Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCF52211
Rev. 2, 3/2011
MCF52211
MCF52211 ColdFire
Microcontroller
Supports MCF52210 / 52211 /
52212 / 52213
The MCF52211 microcontroller family is a member of the
ColdFire® family of reduced instruction set computing
(RISC) microprocessors.
LQFP–64
10 mm x 10 mm
MAPBGA–81
10 mm x 10 mm
LQFP–100
14 mm x 14 mm
• Clock module with 8 MHz on-chip relaxation oscillator
and integrated phase-locked loop (PLL)
• Test access/debug port (JTAG, BDM)
This document provides an overview of the 32-bit MCF52211
microcontroller, focusing on its highly integrated and diverse
feature set.
This 32-bit device is based on the Version 2 ColdFire core
operating at a frequency up to 80 MHz, offering high
performance and low power consumption. On-chip memories
connected tightly to the processor core include up to
128 Kbytes of flash memory and 16 Kbytes of static random
access memory (SRAM). On-chip modules include:
• V2 ColdFire core delivering 76 MIPS (Dhrystone 2.1) at
80 MHz running from internal flash memory with Multiply
Accumulate (MAC) Unit and hardware divider
• Universal Serial Bus On-The-Go (USBOTG)
• USB Transceiver
• Three universal asynchronous/synchronous
receiver/transmitters (UARTs)
• Two inter-integrated circuit (I2C™) bus interface modules
• Queued serial peripheral interface (QSPI) module
• Eight-channel 12-bit fast analog-to-digital converter
(ADC)
• Four-channel direct memory access (DMA) controller
• Four 32-bit input capture/output compare timers with
DMA support (DTIM)
• Four-channel general-purpose timer (GPT) capable of
input capture/output compare, pulse width modulation
(PWM), and pulse accumulation
• Eight-channel/Four-channel, 8-bit/16-bit pulse width
modulation timer
• Two 16-bit periodic interrupt timers (PITs)
• Real-time clock (RTC) module
• Programmable software watchdog timer
• Interrupt controller capable of handling 57 sources
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2011. All rights reserved.
QFN–64
9 mm x 9 mm
Table of Contents
1
2
Family Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.3 Reset Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.4 PLL and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . .20
1.5 Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
1.6 External Interrupt Signals . . . . . . . . . . . . . . . . . . . . . . .21
1.7 Queued Serial Peripheral Interface (QSPI). . . . . . . . . .21
1.8 USB On-the-Go. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
1.9 I2C I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
1.10 UART Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.11 DMA Timer Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.12 ADC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.13 General Purpose Timer Signals . . . . . . . . . . . . . . . . . .23
1.14 Pulse Width Modulator Signals . . . . . . . . . . . . . . . . . . .23
1.15 Debug Support Signals . . . . . . . . . . . . . . . . . . . . . . . . .23
1.16 EzPort Signal Descriptions . . . . . . . . . . . . . . . . . . . . . .24
1.17 Power and Ground Pins . . . . . . . . . . . . . . . . . . . . . . . .25
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .28
3
4
2.4 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . .
2.5 EzPort Electrical Specifications . . . . . . . . . . . . . . . . . .
2.6 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . .
2.8 Clock Source Electrical Specifications . . . . . . . . . . . .
2.9 USB Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.10 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . .
2.11 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.12 I2C Input/Output Timing Specifications . . . . . . . . . . . .
2.13 Analog-to-Digital Converter (ADC) Parameters. . . . . .
2.14 Equivalent Circuit for ADC Inputs . . . . . . . . . . . . . . . .
2.15 DMA Timers Timing Specifications . . . . . . . . . . . . . . .
2.16 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . .
2.17 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . .
2.18 Debug AC Timing Specifications . . . . . . . . . . . . . . . . .
Mechanical Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . .
3.1 64-pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 64 QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 81 MAPBGA Package . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 100-pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
30
31
31
32
33
33
34
35
36
37
38
38
38
41
42
43
46
50
52
54
MCF52211 ColdFire Microcontroller, Rev. 2
2
Freescale Semiconductor
Family Configurations
1
Family Configurations
Table 1. MCF52211 Family Configurations
Module
Version 2 ColdFire Core with MAC
(Multiply-Accumulate Unit)
52210
52211
52212
52213
System Clock
66, 80 MHz
50 MHz
up to 76
up to 46
Performance (Dhrystone 2.1 MIPS)
Flash / Static RAM (SRAM)
64/16 Kbytes
128/16 Kbytes
64/8 Kbytes
128/8 Kbytes
Interrupt Controller (INTC)
Fast Analog-to-Digital Converter (ADC)
USB On-The-Go (USB OTG)
Four-channel Direct-Memory Access (DMA)
Software Watchdog Timer (WDT)
Secondary Watchdog Timer
Two-channel Periodic Interrupt Timer (PIT)
2
2
2
2
Four-Channel General Purpose Timer (GPT)
32-bit DMA Timers
4
4
4
4
QSPI
UART(s)
2
2 (64 LQFP/QFN and
81 MAPBGA)
3 (100 LQFP)
2
2
I2C
2
2
2
2
Eight/Four-channel 8/16-bit PWM Timer
General Purpose I/O Module (GPIO)
Chip Configuration and Reset Controller Module
Background Debug Mode (BDM)
JTAG - IEEE 1149.1 Test Access Port1
64 LQFP/QFN
81 MAPBGA
64 LQFP/QFN
81 MAPBGA
100 LQFP
64 LQFP
64 LQFP
Package
1
The full debug/trace interface is available only on the 100-pin packages. A reduced debug interface is bonded on smaller
packages.
MCF52211 ColdFire Microcontroller, Rev. 2
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Family Configurations
1.1
Block Diagram
Figure 1 shows a top-level block diagram of the device. Package options for this family are described later in this document.
Slave Mode Access
(CIM_IBO/EzPort)
AN
QSPI
M3
M1
Arbiter
M2 M0
TMS
TDI
TDO
TRST
TCLK
SDAn
Interrupt
Controller
SCLn
PADI – Pin Muxing
UTXDn
BDM
PORT
UART
0
JTAG
TAP
UART
2
UART
1
I2C
QSPI
Watch
Dog
URXDn
URTSn
UCTSn
PWMn
DTINn/DTOUTn
GPT
TMR
0
JTAG_EN
TMR
2
TMR
1
TMR
3
RTC
RCON_B
I2C
ALLPST
PST
USB
On-The-Go
DDATA
V2 ColdFire CPU
4 CH
DMA
USB TCVR
PMM
USBD+
USBDIPS Bus Gasket
ADC
AN[7:0]
CIM_IBO
16 Kbytes
SRAM
(2K32)2
Backup
Watchdog
TIM
VSTBY
Edge
Port
CLKMOD
PORTS
CIM_IBO
RSTI
RSTO
VPP
PLL OCO
CLKGEN
EXTAL
GPT[3:0]
CFM
128 Kbytes
Flash
(16K16)4
XTAL
PIT0
PIT1
PWM
CLKOUT
IRQ[7:1]
Figure 1. Block Diagram
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
4
Family Configurations
1.2
1.2.1
Features
Feature Overview
The MCF52211 family includes the following features:
•
•
•
•
•
•
•
Version 2 ColdFire variable-length RISC processor core
— Static operation
— 32-bit address and data paths on-chip
— Up to 80 MHz processor core frequency
— 40 MHz and 33 MHz off-platform bus frequency
— Sixteen general-purpose, 32-bit data and address registers
— Implements ColdFire ISA_A with extensions to support the user stack pointer register and four new instructions
for improved bit processing (ISA_A+)
— Multiply-Accumulate (MAC) unit with 32-bit accumulator to support 1616 32 or 3232 32 operations
System debug support
— Real-time trace for determining dynamic execution path
— Background debug mode (BDM) for in-circuit debugging (DEBUG_B+)
— Real-time debug support, with six hardware breakpoints (4 PC, 1 address and 1 data) configurable into a 1- or
2-level trigger
On-chip memories
— Up to 16-Kbyte dual-ported SRAM on CPU internal bus, supporting core and DMA access with standby power
supply support
— Up to 128 Kbytes of interleaved flash memory supporting 2-1-1-1 accesses
Power management
— Fully static operation with processor sleep and whole chip stop modes
— Rapid response to interrupts from the low-power sleep mode (wake-up feature)
— Clock enable/disable for each peripheral when not used (except backup watchdog timer)
— Software controlled disable of external clock output for low-power consumption
Universal Serial Bus On-The-Go (USB OTG) dual-mode host and device controller
— Full-speed / low-speed host controller
— USB 1.1 and 2.0 compliant full-speed / low speed device controller
— 16 bidirectional end points
— DMA or FIFO data stream interfaces
— Low power consumption
— OTG protocol logic
Three universal asynchronous/synchronous receiver transmitters (UARTs)
— 16-bit divider for clock generation
— Interrupt control logic with maskable interrupts
— DMA support
— Data formats can be 5, 6, 7 or 8 bits with even, odd, or no parity
— Up to two stop bits in 1/16 increments
— Error-detection capabilities
— Modem support includes request-to-send (RTS) and clear-to-send (CTS) lines for two UARTs
— Transmit and receive FIFO buffers
Two I2C modules
MCF52211 ColdFire Microcontroller, Rev. 2
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Family Configurations
•
•
•
•
•
— Interchip bus interface for EEPROMs, LCD controllers, A/D converters, and keypads
— Fully compatible with industry-standard I2C bus
— Master and slave modes support multiple masters
— Automatic interrupt generation with programmable level
Queued serial peripheral interface (QSPI)
— Full-duplex, three-wire synchronous transfers
— Up to four chip selects available
— Master mode operation only
— Programmable bit rates up to half the CPU clock frequency
— Up to 16 pre-programmed transfers
Fast analog-to-digital converter (ADC)
— Eight analog input channels
— 12-bit resolution
— Minimum 1.125 s conversion time
— Simultaneous sampling of two channels for motor control applications
— Single-scan or continuous operation
— Optional interrupts on conversion complete, zero crossing (sign change), or under/over low/high limit
— Unused analog channels can be used as digital I/O
Four 32-bit timers with DMA support
— 12.5 ns resolution at 80 MHz
— Programmable sources for clock input, including an external clock option
— Programmable prescaler
— Input capture capability with programmable trigger edge on input pin
— Output compare with programmable mode for the output pin
— Free run and restart modes
— Maskable interrupts on input capture or output compare
— DMA trigger capability on input capture or output compare
Four-channel general purpose timer
— 16-bit architecture
— Programmable prescaler
— Output pulse-widths variable from microseconds to seconds
— Single 16-bit input pulse accumulator
— Toggle-on-overflow feature for pulse-width modulator (PWM) generation
— One dual-mode pulse accumulation channel
Pulse-width modulation timer
— Support for PCM mode (resulting in superior signal quality compared to conventional PWM)
— Operates as eight channels with 8-bit resolution or four channels with 16-bit resolution
— Programmable period and duty cycle
— Programmable enable/disable for each channel
— Software selectable polarity for each channel
— Period and duty cycle are double buffered. Change takes effect when the end of the current period is reached
(PWM counter reaches zero) or when the channel is disabled.
— Programmable center or left aligned outputs on individual channels
— Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
— Emergency shutdown
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
6
Family Configurations
•
•
•
•
•
•
•
•
Two periodic interrupt timers (PITs)
— 16-bit counter
— Selectable as free running or count down
Real-Time Clock (RTC)
— Maintains system time-of-day clock
— Provides stopwatch and alarm interrupt functions
Software watchdog timer
— 32-bit counter
— Low-power mode support
Backup watchdog timer (BWT)
— Independent timer that can be used to help software recover from runaway code
— 16-bit counter
— Low-power mode support
Clock generation features
— Crystal, on-chip trimmed relaxation oscillator, or external oscillator reference options
— Trimmed relaxation oscillator
— Pre-divider capable of dividing the clock source frequency into the PLL reference frequency range
— System can be clocked from PLL or directly from crystal oscillator or relaxation oscillator
— Low power modes supported
— 2n (0 n 15) low-power divider for extremely low frequency operation
Interrupt controller
— Uniquely programmable vectors for all interrupt sources
— Fully programmable level and priority for all peripheral interrupt sources
— Seven external interrupt signals with fixed level and priority
— Unique vector number for each interrupt source
— Ability to mask any individual interrupt source or all interrupt sources (global mask-all)
— Support for hardware and software interrupt acknowledge (IACK) cycles
— Combinatorial path to provide wake-up from low-power modes
DMA controller
— Four fully programmable channels
— Dual-address transfer support with 8-, 16-, and 32-bit data capability, along with support for 16-byte (432-bit)
burst transfers
— Source/destination address pointers that can increment or remain constant
— 24-bit byte transfer counter per channel
— Auto-alignment transfers supported for efficient block movement
— Bursting and cycle-steal support
— Software-programmable DMA requests for the UARTs (3) and 32-bit timers (4)
Reset
— Separate reset in and reset out signals
— Seven sources of reset:
– Power-on reset (POR)
– External
– Software
– Watchdog
– Loss of clock / loss of lock
MCF52211 ColdFire Microcontroller, Rev. 2
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Family Configurations
•
•
•
1.2.2
– Low-voltage detection (LVD)
– JTAG
— Status flag indication of source of last reset
Chip configuration module (CCM)
— System configuration during reset
— Selects one of six clock modes
— Configures output pad drive strength
— Unique part identification number and part revision number
General purpose I/O interface
— Up to 56 bits of general purpose I/O
— Bit manipulation supported via set/clear functions
— Programmable drive strengths
— Unused peripheral pins may be used as extra GPIO
JTAG support for system level board testing
V2 Core Overview
The version 2 ColdFire processor core is comprised of two separate pipelines decoupled by an instruction buffer. The two-stage
instruction fetch pipeline (IFP) is responsible for instruction-address generation and instruction fetch. The instruction buffer is
a first-in-first-out (FIFO) buffer that holds prefetched instructions awaiting execution in the operand execution pipeline (OEP).
The OEP includes two pipeline stages. The first stage decodes instructions and selects operands (DSOC); the second stage
(AGEX) performs instruction execution and calculates operand effective addresses, if needed.
The V2 core implements the ColdFire instruction set architecture revision A+ with support for a separate user stack pointer
register and four new instructions to assist in bit processing. Additionally, the core includes the multiply-accumulate (MAC)
unit for improved signal processing capabilities. The MAC implements a three-stage arithmetic pipeline, optimized for 16x16
bit operations, with support for one 32-bit accumulator. Supported operands include 16- and 32-bit signed and unsigned
integers, signed fractional operands, and a complete set of instructions to process these data types. The MAC provides support
for execution of DSP operations within the context of a single processor at a minimal hardware cost.
1.2.3
Integrated Debug Module
The ColdFire processor core debug interface is provided to support system debugging with low-cost debug and emulator
development tools. Through a standard debug interface, access to debug information and real-time tracing capability is provided
on 100-lead packages. This allows the processor and system to be debugged at full speed without the need for costly in-circuit
emulators.
The on-chip breakpoint resources include a total of nine programmable 32-bit registers: an address and an address mask register,
a data and a data mask register, four PC registers, and one PC mask register. These registers can be accessed through the
dedicated debug serial communication channel or from the processor’s supervisor mode programming model. The breakpoint
registers can be configured to generate triggers by combining the address, data, and PC conditions in a variety of single- or
dual-level definitions. The trigger event can be programmed to generate a processor halt or initiate a debug interrupt exception.
This device implements revision B+ of the ColdFire Debug Architecture.
The processor’s interrupt servicing options during emulator mode allow real-time critical interrupt service routines to be
serviced while processing a debug interrupt event. This ensures the system continues to operate even during debugging.
To support program trace, the V2 debug module provides processor status (PST[3:0]) and debug data (DDATA[3:0]) ports.
These buses and the PSTCLK output provide execution status, captured operand data, and branch target addresses defining
processor activity at the CPU’s clock rate. The device includes a new debug signal, ALLPST. This signal is the logical AND of
the processor status (PST[3:0]) signals and is useful for detecting when the processor is in a halted state (PST[3:0] = 1111).
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
8
Family Configurations
The full debug/trace interface is available only on the 100-pin packages. However, every product features the dedicated debug
serial communication channel (DSI, DSO, DSCLK) and the ALLPST signal.
1.2.4
JTAG
The processor supports circuit board test strategies based on the Test Technology Committee of IEEE and the Joint Test Action
Group (JTAG). The test logic includes a test access port (TAP) consisting of a 16-state controller, an instruction register, and
three test registers (a 1-bit bypass register, a 256-bit boundary-scan register, and a 32-bit ID register). The boundary scan register
links the device’s pins into one shift register. Test logic, implemented using static logic design, is independent of the device
system logic.
The device implementation can:
•
•
•
•
•
Perform boundary-scan operations to test circuit board electrical continuity
Sample system pins during operation and transparently shift out the result in the boundary scan register
Bypass the device for a given circuit board test by effectively reducing the boundary-scan register to a single bit
Disable the output drive to pins during circuit-board testing
Drive output pins to stable levels
1.2.5
1.2.5.1
On-Chip Memories
SRAM
The dual-ported SRAM module provides a general-purpose 8- or 16-Kbyte memory block that the ColdFire core can access in
a single cycle. The location of the memory block can be set to any 8- or 16-Kbyte boundary within the 4-Gbyte address space.
This memory is ideal for storing critical code or data structures and for use as the system stack. Because the SRAM module is
physically connected to the processor's high-speed local bus, it can quickly service core-initiated accesses or
memory-referencing commands from the debug module.
The SRAM module is also accessible by the DMA. The dual-ported nature of the SRAM makes it ideal for implementing
applications with double-buffer schemes, where the processor and a DMA device operate in alternate regions of the SRAM to
maximize system performance.
1.2.5.2
Flash Memory
The ColdFire flash module (CFM) is a non-volatile memory (NVM) module that connects to the processor’s high-speed local
bus. The CFM is constructed with up to four banks of 16-Kbyte16-bit flash memory arrays to generate up to 128 Kbytes of
32-bit flash memory. These electrically erasable and programmable arrays serve as non-volatile program and data memory. The
flash memory is ideal for program and data storage for single-chip applications, allowing for field reprogramming without
requiring an external high voltage source. The CFM interfaces to the ColdFire core through an optimized read-only memory
controller that supports interleaved accesses from the 2-cycle flash memory arrays. A backdoor mapping of the flash memory
is used for all program, erase, and verify operations, as well as providing a read datapath for the DMA. Flash memory may also
be programmed via the EzPort, which is a serial flash memory programming interface that allows the flash memory to be read,
erased and programmed by an external controller in a format compatible with most SPI bus flash memory chips.
1.2.6
Power Management
The device incorporates several low-power modes of operation entered under program control and exited by several external
trigger events. An integrated power-on reset (POR) circuit monitors the input supply and forces an MCU reset as the supply
voltage rises. The low voltage detector (LVD) monitors the supply voltage and is configurable to force a reset or interrupt
condition if it falls below the LVD trip point. The RAM standby switch provides power to RAM when the supply voltage to the
chip falls below the standby battery voltage.
MCF52211 ColdFire Microcontroller, Rev. 2
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Family Configurations
1.2.7
USB On-The-Go Controller
The device includes a Universal Serial Bus On-The-Go (USB OTG) dual-mode controller. USB is a popular standard for
connecting peripherals and portable consumer electronic devices such as digital cameras and handheld computers to host PCs.
The OTG supplement to the USB specification extends USB to peer-to-peer application, enabling devices to connect directly
to each other without the need for a PC. The dual-mode controller on the device can act as a USB OTG host and as a USB
device. It also supports full-speed and low-speed modes.
1.2.8
UARTs
The device has three full-duplex UARTs that function independently. The three UARTs can be clocked by the system bus clock,
eliminating the need for an external clock source. On smaller packages, the third UART is multiplexed with other digital I/O
functions.
1.2.9
I2C Bus
The processor includes two I2C modules. The I2C bus is an industry-standard, two-wire, bidirectional serial bus that provides
a simple, efficient method of data exchange and minimizes the interconnection between devices. This bus is suitable for
applications requiring occasional communications over a short distance between many devices.
1.2.10
QSPI
The queued serial peripheral interface (QSPI) provides a synchronous serial peripheral interface with queued transfer capability.
It allows up to 16 transfers to be queued at once, minimizing the need for CPU intervention between transfers.
1.2.11
Fast ADC
The fast ADC consists of an eight-channel input select multiplexer and two independent sample and hold (S/H) circuits feeding
separate 12-bit ADCs. The two separate converters store their results in accessible buffers for further processing.
The ADC can be configured to perform a single scan and halt, a scan when triggered, or a programmed scan sequence repeatedly
until manually stopped.
The ADC can be configured for sequential or simultaneous conversion. When configured for sequential conversions, up to eight
channels can be sampled and stored in any order specified by the channel list register. Both ADCs may be required during a
scan, depending on the inputs to be sampled.
During a simultaneous conversion, both S/H circuits are used to capture two different channels at the same time. This
configuration requires that a single channel may not be sampled by both S/H circuits simultaneously.
Optional interrupts can be generated at the end of the scan sequence if a channel is out of range (measures below the low
threshold limit or above the high threshold limit set in the limit registers) or at several different zero crossing conditions.
1.2.12
DMA Timers (DTIM0–DTIM3)
There are four independent, DMA transfer capable 32-bit timers (DTIM0, DTIM1, DTIM2, and DTIM3) on the device. Each
module incorporates a 32-bit timer with a separate register set for configuration and control. The timers can be configured to
operate from the system clock or from an external clock source using one of the DTINn signals. If the system clock is selected,
it can be divided by 16 or 1. The input clock is further divided by a user-programmable 8-bit prescaler that clocks the actual
timer counter register (TCRn). Each of these timers can be configured for input capture or reference (output) compare mode.
Timer events may optionally cause interrupt requests or DMA transfers.
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
10
Family Configurations
1.2.13
General Purpose Timer (GPT)
The general purpose timer (GPT) is a four-channel timer module consisting of a 16-bit programmable counter driven by a
seven-stage programmable prescaler. Each of the four channels can be configured for input capture or output compare.
Additionally, channel three, can be configured as a pulse accumulator.
A timer overflow function allows software to extend the timing capability of the system beyond the 16-bit range of the counter.
The input capture and output compare functions allow simultaneous input waveform measurements and output waveform
generation. The input capture function can capture the time of a selected transition edge. The output compare function can
generate output waveforms and timer software delays. The 16-bit pulse accumulator can operate as a simple event counter or a
gated time accumulator.
1.2.14
Periodic Interrupt Timers (PIT0 and PIT1)
The two periodic interrupt timers (PIT0 and PIT1) are 16-bit timers that provide interrupts at regular intervals with minimal
processor intervention. Each timer can count down from the value written in its PIT modulus register or it can be a free-running
down-counter.
1.2.15
Real-Time Clock (RTC)
The Real-Time Clock (RTC) module maintains the system (time-of-day) clock and provides stopwatch, alarm, and interrupt
functions. It includes full clock features: seconds, minutes, hours, days and supports a host of time-of-day interrupt functions
along with an alarm interrupt.
1.2.16
Pulse-Width Modulation (PWM) Timers
The device has an 8-channel, 8-bit PWM timer. Each channel has a programmable period and duty cycle as well as a dedicated
counter. Each of the modulators can create independent continuous waveforms with software-selectable duty rates from 0% to
100%. The timer supports PCM mode, which results in superior signal quality when compared to that of a conventional PWM.
The PWM outputs have programmable polarity, and can be programmed as left aligned outputs or center aligned outputs. For
higher period and duty cycle resolution, each pair of adjacent channels ([7:6], [5:4], [3:2], and [1:0]) can be concatenated to
form a single 16-bit channel. The module can, therefore, be configured to support 8/0, 6/1, 4/2, 2/3, or 0/4 8-/16-bit channels.
1.2.17
Software Watchdog Timer
The watchdog timer is a 32-bit timer that facilitates recovery from runaway code. The watchdog counter is a free-running
down-counter that generates a reset on underflow. To prevent a reset, software must periodically restart the countdown.
1.2.18
Backup Watchdog Timer
The backup watchdog timer is an independent 16-bit timer that, like the software watchdog timer, facilitates recovery from
runaway code. This timer is a free-running down-counter that generates a reset on underflow. To prevent a reset, software must
periodically restart the countdown. The backup watchdog timer can be clocked by either the relaxation oscillator or the system
clock.
1.2.19
Phase-Locked Loop (PLL)
The clock module contains a crystal oscillator, 8 MHz on-chip relaxation oscillator (OCO), phase-locked loop (PLL), reduced
frequency divider (RFD), low-power divider status/control registers, and control logic. To improve noise immunity, the PLL,
crystal oscillator, and relaxation oscillator have their own power supply inputs: VDDPLL and VSSPLL. All other circuits are
powered by the normal supply pins, VDD and VSS.
MCF52211 ColdFire Microcontroller, Rev. 2
11
Freescale Semiconductor
Family Configurations
1.2.20
Interrupt Controller (INTC)
The device has a single interrupt controller that supports up to 63 interrupt sources. There are 56 programmable sources, 49 of
which are assigned to unique peripheral interrupt requests. The remaining seven sources are unassigned and may be used for
software interrupt requests.
1.2.21
DMA Controller
The direct memory access (DMA) controller provides an efficient way to move blocks of data with minimal processor
intervention. It has four channels that allow byte, word, longword, or 16-byte burst line transfers. These transfers are triggered
by software explicitly setting a DCRn[START] bit or by the occurrence of certain UART or DMA timer events.
1.2.22
Reset
The reset controller determines the source of reset, asserts the appropriate reset signals to the system, and keeps track of what
caused the last reset. There are seven sources of reset:
•
•
•
•
•
•
•
External reset input
Power-on reset (POR)
Watchdog timer
Phase locked-loop (PLL) loss of lock / loss of clock
Software
Low-voltage detector (LVD)
JTAG
Control of the LVD and its associated reset and interrupt are managed by the reset controller. Other registers provide status flags
indicating the last source of reset and a control bit for software assertion of the RSTO pin.
1.2.23
GPIO
Nearly all pins on the device have general purpose I/O capability and are grouped into 8-bit ports. Some ports do not use all
eight bits. Each port has registers that configure, monitor, and control the port pin.
1.2.24
Part Numbers and Packaging
This product is RoHS-compliant. Refer to the product page at freescale.com or contact your sales office for up-to-date RoHS
information.
Table 2. Orderable Part Number Summary
Freescale Part
Number
Description
MCF52210CAE66
MCF52210 Microcontroller, 2 UARTs
66
MCF52210CEP66
MCF52210 Microcontroller, 2 UARTs
MCF52210CVM66
Speed Flash/SRAM
(MHz)
(Kbytes)
Package
Temp range
(C)
64 / 16
64 LQFP
-40 to +85
66
64 / 16
64 QFN
-40 to +85
MCF52210 Microcontroller, 2 UARTs
66
64 / 16
81 MAPBGA
-40 to +85
MCF52210CVM80
MCF52210 Microcontroller, 2 UARTs
80
64 / 16
81 MAPBGA
-40 to +85
MCF52211CAE66
MCF52211 Microcontroller, 2 UARTs
66
128 / 16
64 LQFP
-40 to +85
MCF52211CAF80
MCF52211 Microcontroller, 3 UARTs
80
128 / 16
100 LQFP
-40 to +85
MCF52211CEP66
MCF52211 Microcontroller, 2 UARTs
66
128 / 16
64 QFN
-40 to +85
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
12
Family Configurations
Table 2. Orderable Part Number Summary (continued)
Freescale Part
Number
Description
MCF52211CVM66
MCF52211 Microcontroller, 2 UARTs
66
MCF52211CVM80
MCF52211 Microcontroller, 2 UARTs
MCF52212CAE50
Speed Flash/SRAM
(MHz)
(Kbytes)
Package
Temp range
(C)
128 / 16
81 MAPBGA
-40 to +85
80
128 / 16
81 MAPBGA
-40 to +85
MCF52212 Microcontroller, 2 UARTs
50
64 / 8
64 LQFP
-40 to +85
MCF52212AE50
MCF52212 Microcontroller, 2 UARTs
50
64 / 8
64 LQFP
0 to +70
MCF52213CAE50
MCF52213 Microcontroller, 2 UARTs
50
128 / 8
64 LQFP
-40 to +85
MCF52213AE50
MCF52213 Microcontroller, 2 UARTs
50
128 / 8
64 LQFP
0 to +70
MCF52211 ColdFire Microcontroller, Rev. 2
13
Freescale Semiconductor
Family Configurations
100 LQFP
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VSS
VDDPLL
EXTAL
XTAL
VSSPLL
PST3
PST2
VDD
VSS
PST1
PST0
PSTCLK
GPT3
VDDUSB
USB_DM
USB_DP
VSSUSB
GPT2
VDD
VSS
VSTBY
AN4
AN5
AN6
AN7
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
JTAG_EN
UCTS2
URXD2
UTXD2
URTS2
DTIN2
DTIN3
GPT1
VDD
VSS
DTIN0
DTIN1
GPT0
CLKMOD1
CLKMOD0
VDD
VSS
AN0
AN1
AN2
AN3
VSSA
VRL
VRH
VDDA
VDD
VDD
VSS
URTS1
TEST
UCTS0
URXD0
UTXD0
URTS0
SCL
SDA
QSPI_CS3
QSPI_CS2
VDD
VSS
QSPI-DIN
QSPI_DOUT
QSPI_CLK
QSPI_CS1
QSPI_CS0
RCON
VDD
VDD
VSS
VSS
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
URXD1
UTXD1
UCTS1
RSTO
RSTI
IRQ7
IRQ6
VDD
VSS
IRQ5
IRQ4
IRQ3
IRQ2
IRQ1
ALLPST
DSCLK
DDATA3
DDATA2
VSS
VDD
DSO
DSI
DDATA1
DDATA0
BKPT
Table 2 shows the pinout configuration for the 100 LQFP.
Figure 2. 100 LQFP Pin Assignments
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
14
Family Configurations
Figure 3 shows the pinout configuration for the 81 MAPBGA.
1
2
3
4
5
6
7
8
9
A
VSS
UTXD1
RSTI
IRQ5
IRQ3
ALLPST
TDO
TMS
VSS
B
URTS1
URXD1
RSTO
IRQ6
IRQ2
TRST
TDI
VDDPLL
EXTAL
C
UCTS0
TEST
UCTS1
IRQ7
IRQ4
IRQ1
TCLK
VSSPLL
XTAL
D
URXD0
UTXD0
URTS0
VSS
VDD
VSS
PWM7
GPT3
GPT2
E
SCL
SDA
VDD
VDD
VDD
VDD
VDD
PWM5
GPT1
F
QSPI_CS3
QSPI_CS2
QSPI_DIN
VSS
VDD
VSS
GPT0
VSTBY
AN4
G
QSPI_DOUT
QSPI_CLK
RCON
DTIN1
CLKMOD0
AN2
AN3
AN5
AN6
H
QSPI_CS0
QSPI_CS1
DTIN3
DTIN0
CLKMOD1
AN1
VSSA
VDDA
AN7
J
VSS
JTAG_EN
DTIN2
PWM3
PWM1
AN0
VRL
VRH
VSSA
Figure 3. 81 MAPBGA Pin Assignments
MCF52211 ColdFire Microcontroller, Rev. 2
15
Freescale Semiconductor
Family Configurations
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VSS
URXD1
UTXD1
UCTS1
RSTO
RSTI
IRQ7
IRQ4
IRQ1
ALLPST
DSCLK
VSS
VDD
DSO
DSI
BKPT
Figure 4 shows the pinout configuration for the 64 LQFP and 64 QFN.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64-Pin Packages
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDPLL
EXTAL
XTAL
VSSPLL
PSTCLK
VDDUSB
USB_DM
USB_DP
VSSUSB
VDD
VSS
VSTBY
AN4
AN5
AN6
AN7
JTAG_EN
DTIN2
DTIN3
VDD
VSS
DTIN0
DTIN1
CLKMOD0
AN0
AN1
AN2
AN3
VSSA
VRL
VRH
VDDA
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VDD
URTS1
TEST
UCTS0
URXD0
UTXD0
URTS0
SCL
SDA
VDD
VSS
QSPI_DIN
QSPI_DOUT
QSPI_CLK
QSPI_CS0
RCON
Figure 4. 64 LQFP and 64 QFN Pin Assignments
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
16
Table 3. Pin Functions by Primary and Alternate Purpose
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
1
Control
MCF52211 ColdFire Microcontroller, Rev. 2
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
ADC
AN7
—
—
GPIO
Low
FAST
AN6
—
—
GPIO
Low
AN5
—
—
GPIO
AN4
—
—
AN3
—
AN2
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
51
H9
33
FAST
—
52
G9
34
Low
FAST
—
53
G8
35
GPIO
Low
FAST
—
54
F9
36
—
GPIO
Low
FAST
—
46
G7
28
—
—
GPIO
Low
FAST
—
45
G6
27
AN1
—
—
GPIO
Low
FAST
—
44
H6
26
AN0
—
—
GPIO
Low
FAST
—
43
J6
25
SYNCA3
—
—
—
N/A
N/A
—
—
—
—
3
—
—
—
N/A
N/A
—
—
—
—
VDDA
—
—
—
N/A
N/A
—
50
H8
32
VSSA
—
—
—
N/A
N/A
—
47
H7, J9
29
VRH
—
—
—
N/A
N/A
—
49
J8
31
VRL
—
—
—
N/A
N/A
—
48
J7
30
EXTAL
—
—
—
N/A
N/A
—
73
B9
47
XTAL
—
—
—
N/A
N/A
—
72
C9
46
VDDPLL
—
—
—
N/A
N/A
—
74
B8
48
VSSPLL
—
—
—
N/A
N/A
—
71
C8
45
ALLPST
—
—
—
High
FAST
—
86
A6
55
DDATA[3:0]
—
—
GPIO
High
FAST
—
84,83,78,77
—
—
PST[3:0]
—
—
GPIO
High
FAST
—
70,69,66,65
—
—
PSRR[0]
pull-up4
10
E1
8
PSRR[0]
4
11
E2
9
SYNCB
Clock
Generation
Debug Data
Freescale Semiconductor
Pin on
100 LQFP
2C
I
SCL
SDA
USB_DMI
USB_DPI
UTXD2
URXD2
GPIO
GPIO
PDSR[0]
PDSR[0]
pull-up
Family Configurations
17
Table 3 shows the pin functions by primary and alternate purpose, and illustrates which packages contain each pin.
Freescale Semiconductor
Table 3. Pin Functions by Primary and Alternate Purpose (continued)
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
Interrupts
IRQ7
—
—
GPIO
Low
FAST
IRQ6
—
—
GPIO
Low
IRQ5
—
—
GPIO
IRQ4
—
—
IRQ3
—
IRQ2
—
MCF52211 ColdFire Microcontroller, Rev. 2
JTAG/BDM
Mode
Selection6
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
95
C4
58
FAST
—
94
B4
—
Low
FAST
—
91
A4
—
GPIO
Low
FAST
—
90
C5
57
—
GPIO
Low
FAST
—
89
A5
—
—
GPIO
Low
FAST
—
88
B5
—
87
C6
56
IRQ1
SYNCA
USB_ALT_CL
K
GPIO
High
FAST
pull-up4
JTAG_EN
—
—
—
N/A
N/A
pull-down
26
J2
17
64
C7
44
TCLK/
PSTCLK
CLKOUT
—
—
High
FAST
pull-up5
TDI/DSI
—
—
—
N/A
N/A
pull-up5
79
B7
50
TDO/DSO
—
—
—
High
FAST
—
80
A7
51
TMS
/BKPT
—
—
—
N/A
N/A
pull-up5
76
A8
49
TRST
/DSCLK
—
—
—
N/A
N/A
pull-up5
85
B6
54
CLKMOD0
—
—
—
N/A
N/A
pull-down6
40
G5
24
6
39
H5
—
21
G3
16
CLKMOD1
—
—
—
N/A
N/A
pull-down
RCON/
EZPCS
—
—
—
N/A
N/A
pull-up
Family Configurations
18
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
MCF52211 ColdFire Microcontroller, Rev. 2
Pin
Group
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
QSPI
QSPI_DIN/
EZPD
—
URXD1
GPIO
PDSR[2]
PSRR[2]
QSPI_DOUT/
EZPQ
—
UTXD1
GPIO
PDSR[1]
QSPI_CLK/
EZPCK
SCL
URTS1
GPIO
QSPI_CS3
SYNCA
—
QSPI_CS2
—
QSPI_CS1
QSPI_CS0
9
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
—
16
F3
12
PSRR[1]
—
17
G1
13
PDSR[3]
PSRR[3]
pull-up8
18
G2
14
GPIO
PDSR[7]
PSRR[7]
pull-up/pulldown7
12
F1
—
—
GPIO
PDSR[6]
PSRR[6]
pull-up/pulldown7
13
F2
—
—
—
GPIO
PDSR[5]
PSRR[5]
—
19
H2
—
SDA
UCTS1
GPIO
PDSR[4]
PSRR[4]
pull-up8
20
H1
15
96
A3
59
RSTI
—
—
—
N/A
N/A
pull-up9
RSTO
—
—
—
high
FAST
—
97
B3
60
Test
TEST
—
—
—
N/A
N/A
pull-down
5
C2
3
Timers, 16-bit
GPT3
—
PWM7
GPIO
PDSR[23]
PSRR[23]
pull-up10
63
D7
—
PSRR[22]
pull-up
10
58
E8
—
PSRR[21]
pull-up10
33
J4
—
10
38
J5
—
Reset
GPT2
GPT1
Timers, 32-bit
Freescale Semiconductor
UART 0
—
—
PWM5
PWM3
GPIO
GPIO
PDSR[22]
PDSR[21]
GPT0
—
PWM1
GPIO
PDSR[20]
PSRR[20]
pull-up
DTIN3
DTOUT3
PWM6
GPIO
PDSR[19]
PSRR[19]
—
32
H3
19
DTIN2
DTOUT2
PWM4
GPIO
PDSR[18]
PSRR[18]
—
31
J3
18
DTIN1
DTOUT1
PWM2
GPIO
PDSR[17]
PSRR[17]
—
37
G4
23
DTIN0
DTOUT0
PWM0
GPIO
PDSR[16]
PSRR[16]
—
36
H4
22
UCTS0
—
—
GPIO
PDSR[11]
PSRR[11]
—
6
C1
4
URTS0
—
—
GPIO
PDSR[10]
PSRR[10]
—
9
D3
7
URXD0
RTC_EXTAL
—
GPIO
PDSR[9]
PSRR[9]
—
7
D1
5
UTXD0
RTC_XTAL
—
GPIO
PDSR[8]
PSRR[8]
—
8
D2
6
Family Configurations
19
Table 3. Pin Functions by Primary and Alternate Purpose (continued)
Primary
Function
Secondary
Function
Tertiary
Function
Quaternary
Function
Pin on
100 LQFP
Pin on 81
MAPBGA
Pin on 64
LQFP/QFN
UART 1
UCTS1
SYNCA
URXD2
GPIO
PDSR[15]
PSRR[15]
—
98
C3
61
URTS1
SYNCB
UTXD2
GPIO
PDSR[14]
PSRR[14]
—
4
B1
2
URXD1
—
—
GPIO
PDSR[13]
PSRR[13]
—
100
B2
63
UTXD1
—
—
GPIO
PDSR[12]
PSRR[12]
—
99
A2
62
UCTS2
—
—
GPIO
PDSR[27]
PSRR[27]
—
27
—
—
URTS2
—
—
GPIO
PDSR[26]
PSRR[26]
—
30
—
—
URXD2
—
—
GPIO
PDSR[25]
PSRR[25]
—
28
—
—
UTXD2
—
—
GPIO
PDSR[24]
PSRR[24]
—
29
—
—
VSTBY
VSTBY
—
—
—
N/A
N/A
—
55
F8
37
USB
VDDUSB
—
—
—
N/A
N/A
—
62
D8
43
VSSUSB
—
—
—
N/A
N/A
—
59
F7
40
USB_DM
—
—
—
N/A
N/A
—
61
D9
42
USB_DP
—
—
—
N/A
N/A
—
60
E9
41
VDD
VDD
—
—
—
N/A
N/A
—
1,2,14,22,
23,34,41,
57,68,81,93
VSS
VSS
—
—
—
N/A
N/A
—
3,15,24,25,3 A1,A9,D4,D
5,42,56,
6,F4,F6,J1
67,75,82,92
UART 2
MCF52211 ColdFire Microcontroller, Rev. 2
1
Drive
Slew Rate / Pull-up /
Strength /
Control1 Pull-down2
Control1
Pin
Group
D5,E3–E7, 1,10,20,39,5
F5
2
11,21,38,
53,64
Freescale Semiconductor
The PDSR and PSSR registers are described in the General Purpose I/O chapter. All programmable signals default to 2 mA drive and FAST slew rate in
normal (single-chip) mode.
2 All signals have a pull-up in GPIO mode.
3 These signals are multiplexed on other pins.
4 For primary and GPIO functions only.
5 Only when JTAG mode is enabled.
6 CLKMOD0 and CLKMOD1 have internal pull-down resistors; however, the use of external resistors is very strongly recommended.
7 When these pins are configured for USB signals, they should use the USB transceiver’s internal pull-up/pull-down resistors (see the description of the
OTG_CTRL register). If these pins are not configured for USB signals, each pin should be pulled down externally using a 10 k resistor.
8
For secondary and GPIO functions only.
9
RSTI has an internal pull-up resistor; however, the use of an external resistor is very strongly recommended.
10 For GPIO function. Primary Function has pull-up control within the GPT module.
Family Configurations
20
Table 3. Pin Functions by Primary and Alternate Purpose (continued)
Family Configurations
1.3
Reset Signals
Table 4 describes signals used to reset the chip or as a reset indication.
Table 4. Reset Signals
1.4
Signal Name
Abbreviation
Function
I/O
Reset In
RSTI
Primary reset input to the device. Asserting RSTI for at least 8 CPU
clock cycles immediately resets the CPU and peripherals.
I
Reset Out
RSTO
Driven low for 1024 CPU clocks after the reset source has deasserted.
O
PLL and Clock Signals
Table 5 describes signals used to support the on-chip clock generation circuitry.
Table 5. PLL and Clock Signals
1.5
Signal Name
Abbreviation
External Clock In
EXTAL
Crystal
XTAL
Clock Out
CLKOUT
Function
I/O
Crystal oscillator or external clock input except when the on-chip
relaxation oscillator is used.
I
Crystal oscillator output except when CLKMOD0=0, then sampled as
part of the clock mode selection mechanism.
O
This output signal reflects the internal system clock.
O
Mode Selection
Table 6 describes signals used in mode selection; Table 7 describes the particular clocking modes.
Table 6. Mode Selection Signals
Signal Name
Clock Mode Selection
Abbreviation
Function
CLKMOD[1:0] Selects the clock boot mode.
Reset Configuration
RCON
The Serial Flash Programming mode is entered by asserting the
RCON pin (with the TEST pin negated) as the chip comes out of
reset. During this mode, the EzPort has access to the flash memory
which can be programmed from an external device.
Test
TEST
Reserved for factory testing only and in normal modes of operation
should be connected to VSS to prevent unintentional activation of
test functions.
I/O
I
I
Table 7. Clocking Modes
CLKMOD[1:0]
XTAL
Configure the clock mode.
00
0
PLL disabled, clock driven by external oscillator
00
1
PLL disabled, clock driven by on-chip oscillator
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
21
Family Configurations
Table 7. Clocking Modes (continued)
CLKMOD[1:0]
XTAL
Configure the clock mode.
01
N/A
10
0
PLL in normal mode, clock driven by external oscillator1
10
1
Reserved2
11
N/A
PLL disabled, clock driven by crystal
PLL in normal mode, clock driven by crystal
1
The PLL pre-divider (CCHR+1) reset value is 6 and the PLL input reference range is 2–10 MHz,
so in order to boot with the PLL enabled, the external clock or crystal frequency needs to be
greater than 12 MHz. MCF5221x devices cannot boot with PLL enabled from an external clock
or crystal oscillator with frequency less than 12 MHz. This constraint does not apply to booting
with PLL disabled.
2
Cannot boot from the Internal 8 MHz Relaxation oscillator with the PLL enabled. Refer Note1.
Thus this mode has been removed from the table.
1.6
External Interrupt Signals
Table 8 describes the external interrupt signals.
Table 8. External Interrupt Signals
1.7
Signal Name
Abbreviation
External Interrupts
IRQ[7:1]
Function
I/O
External interrupt sources.
I
Queued Serial Peripheral Interface (QSPI)
Table 9 describes the QSPI signals.
Table 9. Queued Serial Peripheral Interface (QSPI) Signals
Signal Name
QSPI Synchronous
Serial Output
Abbreviation
Function
I/O
QSPI_DOUT Provides the serial data from the QSPI and can be programmed to be
driven on the rising or falling edge of QSPI_CLK.
QSPI Synchronous
Serial Data Input
QSPI_DIN
Provides the serial data to the QSPI and can be programmed to be
sampled on the rising or falling edge of QSPI_CLK.
I
QSPI Serial Clock
QSPI_CLK
Provides the serial clock from the QSPI. The polarity and phase of
QSPI_CLK are programmable.
O
Synchronous Peripheral QSPI_CS[3:0] QSPI peripheral chip select; can be programmed to be active high or
Chip Selects
low.
1.8
O
O
USB On-the-Go
This device is compliant with industry standard USB 2.0 specification.
1.9
I2C I/O Signals
Table 10 describes the I2C serial interface module signals.
MCF52211 ColdFire Microcontroller, Rev. 2
22
Freescale Semiconductor
Family Configurations
Table 10. I2C I/O Signals
Signal Name
1.10
Abbreviation
Function
2
I/O
Serial Clock
SCLn
Open-drain clock signal for the for the I C interface. When the bus is
In master mode, this clock is driven by the I2C module; when the bus
is in slave mode, this clock becomes the clock input.
I/O
Serial Data
SDAn
Open-drain signal that serves as the data input/output for the I2C
interface.
I/O
UART Module Signals
Table 11 describes the UART module signals.
Table 11. UART Module Signals
Signal Name
Abbreviation
Function
I/O
Transmit Serial Data
Output
UTXDn
Transmitter serial data outputs for the UART modules. The output is
held high (mark condition) when the transmitter is disabled, idle, or in
the local loopback mode. Data is shifted out, LSB first, on this pin at
the falling edge of the serial clock source.
O
Receive Serial Data
Input
URXDn
Receiver serial data inputs for the UART modules. Data is received on
this pin LSB first. When the UART clock is stopped for power-down
mode, any transition on this pin restarts the clock.
I
Clear-to-Send
UCTSn
Indication to the UART modules that they can begin data
transmission.
I
Request-to-Send
URTSn
Automatic request-to-send outputs from the UART modules. This
signal can also be configured to be asserted and negated as a
function of the RxFIFO level.
O
1.11
DMA Timer Signals
Table 12 describes the signals of the four DMA timer modules.
Table 12. DMA Timer Signals
Signal Name
Abbreviation
DMA Timer Input
DTIN
DMA Timer Output
DTOUT
Function
I/O
Event input to the DMA timer modules.
I
Programmable output from the DMA timer modules.
O
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
23
Family Configurations
1.12
ADC Signals
Table 13 describes the signals of the Analog-to-Digital Converter.
Table 13. ADC Signals
Signal Name
Abbreviation
Function
Analog Inputs
AN[7:0]
Inputs to the analog-to-digital converter.
I
Analog Reference
VRH
Reference voltage high and low inputs.
I
I
VRL
Analog Supply
Isolate the ADC circuitry from power supply noise.
VDDA
VSSA
ADC Sync Inputs
1.13
I/O
—
—
SYNCA /
SYNCB
These signals can initiate an analog-to-digital conversion
process.
I
General Purpose Timer Signals
Table 14 describes the general purpose timer signals.
Table 14. GPT Signals
Signal Name
Abbreviation
General Purpose Timer
Input/Output
GPT[3:0]
1.14
Function
I/O
Inputs to or outputs from the general purpose timer module.
I/O
Pulse Width Modulator Signals
Table 15 describes the PWM signals.
Table 15. PWM Signals
Signal Name
Abbreviation
PWM Output Channels
PWM[7:0]
1.15
Function
Pulse width modulated output for PWM channels.
I/O
O
Debug Support Signals
These signals are used as the interface to the on-chip JTAG controller and the BDM logic.
Table 16. Debug Support Signals
Signal Name
Abbreviation
JTAG Enable
JTAG_EN
Test Reset
Function
I/O
Select between debug module and JTAG signals at reset.
I
TRST
This active-low signal is used to initialize the JTAG logic
asynchronously.
I
Test Clock
TCLK
Used to synchronize the JTAG logic.
I
Test Mode Select
TMS
Used to sequence the JTAG state machine. TMS is sampled on the
rising edge of TCLK.
I
Test Data Input
TDI
Serial input for test instructions and data. TDI is sampled on the rising
edge of TCLK.
I
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
24
Family Configurations
Table 16. Debug Support Signals (continued)
Signal Name
Abbreviation
Function
I/O
Test Data Output
TDO
Serial output for test instructions and data. TDO is tri-stateable and is
actively driven in the shift-IR and shift-DR controller states. TDO
changes on the falling edge of TCLK.
O
Development Serial
Clock
DSCLK
Development Serial Clock - Internally synchronized input. (The logic
level on DSCLK is validated if it has the same value on two
consecutive rising bus clock edges.) Clocks the serial communication
port to the debug module during packet transfers. Maximum frequency
is PSTCLK/5. At the synchronized rising edge of DSCLK, the data
input on DSI is sampled and DSO changes state.
I
Breakpoint
BKPT
Breakpoint - Input used to request a manual breakpoint. Assertion of
BKPT puts the processor into a halted state after the current
instruction completes. Halt status is reflected on processor
status/debug data signals (PST[3:0] and PSTDDATA[7:0]) as the
value 0xF. If CSR[BKD] is set (disabling normal BKPT functionality),
asserting BKPT generates a debug interrupt exception in the
processor.
I
Development Serial
Input
DSI
Development Serial Input - Internally synchronized input that provides
data input for the serial communication port to the debug module, after
the DSCLK has been seen as high (logic 1).
I
Development Serial
Output
DSO
Development Serial Output - Provides serial output communication for
debug module responses. DSO is registered internally. The output is
delayed from the validation of DSCLK high.
O
Debug Data
DDATA[3:0]
Display captured processor data and breakpoint status. The CLKOUT
signal can be used by the development system to know when to
sample DDATA[3:0].
O
Processor Status Clock
PSTCLK
Processor Status Clock - Delayed version of the processor clock. Its
rising edge appears in the center of valid PST and DDATA output.
PSTCLK indicates when the development system should sample PST
and DDATA values.
If real-time trace is not used, setting CSR[PCD] keeps PSTCLK, and
PST and DDATA outputs from toggling without disabling triggers.
Non-quiescent operation can be reenabled by clearing CSR[PCD],
although the external development systems must resynchronize with
the PST and DDATA outputs.
PSTCLK starts clocking only when the first non-zero PST value (0xC,
0xD, or 0xF) occurs during system reset exception processing.
O
Processor Status
Outputs
PST[3:0]
Indicate core status. Debug mode timing is synchronous with the
processor clock; status is unrelated to the current bus transfer. The
CLKOUT signal can be used by the development system to know
when to sample PST[3:0].
O
All Processor Status
Outputs
ALLPST
Logical AND of PST[3:0]. The CLKOUT signal can be used by the
development system to know when to sample ALLPST.
O
1.16
EzPort Signal Descriptions
Table 17 contains a list of EzPort external signals.
MCF52211 ColdFire Microcontroller, Rev. 2
25
Freescale Semiconductor
Family Configurations
Table 17. EzPort Signal Descriptions
1.17
Signal Name
Abbreviation
Function
I/O
EzPort Clock
EZPCK
Shift clock for EzPort transfers.
I
EzPort Chip Select
EZPCS
Chip select for signalling the start and end of
serial transfers.
I
EzPort Serial Data In
EZPD
EZPD is sampled on the rising edge of
EZPCK.
I
EzPort Serial Data Out
EZPQ
EZPQ transitions on the falling edge of
EZPCK.
O
Power and Ground Pins
The pins described in Table 18 provide system power and ground to the chip. Multiple pins are provided for adequate current
capability. All power supply pins must have adequate bypass capacitance for high-frequency noise suppression.
Table 18. Power and Ground Pins
Signal Name
Abbreviation
Function
PLL Analog Supply
VDDPLL,
VSSPLL
Dedicated power supply signals to isolate the sensitive PLL analog
circuitry from the normal levels of noise present on the digital power
supply.
Positive Supply
VDD
These pins supply positive power to the core logic.
Ground
VSS
This pin is the negative supply (ground) to the chip.
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
26
Electrical Characteristics
2
Electrical Characteristics
This section contains electrical specification tables and reference timing diagrams for the microcontroller unit, including
detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications.
The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not
be fully tested or guaranteed at this early stage of the product life cycle. These specifications will, however, be met for
production silicon. Finalized specifications will be published after complete characterization and device qualifications have
been completed.
NOTE
The parameters specified in this data sheet supersede any values found in the module
specifications.
2.1
Maximum Ratings
Table 19. Absolute Maximum Ratings1, 2
Rating
Symbol
Value
Unit
VDD
–0.3 to 4.0
V
Clock synthesizer supply voltage
VDDPLL
–0.3 to 4.0
V
RAM standby supply voltage
VSTBY
+1.8 to 3.5
V
USB standby supply voltage
VDDUSB
–0.3 to 4.0
V
VIN
–0.3 to 4.0
V
EXTAL pin voltage
VEXTAL
0 to 3.3
V
XTAL pin voltage
VXTAL
0 to 3.3
V
IDD
25
mA
TA
(TL - TH)
–40 to 85 or
0 to 706
C
Tstg
–65 to 150
C
Supply voltage
Digital input voltage
3
Instantaneous maximum current
Single pin limit (applies to all pins)4, 5
Operating temperature range (packaged)
Storage temperature range
1
2
3
4
5
6
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings
are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond
those listed may affect device reliability or cause permanent damage to the device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate logic voltage level (VSS or VDD).
Input must be current limited to the IDD value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then
use the larger of the two values.
All functional non-supply pins are internally clamped to VSS and VDD.
The power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > VDD) is greater than IDD, the
injection current may flow out of VDD and could result in the external power supply going out of
regulation. Ensure that the external VDD load shunts current greater than maximum injection current.
This is the greatest risk when the MCU is not consuming power (e.g., no clock).
Depending on the packaging; see the orderable part number summary.
MCF52211 ColdFire Microcontroller, Rev. 2
27
Freescale Semiconductor
Electrical Characteristics
2.2
Current Consumption
Table 20. Current Consumption in Low-Power Mode1,2
Flash memory
SRAM
Mode
Units
8 MHz
16 MHz
64 MHz
80 MHz
8 MHz
16 MHz
64 MHz
Stop mode 3 (Stop 11)3
0.057
0.002
Stop mode 2 (Stop 10)3
2.5
2.3
Stop mode 1 (Stop 01)3,4
80 MHz
mA
3.03
3.3
4.9
5.6
2.9
3.1
4.8
5.4
3.03
3.3
4.9
5.6
2.9
3.1
4.8
5.4
Wait / Doze
12.3
22.7
40.3
45
5.3
7.9
24
30
Run
TBD
TBD
TBD
TBD
6.7
10.8
35
43
Stop mode 0 (Stop 00)
3
1
All values are measured with a 3.30V power supply.
Refer to the Power Management chapter in the MCF52211 Reference Manual for more information on low-power modes.
3 See the description of the Low-Power Control Register (LPCR) in the MCF52211 Reference Manual for more information on
stop modes 0–3.
4 Results are identical to STOP 00 for typical values because they only differ by CLKOUT power consumption. CLKOUT is
already disabled in this instance prior to entering low power mode.
2
Table 21. Typical Active Current Consumption Specifications
Symbol
Typical1
Active
(SRAM)
Typical1
Active
(Flash)
Peak2
(Flash)
Unit
IDD
8
11
21
mA
PLL @ 16 MHz
12
19
38
PLL @ 64 MHz
38
45
102
PLL @ 80 MHz
45
54
118
Characteristic
PLL @ 8 MHz
RAM standby supply current
• Normal operation: VDD > VSTBY - 0.3 V
• Transient condition: VSTBY - 0.3 V > VDD > VSS + 0.5 V
• Standby operation: VDD < VSS + 0.5 V
ISTBY
Analog supply current
• Normal operation
• Standby
• Powered down
IDDA
USB supply current
PLL supply current
—
—
—
IDDUSB
IDDPLL
—
—
—
—
—
—
—
—
—
—
0
65
16
A
A
A
14
0.8
0
mA
TBD
mA
(see note 3)
6
mA
1
Tested at room temperature with CPU polling a status register. All clocks were off except the UART and CFM (when
running from flash memory).
2 Peak current measured with all modules active, CPU polling a status register, and default drive strength with matching
load.
3 Tested with the PLL MFD set to 7 (max value). Setting the MFD to a lower value results in lower current consumption.
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
28
Electrical Characteristics
2.3
Thermal Characteristics
Table 22 lists thermal resistance values.
Table 22. Thermal Characteristics
Characteristic
100 LQFP
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Unit
Single layer board (1s)
JA
531,2
C/W
Four layer board (2s2p)
JA
1,3
C/W
Single layer board (1s)
JMA
1,3
C/W
Four layer board (2s2p)
JMA
1,3
C/W
—
JB
—
JC
39
42
33
254
C/W
5
C/W
6
9
2
C/W
Tj
105
oC
Single layer board (1s)
JA
611,2
C/W
Four layer board (2s2p)
JA
352,3
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
502,3
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
312,3
C/W
—
JB
204
C/W
—
JC
125
C/W
jt
26
C/W
Tj
105
oC
Single layer board (1s)
JA
621,2
C/W
Four layer board (2s2p)
JA
431,3
C/W
Junction to ambient (@200 ft/min)
Single layer board (1s)
JMA
501,3
C/W
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
JMA
361,3
C/W
—
JB
264
C/W
—
Maximum operating junction temperature
81 MAPBGA Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
64 QFN
Value
jt
Junction to top of package
64 LQFP
Symbol
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
Natural convection
—
Natural convection
—
JC
5
9
C/W
jt
26
C/W
Tj
105
oC
Single layer board (1s)
JA
681,2
C/W
Four layer board (2s2p)
JA
241,3
C/W
Single layer board (1s)
JMA
551,3
C/W
Four layer board (2s2p)
JMA
1,3
C/W
Natural convection
—
19
—
JB
84
C/W
—
JC
0.65
C/W
Natural convection
—
jt
3
C/W
Tj
105
oC
6
MCF52211 ColdFire Microcontroller, Rev. 2
29
Freescale Semiconductor
Electrical Characteristics
1
2
3
4
5
6
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (TJ) in C can be obtained from:
T J = T A + P D JMA (1)
Where:
TA
= ambient temperature, C
JA
= package thermal resistance, junction-to-ambient, C/W
PD
= PINT PI/O
PINT
= chip internal power, IDD VDD, watts
PI/O
= power dissipation on input and output pins — user determined, watts
For most applications PI/O PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
P D = K T J + 273C
(2)
Solving equations 1 and 2 for K gives:
K = PD (TA + 273 C) + JMA PD 2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
2.4
Flash Memory Characteristics
The flash memory characteristics are shown in Table 23 and Table 24.
Table 23. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
System clock (read only)
System clock
1
2
(program/erase)2
Symbol
Min
Typ
Max
Unit
fsys(R)
0
—
50–801
MHz
fsys(P/E)
0.15
—
102.4
MHz
Depending on packaging; see the orderable part number summary.
Refer to the flash memory section for more information
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
30
Electrical Characteristics
Table 24. SGFM Flash Module Life Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Value
Unit
P/E
10,0002
Cycles
Retention
10
Years
Maximum number of guaranteed program/erase cycles1 before failure
Data retention at average operating temperature of 85C
1
2
A program/erase cycle is defined as switching the bits from 1 0 1.
Reprogramming of a flash memory array block prior to erase is not required.
2.5
EzPort Electrical Specifications
Table 25. EzPort Electrical Specifications
Name
Characteristic
Min
Max
Unit
EP1
EPCK frequency of operation (all commands except READ)
—
fsys / 2
MHz
EP1a
EPCK frequency of operation (READ command)
—
fsys / 8
MHz
EP2
EPCS_b negation to next EPCS_b assertion
2 × Tcyc
—
ns
EP3
EPCS_B input valid to EPCK high (setup)
5
—
ns
EP4
EPCK high to EPCS_B input invalid (hold)
5
—
ns
EP5
EPD input valid to EPCK high (setup)
2
—
ns
EP6
EPCK high to EPD input invalid (hold)
5
—
ns
EP7
EPCK low to EPQ output valid (out setup)
—
12
ns
EP8
EPCK low to EPQ output invalid (out hold)
0
—
ns
EP9
EPCS_B negation to EPQ tri-state
—
12
ns
MCF52211 ColdFire Microcontroller, Rev. 2
31
Freescale Semiconductor
Electrical Characteristics
2.6
ESD Protection
Table 26. ESD Protection Characteristics1, 2
Characteristics
Symbol
Value
Units
ESD target for Human Body Model
HBM
2000
V
ESD target for Machine Model
MM
200
V
Rseries
1500
C
100
pF
Rseries
0
C
200
pF
Number of pulses per pin (HBM)
• Positive pulses
• Negative pulses
—
—
1
1
Number of pulses per pin (MM)
• Positive pulses
• Negative pulses
—
—
3
3
Interval of pulses
—
1
HBM circuit description
MM circuit description
—
—
sec
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
2 A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
2.7
DC Electrical Specifications
Table 27. DC Electrical Specifications 1
Characteristic
Symbol
Min
Max
Unit
Supply voltage
VDD
3.0
3.6
V
Standby voltage
VSTBY
1.8
3.5
V
Input high voltage
VIH
0.7 VDD
4.0
V
Input low voltage
VIL
VSS – 0.3
0.35 VDD
V
Input hysteresis2
VHYS
0.06 VDD
—
mV
Low-voltage detect trip voltage (VDD falling)
VLVD
2.15
2.3
V
Low-voltage detect hysteresis (VDD rising)
VLVDHYS
60
120
mV
Iin
–1.0
1.0
A
Output high voltage (all input/output and all output pins)
IOH = –2.0 mA
VOH
VDD – 0.5
—
V
Output low voltage (all input/output and all output pins)
IOL = 2.0mA
VOL
—
0.5
V
Input leakage current
Vin = VDD or VSS, digital pins
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
32
Electrical Characteristics
Table 27. DC Electrical Specifications (continued)1
Characteristic
Symbol
Min
Max
Unit
Output high voltage (high drive)
IOH = -5 mA
VOH
VDD – 0.5
—
V
Output low voltage (high drive)
IOL = 5 mA
VOL
—
0.5
V
Output high voltage (low drive)
IOH = -2 mA
VOH
VDD - 0.5
—
V
Output low voltage (low drive)
IOL = 2 mA
VOL
—
0.5
V
Weak internal pull Up device current, tested at VIL Max.3
IAPU
–10
–130
A
Input Capacitance 4
• All input-only pins
• All input/output (three-state) pins
Cin
—
—
7
7
pF
1
Refer to Table 28 for additional PLL specifications.
Only for pins: IRQ1, IRQ2. IRQ3, IRQ4, IRQ5, IRQ6. IRQ7, RSTIN_B, RCON_B, PCS0, SCK, I2C_SDA, I2C_SCL,
TCLK, TRST_B, TEST
3 Refer toTable 3 for pins having internal pull-up devices.
4 This parameter is characterized before qualification rather than 100% tested.
2
2.8
Clock Source Electrical Specifications
Table 28. Oscillator and PLL Electrical Specifications
(VDD and VDDPLL = 2.7 to 3.6 V, VSS = VSSPLL = 0 V)
Characteristic
Symbol
Min
Max
Clock Source Frequency Range of EXTAL Frequency Range
• Crystal
• External1
fcrystal
fext
1
0
25.02
50-80
PLL reference frequency range
fref_pll
2
10.0
0
fref / 32
50-804
50-804
3
Unit
MHz
MHz
MHz
System frequency
• External clock mode
• On-chip PLL frequency
fsys
Loss of reference frequency 5, 7
fLOR
100
1000
kHz
Self clocked mode frequency 6
fSCM
1
5
MHz
tcst
—
0.1
ms
2.0
3.02
VSS
0.8
Crystal start-up time
7, 8
EXTAL input high voltage
• External reference
VIHEXT
EXTAL input low voltage
• External reference
VILEXT
V
V
PLL lock time4,9
tlpll
—
500
s
Duty cycle of reference 4
tdc
40
60
% fref
MCF52211 ColdFire Microcontroller, Rev. 2
33
Freescale Semiconductor
Electrical Characteristics
Table 28. Oscillator and PLL Electrical Specifications (continued)
(VDD and VDDPLL = 2.7 to 3.6 V, VSS = VSSPLL = 0 V)
Characteristic
Symbol
Min
Max
Unit
Frequency un-LOCK range
fUL
–1.5
1.5
% fref
Frequency LOCK range
fLCK
–0.75
0.75
% fref
—
—
10
.01
% fsys
7.84
8.16
MHz
4, 5, 10 ,11
CLKOUT period jitter
, measured at fSYS Max
• Peak-to-peak (clock edge to clock edge)
• Long term (averaged over 2 ms interval)
Cjitter
foco
On-chip oscillator frequency
1
In external clock mode, it is possible to run the chip directly from an external clock source without enabling the PLL.
This value has been updated.
3
All internal registers retain data at 0 Hz.
4 Depending on packaging; see the orderable part number summary.
5 Loss of Reference Frequency is the reference frequency detected internally, which transitions the PLL into self clocked mode.
6 Self clocked mode frequency is the frequency at which the PLL operates when the reference frequency falls below f
LOR with
default MFD/RFD settings.
7 This parameter is characterized before qualification rather than 100% tested.
8 Proper PC board layout procedures must be followed to achieve specifications.
9 This specification applies to the period required for the PLL to relock after changing the MFD frequency control bits in the
synthesizer control register (SYNCR).
10 Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f .
sys
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via VDDPLL and VSSPLL and variation in crystal oscillator frequency increase the Cjitter percentage
for a given interval.
11 Based on slow system clock of 40 MHz measured at f
sys max.
2
2.9
USB Operation
Table 29. USB Operation Specifications
Characteristic
Minimum core speed for USB operation
2.10
Symbol
Value
Unit
fsys_USB_min
16
MHz
General Purpose I/O Timing
GPIO can be configured for certain pins of the QSPI, DDR Control, timer, UART, Interrupt and USB interfaces. When in GPIO
mode, the timing specification for these pins is given in Table 30 and Figure 5.
The GPIO timing is met under the following load test conditions:
•
•
50 pF / 50 for high drive
25 pF / 25 for low drive
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
34
Electrical Characteristics
Table 30. GPIO Timing
NUM
Characteristic
Symbol
Min
Max
Unit
G1
CLKOUT High to GPIO Output Valid
tCHPOV
—
10
ns
G2
CLKOUT High to GPIO Output Invalid
tCHPOI
1.5
—
ns
G3
GPIO Input Valid to CLKOUT High
tPVCH
9
—
ns
G4
CLKOUT High to GPIO Input Invalid
tCHPI
1.5
—
ns
CLKOUT
G2
G1
GPIO Outputs
G3
G4
GPIO Inputs
Figure 5. GPIO Timing
2.11
Reset Timing
Table 31. Reset and Configuration Override Timing
(VDD = 3.0 to 3.6 V, VSS = 0 V, TA = TL to TH)1
NUM
1
2
Characteristic
Symbol
Min
Max
Unit
R1
RSTI input valid to CLKOUT High
tRVCH
9
—
ns
R2
CLKOUT High to RSTI Input invalid
tCHRI
1.5
—
ns
R3
RSTI input valid time 2
tRIVT
5
—
tCYC
R4
CLKOUT High to RSTO Valid
tCHROV
—
10
ns
All AC timing is shown with respect to 50% VDD levels unless otherwise noted.
During low power STOP, the synchronizers for the RSTI input are bypassed and RSTI is asserted asynchronously to the
system. Thus, RSTI must be held a minimum of 100 ns.
CLKOUT
1R1
RSTI
R2
R3
R4
R4
RSTO
Figure 6. RSTI and Configuration Override Timing
MCF52211 ColdFire Microcontroller, Rev. 2
35
Freescale Semiconductor
Electrical Characteristics
2.12
I2C Input/Output Timing Specifications
Table 32 lists specifications for the I2C input timing parameters shown in Figure 7.
Table 32. I2C Input Timing Specifications between I2C_SCL and I2C_SDA
Num
Characteristic
Min
Max
Units
11
Start condition hold time
2 tCYC
—
ns
I2
Clock low period
8 tCYC
—
ns
I3
SCL/SDA rise time (VIL = 0.5 V to VIH = 2.4 V)
—
1
ms
I4
Data hold time
0
—
ns
I5
SCL/SDA fall time (VIH = 2.4 V to VIL = 0.5 V)
—
1
ms
I6
Clock high time
4 tCYC
—
ns
I7
Data setup time
0
—
ns
I8
Start condition setup time (for repeated start condition only)
2 tCYC
—
ns
I9
Stop condition setup time
2 tCYC
—
ns
Table 33 lists specifications for the I2C output timing parameters shown in Figure 7.
Table 33. I2C Output Timing Specifications between I2C_SCL and I2C_SDA
Num
Characteristic
Min
Max
Units
111
Start condition hold time
6 tCYC
—
ns
I21
Clock low period
10 tCYC
—
ns
I32
I2C_SCL/I2C_SDA rise time
(VIL = 0.5 V to VIH = 2.4 V)
—
—
s
I41
Data hold time
7 tCYC
—
ns
—
3
ns
I5
3
I2C_SCL/I2C_SDA fall time
(VIH = 2.4 V to VIL = 0.5 V)
I61
Clock high time
10 tCYC
—
ns
1
Data setup time
2 tCYC
—
ns
I81
Start condition setup time (for repeated start
condition only)
20 tCYC
—
ns
I91
Stop condition setup time
10 tCYC
—
ns
I7
1
Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the
maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Table 33. The I2C
interface is designed to scale the actual data transition time to move it to the middle of the SCL low
period. The actual position is affected by the prescale and division values programmed into the IFDR;
however, the numbers given in Table 33 are minimum values.
2 Because SCL and SDA are open-collector-type outputs, which the processor can only actively drive
low, the time SCL or SDA take to reach a high level depends on external signal capacitance and pull-up
resistor values.
3 Specified at a nominal 50-pF load.
MCF52211 ColdFire Microcontroller, Rev. 2
Freescale Semiconductor
36
Electrical Characteristics
Figure 7 shows timing for the values in Table 32 and Table 33.
I2
SCL
I6
I1
I4
I5
I3
I8
I7
I9
SDA
Figure 7. I2C Input/Output Timings
2.13
Analog-to-Digital Converter (ADC) Parameters
Table 34 lists specifications for the analog-to-digital converter.
Table 34. ADC Parameters1
Name
Characteristic
Min
Typical
Max
Unit
VREFL
Low reference voltage
VSS
—
VREFH
V
VREFH
High reference voltage
VREFL
—
VDDA
V
VDDA
ADC analog supply voltage
3.0
3.3
3.6
V
VADIN
Input voltages
VREFL
—
VREFH
V
RES
Resolution
12
—
12
Bits
—
2.5
3
LSB3
range)2
INL
Integral non-linearity (full input signal
INL
Integral non-linearity (10% to 90% input signal range)4
—
2.5
3
LSB
DNL
Differential non-linearity
—
–1 < DNL < 1
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