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MD7P19130HR3

MD7P19130HR3

  • 厂商:

    NXP(恩智浦)

  • 封装:

    NI-780-4

  • 描述:

    FET RF 2CH 65V 1.99GHZ NI780H-4

  • 详情介绍
  • 数据手册
  • 价格&库存
MD7P19130HR3 数据手册
Freescale Semiconductor Technical Data Document Number: MD7P19130H Rev. 2, 8/2010 RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs Designed for CDMA base station applications with frequencies from 1930 to 1990 MHz. Suitable for CDMA and multicarrier amplifier applications. To be u s e d i n C l a s s A B a n d C l a s s C f o r P C N -- P C S / c e l l u l a r r a d i o a n d W L L applications. • Typical Single--Carrier W--CDMA Performance: VDD = 28 Volts, IDQ = 1250 mA, Pout = 40 Watts Avg., f = 1987.5 MHz, IQ Magnitude Clipping, Channel Bandwidth = 3.84 MHz, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF. Power Gain — 20 dB Drain Efficiency — 30% Device Output Signal PAR — 6 dB @ 0.01% Probability on CCDF ACPR @ 5 MHz Offset — --36 dBc in 3.84 MHz Channel Bandwidth • Capable of Handling 10:1 VSWR, @ 32 Vdc, 1960 MHz, 130 Watts CW Output Power • Pout @ 1 dB Compression Point ≃ 130 Watts CW Features • 100% PAR Tested for Guaranteed Output Power Capability • Characterized with Series Equivalent Large--Signal Impedance Parameters • Internally Matched for Ease of Use • Integrated ESD Protection • Greater Negative Gate--Source Voltage Range for Improved Class C Operation • RoHS Compliant • In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel. MD7P19130HR3 MD7P19130HSR3 1930--1990 MHz, 40 W AVG., 28 V SINGLE W--CDMA LATERAL N--CHANNEL RF POWER MOSFETs CASE 465M--01, STYLE 1 NI--780--4 MD7P19130HR3 CASE 465H--02, STYLE 1 NI--780S--4 MD7P19130HSR3 RFinA/VGSA 3 1 RFoutA/VDSA RFinB/VGSB 4 2 RFoutB/VDSB (Top View) Figure 1. Pin Connections Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS --0.5, +65 Vdc Gate--Source Voltage VGS --6.0, +10 Vdc Operating Voltage VDD 32, +0 Vdc Storage Temperature Range Tstg -- 65 to +150 °C TC 150 °C TJ 225 °C Case Operating Temperature Operating Junction Temperature (1,2) 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. © Freescale Semiconductor, Inc., 2008, 2010. All rights reserved. RF Device Data Freescale Semiconductor MD7P19130HR3 MD7P19130HSR3 1 Table 2. Thermal Characteristics Characteristic Value (1,2) Symbol Thermal Resistance, Junction to Case Case Temperature 80°C, 130 W CW Case Temperature 75°C, 40 W CW RθJC Unit °C/W 0.31 0.36 Table 3. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22--A114) 1C (Minimum) Machine Model (per EIA/JESD22--A115) A (Minimum) Charge Device Model (per JESD22--C101) IV (Minimum) Table 4. Electrical Characteristics (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit Zero Gate Voltage Drain Leakage Current (VDS = 65 Vdc, VGS = 0 Vdc) IDSS — — 10 μAdc Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) IDSS — — 1 μAdc Gate--Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) IGSS — — 1 μAdc Gate Threshold Voltage (VDS = 10 Vdc, ID = 316 μAdc) VGS(th) 1.2 2 2.7 Vdc Gate Quiescent Voltage (VDD = 28 Vdc, ID = 1250 mAdc, Measured in Functional Test) VGS(Q) 1.9 2.7 3.4 Vdc Drain--Source On--Voltage (VGS = 10 Vdc, ID = 3.16 Adc) VDS(on) 0.1 0.2 0.3 Vdc Reverse Transfer Capacitance (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Crss — 1.2 — pF Output Capacitance (VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc) Coss — 586 — pF Input Capacitance (VDS = 28 Vdc, VGS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz) Ciss — 348 — pF Characteristic Off Characteristics (3) On Characteristics (3) Dynamic Characteristics (3,4) Functional Tests (3) (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 1250 mA, Pout = 40 W Avg., f = 1987.5 MHz, Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. Power Gain Gps 18.5 20 21.5 dB Drain Efficiency ηD 27 30 — % Output Peak--to--Average Ratio @ 0.01% Probability on CCDF Adjacent Channel Power Ratio Input Return Loss PAR 5.6 6 — dB ACPR — --36 --32.5 dBc IRL — --16 --7 dB 1. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. 3. Measurement made with device in single--ended configuration. 4. Part internally matched both on input and output. (continued) MD7P19130HR3 MD7P19130HSR3 2 RF Device Data Freescale Semiconductor Table 4. Electrical Characteristics (TA = 25°C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Typical Performances (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 1250 mA, 1930--1990 MHz Bandwidth Pout @ 1 dB Compression Point, CW P1dB — 130 — W Gain Flatness in 60 MHz Bandwidth @ Pout = 40 W Avg. GF — 0.3 — dB Average Deviation from Linear Phase in 60 MHz Bandwidth @ Pout = 130 W CW Φ — 0.5 — ° Delay — 2.3 — ns Part--to--Part Insertion Phase Variation @ Pout = 130 W CW, f = 1960 MHz, Six Sigma Window ∆Φ — 80 — ° Gain Variation over Temperature (--30°C to +85°C) ∆G — 0.016 — dB/°C ∆P1dB — 0.01 — dB/°C Average Group Delay @ Pout = 130 W CW, f = 1960 MHz Output Power Variation over Temperature (--30°C to +85°C) MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 3 VBIAS B1 + + C2 C1 C3 C4 R1 C7 C6 RF INPUT Z8 Z9 Z10 Z13 Z15 Z16 Z2 Z3 Z4 Z5 C10 C11 C12 Z17 Z18 Z12 Z19 Z1 C8 Z14 Z11 Z7 VSUPPLY + + Z6 Z20 Z21 Z22 Z23 Z24 Z25 Z26 RF OUTPUT DUT C9 C5 Z1 Z2 Z3 Z4 Z5 Z6 Z7 Z8 Z9 Z10 Z11 Z12 Z13 Z14 0.582″ x 0.110″ Microstrip 0.140″ x 0.284″ Microstrip 0.066″ x 0.080″ Microstrip 0.127″ x 0.080″ Microstrip 0.042″ x 0.237″ Microstrip 0.095″ x 0.375″ Microstrip 0.330″ x 0.320″ Microstrip 0.438″ x 0.530″ Microstrip 0.311″ x 0.741″ Microstrip 0.025″ x 0.814″ Microstrip 0.049″ x 0.254″ Microstrip 0.078″ x 0.814″ Microstrip 0.134″ x 0.957″ Microstrip 0.150″ x 0.276″ Microstrip Z15 Z16 Z17 Z18 Z19 Z20 Z21 Z22 Z23 Z24 Z25 Z26 PCB 0.203″ x 0.957″ Microstrip 0.271″ x 0.930″ Microstrip 0.010″ x 0.540″ Microstrip 0.042″ x 0.205″ Microstrip 0.471″ x 0.080″ Microstrip 0.024″ x 0.241″ Microstrip 0.057″ x 0.349″ Microstrip 0.781″ x 0.311″ Microstrip 0.271″ x 0.080″ Microstrip 0.024″ x 0.095″ Microstrip 0.134″ x 0.190″ Microstrip 0.511″ x 0.080″ Microstrip Arlon CuClad 250GX--0300--55--22, 0.030″, εr = 2.55 Figure 2. MD7P19130HR3(HSR3) Test Circuit Schematic Table 5. MD7P19130HR3(HSR3) Test Circuit Component Designations and Values Part Description Part Number Manufacturer B1 Short Ferrite Bead 2743019447 ROP50 Fair--Rite C1 47 μF, 50 V Electrolytic Capacitor 476KXM063M Illinois Cap. C2 100 μF, 50 V Electrolitic Capacitor T491C105K050AT Kemet C3 1.0 μF Chip Capacitor ATC100B102JT50XT ATC C4, C12 0.1 μF Chip Capacitors CDR33BX104AKYS Kemet C5, C9 11 pF Chip Capacitors ATC100B110JT500XT ATC C6 13 pF Chip Capacitor ATC100B130JT500XT ATC C7 8.2 pF Chip Capacitor ATC100B8R2JT500XT ATC C8 22 μF, 35 V Tantalum Capacitor T491C226K035AT Kemet C10 470 μF, 63 V Electrolytic Capacitor 477KXM063M Illinois Cap. C11 10 μF, 50 V Chip Capacitor GRM55DR61H106KA88B Murata R1 10 Ω, 1/4 W Chip Resistor CRCW120610R0FKEA Vishay MD7P19130HR3 MD7P19130HSR3 4 RF Device Data Freescale Semiconductor C2 C10 C7 C6 R1 C3 C4 B1 C12 C1 C11 C8 C5 CUT OUT AREA C9 MD7P19130H/HS Rev. 2 Figure 3. MD7P19130HR3(HSR3) Test Circuit Component Layout Single--ended λ 4 λ Quadrature combined 4 λ 4 λ λ 2 2 Doherty Push--pull Figure 4. Possible Circuit Topologies MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 5 32 Gps, POWER GAIN (dB) 21.5 21 20.5 Gps 20 26 3.84 MHz Channel Bandwidth, Input Signal PAR = 7.5 dB @ 0.01% Probability (CCDF) 19.5 19 18.5 ACPR 18 17.5 1880 29 VDD = 28 Vdc, Pout = 40 W (Avg.) IDQ = 1250 mA, Single--Carrier W--CDMA --28 --4 --30 --8 --32 --34 --36 PARC 1900 IRL 1920 1940 1960 1980 2000 2020 --38 2040 --12 --16 --20 --24 0 --0.5 --1 --1.5 --2 PARC (dB) 35 IRL, INPUT RETURN LOSS (dB) 38 ηD 22 ACPR (dBc) 22.5 ηD, DRAIN EFFICIENCY (%) TYPICAL CHARACTERISTICS --2.5 f, FREQUENCY (MHz) Figure 5. Output Peak--to--Average Ratio Compression (PARC) Broadband Performance @ Pout = 40 Watts Avg. 21.5 IDQ = 1875 mA Gps, POWER GAIN (dB) 20.5 1562.5 mA 19.5 1250 mA 18.5 937.5 mA 17.5 VDD = 28 Vdc, f = 1960 MHz CW Measurements 625 mA 16.5 10 1 200 100 Pout, OUTPUT POWER (WATTS) CW Figure 6. CW Power Gain versus Output Power 19 18.5 18 17.5 0 --1 Gps --1 dB = 33.42 W --2 dB = 49.63 W --2 ACPR --5 20 30 40 50 45 --25 35 30 VDD = 28 Vdc, IDQ = 1250 mA PARC f = 1960 MHz, Single--Carrier W--CDMA 3.84 MHz Channel Bandwidth, Input Signal PAR = 7.5 dB @ 0.01% Probability (CCDF) --4 --20 40 --3 dB = 69.20 W ηD --3 50 60 70 80 90 100 110 --30 --35 --40 25 --45 20 --50 120 ACPR (dBc) 19.5 OUTPUT COMPRESSION AT THE 0.01% PROBABILITY ON CCDF (dB) Gps, POWER GAIN (dB) 20 1 ηD, DRAIN EFFICIENCY (%) 20.5 Pout, OUTPUT POWER (WATTS) Figure 7. Output Peak--to--Average Ratio Compression (PARC) versus Output Power MD7P19130HR3 MD7P19130HSR3 6 RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS 23 50 --10 85°C 40 85°C 17 VDD = 28 Vdc, IDQ = 1250 mA, f = 1960 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth, Input Signal 15 PAR = 7.5 dB @ 0.01% Probability (CCDF) 13 ACPR ηD 30 --40°C 25°C 10 85°C 11 1 20 10 100 --20 --30 --40 ACPR (dBc) Gps, POWER GAIN (dB) 25°C 25°C 19 0 ηD, DRAIN EFFICIENCY (%) TC = --40°C 21 60 --40°C Gps --50 0 200 --60 Pout, OUTPUT POWER (WATTS) AVG. Figure 8. Single--Carrier W--CDMA Power Gain, Drain Efficiency and ACPR versus Output Power S21 --5 S21 (dB) --15 12 S11 --20 8 VDD = 28 Vdc IDQ = 1250 mA 4 1650 1750 1850 S11 (dB) --10 16 MTTF (HOURS) 20 0 1550 109 0 24 108 107 --25 1950 2050 2150 2250 f, FREQUENCY (MHz) Figure 9. Broadband Frequency Response --30 2350 106 90 110 130 150 170 190 210 230 250 TJ, JUNCTION TEMPERATURE (°C) This above graph displays calculated MTTF in hours when the device is operated at VDD = 28 Vdc, Pout = 40 W Avg., and ηD = 30%. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. Figure 10. MTTF versus Junction Temperature MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 7 W--CDMA TEST SIGNAL 100 10 10 --10 --30 Input Signal 0.1 0.01 0 1 2 3 4 5 6 --40 --50 --60 W--CDMA. ACPR Measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF 0.001 0.0001 3.84 MHz Channel BW --20 1 (dB) PROBABILITY (%) 0 +ACPR in 3.84 MHz Integrated BW --ACPR in 3.84 MHz Integrated BW --70 --80 7 8 9 PEAK--TO--AVERAGE (dB) Figure 11. CCDF W--CDMA IQ Magnitude Clipping, Single--Carrier Test Signal 10 --90 --100 --9 --7.2 --5.4 --3.6 --1.8 0 1.8 3.6 5.4 7.2 9 f, FREQUENCY (MHz) Figure 12. Single--Carrier W--CDMA Spectrum MD7P19130HR3 MD7P19130HSR3 8 RF Device Data Freescale Semiconductor Zo = 10 Ω Zsource f = 1880 MHz f = 2040 MHz f = 2040 MHz Zload f = 1880 MHz VDD = 28 Vdc, IDQ = 1250 mA, Pout = 40 W Avg. f MHz Zsource Ω Zload Ω 1880 7.37 + j1.00 1.84 -- j3.56 1900 7.33 + j0.96 1.78 -- j3.37 1920 7.27 + j0.93 1.72 -- j3.17 1940 7.19 + j0.90 1.64 -- j2.98 1960 7.07 + j0.89 1.55 -- j2.79 1980 6.93 + j0.97 1.48 -- j2.55 2000 6.89 + j1.04 1.46 -- j2.36 2020 6.83 + j1.07 1.44 -- j2.20 2040 6.75 + j1.12 1.40 -- j2.02 Zsource = Test circuit impedance as measured from gate to ground. Zload = Test circuit impedance as measured from drain to ground. Output Matching Network Device Under Test Input Matching Network Z source Z load Figure 13. Series Equivalent Source and Load Impedance MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 9 Pout, OUTPUT POWER (dBm) ALTERNATIVE PEAK TUNE LOAD PULL CHARACTERISTICS 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 Ideal P3dB = 53.48 dBm (223 W) P1dB = 52.67 dBm (185 W) Actual VDD = 28 Vdc, IDQ = 1250 mA, Pulsed CW 10 μsec(on), 10% Duty Cycle, f = 1960 MHz 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Pin, INPUT POWER (dBm) NOTE: Load Pull Test Fixture Tuned for Peak P1dB Output Power @ 28 V Test Impedances per Compression Level P1dB Zsource Ω Zload Ω 7.15 -- j1.86 0.84 -- j2.99 Figure 14. Pulsed CW Output Power versus Input Power @ 28 V MD7P19130HR3 MD7P19130HSR3 10 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 11 MD7P19130HR3 MD7P19130HSR3 12 RF Device Data Freescale Semiconductor MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 13 MD7P19130HR3 MD7P19130HSR3 14 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following documents to aid your design process. Application Notes • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins • EB212: Using Data Sheet Impedances for RF LDMOS Devices Software • Electromigration MTTF Calculator • RF High Power Model For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 0 May 2008 • Initial Release of Data Sheet 1 Dec. 2008 • Corrected the pin order in Fig. 1, Pin Connections, to match the Mechanical Outline pin order, p. 1 2 Aug. 2010 • Modified data sheet to reflect RF Test Reduction described in Product and Process Change Notification number, PCN13628, p. 1, 2 • Updated Fig. 14, CCDF W--CDMA IQ Magnitude Clipping, Single--Carrier Test Signal, to better represent production test signal, p. 8 • Updated Fig. 15, Single--Carrier W--CDMA Spectrum, to better represent production test signal, p. 8 • Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software, p. 15 MD7P19130HR3 MD7P19130HSR3 RF Device Data Freescale Semiconductor 15 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1--800--521--6274 or +1--480--768--2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1--8--1, Shimo--Meguro, Meguro--ku, Tokyo 153--0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1--800--441--2447 or +1--303--675--2140 Fax: +1--303--675--2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008, 2010. All rights reserved. MD7P19130HR3 MD7P19130HSR3 Document Number: MD7P19130H Rev. 2, 8/2010 16 RF Device Data Freescale Semiconductor
MD7P19130HR3
物料型号: - MD7P19130HR3 - MD7P19130HSR3

器件简介: - 这些晶体管是N通道增强型横向MOSFET,专为CDMA基站应用设计,频率范围为1930至1990 MHz。适用于CDMA和多载波放大器应用,可用于PCN - PCS/蜂窝无线电和WLL应用的AB类和C类。

引脚分配: - 图1显示了引脚连接,包括RF输出A/B和RF输入A/B。

参数特性: - 最大额定值包括漏极-源极电压、栅极-源极电压、工作电压、存储温度范围和结温。 - 热特性包括结到外壳的热阻。 - ESD保护特性符合人体模型、机器模型和电荷设备模型的测试方法。 - 电气特性包括零栅极电压漏极漏电流、栅极-源极漏电流、阈值电压、静态电压、导通电压、动态特性(如反向传输电容、输出电容和输入电容)。

功能详解: - 功能测试包括在特定条件下的功率增益、漏极效率、输出峰均比、相邻信道功率比和输入回波损耗。 - 提供了典型的性能数据,如1dB压缩点、增益平坦度、线性相位偏差和平均群延迟。

应用信息: - 这些晶体管适用于单载波W-CDMA性能测试,具有特定的输入信号参数和ACPR(相邻信道功率比)测量。

封装信息: - 提供了两种封装类型:CASE 465M-01和CASE 465H-02,以及相关的机械轮廓和尺寸。
MD7P19130HR3 价格&库存

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