MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC for
seamless migration
Rev. 3.1 — 16 March 2017
328631
Product short data sheet
COMPANY PUBLIC
1. General description
MIFARE Plus is the only mainstream smart card family compatible with MIFARE Classic
1K and MIFARE Classic 4K that offers pre-issuance of cards prior to making security
upgrades in the infrastructure. After security upgrade to Security Level 3, MIFARE Plus
uses Advanced Encryption Standard (AES) for authentication, data integrity, and
encryption.
MIFARE Plus SE is the entry-level version of NXP’s proven and reliable MIFARE Plus
product family. Designed for full functional compatibility with MIFARE Classic 1K, it
provides complete support for the MIFARE Classic value blocks.
MIFARE Plus SE is the choice for customers who want to switch to higher security while
preparing for the future by introducing cards, ready for AES security, into the existing
system environment.
MIFARE Plus SE cards are easy to distribute into running MIFARE Classic systems, since
it uses a linear memory structure compatible to MIFARE Classic, and because MIFARE
Plus SE supports all MIFARE Classic value-block operations in the Security Levels SL1
and SL3. MIFARE Plus SE stores its 128-bit AES keys on top of the data blocks. The
optional AES authentication in SL1 enables efficient detection of cards not belonging to
the system.
2. Features and benefits
Entry level version of the proven
MIFARE Plus product family
Simple fixed memory structure
compatible with MIFARE Classic
AES-128 for authenticity and integrity
Freely configurable access conditions
1 kB EEPROM
Fully supports MIFARE Classic value
block operations
NXP originality check
Supports ISO/IEC 14443-3[1] UIDs
(4-Byte NUID, 7-byte UID)
Optional support of random IDs
Multi-sector authentication, Multi-block
read and write
Anti-tearing mechanism for writing AES Keys can be stored as MIFARE
keys
CRYPTO1 keys (2 x 48-bit per sector)
and AES keys (2 x 128-bit per sector)
Virtual card concept
Communication speed up to 848 kbit/s
Number of single write operations:
Data retention time: 10 years
200000 typical
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
[1]
ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.
3. Applications
Public transportation
Access management
Electronic toll collection
Car parking
School and campus cards
Employee cards
Loyalty
Wearables
4. Quick reference data
Table 1.
Symbol
Ci
Quick reference data
Parameter
Conditions
input capacitance
Tamb = 22 C; fi = 13.56 MHz;
2.8 V RMS
Tamb = 22 C; fi = 13.56 MHz;
2.8 V RMS
input frequency
fi
[1]
Min
Typ
Max
Unit
15.0
17.0
19.04 pF
-
70.0
-
pF
-
13.56
-
MHz
-
-
year
-
cycle
EEPROM characteristics
tret
retention time
Tamb = 22 C
10
Nendu(W)
write endurance
Tamb = 22 C; excluding
anti-tearing for AES keys or
sector trailers in security
level 3
100000 200000
[1]
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Measured with LCR meter.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
2 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
5. Ordering information
Table 2.
Ordering information
Type number
Package
Commerci
al Name
Name
Description
Version
MF1SEP1001DUD/03
FFC
-
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
-
MF1SEP1031DUD/03
FFC
-
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
-
MF1SEP1001DA4/03
MOA4
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-2
MF1SEP1031DA4/03
MOA4
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-2
MF1SEP1001DA8/03
MOA8
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-4
MF1SEP1031DA8/03
MOA8
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-4
MF1SEPH1001DUD/03
FCC
-
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
-
MF1SEPH1001DA4/03
MOA4
PLLMC
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte BUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1001DA8/03
MOA8
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
SOT500-4
MF1SEPH1031DUD/03
FFC
-
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
-
MF1SEPH1031DA4/03
MOA4
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1031DA8/03
MOA8
PLLMC
plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-4
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
3 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
6. Block diagram
UART
ISO/IEC
14443A
RF
INTERFACE
AES CRYPTO
CO-PROCESSOR
TRUE RANDOM
NUMBER
GENERATOR
CRYPTO1
SECURITY
SENSORS
POWER ON
RESET
CPU/LOGIC UNIT
CRC
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
ROM
RESET
GENERATOR
RAM
EEPROM
001aah389
Fig 1.
Block diagram
7. Pinning information
7.1
Smart card contactless module
LA
top view
LB
001aaj820
Fig 2.
Table 3.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Contact assignments for SOT500-2 (MOA4)
Bonding pad assignments to smart card contactless module
Contactless interface module
MF1SEP(H)10x1DA4/z3
Antenna contacts
Symbol
Description
LA
LA
antenna coil connection LA
LB
LB
antenna coil connection LB
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
4 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
8. Functional description
8.1 Memory organization
The 1 kB EEPROM memory is organized in 16 sectors of 4 blocks
One block consists of 16 bytes.
Byte numbers within a block
Sector
Block
15
3
0
1
2
3
5(1)
4
CRYPTO1 Key A
6
7
8
9
10
Access bytes
11
12
13
14
15
CRYPTO1 Key B or Data
2
Data
1
Data
Data
0
14
0
Description
Sector trailer 15
3
CRYPTO1 Key A
Access bytes
CRYPTO1 Key B or Data
Sector trailer 14
2
Data
1
0
Data
Data
...
...
...
...
...
...
3
Access bytes
CRYPTO1 Key A
CRYPTO1 Key B or Data
Sector trailer 0
2
Data
1
Data
Manufacturer data
0
aaa-018291
(1) CRYPTO1 Key A in security level 0, 1, 2; plain text access byte in security level 3
Fig 3.
Memory organization
8.1.1 Manufacturer block
The first data block (block 0) of the first sector (sector 0) contains the PICC manufacturer
data. This block is programmed and write protected at production test.
8.1.2 Data blocks
Sectors 0D to 16D contain 3 blocks each for data storage. The data blocks can be
configured using the access bits as:
• read/write blocks for storing binary data
• value blocks
Value blocks are special counters where the stored value can be manipulated with
specific commands such as MF Increment, MF Decrement and MF Transfer.
A successful mutual authentication is required to allow any data operation.
8.1.2.1
Access conditions
The access conditions for every data block and the sector trailer itself are stored in the
sector trailer of the corresponding sector.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
5 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
The access bits control the rights of memory operations using the secret keys A and B.
The access conditions may be altered after authentication with the relevant key and the
current access condition allows this operation.
Furthermore, value blocks are configured using the access bits.
8.1.3 AES keys
AES keys are not shown in the memory map. The keys are stored on top of the other data
and can be updated and used by referencing the so-called Key Number. In security
level 3, anti-tearing is supported for the update of AES keys as well as for the update of
the sector trailer. This anti-tearing mechanism is done by the PICC itself. The EEPROM
stays in a defined status, even if the PICC is removed from the electromagnetic field
during the write operation.
8.1.4 Multi-sector authentication
A new feature has been provided in security level 3 for data which is spread over multiple
sectors to improve transaction performance.
Providing that such sectors are secured with identical keys (key value and key type) only
one authentication is required to read and/or write data from these sectors. There is no
need to re-authenticate when accessing any data within these sectors. Therefore it is
possible to configure a card in such a way that operating with only one authentication is
needed in security level 3 to access all sectors.
8.1.5 Originality function
The originality function is implemented by an AES authentication with the originality key.
The authentication is performed in ISO/IEC 14443-4 protocol layer.
8.2 Card activation and communication protocol
The ISO/IEC 14443-3 anticollision mechanism allows for simultaneous handling of
multiple PICCs in the field. The anticollision algorithm selects each PICC individually and
ensures that execution of a transaction with a selected PICC is performed correctly
without data corruption from other PICCs in the field.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
6 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
There are two different versions of the PICC. The UID is programmed into a locked part of
the NV-memory which is reserved for the manufacturer:
• unique 7-byte serial number
• non-unique 4-byte serial number
Due to security and system requirements, these bytes are write-protected after being
programmed by the PICC manufacturer at production.
Remark: The programmed 4-byte NUID serial number is not globally unique which has to
be considered in the contactless system design. See Ref. 10 for further information
regarding handling of UIDs.
The customer must decide which UID length to use when ordering the product, see
Table 2 for ordering information.
During personalization, the PICC can be configured to support Random ID in security
level 3. The user can configure whether Random ID or fixed UID shall be used. According
to ISO/IEC 14443-3 (see Ref. 4), the first anticollision loop returns the Random Number
Tag 08h, the 3-byte Random Number and the BCC, if Random ID is used. The retrieval of
the UID in this case can be done using the Virtual Card Support Last command (see
Ref. 2) or by reading out block 0.
8.2.1 Backwards compatibility protocol
The backwards compatibility of this product, as used in security level 1 and security
level 2, runs on the same protocol layer as MIFARE Classic 1K. The protocol is formed
out of the following components:
•
•
•
•
Frame definition: according to ISO/IEC 14443-3
Bit encoding: according to ISO/IEC 14443-2
Error code handling: handling is proprietary as error codes are formatted in half bytes.
Command specification: commands are proprietary. Please use the specification as in
Ref. 1 and the additional commands which are only implemented in MIFARE Plus as
described in this document and in Ref. 2.
The following security levels can run on this protocol:
• Security Level 0
• Security Level 1
8.2.2 ISO/IEC 14443-4 Protocol
The ISO/IEC 14443-4 Protocol (also known as T=CL) is used in many processor cards.
This protocol is used for the MIFARE Plus with the following security levels:
• Security Level 0: all commands
• Security Level 1: only the security level switch and originality function.
• Security Level 3: all commands
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
7 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
8.3 Security level switching
The MIFARE Plus SE offers a unique feature to support migration from CRYPTO1 based
systems to AES based operation. The migration on the card-side is done using different
security levels supporting different cryptographic algorithms and protocols. There are
three security levels:
• Security level 0: initial delivery configuration, used for card personalization
• Security level 1: backwards functional compatibility mode (with MIFARE Classic 1K)
with an optional AES authentication
• Security level 3: 3-Pass authentication based on AES, data manipulation commands
secured by AES encryption and an AES based MACing method.
The security level switching (i.e. from security level 1 to security level 3) is performed
using the dedicated AES authentication switching keys.
The security level can only be switched from a lower level to a higher level, never in the
opposite direction.
8.4 Security level 0
Security level 0 is the initial delivery configuration of the PICC. The card can be operated
either using the backwards compatibility protocol or the ISO/IEC 14443-4 protocol.
In this level, the card can be personalized including the programming of user data as well
as of CRYPTO1 and/or AES keys. In addition, the originality function can be used.
The following mandatory AES keys need to be written using the Write Perso command
before the PICC can be switched to security level 1 or security level 3 (for L3 card).
Security level switching is performed using the Commit Perso command:
• Card Configuration Key
• Card Master Key
• Level 3 Switch Key
Using the originality function, it is possible to verify that the chip is a genuine
NXP Semiconductors MIFARE Plus.
8.5 Security level 1
Security level 1 offers the same functionality as a MIFARE Classic 1K using the
backwards compatibility protocol. The MIFARE Classic 1K products is specified in Ref. 1.
Furthermore, an optional AES authentication is available in this level without affecting the
MIFARE Classic 1K functionality. The authenticity of the card can be proven using strong
cryptographic means with this additional functionality.
The timings may differ from the MIFARE Classic 1K products.
Using the originality function, it is possible to verify that the chip is a genuine
NXP Semiconductors MIFARE Plus.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
8 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
8.6 Security level 3
The operation in security level 3 is solely based on the ISO/IEC 14443-4 protocol layer.
The usage of the backwards compatibility protocol is not possible.
In security level 3, a mandatory AES authentication between PICC and reader is
conducted, where two keys are generated as a function of the random numbers from the
PICC and the reader as well as of the shared key. These two session keys are used to
secure the data which is exchanged on the interface between the card and reader. One of
the two keys is used to ensure the confidentiality of the command and the response while
the other key ensures the integrity of the command and the response.
All commands carry a MAC, such that the PICC will only accept commands from the
reader with which it is authenticated. Tampering of operands and messages is detected by
checking the MAC. Also all responses contain a MAC, so that the reader on each
response knows that neither the command nor the response has been tampered with.
Each response carries a MAC. When the appropriate MAC is received, due to linking of
MACs, the reader knows that the command and commands before it was properly
executed.
All commands between two consecutive first authenticate commands belong to one
transaction and the MACing mechanism assures integrity of the whole transaction.
9. Look-up tables
9.1 Security level 0, 1, 3: ISO/IEC 14443-3
Table 4.
ISO/IEC 14443-3
Command
Description
REQA
the REQA and ATQA commands are fully implemented according to
ISO/IEC 14443-3.
WUPA
the WAKE-UP command is fully implemented according to
ISO/IEC 14443-3.
ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented
cascade level 1
according to ISO/IEC 14443-3. The response is part 1 of the UID.
ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented
cascade level 2 for 7 byte according to ISO/IEC 14443-3. The response is part 2 of the UID.
UID version
HALT
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
the HALT command is fully implemented according to
ISO/IEC 14443-3
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
9 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
9.2 Security level 0, 1, 3: ISO/IEC 14443-4
Table 5.
ISO/IEC 14443-4
Command
Description
RATS
the response to the RATS command identifies the PICC type to the
PCD.
PPS
the PPS command allows an individual selection of the
communication baud rate between PCD and PICC. It is possible
for the MF1SEP(H)10x1 to individually set the communication
baud rate independently of each other for both directions i.e.
MF1SEP(H)10x1 allows a non-symmetrical information
interchange speed.
DESELECT
deselection according to ISO/IEC 14443-4
Please find more information on ISO/IEC 14443 in Ref. 4 as well as on the settings of
ATQA, SAK and ATS in Ref. 3.
9.3 Security level 0 command overview
Table 6.
Security level 0 command overview
Command
Description
Write Perso
pre-personalization of AES keys and all blocks
Commit Perso
switch to security level 1
First Authenticate (part 1)
first authenticate
Following Authenticate (part 1) following authenticate
Authenticate (part 2)
second authentication step
9.4 Security level 1 command overview
Table 7.
Security level 1 command overview
MF1ICS50, MF1ICS70,
MF1ICS20 commands
Description
MF Authenticate key A
authentication with key A
MF Authenticate key B
authentication with key B
MF Read
reading data
MF Write
writing data
MF Increment
incrementing a value
MF Decrement
decrementing a value
MF Restore
restoring a value
MF Transfer
transferring a value
Commands using backwards compatibility protocol, see Section 8.2.1
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Following Authenticate (part 1)
following authenticate; protocol used as described in
Section 8.2.1
Authenticate (part 2)
second authentication step; protocol used as described in
Section 8.2.1
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
10 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
Table 7.
Security level 1 command overview …continued
MF1ICS50, MF1ICS70,
MF1ICS20 commands
Description
Command set for security level switch and originality function using ISO/IEC 14443-4
protocol
First Authenticate (part 1)
first authenticate
Following Authenticate (part 1)
following authenticate
Authenticate (part 2)
second authentication step
9.5 Security level 3 command overview
Table 8.
Security level 3 command overview
Command
Description
MIFARE Plus commands
First Authenticate (part 1)
first authenticate
Following Authenticate (part 1) following authenticate
Authenticate (part 2)
second authentication step
ResetAuth
reset the authentication step
READ commands
Read Plain MACed
reading in plain, MAC on response, MAC on command
WRITE commands
Write MACed
writing encrypted, MAC on response, MAC on command
Write Plain MACed
writing in plain, MAC on response, MAC on command
VALUE operations
Increment MACed
incrementing a value encrypted, MAC on response, MAC on
command
Decrement MACed
decrementing a value encrypted, MAC on response, MAC on
command
Transfer MACed
transferring a value, MAC on response, MAC on command
Increment Transfer MACed
combined incrementing and transferring a value encrypted, MAC
on response, MAC on command
Decrement Transfer MACed
combined decrementing and transferring a value encrypted, MAC
on response, MAC on command
Restore MACed
restoring a value, MAC on response, MAC on command
Virtual card concept
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Virtual Card Support Last
check if the virtual card concept is supported, communicate PCD
capabilities and retrieve the UID
Deselect Virtual Card
deselect the virtual card
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
11 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
10. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Min
Max[1][2] Unit
input current
-
30
mA
Ptot/pack
total power dissipation per package
-
200
mW
Tstg
storage temperature
55
125
C
Tamb
ambient temperature
25
70
C
2
-
kV
100
-
mA
Symbol
Parameter
II
Conditions
VESD
electrostatic discharge voltage
Ilu
latch-up current
[3]
[1]
Stresses above one or more of the limiting values may cause permanent damage to the device.
[2]
Exposure to limiting values for extended periods may affect device reliability.
[3]
MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k.
11. Abbreviations
Table 10.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Abbreviations and symbols
Acronym
Description
AES
Advanced Encryption Standard
EEPROM
Electrically Erasable Programmable Read-Only Memory
LCR
L = inductance, Capacitance, Resistance (LCR meter)
MAC
Message Authentication Code
NUID
Non-Unique IDentifier
NV
Non-Volatile memory
PCD
Proximity Coupling Device (Contactless Reader)
PICC
Proximity Integrated Circuit Card (Contactless Card)
PPS
Protocol Parameter Selection
RATS
Request Answer To Select
REQA
REQuest Answer
SAK
Select AcKnowledge, type A
SECS-II
SEMI Equipment Communications Standard part 2
UID
Unique IDentifier
VC
Virtual Card, one MIFARE Plus PICC is one virtual card
WUPA
Wake-Up Protocol type A
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
12 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
12. References
[1]
Data sheet — MIFARE Classic EV1 1K - Mainstream contactless smart card
IC for fast and easy solution development, BL-ID Doc. No. 2792**1.
[2]
Data sheet — M1PLUSx0y1 MIFARE Plus functional specification,
BU-ID Doc. No. 1637**.
[3]
Application note — MIFARE Type identification procedure, BU-ID Doc. No. 1843**.
[4]
Application note — ISO 14443 PICC selection, BU-ID Doc. No. 1308**.
[5]
NIST Special Publication 800-38A — Recommendation for block cipher modes of
operation: methods and techniques, 2001.
[6]
NIST Special Publication 800-38B — Recommendation for block cipher modes of
operation: The CMAC mode for authentication.
[7]
ISO/IEC Standard — ISO/IEC 14443 Identification cards - contactless integrated
circuit cards - proximity cards.
[8]
FIPS PUB 197 ADVANCED ENCRYPTION STANDARD — Recommendation for
block cipher modes of operation: Methods and techniques.
[9]
ISO/IEC Standard — ISO/IEC 9797-1 Information technology - security techniques
- Message Authentication Codes (MACs) - Part 1: Mechanisms using a block cipher.
[10] MIFARE and handling of UIDs — Application note, BU-ID Document number
1907**1
13. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
MF1SEP_H_10x1_SDS
20170316
Product short data sheet
-
•
•
Modifications:
MF1SEP10x1_SDS
1.
MF1SEP10x1_SDS
Product name title changed into MF1SEP(H)10x1
Table 2 “Ordering information”: updated
20150427
Product short data sheet
-
-
** ... document version number
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
13 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
14 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
14.4 Licenses
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
ICs with DPA Countermeasures functionality
NXP ICs containing functionality
implementing countermeasures to
Differential Power Analysis and Simple
Power Analysis are produced and sold
under applicable license from
Cryptography Research, Inc.
14.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP Semiconductors N.V.
MIFARE Plus — is a trademark of NXP Semiconductors N.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
15 of 17
MF1SEP(H)10x1
NXP Semiconductors
MIFARE PLUS SE - Secure contactless smart card IC
16. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .3
Bonding pad assignments to smart card
contactless module . . . . . . . . . . . . . . . . . . . . . .4
ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .9
ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .10
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Security level 0 command overview . . . . . . . . 10
Security level 1 command overview . . . . . . . . 10
Security level 3 command overview . . . . . . . . 11
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations and symbols . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
17. Figures
Fig 1.
Fig 2.
Fig 3.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Contact assignments for SOT500-2 (MOA4) . . . .4
Memory organization . . . . . . . . . . . . . . . . . . . . . . .5
MF1SEP_H_10X1_SDS
Product short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 16 March 2017
328631
© NXP Semiconductors N.V. 2017. All rights reserved.
16 of 17
NXP Semiconductors
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC
18. Contents
1
2
3
4
5
6
7
7.1
8
8.1
8.1.1
8.1.2
8.1.2.1
8.1.3
8.1.4
8.1.5
8.2
8.2.1
8.2.2
8.3
8.4
8.5
8.6
9
9.1
9.2
9.3
9.4
9.5
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Smart card contactless module . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Memory organization . . . . . . . . . . . . . . . . . . . . 5
Manufacturer block . . . . . . . . . . . . . . . . . . . . . . 5
Data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Access conditions . . . . . . . . . . . . . . . . . . . . . . . 5
AES keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Multi-sector authentication . . . . . . . . . . . . . . . . 6
Originality function . . . . . . . . . . . . . . . . . . . . . . 6
Card activation and communication protocol . . 6
Backwards compatibility protocol . . . . . . . . . . . 7
ISO/IEC 14443-4 Protocol . . . . . . . . . . . . . . . . 7
Security level switching . . . . . . . . . . . . . . . . . . 8
Security level 0 . . . . . . . . . . . . . . . . . . . . . . . . . 8
Security level 1 . . . . . . . . . . . . . . . . . . . . . . . . . 8
Security level 3 . . . . . . . . . . . . . . . . . . . . . . . . . 9
Look-up tables . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Security level 0, 1, 3: ISO/IEC 14443-3 . . . . . . 9
Security level 0, 1, 3: ISO/IEC 14443-4 . . . . . 10
Security level 0 command overview . . . . . . . . 10
Security level 1 command overview . . . . . . . . 10
Security level 3 command overview . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 March 2017
328631
工商网监
湘ICP备2023018690号
