MCZ145012EG

Document Number: MC145012 Rev 9.0, 11/2006 Freescale Semiconductor Technical Data Photoelectric Smoke Detector IC with I/O and Temporal Pattern Horn Driver The CMOS MC145012 is an advanced smoke detector component containing sophisticated very-low-power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and an external piezoelectric transducer. The variable-gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local-smoke condition. High gain is used during push-button test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain also. The I/O pin, in combination with VSS, can be used to interconnect up to 40 units for common signaling. An on-chip current sink provides noise immunity when the I/ O is an input. A local-smoke condition activates the short-circuit-protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto-dialers. While in standby, the low-supply detection circuitry conducts periodic checks using a pulsed load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145012 can be a 9.0 V battery. A visible LED flash accompanying a pulsating audible alarm indicates a localsmoke condition. A pulsating audible alarm with no LED flash indicates a remotesmoke condition. A beep or chirp occurring virtually simultaneously with an LED flash indicates a low-supply condition. A beep or chirp occurring halfway between LED flashes indicates degraded chamber sensitivity. A low-supply condition does not affect the smoke detection capability if VDD ≥ 6.0 V. Therefore, the low-supply condition and degraded chamber sensitivity can be further distinguished by performing a push-button (chamber) test. Features • • • • • • • • • • Circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 Specifications Operating Voltage Range: 6.0 V to 12 V, Average Supply Current: 8 µA Operating Temperature Range: -10 to 60°C I/O Pin Allows Units to be Interconnected for Common Signalling Power-On Reset Places IC in Standby Mode (Non-Alarm State) Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors Supports NFPA 72, ANSI S3.41, and ISO 8201 Audible Emergency Evacuation Signals Ideal for battery-powered applications Pb-Free Packaging Designated by Suffix Codes ED and EG ORDERING INFORMATION Device Temp. Range Case No. MC145012P Package 16 Lead Plastic Dip 648-08 MC145012ED 16 PDIP (Pb-Free) -55 to +125°C MC145012DW 16 Lead SOICW 751G-04 MCZ145012EG/R2 © Freescale Semiconductor, Inc., 2006. All rights reserved. 16 SOICW (Pb-Free) MC145012 PHOTOELECTRIC SMOKE DETECTOR IC WITH I/O AND TEMPORAL PATTERN HORN DRIVER P SUFFIX ED SUFFIX (PB-FREE) PLASTIC DIP CASE 648-08 DW SUFFIX EG SUFFIX (PB-FREE) SOIC PACKAGE CASE 751G-04 C1 1 16 C2 2 15 DETECT 3 14 TEST LOW-SUPPLY TRIP VSS STROBE 4 13 R1 VDD 5 12 OSC IRED 6 11 LED I/O 7 10 FEEDBACK BRASS 8 9 SILVER Figure 1. Pin Connections C1 C2 1 2 3 - AMP Zero 12 OSC OSC 13 R1 16 TEST STROBE 4 LOW-SUPPLY 15 TRIP Gain VDD - 3.5 V REF Timing Logic Smoke COMP + Gate On/off GATE ON/OFF 7 Alarm Logic Low Supply DETECT Temporal Pattern Horn Modulator And Driver VDD - 5 V REF 8 9 I/O BRASS SILVER 10 6 FEEDBACK IRED 11 LED COMP + Pin 5 = VDD Pin 14 = VSS Figure 2. Block Diagram MC145012 2 Sensors Freescale Semiconductor Table 1. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. (Voltages referenced to VSS) Rating Symbol Value Unit DC Supply Voltage VDD -0.5 to +12 V DC Input Voltage C1, C2, Detect Osc, Low-Supply Trip I/O Feedback Test VIN DC Input Current, per Pin IIN ±10 mA DC Output Current, per Pin IOUT ±25 mA DC Supply Current, VDD and VSS Pins IDD +25 / -150 mA Power Dissipation in Still Air 5 Seconds Continuous PD Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds Peak Package Reflow Temperature During Reflow (3) , (4) V -0.25 to VDD +0.25 -0.25 to VDD +0.25 -0.25 to VDD +10 -15 to +25 -1.0 to VDD +0.25 mW 1200 (1) 350 (2) TSTG -55 to +125 °C TL 260 °C TPPRT Note 4 °C Note: 1. Derating: -12 mW/°C from 25° to 60°C 2. Derating: -3.5 mW/×C from 25° to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS £ (Vin or Vout) £ VDD except for the I/O, which can exceed VDD, and the Test input, which can go below VSS. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs and/or an unused I/O must be left open. 3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standerd J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), > Go to www.freescale.com > Search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (ie. MC33xxxD enter 33xxx)] > Locate your Part Number and in the Details column, select “View” > Select “Environmental and Compliance Information” MC145012 Sensors Freescale Semiconductor 3 Table 2. Electrical Characteristics (Voltages Referenced to VSS, TA = - 10 to 60°C Unless Otherwise Indicated). Characteristic Symbol Test Condition VDD V Min Max Unit — 6.0 12 V — 6.5 7.8 V Power Supply Voltage Range VDD Supply Threshold Voltage, Low-Supply Alarm VTH Low-Supply Trip: Vin = VDD/3 Average Operating Supply Current (per Package) (Does Not Include Current through D3-IR Emitter) IDD Standby Configured per Figure 8 12.0 — 8.0 µA Peak Supply Current (per Package) (Does Not Include IRED Current into Base of Q1) IDD During Strobe On, IRED Off Configured per Figure 8 12.0 — 2.0 mA During Strobe On, IRED On Configured per Figure 8 12.0 — 3.0 Low-Level Input Voltage I/O Feedback Test VIL 9.0 9.0 9.0 — — — 1.5 2.7 7.0 V High-Level Input Voltage I/O Feedback Test VIH 9.0 9.0 9.0 3.2 6.3 8.5 — — — V OSC, Detect Low-Supply Trip Feedback IIN Vin = VSS or VDD Vin = VSS or VDD Vin = VSS or VDD 12.0 12.0 12.0 — — — ± 100 ± 100 ± 100 nA Low-Level Input Current Test IIL Vin = VSS 12.0 - 100 - 1.0 µA Pull-Down Current Test I/O IIH Vin = VDD No Local Smoke, Vin = VDD No Local Smoke, Vin = 17 V 9.0 9.0 12.0 0.5 25 — 10 100 140 µA Input Current Low-Level Output Voltage LED Silver, Brass VOL Iout = 10 mA Iout = 16 mA 6.5 6.5 — — 0.6 1.0 V High-Level Output Voltage Silver, Brass VOH Iout = - 16 mA 6.5 5.5 — V Strobe VOUT Inactive, Iout = 1 µA Active, Iout = 100 µA to 500 µA (Load Regulation) — 9.0 VDD - 0.1 VDD - 4.40 — VDD - 5.30 V Inactive, Iout = 1 µA Active, Iout = 6 mA (Load Regulation) — 9.0 — 2.25 (5) 0.1 3.75 (5) Local Smoke, Vout = 4.5 V 6.5 -4.0 — Local Smoke, Vout = VSS (Short Circuit Current) 12.0 — -16 12.0 — ±1.0 µA Output Voltage (For Line Regulation, See Pin Descriptions) IRED High-Level Output Current Off-State Output Leakage Current Common Mode Voltage Range Smoke Comparator Reference Voltage I/O IOH mA LED IOZ Vout = VSS or VDD C1, C2, Detect VIC Local Smoke, Push-button Test, or Chamber Sensitivity Test — VDD - 4.0 VDD - 2.0 V VREF Local Smoke, Push-button Test, or Chamber Sensitivity Test — VDD - 3.08 VDD - 3.92 V Internal Notes 5. TA = 25°C only. MC145012 4 Sensors Freescale Semiconductor Table 3. AC Electrical Characteristics (Reference Timing Diagram Figure 6 and Figure 7) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 8: R1 = 100.0 KΩ, C3 = 1500.0 pF, R2 = 7.5 MΩ). No. Parameter Symbol Test Condition Free-Running Sawtooth Measured at Pin 12 1 Oscillator Period 1/FOSC 2 LED Pulse Period TLED No Local Smoke, and No Remote Smoke Clocks Min (6) Typ (7) Max(6) Unit 1.0 7.0 7.9 8.6 ms 4096 28.8 32.4 35.2 s 3 Remote Smoke, but No Local Smoke — 4 Local Smoke 64 0.45 — — 5 Push-button Test 64 0.45 — — 1.0 7.0 — 8.6 ms TW(LED), TW(STB) Extinguished 6 LED Pulse Width and Strobe Pulse Width 7 IRED Pulse Period TIRED Smoke Test 1024 7.2 8.1 8.8 s 8 IRED Pulse Period TIRED Chamber Sensitivity Test, without Local Smoke 4096 28.8 32.4 35.2 s Push-button Test 128 0.9 1.0 1.1 TW(IRED) TF* 94 — 116 9 µs 10 IRED Pulse Width 11 IRED Rise Time TR — — — 30 12 IRED Fall Time TF — — — 200 µs 13 Silver and Brass Temporal Modulation Pulse Width TON 64 0.45 0.5 0.55 s 0.45 0.5 0.55 192 1.35 1.52 1.65 4096 28.8 32.4 35.2 s 1 7.0 7.9 8.6 ms — — 2.0 (8) — s s 14 15 TOFF TOFFD 16 Silver and Brass Chirp Pulse Period TCH Low Supply or Degraded Chamber Sensitivity 17 Silver and Brass Chirp Pulse Width TWCH 18 Rising Edge on I/O to Smoke Alarm Response Time TRR Remote Smoke, No Local Smoke 19 Strobe Out Pulse Period TSTB Smoke Test 1024 7.2 8.1 8.8 20 Chamber Sensitivity Test, without Local Smoke 4096 28.8 32.4 35.2 21 Low Supply Test, without Local Smoke 4096 28.8 32.4 35.2 22 Push-button Test — — 1.0 — Notes 6. Oscillator period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where TR = (0.6931) R2 C3 and TF = (0.6931) R1 * C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. The timing shown should accommodate the NFPA 72, ANSI S3.41, and ISO 8201 audible emergency evacuation signals. 7. Typicals are not guaranteed. 8. Time is typical - depends on what point in cycle signal is applied. MC145012 Sensors Freescale Semiconductor 5 AC Parameter (Normalized To 9.0 V Value) 1.04 1.02 Pulse Width Of IRED 1.00 Period Or Pulse Width Of Other Parameters 0.98 TA = 25°C 0.96 6.0 7.0 8.0 9.0 10.0 11.0 12.0 VDD, Power Supply Voltage (V) AC Parameter (Normalized To 25°C Value) Figure 3. AC Characteristics versus Supply 1.02 1.01 Pulse Width Of IRED 1.00 Period Or Pulse Width Of Other Parameters 0.99 VDD = 9.0 V 0.98 - 10 0 10 20 30 40 50 60 NOTE: Includes external component variations. See Figure 5. TA, Ambient Temperature (°C) Figure 4. AC Characteristics versus Temperature Component Value (Normalized To 25°C Value) 1.03 1.02 7.5 MΩ Carbon Composition 1.01 100 kΩ Metal Film 1.00 1500 Pf DIPPED MICA 0.99 0.98 - 10 0 10 20 30 40 50 60 TA, Ambient Temperature (°C) NOTE: These components were used to generate Figure 4. Figure 5. RC Component Variation Over Temperature MC145012 6 Sensors Freescale Semiconductor Figure 6. Typical Standby Timing MC145012 Sensors Freescale Semiconductor 7 19 7 Power-on Reset 2 21 7 No Low Supply Chamber Sensitivity Ok 20 8 NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Silver, Brass Enable (Internal) LED (Pin 11) Strobe (Pin 4) IRED (Pin 6) Photo Sample (Internal) Chamber Test (Internal) Low Supply Test (Internal) OSC (Pin 12) 1 6 Chirps Indicate Low Supply 16 21 17 Chirps Indicate Degraded Chamber Sensitivity 16 Figure 7. Typical Local Smoke Timing MC145012 8 Sensors Freescale Semiconductor No Smoke 6 6 14 13 90% 10% 12 Local Smoke (Remote Smoke = Don't Care) 18 7 11 4 15 (As Output) (Not Performed) (Not Performed) NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Silver, Brass Enable (Internal) I/O (Pin 7) LED (Pin 11) Strobe (Pin 4) IRED (Pin 6) Chamber Test (Internal) Low Supply Test (Internal) IRED 10 No Smoke 18 Remote Smoke (No Local Smoke) (As Input) 3 (No Pulses) 22 9 5 Pushbutton Test (As Output) C1 0.047 µF 1 TO 22 µF C4(12) + 9V B1 D1 C2(10) 4700 pF 1 TEST SW1 Pushbutton Test 16 R6 100 k R14 560 Ω R8 8.2 k 2 R11 250 k R9(11) 5k 3 R10 4.7 k D2 IR Detector LOW-SUPPLY 15 TRIP C2 DETECT VSS R7 47 k 14 MC145012 4 STROBE R1 13 R1 100 k R12 1k C5 100 µF C1 Reverse Polarity Protection Circuit D3 IR Emitter + 6 Q1 IR Current To Other MC145012(s), Escape Light(S), Auxiliary Alarm(S), Remote Alarm(S), And/or Auto-dialer 5 R13(10) 4.7 TO 22 7 8 VDD OSC IRED LED I/O BRASS FEEDBACK SILVER 12 R2 7.5 M C3 1500 pF D4 Visible LED R3 11 470 R4 (9) 10 9 0.01 µF C6 (9) 100 k Horn X1 2.2 M R5(9) 9. Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used. 10.C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown. 11.R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. 12.C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used. Figure 8. Typical Battery-Powered Application Table 4. Pin Description Pin No. Pin Name Description 1 C1 A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier during pushbutton test and chamber sensitivity test (high gain). The capacitor value is chosen such that the alarm is tripped from background reflections in the chamber during push-button test. Av ≈ 1 + (C1/10) where C1 is in pF. CAUTION: The value of the closed-loop gain should not exceed 10,000. 2 C2 A capacitor connected to this pin as shown in Figure 8 determines the gain of the on-chip photo amplifier except during push-button or chamber sensitivity tests. Av ≈ 1 + (C2/10) where C2 is in pF. This gain increases about 10% during the IRED pulse, after two consecutive local smoke detections. Resistor R14 must be installed in series with C2. R14 ≈ [1/(12√C2)] - 680 where R14 is in ohms and C2 is in farads. 3 DETECT This input to the high-gain pulse amplifier is tied to the cathode of an external photodiode. The photodiode should have low capacitance and low dark leakage current. The diode must be shunted by a load resistor and is operated at zero bias. The Detect input must be AC/DC decoupled from all other signals, VDD, and VSS. Lead length and/or foil traces to this pin must be minimized, also. See Figure 9. MC145012 Sensors Freescale Semiconductor 9 Table 4. Pin Description (Continued) Pin No. Pin Name Description 4 STROBE This output provides a strobed, regulated voltage referenced to VDD. The temperature coefficient of this voltage is ± 0.2%/°C maximum from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6.0 V to 12 V. Strobe is tied to external resistor string R8, R9, and R10. 5 VDD This pin is connected to the positive supply potential and may range from + 6.0 V to + 12 V with respect to VSS CAUTION: In battery-powered applications, reverse-polarity protection must be provided externally. 6 IRED This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from - 10° to 60°C. The supply-voltage coefficient (line regulation) is ± 0.2%/V maximum from 6.0 V to 12 V. The IRED pulse width (active-high) is determined by external components R1 and C3. With a 100 kΩ/1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the visible LED and horn outputs are active. IRED is active near the end of strobe pulses for smoke tests, chamber sensitivity test, and push-button test. 7 I/O This pin can be used to connect up to 40 units together in a wired-OR configuration for common signaling. VSS is used as the return. An on-chip current sink minimizes noise pick up during non-smoke conditions and eliminates the need for an external pull-down resistor to complete the wired-OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto-dialers. As an input, this pin feeds a positive-edge-triggered flip-flop whose output is sampled nominally every 1 second during standby (using the recommended component values). A local-smoke condition or the push-button-test mode forces this current-limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the on-chip power-on reset to eliminate nuisance signaling during battery changes or system power-up. If unused, I/O must be left unconnected. 8 BRASS This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 9 SILVER This half of the push-pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn-starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. 10 FEEDBACK This input is connected to both the feedback electrode of a self-resonating piezoelectric transducer and the horn-starting resistor and capacitor through current-limiting resistor R4. If unused, this pin must be tied to VSS or VDD. 11 LED This active-low open-drain output directly drives an external visible LED at the pulse rates indicated below. The pulse width is equal to the OSC period. The load for the low-supply test is applied by this output. This low-supply test is non-coincident with the smoke tests, chamber sensitivity test, push-button test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 8: Standby (includes low-supply and chamber sensitivity tests) — Pulses every 32.4 seconds (typical) Standby (includes low-supply and chamber sensitivity tests) — Pulses every 32.4 seconds (typical) Local Smoke — Pulses every 0.51 seconds (typical) Remote Smoke — No pulses Push-button Test — Pulses every 0.51 seconds (typical) 12 OSC This pin is used in conjunction with external resistor R2 (7.5 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 7.9 ms (typical). 13 R1 This pin is used in conjunction with resistor R1 (100 kΩ) to Pin 12 and C3 (1500 pF, see Pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. 14 VSS 15 LOWSUPPLY TRIP This pin is connected to an external voltage which determines the low-supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low-supply alarm threshold voltage (in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units. 16 TEST This input has an on-chip pull-down device and is used to manually invoke a test mode. The Push-button Test mode is initiated by a high level at Pin 16 (usually depression of a S.P.S.T. normally-open pushbutton switch to VDD). After one oscillator cycle, IRED pulses approximately every 1.0 second, regardless of the presence of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background reflections in the smoke chamber may be interpreted as smoke, generating a simulated-smoke condition. After the second IRED pulse, a successful test activates the horn-driver and I/O circuits. The active I/O allows remote signaling for system testing. When the Push-button Test switch is released, the Test input returns to VSS due to the on-chip pull-down device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated-smoke condition. After two additional IRED pulses, less than three seconds, the IC exits the alarm mode and returns to standby timing. This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. MC145012 10 Sensors Freescale Semiconductor CALIBRATION To facilitate checking the sensitivity and calibrating smoke detectors, the MC145012 can be placed in a calibration mode. In this mode, certain device pins are controlled/ reconfigured as shown in Table 5. To place the part in the calibration mode, Pin 16 (Test) must be pulled below the VSS pin with 100 µA continuously drawn out of the pin for at least one cycle on the OSC pin. To exit this mode, the Test pin is floated for at least one OSC cycle. In the calibration mode, the IRED pulse rate is increased to one for every OSC cycle. Also, Strobe is always active low. Table 5. Configuration of Pins in the Calibration Mode Description Pin Comment I/O 7 Disabled as an output. Forcing this pin high places the photo amp output on Pin 1 or 2, as determined by LowSupply Trip. The amp's output appears as pulses and is referenced to VDD etc. Low-Supply Trip 15 If the I/O pin is high, Pin 15 controls which gain capacitor is used. Low: normal gain, amp output on Pin 1. High: supervisory gain, amp output on Pin 2. Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; Pin 15 must be low. OSC 12 Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the normal mode of operation. Silver 9 This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that smoke has been detected. A static low level indicates no smoke. Brass 8 This pin becomes the smoke integrator output. That is, 2 consecutive smoke detections are required for “on” (static high level) and 2 consecutive no-detections for “off” (static low level). Do Not Run Any Additional Traces In This Region Pin 16 Pin 1 C1 C2 R14 R11 MOUNTED IN CHAMBER Pin 9 R8 R100 D2 PIN 8 NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image. Optional potentiometer R9 is not included. Drawing is not to scale. Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick up. Pin 3 must be decoupled from all other traces. Figure 9. Recommended PCB Layout MC145012 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A16 9 1 8 B F C L S SEATING PLANE -TK H G D M J 16 PL 0.25 (0.010) M T A STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. M CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.70 1.02 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0 10 0 10 0.020 0.040 0.51 1.01 DIM A B C D F G H J K L M S COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN GATE SOURCE GATE SOURCE GATE SOURCE GATE SOURCE CASE 648-08 ISSUE R 16-LEAD PLASTIC DIP 0.25 8X PIN'S NUMBER M B A 10.55 10.05 2.65 2.35 0.25 0.10 16X 16 1 0.49 0.35 0.25 6 M T A B PIN 1 INDEX 14X 10.45 4 10.15 A A 8 1.27 9 7.6 7.4 SEATING PLANE T B 16X 0.1 T 5 0.75 0.25 X45˚ 0.32 0.23 1.0 0.4 SECTION A-A NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUMS A AND B TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSTION OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 5. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 6. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62mm. 7˚ 0˚ CASE 751G-04 ISSUE D 16-LEAD SOIC MC145012 Sensors Freescale Semiconductor 12 REVISION HISTORY REVISION 9.0 DATE 11/2006 DESCRIPTION OF CHANGES • • • Implemented Revision History page Updated to the current Freescale format and style Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 3. Added note with instructions from www.freescale.com. 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