MC9S08RC16FGE

Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See the table below for the old (gold wire) package versus the new (copper wire) package. To view the new drawing, go to Freescale.com and search on the new 98A package number for your device. For more information about QFN package use, see EB806: Electrical Connection Recommendations for the Exposed Pad on QFN and DFN Packages. © Freescale Semiconductor, Inc., 2014. All rights reserved. Part Number MC68HC908JW32 Package Description Original (gold wire) Current (copper wire) package document number package document number 48 QFN 98ARH99048A 98ASA00466D MC9RS08LA8 48 QFN 98ARL10606D 98ASA00466D MC9S08GT16A 32 QFN 98ARH99035A 98ASA00473D MC9S908QE32 32 QFN 98ARE10566D 98ASA00473D MC9S908QE8 32 QFN 98ASA00071D 98ASA00736D MC9S08JS16 24 QFN 98ARL10608D 98ASA00734D MC9S08QG8 24 QFN 98ARL10605D 98ASA00474D MC9S08SH8 24 QFN 98ARE10714D 98ASA00474D MC9RS08KB12 24 QFN 98ASA00087D 98ASA00602D MC9S08QG8 16 QFN 98ARE10614D 98ASA00671D MC9RS08KB12 8 DFN 98ARL10557D 98ASA00672D 6 DFN 98ARL10602D 98ASA00735D MC9S08AC16 MC9S908AC60 MC9S08AC128 MC9S08AW60 MC9S08GB60A MC9S08GT16A MC9S08JM16 MC9S08JM60 MC9S08LL16 MC9S08QE128 MC9S08QE32 MC9S08RG60 MCF51CN128 MC9S08QB8 MC9S08QG8 MC9RS08KA2 Addendum for New QFN Package Migration, Rev. 0 2 Freescale Semiconductor MC9S08RC8/16/32/60 MC9S08RD8/16/32/60 MC9S08RE8/16/32/60 MC9S08RG32/60 Data Sheet HCS08 Microcontrollers MC9S08RG60/D Rev. 1.11 06/2005 freescale.com MC9S08RG60 Data Sheet Covers: MC9S08RC8/16/32/60 MC9S08RD8/16/32/60 MC9S08RE8/16/32/60 MC9S08RG32/60 MC9S08RG60/D Rev. 1.11 06/2005 Revision History To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://freescale.com The following revision history table summarizes changes contained in this document. Version Number Revision Date Description of Changes 1.11 06/2005 Added 48 QFN package and official mechanical drawings; suppled TBD values for IRO VOL; updated tRTI values; re-emphasized that KBI2 will not wake the MCU from stop2 mode. This product contains SuperFlash® technology licensed from SST. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. © Freescale Semiconductor, Inc., 2005. All rights reserved. List of Chapters Chapter 1 Introduction............................................................................. 15 Chapter 2 Pins and Connections ............................................................ 19 Chapter 3 Modes of Operation ................................................................ 29 Chapter 4 Memory .................................................................................... 35 Chapter 5 Resets, Interrupts, and System Configuration .................... 57 Chapter 6 Parallel Input/Output .............................................................. 73 Chapter 7 Central Processor Unit (S08CPUV2) ..................................... 87 Chapter 8 Carrier Modulator Timer (S08CMTV1)................................. 107 Chapter 9 Keyboard Interrupt (S08KBIV1) ........................................... 123 Chapter 10 Timer/PWM Module (S08TPMV1)......................................... 129 Chapter 11 Serial Communications Interface (S08SCIV1).................... 145 Chapter 12 Serial Communications Interface (S08SCIV1).................... 147 Chapter 13 Serial Peripheral Interface (S08SPIV3) ............................... 163 Chapter 14 Analog Comparator (S08ACMPV1) ..................................... 179 Chapter 15 Development Support .......................................................... 183 Appendix A Electrical Characteristics..................................................... 205 Appendix B Ordering Information and Mechanical Drawings............... 219 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 5 Contents Section Number Title Page Chapter 1 Introduction 1.1 1.2 1.3 1.4 Overview .........................................................................................................................................15 Features ...........................................................................................................................................15 1.2.1 Devices in the MC9S08RC/RD/RE/RG Series ..............................................................16 MCU Block Diagram ......................................................................................................................17 System Clock Distribution ..............................................................................................................18 Chapter 2 Pins and Connections 2.1 2.2 2.3 Introduction .....................................................................................................................................19 Device Pin Assignment ...................................................................................................................19 Recommended System Connections ...............................................................................................21 2.3.1 Power ..............................................................................................................................23 2.3.2 Oscillator ........................................................................................................................23 2.3.3 PTD1/RESET .................................................................................................................23 2.3.4 Background/Mode Select (PTD0/BKGD/MS) ...............................................................24 2.3.5 IRO Pin Description .......................................................................................................24 2.3.6 General-Purpose I/O and Peripheral Ports .....................................................................24 2.3.7 Signal Properties Summary ............................................................................................25 Chapter 3 Modes of Operation 3.1 3.2 3.3 3.4 3.5 3.6 Introduction .....................................................................................................................................29 Features ...........................................................................................................................................29 Run Mode ........................................................................................................................................29 Active Background Mode ................................................................................................................29 Wait Mode .......................................................................................................................................30 Stop Modes ......................................................................................................................................31 3.6.1 Stop1 Mode ....................................................................................................................31 3.6.2 Stop2 Mode ....................................................................................................................31 3.6.3 Stop3 Mode ....................................................................................................................32 3.6.4 Active BDM Enabled in Stop Mode ...............................................................................33 3.6.5 LVD Reset Enabled ........................................................................................................33 3.6.6 On-Chip Peripheral Modules in Stop Mode ...................................................................33 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 7 Section Number Title Page Chapter 4 Memory 4.1 4.2 4.3 4.4 4.5 4.6 MC9S08RC/RD/RE/RG Memory Map ..........................................................................................35 4.1.1 Reset and Interrupt Vector Assignments ........................................................................36 Register Addresses and Bit Assignments ........................................................................................38 RAM ................................................................................................................................................42 FLASH ............................................................................................................................................42 4.4.1 Features ...........................................................................................................................43 4.4.2 Program and Erase Times ...............................................................................................43 4.4.3 Program and Erase Command Execution .......................................................................44 4.4.4 Burst Program Execution ...............................................................................................45 4.4.5 Access Errors ..................................................................................................................46 4.4.6 FLASH Block Protection ...............................................................................................47 4.4.7 Vector Redirection ..........................................................................................................48 Security ............................................................................................................................................48 FLASH Registers and Control Bits .................................................................................................49 4.6.1 FLASH Clock Divider Register (FCDIV) ......................................................................49 4.6.2 FLASH Options Register (FOPT and NVOPT) .............................................................51 4.6.3 FLASH Configuration Register (FCNFG) .....................................................................51 4.6.4 FLASH Protection Register (FPROT and NVPROT) ....................................................52 4.6.5 FLASH Status Register (FSTAT) ...................................................................................54 4.6.6 FLASH Command Register (FCMD) ............................................................................55 Chapter 5 Resets, Interrupts, and System Configuration 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Introduction .....................................................................................................................................57 Features ...........................................................................................................................................57 MCU Reset ......................................................................................................................................57 Computer Operating Properly (COP) Watchdog .............................................................................58 Interrupts .........................................................................................................................................58 5.5.1 Interrupt Stack Frame .....................................................................................................59 5.5.2 External Interrupt Request (IRQ) Pin .............................................................................60 5.5.2.1 Pin Configuration Options ..............................................................................60 5.5.2.2 Edge and Level Sensitivity ..............................................................................61 5.5.3 Interrupt Vectors, Sources, and Local Masks .................................................................61 Low-Voltage Detect (LVD) System ................................................................................................62 5.6.1 Power-On Reset Operation .............................................................................................63 5.6.2 LVD Reset Operation .....................................................................................................63 5.6.3 LVD Interrupt and Safe State Operation ........................................................................63 5.6.4 Low-Voltage Warning (LVW) ........................................................................................63 Real-Time Interrupt (RTI) ...............................................................................................................64 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 8 Freescale Semiconductor Section Number 5.8 Title Page Reset, Interrupt, and System Control Registers and Control Bits ...................................................64 5.8.1 Interrupt Pin Request Status and Control Register (IRQSC) .........................................64 5.8.2 System Reset Status Register (SRS) ...............................................................................65 5.8.3 System Background Debug Force Reset Register (SBDFR) ..........................................67 5.8.4 System Options Register (SOPT) ...................................................................................68 5.8.5 System Device Identification Register (SDIDH, SDIDL) ..............................................69 5.8.6 System Real-Time Interrupt Status and Control Register (SRTISC) .............................70 5.8.7 System Power Management Status and Control 1 Register (SPMSC1) .........................71 5.8.8 System Power Management Status and Control 2 Register (SPMSC2) .........................72 Chapter 6 Parallel Input/Output 6.1 6.2 6.3 6.4 6.5 6.6 Introduction .....................................................................................................................................73 Features ...........................................................................................................................................73 Pin Descriptions ..............................................................................................................................74 6.3.1 Port A ..............................................................................................................................74 6.3.2 Port B ..............................................................................................................................74 6.3.3 Port C ..............................................................................................................................75 6.3.4 Port D ..............................................................................................................................75 6.3.5 Port E ..............................................................................................................................76 Parallel I/O Controls ........................................................................................................................76 6.4.1 Data Direction Control ...................................................................................................76 6.4.2 Internal Pullup Control ...................................................................................................77 Stop Modes ......................................................................................................................................77 Parallel I/O Registers and Control Bits ...........................................................................................77 6.6.1 Port A Registers (PTAD, PTAPE, and PTADD) ............................................................78 6.6.2 Port B Registers (PTBD, PTBPE, and PTBDD) ............................................................79 6.6.3 Port C Registers (PTCD, PTCPE, and PTCDD) ............................................................81 6.6.4 Port D Registers (PTDD, PTDPE, and PTDDD) ...........................................................82 6.6.5 Port E Registers (PTED, PTEPE, and PTEDD) .............................................................84 Chapter 7 Central Processor Unit (S08CPUV2) 7.1 7.2 7.3 Introduction .....................................................................................................................................87 7.1.1 Features ...........................................................................................................................87 Programmer’s Model and CPU Registers .......................................................................................88 7.2.1 Accumulator (A) .............................................................................................................88 7.2.2 Index Register (H:X) ......................................................................................................88 7.2.3 Stack Pointer (SP) ...........................................................................................................89 7.2.4 Program Counter (PC) ....................................................................................................89 7.2.5 Condition Code Register (CCR) .....................................................................................89 Addressing Modes ...........................................................................................................................90 7.3.1 Inherent Addressing Mode (INH) ..................................................................................91 7.3.2 Relative Addressing Mode (REL) ..................................................................................91 7.3.3 Immediate Addressing Mode (IMM) .............................................................................91 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 9 Section Number Title Page 7.3.4 7.3.5 7.3.6 7.4 7.5 Direct Addressing Mode (DIR) ......................................................................................91 Extended Addressing Mode (EXT) ................................................................................91 Indexed Addressing Mode ..............................................................................................91 7.3.6.1 Indexed, No Offset (IX) ..................................................................................92 7.3.6.2 Indexed, No Offset with Post Increment (IX+) ...............................................92 7.3.6.3 Indexed, 8-Bit Offset (IX1) .............................................................................92 7.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+) .........................................92 7.3.6.5 Indexed, 16-Bit Offset (IX2) ...........................................................................92 7.3.6.6 SP-Relative, 8-Bit Offset (SP1) ......................................................................92 7.3.6.7 SP-Relative, 16-Bit Offset (SP2) ....................................................................92 Special Operations ...........................................................................................................................92 7.4.1 Reset Sequence ...............................................................................................................93 7.4.2 Interrupt Sequence ..........................................................................................................93 7.4.3 Wait Mode Operation .....................................................................................................94 7.4.4 Stop Mode Operation .....................................................................................................94 7.4.5 BGND Instruction ..........................................................................................................94 HCS08 Instruction Set Summary ....................................................................................................95 Chapter 8 Carrier Modulator Timer (S08CMTV1) 8.1 8.2 8.3 8.4 8.5 8.6 Introduction ...................................................................................................................................107 Features .........................................................................................................................................108 CMT Block Diagram .....................................................................................................................108 Pin Description ..............................................................................................................................108 Functional Description ..................................................................................................................109 8.5.1 Carrier Generator ..........................................................................................................110 8.5.2 Modulator .....................................................................................................................112 8.5.2.1 Time Mode ....................................................................................................113 8.5.2.2 Baseband Mode .............................................................................................114 8.5.2.3 FSK Mode .....................................................................................................114 8.5.3 Extended Space Operation ...........................................................................................115 8.5.3.1 EXSPC Operation in Time Mode .................................................................115 8.5.3.2 EXSPC Operation in FSK Mode ..................................................................116 8.5.4 Transmitter ....................................................................................................................116 8.5.5 CMT Interrupts .............................................................................................................117 8.5.6 Wait Mode Operation ...................................................................................................117 8.5.7 Stop Mode Operation ...................................................................................................117 8.5.8 Background Mode Operation .......................................................................................118 CMT Registers and Control Bits ...................................................................................................118 8.6.1 Carrier Generator Data Registers (CMTCGH1, CMTCGL1, CMTCGH2, and CMTCGL2) ..............................................................................................................118 8.6.2 CMT Output Control Register (CMTOC) ....................................................................120 8.6.3 CMT Modulator Status and Control Register (CMTMSC) ..........................................121 8.6.4 CMT Modulator Data Registers (CMTCMD1, CMTCMD2, CMTCMD3, and CMTCMD4) .............................................................................................................122 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 10 Freescale Semiconductor Section Number Title Page Chapter 9 Keyboard Interrupt (S08KBIV1) 9.1 9.2 9.3 9.4 Introduction ...................................................................................................................................123 KBI Block Diagram ......................................................................................................................125 Keyboard Interrupt (KBI) Module ................................................................................................125 9.3.1 Pin Enables ...................................................................................................................125 9.3.2 Edge and Level Sensitivity ...........................................................................................125 9.3.3 KBI Interrupt Controls .................................................................................................126 KBI Registers and Control Bits .....................................................................................................126 9.4.1 KBI x Status and Control Register (KBIxSC) ..............................................................127 9.4.2 KBI x Pin Enable Register (KBIxPE) ..........................................................................128 Chapter 10 Timer/PWM Module (S08TPMV1) 10.1 10.2 10.3 10.4 Introduction ...................................................................................................................................129 Features .........................................................................................................................................129 TPM Block Diagram .....................................................................................................................131 Pin Descriptions ............................................................................................................................132 10.4.1 External TPM Clock Sources .......................................................................................132 10.4.2 TPM1CHn — TPM1 Channel n I/O Pins .....................................................................132 10.5 Functional Description ..................................................................................................................132 10.5.1 Counter .........................................................................................................................133 10.5.2 Channel Mode Selection ...............................................................................................134 10.5.2.1 Input Capture Mode ......................................................................................134 10.5.2.2 Output Compare Mode .................................................................................134 10.5.2.3 Edge-Aligned PWM Mode ...........................................................................134 10.5.3 Center-Aligned PWM Mode ........................................................................................135 10.6 TPM Interrupts ..............................................................................................................................137 10.6.1 Clearing Timer Interrupt Flags .....................................................................................137 10.6.2 Timer Overflow Interrupt Description ..........................................................................137 10.6.3 Channel Event Interrupt Description ............................................................................137 10.6.4 PWM End-of-Duty-Cycle Events .................................................................................138 10.7 TPM Registers and Control Bits ...................................................................................................138 10.7.1 Timer Status and Control Register (TPM1SC) .............................................................139 10.7.2 Timer Counter Registers (TPM1CNTH:TPM1CNTL) ................................................140 10.7.3 Timer Counter Modulo Registers (TPM1MODH:TPM1MODL) ................................141 10.7.4 Timer Channel n Status and Control Register (TPM1CnSC) .......................................142 10.7.5 Timer Channel Value Registers (TPM1CnVH:TPM1CnVL) .......................................143 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 11 Section Number Title Page Chapter 11 Serial Communications Interface (S08SCIV1) 11.1 Introduction ...................................................................................................................................145 Chapter 12 Serial Communications Interface (S08SCIV1) 12.1 Introduction ...................................................................................................................................147 12.1.1 Features .........................................................................................................................147 12.1.2 Modes of Operation ......................................................................................................147 12.1.3 Block Diagram ..............................................................................................................148 12.2 Register Definition ........................................................................................................................150 12.2.1 SCI Baud Rate Registers (SCI1BDH, SCI1BHL) ........................................................150 12.2.2 SCI Control Register 1 (SCI1C1) .................................................................................151 12.2.3 SCI Control Register 2 (SCI1C2) .................................................................................152 12.2.4 SCI Status Register 1 (SCI1S1) ....................................................................................153 12.2.5 SCI Status Register 2 (SCI1S2) ....................................................................................155 12.2.6 SCI Control Register 3 (SCI1C3) .................................................................................155 12.2.7 SCI Data Register (SCI1D) ..........................................................................................156 12.3 Functional Description ..................................................................................................................157 12.3.1 Baud Rate Generation ...................................................................................................157 12.3.2 Transmitter Functional Description ..............................................................................157 12.3.2.1 Send Break and Queued Idle .........................................................................158 12.3.3 Receiver Functional Description ..................................................................................158 12.3.3.1 Data Sampling Technique .............................................................................159 12.3.3.2 Receiver Wakeup Operation .........................................................................159 12.3.4 Interrupts and Status Flags ...........................................................................................160 12.3.5 Additional SCI Functions .............................................................................................161 12.3.5.1 8- and 9-Bit Data Modes ...............................................................................161 12.3.5.2 Stop Mode Operation ....................................................................................161 12.3.5.3 Loop Mode ....................................................................................................161 12.3.5.4 Single-Wire Operation ..................................................................................162 Chapter 13 Serial Peripheral Interface (S08SPIV3) 13.1 Features .........................................................................................................................................164 13.2 Block Diagrams .............................................................................................................................164 13.2.1 SPI System Block Diagram ..........................................................................................164 13.2.2 SPI Module Block Diagram .........................................................................................165 13.2.3 SPI Baud Rate Generation ............................................................................................167 13.3 Functional Description ..................................................................................................................167 13.3.1 SPI Clock Formats ........................................................................................................168 13.3.2 SPI Pin Controls ...........................................................................................................170 13.3.2.1 SPSCK1 — SPI Serial Clock ........................................................................170 13.3.2.2 MOSI1 — Master Data Out, Slave Data In ..................................................170 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 12 Freescale Semiconductor Section Number Title Page 13.3.2.3 MISO1 — Master Data In, Slave Data Out ..................................................170 13.3.2.4 SS1 — Slave Select .......................................................................................170 13.3.3 SPI Interrupts ................................................................................................................171 13.3.4 Mode Fault Detection ...................................................................................................171 13.4 SPI Registers and Control Bits ......................................................................................................171 13.4.1 SPI Control Register 1 (SPI1C1) ..................................................................................172 13.4.2 SPI Control Register 2 (SPI1C2) ..................................................................................173 13.4.3 SPI Baud Rate Register (SPI1BR) ...............................................................................174 13.4.4 SPI Status Register (SPI1S) ..........................................................................................176 13.4.5 SPI Data Register (SPI1D) ...........................................................................................177 Chapter 14 Analog Comparator (S08ACMPV1) 14.1 14.2 14.3 14.4 Features .........................................................................................................................................180 Block Diagram ..............................................................................................................................180 Pin Description ..............................................................................................................................180 Functional Description ..................................................................................................................181 14.4.1 Interrupts .......................................................................................................................181 14.4.2 Wait Mode Operation ...................................................................................................181 14.4.3 Stop Mode Operation ...................................................................................................181 14.4.4 Background Mode Operation .......................................................................................181 14.5 ACMP Status and Control Register (ACMP1SC) .........................................................................182 Chapter 15 Development Support 15.1 Introduction ...................................................................................................................................183 15.1.1 Features .........................................................................................................................183 15.2 Background Debug Controller (BDC) ..........................................................................................184 15.2.1 BKGD Pin Description .................................................................................................184 15.2.2 Communication Details ................................................................................................185 15.2.3 BDC Commands ...........................................................................................................189 15.2.4 BDC Hardware Breakpoint ..........................................................................................191 15.3 On-Chip Debug System (DBG) ....................................................................................................192 15.3.1 Comparators A and B ...................................................................................................192 15.3.2 Bus Capture Information and FIFO Operation .............................................................192 15.3.3 Change-of-Flow Information ........................................................................................193 15.3.4 Tag vs. Force Breakpoints and Triggers .......................................................................193 15.3.5 Trigger Modes ..............................................................................................................194 15.3.6 Hardware Breakpoints ..................................................................................................196 15.4 Register Definition ........................................................................................................................196 15.4.1 BDC Registers and Control Bits ...................................................................................196 15.4.1.1 BDC Status and Control Register (BDCSCR) ..............................................197 15.4.1.2 BDC Breakpoint Match Register (BDCBKPT) ............................................198 15.4.2 System Background Debug Force Reset Register (SBDFR) ........................................198 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 13 Section Number 15.4.3 Title Page DBG Registers and Control Bits ..................................................................................199 15.4.3.1 Debug Comparator A High Register (DBGCAH) ........................................199 15.4.3.2 Debug Comparator A Low Register (DBGCAL) .........................................199 15.4.3.3 Debug Comparator B High Register (DBGCBH) .........................................199 15.4.3.4 Debug Comparator B Low Register (DBGCBL) ..........................................199 15.4.3.5 Debug FIFO High Register (DBGFH) ..........................................................200 15.4.3.6 Debug FIFO Low Register (DBGFL) ...........................................................200 15.4.3.7 Debug Control Register (DBGC) ..................................................................201 15.4.3.8 Debug Trigger Register (DBGT) ..................................................................202 15.4.3.9 Debug Status Register (DBGS) .....................................................................203 Appendix A Electrical Characteristics A.1 A.2 A.3 A.4 A.5 A.6 A.7 A.8 A.9 Introduction ...................................................................................................................................205 Absolute Maximum Ratings ..........................................................................................................205 Thermal Characteristics .................................................................................................................206 Electrostatic Discharge (ESD) Protection Characteristics ............................................................207 DC Characteristics .........................................................................................................................207 Supply Current Characteristics ......................................................................................................211 Analog Comparator (ACMP) Electricals ......................................................................................211 Oscillator Characteristics ..............................................................................................................212 AC Characteristics .........................................................................................................................212 A.9.1 Control Timing ...............................................................................................................212 A.9.2 Timer/PWM (TPM) Module Timing .............................................................................213 A.9.3 SPI Timing ......................................................................................................................214 A.10 FLASH Specifications ...................................................................................................................218 Appendix B Ordering Information and Mechanical Drawings B.1 Ordering Information ....................................................................................................................219 B.2 Mechanical Drawings ....................................................................................................................220 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 14 Freescale Semiconductor Chapter 1 Introduction 1.1 Overview The MC9S08RC/RD/RE/RG are members of the low-cost, high-performance HCS08 Family of 8-bit microcontroller units (MCUs). All MCUs in this family use the enhanced HCS08 core and are available with a variety of modules, memory sizes, memory types, and package types. 1.2 Features Features of the MC9S08RC/RD/RE/RG Family of devices are listed here. Please see Table 1-1 for the features that are available on the different family members. HCS08 CPU (Central Processor Unit) On-Chip Memory Oscillator (OSC) Analog Comparator (ACMP1) • • • • Object code fully upward-compatible with M68HC05 and M68HC08 Families HC08 instruction set with added BGND instruction Support for up to 32 interrupt/reset sources Power-saving modes: wait plus three stops • On-chip in-circuit programmable FLASH memory with block protection and security option • On-chip random-access memory (RAM) • Low power oscillator capable of operating from crystal or resonator from 1 to 16 MHz • 8 MHz internal bus frequency • On-chip analog comparator with internal reference (ACMP1) • Full rail-to-rail supply operation • Option to compare to a fixed internal bandgap reference voltage Serial Communications Interface Module (SCI1) • • • • Full-duplex, standard non-return-to-zero (NRZ) format Double-buffered transmitter and receiver with separate enables Programmable 8-bit or 9-bit character length Programmable baud rates (13-bit modulo divider) Serial Peripheral Interface Module (SPI1) • • • • • • • Master or slave mode operation Full-duplex or single-wire bidirectional option Programmable transmit bit rate Double-buffered transmit and receive Serial clock phase and polarity options Slave select output Selectable MSB-first or LSB-first shifting MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 15 Introduction Timer/Pulse-Width Modulator (TPM1) • 2-channel, 16-bit timer/pulse-width modulator (TPM1) module that can operate as a free-running counter, a modulo counter, or an up-/down-counter when the TPM is configured for center-aligned PWM • Selectable input capture, output compare, and edge-aligned or center-aligned PWM capability on each channel Keyboard Interrupt Ports (KBI1, KBI2) • Providing 12 keyboard interrupts • Eight with falling-edge/low-level plus four with selectable polarity • KBI1 inputs can be configured for edge-only sensitivity or edge-and-level sensitivity Carrier Modulator Timer (CMT) • Dedicated infrared output (IRO) pin • Drives IRO pin for remote control communications • Can be disconnected from IRO pin and used as output compare timer • IRO output pin has high-current sink capability Development Support • Background debugging system (see also the Development Support chapter) • Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus two more breakpoints in on-chip debug module) • Debug module containing two comparators and nine trigger modes. Eight deep FIFO for storing change-of-flow addresses and event-only data. Debug module supports both tag and force breakpoints. Port Pins • Eight high-current pins (limited by maximum package dissipation) • Software selectable pullups on ports when used as input. Selection is on an individual port bit basis. During output mode, pullups are disengaged. • 39 general-purpose input/output (I/O) pins, depending on package selection 1.2.1 Package Options • • • • • 28-pin plastic dual in-line package (PDIP) 28-pin small outline integrated circuit (SOIC) 32-pin low-profile quad flat package (LQFP) 44-pin low-profile quad flat package (LQFP) 48-pin quad flat package (QFN) System Protection • • • • Optional computer operating properly (COP) reset Low-voltage detection with reset or interrupt Illegal opcode detection with reset Illegal address detection with reset (some devices don’t have illegal addresses) Devices in the MC9S08RD/RE/RG Series Table 1-1 lists the devices available in the MC9S08RD/RE/RG series and summarizes the differences in functions and configuration among them. Table 1-1. Devices in the MC9S08RD/RE/RG Series Device 9S08RG32/60 9S08RE8/16/32/60 9S08RD8/16/32/60 FLASH RAM ACMP(1) SCI SPI 32K/60K 8/16K/32K/60K 8/16K/32K/60K 2K/2K 1K/1K/2K/2K 1K/1K/2K/2K Yes Yes No Yes Yes Yes Yes No No 1. Available only in 32-, 44-, and 48-pin LQFP packages. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 16 Freescale Semiconductor Introduction 1.3 MCU Block Diagram This block diagram shows the structure of the MC9S08RC/RD/RE/RG MCUs RTI COP IRQ LVD PTB7/TPM1CH1 PTE6 PTB5 PTB4 PTB3 PTB2 PTB1/RxD1 PTB0/TxD1 PTC7/SS1 PTC6/SPSCK1 PTC5/MISO1 PTC4/MOSI1 PTC3/KBI2P3 PTC2/KBI2P2 PTC1/KBI2P1 PTC0/KBI2P0 NOTE 1 PTD6/TPM1CH0 PTD5/ACMP1+ PTD4/ACMP1– PTD3 PTD2/IRQ PTD1/RESET PTD0/BKGD/MS NOTES 1, 3, 4 8-BIT KEYBOARD INTERRUPT MODULE (KBI1) RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT 4-BIT KEYBOARD INTERRUPT MODULE (KBI2) SERIAL COMMUNICATIONS INTERFACE MODULE (SCI1) USER FLASH (RC/RD/RE/RG60 = 63,364 BYTES) (RC/RD/RE/RG32 = 32,768 BYTES) (RC/RD/RE16 = 16,384 BYTES) (RC/RD/RE8 = 8192 BYTES) USER RAM (RC/RD/RE/RG32/60 = 2048 BYTES) (RC/RD/RE8/16 = 1024 BYTES) VDD VSS LOW-POWER OSCILLATOR 2-CHANNEL TIMER/PWM MODULE (TPM1) SERIAL PERIPHERAL INTERFACE MODULE (SPI1) PORT E EXTAL XTAL ANALOG COMPARATOR MODULE (ACMP1) VOLTAGE REGULATOR NOTES1, 2, 6 PTA0/KBI1P0 PORT B HCS08 SYSTEM CONTROL PTA7/KBI1P7– PTA1/KBI1P1 PORT C DEBUG MODULE (DBG) CPU 7 PORT D BDC PORT A INTERNAL BUS HCS08 CORE 8 NOTES 1, 5 PTE7– PTE0 NOTE 1 CARRIER MODULATOR TIMER MODULE (CMT) IRO NOTE 5 NOTES: 1. Port pins are software configurable with pullup device if input port 2. PTA0 does not have a clamp diode to VDD. PTA0 should not be driven above VDD. Also, PTA0 does not pullup to VDD when internal pullup is enabled. 3. IRQ pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1) 4. The RESET pin contains integrated pullup device enabled if reset enabled (RSTPE = 1) 5. High current drive 6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown enabled when KBI is enabled (KBIPEn = 1) and rising edge is selected (KBEDGn = 1). Figure 1-1. MC9S08RC/RD/RE/RG Block Diagram Table 1-2 lists the functional versions of the on-chip modules. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 17 Introduction Table 1-2. Block Versions Module Version Analog Comparator (ACMP) 1.4 1 Carrier Modulator Transmitter (CMT) 1 Keyboard Interrupt (KBI) 1 Serial Communications Interface (SCI) 1 Serial Peripheral Interface (SPI) 3 Timer Pulse-Width Modulator (TPM) 1 Central Processing Unit (CPU) 2 Debug Module (DBG) 1 FLASH 1 System Control 2 System Clock Distribution RTI OSC RTICLKS SYSTEM CONTROL LOGIC TPM CMT SCI SPI RTI ÷2 OSCOUT* OSC CPU BUSCLK BDC ACMP * OSCOUT is the alternate BDC clock source for the MC9S08RC/RD/RE/RG. RAM FLASH FLASH has frequency requirements for program and erase operation. See Appendix A. Figure 1-2. System Clock Distribution Diagram Table 1-2 shows a simplified clock connection diagram for the MCU. The CPU operates at the input frequency of the oscillator. The bus clock frequency is half of the oscillator frequency and is used by all of the internal circuits with the exception of the CPU and RTI. The RTI can use either the oscillator input or the internal RTI oscillator as its clock source. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 18 Freescale Semiconductor Chapter 2 Pins and Connections 2.1 Introduction This section describes signals that connect to package pins. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. 34 PTA1/KBI1P1 PTA2/KBI1P2 PTE5 38 35 PTE6 39 PTA3/KBI1P3 PTE7 40 36 PTA4/KBI1P4 41 PTE4 PTA5/KBI1P5 42 PTB0/TxD1 1 37 PTA6/KBI1P6 43 Device Pin Assignment 44 PTA7/KBI1P7 33 PTA0/KBI1P0 28 XTAL VSS 7 27 PTD3 IRO 8 26 PTD2/IRQ PTB5 9 25 PTD1/RESET PTB6 10 24 PTD0/BKGD/MS PTC0/KBI2P0 12 PTB7/TPM1CH1 11 21 6 PTC5/MISO1 VDD 20 EXTAL PTC4/MOSI1 29 19 5 PTE3 PTB4 18 PTD4/ACMP1– PTE2 30 17 4 PTE1 PTB3 16 PTD5/ACMP1+ PTE0 31 15 3 PTC3/KBI2P3 PTB2 14 PTD6/TPM1CH0 PTC2/KBI2P2 32 13 2 PTC1/KBI2P1 PTB1/RxD1 23 PTC7/SS1 PTC6/SPSCK1 22 2.2 Figure 2-1. MC9S08RC/RD/RE/RG in 44-Pin LQFP Package MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 19 PTA5/KBI1P5 PTA4/KBI1P4 PTA3/KBI1P3 PTA2/KBI1P2 PTA1/KBI1P1 PTA0/KBI1P0 30 29 28 27 26 25 1 PTA6/KBI1P6 PTB0/TxD1 31 32 PTA7/KBI1P7 Pins and Connections 24 PTD6/TPM1CH0 XTAL IRO 6 19 PTD2/IRQ PTB6 7 18 PTD1/RESET PTB7/TPM1CH1 8 17 PTD0/BKGD/MS PTC0/KBI2P0 16 20 PTC7/SS1 5 15 VSS PTC6/SPSCK1 EXTAL 14 21 PTC5/MISO1 4 13 VDD PTC4/MISO1 PTD4/ACMP1– 12 22 PTC3/KBI2P3 3 11 PTB2 PTC2/KBI2P2 PTD5/ACMP1+ 10 23 PTC1/KBI2P1 2 9 PTB1/RxD1 Figure 2-2. MC9S08RC/RD/RE/RG in 32-Pin LQFP Package PTA5/KBI1P5 1 28 PTA4/KBI1P4 PTA6/KBI1P6 2 27 PTA3/KBI1P3 PTA7/KBI1P7 3 26 PTA2/KBI1P2 PTB0/TxD1 4 25 PTA1/KBI1P1 PTB1/RxD1 5 24 PTA0/KBI1P0 PTB2 6 23 PTD6/TPM1CH0 VDD 7 22 EXTAL VSS 8 21 XTAL IRO 9 20 PTD1/RESET PTB7/TPM1CH1 10 19 PTD0/BKGD/MS PTC0/KBI2P0 11 18 PTC7/SS1 PTC1/KBI2P1 12 17 PTC6/SPSCK1 PTC2/KBI2P2 13 16 PTC5/MISO1 PTC3/KBI2P3 14 15 PTC4/MOSI1 Figure 2-3. MC9S08RC/RD/RE/RG in 28-Pin SOIC Package and 28-Pin PDIP Package MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 20 Freescale Semiconductor 37 PTA1/KBI1P1 38 PTA2/KBI1P2 39 PTA3/KBI1P3 40 PTE4 41 PTE5 42 PTE6 43 PTE7 44 PTA4/KBI1P4 45 PTA5/KBI1P5 46 PTA6/KBI1P6 47 PTA7/KBI1P7 48 NC Pins and Connections PTB0/TxD1 1 36 NC PTB1/RxD1 2 35 PTA0/KBI1P0 PTB2 3 34 PTD6/TPM1CH0 PTB3 4 33 PTD5/ACMP1+ PTB4 5 32 PTD4/ACMP1– VDD 6 31 EXTAL VSS 7 30 XTAL IRQ 8 29 PTD3 PTB5 9 28 PTD2/IRQ PTB6 10 27 PTD1/RESET PTB7/TPM1CH1 11 26 PTD0/BKGD/MS 25 PTC7/SS1 NC 24 PTC6/SPSCK1 23 PTC5/MISO1 22 PTC4/MOSI1 21 PTE3 20 PTE2 19 PTE1 18 PTE0 17 PTC3/KBI2P3 16 PTC2/KBI2P2 15 PTC1/KBI2P1 14 PTC0/KBI2P0 13 NC 12 Figure 2-4. MC9S08RC/RD/RE/RG in 48-Pin QFN Package 2.3 Recommended System Connections Figure 2-5 shows pin connections that are common to almost all MC9S08RC/RD/RE/RG application systems. A more detailed discussion of system connections follows. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 21 Pins and Connections MC9S08RC/RD/RE/RG + 3V PTA0/KBI1P0 VDD SYSTEM POWER PTA1/KBI1P1 PTA2/KBI1P2 VDD CBLK + 10 µF CBY 0.1 µF PORT A VSS PTA3/KBI1P3 PTA4/KBI1P4 PTA5/KBI1P5 PTA6/KBI1P6 RF PTA7/KBI1P7 XTAL C2 PTB0/TxD1 C1 X1 PTB1/RxD1 PTB2 EXTAL BACKGROUND HEADER PORT B PTB3 PTB4 PTB5 I/O AND PTB6 1 VDD PTB7/TPM1CH1 BKGD/MS NOTE 1 PTC0/KBI2P0 INTERFACE TO PTC1/KBI2P1 APPLICATION PTC2/KBI2P2 RESET NOTE 2 PORT C PERIPHERAL PTC3/KBI2P3 SYSTEM PTC4/MOSI1 PTC5/MISO1 OPTIONAL MANUAL RESET PTC6/SPSCK1 PTC7/SS1 PTD0/BKGD/MS PTD1/RESET PTD2/IRQ PORT D PTD3 PTD4/ACMP1– PTD5/ACMP1+ PTD6/TPM1CH0 IRO PTE0 PTE1 PTE2 NOTES: 1. BKGD/MS is the same pin as PTD0. 2. RESET is the same pin as PTD1. PORT E PTE3 PTE4 PTE5 PTE6 PTE7 Figure 2-5. Basic System Connections MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 22 Freescale Semiconductor Pins and Connections 2.3.1 Power VDD and VSS are the primary power supply pins for the MCU. This voltage source supplies power to all I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides a regulated lower-voltage source to the CPU and other internal circuitry of the MCU. Typically, application systems have two separate capacitors across the power pins. In this case, there should be a bulk electrolytic capacitor, such as a 10-µF tantalum capacitor, to provide bulk charge storage for the overall system and a 0.1-µF ceramic bypass capacitor located as near to the MCU power pins as practical to suppress high-frequency noise. 2.3.2 Oscillator The oscillator in the MC9S08RC/RD/RE/RG is a traditional Pierce oscillator that can accommodate a crystal or ceramic resonator in the range of 1 MHz to 16 MHz. Refer to Figure 2-5 for the following discussion. RF should be a low-inductance resistor such as a carbon composition resistor. Wire-wound resistors, and some metal film resistors, have too much inductance. C1 and C2 normally should be high-quality ceramic capacitors specifically designed for high-frequency applications. RF is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its value is not generally critical. Typical systems use 1 MΩ. Higher values are sensitive to humidity and lower values reduce gain and (in extreme cases) could prevent startup. C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance that is the series combination of C1 and C2, which are usually the same size. As a first-order approximation, use 5 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and XTAL). 2.3.3 PTD1/RESET The external pin reset function is shared with an output-only port function on the PTD1/RESET pin. The reset function is enabled when RSTPE in SOPT is set. RSTPE is set following any reset of the MCU and must be cleared in order to use this pin as an output-only port. Whenever any reset is initiated (whether from an external signal or from an internal system), the reset pin is driven low for about 34 cycles of fSelf_reset, released, and sampled again about 38 cycles of fSelf_reset later. If reset was caused by an internal source such as low-voltage reset or watchdog timeout, the circuitry expects the reset pin sample to return a logic 1. If the pin is still low at this sample point, the reset is assumed to be from an external source. The reset circuitry decodes the cause of reset and records it by setting a corresponding bit in the system control reset status register (SRS). Never connect any significant capacitance to the reset pin because that would interfere with the circuit and sequence that detects the source of reset. If an external capacitance prevents the reset pin from rising to a valid logic 1 before the reset sample point, all resets will appear to be external resets. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 23 Pins and Connections 2.3.4 Background/Mode Select (PTD0/BKGD/MS) The background/mode select function is shared with an output-only port function on the PTD0/BKDG/MS pin. While in reset, the pin functions as a mode select pin. Immediately after reset rises, the pin functions as the background pin and can be used for background debug communication. While functioning as a background/mode select pin, this pin has an internal pullup device enabled. To use as an output-only port, BKGDPE in SOPT must be cleared. If nothing is connected to this pin, the MCU will enter normal operating mode at the rising edge of reset. If a debug system is connected to the 6-pin standard background debug header, it can hold BKGD/MS low during the rising edge of reset, which forces the MCU to active background mode. The BKGD pin is used primarily for background debug controller (BDC) communications using a custom protocol that uses 16 clock cycles of the target MCU’s BDC clock per bit time. The target MCU’s BDC clock could be as fast as the bus clock rate, so there should never be any significant capacitance connected to the BKGD/MS pin that could interfere with background serial communications. Although the BKGD pin is a pseudo open-drain pin, the background debug communication protocol provides brief, actively driven, high speedup pulses to ensure fast rise times. Small capacitances from cables and the absolute value of the internal pullup device play almost no role in determining rise and fall times on the BKGD pin. 2.3.5 IRO Pin Description The IRO pin is the output of the CMT. See the Carrier Modulator Timer (CMT) Module Chapter for a detailed description of this pin function. 2.3.6 General-Purpose I/O and Peripheral Ports The remaining pins are shared among general-purpose I/O and on-chip peripheral functions such as timers and serial I/O systems. (Not all pins are available in all packages. See Table 2-2.) Immediately after reset, all 37 of these pins are configured as high-impedance general-purpose inputs with internal pullup devices disabled. NOTE To avoid extra current drain from floating input pins, the reset initialization routine in the application program should either enable on-chip pullup devices or change the direction of unused pins to outputs so the pins do not float. For information about controlling these pins as general-purpose I/O pins, see the Chapter 6, “Parallel Input/Output." For information about how and when on-chip peripheral systems use these pins, refer to the appropriate chapter from Table 2-1. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 24 Freescale Semiconductor Pins and Connections Table 2-1. Pin Sharing References Port Pins PTA7–PTA0 PTB7 Alternate Function Reference(1) KBI1P7–KBI1P0 TPM1CH1 PTB6–PTB2 RxD1 TxD1 PTC7 PTC6 PTC5 PTC4 SS1 SPSCK1 MISO1 MOSI1 PTC3–PTC0 Chapter 10, “Timer/PWM Module (S08TPMV1)” — PTB1 PTB0 Chapter 9, “Keyboard Interrupt (S08KBIV1)” Chapter 6, “Parallel Input/Output” Chapter 11, “Serial Communications Interface (S08SCIV1)” Chapter 13, “Serial Peripheral Interface (S08SPIV3)” KBI2P3–KBI2P0 Chapter 9, “Keyboard Interrupt (S08KBIV1)” PTD6 TPM1CH0 Chapter 10, “Timer/PWM Module (S08TPMV1)” PTD5 PTD4 ACMP1+ ACMP1– Chapter 14, “Analog Comparator (S08ACMPV1)” PTD2 IRQ PTD1 RESET PTD0 BKGD/MS PTE7–PTE0 — Chapter 5, “Resets, Interrupts, and System Configuration” Chapter 6, “Parallel Input/Output” 1. See this chapter for information about modules that share these pins. When an on-chip peripheral system is controlling a pin, data direction control bits still determine what is read from port data registers even though the peripheral module controls the pin direction by controlling the enable for the pin’s output buffer. See the Chapter 6, “Parallel Input/Output,” for more details. Pullup enable bits for each input pin control whether on-chip pullup devices are enabled whenever the pin is acting as an input even if it is being controlled by an on-chip peripheral module. When the PTA7–PTA4 pins are controlled by the KBI module and are configured for rising-edge/high-level sensitivity, the pullup enable control bits enable pulldown devices rather than pullup devices. Similarly, when PTD2 is configured as the IRQ input and is set to detect rising edges, the pullup enable control bit enables a pulldown device rather than a pullup device. 2.3.7 Signal Properties Summary Table 2-2 summarizes I/O pin characteristics. These characteristics are determined by the way the common pin interfaces are hardwired to internal circuits. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 25 Pins and Connections Table 2-2. Signal Properties Pin Name High Current Pin Pullup(2) VDD — — VSS — — Dir(1) Comments(3) XTAL O — — Crystal oscillator output EXTAL I — — Crystal oscillator input IRO O Y — Infrared output PTA0/KBI1P0 I N SWC PTA1/KBI1P1 I/O N SWC PTA2/KBI1P2 I/O N SWC PTA3/KBI1P3 I/O N SWC PTA4/KBI1P4 I/O N SWC PTA5/KBI1P5 I/O N SWC PTA6/KBI1P6 I/O N SWC PTA7/KBI1P7 I/O N SWC PTB0/TxD1 I/O Y SWC PTB1/RxD1 I/O Y SWC PTB2 I/O Y SWC PTB3 I/O Y SWC Available only in 44- and 48-pin packages PTB4 I/O Y SWC Available only in 44- and 48-pin packages PTB5 I/O Y SWC Available only in 44- and 48-pin packages PTB6 I/O Y SWC Available only in 32-, 44-, and 48-pin packagess PTB7/TPM1CH1 I/O Y SWC PTC0/KBI2P0 I/O N SWC PTC1/KBI2P1 I/O N SWC PTC2/KBI2P2 I/O N SWC PTC3/KBI2P3 I/O N SWC PTC4/MOSI1 I/O N SWC PTC5/MISO1 I/O N SWC PTC6/SPSCK1 I/O N SWC PTC7/SS1 I/O N SWC PTD0/BKGD/MS I/O N SWC(4) Output-only when configured as PTD0 pin. Pullup enabled. PTD1/RESET I/O N SWC(3) Output-only when configured as PTD1 pin. PTA0 does not have a clamp diode to VDD. PTA0 should not be driven above VDD. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 26 Freescale Semiconductor Pins and Connections Table 2-2. Signal Properties (continued) Pin Name Dir(1) High Current Pin Pullup(2) PTD2/IRQ I/O N SWC(5) PTD3 I/O N SWC Available only in 44- and 48-pin packages PTD4/ACMP1– I/O N SWC Available only in 32-, 44-, and 48-pin packagess PTD5/ACMP1+ I/O N SWC Available only in 32-, 44-, and 48-pin packagess PTD6/TPM1CH0 I/O N SWC PTE0 I/O N SWC Available only in 44- and 48-pin packages PTE1 I/O N SWC Available only in 44- and 48-pin packages PTE2 I/O N SWC Available only in 44- and 48-pin packages PTE3 I/O N SWC Available only in 44- and 48-pin packages PTE4 I/O N SWC Available only in 44- and 48-pin packages PTE5 I/O N SWC Available only in 44- and 48-pin packages PTE6 I/O N SWC Available only in 44- and 48-pin packages PTE7 I/O N SWC Available only in 44- and 48-pin packages Comments(3) Available only in 32-, 44-, and 48-pin packagess 1. Unless otherwise indicated, all digital inputs have input hysteresis. 2. SWC is software-controlled pullup resistor, the register is associated with the respective port. 3. Not all general-purpose I/O pins are available on all packages. To avoid extra current drain from floating input pins, the user’s reset initialization routine in the application program should either enable on-chip pullup devices or change the direction of unconnected pins to outputs so the pins do not float. 4. When these pins are configured as RESET or BKGD/MS pullup device is enabled. 5. When configured for the IRQ function, this pin will have a pullup device enabled when the IRQ is set for falling edge detection and a pulldown device enabled when the IRQ is set for rising edge detection. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 27 Pins and Connections MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 28 Freescale Semiconductor Chapter 3 Modes of Operation 3.1 Introduction The operating modes of the MC9S08RC/RD/RE/RG are described in this section. Entry into each mode, exit from each mode, and functionality while in each of the modes are described. 3.2 • • • 3.3 Features Active background mode for code development Wait mode: — CPU shuts down to conserve power — System clocks running — Full voltage regulation maintained Stop modes: — System clocks stopped; voltage regulator in standby — Stop1 — Full power down of internal circuits for maximum power savings — Stop2 — Partial power down of internal circuits, RAM remains operational — Stop3 — All internal circuits powered for fast recovery Run Mode This is the normal operating mode for the MC9S08RC/RD/RE/RG. This mode is selected when the BKGD/MS pin is high at the rising edge of reset. In this mode, the CPU executes code from internal memory with execution beginning at the address fetched from memory at $FFFE:$FFFF after reset. 3.4 Active Background Mode The active background mode functions are managed through the background debug controller (BDC) in the HCS08 core. The BDC, together with the on-chip debug module (DBG), provide the means for analyzing MCU operation during software development. Active background mode is entered in any of five ways: • When the BKGD/MS pin is low at the rising edge of reset • When a BACKGROUND command is received through the BKGD pin • When a BGND instruction is executed • When encountering a BDC breakpoint • When encountering a DBG breakpoint MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 29 Modes of Operation After active background mode is entered, the CPU is held in a suspended state waiting for serial background commands rather than executing instructions from the user’s application program. Background commands are of two types: • Non-intrusive commands, defined as commands that can be issued while the user program is running. Non-intrusive commands can be issued through the BKGD pin while the MCU is in run mode; non-intrusive commands can also be executed when the MCU is in the active background mode. Non-intrusive commands include: — Memory access commands — Memory-access-with-status commands — BDC register access commands — BACKGROUND command • Active background commands, which can only be executed while the MCU is in active background mode, include commands to: — Read or write CPU registers — Trace one user program instruction at a time — Leave active background mode to return to the user’s application program (GO) The active background mode is used to program a bootloader or user application program into the FLASH program memory before the MCU is operated in run mode for the first time. When the MC9S08RC/RD/RE/RG is shipped from the Freescale Semiconductor factory, the FLASH program memory is usually erased so there is no program that could be executed in run mode until the FLASH memory is initially programmed. The active background mode can also be used to erase and reprogram the FLASH memory after it has been previously programmed. For additional information about the active background mode, refer to the Development Support chapter. 3.5 Wait Mode Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU enters a low-power state in which it is not clocked. The I bit in CCR is cleared when the CPU enters the wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits the wait mode and resumes processing, beginning with the stacking operations leading to the interrupt service routine. Only the BACKGROUND command and memory-access-with-status commands are available when the MCU is in wait mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND command can be used to wake the MCU from wait mode and enter active background mode. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 30 Freescale Semiconductor Modes of Operation 3.6 Stop Modes One of three stop modes is entered upon execution of a STOP instruction when the STOPE bit in the system option register is set. In all stop modes, all internal clocks are halted. If the STOPE bit is not set when the CPU executes a STOP instruction, the MCU will not enter any of the stop modes and an illegal opcode reset is forced. The stop modes are selected by setting the appropriate bits in SPMSC2. Table 3-1 summarizes the behavior of the MCU in each of the stop modes. Table 3-1. Stop Mode Behavior Mode PDC PPDC CPU, Digital Peripherals, FLASH Stop1 1 0 Stop2 1 1 Stop3 0 Don’t care 3.6.1 RAM OSC ACMP Regulator I/O Pins RTI Off Off Off Standby Standby Reset Off Off Standby Off Standby Standby States held Optionally on Standby Standby Off Standby Standby States held Optionally on Stop1 Mode Stop1 mode provides the lowest possible standby power consumption by causing the internal circuitry of the MCU to be powered down. To enter stop1, the user must execute a STOP instruction with the PDC bit in SPMSC2 set and the PPDC bit clear. Stop1 can be entered only if the LVD reset is disabled (LVDRE = 0). When the MCU is in stop1 mode, all internal circuits that are powered from the voltage regulator are turned off. The voltage regulator is in a low-power standby state, as are the OSC and ACMP. Exit from stop1 is done by asserting any of the wakeup pins on the MCU: RESET, IRQ, or KBI1, which have been enabled. IRQ and KBI pins are always active-low when used as wakeup pins in stop1 regardless of how they were configured before entering stop1. Upon wakeup from stop1 mode, the MCU will start up as from a power-on reset (POR). The CPU will take the reset vector. 3.6.2 Stop2 Mode Stop2 mode provides very low standby power consumption and maintains the contents of RAM and the current state of all of the I/O pins. To select entry into stop2 upon execution of a STOP instruction, the user must execute a STOP instruction with the PPDC and PDC bits in SPMSC2 set. Stop2 can be entered only if LVDRE = 0. Before entering stop2 mode, the user must save the contents of the I/O port registers, as well as any other memory-mapped registers that they want to restore after exit of stop2, to locations in RAM. Upon exit from stop2, these values can be restored by user software. When the MCU is in stop2 mode, all internal circuits that are powered from the voltage regulator are turned off, except for the RAM. The voltage regulator is in a low-power standby state, as is the ACMP. Upon entry MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 31 Modes of Operation into stop2, the states of the I/O pins are latched. The states are held while in stop2 mode and after exiting stop2 mode until a 1 is written to PPDACK in SPMSC2. Exit from stop2 is done by asserting any of the wakeup pins: RESET, IRQ, or KBI1 that have been enabled, or through the real-time interrupt. IRQ and KBI1 pins are always active-low when used as wakeup pins in stop2 regardless of how they were configured before entering stop2. (KBI2 will not wake the MCU from stop2.) Upon wakeup from stop2 mode, the MCU will start up as from a power-on reset (POR) except pin states remain latched. The CPU will take the reset vector. The system and all peripherals will be in their default reset states and must be initialized. After waking up from stop2, the PPDF bit in SPMSC2 is set. This flag may be used to direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched until a 1 is written to PPDACK in SPMSC2. For pins that were configured as general-purpose I/O, the user must copy the contents of the I/O port registers, which have been saved in RAM, back to the port registers before writing to the PPDACK bit. If the port registers are not restored from RAM before writing to PPDACK, then the register bits will be in their reset states when the I/O pin latches are opened and the I/O pins will switch to their reset states. For pins that were configured as peripheral I/O, the user must reconfigure the peripheral module that interfaces to the pin before writing to the PPDACK bit. If the peripheral module is not enabled before writing to PPDACK, the pins will be controlled by their associated port control registers when the I/O latches are opened. 3.6.3 Stop3 Mode Upon entering stop3 mode, all of the clocks in the MCU, including the oscillator itself, are halted. The OSC is turned off, the ACMP is disabled, and the voltage regulator is put in standby. The states of all of the internal registers and logic, as well as the RAM content, are maintained. The I/O pin states are not latched at the pin as in stop2. Instead they are maintained by virtue of the states of the internal logic driving the pins being maintained. Exit from stop3 is done by asserting RESET, any asynchronous interrupt pin that has been enabled, or through the real-time interrupt. The asynchronous interrupt pins are the IRQ or KBI1 and KBI2 pins. If stop3 is exited by means of the RESET pin, then the MCU will be reset and operation will resume after taking the reset vector. Exit by means of an asynchronous interrupt or the real-time interrupt will result in the MCU taking the appropriate interrupt vector. A separate self-clocked source (≈1 kHz) for the real-time interrupt allows a wakeup from stop2 or stop3 mode with no external components. When RTIS2:RTIS1:RTIS0 = 0:0:0, the real-time interrupt function and this 1-kHz source are disabled. Power consumption is lower when the 1-kHz source is disabled, but in that case the real-time interrupt cannot wake the MCU from stop. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 32 Freescale Semiconductor Modes of Operation 3.6.4 Active BDM Enabled in Stop Mode Entry into the active background mode from run mode is enabled if the ENBDM bit in BDCSCR is set. This register is described in the Development Support chapter of this data sheet. If ENBDM is set when the CPU executes a STOP instruction, the system clocks to the background debug logic remain active when the MCU enters stop mode so background debug communication is still possible. In addition, the voltage regulator does not enter its low-power standby state but maintains full internal regulation. The MCU cannot enter either stop1 mode or stop2 mode if ENBDM is set. Most background commands are not available in stop mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND command can be used to wake the MCU from stop and enter active background mode if the ENBDM bit is set. After active background mode is entered, all background commands are available. Table 3-2 summarizes the behavior of the MCU in stop when entry into the active background mode is enabled. Table 3-2. BDM Enabled Stop Mode Behavior Mode PDC PPDC Stop3 Don’t care Don’t care 3.6.5 CPU, Digital Peripherals, FLASH RAM OSC ACMP Regulator I/O Pins RTI Standby Standby On Standby On States held Optionally on LVD Reset Enabled The LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below the LVD voltage. If the LVD reset is enabled in stop by setting the LVDRE bit in SPMSC1 when the CPU executes a STOP instruction, then the voltage regulator remains active during stop mode. If the user attempts to enter either stop1 or stop2 with the LVD reset enabled (LVDRE = 1) the MCU will instead enter stop3. Table 3-3 summarizes the behavior of the MCU in stop when LVD reset is enabled. Table 3-3. LVD Enabled Stop Mode Behavior Mode PDC PPDC Stop3 Don’t care Don’t care 3.6.6 CPU, Digital Peripherals, FLASH RAM OSC ACMP Regulator I/O Pins RTI Standby Standby On Standby On States held Optionally on On-Chip Peripheral Modules in Stop Mode When the MCU enters any stop mode, system clocks to the internal peripheral modules are stopped. Even in the exception case (ENBDM = 1), where clocks are kept alive to the background debug logic, clocks to the peripheral systems are halted to reduce power consumption. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 33 Modes of Operation I/O Pins • All I/O pin states remain unchanged when the MCU enters stop3 mode. • If the MCU is configured to go into stop2 mode, all I/O pin states are latched before entering stop. Pin states remain latched until the PPDACK bit is written. • If the MCU is configured to go into stop1 mode, all I/O pins are forced to their default reset state upon entry into stop. Memory • All RAM and register contents are preserved while the MCU is in stop3 mode. • All registers will be reset upon wakeup from stop2, but the contents of RAM are preserved. The user may save any memory-mapped register data into RAM before entering stop2 and restore the data upon exit from stop2. • All registers will be reset upon wakeup from stop1 and the contents of RAM are not preserved. The MCU must be initialized as upon reset. The contents of the FLASH memory are non-volatile and are preserved in any of the stop modes. OSC — In any of the stop modes, the OSC stops running. TPM — When the MCU enters stop mode, the clock to the TPM module stops. The modules halt operation. If the MCU is configured to go into stop2 or stop1 mode, the TPM module will be reset upon wakeup from stop and must be reinitialized. ACMP — When the MCU enters any stop mode, the ACMP will enter a low-power standby state. No compare operation will occur while in stop. If the MCU is configured to go into stop2 or stop1 mode, the ACMP will be reset upon wakeup from stop and must be reinitialized. KBI — During stop3, the KBI pins that are enabled continue to function as interrupt sources. During stop1 or stop2, enabled KBI1 pins function as wakeup inputs. When functioning as a wakeup, a KBI pin is always active low regardless of how it was configured before entering stop1 or stop2. SCI — When the MCU enters stop mode, the clock to the SCI module stops. The module halts operation. If the MCU is configured to go into stop2 or stop1 mode, the SCI module will be reset upon wakeup from stop and must be reinitialized. SPI — When the MCU enters stop mode, the clock to the SPI module stops. The module halts operation. If the MCU is configured to go into stop2 or stop1 mode, the SPI module will be reset upon wakeup from stop and must be reinitialized. CMT — When the MCU enters stop mode, the clock to the CMT module stops. The module halts operation. If the MCU is configured to go into stop2 or stop1 mode, the CMT module will be reset upon wakeup from stop and must be reinitialized. Voltage Regulator — The voltage regulator enters a low-power standby state when the MCU enters any of the stop modes unless the LVD reset function is enabled or BDM is enabled. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 34 Freescale Semiconductor Chapter 4 Memory 4.1 MC9S08RC/RD/RE/RG Memory Map As shown in Figure 4-1, on-chip memory in the MC9S08RC/RD/RE/RG series of MCUs consists of RAM, FLASH program memory for nonvolatile data storage, and I/O and control/status registers. The registers are divided into three groups: • Direct-page registers ($0000 through $0045 for 32K and 60K parts, and $0000 through $003F for 16K and 8K parts) • High-page registers ($1800 through $182B) • Nonvolatile registers ($FFB0 through $FFBF) MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 35 Memory $0000 DIRECT PAGE REGISTERS $0045 $0046 RAM 2048 BYTES $0845 $0846 $17FF $1800 $182B $182C DIRECT PAGE REGISTERS RAM 2048 BYTES FLASH 4026 BYTES UNIMPLEMENTED 4026 BYTES HIGH PAGE REGISTERS HIGH PAGE REGISTERS $0000 $0045 $0046 DIRECT PAGE REGISTERS RAM 1024 BYTES(1) $0845 $0846 $0000 $003F $0040 $043F $0440 UNIMPLEMENTED 5056 BYTES $17FF $1800 $182B $182C HIGH PAGE REGISTERS DIRECT PAGE REGISTERS RAM 1024 BYTES(1) $0000 $003F $0040 $043F $0440 UNIMPLEMENTED 5056 BYTES $17FF $1800 $182B $182C HIGH PAGE REGISTERS $17FF $1800 $182B $182C UNIMPLEMENTED 26580 BYTES $8000 UNIMPLEMENTED 42964 BYTES FLASH 59348 BYTES UNIMPLEMENTED 51156 BYTES FLASH 32768 BYTES $BFFF $C000 FLASH 16384 BYTES $DFFF $E000 FLASH 8192 BYTES $FFFF $FFFF $FFFF MC9S08RC/RD/RE/RG60 MC9S08RC/RD/RE/RG32 MC9S08RC/RD/RE16 MC9S08RC/RD/RE8 Figure 4-1. MC9S08RC/RD/RE/RG Memory Map 4.1.1 Reset and Interrupt Vector Assignments Figure 4-2 shows address assignments for reset and interrupt vectors. The vector names shown in this table are the labels used in the Freescale-provided equate file for the MC9S08RC/RD/RE/RG. For more details about resets, interrupts, interrupt priority, and local interrupt mask controls, refer to the Chapter 5, “Resets, Interrupts, and System Configuration." MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 36 Freescale Semiconductor Memory Figure 4-2. Reset and Interrupt Vectors Vector Number Address (High/Low) 16 through 31 $FFC0:FFC1 Vector Vector Name Unused Vector Space (available for user program) $FFDE:FFDF 15 $FFE0:FFE1 SPI(1) Vspi1 14 $FFE2:FFE3 RTI Vrti 13 $FFE4:FFE5 KBI2 Vkeyboard2 12 $FFE6:FFE7 KBI1 Vkeyboard1 (2) 11 $FFE8:FFE9 ACMP 10 $FFEA:FFEB CMT 9 8 $FFEC:FFED $FFEE:FFEF SCI Vacmp1 Vcmt Transmit(3) Vsci1tx (3) Vsci1rx SCI Receive (3) SCI Error Vsci1err 7 $FFF0:FFF1 6 $FFF2:FFF3 TPM Overflow Vtpm1ovf 5 $FFF4:FFF5 TPM Channel 1 Vtpm1ch1 4 $FFF6:FFF7 TPM Channel 0 Vtpm1ch0 3 $FFF8:FFF9 IRQ Virq 2 $FFFA:FFFB Low Voltage Detect Vlvd 1 $FFFC:FFFD SWI Vswi 0 $FFFE:FFFF Reset Vreset 1. The SPI module is not included on the MC9S08RC/RD/RE devices. This vector location is unused for those devices. 2. The analog comparator (ACMP) module is not included on the MC9S08RD devices. This vector location is unused for those devices. 3. The SCI module is not included on the MC9S08RC devices. This vector location is unused for those devices. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 37 Memory 4.2 Register Addresses and Bit Assignments The registers in the MC9S08RC/RD/RE/RG are divided into these three groups: • Direct-page registers are located within the first 256 locations in the memory map, so they are accessible with efficient direct addressing mode instructions. • High-page registers are used much less often, so they are located above $1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables. • The nonvolatile register area consists of a block of 16 locations in FLASH memory at $FFB0–$FFBF. Nonvolatile register locations include: — Three values that are loaded into working registers at reset — An 8-byte backdoor comparison key that optionally allows a user to gain controlled access to secure memory Because the nonvolatile register locations are FLASH memory, they must be erased and programmed like other FLASH memory locations. Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation instructions can be used to access any bit in any direct-page register. Table 4-1 is a summary of all user-accessible direct-page registers and control bits. The direct page registers in Table 4-1 can use the more efficient direct addressing mode, which requires only the lower byte of the address. Because of this, the lower byte of the address in column one is shown in bold text. In Table 4-2 and Table 4-3, the whole address in column one is shown in bold. In Table 4-1, Table 4-2, and Table 4-3, the register names in column two are shown in bold to set them apart from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit locations that could read as 1s or 0s. MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 38 Freescale Semiconductor Memory Table 4-1. Direct-Page Register Summary Address Register Name Bit 7 6 5 4 3 2 1 Bit 0 $0000 PTAD $0001 PTAPE PTAD7 PTAD6 PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0 PTAPE7 PTAPE6 PTAPE5 PTAPE4 PTAPE3 PTAPE2 PTAPE1 PTAPE0 $0002 Reserved $0003 PTADD $0004 PTBD $0005 PTBPE $0006 Reserved $0007 PTBDD $0008 PTCD $0009 PTCPE $000A Reserved $000B PTCDD $000C PTDD 0 PTDD6 PTDD5 PTDD4 PTDD3 PTDD2 PTDD1 PTDD0 $000D PTDPE 0 PTDPE6 PTDPE5 PTDPE4 PTDPE3 PTDPE2 PTDPE1 PTDPE0 — — — — — — — — PTADD7 PTADD6 PTADD5 PTADD4 PTADD3 PTADD2 PTADD1 PTADD0 PTBD7 PTBD6 PTBD5 PTBD4 PTBD3 PTBD2 PTBD1 PTBD0 PTBPE7 PTBPE6 PTBPE5 PTBPE4 PTBPE3 PTBPE2 PTBPE1 PTBPE0 — — — — — — — — PTBDD7 PTBDD6 PTBDD5 PTBDD4 PTBDD3 PTBDD2 PTBDD1 PTBDD0 PTCD7 PTCD6 PTCD5 PTCD4 PTCD3 PTCD2 PTCD1 PTCD0 PTCPE7 PTCPE6 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0 — — — — — — — — PTCDD7 PTCDD6 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0 $000E Reserved — — — — — — — — $000F PTDDD 0 PTDDD6 PTDDD5 PTDDD4 PTDDD3 PTDDD2 PTDDD1 PTDDD0 $0010 PTED $0011 PTEPE PTED7 PTED6 PTED5 PTED4 PTED3 PTED2 PTED1 PTED0 PTEPE7 PTEPE6 PTEPE5 PTEPE4 PTEPE3 PTEPE2 PTEPE1 PTEPE0 $0012 Reserved — — — — — — — — $0013 PTEDD PTEDD7 PTEDD6 PTEDD5 PTEDD4 PTEDD3 PTEDD2 PTEDD1 PTEDD0 $0014 KBI1SC KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBF KBACK KBIE KBIMOD $0015 KBI1PE KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0 $0016 KBI2SC 0 0 0 0 KBF KBACK KBIE KBIMOD $0017 KBI2PE 0 0 0 0 KBIPE3 KBIPE2 KBIPE1 KBIPE0 (1) $0018 SCI1BDH $0019 SCI1BDL(1) (1) 0 0 0 SBR12 SBR11 SBR10 SBR9 SBR8 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 $001A SCI1C1 LOOPS SCISWAI RSRC M WAKE ILT PE PT $001B SCI1C2(1) TIE TCIE RIE ILIE TE RE RWU SBK $001C SCI1S1(1) TDRE TC RDRF IDLE OR NF FE PF $001D SCI1S2(1) 0 0 0 0 0 0 0 RAF $001E SCI1C3(1) R8 T8 TXDIR 0 ORIE NEIE FEIE PEIE $001F SCI1D(1) R7/T7 R6/T6 R5/T5 R4/T4 R3/T3 R2/T2 R1/T1 R0/T0 $0020 CMTCGH1 PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 $0021 CMTCGL1 PL7 PL6 PL5 PL4 PL3 PL2 PL1 PL0 $0022 CMTCGH2 SH7 SH6 SH5 SH4 SH3 SH2 SH1 SH0 $0023 CMTCGL2 SL7 SL6 SL5 SL4 SL3 SL2 SL1 SL0 IROPEN $0024 CMTOC IROL CMTPOL $0025 CMTMSC EOCF CMTDIV1 CMTDIV0 0 0 0 0 0 EXSPC BASE FSK EOCIE MCGEN $0026 CMTCMD1 MB15 MB14 $0027 CMTCMD2 MB7 MB6 MB13 MB12 MB11 MB10 MB9 MB8 MB5 MB4 MB3 MB2 MB1 MB0 $0028 CMTCMD3 SB15 $0029 CMTCMD4 SB7 SB14 SB13 SB12 SB11 SB10 SB9 SB8 SB6 SB5 SB4 SB3 SB2 SB1 SB0 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 39 Memory Table 4-1. Direct-Page Register Summary (continued) Address Register Name $002A IRQSC $002B ACMP1SC(2) $002C– $002F Bit 7 6 5 4 3 2 1 Bit 0 0 0 IRQEDG IRQPE IRQF IRQACK IRQIE IRQMOD ACME ACBGS ACF ACIE ACO — ACMOD1 ACMOD0 Reserved — — — — — — — — — — — — — — — — $0030 TPM1SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0 $0031 TPM1CNTH Bit 15 14 13 12 11 10 9 Bit 8 $0032 TPM1CNTL Bit 7 6 5 4 3 2 1 Bit 0 $0033 TPM1MODH Bit 15 14 13 12 11 10 9 Bit 8 $0034 TPM1MODL Bit 7 6 5 4 3 2 1 Bit 0 $0035 TPM1C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0 $0036 TPM1C0VH Bit 15 14 13 12 11 10 9 Bit 8 $0037 TPM1C0VL Bit 7 6 5 4 3 2 1 Bit 0 $0038 TPM1C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0 $0039 TPM1C1VH Bit 15 14 13 12 11 10 9 Bit 8 $003A TPM1C1VL Bit 7 6 5 4 3 2 1 Bit 0 $003B– $003F Reserved — — — — — — — — — — — — — — — — $0040 SPI1C1(3) SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE $0041 SPI1C2(3) 0 0 0 MODFEN BIDIROE 0 SPISWAI SPC0 $0042 SPI1BR (3) $0043 SPI1S(3) 0 SPPR2 SPPR1 SPPR0 0 SPR2 SPR1 SPR0 SPRF 0 SPTEF MODF 0 0 0 0 $0044 Reserved — — — — — — — — $0045 SPI1D(3) Bit 7 6 5 4 3 2 1 Bit 0 1. The SCI module is not included on the MC9S08RC devices. This is a reserved location for those devices. 2. The analog comparator (ACMP) module is not included on the MC9S08RD devices. This is a reserved location for those devices. 3. The SPI module is not included on the MC9S08RC/RD/RE devices. These are reserved locations on the 32K and 60K versions of these devices. The address range $0040–$004F are RAM locations on the 16K and 8K devices. There are no MC9S08RG8/16 devices. High-page registers, shown in Table 4-2, are accessed much less often than other I/O and control registers so they have been located outside the direct addressable memory space, starting at $1800. Table 4-2. High-Page Register Summary Address $1800 Register Name SRS Bit 7 POR 6 PIN 5 COP 4 ILOP 3 (1) ILAD 2 1 Bit 0 0 LVD 0 $1801 SBDFR 0 0 0 0 0 0 0 BDFR $1802 SOPT 7 COPT STOPE — 0 0 BKGDPE RSTPE $1803– $1804 Reserved — — — — — — — — — — — — — — — — $1805 Reserved $1806 SDIDH $1807 SDIDL $1808 SRTISC 0 0 0 0 0 0 0 0 REV3 REV2 REV1 REV0 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTIF RTIACK RTICLKS RTIE 0 RTIS2 RTIS1 RTIS0 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 40 Freescale Semiconductor Memory Table 4-2. High-Page Register Summary (continued) Address Register Name Bit 7 6 5 4 3 2 1 Bit 0 $1809 SPMSC1 LVDF LVDACK LVDIE SAFE LVDRE — — — $180A SPMSC2 LVWF LVWACK 0 0 PPDF PPDACK PDC PPDC $180B– $180F Reserved — — — — — — — — — — — — — — — — $1810 DBGCAH Bit 15 14 13 12 11 10 9 Bit 8 $1811 DBGCAL Bit 7 6 5 4 3 2 1 Bit 0 $1812 DBGCBH Bit 15 14 13 12 11 10 9 Bit 8 $1813 DBGCBL Bit 7 6 5 4 3 2 1 Bit 0 $1814 DBGFH Bit 15 14 13 12 11 10 9 Bit 8 $1815 DBGFL Bit 7 6 5 4 3 2 1 Bit 0 $1816 DBGC DBGEN ARM TAG BRKEN RWA RWAEN RWB RWBEN $1817 DBGT TRGSEL BEGIN 0 0 TRG3 TRG2 TRG1 TRG0 $1818 DBGS AF BF ARMF 0 CNT3 CNT2 CNT1 CNT0 $1819– $181F Reserved — — — — — — — — — — — — — — — — $1820 FCDIV DIVLD PRDIV8 DIV5 DIV4 DIV3 DIV2 DIV1 DIV0 $1821 FOPT KEYEN FNORED 0 0 0 0 SEC01 SEC00 $1822 Reserved — — — — — — — — $1823 FCNFG 0 0 KEYACC 0 0 0 0 0 $1824 FPROT FPOPEN FPDIS FPS2 FPS1 FPS0 0 0 0 $1825 FSTAT FCBEF FCCF FPVIOL FACCERR 0 FBLANK 0 0 $1826 FCMD FCMD7 FCMD6 FCMD5 FCMD4 FCMD3 FCMD2 FCMD1 FCMD0 $1827– $182B Reserved — — — — — — — — — — — — — — — — 1. The ILAD bit is only present on 16K and 8K versions of the devices. Nonvolatile FLASH registers, shown in Table 4-3, are located in the FLASH memory. These registers include an 8-byte backdoor key that optionally can be used to gain access to secure memory resources. During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the FLASH memory are transferred into corresponding FPROT and FOPT working registers in the high-page registers to control security and block protection options. Table 4-3. Nonvolatile Register Summary Address Register Name Bit 7 6 5 4 3 $FFB0– $FFB7 NVBACKKEY $FFB8– $FFBC Reserved — — — — — — — — — — 2 1 Bit 0 — — — — — — 8-Byte Comparison Key $FFBD NVPROT FPOPEN FPDIS FPS2 FPS1 FPS0 0 0 0 $FFBE Reserved — — — — — — — — $FFBF NVOPT KEYEN FNORED 0 0 0 0 SEC01 SEC00 MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11 Freescale Semiconductor 41 Memory Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily disengage memory security. This key mechanism can be accessed only through user code running in secure memory. (A security key cannot be entered directly through background debug commands.) This security key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the only way to disengage security is by mass erasing the FLASH if needed (normally through the background debug interface) and verifying that FLASH is blank. To avoid returning to secure mode after the next reset, program the security bits (SEC01:SEC00) to the unsecured state (1:0). 4.3 RAM The MC9S08RC/RD/RE/RG includes static RAM. The locations in RAM below $0100 can be accessed using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit-manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program variables in this area of RAM is preferred. The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on or after wakeup from stop1, the contents of RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage does not drop below the minimum value for RAM retention. For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to $00FF. In the MC9S08RC/RD/RE/RG, it is usually best to reinitialize the stack pointer to the top of the RAM so the direct page RAM can be used for frequently accessed RAM variables and bit-addressable program variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated to the highest address of the RAM in the Freescale-provided equate file). LDHX TXS #RamLast+1 ;point one past RAM ;SP