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MC7448THX1000ND

MC7448THX1000ND

  • 厂商:

    NXP(恩智浦)

  • 封装:

    BCBGA360

  • 描述:

    IC MPU MPC74XX 1.0GHZ 360FCCBGA

  • 数据手册
  • 价格&库存
MC7448THX1000ND 数据手册
Freescale Semiconductor Technical Data Document Number: MPC7448ECS02AD Rev. 2, 04/2007 MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC7448 RISC Microprocessor Hardware Specifications. The MPC7448 is a PowerPC™ microprocessor built on Power Architecture™ technology. Specifications provided in this document supersede those in the MPC7448 RISC Microprocessor Hardware Specifications, Rev. 3 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, refer to the website on the back page of this document or to your Freescale sales office for the latest version. Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification. Part numbers addressed in this document are listed in Table A. © Freescale Semiconductor, Inc., 2007. All rights reserved. Freescale Part Numbers Affected: MC7448THX1000Nx MC7448THX1267Nx MC7448THX1400Nx MC7448THX1700LD PPC7448THX1000Nx PPC7448THX1267Nx PPC7448THX1400Nx General Parameters Table A. Part Numbers Addressed by This Data Sheet Operating Conditions Freescale Part Number CPU Frequency (MHz) VDD Tj (•C) C) MC7448THX1000Nx 1000 1.0 V ± 50 mV –40 to 105 MC7448THX1267NC 1267 1.1 V ± 50 mV MC7448THX1267ND 1267 1.05 V ± 50 mV MC7448THX1400Nx 1400 1.15 V ± 50 mV 2 MC7448THX1700LD 1700 1.3 V +20/-50 mV PPC7448THX1000Nx 1 1000 1.0 V ± 50 mV PPC7448THX1267NC1 1267 1.1 V ± 50 mV PPC7448THX1267ND1 1267 1.05 V ± 50 mV PPC7448THX1400Nx1 1400 1.15 V ± 50 mV 2 Significant Differences from Hardware Specifications Modified core frequency and voltage to reduce power consumption, extended operating temperature. Note: 1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur as pilot production prototypes are shipped. 2 See Section 5.1, “DC Electrical Characteristics,” for information regarding VDD specifications for 1400 MHz device. 4 General Parameters Core power supply 1.3 V (1700L MHz revision level D devices) 1.15 V (1400N MHz devices) 1.1 V (1267N MHz revision level C devices) 1.05 V (1267N MHz revision level D devices) 1.0 V (1000N MHz devices) Note: See Section 5.1, “DC Electrical Characteristics,” for information regarding VDD specifications for 1400 MHz device. 5.1 DC Electrical Characteristics Table 4 provides the recommended operating conditions for the MPC7448 part numbers described here. NOTE Table 4 describes the nominal operating conditions of the device. For information on the operation of the device at supported derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 2 Freescale Semiconductor General Parameters Table 4. Recommended Operating Conditions1 Recommended Value Characteristic 1000N MHz 1267N MHz3 Revision Level C 1267N MHz3 Revision Level D 1400N MHz3 1700L MHz Symbol Unit Core supply voltage VDD 1.0 V ± 50 mV 1.1 V ± 50 mV 1.05 V ± 50 mV 1.15 V ± 50 mV 1.3 V +20/-50 mV V PLL supply voltage AVDD 1.0 V ± 50 mV 1.1 V ± 50 mV 1.05 V ± 50 mV 1.15 V ± 50 mV 1.3 V +20/-50 mV V Tj –40 to 105 –40 to 105 –40 to 105 –40 to 105 –40 to 105 •C C Die-junction temperature Notes 2 Notes: 1. These are the recommended and tested operating conditions. Some speed grades in addition support voltage derating; see Section 5.3, “Voltage and Frequency Derating.” Proper device operation outside of these conditions and those specified in Section 5.3, “Voltage and Frequency Derating,” is not guaranteed. 2. This voltage is the input to the filter discussed in Section 9.2.2, “PLL Power Supply Filtering,” in the hardware specifications and not necessarily the voltage at the AVDD pin, which may be reduced from VDD by the filter. 3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency constraints are observed. See Section 5.3, “Voltage and Frequency Derating,” for specific information. Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see Section 11.1, “Part Numbers Addressed by This Specification,” for more information. The MPC7448 RISC Microprocessor Hardware Specifications presents guidelines on the use of these parameters for system design. For information on power consumption when dynamic frequency switching is enabled, see Section 9.8.5, “Dynamic Frequency Switching (DFS),” in the hardware specifications. The power consumptions provided in Table 7 represent the power consumption of each speed grade when operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as by core frequency, and power limits for each speed grade are independent of each other. Each device is tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is independent of clock frequency.) Operating a device at a frequency lower than its rated maximum is fully supported provided the clock frequencies are within the specifications given in Table 8, and a device operated below its rated maximum will have lower power consumption. However, inferences should not be made about a device’s power consumption based on the power specifications of another (lower) speed grade. For example, a 1400 MHz device operated at 1267 MHz will not exhibit the same power consumption as a 1267 MHz device operated at 1267 MHz. NOTE The power consumption information in this table applies when the device operates at the nominal core voltage indicated in Table 4. For power consumption at derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 3 General Parameters Table 7. Power Consumption for MPC7448 at Maximum Rated Frequency Die Junction (Tj) (•C) C) Maximum Processor Core Frequency (Speed Grade, MHz) 1000N 1267N 7 1400N 1700L Unit Notes Full-Power Mode Typical 65 9.5 8.4 11.0 21.0 W 1, 2 Thermal 105 12.0 10.3 13.7 25.6 W 1, 5 Maximum 105 13.9 12.0 15.9 29.8 W 1, 3 6.5 8.3 13.0 W 1, 6 6.3 8.0 12.5 W 1, 6 7.7 12.0 W 1, 6 Nap Mode Typical 105 6.5 Sleep Mode Typical 105 6.3 Deep Sleep Mode (PLL Disabled) Typical 105 6.0 6.0 Notes: 1. These values specify the power consumption for the core power supply (VDD) at nominal voltage and apply to all valid processor bus frequencies and configurations. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD). OVDD power is system dependent but is typically < 5% of VDD power. Worst case power consumption for AVDD < 13 mW. 2. Typical nominal power consumption is an average value measured at the nominal recommended VDD (see Table 4) and 65°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100% tested but periodically sampled. 3. Maximum power consumption is the average measured at nominal VDD and maximum operating junction temperature (see Table 4) while running an entirely cache-resident, contrived sequence of instructions to keep all the execution units maximally busy. 4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a result, power consumption for this mode is not tested. 5. Typical thermal power consumption is an average value measured at the nominal recommended VDD (see Table 4) and 105°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100% tested but periodically sampled. 6. Typical power consumption for these modes is measured at the nominal recommended VDD (see Table 4) and 105°C in the mode described. This parameter is not 100% tested but is periodically sampled. 7. Power consumption for the 1267 MHz device is intentionally constrained via testing and sorting to assure low power consumption for this device. 5.2.1 Clock AC Specifications Table 8 provides the clock AC timing specifications for the MPC7448 part numbers discussed here. NOTE The core frequency information in this table applies when the device operates at the nominal core voltage indicated in Table 4. For core frequency specifications at derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 4 Freescale Semiconductor General Parameters Table 8. Clock AC Timing Specifications At recommended operating conditions. See Table 4. Maximum Processor Core Frequency (MHz) Characteristic Symbol 1000N 1267N 1400N 1700L Min Max Min Max Min Max Min Max Unit Notes Processor frequency DFS mode disabled fcore 500 1000 500 1267 500 1400 600 1700 MHz 1, 8, 9 Processor frequency DFS mode enabled fcore_DFS 250 500 250 633 250 700 300 850 MHz 10 fVCO 500 1000 500 1267 500 1400 600 1700 MHz 1, 9 VCO frequency Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0:5] settings must be chosen such that the resulting SYSCLK (bus) frequency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0:5] signal description in Section 9.1.1, “PLL Configuration,” in the hardware specifications for valid PLL_CFG[0:5] settings. 8. This reflects the maximum and minimum core frequencies when the dynamic frequency switching feature (DFS) is disabled. fcore_DFS provides the maximum and minimum core frequencies in a DFS mode. 9. Caution: These values specify the maximum processor core and VCO frequencies when the device is operated at the nominal core voltage. If operating the device at the derated core voltage, the processor core and VCO frequencies must be reduced. See Section 5.3, “Voltage and Frequency Derating,” for more information. 10.This specification supports the Dynamic Frequency Switching (DFS) feature and is applicable only when one of the DFS modes (divide-by-2 or divide-by-4) is enabled. When DFS is disabled, the core frequency must conform to the maximum and minimum frequencies stated for fcore. 5.3 Voltage and Frequency Derating To reduce power consumption, these devices support voltage and frequency derating in which the core voltage (VDD) may be reduced if the reduced maximum processor core frequency requirements are observed. The supported derated core voltage, resulting maximum processor core frequency (fcore), and power consumption are provided in Table 11. Only those parameters in Table 11 are affected; all other parameter specifications are unaffected. Table 11. Supported Voltage, Core Frequency, and Power Consumption Derating Maximum Rated Core Frequency (Device Marking) Supported Derated Core Voltage (VDD) Maximum Derated Core Frequency (fcore) 1000N Full-Power Mode Power Consumption Typical Thermal Maximum N/A 1267N 1.0 V ± 50 mV 1000 MHz 6.0 W 7.3 W 8.5 W 1400N 1.0 V ± 50 mV 1000 MHz 8.0 W 9.9 W 11.5 W 1700L N/A MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 5 Part Numbering and Marking 9.2 Power Supply Design and Sequencing The power supply design and sequencing requirements of the devices described here are identical to those described in the MPC7448 RISC Microprocessor Hardware Specifications. 11 11.1 Part Numbering and Marking Part Numbers Addressed by This Specification Table 17 provides the ordering information for the MPC7448 parts described in this document. Table 17. Part Marking Nomenclature xx 7448 T Product Part Specification Code Identifier Modifier MC PPC1 7448 xx nnnn m x Package Processor Frequency Application Modifier Revision Level T = Extended HX = HCTE BGA Temperature Device 1000 N: 1.0 V ± 50 mV – 40 to 105 °C C: 2.1: PVR = 0x8004_0201 D: 2.2: PVR = 0x8004_0202 1267 N: 1.1 V ± 50 mV Revision C only – 40 to 105 °C 1267 N: 1.05 V ± 50 mV Revision D only – 40 to 105 °C MC 1400 N: 1.15 V ± 50 mV – 40 to 105 °C 1700 L: 1.3 V +20/-50 mV – 40 to 105 °C D:2.2: PVR = 0x8004_0202 Notes: 1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur as pilot production prototypes are shipped. MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 6 Freescale Semiconductor Document Revision History 11.3 Part Marking Parts are marked as the example shown in Figure 23. xx7448T xxnnnnmx AWLYYWW MMMMMM YWWLAZ 7448 BGA Notes: AWLYYWW is the test code, where YYWW is the date code (YY = year, WW = work week) MMMMMM is the M00 (mask) number. YWWLAZ is the assembly traceability code. Figure 23. Part Marking for BGA Device Document Revision History Table B provides a revision history for this part number specification. Table B. Document Revision History Revision Date Substantive Change(s) 2 04/2007 Added 1700LD device information. On first page changed title part number from being N application modifier specific (MC7448TxxxnnnnNx) to generic MC7448Txxnnnnmx. On first page under Freescale Part Numbers Affected added MC7448THX1700LD. Table A: Added a 1700L MHz revision D row. Section 4, “General Parameters”: Added 1700L MHz revision level D information and added N application modifier information to the 1000, 1267, and 1400 devices. Table 4, Table 7, and Table 8: Added 1700L columns. Table 4, Table 7, Table 8, and Table 11: Added added N application modifier information to the 1000, 1267, and 1400 column headings. Table 11: Added 1700L row. Table 17: Changed ‘N’ application modifier at top of table to generic ‘m’. Added 1700L information for revision level D. Figure 23: Updated part marking replacing ‘N’ application modifier with ‘m’. 1 10/2006 Added revision level D device information. On first page under Freescale Part Numbers Affected added PPC7448THX1000Nx, PPC7448THX1267Nx, and PPC7448THX1400Nx. Table A and list on first page: x stands for C or D revision level. Table A: Added 1267 MHz revision D row and 4 PPC part number rows. Section 4, “General Parameters”: Added 1267 MHz revision level D information. Table 4: Added 1267 MHz revision D only column. Table 17: Added PVR and 1267 information for revision level D, added PPC product code, and footnote 1. 0 6/2006 Initial release. MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 1-800-521-6274 480-768-2130 support@freescale.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Freescale Semiconductor reserves the right to make changes without further notice to Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064, Japan 0120 191014 +81 3 5437 9125 support.japan@freescale.com parameters, including “Typicals” must be validated for each customer application by Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate, Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The Power Architecture and Power.org word marks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. The described product is a PowerPC microprocessor. The PowerPC name is a trademark of IBM Corp. and is used under license. All other product or service names are the property of their respective owners. Document Number: MPC7448ECS02AD Rev. 2 04/2007 any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. © Freescale Semiconductor, Inc., 2007.
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