Analog, Mixed-Signal and Power Management
MC33903/4/5
System Basis Chip Gen2 with High Speed CAN and
LIN Interface
Overview
The MC33903/4/5 is the second generation
family of System Basis Chips, which combine
several features and enhance present module
designs. The device works as an advanced
power management unit for the MCU and
additional integrated circuits such as sensors
and CAN transceivers. It has a built-in enhanced
high speed CAN interface (ISO11898-2 and -5),
with local and bus failure diagnostics, protection,
and fail safe operation mode. The SBC may
include one or two LIN 2.1/J2602-2 interfaces
with LIN master terminal outputs. It includes
wake-up input pins than can also be configured
as output drivers for flexibility.
This device implements multiple Low Power
modes with very low-current consumption. In
addition, the device is part of a family concept
where pin compatibility, among the various
devices with and without LIN interfaces, adds
versatility to module design.
The MC33903/4/5 also implements an
innovative and advanced fail-safe state machine
and concept solution. This family of devices are
supported by an enablement ecosystem that
includes an evaluation board, software interface,
EMC/ESD conformance reports and training
material that allows a faster time to market and
eases your designs.
MC33903/4/5 Block Diagram
MCU Voltage Regulator (VDD)
Internal CAN Regulator (VCAN)
Legend
Low Power Modes
SPI Adv W/D
Flexible (I/O)
33903
33903S
33903D
Secured State Machine
CAN High Speed
33904
33905S
Power Sharing (VDD BALLAST)
33905D
Ballast Regulator (VAUX)
LIN 1
LIN 2
Power Management Scalability
• MCU power supply (VDD): 5.0 or 3.3 V /
150 mA (power split option for scalable
needs - up to 300 mA)
• 5.0 or 3.3 V voltage regulator (VAUX) for
auxiliary loads
• Dedicated 5.0 V voltage regulator (5 V
CAN) for High Speed CAN
Functional Safety
• Innovative cranking pulse management
during VDD low
• Fail safe & configurable state machine
• Enhanced protections and diagnostics
Energy Savings
• Ultra low power modes (typ 15 µA with
VDD off)
• Innovative Wake-up management and
cyclic sense capability
Robust Physical Layers
• Certification to LIN 2.1, J2602-2, and
ISO11898-2-5 standards
• Successfully certified for stringent EMC,
ISO, and ESD standards
Easy to Use
• Ecosystem to lower development time and
simplify access
• Debug mode to save time during
application development
Flexibility & Compatibility:
• Selectable parameters (RST time, W/D
type, VDD under-voltage threshold, VAUX
3.3 or 5.0 V)
• 1 or 2 LIN options (33903S, 33905S and
33903D, 33905D)
• Scalable (I/O pins configurable as wake-up
inputs or output LIN master terminations)
IDEAL COMPANION CHIP FOR MCU IN BODY, SAFETY, AND POWERTRAIN APPLICATIONS
Segment
Applications
Proposed FSL MCU
Body
Body Controller
S12x, MPC560x
Gateway
Seat Module
Door Module
Lighting Control Module
S12x, MPC560x, S08x
Column Module
HVAC
Cluster
Safety & Chassis
Seat Belt Pre-tensioner
Electric Parking Brake
S12x, MPC560x
Steering
Power Train
Fuel Pump
Water Pump
S12x, S08x
Glow Plug
Engine Management Low End
S12x, MPC563x
Key Characteristics
Parameter
Characterization
MCU Linear VREG (LDO)
5.0 / 3.3 V
Output Current
(300 mA for 33903D/S, 33904, 33905D/S with optional external PNP implementation)
Bus Output
CAN
33903D/S, 33905D/S only
LIN
Data Rate
CAN
40 kB/s – 1.0 MB/s
LIN
10.4 kB/s – 20 kB/s (100 kB/s in fast mode)
Low Power VDD OFF/ VDD ON Current
15/25 µA
ESD - Module Level (CAN and LIN)
±8000 V
Operating Voltage
5.5 - 28 V
Maximum Input Voltage
27 VDC, 40 V (Load Dump)
Operating Temperature
-40 °C
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