming changes ones to zeros. If
any bit in a location needs to be changed from a zero to a one, the byte must be erased
in a separate operation before it is reprogrammed. If a new data byte has no ones in
bit positions which were already programmed to zero, it is acceptable to program the
new data without erasing the EEPROM byte first. For example, programming $50 to a
location which was already $55 would change the location to $50.
3
Programming and erasure of the EEPROM relies on an internal high-voltage charge
pump. At E clock frequencies below 2 MHz the efficiency of this charge pump decreases which increases the time required to program or erase a location. The recommended program and erase time is 10 milliseconds when the E clock is 2 MHz and should
be increased to as much as 20 milliseconds when E is between 1 MHz and 2 MHz.
When the E clock is below 1 MHz, the clock source for the charge pump should be
switched from the system clock to an on-chip R-C oscillator clock. This is done by setting the CSEL bit in the OPTION register. A 10 millisecond period should be allowed
after setting the CSEL bit to allow the charge pump to stabilize. Note that the CSEL bit
also controls a clock to the analog-to-digital converter subsystem.
3.5.1 EEPROM Programming Control Register (PPROG)
This 8-bit register is used to control programming and erasure of the 512-byte EEPROM. Reset clears this register so the EEPROM is configured for normal reads.
7
6
5
4
3
2
1
0
$103B
ODD
EVEN
0
BYTE
ROW
ERASE
EELAT
EEPGM
RESET
0
0
0
0
0
0
0
0
PPROG
ODD — Program Odd Rows (TEST)
EVEN — Program Even Rows (TEST)
Bit 5 — Not implemented.
This bit always reads zero.
BYTE — Byte Erase Select
This bit overrides the ROW bit.
0 = Row or Bulk Erase
1 = Erase Only One Byte
ROW — Row Erase Select
If the BYTE bit is 1, ROW has no meaning.
0 = Bulk Erase
1 = Row Erase
ERASE — Erase Mode Select
0 = Normal Read or Program
1 = Erase Mode
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EELAT — EEPROM Latch Control
0 = EEPROM Address and Data Configured for Read Mode
1 = EEPROM Address and Data Configured for Programming/Erasing
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EEPGM — EEPROM Programming Voltage Enable
0 = Programming Voltage Switched Off
1 = Programming Voltage Turned On
If an attempt is made to set both the EELAT and EEPGM bits in the same write cycle,
neither will be set. If a write to an EEPROM address is performed while the EEPGM
bit is set, the write is ignored and the programming operation currently in progress is
not disturbed. These two safeguards were included to prevent accidental EEPROM
changes in cases of program runaway. Mask sets A38P, A49N, and date codes before
86xx did not have these safeguards.
3.5.2 Programming/Erasing Internal EEPROM
The EEPROM programming and erasure process is controlled by the PPROG register. The following paragraphs describe the various operations performed on the EEPROM and include example program segments to demonstrate programming and
erase operations.
These program segments are intended to be simple straightforward examples of the
sequences needed for basic program and erase operations. There are no special restrictions on the address modes used and bit manipulation instructions may be used.
Other MCU operations can continue to be performed during EEPROM programming
and erasure provided these operations do not include reads of data from EEPROM
(the EEPROM is disconnected from the read data bus during EEPROM program and
erase operations). The subroutine DLY10 used in these program segments is not
shown but can be any set of instructions which takes ten milliseconds.
3.5.2.1 Read
For the read operation the EELAT bit in the PPROG register must be clear. When this
bit is cleared, the remaining bits in the PPROG register have no meaning or effect, and
the EEPROM may be read as if it were a normal ROM.
3.5.2.2 Programming
During EEPROM programming, the ROW and BYTE bits are not used. If the E clock
frequency is 1 MHz or less, the CSEL bit in the OPTION register must be set. Recall
that in this EEPROM, zeros must be erased by a separate erase operation before programming. The following program segment demonstrates how to program an EEPROM byte.
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* On entry, A
•
•
•
PROG
LDAB
STAB
STAA
LDAB
STAB
JSR
CLR
3
= data to be programmed and X = EEPROM address
#$02
$103B
0,X
#$03
$103B
DLY10
$103B
Set EELAT Bit (EEPGM = 0)
Store Data to EEPROM Address
Set EEPGM Bit (EELAT = 1)
Delay 10 ms
Turn Off High Voltage and Set to READ
Mode
•
•
•
3.5.2.3 Bulk Erase
The following program segment demonstrates how to bulk erase the 512-byte EEPROM. The CONFIG register is not affected in this example.
•
•
•
BULKE LDAB
STAB
STAB
LDAB
STAB
JSR
CLR
#$06
$103B
$B600
#$07
$103B
DLY10
$103B
Set to Bulk Erase Mode
Write any Data to any EEPROM Address
Turn On Programming Voltage
Delay 10 ms
Turn Off High Voltage and Set to READ
Mode
•
•
•
3.5.2.4 Row Erase
The following program segment demonstrates the row erase function. A ‘row’ is sixteen bytes ($B600-$B60F, $B610-$B61F... $B7F0-$B7FF). This type of erase operation saves time compared to byte erase when large sections of EEPROM are to be
erased.
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*On entry X = any address in the row to be erased
•
•
•
ROWE
LDAB #$0E
STAB $103B Set to Row Erase Mode
STAB 0,X
Write any Data to any Address in Row
LDAB #$0F
STAB $103B Turn on High Voltage
JSR
DLY10 Delay 10 ms
CLR
$103B Turn Off High Voltage and Set to Read
Mode
•
•
•
3.5.2.5 Byte Erase
The following program segment shows the byte erase function.
*On entry, X
•
•
•
BYTEE LDAB
STAB
STAB
LDAB
STAB
JSR
CLR
= address of byte to be erased
#$16
$103B
0,X
#$17
$103B
DLY10
$103B
Set to Byte Erase Mode
Write any Data to the Address to Erase
Turn on High Voltage
Delay 10 ms
Turn off High Voltage and Set to Read
Mode
•
•
•
3.5.3 System Configuration Register (CONFIG)
The MC68HC11A8 can be configured to specific system requirements through the use
of hardwired options such as the mode select pins, semi-permanent EEPROM control
bit specifications (CONFIG register), or by use of control registers. The configuration
control register (CONFIG) is implemented in EEPROM cells and controls the presence
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of ROM and EEPROM in the memory map, as well as enabling the COP watchdog
system. A security feature to protect data in the EEPROM and RAM is also available
on mask programmed MC68HC11A8s.
$103F
RESET
7
6
5
4
3
2
1
0
0
0
0
0
NOSEC
NOCOP
ROMON
EEON
CONFIG
(see 3.5.3.2 Operation of the Configuration Mechanism)
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Bits 7, 6, 5, and 4 — Not Implemented
These bits are always read as zero.
3
NOSEC — Security Mode Disable Bit
This bit is only implemented if it is specifically requested at the time mask ROM information is submitted. When this bit is not implemented it always reads one.
When RAM and EEPROM security are required, the NOSEC bit can be programmed
to zero to enable the software anti-theft mechanism. When clear, the NOSEC bit prevents the selection of expanded multiplexed operating modes. If the MCU is reset in
the special bootstrap operating mode while NOSEC is zero, EEPROM, RAM, and
CONFIG are erased before the loading process continues.
0 = Enable Security Mode
1 = Disable Security Mode
NOCOP — COP System Disable
0 = COP Watchdog System Enabled
1 = COP Watchdog System Disabled
ROMON — Enable On-Chip ROM
When this bit is clear, the 8K ROM is disabled, and that memory space becomes externally accessed space. In the single-chip operating mode, the internal 8K ROM is enabled regardless of the state of the ROMON bit.
EEON — Enable On-Chip EEPROM
When this bit is clear, the 512-byte EEPROM is disabled, and that memory space becomes externally accessed space.
3.5.3.1 Programming and Erasure of the CONFIG Register
Since the CONFIG register is implemented with EEPROM cells, special provisions
must be made to erase and program this register. The normal EEPROM control bits in
the PPROG register are used for this purpose. Programming follows the same procedure as programming a byte in the 512-byte EEPROM except the CONFIG register
address is used. Erase also follows the same procedure as that used for the EEPROM
except that only bulk erase can be used on the CONFIG register. When the CONFIG
register is erased, the 512-byte EEPROM array is also erased. Be sure to check the
Technical Summary for the particular MC68HC11 Family member you are using.
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On mask set B96D and newer, the CONFIG register may only be programmed or
erased while the MCU is operating in the test mode or the bootstrap mode. This interlock was added to help prevent accidental changes to the CONFIG register.
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The following program segment demonstrates how to program the CONFIG register.
This program assumes that the CONFIG register was previously erased.
*On entry, A
•
•
•
PROGC LDAB
STAB
STAA
LDAB
STAB
JSR
CLR
= data to be programmed onto CONFIG
#$02
$103B
$103F
#$03
$103B
DLY10
$103B
Set EELAT Bit (EEPGM = 0)
Store Data to CONFIG Address
Turn on Programming Voltage
Delay 10 ms
Turn Off High Voltage and Set to READ
Mode
•
•
•
The following program segment demonstrates the erase procedure for the CONFIG
register.
•
•
•
BULKC LDAB
STAB
STAB
LDAB
STAB
JSR
CLR
#$06
$103B
$103F
#$07
$103B
DLY10
$103B
Set Bulk Erase Mode
Write any Data to CONFIG
Turn on Programming Voltage
Delay 10 ms
Turn Off High Voltage and Set to READ
Mode
•
•
•
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3.5.3.2 Operation of the Configuration Mechanism
The CONFIG register consists of an EEPROM byte and static working latches. This
register controls the start-up configuration of the MCU. The contents of the EEPROM
CONFIG byte are transferred into static working latches during any reset sequence.
The operation of the MCU is controlled directly by these latches and not the actual EEPROM byte. Changes to the EEPROM byte do not affect operation of the MCU until
after the next reset sequence. When programming the CONFIG register, the EEPROM byte is being accessed. When the CONFIG register is being read, the static
latches are being accessed.
To change the value in the CONFIG register proceed as follows:
Freescale Semiconductor, Inc...
1. Erase the CONFIG register.
CAUTION
Do not issue a reset at this time.
3
2. Program the new value to the CONFIG register.
3. Issue a reset so the new configuration will take effect.
ON-CHIP MEMORY
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4 PARALLEL I/O
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The MC68HC11A8 has 40 I/O pins arranged as five 8-bit ports. All of these pins serve
multiple functions depending on the operating mode and data in the control registers.
This section explains the operation of these pins only when they are used for parallel
l/O.
Ports C and D are used as general purpose input and/or output pins under direct control of their respective data direction registers. Ports A, B, and E, with the exception of
port A pin 7, are fixed direction inputs or outputs and therefore do not have data direction registers. Port B, port C, the STRA pin, and the STRB pin are used for strobed
and/or handshake modes of parallel l/O, as well as general purpose l/O.
4.1 General-Purpose I/O (Ports C and D)
Each port l/O line has an associated bit in a specific port data register and port data
direction register. The data direction register bits are used to specify the primary direction of data for each l/O line. When an output line is read, the value at the input to the
pin driver is returned. When a line is configured as an input, that pin becomes a highimpedance input. If a write is executed to an input line, the value does not affect the l/
O pin, but is stored in an internal latch. When the line becomes an output, this value
appears at the l/O pin. Data direction register bits are cleared by reset to configure l/
O pins as inputs.
The AS and R/W pins are dedicated to bus control while in the expanded multiplexed
operating modes, or parallel l/O strobes (STRA and STRB) while in the single chip operating modes.
4.2 Fixed Direction I/O (Ports A, B, and E)
The lines for ports A, B, and E (except for port A bit 7) have fixed data directions. When
port A is being used for general purpose l/O, bits 0, 1, and 2 are configured as input
only and writes to these lines have no effect. Bits 3, 4, 5, and 6 of port A are configured
as output only and reads of these lines return the levels sensed at the input to the line
drivers. Port A bit 7 can be configured as either a general-purpose input or output using the DDRA7 bit in the pulse accumulator control register. When port B is being used
for general purpose output, it is configured as output only and reads of these lines will
return the levels sensed at the input of the pin drivers. Port E contains the eight A/D
channel inputs, but these lines may also be used as general purpose digital inputs.
Writes to the port E address have no effect.
PARALLEL I/O
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4.3 Simple Strobed I/O
The simple strobed mode of parallel l/O is invoked and controlled by the parallel l/O
control register (PIOC). This mode is selected when the handshake bit (HNDS) in the
PIOC register is clear. Port C becomes a strobed input port with the STRA line as the
edge-detecting latch command input. Also, port B becomes a strobed output port with
the STRB line as the output strobe. The logic sense of the STRB output is selected by
the invert strobe B bit (INVB) in the PIOC register.
4.3.1 Strobed Input Port C
In this mode, there are two addresses where port C may be read, the PORTC data
register and the alternate latched port C register (PORTCL). The data direction register still controls the data direction of all port C lines. Even when the strobed input mode
is selected, any or all of the port C lines may still be used for general purpose l/O.
The STRA line is used as an edge-detecting input, and the edge-select for strobe A
(EGA) bit in the PIOC register defines either falling or rising edge as the significant
edge. Whenever the selected edge is detected at the STRA pin, the current logic levels
at port C lines are latched into the PORTCL register and the strobe A flag (STAF) in
the PIOC register is set. If the strobe A interrupt enable (STAI) bit in PIOC is also set,
an internal interrupt sequence is requested. The strobe A flag (STAF) is automatically
cleared by reading the PIOC register (with STAF set) followed by a read of the
PORTCL register. Data is latched in the PORTCL register whether or not the STAF
flag was previously clear.
4
4.3.2 Strobed Output Port B
In this mode, the STRB pin is a strobe output which is pulsed for two E clock periods
each time there is a write to port B. The INVB bit in the PIOC register controls the polarity of the pulse on the STRB line.
4.4 Full Handshake I/O
The full handshake modes of parallel l/O involve port C and the STRA and STRB lines.
There are two basic modes (input and output) and an additional variation on the output
handshake mode that allows three-stated operation of port C. In all handshake modes,
STRA is an edge-detecting input, and STRB is a handshake output line.
When full input handshake protocol is specified, both general purpose input and/or
general purpose output can coexist at port C. When full output handshake protocol is
specified, general purpose output can coexist with the handshake outputs at port C,
but the three-state feature of the output handshake mode interferes with general purpose input in two ways. First, in full output handshake, the port C lines are outputs
whenever STRA is at its active level regardless of the data direction register bits. This
potentially conflicts with any external device trying to drive port C unless that external
device has an open-drain type output driver. Second, the value returned on reads of
port C is the state of the outputs of an internal port C output latch regardless of the
states of the data direction register bits, so that the data written for output handshake
can be read even if the pins are in a three-state condition.
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4.4.1 Input Handshake Protocol
In the input handshake protocol, port C is a latching input port, STRA is an edge-sensitive latch command from the external system that is driving port C, and STRB is a
“ready” output line controlled by logic in the MCU.
Freescale Semiconductor, Inc...
When a “ready” condition is recognized, the external device places data on the port C
lines, then pulses the STRA line. The active edge on the STRA line latches the port C
data into the PORTCL register, sets the STAF flag (optionally causing an interrupt),
and deasserts the STRB line. Deassertion of the STRB line automatically inhibits the
external device from strobing new data into port C. Reading the PORTCL latch register
(independent of clearing the STAF flag) asserts the STRB line, indicating that new
data may now be applied to port C.
The STRB line can be configured (with the PLS control bit) to be a pulse output (pulse
mode) or a static output (interlocked mode).
The port C data direction register bits should be cleared for each line that is to be used
as a latched input line. However, some port C lines can be used as latched inputs with
the input handshake protocol while, at the same time, using some port C lines as static
inputs, and some port C lines as static outputs. The input handshake protocol has no
effect on the use of port C lines as static inputs or as static outputs. Reads of the
PORTC data register always return the static logic level at the port C lines (for lines
configured as inputs). Writes to either the PORTC data register or the alternate latched
port C register (PORTCL) send information to the same port C output register without
affecting the input handshake strobes.
4.4.2 Output Handshake Protocol
In the output handshake protocol, port C is an output port, STRB is a “ready” output,
and STRA is an edge-sensitive acknowledge input signal, used to indicate to the MCU
that the output data has been accepted by the external device. In a variation of this
output handshake protocol, STRA is also used as an output-enable input, as well as
an edge-sensitive acknowledge input.
The MCU places data on the port C output lines and then indicates stable data is available by asserting the STRB line. The external device then processes the available
data and pulses the STRA line to indicate that new data may be placed on the port C
output lines. The active edge on the STRA line causes the STRB line to be deasserted
and the STAF status flag to be set. In response to the STAF bit being set, the program
transfers new data out of port C as required. Writing data to the PORTCL register
causes the data to appear on port C lines and asserts the STRB line.
There is a variation to the output handshake protocol that allows three-state operation
on port C. It is possible to directly connect this 8-bit parallel port to other three-state
devices with no additional parts.
While the STRA input line is inactive, all port C lines obey the data direction specified
by the data direction register so that lines which are configured as inputs are high impedance. When the STRA line is activated, all port C lines are forced to outputs regardless of the data in the data direction register. Note that in output handshake
PARALLEL I/O
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protocol, reads of port C always return the value sensed at the input to the output buffer regardless of the state of the data direction register bits because the lines would not
necessarily have meaningful data on them in the three-state variation of this protocol.
This operation makes it impractical to use some port C lines as static inputs, while using others as handshake outputs, but does not interfere with the use of some port C
lines as static outputs. Port C lines intended as static outputs or normal handshake
outputs should have their corresponding data direction register bits set, and lines intended as three-state handshake outputs should have their corresponding data direction register bits clear.
4.5 Parallel I/O Control Register (PIOC)
The parallel handshake l/O functions are available only in the single-chip operating
mode. The PIOC is a read/write register except for bit 7 which is read only. Table 4-1
shows a summary of handshake l/O operations.
.
Table 4-1 Handshake l/O Operations Summary
4
STAI
CWOM
INVB
0
STAF Interrupts
Inhibited
Port C Outputs
Normal
STRB Active
Low
1
STAF Interrupts
Enabled
Port C Outputs
Open-Drain
STRB Active
High
STAF
Clearing
HNDS OIN
PLS
EGA
Port C
Port B
Sequence1
Simple
Strobe
Mode
Read PIOC with
STAF = 1 then
Read PORTCL
0
X
X
0
1
Full
Read PIOC with
Input
STAF = 1 then
Handshake Read PORTCL
Full
Read PIOC with
Output
STAF = 1 then
Handshake Write to
PORTCL
1
0
1
1
0 = STRB
Active
Level
1 = STRB
Active
Pulse
0 = STRB
Active
Level
1 = STRB
Active
Pulse
0
1
0
Port C
Driven
1
Follow
DDRC
STRA
Active Edge
Follow
DDRC
Inputs latched
into PORTCL
on any active
edge on
STRA.
STRB pulses
on writes to
port B.
Inputs latched
into PORTCL
on any active
edge on
STRA.
Normal output port. Unaffected in
handshake
modes
Driven as outputs if STRA at
active level.
Follows DDRC
if STRA not at
active level.
Normal output port. Unaffected in
handshake
modes
NOTE:
1. Set by active edge on STRA
$1002
RESET
7
STAF
0
6
STAI
0
5
CWOM
0
4
HNDS
0
3
OIN
0
2
PLS
U
1
EGA
1
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0
INVB
1
PIOC
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STAF — Strobe A Interrupt Status Flag
This bit is set when a selected edge occurs on strobe A. Clearing it depends on the
state of HNDS and OIN bits. In simple strobed mode or in full input handshake mode,
STAF is cleared by reading the PIOC register with STAF set followed by reading the
PORTCL register. In output handshake, STAF is cleared by reading the PIOC register
with STAF set followed by writing to the PORTCL register.
Freescale Semiconductor, Inc...
STAI — Strobe A Interrupt Enable Mask
When the I bit in the condition code register is clear and STAI is set, STAF (when set)
will request an interrupt.
CWOM — Port C Wire-OR Mode
CWOM affects all eight port C pins together
0 = Port C outputs are normal CMOS outputs
1 = Port C outputs act as open-drain outputs
HNDS — Handshake Mode
When clear, strobe A acts as a simple input strobe to latch data into PORTCL, and
strobe B acts as a simple output strobe which pulses after a write to port B. When set,
a handshake protocol involving port C, STRA, and STRB is selected (see the definition
for the OIN bit).
0 = Simple strobe mode
1 = Full input or output handshake mode
OIN — Output or Input Handshaking
This bit has no meaning when HNDS = 0.
0 = Input handshake
1 = Output handshake
PLS — Pulse/Interlocked Handshake Operation
This bit has no meaning if HNDS = 0. When interlocked handshake operation is selected, strobe B, once activated, stays active until the selected edge of strobe A is detected. When pulsed handshake operation is selected, strobe B is pulsed for two E
cycles.
0 = Interlocked handshake select
1 = Pulsed handshake selected
EGA — Active Edge for Strobe A
0 = Falling edge of STRA is selected. When output handshake is selected, port C
lines obey the data direction register while STRA is low, but port C is forced to
output when STRA is high.
1 = Rising edge of STRA is selected. When output handshake is selected, port C
lines obey the data direction register while STRA is high, but port C is forced to
output when STRA is low.
INVB — Invert Strobe B
0 = Active level is logic zero
1 = Active level is logic one
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4
PARALLEL I/O
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5 SERIAL COMMUNICATIONS INTERFACE
This section contains a description of the serial communication interface (SCI).
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5.1 Overview and Features
A full-duplex asynchronous Serial Communications Interface (SCI) is provided with a
standard NRZ format (one start bit, eight or nine data bits, and one stop bit) and a variety of baud rates. The SCI transmitter and receiver are functionally independent, but
use the same data format and bit rate. “Baud” and “bit rate” are used synonymously in
the following description.
5.1.1 SCI Two-Wire System Features
• Standard NRZ (mark/space) format.
• Advanced error detection method includes noise detection for noise duration of
up to 1/16 bit time.
• Full-duplex operation.
• Software programmable for one of 32 different baud rates.
• Software selectable word length (eight or nine bit words).
• Separate transmitter and receiver enable bits.
• Capable of being interrupt driven.
• Four separate enable bits available for interrupt control.
5.1.2 SCI Receiver Features
• Receiver wake-up function (idle or address bit).
• Idle line detect.
• Framing error detect.
• Noise detect.
• Overrun detect.
• Receiver data register full flag.
5.1.3 SCI Transmitter Features
• Transmit data register empty flag.
• Transmit complete flag.
• Send break.
5.2 Data Format
Receive data or transmit data is the serial data which is transferred to the internal data
bus from the receive data input pin (RxD), or from the internal bus to the transmit data
output pin (TxD).
The non-return-to-zero (NRZ) data format shown in Figure 5-1 is used and must meet
the following criteria:
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1. The idle line is brought to a logic one state prior to transmission/reception of a
character.
2. A start bit (logic zero) is used to indicate the start of a frame.
3. The data is transmitted and received least-significant-bit first.
4. A stop bit (logic one) is used to indicate the end of a frame. A frame consists of
a start bit, a character of eight or nine data bits, and a stop bit.
5. A break is defined as the transmission or reception of a low (logic zero) for at
least one complete frame time.
0
IDLE LINE
1
2
3
4
5
6
7
START
8*
STOP
0
1
START
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* CONTROL BIT M IN SCCR1 SELECTS EITHER 8-BIT OR 9-BIT DATA.
5
SCI DATA FORMAT
Figure 5-1 Data Format
5.3 Wake-Up Feature
The receiver wake-up feature reduces SCI service overhead in multiple receiver systems. Software in each receiver evaluates the first character(s) of each message. If
the message is intended for a different receiver, the SCI can be placed in a sleep mode
so that the rest of the message will not generate requests for service. Whenever a new
message is started, logic in the sleeping receivers causes them to wake up so they
can evaluate the initial character(s) of the new message.
A sleeping SCI receiver can be configured (using the WAKE control bit in serial communications control register 1 (SCCR1)) to wake up using either of two methods: idle
line wake up or address mark wake up.
In idle line wake up, a sleeping receiver wakes up as soon as the RxD line becomes
idle. Idle is defined as a continuous logic high on the RxD line for ten (or eleven) full
bit times. Systems using this type of wake up must provide at least one character time
of idle between messages to wake up sleeping receivers but must not allow any idle
time between characters within a message.
In address mark wake up, the most significant bit (MSB) in a character is used to indicate that the character is an address (1) or a data (0) character. Sleeping receivers will
wake up whenever an address character is received. Systems using this method for
wake up would set the MSB of the first character in each message and leave it clear
for all other characters in the message. Idle periods may be present within messages
and no idle time is required between messages for this wake up method.
5.4 Receive Data (RxD)
Receive data is the serial data which is applied through the input line and the serial
communications interface to the internal bus. The receiver circuitry clocks the input at
a rate equal to 16 times the baud rate and this time is referred to as the RT clock.
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Once a valid start bit is detected, the start bit, each data bit, and the stop bit are sampled three times at RT intervals 8 RT, 9 RT, and 10 RT (1 RT is the position where the
bit is expected to start), as shown in Figure 5-2. The value of the bit is determined by
voting logic which takes the value of the majority of samples.
PRESENT BIT
PREVIOUS BIT
NEXT BIT
SAMPLES
RxD
16
R
T
1
R
T
v
8
R
T
v
9
R
T
v
10
R
T
16
R
T
1
R
T
SCI BIT SAMPLING
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Figure 5-2 Sampling Technique Used on All Bits
5.5 Start Bit Detection
When the RxD input is detected low, it is tested for three more sample times (referred
to as the start edge verification samples in Figure 5-3). If at least two of these three
verification samples detect a logic zero, a valid start bit has been detected, otherwise
the line is assumed to be idle. A noise flag is set if all three verification samples do not
detect a logic zero. A valid start bit could be assumed with a set noise flag present.
If there has been a framing error without detection of a break (10 zeros for 8-bit format
or 11 zeros for 9-bit format), the circuit continues to operate as if there actually was a
stop bit and the start edge will be placed artificially. The last bit received in the data
shift register is inverted to a logic one, and the three logic one start qualifiers (shown
in Figure 5-3) are forced into the sample shift register during the interval when detection of a start bit is anticipated (see Figure 5-4); therefore, the start bit will be accepted
no sooner than it is anticipated.
If the receiver detects that a break produced the framing error, the start bit will not be
artificially induced and the receiver must actually detect a logic one before the start bit
can be recognized. See Figure 5-5.
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16X INTERNAL
SAMPLING CLOCK
1
R
T
IDLE
2
R
T
3
R
T
4
R
T
5
R
T
6
R
T
7
R
T
8
R
T
RxD
1
1
1
1
1
1
1
1
1
1
0
0
0
PERCEIVED
START BIT
IDLE
0
NOISE
RxD
1
1
1
1
IDLE
1
1
1
1
1
1
0
0
1
0
0
0
0
PERCEIVED
START BIT
NOISE
RxD
1
1
1
1
0
1
1
1
1
1
0
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START EDGE
VERIFICATION SAMPLES
SCI SAMPLE EX
5
Figure 5-3 Examples of Start Bit Sampling Techniques
DATA
EXPECTED
STOP BIT
ARTIFICIAL
EDGE
DATA
RECEIVE
DATA IN
START
BIT
DATA
SAMPLES
(a) Case 1, Receive Line Low During Artificial Edge
DATA
EXPECTED
STOP BIT
START
EDGE
DATA
RECEIVE
DATA IN
START
BIT
DATA
SAMPLES
(b) Case 2, Receive Line High During Expected Start Edge
SCI FRM ERR EX
Figure 5-4 SCI Artificial Start Following a Framing Error
EXPECTED
STOP BIT
DETECTED AS VALID
START EDGE
BREAK
RECEIVE
DATA IN
START
BIT
DATA
SAMPLES
START
QUALIFIERS
START EDGE
VERIFICATION
SAMPLES
SCI FRM ERR EX
Figure 5-5 SCI Start Bit Following a Break
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5.6 Transmit Data (TxD)
Transmit data is the serial data from the internal data bus which is applied through the
serial communications interface to the output line. The transmitter generates a bit time
by using a derivative of the RT clock, thus producing a transmission rate equal to 1/16
that of the receiver sample clock.
5.7 Functional Description
A block diagram of the SCI is shown in Figure 5-6. The user has option bits in serial
communications control register 1 (SCCR1) to determine the “wake-up” method
(WAKE bit) and data word length (M bit) of the SCI. Serial communications control register 2 (SCCR2) provides control bits which individually enable/disable the transmitter
or receiver (TE and RE, respectively), enable system interrupts (TIE, TCIE, ILIE) and
provide the wake-up enable bit (RWU) and the send break code bit (SBK). The baud
rate register (BAUD) bits allow the user to select different baud rates which may be
used as the rate control for the transmitter and receiver.
Data transmission is initiated by a write to the serial communications data register
(SCDR). Provided the transmitter is enabled, data stored in the SCDR is transferred
to the transmit data shift register. This transfer of data sets the TDRE bit of the SCI
status register (SCSR) and may generate an interrupt if the transmit interrupt is enabled. The transfer of data to the transmit data shift register is synchronized with the
bit rate clock (Figure 5-7). All data is transmitted LSB first. Upon completion of data
transmission, the transmission complete (TC) bit of the SCSR is set (provided no
pending data, preamble, or break is to be sent), and an interrupt may be generated if
the transmit complete interrupt is enabled. If the transmitter is disabled, and the data,
preamble, or break (in the transmit shift register) has been sent, the TC bit will also be
set. This will also generate an interrupt if the TCIE bit is set. If the transmitter is disabled in the middle of a transmission, that character will be completed before the transmitter gives up control of the TxD pin.
When the SCDR is read, it contains the last data byte received, provided that the receiver is enabled. The RDRF bit of the SCSR is set to indicate that a data byte has
been transferred from the input serial shift register to the SCDR, which can cause an
interrupt if the receiver interrupt is enabled. The data transfer from the input serial shift
register to the SCDR is synchronized by the receiver bit rate clock. The OR (over-run),
NF (noise), or FE (framing) error bits of the SCSR may be set if data reception errors
occurred.
An idle line interrupt is generated if the idle line interrupt is enabled and the IDLE bit
(which detects idle line transmission) of SCSR is set. This allows a receiver that is not
in the wake-up mode to detect the end of a message, the preamble of a new message,
or to resynchronize with the transmitter. A valid character must be received before the
idle line condition or the IDLE bit will not be set and an idle line interrupt will not be
generated.
5.8 SCI Registers
There are five registers used in the serial communications interface and the operation
of these registers is discussed in the following paragraphs. Reference should be made
to the block diagram shown in Figure 5-6.
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5.8.1 Serial Communications Data Register (SCDR)
The serial communications data register performs two functions; i.e., it acts as the receive data register when it is read and as the transmit data register when it is written.
Figure 5-6 shows this register as two separate registers, namely: the receive data register and the transmit data register.
5
SERIAL COMMUNICATIONS INTERFACE
5-6
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INTERNAL BUS
$102D
TIE
TCIE
RIE
ILIE
TE
RE
RWU SBK SCCR2
IDLE LINE
Rx
INTERRUPT
Rx REG FULL
SCI
INTERRUPT
OVERRUN
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Tx
COMPLETE
Tx
REG
EMPTY
$102E TDRE
TC
TE
RDRF IDLE
OR
NF
FE
SBK
—
5
BAUD
RE
FLAG
CONTROL
TRANSMIT
CONTROL
RWU
RECEIVE
CONTROL
M
WAKE UP
UNIT
M
SCI Tx CLOCK
SCI Rx CLOCK
RATE GENERATOR
$102B
—
—
$102C
R8
T8
7
6
7
7
8
$102F
RxD/
PD0
8
SCP1 SCP0
—
—
SCR2 SCR1 SCR0 BAUD
—
—
TxD DATA SHIFT REG
1
0
6
5
2
1
0
6
RxD DATA SHIFT REG
1
0
M
4
WAKE
3
—
SCCR1
TxD/
PD1
SCDR
INTERNAL BUS
Figure 5-6 Serial Communications Interface Block Diagram
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5.8.2 Serial Communications Control Register 1 (SCCR1)
The serial communications control register 1 (SCCR1) provides the control bits which:
(1) determine the word length, and (2) select the method used for the wake-up feature.
$102C
RESET
7
R8
U
6
T8
U
5
0
0
4
M
0
3
WAKE
0
2
0
0
1
0
0
0
0
0
SCCR1
Freescale Semiconductor, Inc...
R8 — Receive Data Bit 8
If the M bit is set, this bit provides a storage location for the ninth bit in the receive data
character.
5
T8 —Transmit Data Bit 8
If the M bit is set, this bit provides a storage location for the ninth bit in the transmit
data character. It is not necessary to write to this bit for every character transmitted,
only when the sense is to be different than that for the previous character.
Bit 5 — Not Implemented
This bit always reads zero.
M — SCI Character Length
0 = 1 start bit, 8 data bits, 1 stop bit
1 = 1 start bit, 9 data bits, 1 stop bit
WAKE — Wake Up Method Select
0 = Idle Line
1 = Address Mark
Bits 2-0 — Not Implemented
These bits always read zero.
5.8.3 Serial Communications Control Register 2 (SCCR2)
The serial communications control register 2 (SCCR2) provides the control bits which
enable/disable individual SCI functions.
$102D
RESET
7
TIE
0
6
TCIE
0
5
RIE
0
4
ILIE
0
3
TE
0
2
RE
0
1
RWU
0
0
SBK
0
SCCR2
TIE — Transmit Interrupt Enable
0 = TDRE interrupts disabled
1 = SCI interrupt if TDRE = 1
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TCIE — Transmit Complete Interrupt Enable
0 = TC interrupts disabled
1 = SCI Interrupt if TC = 1
RIE — Receive Interrupt Enable
0 = RDRF and OR interrupts disabled
1 = SCI interrupt if RDRF or OR = 1
Freescale Semiconductor, Inc...
ILIE — Idle Line Interrupt Enable
0 = IDLE interrupts disabled
1 = SCI interrupt if IDLE = 1
TE — Transmit Enable
When the transmit enable bit is set, the transmit shift register output is applied to the
TxD line. Depending on the state of control bit M (SCCR1), a preamble of 10 (M = 0)
or 11 (M = 1) consecutive ones is transmitted when software sets the TE bit from a
cleared state. After loading the last byte in the serial communications data register and
receiving the TDRE flag, the user can clear TE. Transmission of the last byte will then
be completed before the transmitter gives up control of the TxD pin. While the transmitter is active, the data direction register control for port D bit 1 is overridden and the
line is forced to be an output.
RE — Receive Enable
When the receive enable bit is set, the receiver is enabled. When RE is clear, the receiver is disabled and all of the status bits associated with the receiver (RDRF, IDLE,
OR, NF, and FE) are inhibited. While the receiver is enabled, the data direction register
control for port D bit 0 is overridden and the line is forced to be an input.
RWU — Receiver Wake Up
When the receiver wake-up bit is set by the user’s software, it puts the receiver to
sleep and enables the “wake up” function. If the WAKE bit is cleared, RWU is cleared
by the SCI logic after receiving 10 (M = 0) or 11 (M = 1) consecutive ones. If the WAKE
bit is set, RWU is cleared by the SCI logic after receiving a data word whose MSB is
set.
SBK — Send Break
If the send break bit is toggled set and cleared, the transmitter sends 10 (M = 0) or 11
(M = 1) zeros and then reverts to idle or sending data. If SBK remains set, the transmitter will continually send whole blocks of zeros (sets of 10 or 11) until cleared. At the
completion of the break code, the transmitter sends at least one high bit to guarantee
recognition of a valid start bit. If the transmitter is currently empty and idle, setting and
clearing SBK is likely to queue two character times of break because the first break
transfers almost immediately to the shift register and the second is then queued into
the parallel transmit buffer.
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5.8.4 Serial Communications Status Register (SCSR)
The serial communications status register (SCSR) provides inputs to the interrupt logic
circuits for generation of the SCI system interrupt.
Freescale Semiconductor, Inc...
$102E
RESET
5
7
TDRE
1
6
TC
1
5
RDRF
0
4
IDLE
0
3
OR
0
2
NF
0
1
FE
0
0
0
0
SCSR
TDRE — Transmit Data Register Empty
The transmit data register empty bit is set to indicate that the content of the serial communications data register have been transferred to the transmit serial shift register.
This bit is cleared by reading the SCSR (with TDRE = 1) followed by a write to the
SCDR.
TC — Transmit Complete
The transmit complete bit is set at the end of a data frame, preamble, or break condition if:
1. TE = 1, TDRE = 1, and no pending data, preamble, or break is to be transmitted;
or
2. TE = 0, and the data, preamble, or break in the transmit shift register has been
transmitted.
The TC bit is a status flag which indicates that one of the above conditions have occurred.
The TC bit is cleared by reading the SCSR (with TC set) followed by a write to the
SCDR.
RDRF — Receive Data Register Full
The receive data register full bit is set when the receiver serial shift register is transferred to
the SCDR. The RDRF bit is cleared when the SCSR is read (with RDRF set) followed by a
read of the SCDR.
IDLE — Idle Line Detect
The idle line detect bit, when set, indicates the receiver has detected an idle line. The IDLE
bit is cleared by reading the SCSR with IDLE set followed by reading SCDR. Once the IDLE
status flag is cleared, it will not be set again until after the RxD line has been active and becomes idle again.
OR — Overrun Error
The overrun error bit is set when the next byte is ready to be transferred from the receive shift
register to the SCDR which is already full (RDRF bit is set). When an overrun error occurs,
the data which caused the overrun is lost and the data which was already in SCDR is not disturbed. The OR is cleared when the SCSR is read (with OR set), followed by a read of the
SCDR.
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NF — Noise Flag
The noise flag bit is set if there is noise on any of the received bits, including the start
and stop bits. The NF bit is not set until the RDRF flag is set. The NF bit is cleared
when the SCSR is read (with NF set), followed by a read of the SCDR.
Freescale Semiconductor, Inc...
FE — Framing Error
The framing error bit is set when no stop bit was detected in the received data character. The FE bit is set at the same time as the RDRF is set. If the byte received causes
both framing and overrun errors, the processor will only recognize the overrun error.
The framing error flag inhibits further transfer of data into the SCDR until it is cleared.
The FE bit is cleared when the SCSR is read (with FE equal to one) followed by a read
of the SCDR.
Bit 0 — Not Implemented
This bit always reads zero.
5.8.5 Baud Rate Register (BAUD)
The baud rate register selects the different baud rates which may be used as the rate
control for the transmitter and receiver. The SCP[0:1] bits function as a prescaler for
the SCR[0:2] bits. Together, these five bits provide multiple baud rate combinations for
a given crystal frequency.
$102B
RESET
7
TCLR
0
6
0
0
5
SCP1
0
4
SCP0
0
3
RCKB
0
2
SCR2
U
1
SCR1
U
0
SCR0
U
BAUD
TCLR — Clear Baud Rate Counters (Test)
This bit is used to clear the baud rate counter chain during factory testing. TCLR is
zero and cannot be set while in normal operating modes.
SCP1 and SCP0 — SCI Baud Rate Prescaler Selects
The E clock is divided by the factors shown in Table 5-1. This prescaled output provides an input to a divider which is controlled by the SCR2-SCR0 bits.
Table 5-1 First Prescaler Stage
SCP1
SCP0
Internal Processor Clock Divided By
0
0
1
0
1
3
1
0
4
1
1
13
SCR2, SCR1, and SCR0 — SCI Baud Rate Selects
These three bits select the baud rates for both the transmitter and the receiver. The
prescaler output described above is further divided by the factors shown in Table 5-2.
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Freescale Semiconductor, Inc...
Table 5-2 Second Prescaler Stage
5
SCR2
SCR1
SCR0
Prescaler Output
Divide By
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
8
1
0
0
16
1
0
1
32
1
1
0
64
1
1
1
128
RCKB — SCI Baud Rate Clock Check (Test)
This bit is used during factory testing to enable the exclusive-OR of the receiver clock
and transmitter clock to be driven out the TxD pin. RCKB is zero and cannot be set
while in normal operating modes.
The diagram shown in Figure 5-7 and the data given in Table 5-3 and Table 5-4 illustrate the divider chain used to obtain the baud rate clock. Note that there is a fixed rate
divide-by-16 between the receive clock (RT) and the transmit clock (Tx). The actual
divider chain is controlled by the combined SCP[1:0] and SCR[2:0] bits in the baud rate
register as illustrated.
INTERNAL BUS
CLOCK (PH2)
SCI RECEIVER
CLOCK
OSCILLATOR
FREQUENCY
÷4
SCI
PRESCALER
SCP[1:0]
SCI BAUD
SELECT
SCR[2:0]
÷ 16
SCI TRANSMITTER
CLOCK
SCI BAUD DIV
Figure 5-7 Rate Generator Division
Table 5-3 Prescaler Highest Baud Rate Frequency Output
SCP Bit Clock*
Crystal Frequency (MHz)
1
0 Divided
12.0
8.3886
8.0
4.9152
4.0
3.6864
By
0
0
1
187.50 K Baud 131.072 K Baud 125.000 K Baud 76.80 K Baud 62.50 K Baud 57.60 K Baud
0
1
3
62.50 K Baud
43.690 K Baud 41.666 K Baud 25.60 K Baud 20.833 K Baud 19.20 K Baud
1
0
4
46.875 K Baud 32.768 K Baud 31.250 K Baud 19.20 K Baud 15.625 K Baud 14.40 K Baud
1
1
13
14.423 K Baud 10.082 K Baud
9600 Baud
5.907 K Baud
4800 Baud
4430 Baud
*The clock in the “Clock Divided By” column is the internal processor clock
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NOTE
The divided frequencies shown in Table 5-3 represent baud rates
which are the highest transmit baud rate (Tx) that can be obtained by
a specific crystal frequency and only using the prescaler division.
Lower baud rates may be obtained by providing a further division using the SCI rate select bits as shown below for some representative
prescaler outputs.
Freescale Semiconductor, Inc...
Table 5-4 Transmit Baud Rate Output for a Given Prescaler Output
SCR Bit
2 1 0
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
Divided
By
1
2
4
8
16
32
64
128
131.072 K Baud
131.072 K Baud
65.536 K Baud
32.768 K Baud
16.384 K Baud
8.192 K Baud
4.096 K Baud
2.048 K Baud
1.024 K Baud
Representative Highest Prescaler Baud Rate Output
32.768 K Baud
76.80 K Baud
19.20 K Baud 9600 Baud
32.768 K Baud
76.80 K Baud
19.20 K Baud
9600 Baud
16.384 K Baud
38.40 K Baud
9600 Baud
4800 Baud
8.192 K Baud
19.20 K Baud
4800 Baud
2400 Baud
4.096 K Baud
9600 Baud
2400 Baud
1200 Baud
2.048 K Baud
4800 Baud
1200 Baud
600 Baud
1.024 K Baud
2400 Baud
600 Baud
300 Baud
512 Baud
1200 Baud
300 Baud
150 Baud
256 Baud
600 Baud
150 Baud
75 Baud
4800 Baud
4800 Baud
2400 Baud
1200 Baud
600 Baud
300 Baud
150 Baud
75 Baud
—
NOTE
Table 5-4 illustrates how the SCI select bits can be used to provide
lower transmitter baud rates by further dividing the prescaler output
frequency. The five examples are only representative samples. In all
cases, the baud rates shown are transmit baud rates (transmit clock)
and the receiver clock is 16 times higher in frequency than the actual
baud rate.
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5
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5
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6 SERIAL PERIPHERAL INTERFACE
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This section contains a description on the serial peripheral interface (SPI).
6.1 Overview and Features
The serial peripheral interface (SPI) is a synchronous interface which allows several
SPI microcontrollers or SPI-type peripherals to be interconnected. In a serial peripheral interface, separate wires (signals) are required for data and clock. In the SPI format, the clock is not included in the data stream and must be furnished as a separate
signal. The MC68HC11A8 SPI system may be configured either as a master or as a
slave. The SPI contains the following features:
• Full Duplex, Three-Wire Synchronous Transfers
• Master or Slave Operation
• 1.5 MHz (Maximum) Master Bit Frequency
• 3 MHz (Maximum) Slave Bit Frequency
• Four Programmable Master Bit Rates
• Programmable Clock Polarity and Phase
• End-of-Transmission Interrupt Flag
• Write Collision Flag Protection
• Master-Master Mode Fault Protection
• Easily Interfaces to Simple Expansion Parts (PLLs, D/As, Latches, Display Drivers, etc.)
6.2 SPI Signal Descriptions
The four basic SPI signals (MISO, MOSI, SCK, and SS) are discussed in the following
paragraphs. Each signal is described for both the master and slave modes.
Any SPI output line has to have its corresponding data direction register bit set. If this
bit is clear, the line is disconnected from the SPI logic and becomes a general-purpose
input line. Any SPI input line is forced to act as an input regardless of what is in the
corresponding data direction register bit.
6.2.1 Master In Slave Out (MISO)
The MISO line is configured as an input in a master device and as an output in a slave
device. It is one of the two lines that transfer serial data in one direction, with the most
significant bit sent first. The MISO line of a slave device is placed in the high-impedance state if the slave is not selected.
6.2.2 Master Out Slave In (MOSI)
The MOSI line is configured as an output in a master device and as an input in a slave
device. It is one of the two lines that transfer serial data in one direction with the most
significant bit sent first.
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6.2.3 Serial Clock (SCK)
The serial clock is used to synchronize data movement both in and out of the device
through its MOSI and MISO lines. The master and slave devices are capable of exchanging a byte of information during a sequence of eight clock cycles. Since SCK is
generated by the master device, this line becomes an input on a slave device.
Freescale Semiconductor, Inc...
As shown in Figure 6-1, four possible timing relationships may be chosen by using
control bits CPOL and CPHA in the serial peripheral control register (SPCR). Both
master and slave devices must operate with the same timing. The master device always places data on the MOSI line a half-cycle before the clock edge (SCK), in order
for the slave device to latch the data.
6
Two bits (SPR0 and SPR1) in the SPCR of the master device select the clock rate. In
a slave device, SPR0 and SPR1 have no effect on the operation of the SPI.
6.2.4 Slave Select (SS)
The slave select (SS) input line is used to select a slave device. It has to be low prior
to data transactions and must stay low for the duration of the transaction.
The SS line on the master must be tied high. If it goes low, a mode fault error flag
(MODF) is set in the serial peripheral status register (SPSR). The SS pin can be selected to be a general-purpose output by writing a one in bit 5 of the port D data direction register, thus disabling the mode fault circuit. The other three SPI lines are
dedicated to the SPI whenever the SPI is on.
SCK CYCLE #
(FOR REFERENCE)
1
2
3
4
5
6
7
8
SCK (CPOL = 0)
SCK (CPOL = 1)
SAMPLE INPUT
(CPHA = 0) DATA OUT
MSB
6
5
4
3
2
1
LSB
SAMPLE INPUT
(CPHA = 1) DATA OUT
MSB
6
5
4
3
2
1
LSB
SS (TO SLAVE)
SPI TRANSFER FORMAT
Figure 6-1 Data Clock Timing Diagram
When CPHA = 0, the shift clock is the OR of SS with SCK. In this clock phase mode,
SS must go high between successive characters in an SPI message. When CPHA =
1, SS may be left low for several SPI characters. In cases where there is only one SPI
slave MCU, its SS line could be tied to VSS as long as CPHA = 1 clock modes are used.
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6.3 Functional Description
Figure 6-2 shows a block diagram of the serial peripheral interface circuitry. When a
master device transmits data to a slave device via the MOSI line, the slave device responds by sending data to the master device via the master’s MISO line. This implies
full duplex transmission with both data out and data in synchronized with the same
clock signal. Thus, the byte transmitted is replaced by the byte received and eliminates
the need for separate transmit-empty and receiver-full status bits. A single status bit
(SPIF) is used to signify that the l/O operation has been completed.
MSB
INTERNAL
MCU SYSTEM
CLOCK
LSB
8-BIT SHIFT REGISTER
READ DATA BUFFER
DIVIDER
÷2 ÷4 ÷16 ÷32
CLOCK
S
M
MISO
PD2
M
S
MOSI
PD3
PIN
CONTROL
LOGIC
SPI CLOCK (MSTR = 1)
SELECT
S
M
SPR1
SPR0
CLOCK
LOGIC
SCK
PD4
MODF
SPI CONTROL
MSTR
SPE
SPIE
8
SPI STATUS (SPSR)
SPIE
SPE
DWOM
MSTR
CPHA
CPOL
SPR1
SPR0
SPI
INTERRUPT
MSTR
SPE
DWOM
SS
PD5
SPIF
WCOL
Freescale Semiconductor, Inc...
The SPI is double buffered on read, but not on write. If a write is performed during data
transfer, the transfer occurs uninterrupted, and the write will be unsuccessful. This
condition will cause the write collision (WCOL) status bit in the SPSR to be set. After
a data byte is shifted, the SPIF flag of the SPSR is set.
SPI CONTROL (SPCR)
SPI BLOCK DIAGRAM
Figure 6-2 Serial Peripheral Interface Block Diagram
In the master mode, the SCK pin is an output. It idles high or low, depending on the
CPOL bit in the SPCR, until data is written to the shift register, at which point eight
clocks are generated to shift the eight bits of data and then SCK goes idle again.
In a slave mode, the slave start logic receives a logic low at the SS pin and a clock
input at the SCK pin. Thus, the slave is synchronized with the master. Data from the
master is received serially at the slave MOSI line and loads the 8-bit shift register. After
the 8-bit shift register is loaded, its data is parallel transferred to the read buffer. During
a write cycle, data is written into the shift register, then the slave waits for a clock train
from the master to shift the data out on the slave’s MISO line.
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Figure 6-3 illustrates the MOSI, MISO, SCK, and SS master-slave interconnections.
Due to data direction register control of SPI outputs and the port D wire-OR mode
(DWOM) option, the SPI system can be configured in a variety of ways. Systems with
a single bidirectional data path rather than separate MISO and MOSI paths can be accommodated. Since MC68HC11A8 SPI slaves can selectively disable their MISO output, a broadcast message protocol is also possible.
MASTER
SLAVE
Freescale Semiconductor, Inc...
8-BIT SHIFT REGISTER
SPI CLOCK
GENERATOR
MISO
MISO
MOSI
MOSI
SCK
SCK
+5V
SS
6
8-BIT SHIFT REGISTER
SS
DUAL-MCU SPI CONN
Figure 6-3 Serial Peripheral Interface Master-Slave Interconnection
6.4 SPI Registers
There are three registers in the serial peripheral interface which provide control, status, and data storage functions. These registers are called the serial peripheral control
register (SPCR), serial peripheral status register (SPSR), and serial peripheral data l/
O register (SPDR) and are described in the following paragraphs.
6.4.1 Serial Peripheral Control Register (SPCR)
$1028
RESET
7
SPIE
0
6
SPE
0
5
DWOM
0
4
MSTR
0
3
CPOL
0
2
CPHA
1
1
SPR1
U
0
SPR0
U
SPCR
SPIE — Serial Peripheral Interrupt Enable
0 = SPIF interrupts disabled
1 = SPI interrupt if SPIF = 1
SPE — Serial Peripheral System Enable
0 = SPI system off
1 = SPI system on
DWOM — Port D Wire-OR Mode Option
DWOM affects all six port D pins together.
0 = Port D outputs are normal CMOS outputs
1 = Port D outputs act as open-drain outputs
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MSTR — Master Mode Select
0 = Slave mode
1 = Master mode
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CPOL — Clock Polarity
When the clock polarity bit is cleared and data is not being transferred, a steady state
low value is produced at the SCK pin of the master device. Conversely, if this bit is set,
the SCK pin will idle high. This bit is also used in conjunction with the clock phase control bit to produce the desired clock-data relationship between master and slave. See
Figure 6-1.
CPHA — Clock Phase
The clock phase bit, in conjunction with the CPOL bit, controls the clock-data relationship between master and slave. The CPOL bit can be thought of as simply inserting
an inverter in series with the SCK line. The CPHA bit selects one of two fundamentally
different clocking protocols. When CPHA = 0, the shift clock is the OR of SCK with SS.
As soon as SS goes low the transaction begins and the first edge on SCK invokes the
first data sample. When CPHA = 1, the SS pin may be thought of as a simple output
enable control. Refer to Figure 6-1.
Table 6-1 Serial Peripheral Rate Selection
SPR1
SPR0
Internal Processor,
Clock Divide By
0
0
2
0
1
4
1
0
16
1
1
32
SPR1 and SPR0—SPI Clock Rate Selects
These two serial peripheral rate bits select one of four baud rates (Table 6-1) to be
used as SCK if the device is a master; however, they have no effect in the slave mode.
6.4.2 Serial Peripheral Status Register (SPSR)
$1029
RESET
7
SPIF
0
6
WCOL
0
5
0
0
4
MODF
0
3
0
0
2
0
0
1
0
0
0
0
0
SPSR
SPIF — SPI Transfer Complete Flag
The serial peripheral data transfer flag bit is set upon completion of data transfer between the processor and external device. If SPIF goes high, and if SPIE is set, a serial
peripheral interrupt is generated. Clearing the SPIF bit is accomplished by reading the
SPSR (with SPIF set) followed by an access of the SPDR. Unless SPSR is read (with
SPIF set) first, attempts to write to SPDR are inhibited.
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WCOL — Write Collision
The write collision bit is set when an attempt is made to write to the serial peripheral
data register while data transfer is taking place. If CPHA is zero a transfer is said to
begin when SS goes low and the transfer ends when SS goes high after eight clock
cycles on SCK. When CPHA is one a transfer is said to begin the first time SCK becomes active while SS is low and the transfer ends when the SPIF flag gets set. Clearing the WCOL bit is accomplished by reading the SPSR (with WCOL set) followed by
an access to SPDR.
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Bit 5 — Not Implemented
This bit always reads zero.
6
MODF — Mode Fault
The mode fault flag indicates that there may have been a multi-master conflict for system control and allows a proper exit from system operation to a reset or default system
state. The MODF bit is normally clear, and is set only when the master device has its
SS pin pulled low. Setting the MODF bit affects the internal serial peripheral interface
system in the following ways:
1. An SPI interrupt is generated if SPIE = 1.
2. The SPE bit is cleared. This disables the SPI.
3. The MSTR bit is cleared, thus forcing the device into the slave mode.
4. DDRD bits for the four SPI pins are forced to zeros.
Clearing the MODF bit is accomplished by reading the SPSR (with MODF set), followed by a write to the SPCR. Control bits SPE and MSTR may be restored by user
software to their original state after the MODF bit has been cleared. It is also necessary to restore DDRD after a mode fault.
Bits 3-0 — Not Implemented
These bits always read zero.
6.4.3 Serial Peripheral Data l/O Register (SPDR)
The serial peripheral data l/O register is used to transmit and receive data on the serial
bus. Only a write to this register will initiate transmission/reception of another byte, and
this will only occur in the master device. At the completion of transmitting a byte of data, the SPIF status bit is set in both the master and slave devices.
When the user reads the serial peripheral data l/O register, a buffer is actually being
read. The first SPIF must be cleared by the time a second transfer of data from the
shift register to the read buffer is initiated or an overrun condition will exist. In cases of
overrun the byte which causes the overrun is lost.
A write to the serial peripheral data l/O register is not buffered and places data directly
into the shift register for transmission.
SERIAL PERIPHERAL INTERFACE
6-6
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7 ANALOG-TO-DIGITAL CONVERTER
The MC68HC11A8 includes an 8-channel, multiplexed-input, successive approximation, analog-to-digital (A/D) converter with sample and hold to minimize conversion errors caused by rapidly changing input signals. Two dedicated lines (VRL, VRH) are
provided for the reference voltage inputs. These pins may be connected to a separate
or isolated power supply to ensure full accuracy of the A/D conversion. The 8-bit A/D
converter has a total error of ±1 LSB which includes ± 1/2 LSB of quantization error
and accepts analog inputs which range from VRL to VRH. Smaller analog input ranges
can also be obtained by adjusting VRH and VRL to the desired upper and lower limits.
Conversion is specified and tested for VRL = 0 V and VRH = 5 V ± 10%; however, laboratory characterization over the full temperature range indicates little or no degradation with VRH-VRL as low as 2.5 to 3 V. The A/D system can be operated with VRH below
VDD and/or VRL above VSS as long as VRH is above VRL by enough to support the conversions (2.5 to 5.0 V). Each conversion is accomplished in 32 MCU E clock cycles,
provided the E clock rate is greater than 750 kHz. For systems which operate at clock
rates less than 750 kHz, an internal R-C oscillator must be used to clock the A/D system. The internal R-C oscillator is selected by setting the CSEL bit in the OPTION register.
NOTE
Only four A/D input channels are available in the 48-pin version.
7.1 Conversion Process
The A/D converter is ratiometric. An input voltage equal to VRL converts to $00 and an
input voltage equal to VRH converts to $FF (full scale), with no overflow indication. For
ratiometric conversions, the source of each analog input should use VRH as the supply
voltage and be referenced to VRL.
Figure 7-1 shows the detailed sequence for a set of four conversions. This sequence
begins one E clock cycle after a write to the A/D control/status register (ADCTL). Figure 7-2 shows a model of the port E A/D channel inputs. This model is useful for understanding the effects of external circuitry on the accuracy of A/D conversions.
7.2 Channel Assignments
A multiplexer allows the single A/D converter to select one of sixteen analog signals.
Eight of these channels correspond to port E input lines to the MCU, four of the channels are for internal reference points or test functions, and four channels are reserved
for future use. Table 7-1 shows the signals selected by the four channel select control
bits.
ANALOG-TO-DIGITAL CONVERTER
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7.3 Single-Channel Operation
There are two variations of single-channel operation. In the first variation (SCAN = 0),
the single selected channel is converted four consecutive times with the first result being stored in A/D result register 1 (ADR1) and the fourth result being stored in register
ADR4. After the fourth conversion is complete, all conversion activity is halted until a
new conversion command is written to the ADCTL register. In the second variation
(SCAN = 1), conversions continue to be performed on the selected channel with the
fifth conversion being stored in register ADR1 (overwriting the first conversion result),
the sixth conversion overwrites ADR2, and so on.
MSB
4
CYCLES
7
SAMPLE ANALOG INPUT
0
CONVERT FIRST
CHANNEL, UPDATE
ADR1
32
BIT 6
2
CYC
BIT 5
2
CYC
BIT 4
2
CYC
BIT 3
2
CYC
BIT 2
2
CYC
BIT 1
2
CYC
LSB
2
CYC
2
CYC
END
SUCCESSIVE APPROXIMATION SEQUENCE
CONVERT SECOND
CHANNEL, UPDATE
ADR2
64
CONVERT THIRD
CHANNEL, UPDATE
ADR3
96
CONVERT FOURTH
CHANNEL, UPDATE
ADR4
SET CC FLAG
WRITE TO ADCTL
Freescale Semiconductor, Inc...
12 E CYCLES
REPEAT SEQUENCE, SCAN = 1
E CLOCK
128 — E CYCLES
Figure 7-1 A/D Conversion Sequence
DIFFUSION/POLY
COUPLER
ANALOG
INPUT
PIN
+ ~20V
– ~0.7V
< 2 pF
INPUT
PROTECTION
DEVICE
≤ 4 KΩ
+ ~12V
– ~0.7V
DUMMY N-CHANNEL
OUTPUT DEVICE
400 nA
JUNCTION
LEAKAGE
*
~ 20 pF
DAC
CAPACITANCE
VRL
* THIS ANALOG SWITCH IS CLOSED ONLY DURING THE 12-CYCLE SAMPLE TIME.
Figure 7-2 A/D Pin Model
7.4 Multiple-Channel Operation
There are two variations in multiple-channel operation. In the first variation (SCAN =
0), the selected group of four channels are converted, one time each, with the first result being stored in register ADR1 and the fourth result being stored in register ADR4.
After the fourth conversion is complete, all conversion activity is halted until a new conversion command is written to the ADCTL register. In the second variation (SCAN =
1), conversions continue to be performed on the selected group of channels with the
fifth conversion being stored in register ADR1 (replacing the earlier conversion result
for the first channel in the group), the sixth conversion overwrites ADR2, and so on.
ANALOG-TO-DIGITAL CONVERTER
7-2
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7.5 Operation in STOP and WAIT Modes
If a conversion sequence is still in process when either the STOP or WAIT mode is
entered, the conversion of the current channel is suspended. When the MCU resumes
normal operation, that channel will be re-sampled and the conversion sequence resumed. As the MCU exits the WAIT mode, the A/D circuits are stable and valid results
can be obtained on the first conversion. However, in STOP mode, all analog bias currents are disabled and it becomes necessary to allow a stabilization period when leaving the STOP mode. If the STOP mode is exited with a delay, there will be enough time
for these circuits to stabilize before the first conversion. If the STOP mode is exited
with no delay (DLY bit in OPTION register equal to zero), sufficient time must be allowed for the A/D circuitry to stabilize to avoid invalid results (see 7.8 A/D Power-Up
and Clock Select).
7.6 A/D Control/Status Register (ADCTL)
All bits in this register may be read or written, except bit 7 which is a read-only status
indicator and bit 6 which always reads as a zero.
$1030
RESET
7
CCF
0
6
0
0
5
SCAN
U
4
MULT
U
3
CD
U
2
CC
U
1
CB
U
0
CA
U
ADCTL
CCF — Conversions Complete Flag
This read-only status indicator is set when all four A/D result registers contain valid
conversion results. Each time the ADCTL register is written, this bit is automatically
cleared to zero and a conversion sequence is started. In the continuous modes, conversions continue in a round-robin fashion and the result registers continue to be updated with current data even though the CCF bit remains set.
NOTE
The user must write to register ADCTL to initiate conversion. To abort
a conversion in progress, write to the ADCTL register and a new conversion sequence is initiated immediately.
Bit 6 — Not Implemented
This bit always reads zero.
SCAN — Continuous Scan Control
When this control bit is clear, the four requested conversions are performed once to
fill the four result registers. When this control bit is set, conversions continue in a
round-robin fashion with the result registers being updated as data becomes available.
MULT — Multiple-Channel/Single Channel Control
When this bit is clear, the A/D system is configured to perform four consecutive conversions on the single channel specified by the four channel select bits CD through CA
(bits [3:0] of the ADCTL register). When this bit is set, the A/D system is configured to
perform a conversion on each of four channels where each result register corresponds
to one channel.
ANALOG-TO-DIGITAL CONVERTER
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CAUTION
When the multiple channel continuous scan mode is used, extra care
is needed in the design of circuitry driving the A/D inputs. Refer to the
A/D Pin Model and A/D Conversion Sequence figures in addition to
the following discussion. The charge on the capacitive DAC array prior to the sample time is related to the voltage on the previously converted channel. A charge share situation exists between the internal
DAC capacitance and the external circuit capacitance. Although the
amount of charge involved is small the rate at which it is repeated is
every 64 microseconds for an E clock of 2 MHz. The RC charging
rate of the external circuit must be balanced against this charge sharing effect to avoid accuracy errors.
7
CD — Channel Select D
CC — Channel Select C
CB — Channel Select B
CA — Channel Select A
These four bits are used to select one of 16 A/D channels (see Table 7-1). When a
multiple channel mode is selected (MULT = 1), the two least-significant channel select
bits (CB and CA) have no meaning and the CD and CC bits specify which group of four
channels are to be converted. The channels selected by the four channel select control
bits are shown in Table 7-1.
Table 7-1 Analog-to-Digital Channel Assignments
CD
0
0
0
0
0
0
0
0
1
1
1
1
1
CC
0
0
0
0
1
1
1
1
0
0
0
0
1
CB
0
0
1
1
0
0
1
1
0
0
1
1
0
CA
0
1
0
1
0
1
0
1
0
1
0
1
0
Channel
Signal
AN0
AN1
AN2
AN3
AN4*
AN5*
AN6*
AN7*
Reserved
Reserved
Reserved
Reserved
VRH Pin**
Result in ADRx
if MULT=1
ADR1
ADR2
ADR3
ADR4
ADR1
ADR2
ADR3
ADR4
ADR1
ADR2
ADR3
ADR4
ADR1
1
1
0
1
VRL Pin**
ADR2
1
1
1
0
(VRH)/2**
ADR3
1
1
1
1
Reserved**
ADR4
*Not available in 48-pin package versions.
**This group of channels used during factory test.
ANALOG-TO-DIGITAL CONVERTER
7-4
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7.7 A/D Result Registers 1, 2, 3, and 4 (ADR1, ADR2, ADR3, and ADR4)
The A/D result registers are read-only registers used to hold an 8-bit conversion result.
Writes to these registers have no effect. Data in the A/D result registers is valid when
the CCF flag bit in the ADCTL register is set, indicating a conversion sequence is complete. If conversion results are needed sooner refer to Figure 7-1. For example the
ADR1 result is valid 33 cycles after an ADCTL write. Refer to the A/D channel assignments in Table 7-1 for the relationship between the channels and the result registers.
7.8 A/D Power-Up and Clock Select
A/D power-up is controlled by bit 7 (ADPU) of the OPTION register. When ADPU is
cleared, power to the A/D system is disabled. When ADPU is set, the A/D system is
enabled. A delay of as much as 100 microseconds is required after turning on the A/
D converter to allow the analog bias voltages to stabilize.
Clock select is controlled by bit 6 (CSEL) of the OPTION register. When CSEL is
cleared, the A/D system uses the system E clock. When CSEL is set, the A/D system
uses an internal R-C clock source, which runs at about 1.5 MHz. The MCU E clock is
not suitable to drive the A/D system if it is operating below 750 kHz, in which case the
R-C internal clock should be selected. A delay of 10 ms is required after changing
CSEL from zero to one to allow the R-C oscillator to start and internal bias voltages to
settle. Refer to 9.1.5 Configuration Options Register (OPTION) for additional information. Note that the CSEL control bit also enables a separate R-C oscillator to drive
the EEPROM charge pump.
When the A/D system is operating with the MCU E clock, all switching and comparator
operations are synchronized to the MCU clocks. This allows the comparator results to
be sampled at quiet clock times to minimize noise errors. The internal R-C oscillator is
asynchronous to the MCU clock so noise will affect A/D results more while CSEL = 1.
ANALOG-TO-DIGITAL CONVERTER
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7
ANALOG-TO-DIGITAL CONVERTER
7-6
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8 PROGRAMMABLE TIMER, RTI, AND PULSE ACCUMULATOR
Freescale Semiconductor, Inc...
This section describes the 16-bit programmable timer, the real time interrupt, and the
pulse accumulator system.
8.1 Programmable Timer
The timer has a single 16-bit free-running counter which is clocked by the output of a
four-stage prescaler (divide by 1, 4, 8, or 16), which is in turn driven by the MCU E
clock. Input functions are called input captures. These input captures record the count
from the free-running counter in response to a detected edge on an input line. Output
functions, called output compares, cause an output action when there is a match between a 16-bit output-compare register and the free-running counter. This timer system has three input capture registers and five output compare registers.
8.1.1 Counter
The key element in the timer system is a 16-bit free-running counter, or timer counter
register. After reset, the MCU is configured to use the E clock as the input to the freerunning counter. Initialization software may optionally reconfigure the system to use
one of the three prescaler values. The prescaler control bits can only be written once
during the first 64 cycles after a reset. Software can read the counter at any time without affecting its value because it is clocked and read during opposite phases of the E
clock.
A counter read should first address the most significant byte. An MPU read of this address causes the least significant byte to be transferred to a buffer. This buffer is not
affected by reset and is accessed when reading the least significant byte of the
counter. For double byte read instructions, the two accesses occur on consecutive bus
cycles.
The counter is cleared to $0000 during reset and is a read-only register with one exception. In test modes only, any MPU write to the most significant byte presets the
counter to $FFF8 regardless of the value involved in the write.
When the count changes from $FFFF to $0000, the timer overflow flag (TOF) bit is set
in timer interrupt flag register 2 (TFLG2). An interrupt can be enabled by setting the
interrupt enable bit (TOI) in timer interrupt mask register 2 (TMSK2).
8.1.2 Input Capture
The input capture registers are 16-bit read-only registers which are not affected by reset and are used to latch the value of the counter when a defined transition is sensed
by the corresponding input capture edge detector. The level transition which triggers
counter transfer is defined by the corresponding input edge bits (EDGxB, EDGxA) in
TCTL2.
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The result obtained by an input capture corresponds to the value of the counter one E
clock cycle after the transition which triggered the edge-detection logic. The selected
edge transition sets the ICxF bit in timer interrupt flag register 1 (TFLG1) and can
cause an interrupt if the corresponding ICxl bit(s) is (are) set in the timer interrupt mask
register 1 (TMSK1). A read of the input capture register’s most significant byte inhibits
captures for one E cycle to allow a double-byte read of the full 16-bit register.
8.1.3 Output Compare
All output compare registers are 16-bit read/write registers which are initialized to
$FFFF by reset. They can be used as output waveform controls or as elapsed time
indicators. If an output compare register is not used, it may be used as a storage location.
Freescale Semiconductor, Inc...
All output compare registers have a separate dedicated comparator for comparing
against the free-running counter. If a match is found, the corresponding output compare flag (OCxF) bit in TFLG1 is set and a specified action is automatically taken. For
output compare functions two through five the automatic action is controlled by pairs
of bits (OMx and OLx) in the timer control register 1 (TCTL1). Each pair of control bits
are encoded to specify the output action to be taken as a result of a successful OCx
compare. The output action is taken on each successful compare regardless of whether or not the OCxF flag was previously clear.
8
An interrupt can also accompany a successful output compare, provided that the corresponding interrupt enable bit (OCxl) is set in TMSK1.
After a write cycle to the most significant byte, output compares are inhibited for one
E cycle in order to allow writing two consecutive bytes before making the next comparison. If both bytes of the register are to be changed, a double-byte write instruction
should be used in order to take advantage of the compare inhibit feature.
Writes can be made to either byte of the output compare register without affecting the
other byte.
A write-only register, timer compare force (CFORC), allows forced compares. Five of
the bit positions in the CFORC register correspond to the five output compares. To
force a compare, or compares, a write is done to CFORC register with the associated
bits set for each output compare that is to be forced. The action taken as a result of a
forced compare is the same as if there was a match between the OCx register and the
free-running counter, except that the corresponding interrupt status flag bits are not
set. Output actions are synchronized to the prescaled timer clock so there could be as
much as 16 E clock cycles of delay between the write to CFORC and the output action.
8.1.4 Output Compare 1 I/O Pin Control
Unlike the other four output compares, output compare 1 can automatically affect any
or all of the five output pins (bits 3-7) in port A as a result of a successful compare between the OC1 register and the 16-bit free-running counter. The two 5-bit registers
used in conjunction with this function are the output compare 1 mask register (OC1M)
and the output compare 1 data register (OC1D).
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Register OC1M is used to specify the bits of port A (I/O and timer port) which are to be
affected as a result of a successful OC1 compare. Register OC1D is used to specify
the data which is to be stored to the affected bits of port A as the result of a successful
OC1 compare. If an OC1 compare and another output compare occur during the same
E cycle and both attempt to alter the same port A line, the OC1 compare prevails.
This function allows control of multiple l/O pins automatically with a single output compare.
Freescale Semiconductor, Inc...
Another intended use for the special l/O pin control on output compare 1 is to allow
more than one output compare to control a single l/O pin. This allows pulses as short
as one E clock cycle to be generated.
8.1.5 Timer Compare Force Register (CFORC)
The timer compare force register is used to force early output compare actions. The
CFORC register is an 8-bit write-only register. Reads of this location have no meaning
and always return logic zeros. Note that the compare force function is not generally
recommended for use with the output toggle function because a normal compare occurring immediately before or after the force may result in undesirable operation.
$100B
RESET
7
FOC1
0
6
FOC2
0
5
FOC3
0
4
FOC4
0
3
FOC5
0
2
0
0
1
0
0
0
0
0
CFORC
FOC1-FOC5 — Force Output Compare x Action
0 = Has no meaning
1 = Causes action programmed for output compare x, except the OCxF flag bit is
not set.
Bits 2-0 — Not Implemented
These bits always read zero.
8.1.6 Output Compare 1 Mask Register (OC1M)
This register is used in conjunction with output compare 1 to specify the bits of port A
which are affected as a result of a successful OC1 compare.
$100C
RESET
7
OC1M7
0
6
OC1M6
0
5
OC1M5
0
4
OC1M4
0
3
OC1M3
0
2
0
0
1
0
0
0
0
0
OC1M
The bits of the OC1M register correspond bit-for-bit with the lines of port A (lines 7
through 3 only). For each bit that is affected by the successful compare, the corresponding bit in OC1M should be set to one.
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Note that the pulse accumulator function shares line 7 of port A. If the DDRA7 bit in
the pulse accumulator control register (PACTL) is set, then port A line 7 is configured
as an output and OC1 can obtain access by setting OC1M bit 7. In this condition if the
PAEN bit in the PACTL register is set, enabling the pulse accumulator input, then OC1
compares cause a write of OC1D bit 7 to an internal latch, and the output of that latch
drives the pin and the pulse accumulator input. This action can then cause the pulse
accumulator to take the appropriate action (pulse count or gate modes).
Freescale Semiconductor, Inc...
8.1.7 Output Compare 1 Data Register (OC1D)
This register is used in conjunction with output compare 1 to specify the data which is
to be stored to the affected bits of port A as the result of a successful OC1 compare.
$100D
RESET
8
7
OC1D7
0
6
OC1D6
0
5
OC1D5
0
4
OC1D4
0
3
OC1D3
0
2
0
0
1
0
0
0
0
0
OC1D
The bits of the OC1D register correspond bit-for-bit with the lines of port A (lines 7 thru
3 only). When a successful OC1 compare occurs, for each bit that is set in OC1M, the
corresponding data bit in OC1D is stored in the corresponding bit of port A. If there is
a conflicting situation where an OC1 compare and another output compare function
occur during the same E cycle with both attempting to alter the same port A line, the
OC1 action prevails.
8.1.8 Timer Control Register 1 (TCTL1)
$1020
RESET
7
OM2
0
6
OL2
0
5
OM3
0
4
OL3
0
3
OM4
0
2
OL4
0
1
OM5
0
0
OL5
0
TCTL1
OM2, OM3, OM4, and OM5 — Output Mode
OL2, OL3, OL4, and OL5 — Output Level
These two control bits (OMx and OLx) are encoded to specify the output action taken
as a result of a successful OCx compare.
OMx
0
0
1
1
OLx
0
1
0
1
Action Taken Upon Successful Compare
Timer disconnected from output pin logic
Toggle OCx output line
Clear OCx output line to zero
Set OCx output line to one
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8.1.9 Timer Control Register 2 (TCTL2)
$1021
RESET
7
0
0
6
0
0
5
EDG1B
0
4
EDG1A
0
3
EDG2B
0
2
EDG2A
0
1
EDG3B
0
0
EDG3A
0
TCTL2
Bits 7-6 — Not Implemented
These bits always read zero.
Freescale Semiconductor, Inc...
EDGxB and EDGxA — Input Capture x Edge Control.
These two bits (EDGxB and EDGxA) are cleared to zero by reset and are encoded to
configure the input sensing logic for input capture x as follows:
EDGxB
0
0
1
1
EDBxA
0
1
0
1
Configuration
Capture disabled
Capture on rising edges only
Capture on falling edges only
Capture on any (rising or falling) edge
8
8.1.10 Timer Interrupt Mask Register 1 (TMSK1)
$1022
RESET
7
OC1I
0
6
OC2I
0
5
OC3I
0
4
OC4I
0
3
OC5I
0
2
IC1I
0
1
IC2I
0
0
IC3I
0
TMSK1
OCxl — Output Compare x Interrupt
If the OCxl enable bit is set when the OCxF flag bit is set, a hardware interrupt sequence is requested.
ICxl — Input Capture x Interrupt
If the ICxl enable bit is set when the ICxF flag bit is set, a hardware interrupt sequence
is requested.
8.1.11 Timer Interrupt Flag Register 1 (TFLG1)
Timer interrupt flag register 1 is used to indicate the occurrence of timer system
events, and together with the TMSK1 register allows the timer subsystem to operate
in a polled or interrupt driven system. For each bit in TFLG1, there is a corresponding
bit in TMSK1 in the same bit position. If the mask bit is set, each time the conditions
for the corresponding flag are met, a hardware interrupt sequence is requested as well
as the flag bit being set.
These timer system status flags are cleared by writing a one to the bit positions corresponding to the flag(s) which are to be cleared. Bit manipulation instructions would be
inappropriate for flag clearing because they are read-modify-write instructions. Even
though the instruction mask implies that the programmer is only interested in some of
the bits in the manipulated location, the entire location is actually read and rewritten
which may clear other bits in the register.
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$1023
RESET
7
OC1F
0
6
OC2F
0
5
OC3F
0
4
OC4F
0
3
OC5F
0
2
IC1F
0
1
IC2F
0
0
IC3F
0
TFLG1
OCxF — Output Compare x Flag
This flag bit is set each time the timer counter matches the output compare register x
value. A write of a zero does not affect this bit. A write of a one causes this bit to be
cleared.
Freescale Semiconductor, Inc...
ICxF — Input Capture x Flag
This flag is set each time a selected active edge is detected on the ICx input line. A
write of a zero does not affect this bit. A write of a one causes this bit to be cleared.
8.1.12 Timer Interrupt Mask Register 2 (TMSK2)
Timer interrupt mask register 2 is used to control whether or not a hardware interrupt
sequence is requested as a result of a status bit being set in timer interrupt flag register
2. In addition, two timer prescaler bits are included in this register. For each of the four
most significant bits in timer flag register 2, (TFLG2), there is a corresponding bit in the
timer mask register 2 (TMSK2) in the same bit position.
8
$1024
RESET
7
TOI
0
6
RTII
0
5
PAOVI
0
4
PAII
0
3
0
0
2
0
0
1
PR1
0
0
PR0
0
TMSK2
TOI — Timer Overflow Interrupt Enable
0 = TOF interrupts disabled
1 = Interrupt requested when TOF = 1
RTII — RTI Interrupt Enable
0 = RTIF interrupts disabled
1 = Interrupt requested when RTIF = 1
PAOVI — Pulse Accumulator Overflow Interrupt Enable
0 = PAOVF interrupts disabled
1 = Interrupt requested when PAOVF = 1
PAII — Pulse Accumulator Input Interrupt Enable
0 = PAIF interrupts disabled
1 = Interrupt requested when PAIF = 1
Bits 3 and 2 — Not Implemented
These bits always read zero.
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PR1 and PR0 — Timer Prescaler Selects
These two bits may be read at any time but may only be written during initialization.
Writes are disabled after the first write or after 64 E cycles out of reset. If the MCU is
in special test or special bootstrap mode, then these two bits may be written any time.
These two bits specify the timer prescaler divide factor.
PR1
0
PR0
0
0
1
1
0
1
1
Prescaler
÷1
÷4
÷8
÷ 16
8.1.13 Timer Interrupt Flag Register 2 (TFLG2)
Timer interrupt flag register 2 is used to indicate the occurrence of timer system events
and, together with the TMSK2 register, allows the timer subsystems to operate in a
polled or interrupt driven system. For each bit in timer flag register 2 (TFLG2), there is
a corresponding bit in timer mask register 2 (TMSK2) in the same bit position. If the
enable bit is set each time the conditions for the corresponding flag are met, a hardware interrupt sequence is requested as well as the flag bit being set.
The timer system status flags are cleared by writing a one to the bit positions corresponding to the flag(s) which are to be cleared. Bit manipulation instructions would be
inappropriate for flag clearing because they are read-modify-write instructions. Even
though the instruction mask implies that the programmer is only interested in some of
the bits in the manipulated location, the entire location is actually read and rewritten
which may clear other bits in the register.
$1025
RESET
7
TOF
0
6
RTIF
0
5
PAOVF
0
4
PAIF
0
3
0
0
2
0
0
1
0
0
0
0
0
TFLG2
TOF — Timer Overflow
This bit is cleared by reset. It is set to one each time the 16-bit free-running counter
advances from a value of $FFFF to $0000. This bit is cleared by a write to the TFLG2
register with bit 7 set.
RTIF — Real Time Interrupt Flag
This bit is set at each rising edge of the selected tap point. This bit is cleared by a write
to the TFLG2 register with bit 6 set.
PAOVF — Pulse Accumulator Overflow Interrupt Flag
This bit is set when the count in the pulse accumulator rolls over from $FF to $00. This
bit is cleared by a write to the TFLG2 register with bit 5 set.
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PAIF — Pulse Accumulator Input Edge Interrupt Flag
This bit is set when an active edge is detected on the PAI input pin. This bit is cleared
by a write to the TFLG2 register with bit 4 set.
Freescale Semiconductor, Inc...
Bits 3-0 — Not Implemented
These bits always read zero.
8
8.2 Real-Time Interrupt
The real-time interrupt feature on the MCU is configured and controlled by using two
bits (RTR1 and RTR0) in the PACTL register to select one of four interrupt rates. The
RTII bit in the TMSK2 register enables the interrupt capability. Every timeout causes
the RTIF bit in TFLG2 to be set, and if RTII is set, an interrupt request is generated.
After reset, one entire real time interrupt period elapses before the RTIF flag is set for
the first time.
8.3 Pulse Accumulator
The pulse accumulator is an 8-bit read/write counter which can operate in either of two
modes (external event counting or gated time accumulation) depending on the state
of the PAMOD control bit in the PACTL register. In the event counting mode, the 8-bit
counter is clocked to increasing values by an external pin. The maximum clocking rate
for the external event counting mode is E clock divided by two. In the gated time accumulation mode, a free-running E clock/64 signal drives the 8-bit counter, but only
while the external PAI input pin is enabled.
The pulse accumulator uses port A bit 7 as its PAI input, but this pin also shares function as a general purpose l/O pin and as a timer output compare pin. Normally port A
bit 7 would be configured as an input when being used for the pulse accumulator. Note
that even when port A bit 7 is configured for output, this pin still drives the input to the
pulse accumulator.
8.3.1 Pulse Accumulator Control Register (PACTL)
Four bits in this register are used to control an 8-bit pulse accumulator system and two
other bits are used to select the rate for the real time interrupt system.
$1026
RESET
7
DDRA7
0
6
PAEN
0
5
PAMOD
0
4
PEDGE
0
3
0
0
2
0
0
1
RTR1
0
0
RTR0
0
PACTL
DDRA7 — Data Direction for Port A Bit 7
0 = Input only
1 = Output
PAEN — Pulse Accumulator System Enable
0 = Pulse accumulator off
1 = Pulse accumulator on
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8-8
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PAMOD — Pulse Accumulator Mode
0 = External event counting
1 = Gated time accumulation
PEDGE — Pulse Accumulator Edge Control
This bit has different meanings depending on the state of the PAMOD bit.
Freescale Semiconductor, Inc...
PAMOD
0
0
1
1
PEDGE
0
1
0
1
Action on Clock
PAI Falling Edge Increments the Counter
PAI Rising Edge Increments the Counter
A zero on PAI Inhibits Counting
A one on PAI Inhibits Counting
Bits 3-2 — Not Implemented
These bits always read zero.
RTR1 and RTR0 — RTI Interrupt Rate Selects
These two bits select one of four rates for the real time periodic interrupt circuit (see
Table 8-1). Reset clears these two bits and after reset, a full RTI period elapses before
the first RTI interrupt.
Table 8-1 Real Time Interrupt Rate versus RTR1 and RTR0
RTR1
RTR0
Rate
XTAL =
12.0 MHz
XTAL =
223
XTAL =
8.0 MHz
XTAL =
4.9152 MHz
XTAL =
4.0 MHz
XTAL =
3.6864 MHz
0
0
213 ÷ E
8.192 ms
3.91 ms
4.10 ms
6.67 ms
8.19 ms
8.89 ms
0
1
214 ÷ E
16.384 ms
7.81 ms
8.19 ms
13.33 ms
16.38 ms
17.78 ms
1
0
215 ÷ E
32.768 ms
15.62 ms
16.38 ms
26.67 ms
32.77 ms
35.56 ms
1
1
216 ÷ E
E=
65.536 ms
31.25 ms
32.77 ms
53.33 ms
65.54 ms
71.11 ms
3.0 MHz
2.1 MHz
2.0 MHz
1.2288 MHz
1.0 MHz
921.6 kHz
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8
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8-10
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9 RESETS, INTERRUPTS, AND LOW POWER MODES
Freescale Semiconductor, Inc...
This section provides a description of the resets, interrupts, and low power modes. The
computer operating properly (COP) watchdog system and clock monitor are described
as part of the reset system. The interrupt description includes a flowchart to illustrate
how interrupts are executed.
9.1 Resets
The MCU has four possible types of reset: an active low external reset pin (RESET),
a power-on reset, a computer operating properly (COP) watchdog timer reset, and a
clock monitor reset.
9.1.1 External RESET Pin
The RESET pin is used to reset the MCU and allow an orderly software start-up procedure. When a reset condition is sensed, this pin is driven low by an internal device
for four E clock cycles, then released, and two E clock cycles later it is sampled. If the
pin is still low, it means that an external reset has occurred. If the pin is high, it implies
that the reset was initiated internally by either the watchdog timer (COP) or the clock
monitor (refer to Figure 9-1). This method of differentiation between internal and external reset conditions assumes that the reset pin will rise to a logic one in less than
two E clock cycles once it is released and that an externally generated reset should
stay active for at least eight E clock cycles.
Since there is EEPROM on chip, it is very important to control reset during power transitions. If the reset line is not held low while VDD is below its minimum operating level,
the EEPROM contents could be corrupted. Corruption occurs due to improper instruction execution when there is not sufficient voltage to execute instructions correctly.
Both EEPROM memories and the EEPROM based CONFIG register are subject to
this potential problem.
A low voltage inhibit (LVI) circuit which holds reset low whenever VDD is below its minimum operating level is required to protect against EEPROM corruption. Figure 9-2
shows an example of reset circuits with LVI capabilities. The best circuit for a particular
application may be different from the suggested circuit.
9.1.2 Power-On Reset
The power-on reset occurs when a positive transition is detected on VDD. The poweron reset is used strictly for power turn-on conditions and should not be used to detect
any drops in power
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EXTERNAL RESET CASE
VECTOR
FETCH
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFF
E
RESET
PIN
1
ENABLE RESET PIN
PULL-DOWN
(INTERNAL SIGNAL)
COP WATCHDOG RESET CASE
VECTOR
FETCH
Freescale Semiconductor, Inc...
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFA
FFFB
E
1
RESET
PIN
9
CLOCK MONITOR RESET CASE
VECTOR
FETCH
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFE
FFFC FFFD
E
1
RESET
PIN
1 RESET PIN SAMPLED AT THIS TIME. LOW LEVEL INDICATES EXTERNAL RESET. HIGH LEVEL INDICATES CLOCK MONITOR OR COP SYSTEM RESET.
Figure 9-1 Reset Timing
supply voltage. The power-on circuitry provides a 4064 cycle time delay from the time
of the first oscillator operation. In a system where E = 2 MHz, power on reset lasts
about 2 milliseconds. If the external RESET pin is low at the end of the power-on delay
time, the MCU remains in the reset condition until the RESET pin goes high.
9.1.2.1 CPU
After reset the CPU fetches the restart vector from locations $FFFE and $FFFF
($BFFE and $BFFF if in special bootstrap or special test operating mode) during the
first three cycles, and begins executing instructions. The stack pointer and other CPU
registers are indeterminate immediately after reset; however, the X and I interrupt
mask bits in the condition code register are set to mask any interrupt requests. Also,
the S bit in the condition code register is set to disable the STOP mode.
RESETS, INTERRUPTS, AND LOW POWER MODES
9-2
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VDD
VDD
4.7K
MOTOROLA
MC34064
TO RESET OF 68HC11
(AND OTHER SYSTEM DEVICES)
Freescale Semiconductor, Inc...
Figure 9-2 Simple LVI Reset Circuit
9.1.2.2 Memory Map
After reset, the INIT register is initialized to $01, putting the 256 bytes of RAM at locations $0000 through $00FF and the control registers at locations $1000 through
$103F. The 8K-byte ROM and/or the 512-byte EEPROM may or may not be present
in the memory map because the two bits that enable them in the CONFIG register are
EEPROM cells and are not affected by reset or power down.
9.1.2.3 Parallel l/O
When a reset occurs in expanded multiplexed operating mode, the 18 pins used for
parallel l/O are dedicated to the expansion bus. If a reset occurs in the single-chip operating mode, the STAF, STAI, and HNDS bits in the parallel input/output control register (PIOC) are cleared so that no interrupt is pending or enabled, and the simple
strobed mode (rather than full handshake mode) of parallel l/O is selected. The CWOM
bit in PIOC is cleared so port C is not in wired-OR mode. Port C is initialized as an input
port (DDRC = $00), port B is a general purpose output port with all bits cleared. STRA
is the edge-sensitive strobe A input and the active edge is initially configured to detect
rising edges (EGA bit in the PIOC set), and STRB is the strobe B output and is initially
a logic zero (the INVB bit in the PIOC is set). Port C, port D bits 0 through 5, port A bits
0, 1, 2, and 7, and port E are configured as general purpose high-impedance inputs.
Port B and bits 3 through 6 of port A have their directions fixed as outputs and their
reset state is a logic zero.
9.1.2.4 Timer
During reset, the timer system is initialized to a count of $0000. The prescaler bits are
cleared, and all output compare registers are initialized to $FFFF. All input capture registers are indeterminate after reset. The output compare 1 mask (OC1M) register is
cleared so that successful OC1 compares do not affect any l/O pins. The other four
output compares are configured to not affect any l/O pins on successful compares. All
three input capture edge-detector circuits are configured for “capture disabled” operation. The timer overflow interrupt flag and all eight timer function interrupt flags are
cleared. All nine timer interrupts are disabled since their mask bits are cleared.
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9.1.2.5 Real-Time Interrupt
The real time interrupt flag is cleared and automatic hardware interrupts are masked.
The rate control bits are cleared after reset and may be initialized by software before
the real time interrupt system is used.
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9.1.2.6 Pulse Accumulator
The pulse accumulator system is disabled at reset so that the PAI input pin defaults to
being a general purpose input pin.
9.1.2.7 COP
The COP watchdog system is enabled if the NOCOP control bit in the system configuration control register (EEPROM cell) is clear, and disabled if NOCOP is set. The
COP rate is set for the shortest duration timeout.
9.1.2.8 SCI Serial l/O
9
The reset condition of the SCI system is independent of the operating mode. At reset,
the SCI baud rate is indeterminate and must be established by a software write to the
BAUD register. All transmit and receive interrupts are masked and both the transmitter
and receiver are disabled so the port pins default to being general purpose l/O lines.
The SCI frame format is initialized to an 8-bit character size. The send break and receiver wake up functions are disabled. The TDRE and TC status bits in the SCI status
register are both set, indicating that there is no transmit data in either the transmit data
register or the transmit serial shift register. The RDRF, IDLE, OR, NF, and FE receiverelated status bits are all cleared.
Note that upon reset in special bootstrap mode execution begins in the 192 byte boot
ROM. This firmware sets port D to wire-OR mode, establishes a baud rate, and enables the SCI receiver and transmitter.
9.1.2.9 SPI Serial l/O
The SPI system is disabled by reset. The port pins associated with this function default
to being general purpose l/O lines.
9.1.2.10 A/D Converter
The A/D converter system configuration is indeterminate after reset. The conversion
complete flag is cleared by reset. The ADPU bit is cleared by reset thus disabling the
A/D system.
9.1.2.11 System
The EEPROM programming controls are all disabled so the memory system is configured for normal read operation. The highest priority I interrupt defaults to being the external IRQ pin by PSEL[3:0] equal to 0:1:0:1. The IRQ interrupt pin is configured for
level sensitive operation (for wire-OR systems). The RBOOT, SMOD, and MDA bits in
the HPRIO register reflect the status of the MODB and MODA inputs at the rising edge
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of reset. The DLY control bit is set to specify that an oscillator start-up delay is imposed
upon recovery from STOP mode. The clock monitor system is disabled by CME equal
zero.
9.1.3 Computer Operating Properly (COP) Reset
The MCU includes a computer operating properly watchdog system to help protect
against software failures. To use a COP watchdog timer, a watchdog timer reset sequence must be executed on a regular periodic basis so that the watchdog timer is
never allowed to time out.
Freescale Semiconductor, Inc...
The internal COP function includes special control bits which permit specification of
one of four time out periods and even allows the function to be disabled completely.
The COP system has a separate reset vector.
The NOCOP control bit, which determines whether or not a watchdog timeout causes
a system reset, is implemented in an EEPROM cell in the CONFIG register. Once programmed, this bit remains set (or cleared) even when no power is applied, and the
COP function is enabled or disabled independent of resident software. The NOCOP
control bit may be preempted while in special modes to prevent the COP system from
causing a hardware reset.
Two other control bits in the OPTION register select one of four timeout durations for
the COP timer. The actual timeout period is dependent on the system E clock frequency, but for reference purposes, Table 9-1 shows the relationship between the CR1 and
CR0 control bits and the COP timeout period for various system clock frequencies.
Table 9-1 COP Timeout Period versus CR1 and CR0
CR1 CR0
Rate
XTAL = 12.0
MHz Timeout
–0/+10.9 ms
XTAL = 223
Timeout
– 0/+15.6 ms
XTAL = 8.0 MHz XTAL = 4.9152 XTAL = 4.0 MHz XTAL = 3.6864
MHz Timeout
MHz Timeout
Timeout
Timeout
– 0/+35.6 ms
–
0/+26.7
ms
– 0/+32.8 ms
– 0/+16.4 ms
0
0
215 ÷ E
10.923 ms
15.625 ms
0
1
217 ÷ E
43.691 ms
62.5 ms
65.536 ms
106.67 ms
131.07 ms
142.22 ms
1
0
219
÷E
174.76 ms
250 ms
262.14 ms
426.67 ms
524.29 ms
568.89 ms
1
1
221 ÷ E
E=
699.05 ms
1s
1.049 s
1.707 s
2.1 s
2.276 s
3.0 MHz
2.1 MHz
2.0 MHz
1.2288 MHz
1.0 MHz
921.6 kHz
16.384 ms
26.667 ms
32.768 ms
35.556 ms
The default reset condition of the CR1 and CR0 bits is cleared which corresponds to
the shortest timeout period.
The sequence required to reset the watchdog timer is:
1. Write $55 to the COP reset register (COPRST) at $103A, followed by
2. Write $AA to the same address.
Both writes must occur in correct order prior to timeout but, any number of instructions
may be executed between the writes. The elapsed time between adjacent software reset sequences must never be greater than the COP time out period. Reading the COPRST register does not return meaningful data and does not affect the watchdog
timer.
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9.1.4 Clock Monitor Reset
The clock monitor function is enabled by the CME control bit in the OPTION register.
When CME is clear, the monitor function is disabled. When the CME bit is set, the
clock monitor function detects the absence of an E clock for more than a certain period
of time. The timeout period is dependent on processing parameters and will be between 5 and 100 microseconds. This means that an E-clock rate of 200 kHz or more
will never cause a clock monitor failure and an E-clock rate of 10 kHz or less will definitely cause a clock monitor failure. This implies that systems operating near or below
an E-clock rate of 200 kHz should not use the clock monitor function.
Freescale Semiconductor, Inc...
Upon detection of a slow or absent clock, the clock monitor circuit will cause a system
reset. This reset is issued to the external system via the bidirectional RESET pin. The
clock monitor system has a separate reset vector.
Special considerations are needed when using a STOP function and clock monitor in
the same system. Since the STOP function causes the clocks to be halted, the clock
monitor function will generate a reset sequence if it is enabled at the time the STOP
mode is entered.
9
The clock monitor is useful as a backup for the COP watchdog timer. Since the watchdog timer requires a clock to function, it will not indicate any failure if the system clocks
fail. The clock monitor would detect such a failure and force the MCU to its reset state.
Note that clocks are not required for the MCU to reach its reset configuration, although
clocks are required to sequence through reset back to the run condition.
9.1.5 Configuration Options Register (OPTION)
This is a special purpose 8-bit register that is used (optionally) during initialization to
configure internal system configuration options. With the exception of bits 7, 6, and 3
(ADPU, CSEL, and CME) which may be read or written at any time, this register may
be written to only once after a reset and thereafter is a read-only register. If no write is
performed to this location within 64 E-clock cycles after reset, then bits 5, 4, 1, and 0
(IRQE, DLY, CR1, and CR0) will become read-only to minimize the possibility of any
accidental changes to the system configuration (writes will be ignored). While in special test modes, the protection mechanism on this register is preempted and all bits in
the OPTION register may be written repeatedly.
$1039
RESET
7
ADPU
0
6
CSEL
0
5
IRQE
0
4
DLY
1
3
CME
0
2
0
0
1
CR1
0
0
CR0
0
OPTION
ADPU — A/D Power-up
This bit controls operations of the on-chip analog-to-digital converter. When ADPU is
clear, the A/D system is powered down and conversion requests will not return meaningful information. To use the A/D system, this bit should be set. A 100 microsecond
delay is required after ADPU is turned on to allow the A/D system to stabilize.
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CSEL — A/D/EE Charge Pump Clock Source Select
This bit determines the clocking source for the on-chip A/D and EEPROM charge
pump. When this bit is zero, the MCU E clock drives the A/D system and the EEPROM
charge pump. When CSEL is one, on-chip separate R-C oscillators are enabled and
clock the systems at about 2 MHz. When running with an E clock below 1 MHz, CSEL
must be high to program or erase EEPROM. When operating below 750 kHz E clock
rate, CSEL should be high for A/D conversions. A delay of 10 milliseconds is required
after CSEL is turned on to allow the A/D system to stabilize.
IRQE — IRQ Edge/Level Sensitive
This bit may only be written under special circumstances as described above. When
this bit is clear, the IRQ pin is configured for level sensitive wired-OR operation (low
level) and when it is set, the IRQ pin is configured for edge-only sensitivity (falling edges).
DLY — STOP Exit Turn-On Delay
This bit may only be written under special circumstances as described above. This bit
is set during reset and controls whether or not a relatively long turn-on delay will be
imposed before processing can resume after a STOP period. If an external clock
source is supplied this delay can be inhibited so that processing can resume within a
few cycles of a wake up from STOP mode. When DLY is set, a 4064 E clock cycle delay is imposed to allow oscillator stabilization and when DLY is clear, this delay is bypassed.
CME — Clock Monitor Enable
This control bit may be read or written at any time and controls whether or not the internal clock monitor circuit will trigger a reset sequence when a slow or absent system
clock is detected. When it is clear, the clock monitor circuit is disabled and when it is
set, the clock monitor circuit is enabled. Systems operating at or below 200 kHz should
not use the clock monitor function. Reset clears the CME bit.
Bit 2 — Not Implemented
This bit always reads zero.
CR1 and CR0 — COP Timer Rate Selects
These bits may only be written under special circumstances as described above. Refer to Table 9-1 for the relationship between CR1:CR0 and the COP timeout period.
9.2 Interrupts
When an external or internal (hardware) interrupt occurs, the interrupt is not serviced
until the current instruction being executed is completed. Until the current instruction
is complete, the interrupt is considered pending. After completion of current instruction
execution, unmasked interrupts may be serviced in accordance with an established
fixed hardware priority circuit; however, one l-bit related interrupt source may be dynamically elevated to the highest I bit priority position in the hierarchy (see 9.2.5 Highest Priority I Interrupt Register (HPRIO)).
Seventeen hardware interrupts and one software interrupt (excluding reset type interrupts) can be generated from all of the possible sources. The interrupts can be divided
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into two basic categories, maskable and non-maskable. In the MC68HC11A8 fifteen
of the interrupts can be masked using the condition code register I bit. In addition to
being maskable by the I bit in the condition code register, all of the on-chip interrupt
sources are individually maskable by local control bits.
Table 9-2 IRQ Vector Interrupts
Interrupt Cause
External Pin
Parallel l/O Handshake
Local Mask
None
STAI
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The software interrupt (SWI instruction) is a non-maskable instruction rather than a
maskable interrupt source. The illegal opcode interrupt is a non-maskable interrupt.
The last interrupt source, external input to the XIRQ pin, is considered a non-maskable
interrupt because once enabled, it cannot be masked by software; however, it is
masked during reset and upon receipt of an interrupt at the XIRQ pin. Table 9-2, Table
9-3, and Table 9-4 provide a list of each interrupt, its vector location in memory, and
the actual condition code and control bits that mask it. A discussion of the various interrupts is provided below. Figure 9-3 shows the interrupt stacking order.
9
Table 9-3 Interrupt Vector Assignments
Vector
Address
FFC0, C1
•
•
FFD4, D5
FFD6, D7
FFD8, D9
FFDA, DB
FFDC, DD
FFDE, DF
FFE0, E1
FFE2, E3
FFE4, E5
FFE6, E7
FFE8, E9
FFEA, EB
FFEC, ED
FFEE, EF
FFF0, F1
FFF2, F3
FFF4, F5
FFF6, F7
FFF8, F9
FFFA, FB
FFFC, FD
FFFE, FF
Interrupt Source
Reserved
•
•
Reserved
SCI Serial System
SPI Serial Transfer Complete
Pulse Accumulator Input Edge
Pulse Accumulator Overflow
Timer Overflow
Timer Output Compare 5
Timer Output Compare 4
Timer Output Compare 3
Timer Output Compare 2
Timer Output Compare 1
Timer Input Capture 3
Timer Input Capture 2
Timer Input Capture 1
Real Time Interrupt
IRQ (External Pin or Parallel l/O)
XIRQ Pin (Pseudo Non-Maskable Interrupt)
SWI
Illegal Opcode Trap
COP Failure (Reset)
COP Clock Monitor Fail (Reset)
RESET
CC
Register Mask
—
Local Mask
—
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
I Bit
X Bit
None
None
None
None
None
—
See Table 9-3
SPIE
PAII
PAOVI
TOI
OC5I
OC4I
OC3I
OC2I
OC1I
OC3I
OC2I
OC1I
RTII
See Table 9-4
None
None
None
NOCOP
CME
None
RESETS, INTERRUPTS, AND LOW POWER MODES
9-8
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Table 9-4 SCI Serial System Interrupts
Freescale Semiconductor, Inc...
Interrupt Cause
Receive Data Register Full
Receiver Overrun
Idle Line Detect
Transmit Data Register Empty
Transmit Complete
Local Mask
RIE
RIE
ILIE
TIE
TCIE
9.2.1 Software Interrupt (SWI)
The software interrupt is executed in the same manner as any other instruction and
will take precedence over interrupts only if the other interrupts are masked (I and X bits
in the condition code register set). The SWI instruction is executed in a manner similar
to other maskable interrupts in that it sets the I bit, CPU registers are stacked, etc.
NOTE
The SWI instruction will not be fetched if an interrupt is pending.
However, once an SWI instruction has begun, no interrupt can be
honored until the SWI vector has been fetched.
7
SP
SP–1
SP–2
SP–3
SP–4
SP–5
SP–6
SP–7
SP–8
SP–9
0
PCL
PCH
IYL
IYH
IXL
IXH
ACCA
ACCB
CCR
— SP BEFORE INTERRUPT
— SP AFTER INTERRUPT
Figure 9-3 Interrupt Stacking Order
9.2.2 Illegal Opcode Trap
Since not all possible opcodes or opcode sequences are defined, an illegal opcode detection circuit has been included. When an illegal opcode is detected, an interrupt is
requested to the illegal opcode vector. The illegal opcode vector should never be left
uninitialized. It is a good idea to reinitialize the stack pointer as a result of an illegal
opcode interrupt so repeated execution of illegal opcodes does not cause stack overruns.
9.2.3 Interrupt Mask Bits in Condition Code Register
Upon reset, both the X bit and the I bit are set to inhibit all maskable interrupts and
XIRQ. After minimum system initialization, software may clear the X bit by a TAP instruction, thus enabling XIRQ interrupts. Thereafter software cannot set the X bit so
an XIRQ interrupt is effectively a nonmaskable interrupt. Since the operation of the I
RESETS, INTERRUPTS, AND LOW POWER MODES
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bit related interrupt structure has no effect on the X bit, the external XIRQ pin remains
effectively non-masked. In the interrupt priority logic, the XIRQ interrupt is a higher priority than any source that is maskable by the I bit. All I bit related interrupts operate
normally with their own priority relationship. When an I bit related interrupt occurs, the
I bit is automatically set by hardware after stacking the condition code register byte,
but the X bit is not affected. When an X bit related interrupt occurs, both the X bit and
the I bit are automatically set by hardware after stacking the condition code register.
An RTI (return from interrupt) instruction restores the X and I bits to their pre-interrupt
request state.
9
9.2.4 Priority Structure
Interrupts obey a fixed hardware priority circuit to resolve simultaneous requests; however, one I bit related interrupt source may be elevated to the highest I bit priority position in the resolution circuit. The first six interrupt sources are not masked by the I bit
in the condition code register and have the fixed priority interrupt relationship of: reset,
clock monitor fail, COP fail, illegal opcode, and XIRQ. (SWI is actually an instruction
and has highest priority other than reset in the sense that once the SWI opcode is
fetched, no other interrupt can be honored until the SWI vector has been fetched).
Each of these sources is an input to the priority resolution circuit. The highest I bit
masked priority input to the resolution circuit is assigned under software control (of the
HPRIO register) to be connected to any one of the remaining I bit related interrupt
sources. In order to avoid timing races, the HPRIO register may only be written while
the I bit related interrupts are inhibited (I bit in condition code register is a logic one).
An interrupt that is assigned to this high priority position is still subject to masking by
any associated control bits or the I bit in the condition code register. The interrupt vector address is not affected by assigning a source to this higher priority position.
Figure 9-4, Figure 9-5, and Figure 9-6 illustrate the interrupt process as it relates to
normal processing. Figure 9-4 shows how the CPU begins from a reset and how interrupt detection relates to normal opcode fetches. Figure 9-5 is an expansion of a
block in Figure 9-4 and shows how interrupt priority is resolved. Figure 9-6 is an expansion of the SCI interrupt block in Figure 9-5. Figure 9-6 shows the resolution of
interrupt sources within the SCI subsystem.
9.2.5 Highest Priority I Interrupt Register (HPRIO)
This register is used to select one of the I bit related interrupt sources to be elevated
to the highest I bit masked position in the priority resolution circuit. In addition, four miscellaneous system control bits are included in this register.
$103C
RESET
7
RBOOT
—
6
SMOD
—
5
MDA
—
4
IRV
—
3
PSEL3
0
2
PSEL2
1
1
PSEL1
0
0
PSEL0
1
HPRIO
RBOOT — Read Bootstrap ROM
The read bootstrap ROM bit only has meaning when the SMOD bit is a one (special
bootstrap mode or special test mode). At all other times, this bit is clear and may not
be written.
RESETS, INTERRUPTS, AND LOW POWER MODES
9-10
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When set, upon reset in bootstrap mode only, the small bootstrap loader program is
enabled. When clear, by reset in the other three modes, this ROM is disabled and accesses to this area are treated as external accesses.
Freescale Semiconductor, Inc...
SMOD — Special Mode
The special mode bit reflects the inverse of the MODB input pin at the rising edge of
reset. It is set if the MODB pin is low during reset. If MODB is high during reset, it is
cleared. This bit may be cleared under software control from the special modes, thus,
changing the operating mode of the MCU, but may never be set by software.
MDA — Mode Select A
The mode select A bit reflects the status of the MODA input pin at the rising edge of
reset. While the SMOD bit is set (special bootstrap or special test mode in effect) the
MDA bit may be written, thus, changing the operating mode, of the MCU. When the
SMOD bit is clear, the MDA bit is a read-only bit and the operating mode cannot be
changed without going through a reset sequence.
Table 9-5 summarizes the relationship between the SMOD and MDA bits and the
MODB and MODA input pins at the rising edge of reset.
Table 9-5 Mode Bits Relationship
Inputs
MODB MODA
1
0
1
1
0
0
0
1
1 = Logic High
Mode Description
Single Chip
Expanded Multiplexed
Special Bootstrap
Special Test
0 = Logic Low
Latched at Reset
SMOD
MDA
0
0
0
1
1
0
1
1
IRV — Internal Read Visibility
The internal read visibility bit is used in the special modes (SMOD = 1) to affect visibility of internal reads on the expansion data bus. IRV is writeable only if SMOD = 1 and
returns to zero if SMOD = 0. If IRV is clear, visibility of internal reads is blocked. If the
bit is set, internal reads are visible on the external bus.
PSEL3, PSEL2, PSEL1, and PSEL0 — Priority Select
These four priority select bits are used to specify one I bit related interrupt source
which becomes the highest priority I bit related source (Table 9-6). These bits may be
written only while the I bit in CCR = 1 (interrupts masked).
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HIGHEST
PRIORITY
POWER-ON RESET
(POR)
DELAY 4064 E CYCLES
EXTERNAL RESET
CLOCK MONITOR FAIL
(WITH CME = 1)
Freescale Semiconductor, Inc...
LOWEST
PRIORITY
COP WATCHDOG
TIMEOUT
(WITH NOCOP = 0)
9
LOAD PROGRAM COUNTER
WITH CONTENTS OF
$FFFE, $FFFF
(VECTOR FETCH)
LOAD PROGRAM COUNTER
WITH CONTENTS OF
$FFFC, $FFFD
(VECTOR FETCH)
LOAD PROGRAM COUNTER
WITH CONTENTS OF
$FFFA, $FFFB
(VECTOR FETCH)
SET BITS S, I, AND X
RESET MCU
HARDWARE
1A
BEGIN INSTRUCTION
SEQUENCE
Y
BIT X IN
CCR = 1?
N
XIRQ
PIN LOW?
N
2A
Y
STACK CPU
REGISTERS
SET BITS I AND X
FETCH VECTOR
$FFF4, $FFF5
Figure 9-4 Processing Flow Out of Resets (Sheet 1 of 2)
RESETS, INTERRUPTS, AND LOW POWER MODES
9-12
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2A
Y
BIT I IN
CCR = 1?
N
ANY I-BIT
INTERRUPT
PENDING?
Y
STACK CPU
REGISTERS
N
Freescale Semiconductor, Inc...
FETCH OPCODE
Y
STACK CPU
REGISTERS
ILLEGAL
OPCODE?
SET BIT I IN CCR
N
FETCH VECTOR
$FFF8, $FFF9
WAI
Y
INSTRUCTION?
9
STACK CPU
REGISTERS
N
Y
STACK CPU
REGISTERS
SWI
INSTRUCTION?
N
SET BIT I IN CCR
FETCH VECTOR
$FFF6, $FFF7
Y
RESTORE CPU
REGISTERS
FROM STACK
RTI
INSTRUCTION?
N
EXECUTE THIS
INSTRUCTION
N
ANY
INTERRUPT
PENDING?
Y
SET BIT I IN CCR
RESOLVE INTERRUPT
PRIORITY AND FETCH
VECTOR FOR HIGHEST
PENDING SOURCE
SEE FIGURE 9–5
1A
Figure 9-4 Processing Flow Out of Resets (Sheet 2 of 2)
RESETS, INTERRUPTS, AND LOW POWER MODES
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Freescale Semiconductor, Inc.
BEGIN
BIT X IN
CCR = 1?
N
XIRQ
PIN LOW?
Y
FETCH VECTOR
$FFF4, $FFF5
N
Y
HIGHEST
PRIORITY
INT?
SET BIT X IN CCR
Y
FETCH APPROPRIATE
VECTOR
N
Y
Freescale Semiconductor, Inc...
IRQ?
N
EXTERNAL
PIN?
Y
N
STAF
AND STAI = 1?
9
Y
FETCH VECTOR
$FFF2, $FFF3
Y
FETCH VECTOR
$FFF0, $FFF1
Y
FETCH VECTOR
$FFEE, $FFEF
Y
FETCH VECTOR
$FFEC, $FFED
Y
FETCH VECTOR
$FFEA, $FFEB
Y
FETCH VECTOR
$FFE8, $FFE9
N
Y
RTII = 1?
N
N
IC1I = 1?
Y
FLAG
IC1F = 1
N
N
Y
IC2I = 1?
FLAG
IC2F = 1?
N
N
Y
IC3I = 1?
FLAG
IC3F = 1?
N
N
OC1I = 1?
N
REAL-TIME
INTERRUPT?
Y
FLAG
OC1F = 1?
N
2A
2B
Figure 9-5 Interrupt Priority Resolution (Sheet 1 of 2)
RESETS, INTERRUPTS, AND LOW POWER MODES
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2A
2B
Y
OC2I = 1?
OC3I = 1?
Y
FETCH VECTOR
$FFE6, $FFE7
FLAG
OC3F = 1
Y
FETCH VECTOR
$FFE4, $FFE5
Y
FETCH VECTOR
$FFE2, $FFE3
Y
FETCH VECTOR
$FFE0, $FFE1
Y
FETCH VECTOR
$FFDE, $FFDF
Y
FETCH VECTOR
$FFDC, $FFDD
Y
FETCH VECTOR
$FFDA, $FFDB
Y
FETCH VECTOR
$FFD8, $FFD9
N
N
OC4I = 1?
Freescale Semiconductor, Inc...
Y
N
N
Y
FLAG
OC4F = 1?
N
N
OC5I = 1?
Y
FLAG
OC5F = 1?
9
N
N
Y
TOI = 1?
FLAG
TOF = 1?
N
N
PAOVI = 1?
Y
FLAG
PAOVF = 1
N
N
Y
PAII = 1?
FLAG
PAIF = 1?
N
N
SPIE = 1?
Y
FLAGS
SPIF = 1? OR
MODF = 1?
N
N
SCI
INTERRUPT?
SEE FIGURE
9–6
N
FLAG
OC2F = 1?
Y
FETCH VECTOR
$FFD6, $FFD7
FETCH VECTOR
$FFF2, $FFF3
END
Figure 9-5 Interrupt Priority Resolution (Sheet 2 of 2)
RESETS, INTERRUPTS, AND LOW POWER MODES
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BEGIN
FLAG
RDRF = 1?
Y
N
Y
OR = 1?
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Y
N
N
TDRE = 1?
9
RIE = 1?
Y
TIE = 1?
Y
TE = 1?
Y
N
Y
TC = 1?
Y
N
N
N
RE = 1?
TCIE = 1?
N
Y
N
IDLE = 1?
Y
Y
ILIE = 1?
N
N
RE = 1?
Y
N
NO
VALID SCI REQUEST
VALID SCI REQUEST
Figure 9-6 Interrupt Source Resolution Within SCI
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Table 9-6 Highest Priority I Interrupt versus PSEL[3:0]
PSEL3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
PSEL2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
PSEL1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
PSEL0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Interrupt Source Promoted
Timer Overflow
Pulse Accumulator Overflow
Pulse Accumulator Input Edge
SPI Serial Transfer Complete
SCI Serial System
Reserved (Default to IRQ)
IRQ (External Pin or Parallel l/O)
Real Time Interrupt
Timer Input Capture 1
Timer Input Capture 2
Timer Input Capture 3
Timer Output Compare 1
Timer Output Compare 2
Timer Output Compare 3
Timer Output Compare 4
Timer Output Compare 5
NOTE:
During reset, PSEL3, PSEL2, PSEL1, and PSEL0 are initialized to 0:1:0:1 which corresponds to “Reserved (default to IRQ)” being the highest priority I-bit-related interrupt source.
9.3 Low-Power Modes
The MCU contains two programmable low power consumption modes; WAIT and
STOP. These two instructions are discussed below. Table 9-7 summarizes the activity
on all pins of the MCU for all operating conditions.
9.3.1 WAIT Instruction
The WAI instruction puts the MCU in a low power consumption mode, keeping the oscillator running. Upon execution of a WAI instruction, the machine state is stacked and
program execution stops. The wait state can be exited only by an unmasked interrupt
or RESET. If the I bit is set (interrupts masked) and the COP is disabled, the timer system will be turned off to additionally reduce power consumption. The amount of power
savings is application dependent and depends upon circuitry connected to the MCU
pins as well as which subsystems (i.e., timer, SPI, SCI) are active when the WAIT
mode is entered. Turning off the A/D subsystem by clearing ADPU further reduces
WAIT mode current.
9.3.2 STOP Instruction
The STOP instruction places the MCU in its lowest power consumption mode provided
the S bit in the condition code register is clear. If the S bit is set, the STOP mode is
disabled and STOP instructions are treated as NOPs (no operation). In the STOP
mode, all clocks including the internal oscillator are stopped causing all internal processing to be halted. Recovery from the STOP mode may be accomplished by RESET, XIRQ, or an unmasked IRQ. When the XIRQ is used, the MCU exits from the
STOP mode regardless of the state of the X bit in the condition code register; however,
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the actual recovery sequence differs depending on the state of the X bit. If the X bit is
clear, the MCU starts up with the stacking sequence leading to normal service of the
XIRQ request. If the X bit is set, then processing will continue with the instruction immediately following the STOP instruction and no XIRQ interrupt service routine is requested. A reset will always result in an exit from the STOP mode, and the start of
MCU operation is determined by the reset vector.
Table 9-7 Pin State Summary for RESET, STOP, and WAIT
Pins
Single Chip Modes
RESET
WAIT
STOP
RESET
Active E
Active
0
0
0
Active E
Active
SS
SS
SS
0
1
SS
SS
SS
Active E
Active
1
0
Hl ADD
Active E
Active
1
SS
Hl ADD
0
1
1
SS
Hl ADD
I (0)
I (0)
I (MODB)
I
OD (1)
l (VSTBY)
I
OD (1)
l (VSTBY)
I (0)
I (1)
I (MODES)
I
OD (1)
l (VSTBY)
I
OD (1)
l (VSTBY)
STRA/AS
PA7
PC0-PC7
PD0-PD5
Input Only
EXTAL
IRQ
I (STRA)
I
I
I
I (STRA)
I/O
I/O
I/O
I (STRA)
I/O
I/O
I/O
Active AS
Active AS
I
l/O
ADD/DATA SP-8/DATA
I
I/O
XIRQ
Terminate Unused Inputs to VDD
PA0-PA2
Terminate Unused Inputs to VDD or VSS
PE0-PE7
VRH-VRL
If Not Used, External Drive Not Required
If Not Used, External Drive Not Required
Freescale Semiconductor, Inc...
Output Only
E
XTAL!!!
STRB/RW
PA3-PA6
PB0-PB7
Input/Output
RESET
MODA/LIR
MODB/VSTBY
9
Expanded Modes
WAIT
STOP
0
I/O
LO ADD
I/O
Input Clock or Connect to Crystal with XTAL
Terminate Unused Inputs to VDD
SYMBOLS:
DATA
=Current data present.
I
=Input pin, if ( ) associated then this is required input state.
l/O
=Input/output pin, state determined by data direction register.
Hl ADD
=High byte of the address.
LO ADD =Low byte of the address.
ADD/DATA =Low byte of the address multiplexed with data.
OD
=Open drain output, ( ) current output state.
SS
=Steady state, output pin stays in current state.
SP-8
=Address output during WAI period following WAI instruction, stack pointer value, at time of WAI, minus 8.
!!!
=XTAL is output but not normally usable for any output function beyond
crystal drive.
Since the oscillator is stopped in the STOP mode, a restart delay of 4064 clock cycle
times may be required to allow oscillator stabilization. If the internal oscillator is being
used, this delay is required; however, if a stable external oscillator is being used, a
control bit in the OPTION register may be used (DLY = 0) to give a delay of four cycles.
RESETS, INTERRUPTS, AND LOW POWER MODES
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10 CPU, ADDRESSING MODES, AND INSTRUCTION SET
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This section provides a description of the CPU registers, addressing modes, and a
summary of the M68HC11 instruction set. Special operations such as subroutine calls
and interrupts are described and cycle-by-cycle operations for all instructions are presented.
10.1 CPU Registers
In addition to being able to execute all M6800 and M6801 instructions, the
MC68HC11A8 uses a 4-page opcode map to allow execution of 91 new opcodes (see
10.2.7 Prebyte). Seven registers, discussed in the following paragraphs, are available
to programmers as shown in Figure 10-1.
10.1.1 Accumulators A and B
Accumulator A and accumulator B are general-purpose 8-bit registers used to hold
operands and results of arithmetic calculations or data manipulations. These two accumulators can be concatenated into a single 16-bit accumulator called the D accumulator.
10.1.2 Index Register X (IX)
The 16-bit IX register is used for indexed mode addressing. It provides a 16-bit indexing value which is added to an 8-bit offset provided in an instruction to create an effective address. The IX register can also be used as a counter or as a temporary storage
register.
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10
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7
15
A
0
7
B
0
0
D
8-BIT ACCUMULATORS A & B
OR 16-BIT DOUBLE ACCUMULATOR D
IX
INDEX REGISTER X
IY
INDEX REGISTER Y
SP
STACK POINTER
PC
PROGRAM COUNTER
7
S
0
X
H
I
N
Z
V
C
CONDITION CODES
CARRY/BORROW FROM MSB
Freescale Semiconductor, Inc...
OVERFLOW
ZERO
NEGATIVE
I-INTERRUPT MASK
10
HALF CARRY (FROM BIT 3)
X-INTERRUPT MASK
STOP DISABLE
Figure 10-1 Programming Model
10.1.3 Index Register Y (IY)
The 16-bit IY register is also used for indexed mode addressing similar to the IX register; however, all instructions using the IY register require an extra byte of machine
code and an extra cycle of execution time since they are two byte opcodes.
10.1.4 Stack Pointer (SP)
The stack pointer (SP) is a 16-bit register that contains the address of the next free
location on the stack. The stack is configured as a sequence of last-in-first-out read/
write registers which allow important data to be stored during interrupts and subroutine
calls. Each time a new byte is added to the stack (a push instruction), the SP is decrement; whereas, each time a byte is removed from the stack (a pull instruction) the
SP is incremented.
10.1.5 Program Counter (PC)
The program counter is a 16-bit register that contains the address of the next instruction to be executed.
10.1.6 Condition Code Register (CCR)
The condition code register is an 8-bit register in which each bit signifies the results of
the instruction just executed. These bits can be individually tested by a program and
a specific action can be taken as a result of the test. Each individual condition code
register bit is explained below.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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10.1.6.1 Carry/Borrow (C)
The C bit is set if there was a carry or borrow out of the arithmetic logic unit (ALU) during the last arithmetic operation. The C bit is also affected during shift and rotate instructions.
10.1.6.2 Overflow (V)
The overflow bit is set if there was an arithmetic overflow as a result of the operation;
otherwise, the V bit is cleared.
Freescale Semiconductor, Inc...
10.1.6.3 Zero (Z)
The zero bit is set if the result of the last arithmetic, logic, or data manipulation operation was zero; otherwise, the Z bit is cleared.
10.1.6.4 Negative (N)
The negative bit is set if the result of the last arithmetic, logic, or data manipulation operation was negative; otherwise, the N bit is cleared. A result is said to be negative if
its most significant bit is a one.
10.1.6.5 Interrupt Mask (I)
The I interrupt mask bit is set either by hardware or program instruction to disable
(mask) all maskable interrupt sources (both external and internal).
10.1.6.6 Half Carry (H)
The half carry bit is set to a logic one when a carry occurs between bits 3 and 4 of the
arithmetic logic unit during an ADD, ABA, or ADC instruction; otherwise, the H bit is
cleared.
10.1.6.7 X Interrupt Mask (X)
The X interrupt mask bit is set only by hardware (RESET or XIRQ acknowledge); and
it is cleared only by program instruction (TAP or RTI).
10.1.6.8 Stop Disable (S)
The stop disable bit is set to disable the STOP instruction, and cleared to enable the
STOP instruction. The S bit is program controlled. The STOP instruction is treated as
no operation (NOP) if the S bit is set.
10.2 Addressing Modes
Six addressing modes can be used to reference memory; they include: immediate, direct, extended, indexed (with either of two 16-bit index registers and an 8-bit offset),
inherent and relative. Some instructions require an additional byte before the opcode
to accommodate a multi-page opcode map; this byte is called a prebyte.
The following paragraphs provide a description of each addressing mode plus a discussion of the prebyte. In these descriptions the term effective address is used to inCPU, ADDRESSING MODES, AND INSTRUCTION SET
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10
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dicate the address in memory from which the argument is fetched or stored, or from
which execution is to proceed.
Freescale Semiconductor, Inc...
10.2.1 Immediate Addressing
In the immediate addressing mode, the actual argument is contained in the byte(s) immediately following the instruction, where the number of bytes matches the size of the
register. These are two, three, or four (if prebyte is required) byte instructions.
10
10.2.2 Direct Addressing
In the direct addressing mode (sometimes called zero page addressing), the least significant byte of the operand address is contained in a single byte following the opcode
and the most significant byte is assumed to be $00. Direct addressing allows the user
to access $0000 through $00FF using two byte instructions and execution time is reduced by eliminating the additional memory access. In most applications, this 256byte area is reserved for frequently referenced data. In the MC68HC11A8, software
can configure the memory map so that internal RAM, and/or internal registers, or external memory space can occupy these addresses.
10.2.3 Extended Addressing
In the extended addressing mode, the second and third bytes (following the opcode)
contain the absolute address of the operand. These are three or four (if prebyte is required) byte instructions: one or two for the opcode, and two for the effective address.
10.2.4 Indexed Addressing
In the indexed addressing mode, one of the index registers (X or Y) is used in
calculating the effective address. In this case, the effective address is variable
and depends on two factors: 1) the current contents of the index register (X or
Y) being used, and 2) the 8-bit unsigned offset contained in the instruction.
This addressing mode allows referencing any memory location in the 64 Kbyte
address space. These are usually two or three (if prebyte is required) byte instructions, the opcode plus the 8-bit offset.
10.2.5 Inherent Addressing
In the inherent addressing mode, all of the information is contained in the opcode. The
operands (if any) are registers and no memory reference is required. These are usually one or two byte instructions.
10.2.6 Relative Addressing
The relative addressing mode is used for branch instructions. If the branch condition
is true, the contents of the 8-bit signed byte following the opcode (the offset) is added
to the contents of the program counter to form the effective branch address; otherwise,
control proceeds to the next instruction. These are usually two byte instructions.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-4
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10.2.7 Prebyte
In order to expand the number of instructions used in the MC68HC11A8, a prebyte instruction has been added to certain instructions. The instructions affected are usually
associated with index register Y. The instruction opcodes which do not require a prebyte could be considered as page 1 of the overall opcode map. The remaining opcodes could be considered as pages 2, 3, and 4 of the opcode map and would require
a prebyte; $18 for page 2, $1A for page 3, and $CD for page 4.
10.3 Instruction Set
The central processing unit (CPU) in the MC68HC11A8 is basically a proper extension
of the MC6801 CPU. In addition to its ability to execute all M6800 and M6801 instructions, the MC68HC11A8 CPU has a paged operation code (opcode) map with a total
of 91 new opcodes. Major functional additions include a second 16-bit index register
(Y register), two types of 16-by-16 divide instructions, STOP and WAIT instructions,
and bit manipulation instructions.
Table 10-1 shows all MC68HC11A8 instructions in all possible addressing modes. For
each instruction, the operand construction is shown as well as the total number of machine code bytes and execution time in CPU E-clock cycles. Notes are provided at the
end of Table 10-1 which explain the letters in the Operand and Execution Time columns for some instructions. Definitions of “Special Ops” found in the Boolean Expression column are found in Figure 10-2.
Table 10-2 through Table 10-8 provide a detailed description of the information
present on the address bus, data bus, and the read/write (R/W) line during each cycle
of each instruction. The information is useful in comparing actual with expected results
during debug of both software and hardware as the program is executed. The information is categorized in groups according to addressing mode and number of cycles per
instruction. In general, instructions with the same address mode and number of cycles
execute in the same manner. Exceptions are indicated in the table.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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MOTOROLA
10-5
10
Freescale Semiconductor, Inc.
ABA
ABX
ABY
ADCA
(opr)
Operation
Boolean Expression
A+B→A
IX + 00:B → IX
IY + 00:B → IY
A+M+C→A
Add Accumulators
Add B to X
Add B to Y
Add with Carry to A
Freescale Semiconductor, Inc...
10
A+M→A
ADDA (opr) Add Memory to A
B+M→B
ADDB (opr) Add Memory to B
D + M:M + 1 → D
ADDD (opr) Add 16-Bit to D
A•M → A
ANDA (opr) AND A with Memory
B•M → B
ANDB (opr) AND B with Memory
ASL (opr)
INH
INH
INH
A IMM
A DIR
A EXT
A IND,X
A IND,Y
B+M+C→B
ADCB (opr) Add with Carry to B
Addressing
Mode for
Operand
Arithmetic Shift Left
C
ASLD
b7
C9 ii
D9 dd
F9 hh
E9 ff
18 E9 ff
A IMM
A DIR
A EXT
A IND,X
A IND,Y
8B ii
9B dd
BB hh
AB ff
18 AB ff
B IMM
B DIR
B EXT
B IND,X
B IND,Y
CB ii
DB dd
FB hh
EB ff
18 EB ff
IMM
DIR
EXT
IND,X
IND,Y
C3 jj
D3 dd
F3 hh
E3 ff
18 E3 ff
A IMM
A DIR
A EXT
A IND,X
A IND,Y
84 ii
94 dd
B4 hh
A4 ff
18 A4 ff
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C4 ii
D4 dd
F4 hh
E4 ff
18 E4 ff
EXT
78 hh
68 ff
18 68 ff
48
58
IND,Y
A INH
B INH
b0
Arithmetic Shift Left Double
89 ii
99 dd
B9 hh
A9 ff
18 A9 ff
B IMM
B DIR
B EXT
B IND,X
B IND,Y
0 IND,X
ASLA
ASLB
Machine Coding
(Hexadecimal)
Opcode Operand(s)
1B
1
3A
1
18 3A
2
Bytes
Source
Form(s)
INH
05
EXT
IND,X
C IND,Y
A INH
B INH
77 hh
67 ff
18 67 ff
47
57
REL
DIR
IND,X
IND,Y
REL
REL
REL
REL
REL
REL
24 rr
15 dd
1D ff
18 1D ff
25 rr
27 rr
2C rr
2E rr
22 rr
24 rr
Cycle
Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 1 of 6)
2
3
4
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
2-1 - - ↕ - ↕ ↕ ↕ ↕
2-2 - - - - - - - 2-4 - - - - - - - -
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
--↕-↕↕↕↕
ll
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
--↕-↕↕↕↕
ll
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
--↕-↕↕↕↕
ll
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
--↕-↕↕↕↕
ll
2
2
3
2
3
4
5
6
6
7
3-3
4-7
5-10
6-10
7-8
----↕↕↕↕
ll
3
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
3
2
3
1
1
6
6
7
2
2
5-8
6-3
7-3
2-1
2-1
----↕↕↕↕
1
3
2-2
----↕↕↕↕
3
2
3
1
1
6
6
7
2
2
5-8
6-3
7-3
2-1
2-1
----↕↕↕↕
2
3
3
4
2
2
2
2
2
2
3
6
7
8
3
3
3
3
3
3
8-1
4-10
6-13
7-10
8-1
8-1
8-1
8-1
8-1
8-1
-----------↕↕0-
kk
ll
0
C
ASR (opr)
b15
b0
Arithmetic Shift Right
b7
ASRA
ASRB
b0
BCC (rel)
Branch if Carry Clear
BCLR (opr) Clear Bit(s)
(msk)
?C=0
BCS (rel)
BEQ (rel)
BGE (rel)
BGT (rel)
BHI (rel)
BHS (rel)
?C=1
?Z=1
?N⊕V=0
? Z + (N ⊕ V) = 0
?C+Z=0
?C=0
Branch if Carry Set
Branch if = Zero
Branch if ≥ Zero
Branch if > Zero
Branch if Higher
Branch if Higher or Same
M•(mm) → M
ll
mm
mm
mm
-------------------------------------------
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-6
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TECHNICAL DATA
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Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 2 of 6)
Boolean Expression
Addressing
Mode for
Operand
Machine Coding
(Hexadecimal)
Opcode Operand(s)
85 ii
95 dd
B5 hh ll
A5 ff
18 A5 ff
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
2
2
3
2
3
2
3
4
4
5
----↕↕0-
2F rr
25 rr
23 rr
2D rr
2B rr
26 rr
2A rr
20 rr
13 dd mm rr
1F ff mm rr
18 1F ff mm rr
21 rr
12 dd mm rr
1E ff mm rr
18 1E ff mm rr
14 dd mm
1C ff mm
18 1C ff mm
8D rr
28 rr
29 rr
11
0C
0E
7F hh ll
6F ff
18 6F ff
4F
5F
0A
2
2
2
2
2
2
2
2
4
4
5
2
4
4
5
3
3
4
2
2
2
1
1
1
3
2
3
1
1
1
3
3
3
3
3
3
3
3
6
7
8
3
6
7
8
6
7
8
6
3
3
2
2
2
6
6
7
2
2
2
3-1
4-1
5-2
6-2
7-2
8-1
8-1
8-1
8-1
8-1
8-1
8-1
8-1
4-11
6-14
7-11
8-1
4-11
6-14 711
4-10
6-13
7-10
8-2
8-1
8-1
2-1
2-1
2-1
5-8
6-3
7-3
2-1
2-1
2-1
81 ii
91 dd
B1 hh
A1 ff
18 A1 ff
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕↕↕
ll
2
2
3
2
3
2
3
4
4
5
3
2
3
1
1
6
6
7
2
2
3-1
4-1
5-2
6-2
7-2
5-8
6-3
7-3
2-1
2-1
----↕↕↕↕
ll
2
2
3
2
3
4
3
4
3
3
5
6
7
7
7
3-5
4-9
5-11
6-11
7-8
----↕↕↕↕
BITA (opr)
Bit(s) Test A with Memory
A•M
A IMM
A DIR
A EXT
A IND,X
A IND,Y
BITB (opr)
Bit(s) Test B with Memory
B•M
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C5 ii
D5 dd
F5 hh
E5 ff
18 E5 ff
REL
REL
REL
REL
REL
REL
REL
REL
DIR
IND,X
IND,Y
REL
DIR
IND,X
IND,Y
DIR
IND,X
IND,Y
REL
REL
REL
INH
INH
INH
EXT
IND,X
IND,Y
A INH
B INH
INH
A IMM
A DIR
A EXT
A IND,X
A IND,Y
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C1 ii
D1 dd
F1 hh
E1 ff
18 E1 ff
EXT
IND,X
IND,Y
A INH
B INH
IMM
DIR
EXT
IND,X
IND,Y
73 hh
63 ff
18 63 ff
43
53
BLE (rel)
Branch if ≤ Zero
BLO (rel)
Branch if Lower
BLS (rel)
Branch if Lower or Same
BLT (rel)
Branch If < Zero
BMI (rel)
Branch if Minus
BNE (rel)
Branch if Not = Zero
BPL (rel)
Branch if Plus
BRA (rel)
Branch Always
BRCLR(opr) Branch if Bit(s) Clear
(msk)
(rel)
BRN (rel)
Branch Never
BRSET(opr) Branch if Bit(s) Set
(msk)
(rel)
BSET(opr) Set Bit(s)
(msk)
? Z + (N ⊕ V) = 1
?C=1
?C+Z=1
?N⊕V=1
?N=1
?Z=0
?N=0
?1=1
? M • mm = 0
BSR (rel)
BVC (rel)
BVS (rel)
CBA
CLC
CLI
CLR (opr)
Branch to Subroutine
Branch if Overflow Clear
Branch if Overflow Set
Compare A to B
Clear Carry Bit
Clear Interrupt Mask
Clear Memory Byte
See Special Ops
?V=0
?V=1
A–B
0→C
0→l
0→M
CLRA
CLRB
CLV
CMPA (opr)
Clear Accumulator A
Clear Accumulator B
CIear Overflow Flag
Compare A to Memory
0→A
0→B
0→V
A–M
CMPB (opr) Compare B to Memory
?1=0
? (M) • mm = 0
M + mm → M
B–M
COM (opr)
1’s Complement Memory Byte $FF – M → M
COMA
COMB
CPD (opr)
1’s Complement A
1’s Complement B
Compare D to Memory 16-Bit
$FF – A → A
$FF – B → B
D – M:M + 1
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
Cycle
Operation
Bytes
Freescale Semiconductor, Inc...
Source
Form(s)
ll
ll
1A 83 jj kk
1A 93 dd
1A B3 hh ll
1A A3 ff
CD A3 ff
----------------------------------------------------------------
---------------
----↕↕0-
-------------------------↕↕↕↕
-------0
---0-------0100
----0100
----0100
------0-
----↕↕01
----↕↕01
----↕↕01
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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MOTOROLA
10-7
10
Freescale Semiconductor, Inc.
Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 3 of 6)
Boolean Expression
Addressing
Mode for
Operand
4
5
6
6
7
3-3
4-7
5-10
6-10
7-8
----↕↕↕↕
18 8C jj kk
18 9C dd
18 BC hh ll
1A AC ff
18 AC ff
4
3
4
3
3
5
6
7
7
7
----↕↕↕↕
INH
EXT
IND,X
IND,Y
A INH
B INH
INH
INH
19
7A hh
6A ff
18 6A ff
4A
5A
34
09
1
3
2
3
1
1
1
1
2
6
6
7
2
2
3
3
3-5
4-9
5-11
6-11
7-8
2-1
5-8
6-3
7-3
2-1
2-1
2-3
2-2
INH
A IMM
A DIR
A EXT
A IND,X
A IND,Y
18 09
2
4
2-4
-----↕ --
88 ii
98 dd
88 hh
A8 ff
18 A8 ff
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C8 ii
D8 dd
F8 hh
E8 ff
18 E8 ff
2
3
4
4
5
INH
INH
EXT
IND,X
IND,Y
A INH
B INH
INH
INH
INH
EXT
IND,X
IND,Y
DIR
EXT
IND,X
IND,Y
A IMM
A DIR
A EXT
A IND,X
A IND,Y
03
02
7C hh
6C ff
18 6C ff
4C
5C
31
08
18 08
7E hh
6E ff
18 6E ff
9D dd
BD hh
AD ff
18 AD ff
1
1
3
2
3
1
1
1
1
2
3
2
3
2
3
2
3
41
41
6
6
7
2
2
3
3
4
3
3
4
5
6
6
7
3-1
4-1
5-2
6-2
7-2
2-17
2-17
5-8
6-3
7-3
2-1
2-1
2-3
2-2
2-4
5-1
6-1
7-1
4-8
5-12
6-12
7-9
----↕↕0-
ll
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C6 ii
D6 dd
F6 hh
E6 ff
18 E6 ff
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
IMM
DIR
EXT
IND,X
IND,Y
CC jj
DC dd
FC hh
EC ff
18 EC ff
3
2
3
2
3
3
4
5
5
6
3-2
4-3
5-4
6-6
7-6
----↕↕0-
Compare X to Memory 16-Bit
IX – M:M + 1
IMM
DIR
EXT
IND,X
IND,Y
CPY (opr)
Compare Y to Memory
16-Bit
IY – M:M + 1
IMM
DIR
EXT
IND,X
IND,Y
DAA
DEC (opr)
Decimal Adjust A
Decrement Memory Byte
Adjust Sum to BCD
M–1→M
DECA
DECB
DES
DEX
Decrement Accumulator A
Decrement Accumulator B
Decrement Stack Pointer
Decrement Index Register X
A–1→A
B–1→B
SP – 1 → SP
IX – 1 → IX
EORB (opr) Exclusive OR B with Memory
IY – 1 → IY
A⊕M→A
B⊕M→B
FDIV
IDIV
INC (opr)
Fractional Divide 16 by 16
Integer Divide 16 by 16
Increment Memory Byte
D/IX → IX; r → D
D/IX → IX; r → D
M+1→M
INCA
INCB
INS
INX
INY
JMP (opr)
Increment Accumulator A
Increment Accumulator B
Increment Stack Pointer
Increment Index Register X
Increment Index Register Y
Jump
A+1→A
B+1→B
SP + 1 → SP
IX + 1 → IX
IY + 1 → IY
See Special Ops
JSR (opr)
Jump to Subroutine
See Special Ops
M→A
LDAA (opr) Load Accumulator A
M→B
LDAB (opr) Load Accumulator B
LDD (opr)
Load Double Accumulator D
M → A,M + 1 → B
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
3
2
3
2
3
CPX (opr)
DEY
Decrement Index Register Y
EORA (opr) Exclusive OR A with Memory
Machine Coding
(Hexadecimal)
Opcode Operand(s)
8C jj kk
9C dd
BC hh ll
AC ff
CD AC ff
Cycle
10
Operation
Bytes
Freescale Semiconductor, Inc...
Source
Form(s)
86 ii
96 dd
B6 hh
A6 ff
18 A6 ff
ll
ll
ll
ll
kk
ll
----↕↕↕↕
----↕↕↕-
----↕↕↕----↕↕↕------------↕ --
-----↕↕↕
-----↕0↕
----↕↕↕-
----↕↕↕----↕↕↕------------↕ ------↕ ---------
--------
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-8
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 4 of 6)
Boolean Expression
Addressing
Mode for
Operand
3
4
5
5
6
3-2
4-3
5-4
6-6
7-6
----↕↕0-
CE jj kk
DE dd
FE hh ll
EE ff
CD EE ff
3
2
3
2
3
3
4
5
5
6
3-2
4-3
5-4
6-6
7-6
----↕↕0-
IMM
DIR
EXT
IND,X
IND,Y
18 CE jj
18 DE dd
18 FE hh
1A EE ff
18 EE ff
kk
4
3
4
3
3
4
5
6
6
6
3-4
4-5
5-6
6-7
7-6
----↕↕0-
EXT
IND,X
0 IND,Y
A INH
B INH
78 hh
68 ff
18 68 ff
48
58
ll
3
2
3
1
1
6
6
7
2
2
5-8
6-3
3-7
2-1
2-1
----↕↕↕↕
INH
05
1
3
2-2
----↕↕↕↕
EXT
IND,X
IND,Y
C A INH
B INH
74 hh
64 ff
18 64 ff
44
54
3
2
3
1
1
6
6
7
2
2
5-8
6-3
7-3
2-1
2-1
----↕↕↕↕
INH
04
1
3
2-2
----0↕↕↕
INH
3D
1
10
2-13
-------↕
----↕↕↕↕
Load Stack Pointer
M:M + 1 → SP
IMM
DIR
EXT
IND,X
IND,Y
LDX (opr)
Load Index Register X
M:M + 1 → IX
IMM
DIR
EXT
IND,X
IND,Y
LDY (opr)
Load Index Register Y
M:M + 1 → IY
Logical Shift Left
LSLA
LSLB
LSLD
C
b7
b0
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
3
2
3
2
3
LDS (opr)
LSL (opr)
Machine Coding
(Hexadecimal)
Opcode Operand(s)
8E jj
kk
9E dd
BE hh ll
AE ff
18 AE ff
Cycle
Operation
Bytes
Freescale Semiconductor, Inc...
Source
Form(s)
Logical Shift Left Double
ll
0
C
LSR (opr)
b0
Logical Shift Right
LSRA
LSRB
LSRD
b15
0
b7
b0
Logical Shift Right Double
ll
0
b15
b0
C
AxB → D
MUL
Multiply 8 by 8
NEG (opr)
2’s Complement Memory Byte 0 – M → M
NEGA
NEGB
NOP
ORAA (opr)
2’s Complement A
2’s Complement B
No Operation
OR Accumulator A (Inclusive)
0–A→A
0–B→B
No Operation
A+M→A
ORAB (opr) OR Accumulator B (Inclusive) B + M → B
PSHA
PSHB
PSHX
PSHY
PULA
PULB
PULX
PULY
ROL (opr)
Push A onto Stack
Push B onto Stack
Push X onto Stack (Lo First)
Push Y onto Stack (Lo First)
Pull A from Stack
Pull B from Stack
Pull X from Stack (Hi First)
Pull Y from Stack (Hi First)
Rotate Left
ROLA
ROLB
A → Stk, SP = SP–1
B → Stk, SP = SP–1
IX → Stk, SP = SP–2
IY → Stk, SP = SP–2
SP = SP + 1, A←Stk
SP = SP + 1, B←Stk
SP = SP + 2, IX←Stk
SP = SP + 2, IY←Stk
C
b7
b0
EXT
IND,X
IND,Y
A INH
B INH
INH
A IMM
A DIR
A EXT
A IND,X
A IND,Y
70 hh ll
60 ff
18 60 ff
40
50
01
3
2
3
1
1
1
6
6
7
2
2
2
5-8
6-3
7-3
2-1
2-1
2-1
8A ii
9A dd
BA hh
AA ff
18 AA ff
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕0-
ll
2
2
3
2
3
B IMM
B DIR
B EXT
B IND,X
B IND,Y
CA ii
DA dd
FA hh
EA ff
18 EA ff
2
3
4
4
5
1
1
1
2
1
1
1
2
3
3
4
5
4
4
5
6
3-1
4-1
5-2
6-2
7-2
2-6
2-6
2-7
2-8
2-9
2-9
2-10
2-11
----↕↕0-
ll
2
2
3
2
3
3
2
3
1
1
6
6
7
2
2
5-8
6-3
7-3
2-1
2-1
A INH
B INH
INH
INH
A INH
B INH
INH
INH
EXT
IND,X
IND,Y
C A INH
B INH
36
37
3C
18 3C
32
33
38
18 38
79 hh
69 ff
18 69 ff
49
59
ll
----↕↕↕↕
----↕↕↕↕
--------
------------------------------------------------------------↕↕↕↕
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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MOTOROLA
10-9
10
Freescale Semiconductor, Inc.
Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 5 of 6)
Boolean Expression
Rotate Right
RORA
RORB
Freescale Semiconductor, Inc...
RTI
RTS
SBA
SBCA (opr)
10
C
Return from Interrupt
Return from Subroutine
Subtract B from A
Subtract with Carry from A
SBCB (opr) Subtract with Carry from B
SEC
SEI
Set Carry
Set Interrupt Mask
SEV
Set Overflow Flag
STAA (opr) Store Accumulator A
STOP
STS (opr)
STX (opr)
STY (opr)
See Special Ops
See Special Ops
A–B→A
A–M–C→A
B–M–C→B
Stop Internal Clocks
Store Stack Pointer
Store Index Register Y
SUBB (opr) Subtract Memory from B
SUBD (opr) Subtract Memory from D
Software Interrupt
Transfer A to B
Transfer A to CC Register
Transfer B to A
↕↓↕↕↕↕↕↕
-----------↕↕↕↕
82 ii
92 dd
B2 hh
A2 ff
18 A2 ff
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕↕↕
ll
2
2
3
2
3
B IMM
B DIR
B EXT
B IND,X
B IND,Y
C2 ii
D2 dd
F2 hh
E2 ff
18 E2 ff
2
3
4
4
5
OD
OF
1
1
2
2
3-1
4-1
5-2
6-2
7-2
2-1
2-1
----↕↕↕↕
ll
2
2
3
2
3
1
2
3
2
3
2
3
2
3
2
3
2
3
1
2
3
2
3
2
3
2
3
3
4
3
3
2
3
4
4
5
3
4
4
5
4
5
5
6
2
4
5
5
6
4
5
5
6
5
6
6
6
2-1
4-2
5-3
6-5
7-5
4-2
5-3
6-5
7-5
4-4
5-5
6-8
7-7
2-1
4-4
5-5
6-8
7-7
4-4
5-5
6-8
7-7
4-6
5-7
6-9
7-7
------1----↕↕0-
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕↕↕
lI
2
2
3
2
3
2
3
4
4
5
3-1
4-1
5-2
6-2
7-2
----↕↕↕↕
ll
2
2
3
2
3
3
2
3
2
3
4
5
6
6
7
----↕↕↕↕
1
1
1
1
14
2
2
2
3-3
4-7
5-10
6-10
7-8
2-15
2-1
2-1
2-1
C0 ii
D0 dd
F0 hh
E0 ff
18 E0 ff
IMM
DlR
EXT
IND,X
IND,Y
83 jj
93 dd
B3 hh
A3 ff
18 A3 ff
D – M:M + 1→ D
See Special Ops
A→B
A → CCR
B→A
----↕↕↕↕
2-14
2-12
2-1
B IMM
B DIR
B EXT
B IND,X
B IND,Y
B–M→B
5-8
6-3
7-3
2-1
2-1
12
5
2
OB
97 dd
B7 hh
A7 ff
18 A7 ff
D7 dd
F7 hh
E7 ff
18 E7 ff
DD dd
FD hh
ED ff
18 ED ff
CF
9F dd
BF hh
AF ff
18 AF ff
DF dd
FF hh
EF ff
CD EF ff
18 DF dd
18 FF hh
1A EF ff
18 EF ff
A–M→A
6
6
7
2
2
1
1
1
INH
A DIR
A EXT
A IND,X
A IND,Y
B DIR
B EXT
B IND,X
B IND,Y
DIR
EXT
IND,X
IND,Y
INH
DIR
EXT
IND,X
IND,Y
DIR
EXT
IND,X
IND,Y
DIR
EXT
IND,X
IND,Y
A IMM
A DIR
A EXT
A IND,X
A IND,Y
IY → M:M + 1
3
2
3
1
1
3B
39
10
1→V
A→M
IX → M:M + 1
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
INH
INH
INH
A IMM
A DIR
A EXT
A IND,X
A IND,Y
INH
INH
SP → M:M + 1
Store Index Register X
EXT
IND,X
IND,Y
C A INH
B INH
Machine Coding
(Hexadecimal)
Opcode Operand(s)
76 hh ll
66 ff
18 66 ff
46
56
1→C
1→I
A → M, B → M + 1
Store Accumulator D
SUBA (opr) Subtract Memory from A
SWI
TAB
TAP
TBA
b0
B→M
STAB (opr) Store Accumulator B
STD (opr)
b7
Addressing
Mode for
Operand
Cycle
ROR (opr)
Operation
Bytes
Source
Form(s)
INH
INH
INH
INH
80 ii
90 dd
B0 hh
A0 ff
18 A0 ff
ll
ll
ll
ll
ll
ll
kk
ll
3F
16
06
17
-------1
---1----
----↕↕0-
----↕↕0-
-----------↕↕0-
----↕↕0-
----↕↕0-
- - - 1- - - ----↕↕0↕↓↕↕↕↕↕↕
----↕↕0-
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-10
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TEST
TPA
TST (opr)
TSTA
TSTB
TSX
TSY
TXS
TYS
WAI
XGDX
XGDY
Operation
Boolean Expression
TEST (Only in Test Modes)
Transfer CC Register to A
Test for Zero or Minus
Address Bus Counts
CCR → A
M–0
Transfer Stack Pointer to X
Transfer Stack Pointer to Y
Transfer X to Stack Pointer
Transfer Y to Stack Pointer
Wait for Interrupt
Exchange D with X
Exchange D with Y
A–0
B–0
SP + 1 → IX
SP + 1 → IY
IX – 1 → SP
IY – 1 → SP
Stack Regs & WAlT
IX → D, D → IX
IY → D, D → IY
Addressing
Mode for
Operand
INH
INH
EXT
IND,X
IND,Y
A INH
B INH
INH
INH
INH
INH
INH
INH
INH
Machine Coding
(Hexadecimal)
Opcode Operand(s)
00
07
7D hh ll
6D ff
18 6D ff
4D
5D
30
18 30
35
18 35
3E
8F
18 8F
Cycle
Source
Form(s)
Bytes
Table 10-1 MC68HC11A8 Instructions, Addressing Modes, and Execution Times
(Sheet 6 of 6)
1
1
3
2
3
1
1
1
2
1
2
1
1
2
**
2
6
6
7
2
2
3
4
3
4
***
3
4
Cycle
Condition Codes
by
Cycle* S X H I N Z V C
2-20 - - - - - - - 2-1 - - - - - - - 5-9 - - - - ↕ ↕ 0 0
6-4
7-4
2-1 - - - - ↕ ↕ 0 0
2-1 - - - - ↕ ↕ 0 0
2-3 - - - - - - - 2-5 - - - - - - - 2-2 - - - - - - - 2-4 - - - - - - - 2-16 - - - - - - - 2-2 - - - - - - - 2-4 - - - - - - - -
*Cycle-by-cycle number provides a reference to Tables 10-2 through 10-8 which detail cycle-by-cycle operation.
Example: Table 10-1 Cycle-by-Cycle column reference number 2-4 equals Table 10-2 line item 2-4.
**Infinity or Until Reset Occurs
***12 Cycles are used beginning with the opcode fetch. A wait state is entered which remains in effect for an integer
number of MPU E-clock cycles (n) until an interrupt is recognized. Finally, two additional cycles are used to fetch
the appropriate interrupt vector (14 + n total).
dd
= 8-Bit Direct Address ($0000 –$00FF) (High Byte Assumed to be $00)
ff
= 8-Bit Positive Offset $00 (0) to $FF (255) (Is Added to Index)
hh
= High Order Byte of 16-Bit Extended Address
ii
= One Byte of Immediate Data
jj
= High Order Byte of 16-Bit Immediate Data
kk
= Low Order Byte of 16-Bit Immediate Data
ll
= Low Order Byte of 16-Bit Extended Address
mm = 8-Bit Bit Mask (Set Bits to be Affected)
rr
= Signed Relative Offset $80 (– 128) to $7F (+ 127)
(Offset Relative to the Address Following the Machine Code Offset Byte)
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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10-11
10
Freescale Semiconductor, Inc.
JSR, JUMP TO SUBROUTINE
WAI, WAIT FOR INTERRUPT
MAIN PROGRAM
PC
DIRECT
$9D = JSR
dd
RTN NEXT MAIN INSTR.
MAIN PROGRAM
PC
INDEXED, X
$AD = JSR
ff
RTN NEXT MAIN INSTR.
MAIN PROGRAM
PC
Freescale Semiconductor, Inc...
INDEXED, Y
$18 = PRE
$AD = JSR
RTN
ff
NEXT MAIN INSTR.
7
STACK
PC
SP
SP+1
SP+2
SP+3
SP+4
SP+5
SP+6
SP+7
SP+8
➩ SP+9
INTERRUPT ROUTINE
0
7
SP+2
SP+3
SP+4
SP+5
SP+6
SP+7
SP+8
➩ SP+9
SWI, SOFTWARE INTERRUPT
MAIN PROGRAM
PC
$3F = SWI
7
10
JMP, JUMP
SP–7
SP–6
SP–5
WAI, WAIT FOR INTERRUPT
SP–4
MAIN PROGRAM
SP–3
$3E = WAI
SP–2
SP–1
MAIN PROGRAM
PC
$6E = JMP
ff
SP
BSR, BRANCH TO SUBROUTINE
INDEXED, X
MAIN PROGRAM
X + ff NEXT MAIN INSTR.
PC
$8D = BSR
INDEXED, Y
$18 = PRE
$6E = JMP
ff
RTS, RETURN FROM
SUBROUTINE
MAIN PROGRAM
$39 = RTS
X + ff NEXT MAIN INSTR.
EXTENDED
$7E = JMP
hh
ll
hh ll NEXT MAIN INSTR.
0
RTNH
RTNL
7
STACK
0
SP
SP+1
➩ SP+2
MAIN PROGRAM
STACK
➩ SP–2
SP
PC
PC
7
SP–1
MAIN PROGRAM
PC
0
CCR
ACCB
ACCA
IXH
IXL
IYH
IYL
RTNH
RTNL
SP–8
PC
STACK
➩ SP–9
PC
$BD = PRE
hh
RTN
ll
NEXT MAIN INSTR.
CCR
ACCB
ACCA
IXH
IXL
IYH
IYL
RTNH
RTNL
SP+1
MAIN PROGRAM
INDEXED, Y
0
SP
$3E = WAI
CCR
ACCB
ACCA
IXH
IXL
IYH
IYL
RTNH
RTNL
STACK
RTNH
RTNL
LEGEND:
RTN = ADDRESS OF NEXT INSTRUCTION IN MAIN PROGRAM TO
BE EXECUTED UPON RETURN FROM SUBROUTINE
RTNH = MOST SIGNIFICANT BYTE OF RETURN ADDRESS
RTNL = LEAST SIGNIFICANT BYTE OF RETURN ADDRESS
➩ = STACK POINTER POSITION AFTER OPERATION IS COMPLETE
dd = 8-BIT DIRECT ADDRESS ($0000–$00FF) (HIGH BYTE ASSUMED
TO BE $00)
ff = 8-BIT POSITIVE OFFSET $00 (0) TO $FF (256) IS ADDED TO INDEX
hh = HIGH-ORDER BYTE OF 16-BIT EXTENDED ADDRESS
ll = LOW-ORDER BYTE OF 16-BIT EXTENDED ADDRESS
rr= SIGNED RELATIVE OFFSET $80 (–128) TO $7F (+127) (OFFSET
RELATIVE TO THE ADDRESS FOLLOWING THE MACHINE CODE
OFFSET BYTE)
Figure 10-2 Special Operations
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-12
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TECHNICAL DATA
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Freescale Semiconductor, Inc...
Table 10-2 Cycle-by-Cycle Operation — Inherent Mode (Sheet 1 of 4)
Reference
Number*
Address Mode
and Instructions
2-1
ABA, ASLA, ASLB,
ASRA, ASRB, CBA,
CLC, CLI, CLRA,
CLRB, CLV, COMA,
COMB, DAA, DECA,
DECB, INCA, INCB,
LSLA, LSLB, LSRA,
LSRB, NEGA, NEGB,
NOP, ROLA, ROLB,
RORA, RORB, SBA,
SEC, SEI, SEV, STOP,
TAB, TAP, TBA, TPA,
TSTA, TSTB
ABX, ASLD, DEX, INX,
LSLD, LSRD, TXS,
XGDX
DES, INS, TSX
2
1
2
Opcode Address
Opcode Address + 1
3
ABY, DEY, INY,
TYS, XGDY
4
1
2
3
1
2
3
1
Opcode Address
Opcode Address + 1
$FFFF
Opcode Address
Opcode Address + 1
Previous SP Value
Opcode Address
1
1
1
1
1
1
1
4
2
3
4
1
Opcode Address + 1
Opcode Address + 2
$FFFF
Opcode Address
1
1
1
1
2
3
4
1
2
3
1
2
3
4
1
Opcode Address + 1
Opcode Address + 2
Stack Pointer
Opcode Address
Opcode Address + 1
Stack Pointer
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer – 1
Opcode Address
1
1
1
1
1
0
1
1
0
0
1
2
3
4
5
1
2
3
4
1
2
3
4
5
Opcode Address + 1
Opcode Address + 2
Stack Pointer
Stack Pointer – 1
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer + 1
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer + 1
Stack Pointer + 2
1
1
0
0
1
1
1
1
1
1
1
1
1
2-2
2-3
2-4
2-5
TSY
Cycles Cycle
#
3
2-6
PSHA, PSHB
3
2-7
PSHX
4
2-8
PSHY
5
2-9
PULA, PULB
4
2-10
PULX
5
Address Bus
Data Bus
R/W
Line
1 Opcode
1 Irrelevant Data
Opcode
Irrelevant Data
Irrelevant Data
Opcode
Irrelevant Data
Irrelevant Data
Opcode (Page Select Byte)
($18)
Opcode (Second Byte)
Irrelevant Data
Irrelevant Data
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($30)
Irrelevant Data
Irrelevant Data
Opcode
Irrelevant Data
Accumulator Data
Opcode ($3C)
Irrelevant Data
IXL (Low Byte) to Stack
IXH (High Byte) to Stack
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($3C)
Irrelevant Data
IXL (Low Byte) to Stack
IXH (High Byte) to Stack
Opcode
Irrelevant Data
Irrelevant Data
Operand Data from Stack
Opcode ($38)
Irrelevant Data
Irrelevant Data
IXH (High Byte) from Stack
IXL (Low Byte) from Stack
* The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
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10-13
10
Freescale Semiconductor, Inc.
Table 10-2 Cycle-by-Cycle Operation — Inherent Mode (Sheet 2 of 4)
Reference
Number*
2-11
Freescale Semiconductor, Inc...
2-12
Address Mode
and Instructions
PULY
RTS
Cycles Cycle
#
6
5
2-13
MUL
10
2-14
RTI
12
10
2-15
SWI
14
Address Bus
1
Opcode Address
2
3
4
5
6
1
2
3
4
Opcode Address + 1
Opcode Address + 2
Stack Pointer
Stack Pointer + 1
Stack Pointer + 2
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer +1
5
Stack Pointer + 2
1
2
3
4
5
6
7
8
9
10
1
2
3
4
Opcode Address
Opcode Address + 1
$FFFF
$FFFF
$FFFF
$FFFF
$FFFF
$FFFF
$FFFF
$FFFF
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer + 1
5
6
7
8
9
10
11
Stack Pointer + 2
Stack Pointer + 3
Stack Pointer + 4
Stack Pointer + 5
Stack Pointer + 6
Stack Pointer + 7
Stack Pointer + 8
12
Stack Pointer + 9
1
2
3
4
5
6
7
8
9
10
11
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer – 1
Stack Pointer – 2
Stack Pointer – 3
Stack Pointer – 4
Stack Pointer – 5
Stack Pointer – 6
Stack Pointer – 7
Stack Pointer – 8
12
13
Stack Pointer – 8
Address of SWI
Vector (First Location)
Address of Vector + 1
(Second Location)
14
Data Bus
R/W
Line
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte) ($38)
1 Irrelevant Data
1 Irrelevant Data
1 IYH (High Byte) from Stack
1 IYH (Low Byte) from Stack
1 Opcode ($39)
1 Irrelevant Data
1 Irrelevant Data
1 Address of Next Instruction
(High Byte)
1 Address of Next Instruction
(Low Byte)
1 Opcode ($3D)
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Irrelevant Data
1 Opcode ($3B)
1 Irrelevant Data
1 Irrelevant Data
1 Condition Code Register from
Stack
1 B Accumulator from Stack
1 A Accumulator from Stack
1 IXH (High Byte) from Stack
1 IXL (Low Byte) from Stack
1 IYH (High Byte) from Stack
1 IYL (Low Byte) from Stack
1 Address of Next Instruction
(High Byte)
1 Address of Next Instruction
(Low Byte)
1 Opcode ($3F)
1 Irrelevant Data
0 Return Address (Low Byte)
0 Return Address (High Byte)
0 IYL (Low Byte) to Stack
0 IYH (High Byte) to Stack
0 IXL (Low Byte) to Stack
0 IXH (High Byte) to Stack
0 A Accumulator to Stack
0 B Accumulator to Stack
0 Condition Code Register to
Stack
1 Irrelevant Data
1 SWI Service Routine Address
(High Byte)
1 SWI Service Routine Address
(Low Byte)
* The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-14
For More Information On This Product,
Go to: www.freescale.com
MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table 10-2 Cycle-by-Cycle Operation — Inherent Mode (Sheet 3 of 4)
Reference
Number*
Freescale Semiconductor, Inc...
2-16
Address Mode
and Instructions
WAI
Cycles Cycle
#
14 + n
2-17
FDIV, IDIV
41
2-18
Page 1 Illegal
Opcodes
15
1
2
3
4
5
6
7
8
9
10
11
12 to
n + 12
n + 13
15
Pages 2, 3, or 4
Illegal Opcodes
16
Opcode Address
Opcode Address + 1
Stack Pointer
Stack Pointer – 1
Stack Pointer – 2
Stack Pointer – 3
Stack Pointer – 4
Stack Pointer – 5
Stack Pointer – 6
Stack Pointer – 7
Stack Pointer – 8
Stack Pointer – 8
Address of Vector
(First Location)
n + 14 Address of Vector + 1
(Second Location)
1
Opcode Address
2
Opcode Address + 1
3 – 41 $FFFF
Opcode Address
1
Opcode Address + 1
2
$FFFF
3
Stack Pointer
4
Stack Pointer – 1
5
Stack Pointer – 2
6
Stack Pointer – 3
7
Stack Pointer – 4
8
Stack Pointer – 5
9
10 Stack Pointer – 6
11 Stack Pointer – 7
12 Stack Pointer – 8
13
14
2-19
Address Bus
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
R/W
Line
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
Stack Pointer – 8
Address of Vector
(First Location)
Address of Vector + 1
(Second Location)
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
Stack Pointer
Stack Pointer – 1
Stack Pointer – 2
Stack Pointer – 3
Stack Pointer – 4
Stack Pointer – 5
Stack Pointer – 6
Stack Pointer – 7
Stack Pointer – 8
1
1
Stack Pointer – 8
Address of Vector
(First Location)
Address of Vector + 1
(Second Location)
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
Data Bus
Opcode ($3E)
Irrelevant Data
Return Address (Low Byte)
Return Address (High Byte)
IYL (Low Byte) to Stack
IYH (High Byte) to Stack
IXL (Low Byte) to Stack
IXH (High Byte) to Stack
A Accumulator to Stack
B Accumulator to Stack
Condition Code Register to
Stack
Irrelevant Data
Service Routine Address (High
Byte)
Service Routine Address (Low
Byte)
Opcode
Irrelevant Data
Irrelevant Data
Opcode (Illegal)
Irrelevant Data
Irrelevant Data
Return Address (Low Byte)
Return Address (High Byte)
IYL (Low Byte) to Stack
IYH (High Byte) to Stack
IXL (Low Byte) to Stack
IXH (High Byte) to Stack
A Accumulator
B Accumulator
Condition Code Register to
Stack
Irrelevant Data
Service Routine Address
(High Byte)
Service Routine Address
(Low Byte)
Opcode (Legal Page Select)
Opcode (Illegal Second Byte)
Irrelevant Data
Irrelevant Data
Return Address (Low Byte)
Return Address (High Byte)
IYL (Low Byte) to Stack
IYH (High Byte) to Stack
IXL (Low Byte) to Stack
IXH (High Byte) to Stack
A Accumulator
B Accumulator
Condition Code Register to
Stack
Irrelevant Data
Service Routine Address
(High Byte)
Service Routine Address
(Low Byte)
* The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
TECHNICAL DATA
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
10-15
10
Freescale Semiconductor, Inc.
Table 10-2 Cycle-by-Cycle Operation — Inherent Mode (Sheet 4 of 4)
Reference
Number*
2-20
Address Mode
and Instructions
TEST
Cycles Cycle
#
Infinite
1
2
3
4
5–n
Address Bus
Opcode Address
Opcode Address + 1
Opcode Address + 1
Opcode Address + 2
Previous Address + 1
R/W
Line
1
1
1
1
1
Data Bus
Opcode ($00)
Irrelevant Data
Irrelevant Data
Irrelevant Data
Irrelevant Data
* The reference number is given to provide a cross-reference to Table 10-1.
Freescale Semiconductor, Inc...
Table 10-3 Cycle-by-Cycle Operation — Immediate Mode
10
Reference
Number*
Address Mode
and Instructions
3-1
2
1
2
Opcode Address
Opcode Address + 1
3-2
ADCA, ADCB, ADDA,
ADDB, ANDA, ANDB,
BITA, BITB, CMPA,
CMPB, EORA, EORB,
LDAA, LDAB, ORAA,
ORAB, SBCA, SBCB,
SUBA, SUBB,
LDD, LDS, LDX
3
3-3
ADDD, CPX, SUBD
4
3-4
LDY
4
1
2
3
1
2
3
4
1
Opcode Address
Opcode Address + 1
Opcode Address + 2
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
Opcode Address
1
1
1
1
1
1
1
1
2
3
4
1
2
3
4
5
Opcode Address + 1
Opcode Address + 2
Opcode Address + 3
Opcode Address
Opcode Address + 1
Opcode Address + 2
Opcode Address + 3
$FFFF
1
1
1
1
1
1
1
1
3-5
CPD, CPY
Cycles Cycle
#
5
Address Bus
Data Bus
R/W
Line
1 Opcode
1 Operand Data
Opcode
Operand Data (High Byte)
Operand Data (Low Byte)
Opcode
Operand Data (High Byte)
Operand Data (Low Byte)
Irrelevant Data
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($EC)
Operand Data (High Byte)
Operand Data (Low Byte)
Opcode (Page Select Byte)
Opcode (Second Byte)
Operand Data (High Byte)
Operand Data (Low Byte)
Irrelevant Data
*The reference number is given to provide a cross-reference to Table 10-1.
Table 10-4 Cycle-by-Cycle Operation — Direct Mode (Sheet 1 of 2)
Reference
Number*
Address Mode
and Instructions
4-1
ADCA, ADCB, ADDA,
ADDB, ANDA, ANDB,
BITA, BITB, CMPA,
CMPB, EORA, EORB,
LDAA, LDAB, ORAA,
ORAB, SBCA, SBCB,
SUBA, SUBB
STAA, STAB
4-2
Cycles Cycle
#
3
3
Address Bus
Data Bus
R/W
Line
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Operand Data
1
2
Opcode Address
Opcode Address + 1
3
Operand Address
1
2
Opcode Address
Opcode Address + 1
1
1
3
Operand Address
0
Opcode
Operand Address (Low Byte)
(High Byte Assumed to be $00)
Data from Accumulator
*The reference number is given to provide a cross-refrerence to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-16
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table 10-4 Cycle-by-Cycle Operation — Direct Mode (Sheet 2 of 2)
Reference
Number*
4-3
4-4
Freescale Semiconductor, Inc...
4-5
4-6
4-7
4-8
4-9
4-10
4-11
Address Mode
and Instructions
LDD, LDS, LDX
Cycles Cycle
#
4
STD, STS, STX
4
LDY
5
STY
5
ADDD, CPX, SUBD
JSR
5
5
CPD, CPY
6
BCLR, BSET
BRCLR, BRSET
6
6
Address Bus
1
2
Opcode Address
Opcode Address + 1
3
4
1
2
Operand Address
Operand Address + 1
Opcode Address
Opcode Address + 1
3
4
1
Operand Address
Operand Address + 1
Opcode Address
2
3
Opcode Address + 1
Opcode Address + 2
4
5
1
Operand Address
Operand Address + 1
Opcode Address
2
3
Opcode Address + 1
Opcode Address + 2
4
5
1
2
Operand Address
Operand Address + 1
Opcode Address
Opcode Address + 1
3
4
5
1
2
Operand Address
Operand Address + 1
$FFFF
Opcode Address
Opcode Address + 1
3
4
5
1
2
3
Subroutine Address
Stack Pointer
Stack Pointer – 1
Opcode Address
Opcode Address + 1
Opcode Address + 2
4
5
6
1
2
Operand Address
Operand Address + 1
$FFFF
Opcode Address
Opcode Address + 1
3
4
5
6
1
2
Operand Address
Opcode Address + 2
$FFFF
Operand Address
Opcode Address
Opcode Address + 1
3
4
5
6
Operand Address
Opcode Address + 2
Opcode Address + 3
$FFFF
Data Bus
R/W
Line
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
0 Register Data (High Byte)
0 Register Data (Low Byte)
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte) ($DE)
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte) ($DF)
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
0 Register Data (High Byte)
0 Register Data (Low Byte)
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Irrelevant Data
1 Opcode ($9D)
1 Subroutine Address (Low Byte)
(High Byte Assumed to be $00)
1 First Subroutine Opcode
0 Return Address (Low Byte)
0 Return Address (High Byte)
1 Opcode (Page Select Byte)
1 Opcode (Second Byte)
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Irrelevant Data
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Original Operand Data
1 Mask Byte
1 Irrelevant Data
0 Result Operand Data
1 Opcode
1 Operand Address (Low Byte)
(High Byte Assumed to be $00)
1 Original Operand Data
1 Mask Byte
1 Branch Offset
1 Irrelevant Data
*The reference number is given to provide a cross-refrerence to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
TECHNICAL DATA
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
10-17
10
Freescale Semiconductor, Inc.
Table 10-5 Cycle-by-Cycle Operation — Extended Mode (Sheet 1 of 2)
Freescale Semiconductor, Inc...
Reference
Number*
10
Address Mode
and Instructions
Cycles Cycle
#
1
2
3
1
2
3
4
Opcode Address
Opcode Address + 1
Opcode Address + 2
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
R/W
Line
1
1
1
1
1
1
1
6
1
2
3
4
1
2
3
4
5
1
2
3
4
5
1
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
Operand Address + 1
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
Operand Address + 1
Opcode Address
1
1
1
0
1
1
1
1
1
1
1
1
0
0
1
6
2
3
4
5
6
1
Opcode Address + 1
Opcode Address + 2
Opcode Address + 3
Operand Address
Operand Address + 1
Opcode Address
1
1
1
1
1
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
Opcode Address + 1
Opcode Address + 2
Opcode Address + 3
Operand Address
Operand Address + 1
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
$FFFF
Operand Address
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
$FFFF
$FFFF
Opcode Address
Opcode Address + 1
Opcode Address + 2
Operand Address
Operand Address + 1
$FFFF
1
1
1
0
0
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
1
5-1
JMP
3
5-2
4
5-3
ADCA, ADCB, ADDA,
ADDB, ANDA, ANDB,
BITA, BITB, CMPA,
CMPB, EORA, EORB,
LDAA, LDAB, ORAA
ORAB, SBCA, SBCB,
SUBA, SUBB
STAA, STAB
5-4
LDD, LDS, LDX
5
5-5
STD, STS, STX
5
5-6
LDY
5-7
STY
Address Bus
4
5-8
ASL, ASR, CLR,
COM, DEC, INC,
LSL, LSR, NEG,
ROL, ROR
6
5-9
TST
6
5-10
ADDD, CPX, SUBD
6
Data Bus
Opcode ($7E)
Jump Address (High Byte)
Jump Address (Low Byte)
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Operand Data
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Accumulator Data
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Operand Data (High Byte)
Operand Data (Low Byte)
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Register Data (High Byte)
Register Data (Low Byte)
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($FE)
Operand Address (High Byte)
Operand Address (Low Byte)
Operand Data (High Byte)
Operand Data (Low Byte)
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($FF)
Operand Address (High Byte)
Operand Address (Low Byte)
Register Data (High Byte)
Register Data (Low Byte)
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Original Operand Data
Irrelevant Data
Result Operand Data
Opcode ($7D)
Operand Address (High Byte)
Operand Address (Low Byte)
Original Operand Data
Irrelevant Data
Irrelevant Data
Opcode
Operand Address (High Byte)
Operand Address (Low Byte)
Operand Data (High Byte)
Operand Data (Low Byte)
Irrelevant Data
*The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-18
For More Information On This Product,
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table 10-5 Cycle-by-Cycle Operation — Extended Mode (Sheet 2 of 2)
Freescale Semiconductor, Inc...
Reference
Number*
Address Mode
and Instructions
Cycles Cycle
#
5-11
CPD, CPY
7
5-12
JSR
6
1
2
3
4
5
6
7
1
2
3
4
5
6
Address Bus
Opcode Address
Opcode Address + 1
Opcode Address + 2
Opcode Address + 3
Operand Address
Operand Address + 1
$FFFF
Opcode Address
Opcode Address + 1
Opcode Address + 2
Subroutine Address
Stack Pointer
Stack Pointer – 1
R/W
Line
1
1
1
1
1
1
1
1
1
1
1
0
0
Data Bus
Opcode (Page Select Byte)
Opcode (Second Byte)
Operand Address (High Byte)
Operand Address (Low Byte)
Operand Data (High Byte)
Operand Data (Low Byte)
Irrelevant Data
Opcode ($BD)
Subroutine Address (High Byte)
Subroutine Address (Low Byte)
First Opcode in Subroutine
Return Address (Low Byte)
Return Address (High Byte)
*The reference number is given to provide a cross-reference to Table 10-1.
Table 10-6 Cycle-by-Cycle Operation — Indexed X Mode (Sheet 1 of 2)
Reference
Number*
Address Mode
and Instructions
Cycles Cycle
#
6-1
JMP
3
6-2
ADCA, ADCB, ADDA,
ADDB, ANDA, ANDB,
BITA, BITB, CMPA,
CMPB, EORA, EORB,
LDAA, LDAB, ORAA,
ORAB, SBCA, SBCB,
SUBA, SUBB
ASL, ASR, CLR,
COM, DEC, INC,
LSL, LSR, NEG,
ROL, ROR
4
6-4
TST
6
6-5
STAA, STAB
4
6-6
LDD, LDS, LDX
5
6-3
6
Address Bus
1
2
3
1
2
3
4
Opcode Address
Opcode Address + 1
$FFFF
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
R/W
Line
1
1
1
1
1
1
1
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
1
2
3
4
5
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
$FFFF
(IX) + Offset
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
$FFFF
$FFFF
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
(IX) + Offset + 1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
Data Bus
Opcode ($6E)
Index Offset
Irrelevant Data
Opcode
Index Offset
Irrelevant Data
Operand Data
Opcode
Index Offset
Irrelevant Data
Original Operand Data
Irrelevant Data
Result Operand Data
Opcode ($6D)
Index Offset
Irrelevant Data
Original Operand Data
Irrelevant Data
Irrelevant Data
Opcode
Index Offset
Irrelevant Data
Accumulator Data
Opcode
Index Offset
Irrelevant Data
Operand Data (High Byte)
Operand Data (Low Byte)
*The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
TECHNICAL DATA
For More Information On This Product,
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MOTOROLA
10-19
10
Freescale Semiconductor, Inc.
Table 10-6 Cycle-by-Cycle Operation — Indexed X Mode (Sheet 2 of 2)
Reference
Number*
Freescale Semiconductor, Inc...
6-7
10
Address Mode
and Instructions
LDY
Cycles Cycle
#
Address Bus
6
1
Opcode Address
2
3
4
5
6
1
2
3
4
5
1
Opcode Address + 1
Opcode Address + 2
$FFFF
(IX) + Offset
(IX) + Offset + 1
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
(IX) + Offset + 1
Opcode Address
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
7
1
2
3
4
5
6
1
2
3
4
5
6
7
1
2
3
4
5
6
7
Opcode Address + 1
Opcode Address + 2
$FFFF
(IX) + Offset
(IX) + Offset + 1
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
(IX) + Offset + 1
$FFFF
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
(IX) + Offset
(IX) + Offset + 1
$FFFF
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
Stack Pointer
Stack Pointer – 1
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
Opcode Address + 2
$FFFF
(IX) + Offset
Opcode Address
Opcode Address + 1
$FFFF
(IX) + Offset
Opcode Address + 2
Opcode Address + 3
$FFFF
6-8
STD, STS, STX
5
6-9
STY
6
6-10
ADDD, CPX, SUBD
6
6-11
CPD, CPY
7
6-12
JSR
6
6-13
BCLR, BSET
7
6-14
BRCLR, BRSET
7
Data Bus
R/W
Line
1 Opcode (Page Select Byte)
($1A)
1 Opcode (Second Byte) ($EE)
1 Index Offset
1 Irrelevant Data
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Opcode
1 Index Offset
1 Irrelevant Data
0 Register Data (High Byte)
0 Register Data (Low Byte)
1 Opcode (Page Select Byte)
($1A)
1 Opcode (Second Byte) ($EF)
1 Index Offset
1 Irrelevant Data
0 Register Data (High Byte)
0 Register Data (Low Byte)
1 Opcode
1 Index Offset
1 Irrelevant Data
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Irrelevant Data
1 Opcode (Page Select Byte)
1 Opcode (Second Byte)
1 Index Offset
1 Irrelevant Data
1 Operand Data (High Byte)
1 Operand Data (Low Byte)
1 Irrelevant Data
1 Opcode ($AD)
1 Index Offset
1 Irrelevant Data
1 First Opcode in Subroutine
0 Return Address (Low Byte)
0 Return Address (High Byte)
1 Opcode
1 Index Offset
1 Irrelevant Data
1 Original Operand Data
1 Mask Byte
1 Irrelevant Data
0 Result Operand Data
1 Opcode
1 Index Offset
1 Irrelevant Data
1 Original Operand Data
1 Mask Byte
1 Branch Offset
1 Irrelevant Data
*The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-20
For More Information On This Product,
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table 10-7 Cycle-by-Cycle Operation — Indexed Y Mode (Sheet 1 of 2)
Reference
Number*
7-1
Freescale Semiconductor, Inc...
7-2
7-3
7-4
7-5
Address Mode
and Instructions
JMP
Cycles Cycle
#
Address Bus
Data Bus
R/W
Line
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte) ($6E)
1 Index Offset
1 Irrelevant Data
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte)
1 Index Offset
1 Irrelevant Data
1 Operand Data
4
1
Opcode Address
ADCA, ADCB, ADDA,
ADDB, ANDA ANDB,
BITA, BITB, CMPA,
CMPB, EORA, EORB,
LDAA, LDAB, ORAA,
ORAB, SBCA, SBCB,
SUBA, SUBB,
ASL, ASR, CLR,
COM, DEC, INC,
LSL, LSR, NEG,
ROL, ROR
5
2
3
4
1
Opcode Address + 1
Opcode Address + 2
$FFFF
Opcode Address
2
3
4
5
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
TST
7
1
2
3
4
5
6
7
1
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
$FFFF
(IY) + Offset
Opcode Address
1
1
1
1
1
1
0
1
5
2
3
4
5
6
7
1
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
$FFFF
$FFFF
Opcode Address
1
1
1
1
1
1
1
2
3
4
5
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
7
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
(IY) + Offset + 1
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
(IY) + Offset + 1
Opcode Address
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
(IY) + Offset + 1
$FFFF
1
1
1
0
1
1
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
1
1
STAA, STAB
7
7-6
LDD, LDS, LDX,
LDY
6
7-7
STD, STS, STX,
STY
6
7-8
ADDD, CPD, CPX,
CPY, SUBD
7
Opcode (Page Select Byte)
Opcode (Second Byte)
Index Offset
Irrelevant Data
Original Operand Data
Irrelevant Data
Result Operand Data
Opcode (Page Select Byte)
($18)
Opcode (Second Byte) ($6D)
Index Offset
Irrelevant Data
Original Operand Data
Irrelevant Data
Irrelevant Data
Opcode (Page Select Byte)
($18)
Opcode (Second Byte)
Index Offset
Irrelevant Data
Accumulator Data
Opcode (Page Select Byte)
Opcode (Second Byte)
Index Offset
Irrelevant Data
Operand Data (High Byte)
Operand Data (Low Byte)
Opcode (Page Select Byte)
Opcode (Second Byte)
Index Offset
Irrelevant Data
Register Data (High Byte)
Register Data (Low Byte)
Opcode (Page Select Byte)
Opcode (Second Byte)
Index Offset
Irrelevant Data
Operand Data (High Byte)
Operand Data (Low Byte)
Irrelevant Data
* The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
TECHNICAL DATA
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MOTOROLA
10-21
10
Freescale Semiconductor, Inc.
Table 10-7 Cycle-by-Cycle Operation — Indexed Y Mode (Sheet 2 of 2)
Reference
Number*
7-9
Freescale Semiconductor, Inc...
7-10
10
7-11
Address Mode
and Instructions
JSR
BCLR, BSET
BRCLR, BRSET
Cycles Cycle
#
Address Bus
7
1
Opcode Address
8
2
3
4
5
6
7
1
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
Stack Pointer
Stack Pointer – 1
Opcode Address
8
2
3
4
5
6
7
8
1
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
Opcode Address + 3
$FFFF
(IY) + Offset
Opcode Address
2
3
4
5
6
7
8
Opcode Address + 1
Opcode Address + 2
$FFFF
(IY) + Offset
Opcode Address + 3
Opcode Address + 4
$FFFF
Data Bus
R/W
Line
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte) ($AD)
1 Index Offset
1 Irrelevant Data
1 First Opcode in Subroutine
0 Return Address (Low Byte)
0 Return Address (High Byte)
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte)
1 Index Offset
1 Irrelevant Data
1 Original Operand Data
1 Mask Byte
1 Irrelevant Data
0 Result Operand Data
1 Opcode (Page Select Byte)
($18)
1 Opcode (Second Byte)
1 Index Offset
1 Irrelevant Data
1 Original Operand Data
1 Mask Byte
1 Branch Offset
1 Irrelevant Data
* The reference number is given to provide a cross-reference to Table 10-1.
Table 10-8 Cycle-by-Cycle Operation — Relative Mode
Reference
Number*
8-1
8-2
Address Mode
and Instructions
BCC, BCS, BEQ,
BGE, BGT, BHI,
BHS, BLE, BLO,
BLS, BLT, BMI,
BNE, BPL, BRA,
BRN, BVC, BVS,
BSR
Cycles Cycle
#
Address Bus
3
1
2
3
Opcode Address
Opcode Address + 1
$FFFF
6
1
2
3
4
5
6
Opcode Address
Opcode Address + 1
$FFFF
Subroutine Address
Stack Pointer
Stack Pointer – 1
Data Bus
R/W
Line
1 Opcode
1 Branch Offset
1 Irrelevant Data
1
1
1
1
0
0
Opcode ($8D)
Branch Offset
Irrelevant Data
Opcode of Next Instruction
Return Address (Low Byte)
Return Address (High Byte)
*The reference number is given to provide a cross-reference to Table 10-1.
CPU, ADDRESSING MODES, AND INSTRUCTION SET
10-22
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
A ELECTRICAL CHARACTERISTICS
Freescale Semiconductor, Inc...
Table A-1 Maximum Rating
Rating
Supply Voltage
Input Voltage
Operating Temperature Range
MC68HC11A8
MC68HC11A8C
MC68HC11A8V
MC68HC11A8M
MC68L11A8
Storage Temperature Range
Current Drain per Pin*
Excluding VDD, VSS, VRH, and VRL
Symbol
VDD
Vin
TA
Value
– 0.3 to + 7.0
– 0.3 to + 7.0
TL to TH
0 to 70
– 40 to 85
– 40 to 105
– 40 to 125
– 20 to 70
– 55 to 150
25
Tstg
ID
Unit
V
V
°C
°C
mA
*One pin at a time, observing maximum power dissipation limits.
Internal circuitry protects the inputs against damage caused by high static voltages or
electric fields; however, normal precautions are necessary to avoid application of any
voltage higher than maximum-rated voltages to this high-impedance circuit. Extended
operation at the maximum ratings can adversely affect device reliability. Tying unused
inputs to an appropriate logic voltage level (either GND or VDD) enhances reliability of
operation.
Table A-2 Thermal Characteristics
Characteristic
Average Junction Temperature
Ambient Temperature
Package Thermal Resistance (Junction-to-Ambient)
52-Pin Plastic Quad Pack (PLCC)
48-Pin Plastic Dual In-Line Package (DIP)
Total Power Dissipation
Symbol
TJ
TA
ΘJA
Device Internal Power Dissipation
I/O Pin Power Dissipation
A Constant
PINT
PI/O (Note 2)
K
PD
Value
TA + (PD x ΘJA)
User-determined
Unit
°C
°C
°C/W
50
40
PINT + PI/O
K ÷ (TJ + 273°C) (Note 1)
IDD x VDD
User-determined
PD x (TA + 273°C) +
ΘJA x PD2 (Note 3)
W
W
W
W · °C
NOTES:
1. This is an approximate value, neglecting PI/O.
2. For most applications PI/O « PINT and can be neglected.
3. K is a constant pertaining to the device. Solve for K with a known TA and a measured PD (at equilibrium). Use
this value of K to solve for PD and TJ iteratively for any value of TA.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-1
A
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Table A-3 DC Electrical Characteristics
A
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted
Characteristics
Symbol
Min
Max
Output Voltage (Note 1)
All Outputs except XTAL
VOL
—
0.1
All Outputs Except XTAL, RESET,
VDD – 01
VOH
—
ILoad =± 10.0 µA
and MODA
VDD – 0.8
—
Output High Voltage (Note 1)
All Outputs Except XTAL,
VOH
ILoad = – 0.8 mA, VDD = 4.5 V
RESET, and MODA
—
0.4
Output Low Voltage
All Outputs Except XTAL
VOL
ILoad = 1.6 mA
VIH
0.7 x VDD
VDD + 0.3
Input High Voltage
All Inputs Except RESET
VDD + 0.3
RESET
0.8 x VDD
VSS – 0.3
0.2 x VDD
Input Low Voltage
All Inputs
VIL
I/O Ports, Three-State Leakage
PA7, PC0-PC7, PD0-PD5,
IOZ
—
±10
Vin = VIH or VIL
AS/STRA, MODA/LIR, RESET
lin
Input Leakage Current (Note 2)
Vin = VDD or VSS
PA0-PA2, IRQ, XIRQ
—
±1
—
±10
Vin = VDD or VSS
MODB/VSTBY
RAM Standby Voltage
Power down
VSB
4.0
VDD
RAM Standby Current
Power down
ISB
—
10
Total Supply Current (Note 3)
RUN:
IDD
15
Single-Chip Mode
dc – 2 MHz
—
27
3 MHz
—
27
Expanded Multiplexed Mode
dc – 2 MHz
—
35
3 MHz
—
WAIT:
All Peripheral Functions Shut Down
Single-Chip Mode
Expanded Multiplexed Mode
STOP:
No Clocks, Single-Chip Mode
Input Capacitance
PA0-PA2, PE0-PE7, IRQ, XIRQ, EXTAL
PA7, PC0-PC7, PD0-PD5, AS/STRA, MODA/LIR, RESET
Power Dissipation
Single-Chip Mode
Expanded Multiplexed Mode
Single-Chip Mode
Expanded Multiplexed Mode
PD
2 MHz
3 MHz
V
V
V
V
µA
µA
V
µA
mA
mA
WIDD
dc – 2 MHz
3 MHz
dc – 2 MHz
3 MHz
SIDD
dc – 2 MHz
3 MHz
Cin
Unit
V
—
—
—
—
6
15
10
20
—
—
—
—
50
150
8
12
—
—
—
—
85
150
150
195
µA
pF
mW
NOTES:
1. VOH specification for RESET and MODA is not applicable because they are open-drain pins. VOH specification
not applicable to ports C and D in wired-OR mode.
2. Refer to A/D specification for leakage current for port E.
3. EXTAL is driven with a square wave, and
tcyc = 500 ns for 2 MHz rating;
tcyc = 333 ns for 3 MHz rating.
VIL ≤ 0.2 V
VIH ≥ VDD – 0.2 V
No dc loads.
ELECTRICAL CHARACTERISTICS
A-2
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Table A-3a DC Electrical Characteristics (MC68L11A8)
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted
Characteristics
Symbol
Min
Max
Output Voltage (Note 1)
All Outputs except XTAL
VOL
—
0.1
All Outputs Except XTAL, RESET,
VDD – 01
VOH
—
ILoad =± 10.0 µA
and MODA
VDD – 0.8
3
Output High Voltage (Note 1)
All Outputs Except XTAL,
VOH
ILoad = – 0.8 mA, VDD = 4.5 V
RESET, and MODA
—
0.4
Output Low Voltage
All Outputs Except XTAL
VOL
ILoad = 1.6 mA
VIH
0.7 x VDD
VDD + 0.3
Input High Voltage
All Inputs Except RESET
VDD + 0.3
RESET
0.8 x VDD
VSS – 0.3
0.2 x VDD
Input Low VoltageAll Inputs
VIL
I/O Ports, Three-State Leakage PA7, PC0-PC7, PD0-PD5,
IOZ
—
±10
Vin = VIH or VIL
AS/STRA, MODA/LIR, RESET
lin
Input Leakage Current (Note 2)
Vin = VDD or VSS
PA0-PA2, IRQ, XIRQ
—
±1
—
±10
Vin = VDD or VSS
MODB/VSTBY
RAM Standby Voltage
Power down
VSB
2.0
VDD
RAM Standby Current
Power down
ISB
—
10
Total Supply Current (Note 3)
RUN:
IDD
4
Single-Chip Mode
dc – 1 MHz
—
8
2MHz
—
7
Expanded Multiplexed Mode
dc – 1 MHz
—
14
2 MHz
—
WAIT:
All Peripheral Functions Shut Down
Single-Chip Mode
Expanded Multiplexed Mode
STOP:
No Clocks, Single-Chip Mode
Input Capacitance PA0-PA2, PE0-PE7, IRQ, XIRQ, EXTAL
PA7, PC0-PC7, PD0-PD5, AS/STRA, MODA/LIR, RESET
Power Dissipation
Single-Chip Mode
Expanded Multiplexed Mode
Single-Chip Mode
Expanded Multiplexed Mode
PD
1 MHz
2 MHz
V
V
V
V
µA
µA
V
µA
mA
mA
WIDD
dc – 1 MHz
2 MHz
dc – 1 MHz
2 MHz
SIDD
dc – 1 MHz
2 MHz
Cin
Unit
V
—
—
—
—
3
6
2.5
5
—
—
—
—
25
25
8
12
—
—
—
—
12
21
24
42
µA
pF
mW
NOTES:
1. VOH specification for RESET and MODA is not applicable because they are open-drain pins. VOH specification
not applicable to ports C and D in wired-OR mode.
2. Refer to A/D specification for leakage current for port E.
3. EXTAL is driven with a square wave, and
tcyc = 1000 ns for 1MHz rating;
tcyc = 500 ns for 2 MHz rating.
VIL ≤ 0.2 V
VIH ≥ VDD – 0.2 V
No dc loads.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-3
A
Freescale Semiconductor, Inc.
CLOCKS,
STROBES
~ VDD
0.4 Volts
~ V SS
0.4 Volts
VDD – 0.8 Volts
NOM.
NOM.
70% of V DD
INPUTS
20% of V DD
NOMINAL TIMING
~ VDD
VDD – 0.8 Volts
OUTPUTS
0.4 Volts
~ VSS
Freescale Semiconductor, Inc...
DC TESTING
CLOCKS,
STROBES
A
~ VDD
70% of V DD
20% of VDD
~ VSS
20% of V DD
SPEC
SPEC
70% of VDD
INPUTS
20% of V DD
(NOTE 2)
VDD – 0.8 Volts
0.4 Volts
SPEC TIMING
~ VDD
OUTPUTS
~ VSS
70% of V DD
20% of V DD
AC TESTING
NOTES:
1. Full test loads are applied during all DC electrical tests and AC timing measurements.
2. During AC timing measurements, inputs are driven to 0.4 volts and VDD – 0.8 volts while timing
measurements are taken at the 20% and 70% of VDD points.
TEST METHODS
Figure A-1 Test Methods
ELECTRICAL CHARACTERISTICS
A-4
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table A-4 Control Timing
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH
Characteristic
Symbol
Max
fo
dc
tcyc
1000
fXTAL
—
4 fo
dc
Processor Control Setup tPCSU = 1/4 tcyc + 50 ns
Time
tPCSU
Reset Input Pulse Width (To Guarantee External
(Note 1)
Reset Vector)
(Minimum Input Time;
Can Be Preempted by
Internal Reset)
PWRSTL
Frequency of Operation
E-Clock Period
Crystal Frequency
External Oscillator Frequency
Freescale Semiconductor, Inc...
1.0 MHz
Min
2.0 MHz
Min
Max
1.0
dc
—
500
4.0
—
4.0
dc
300
—
8
1
—
—
3.0 MHz
Unit
Min
Max
2.0
dc
3.0
MHz
—
333
—
ns
8.0
—
12.0
MHz
8.0
dc
12.0
MHz
175
—
133
—
ns
8
1
—
—
8
1
—
—
tcyc
Mode Programming Setup Time
tMPS
2
—
2
—
2
—
tcyc
Mode Programming Hold Time
tMPH
10
—
10
—
10
—
ns
PWIRQ
1020
—
520
—
353
—
ns
tWRS
—
4
—
4
—
4
tcyc
PWTIM
1020
—
520
—
353
—
ns
Interrupt Pulse Width,
PWIRQ = tcyc + 20 ns
IRQ Edge-Sensitive Mode
Wait Recovery Start-up Time
Timer Pulse Width
PWTIM = tcyc + 20 ns
Input Capture,
Pulse Accumulator Input
NOTES:
1. RESET is recognized during the first clock cycle it is held low. Internal circuitry then drives the pin low for four
clock cycles, releases the pin, and samples the pin level two cycles later to determine the source of the interrupt.
Refer to 9 RESETS, INTERRUPTS, AND LOW POWER MODES for further detail.
2. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-5
A
Freescale Semiconductor, Inc.
Table A-4a Control Timing (MC68L11A8)
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH
Characteristic
Frequency of Operation
E-Clock Period
Crystal Frequency
Freescale Semiconductor, Inc...
External Oscillator Frequency
A
Symbol
1.0 MHz
Min
Max
fo
dc
tcyc
1000
fXTAL
—
4 fo
dc
Processor Control Setup
Time
tPCSU = 1/4 tcyc + 50 ns
tPCSU
Reset Input Pulse Width
(Note 1)
(To Guarantee External
Reset Vector)
(Minimum Input Time;
Can Be Preempted by
Internal Reset)
PWRSTL
2.0 MHz
Unit
Min
Max
1.0
dc
2.0
MHz
—
500
—
ns
4.0
—
8.0
MHz
4.0
dc
8.0
MHz
325
—
200
—
ns
8
1
—
—
8
1
—
—
tcyc
Mode Programming Setup Time
tMPS
2
—
2
—
tcyc
Mode Programming Hold Time
tMPH
10
—
10
—
ns
PWIRQ = tcyc + 20 ns
PWIRQ
1020
—
520
—
ns
Wait Recovery Start-up Time
tWRS
—
4
—
4
tcyc
Timer Pulse Width
Input Capture,
Pulse Accumulator Input
PWTIM = tcyc + 20 ns
PWTIM
1020
—
520
—
ns
Interrupt Pulse Width,
IRQ Edge-Sensitive Mode
NOTES:
1. RESET is recognized during the first clock cycle it is held low. Internal circuitry then drives the pin low for four
clock cycles, releases the pin, and samples the pin level two cycles later to determine the source of the interrupt.
Refer to 9 RESETS, INTERRUPTS, AND LOW POWER MODES for further detail.
2. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
A-6
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
PA[2:0] 1
PA[2:0] 2
PA71,3
PWTIM
PA72,3
Freescale Semiconductor, Inc...
NOTES:
1. Rising edge sensitive input
2. Falling edge sensitive input
3. Maximum pulse accumulator clocking rate is E-clock frequency divided by 2.
TIMER INPUTS TIM
A
Figure A-2 Timer Inputs
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-7
4064 tCYC
FFFE
FFFE
FFFE
FFFE
FFFF
tPCSU
NEW
PC
PWRSTL
FFFE
tMPS
FFFE
FFFE
ELECTRICAL CHARACTERISTICS
Freescale Semiconductor, Inc...
VDD
EXTAL
E
RESET
MODA, MODB
ADDRESS
Figure A-3 POR and External Reset Timing Diagram
tMPH
FFFE
FFFE
FFFF
NEW
PC
POR EXT RESET TIM
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MOTOROLA
A-8
Freescale Semiconductor, Inc.
MC68HC11A8
TECHNICAL DATA
INTERNAL
CLOCKS
IRQ1
IRQ
or XIRQ
E
ADDRESS4
ADDRESS5
STOP
ADDR
STOP
ADDR
STOP
ADDR + 1
STOP
ADDR + 1
PWIRQ
tSTOPDELAY3
NOTES:
1. Edge Sensitive IRQ pin (IRQE bit = 1)
2. Level sensitive IRQ pin (IRQE bit = 0)
3. tSTOPDELAY = 4064 tCYC if DLY bit = 1 or 4 tCYC if DLY = 0.
4. XIRQ with X bit in CCR = 1.
5. IRQ or (XIRQ with X bit in CCR = 0).
STOP
ADDR + 1
STOP
ADDR + 1
OPCODE
SP…SP–7
SP – 8
SP – 8
FFF2
(FFF4)
FFF3
(FFF5)
Resume program with instruction which follows the STOP instruction.
STOP
ADDR + 2
Freescale Semiconductor, Inc...
ELECTRICAL CHARACTERISTICS
Figure A-4 STOP Recovery Timing Diagram
NEW
PC
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
MOTOROLA
A-9
STOP RECOVERY TIM
E
IRQ, XIRQ,
OR INTERNAL
INTERRUPTS
ADDRESS
R/W
WAIT
ADDR
WAIT
ADDR + 1
SP
PCL
SP – 1
SP – 2…SP – 8
PCH, YL, YH, XL, XH, A, B, CCR
STACK REGISTERS
SP – 8
SP – 8…SP – 8
tPCSU
SP – 8
tWRS
SP – 8
SP – 8
ELECTRICAL CHARACTERISTICS
Freescale Semiconductor, Inc...
NOTE: RESET also causes recovery from WAIT.
Figure A-5 WAIT Recovery Timing Diagram
VECTOR
ADDR
VECTOR
ADDR + 1
NEW
PC
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MOTOROLA
A-10
Freescale Semiconductor, Inc.
MC68HC11A8
TECHNICAL DATA
WAIT RECOVERY TIM
E
IRQ 1
tPCSU
NEXT
OPCODE
––
NEXT
OP + 1
PWIRQ
ADDRESS
OP
CODE
IRQ 2, XIRQ,
OR INTERNAL
INTERRUPT
DATA
R/W
SP
PCL
PCH
SP – 1
IYL
SP – 2
IYH
SP – 3
IXL
SP – 4
IXH
SP – 5
B
SP – 6
A
SP – 7
CCR
SP – 8
––
SP – 8
VECT
MSB
VECTOR
ADDR
VECT
LSB
VECTOR
ADDR + 1
ELECTRICAL CHARACTERISTICS
Freescale Semiconductor, Inc...
NOTES:
1. Edge sensitive IRQ pin (IRQE bit = 1)
2. Level sensitive IRQ pin (IRQE bit = 0)
Figure A-6 Interrupt Timing Diagram
NEW
PC
OP
CODE
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
MOTOROLA
A-11
INTERRUPT TIM
Freescale Semiconductor, Inc.
Table A-5 Peripheral Port Timing
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH
Freescale Semiconductor, Inc...
Characteristic
A
Symbol
1.0 MHz
Min
Max
2.0 MHz
Min
Max
3.0 MHz
Min
Max
Unit
Frequency of Operation (E-Clock Frequency)
fo
dc
1.0
dc
2.0
dc
3.0
MHz
E-Clock Period
tcyc
1000
—
500
—
333
—
ns
Peripheral Data Setup Time
(MCU Read of Ports A, C, D, and E)
tPDSU
100
—
100
—
100
—
ns
Peripheral Data Hold Time
(MCU Read of Ports A, C, D, and E)
tPDH
50
—
50
—
50
—
ns
Delay Time, Peripheral Data Write
MCU Write to Port A
MCU Writes to Ports B, C, and D
tPWD = 1/4 tcyc + 100 ns
tPWD
—
200
—
200
—
200
—
350
—
225
—
183
Input Data Setup Time (Port C)
tIS
60
—
60
—
60
—
Input Data Hold Time (Port C)
tIH
100
—
100
—
100
—
ns
Delay Time, E Fall to STRB tDEB = 1/4 tcyc + 100 ns
tDEB
—
350
—
225
—
183
ns
ns
ns
Setup Time, STRA Asserted to E Fall (Note 1)
tAES
0
—
0
—
0
—
ns
Delay Time, STRA Asserted to Port C Data Output Valid
tPCD
—
100
—
100
—
100
ns
Hold Time, STRA Negated to Port C Data
tPCH
10
—
10
—
10
—
ns
Three-State Hold Time
tPCZ
—
150
—
150
—
150
ns
NOTES:
1. If this setup time is met, STRB acknowledges in the next cycle. If it is not met, the response may be delayed one
more cycle.
2. Port C and D timing is valid for active drive (CWOM and DWOM bits not set in PIOC and SPCR registers respectively).
3. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
A-12
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table A-5a Peripheral Port Timing (MC68L11A8)
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH
Freescale Semiconductor, Inc...
Characteristic
Symbol
1.0 MHz
Min
Max
2.0 MHz
Min
Max
Unit
Frequency of Operation (E-Clock Frequency)
fo
dc
1.0
dc
2.0
MHz
E-Clock Period
tcyc
1000
—
500
—
ns
Peripheral Data Setup Time
(MCU Read of Ports A, C, D, and E)
Peripheral Data Hold Time
(MCU Read of Ports A, C, D, and E)
Delay Time, Peripheral Data Write
MCU Write to Port A
MCU Writes to Ports B, C, and D
tPWD = 1/4 tcyc + 150 ns
tPDSU
100
—
100
—
ns
tPDH
50
—
50
—
ns
—
250
—
250
—
400
—
275
tPWD
ns
Input Data Setup Time (Port C)
tIS
60
—
60
—
ns
Input Data Hold Time (Port C)
tIH
100
—
100
—
ns
tDEB
—
400
—
275
ns
tAES
0
—
0
—
ns
Delay Time, E Fall to STRB
tDEB = 1/4 tcyc + 150 ns
Setup Time, STRA Asserted to E Fall (Note 1)
Delay Time, STRA Asserted to Port C Data Output Valid
tPCD
—
100
—
100
ns
Hold Time, STRA Negated to Port C Data
tPCH
10
—
10
—
ns
Three-State Hold Time
tPCZ
—
150
—
150
ns
NOTES:
1. If this setup time is met, STRB acknowledges in the next cycle. If it is not met, the response may be delayed one
more cycle.
2. Port C and D timing is valid for active drive (CWOM and DWOM bits not set in PIOC and SPCR registers respectively).
3. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-13
A
Freescale Semiconductor, Inc.
MCU WRITE TO PORT
E
tPWD
PORTS
B, C, D
PREVIOUS PORT DATA
NEW DATA VALID
tPWD
PREVIOUS PORT DATA
PORT A
NEW DATA VALID
Freescale Semiconductor, Inc...
A8 PORT WR TIM
Figure A-7 Port Write Timing Diagram
A
MCU READ OF PORT
E
tPDSU
tPDH
PORTS
A, C*, D
tPDSU
tPDH
PORT E
* FOR NON-LATCHED OPERATION OF PORT C
A8 PORT RD TIM
Figure A-8 Port Read Timing Diagram
MCU WRITE TO PORT B
E
tPWD
PORT B
PREVIOUS PORT DATA
NEW DATA VALID
tDEB
STRB (OUT)
OUTPUT STROBE TIM
Figure A-9 Simple Output Strobe Timing Diagram
ELECTRICAL CHARACTERISTICS
A-14
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
STRA (IN)
tIS
tIH
PORT C (IN)
INPUT STROBE TIM
Figure A-10 Simple Input Strobe Timing Diagram
Freescale Semiconductor, Inc...
READ PORTCL1
E
tDEB
"READY"
tDEB
STRB (OUT)
A
tAES
STRA (IN)
tIS
tIH
PORT C (IN)
NOTES:
1. After reading PIOC with STAF set
2. Figure shows rising edge STRA (EGA = 1) and high true STRB (INVB = 1).
PORTC INPUT HNDSHK TIM
Figure A-11 Port C Input Handshake Timing Diagram
WRITE PORTCL1
E
tPWD
PORT C (OUT)
PREVIOUS PORT DATA
NEW DATA VALID
tDEB
"READY"
tDEB
STRB (OUT)
tAES
STRA (IN)
NOTES:
1. After reading PIOC with STAF set
2. Figure shows rising edge STRA (EGA = 1) and high true STRB (INVB = 1).
PORTC OUTPUT HNDSHK TIM
Figure A-12 Port C Output Handshake Timing Diagram
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-15
Freescale Semiconductor, Inc.
READ PORTCL1
E
tPWD
PORT C (OUT)
(DDR = 1)
tDEB
tDEB
"READY"
STRB (OUT)
Freescale Semiconductor, Inc...
tAES
STRA (IN)
t PCD
PORT C (OUT)
(DDR = 0)
A
OLD DATA
tPCH
NEW DATA VALID
tPCZ
a) STRA ACTIVE BEFORE PORTCL WRITE
STRA (IN)
tPCH
tPCD
PORT C (OUT)
(DDR = 0)
NEW DATA VALID
b) STRA ACTIVE AFTER PORTCL WRITE
tPCZ
NOTES:
1. After reading PIOC with STAF set
2. Figure shows rising edge STRA (EGA = 1) and high true STRB (INVB = 1).
3STATE VAR HNDSHK
Figure A-13 Three-State Variation of Output Handshake Timing Diagram
(STRA Enables Output Buffer)
ELECTRICAL CHARACTERISTICS
A-16
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Table A-6 Analog-To-Digital Converter Characteristics
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH, 750 kHz ≤ E ≤ 3.0 MHz, unless otherwise noted
Characteristic
Parameter
Min
Absolute 2.0 MHz 3.0 MHz
Max
Max
Resolution
Number of Bits Resolved by A/D Converter
—
8
—
—
Non-Linearity Maximum Deviation from the Ideal A/D Transfer
—
—
± 1/2
±1
Characteristics
Zero Error
Difference Between the Output of an Ideal and an
—
—
± 1/2
±1
Actual for Zero Input Voltage
Full Scale Error Difference Between the Output of an Ideal and an
—
—
± 1/2
±1
Actual A/D for Full-Scale Input Voltage
Total Unadjust- Maximum Sum of Non-Linearity, Zero Error, and
—
—
± 1/2
± 1 1/2
ed Error
Full-Scale Error
Quantization
Uncertainty Because of Converter Resolution
—
—
± 1/2
± 1/2
Error
Absolute Accu- Difference Between the Actual Input Voltage and
—
—
±1
±2
racy
the Full-Scale Weighted Equivalent of the Binary
Output Code, All Error Sources Included
—
VRH
VRH
Conversion
Analog Input Voltage Range
VRL
Range
Maximum Analog Reference Voltage (Note 2)
VRL
—
VDD + 0.1 VDD +
VRH
0.1
Minimum Analog Reference Voltage (Note 2)
VSS –
—
VRH
VRH
VRL
0.1
Minimum Difference between VRH and VRL
3
—
—
—
∆VR
(Note 2)
Conversion
Total Time to Perform a Single Analog-to-Digital
Time
Conversion:
a. E Clock
—
32
—
—
b. Internal RC Oscillator
—
—
tcyc + 32 tcyc + 32
Monotonicity
Zero Input
Reading
Full Scale
Reading
Sample Acquisition Time
Sample/Hold
Capacitance
Input Leakage
Unit
Bits
LSB
LSB
LSB
LSB
LSB
LSB
V
V
V
V
Conversion Result Never Decreases with an Increase in Input Voltage and has no Missing Codes
Conversion Result when Vin = VRL
—
Guaranteed
—
—
tcyc
µs
—
00
—
—
—
Hex
Conversion Result when Vin = VRH
—
—
FF
FF
Hex
Analog Input Acquisition Sampling Time:
a. E Clock
b. Internal RC Oscillator
Input Capacitance during Sample PE0-PE7
—
—
—
12
—
20 (Typ)
—
12
—
—
12
—
tcyc
µs
pF
Input Leakage on A/D PinsPE0-PE7
VRL, VRH
—
—
—
—
400
1.0
400
1.0
nA
µA
NOTES:
1. Source impedances greater than 10 kΩ affect accuracy adversely because of input leakage.
2. Performance verified down to 2.5 V ∆VR, but accuracy is tested and guaranteed at ∆VR = 5 V ± 10%.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-17
A
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Table A-6a Analog-To-Digital Converter Characteristics (MC68L11A8)
A
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH, 750 kHz ≤ E ≤ 2.0 MHz, unless otherwise noted
Characteristic
Parameter
Min
Absolute
Max
Resolution
Number of Bits Resolved by A/D Converter
—
8
—
Non-Linearity
Maximum Deviation from the Ideal A/D Transfer
—
—
±1
Characteristics
Zero Error
Difference Between the Output of an Ideal and an
—
—
±1
Actual for Zero Input Voltage
Full Scale Error Difference Between the Output of an Ideal and an
—
—
±1
Actual A/D for Full-Scale Input Voltage
Total Unadjusted Maximum Sum of Non-Linearity, Zero Error, and
—
—
±1 1/2
Error
Full-Scale Error
Quantization Error
Uncertainty Because of Converter Resolution
—
—
± 1/2
Absolute Accuracy Difference Between the Actual Input Voltage and
—
—
±2
the Full-Scale Weighted Equivalent of the Binary
Output Code, All Error Sources Included
—
VRH
Conversion Range
Analog Input Voltage Range
VRL
VRH
Maximum Analog Reference Voltage(Note 2)
VRL
—
VDD + 0.1
VRL
Minimum Analog Reference Voltage (Note 2)
VSS – 0.1
—
VRH
∆VR
Minimum Difference between VRH and VRL
3
—
—
(Note 2)
Conversion Time Total Time to Perform a Single Analog-to-Digital
Conversion:
a. E Clock
—
32
—
b. Internal RC Oscillator
—
—
tcyc + 32
Monotonicity
Conversion Result Never Decreases with an In—
Guaranteed
—
crease in Input Voltage and has no Missing Codes
Zero Input Reading
Conversion Result when Vin = VRL
00
—
—
Full Scale Reading
Conversion Result when Vin = VRH
—
—
FF
Sample Acquisition
Analog Input Acquisition Sampling Time:
Time
a. E Clock
—
12
—
b. Internal RC Oscillator
—
—
12
Sample/Hold CaInput Capacitance during Sample PE0-PE7
—
20 (Typ)
—
pacitance
Input Leakage
Input Leakage on A/D PinsPE0-PE7
—
—
400
VRL, VRH
—
—
1.0
Unit
Bits
LSB
LSB
LSB
LSB
LSB
LSB
V
V
V
V
tcyc
µs
—
Hex
Hex
tcyc
µs
pF
nA
µA
NOTES:
1. Source impedances greater than 10 kΩ affect accuracy adversely because of input leakage.
ELECTRICAL CHARACTERISTICS
A-18
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table A-7 Expansion Bus Timing
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH
Characteristic
Symbol
1.0 MHz
2.0 MHz
Min
Max
Min
Max
Frequency of Operation (E-Clock Frequency)
fo
dc
1.0
dc
2.0
1
Cycle Time
tcyc
1000
—
500
—
2
Pulse Width, E Low
477
—
227
—
PWEL
PWEL = 1/2 tcyc – 23 ns(Note 1)
472
—
222
—
3
Pulse Width, E High
PWEH
PWEH = 1/2 tcyc – 28 ns(Note 1)
—
20
—
20
4a, b
E and AS Rise and Fall Time
tr
20
20
tf
95.5
—
33
—
9
Address Hold Time
tAH
tAH = 1/8 tcyc – 29.5 ns (Note 1, 2a)
281.5
—
94
—
12
Non-Muxed Address Valid Time to E Rise
tAV
tAV = PWEL – (tASD + 80 ns)(Note 1, 2a)
30
—
30
—
17
Read Data Setup Time
tDSR
18
Read Data Hold Time (Max = tMAD)
tDHR
0
145.5
0
83
19
Write Data Delay Time
—
190.5
—
128
tDDW
tDDW = 1/8 tcyc + 65.5 ns (Note 1, 2a)
95.5
—
33
—
tDHW
21
Write Data Hold Time
tDHW = 1/8 tcyc – 29.5 ns(Note 1, 2a)
271.5
—
84
—
tAVM
22
Muxed Address Valid Time to E Rise
tAVM = PWEL – (tASD + 90 ns)(Note 1, 2a)
151
—
26
—
tASL
24
Muxed Address Valid Time to AS Fall
tASL = PWASH – 70 ns(Note 1)
95.5
—
33
—
tAHL
25
Muxed Address Hold Time
tAHL = 1/8 tcyc – 29.5 ns(Note 1, 2b)
115.5
—
53
—
tASD
26
Delay Time, E to AS Rise
tASD = 1/8 tcyc – 9.5 ns (Note 1, 2a)
221
—
96
—
PWASH
27
Pulse Width, AS High
PWASH = 1/4 tcyc – 29 ns(Note 1)
115.5
—
53
—
tASED
28
Delay Time, AS to E Rise
tASED = 1/8 tcyc – 9.5 ns(Note 1, 2b)
tACCA
744.5
—
307
—
29
MPU Address Access Time(Note 2a)
tACCA = tcyc – (PWEL – tAVM) – tDSR – tf
tACCE
—
442
—
192
35
MPU Access Time
tACCE = PWEH – tDSR
145.5
—
83
—
tMAD
36
Muxed Address Delay
(Previous Cycle MPU Read)
tMAD = tASD + 30 ns(Note 1, 2a)
Freescale Semiconductor, Inc...
Num
3.0 MHz
Min
Max
dc
3.0
333
—
146
—
Unit
MHz
ns
ns
141
—
ns
—
ns
26
20
15
—
54
—
ns
30
0
—
—
51
71
ns
ns
ns
26
—
ns
54
—
ns
13
—
ns
31
—
ns
31
—
ns
63
—
ns
31
—
ns
196
—
ns
—
111
ns
51
—
ns
ns
NOTES:
1. Formula only for dc to 2 MHz.
2. Input clocks with duty cycles other than 50% affect bus performance. Timing parameters affected by input clock
duty cycle are identified by (a) and (b). To recalculate the approximate bus timing values, substitute the following
expressions in place of 1/8 tcyc in the above formulas, where applicable:
(a) (1-DC) x 1/4 tcyc
(b) DC x 1/4 tcyc
Where:
DC is the decimal value of duty cycle percentage (high time).
3. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-19
A
Freescale Semiconductor, Inc.
Table A-7a Expansion Bus Timing (MC68L11A8)
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH
Characteristic
Symbol
1.0 MHz
Min
Max
Frequency of Operation (E-Clock Frequency)
fo
dc
1.0
1
Cycle Time
tcyc
1000
—
2
Pulse Width, E Low
475
—
PWEL
PWEL = 1/2 tcyc – 23 ns
(Note 1)
470
—
3
Pulse Width, E High
PWEH
PWEH = 1/2 tcyc – 28 ns
(Note 1)
—
25
4a, b E and AS Rise and Fall Time
tr
25
tf
95
—
9
Address Hold Time
tAH
tAH = 1/8 tcyc – 29.5 ns
(Note 1, 2a)
275
—
12 Non-Muxed Address Valid Time to E Rise
tAV
tAV = PWEL – (tASD + 80 ns)
(Note 1, 2a)
30
—
17 Read Data Setup Time
tDSR
18 Read Data Hold Time (Max = tMAD)
tDHR
0
150
19 Write Data Delay Time
—
195
tDDW
tDDW = 1/8 tcyc + 65.5 ns
(Note 1, 2a)
95
—
tDHW
21 Write Data Hold Time
(Note 1, 2a)
tDHW = 1/8 tcyc – 29.5 ns
265
—
tAVM
22 Muxed Address Valid Time to E Rise
(Note 1, 2a)
tAVM = PWEL – (tASD + 90 ns)
150
—
tASL
24 Muxed Address Valid Time to AS Fall
(Note 1)
tASL = PWASH – 70 ns
95
—
tAHL
25 Muxed Address Hold Time
(Note 1, 2b)
tAHL = 1/8 tcyc – 29.5 ns
120
—
tASD
26 Delay Time, E to AS Rise
(Note 1, 2a)
tASD = 1/8 tcyc – 9.5 ns
220
—
PWASH
27 Pulse Width, AS High
(Note 1)
PWASH = 1/4 tcyc – 29 ns
120
—
tASED
28 Delay Time, AS to E Rise
(Note 1, 2b)
tASED = 1/8 tcyc – 9.5 ns
tACCA
735
—
29 MPU Address Access Time
(Note 2a)
tACCA = tcyc – (PWEL – tAVM) – tDSR – tf
tACCE
—
440
35 MPU Access Time
tACCE = PWEH – tDSR
150
—
tMAD
36 Muxed Address Delay
(Previous Cycle MPU Read)
(Note 1, 2a)
tMAD = tASD + 30 ns
Freescale Semiconductor, Inc...
Num
A
2.0 MHz
Min
Max
dc
2.0
500
—
225
—
Unit
MHz
ns
ns
220
—
ns
—
ns
33
25
25
—
88
—
ns
30
0
—
—
88
133
ns
ns
ns
33
—
ns
78
—
ns
25
—
ns
33
—
ns
58
—
ns
95
—
ns
58
—
ns
298
—
ns
—
190
ns
88
—
ns
ns
NOTES:
1. Formula only for dc to 2 MHz.
2. Input clocks with duty cycles other than 50% affect bus performance. Timing parameters affected by input clock
duty cycle are identified by (a) and (b). To recalculate the approximate bus timing values, substitute the following
expressions in place of 1/8 tcyc in the above formulas, where applicable:
(a) (1-DC) x 1/4 tcyc
(b) DC x 1/4 tcyc
Where:
DC is the decimal value of duty cycle percentage (high time).
3. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
A-20
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
1
2
3
E
4a
4b
12
9
R/W, ADDRESS
(NON-MUX)
22
36
35
17
29
READ
ADDRESS
DATA
ADDRESS/DATA
(MULTIPLEXED)
Freescale Semiconductor, Inc...
18
19
WRITE
ADDRESS
21
DATA
25
24
4a
A
4b
AS
26
27
28
NOTE: Measurement points shown are 20% and 70% of VDD.
MUX BUS TIM
Figure A-14 Multiplexed Expansion Bus Timing Diagram
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
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MOTOROLA
A-21
Freescale Semiconductor, Inc.
Table A-8 Serial Peripheral Interface (SPI) Timing
Num
1
2
Freescale Semiconductor, Inc...
3
A
4
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH
Characteristic
Symbol
2.0 MHz
Min
Max
Operating Frequency
Master
fop(m)
dc
0.5
Slave
fop(s)
dc
2.0
Cycle Time
Master
tcyc(m)
2.0
—
Slave
500
—
tcyc(s)
Enable Lead Time
Master
(Note 2) tlead(m)
—
—
Slave
250
—
tlead(s)
Enable Lag Time
Master
(Note 2)
—
tlag(m)
—
Slave
—
250
tlag(s)
Clock (SCK) High Time
Master
Slave
Clock (SCK) Low Time
Master
Slave
Data Setup Time (Inputs)
Master
Slave
Data Hold Time (Inputs)
Master
Slave
Access Time (Time to Data Active from HighImpedance State)
Slave
Disable Time (Hold Time to High-Impedance State)
Slave
Data Valid (After Enable Edge)(Note 3)
Data Hold Time (Outputs) (After Enable Edge)
Rise Time (20% VDD to 70% VDD, CL = 200 pF)
SPI Outputs (SCK, MOSI, and MISO)
SPI Inputs (SCK, MOSI, MISO, and SS)
Fall Time (70% VDD to 20% VDD, CL = 200 pF)
SPI Outputs (SCK, MOSI, and MISO)
SPI Inputs (SCK, MOSI, MISO, and SS)
5
6
7
8
9
10
11
12
13
3.0 MHz
Min
Max
Unit
dc
dc
0.5
3.0
fop
MHz
2.0
333
—
—
tcyc
ns
—
240
—
—
ns
ns
—
240
—
—
ns
ns
tw(SCKH)m
tw(SCKH)s
340
190
—
—
227
127
—
—
ns
ns
tw(SCKL)m
tw(SCKL)s
340
190
—
—
227
127
—
—
ns
ns
tsu(m)
tsu(s)
100
100
—
—
100
100
—
—
ns
ns
th(m)
th(s)
100
100
—
—
100
100
—
—
ns
ns
ta
0
120
0
120
ns
tdis
tv(s)
tho
—
—
0
240
240
—
—
—
0
167
167
—
ns
ns
ns
trm
trs
—
—
100
2.0
—
—
100
2.0
ns
µs
tfm
tfs
—
—
100
2.0
—
—
100
2.0
ns
µs
NOTES:
1. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins.
ELECTRICAL CHARACTERISTICS
A-22
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MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
Table A-8a Serial Peripheral Interface (SPI) Timing (MC68L11A8)
VDD = 3.0 Vdc to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH
Characteristic
Symbol
1.0 MHz
Min
Max
Num
1
2
Freescale Semiconductor, Inc...
3
4
5
6
7
8
9
10
11
12
13
Operating Frequency
Master
Slave
Cycle Time
Master
Slave
Enable Lead Time
Master
Slave
Enable Lag Time
Master
Slave
2.0 MHz
Min
Max
Unit
fop(m)
fop(s)
dc
dc
0.5
1.0
dc
dc
0.5
2.0
fop
MHz
tcyc(m)
tcyc(s)
2.0
1000
—
—
2.0
500
—
—
tcyc
ns
(Note 2)
tlead(m)
tlead(s)
—
500
—
—
—
250
—
—
ns
ns
(Note 2)
tlag(m)
tlag(s)
—
500
—
—
—
250
—
—
ns
ns
tw(SCKH)m
tw(SCKH)s
680
380
—
—
340
190
—
—
ns
ns
tw(SCKL)m
tw(SCKL)s
680
380
—
—
340
190
—
—
ns
ns
tsu(m)
tsu(s)
100
100
—
—
100
100
—
—
ns
ns
th(m)
th(s)
100
100
—
—
100
100
—
—
ns
ns
ta
0
120
0
120
ns
tdis
tv(s)
tho
—
—
0
240
240
—
—
—
0
240
240
—
ns
ns
ns
trm
trs
—
—
100
2.0
—
—
100
2.0
ns
µs
tfm
tfs
—
—
100
2.0
—
—
100
2.0
ns
µs
Clock (SCK) High Time
Master
Slave
Clock (SCK) Low Time
Master
Slave
Data Setup Time (Inputs)
Master
Slave
Data Hold Time (Inputs)
Master
Slave
Access Time (Time to Data Active from HighImpedance State)
Slave
Disable Time (Hold Time to High-Impedance State)
Slave
Data Valid (After Enable Edge)(Note 3)
Data Hold Time (Outputs) (After Enable Edge)
Rise Time (20% VDD to 70% VDD, CL = 200 pF)
SPI Outputs (SCK, MOSI, and MISO)
SPI Inputs (SCK, MOSI, MISO, and SS)
Fall Time (70% VDD to 20% VDD, CL = 200 pF)
SPI Outputs (SCK, MOSI, and MISO)
SPI Inputs (SCK, MOSI, MISO, and SS)
NOTES:
1. All timing is shown with respect to 20% VDD and 70% VDD, unless otherwise noted.
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins.
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
A-23
A
Freescale Semiconductor, Inc.
SS
(INPUT)
SS is held high on master.
1
12
13
13
12
5
SCK (CPOL = 0)
(OUTPUT)
SEE
NOTE
4
5
SCK (CPOL = 1)
(OUTPUT)
SEE
NOTE
6
MISO
(INPUT)
7
MSB IN
BIT 6 - - - -1
10 (ref)
Freescale Semiconductor, Inc...
4
11
MOSI
(OUTPUT)
MASTER MSB OUT
LSB IN
11 (ref)
10
BIT 6 - - - -1
MASTER LSB OUT
13
12
NOTE: This first clock edge is generated internally but is not seen at the SCK pin.
A
SPI MASTER CPHA0 TIM
a) SPI Master Timing (CPHA = 0)
SS
(INPUT)
SS is held high on master.
1
13
12
5
SEE
NOTE
SCK (CPOL = 0)
(OUTPUT)
4
13
5
SEE
NOTE
SCK (CPOL = 1)
(OUTPUT)
4
MISO
(INPUT)
MSB IN
10 (ref)
MOSI
(OUTPUT)
12
7
6
BIT 6 - - - -1
11 (ref)
10
11
MASTER MSB OUT
LSB IN
BIT 6 - - - -1
MASTER LSB OUT
13
NOTE: This last clock edge is generated internally but is not seen at the SCK pin.
12
SPI MASTER CPHA1 TIM
b) SPI Master Timing (CPHA = 1)
Figure A-15 SPI Timing Diagram (1 of 2)
ELECTRICAL CHARACTERISTICS
A-24
For More Information On This Product,
Go to: www.freescale.com
MC68HC11A8
TECHNICAL DATA
Freescale Semiconductor, Inc.
SS
(INPUT)
1
13
12
12
13
3
5
SCK (CPOL = 0)
(INPUT)
4
2
5
SCK (CPOL = 1)
(INPUT)
4
8
MISO
(OUTPUT)
Freescale Semiconductor, Inc...
6
MOSI
(INPUT)
BIT 6 - - - -1
MSB OUT
SLAVE
7
10
SEE
NOTE
SLAVE LSB OUT
11
11
BIT 6 - - - -1
MSB IN
9
LSB IN
NOTE: Not defined but normally MSB of character just received.
SPI SLAVE CPHA0 TIM
A
c) SPI Slave Timing (CPHA = 0)
SS
(INPUT)
1
12
13
5
SCK (CPOL = 0)
(INPUT)
4
2
3
5
SCK (CPOL = 1)
(INPUT)
8
MISO
(OUTPUT)
4
10
SEE
NOTE
SLAVE
MSB OUT
6
MOSI
(INPUT)
7
MSB IN
13
BIT 6 - - - -1
10
12
9
SLAVE LSB OUT
11
BIT 6 - - - -1
LSB IN
NOTE: Not defined but normally LSB of character previously transmitted.
SPI SLAVE CPHA1 TIM
d) SPI Slave Timing (CPHA = 1)
Figure A-15 SPI Timing Diagrams (2 of 2)
ELECTRICAL CHARACTERISTICS
TECHNICAL DATA
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
A-25
Freescale Semiconductor, Inc.
Table A-9 EEPROM Characteristics
Freescale Semiconductor, Inc...
VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = TL to TH
Characteristic
Temperature Range
Unit
– 40 to 85° C – 40 to 105° C – 40 to 125° C
Programming Time