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MCZ33730EKR2

MCZ33730EKR2

  • 厂商:

    NXP(恩智浦)

  • 封装:

    SSOP32_300MIL_EP

  • 描述:

    Linear And Switching Voltage Regulator IC 4 Output Step-Down (Buck) Synchronous (1), Linear (LDO) (3...

  • 数据手册
  • 价格&库存
MCZ33730EKR2 数据手册
Freescale Semiconductor Advance Information Document Number: MC33730 Rev. 9.0, 8/2012 Switch Mode Power Supply with Multiple Linear Regulators 33730 The 33730 is a multiple output power supply integrated circuit for automotive applications. The integrated circuit (IC) incorporates a switching regulator, which operates over a wide input voltage range from 4.5 to 26.5 V. The step-down switching regulator uses a fixed frequency pulsewidth modulation (PWM) voltage mode control. It has a 3.5 A current limit (typical) and the slew-rate is adjustable via a control pin to reduce switching noise. The switching regulator has an adjustable frequency oscillator, which allows the user to optimize its operation over a wide range of input voltages and component values. The linear regulators can be configured either as two Normal mode regulators (VDD3, VDDL) and one standby regulator (VKAM), or as one Normal mode linear regulator (VDDL) and two standby regulators (VKAM and VDD3 Standby). Two protected outputs [VREF (1, 2)] are used to provide power to external sensors. SWITCHING POWER SUPPLY EK SUFFIX (PB-FREE) 98ARL10543D 32-LEAD SOICW-EP Features • Provides all regulated voltages for Freescale 32-bit microcontroller family • Adjustable frequency switching buck regulator with slew-rate control • Power sequencing provided • Programmable voltages VDDL, VDD3 - 3% accuracy • Programmable standby regulator VKAM - 15% accuracy, operating down to 4.5 V at the KA_VBAT pin • VDD3 can be programmed as an optional second standby regulator with 15% accuracy • Provides two 5.0 V protected supplies for sensors • Provides reverse battery protection FET gate drive • Provides necessary MCU monitoring and fail-safe support ORDERING INFORMATION Device (Add R2 Suffix for Tape and Reel) Temperature Range (TA) Package - 40 °C to 125 °C 32-SOICW-EP MCZ33730EK MC33730EK * * Recommended device for all new designs 33730 + + VBAT PFD KA_VBAT VIGN IGN_ON 5.0 V + BOOT SW + VDDH INV VCOMP VDD3_B VDD3 5.0 V 3.3 V VREF1,2 MCU (32 Bit) P1 P2 P3 CP VDDL_B VDDL VKAM 1.5 V 5.0V KA_1.0 V GND HRT RSTs REGON Figure 1. 33730 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2009 - 2012. All rights reserved. DEVICE VARIATIONS DEVICE VARIATIONS Table 1. Device Variations Part no. Temperature Range MCZ33730EK MC33730EK Description Reset detect circuitry - 40 °C to 125 °C Improved VDDL and VDD3 reset detect circuitry 33730 2 Analog Integrated Circuit Device Data Freescale Semiconductor INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM VBAT VBAT SW UVLO /OVLO SW Feed Forward Ramp Generator CP Buck KA_VBAT VKAM Protection FET Drive HS Drive Level Shifter BOOT Control Logic VKAM 15 mA, ILIM, TLIM SR + – CP PFD FREQ Oscillator 10.4 K Charge Pump + – REG ON – + INV 1.98 K VBG VCOMP VIGN Enable IGN_ON VDDH VDD3 T-lim VREF1 VREF2 Standby Control 5.0 V ILIM=15 0mA 26.5 V,-1V,TLIM Bandgap Preference 5.0 V P2 P3 Lim, TLim VDD3_B VDD3_SBY I Lim, TLim VDD3 VBG VDDL I ILIM=150 mA Lim 26.5 V,-1V,TLIM P1 I Ref. Voltage Programming VDDL_B VDDL VKAM, VDDL, VDD3, VDD3_SBY Reference Voltage Block RSTKAM VKAM Reset Detect RSTH VDDH Reset Detect RST3 VDD3 Reset Detect RSTL VDDL Reset Detect HR Timer HRT GND Figure 2. 33730 Simplified Internal Block Diagram 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS PIN CONNECTIONS HRT RSTKAM RSTH RSTL RST3 VREF2 VDDL VDDH VDDL_B VREF1 REGON IGN_ON VCOMP INV FREQ P1 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 P3 VIGN GND VDD3_B VDD3 VKAM CP KA_VBAT VBAT VBAT SW SW SR BOOT PFD P2 Note: The exposed pad is electrically and thermally connected to the IC ground. Figure 3. 33730 Pin Connections Table 2. 33730 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Name Pin Function Formal Name Definition 1 HRT Analog Output 2 RSTKAM Open Drain VKAM Reset This pin is an open drain reset output, monitoring the VKAM supply to the microprocessor. 3 RSTH Open Drain VDDH Reset This pin is an open drain reset output, monitoring the VDDH regulator. 4 RSTL Open Drain VDDL Reset This pin is an open drain reset output, monitoring the VDDL regulator. 5 RST3 Open Drain VDD3 Reset This pin is an open drain reset output, monitoring the VDD3 regulator. 6 VREF2 Power Output VREF Output 2 This pin is the output of the protected supply VREF2. The pin is supplied from the VDDH through the protection FET. 7 VDDL Analog Input VDDL Regulator This pin is the VDDL regulator output feedback pin. 8 VDDH Analog/ Power Input VDDH Regulator This pin is the 5.0 V output feedback pin of the buck regulator. The pin is also a power input for the protected outputs VREF1,2. 9 VDDL_B Analog Output VDDL Regulator Base Drive 10 VREF1 Power Output VREF Output 1 11 REGON Logic Input Regulator Hold On 12 IGN_ON Open Drain VIGN Status 13 VCOMP Analog Output Compensation This pin provides switching pre-regulator compensation, it is the output of the error amplifier. 14 INV Analog Input Inverting Input Inverting input of the switching regulator error amplifier. 15 FREQ Hardware Reset Timer This pin is the hardware reset timer programmed with an external resistor. VDDL linear regulator base drive. This pin is the output of the protected supply VREF1. The pin is supplied from the VDDH through the protection FET. Regulator Hold On input pin (5.0 V logic level input). This open drain output signals the status of the VIGN pin. Analog Input Frequency Adjustment Frequency adjustment of the switching regulator. The value of the resistor to ground at this pin determines the oscillator frequency. 33730 4 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS Table 2. 33730 Pin Definitions(continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 12. Pin Number Pin Function Formal Name P1 (1) Logic Input Programming Pin 1 Programming pin 1 for the VDD3, VDDL, and VKAM reference voltages. 17 P2 (1) Logic Input Programming Pin 2 Programming pin 2 for the VDD3, VDDL, VKAM reference voltages. 18 PFD Analog Output Protection FET Drive 19 BOOT Analog Input Bootstrap This pin is connected to the bootstrap capacitor. 20 SR Analog Input Slew-rate Slew-rate Control of the switching regulator. 21,22 SW Power Output Switch Node 23,24 VBAT Power Input Battery Voltage Supply 25 KA_VBAT Power Input Keep Alive Supply 26 CP Analog Output Charge Pump 27 VKAM Power Output Keep Alive Memory 28 VDD3 Analog Input VDD3 Linear Regulator 16 Pin Name Definition Reverse battery protection FET gate drive. These pins are the source of the internal power switch (N-channel MOSFET). Voltage supply to the IC (external reverse battery protection needed in some applications). This pin is the keep alive supply input. External capacitor reservoir of the internal charge pump. Keep-Alive Memory (standby) supply output. This is a VDD3 regulator output feedback pin. This pin is also the output of the VDD3 standby regulator. This pin can be used also as an additional standby regulator without the external pass transistor. 29 VDD3_B Analog Output VDD3 Linear Regulator Base Drive 30 GND Ground Ground 31 VIGN Analog Input Voltage Ignition This pin is the ignition switch control input pin. It contains an internal protection diode. 32 P3(1) Logic Input Programming Pin 3 Programming pin 3 for the VDD3, VDDL, and VKAM reference voltages. This pin is a ground. Notes 1. Programming pins must never be left floating, they must be tied to ground or protected battery voltage depending on the output voltage selections desired. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VBAT - 0.3 to +40 V KA_VBAT - 18 to +40 V - 18 to +40 V VBOOT - 0.3 to +50 V VBOOT - VSW - 0.3 to +12 V Charge Pump Output Voltage (CP) VCP - 0.3 to +12 V Switch Node Voltage SW VSW - 2.0 to +40 V Sensor Supplies (VREF1, VREF2) VREF - 1.0 to +26.5 V VREFMAXSR 2.0 V/µs Regulator Voltages (VDDH,VDD3, VDD3_B, VDDL,VDDL_B, VKAM) VREG - 0.3 to +7.0 V Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON) VDD - 0.3 to +7.0 V VREGON -0.3 to +7.0 V VIN - 0.3 to + 3.0 V Supply Voltage (VBAT) Keep-Alive Supply Voltage (KA_VBAT) Control Inputs (VIGN, P1, P2, P3), PFD Output Bootstrap Voltage (BOOT, SR) referenced to ground Bootstrap Voltage (BOOT, SR) referenced to SW Sensor Supplies (VREF1, VREF2) Maximum Slew Rate Regon Input Analog Inputs (VCOMP, INV, FREQ, HRT) ESD Voltage(2) VESD V Human Body Model - HBM (all pins except BOOT, VDDL, RSTL) ± 2000 Human Body Model - HBM (Pins BOOT, VDDL, RSTL) ± 1500 Machine Model - MM (all pins) ± 200 Charge Device Model - CDM (all pins) ±750 Operational Package Temperature (Ambient Temperature) Storage Temperature Peak Package Reflow Temperature During Maximum Junction Temperature Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case(6) (5) Reflow(3), (4) TA_MAX - 40 to + 125 °C TSTO - 65 to + 150 °C TPPRT Note 4 °C TJ_MAX 150 °C RθJ-A 41 °C/W RθJ-C 1.2 °C/W Notes 2. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003), RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011). 3. 4. 5. 6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Thermal resistance measured in accordance with EIA/JESD51-2. Theoretical thermal resistance from the die junction to the exposed pad. 33730 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS RECOMMENDED OPERATING CONDITIONS Table 4. Recommended Operating Conditions All voltages are with respect to ground unless otherwise noted. Parameter Value Unit *6.0 to 26.5 V Switching Regulator Output Current (IVDDH) total, VBAT = 6.0 to 26.5 V 0 to 2.0 A VDD3 Standby Output Current 0 to 15 mA VKAM Standby Output Current 0 to 15 mA VREF1,2 Output Current 0 to 100 mA 100 to 500 kHz Supply Voltages (VBAT, KA_VBAT) Switching Frequency Range * Tracks battery voltage from 6.0 down to 4.5 V. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristic Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit, unless otherwise noted. Characteristic Symbol Min Typ Max Unit VKAM_STUP 4.5 — — V VSTUP 4.5 — — V VSHDN_R 35 — 42 VUVLO_F 3.6 — 4.3 VUVLO_R 3.7 — 4.4 VUVLO_HYS — 0.1 — — — 500 GENERAL Keep-Alive Start-up Voltage (at the KA_VBAT pin), VKAM Output Up Start-up Voltage (at the KA_VBAT pin), VDD3, VDD3 standby, VDDL Up Over-voltage Shutdown V Voltage at KA_VBAT pin rising Under-voltage Lock-out V Voltage at KA_VBAT pin falling Voltage at KA_VBAT pin rising (7) Under-voltage Lock-out Hysteresis Sleep Quiescent Current (Sleep mode) IQ VIGN = 0 V, REGON = 0 V, IVKAM = 0 mA, VDD3 OFF, VBAT = 14.0 V, µA KA_VBAT = 14 V (P1=1, P2=1, P3=1) SWITCHING REGULATOR (VDDH) Buck Converter Output Voltage VDDH V VBAT = 6.0 to 26.5 V, ILOAD = 100 mA 4.9 5.0 5.1 VBAT = 26.5 to 35 V, ILOAD = 100 mA 4.85 5.0 5.15 Switching Regulator Current Limit (see Figure 5) Pulse-by-Pulse Current Limit Extreme Current Limit (see Figure 5)(7) SW Drain Source On Resistance(7) A ILIM_SW -2.25 -3.5 -4.25 ILIM_SW_EX -3.75 -4.5 -6.00 — — 200 TSH — — 195 TSL 155 — — TSHYS 1.0 — 20 RDS(ON) ID = 500 mA, VBAT = 5.0 V Thermal Shutdown Junction Temperature(7) Thermal Shutdown Hysteresis(7) mΩ °C °C VDD3 LINEAR REGULATOR VDD3 Output Voltage (Includes Line and Load Regulation) VDD3 IVDD3 = 0 to -500 mA, See Table 2 for VDD3 Output Settings % -3.0 — 3.0 — 1.1 1.5 KA_VBAT = 14 V, VBAT = 14 V -20 — -50 KA_VBAT = 5.0 V, VBAT = 5.0 V -20 — -50 VDD3 Dropout Voltage (VDDH - VDD3) VDD3_DO IVDD3 = -800 mA (VDD3 set to 3.3 V via P1, P2, P3 and with an external transistor) VDD3_B Current Limit, VDD3_B = 0 V, V IVDD3B_Lim mA Notes 7. Guaranteed By Design. 33730 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristic(continued) Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit, unless otherwise noted. Characteristic Symbol Min Typ Max -15 — 15 — — 1.4 Unit VDD3 STANDBY LINEAR REGULATOR VDD3 Standby Output Voltage (Includes Line and Load Regulation) VDD3_SBY IVDD3_SBY = 0 to -15 mA, See Table 2 for VDD3_SBY Output Setting VDD3 Dropout Voltage (KA_VBAT - VDD3) Standby Mode VDD3_DO (VDD3 set at 3.3 V via P1, P2, P3) IVDD3 = -10 mA VDD3 Standby Current Limit, VDD3 = 0 V % V IVDD3SBY_LIM mA KA_VBAT = 14 V, VBAT = 14 V -20 — -50 KA_VBAT = 5.0 V, VBAT = 5.0 V -20 — -50 TSH — — 190 TSL 150 — — TSHYS 5.0 — 20 -3.0 — 3.0 — — 280 KA_VBAT = 14 V, VBAT = 14 V -18 — -50 KA_VBAT = 5.0 V, VBAT = 5.0 V -18 — -50 -15 — 15 Thermal Shutdown Junction Temperature(8) Thermal Shutdown Hysteresis(8) °C °C VDDL LINEAR REGULATOR VDDL Output Voltage (Includes Line and Load Regulation) VDDL IVDDL = 0 to -500 mA, See Table 1 for VDDL Output Setting VDDL_B Dropout Voltage (VDDH - VDDL) VDDL_DO % mV (VDDL set at 3.3 V via P1, P2, P3) IVDDL = -800 mA VDDL_B Current Limit, VDDL = 0 V IVDDL_LIM mA VKAM STANDBY LINEAR REGULATOR VKAM Output Voltage (Includes Line and Load Regulation) VKAM IVKAM = 0 to -15 mA, See Table 1 for VKAM Output Setting VKAM Dropout Voltage (KA_VBAT - VKAM) % VKAM_DO IVKAM = -10 mA, VKAM set to 5.0 V (P1 = L, P2 = H, P3 = L) V — — 1.4 VKAM STANDBY LINEAR REGULATOR (CONTINUED) VKAM Current Limit, VKAM = 0 V IVKAM_LIM mA KA_VBAT = 14 V, VBAT = 14 V -20 — -50 KA_VBAT = 5.0 V, VBAT = 5.0 V -20 — -50 TSH — — 190 TSL 150 — — TSHYS 5.0 — 20 Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis(8) (8) °C °C Notes 8. Guaranteed By Design. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristic(continued) Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit, unless otherwise noted. Characteristic Symbol Min Typ Max Unit RDS(ON) — — 500 mΩ IREF_LIM -150 -280 -450 mA IREF_REVLIM — — 40 mA IREF_REVLIM -2.0 — — mA TSH — — 190 °C TSL 150 — — TSHYS 5.0 — 20 °C VIGN_IH 4.0 4.3 4.6 V VIGN_IL 2.0 2.15 2.4 VIGN-HYS 1.7 — — SENSOR SUPPLIES VREF1, VREF2 VREF On-resistance, IVREF = -100 mA VREF Current Limit, VREF = -1.0 V (9) VREF Reverse Current Limit, VREF = 26.5 V (9) VREF Leakage Current, VREF Shut Down, VREF = -1.0 Thermal Shutdown Junction Temperature V(9) (10) Thermal Shutdown Hysteresis(10) SUPERVISORY AND CONTROL CIRCUITS VIGN Input Voltage Threshold VBAT = 14.0 V, KA_VBAT = 14 V VIGN Hysteresis VIGN Pull-down Current @ 5.0 V IPD VBAT = 14.0 V, KA_VBAT = 14 V REGON Input Voltage Threshold V µA 10 30 60 VIH 1.7 — — VBAT = 14.0V, Battery Voltage = 14V VIL -0.3 — 1.0 REGON Input Voltage Threshold Hysteresis V VIHYS 0.1 0.3 0.4 V REGON Pull-down Current @ 3.0 V IPD 5.0 — 30 µA Programming Pin Input Voltage Threshold VIH 2.5 — VBAT V VIL -0.3 — 1.0 IPD — 1.0 5.0 µA VDDH Reset Upper Threshold Voltage (ΔVDDH/VDDH) 4.0 8.0 13.0 % VDDH Reset Lower Threshold Voltage (ΔVDDH/VDDH) -3.0 -8.0 -13.0 % VDDL Reset Lower Threshold Voltage (ΔVDDL /VDDL) -3.0 -8.0 -13.0 % VDD3 Reset Lower Threshold Voltage (ΔVDD3 /VDD3) -3.0 -8.0 -13.0 % -3.0 -12.5 -30 -3.0 -12.5 -30 — — 0.4 — — 0.4 VBAT = KA_VBAT = 14 V Programming P1, P2, P3 Leakage Current @ 14.0 V VDD3_SBY Reset Lower Threshold Voltage (ΔVDD3_SBY /VDD3_SBY) VKAM Reset Lower Threshold Voltage (ΔVKAM /VkAM) % RSTH, RSTL, RST3, RSTKAM Low-level Output Voltage IOL = 5.0 mA V IGN_ON Low-level Output Voltage IOL = 5.0 mA % V Notes 9. The short circuit transient events on the VREF outputs must be limited to the voltage levels specified in the Maximum Ratings and slew rates of less than 2.0 V/µs, otherwise damage to the part may occur. Refer to the paragraph Sensor Supplies (VREF1, VREF2) on page 18 and typical application circuit diagrams on Figure 8,and Figure 9 for recommended VREF output termination. 10. Guaranteed by design. 33730 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 6. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0 V ≤ KA_VBAT = VBAT ≤ 26.5 V, - 40°C ≤ TA ≤ 125°C using the typical application circuit, unless otherwise noted. Characteristic Symbol Min Typ Max Unit 0 — 68 8.0 — 12 ms GENERAL Power On Reset Delay Time (HR Timer) (see Table 8) tD_POR (Time to RESET up after Regulator in regulation) Power On Reset Delay Time (HR Timer) Accuracy (33 k resistor) ms (11) tLD_P — 500 — µs Oscillator Frequency (Switching Freq.) Range - Adjustable (Figure 4) Freq 100 — 500 kHz Oscillator Frequency Tolerance at 100 kHz (FREQ Pin Open) fTOL 90 — 110 kHz Programming Pin Latching Delay SWITCHING REGULATOR SW Node Rise Time, VBAT = KA_VBAT = 14 V, ISW = 500 mA(11) tSW_R V/ns SR pin shorted to SW pin — 0.96 — SR pin open — 1.82 — SR pin shorted to BOOT pin — 2.38 — SR pin shorted to SW pin — 0.83 — SR pin open — 0.83 — SR pin shorted to BOOT pin — 0.83 — SW Node Fall Time, VBAT = KA_VBAT = 14 V, ISW = 500 mA(11) tSW_F V/ns Notes 11. Guaranteed by design. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 11 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 33730 multi-output power supply integrated circuit addresses the system power supply needs for applications using the Freescale 32-bit microcontroller family architecture. FUNCTIONAL PIN DESCRIPTION HARDWARE RESET TIMER (HRT) VDDL REGULATOR BASE DRIVE (VDDL_B) This pin is the hardware reset timer input, which provides delays for the Reset outputs. This delay is programmed by an external resistor to GND. VDDL linear regulator base drive. This output supplies current into the base of the regulator external pass NPN transistor. VKAM RESET (RSTKAM) VREF OUTPUT 1 (VREF1) This pin is an open drain reset output monitoring the VKAM supply to the microprocessor. This output is actively pulled low when the VKAM output voltage falls below its reset threshold level. This pin is output of the protected supply VREF1. This output supplies sensors outside of the electronic control module and therefore it is protected against short battery and short to -1.0 V. This pin is supplied from the VDDH through the internal protection FET. VDDH RESET (RSTH) This pin is an open drain reset output monitoring the VDDH regulator. This output is actively pulled low when the VDDH output voltage falls below its reset lower threshold level or when the VDDH output voltage exceeds its reset upper threshold level REGULATOR HOLD ON (REGON) Regulator Hold On input control pin. The 33730 can be enabled or kept in the Normal operational mode by holding this pin high. This is a 5.0 V logic input. VIGN STATUS (IGN_ON) VDDL RESET (RSTL) This pin is an open drain reset output monitoring the VDDL regulator. This output is actively pulled low when the VDDL output voltage falls below its reset threshold level. This open drain output signals the status of the VIGN pin. This logic output is actively pulled low when the VIGN control input is pulled high. COMPENSATION (VCOMP) VDD3 RESET (RST3) This pin is an open drain reset output monitoring the VDD3 regulator. This output is actively pulled low when the VDD3 output voltage falls below its reset threshold level. This pin provides switching pre-regulator compensation network. It is the output of the switching regulator error amplifier. INVERTING INPUT (INV) VREF OUTPUT 2 (VREF2) This pin is output of the protected supply VREF2. This output supplies sensors outside of the electronic control module and therefore it is protected against a battery short and short to -1.0 V. This pin is supplied from the VDDH through the internal protection FET. VDDL REGULATOR (VDDL) This pin is the VDDL regulator output feedback pin. The emitter of VDDL regulator external NPN pass transistor is connected to this pin. VDDH REGULATOR (VDDH) This pin is the 5.0 V output feedback pin of the buck regulator. This pin is also a power input for the protected outputs VREF1 and VREF2. This pin is the inverting input of the switching regulator error amplifier. FREQUENCY ADJUSTMENT (FREQ) This is the frequency adjustment input of the switching regulator. The operating frequency of the switching regulator can be programmed by an external resistor from this pin to ground. PROGRAMMING PIN 1 (P1) Programming Pin 1 for the VDD3, VDDL, and VKAM reference voltage. The output voltage of the VDD3, VDDL and VKAM regulators can be programmed by the P1, P2, and P3 pins (see Table 7). 33730 12 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION PROGRAMMING PIN 2 (P2) KEEP ALIVE SUPPLY (KA_VBAT) Programming Pin 2 for the VDD3, VDDL, and VKAM reference voltage. The output voltage of the VDD3, VDDL and VKAM regulators can be programmed by the P1, P2, and P3 pins (see Table 7). This pin is the keep alive supply input. This input is reverse battery protected. This input supplies power to the internal supply and bias circuits that have to do with this VKAM and other always-on supplies. PROGRAMMING PIN 3 (P3) CHARGE PUMP (CP) Programming Pin 3 for the VDD3, VDDL, and VKAM reference voltages. The output voltage of the VDD3, VDDL and VKAM regulators can be programmed by the P1, P2, and P3 pins (see Table 7). External reservoir capacitor of the internal charge pump. This charge pump provides the voltage needed to sufficiently enhance the gates of the internal n-channel mosfets (VREF1, VREF2, and VDDH) during the low battery condition. PROTECTION FET DRIVE (PFD) KEEP ALIVE MEMORY (VKAM) Reverse battery protection FET gate drive. This pin is an output drive for the gate of the external Reverse Battery Protection N-channel FET. Keep Alive Memory (standby) supply output. This output supplies power for the module Keep-Alive memory. This output is always on, if the voltage at the KA_VBAT pin is above 4.5 V. BOOTSTRAP (BOOT) This pin is connected to the bootstrap capacitor. It provides the supply power for the switching regulator highside drive. SLEW-RATE (SR) Slew-rate Control of the switching regulator. The slew-rate of the switching regulator can be adjusted by connecting this pin to switch node (SW pin, slow slew-rate selection), BOOT pin (fast slew-rate selection), or it can be left open (medium slew-rate selection). SWITCH NODE (SW) This pin is the source of the switching regulator internal power switch (N-channel MOSFET source). VDD3 LINEAR REGULATOR (VDD3) This is a VDD3 regulator output feedback pin.The emitter of VDD3 regulator external NPN pass transitory is connected to this pin. This pin can programmed to be the output of the VDD3 Standby regulator (see Table 7). VDD3 LINEAR REGULATOR BASE DRIVE (VDD3_B) This pin can be used also as an additional standby regulator without the external pass transistor.This output supplies current into the base of the regulator external pass NPN transistor. GROUND (GND) BATTERY VOLTAGE SUPPLY (VBAT) Voltage supply to the IC (external reverse battery protection is recommended). This pin is the ground pin of the integrated circuit. VOLTAGE IGNITION (VIGN) This pin is the turn-on control input that is controlled through an ignition switch. This pin is reverse battery protected. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 13 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION MC33730 - Functional Block Diagram Output Functions Input Functions Voltage Programmming Input Protection FET Driver 5 Volt Buck Switching Regulator Ignition Input 5 Volt Protected Outputs (VREF1, VREF2) Internal Functions Linear Regulator Outputs (VDDL, VDD3, VKAM) Band Gap Reference Sleep/Wake Circuitry Oscillator 5.0 VOLT BUCK REGULATOR This is the main regulator that supplies 5.0 Volts to the following protected and regulated outputs, VREF1, VREF2, VDD3, and VDDL. OSCILLATOR This is the frequency source for the switching (buck) 5 Volt regulator. The frequency of oscillation is selected by an external resistor to ground. BAND GAP REFERENCE This is the main voltage reference, which is used as the standard for all the current and voltage sources in the MC33730. PROTECTION FET DRIVER The protection FET is used to prevent reverse battery connections from damaging the MC33730. The gate drive for the Protection FET is provided by this driver circuit. Ignition Driver Reset Circuitry output signal to indicate that the ignition switch has been activated. VREF1 This output is one of two protected 5.0 volt outputs that can be used to supply external sensors or other analog circuits requiring a regulated, short-circuit protected 5.0 volt supply. VREF2 This output is one of two protected 5.0 volt outputs that can be used to supply external sensors or other analog circuits requiring a regulated, short-circuit protected 5.0 volt supply. VDD3 REGULATOR This is one of three, voltage programmable, regulated supplies. This supply is controlled by the ignition switch. VDDL REGULATOR This is one of three, voltage programmable, regulated supplies. This supply is controlled by the ignition switch. SLEEP/WAKE CIRCUITRY This circuitry is responsible for the two main modes of operation for the MC33730, Sleep mode and Wake mode. In the Sleep mode, only the keep alive outputs are active, and the rest of the circuitry is in a low power drawing sleep state. In the Wake mode, the MC33730 is fully functional and normal current is being consumed. IGNITION DRIVER This block of circuitry controls all the voltage outputs, except for the keep alive voltage output(s). It also provides an VKAM This is one of three, voltage programmable, regulated supplies. This supply is NOT controlled by the ignition switch. VOLTAGE PROGRAMMING P1, P2, and P3 are three logic level inputs that control the voltage that is available on the VDD3, VDDL and VKAM outputs. Table 7 indicates the 8 different combinations of P1, P2, and P3 and the resultant voltage values. 33730 14 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION RESET CIRCUITRY REGON INPUT There are four open drain reset lines that indicate the status of the four voltage outputs; VDDH, VDDL, VDD3, and VKAM. They are labeled: RSTH, RSTL, RST3, and RSTKAM. This input is OR’d with VIGN. However, it is a 5.0 volt logic input, as opposed to VIGN, which is a VBAT level input. This input is controlled by an MCU I/O pin, to hold power up when the ignition switch is turned off, so housekeeping functions can be performed before power is shut off, by lowering the REGON line. IF REGON is not needed, it should be tied to GND. 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DEVICE OPERATION OPERATION DESCRIPTION FUNCTIONAL DEVICE OPERATION OPERATION DESCRIPTION The 33730 has two supply inputs. The KA_VBAT pin is the supply input for the standby regulators VKAM (and optionally VDD3_SBY, see Table 7) and for the internal supply circuits. The VBAT pin is the power input of the integrated buck regulator, which steps-down the protected battery voltage providing directly the 5.0 V system supply VDDH. VDDH provides power for the main linear regulator(s) VDDL, VDD3, and also for the other module circuits requiring 5.0 V supply voltage (e.g. protected VREF1,2 outputs). If the supply voltage ramps from zero volts up to its nominal level, the 33730 will start at the latest when the supply (battery) voltage reaches VSTUP at the KA_VBAT pin. If the supply voltage ramps down, the 33730 will keep operating (with degradation of the output voltage regulation) down to VUVLO_f at the KA_VBAT pin. The VKAM output stays operational down to VUVLO_f at the KA_VBAT pin. The 33730 will operate in systems with and without standby mode. In the Standby (sleep) mode of operation the IC will draw maximum IQ quiescent current, assuming only the VKAM is used as a standby output, and it is unloaded. When VDD3 is used as an additional standby output the quiescent current increases by approximately another 100 μA. POWER UP The 33730 will safely power up when the power is applied simultaneously (hot plugged) or in the random sequence to the KA_VBAT, VBAT and VIGN (or REGON) inputs. POWER DOWN The 33730 will safely power down when the power is disconnected from any of the KA_VBAT, VBAT inputs or when control signals the VIGN or REGON inputs go low. UNDERVOLTAGE LOCK-OUT (UVLO) There is an under-voltage lock-out feature implemented into the IC. When the battery voltage at the KA_VBAT pin falls below VUVLO_f the under-voltage comparator initiates the power down sequence for the whole IC. The under-voltage lock-out circuit has a VUVLO_hys hysteresis and 5.0 μs glitch filter in order to prevent spurious tripping its threshold level and consequent system oscillations between the ON and OFF states. SWITCHING REGULATOR The 33730 switching regulator is a fixed frequency (externally adjustable) PWM voltage mode controller with integrated low-RDS(ON) N-channel power MOSFET. This architecture is widely flexible and provides a possibility to optimize its operation over a wide range of input voltages. The 33730 switching regulator provide the following features: Adjustable Switching Frequency The adjustable frequency feature provides the ability to modify the switcher performance for optimized cost (higher frequency, smaller, cheaper components), or higher efficiency and better EMC performance (lower switching frequency for reduced losses and EMI). The operating frequency of the switching regulator can be adjusted by means of an external resistor RF connected from the FREQ pin to ground (see Figure 4). Frequency vs RFreq 600 Switching Frequency [kHz] INTRODUCTION 500 400 300 200 100 0 0 20 40 60 80 100 RFreq [kohm ] FSW ≅ 18.48 + (5098.7/RFREQ) FSW is the switch frequency in kHz RFREQ is the resistor value in kOhms Figure 4. Switching Regulator Frequency vs. RFreq Value Adjustable Slew-rate The adjustable slew-rate option allows, with selection of the right switching frequency, optimization of the system for EMC performance. Over-voltage Lock-Out (Shutdown) The over-voltage lock-out (shutdown) feature turns the switching regulator off when the input voltage exceeds the VSHDN_r limit. This extends the 33730 capability to survive the severe load dump conditions up to max VBAT. Operation at 100% Duty Cycle The internal charge pump is used to enhance the power MOSFET gate when the switching regulator reaches 100% duty cycle during the low battery conditions. The switching regulator output voltage VDDH is regulated to provide 5.0 V @ 2.0 A with ±2% accuracy and it is intended 33730 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATION DESCRIPTION to directly power the digital and analog circuits of the Electronic Control Module (ECM). The switching regulator output current is also used by the following linear regulators VDD3_3, VDDL, and sensor supplies VREF1, and VREF2. The direct voltage conversion to VDDH = 5.0 V together with the Protection FET Driver circuit allows operation of the IC at very low battery voltages, which would otherwise require to use a boost regulator (with an additional system cost) or a different and more expensive switching converter topology (e.g. flyback). Short Circuit Protection The switching regulator is protected against the overcurrent and short-circuit conditions. It integrates a current limit circuit, which has two threshold levels - the pulse by pulse, and the extreme. Pulse by Pulse Current Limit Pulse-by-Pulse Current Limit threshold has a nominal value set ILIM_SW. When the current flowing through switching regulator power FET exceeds this value the power FET is immediately turned off. During the next switching cycle the power FET is turned on again until it is commanded off by its natural duty cycle or until the current reaches the threshold level again. It should be noted that the current limit is blanked for several tens of nanoseconds during the turn-on and turnoff transition times in order to prevent erroneous turn off due to the current spikes caused by switcher parasitic components. Extreme Current Limit. In some cases, during the over-current or short-circuit condition, the inductor current does not sufficiently decay during the off time of the switching period. The current rise during the current limit blanking time is higher than the decay during the off time. In this case the current in the inductor builds up every consecutive switching cycle. In order to prevent the power FET failure during this condition an extreme current limit has been implemented. When the current flowing through the power FET reaches the ILIM_SW_Ext threshold, the switching regulator will shut off for 500 μs, before the switching regulator is allowed to turn on again (see Figure 5). Ex t. I 4.5A Lim I Lim 3.5A Inductor Cu rrent tBLANK 0 TSW 500us d elay Switcher FET Gate TSW Soft Start The switching regulator has an integrated soft-start feature. During the soft-start sequence the duty cycle of the internal power switch will be gradually increased from low value to the regulation level. This technique prevents any undesirable inrush current into the buck regulator output capacitor. LINEAR REGULATORS The 33730 integrates two linear regulator control circuits VDD3 (programmable), VDDL (programmable) both capable of driving up to 15 mA (min.) base current into the external pass NPN transistors. The output voltage of both linear regulators is monitored at their feedback pins (VDD3 and VDDL). If the voltage at any of the VDD3, VDDL feedback pins fall below their regulation level, the supervisory Reset control circuits will assert the corresponding reset signal (RSTL, and/or RST3 lines will be pulled low). See Table 7 for the output voltage selection details. The linear regulators will stay in regulation down to 4.5 V at the KA_VBAT pin. The 33730 linear regulators offer high flexibility and variability of the module design in terms of selectable output voltages as well as wide range of output current capability. There several types of suitable external pass NPN transistors which could be used. The choice of the particular type depends mostly on the expected power dissipation of the pass transistor. The following parts provide good solution and have been bench tested with the 33730: BCP68T1 (SOT-223) NJD2873T4 (DPAK) MJB44H11 (D2PAK) Available from ON Semiconductor. NOTE: The 33730 linear regulators have been designed to use low ESR ceramic output capacitors - see Figure 8 and Figure 9 for the recommended values. STANDBY REGULATORS The 33730 integrates two standby linear regulators, the VKAM and the optional standby regulator VDD3 (see Figure 9) for the optional standby circuit).The output voltage levels of both standby linear regulators are programmable and supervised by the Reset control circuits (RSTKAM, and/or RST3). Both the VKAM and VDD3 outputs are capable of delivering IVKAM_LIM and IVDD3_LIM of load current. See Table 7 for the VKAM and VDD3 standby output voltage selection details. The VKAM standby regulator will keep functioning even below VUVLO_f but the specified drop out voltage may not be maintained. NOTE: The 33730 standby regulators have been designed to use low ESR ceramic output capacitors - see Figure 8 and Figure 9 for recommended values. Figure 5. 33730 Current Limit 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 17 FUNCTIONAL DEVICE OPERATION OPERATION DESCRIPTION PROGRAMMING LINEAR REGULATOR OUTPUT VOLTAGE The output voltage of the VDD3, VDDL and VKAM outputs can be externally programmed by placing logic levels on the programming pins P1, P2, and P3 (see Table 7). This extends the application flexibility of the IC without having to use an external resistor divider, thus improving the regulator accuracy over the whole temperature range, and reducing the component count. The logic level of the programming pin (Px) can be selected by tying the pin to ground (logic level "0") or to protected battery voltage (logic level "1"). Programming pins must never be left floating, they must be tied to either ground or protected battery voltage. The programming information is read and latched with the 500 μs delay after the power is applied to the IC. Table 7. Programming VDD3, VDDL, VKAM Output Voltage P1 P2 P3 VDD3 VDDL VKAM High High High 3.3 V 2.6 V 2.6 V High High Low 3.3 V 3.3 V 3.3 V High Low High 3.3 V 1.5 V 1.0 V During the power down sequence the VDD3 and VDDL outputs will be pulled down by the internal pull-down power FETs, and VDDH will be shut off with a defined delay (~100 μs typ.). In order to engage the power down sequence, the following conditions have to be met: (VIGN . REGON) + UVLO = Power Down The VDD3 output is not power sequenced when used as a standby regulator. SENSOR SUPPLIES (VREF1, VREF2) There are two sensor supplies, VREF1 and VREF2, integrated into the IC. They are internally connected to VDDH through power MOSFETs which protect against short to battery and short to ground conditions. Severe fault conditions on the VREF1 and VREF2 outputs, like shorts to either ground or battery, will not disrupt the operation of the main regulator VDDH, or cause assertion of any Reset signal. IMPORTANT NOTE: The VREF outputs MUST be externally protected against transient voltage events with slew rates faster than 2.0 V/μs, otherwise damage to the part may occur. A practical and inexpensive solution consists of using a series RC network connected from the VREF output to ground (see Figures 8 and 9 for typical component values). Other means, such as a single electrolytic capacitor with its capacitance value C > 10 μF, may be also used. High Low Low 3.3 V 3.3 V 1.0 V Low High High 3.3 V Standby 3.3 V 1.0 V Low High Low 2.0 V 3.15 V 5.0 V Low Low High 2.6 V Standby 3.3 V 1.0 V PROTECTION FET DRIVE (PFD) Low Low Low 2.6 V Standby 3.3 V 1.5 V The Protection FET Drive circuit allows using an optional N-channel protection MOSFET (instead of a standard reverse protection diode) to protect against a reverse battery voltage condition. This approach improves the operating capabilities at very low battery voltages. An internal charge pump is used to enhance the Protection FET gate during nominal and low battery conditions. The charge pump will be enabled at the startup voltage. When the battery voltage gets sufficiently high, the Protection FET is turned off and the integrated circuit power input (VBAT pins) are supplied through the body diode of the Protection FET. Use of the Protection FET is not necessary in systems already using a protection diode, relay or when no reverse battery protection is required. The Programming Pins can be tied high, to protected battery voltage, or low, to ground. LOW BATTERY OPERATION When the battery voltage falls below the specified minimum value, the 33730 switching regulator will enter a 100% duty cycle mode of operation and its output voltage VDDH will follow the decreasing battery voltage. If the battery voltage continues to fall, the VDDH voltage reaches its reset threshold level, and the RSTH signal will be pulled low, but the other linear regulators will continue to operate, and their monitoring signals stay high as long as the VDDH provides sufficient headroom for the regulators to stay in their regulation limits (see Figure 6 and Figure 7). If the battery voltage continues to fall, the linear regulators would not have sufficient headroom to stay in regulation, and their resets would be asserted (RSTL, RST3, or both would be pulled low). At that moment the power down sequence would be engaged. The VKAM standby regulator will operate down to (VKAM and VKAM_DO) and VKAM-DO at the KA_VBAT pin. POWER SEQUENCING (VDDH, VDD3, VDDL) VDDH, VDD3, and VDDL are power sequenced by means of internal pull-down FETs. During the power up sequence, VDD3 and VDDL will follow VDDH. CONTROL INPUT (VIGN) The VIGN pin is used as a control input to the IC. The regulation circuits will function and draw current from VBAT when VIGN is high (active) or when the REGON pin is high. The VIGN pin has a VIHN-IH power-up threshold VIGN-IL typical power-down threshold) and VIGN-HYS (minimum) of hysteresis. VIGN is designed to operate up to max VBAT battery while providing reverse battery and max VBAT load dump protection. 33730 18 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATION DESCRIPTION REGON The REGON feature permits the microcontroller to select a delayed shutdown of the 33730. It holds off the activation of the reset signals to the microcontroller after the VIGN signal has transitioned. This allows the microcontroller to control the power up and power down of the main regulator outputs except for the standby supplies. The REGON pin input threshold voltages allow control by the standard 2.5 V (up to 5.0 V) logic ICs. HARDWARE RESETS (RSTL, RST3, RSTH, and RSTKAM) The Hardware Resets are open drain, active low outputs capable of sinking 5.0 mA current and able to withstand +7.0 V. The RSTL control circuit monitors the VDDL output. If the VDDL output is out of regulation (low), the device will assert the RSTL signal low. The RST3 control circuit monitors the VDD3 output. If the VDD3 output is out of regulation (low), the device will assert the RST3 signal low. The RSTH control circuit monitors the VDDH output. If the VDDH output is out of regulation (low or high), the device will assert the RSTH signal low. All Reset monitoring circuits have a 20 μs delay filter to avoid unintended resets caused by noise glitches on the regulator output lines. HR TIMER The HR (Hardware Reset) Timer provides the delay between the time when the particular regulator output voltage is in regulation and the release of the Reset signal. This delay can be programmed by a single external resistor. This solution provides better accuracy than the commonly used external RC timer. The HR Timer delay can be programmed in eight 8ms steps from 0 to 56 ms (see Table 8) . Table 8. HR Timer Delay Programming Programming Resistor Value RHRT [ohms] Delay (typ.) [ms] 68 k 0 33 k 10 16 k 19 8.2 k 29 3.9 k 39 2.0 k 48 1.0 k 58 470 68 The RSTKAM control circuit monitors the VKAM output. If the VKAM output is out of regulation (low), the device will assert the RSTH signal low. VDDH = 5.0 V 4.5V V DDL = VDD3 = 3.3V Battery Voltage V KAM = 1.0V POR Delay RSTKAM RST L, RST 3 RSTH POR Delay POR Delay Figure 6. Battery Voltage Ramp Up 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 19 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES VDDH out of regulation B att ery Voltage V DD3, V DDL out of regulat ion 100us V DDH turned off VDDH = 5. 0 V VDDL = V DD3 = 3. 3V VDD3, V DDL act ively pulled low 4.5V 3.0V V = 1.0V KA M RS TKA M RS TL, RS T3 RSTH Figure 7. Battery Voltage Ramp Down OPERATIONAL MODES The 33730 can operate in the two modes: Low quiescent current Sleep mode and Normal mode of operation. SLEEP MODE The 33730 operates in the Sleep mode when both the VIGN pin and the REGON pins are pulled low. Both of these pins have internal pull-downs, which assures that the IC is in this defined state when those pins are left open. When the IC enters the Sleep mode, all major functions are disabled except for the Standby regulators. The KeepAlive regulator VKAM stays always operational (see Table 7). If this output stays unloaded, the IC in the Sleep mode consumes very low quiescent current (IQ). If the VDD3 output was programmed as a VDD3 Standby regulator (see Table 7), it too stays operational during the Sleep mode, as well as the VKAM regulator. In this case, the IC consumes about 100 μA of additional quiescent current (assuming both VKAM and VDD3 Standby outputs are unloaded). NOTE: In the Sleep mode, the RSTKAM and RST3 are not active and their outputs (as well as the outputs of RSTL and RSTH) are in the high-impedance state. NORMAL MODE The 33730 enters the Normal mode of operation when either the VIGN pin or the REGON pin is pulled high. In this case the IC is fully operational with all regulator outputs ready to supply power and all control, monitoring and protection features activated. 33730 20 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS OPERATIONAL MODES TYPICAL APPLICATIONS Battery 10nF Optional Protection FET 3.3uH VBAT 100uF 1.0uF VBAT Feed Forward Ramp Generator UVLO /OVLO KA_VBAT SW FREQ Oscillator CP Buck VKAM 1.0 V 4.7uF 10nF CP PFD REGON 5.1k HS Drive, Level Shifter VKAM 15 mA,I Lim, TLim VDDH = 5.0= V VDDH 5.0V @ mA(11) @2000 2000mA total 100uF SS26 BOOT RFreq SR Control Logic 10nF 1.0uF 22uH SW Feedback Compensation Network 10.4 20k k CP Protection FET Drive 5.0k k 1.98 V BG Charge Pump 1.5nF INV k(12) 20-60 20k 2.2nF VCOMP 430R 56pF 2.2-4.7 nF(12) VIGN VREF1 5.0 V 10nF VDD3 ILim,TLim T-lim 5.0 V, ILim=150 mA 26.5V,-1V,TLim 1.5R VDDH Enable IGN_ON Standby Control VDD3_SBY ILim,TLim 1.0uF 5.0 V 5.0 V, I Lim=150 mA 26.5V,-1V,TLim VREF2 1.5R 1.0uF P1 P2 4 x 5.1k P3 Ref. Voltage Programming Block Band-Gap Reference VKAM, VDDL, VDD3, VDD3_SBY Ref. Voltage RSTH VDDL Q1 1.5 V I Lim VDDL 10uF 10nF HRT RHRT Reset Detect VDD3 Reset Detect RSTL 10nF HR Timer V DDH RST3 3.3 V VDD3 VDDL_B VKAM Reset Detect RSTKAM Q2 VDD3_B 4.7uF V BG 100nF GND Recommended Q1, Q2: BCP68T1 (SOT-223) NJD2873T4 (DPAK) MJB44H11 (D2PAK) V DDL Reset Detect Notes 12. The VDDH total current includes the sum of all output currents of the IC. 13. Higher resistance (60 k) and higher capacitance (4.7nF) in the compensation network will reduce the VDDH overshoot. Compensation network values should be optimized for specific circuit applications. Figure 8. 33730 Typical Application Circuit Table 9. Programming Output Voltage (BOLD denotes selected combinations) P1 P2 P3 VDD3 VDDL VKAM High High High 3.3 V 2.6 V 2.6 V High High Low 3.3 V 3.3 V 3.3 V High Low High 3.3 V 1.5 V 1.0 V High Low Low 3.3 V 3.3 V 1.0 V Low High High 3.3 V Standby 3.3 V 1.0 V Low High Low 2.0 V 3.15 V 5.0 V Low Low High 2.6 V Standby 3.3 V 1.0 V Low Low Low 2.6 V Standby 3.3 V 1.5 V 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 21 TYPICAL APPLICATIONS OPERATIONAL MODES Battery 10nF Optional Protection FET 3.3uH VBAT VBAT 100uF 1.0uF UVLO /OVLO KA_VBAT Feed Forward Ramp Generator SW FREQ Osc illator CP Buck 1.0 V VKAM 4.7uF 10nF CP PFD REGON 5.1k Feedback Compens ation Network 10.4 20k k CP Protection FET Drive 1.5R 1.98 5.0k k VREF2 1.5R P1 P2 4 x 5.1k 20-60 20k 56pF 2.2nF VCOMP 2.2-4.7 nF(14) VDDH Enable 10nF VDD3 ILim,TLim T-lim 5.0 V, ILim=150 mA 26.5V,-1V,TLim Standby Control P3 5.0 V, I Lim =150 mA 26.5V,-1V,TLim Ref. Voltage Programming Block Band-Gap Reference 4.7uF 1.5 V VDDL 10uF HRT RHRT Reset Detect VDD3 Reset Detect RSTL 10nF HR Timer V DDH RST3 Q1 I Lim Ref. Voltage RSTH 10nF VDDL_B VDDL VKAM Reset Detect RSTKAM 3.3 V Standby VDD3 V BG VKAM, VDDL, VDD3, VDD3_SBY 100nF VDD3_B VDD3_SBY ILim,TLim 1.0uF 1.0uF 430R k(14) V BG Charge Pump 1.5nF INV VIGN VREF1 5.0 V RFreq SR VKAM 15 mA,I Lim, TLim IGN_ON 5.0 V 100uF SS26 BOOT Control Logic 10nF 1.0uF HS Drive, Level Shifter VDDH = 5.0 V VDDH = 5.0V @ 2000mA 2000 mA(13) @ total 22uH SW GND V DDL Reset Detect Recommended Q1, Q2: BCP68T1 (SOT-223) NJD2873T4 (DPAK) MJB44H11 (D2PAK) Notes 14. The VDDH total current includes the sum of all output currents of the IC. 15. Higher resistance (60 k) and higher capacitance (4.7nF) in the compensation network will reduce the VDDH overshoot. Compensation network values should be optimized for specific circuit applications. Figure 9. 33730 Typical Application, VDD3 Standby Output @ 15 mA Table 10. Programming Output Voltage (BOLD denotes selected combinations)' P1 P2 P3 VDD3 VDDL VKAM High High High 3.3V 2.6V 2.6V High High Low 3.3V 3.3V 3.3V High Low High 3.3V 1.5V 1.0V High Low Low 3.3V 3.3V 1.0V Low High High 3.3 V Standby 3.3 V 1.0 V Low High Low 2.0 V 3.15 V 5.0 V Low Low High 2.6 V Standby 3.3 V 1.0 V Low Low Low 2.6 V Standby 3.3 V 1.5 V 33730 22 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10543D listed below. Dimensions shown are provided for reference ONLY. EK SUFFIX (PB-FREE) 32-PIN SOICW - EP 98ARL10543D REVISION C 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 23 PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (Continued) EK SUFFIX (PB-FREE) 32-PIN SOICW - EP 98ARL10543D REVISION C 33730 24 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (Continued) EK SUFFIX (PB-FREE) 32-PIN SOICW - EP 98ARL10543D REVISION C 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 25 REFERENCE SECTION PACKAGE DIMENSIONS (CONTINUED) REFERENCE SECTION Table 11. Reference Documents Reference MC33730ER Description MC33730, Mask DA03M89H, Rev. 4.2 Errata 33730 26 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 5.0 2/2009 • Initial Release 6.0 2/2010 • • • • • • • • Updated resistors on the INV pin (page 2, 20, 21) Clarified REGON pin operation (page 3, 9, 11, 14) Added sensor supply max. slew rate (page 5,17) Clarified POR delay section with updated typical values (page 10,18) Modified the SW rise and fall time to V/ns (page 10) Provided a switching frequency equation (page 15) Updated the recommended compensation network values (page 20,21) Made format layout corrections 7.0 4/2010 • Corrected typographical error on Capacitor (μF to nF) in Figures 8 and 9. 8.0 8/2010 • • Added Note to page 4 (Pin Definitions) for Pins P1, P2 and P3. Revised paragraph in section; Programming Linear Regulator Output Voltage on page 18 9.0 8/2012 • • • • Added part number MC33730EK to the Ordering Information table Added Device Variations on page 2 Added REFERENCE SECTION on page 26 Updated Freescale form and style 33730 Analog Integrated Circuit Device Data Freescale Semiconductor 27 How to Reach Us: Information in this document is provided solely to enable system and software implementers to Home Page: freescale.com use Freescale products. There are no express or implied copyright licenses granted hereunder to Web Support: freescale.com/support Freescale reserves the right to make changes without further notice to any products herein. design or fabricate any integrated circuits based on the information in this document. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: store.esellerate.net/store/ Policy.aspx?Selector=RT&s=STR0326182960&pc. Freescale, the Freescale logo, AltiVec, C-5, CodeTest, CodeWarrior, ColdFire, C-Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. Document Number: MC33730 Rev. 9.0 8/2012
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