MCIMX7U3CVP06SC

i.MX 7ULP ULTRA LOW POWER PLATFORM FOR PORTABLE APPLICATIONS EXTERNAL USE ULP Family: Market Opportunity in Power Efficiency i.MX 8 series 6QuadPlus M4 Advanced Graphics and Performance 6Quad i.MX 8M series 6DualPlus M4 Advanced Audio and Video 6Dual i.MX 8X series 6DualLite M4 BOM and Energy Efficiency 6Solo 6SoloX 6SoloLite 6SLL 6UltraLite 6ULL ARM® v8-A (32-Bit / 64-Bit) M4 i.MX 7 M4 ARM® v7-A (32-Bit) Flexible Efficient Connectivity i.MX 7ULP M4 Ultra Low Power with Graphics ARM® v7-A PUBLIC 1 SCALABILITY OF EMBEDDED PROCESSING THE NEW NORMAL i.MX 7ULP Ultra-low Power Dynamic & Static i.MX 6UL/ULL/ULZ i.MX RT ARM v8/v8m + GPU/DSP ARM v7/v7m + 2D/3D ARM v7m + Audio PUBLIC 2 HETEROGENEOUS PROCESSING: PROVIDING SOLUTIONS TO MARKET CHALLENGES OFFLOAD TASKS OPTIMIZE POWER INCREASE SECURITY RICH GRAPHICS Right core for the task Power gate maximum amount of silicon Allocate H/W access to silicon 3D/2D based rich UIs i.MX 7ULP Key Highlights Bringing together Apps Processor performance and MCU Low Power i.MX 7ULP Ultra Low Power • FDSOI • • Effective control of the transistor channel through biasing Performance on Demand with fast wake up times • 4 • GC7000 nanoULTRA Heterogeneous Domain Computing • EXTERNAL USE • GC320 2D Composition • Offloads tasks from 3D GPU • Stretch/Shrinking, rotation, GUI processing Multiple software execution: • Powerful processing using CortexA7 and Neon co-processor • Real-time performance through Cortex-M4 • OpenGL ES 2.0/1.1 • OpenVG 1.1 High Performance/mW extending battery life for portable devices. • Efficient 3D & 2D Graphics • System integrity and security • • • Resource Domain Controller Fast Low Power Boot Safe Recovery of Application domain Target Applications • Wearables • Home Control • Portable Healthcare • Portable Printing • Gaming Accessories • General Embedded Control • IoT Edge 5 EXTERNAL USE Cortex-A7 enables power efficiency 6 EXTERNAL USE Source: Arm.com i.MX 7ULP Applications Processor Specifications: CPU: Cortex-A7 @ 720MHz Cortex-M4 @ 200Mhz Process: 28nm FD-SOI Package: ▪ 14x14 393BGA, 0.5mm pitch: Consumer & Industrial ▪ 10x10 361BGA, 0.5mm pitch: Consumer Only • • Temp Range (junction): Industrial: -40C to +105C Consumer: 0C to +95C Key Features: ▪ Graphics ▪ GC7000 nanoULTRA GPU: OpenGL 2.0 / OpenVG ▪ GC320 Composition Engine ▪ Ultra Low Power ▪ Independent Real-time domain ▪ Ultra Low Run Current ▪ Memory options ▪ QSPI (on the fly decryption) ▪ 32-bit LPDDR2/3 @380MHz ▪ eMMC 5.0 /SD3.0 ▪ Connectivity ▪ USB HS OTG with PHY ▪ USB HS HOST HSIC ▪ I2C X 8, SPI X 4, UART X 8, SDIO X 2, I2S X 2 ▪ Security ▪ High Assurance Boot ▪ Crypto Acceleration: AES-128/256, SHA-1, SHA-224, SHA-256 ▪ RNG and Tamper Detection 7 EXTERNAL USE 28nm FD SOI • • • 8 Power – Performance Benefits − Improved electrostatics enables shorter gate lengths − Reduced device parasitics − Device back bias allows for lower Vdd while maintaining performance − Device tuning with back biasing to compensate process variation Analog Integration and Performance Benefits − Higher gain, better matching and lower 1/f noise − Gate first integration removes density rules for precision analog Better SER and Latchup Immunity − 10-100x better SER performance versus 28nm bulk alternatives − Thin buried oxide layer makes device immune to latchup EXTERNAL USE Body Biasing: Faster when required and more energy efficient when performance isn’t as critical NXP Complete Solutions i.MX7 ULP Family Processors • 720 MHz Cortex™-A7 • PF1550 PMIC + • NEON™ coprocessor • ARM® Cortex™-M4, • Targeting a broad range of Low Power Applications that rely on a multitude of Low power states to extend battery life to its fullest. • Integration of NXP’s PMIC chip set with i.MX processor for optimization of power efficiency and software/hardware integration One-stop customer service and support during development phase to enable the design process Sensors + • = MEMS gyroscopes for reliable sensing and measuring • Magnetometers: measuring the magnitude and direction of magnetic fields • Pressure Sensing Devices, composed of single silicon, piezoresistive devices A Single Solution for Streamlined Performance 9 EXTERNAL USE ULP EVK Development Platform Development platform: • SOM based evaluation kit • Linux® and Android™ Board Support Packages are available through NXP i.MX WiFi & Bluetooth Strategy 3 companies partnering to deliver world-class solutions for connected products + Leading Microprocessor Solutions with i.MX products + Industry leader for WiFi & Bluetooth IC #1 market share for WiFi & Bluetooth modules • Out-of-box processor and wireless connectivity for Linux and Android based systems • Wi-Fi (802.11bgn, abgn, abgn/ac) & Bluetooth Smart Ready Options 10 EXTERNAL USE • Enables fast use case evaluation through quick builds of of customized base boards. • Allows customers to leverage the critical features of SOM design including DDR and PMIC design/layout. • Design Files provided − Schematics − Layout − BOM 11 EXTERNAL USE Part Numbers: i.MX 7ULP Family All parts are orderable now and shipment is expected to start in Jun 2019 (Consumer) /Q3 2019 (Industrial) Real-time companion CPU: 2D & 3D GPU I2S SPI UART I2C Tightly-coupled memory On-chip SRAM Real-time companion CPU MAPBGA ARM Cortex-A7 720 393 MHz 256 KB ARM Cortex-M4 200 MHz 256 KB Y 4 4 8 USB 2.0 OTG 8 +PHY, USB 2.0 Host +HSIC 0-95°C Consumer VFBGA ARM Cortex-A7 720 361 MHz 256 KB ARM Cortex-M4 200 MHz 256 KB Y 4 4 8 USB 2.0 OTG 8 +PHY, USB 2.0 Host +HSIC 0-95°C MCIMX7U3DVK07SC Consumer VFBGA ARM Cortex-A7 720 361 MHz 256 KB ARM Cortex-M4 200 MHz 256 KB - 4 4 8 USB 2.0 OTG 8 +PHY, USB 2.0 Host +HSIC 0-95°C MCIMX7U5CVP06SC Industrial MAPBGA ARM Cortex-A7 650 393 MHz 256 KB ARM Cortex-M4 200 MHz 256 KB Y 4 4 8 USB 2.0 OTG 8 +PHY, USB 2.0 Host -40-105°C +HSIC MCIMX7U3CVP06SC Industrial MAPBGA ARM Cortex-A7 650 393 MHz 256 KB ARM Cortex-M4 200 MHz 256 KB - 4 4 8 USB 2.0 OTG 8 +PHY, USB 2.0 Host -40-105°C +HSIC Part number Qual tier MCIMX7U5DVP07SC Consumer MCIMX7U5DVK07SC 12 EXTERNAL USE Package Main CPU USB Temperature range