Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MC9S08PT60
Rev. 3, 4/2012
MC9S08PT60
MC9S08PT60 Series
Support: MC9S08PT60 and
MC9S08PT32
Features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 105 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 60 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
– Up to 4096 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable clocks to
unused modules, reducing currents; allows clocks to
remain enabled to specific peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
– Internal clock source (ICS) - containing a frequencylocked-loop (FLL) controlled by internal or external
reference; precision trimming of internal reference
allowing 1% deviation across temperature range of 0
°C to 70 °C and 2% deviation across temperature
range of -40 °C to 105 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger modes
• Peripherals
– ACMP - one analog comparator with both positive
and negative inputs; separately selectable interrupt
on rising and falling comparator output; filtering
– ADC - 16-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function; internal
bandgap reference channel; operation in stop mode;
optional hardware trigger
– CRC - programmable cyclic redundancy check
module
– FTM - three flex timer modulators modules
including one 6-channel and two 2-channel ones;
16-bit counter; each channel can be configured for
input capture, output compare, edge- or centeraligned PWM mode
– IIC - One inter-integrated circuit module; up to 400
kbps; multi-master operation; programmable slave
address; supporting broadcast mode and 10-bit
addressing
– MTIM - Two modulo timers with 8-bit prescaler and
overflow interrupt
– RTC - 16-bit real timer counter (RTC)
– SCI - three serial communication interface (SCI/
UART) modules optional 13-bit break; full duplex
non-return to zero (NRZ); LIN extension support
– SPI - one 8-bit and one 16-bit serial peripheral
interface (SPI) modules; full-duplex or single-wire
bidirectional; master or slave mode
– TSI - supporting up to 16 external electrodes;
configurable software or hardware scan trigger; fully
support freescale touch sensing software library;
capability to wake MCU from stop3 mode
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2012 Freescale Semiconductor, Inc.
• Input/Output
– 57 GPIOs including one output-only pin
– Two 8-bit keyboard interrupt modules (KBI)
– Two true open-drain output pins
– Eight, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 64-pin LQFP; 64-pin QFP
– 48-pin LQFP
– 44-pin LQFP
– 32-pin LQFP
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
2
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................4
5.2.2
Debug trace timing specifications.........................15
1.1 Determining valid orderable parts......................................4
5.2.3
FTM module timing...............................................16
2 Part identification......................................................................4
2.1 Description.........................................................................4
5.3 Thermal specifications.......................................................17
5.3.1
Thermal characteristics.........................................17
2.2 Format...............................................................................4
6 Peripheral operating requirements and behaviors....................18
2.3 Fields.................................................................................4
6.1 External oscillator (XOSC) and ICS characteristics...........18
2.4 Example............................................................................5
6.2 NVM specifications............................................................20
3 Parameter Classification...........................................................5
6.3 Analog...............................................................................21
4 Ratings......................................................................................5
6.3.1
ADC characteristics...............................................21
4.1 Thermal handling ratings...................................................5
6.3.2
Analog comparator (ACMP) electricals.................25
4.2 Moisture handling ratings..................................................6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings...............................6
5 General.....................................................................................7
5.1 Nonswitching electrical specifications...............................7
6.4 Communication interfaces.................................................25
6.4.1
SPI switching specifications..................................25
6.5 Human-machine interfaces (HMI)......................................28
6.5.1
TSI electrical specifications...................................28
7 Dimensions...............................................................................29
5.1.1
DC characteristics.................................................7
5.1.2
Supply current characteristics...............................12
8 Pinout........................................................................................29
5.1.3
EMC performance.................................................13
8.1 Signal multiplexing and pin assignments...........................29
5.2 Switching specifications.....................................................14
8.2 Device pin assignment......................................................33
5.2.1
Control timing........................................................14
7.1 Obtaining package dimensions.........................................29
9 Revision history.........................................................................36
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers: PT60 and PT32.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
MC 9 S08 PT AA B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
MC
Qualification status
• MC = fully qualified, general market flow
9
Memory
• 9 = flash based
S08
Core
• S08 = 8-bit CPU
PT
Device family
• PT
AA
Approximate flash size in KB
• 60 = 60 KB
• 32 = 32 KB
B
Temperature range (°C)
• V = –40 to 105
• C = –40 to 85
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
CC
Description
Package designator
Values
•
•
•
•
•
QH = 64-pin QFP
LH = 64-pin LQFP
LF = 48-pin LQFP
LD = 44-pin LQFP
LC = 32-pin LQFP
2.4 Example
This is an example part number:
MC9S08PT60VQH
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
Those parameters are guaranteed during production testing on each individual device.
C
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
T
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
4 Ratings
4.1 Thermal handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
TSTG
Storage temperature
–55
150
°C
1
TSDR
Solder temperature, lead-free
—
260
°C
2
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
5
Ratings
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
Max.
Unit
Notes
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
VHBM
Electrostatic discharge voltage, human body model
-4000
+4000
V
1
VCDM
Electrostatic discharge voltage, charged-device model
-500
+500
V
2
Latch-up current at ambient temperature of 105°C
-100
+100
mA
ILAT
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
4.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in below table may affect
device reliability or cause permanent damage to the device. For functional operating
conditions, refer to the remaining tables in this document.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (for instance, either VSS or VDD) or the programmable pullup resistor
associated with the pin is enabled.
Symbol
Description
Min.
Max.
Unit
VDD
Supply voltage
–0.3
5.8
V
IDD
Maximum current into VDD
—
120
mA
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
6
Freescale Semiconductor, Inc.
General
Symbol
Description
Min.
Max.
Unit
VDIO
Digital input voltage (except RESET, EXTAL, and XTAL)
–0.3
VDD + 0.3
V
VAIO
Analog1, RESET, EXTAL, and XTAL input voltage
–0.3
VDD + 0.3
V
Instantaneous maximum current single pin limit (applies to all
port pins)
–25
25
mA
VDD – 0.3
VDD + 0.3
V
ID
VDDA
Analog supply voltage
1. Analog pins are defined as pins that do not have an associated general purpose I/O port function.
5 General
5.1 Nonswitching electrical specifications
5.1.1 DC characteristics
This section includes information about power supply requirements and I/O pin
characteristics.
Table 2. DC characteristics
Symbol
C
—
—
VOH
P
Descriptions
Min
Typical1
Max
Unit
—
2.7
—
5.5
V
5 V, Iload =
-2 mA
VDD - 1.5
—
—
V
3 V, Iload =
-0.6 mA
VDD - 0.8
—
—
V
High current drive
pins, high-drive
strength2
5 V, Iload =
-20 mA
VDD - 1.5
—
—
V
3 V, Iload =
-6 mA
VDD - 0.8
—
—
V
Output high
current
Max total IOH for all
ports
5V
—
—
-100
mA
3V
—
—
-60
Output low
voltage
All I/O pins, low-drive
strength
5 V, Iload =
2 mA
—
—
1.5
V
3 V, Iload =
0.6 mA
—
—
0.8
V
5 V, Iload
=20 mA
—
—
1.5
V
3 V, Iload =
6 mA
—
—
0.8
V
Operating voltage
Output high
voltage
All I/O pins, low-drive
strength
C
P
C
IOHT
VOL
D
P
C
P
C
High current drive
pins, high-drive
strength2
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
7
Nonswitching electrical specifications
Table 2. DC characteristics (continued)
Symbol
C
IOLT
D
VIH
VIL
P
P
Descriptions
Min
Typical1
Max
Unit
mA
Output low
current
Max total IOL for all
ports
5V
—
—
100
3V
—
—
60
Input high
voltage
All digital inputs
VDD>4.1V
0.70 × VDD
—
—
VDD>2.7V
0.85 × VDD
—
—
Input low
voltage
All digital inputs
VDD>4.1V
—
—
0.35 × VDD
VDD>2.7V
—
—
0.30 × VDD
V
V
Vhys
C
Input
hysteresis
All digital inputs
—
0.06 × VDD
—
—
mV
|IIn|
P
Input leakage
current
All input only pins
(per pin)
VIN = VDD
or VSS
—
0.1
1
µA
|IOZ|
P
Hi-Z (offstate)
leakage
current
All input/output (per
pin)
VIN = VDD
or VSS
—
0.1
1
µA
|IOZTOT|
C
Total leakage All input only and I/O
combined for
all inputs and
Hi-Z pins
VIN = VDD
or VSS
—
—
2
µA
RPU
P
Pullup
resistors
All digital inputs,
when enabled (all I/O
pins other than
PTA5/IRQ/TCLK/
RESET
—
17.5
—
52.5
kΩ
RPU3
P
Pullup
resistors
PTA5/IRQ/TCLK/
RESET
—
17.5
—
52.5
kΩ
IIC
D
DC injection
current4, 5, 6
Single pin limit
VIN < VSS,
VIN > VDD
-0.2
—
0.2
mA
-5
—
5
Total MCU limit,
includes sum of all
stressed pins
CIn
C
Input capacitance, all pins
—
—
—
8
pF
VRAM
C
RAM retention voltage
—
2.0
—
—
V
1. Typical values are measured at 25 °C. Characterized, not tested.
2. Only PTB4, PTB5, PTD0, PTD1, PTE0, PTE1, PTH0, and PTH1 support ultra high current output.
3. The specified resistor value is the actual value internal to the device. The pullup value may appear higher when measured
externally on the pin.
4. All functional non-supply pins, except for PTA5, are internally clamped to VSS and VDD.
5. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the large one.
6. Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If the positive injection current (VIn > VDD) is higher than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure that external VDD load will shunt current higher than
maximum injection current when the MCU is not consuming power, such as no system clock is present, or clock rate is
very low (which would reduce overall power consumption).
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
8
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
Table 3. LVD and POR Specification
Symbol
C
Description
Min
Typ
Max
Unit
VPOR
D
POR re-arm voltage1
1.5
1.75
2.0
V
VLVDH
C
Falling low-voltage detect threshold - high
range (LVDV = 1)2
4.2
4.3
4.4
V
VLVW1H
C
Level 1 falling (LVWV = 00)
4.3
4.4
4.5
V
VLVW2H
C
Level 2 falling (LVWV = 01)
4.5
4.5
4.6
V
VLVW3H
C
Level 3 falling (LVWV = 10)
4.6
4.6
4.7
V
VLVW4H
C
Level 4 falling (LVWV = 11)
4.7
4.7
4.8
V
VHYSH
C
High range low-voltage detect/warning
hysteresis
—
100
—
mV
VLVDL
C
Falling low-voltage detect threshold - low range
(LVDV = 0)
2.56
2.61
2.66
V
VLVDW1L
C
Level 1 falling (LVWV = 00)
2.62
2.7
2.78
V
VLVDW2L
C
Level 2 falling (LVWV = 01)
2.72
2.8
2.88
V
VLVDW3L
C
Falling lowvoltage warning
threshold - low
range
Level 3 falling (LVWV = 10)
2.82
2.9
2.98
V
VLVDW4L
C
Level 4 falling (LVWV = 11)
2.92
3.0
3.08
V
VHYSDL
C
Low range low-voltage detect hysteresis
—
40
—
mV
VHYSWL
C
Low range low-voltage warning hysteresis
—
80
—
mV
VBG
P
Buffered bandgap output 3
1.14
1.16
1.18
V
Falling lowvoltage warning
threshold - high
range
1. Maximum is highest voltage that POR is guaranteed.
2. Rising thresholds are falling threshold + hysteresis.
3. voltage Factory trimmed at VDD = 5.0 V, Temp = 25 °C
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
9
Nonswitching electrical specifications
0.7
0.6
VDD=3V
0.5
VDD-VOH(V)
0.4
VDD=5V
0.3
0.2
0.1
0
1
2
3
4
IOH(mA)
5
6
Figure 1. Typical IOH Vs. VDD-VOH
0.8
0.7
VDD=3V
0.6
0.5
VDD=5V
VDD-VOH(V) 0.4
0.3
0.2
0.1
0
5
10
15
IOH(mA)
20
25
Figure 2. Typical IOH Vs. VDD-VOH (High current drive)
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
10
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
0.6
VDD=3V
0.5
0.4
VDD=5V
VOL(V) 0.3
0.2
0.1
0
1
2
3
4
IOL(mA)
5
6
Figure 3. Typical IOL Vs. VOL
0.7
0.6
VDD=3V
0.5
VOL(V)
0.4
VDD=5V
0.3
0.2
0.1
0
5
10
15
IOL(mA)
20
25
Figure 4. Typical IOL Vs. VOL (High current drive)
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
11
Nonswitching electrical specifications
5.1.2 Supply current characteristics
This section includes information about power supply current in various operating modes.
Table 4. Supply current characteristics
Num
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
Temp
1
C
Run supply current FEI
mode, all modules on;
run from flash
RIDD
20 MHz
5
12.6
—
mA
-40 to 105 °C
10 MHz
7.2
—
1 MHz
2.4
—
9.6
—
mA
-40 to 105 °C
mA
-40 to 105 °C
mA
-40 to 105 °C
mA
-40 to 105 °C
C
2
C
20 MHz
C
10 MHz
6.1
—
1 MHz
2.1
—
10.5
—
10 MHz
6.2
—
1 MHz
2.3
—
7.4
—
C
C
3
20 MHz
5
20 MHz
C
10 MHz
5.0
—
1 MHz
2.0
—
12.1
14.8
10 MHz
6.5
—
1 MHz
1.8
—
9.1
11.8
P
Run supply current FBE
mode, all modules on;
run from RAM
RIDD
20 MHz
3
5
P
20 MHz
C
10 MHz
5.5
—
1 MHz
1.5
—
9.8
12.3
10 MHz
5.4
—
1 MHz
1.6
—
6.9
9.2
P
C
5
RIDD
C
C
4
Run supply current FEI
mode, all modules off &
gated; run from flash
3
Run supply current FBE
mode, all modules off &
gated; run from RAM
RIDD
20 MHz
3
5
P
20 MHz
C
10 MHz
4.4
—
1 MHz
1.4
—
7.8
—
10 MHz
4.5
—
1 MHz
1.3
—
5.1
—
10 MHz
3.5
—
1 MHz
1.2
—
C
C
C
Wait mode current FEI
mode, all modules on
WIDD
20 MHz
20 MHz
3
5
3
Table continues on the next page...
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
12
Freescale Semiconductor, Inc.
Nonswitching electrical specifications
Table 4. Supply current characteristics (continued)
Num
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
Temp
6
C
S3IDD
—
5
3.8
—
µA
-40 to 105 °C
C
Stop3 mode supply
current no clocks active
(except 1kHz LPO
clock)2, 3
—
3
3
—
C
ADC adder to stop3
—
—
5
44
—
C
ADLPC = 1
3
40
—
5
111
—
3
110
—
5
130
—
3
125
—
7
-40 to 105 °C
µA
-40 to 105 °C
µA
-40 to 105 °C
µA
-40 to 105 °C
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
8
C
TSI adder to stop34
C
PS = 010B
—
—
NSCN =0x0F
EXTCHRG = 0
REFCHRG = 0
DVOLT = 01B
9
C
LVD adder to stop35
C
1.
2.
3.
4.
5.
—
—
Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
RTC adder cause